Electronic device

Abstract

The present disclosure provides an electronic device comprising: a printed circuit board on which a heat-generating component is mounted; and a housing that houses the printed circuit board. The printed circuit board is provided with a mounting component at least partially facing the outside of the housing, and an inner surface of the housing is provided with a heat conductive material. Heat emitted from the heat generating component is transmitted to the mounting component via the heat conductive material.

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Japanese Patent Application Laid-Open No. 2015-88575 discloses an electronic device that transfers heat generated by heat-generating components mounted on a board to a housing via a heat-protection sheet.

[0003] There is a long awaited need for better electronic devices.

[0004] One aspect of the present disclosure is an electronic device comprising: a printed circuit board on which a heat-generating component is mounted; and a housing that houses the printed circuit board, wherein the printed circuit board is provided with a mounted component, at least a portion of which faces the outside of the housing; a thermally conductive material is provided on the inner surface of the housing; and heat generated from the heat-generating component is transferred to the mounted component via the thermally conductive material.

[0005] Fig. 1 is a perspective view of an electronic device. Fig. 2 is an exploded perspective view of the electronic device. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3.

[0006] In the above-mentioned Japanese Patent Application Laid-Open No. 2015-88575, heat generated by heat-generating components is transferred from a thermal protection sheet to a housing. However, for example, if the housing is small and has a relatively small surface area, sufficient heat dissipation cannot be expected. The present disclosure can provide an electronic device that can improve heat dissipation.

[0007] An electronic device 10 according to an embodiment of the present disclosure will be described below with reference to the drawings. Fig. 1 is a perspective view of the electronic device 10. Fig. 2 is an exploded perspective view of the electronic device 10. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3.

[0008] 1 to 4, the electronic device 10 is, for example, a conversion adapter for connecting a terminal of a USB cable (not shown) to a terminal of a LAN cable (not shown). However, the electronic device 10 is not limited to such a conversion adapter. The electronic device 10 includes a printed circuit board 12, a housing 14, and a thermally conductive material 16.

[0009] As shown in Figures 2 and 3, the printed circuit board 12 extends in, for example, the X direction. The printed circuit board 12 extends in a rectangular shape. As shown in Figures 2 to 4, a heat-generating component 18 is mounted on the printed circuit board 12. The heat-generating component 18 is, for example, an integrated circuit (IC). The heat-generating component 18 is not limited to an integrated circuit, as long as it is a component that generates heat when the electronic device 10 is operated. The heat-generating component 18 is located, for example, in the center of the printed circuit board 12. The position of the heat-generating component 18 relative to the printed circuit board 12 can be set as appropriate.

[0010] 2 and 3, the printed circuit board 12 is provided with a mounted component 20. At least a portion of the mounted component 20 faces the outside of the housing 14 (see FIGS. 1 and 3). In this embodiment, the mounted component 20 is a pair of connectors 22, 24.

[0011] One connector 22 is located at one end (the end in the X1 direction) of the printed circuit board 12. The connector 22 has a rectangular parallelepiped shape. The connector 22 has a port 26 that opens in the X1 direction. The port 26 is, for example, but is not limited to, a USB port to which a terminal of a USB cable (not shown) can be connected. The connector 22 has a metal shell 28. The shell 28 forms the outer surface of the connector 22.

[0012] The other connector 24 is located at the other end (the end in the X2 direction) of the printed circuit board 12. The connector 24 has a rectangular parallelepiped shape. As shown in FIG. 3 , the connector 24 has a port 30 that opens in the X2 direction. The port 30 is, for example, a LAN port to which a terminal of a LAN cable (not shown) can be connected, but is not limited to this. The connector 24 has a metal shell 32 (see FIG. 2 ). The shell 32 forms the outer surface of the connector 24.

[0013] 1 to 4, the housing 14 houses the printed circuit board 12. The housing 14 extends, for example, in the X direction. The housing 14 has a base member 34 and a cover member 36. The base member 34 and the cover member 36 are each integrally molded from a resin material.

