Electronic device

Abstract

This electronic device comprises: a first metal constituting a part or the whole of a connector shell; a second metal serving as a ground; and a conductive elastic member disposed between the first metal and the second metal so that the first metal and the second metal are coupled at a high frequency.

Description

electronic equipment

[0001] The present disclosure relates to electronic devices.

[0002] Many electronic devices are equipped with a wired communication interface such as a USB (Universal Serial Bus) interface.

[0003] International Publication No. 2018 / 211791

[0004] Electronic devices may have a function that involves receiving radio waves (hereinafter referred to as a radio wave receiving function). During wired communication such as USB communication, communication noise from the wired communication interface may cause performance degradation of the radio wave receiving function (for example, deterioration of radio wave receiving sensitivity and / or communication failure).

[0005] Therefore, the present disclosure proposes an electronic device that can suppress performance degradation of the radio wave receiving function due to communication noise.

[0006] It should be noted that the above problem or object is merely one of multiple problems or objects that can be solved or achieved by multiple embodiments disclosed in this specification.

[0007] In order to solve the above problems, one form of electronic device according to the present disclosure comprises a first metal that constitutes part or all of a connector shell, a second metal that serves as ground, and an elastic member that is conductive and is disposed between the first metal and the second metal so that the first metal and the second metal are high-frequency coupled.

[0008] 1 is a diagram for explaining a problem of an embodiment. FIG. 1 is a diagram for explaining a problem of an embodiment. FIG. 1 is a diagram for explaining an overview of a solving means of an embodiment. FIG. 2 is a diagram for explaining a configuration example of a terminal device according to an embodiment of the present disclosure. FIG. 3 is a diagram for explaining an example of an arrangement of antennas. FIG. 4 is a diagram for explaining an example of an arrangement of connectors. FIG. 5 is a diagram for explaining an example of a configuration of a base station according to an embodiment of the present disclosure. FIG. 6 is a diagram for explaining an example of the appearance of a terminal device. FIG. 7 is a diagram for explaining an example of mounting a connector on a substrate. FIG. 8 is a perspective view of a wired communication interface structure according to a first example. FIG. 9 is a side view of a wired communication interface structure according to the first example. FIG. 10 is a diagram for explaining an example of a configuration of an elastic member. FIG. 11 is a diagram for explaining an example of an arrangement of an insulating sheet. FIG. 12 is a perspective view of a wired communication interface structure according to a second example. FIG. 13 is a side view of a wired communication interface structure according to the second example. FIG. 14 is a diagram for explaining an example of an elastic member (metal spring). FIG. 15 is a diagram for explaining another example of an elastic member (metal spring). FIG. 16 is a perspective view of a wired communication interface structure according to a third example. FIG. 17 is a side view of a wired communication interface structure according to the third example. FIG. 18 is a perspective view of a wired communication interface structure according to a fourth example. FIG. 19 is a side view of a wired communication interface structure according to the fourth example. FIG. 19 is a perspective view of a wired communication interface structure according to a fifth example. 10A and 10B are a side view and a perspective view of a wired communication interface structure according to a fifth embodiment, a perspective view and a perspective view of a wired communication interface structure according to a sixth embodiment, a side view and a perspective view of a wired communication interface structure according to a seventh embodiment, and a side view and a perspective view of a wired communication interface structure according to a seventh embodiment.

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the following embodiments, the same components are designated by the same reference numerals, and redundant description will be omitted.

[0010] Additionally, in this description / specification, the phrase "at least one of" following a list of elements is understood to mean that the listed elements are optional. For example, "at least one of A, B, and C" means "(A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C)." "At least one of A, B, or C" and "at least one of A, B, and / or C" are similar to "at least one of A, B, and C." Here, A, B, and C are all arbitrary expressions (e.g., words, phrases, clauses, terms, or items).

[0011] In addition, in this specification and drawings, multiple components having substantially the same functional configuration may be distinguished by adding different numbers to the same reference numeral. For example, multiple components having substantially the same functional configuration may be distinguished by adding different numbers to the same reference numerals as necessary. １ , and 16 ２ However, when there is no need to particularly distinguish between multiple components having substantially the same functional configuration, only the same reference numerals are used. For example, the connector 16 １ , and 16 ２ When there is no need to particularly distinguish between them, they will be simply referred to as connectors 16.

[0012] One or more embodiments (including examples and modified examples) described below can be implemented independently. However, at least a portion of the embodiments described below may be implemented in appropriate combination with at least a portion of another embodiment. These embodiments may include novel features that are different from each other. Therefore, these embodiments may contribute to solving different purposes or problems and may achieve different effects. The present disclosure will be described in the following order.

[0013] 1. Overview 2. Examples of Electronic Devices 2-1. Terminal Device 2-2. Base Station 2-3. Other Examples 3. Structure of Electronic Devices 3-1. First Example 3-2. Second Example 3-3. Third Example 3-4. Fourth Example 3-5. Fifth Example 3-6. Sixth Example 3-7. Seventh Example 4. Modifications 5. Conclusion

[0014] <<1. Overview>> First, an overview of this embodiment will be described.

[0015] Electronic devices such as smartphones may have a function involving reception of radio waves (hereinafter referred to as a radio wave reception function). For example, the electronic device may have at least one of a radio positioning function, a wireless communication function, and a broadcast reception function as the radio wave reception function. Here, the wireless communication function may be, for example, a Wi-Fi function or a mobile communication system function (e.g., a cellular communication function such as 4G and / or 5G). Furthermore, the radio positioning function may be, for example, a satellite positioning function such as a GPS function. Furthermore, the broadcast reception function may be a television broadcast reception function.

[0016] In addition to the radio wave receiving function, electronic devices may also have a wired communication interface, for example, a USB interface such as a USB 3.X interface as the wired communication interface.

[0017] 1 and 2 are diagrams for explaining the problem of this embodiment. Specifically, Fig. 1 is a diagram showing the structure of an electronic device, and Fig. 2 is a diagram showing the structure of a conventional wired communication interface (wired communication connector).

[0018] In the structure of a conventional electronic device, when the electronic device performs wired communication (e.g., USB communication), communication noise from the wired communication interface may cause a degradation in performance of the radio wave receiving function. For example, in the structure of a conventional wired communication interface, noise radiated from a wired communication connector (e.g., a USB connector such as USB 3.X) mounted in the electronic device may be mixed into the antenna, causing a degradation in performance of the radio wave receiving function (e.g., a deterioration in radio wave receiving sensitivity and / or communication failure).

[0019] Therefore, in this embodiment, the above problem is solved as follows.

[0020] Fig. 3 is a diagram for explaining an outline of the solution of this embodiment. Specifically, Fig. 3 is a diagram showing an example of a wired communication connector of this embodiment. In this embodiment, the wired communication connector may be simply referred to as a connector.

[0021] In this embodiment, a conductive elastic member is disposed between a first metal constituting part or all of the connector shell and a second metal serving as ground. The connector shell is, for example, an exterior metal provided on the connector. If the connector is a USB connector, the connector shell is a USB shell. The elastic member is, for example, a gasket, cushion, rubber, or metal spring. The second metal is, for example, part or all of the housing of the electronic device. In the example of FIG. 3 , the second metal is disposed so that a portion of the second metal is in contact with the ground (hereinafter also referred to as a ground pattern) on the circuit board. This allows the second metal to function as ground.

[0022] To ensure safety, it is desirable to prevent DC conduction between the connector shell and the ground pattern of the circuit board. In particular, when the connector shell is a USB shell, it is necessary to prevent DC conduction between the connector shell and the ground pattern of the circuit board and to provide a capacitor or the like between them. In the example of Figure 3, a capacitor is provided between the connector shell and the ground pattern.

[0023] In this embodiment, noise radiated from the connector is suppressed by high-frequency coupling the connector shell to a stable surrounding ground. For example, in this embodiment, noise radiated from the connector is suppressed by high-frequency coupling a first metal that constitutes part or all of the connector shell to a second metal that serves as ground.

[0024] Here, high-frequency coupling refers to coupling having frequency characteristics such that impedance decreases as the frequency increases and impedance increases as the frequency decreases. For example, high-frequency coupling refers to coupling that provides insulation (e.g., almost infinite resistance) in direct current and low impedance (e.g., low resistance / low reactance / low inductance) at high frequencies. Here, the high frequency may be, for example, a frequency that may cause a degradation in performance of the radio wave receiving function. For example, the high frequency may be a frequency that may cause a degradation in receiving sensitivity (e.g., a frequency used in wireless communication). For example, the high frequency is a frequency of several hundred MHz or more (e.g., 300 MHz or more).

[0025] High frequency coupling is typically capacitive coupling. However, as long as the coupling has the above frequency characteristics, the high frequency coupling is not limited to capacitive coupling. For example, the high frequency coupling may be inductive coupling. Alternatively, the high frequency coupling may be a connection using a high-pass filter / band-pass filter.

[0026] In this embodiment, the first metal and the second metal are high-frequency coupled via the elastic member. Specifically, in this embodiment, the elastic member is high-frequency coupled to at least one of the first metal and the second metal. In the example of FIG. 3 , the elastic member is high-frequency coupled to both the first metal and the second metal. Specifically, the elastic member is separated from both the first metal and the second metal by an insulating sheet. This allows the elastic member to be capacitively coupled to both the first metal and the second metal. As a result, the first metal and the second metal are high-frequency coupled via the elastic member.

[0027] It should be noted that the elastic member does not necessarily have to be high-frequency coupled to both the first metal and the second metal. For example, the elastic member may be high-frequency coupled (e.g., capacitively coupled) to one of the first metal and the second metal, and electrically connected (e.g., in direct contact) to the other of the first metal and the second metal. This also allows the first metal and the second metal to be high-frequency coupled via the elastic member.

