Plating apparatus and resistor for plating apparatus

Abstract

Provided is a plating apparatus which is capable of improving the uniformity of the thickness of a plating film that is formed on an object to be plated.　Also provided is a resistor for electric field adjustment for a plating apparatus, the resistor for a plating apparatus being disposed between an anode and a holder for holding an object to be plated in a plating apparatus. The resistor for a plating apparatus has a plate-like main body. The plate-like main body has an upper surface, a lower surface, and a plurality of through holes with which the upper surface and the lower surface are in communication with each other. The resistor for a plating apparatus additionally has an insertion body that is disposed inside the main body. The insertion body has a plurality of through holes, and the insertion body is movable between a first position at which the plurality of through holes of the insertion body are in communication with the plurality of through holes of the main body and a second position at which the plurality of through holes of the insertion body are not in communication with the plurality of through holes of the main body.

Description

Plating equipment and resistors for plating equipment

[0001] The present application relates to a plating apparatus and a resistor for use in the plating apparatus.

[0002] One example of a plating apparatus using electroplating is a so-called dip-type plating apparatus in which a substrate (e.g., a semiconductor wafer) and an anode are arranged horizontally facing each other (see, for example, Patent Document 1). Another example of a plating apparatus using electroplating is a cup-type plating apparatus (see, for example, Patent Document 2). In the cup-type plating apparatus, a substrate held by a substrate holder is immersed in a plating solution with the surface to be plated facing downward, and a voltage is applied between the substrate and the anode to deposit a conductive film (plating film) on the surface of the substrate.

[0003] In such plating apparatuses, the substrate generally has an electrical contact on its periphery. Due to differences in distance from the electrical contact, a potential difference occurs between the periphery and center of the substrate during plating, which can result in a bias in the plating current. For this reason, it has been known to place a resistor for adjusting the electric field between the substrate and the anode to improve the uniformity of the thickness of the plating film formed on the substrate. Furthermore, a plating apparatus has been proposed in which the size of the resistor hole is variable to allow for greater freedom in adjusting the electric field (see Patent Document 3).

[0004] Patent No. 7462125 Patent No. 7079388 Patent No. 7204060

[0005] In plating equipment, uneven plating film thickness can occur due to factors other than the distance from the electrical contacts, such as the resist pattern formed on the substrate. In other words, if the substrate surface to be plated contains a certain number of areas without resist openings (non-opening areas), the plating current does not flow through the non-opening areas, and instead concentrates around the non-opening areas, resulting in a thicker plating film. As a specific example, if resist openings are formed only in a roughly cross-shaped area on the substrate, the area outside the cross does not have resist openings and current does not flow, potentially resulting in a loss of uniformity in the thickness of the plating film. For example, Patent Document 1 uses an anode mask with adjustable anode opening dimensions to adjust the electric field between the anode and the substrate. However, conventional configurations are designed to address variations in plating film thickness due to the configuration of the plating equipment, such as electrical contacts, and may not adequately address variations in plating film thickness due to the resist pattern on the substrate. While forming dummy openings in the non-opening areas to achieve uniform plating film thickness is conceivable, this increases plating process costs due to the additional processing required to form the dummy openings and the formation of unnecessary plating in the dummy openings.

[0006] The present invention has been made in view of the above problems, and one of its objects is to propose a plating apparatus that can improve the uniformity of the thickness of a plating film formed on an object to be plated.

[0007] According to one embodiment, a resistor for a plating apparatus is provided, the resistor for a plating apparatus being for adjusting an electric field and being arranged between an anode and a holder for holding an object to be plated in a plating apparatus, the resistor for a plating apparatus having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the resistor for a plating apparatus further having an insert arranged inside the body, the insert having a plurality of through holes, the insert being movable between a first position in which the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position in which the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

[0008] 1 is a perspective view showing the overall configuration of a plating apparatus according to one embodiment; FIG. 2 is a plan view showing the overall configuration of a plating apparatus according to one embodiment; FIG. 3 is a longitudinal cross-sectional view showing a schematic configuration of a plating module according to one embodiment; FIG. 4A is a longitudinal cross-sectional view showing a schematic cross-sectional view of a resistor that can be used in the plating module shown in FIG. 3 according to one embodiment; FIG. 5A is a longitudinal cross-sectional view showing a schematic cross-sectional view of a resistor that can be used in the plating module shown in FIG. 3 according to one embodiment; FIG. 5B is a longitudinal cross-sectional view showing a schematic cross-sectional view of a resistor that can be used in the plating module shown in FIG. 3 according to one embodiment; FIG. 9A is a cross-sectional cross-sectional view showing a schematic cross-sectional view of a resistor that can be used in the plating module shown in FIG. 3 according to one embodiment; FIG. 9B is a cross-sectional view showing a schematic cross-sectional view of a resistor that can be used in the plating module shown in FIG. 3 according to one embodiment; FIG. 9A is a cross-sectional perspective view showing a portion of a resistor that can be used in the plating module shown in FIG. 3 according to one embodiment; FIG. 9B is a cross-sectional perspective view showing a portion of the resistor that can be used in the plating module shown in FIG. 1 is a flowchart showing an example of a method for setting an operation recipe for a resistor, an anode mask, and a shield by a control module. FIG. 2 is a diagram showing a resist pattern formed on a surface to be plated of a substrate according to an embodiment. FIG. 3 is a flowchart showing an example of a method for setting an operation recipe for a resistor, an anode mask, and a shield by a control module during plating processing.

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and redundant description will be omitted.

[0010] <Overall Configuration of Plating Apparatus> Fig. 1 is a perspective view showing the overall configuration of the plating apparatus of this embodiment. Fig. 2 is a plan view showing the overall configuration of the plating apparatus of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0011] The load port 100 is a module for loading substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading substrates from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are optional. The transfer robot 110 is a robot for transporting substrates and is configured to transfer substrates between the load port 100, the aligner 120, and the transfer device 700. When transferring substrates between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrates via a temporary stage (not shown).