[0014] The base member 34 covers the printed circuit board 12 from one side (Z1 direction) in the thickness direction (Z direction) of the printed circuit board 12. In other words, the base member 34 covers the surface (back surface 38) of the printed circuit board 12 on which the heat-generating components 18 are not mounted. The cover member 36 covers the printed circuit board 12 from the other side (Z2 direction) in the thickness direction of the printed circuit board 12. In other words, the cover member 36 covers the surface (component surface 40) of the printed circuit board 12 on which the heat-generating components 18 are mounted. The housing 14 is formed by attaching (engaging) the cover member 36 to the base member 34. Although detailed illustrations are omitted in FIGS. 2 to 4 , the cover member 36 and the base member 34 sandwich the printed circuit board 12 from the Z direction.

[0015] 1 to 3, the cover member 36 has a cover main body 42 and a peripheral wall portion 44. As shown in Fig. 3, the cover main body 42 covers a surface 46 of the heat-generating component 18 that faces away from the printed circuit board 12 (in the Z2 direction). The cover main body 42 is disposed to face the component surface 40 of the printed circuit board 12. The peripheral wall portion 44 protrudes in the Z2 direction from the outer peripheral edge of the cover main body 42.

[0016] 2 and 3, a first hole 48 is formed through the portion of the peripheral wall 44 facing the X1 direction. The first hole 48 opens in the Z1 direction. A second hole 50 is formed through the portion of the peripheral wall 44 facing the X2 direction. The second hole 50 opens in the Z1 direction.

[0017] The connector 22 is disposed in the first hole 48. A portion of the connector 22 faces the outside of the housing 14. The connector 24 is disposed in the second hole 50. A portion of the connector 24 faces the outside of the housing 14. That is, in this embodiment, at least a portion of the mounted component 20 faces the outside of the housing 14.

[0018] The cover body 42 includes a first end 52, a second end 54, and a curved portion 56. The first end 52 forms one end (end in the X1 direction) of the cover body 42. The first end 52 covers the connector 22 from the Z2 direction. In other words, the first end 52 covers a surface 58 of the connector 22 facing away from the printed circuit board 12. The second end 54 forms the other end (end in the X2 direction) of the cover body 42. The second end 54 covers the connector 24 from the Z2 direction. In other words, the second end 54 covers a surface 60 of the connector 24 facing away from the printed circuit board 12.

[0019] The curved portion 56 is located in the center of the cover body 42 in the extension direction. The curved portion 56 connects the first end 52 and the second end 54. The curved portion 56 is curved concavely toward the heat-generating component 18. In other words, the curved portion 56 protrudes from the first end 52 and the second end 54 toward the heat-generating component 18 (in the Z1 direction). The portion of the curved portion 56 that is located furthest in the Z1 direction (the protruding end) can be positioned closer to the heat-generating component 18.

[0020] A thermally conductive material 16 is provided on the inner surface of the housing 14. The heat-generating components 18 and the mounted components 20 are in contact with the thermally conductive material 16. The heat-generating components 18 and the mounted components 20 may be in close proximity to the thermally conductive material 16. The thermally conductive material 16 has a first thermally conductive sheet 62, a second thermally conductive sheet 64, and two third thermally conductive sheets 66, 68.

[0021] The first thermally conductive sheet 62 is attached to the inner surface of the housing 14. The first thermally conductive sheet 62 is a heat dissipation film that has appropriate rigidity and is easily bendable. The thermal conductivity of the first thermally conductive sheet 62 is higher than the thermal conductivity of the housing 14.

[0022] The first thermally conductive sheet 62 is attached to the inner surface of the cover body 42. The first thermally conductive sheet 62 extends from the first end 52 via the curved portion 56 to the second end 54. The first thermally conductive sheet 62 has, for example, an adhesive layer for adhering to the inner surface of the housing 14. In this case, the first thermally conductive sheet 62 can be easily attached to the inner surface of the housing 14.