[0028] According to this embodiment, the connector shell is high-frequency coupled to a stable surrounding ground, which suppresses communication noise (e.g., USB 3.X communication noise) emitted from the connector, thereby suppressing performance degradation of the radio wave receiving function (e.g., deterioration of radio wave receiving sensitivity and / or communication failure).

[0029] The wired communication interface is not limited to a USB interface (e.g., a USB 3.X interface). For example, the wired communication interface may be a High-Definition Multimedia Interface (HDMI), a wired LAN interface (Ethernet), a Peripheral Component Interconnect Express (PCIe), a Serial Digital Interface (SDI), or a Lightning interface. Alternatively, the wired communication interface may be a wired communication interface with a communication speed of several hundred Mbps or more (e.g., 300 MHz or more).

[0030] The outline of this embodiment has been explained above, and the structure of the electronic device of this embodiment will be explained in detail below.

[0031] <<2. Examples of Electronic Devices>> An overview of this embodiment has been described above, but before describing the structure of the electronic device of this embodiment in detail, examples of electronic devices to which this embodiment can be applied will be given.

[0032] The electronic device of this embodiment is typically a terminal device such as a smartphone. However, the electronic device of this embodiment is not limited to a terminal device. The electronic device of this embodiment may be another wireless communication device such as a base station.

[0033] In the following description, a terminal device 10 will first be described as an example of an electronic device according to this embodiment. Then, a base station 20 will be described as another example of the electronic device according to this embodiment. Note that the wireless communication device according to this embodiment is not limited to the terminal device 10 and the base station 20. The wireless communication device according to this embodiment may be another wireless communication device equipped with an antenna for transmitting and / or receiving radio waves.

[0034] <2-1. Terminal Device> First, the terminal device 10 will be described.

[0035] The terminal device 10 is a wireless communication device that wirelessly communicates with other wireless communication devices such as a base station 20. The terminal device 10 may be any type of information processing device (computer). For example, the terminal device 10 may be a mobile terminal such as a mobile phone, a smart device (smartphone or tablet), a personal digital assistant (PDA), a notebook PC, or a portable game console. The terminal device 10 may also be an imaging device (e.g., a camcorder) equipped with a communication function. The terminal device 10 may also be a motorcycle or a mobile broadcast vehicle equipped with a communication device such as a field pickup unit (FPU). The terminal device 10 may also be a machine-to-machine (M2M) device or an Internet of Things (IoT) device. The terminal device 10 may also be a wearable device such as a smartwatch.

[0036] The terminal device 10 may also be an XR device such as an AR (Augmented Reality) device, a VR (Virtual Reality) device, or an MR (Mixed Reality) device. In this case, the XR device may be a glasses-type device such as AR glasses or MR glasses, or a head-mounted device such as a VR head-mounted display. When the terminal device 10 is an XR device, the terminal device 10 may be a standalone device consisting only of a part worn by a user (e.g., a glasses part). Alternatively, the terminal device 10 may be a terminal-linked device consisting of a part worn by a user (e.g., a glasses part) and a terminal part (e.g., a smart device) linked to the part worn by a user.

[0037] The terminal device 10 of this embodiment may be configured to connect to a network using a radio access technology (RAT) such as LTE (Long Term Evolution), NR (New Radio), B5G (Beyond 5G), 6G, Wi-Fi, or Bluetooth (registered trademark). In this case, the terminal device 10 may be configured to be able to use different radio access technologies (wireless communication methods). For example, the terminal device 10 may be configured to be able to use NR and Wi-Fi. Furthermore, the terminal device 10 may be configured to be able to use different cellular communication technologies (e.g., LTE, NR, B5G, or 6G). Furthermore, the terminal device 10 may be capable of satellite communication. In the following description, the terminal device 10 may be referred to as UE (User Equipment).

[0038] LTE and NR are types of cellular communication technologies that enable mobile communication for terminal devices by arranging multiple areas covered by base stations in the form of cells. 6G, also a type of cellular communication technology, has the potential to become a technology that enables mobile communication for terminal devices by arranging multiple areas covered by base stations in the form of cells.

[0039] In the following description, "LTE" includes LTE-A (LTE-Advanced), LTE-A Pro (LTE-Advanced Pro), and EUTRA (Evolved Universal Terrestrial Radio Access). NR includes NRAT (New Radio Access Technology) and FEUTRA (Further EUTRA). A single base station 20 may manage multiple cells. In the following description, a cell corresponding to LTE is referred to as an LTE cell, and a cell corresponding to NR is referred to as an NR cell.

[0040] NR is the next generation (5th generation) radio access technology after LTE (4th generation communications including LTE-Advanced and LTE-Advanced Pro). NR is a radio access technology that can support various use cases including eMBB (Enhanced Mobile Broadband), mMTC (Massive Machine Type Communications), and URLLC (Ultra-Reliable and Low Latency Communications). NR was standardized in 3GPP (registered trademark) Rel-15 as a technical framework that corresponds to the usage scenarios, requirements, and deployment scenarios of these use cases. Furthermore, B5G and 6G are required to simultaneously achieve multiple axes of high speed, large capacity, low latency, high reliability, and multiple simultaneous connections.

[0041] 6G is the next generation of cellular communications technology after NR (5th generation mobile communications) and 5GS (5G system). 6G includes radio access technology and network technologies between base stations, core networks, and data networks. 6G also includes technologies for extreme connectivity of eMBB, mMTC, and URLLC, which were the main use cases or requirements of NR. 6G also includes new technologies in new areas. For example, 6G may include technologies related to AI (cognitive network, AI native air interface), sensing (including radar sensing and network as a sensor), and terahertz communications.

[0042] The wireless network may support at least one of radio access technologies (RATs) such as LTE (Long Term Evolution), NR (New Radio), B5G, and 6G. LTE, NR, and 6G are types of cellular communication technologies that enable mobile communication for terminal devices by arranging multiple areas covered by base stations in the form of cells. The wireless access method used by the communication system 1 is not limited to LTE, NR, B5G, and 6G, and may be other wireless access methods such as W-CDMA (Wideband Code Division Multiple Access) and cdma2000 (Code Division Multiple Access 2000).

[0043] The terminal device 10 may be capable of NOMA (Non-Orthogonal Multiple Access) communication with the base station 20. Here, NOMA communication refers to communication (transmission, reception, or both) using non-orthogonal resources. The terminal device 10 may be able to use an automatic repeat retransmission technique such as HARQ (Hybrid Automatic Repeat reQuest) when communicating with the base station 20. The terminal device 10 may be capable of sidelink communication with another terminal device 10. The terminal device 10 may be able to use an automatic repeat retransmission technique such as HARQ when performing sidelink communication. The terminal device 10 may be capable of NOMA communication when performing sidelink communication with another terminal device 10. The terminal device 10 may be capable of LPWA (Low Power Wide Area) communication with another wireless communication device such as the base station 20. The wireless communication used by the terminal device 10, including sidelink communication, may be wireless communication using radio waves or wireless communication using infrared or visible light, i.e., optical wireless.

[0044] The wireless communication used by the terminal device 10 may be wireless communication using a millimeter wave band (30 GHz to 300 GHz band) or a quasi-millimeter wave band (e.g., 20 GHz to 30 GHz band). The wireless communication used by the terminal device 10 may be wireless communication using a frequency band below 6 GHz (e.g., Sub6) or a frequency band above 6 GHz (e.g., 6 GHz to 20 GHz band). The terminal device 10 may be capable of wireless communication using terahertz waves. The terminal device 10 may also be capable of wireless power transmission or radio wave sensing (e.g., sensing in the ultra wide band (UWB) and / or millimeter wave bands, etc.).

[0045] The terminal device 10 may also be a mobile device. The mobile device is a wireless communication device that can move. In this case, the terminal device 10 may be a wireless communication device installed in a mobile device, or may be the mobile device itself.

[0046] Here, the moving body may be a mobile terminal such as a smartphone or a mobile phone. The moving body may be a moving body that moves on land (ground in the narrow sense) (e.g., a vehicle such as an automobile, bicycle, bus, truck, motorcycle, train, or linear motor car), or a moving body that moves underground (e.g., in a tunnel) (e.g., a subway). The moving body may also be a moving body that moves on water (e.g., a ship such as a passenger ship, cargo ship, or hovercraft), or a moving body that moves underwater (e.g., a submersible vessel such as a submersible boat, submarine, or unmanned submersible). The moving body may also be a moving body that moves in the atmosphere (e.g., an aircraft such as an airplane, airship, or drone).

[0047] The terminal device 10 may be capable of simultaneously connecting to and communicating with a plurality of base stations 20 or a plurality of cells. When one base station 20 supports a communication area via a plurality of cells (e.g., pCell or sCell), the plurality of cells can be bundled together to enable communication between the base station 20 and the terminal device 10 by using carrier aggregation (CA) technology, dual connectivity (DC) technology, multi-connectivity (MC) technology, or the like. Alternatively, communication between the terminal device 10 and the plurality of base stations 20 can also be achieved via cells of different base stations 20 by coordinated multi-point transmission and reception (CoMP) technology.

[0048] The terminal device 10 may also be a relay terminal that relays communication to a remote terminal.

[0049] FIG. 4 is a diagram illustrating an example configuration of a terminal device 10 according to an embodiment of the present disclosure. The terminal device 10 includes a wireless communication unit 11, a storage unit 12, a control unit 13, a sensor unit 14, and a wired communication interface 15. The terminal device 10 does not necessarily have to include all of these components. The terminal device 10 may also include components other than these components. Note that the configuration illustrated in FIG. 4 is a functional configuration, and the hardware configuration may be different from this. Furthermore, the functions of the terminal device 10 may be distributed and implemented across multiple physically separated components.

