Process automation field device

Abstract

The invention relates to a process automation field device (1) for determining a property of a medium, in particular a flowmeter (100) for determining a flow rate-based measurement variable, the field device being suitable for applications with a medium temperature higher than 100°C, comprising: - at least one sensor component (21) of a sensor (20) for determining the property of a medium, - at least one electronic component (31) of an electronic unit (30) for operating the sensor (20), - a housing (10) for accommodating the at least one sensor component (21) and the at least one electronic component (31), the housing (10) having a housing body (11) with a housing wall (12) and having a housing chamber (13), in particular exactly one housing chamber, which is delimited by the housing wall (12), the at least one electronic component (31) being at least partly provided in an electronics portion (EA) of the housing chamber (13), and the at least one sensor component (21) being at least partly provided in a sensor portion (SA) of the housing chamber (13); and - an insulating body (40) which at least partly separates the electronics portion (EA) from the sensor portion (SA), the insulating body (40) being designed to reduce convection between the sensor portion (SA) and the electronics portion (EA).

Description

[0001] Field device for process automation

[0002] The invention relates to a field device for process automation for determining a medium property of a medium, in particular a flow meter for determining a flow velocity-dependent measured quantity, suitable in applications with a medium temperature above 100°C.

[0003] In automation technology, particularly in process automation, field devices are frequently used to detect and / or control process variables. Sensors, such as those integrated into level gauges, flow meters, pressure and temperature gauges, pH / ORP meters, conductivity meters, etc., are used to detect process variables, measuring levels, flow rates, pressure, temperature, pH, and conductivity. Actuators, such as valves or pumps, are used to control process variables, changing the flow rate of a liquid in a pipe section or the fill level in a container. In principle, all devices used close to the process that provide or process process-relevant information are considered field devices.

[0004] A field device is specifically selected from a group consisting of flow meters, level meters, pressure meters, temperature meters, limit level meters and / or analytical measuring instruments.

[0005] Flow meters include, in particular, Coriolis, ultrasonic, vortex, thermal, and / or magnetic-inductive flow meters. Level meters include, in particular, radar-based level meters, microwave level meters, ultrasonic level meters, time-domain reflectometric level meters, radiometric level meters, capacitive level meters, inductive level meters, and / or temperature-sensitive level meters. Pressure meters include, in particular, absolute, gauge, or differential pressure meters. Temperature meters include, in particular, meters with thermocouples and / or temperature-dependent resistors. Limit level meters include, in particular, vibronic limit level meters, ultrasonic limit level meters, and / or capacitive limit level meters.Analytical measuring instruments include, in particular, pH sensors, conductivity sensors, oxygen and active oxygen sensors, (spectro)photometric sensors, and / or ion-selective electrodes.

[0006] Operating conditions for field devices are known in which the process medium can temporarily reach temperatures exceeding 100°C. This can occur, for example, with flow meters when cleaning or sterilizing the part in contact with the medium—such as the measuring tube. Due to the trend toward increasingly compact field devices, the electronics for operating the device are positioned as close as possible to the part in contact with the medium. However, this results in the electronics being briefly exposed to higher temperatures, which can lead to damage to the electronics, particularly to individual electronic components or components on the electronic component.

[0007] The invention is based on the objective of providing a field device that is suitable for being exposed to a medium temperature of more than 100°C for short periods.

[0008] The problem is solved by the field device according to claim 1.

[0009] The field device according to the invention for process automation for determining a medium property of a medium, in particular a flow meter for determining a flow velocity-dependent measured quantity, suitable in applications with a medium temperature above 100°C, comprises:

[0010] - at least one sensor component of a sensor for determining the medium property of a medium,

[0011] - at least one electronic component of an electronic system for operating the sensor,

[0012] - a housing for accommodating the at least one sensor component and the at least one electronic component, wherein the housing comprises a housing body with a housing wall, wherein the housing comprises one, in particular precisely one, housing chamber which is bounded by the housing wall, wherein the at least one electronic component is arranged at least partially in an electronics section of the housing chamber, and wherein the at least one sensor component is arranged at least partially in a sensor section of the housing chamber; and

[0013] - an insulating body that at least partially separates the electronics section from the sensor section, wherein the insulating body is designed to reduce convection between the sensor section and the electronics section.