[0023] The second thermally conductive sheet 64 is disposed on the surface 46 of the heat-generating component 18. For example, the second thermally conductive sheet 64 is in contact with the entire surface 46 of the heat-generating component 18. The thermal conductivity of the second thermally conductive sheet 64 is higher than the thermal conductivity of air. The thickness of the second thermally conductive sheet 64 is greater than the thickness of the first thermally conductive sheet 62.

[0024] The second thermally conductive sheet 64 has elasticity. In other words, the second thermally conductive sheet 64 is elastically deformable in the thickness direction of the second thermally conductive sheet 64. The second thermally conductive sheet 64 is made of a flexible material.

[0025] The first thermally conductive sheet 62 is in contact with the second thermally conductive sheet 64. The cover body 42 and the heat-generating component 18 sandwich the first thermally conductive sheet 62 and the second thermally conductive sheet 64 in an overlapping state so that the second thermally conductive sheet 64 is elastically deformed. This allows the second thermally conductive sheet 64 to be in close contact with the surface 46 of the heat-generating component 18. This reduces the thermal resistance between the heat-generating component 18 and the second thermally conductive sheet 64. Furthermore, the second thermally conductive sheet 64 can be in close contact with the first thermally conductive sheet 62. This reduces the thermal resistance between the first thermally conductive sheet 62 and the second thermally conductive sheet 64.

[0026] The third thermally conductive sheets 66, 68 have the same configuration as the second thermally conductive sheet 64. The third thermally conductive sheet 66 is disposed on a surface 58 of the connector 22 facing away from the printed circuit board 12 (in the Z2 direction). The third thermally conductive sheet 66 is in contact with one end (the end in the X1 direction) of the first thermally conductive sheet 62. The cover body 42 and the connector 22 sandwich the first thermally conductive sheet 62 and the third thermally conductive sheet 66 in an overlapping state so that the third thermally conductive sheet 66 is elastically deformable.

[0027] This allows the third thermally conductive sheet 66 to be in close contact with the first thermally conductive sheet 62. This reduces the thermal resistance between the first thermally conductive sheet 62 and the third thermally conductive sheet 66. Furthermore, the third thermally conductive sheet 66 can be in close contact with the surface 58 of the connector 22. This reduces the thermal resistance between the third thermally conductive sheet 66 and the connector 22.

[0028] The third thermally conductive sheet 68 is disposed on a surface 60 of the connector 24 facing away from the printed circuit board 12 (in the Z2 direction). The third thermally conductive sheet 68 is in contact with the other end (the end in the X2 direction) of the first thermally conductive sheet 62. The cover body 42 and the connector 24 sandwich the first thermally conductive sheet 62 and the third thermally conductive sheet 68 in an overlapping state so that the third thermally conductive sheet 68 is elastically deformable.

[0029] This allows the third thermally conductive sheet 68 to be in close contact with the first thermally conductive sheet 62. This reduces the thermal resistance between the first thermally conductive sheet 62 and the third thermally conductive sheet 68. Furthermore, the third thermally conductive sheet 68 can be in close contact with the surface 60 of the connector 24. This reduces the thermal resistance between the third thermally conductive sheet 68 and the connector 24.

[0030] In the electronic device 10, heat generated by the heat-generating component 18 is transferred to the central portion of the first thermally conductive sheet 62 via the second thermally conductive sheet 64. The heat transferred from the second thermally conductive sheet 64 to the central portion of the first thermally conductive sheet 62 is transferred to both ends of the first thermally conductive sheet 62 in the extension direction and is dissipated to the outside of the housing 14 via the housing 14. The heat transferred to one end of the first thermally conductive sheet 62 is dissipated to the outside of the housing 14 via the third thermally conductive sheet 66 and the connector 22. The heat transferred to the other end of the first thermally conductive sheet 62 is dissipated to the outside of the housing 14 via the third thermally conductive sheet 66 and the connector 24.