[0012] The aligner 120 is a module for aligning the positions of the substrate's orientation flat, notch, and the like in a predetermined direction. In this embodiment, two aligners 120 are arranged horizontally, but the number and arrangement of the aligners 120 are optional. The prewet module 200 wets the surface of the substrate to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing air within the pattern formed on the substrate surface with the treatment liquid. The prewet module 200 is configured to perform a prewet process that replaces the treatment liquid within the pattern with a plating liquid during plating, thereby making it easier to supply the plating liquid within the pattern. In this embodiment, two prewet modules 200 are arranged vertically, but the number and arrangement of the prewet modules 200 are optional.

[0013] The presoak module 300 is configured to perform a presoak process, which involves etching away, for example, an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface of a substrate to be plated before plating, using a treatment solution such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are optional. The plating module 400 performs plating on the substrate. In this embodiment, two sets of 12 plating modules 400 are arranged vertically, three vertically and four horizontally, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are optional.

[0014] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are optional. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers are arranged vertically, but the number and arrangement of the spin rinse dryers are optional. The transport device 700 is a device for transporting substrates between multiple modules within the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0015] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette in the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, etc. of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the transfer apparatus 700.

[0016] The transfer device 700 transfers the substrate received from the transfer robot 110 to the prewet module 200. The prewet module 200 performs a prewet process on the substrate. The transfer device 700 transfers the substrate that has been subjected to the prewet process to the presoak module 300. The presoak module 300 performs a presoak process on the substrate. The transfer device 700 transfers the substrate that has been subjected to the presoak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0017] The transfer device 700 transfers the substrate that has been plated to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate that has been cleaned to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer device 700 delivers the substrate that has been dried to the transfer robot 110. The transfer robot 110 transfers the substrate received from the transfer device 700 to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0018] <Configuration of Plating Module> Next, a description will be given of the configuration of the plating module 400. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described.

[0019] 3 is a longitudinal cross-sectional view schematically illustrating the configuration of a plating module 400 according to this embodiment. As shown in FIG. 3, the plating module 400 includes a plating tank 410 for containing a plating solution. The plating tank 410 includes a cylindrical inner tank with an open top and an outer tank (not shown) that is provided around the inner tank to collect plating solution that overflows from the upper edge of the inner tank.

[0020] The plating module 400 includes a substrate holder 440 for holding the substrate Wf with its plating surface Wf-a facing downward. The substrate holder 440 also includes a power supply contact (not shown) for supplying power to the substrate Wf from a power source (not shown). In one embodiment, the power supply contact contacts contact the outer edge of the substrate Wf to supply power to the outer edge of the substrate Wf. The plating module 400 also includes a lifting mechanism 442 for raising and lowering the substrate holder 440. In one embodiment, the plating module 400 also includes a rotation mechanism 448 for rotating the substrate holder 440 around a vertical axis. The lifting mechanism 442 and the rotation mechanism 448 can be realized by known mechanisms such as motors.

[0021] The plating module 400 includes a membrane 420 that vertically separates the interior of a plating tank 410. The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the membrane 420. The cathode region 422 and the anode region 424 are each filled with a plating solution. Note that, although an example in which the membrane 420 is provided has been shown in this embodiment, the membrane 420 need not be provided.

[0022] An anode 430 is provided on the bottom surface of the anode region 424 of the plating tank 410. The anode 430 is, for example, a circular member having a surface dimension approximately equal to that of the substrate Wf. An anode mask 426 is also provided in the anode region 424 to adjust the electric field between the anode 430 and the substrate Wf. The anode mask 426 is provided near the anode 430 and is, for example, a substantially plate-shaped electric field shield made of a dielectric material. The anode mask 426 has an opening through which a current flows between the anode 430 and the substrate Wf. In this embodiment, the anode mask 426 is configured to have variable opening dimensions, and the opening dimensions are adjusted by the control module 800. Here, the opening dimension refers to the diameter if the opening is circular, and to the length of one side or the longest opening width if the opening is polygonal. The opening dimensions of the anode mask 426 can be adjusted using a known mechanism. In addition, although the present embodiment shows an example in which the anode mask 426 is provided, it is not necessary to provide the anode mask 426. Furthermore, the membrane 420 described above may be provided in the opening of the anode mask 426.

[0023] The plating module 400 includes a resistor 450 disposed between the substrate Wf and the anode 430. In this embodiment, the resistor 450 is disposed in the cathode region 422. The resistor 450 is a component for adjusting the electric field to achieve uniformity in the plating process on the plating surface Wf-a of the substrate Wf. The resistor 450 increases the resistance between the anode 430 and the substrate Wf, making it difficult for the electric field to spread. As a result, the distribution of the plating film thickness formed on the plating surface Wf-a of the substrate Wf can be made uniform. Therefore, increasing the distance between the substrate Wf and the resistor 450 increases the space available for the electric field to spread between the substrate Wf and the resistor 450. For this reason, the resistor 450 is preferably disposed near the plating surface Wf-a of the substrate Wf. The resistor 450 will be described in detail later.

[0024] The plating module 400 also includes a paddle 480 disposed between the substrate Wf held by the substrate holder 440 and the resistor 450, and a paddle stirring mechanism 482 for moving the paddle 480 through the plating solution to stir the plating solution. The paddle 480 may be configured, for example, but not limited to, a plate member with numerous honeycomb-shaped holes formed therein. The paddle stirring mechanism may be realized by a known mechanism, such as a motor. The paddle stirring mechanism 482 is configured to stir the plating solution near the plating surface Wf-a of the substrate Wf by reciprocating the paddle 480 along the plating surface Wf-a of the substrate Wf. However, the present invention is not limited to this example, and the paddle stirring mechanism 482 may, for example, be configured to reciprocate the paddle 480 perpendicular to the plating surface Wf-a. Although the present embodiment illustrates an example in which the paddle 480 and the paddle stirring mechanism 482 are provided, the paddle 480 and the paddle stirring mechanism 482 may not be provided.

[0025] The cathode region 422 is also provided with a sensor 460 for detecting parameters related to the plating film formed on the plating surface Wf-a of the substrate Wf. In this embodiment, the parameters related to the plating film refer to physical quantities for estimating the thickness of the plating film or the formation rate of the plating film. The sensor 460 is disposed so as to face the plating surface Wf-a. In this embodiment, the sensor 460 is configured to be movable so that the detection position can be changed along the radial direction of the substrate Wf. However, this is not limited to this example, and multiple sensors 460 facing the plating surface Wf-a may be provided. In one embodiment, the detection end of the sensor 460 is disposed inside the resistor 450. However, this is not limited to this example, and the sensor 460 may be disposed in another location outside the resistor 450, for example.

