Passive radio-frequency component

Abstract

The invention relates to a passive radio-frequency component (1) for transmitting radio-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band, the passive radio-frequency component (1) having the following connections: a common-mode connection (2), which is designed to transmit the common-mode signal, differential-mode connections (3) and (4), which are designed to transmit the differential-mode signal, and antenna connections (5) and (6), which are designed to transmit the common-mode signal and the differential-mode signal.

Description

[0001] Description

[0002] PASSIVE HIGH-FREQUENCY COMPONENT

[0003] TECHNICAL AREA

[0004] The invention relates to a passive high-frequency component for transmitting high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band, a method for manufacturing a passive high-frequency component, a method for operating a passive high-frequency component, as well as a computer program for it and a data carrier for it.

[0005] The following background information is intended solely to provide information necessary for understanding the relationship between the inventive ideas and concepts disclosed herein. Therefore, this background section may contain patentable subject matter and should not be considered prior art per se.

[0006] BACKGROUND

[0007] In-Band Full-Duplex (IBFD) technology represents a significant advancement in wireless communication. Unlike traditional communication systems that operate in half-duplex mode (either transmitting or receiving at a given time) or out-of-band full-duplex mode (using separate frequency bands for transmitting and receiving), IBFD enables simultaneous transmission and reception on the same frequency. This capability has the potential to double spectral efficiency and significantly improve the performance and capacity of wireless networks.

[0008] A key advantage of IBFD technology is the doubling of spectral efficiency. By simultaneously using the same frequency band for transmitting and receiving, twice as much data can be transmitted in the same amount of spectrum. This is particularly important given the limited availability of wireless spectrum. Furthermore, IBFD reduces latency because data can be sent and received concurrently. This results in faster data transmission and is especially beneficial for real-time applications such as online gaming, video conferencing, and autonomous driving.

[0009] A major technical obstacle to IBFD is self-interference, where the transmitted signal interferes with the received signal. To reduce this self-interference and enable effective full-duplex communication, advanced signal processing techniques such as adaptive filtering and specialized antenna designs are employed, which can increase the cost and power consumption of communication devices. Integrating IBFD technology into existing wireless standards and ensuring compatibility with current communication systems present further challenges.

[0010] By overcoming these obstacles and challenges, using the available spectrum more efficiently, and reducing latency, IBFD can significantly improve the overall performance of wireless networks. This is particularly important to meet the growing demand for high-speed data services.

[0011] In summary, in-band full-duplex (IBFD) technology has great potential to revolutionize wireless communication by doubling spectral efficiency, reducing latency, and increasing network performance. However, significant technical challenges must be overcome before widespread adoption can occur. IBFD technology can therefore be a key technology for future wireless networks, including 5G and future 6G systems.

[0012] The invention aims to contribute to this technology, in particular to provide a simple and cost-effective component for this technology. SUMMARY

[0013] This summary serves to present a selection of features and concepts of the invention, which are explained further in the description below. This summary is not intended to identify important or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0014] According to the invention, the above-mentioned problem is solved by the features of the independent claims.

[0015] Specifically, the task is solved by a passive high-frequency component. This passive high-frequency component is designed to transmit high-frequency signals, comprising a common-mode signal and a differential-mode signal, within a frequency band. The passive high-frequency component has a common-mode terminal. The common-mode terminal is configured to transmit the common-mode signal. In other words, the common-mode signal can either be received or transmitted via the common-mode terminal. The passive high-frequency component also has differential-mode terminals. These differential-mode terminals are configured to transmit the differential-mode signal. In other words, the common-mode signal can either be sent or received via the differential-mode terminals.For example, the common-mode and differential-mode terminals can be arranged such that, preferably simultaneously, one of the common-mode and one of the differential-mode signals is transmitted and another is received. The passive high-frequency component has antenna connections. The antenna connections are arranged to transmit the common-mode and differential-mode signals, preferably simultaneously. In other words, forward and reverse transmission of each of the high-frequency signals.