[0031] According to this embodiment, since the thermally conductive material 16 is provided on the inner surface of the housing 14, heat generated from the heat-generating component 18 is transferred from the thermally conductive material 16 to the housing 14 and dissipated to the outside of the housing 14. Furthermore, the heat transferred from the heat-generating component 18 to the thermally conductive material 16 is transferred to the mounted component 20 and dissipated to the outside of the housing 14. In other words, the heat generated from the heat-generating component 18 can be dissipated to the outside of the housing 14 from both the housing 14 and the mounted component 20. This allows a sufficient heat dissipation effect to be obtained even when, for example, the housing 14 is small and has a relatively small surface area. Therefore, an electronic device 10 with improved heat dissipation effect can be provided. Therefore, a better electronic device 10 can be provided.

[0032] Each of the heat-generating component 18 and the mounting component 20 is in contact with the thermally conductive material 16. This allows efficient heat transfer from the heat-generating component 18 to the thermally conductive material 16. Also, efficient heat transfer from the thermally conductive material 16 to the mounting component 20.

[0033] The thermally conductive material 16 has a first thermally conductive sheet 62 attached to the inner surface of the housing 14 and a second thermally conductive sheet 64 arranged on the heat-generating component 18. The first thermally conductive sheet 62 is in contact with the second thermally conductive sheet 64. This allows heat generated from the heat-generating component 18 to be transferred to the mounted component 20 via the second thermally conductive sheet 64 and the first thermally conductive sheet 62.

[0034] The thermally conductive material 16 has third thermally conductive sheets 66, 68 arranged on the mounted component 20. The first thermally conductive sheet 62 is in contact with the third thermally conductive sheets 66, 68. This allows heat generated from the heat-generating component 18 to be transferred to the mounted component 20 via the second thermally conductive sheet 64, the first thermally conductive sheet 62, and the third thermally conductive sheets 66, 68.

[0035] The second thermally conductive sheet 64 is elastic and is disposed on the surface 46 of the heat-generating component 18 facing away from the printed circuit board 12. The housing 14 has a cover body 42 that covers the surface 46 of the heat-generating component 18. The cover body 42 and the heat-generating component 18 sandwich the first thermally conductive sheet 62 and the second thermally conductive sheet 64 in an overlapping state so that the second thermally conductive sheet 64 is elastically deformed. This allows heat to be efficiently transferred from the heat-generating component 18 to the first thermally conductive sheet 62 via the second thermally conductive sheet 64.

[0036] The third thermally conductive sheets 66, 68 are elastic and are disposed on the surfaces 58, 60 of the mounted component 20 facing away from the printed circuit board 12. The cover body 42 covers the surfaces 58, 60 of the mounted component 20. The cover body 42 and the mounted component 20 sandwich the first thermally conductive sheet 62 and the third thermally conductive sheets 66, 68 in an overlapping state so that the third thermally conductive sheets 66, 68 are elastically deformed. This allows heat to be efficiently transferred from the first thermally conductive sheet 62 to the mounted component 20 via the third thermally conductive sheets 66, 68.

[0037] The cover body 42 has a curved portion 56 that is curved concavely toward the heat-generating component 18. The first thermally conductive sheet 62 is attached to the curved portion 56. This allows the first thermally conductive sheet 62 to be positioned near the heat-generating component 18 with a simple configuration.

[0038] The mounted components 20 are connectors 22 and 24. This allows heat generated from the heat-generating component 18 to be dissipated from the connectors 22 and 24 to the outside of the housing 14.

[0039] The connectors 22, 24 have metal shells 28, 32, which allow heat to be efficiently dissipated from the connectors 22, 24 to the outside of the housing 14.