[0026] The detection signal from the sensor 460 is input to the control module 800. In this embodiment, a potential sensor having a detection electrode (not shown) is used as the sensor 460. The detection electrode of the sensor 460 may be arranged so as to face the plating surface Wf-a, or may be arranged in a conduit arranged so as to face the plating surface Wf-a and filled with plating solution. Furthermore, when a potential sensor is used as the sensor 460, at least one reference potential sensor 462 is preferably provided in the plating tank 410. The reference potential sensor 462 is preferably provided outside the area between the substrate Wf and the anode 430. In other words, the reference potential sensor 462 is preferably provided in a position that does not overlap the substrate Wf and the anode 430 when viewed from a direction perpendicular to the plating surface Wf-a of the substrate Wf. Based on the potential difference between the potential sensor 460, which is a potential sensor, and the reference potential sensor 462, the control module 800 can estimate the formation rate of the plating film formed on the surface Wf-a to be plated and measure the thickness of the plating film. This is based on the correlation between the plating current and the potential during the plating process. However, the sensor 460 may be any sensor capable of detecting parameters related to the plating film, and other sensors, such as an optical distance sensor such as a white light confocal sensor, a magnetic field sensor, or an eddy current sensor, may be used instead of or in addition to the potential sensor. Note that, although the present embodiment illustrates an example in which the sensor 460 for detecting parameters related to the plating film is provided, the sensor 460 need not be provided.

[0027] A shield 470 is provided in the cathode region 422 to shield the current flowing from the anode 430 to the substrate Wf. In this embodiment, the shield 470 is provided at the same height as the paddle 480, but this is not limited to this example. The shield 470 is, for example, a substantially plate-shaped member made of a dielectric material. The shield 470 is configured to be movable between a shielding position interposed between the plating surface Wf-a of the substrate Wf and the anode 430, and a retracted position retracted from between the plating surface Wf-a and the anode 430. In other words, the shield 470 is configured to be movable between a shielding position below the plating surface Wf-a and a retracted position away from below the plating surface Wf-a. The position of the shield 470 is controlled by a drive mechanism 472 that receives commands from the control module 800. The drive mechanism 472 can be realized by a known mechanism such as a motor or a solenoid.

[0028] <Resistor> The resistor 450 of this embodiment will be described in detail. FIG. 4A is a cross-sectional view schematically illustrating the resistor 450 shown in FIG. 3 according to one embodiment. FIG. 4B is a longitudinal cross-sectional view schematically illustrating the resistor 450 shown in FIG. 4A. The resistor 450 of this embodiment includes a disk-shaped main body 452 and arc-plate-shaped first and second inserts 456A and 456B disposed within the main body 452. In other words, the main body 452 includes an annular space 455 therein, and the arc-plate-shaped first and second inserts 456A and 456B are disposed within the annular space 455. The main body 452 and the two inserts 456A and 456B are preferably dielectric materials having a higher electrical resistivity than the plating solution. The main body 452 and the inserts 456A and 456B may be formed of the same material or different materials.

[0029] In one embodiment, the main body 452 is fixed to the plating tank 410 and is a circular, plate-like member slightly larger than the substrate Wf when viewed from above. Note that, as an example, the main body 452 may be configured to be movable up and down within the plating tank 410. As shown in FIGS. 4A and 4B , the main body 452 has a plurality of through holes 453 formed therein, communicating with the upper surface 452-a and the lower surface 452-b of the main body 452. In other words, the main body 452 has a plurality of through holes 453 formed therein, each opening toward the substrate holder 440 and the anode 430. In FIG. 4A , the through holes 453 are indicated by dashed lines. Each of the plurality of through holes 453 has the same dimensions and defines an elongated opening whose circumferential length is approximately twice its radial length. However, this is not limited to this example, and each of the plurality of through holes 453 may have a perfect circular shape when viewed from above, or any other shape, or may have different dimensions. In one embodiment, the through holes 453 are arranged on two or more imaginary reference circles (see the dashed lines in FIG. 4A ) that are concentric but have different diameters. In this case, in one embodiment, the through holes 453 arranged on adjacent reference circles are arranged at angular positions offset from each other on the reference circles. In other words, the centers of the through holes 453 arranged on adjacent reference circles are not aligned on a straight line extending in the radial direction, but are offset from each other in the circumferential direction. However, the arrangement of the through holes 453 is not limited to this example. The through holes 453 may be aligned on a straight line extending in the radial direction, or the above-described arrangement of the through holes 453 may be adopted only in a partial region. Note that, although the through holes 453 are illustrated sparsely in FIG. 4A for clarity, in an actual design, a greater number of through holes 453 are formed in the main body 452.

[0030] As shown in FIG. 4A , the first insert 456A and the second insert 456B are arc-shaped plate-shaped members when viewed from above. As described above, the first insert 456A and the second insert 456B are disposed within the annular space 455 formed inside the main body 452. Furthermore, the first insert 456A and the second insert 456B are disposed concentrically with the substrate Wf or the anode 430 when viewed from above. In one embodiment, the first insert 456A and the second insert 456B have dimensions smaller than the substrate Wf or the anode 430 when viewed from above, and are disposed closer to the center than the periphery of the substrate Wf or the anode 430 (see FIG. 3 ). As will be described later, the first insert 456A and the second insert 456B are each movable in the circumferential direction within the annular space 455 formed inside the main body 452.