[0016] The invention has the advantage that a passive high-frequency component for operation in transceivers can be provided in a cost-effective and simple manner. The passive high-frequency component can be configured to transmit the common-mode signal and the differential-mode signal simultaneously in the frequency band, preferably to transmit or receive the common-mode signal and, conversely, especially to receive or transmit the differential-mode signal.

[0017] Advantageous embodiments of the invention are specified in the dependent claims.

[0018] The passive high-frequency component can be configured to simultaneously receive the common-mode signal and transmit the differential-mode signal. The passive high-frequency component can also be configured to simultaneously transmit the sliding-mode signal and receive the differential-mode signal.

[0019] This allows the bandwidth of a transceiver to be increased.

[0020] The passive high-frequency component's connections for transmitting high-frequency signals can have an odd number. For example, the common-mode connection can consist of one connection. The differential-mode connections can consist of two connections. It is also possible to have several separate common-mode connections, each to be driven by a common-mode signal. A multiple of two differential-mode connections, each to be driven by a differential-mode signal, can also be used.

[0021] The high-frequency signals can therefore be separated in a simple way.

[0022] The passive high-frequency component can be a printed circuit board (e.g., a single piece). Alternatively, the high-frequency component can consist of a combination of circuit boards. For example, one side of the circuit board can provide a metallic structure for the passive high-frequency component to function. Concentrated components can also be arranged on this side. The opposite side of the circuit board can have a (full-)area metallization that acts as a ground plane.

[0023] The passive high-frequency component can preferably be designed in the form of a coplanar line, as microstrip lines, or as a symmetrically or asymmetrically embedded strip line.

[0024] The antennas to be connected to the antenna terminals can be part of the passive high-frequency component and, for example, be designed as patch antennas (microstrip antennas). For this purpose, the patch antennas can be arranged on the same side of the circuit board and symmetrically to the rest of the circuit to ensure sufficient spatial separation.

[0025] The passive high-frequency component can be designed as a transmit / receive switch to transmit high-frequency signals simultaneously in one and the same frequency band.

[0026] This means that unnecessarily complicated components such as switches can be eliminated or omitted.

[0027] The first characteristic impedance of a first transmission line between the differential-mode terminals can be lower than the second characteristic impedance of second transmission lines. The second transmission lines can each be located between one of the (two) differential-mode terminals and one of the (two) antenna terminals. The second transmission lines can connect each differential-mode terminal to each antenna terminal. The second characteristic impedance can correspond to a system impedance, for example, 50 ohms. The second characteristic impedance can be lower than the third characteristic impedance of third transmission lines. The third transmission lines are each located between one of the antenna terminals and the common-mode terminal. The third transmission lines can connect each antenna terminal to the common-mode terminal. The first, second, and third transmission lines can together form a closed loop.The individual lines can have an electrical length of less than 0.7t / f relative to an operating center wavelength X or 0.7t / f relative to an operating center frequency f. Each individual line can have an electrical length of X / 2 or X / 4. For example, the first line has an electrical length less than 0.7t / f, for example, an electrical length of X / 2. For example, the second line, or each of the second lines, has an electrical length less than k / 2, for example, an electrical length of X / 4. For example, the third line, or each of the third lines, has an electrical length less than k / 2, for example, an electrical length of X / 4.

[0028] This saves space. It goes without saying that all connections are electrically conductive. This electrically conductive connection can be the ring connection formed by the connections.

[0029] All connections can have the same characteristic impedance, preferably corresponding to the second characteristic impedance mentioned above. To simplify manufacturing and avoid inaccuracies, the ring can consist of four straight, interconnected conductor segments with a length x width of k / 2 x x / 4. The length can correspond to the distance between the antenna connections and / or the differential-mode connections. The width can correspond to the distance between one corresponding antenna connection and one corresponding differential-mode connection. The common-mode connection can be located midway between the antenna connections.

[0030] The symmetrical arrangement allows for effective separation of the differential-mode and common-mode signals.

[0031] The first wave impedance can be at least 1 time (or 2 times or 3 times) greater than the third wave impedance. The first wave impedance can be at least 1 time (or 1.5 times or 2 times) greater than the second wave impedance. The second wave impedance can be at least 1 time (1.25 times or 1.5 times) greater than the third wave impedance. For example, the third wave impedance can be at least 2 times that of the second wave impedance. Furthermore, the second wave impedance can be at least 2 times that of the first wave impedance.