[0040] This embodiment is not limited to the above-described configuration. The electronic device 10 may omit one of the two connectors 22, 24. The mounted component 20 may have three or more connectors. The mounted component 20 is not limited to a connector and may be, for example, a light-emitting diode, a switch, a display, or the like. The thermally conductive material 16 may not include the second thermally conductive sheet 64 and the third thermally conductive sheets 66, 68. That is, the thermally conductive material 16 may be composed of only the first thermally conductive sheet 62. In this case, it is preferable that the first thermally conductive sheet 62 be in contact with or adjacent to the heat-generating component 18 and the mounted component 20. Alternatively, the thermally conductive material 16 may include the first thermally conductive sheet 62 and the second thermally conductive sheet 64, but not the third thermally conductive sheets 66, 68. Furthermore, the thermally conductive material 16 may include the first thermally conductive sheet 62 and the third thermally conductive sheets 66, 68, but not the second thermally conductive sheet 64. The thermally conductive material 16 may be formed, for example, by applying or depositing a material with high thermal conductivity (for example, a material containing metal, carbon, etc.) on the inner surface of the housing 14 .

[0041] The following additional notes are further disclosed regarding the above embodiment.

[0042] (Supplementary Note 1) The present disclosure relates to an electronic device (10) comprising a printed circuit board (12) on which a heat-generating component (18) is mounted, and a housing (14) that houses the printed circuit board, wherein the printed circuit board is provided with a mounted component (20) at least a portion of which faces the outside of the housing, and a thermally conductive material (16) is provided on the inner surface of the housing, and heat generated from the heat-generating component is transferred to the mounted component via the thermally conductive material.

[0043] (Supplementary Note 2) In the electronic device according to Supplementary Note 1, the heat-generating component and the mounted component may each be in contact with or in proximity to the thermally conductive material.

[0044] (Supplementary Note 3) In the electronic device described in Supplementary Note 1 or 2, the thermally conductive material may have a first thermally conductive sheet (62) attached to the inner surface of the housing and a second thermally conductive sheet (64) arranged on the heat-generating component, and the first thermally conductive sheet may be in contact with the second thermally conductive sheet.

[0045] (Supplementary Note 4) In the electronic device described in Supplementary Note 3, the thermally conductive material may have a third thermally conductive sheet (66, 68) arranged on the mounting component, and the first thermally conductive sheet may be in contact with the third thermally conductive sheet.

[0046] (Appendix 5) In the electronic device described in Appendix 1 or 2, the thermally conductive material may have a first thermally conductive sheet attached to the inner surface of the housing and a third thermally conductive sheet disposed on the mounted component, and the first thermally conductive sheet may be in contact with the third thermally conductive sheet.

[0047] (Appendix 6) In the electronic device described in Appendix 3 or 4, the second thermally conductive sheet is elastic and is arranged on a surface (46) of the heat-generating component facing away from the printed circuit board, the housing has a cover body (42) covering the surface of the heat-generating component, and the cover body and the heat-generating component may be sandwiched between the first thermally conductive sheet and the second thermally conductive sheet in a state where the first thermally conductive sheet and the second thermally conductive sheet are overlapped so that the second thermally conductive sheet is elastically deformed.

[0048] (Appendix 7) In the electronic device described in Appendix 4 or 5, the third thermally conductive sheet is elastic and is arranged on a surface (58, 60) of the mounted component that faces away from the printed circuit board, the housing has a cover body that covers the surface of the heat-generating component that faces away from the printed circuit board, the cover body covers the surface of the mounted component, and the cover body and the mounted component may be sandwiched between the first thermally conductive sheet and the third thermally conductive sheet so that the third thermally conductive sheet elastically deforms with the first thermally conductive sheet and the third thermally conductive sheet overlapping each other.

[0049] (Appendix 8) In the electronic device described in any one of Appendices 1 to 5, the housing has a cover body that covers the surface of the heat-generating component facing away from the printed circuit board, the cover body has a curved portion (56) that is curved concavely toward the heat-generating component, and the thermally conductive material may be attached to the curved portion.