[0031] The first insert 456A has a through-hole 457A that connects the upper and lower surfaces of the first insert 456A. ​​In other words, the first insert 456A has a plurality of through-holes 457A that open to the substrate holder 440 side and the anode 430 side. In FIG. 4A , the through-holes 457A are indicated by solid lines. In one embodiment, the plurality of through-holes 457A are arranged on two or more imaginary reference circles (see the dashed-dotted lines in FIG. 4A ) that are concentric but have different diameters. In other words, the plurality of through-holes 457A are arranged so as to be dispersed in the radial direction of the first insert 456A. ​​In this case, in one embodiment, the plurality of through-holes 457A arranged on adjacent reference circles are arranged at angular positions offset from each other on the reference circles. In other words, the centers of the through-holes 457A arranged on adjacent reference circles are not aligned on a straight line extending in the radial direction, but are offset from each other in the circumferential direction. However, the multiple through holes 457A are not limited to this example and may be arranged side by side in a radially extending line. Furthermore, in one embodiment, each of the multiple through holes 457A defines an opening of the same dimensions as the through holes 453 of the main body 452. That is, in the embodiment shown in FIG. 4A , the multiple through holes 457A of the first insert 456A define an elongated opening whose circumferential length is approximately twice its radial length, similar to the through holes 453 of the main body 452. However, the multiple through holes 457A of the first insert 456A are not limited to being elongated when viewed from above, and may be perfectly circular or any other shape. As an example, the multiple through holes 457A of the first insert 456A may be elongated so as to define an opening whose circumferential length is longer than that of the through holes 453 of the main body 452. In one embodiment, the through holes 457A are arranged in the same distribution as the through holes 453 of the main body 452. That is, the plurality of through holes 457A are configured to be able to overlap with the plurality of through holes 453 of the main body 452. Fig. 4A shows a state in which the plurality of through holes 457A overlap with the plurality of through holes 453 of the main body 452. Note that in Fig. 4A, the plurality of through holes 457A, 457B are sparsely illustrated for clarity, but in an actual design, a greater number of through holes 457A, 457B are formed in the inserts 456A, 456B.

[0032] The second insert A 456B has a plurality of through holes 457B that open to the substrate holder 440 side and the anode 430 side. The dimensions of the second insert 456B and the through holes 457B of the second insert 456B are the same as those of the first insert 456A, and therefore a description thereof will be omitted.

[0033] As shown in FIG. 4A , the first insert 456A and the second insert 456B are connected at one end by an elastic member 454. Furthermore, as shown in FIGS. 4A and 5A , the resistor 450 according to one embodiment includes a biasing member 490 for circumferentially moving the first insert 456A and the second insert 456B within the annular space 455 of the main body 452. As shown in FIG. 4A , the biasing member 490 is a wedge-shaped plate-like member having the same thickness as the first insert 456A and the second insert 456B. As shown, the biasing member 490 is disposed at the end of the first insert 456A and the second insert 456B opposite the end where the elastic member 454 is disposed. Furthermore, the biasing member 490 is provided with a plurality of through holes 494, similar to the first insert 456A and the second insert 456B. A drive mechanism 492 is connected to the biasing member 490, and the biasing member 490 is configured to be movable in the radial direction by the drive mechanism 492. The drive mechanism 492 for moving the biasing member 490 in the radial direction may be any mechanism, and for example, a cam mechanism or a ball screw may be adopted.

[0034] FIG. 4A illustrates a state in which no force is applied to the elastic member 454. The positions of the first insert 456A and the second insert 456B illustrated in FIG. 4A are referred to herein as the "first position." In the first position, the through-holes 453 of the body 452 of the resistor 450 are aligned so as to communicate with the through-holes 457A of the first insert 456A and the through-holes 457B of the second insert 456B. FIG. 4B is a vertical cross-sectional view illustrating a state in which the through-holes 453 of the body 452 of the resistor 450 are aligned so as to communicate with the through-holes 457A of the first insert 456A and the through-holes 457B of the second insert 456B. In the first position, the through-holes 494 of the biasing member 490 are aligned so as to communicate with the through-holes 453 of the body 452 of the resistor 450. It should be noted that while in FIG. 4A for clarity of illustration, the biasing member 490 is shown as having one through hole 494, in an actual design the biasing member 490 may have multiple through holes 494.

[0035] When the biasing member 490 is moved radially inward by the drive mechanism 492 from the first position shown in FIG. 4A , the first insert 456A and the second insert 456B each move circumferentially, compressing the elastic member 454. The drive mechanism 492 can also be said to move the biasing member 490 circumferentially against the force applied to the first insert 456A and the second insert 456B by the elastic member 454. FIG. 5A illustrates a state in which the first insert 456A and the second insert 456B move circumferentially, applying a force to the elastic member 454. The position of the first insert 456A and the second insert 456B shown in FIG. 5A is referred to herein as the "second position." In the second position, the through-holes 453 in the body 452 of the resistor 450 are not in communication with the through-holes 457A in the first insert 456A and the through-holes 457B in the second insert 456B. In other words, in the second position, the through-holes 453 in the body 452 of the resistor 450 are blocked by the first insert 456A and the second insert 456B. FIG. 5B is a vertical cross-sectional view showing a state in which the through-holes 453 in the body 452 of the resistor 450 are not in communication with the through-holes 457A in the first insert 456A and the through-holes 457B in the second insert 456B. In addition, in the second position, the through-holes 494 in the biasing member 490 are not in communication with the through-holes 453 in the body 452 of the resistor 450. In other words, the plurality of through holes 453 in the main body 452 of the resistor 450 are closed by the biasing member 490 .

[0036] When the biasing member 490 moves radially outward from the second position shown in FIG. 5A , the compressive force applied to the elastic member 454 moves the first insert 456A and the second insert 456B toward the first position. In other words, the elastic member 454 applies a biasing force to the first insert 456A and the second insert 456B toward the first position. In the first position shown in FIG. 4A , the through-holes 453 in the body 452 of the resistor 450 are aligned with the through-holes 457A in the first insert 456A and the through-holes 457B in the second insert 456B, completely opening the through-holes 453 in the body 452. In the second position, the through-holes 453 in the body 452 of the resistor 450 are completely blocked by the first insert 456A and the second insert 456B. In one embodiment, the first insert 456A and the second insert 456B can be positioned anywhere between a first position and a second position, and the plurality of through-holes 453 in the body 452 can be partially blocked by the first insert 456A and the second insert 456B. In one embodiment, the radial position of the biasing member 490 can position the first insert 456A and the second insert 456B anywhere between the first position and the second position. That is, the radial position of the biasing member 490 can adjust the opening amount of the plurality of through-holes 453 in the body 452 of the resistor 450.