[0014] An advantage of the solution according to the invention is the reduction of the electronics temperature by 1 to 3 °C when the medium reaches a temperature of 150 °C. This has a significant impact on the aging of the at least one electronic component.

[0015] Advantageous embodiments of the invention are the subject of the dependent claims.

[0016] One embodiment provides that the insulating body comprises a foam, in particular preferably expanded polypropylene or preferably expanded polystyrene. Another embodiment provides that the insulating body has a basic shape extending from a first inner side of the housing wall, in particular a frame element of the housing wall, to a second inner side of the housing wall, in particular a frame element of the housing wall, wherein a side arm extends from the basic shape itself in two spaced-apart end sections, in particular perpendicular to the basic shape.

[0017] An advantage of this design is that the side arms allow for a reduction in the electronics temperature in the adjacent edge area by up to 1.3 °C compared to a field device without insulation.

[0018] One embodiment provides that the at least one electronic component comprises a printed circuit board on which electronic components are arranged, wherein the insulating body, in particular the two side arms of the insulating body, are positioned relative to the printed circuit board in such a way that, in a top view of the printed circuit board, the insulating body, in particular the two side arms of the insulating body, each covers a partial section of the printed circuit board, in particular in an edge region of the printed circuit board, wherein the printed circuit board has a further partial section which, in a top view of the printed circuit board, is not covered by the insulating body, in particular not by the side arms.

[0019] This has the advantage that electronic components, which generate increased heat during operation, can dissipate this heat more effectively, and the electronic temperature during operation can be kept below a certain limit.

[0020] One embodiment provides that at least one of the listed electronic components is arranged in the further subsection (TA3):

[0021] - Transformer,

[0022] - Capacitor,

[0023] - Throttle coil,

[0024] - Power supply components,

[0025] - Voltage or current regulators,

[0026] - Voltage converter.

[0027] One embodiment provides that the insulating body is arranged in the housing chamber in such a way that the side arms extend along an inner lateral surface of the housing wall.

[0028] One embodiment provides that the two side arms each have a different length. This allows electronic components that generate little heat during operation to be covered by the insulating body, while selectively allowing the heat dissipation of these components to the environment.

[0029] One embodiment provides that the insulating body is arranged in the housing chamber in a form-fitting manner.

[0030] One embodiment provides that the insulating body, in particular the two side arms, has a contact surface on one side facing away from at least one electronic component, which rests against one or the inner surface of the housing wall and which forms a mold against the housing wall.

[0031] One embodiment provides that the insulating body is spaced away from at least one electronic component, in particular the circuit board.

[0032] One embodiment provides that the sensor section contains a hardened potting compound to prevent condensation from forming on the at least one sensor component, with the basic shape being at least partially covered by the potting compound.

[0033] One embodiment provides that the insulating body, in conjunction with another component, in particular a cable guide, completely separates the sensor section from the electronics section, especially in a cross-sectional plane through the housing chamber.

[0034] This has the advantage of further reducing convection between the sensor section and the electronics section.

[0035] One embodiment provides that the cable routing is designed to hold at least one cable, which connects the sensor, in particular the at least one sensor component, to the electronics, in particular to the at least one electronic component, in a predetermined cable position and to protect it against tensile force and vibration.

[0036] One design provides that the insulating body has a recess into which the component, in particular the cable routing, engages. This has the advantage of simplified installation.

[0037] One embodiment provides that the housing wall comprises a shell element and a frame element, wherein the shell element is materially bonded to the frame element, in particular via a welded connection, wherein the shell element has an average thermal conductivity that is higher than an average thermal conductivity of the frame element, wherein the insulating body is shaped and positioned in the housing chamber in such a way that heat convection from the frame element towards a center point of the at least one sensor component is reduced.

[0038] One embodiment provides that the housing includes a housing neck which is arranged between the sensor section and the electronics section, wherein the insulating body extends at least partially through the housing neck or is arranged at least partially in the housing neck.

[0039] One embodiment provides that the field device is a magnetic-inductive flowmeter with a measuring tube, wherein the at least one sensor component comprises a magnetic field-generating device arranged on an outer surface of the measuring tube, in particular with at least one magnetic coil, and at least two measuring electrodes.

