Driver chip of vehicle and determination method therefor

Abstract

Disclosed in the present disclosure are a driver chip of a vehicle and a determination method therefor. The method relates to the field of vehicles, and comprises: acquiring a performance parameter of a driver chip; on the basis of the performance parameter, calculating a maximum junction temperature of the driver chip and the operating life of the driver chip at the maximum junction temperature; and on the basis of the maximum junction temperature and the operating life, determining whether the driver chip is a target driver chip for the vehicle. The present disclosure solves the technical problem of low efficiency in vehicle design caused by low standards for determining vehicle driver chips.

Description

Driving chip of vehicle and determination method thereof TECHNICAL FIELD

[0001] The present disclosure relates to the field of vehicles, and in particular, to a driving chip of a vehicle and a determination method thereof. BACKGROUND

[0002] With the innovative development of the vehicle field, the control demand of users and vehicle enterprises for vehicle functions is gradually increasing, and the vehicle driving chip is one of the important components in the vehicle electronic system for controlling vehicle functions. The vehicle driving chip controls many key functions of the vehicle, such as engine control, gearbox control, brake system, safety system, etc. With the development of the vehicle industry, vehicle driving chips are constantly improving to meet higher performance requirements and more stringent safety standards. Therefore, the determination of the vehicle driving chip is one of the important steps in vehicle design. In the related art, the determination of the vehicle driving chip is often based on the experience of designers, or only based on the load working voltage demand and working current demand to determine the vehicle driving chip. The determination accuracy of the vehicle driving chip is low, which leads to the fact that the vehicle driving chip often does not meet the working demand in the actual test link, and it is necessary to determine the vehicle driving chip again, or even to re-plan the vehicle design scheme, so that the efficiency of vehicle design is low.

[0003] At present, there is no effective solution to the above problems. SUMMARY

[0004] The embodiments of the present disclosure provide a driving chip of a vehicle and a determination method thereof to at least solve the technical problem of low efficiency of vehicle design caused by low determination standard of the vehicle driving chip.

[0005] According to an aspect of an embodiment of the present disclosure, a determination method of a driving chip of a vehicle is provided, including: obtaining a performance parameter of the driving chip, wherein the performance parameter includes: working voltage, driving current, working temperature, working equivalent resistance, chip thermal coefficient, maximum working current, and maximum working temperature of the driving chip; based on the performance parameter, calculating the maximum junction temperature of the driving chip and the working life of the driving chip at the maximum junction temperature; and based on the maximum junction temperature and the working life, determining whether the driving chip is a target driving chip of the vehicle.

[0006] Further, the driving current of the driving chip includes: transient current and working current, based on the performance parameter, the maximum junction temperature of the driving chip and the working life of the driving chip at the maximum junction temperature are calculated, including: based on the maximum working current, the working equivalent resistance, the chip thermal coefficient, and the maximum working temperature, the maximum junction temperature of the driving chip is calculated; and based on the working temperature, the working life of the driving chip at the maximum junction temperature is calculated.

[0007] Further, based on the performance parameters, the highest junction temperature of the driving chip is calculated, and before the working life of the driving chip at the highest junction temperature, the method further comprises: determining whether the driving chip passes the preset test, whether the range of the working voltage of the driving chip is greater than or equal to the range of the working voltage of the load of the vehicle, whether the transient current of the driving chip is greater than or equal to the starting current of the load, and whether the working current of the driving chip is greater than or equal to the working current of the load; in response to determining that the driving chip passes the preset test, and the range of the working voltage of the driving chip is greater than or equal to the range of the working voltage of the load of the vehicle, and the transient current of the driving chip is greater than or equal to the starting current of the load, and the working current of the driving chip is greater than or equal to the working current of the load, based on the performance parameters, the highest junction temperature of the driving chip is calculated, and the working life of the driving chip at the highest junction temperature; in response to determining that the driving chip does not pass the preset test, or the range of the working voltage of the driving chip is less than the range of the working voltage of the load of the vehicle, or the transient current of the driving chip is less than the starting current of the load, or the working current of the driving chip is less than the working current of the load, it is determined that the driving chip is not the target driving chip of the vehicle.

[0008] Further, based on the maximum working current, the working equivalent internal resistance, the chip thermal coefficient and the highest working temperature, the highest junction temperature of the driving chip is calculated, comprising: obtaining the square of the maximum working current to obtain a first square; obtaining the product of the first square and the working equivalent internal resistance to obtain the power of the driving chip under the maximum working current; based on the power, the chip thermal coefficient and the highest working temperature, the highest junction temperature is obtained.

[0009] Further, based on the power, the chip thermal coefficient and the highest working temperature, the highest junction temperature is obtained, comprising: obtaining the product of the power and the chip thermal coefficient to obtain the chip temperature rise of the driving chip; obtaining the sum of the chip temperature rise and the highest working temperature to obtain the highest junction temperature of the driving chip.

[0010] Further, based on the working temperature, the working life of the driving chip at the highest junction temperature is calculated, comprising: based on a preset temperature spectrum, different average junction temperatures of the driving chip at different positions of the vehicle are obtained, wherein the preset temperature spectrum is used to reflect the different average junction temperatures of the driving chip at different positions of the vehicle; based on the different average junction temperatures, the activation energy of the driving chip, the Boltzmann constant, and the junction temperature of the driving chip in the preset test, a plurality of acceleration factors of the driving chip are calculated; based on the plurality of acceleration factors, the working life of the driving chip at the highest junction temperature is obtained.

[0011] Further, based on the different average junction temperatures, the activation energy of the driving chip, the Boltzmann constant, and the junction temperature of the driving chip in the preset test, a plurality of acceleration factors of the chip are calculated, including: obtaining a plurality of first inverses by taking inverses of the different average junction temperatures; obtaining a second inverse by taking an inverse of the junction temperature; obtaining a plurality of first differences by taking differences between the plurality of first inverses and the second inverse; obtaining a first ratio by taking a ratio of the activation energy and the Boltzmann constant; obtaining a plurality of first products by taking products of the first ratio and the plurality of first differences, respectively; and obtaining the plurality of acceleration factors by calculating the plurality of first products based on a natural exponential function, respectively.

[0012] Further, based on the plurality of acceleration factors, a working life of the driving chip at the highest junction temperature is obtained, including: determining different working times corresponding to the different average junction temperatures based on a preset temperature spectrum, wherein the preset temperature spectrum can indicate a corresponding relationship between different average junction temperatures and different working times of the driving chip; obtaining a plurality of different working durations of the driving chip at the highest junction temperature by taking ratios of the different working times and corresponding acceleration factors in the plurality of acceleration factors, respectively; and obtaining the working life of the driving chip by taking a sum of the plurality of different working durations.

[0013] Further, based on the preset temperature spectrum, different working times corresponding to different average junction temperatures are determined, including: determining different proportions of the working life of the driving chip at different average junction temperatures based on the preset temperature spectrum; and obtaining the different working times by taking products of the different proportions and running times of a controller of the vehicle, respectively, wherein the controller is configured with the driving chip.