[0037] In one embodiment, with regard to the radial dimensions of the first insert 456A and the second insert 456B, the inner diameters of the first insert 456A and the second insert 456B are 50% to 70% of the diameter of the main body 452 or the substrate Wf, and preferably 55% to 65%. Furthermore, in one embodiment, the outer diameters of the first insert 456A and the second insert 456B are 70% to 90% of the diameter of the main body 452 or the substrate Wf, and preferably 80% to 90%. The inner and outer diameters of the first insert 456A and the second insert 456B can also be said to be the inner and outer diameters of the annular space 455 inside the main body 452. In one embodiment, the radial dimensions of the first insert 456A and the second insert 456B may be determined to coincide with an intermediate region B2 shown in FIG. 13 , which will be described later.

[0038] In one embodiment, a groove 459 for accommodating at least a portion of the sensor 460 is formed in the main body 452. In one embodiment, the groove 459 penetrates from the substrate holder 440 side to the anode 430 side, although, as an example, the anode 430 side may be closed. In addition, in FIGS. 4 and 5 , the groove 459 is formed on the outer periphery of the annular space 455 for accommodating the first insert 456A and the second insert 456B and is radially separated from the annular space 455, but, as an example, the annular space 455 and the groove 459 may be connected to each other. In one embodiment, the groove 459 extends inward from the outer periphery of the main body 452 when viewed from above. In one embodiment, as shown in FIG. 3 , the sensor 460 is disposed in the groove 459 so as not to protrude above the upper surface 452-a of the main body 452. As described above, the resistor 450 is preferably disposed near the plating surface Wf-a, and the sensor 460 for detecting parameters related to the plating film is also preferably disposed near the plating surface Wf-a of the substrate Wf. By disposing the sensor 460 in the groove 459, the distance between the resistor 450 and the plating surface Wf-a of the substrate Wf can be reduced, allowing for optimal detection of parameters related to the thickness of the plating film. In addition, in this embodiment, a paddle 480 is disposed between the resistor 450 and the substrate Wf. By disposing the sensor 460 in the groove 459, interference between the sensor 460 and the paddle 480 can be prevented without restricting the movement of the paddle 480 for stirring.

[0039] FIG. 6 is a cross-sectional view schematically illustrating a resistor 450 according to one embodiment that can be employed in the plating module 400 shown in FIG. 6. The resistor 450 in the embodiment shown in FIG. 6 has a double-insertion arrangement. As shown in FIG. 6, the body 452 of the resistor 450 has an outer annular space 455A and an inner annular space 455B. A first insert 456A and a second insert 456B are disposed in the outer annular space 455A. A third insert 456C and a fourth insert 456D are disposed in the inner annular space 455B. The first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D according to the embodiment shown in FIG. 6 have the same structure as the first insert 456A and the second insert 456B shown in FIGS. 4 and 5, except for their radial widths. First insert 456A, second insert 456B, third insert 456C, and fourth insert 456D each include a plurality of through-holes 457A-D, although for clarity of illustration, the plurality of through-holes 457A-D are not shown in FIG.

[0040] As shown in Fig. 6, the first insert 456A and the second insert 456B are connected at one end thereof by an elastic member 454A, and the third insert 456C and the fourth insert 456D are connected at one end thereof by an elastic member 454B. Also, as shown in Fig. 6, a biasing member 490 is provided for moving the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D in the circumferential direction within the annular spaces 455A and 455B of the main body 452. The biasing member 490 shown in Fig. 6 can have a configuration similar to that of the biasing member 490 shown in Figs. 4 and 5. 6, first insert 456A, second insert 456B, third insert 456C, and fourth insert D have their respective multiple through-holes 457A-D movable between a first position in communication with the multiple through-holes 453 of body 452 and a second position in communication with the multiple through-holes 453 of body 452. Additionally, biasing member 490 has multiple through-holes 494 movable between a position in communication with the multiple through-holes 453 of body 452 and a position in communication with the multiple through-holes 453 of body 452. In the state shown in FIG. 6, the multiple through-holes 494 of biasing member 490 are aligned so as to communicate with the multiple through-holes 453 of body 452.

[0041] 7 illustrates a state in which the biasing member 490 has moved partway radially inward, with the through-holes 457A, 457B of the first and second inserts 456A, 456B communicating with the through-holes 453 of the body 452, while the through-holes 457C, 457D of the third and fourth inserts 456C, 456D not communicating with the through-holes 453 of the body 452. Also, in the position illustrated in FIG. 7, the through-holes 494 of the biasing member 490 may not communicate with the through-holes 453 of the body 452 at the radial position where the first and second inserts 456A, 456B are located, such that the biasing member 490 blocks the through-holes 453 of the body 452. 8 illustrates a state in which the biasing member 490 has been moved further radially inward, such that none of the plurality of through-holes 457A-D in the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D communicate with the plurality of through-holes 453 in the body 452. Also, in the position illustrated in FIG. 8, the plurality of through-holes 494 in the biasing member 490 may not communicate with the plurality of through-holes 453 in the body 452 at the radial positions where the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D are located, such that the biasing member 490 blocks the through-holes 453 in the body 452.

[0042] In one embodiment, with respect to the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D, the inner diameters of the third insert 456C and the fourth insert 456D are 50% to 70%, preferably 55% to 65%, of the diameter of the main body 452 or the substrate Wf. Also, in one embodiment, the outer diameters of the first insert 456A and the second insert 456B are 70% to 90%, preferably 80% to 90% of the diameter of the main body 452 or the substrate Wf. In one embodiment, the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert D may be determined to correspond to an intermediate region B2 shown in FIG. 13, which will be described later.

[0043] FIG. 9A is a schematic perspective view of a portion of a resistor 450 according to one embodiment that can be employed in the plating module 400 shown in FIG. 3 . FIGS. 9B and 9C are cross-sectional perspective views of a portion of the resistor 450 shown in FIG. 9A . Similar to the previously described embodiments, the resistor 450 of this embodiment includes a disk-shaped body 452 and a cylindrical insert 560 disposed within the body 452. In other words, the body 452 includes a cylindrical space 455 therein, and the cylindrical insert 560 is disposed within the cylindrical space 455. The insert 560 is inserted into the cylindrical space 455 from the outer periphery of the body 452 toward the inside in the radial direction. The body 452 and the insert 560 are preferably dielectric materials having a higher electrical resistivity than the plating solution. The body 452 and the insert 560 may be formed of the same material or different materials.