[0050] The wireless communication unit 11 is, for example, a signal processing unit for wireless communication with other wireless communication devices (e.g., a base station 20 or another terminal device 10). The wireless communication unit 11 may be referred to as a wireless transceiver or simply as a transceiver. In this case, the wireless communication unit 11 may be a transceiver of a standard defined in the 3GPP technical specifications (hereinafter referred to as a 3GPP transceiver). The 3GPP transceiver may be a 3G transceiver, a 4G (LTE) transceiver, a 5G (NR) transceiver, or a transceiver of a generation after 5G. The wireless communication unit 11 is controlled, for example, by the control unit 13. The wireless communication unit 11 supports one or more wireless access methods. The wireless communication unit 11 may support at least one of wireless LAN, NR, LTE, B5G, and 6G. The wireless communication unit 11 may support W-CDMA, cdma2000, etc. in addition to NR, LTE, B5G, and 6G. The wireless communication unit 11 may support automatic repeat transmission techniques such as HARQ. Some or all of the processing performed by the wireless communication unit 11 may be performed by the control unit 13.

[0051] The wireless communication unit 11 is not limited to a 3GPP transceiver. The wireless communication unit 11 may be a transceiver of another wireless access technology, such as Wi-Fi, Bluetooth, or LPWA. When the wireless communication unit 11 is a Wi-Fi transceiver, the wireless communication unit 11 may support at least one of wireless communication using the 5 GHz band and wireless communication using the 2.4 GHz band. Of course, the wireless communication supported by the wireless communication unit 11 is not limited to wireless communication using these frequency bands. For example, when the wireless communication unit 11 is a Wi-Fi transceiver, the wireless communication unit 11 may support wireless communication using the 6 GHz band or wireless communication using a band above 6 GHz. Furthermore, the wireless communication unit 11 may support multiple wireless access technologies. For example, the wireless communication unit 11 may function as a Wi-Fi transceiver in addition to functioning as a 3GPP transceiver.

[0052] The wireless communication unit 11 includes an antenna 111. The antenna 111 may be considered as the wireless communication unit 11 itself. The wireless communication unit 11 may include a plurality of antennas 111. When the wireless communication unit 11 supports a plurality of wireless access methods, each unit of the wireless communication unit 11 may be configured individually for each wireless access method. The antenna 111 may be configured with a plurality of antenna elements, for example, a plurality of patch antennas. The wireless communication unit 11 may have a beamforming function. For example, the wireless communication unit 11 may have a polarization beamforming function using vertical polarization (V polarization) and horizontal polarization (H polarization) (or a polarization beamforming function using dual polarization in polarization directions 45 degrees and -45 degrees from the vertical direction).

[0053] Fig. 5 is a diagram showing an example of the arrangement of the antennas 111. In the example of Fig. 5, the terminal device 10 is a flat smart device, and antennas 111a, 111b, 111c, and 111d are arranged at the top, bottom, left, and right ends of the terminal device 10, respectively. Each of these multiple antennas 111 transmits radio waves in a predetermined direction and / or receives radio waves from a predetermined direction.

[0054] The antenna 111 may be an antenna composed of one antenna element or an antenna composed of multiple antenna elements. When the antenna 111 is composed of multiple antenna elements, the wireless communication unit 11 may be configured to generate a directional beam by controlling the directivity of the wireless signal using the multiple antenna elements. Figure 6 is a diagram showing an example configuration of the antenna 111. In the example of Figure 6, an inverted-F antenna is used as the antenna element. The inverted-F antenna is a type of linear antenna, and is composed of, for example, an antenna element 112 arranged around a housing and a ground 113 (such as the housing).

[0055] The antenna 111 is not limited to the antenna having the configuration shown in FIG. 6 . For example, the antenna 111 may be an array antenna using patch antennas as antenna elements. The patch antenna is a rectangular microstrip antenna. The patch antenna is configured, for example, by antenna elements (patches) arranged on a dielectric substrate having a ground plane on the back surface. In addition, antennas of various configurations (for example, an inverted-F antenna, an inverted-L antenna, a loop antenna, or a patch antenna) can be used for the antenna 111.

[0056] The storage unit 12 is a storage device that can read and write data, such as a DRAM, an SRAM, a flash memory, or a hard disk.

[0057] The control unit 13 is a controller that controls each unit of the terminal device 10. The control unit 13 may be realized by a processor such as a central processing unit (CPU) or a micro processing unit (MPU). The control unit 13 may be realized by an integrated circuit such as an application specific integrated circuit (ASIC) or a field programmable gate array (FPGA). The control unit 13 may be realized by a graphics processing unit (GPU).

[0058] The sensor unit 14 is a sensor for detecting various types of information. For example, the sensor unit 14 is a sensor that acquires information about objects around the device. For example, the sensor unit 14 is a sensor that acquires information about the position, shape, movement, etc. of other objects. Note that the sensor unit 14 is not limited to a sensor that acquires information about objects around the device. The sensor unit 14 may also be a sensor for detecting the state of the device itself (for example, the position, movement speed, tilt, vibration, rotation, etc. of the terminal device 10).

[0059] The sensor unit 14 may be an RF (Radio Frequency) sensor or a non-RF sensor. Alternatively, the sensor unit 14 may be a sensor system (for example, a sensor unit or a sensor module) that combines an RF sensor and a non-RF sensor. An RF sensor is a sensor that performs measurements using radio waves, and a non-RF sensor is a sensor that performs measurements without using radio waves.

[0060] An example of an RF sensor is a radar that uses radio waves such as millimeter waves. In this case, the radio waves used for the radar are not limited to radio waves in the millimeter wave band (e.g., 30 to 300 GHz band), but may also be radio waves in the microwave band (e.g., 3 to 30 GHz band) or quasi-millimeter wave band (e.g., 20 to 30 GHz band).

[0061] Another example of an RF sensor is a radio positioning sensor (radio positioning system). An example of a radio positioning sensor is a Global Navigation Satellite System (GNSS) sensor. Here, the GNSS sensor may be a Global Positioning System (GPS) sensor, a GLONASS sensor, a Galileo sensor, or a Quasi-Zenith Satellite System (QZSS) sensor. Note that the radio positioning sensor is not limited to a GNSS sensor, and may be, for example, a sensor for 3GPP positioning or Wi-Fi / Bluetooth positioning.

[0062] Of course, the sensor unit 14 is not limited to the above-mentioned sensors, and may be a sensor system that combines a plurality of the above-mentioned sensors.

[0063] The wired communication interface 15 is an interface for wired communication. For example, the wired communication interface 15 is a USB interface such as a USB 3.X interface. Here, USB 3.X is, for example, at least one of USB 3.0, USB 3.1, and USB 3.2. Of course, USB 3.X may include other USB standards (e.g., USB 3.2 or later). Furthermore, the USB interface is not limited to a USB 3.X interface. The USB interface may be a USB 2.0 interface, a USB 1.1 interface, or a USB 4 interface. Of course, the USB interface may be an interface compatible with a USB standard other than those mentioned above. The USB interface may also be an interface that supports multiple USB standards (for example, at least one of USB 1.1, USB 2.0, USB 3.0, USB 3.1, USB 3.2, and USB 4).

[0064] The wired communication interface 15 is not limited to a USB interface. For example, the wired communication interface may be an HDMI, a wired LAN interface (Ethernet), PCIe, SDI, or a Lightning interface. Alternatively, the wired communication interface may be a wired communication interface with a communication speed of several hundred Mbps or more (for example, 300 MHz or more). Of course, the wired communication interface may be an interface of a standard other than these. Furthermore, the wired communication interface may be an interface that supports multiple standards.

[0065] The wired communication interface 15 includes one or more connectors 16. In the example of FIG. 4, the wired communication interface 15 includes at least two connectors (connectors 16 １ , and connector 16 ２). The connector 16 is a communication connector for connecting a wired communication cable (e.g., a USB cable, a LAN cable, etc.). For example, the connector 16 is a USB connector (e.g., a USB 3.X connector) for connecting a USB cable. The USB connector may be a USB 1.1 connector, a USB 2.0 connector, a USB 3.X connector, or a USB 4 connector. Note that the connector 16 is not limited to a USB connector. For example, the connector 16 may be an HDMI connector for connecting an HDMI cable, a LAN connector for connecting a LAN cable, a PCIe connector for connecting a PCIe cable, an SDI connector for connecting an SDI cable, or a Lightning connector for connecting a Lightning cable. Alternatively, the connector 16 may be a connector for a wired communication interface with a communication speed of several hundred Mbps or more (e.g., 300 Mbps or more).

[0066] Fig. 7 is a diagram showing an example of the arrangement of the connectors 16. In the example of Fig. 7, one connector 16 is arranged on one of the side surfaces of the terminal device 10. Note that the wired communication interface 15 may include multiple connectors 16. When the wired communication interface 15 includes multiple connectors 16, the multiple connectors 16 may be connectors of different standards. For example, the wired communication interface 15 may include one or more USB connectors and one or more HDMI connectors.

[0067] <2-2. Base Station> As described above, the electronic device of this embodiment is not limited to the terminal device 10. Below, a base station 20 will be described as another example of the electronic device of this embodiment.

[0068] The base station 20 is a wireless communication device that performs wireless communication with other wireless communication devices (e.g., the terminal device 10 or another base station 20). The base station 20 may perform wireless communication with the terminal device 10 via a relay station, or may perform wireless communication directly with the terminal device 10.

[0069] The base station 20 is a type of communication device. More specifically, the base station 20 is a device equivalent to a wireless access point (Access Point) or a wireless base station (e.g., Base Station, Node B, eNB, gNB, or 6GNB). The base station 20 may be a wireless relay station. The base station 20 may be an optical device called an RRH (Remote Radio Head). The base station 20 may be a receiving station such as an FPU (Field Pickup Unit). The base station 20 may be an IAB (Integrated Access and Backhaul) donor node or an IAB relay node that provides wireless access lines and wireless backhaul lines using time division multiplexing, frequency division multiplexing, or space division multiplexing.