[0014] Further, based on the highest junction temperature and the working life, a target driving chip of the vehicle is determined, including: in response to the highest junction temperature being less than or equal to a preset junction temperature of the chip and the working life being less than a preset time length, determining that the driving chip is the target driving chip of the vehicle; and in response to the highest junction temperature being greater than the preset junction temperature or the working life being greater than or equal to the preset time length, determining that the driving chip is not the target driving chip of the vehicle.

[0015] Further, after determining the target driving chip of the vehicle, the method further includes: monitoring a load of the vehicle by the target driving chip, and determining whether to output an alarm information based on a monitoring result.

[0016] According to another aspect of the embodiments of the present disclosure, a driving chip is also provided, which is configured to execute the method described above. The driving chip comprises: a logic control module, connected with a main controller of a vehicle, configured to process instructions from the main controller or decode signals from the main controller to generate corresponding control signals; an output driving module, connected with the logic control module and a load of the vehicle, configured to convert the control signals into power signals for driving the load to control the load to work; and a diagnosis and protection module, connected with the logic control module and the output driving module, configured to control the logic control module to stop working when an abnormality of the power signals is monitored.

[0017] Further, the driving chip further comprises: a power management module, connected with a power battery of the vehicle and the output driving module, configured to provide power for the output driving module when receiving power provided by the power battery.

[0018] According to another aspect of the embodiments of the present disclosure, an electronic device is also provided, which comprises: a memory, storing an executable program; and a processor, configured to run the program, wherein the program is configured to execute the method in the embodiments of the present disclosure when running.

[0019] According to another aspect of the embodiments of the present disclosure, a computer readable storage medium is also provided, which comprises a stored executable program, wherein the computer readable storage medium is configured to control a device where the computer readable storage medium is located to execute the method in the embodiments of the present disclosure when the executable program runs.

[0020] According to another aspect of the embodiments of the present disclosure, a computer program product is also provided, which comprises a computer program, configured to implement the method in the embodiments of the present disclosure when executed by a processor.

[0021] In the embodiments of the present disclosure, the performance parameters of the driving chip are acquired, the highest junction temperature of the driving chip and the working life of the driving chip at the highest junction temperature are calculated based on the performance parameters, and whether the driving chip is the target driving chip of the vehicle is determined based on the highest junction temperature and the working life. The present disclosure determines whether the driving chip meets the design requirements of the vehicle by accurately calculating the highest junction temperature and the working life of the driving chip, so as to accurately determine whether the driving chip is the target driving chip of the vehicle, thereby improving the determination accuracy of the driving chip of the vehicle and effectively improving the efficiency of vehicle design, and further solving the technical problem of low efficiency of vehicle design caused by low determination standard of the driving chip of the vehicle. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings, which are included to provide a further understanding of the disclosure and constitute a part of the disclosure, illustrate embodiments of the disclosure and serve to explain the principles of the disclosure, and do not constitute improper limitations on the disclosure. In the drawings:

[0023] Fig. 1 is a flow chart of a method for determining a driving chip of a vehicle according to an embodiment of the disclosure;

[0024] Fig. 2 is a flow chart of a method for determining a driving chip of a vehicle according to an embodiment of the disclosure;

[0025] Fig. 3 is a schematic diagram of an optional driving chip structure and connection according to an embodiment of the disclosure.

[0026] In the above drawings, the following reference signs are used: 31, driving chip; 311, power management module; 312, logic control module; 313, output driving module; 314, diagnosis and protection module; 32, load. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of the present disclosure.

[0028] It should be noted that the terms "first", "second", and the like in the specification and claims of the present disclosure and the above drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0029] Embodiment 1

[0030] According to the embodiments of the present disclosure, an embodiment of a method for determining a driving chip of a vehicle is provided. It is to be understood that the steps shown in the flowchart of the drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described herein can be executed in an order different from that shown.

[0031] FIG. 1 is a flowchart of an optional method for determining a driving chip of a vehicle according to an embodiment of the present disclosure. As shown in FIG. 1, the method includes the following steps:

[0032] In step S102, a performance parameter of the driving chip is obtained.

[0033] The performance parameter includes the working voltage, driving current, working temperature, working equivalent resistance, chip thermal coefficient, maximum working current, and maximum working temperature of the driving chip.

[0034] The vehicle refers to a vehicle that needs to be controlled by a driving chip, including but not limited to an electric sedan, an electric truck, an electric van, an oil-powered sedan, an oil-powered truck, an oil-powered van, a hybrid sedan, a hybrid truck, a hybrid van, etc.

[0035] The driving chip refers to a chip configured to control the key functions of the vehicle. The driving chip is one of the key components in the electronic system of the vehicle. The driving chip controls the engine, gearbox, brake system, safety system, etc. of the vehicle. The driving chip includes but is not limited to a sensor interface chip, a communication interface chip, a safety chip, etc. The driving chip includes a power management module, a logic control module, an output driving module, and a diagnosis and protection module. The driving chip is connected to the power battery of the vehicle through the power management module. The power battery supplies power to the power management module. The output driving module is connected to the load and is configured to control the load. The logic control module is configured to receive external instructions or signals. The logic control module is also configured to control the output driving module through a switching signal. The power management module is connected to the output driving module and supplies power to the output driving module. The diagnosis and protection module is connected to the output end of the output driving module and is configured to monitor the output voltage signal and current signal of the output driving module. In response to an abnormal output of the output driving module, the diagnosis and protection module controls the logic control module to output an off signal, thereby controlling the output driving module to stop outputting.

[0036] The performance parameter refers to the performance parameter of the driving chip in the vehicle, including but not limited to the working voltage, driving current, working temperature, working equivalent resistance, chip thermal coefficient, maximum working current, and maximum working temperature of the driving chip, etc. The performance parameter is determined by the type and process of the driving chip.

[0037] The chip thermal coefficient refers to the rate of change of the performance of the driving chip in response to the temperature change of the driving chip. The chip thermal coefficient is crucial to the reliability and performance of the chip. The chip thermal coefficient includes but is not limited to the thermal expansion coefficient, thermal conductivity, thermal resistance, heat capacity, temperature coefficient, etc.

[0038] In an optional embodiment, in response to the driving chip in the vehicle starting to work, the performance parameters of the driving chip in the vehicle can be obtained through the sensor. The working voltage of the driving chip is obtained through the voltage sensor, the working current of the driving chip is obtained through the current sensor, the working temperature of the driving chip is obtained through the temperature sensor, the working equivalent resistance of the driving chip is obtained through the artificial or pre-written program calculation, and the chip thermal coefficient, the maximum working current and the highest working temperature of the driving chip are obtained through the driving chip specification.

[0039] In another optional embodiment, the performance parameters of the driving chip in the vehicle can also be obtained by directly looking up the official document. The working voltage, driving current, working temperature, working equivalent resistance, chip thermal coefficient, maximum working current and highest working temperature of the driving chip.

[0040] Step S104, based on the performance parameters, the maximum junction temperature of the driving chip is calculated, and the working life of the driving chip at the maximum junction temperature is calculated.

[0041] The maximum junction temperature refers to the maximum temperature that the internal connection point in the chip can reach. In response to the temperature of the internal connection point in the chip exceeding the maximum junction temperature, the performance of the chip will be affected, and even the chip will be damaged. The maximum junction temperature is the internal connection point temperature threshold of the driving chip when the driving chip is kept safe and running.