[0044] In the embodiment shown in FIG. 9A , the main body 452 has a plurality of through holes 453 formed therein, which open to the substrate holder 440 side (upper surface side) and the anode 430 side (lower surface side). Note that in FIG. 9A , for clarity of illustration, only the portion of the main body 452 associated with the insert 560 is shown, but the plurality of through holes 453 are formed throughout the main body 452. In FIG. 9A , each of the plurality of through holes 453 has the same dimensions and a perfect circular shape when viewed from above. However, this is not limited to this example, and each of the plurality of through holes 453 may define an elongated opening whose circumferential length is approximately twice its radial length, as in the embodiments of FIGS. 4 and 5 , or may have any other shape, and may be through holes of different dimensions.

[0045] As shown in FIG. 9A , the insert 560 is a cylindrical member. As shown in FIG. 9B , the insert 560 has a plurality of through-holes 562 formed therein, which open toward the substrate holder 440 side and the anode 430 side. In the embodiment shown in FIG. 9B , the plurality of through-holes 562 of the insert 560 have openings of the same dimensions and the same distribution as the plurality of through-holes 453 of the main body 452. As shown in FIG. 9A , the insert 560 is connected to a drive mechanism 564 and configured to be rotatable within the main body 452. The drive mechanism 564 can be any drive mechanism including a motor or the like. As shown in FIG. 9A , the plurality of through-holes 562 of the insert 560 are formed in a partial region in the axial direction of the insert 560 (the radial direction of the main body 452). The axial dimension (radial direction of body 452) of the region where through-hole 562 of insert 560 is formed can be any dimension, but as an example, it can be the radial dimension of inserts 456A-D in the embodiment of Figures 4-8. Also, in one embodiment, the axial dimension (radial direction of body 452) of the region where through-hole 562 of insert 560 is formed can be determined to coincide with intermediate region B2 shown in Figure 13, which will be described later.

[0046] Fig. 9B shows a state in which the through-holes 453 of the body 452 and the through-holes 562 of the insert 560 are aligned to communicate with each other. The position of the insert 560 shown in Fig. 9B is referred to herein as the "first position." Fig. 9C shows a state in which the insert 560 is rotated 90 degrees, such that the through-holes 453 of the body 452 and the through-holes 562 of the insert 560 are not in communication with each other. The position of the insert 560 shown in Fig. 9C is referred to herein as the "second position." In other words, in the second position, the through-holes 453 of the body 452 of the resistor 450 are blocked by the insert 560. Furthermore, by slightly rotating the insert 560 from the first position, the multiple through holes 453 of the main body 452 and the multiple through holes 562 of the insert 560 can be partially aligned, so that the multiple through holes 453 of the main body 452 are partially blocked by the insert 560.

[0047] FIG. 10 is a diagram illustrating the arrangement of inserts 560 according to one embodiment. As shown in FIG. 10 , in one embodiment, multiple inserts 560 are arranged at equal intervals around the outer periphery of the main body 452. Furthermore, in the embodiment shown in FIG. 10 , the multiple inserts 560 have the same configuration. In the embodiment shown in FIG. 10 , the multiple inserts 560 may be configured to be independently rotatable. By independently rotating each of the multiple inserts 560 between the first position and the second position, the opening amount of the multiple through holes 453 can be adjusted. Note that, in one embodiment, the multiple inserts 560 may be configured to rotate synchronously.

[0048] FIG. 11 is a diagram illustrating the arrangement of inserts 560 according to one embodiment. As shown in FIG. 11 , in one embodiment, multiple inserts 560 are arranged at equal intervals around the outer periphery of the main body 452. In the embodiment shown in FIG. 11 , the multiple inserts 560 have different lengths. In the embodiment shown in FIG. 11 , the inserts 560 of different lengths can have different sizes and positions of the regions in which the through holes 562 are formed. Therefore, in the embodiment shown in FIG. 11 , the opening amounts of the multiple through holes 453 can be adjusted at different radial positions. Note that in FIGS. 10 and 11 , the through holes 453 and 562 are not shown for clarity.

[0049] <Plating Process> Next, the plating process in the plating module 400 of this embodiment will be described in more detail. The substrate Wf is exposed to the plating solution by immersing it in the plating solution in the cathode region 422 using the lifting mechanism 442. In this state, the plating module 400 can perform plating on the plating surface Wf-a of the substrate Wf by applying a voltage between the anode 430 and the substrate Wf. In one embodiment, the plating process is performed while the substrate holder 440 is rotated using the rotation mechanism 448. As a result of the plating process, a conductive film (plating film) is deposited on the plating surface Wf-a of the substrate Wf-a.

[0050] In one embodiment, the control module (controller) 800 can improve the uniformity of the plating film thickness distribution across the entire substrate Wf by controlling the drive mechanisms 492, 564 to adjust the resistor 450 (the position of the insert). As an example, the adjustment of the resistor 450 using the drive mechanisms 492, 564 is performed before the plating process begins. Also, as another example, the adjustment of the resistor 450 using the drive mechanisms 492, 564 is performed in real time during the plating process based on the detection value by the sensor 460.

[0051] FIG. 12 is a flowchart illustrating an example of a method for setting operation recipes for the resistor 450, the anode mask 426, and the shield 470 by the control module 800. The method illustrated in FIG. 12 is executed, for example, when processing a new substrate lot. The control module 800 may set operation recipes for only some of the resistor 450, the anode mask 426, and the shield 470. The operation recipe for the resistor 450 indicates the positions of the inserts 456A-D and 560, i.e., the opening size of the through-hole 453 in the main body 452. The operation recipe for the anode mask 426 indicates the opening dimensions of the anode mask 426. The operation recipe for the shield 470 indicates the advance / retract position of the shield 470. Instead of being set by the control module 800 of the plating apparatus 1000, the operation recipes may be set by a computer external to the plating apparatus 1000 and transmitted to the plating apparatus 1000.