[0070] The radio access technology used by the base station 20 may be wireless LAN technology (IEEE 802.11), LTE-U (LTE-Unlicensed), NR-U (NR Unlicensed), LAA (Licensed Assisted Access), or MulteFire. Of course, the radio access technology used by the base station 20 may be cellular communication technology. Furthermore, the radio access technology used by the base station 20 may be LPWA (Low Power Wide Area) communication technology. Of course, the radio access technology used by the base station 20 is not limited to these.

[0071] The wireless communication used by the base station 20 may be wireless communication using a millimeter wave band (30 GHz to 300 GHz band) or a quasi-millimeter wave band (for example, 20 GHz to 30 GHz band). Of course, the wireless communication used by the base station 20 may be wireless communication using a frequency band below 6 GHz (for example, Sub6) or a frequency band above 6 GHz (for example, 6 GHz to 20 GHz band). Furthermore, the wireless communication used by the base station 20 may be wireless communication using terahertz waves.

[0072] The base station 20 may also be capable of NOMA (Non-Orthogonal Multiple Access) communication with the terminal device 10. Here, NOMA communication refers to communication (transmission, reception, or both) using non-orthogonal resources. Note that the base station 20 may also be capable of NOMA communication with other base stations 20.

[0073] The concept of a base station (also called a "base station device") includes not only a donor base station but also a relay base station (also called a "relay station"). A relay base station may be any one of an RF Repeater, a Smart Repeater, and an Intelligent Surface. The concept of a base station includes not only a structure with base station functions but also equipment installed in the structure.

[0074] Examples of structures include high-rise buildings, houses, steel towers, station facilities, airport facilities, port facilities, office buildings, school buildings, hospitals, factories, commercial facilities, stadiums, and other buildings. The concept of a structure includes not only buildings, but also non-building structures such as tunnels, bridges, dams, fences, and steel pillars, as well as equipment such as cranes, gates, and wind turbines. The concept of a structure includes not only land (ground in the narrow sense) or underground structures, but also water-based structures such as piers or megafloats, and underwater structures such as ocean observation facilities. A base station can also be referred to as an information processing device.

[0075] The base station 20 may be a donor station or a relay station (relay station). The base station 20 may also be a fixed station or a mobile station. A mobile station is a wireless communication device (e.g., a base station) configured to be mobile. In this case, the base station 20 may be a device installed in a mobile body, or may be the mobile body itself. For example, a relay station with mobility can be considered as the base station 20 as a mobile station. Furthermore, devices that are inherently mobile and have base station functionality (at least part of the base station functionality), such as vehicles, UAVs (Unmanned Aerial Vehicles) represented by drones, and smartphones, also fall under the category of the base station 20 as a mobile station.

[0076] Here, the moving body may be a mobile terminal such as a smartphone or a mobile phone. The moving body may be a moving body that moves on land (ground in the narrow sense) (e.g., a vehicle such as an automobile, bicycle, bus, truck, motorcycle, train, or linear motor car), or a moving body that moves underground (e.g., in a tunnel) (e.g., a subway). The moving body may also be a moving body that moves on water (e.g., a ship such as a passenger ship, cargo ship, or hovercraft), or a moving body that moves underwater (e.g., a submersible vessel such as a submersible boat, submarine, or unmanned submersible). The moving body may also be a moving body that moves in the atmosphere (e.g., an aircraft such as an airplane, airship, or drone).

[0077] The base station 20 may also be a terrestrial base station (ground station) installed on the ground. For example, the base station 20 may be a base station located on a structure on the ground, or a base station installed on a mobile object moving on the ground. More specifically, the base station 20 may be an antenna installed on a structure such as a building and a signal processing device connected to the antenna. Of course, the base station 20 may also be the structure or mobile object itself. "Ground" refers not only to land (ground in the narrow sense) but also to ground, on water, and underwater. Note that the base station 20 is not limited to a terrestrial base station. For example, if a communication system including the base station 20 is a satellite communication system, the base station 20 may also be an aircraft station. From the perspective of the satellite station, an aircraft station located on Earth is a ground station.

[0078] The base station 20 is not limited to a terrestrial station. The base station 20 may be a non-terrestrial base station (non-terrestrial station) that can fly in the air or space. For example, the base station 20 may be an aircraft station or a satellite station.

[0079] Here, the satellite station is a satellite station capable of floating outside the atmosphere. The satellite station may be a device mounted on a space vehicle such as an artificial satellite, or may be the space vehicle itself. The space vehicle is a vehicle that moves outside the atmosphere. The space vehicle may be at least one of an artificial satellite, a spacecraft, a space station, and a probe. Of course, the space vehicle may also be an artificial celestial body other than these. Note that a satellite that serves as a satellite station may be any of a low Earth orbiting (LEO) satellite, a medium Earth orbiting (MEO) satellite, a geostationary Earth orbiting (GEO) satellite, or a highly elliptical orbiting (HEO) satellite. The satellite station may be a device mounted on a low Earth orbiting (LEO), a medium Earth orbiting (MEO), a geostationary Earth orbiting (GEO), or a highly elliptical orbiting (HEO) satellite.

[0080] Furthermore, an aircraft station is a wireless communication device capable of floating within the atmosphere of an aircraft or the like. The aircraft station may be a device mounted on the aircraft or the like, or may be the aircraft itself. The concept of aircraft includes not only heavier-than-air vehicles such as airplanes and gliders, but also lighter-than-air vehicles such as balloons and airships. The concept of aircraft includes not only heavier-than-air vehicles or lighter-than-air vehicles, but also rotorcraft such as helicopters and autogyros. The aircraft station, or an aircraft equipped with an aircraft station, may be an unmanned aerial vehicle such as a drone.

[0081] The concept of unmanned aerial vehicles also includes unmanned aerial systems (UAS) and tethered unmanned aerial systems (TAS). The concept of unmanned aerial vehicles also includes lighter than air UAS (LTA) and heavier than air UAS (HTA). The concept of unmanned aerial vehicles also includes high altitude unmanned aerial system platforms (HAPs).

[0082] The coverage size of the base station 20 may be as large as a macrocell or as small as a picocell. Of course, the coverage size of the base station 20 may also be extremely small, such as a femtocell. The base station 20 may also have beamforming capabilities. In this case, the base station 20 may form a cell or service area for each beam. In addition to beamforming, which imparts directionality to a beam, the base station 20 may also have a function to pinpoint a desired wave to a specific location by further considering distance information from the antenna of the base station 20. This function may be called beam focusing or point forming.

[0083] FIG. 8 is a diagram illustrating an example configuration of a base station 20 according to an embodiment of the present disclosure. The base station 20 includes a wireless communication unit 21, a storage unit 22, a control unit 23, a sensor unit 24, and a wired communication interface 25. The base station 20 does not necessarily have to include all of these components. The base station 20 may also include components other than these components. Note that the configuration illustrated in FIG. 8 is a functional configuration, and the hardware configuration may be different. Furthermore, the functions of the base station 20 may be distributed and implemented across multiple physically separated components.

[0084] The wireless communication unit 21 is, for example, a signal processing unit for wireless communication with other wireless communication devices (for example, the terminal device 10 and another base station 20). The wireless communication unit 21 includes an antenna 211. The antenna 211 may be considered to be the wireless communication unit 21 itself. The wireless communication unit 21 may include multiple antennas 211. The wireless communication unit 21 operates under the control of the control unit 23. Additionally, the configuration of the wireless communication unit 21 may be the same as the configuration of the wireless communication unit 11 included in the terminal device 10.

[0085] The storage unit 22 is a storage device that can read and write data, such as a DRAM, an SRAM, a flash memory, or a hard disk.

[0086] The control unit 23 is a controller that controls each unit of the base station 20. The control unit 23 may be realized by a processor such as a CPU or an MPU. The control unit 23 may be realized by an integrated circuit such as an ASIC or an FPGA. The control unit 23 may be realized by a GPU.

[0087] The sensor unit 24 is a sensor for detecting various types of information. For example, the sensor unit 24 is a sensor that acquires information about objects around the device. For example, the sensor unit 24 is a sensor that acquires information about the position, shape, movement, etc. of other objects. The sensor unit 24 may be a sensor that detects the state of the device itself (for example, the position, movement speed, tilt, vibration, rotation, etc. of the base station 20). Alternatively, the configuration of the sensor unit 24 may be the same as the configuration of the sensor unit 14 included in the terminal device 10. For example, the sensor unit 24 may be an RF sensor or a non-RF sensor. Furthermore, the sensor unit 24 may be a sensor system that combines an RF sensor and a non-RF sensor.

[0088] The wired communication interface 25 is an interface for wired communication. For example, the wired communication interface 25 is a USB interface such as a USB 3.X interface. It may also be an HDMI, a wired LAN interface (Ethernet), PCIe, or SDI. Note that the wired communication interface is not limited to a USB interface. For example, the wired communication interface may be an HDMI, a wired LAN interface (Ethernet), PCIe, SDI, or Lightning interface. Of course, the wired communication interface may be an interface of a standard other than these. Furthermore, the wired communication interface may be an interface that supports multiple standards. Additionally, the configuration of the wired communication interface 25 may be the same as the configuration of the wired communication interface 15 provided in the terminal device 10.

[0089] The wired communication interface 25 includes one or more connectors 26. In the example of FIG. 8, the wired communication interface 25 includes at least two connectors (connectors 16). １ , and connector 16 ２) The connector 26 is a communication connector for connecting a wired communication cable (for example, a USB cable, a LAN cable, or the like). For example, the connector 26 is a USB connector (for example, a USB 3.X connector) for connecting a USB cable. Note that the connector 26 is not limited to a USB connector. For example, the connector 26 may be an HDMI connector for connecting an HDMI cable, a LAN connector for connecting a LAN cable, a PCIe connector for connecting a PCIe cable, or an SDI connector for connecting an SDI cable. Alternatively, the configuration of the connector 26 may be the same as the configuration of the connector 16 included in the terminal device 10.