[0032] Alternatively, discrete components can be used instead of one or more of the first, second, and third lines. For example, a first T-circuit consisting of two first coils and a first capacitor can be connected between the push-pull terminals. One end of the first capacitor can be connected to ground. Each end of the two first coils can be connected to a corresponding push-pull terminal, and their respective other ends can be connected to the other end of the first capacitor. Similarly, a second T-circuit consisting of two second coils and a second capacitor can be connected between the antenna terminals. One end of the second capacitor can be connected to ground. Each end of the two second coils can be connected to a corresponding push-pull terminal, and their respective other ends can be connected to the other end of the second capacitor.Alternatively, a capacitor can connect each pair of antenna and push-pull terminals. Another option is to replace the coils of the first and second T-circuits with coupled inductors.

[0033] The aforementioned problem is also solved by a method for manufacturing a passive high-frequency component, preferably as described above for transmitting high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band. The method comprises providing, in particular by metal printing, the following connections to the passive high-frequency component: a common-mode connection for transmitting the common-mode signal, differential-mode connections for transmitting the differential-mode signal, and antenna connections for transmitting both the common-mode and differential-mode signals. The invention thus has the advantage that a passive high-frequency component for operation in transceivers can be provided in a cost-effective and simple manner.

[0034] Furthermore, the circuit board can be prepared upstream and undergo various stages of metal printing. For example, a base layer can first be applied to one side of the board, followed by the configuration of the passive high-frequency component as a single metal layer on the other side. Here, a PCB manufacturing device can, for instance, first laminate a thin metal layer (e.g., copper) onto a dielectric substrate. Subsequently, a photolithographic process can be used, in which the desired conductive traces are formed by exposure and subsequent etching to create the functionality of the passive high-frequency component. The unprotected areas of the metal are removed, leaving only the desired metallic conductive traces on the circuit board, which define the functionality of the passive high-frequency component.

[0035] The aforementioned problem is also solved by a method for operating a passive high-frequency component, preferably as described above. The method comprises transmitting high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band.

[0036] The transmission of high-frequency signals includes, firstly, feeding the common-mode signal via a common-mode connection of the passive high-frequency component, transmitting the common-mode signal via antenna connections of the passive high-frequency component, receiving the differential-mode signal via the antenna connections of the passive high-frequency component, and tapping the differential-mode signal via differential-mode connections of the passive high-frequency component.

[0037] The transmission of high-frequency signals includes, on the other hand, feeding the differential-mode signal via the push-pull terminals of the passive high-frequency component, transmitting the differential-mode signal via the antenna terminals of the passive high-frequency component, receiving the common-mode signal via the antenna terminals of the passive high-frequency component, and tapping the common-mode signal via a common-mode terminal of the passive high-frequency component.

[0038] The invention has the advantage that a passive high-frequency component can be provided for operation in a transceiver in a cost-effective and simple manner.

[0039] The aforementioned task is also solved by a computer program. The computer program comprises instructions which, when executed by a computer, cause the computer to execute or initiate the procedure described above, or at least one of its steps. The computer program could, for example, be a module for starting / operating the aforementioned transceiver or a corresponding PCB manufacturing device, as described herein.

[0040] The aforementioned task can also be accomplished using a data storage medium. The computer program can be stored on a machine-, processor-, or computer-readable storage medium, such as a permanent or rewritable storage medium. This also includes the possibility that the computer program can be made available for download on a server or a cloud server, for example, via a data network such as the internet or a communication connection such as a wireless connection.

[0041] In other words, the invention relates to a transceiver with a passive component in the form of a Gysel power divider or combiner, which is repurposed as a transmit / receive switch. This allows a signal to be transmitted and received simultaneously. The invention thus enables the simultaneous transmission and reception of radio signals in the same frequency band. Separating the transmit and receive bands would otherwise require more usable frequency spectrum. Separating the transmit and receive bands in the time domain would reduce the data rate. Separation of common-mode and differential-mode operation in the Gysel combiner can be more bandwidth-efficient than implementations using other ring hybrids.