[0042] The working life refers to the working life of the driving chip at the maximum junction temperature, that is, the time that the driving chip can maintain running at the maximum junction temperature. It is set to represent the reliability or durability of the chip.

[0043] In an optional embodiment, after obtaining the performance parameters of the drive chip, the maximum junction temperature of the drive chip can be obtained based on the maximum working current, working equivalent resistance, chip thermal coefficient and maximum working temperature of the drive chip, and the working life of the drive chip at the maximum junction temperature can be obtained by artificial calculation based on the working temperature of the drive chip. The power of the drive chip at the maximum working current is obtained by the maximum working current and the working equivalent internal resistance of the drive chip, the chip temperature rise of the drive chip is obtained based on the power of the drive chip at the maximum working current and the chip thermal coefficient, and the maximum junction temperature of the drive chip is obtained based on the chip temperature rise and the maximum working temperature. Based on the different average junction temperatures of the drive chip, the activation energy of the drive chip, the Boltzmann constant and the junction temperature of the drive chip in the preset test, a plurality of acceleration factors of the drive chip are obtained, and the working life of the drive chip at the maximum junction temperature is obtained based on the plurality of acceleration factors.

[0044] In the present disclosure, the maximum junction temperature of the drive chip is obtained by calculation to determine the internal connection point temperature threshold of the drive chip when the drive chip is kept in safe operation. The working life of the drive chip at the maximum junction temperature is obtained based on the maximum junction temperature to determine the working life threshold of the drive chip at the normal junction temperature, so as to improve the standard of the vehicle drive chip determination.

[0045] Step S106, based on the maximum junction temperature and the working life, determine whether the drive chip is the target drive chip of the vehicle.

[0046] The above target drive chip refers to the drive chip meeting the design requirements of the vehicle. In response to determining that the drive chip is the target drive chip of the vehicle, the target drive chip is used to control the vehicle, and the determination of the drive chip of the vehicle is completed. In response to the drive chip not being the target drive chip of the vehicle, the drive chip does not meet the design requirements of the vehicle, and the drive chip is excluded.

[0047] In an optional embodiment, after obtaining the maximum junction temperature of the vehicle driving chip and the working life of the driving chip at the maximum junction temperature, the maximum junction temperature is compared with a preset junction temperature to determine whether the maximum junction temperature meets the vehicle design requirement, and the working life is compared with a preset time length to determine whether the working life meets the vehicle design requirement. In response to the maximum junction temperature being less than or equal to the preset junction temperature of the chip and the working life being less than the preset time length, it is determined that the driving chip meets the vehicle design requirement. In response to the maximum junction temperature being greater than the preset junction temperature or the working life being greater than or equal to the preset time length, it is determined that the driving chip does not meet the vehicle design requirement. In response to the maximum junction temperature meeting the vehicle design requirement and the working life meeting the vehicle design requirement, the driving chip is determined to be the target driving chip of the vehicle. In response to the maximum junction temperature not meeting the vehicle design requirement or the working life not meeting the vehicle design requirement, the driving chip is determined to be not the target driving chip of the vehicle. The vehicle design requirement can be set by experience and requirement, or can be set according to the actual application scenario. The design requirement of the vehicle can be that the maximum junction temperature does not exceed the set temperature, or that the working life is less than a certain time length.

[0048] In the present disclosure, whether the vehicle driving chip meets the vehicle design requirement is determined by the maximum junction temperature and the working life, so as to quickly determine whether the driving chip is the target driving chip, effectively improving the efficiency of determining the vehicle driving chip and improving the design efficiency of the vehicle.

[0049] Through the above steps, the performance parameters of the driving chip are obtained; based on the performance parameters, the maximum junction temperature of the driving chip and the working life of the driving chip at the maximum junction temperature are calculated; and based on the maximum junction temperature and the working life, it is determined whether the driving chip is the target driving chip of the vehicle. The present disclosure obtains the maximum junction temperature of the driving chip and the working life of the driving chip at the maximum junction temperature through the performance parameters of the driving chip, and determines whether the driving chip meets the vehicle design requirement through the maximum junction temperature and the working life, so as to determine whether the driving chip is the target driving chip of the vehicle. By accurately calculating the maximum junction temperature and the working life of the driving chip, the determination standard of the vehicle driving chip is improved, the efficiency of vehicle design is effectively improved, and the technical problem of low efficiency of vehicle design caused by low determination standard of vehicle driving chip is solved.

[0050] Optionally, the driving current of the driving chip includes a transient current and a working current, and based on the performance parameters, the maximum junction temperature of the driving chip and the working life of the driving chip at the maximum junction temperature are calculated, including: based on the maximum working current, the working equivalent resistance, the chip thermal coefficient and the maximum working temperature, the maximum junction temperature of the driving chip is calculated; and based on the working temperature, the working life of the driving chip at the maximum junction temperature is calculated.

[0051] The transient current refers to a sudden change in current in the driving chip. In the present disclosure, the transient current refers to the starting current of the driving chip. By obtaining the transient current of the driving chip, it is ensured that the driving chip can match the starting current demand of the load.

[0052] In an optional embodiment, the driving current of the driving chip includes the transient current of the driving chip and the working current of the driving chip. The maximum working current is squared and multiplied by the working equivalent internal resistance to obtain the power of the driving chip under the maximum working current. The power of the driving chip under the maximum working current is multiplied by the chip thermal coefficient to obtain the chip temperature rise of the driving chip. The chip temperature rise of the driving chip is added to the maximum working temperature to obtain the maximum junction temperature of the driving chip. A plurality of acceleration factors are obtained in combination with different average junction temperatures, the junction temperature of the driving chip in the preset test, and the ratio of the activation energy to the Boltzmann constant. A plurality of different working durations corresponding to the plurality of acceleration factors are obtained based on the plurality of acceleration factors. The working life of the driving chip under the maximum junction temperature is determined based on the plurality of different working durations.

[0053] In the present disclosure, whether the driving chip can match the starting current demand of the load is determined by the transient current of the driving chip to prevent the driving chip from being damaged when the load starts. After obtaining the performance parameters of the driving chip, the power of the driving chip under the maximum working current is accurately calculated based on the performance parameters of the driving chip. The maximum junction temperature and the working life of the driving chip under the maximum junction temperature are accurately calculated based on the power of the driving chip under the maximum working current. The accuracy of obtaining the maximum junction temperature is improved. The accuracy of obtaining the working life of the driving chip under the maximum junction temperature is improved. The accuracy of the determination of the vehicle driving chip is improved.

[0054] Optionally, before the maximum junction temperature of the driving chip and the working life of the driving chip under the maximum junction temperature are calculated based on the performance parameters, the method further includes: determining whether the driving chip passes the preset test, whether the range of the working voltage of the driving chip is greater than or equal to the range of the working voltage of the load of the vehicle, whether the transient current of the driving chip is greater than or equal to the starting current of the load, and whether the working current of the driving chip is greater than or equal to the working current of the load; in response to determining that the driving chip passes the preset test, and that the range of the working voltage of the driving chip is greater than or equal to the range of the working voltage of the load of the vehicle, and that the transient current of the driving chip is greater than or equal to the starting current of the load, and that the working current of the driving chip is greater than or equal to the working current of the load, the maximum junction temperature of the driving chip and the working life of the driving chip under the maximum junction temperature are calculated based on the performance parameters; in response to determining that the driving chip does not pass the preset test, or that the range of the working voltage of the driving chip is less than the range of the working voltage of the load of the vehicle, or that the transient current of the driving chip is less than the starting current of the load, or that the working current of the driving chip is less than the working current of the load, it is determined that the driving chip is not the target driving chip of the vehicle.