[0040] The invention is explained in more detail with reference to the following figures. They show:

[0041] Fig. 1: a perspective view of a field device;

[0042] Fig. 2a, b: two side views of the interior of a field device;

[0043] Fig. 3: a perspective view of an insulating body in conjunction with a cable routing;

[0044] Fig. 4: a side view of an insulating body in conjunction with a cable guide and an electronic component;

[0045] Fig. 5a-c: three cross-sections through a field device offset along an axis.

[0046] Fig. 1 shows a perspective view of a field device (1) for process automation for determining a medium property. This field device (1) is suitable for applications with a medium temperature of 100°C or higher. Specifically, the illustrated configuration shows a flow meter (100) for determining a flow velocity-dependent measured quantity. This flow velocity-dependent measured quantity can be a flow velocity, a volumetric flow rate, or a mass flow rate. The sensor (20, see Fig. 1) required for determining the flow velocity-dependent measured quantity is shown in Fig. 1.2a, 2b and 5b) may, depending on the measuring principle, comprise as a sensor component (21) a magnetic field generating device, a magnetic field guiding device, at least two measuring electrodes, a vortex paddle, at least one excitation coil, at least one sensor coil, at least one microwave antenna, at least two ultrasonic transducers and / or at least two temperature sensors (e.g. resistance thermometers).

[0047] The illustrated field device (1) comprises a housing (10) for accommodating the at least one sensor component (21, see Figs. 2a, 2b) and the at least one electronic component (31, see Figs. 2a, 2b) of the electronics (30). The electronics (30) are configured to operate the field device (1), in particular the flow meter (100), and / or to determine the medium property, especially the flow velocity-dependent measured quantity. The electronics (30) may include a signal input and / or a signal output. The housing (10) comprises a housing body (11), which in turn has a housing wall (12). The housing body (11) may be made of plastic, metal, or a fiber composite. The housing wall (12) may, for example, be a sheet metal wall, particularly a thin-walled one. Thus, the housing wall (12) may be formed in multiple parts.A casing element (14) and a frame element (15) can be joined together, in particular by a material bond, to form the housing wall (12). The casing element (14) can be joined to the frame element (15) by a material bond, in particular by a weld. Alternatively, a form-fit and / or force-fit connection can also be provided. The frame element (15) can comprise a single component, in particular a bent one, or an assembly composed of several components. The casing element (14) preferably has an average thermal conductivity that is higher than the average thermal conductivity of the frame element (15). This results in a reduced heat transfer from the medium via the frame element (15) to the at least one electronic component (31) and an increased dissipation of the heat generated at the electronic component (31) to the environment via the casing element (14).This can be adjusted by selecting the wall thickness of the individual elements. For example, the wall thickness of the wall element (14) can be less than the wall thickness of the frame element (15). The frame element (15) has a greater thickness than the wall element (14) because it must possess sufficient mechanical stability to support or hold, for example, a measuring tube (101).

[0048] The housing (10) has one, in particular exactly one, housing chamber (13, see Figs. 2a, 2b), which is bounded by the housing wall (12) and in which at least one electronic component (31) and / or the sensor component (21) is arranged at least partially. The at least one electronic component (31) is arranged at least partially in an electronics section (EA) of the housing chamber (13), and the at least one sensor component (21) is arranged at least partially in a sensor section (SA) of the housing chamber (13). The housing (10) shown further comprises a housing neck (19), which housing neck (19) is arranged between the sensor section (SA) and the electronics section (EA). The housing neck (19) can be designed as a connecting tube. In contrast, the housing neck (19) of the embodiment is designed as a tapered section of the housing body (11).The housing wall (12) is bent inwards towards the housing chamber (13) on two opposite sides in the area of ​​the housing neck (19), so that the housing wall (12) is essentially U-shaped in the area of ​​the housing neck (19) (see Fig. 5a-c).

[0049] According to the invention, the field device has an insulating body (40) that spatially separates at least partially the electronics section (EA) from the sensor section (SA). An embodiment of the insulating body (40) is shown, for example, in Figures 2a to 5c. The insulating body (40) is designed and configured to reduce heat convection, i.e., heat transfer between the sensor section (SA) and the electronics section (EA). This means that the electronics section (EA) and the at least one electronic component (31) arranged therein require more time to reach a temperature increase caused by the elevated medium temperature. This ensures that the medium can briefly reach the temperature required, for example, for cleaning or sterilization processes, while the resulting electronics temperature of the electronics section (EA), in particular of the electronics (30), is reduced.the electronic component (31), however, remains below a critical limit. This results in the aging of the at least one electronic component (31) being reduced and the service life and reliability of the at least one electronic component (31) remaining stable.