[0090] In some embodiments, the base station 20 may be configured as a collection of multiple physical or logical devices. As an example, the base station 20 of this embodiment may be divided into multiple devices such as a baseband unit (BBU) and a radio unit (RU). The base station 20 may be interpreted as a collection of these multiple devices. Furthermore, the base station may be either a BBU or an RU, or may be both. The BBU and the RU may be connected by a predetermined interface such as an enhanced Common Public Radio Interface (eCPRI).

[0091] The RU may be referred to as an RRU (Remote Radio Unit) or an RD (Radio DoT). The RU may correspond to a gNB-DU (gNB Distributed Unit) described later. The BBU may correspond to a gNB-CU (gNB Central Unit) described later. The RU may be a device integrally formed with an antenna. The antenna of the base station 20, for example, an antenna integrally formed with the RU, may employ an Advanced Antenna System and support MIMO such as FD-MIMO or beamforming. The antenna of the base station 20 may include, for example, 64 transmitting antenna ports and 64 receiving antenna ports.

[0092] The antenna mounted on the RU may be an antenna panel consisting of one or more antenna elements, and the RU may be equipped with one or more antenna panels. The RU may be equipped with two types of antenna panels, a horizontally polarized antenna panel and a vertically polarized antenna panel. The RU may be equipped with two types of antenna panels, a right-handed circularly polarized antenna panel and a left-handed circularly polarized antenna panel, or an antenna panel with a polarization direction at 45 degrees from the vertical direction and an antenna panel with a polarization direction at -45 degrees from the vertical direction. Multiple antennas with these multiple polarization directions may be mounted on a single antenna panel. The RU may form and control an independent beam for each antenna panel.

[0093] A plurality of base stations 20 may be connected to each other. One or more base stations 20 may be included in a radio access network (RAN). In this case, the base station 20 may be simply referred to as a RAN, a RAN node, an AN (Access Network), an AN node, or the like. The RAN in LTE may be called an Enhanced Universal Terrestrial RAN (EUTRAN). The RAN in NR may be called an NGRAN. Furthermore, the RAN in 6G may be called a 6GRAN. The RAN in W-CDMA (UMTS) may be called a UTRAN.

[0094] An LTE base station 20 may be referred to as an eNodeB (Evolved Node B) or eNB. In this case, the EUTRAN includes one or more eNodeBs (eNBs). An NR base station 20 may be referred to as a gNodeB or gNB. In this case, the NGRAN includes one or more gNBs. A 6G base station may be referred to as a 6GNodeB, 6gNodeB, 6GNB, or 6gNB. In this case, the 6GRAN includes one or more 6GNBs. The EUTRAN may include a gNB (en-gNB) connected to a core network (EPC) in an LTE communication system (EPS). The NGRAN may include an ng-eNB connected to a core network 5GC in a 5G communication system (5GS).

[0095] When the base station 20 is an eNB, gNB, 6GNB, or the like, the base station 20 may be referred to as a 3GPP access. When the base station 20 is a wireless access point, the base station 20 may be referred to as a non-3GPP access. The base station 20 may be a radio device called an RRH (Remote Radio Head). When the base station 20 is a gNB, the base station 20 may be a combination of the gNB-CU and gNB-DU described above, or may be either a gNB-CU or a gNB-DU.

[0096] <2-3. Other Examples> Although a wireless communication device has been described above as an example of the electronic device of this embodiment, the electronic device of this embodiment is not limited to a wireless communication device.

[0097] For example, the electronic device of this embodiment may be an information processing device / signal processing device equipped with an RF sensor. For example, the electronic device of this embodiment may be a positioning device (e.g., a GNSS device such as a GPS device) equipped with a radio positioning sensor (e.g., a GNSS sensor such as a GPS sensor) as an RF sensor. Alternatively, the electronic device of this embodiment may be a radar device equipped with a radar as an RF sensor. Here, the RF sensor may be the same as the RF sensor equipped in the sensor unit 14 and / or the sensor unit 24. A sensing function using an RF sensor (e.g., a function for receiving sensing radio waves) is also a type of radio wave receiving function.

[0098] The electronic device of the present embodiment may be a broadcast receiving device such as a television receiver, etc. A broadcast receiving function (for example, a function for receiving television broadcasts) is also a type of radio wave receiving function.

[0099] Note that the electronic device of this embodiment does not necessarily have to have a wireless communication function as long as it has a radio wave receiving function. Of course, the electronic device may have a wireless communication function as one of its radio wave receiving functions. For example, the electronic device may have a wireless communication function in addition to a function for receiving sensing radio waves (e.g., GNSS signals and / or radar signals). Here, the configuration of the wireless communication function may be the same as the configuration of the wireless communication unit 11 and / or the wireless communication unit 21 described above. When an electronic device has a wireless communication function, the electronic device can be considered a wireless communication device.

[0100] 3. Structure of Electronic Device The electronic device of the present embodiment has been described above, but the structure of the electronic device of the present embodiment will be described in detail below. In the following description, the structure of the terminal device 10 will be described as an example of the structure of the electronic device.

[0101] In the following description, only the wired communication interface 15 and its surrounding structure will be shown as the structure of the terminal device 10. In the following description, this structure may be referred to as the wired communication interface structure.

[0102] The wired communication interface structure shown below can also be applied to electronic devices other than the terminal device 10. For example, the wired communication interface structure shown below can also be applied to a base station 20, a positioning device, a radar device, or a broadcast receiving device. In this case, the description of "terminal device 10" shown below can be replaced with a description indicating the corresponding electronic device (e.g., "base station 20," "positioning device," "radar device," or "broadcast receiving device"), and the description of "wired communication interface 15" can be replaced with a description indicating the wired communication interface of the electronic device (e.g., "wired communication interface 25" or "wired communication interface"). Note that the description of "terminal device 10" can also be replaced with "electronic device," "information processing device," or "signal processing device."

[0103] FIG. 9 is a diagram illustrating an example of the external appearance of the terminal device 10. In the example of FIG. 9, the terminal device 10 is a smartphone. In the following description, an XYZ coordinate system may be used for ease of understanding. Here, the X-axis direction, Y-axis direction, and Z-axis direction are all directions determined with respect to the terminal device 10. The positive X-axis direction is, for example, the left side direction of the terminal device 10, and the negative X-axis direction is, for example, the right side direction of the terminal device 10. The positive Y-axis direction is, for example, the upper side direction of the terminal device 10, and the negative Y-axis direction is, for example, the lower side direction of the terminal device 10. The positive Z-axis direction is, for example, the front direction (upward direction) of the terminal device 10, and the negative Z-axis direction is, for example, the rear direction (downward direction) of the terminal device 10.

[0104] The definitions of the X-axis, Y-axis, and Z-axis directions shown here are merely examples and can be changed as appropriate. For example, the positive Z-axis direction may be the downward direction, and the negative Z-axis direction may be the upward direction. In this case, the term "upper surface" in the following description will be replaced with "lower surface," and vice versa.

[0105] As described above, the terminal device 10 has a radio wave receiving function. The radio wave receiving function of the terminal device 10 is, for example, a radio positioning function (for example, a satellite positioning function such as a GPS function) and / or a wireless communication function (for example, a Wi-Fi function and / or a mobile communication system function). Of course, the terminal device 10 may also have other radio wave receiving functions. The terminal device 10 may also have, as the radio wave receiving function, a sensing radio wave receiving function (for example, a sensing function using an RF sensor).

[0106] The terminal device 10 also includes a connector 16. The connector 16 is, for example, a USB connector (e.g., a USB 3.X connector). Of course, the connector 16 may be a connector of another standard. For example, the connector 16 may be an HDMI connector. In the example of Fig. 9, the connector 16 includes a connector shell 16s and a plurality of terminals 16p.

[0107] The connector shell 16s is a member (e.g., a metal member) that surrounds the connector 16. If the connector 16 is a USB connector, the connector shell 16s is a USB shell. Of course, the connector shell 16s may be a connector shell of another standard. For example, the connector shell 16s may be an HDMI shell.

[0108] In this embodiment, a portion or all of the connector shell 16s is made of a metal (hereinafter referred to as the first metal). The first metal is a highly conductive metal such as iron, copper, aluminum, magnesium, or nickel. The first metal may be a combination of multiple metals selected from these metals, or an alloy containing one or more metals selected from these metals. The first metal may have a conductive film on its surface. In this case, the first metal with the conductive film formed thereon can be considered the first metal itself. The conductive film may also be considered the first metal. The conductive film may be formed by plating (e.g., silver plating, copper plating, gold plating, nickel plating, or tin plating). Of course, the conductive film may be formed by other methods.

[0109] The connector shell 16s may also be made of a material with low electrical conductivity. For example, the connector shell 16s may be made of a metal material with low electrical conductivity (e.g., titanium or stainless steel) or a non-metal material (e.g., ceramic or plastic). In this case, the material (e.g., metal material and / or non-metal material) making up the connector shell 16s may have a conductive film on its surface. In this case, the conductive film may be considered the first metal. The conductive film may be formed by plating (e.g., silver plating, copper plating, gold plating, nickel plating, or tin plating). Of course, the conductive film may be formed by other methods.

[0110] 9, the entire connector shell 16s is made of the first metal. In the following description, the entire connector shell 16s is made of the first metal, but only a portion of the connector shell 16s may be made of the first metal. When only a portion of the connector shell 16s is made of the first metal, the term "connector shell 16s" below can be replaced with "first metal" as appropriate.

[0111] The terminals 16p are contact terminals that come into contact with terminals of a wired communication cable. In the example of FIG. 9, the connector 16 has N terminals 16p (terminals 16p １ ~16p Ｎ ) where N is any integer.