[0052] In the example shown in FIG. 12 , the control module 800 first acquires a resist pattern for the substrate Wf to be processed (step S110). The resist pattern refers to a pattern of a resist layer formed on the surface Wf-a to be plated so that a desired plating pattern is formed by plating. The resist pattern may be acquired by detecting the substrate Wf using a sensor provided in the plating apparatus 1000. As an example, the plating apparatus 1000 may be equipped with an imaging sensor (not shown), such as a camera, that captures an image of the surface Wf-a to be plated of the substrate Wf. The control module 800 may then acquire imaging data detected by the imaging sensor and analyze the imaging data to acquire the resist pattern for the surface Wf-a to be plated. The resist pattern may be acquired from the imaging data using a known method based on shading or feature points of the imaging data. Alternatively, the control module 800 may acquire the resist pattern via external input via wired or wireless communication, for example.

[0053] The control module 800 then sets operation recipes for the resistor 450, the anode mask 426, and the shield 470 based on the acquired resist pattern (step S120). As a specific example, the control module 800 calculates a plating growth coefficient for each predetermined region of the plating surface Wf of the substrate Wf based on the acquired resist pattern, and sets operation recipes for each control object based on the calculated plating growth coefficient. Here, the plating growth coefficient is a parameter indicating the growth rate (formation rate) of the plating film when each of the resistor 450, the anode mask 426, and the shield 470 least shields the current. As an example, the plating growth coefficient can be expressed as the amount (e.g., nanometers) of plating film formed per unit time (e.g., 1 second). As a specific example, the control module 800 can calculate the aperture ratio of the resist layer for each predetermined region based on the resist pattern, and then calculate the plating growth coefficient based on the calculated aperture ratio. This is because in areas where the aperture ratio of the resist layer is large, the area on which plating is deposited and the amount of plating required to form a certain amount of plating film are large, and the growth rate of the plating film tends to be slower than in areas where the aperture ratio of the resist layer is small.

[0054] FIG. 13 is a schematic diagram illustrating a resist pattern formed on the plating surface Wf-a of a substrate Wf according to one embodiment. In FIG. 13 , resist openings are formed only in the cross-shaped region A1, which is hatched, and the region A2 outside the cross-shaped region A1 is a non-opening region where no resist openings are formed. When plating is performed on a substrate Wf with such a resist pattern, plating current does not flow through the non-opening region A2, but only through the opening region A1. In this embodiment, plating is performed while rotating the substrate holder 440 using the rotation mechanism 448. The plating current concentrates in the cross-shaped convex region of region A1, particularly in the circumferential direction, including region A2, resulting in a large plating film thickness. In this specification, the region in which resist openings are formed substantially entirely when viewed circumferentially is referred to as the "central region B1" (in the example shown in FIG. 13 , the circular region surrounded by the inner dashed line C1). Furthermore, when viewed in the circumferential direction, a region that includes both a region where a resist opening is formed (opening region A1) and a region where a resist opening is not formed (non-opening region A2), and where the area of ​​the opening region A1 is larger in the circumferential direction than the area of ​​the non-opening region A2, is called an "intermediate region B2" (in the example shown in FIG. 13, this is an annular region surrounded by dashed-dotted lines C1 and C2). Furthermore, when viewed in the circumferential direction, a region that includes both the opening region A1 and the non-opening region A2, and where the area of ​​the opening region A1 is smaller in the circumferential direction than the area of ​​the non-opening region A2, is called an "outer peripheral region B3" (in the example shown in FIG. 13, this is an annular region surrounded by dashed-dotted lines C2 and C3). In the example shown in FIG. 13, the central region B1, intermediate region B2, and outer peripheral region B3 are located in this order from the center to the outer periphery of the plating surface Wf-a, and no resist opening is formed on the outer periphery of the outer peripheral region B3. However, this is not limited to this example, and any resist pattern may be formed on the substrate Wf.

[0055] Here, the anode mask 426 or the shield 470 provided in the plating module 400 can suitably adjust the plating film formation rate near the outer periphery of the plating surface Wf-a. However, when a substrate Wf such as that shown in Figure 13 is plated, the plating film formation rate in the region (particularly the middle region B2) that is closer to the inner periphery than near the outer periphery may become relatively higher, which may impair the uniformity of the thickness of the plating film.

[0056] In contrast, the plating module 400 of the above-described embodiment is configured so that the opening size of the through-hole 453 in the main body 452 can be adjusted by moving or rotating the inserts 456A-D, 560 disposed inside the resistor 450. This allows the current flowing through the intermediate region B2 to be adjusted, thereby adjusting the plating formation rate in the intermediate region B2. For example, in the substrate Wf of FIG. 13 , if the plating formation rate in the intermediate region B2 enclosed by the dashed-dotted lines C1 and C2 is relatively high, the opening size of the through-hole 453 in the main body 452 can be reduced by moving or rotating the inserts 456A-D, 560, thereby reducing the plating film thickness in the intermediate region B2. This improves the uniformity of the plating film thickness even when plating a substrate Wf such as that shown in FIG. 13 . Additionally, the plating module 400 of this embodiment includes an anode mask 426 and a shield 470. As a result, the plating speed can be adjusted in the intermediate region B2 by moving or rotating the inserts 456A-D and 560, and the plating speed can be adjusted in the outer peripheral region B3 by the anode mask 426 and the shield 470. Therefore, by controlling the resistor 450, the anode mask 426, and the shield 470, the plating speed can be adjusted for each region of the substrate Wf, thereby improving the uniformity of the thickness of the plating film. The radial dimensions of the various inserts 456A-D of the resistor 450 and the radial dimension of the region where the through-hole 562 of the insert 560 is formed may be determined based on the intermediate region B2, for example, by making them approximately the same dimensions as the intermediate region B2.

[0057] Fig. 14 is a flowchart showing an example of a method for setting an operation recipe for the resistor 450, the anode mask 426, and the shield 470 during a plating process by the control module 800. The method shown in Fig. 14 is executed during a plating process in place of the method shown in Fig. 12 or to correct the operation recipe set by the method shown in Fig. 12. Note that the control module 800 may set operation recipes for only some of the resistor 450, the anode mask 426, and the shield 470.