[0042] In other words, the invention can be understood as a replica of a Gysel power divider as a transmit / receive switch, in which a device consisting of a Gysel combiner with an odd number of taps or connections is provided for simultaneous transmitting and receiving in transceivers. Instead of one antenna, two antennas are used to separate common-mode and differential-mode signals. This allows bandwidth to be saved without sacrificing transmission speed.

[0043] Although some of the aspects described above relate to the passive high-frequency component, the manufacturing process, the operating procedure, the computer program, or the data carrier, these aspects can also apply to the other aspects accordingly.

[0044] All technical and scientific terms used herein have the meaning that corresponds to the general understanding of a person skilled in the art in the field of high-frequency technology; they are to be interpreted based on the definitions found in the glossary or the technical jargon of this field. If technical terms are used incorrectly herein and thus do not express the technical concept of the present invention, they are to be replaced by technical terms that convey a correct understanding to a person skilled in the art.

[0045] The terms "first," "second," etc., are used solely to distinguish components from one another. For example, a first component can be referred to as a second component, and a second component as a first component. The terms "first," "second," etc., can indicate a sequence, at least for the purposes of disclosure, particularly a direct or indirect succession. It should be noted that these terms, as well as all numerical references ("one," "two," etc.), are not to be understood as exhaustive with regard to the scope of protection, but are also exhaustively disclosed with regard to the content of the disclosure ("only one," "only two," etc.). Thus, for example, the expression "two ABC" can mean either "exactly two ABC" or "two or more ABC."

[0046] When it is stated that one component is "connected" to another component, this can mean, for the purposes of this disclosure, that these components can also be directly connected to each other. The term "directly" indicates that no other component is present between them.

[0047] The procedural steps described herein should not be interpreted as requiring them to be performed in a specific order, unless explicitly or implicitly stated otherwise, for example, if these procedural steps cannot be exchanged for technical reasons. The procedural steps may also be performed directly one after the other (without any intervening steps) and / or continuously.

[0048] BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Further objectives, features, advantages, and applications will become apparent from the following description of embodiments, which are not to be understood as limiting, with reference to the accompanying drawings. These show:

[0050] Fig. 1 shows an equivalent circuit diagram of a passive high-frequency component;

[0051] Fig. 2 shows a block diagram of a manufacturing process for the passive high-frequency component from Fig. 1; and

[0052] Fig. 3 shows a block diagram of an operating procedure for the passive high-frequency component from Fig. 1 and for a passive high-frequency component manufactured using the manufacturing process from Fig. 2. The reference numerals used in the drawings and their meanings are summarized in the list of reference numerals at the end of this description. Identical or similar components in the drawings are always identified by the same or similar reference numerals. Detailed explanations of known functions and structures are omitted if they detract from the invention.

[0053] DETAILED DESCRIPTION OF THE DRAWINGS

[0054] The passive high-frequency component 1 and the methods S1 and S2 for it are now described with regard to their embodiments. Without being definitively bound to do so, specific details are explained to provide a deeper understanding of the invention.