[0112] The connector shell 16s is mounted on a substrate 171 inside the housing of the terminal device 10. FIG. 10 is a diagram showing an example of mounting the connector 16 on the substrate 171. The substrate 171 is, for example, an electronic substrate such as a flexible substrate or an FR4 substrate. The substrate 171 is formed with a pattern 171a serving as a ground and a pattern 171b separated from the ground (pattern 171a). To ensure safety, the connector shell 16s is mounted on the pattern 171b separated from the ground by soldering or the like. Note that the patterns 171a and 171b may be capacitively coupled by one or more capacitors.

[0113] Based on the above, the wired communication interface structures according to the first embodiment 1 to the seventh embodiment will be described below. In the following description, only the connector shell 16s and its surrounding structure will be shown as the wired communication interface structure.

[0114] In the following description, only some elements may be shown schematically as elements of the board included in the terminal device 10. For example, in the following description, only the ground pattern (e.g., pattern 171a and / or pattern 173a) and the pattern at the same potential as the connector shell 16s (e.g., pattern 171b) may be shown as elements of the board (board 171 and / or board 173) included in the terminal device 10. However, in reality, the board also has electronic components and associated wiring.

[0115] 11A and 11B are diagrams showing a wired communication interface structure according to a first embodiment. Specifically, Fig. 11A is a perspective view of the wired communication interface structure according to the first embodiment, and Fig. 11B is a side view of the wired communication interface structure according to the first embodiment. In Fig. 11A and 11B, some of the elements constituting the wired communication interface structure are shown in an exploded state.

[0116] As shown in FIGS. 11A and 11B , the wired communication interface structure according to the first embodiment includes a connector shell 16s (first metal), a substrate 171, a metal housing 172 (second metal), an elastic member 18A, and an insulating sheet 19.

[0117] As described above, the connector shell 16s is a member (e.g., a metal member) that surrounds the connector 16. The substrate 171 is, for example, an electronic substrate such as a flexible substrate or an FR4 substrate. The substrate 171 is formed with a pattern 171a that serves as a ground and a pattern 171b that is separated from the ground. In the examples of FIGS. 11A and 11B , the connector shell 16s is mounted on the pattern 171b. The metal housing 172 is part or all of the housing of the terminal device 10. In the first embodiment, the metal housing 172 is at the same potential as the ground.

[0118] The elastic member 18A is an elastic member having electrical conductivity. In the first embodiment, the elastic member 18A is a gasket having electrical conductivity (hereinafter referred to as a conductive gasket). More specifically, the elastic member 18A is a conductive gasket in which a cushion 181 and a conductive member 182 are integrally formed. The cushion 181 may also be referred to as the elastic member 181.

[0119] The cushion 181 (elastic member 181) is a member that provides elasticity to the elastic member 18A. In the example of Figures 11A and 11B, the cushion 181 is a thick elastic member whose upper surface (in the example of the figure, the surface in the positive direction of the Z axis) and lower surface (in the example of the figure, the surface in the negative direction of the Z axis) are both flat. The cushion 181 has elasticity at least in the thickness direction (in the example of the figure, the Z axis direction).

[0120] Various materials can be used for the cushion 181 as long as they have elasticity. For example, the cushion 181 may be made of foamed plastic (e.g., expanded polystyrene or foamed polyurethane) or bubble cushioning material (air cushion). The cushion 181 may also be made of cloth (woven and / or nonwoven fabric). For example, the cushion 181 may be made of thick cloth, folded cloth, or multiple layers of stacked cloth. The cushion 181 may also be made of elastomer (thermoplastic elastomer) or rubber. Here, the rubber may be silicone rubber, fluororubber, styrene rubber, butadiene rubber, ethylene propylene rubber, ethylene propylene diene rubber, urethane rubber, acrylic rubber, or butyl rubber. Rubber can be considered a type of elastomer (thermosetting elastomer). The cushion 181 may also be made of a combination of multiple materials selected from the above materials.

[0121] The shape of the cushion 181 is not limited to the shape shown in FIGS. 11A and 11B . For example, the upper and / or lower surfaces of the cushion 181 do not necessarily have to be flat. For example, the upper and / or lower surfaces of the cushion 181 may be shaped to match the shapes of the connector shell 16s and / or the metal housing 172. For example, if the lower surface of the metal housing 172 (the portion facing the upper surface of the cushion 181) has irregularities, the upper surface of the cushion 181 may be shaped to fit into the irregularities of the metal housing 172. Furthermore, if the upper surface of the connector shell 16s (the portion facing the lower surface of the cushion 181) has irregularities, the lower surface of the cushion 181 may be shaped to fit into the irregularities of the connector shell 16s. Note that the horizontal size of the cushion 181 (in the illustrated example, the XY axis directions) may be larger than the horizontal size of the connector shell 16s. In this case, the shape of the cushion 181 may be shaped to fit into the connector shell 16s itself from above. The cushion 181 may have any shape.

[0122] The conductive member 182 is a member that provides conductivity to the elastic member 18A. For example, the conductive member 182 is a conductive cloth-like member. For example, the conductive member 182 is a conductive woven fabric having a conductive metal film on the surface of the fibers. Examples of conductive metals include silver, copper, gold, nickel, zinc, and tin. The conductive metal may also be an alloy containing at least one of these metals (e.g., a tin alloy). Of course, the conductive metal is not limited to these metals. The conductive member 182 is not limited to a woven fabric (conductive woven fabric) but may also be a nonwoven fabric. The conductive member 182 may also be a woven fabric (i.e., a wire mesh) woven with metal threads (threads made of metal not only on the surface but also in the center). The conductive member 182 is not limited to a woven fabric or a nonwoven fabric. For example, the conductive member 182 may be a resin film having a metal film on the surface or a metal film made of metal (e.g., tin foil). Alternatively, the conductive member 182 may be a sheet-, film-, or plate-shaped member that is partially or entirely made of a conductive metal.

[0123] The conductive member 182 is disposed on the surface (for example, the upper surface and / or the lower surface) of the cushion 181. In the example of Fig. 11A and Fig. 11B, one conductive member 182 is curved and wrapped around the cushion 181, thereby disposing the conductive member 182 on the upper and lower surfaces of the cushion 181. One conductive member 182 may also be bent and wrapped around the cushion 181. Note that the method of disposing the conductive member 182 is not limited to this. For example, a plurality of conductive members 182 may be disposed on the surface (for example, the upper surface and / or the lower surface) of the cushion 181. Fig. 12 is a diagram showing an example of the configuration of the elastic member 18A. In the example of Fig. 12, the conductive member 182 １ The conductive member 182 is attached to the upper surface of the cushion 181. ２ is disposed on the underside of the cushion 181.

[0124] In the above example, the conductive gasket is an integral structure of the cushion 181 and the conductive member 182. However, the conductive gasket may be made up of only the conductive member 182 (e.g., conductive woven fabric).

[0125] The insulating sheet 19 is a sheet-like (film-like) insulator. The insulating sheet 19 is, for example, a resin sheet (also called a resin film). For example, the insulating sheet 19 may be a PET sheet (also called a PET film). Of course, the insulating sheet 19 is not limited to a resin sheet (resin film) and may be, for example, a paper sheet.

[0126] In the first embodiment, the elastic member 18A is disposed between the connector shell 16s (first metal) and the metal housing 172 (second metal). In the first embodiment, an insulating sheet 19 is disposed between the elastic member 18A and the connector shell 16s and between the elastic member 18A and the metal housing 172. The insulating sheet 19 provides insulation between the elastic member 18A and the connector shell 16s and between the elastic member 18A and the metal housing 172. In the example shown in FIGS. 11A and 11B, the metal housing 172 is separated from other structures to facilitate understanding of the structure. However, in reality, the metal housing 172 is layered on the insulating sheet 19 above the elastic member 18A.

[0127] Various methods can be used to fix the elastic member 18A. For example, the insulating sheet 19 may be an adhesive / sticky sheet. For example, the insulating sheet 19 may be a double-sided tape. The insulating sheet 19 may also be formed from an adhesive. The adhesive / sticky force of the insulating sheet 19 then fixes the elastic member 18A between the metal housing 172 and the connector shell 16s. Of course, the method for fixing the elastic member 18A is not limited to this. For example, the elastic member 18A may be fixed using a structure not shown.

[0128] By disposing the elastic member 18A between the connector shell 16s and the metal housing 172, contact pressure is generated between the lower surface of the elastic member 18A and the insulating sheet 19, and between the upper surface of the connector shell 16s and the insulating sheet 19. Furthermore, by disposing the elastic member 18A between the connector shell 16s and the metal housing 172, contact pressure is generated between the upper surface of the elastic member 18A and the insulating sheet 19, and between the lower surface of the metal housing 172 and the insulating sheet 19. This contact pressure ensures reliable contact (surface contact) between them.

[0129] As described above, the insulating sheet 19 is disposed between the elastic member 18A and the connector shell 16s to prevent electrical conduction between the elastic member 18A and the connector shell 16s. This causes the lower surface of the elastic member 18A and the upper surface of the connector shell 16s to face each other with the insulating sheet 19 sandwiched between them. That is, the conductive member 182 of the elastic member 18A and the connector shell 16s are slightly spaced apart with the insulating sheet 19 sandwiched between them. As a result, this portion functions like a parallel plate capacitor, and the elastic member 18A is high-frequency coupled (capacitively coupled in this example) with the connector shell 16s.

[0130] As described above, the insulating sheet 19 is disposed between the elastic member 18A and the metal housing 172 to prevent electrical conduction between the elastic member 18A and the metal housing 172. This causes the upper surface of the elastic member 18A and the lower surface of the metal housing 172 to face each other with the insulating sheet 19 sandwiched between them. That is, the conductive member 182 of the elastic member 18A and the metal housing 172 are slightly spaced apart with the insulating sheet 19 sandwiched between them. As a result, this portion functions like a parallel plate capacitor, and the elastic member 18A is high-frequency coupled (capacitively coupled in this example) with the metal housing 172.