[0055] The preset test refers to a test for determining whether the driving chip is a vehicle-level driving chip. In the present disclosure, the preset test of the driving chip includes, but is not limited to, environmental stress screening, temperature cycle test, high-temperature storage, humidity test, electrostatic discharge test, etc. In response to the driving chip passing the preset test, the driving chip is a vehicle-level driving chip. In response to the driving chip failing to pass the preset test, the driving chip is not a vehicle-level driving chip and is not a target driving chip of the vehicle.

[0056] The load refers to a load in the vehicle, including various electrical equipment in the vehicle. The vehicle load power is closely related to the driving chip. Therefore, the driving chip needs to meet the voltage and current requirements in the vehicle load to prevent the vehicle from failing to normally implement part of the functions.

[0057] In an optional embodiment, based on the performance parameters, the highest junction temperature of the driving chip is calculated, and it is determined whether the driving chip passes the preset test before the working life of the driving chip at the highest junction temperature, wherein the preset test includes, but is not limited to, environmental stress screening, temperature cycle test, high-temperature storage, humidity test, electrostatic discharge test, etc. It is judged whether the range of the working voltage of the driving chip is greater than or equal to the range of the working voltage of the load, whether the transient current of the driving chip is greater than or equal to the starting current of the load, and whether the working current of the driving chip is greater than or equal to the working current of the load. In response to determining that the driving chip passes the preset test, the driving chip is a vehicle-level driving chip, the range of the working voltage of the driving chip is greater than or equal to the range of the working voltage of the load of the vehicle, the working voltage of the driving chip meets the design requirements of the vehicle, the transient current of the driving chip is greater than or equal to the starting current of the load, the transient current of the driving chip meets the starting current of the vehicle load, the working current of the driving chip is greater than or equal to the working current of the load, and the working current of the driving chip meets the design requirements of the vehicle. Based on the performance parameters, the highest junction temperature of the driving chip is calculated, and the working life of the driving chip at the highest junction temperature. In response to determining that the driving chip fails to pass the preset test, the driving chip is not a vehicle-level driving chip, or the range of the working voltage of the driving chip is less than the range of the working voltage of the load of the vehicle, the working voltage of the driving chip does not meet the design requirements of the vehicle, or the transient current of the driving chip is less than the starting current of the load, the transient current of the driving chip does not meet the starting current of the vehicle load, or the working current of the driving chip is less than the working current of the load, and the working current of the driving chip does not meet the design requirements of the vehicle. It is determined that the driving chip is not a target driving chip of the vehicle.

[0058] In the present disclosure, before calculating the maximum junction temperature of the driving chip and the working life of the driving chip at the maximum junction temperature, the driving chip is verified through a preset test, so as to quickly determine whether the driving chip is a vehicle-level driving chip, and to quickly judge whether the driving chip meets the demand of normal operation of the vehicle load through the working voltage, transient current and working current of the driving chip, so that when the driving chip is not a vehicle-level driving chip or the driving chip does not meet the demand of normal operation of the vehicle load, it can be quickly determined that the driving chip is not the target driving chip of the vehicle, thereby effectively improving the determination efficiency of the vehicle driving chip.

[0059] Optionally, the maximum junction temperature of the driving chip is calculated based on the maximum working current, the working equivalent resistance, the chip thermal coefficient and the maximum working temperature, including: obtaining the square of the maximum working current to obtain a first square; obtaining the product of the first square and the working equivalent resistance to obtain the power of the driving chip under the maximum working current; and obtaining the maximum junction temperature based on the power, the chip thermal coefficient and the maximum working temperature.

[0060] In an optional embodiment, the square of the maximum working current is obtained to obtain a first square, and the product of the first square and the working equivalent resistance is obtained, that is, the power of the driving chip under the maximum working current, wherein the calculation formula of the power of the driving chip under the maximum working current is as follows:

[0061] wherein P max is the power of the driving chip under the maximum working current, I max is the maximum working current, is the first square, R dson is the working equivalent resistance.

[0062] After obtaining the power of the driving chip under the maximum working current, the chip temperature rise of the driving chip is obtained by multiplying the power of the driving chip under the maximum working current and the chip thermal coefficient, and the maximum junction temperature is obtained by adding the chip temperature rise of the driving chip and the maximum working temperature.

[0063] In the present disclosure, the power of the driving chip under the maximum working current is quickly obtained by multiplying the first square and the working equivalent resistance, and the chip temperature rise is obtained by multiplying the power of the driving chip under the maximum working current and the chip thermal coefficient, and the maximum junction temperature is quickly obtained by adding the maximum working temperature and the chip temperature rise, thereby improving the efficiency of obtaining the maximum junction temperature and effectively improving the efficiency of determining the vehicle driving chip.

[0064] Optionally, the maximum junction temperature is obtained based on the power, the chip thermal coefficient and the maximum working temperature, including: obtaining the product of the power and the chip thermal coefficient to obtain the chip temperature rise of the driving chip; and obtaining the sum of the chip temperature rise and the maximum working temperature to obtain the maximum junction temperature of the driving chip.

[0065] The chip temperature rise refers to the temperature rise of the chip when the chip is working, and in the present disclosure, the chip temperature rise refers to the temperature rise of the driving chip when the driving chip is running at the maximum working current.

[0066] In an optional embodiment, the product of the power and the chip thermal coefficient is obtained to obtain the chip temperature rise of the driving chip, wherein the calculation formula of the chip temperature rise of the driving chip is as follows: ΔT=P max *R thj ;

[0067] Wherein, ΔT is the chip temperature rise of the driving chip, P max is the power of the driving chip at the maximum working current, R thj is the chip thermal coefficient, and the chip thermal coefficient R thj is obtained by querying the chip data manual.

[0068] After obtaining the chip temperature rise, the sum of the chip temperature rise and the highest working temperature is obtained to obtain the highest junction temperature of the driving chip, wherein the calculation formula of the highest junction temperature of the driving chip is as follows: T max =T umax +ΔT;

[0069] Wherein, T max is the highest junction temperature of the driving chip, T umax is the highest working temperature of the driving chip, and ΔT is the chip temperature rise of the driving chip. In this way, the highest junction temperature of the driving chip is obtained.

[0070] In the present disclosure, the chip temperature rise of the driving chip is obtained by multiplying the power and the chip thermal coefficient, and the highest junction temperature is quickly obtained by adding the chip temperature rise of the driving chip and the highest working temperature of the driving chip, so that the highest junction temperature of the driving chip is obtained conveniently, and the efficiency of obtaining the highest junction temperature of the driving chip is improved.