[0050] The insulating body (40) can be shaped and positioned in the housing chamber (13) such that convection originating from the frame element (15) towards a center point (MP) of the at least one sensor component (31) is reduced, at least in sections. The medium under investigation can have a medium temperature that is significantly higher than the ambient temperature. For short periods, the medium temperature can also exceed the maximum application temperature specified for the field device (1). In this case, the medium temperature heats the housing wall (12), in particular the frame element (15) and the casing element (14). These release the heat to the environment but also conduct it towards the electronics section (EA).In order to prevent the heat emitted by the frame element (15) from being directed to at least one electronic component (31) and thus causing the electronic temperature there to exceed a critical limit, the insulating body (40) also extends at least partially between the frame element (15) and the electronic component (31).

[0051] The insulating body (40) can extend at least partially through the housing neck (19) or is at least partially located in the area of ​​the housing neck (19). Optionally, an opening for a display (not shown) can be provided in the housing wall (13), in which a display for showing measured values ​​and / or status information is arranged.

[0052] The electronics (30), in particular the at least one electronic component (31), may comprise at least one transformer, one capacitor, one inductor, one power supply component, one voltage or current regulator, and / or one voltage converter. Furthermore, the electronics (30) may include a display, operating, measuring, and / or evaluation circuit. The electronics (30) may also include a microprocessor and / or a microcontroller.

[0053] Figures 2a and 2b each show a side view of the interior of the field device of Figure 1. The wall element (14) of Figure 1 has been removed. The housing chamber (13) contains at least one sensor component (21) of the sensor (20) for determining the medium property of a medium – in this case, the flow velocity-dependent measured quantity – and at least one electronic component (31) of the electronics (30) for operating the sensor (20) – e.g., a printed circuit board with the necessary operating, measuring, and / or evaluation circuitry.

[0054] The insulating body (40) can comprise a foam, in particular preferably expanded polypropylene or preferably expanded polystyrene. Alternatively, the insulating body can also consist entirely of a foam, in particular preferably expanded polypropylene or preferably expanded polystyrene. However, the insulating body (40) is preferably made of polypropylene, since the mechanical properties of the insulating body (40) made of polypropylene are better suited for assembly.

[0055] The illustrated insulating body (40) has a basic shape (41) that extends from a first inner side (42a) of the housing wall (12), in particular of a frame element (15) of the housing wall (12), to a second inner side of the housing wall (12), in particular of the frame element (15) of the housing wall (22). This ensures that a section plane separating the at least one sensor component (21) from the at least one electronic component (31) is filled as completely as possible by the insulating body (40).

[0056] Furthermore, in two spaced-apart end sections of the basic shape (41) – each adjoining the frame element (15) – a side arm (43a, 43b) can extend from the basic shape (41) itself, in particular perpendicular to the basic shape (41). These two side arms (43a, 43b), which extend along the frame element (15), in particular along an inner surface of the housing wall (12), prevent the heat conducted from the sensor component (e.g., the measuring tube) via the frame element (15) from being transferred directly via the air in the electronics section (EA) to the at least one electronic component (31). The two side arms (43a, 43b) are thus designed to reduce convection from the frame element (15) to the at least one electronic component (31).The exposed area spanned by the two side arms (43a, 43b) is chosen to be exposed in order to allow the heat generated by the at least one electronic component (31) to be dissipated via the air in the electronics section (EA) towards the wall element (14).

[0057] The at least one electronic component (31) can be an electrically insulating electronic component carrier, in particular a printed circuit board (32), on which electronic components (33) are arranged to form an operating, measuring and / or evaluation circuit.

[0058] The insulating body (40), in particular its two side arms (43a, 43b), can be positioned relative to the electronic component carrier, in particular the printed circuit board (32), such that, when viewed from above, the insulating body (40), in particular its two side arms (43a, 43b), each covers a partial section (TA1, TA2) of the electronic component carrier, in particular the printed circuit board (32), especially in an edge region of the printed circuit board (32). At the same time, the electronic component carrier, in particular the printed circuit board (32), has a further partial section (TA3) which, when viewed from above, is not covered by the insulating body (40), in particular not by its side arms (43a, 43b).The further subsection (TA3) differs from the subsections (TA1) and the subsection (TA2) in that at least one transformer (33a), one capacitor (33b), one choke coil (33d), one power supply component (33c), one voltage or current regulator and / or one voltage converter (33e) is or are arranged in the further subsection (TA3), while the subsection (TA1) and the subsection (TA2) are free of the aforementioned electronic components (33).