[0050] (Supplementary Note 9) In the electronic device according to any one of Supplementary Notes 1 to 8, the mounted component may be a connector (22, 24).

[0051] (Supplementary Note 10) In the electronic device according to Supplementary Note 9, the connector may have a metal shell (28, 32).

[0052] Although the present disclosure has been described in detail, the present disclosure is not limited to the individual embodiments described above. Various additions, substitutions, modifications, partial deletions, etc. are possible in these embodiments without departing from the gist of the present disclosure or the spirit of the present disclosure derived from the content of the claims and their equivalents. These embodiments can also be implemented in combination. For example, in the above-described embodiments, the order of each operation and the order of each process are shown as examples and are not limited to these. The same applies when numerical values ​​or mathematical expressions are used in the description of the above-described embodiments.

[0053] REFERENCE SIGNS LIST 10...Electronic device 12...Printed circuit board 14...Housing 16...Thermal conductive material 18...Heat-generating component 20...Mounted component 22, 24...Connector 28, 32...Shell 42...Cover body 46...Surface of heat-generating component 56...Curved portion 58, 60...Surface of mounted component 62...First thermally conductive sheet 64...Second thermally conductive sheet 66, 68...Third thermally conductive sheet

Claims

1. An electronic device comprising: a printed circuit board on which a heat-generating component is mounted; and a housing that houses the printed circuit board, wherein the printed circuit board has mounted components at least a portion of which faces the outside of the housing, and the inner surface of the housing is provided with a thermally conductive material, so that heat generated from the heat-generating component is transferred to the mounted components via the thermally conductive material.

2. An electronic device according to claim 1, wherein the heat-generating component and the mounting component are each in contact with or in close proximity to the thermally conductive material.

3. An electronic device according to claim 1 or 2, wherein the thermally conductive material comprises a first thermally conductive sheet attached to the inner surface of the housing and a second thermally conductive sheet disposed on the heat-generating component, and the first thermally conductive sheet is in contact with the second thermally conductive sheet.

4. An electronic device according to claim 3, wherein the thermally conductive material has a third thermally conductive sheet disposed on the mounting component, and the first thermally conductive sheet is in contact with the third thermally conductive sheet.

5. An electronic device according to claim 1 or 2, wherein the thermally conductive material comprises a first thermally conductive sheet attached to the inner surface of the housing, and a third thermally conductive sheet disposed on the mounted component, and the first thermally conductive sheet is in contact with the third thermally conductive sheet.

6. An electronic device as claimed in claim 3 or 4, wherein the second thermally conductive sheet is elastic and is arranged on a surface of the heat-generating component facing away from the printed circuit board, the housing has a cover body that covers the surface of the heat-generating component, and the cover body and the heat-generating component sandwich the first thermally conductive sheet and the second thermally conductive sheet in a state where they are overlapped, so that the second thermally conductive sheet is elastically deformed.

7. An electronic device as claimed in claim 4 or 5, wherein the third thermally conductive sheet is elastic and is arranged on a surface of the mounted component facing away from the printed circuit board, the housing has a cover body covering the surface of the heat-generating component facing away from the printed circuit board, the cover body covering the surface of the mounted component, and the cover body and the mounted component sandwich the first thermally conductive sheet and the third thermally conductive sheet together so that the third thermally conductive sheet is elastically deformed.

8. An electronic device according to any one of claims 1 to 5, wherein the housing has a cover body that covers the surface of the heat-generating component facing away from the printed circuit board, the cover body has a curved portion that is concavely curved toward the heat-generating component, and the thermally conductive material is attached to the curved portion.

9. An electronic device according to any one of claims 1 to 8, wherein the mounting component is a connector.

10. An electronic device according to claim 9, wherein the connector has a metal shell.

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