[0055] Fig. 1 shows an equivalent circuit diagram of a passive high-frequency device 1. The passive high-frequency device 1 has one common-mode terminal 2 and two differential-mode terminals 3 and 4. The terminals 2, 3, and 4 used to operate the passive high-frequency device 1 each have a characteristic impedance Z2, which corresponds to a system characteristic impedance, for example, a 50-ohm system. This can increase flexibility. The common-mode terminal 2 is located midway between two antenna terminals 5 and 6, which also have a characteristic impedance Z2. The connection between common-mode terminal 2 and antenna terminal 5, as well as the connection between common-mode terminal 2 and antenna terminal 6, are each k / 4 long, based on the operating center wavelength of a frequency band intended for use. These connections each have a characteristic impedance Z3. The characteristic impedance Z3 is the highest in the design of the passive high-frequency device 1.The characteristic impedance Z2 is at least 2 units lower than the characteristic impedance Z3. The characteristic impedances Z2 at terminals 2, 3, 4, 5, and 6 are shown here for illustrative purposes, as the terminals can be designed so that, in the technical implementation, all terminals have, for example, the same impedance matching to a system impedance (here Z2). Antenna terminal 5 is connected to push-pull terminal 3 via an X / 4 line with characteristic impedance Z2. Similarly, antenna terminal 6 is connected to push-pull terminal 4 via an X / 4 line with characteristic impedance Z2. Push-pull terminal 3 and push-pull terminal 4 are connected via an X / 2 line with characteristic impedance ZI. The characteristic impedance ZI can be at least 2 units lower than the characteristic impedance Z2. The resulting ring (for example, as a rectangular metallization) can have side lengths of X / 4 and X / 2, with its corners forming connection surfaces.The common-mode connection is located midway between a pair consisting of antenna connection 5 and differential-mode connection 3, and a pair consisting of antenna connection 6 and differential-mode connection 4. Antennas 7 and 8 are either manufactured directly together with connections 5 and 6 or can be subsequently attached by soldering.

[0056] Fig. 2 shows a block diagram of a manufacturing process S1 for the passive high-frequency component 1 from Fig. 1. In process S1, the circuit board can first be prepared in step S11. In particular, different stages of metal printing can be performed, represented here as steps S12 and S13. For example, in step S12, a thin metal layer can first be laminated onto a dielectric substrate of the circuit board, for example, on both sides. Subsequently, a photolithographic process can be used in step S13, in which the desired conductive traces are formed by exposure and etching to create the functionality of the passive high-frequency component. Thus, process S1 for manufacturing a passive high-frequency component 1, as shown in Fig.Figure 1 describes a device for transmitting high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band, and the provision, in particular by metal printing, of the following connections to the passive high-frequency component 1: a common-mode connection 2, which is to transmit the common-mode signal, differential-mode connections 3 and 4, which are to transmit the differential-mode signal, and antenna connections 5 and 6, which are to transmit the common-mode signal and the differential-mode signal. Figure 3 shows a block diagram of an operating method S2 for the passive high-frequency component 1 from Figure 1 or for a passive high-frequency component 1 manufactured by the manufacturing method from Figure 2.The transmission of high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band includes, firstly, in step S211: feeding the common-mode signal via a common-mode connection (2) of the passive high-frequency component (1), in step S212: transmitting the common-mode signal via antenna connections (5, 6) of the passive high-frequency component (1), in step S213: receiving the differential-mode signal via the antenna connections (5, 6) of the passive high-frequency component (1), and in step S214: tapping the differential-mode signal via differential-mode connections (3, 4) of the passive high-frequency component (1).

[0057] The transmission of high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band comprises, in step S211: feeding the differential-mode signal via differential-mode terminals 3 and 4 of the passive high-frequency component 1; in step S212: transmitting the differential-mode signal via antenna terminals 5 and 6 of the passive high-frequency component 1; in step S213: receiving the common-mode signal via antenna terminals 5 and 6 of the passive high-frequency component 1; and in step S214: tapping the common-mode signal via a common-mode terminal 2 of the passive high-frequency component 1.

[0058] The process steps represented as blocks of the block diagrams in Figures 2 and 3 can, for example, be substantially represented on a machine-, processor-, or computer-readable data carrier and thus executed by a computer as described herein. Examples may also include, or refer to, a computer program containing program code for executing at least some of the process steps from Figures 2 and 3 when the computer program is executed on the computer. An example may also include volatile or persistent memory that is machine-, processor-, or computer-readable and encodes machine-, processor-, or computer-executable programs with instructions that cause the execution of some or all of the process steps.It should be noted here that all the parts described above, considered individually and in any combination, especially the details shown in the drawings, are claimed to be essential to the invention. Modifications to this are familiar to those skilled in the art.