[0059] The two side arms (43a, 43b) can each have a side arm length (L1, L2). The two side arm lengths (L1, L2) can be identical. In the illustrated embodiment, the two side arm lengths (L1, L2) differ from each other. Side arm (43a) with side arm length (L2) is shorter than side arm (43b) with side arm length (L1).

[0060] The insulating body (40) can be positively fitted into the housing chamber (13). For this purpose, the insulating body (40) can have a receptacle (44, see Figs. 3 and 4) with which it interacts with another component of the field device (1) that is fixedly arranged in the housing chamber (13). Alternatively or additionally, the insulating body (40) can have a bearing surface (47) with which it rests on a component of the field device (1) that is fixedly positioned in the housing chamber (13). This component can be, for example, a grounding socket (110) and / or a dome mount (111) (e.g., a fixed threaded sleeve) via which a flange with the measuring tube can be fixed (e.g., by means of a screw). Furthermore, the insulating body (40), in particular the two side arms (43a, 43b), can have a contact surface (45) on one side facing away from at least one electronic component (31), which is connected to a orthe inner surface of the housing wall (12) and which conforms to the housing wall (12). For this purpose, the insulating body (40) can, at least in sections, assume a shape that resembles or corresponds to the contour of the housing wall (12), in particular the outer element (14).

[0061] The insulating body (40) can be spaced apart from the at least one electronic component (31), in particular the printed circuit board (32), i.e., the insulating body (40) is not in direct contact with the at least one electronic component (31), in particular with the printed circuit board (32). The insulating body (40) is therefore not designed to support a printed circuit board (32) or a display and is thus not equivalent to holding devices made of expanded polypropylene (e.g.). The insulating body (40) is mechanically fixed to the cable guide (50). The cable guide (50) can be an injection-molded plastic component that is positively and / or force-fit connected to a support (80) for holding the at least one electronic component (31).The carrier (80) comprises a main body (81) with at least one strip-shaped extension (82) which is folded inwards, forming a two-layer area in which an internal thread is arranged and which has a contact surface that is in contact with the at least one electronic component (31). Furthermore, the main body (81) has several strip-shaped extensions which are bent with respect to a reference plane defined by the main body and via which the carrier (80) is connected to the frame element (15). The main body (81) is made of a sheet approximately 1.5 mm thick, which has three strip-shaped extensions (82) and four strip-shaped extensions and bent extensions. The electrically conductive extensions (82) are U-shaped and thus form a contact area approximately 3 mm thick.A contact area has a through-hole with an internal thread to accommodate a connecting element (83) (e.g., a screw, a bolt, or a rivet). Additional electrically conductive connecting elements are provided to connect the support (80) to the frame element (15) by spot soldering or resistance spot welding, creating an electrically conductive connection between the main body (80) and the frame element (15).

[0062] The sensor section (SA) contains a potting compound (16), which is cast into the housing chamber (13), particularly after the at least one sensor component (21) and / or electronic component (31) has been mounted, and which has cured to prevent condensation on the at least one sensor component (21). The potting compound (16) can, for example, be a silicone rubber that vulcanizes into a soft silicone gel at room temperature thanks to a crosslinking agent. The basic shape (41) of the insulating body (40) is at least partially covered or wetted with the potting compound (16). The insulating body (40) can also serve to separate the potting compound (16) in the sensor section (SA) from the electronic section (EA). It is advantageous if the electronic section (EA) is free of potting compound (16).

[0063] The insulating body (40), in conjunction with another component, in particular a cable guide (50) for guiding cables connecting the at least one sensor component (21) to the at least one electronic component (31), can completely separate the sensor section (SA) from the electronic section (EA), particularly in a cross-sectional plane (SE) through the housing chamber (13). Complete separation within the meaning of the invention means a coverage of the cross-sectional area of ​​the electronic chamber (13) in the cross-sectional plane (SE) by more than 80%, in particular 90%. The cross-sectional plane (SE) is perpendicular to the cross-sectional plane of the field device (1). If the field device (1) is a flow meter (100), the cross-sectional plane (SE) runs perpendicular to a cross-sectional plane of the measuring tube (101) and also perpendicular to a longitudinal plane of the measuring tube (101).