[0131] The elastic member 18A and the insulating sheet 19 are designed to achieve desired high-frequency coupling between the connector shell 16s and the metal housing 172. For example, the dimensions of the elastic member 18A and the insulating sheet 19 and / or the dielectric constant of the insulating sheet 19 are designed to achieve the desired high-frequency coupling.

[0132] For example, the thickness (length in the Z-axis direction) of the conductive member 182 of the elastic member 18A may be in the range of 1 μm to 10 μm. Of course, the thickness of the conductive member 182 may be greater or less than that. The area of ​​the upper surface of the elastic member 18A is 1 mm ２ ~100mm ２ The area of ​​the upper surface of the elastic member 18A may be larger than that. The area of ​​the insulating sheet 19 that is in close contact with the upper surface of the elastic member 18A may also be the same as the area of ​​the upper surface of the elastic member 18A. The area of ​​the upper surface of the elastic member 18A and the area of ​​the insulating sheet 19 may be different. Furthermore, the area of ​​the upper surface of the elastic member 18A and / or the area of ​​the insulating sheet 19 may be different from the area of ​​the lower surface of the metal housing 172.

[0133] For example, the area of ​​the lower surface of the elastic member 18A is 1 mm ２ ~100mm ２The area of ​​the upper surface of the elastic member 18A may, of course, be larger. The area of ​​the insulating sheet 19 that is in close contact with the lower surface of the elastic member 18A may also be the same as the area of ​​the lower surface of the elastic member 18A. The area of ​​the lower surface of the elastic member 18A and the area of ​​the insulating sheet 19 may be different. Furthermore, the area of ​​the lower surface of the elastic member 18A and / or the area of ​​the insulating sheet 19 may be different from the area of ​​the upper surface of the connector shell 16s.

[0134] Furthermore, the thickness of the insulating sheet 19 (length in the Z-axis direction) may be 1 μm to 100 μm. More specifically, the thickness of the insulating sheet 19 may be 1 μm to 60 μm, preferably 10 μm to 30 μm, and more preferably 10 to 20 μm. Of course, the thickness of the insulating sheet 19 may be greater or less than that. For example, the thickness of the insulating sheet 19 may be 100 μm to 200 μm, or may be greater than that. Furthermore, the dielectric constant of the insulating sheet 19 may be, for example, 2 to 5. Of course, the dielectric constant of the insulating sheet 19 may be greater or less than that.

[0135] According to this embodiment, the connector shell 16s (first metal) is high-frequency coupled to the metal housing 172 (second metal) via the elastic member 18A, thereby suppressing communication noise emitted from the connector 16. As a result, deterioration in the radio wave receiving function of the terminal device 10 is suppressed.

[0136] Additionally, an elastic member 18A is disposed between the connector shell 16s (first metal) and the metal housing 172 (second metal). Pressure from the elastic member 18A ensures contact (surface contact) between the lower surface (conductive member 182) of the elastic member 18A and the insulating sheet 19, and between the upper surface of the connector shell 16s and the insulating sheet 19. In other words, the connector shell 16s and the elastic member 18A (conductive member 182) are reliably capacitively coupled. Pressure from the elastic member 18A also ensures contact (surface contact) between the upper surface (conductive member 182) of the elastic member 18A and the insulating sheet 19, and between the lower surface of the metal housing 172 and the insulating sheet 19. In other words, the metal housing 172 and the elastic member 18A (conductive member 182) are reliably capacitively coupled. As a result, communication noise radiated from the connector 16 can be accurately absorbed by the metal housing 172.

[0137] Furthermore, the elastic member 18A can absorb mechanical tolerances (also called machining tolerances), making it easy to assemble the terminal device 10.

[0138] In the first embodiment, the elastic member 18A is capacitively coupled to both the connector shell 16s (first metal) and the metal housing 172 (second metal). In the example of FIGS. 11A and 11B , insulating sheets 19 are disposed on both the upper and lower portions of the elastic member 18A, thereby capacitively coupling the elastic member 18A to both the connector shell 16s and the metal housing 172. However, the elastic member 18A does not necessarily have to be capacitively coupled to both the connector shell 16s and the metal housing 172. For example, the elastic member 18A may be capacitively coupled to one of the connector shell 16s and the metal housing 172 and electrically conductive (e.g., in direct contact) with the other of the connector shell 16s and the metal housing 172. In the example of FIGS. 11A and 11B , insulating sheets 19 may be disposed only on one of the upper and lower portions of the elastic member 18A, and no insulating sheet 19 may be disposed on the other portion. This also allows the connector shell 16s and the metal housing 172 to be high frequency coupled via the elastic member.

[0139] Furthermore, when high-frequency coupling is performed between the connector shell 16s and the metal housing 172, the insulating sheet 19 does not necessarily need to be disposed on the terminal device 10 (wired interface structure). For example, at least one of the one or more insulating sheets 19 provided on the terminal device 10 (wired interface structure) may be replaced with an insulating layer other than the insulating sheet 19. In this case, the insulating layer may be an insulating coating provided on the connector shell 16s and / or the metal housing 172. The insulating coating may be formed by an insulating coating treatment (e.g., anodizing). Alternatively, the insulating layer may be air (clearance). This also enables high-frequency coupling between the connector shell 16s and the metal housing 172 via the elastic member 18A. Note that the insulating sheet 19 may be disposed in addition to an insulating layer (e.g., an insulating coating). The term "insulating sheet 19" described above or below may be replaced with "insulating layer." The insulating sheet 19 is also a type of insulating layer.

[0140] 11A and 11B, the insulating sheet 19 is separated into two pieces. However, it is not necessary for multiple insulating sheets 19 to be present for one elastic member 18A. For example, the insulating sheet 19 disposed between the elastic member 18A and the connector shell 16s and the insulating sheet 19 disposed between the elastic member 18A and the metal housing 172 may be an integrated sheet. FIG. 13 shows an example of the arrangement of the insulating sheet 19. For example, a single insulating sheet 19 may be curved or bent and wrapped around the elastic member 18A, thereby arranging the insulating sheet 19 on the upper and lower surfaces of the elastic member 18A. In the example of FIG. 13, the insulating sheet 19 is integrated along the conductive member 182. By forming the insulating sheet 19 disposed between the elastic member 18A and the connector shell 16s and the insulating sheet 19 disposed between the elastic member 18A and the metal housing 172 into an integrated sheet, assembly of the terminal device 10 is facilitated.

[0141] In the first embodiment, the second metal coupled to the connector shell 16s at high frequency is the metal housing 172. However, the second metal is not limited to the metal housing 172. The second metal may be a metal other than the metal housing 172. For example, the second metal may be a metal (e.g., sheet metal) having the same potential as the ground, rather than the metal housing. In this case, the metal having the same potential as the ground may be a conductor electrically connected to the metal housing 172 (e.g., a highly conductive metal in contact with the metal housing 172) or a conductor electrically connected to a ground pattern on the circuit board (e.g., a highly conductive metal in contact with the ground pattern). The second metal may also be a ground (ground pattern) on the circuit board. Note that when the second metal is the ground on the circuit board, the circuit board may be different from the circuit board 171 on which the connector 16 is mounted. This example will be described in detail in the third embodiment.

[0142] 14A and 14B are diagrams showing a wired communication interface structure according to a second embodiment. Specifically, Fig. 14A is a perspective view of the wired communication interface structure according to the second embodiment, and Fig. 14B is a side view of the wired communication interface structure according to the second embodiment. In Fig. 14A and 14B, some of the elements constituting the wired communication interface structure are shown disassembled.

[0143] As shown in FIGS. 14A and 14B , the wired communication interface structure according to the second embodiment includes a connector shell 16s (first metal), a substrate 171, a metal housing 172 (second metal), an elastic member 18B, and an insulating sheet 19.

[0144] The wired communication interface structure according to the second embodiment is the same as the wired communication interface structure according to the first embodiment, except that the elastic member 18A is replaced by the elastic member 18B. Therefore, a description of the elements other than the elastic member 18B (the connector shell 16s, the substrate 171, the metal housing 172, and the insulating sheet 19) will be omitted.

[0145] The elastic member 18B is an elastic member having electrical conductivity. In the first embodiment, the elastic member is an electrically conductive gasket, but in the second embodiment, the elastic member 18B is a metal spring.

[0146] Fig. 15 is a diagram showing an example of an elastic member 18B (metal spring). The elastic member 18B may be made of a metal plate processed to have elasticity at least in the up-down direction (Z-axis direction). In the example of Fig. 15, the elastic member 18B is a metal spring in the shape of a metal plate that has been curved or bent and folded in half. Note that, although the example of Fig. 15 shows the elastic member 18B folded in half, it may also be folded in three, four, or more.

[0147] The metal plate is made of a highly conductive metal material such as iron, copper, aluminum, magnesium, or nickel. The metal material may be a combination of multiple metals selected from these metals, or an alloy containing one or more metals selected from these metals. The metal plate may have a conductive film on its surface. The conductive film may be formed by plating (e.g., silver plating, copper plating, gold plating, nickel plating, or tin plating). Of course, the conductive film may be formed by other methods. As long as conductivity can be ensured by the conductive film, the metal plate does not necessarily have to be made of a highly conductive metal material. The metal plate may also be made of a low-conductivity metal material (e.g., titanium or stainless steel).

[0148] The elastic member 18B has a flat surface on each of its upper (positive Z-axis direction) and lower (negative Z-axis direction) surfaces. In the example of FIG. 15, the elastic member 18B has a flat surface 183 on its upper surface. １ and a flat portion 183 at the bottom. ２ It has.

[0149] 16 is a diagram showing another example of the elastic member 18B (metal spring). In the example of FIG. 16, the elastic member 18B is made up of a coil spring 184 and a metal plate 185. １ and metal plate 185 ２ In the example of FIG. 16, in order to make it easier to understand the structure, the metal spring is composed of the metal plate 185. １However, in reality, the metal plate 185 １ is stacked on top of the coil spring 184.