[0059] REFERENCE MARK LIST

[0060] 1 Passive high-frequency component

[0061] 2 common-mode terminals

[0062] 3 First push-pull terminal

[0063] 4 Second push-pull terminal

[0064] 5 First antenna connection

[0065] 6 Second antenna connection

[0066] 7 First antenna

[0067] 8 Second antenna

[0068] Z 1 First W-resistance

[0069] Z2 Second (system) wave impedance

[0070] Z3 Third wave impedance Operating center wavelength

Claims

Claims 1. Passive high-frequency component (1) for transmitting high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band, characterized in that the passive high-frequency component (1) has the following connections: a common-mode connection (2) which is arranged to transmit the common-mode signal, Push-pull terminals (3, 4) arranged to transmit the push-pull signal, and Antenna connections (5, 6) arranged to transmit the common-mode signal and the differential-mode signal.

2. Passive high-frequency component (1) according to claim 1, characterized in that the passive high-frequency component (1) is configured to simultaneously receive the common-mode signal and transmit the differential-mode signal or to simultaneously transmit the sliding-mode signal and receive the differential-mode signal.

3. Passive high-frequency component (1) according to claim 2, characterized in that the connections of the passive high-frequency component provided for transmitting the high-frequency signals have an odd number.

4. Passive high-frequency component (1) according to one of the preceding claims, characterized in that the passive high-frequency component (1) is a printed circuit board or consists of a combination of circuit boards, preferably with one side of the circuit board that provides a metallic structure for the operation of the passive high-frequency component (1), on which side concentrated components can also be arranged, and the opposite other side of the circuit board has a metallization acting as a grounding plane.

5. Passive high-frequency component (1) according to one of the preceding claims, characterized in that the passive high-frequency component (1) is designed as a transmit / receive switch to transmit the high-frequency signals simultaneously in one and the same frequency band.

6. Passive high-frequency component (1) according to one of the preceding claims, characterized in that a first characteristic impedance (ZI) of a first line between the differential-mode terminals (3, 4) is smaller than a second characteristic impedance (Z2) of second lines, each between one of the differential-mode terminals (3, 4) and one of the antenna terminals (5, 6), and the second characteristic impedance (Z2) is smaller than a third characteristic impedance (Z3) of third lines, each between one of the antenna terminals (5, 6) and the common-mode terminal (2); and The first, second, and third conductors form a closed ring, the individual conductors of which have an electrical conductor length of 2 relative to a Operating center wavelength A or - relative to an operating center frequency f - fall below this value.

7. Method (Sl) for manufacturing a passive high-frequency component (1), preferably according to one of the preceding claims, for transmitting high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band, characterized by Providing (S13), in particular by metal printing, the following connections to the passive high-frequency component (1): a common-mode connection (2) which is to transmit the common-mode signal, Push-pull terminals (3, 4), which are intended to transmit the push-pull signal, and Antenna connections (5, 6) that are intended to transmit the common-mode signal and the differential-mode signal.

8. Method (S2) for operating a passive high-frequency component (1), preferably according to one of the preceding claims, the method (S2) comprising: Transmitting (S21) high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band, characterized by: Food (S211), by means of a common-mode connection (2) of the passive high-frequency component (1), of the common-mode signal, Transmitting (S212), via antenna connections (5, 6) of the passive high-frequency component (1), the common-mode signal, Receiving (S213) the push-pull signal via the antenna connections (5, 6) of the passive high-frequency component (1), and Tapping (S214), via push-pull terminals (3, 4) of the passive high-frequency component (1), the push-pull signal; and / or Transmitting (S21) high-frequency signals comprising a common-mode signal and a differential-mode signal in a frequency band, characterized by: Food (S211), via push-pull connections (3, 4) of the passive high-frequency component (1), of the push-pull signal, Transmitting (S212) via antenna connections (5, 6) of the passive high-frequency component (1), of the push-pull signal, Receiving (S213) the common-mode signal via the antenna connections (5, 6) of the passive high-frequency component (1), and Tapping (S214) of the common-mode signal via a common-mode connection (2) of the passive high-frequency component (1).

9. Computer program, characterized in that the computer program includes instructions which, when the computer program is executed by a computer, cause the computer to A method according to claim 7 or 8, or at least one of the steps thereof, or to execute or initiate it.

10. A data carrier, characterized in that the computer program according to claim 9 is stored on the data carrier.

Images