[0064] The cable guide (50) is designed to hold at least one cable (60), which connects the sensor (20), in particular the at least one sensor component (21), to the electronics (30), in particular to the at least one electronic component (31), in a predetermined cable position and to protect it against tensile force and vibration. The cable guide (50) can be an injection-molded component made of plastic.

[0065] Fig. 3 shows a perspective view of an insulating body (40) in conjunction with a cable guide (50). Fig. 4 shows a cross-section through an insulating body (40) in conjunction with a cable guide (50) and an electronic component (31). The cable guide (50) is designed to hold at least one cable (60), which connects the sensor (20), in particular the at least one sensor component (21), to the electronics (30), in particular to the at least one electronic component (31), in a predetermined cable position and to protect it against tensile force and vibration. The insulating body (40) has a receptacle (44) which encompasses the cable guide (50) at least partially. The receptacle (44) itself is formed by at least two webs (48a, 48b) projecting from the base shape (41). The cable guide (50) is planar in certain sections. At least one planar section of the cable guide extends into the receptacle (44) of the insulating body (40).In the illustrated embodiment (see Fig. 4), the at least one electronic component (31) comprises a printed circuit board (32) on which electronic components (33) are arranged. The printed circuit board (32) also provides at least one connection component for a cable (60), which cable (60) connects the at least one electronic component (31), in particular the printed circuit board (32), to the at least one sensor component (21).

[0066] Figures 5a-5c show three cross-sections offset along an axis through the field device (1) of the previous figures, in particular through a flow meter (100). The flow meter (100) is a magnetic-inductive flow meter (200). The magnetic-inductive flow meter (200) comprises a magnetic field-generating device with at least one electromagnetic coil (saddle coil or cylindrical coil), in particular with exactly two electromagnetic coils (210a, 210b), preferably arranged opposite each other, and / or at least one permanent magnet. The magnetic field-generating device is configured to generate a magnetic field penetrating the measuring tube (101) and the medium flowing through the measuring tube in the application. Furthermore, the magnetic field-generating device can have at least one coil core (211), preferably with a pole piece.The magnetic-inductive flowmeter (200) further comprises a measuring tube (101) with a support tube, in particular made of metal, and an electrical liner in the form of a coating or an inserted tube or hose. Alternatively, the support tube can be made, in particular entirely, of an electrically insulating plastic or ceramic. In this case, an electrically insulating liner is not necessary. The support tube has two openings, in particular opposite openings, each containing a measuring electrode (130a, 130b). The measuring electrodes (130a, 130b) are electrically connected to a measuring circuit—which can be part of the electronics—that is configured to measure a measuring voltage induced in the flowing medium and, depending on this, to determine the flow velocity-dependent measured quantity.

Claims

PATENT CLAIMS 1. Field device (1) for process automation for determining a medium property of a medium, in particular a flow meter (100) for determining a flow velocity-dependent measured quantity, suitable for applications with a medium temperature above 100°C, comprising: - at least one sensor component (21) of a sensor (20) for determining the medium property of a medium, - at least one electronic component (31) of an electronics (30) for operating the sensor (20), - a housing (10) for accommodating the at least one sensor component (21) and the at least one electronic component (31), wherein the housing (10) comprises a housing body (11) with a housing wall (12), wherein the housing (10) comprises a, in particular precisely one, housing chamber (13) which is bounded by the housing wall (12), wherein the at least one electronic component (31) is arranged at least partially in an electronic section (EA) of the housing chamber (13), and wherein the at least one sensor component (21) is arranged at least partially in a sensor section (SA) of the housing chamber (13); and - an insulating body (40) that at least partially separates the electronics section (EA) from the sensor section (SA), wherein the insulating body (40) is configured to reduce convection between the sensor section (SA) and the electronics section (EA).

2. Field device (1) according to claim 1, wherein the insulating body (40) comprises a foam, in particular a, preferably expanded, polypropylene or a, preferably expanded, polystyrene.