[0071] Optionally, the working life of the driving chip at the highest junction temperature is calculated based on the working temperature, including: obtaining different average junction temperatures of the driving chip at different positions of the vehicle based on a preset temperature spectrum, wherein the preset temperature spectrum is used to reflect different average junction temperatures of the driving chip at different positions of the vehicle; calculating a plurality of acceleration factors of the driving chip based on the different average junction temperatures, the activation energy of the driving chip, the Boltzmann constant, and the junction temperature of the driving chip in a preset test; and obtaining the working life of the driving chip at the highest junction temperature based on the plurality of acceleration factors.

[0072] The preset temperature spectrum refers to the average junction temperature of the driving chip at different positions of the vehicle, wherein the different positions include but are not limited to the inside of the vehicle, the top of the vehicle, etc. The preset temperature spectrum is used to reflect the different average junction temperatures of the driving chip at different positions of the vehicle. The average junction temperature of the driving chip at different positions of the vehicle is obtained through the preset temperature spectrum. The preset temperature spectrum can be set according to the performance parameters of the driving chip. The preset temperature spectrum can also be set artificially according to experience and demand. The preset temperature spectrum can also be set according to the actual application scenario.

[0073] The activation energy refers to the energy required by the chip during the working process. In the present disclosure, the activation energy refers to the energy required by the driving chip during the working process.

[0074] The accelerated aging factor (AAF) is an index for evaluating the service life of the chip under conditions of higher temperature, voltage or mechanical stress, etc. In the present disclosure, the accelerated aging factor is an index for evaluating the service life of the driving chip of the vehicle at the highest junction temperature. The service life of the driving chip under normal use conditions can be predicted through the accelerated aging factor.

[0075] In an alternative embodiment, the different average junction temperatures of the driving chip at different positions of the vehicle are obtained based on a preset temperature spectrum. The preset temperature spectrum is used to reflect the different average junction temperatures of the driving chip at different positions of the vehicle. The different average junction temperatures of the driving chip at different positions of the vehicle are obtained by querying the preset temperature spectrum set in advance.

[0076] For example, Table 1 is a table of different average junction temperatures of the driving chip at different positions of the vehicle. As shown in Table 1, the first preset temperature spectrum refers to the average junction temperature of the driving chip installed in the vehicle or the vehicle body. The second preset temperature spectrum refers to the average junction temperature of the driving chip installed in the vehicle body and exposed to sunlight or installed on the top of the vehicle body. The average junction temperature changes during normal working time, so different average junction temperatures are generated. The proportion of different average junction temperatures in the running time of the vehicle controller is shown in Table 1.

[0077] Table 1

[0078] After obtaining the different average junction temperatures, a plurality of accelerated aging factors of the driving chip are calculated based on the different average junction temperatures, the activation energy of the driving chip, the Boltzmann constant and the junction temperature of the driving chip in the preset test. After obtaining a plurality of accelerated aging factors, the working life of the driving chip at the highest junction temperature is obtained through the plurality of accelerated aging factors.

[0079] In the present disclosure, the different average junction temperatures of the driving chip at different positions of the vehicle are quickly obtained by querying the preset temperature spectrum, and the proportion of the running time of the vehicle controller at different junction temperatures is obtained. The specific position of the driving chip is analyzed, and the accuracy of determining the driving chip of the vehicle is improved.

[0080] Optionally, based on the different average junction temperatures, the activation energy of the driving chip, the Boltzmann constant, and the junction temperature of the driving chip in the preset test, a plurality of acceleration factors of the chip are calculated, including: obtaining a plurality of first inverses by taking inverses of the different average junction temperatures; obtaining a second inverse by taking an inverse of the junction temperature; obtaining a plurality of first differences by taking differences between the plurality of first inverses and the second inverse; obtaining a first ratio by taking a ratio of the activation energy and the Boltzmann constant; obtaining a plurality of first products by respectively taking products of the first ratio and the plurality of first differences; and calculating the plurality of first products based on a natural exponential function to obtain the plurality of acceleration factors.

[0081] In an optional embodiment, after obtaining the different average junction temperatures of the driving chip, a first inverse is obtained by taking an inverse of the different average junction temperatures, a second inverse is obtained by taking an inverse of the junction temperature of the driving chip in the preset test, a plurality of first differences are obtained by taking differences between the plurality of first inverses and the second inverse, a first ratio is obtained by taking a ratio of the activation energy and the Boltzmann constant, a plurality of first products are obtained by respectively taking products of the first ratio and the plurality of first differences, and the plurality of first products are calculated based on a natural exponential function to obtain a plurality of acceleration factors, wherein a calculation formula of the plurality of acceleration factors is as follows:

[0082] wherein Af is an acceleration factor, is a first product, T u is a different average junction temperature, T t is a junction temperature of the driving chip in the preset test, is a first inverse, is a second inverse, E a is an activation energy of the driving chip, K B is a Boltzmann constant.

[0083] In the present disclosure, the influence of the different average junction temperatures on the driving chip is determined by calculating the plurality of acceleration factors, so that the determination of the driving chip is more comprehensive, and the accuracy of determining the driving chip of the vehicle is effectively improved, and the accuracy of the vehicle design is effectively improved.

[0084] Optionally, the working life of the driving chip at the highest junction temperature is obtained based on the plurality of acceleration factors, including: determining different working times corresponding to different average junction temperatures based on a preset temperature spectrum, wherein the preset temperature spectrum can indicate a corresponding relationship between different average junction temperatures and different working times of the driving chip; obtaining a ratio of each working time to a corresponding acceleration factor in the plurality of acceleration factors to obtain a plurality of different working durations of the driving chip at the highest junction temperature; and obtaining a sum of the plurality of different working durations to obtain the working life of the driving chip.

[0085] In an optional embodiment, the different working times corresponding to the different average junction temperatures are determined based on a preset temperature spectrum, wherein the preset temperature spectrum contains a working time ratio of the average junction temperature, and the different working times corresponding to the different average junction temperatures are obtained by multiplying a running time of the vehicle controller by the working time ratio of the average junction temperature, wherein the preset temperature spectrum can indicate a corresponding relationship between different average junction temperatures and different working times of the driving chip. The ratio of each working time to a corresponding acceleration factor in the plurality of acceleration factors is obtained to obtain a plurality of different working durations of the driving chip at the highest junction temperature, wherein the calculation formula of the different working durations is as follows:

[0086] wherein t t is the different working duration, t u is the different working time, and A f is the acceleration factor. After obtaining the plurality of different working durations of the driving chip at the highest junction temperature, the plurality of different working durations are added to obtain the working life of the driving chip.

[0087] In the present disclosure, the plurality of working times corresponding to the different average junction temperatures are calculated separately, and the plurality of working durations corresponding to the different junction temperatures are accurately obtained by multiplying the plurality of working times corresponding to the different junction temperatures by the plurality of acceleration factors, and the working life of the driving chip is obtained by adding the plurality of working durations, so that the working life of the driving chip is more accurate, and the accuracy of the working life of the driving chip is effectively improved.

[0088] Optionally, the different working times corresponding to the different average junction temperatures are determined based on a preset temperature spectrum, including: determining different proportions of the working life of the driving chip at different average junction temperatures based on the preset temperature spectrum; and obtaining a product of each proportion and a running time of a controller of the vehicle to obtain the different working times, wherein the controller is configured with the driving chip.