[0058] When the plating process begins (step S210), the control module 800 acquires plating film parameters from the sensor 460 in real time (step S220). In this embodiment, the sensor 460 detects the plating film parameters as the substrate Wf rotates. In one embodiment, the sensor 460 detects the plating film parameters at multiple points along the radial direction on the plating surface Wf-a. The control module 800 calculates the thickness distribution of the plating film on the plating surface Wf-a based on the values ​​detected by the sensor 460 (step S230). Next, the control module 800 sets operation recipes for the resistor 450, the anode mask 426, and the shield 470 based on the calculated thickness distribution (step S240). The control module 800 repeats steps S220 to S240 until the plating process is completed (step S250), setting operation recipes for the controlled objects. The control module 800 then controls the resistor 450, the anode mask 426, and the shield 470 based on the set operation recipes. In this way, by setting or modifying the operating recipe for resistor 450, etc. during the plating process based on the parameters related to the plating film obtained from sensor 460, the uniformity of the thickness of the plating film can be further improved.

[0059] The present invention can also be described as the following aspects: [Aspect 1] According to aspect 1, there is provided a plating apparatus resistor for adjusting an electric field, which is disposed in a plating apparatus between an anode and a holder for holding an object to be plated, the plating apparatus resistor having a plate-shaped main body having an upper surface, a lower surface, and a plurality of through holes communicating between the upper surface and the lower surface, and an insert disposed inside the main body, the insert having a plurality of through holes, the insert being movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the main body, and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the main body.

[0060] [Mode 2] According to mode 2, in the resistor for use in a plating apparatus according to mode 1, the plurality of through holes of the insert communicate with the upper surface and the lower surface of the insert.

[0061] [Form 3] According to Form 3, in the resistor for a plating device according to Form 2, the insert has a first insert having an arc-plate shape and a second insert having an arc-plate shape, and the resistor for a plating device further has an elastic member connecting between the first insert and the second insert, and the elastic member is configured to apply a bias force to the first insert and the second insert in the direction of the first position.

[0062] [Mode 4] According to Mode 4, the resistor for a plating apparatus according to Mode 3 further includes a biasing member that moves the first insert and the second insert toward the second position against the bias force of the elastic member.

[0063] [Mode 5] According to Mode 5, in the resistor for a plating device according to Mode 3, the inserts have a third insert having an arc-plate shape and a fourth insert having an arc-plate shape, and the resistor for a plating device further has a second elastic member connecting the third insert and the fourth insert, and the second elastic member is configured to apply a bias force to the third insert and the fourth insert in the direction of the first position.

[0064] [Mode 6] According to Mode 6, in the resistor for a plating apparatus according to Mode 1, the insert is a cylindrical member having the plurality of through holes, is inserted into the interior of the plate-like main body from a side surface, and is movable between the first position and the second position by rotating about the central axis of the cylindrical member.

[0065] [Mode 7] According to Mode 7, in the resistor for a plating apparatus according to Mode 6, the plate-shaped main body is disk-shaped, the insert has a plurality of the cylindrical members, and the plurality of cylindrical members are inserted radially into the plate-shaped main body.

[0066] [Eighth Mode] According to an eighth mode, in the resistor for use in a plating apparatus according to the seventh mode, the plurality of cylindrical members have different longitudinal dimensions.

[0067] [Form 9] According to Form 9, there is provided a plating apparatus having a plating tank, an anode disposed in the plating tank, a holder for holding an object to be plated, and a resistor for adjusting an electric field disposed between the anode and the holder, wherein the resistor has a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, and the resistor further has an insert disposed inside the body, the insert having a plurality of through holes, and the insert is movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

[0068] Wf-a...surface to be plated Wf...substrate 400...plating module 410...plating tank 420...membrane 422...cathode region 424...anode region 430...anode 440...substrate holder 442...lifting mechanism 448...rotation mechanism 450...resistor 452...main body 453...through hole 456A-D...insertion body 457A-D...through hole 459...groove 460...sensor 470...shield 480...paddle 490...biasing member 492...drive mechanism 494...through hole 560...insertion body 562...through hole 564...drive mechanism 800...control module 1000...plating apparatus

Claims

1. A resistor for use in a plating apparatus for adjusting an electric field, which is disposed between an anode and a holder for holding an object to be plated in a plating apparatus, the resistor for use in plating having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the resistor for plating further having an insert disposed inside the body, the insert having a plurality of through holes, the insert being movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

2. A resistor for use in a plating apparatus according to claim 1, wherein the plurality of through holes in the insert communicate with the upper and lower surfaces of the insert.

3. A resistor for use in a plating apparatus as set forth in claim 2, wherein the inserts have a first insert having an arc-shaped plate-like shape and a second insert having an arc-shaped plate-like shape, and the resistor for use in a plating apparatus further has an elastic member connecting the first insert and the second insert, and the elastic member is configured to apply a bias force to the first insert and the second insert in the direction of the first position.

4. A resistor for use in a plating apparatus according to claim 3, further comprising a biasing member that moves the first insert and the second insert toward the second position against the bias force of the elastic member.

5. A resistor for use in a plating apparatus as claimed in claim 3, wherein the inserts comprise a third insert having an arc-shaped plate and a fourth insert having an arc-shaped plate, and the resistor for use in a plating apparatus further comprises a second elastic member connecting the third insert and the fourth insert, and the second elastic member is configured to apply a bias force to the third insert and the fourth insert in the direction of the first position.

6. A resistor for use in a plating apparatus according to claim 1, wherein the insert is a cylindrical member having the plurality of through holes, is inserted into the plate-like main body from a side surface, and is movable between the first position and the second position by rotating about the central axis of the cylindrical member.

7. A resistor for use in a plating apparatus according to claim 6, wherein the plate-shaped main body is disc-shaped, and the insert has a plurality of the cylindrical members, and the plurality of cylindrical members are inserted in the radial direction of the plate-shaped main body.

8. A resistor for use in a plating apparatus according to claim 7, wherein the plurality of cylindrical members have different longitudinal dimensions.

9. A plating apparatus comprising: a plating tank; an anode disposed in the plating tank; a holder for holding an object to be plated; and a resistor for adjusting an electric field disposed between the anode and the holder, wherein the resistor has a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the resistor further having an insert disposed inside the body, the insert having a plurality of through holes, and the insert is movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

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