3. Field device (1) according to claim 1 or 2, wherein the insulating body (40) has a basic shape (41) extending from a first inner side (42a) of the housing wall (12), in particular a frame element (15) of the housing wall (12), to a second inner side of the housing wall (12), in particular a frame element (15) of the housing wall (22), wherein a side arm (43a, 43b) extends from the basic shape (41) itself in two spaced-apart end sections, in particular perpendicular to the basic shape (41).

4. Field device (1) according to claim 3, wherein the at least one electronic component (31) comprises a printed circuit board (32) on which electronic components (33) are arranged, wherein the insulating body (40), in particular the two side arms (43a, 43b) of the insulating body (40), are positioned relative to the printed circuit board (32) such that, in a top view of the printed circuit board (32), the insulating body (40), in particular the two side arms (43a, 43b) of the insulating body (40), each conceals a partial section (TA1, TA2) of the printed circuit board (32), in particular in an edge region of the printed circuit board (32), wherein the printed circuit board (32) has a further partial section (TA3) which, in a top view of the printed circuit board (32), is not concealed by the insulating body (40), in particular not by the side arms (43a, 43b).

5. Field device (1) according to claim 4, wherein at least one of the listed electronic components (33) is arranged in the further subsection (TA3): - Transformer (33a), - Capacitor (33b), - Throttle coil (33d), - Power supply components (33c), - Voltage or current regulators, - Voltage converter (33e).

6. Field device (1) according to one of claims 3 to 5, wherein the insulating body (40) is arranged in the housing chamber (13) such that the side arms (43a, 43b) extend along an inner lateral surface of the housing wall (12).

7. Field device (1) according to one of claims 3 to 6, wherein the two side arms (43a, 43b) each have a side arm length (L1 , L2), wherein the two side arm lengths (L1 , L2) differ from each other.

8. Field device (1) according to one of the preceding claims, wherein the insulating body (40) is arranged in a form-fitting manner in the housing chamber (13).

9. Field device (1) according to one of the preceding claims, wherein the insulating body (40), in particular the two side arms (43a, 43b), has a contact surface (45) on one side facing away from the at least one electronic component (31), which rests against one or the inner cladding surface of the housing wall (12) and which forms itself against the housing wall (12).

10. Field device (1) according to one of the preceding claims, wherein the insulating body (40) is spaced apart from at least one electronic component (31), in particular from the circuit board (32).

11. Field device (1) according to one of the preceding claims, wherein a hardened potting compound (16) is located in the sensor section (SA) to prevent condensation on the at least one sensor component (21), wherein the basic shape (41) is at least partially covered with the potting compound (16).

12. Field device (1) according to one of the preceding claims, wherein the insulating body (40) in conjunction with a further component, in particular a cable guide (50), completely separates the sensor section (SA) from the electronics section (EA), in particular in a section plane (SE) through the housing chamber (13).

13. Field device (1) according to claim 12, wherein the cable guide (50) is configured to hold at least one cable (60), which connects the sensor (20), in particular the at least one sensor component (21), with the electronics (30), in particular with the at least one electronic component (31), in a predetermined cable position and to protect it against tensile force and vibration.

14. Field device (1) according to claim 12 or 13, wherein the insulating body (40) has a receptacle (44) into which the component, in particular the cable guide (50), engages.

15. Field device (1) according to one of the preceding claims, wherein the housing wall comprises a shell element (14) and a frame element (15), wherein the shell element (14) is materially bonded to the frame element (15), in particular via a welded connection, wherein the shell element (14) has an average thermal conductivity that is higher than an average thermal conductivity of the frame element (15), wherein the insulating body (40) is shaped and positioned in the housing chamber (13) such that heat convection from the frame element (15) towards a center point (MP) of the at least one sensor component (31) is reduced.

16. Field device (1) according to one of the preceding claims, wherein the housing (10) comprises a housing neck (19) which is arranged between sensor section (SA) and electronics section (EA), wherein the insulating body (40) extends at least partially through the housing neck (19) or is arranged at least partially in the housing neck (19).

17. Field device (1) according to one of the preceding claims, wherein the field device (1) is a magnetic-inductive flow meter (200) with a measuring tube (101), wherein the at least one sensor component (21) comprises a magnetic field generating device (102) arranged on an outer lateral surface of the measuring tube (101), in particular with at least one magnetic coil (103), and at least two measuring electrodes (104a, 104b).

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