[0089] In an optional embodiment, the preset temperature spectrum contains the proportion of working time of the average junction temperature, after determining different proportions of the working life of the driving chip at different average junction temperatures in the preset temperature spectrum, multiplying the different proportions by the running time of the vehicle controller, different working times corresponding to different average junction temperatures are obtained, and different average junction temperatures and different working times correspond to each other, wherein the driving chip is arranged in the controller.

[0090] In the present disclosure, by setting different proportions at different average junction temperatures in the preset temperature spectrum, multiplying the different proportions by the running time of the vehicle controller, different working times of the driving chip are quickly obtained, and the acquisition efficiency of different working times of the driving chip is improved.

[0091] Optionally, based on the maximum junction temperature and the working life, the target driving chip of the vehicle is determined, including: in response to the maximum junction temperature being less than or equal to the preset junction temperature of the chip and the working life being less than the preset time length, determining that the driving chip is the target driving chip of the vehicle; in response to the maximum junction temperature being greater than the preset junction temperature or the working life being greater than or equal to the preset time length, determining that the driving chip is not the target driving chip of the vehicle.

[0092] The above-mentioned preset junction temperature refers to a preset value for determining the maximum junction temperature threshold, wherein the above-mentioned preset junction temperature can be set according to the performance parameters of the driving chip, the above-mentioned preset junction temperature can also be set according to experience and demand by human setting, and the above-mentioned preset junction temperature can also be set according to the actual application scenario.

[0093] The above-mentioned preset time length refers to a preset value for determining the working life threshold, wherein the above-mentioned preset time length can be set according to the performance parameters of the driving chip, the above-mentioned preset time length can also be set according to experience and demand by human setting, and the above-mentioned preset time length can also be set according to the actual application scenario.

[0094] In an optional embodiment, the maximum junction temperature of the driving chip can be compared with the preset junction temperature by human or pre-set program, the working life of the driving chip can be compared with the preset time length, in response to the maximum junction temperature being less than or equal to the preset junction temperature of the chip and the working life being less than the preset time length, it is determined that the driving chip meets the design requirements of the vehicle, and it is determined that the driving chip is the target driving chip of the vehicle; in response to the maximum junction temperature being greater than the preset junction temperature or the working life being greater than or equal to the preset time length, it is determined that the driving chip does not meet the design requirements of the vehicle, and it is determined that the driving chip is not the target driving chip of the vehicle.

[0095] In the present disclosure, the maximum junction temperature of the driving chip is compared with the preset junction temperature through artificial or preset procedures, and the working life of the driving chip is compared with the preset time length, so as to quickly determine whether the driving chip meets the design requirements of the vehicle and whether the driving chip is the target driving chip of the vehicle. The efficiency of determining the driving chip of the vehicle is effectively improved.

[0096] Optionally, after determining the target driving chip of the vehicle, the method further comprises: monitoring the load of the vehicle by the target driving chip, and determining whether to output alarm information based on the monitoring result.

[0097] The above-mentioned alarm information refers to alarm information when the load of the vehicle does not operate normally, wherein the alarm information can be sound alarm information, display alarm information or vibration alarm information.

[0098] In an optional embodiment, after determining the target driving chip of the vehicle, the load of the vehicle is detected by the target driving chip, when the load of the vehicle does not operate normally, the monitoring result is a vehicle load failure, sound alarm information can be output through a buzzer, display alarm information can be output through a vehicle central control screen, and vibration alarm information can be output through a terminal connected to the vehicle.

[0099] A preferred embodiment of the present disclosure will be described in detail below in combination with FIG. 2, wherein FIG. 2 is a flowchart of a preferred method for determining a driving chip of a vehicle according to an embodiment of the present disclosure. The driving chip in FIG. 2 is a high-side driving chip, the working equivalent resistance is 36 m eff, the chip thermal coefficient is 34.5 K / W, the maximum working voltage is 28 V, the transient current is 25 A, the maximum junction temperature is 150 °C, the working voltage range of the vehicle load is 9 V to 16 V, the starting current is 12 A, the working current of the load is 6 A, the working temperature is -40 °C to 80 °C, the running time of the controller of the vehicle is 8760 hours, and the preset time length is 1000 hours. As shown in FIG. 2, the method for determining the driving chip of the vehicle comprises the following steps:

[0100] Step S201, performing a preset test on the high-side driving chip.

[0101] In an optional embodiment, the preset test includes but is not limited to environmental stress screening, temperature cycle test, high-temperature storage, humidity test, electrostatic discharge test, etc. The high-side driving chip is subjected to environmental stress screening, temperature cycle test, high-temperature storage, humidity test, electrostatic discharge test, etc. to determine whether the high-side driving chip is a vehicle-level driving chip.

[0102] Step S202, verifying the voltage of the high-side driving chip.

[0103] In an optional embodiment, it is judged whether the range of the working voltage of the high-side drive chip is greater than or equal to the range of the working voltage of the load. It can be seen that the range of the working voltage of the high-side drive chip is greater than the range of the working voltage of the load, and thus it is judged that the working voltage of the high-side drive chip meets the design requirements of the vehicle.

[0104] In step S203, the current of the high-side drive chip is verified.

[0105] In an optional embodiment, it is judged whether the transient current of the high-side drive chip is greater than or equal to the starting current of the load and whether the working current of the high-side drive chip is greater than or equal to the working current of the load. It can be seen that the transient current of the high-side drive chip is greater than the starting current of the load and the working current of the high-side drive chip is greater than the working current of the load, and thus the working current of the high-side drive chip meets the design requirements of the vehicle.

[0106] In step S204, the working temperature of the high-side drive chip is verified.

[0107] In an optional embodiment, the maximum junction temperature of the drive chip is calculated based on the maximum working current, the working equivalent resistance, the chip thermal coefficient, and the maximum working temperature, including: obtaining the square of the maximum working current to obtain a first square; obtaining the product of the first square and the working equivalent resistance to obtain the power of the drive chip under the maximum working current; and obtaining the maximum junction temperature based on the power, the chip thermal coefficient, and the maximum working temperature. Taking the maximum ambient temperature of the load working as 80℃ and the temperature rise of the plastic shell as 15℃, the maximum junction temperature of the high-side drive chip is 95℃. The preset junction temperature is taken as the maximum junction temperature of the chip 150℃, and the maximum long-time working current of the chip allowed under this working condition is obtained by the formula as 16A, which is greater than the long-time working current of the load 6A. At the same time, it is also illustrated that when 6A works continuously, the maximum junction temperature is less than the preset junction temperature of the chip.

[0108] In step S205, the working life of the high-side drive chip is verified.

[0109] In an optional embodiment, the working life of the high-side drive chip is calculated based on the preset temperature spectrum and the working temperature by the formula in the above embodiment. Table 2 is a working time table of the high-side drive chip at different average junction temperatures.

[0110] The working life of the high-side drive chip is determined as 373.7 hours by adding the plurality of working times, which is less than the preset time length 1000 hours, and thus the working life of the high-side drive chip is less than the preset time length.

[0111] In step S206, the high-side drive chip is determined as the target drive chip.

[0112] In an optional embodiment, in response to the highest junction temperature being less than the preset junction temperature and the service life being less than the preset time length, the high-side drive chip is determined as the target drive chip of the vehicle.

[0113] Table 2

[0114] Embodiment 2

[0115] According to another aspect of the embodiments of the present disclosure, a drive chip is also provided, which can perform the determination method of the drive chip of the vehicle provided in Embodiment 1 above, and the specific implementation and preferred application scenarios are the same as those of Embodiment 1 above, which will not be repeated here.

[0116] FIG. 3 is a schematic diagram of an optional drive chip structure and connection according to an embodiment of the present disclosure. As shown in FIG. 3, the drive chip 31 includes a logic control module 312 connected with a main controller of a vehicle, configured to process instructions from the main controller or decode signals from the main controller to generate corresponding control signals; an output drive module 313 connected with the logic control module and a load 32 of the vehicle, configured to convert the control signals into power signals for driving the load to control the load to work; and a diagnosis and protection module 314 connected with the logic control module and the output drive module, configured to control the logic control module 312 to stop working when an abnormality of the power signals is monitored.

[0117] In an optional embodiment, as shown in FIG. 3, the drive chip 31 includes the logic control module 312, the output drive module 313, and the diagnosis and protection module 314. The main controller of the vehicle sends instructions or signals to the logic control module 312, the logic control module 312 outputs switching signals to the output drive module 313, and the logic control module 312 controls the output drive module 313 to output power to the load 32 through the switching signals to control the vehicle load 32 to work. The diagnosis and protection module 314 is connected to the output end of the output drive module 313, and the voltage and current signals of the output drive module 313 flow into the diagnosis and protection module 314 to monitor the current and voltage of the output drive module 313. The diagnosis and protection module 314 is also connected to the logic control module 312, and when the current or voltage of the output drive module 313 is abnormal, the logic control module 312 is controlled to stop working.

[0118] Optionally, the drive chip further includes a power management module connected with a power battery of the vehicle and the output drive module, and the power management module is configured to provide power for the output drive module when receiving the power provided by the power battery.

[0119] In an optional embodiment, as shown in FIG. 3, the driving chip 31 further comprises a power management module 311, the power management module 311 being connected with a power battery of the vehicle and an output driving module 312, the power management module 311 supplying power to the output driving module 312 after the power battery supplies power to the power management module 311.

[0120] Embodiment 3

[0121] Embodiments of the present disclosure further provide an electronic device, comprising a memory storing an executable program, and a processor configured to run the program, wherein the program performs the method in the embodiments of the present disclosure when running.

[0122] Embodiment 4

[0123] Embodiments of the present disclosure further provide a computer readable storage medium comprising a stored executable program, wherein the computer readable storage medium controls the device where the computer readable storage medium is located to perform the method in the embodiments of the present disclosure when the executable program runs.

[0124] Embodiment 5

[0125] Embodiments of the present disclosure further provide a computer program product comprising a computer program, the computer program implementing the method in the embodiments of the present disclosure when executed by a processor.

[0126] Embodiment 6

[0127] Embodiments of the present disclosure further provide a computer program, the computer program implementing the method in the embodiments of the present disclosure when executed by a processor.

[0128] The above-mentioned serial numbers of the embodiments of the present disclosure are only for description, and do not represent the advantages or disadvantages of the embodiments.

[0129] In the above-mentioned embodiments of the present disclosure, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0130] In the several embodiments provided by the present disclosure, it should be understood that the disclosed technology can be implemented in other ways. Of course, the embodiment described above is only a schematic, for example, the division of units can be a logical function division, and there can be another division manner in actual implementation, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, units or modules, and can be electrical or other forms.

[0131] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment of the present application.

[0132] In addition, each functional unit in various embodiments of the present disclosure can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0133] The integrated unit, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present disclosure essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server or a network device, etc.) to execute all or part of the steps of the method described in various embodiments of the present disclosure. The foregoing storage medium includes: a U disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store program codes.

[0134] The above is only the preferred embodiment of the present disclosure, and it should be pointed out that for those skilled in the art, without departing from the principles of the present disclosure, a number of improvements and refinements can be made, and these improvements and refinements should be considered as the protection scope of the present disclosure. Industrial applicability

[0135] In the embodiment of the present disclosure, the performance parameters of the drive chip are obtained; based on the performance parameters, the highest junction temperature of the drive chip and the working life of the drive chip at the highest junction temperature are calculated; and based on the highest junction temperature and the working life, it is determined whether the drive chip is the target drive chip of the vehicle. The present disclosure determines whether the drive chip meets the design requirements of the vehicle by accurately calculating the highest junction temperature and the working life of the drive chip, to accurately determine whether the drive chip is the target drive chip of the vehicle, thereby improving the determination accuracy of the drive chip of the vehicle and effectively improving the efficiency of vehicle design, thereby solving the technical problem of low efficiency of vehicle design caused by low determination standard of vehicle drive chip.

Claims

1. A method for determining a drive chip of a vehicle, comprising: obtaining performance parameters of the drive chip, wherein the performance parameters comprise: an operating voltage, a drive current, an operating temperature, an operating equivalent resistance, a chip thermal coefficient, a maximum operating current, and a maximum operating temperature of the drive chip; based on the performance parameters, calculating a maximum junction temperature of the drive chip, and a service life of the drive chip at the maximum junction temperature; based on the maximum junction temperature and the service life, determining whether the drive chip is a target drive chip of the vehicle.

2. The method of claim 1, wherein, The drive current of the drive chip comprises: a transient current and an operating current, based on the performance parameters, calculating the maximum junction temperature of the drive chip, and the service life of the drive chip at the maximum junction temperature, comprising: based on the maximum operating current, the operating equivalent resistance, the chip thermal coefficient, and the maximum operating temperature, calculating the maximum junction temperature of the drive chip; based on the operating temperature, calculating the service life of the drive chip at the maximum junction temperature.

3. The method of claim 1, wherein, Before calculating the maximum junction temperature of the drive chip, and the service life of the drive chip at the maximum junction temperature based on the performance parameters, the method further comprises: determining whether the drive chip passes a preset test, whether a range of the operating voltage of the drive chip is greater than or equal to a range of an operating voltage of a load of the vehicle, whether the transient current of the drive chip is greater than or equal to a starting current of the load, and whether the operating current of the drive chip is greater than or equal to an operating current of the load; in response to determining that the drive chip passes the preset test, and that the range of the operating voltage of the drive chip is greater than or equal to the range of the operating voltage of the load of the vehicle, and that the transient current of the drive chip is greater than or equal to the starting current of the load, and that the operating current of the drive chip is greater than or equal to the operating current of the load, calculating the maximum junction temperature of the drive chip, and the service life of the drive chip at the maximum junction temperature based on the performance parameters; in response to determining that the drive chip does not pass the preset test, or that the range of the operating voltage of the drive chip is less than the range of the operating voltage of the load of the vehicle, or that the transient current of the drive chip is less than the starting current of the load, or that the operating current of the drive chip is less than the operating current of the load, determining that the drive chip is not the target drive chip of the vehicle.

4. The method of claim 2, wherein, Based on the maximum operating current, the operating equivalent resistance, the chip thermal coefficient, and the maximum operating temperature, calculating the maximum junction temperature of the drive chip, comprises: obtaining a square of the maximum operating current to obtain a first square; obtaining a product of the first square and the operating equivalent resistance to obtain a power of the drive chip at the maximum operating current; based on the power, the chip thermal coefficient, and the maximum operating temperature, obtaining the maximum junction temperature.

5. The method of claim 4, wherein, Based on the power, the chip thermal coefficient, and the maximum operating temperature, obtaining the maximum junction temperature, comprises: Obtaining a product of the power and the chip thermal coefficient to obtain a chip temperature rise of the driving chip; Obtaining a sum of the chip temperature rise and the highest working temperature to obtain the highest junction temperature of the driving chip.

6. The method of claim 2, wherein, Based on the working temperature, the working life of the driving chip at the highest junction temperature is calculated, including: Based on a preset temperature spectrum, different average junction temperatures of the driving chip at different positions of the vehicle are obtained, wherein the preset temperature spectrum is used to reflect different average junction temperatures of the driving chip at different positions of the vehicle; Based on the different average junction temperatures, the activation energy of the driving chip, the Boltzmann constant, and the junction temperature of the driving chip in the preset test, a plurality of acceleration factors of the driving chip are calculated; Based on the plurality of acceleration factors, the working life of the driving chip at the highest junction temperature is obtained.

7. The method of claim 6, wherein, Based on the different average junction temperatures, the activation energy of the driving chip, the Boltzmann constant, and the junction temperature of the driving chip in the preset test, a plurality of acceleration factors of the chip are calculated, including: Obtaining a plurality of first inverses of the different average junction temperatures; Obtaining a second inverse of the junction temperature; Obtaining a plurality of first differences between the plurality of first inverses and the second inverse to obtain a plurality of first differences; Obtaining a first ratio of the activation energy and the Boltzmann constant to obtain a first ratio; Respectively obtaining a plurality of first products of the first ratio and the plurality of first differences; Based on a natural exponential function, the plurality of first products are calculated to obtain the plurality of acceleration factors.

8. The method of claim 6, wherein, Based on the plurality of acceleration factors, the working life of the driving chip at the highest junction temperature is obtained, including: Based on a preset temperature spectrum, different working times corresponding to the different average junction temperatures are determined, wherein the preset temperature spectrum can indicate the corresponding relationship between the different average junction temperatures of the driving chip and the different working times; Respectively obtaining a plurality of different working durations of the driving chip at the highest junction temperature by obtaining a ratio of the different working times and corresponding acceleration factors in the plurality of acceleration factors; Obtaining a sum of the plurality of different working durations to obtain the working life of the driving chip.

9. The method of claim 8, wherein, Based on a preset temperature spectrum, different working times corresponding to the different average junction temperatures are determined, including: Based on the preset temperature spectrum, different proportions of the working life of the driving chip at the different average junction temperatures are determined; Respectively obtaining a plurality of different working times by obtaining a product of the different proportions and a running time of a controller of the vehicle, wherein the controller is configured with the driving chip.

10. The method of claim 1, wherein, Based on the highest junction temperature and the working life, a target driving chip of the vehicle is determined, including: In response to the highest junction temperature being less than or equal to a preset junction temperature of the chip, and the working life being less than a preset time length, the driving chip is determined as the target driving chip of the vehicle; In response to the highest junction temperature being greater than the preset junction temperature, or the working life being greater than or equal to the preset time length, the driving chip is determined as not being the target driving chip of the vehicle.

11. The method of claim 1, wherein, After determining the target drive chip of the vehicle, the method further comprises: monitoring the load of the vehicle through the target drive chip, and determining whether to output an alarm information based on the monitoring result.

12. A drive chip configured to perform the method of any one of claims 1 to 10, the drive chip comprising: a logic control module connected with a main controller of the vehicle, configured to process an instruction from the main controller or decode a signal from the main controller to generate a corresponding control signal; an output drive module connected with the logic control module and a load of the vehicle, configured to convert the control signal into a power signal to drive the load to control the load to work; a diagnosis and protection module connected with the logic control module and the output drive module, configured to control the logic control module to stop working in a case where an abnormality of the power signal is monitored.

13. The drive chip of claim 12, wherein, The drive chip further comprises: a power management module connected with a power battery of the vehicle and the output drive module, the power management module being configured to provide power for the output drive module in a case where the power management module accepts power provided by the power battery.

14. An electronic device comprising: a memory storing an executable program; a processor configured to run the program, wherein the program performs the following method when running: obtaining a performance parameter of the drive chip, wherein the performance parameter comprises: a working voltage, a drive current, a working temperature, a working equivalent resistance, a chip thermal coefficient, a maximum working current, and a highest working temperature of the drive chip; based on the performance parameter, calculating a highest junction temperature of the drive chip and a working life of the drive chip at the highest junction temperature; based on the highest junction temperature and the working life, determining whether the drive chip is a target drive chip of the vehicle.

15. The electronic device of claim 14, wherein, The drive current of the drive chip comprises: a transient current and a working current, and the program further performs the following method when running: based on the maximum working current, the working equivalent resistance, the chip thermal coefficient, and the highest working temperature, calculating the highest junction temperature of the drive chip; based on the working temperature, calculating the working life of the drive chip at the highest junction temperature.

16. The electronic device of claim 14, wherein, The program further performs the following method when running: determining whether the drive chip passes a preset test, whether a range of the working voltage of the drive chip is greater than or equal to a range of a working voltage of a load of the vehicle, whether the transient current of the drive chip is greater than or equal to a starting current of the load, and whether the working current of the drive chip is greater than or equal to a working current of the load; in response to determining that the driving chip passes the preset test, and a range of working voltage of the driving chip is greater than or equal to a range of working voltage of the load of the vehicle, and a transient current of the driving chip is greater than or equal to a starting current of the load, and a working current of the driving chip is greater than or equal to a working current of the load, based on the performance parameters, a highest junction temperature of the driving chip is calculated, and a working life of the driving chip at the highest junction temperature is calculated; in response to determining that the driving chip does not pass the preset test, or a range of working voltage of the driving chip is less than a range of working voltage of the load of the vehicle, or a transient current of the driving chip is less than a starting current of the load, or a working current of the driving chip is less than a working current of the load, it is determined that the driving chip is not a target driving chip of the vehicle.

17. The electronic device of claim 15, wherein, The program further performs the following method when running: obtaining a square of the maximum working current to obtain a first square; obtaining a product of the first square and the working equivalent resistance to obtain a power of the driving chip under the maximum working current; based on the power, the chip thermal coefficient and the highest working temperature, the highest junction temperature is obtained.

18. The electronic device of claim 17, wherein, The program further performs the following method when running: obtaining a product of the power and the chip thermal coefficient to obtain a chip temperature rise of the driving chip; obtaining a sum of the chip temperature rise and the highest working temperature to obtain the highest junction temperature of the driving chip.

19. A computer readable storage medium comprising a stored executable program, wherein, The storage medium is controlled to perform the method of any one of claims 1-11 when the executable program runs.

20. A computer program product comprising a computer program which, when executed by a processor, implements the method of any one of claims 1-11.

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