[0150] The coil spring 184 is, for example, a compression coil spring. ２ are respectively disposed at the ends (ends in the compression direction) of the coil spring 184. In the example of FIG. １ is disposed at the upper end (positive direction of the Z axis) of the coil spring 184, and the metal plate 185 ２ is disposed at the lower end (negative Z-axis direction) of the coil spring 184.

[0151] Coil spring 184, metal plate 185 １ , and metal plate 185 ２ are made of a metal material with high conductivity. If conductivity can be ensured, the coil spring 184 and the metal plate 185 １ , and metal plate 185 ２ The metal plate does not necessarily have to be made of a metal material with high conductivity. １ , and metal plate 185 ２ The metal material constituting the metal plate may be the same as the metal material described above (the metal material constituting the metal plate shown in FIG. 15).

[0152] The elastic member 18B is not limited to the metal spring having the structure shown in Figures 15 and 16. For example, the elastic member 18B may be a metal spring having a structure other than that shown in Figures 15 and 16. Furthermore, the elastic member 18B may be a spring made of a non-metallic material (for example, a resin spring). In this case, the spring may be made conductive by forming a conductive film on the surface of the non-metallic material.

[0153] In the following description, the upper surface of the elastic member 18B (for example, the flat surface 183 １ , or metal plate 185 １ The upper surface of the elastic member 18B (metal spring) may be referred to as the upper surface of the elastic member 18B. ２ or metal plate 185 ２The lower surface of the elastic member 18B may be referred to as the lower surface of the elastic member 18B.

[0154] In the second embodiment, the elastic member 18B (metal spring) is disposed between the connector shell 16s (first metal) and the metal housing 172. In the second embodiment, an insulating sheet 19 is disposed between the elastic member 18B and the connector shell 16s and between the elastic member 18B and the metal housing 172. The insulating sheet 19 provides insulation between the elastic member 18B and the connector shell 16s and between the elastic member 18B and the metal housing 172. In the example of FIGS. 14A and 14B , the metal housing 172 is separated from other structures to make the structure easier to understand. However, in reality, the metal housing 172 is layered on the insulating sheet 19 above the elastic member 18B.

[0155] Various methods can be used to fix the elastic member 18B (metal spring). For example, the insulating sheet 19 may be an adhesive / sticky sheet. For example, the insulating sheet 19 may be a double-sided tape. The insulating sheet 19 may also be formed of an adhesive. Then, the adhesive / sticky force of the insulating sheet 19 fixes the elastic member 18B between the elastic member 18B and the connector shell 16s. Of course, the method for fixing the elastic member 18B is not limited to this. For example, the elastic member 18B may be fixed using a structure not shown.

[0156] By disposing the elastic member 18B between the connector shell 16s and the metal housing 172, contact pressure is generated between the lower surface of the elastic member 18B and the insulating sheet 19, and between the upper surface of the connector shell 16s and the insulating sheet 19. Furthermore, by disposing the elastic member 18B between the connector shell 16s and the metal housing 172, contact pressure is generated between the upper surface of the elastic member 18B and the insulating sheet 19, and between the lower surface of the metal housing 172 and the insulating sheet 19. This contact pressure ensures reliable contact (surface contact) between them.

[0157] As described above, the insulating sheet 19 is disposed between the elastic member 18B and the connector shell 16s to prevent electrical conduction between the elastic member 18B and the connector shell 16s. This causes the lower surface of the elastic member 18B and the upper surface of the connector shell 16s to face each other with the insulating sheet 19 sandwiched between them. That is, the conductive member 182 of the elastic member 18B and the connector shell 16s are slightly spaced apart with the insulating sheet 19 sandwiched between them. As a result, this portion functions like a parallel plate capacitor, and the elastic member 18B is high-frequency coupled (capacitively coupled in this example) with the connector shell 16s.

[0158] As described above, the insulating sheet 19 is disposed between the elastic member 18B and the metal housing 172 to prevent electrical conduction between the elastic member 18B and the metal housing 172. This causes the upper surface of the elastic member 18B and the lower surface of the metal housing 172 to face each other with the insulating sheet 19 sandwiched between them. That is, the conductive member 182 of the elastic member 18B and the metal housing 172 are slightly spaced apart with the insulating sheet 19 sandwiched between them. As a result, this portion functions like a parallel plate capacitor, and the elastic member 18B is high-frequency coupled (capacitively coupled in this example) with the metal housing 172.

[0159] The elastic member 18B and the insulating sheet 19 are designed to achieve desired high-frequency coupling between the connector shell 16s and the metal housing 172. For example, the dimensions of the elastic member 18B and the insulating sheet 19 and / or the dielectric constant of the insulating sheet 19 are designed to achieve the desired high-frequency coupling.

[0160] For example, the area of ​​the upper surface of the elastic member 18B is 1 mm ２ ~100mm ２ The area of ​​the upper surface of the elastic member 18B may be larger than that. The area of ​​the insulating sheet 19 that is in close contact with the upper surface of the elastic member 18B may also be the same as the area of ​​the upper surface of the elastic member 18B. The area of ​​the upper surface of the elastic member 18B and the area of ​​the insulating sheet 19 may be different. Furthermore, the area of ​​the upper surface of the elastic member 18B and / or the area of ​​the insulating sheet 19 may be different from the area of ​​the lower surface of the metal housing 172.

[0161] The area of ​​the lower surface of the elastic member 18B is 1 mm２ ~100mm ２ The area of ​​the upper surface of the elastic member 18B may, of course, be greater than this. The area of ​​the insulating sheet 19 that is in close contact with the lower surface of the elastic member 18B may also be the same as the area of ​​the lower surface of the elastic member 18B. The area of ​​the lower surface of the elastic member 18B and the area of ​​the insulating sheet 19 may be different. Furthermore, the area of ​​the lower surface of the elastic member 18B and / or the area of ​​the insulating sheet 19 may be different from the area of ​​the upper surface of the connector shell 16s.

[0162] The dimensions and / or dielectric constant of the insulating sheet 19 may be the same as those in the first embodiment.

[0163] According to this embodiment, the connector shell 16s (first metal) is high-frequency coupled to the metal housing 172 (second metal) via the elastic member 18B, thereby suppressing communication noise emitted from the connector 16. As a result, deterioration in the radio wave receiving function of the terminal device 10 is suppressed.

[0164] Additionally, an elastic member 18B is disposed between the connector shell 16s (first metal) and the metal housing 172 (second metal). Pressure from the elastic member 18B ensures contact (surface contact) between the bottom surface of the elastic member 18B and the insulating sheet 19, and between the top surface of the connector shell 16s and the insulating sheet 19. In other words, the connector shell 16s and the elastic member 18B are reliably capacitively coupled. Pressure from the elastic member 18B also ensures contact (surface contact) between the top surface of the elastic member 18B and the insulating sheet 19, and between the bottom surface of the metal housing 172 and the insulating sheet 19. In other words, the metal housing 172 and the elastic member 18B are reliably capacitively coupled. As a result, communication noise radiated from the connector 16 can be accurately absorbed by the metal housing 172.

[0165] Moreover, the elastic member 18B can absorb mechanical tolerances, making it easy to assemble the terminal device 10.

[0166] In the second embodiment, the elastic member 18B is capacitively coupled to both the connector shell 16s (first metal) and the metal housing 172 (second metal). In the example of FIGS. 14A and 14B , insulating sheets 19 are disposed on both the upper and lower portions of the elastic member 18B, thereby capacitively coupling the elastic member 18B to both the connector shell 16s and the metal housing 172. However, the elastic member 18B does not necessarily have to be capacitively coupled to both the connector shell 16s and the metal housing 172. For example, the elastic member 18B may be capacitively coupled to one of the connector shell 16s and the metal housing 172 and electrically conductive (e.g., in direct contact) with the other of the connector shell 16s and the metal housing 172. In the example of FIGS. 14A and 14B , insulating sheets 19 may be disposed only on one of the upper and lower portions of the elastic member 18B, and no insulating sheet 19 may be disposed on the other portion. This also allows the connector shell 16s and the metal housing 172 to be high frequency coupled via the elastic member.

[0167] In the second embodiment, the elastic member 18B is a separate object from the connector shell 16s (first metal) and the metal casing 172 (second metal). However, the elastic member 18B may be integral with the connector shell 16s or the metal casing 172. For example, the elastic member 18B may be a spring-like protrusion provided on a part of the connector shell 16s, or a spring-like protrusion provided on a part of the metal casing 172. In this case, the spring-like protrusion may be part of the metal constituting the connector shell 16s or may be part of the metal constituting the metal casing 172. In other words, the spring-like protrusion may be formed by deforming the metal constituting the connector shell 16s or the metal constituting the metal casing 172.

[0168] Furthermore, when high-frequency coupling is performed between the connector shell 16s and the metal housing 172, the insulating sheet 19 does not necessarily need to be disposed on the terminal device 10 (wired interface structure). For example, at least one of the one or more insulating sheets 19 provided on the terminal device 10 (wired interface structure) may be replaced with an insulating layer other than the insulating sheet 19. In this case, the insulating layer may be an insulating coating provided on the connector shell 16s and / or the metal housing 172. Alternatively, the insulating layer may be an insulating coating provided on the surface of the elastic member 18B (at least the contact surface with the connector shell 16s and / or the metal housing 172). The insulating coating may be formed by insulating coating treatment (e.g., anodizing). Alternatively, the insulating layer may be air (clearance). This also allows high-frequency coupling between the connector shell 16s and the metal housing 172 via the elastic member 18B. The insulating sheet 19 may be disposed in addition to an insulating layer (e.g., an insulating coating). The term "insulating sheet 19" mentioned above or below can be replaced with "insulating layer." The insulating sheet 19 is also a type of insulating layer.

[0169] 14A and 14B, the insulating sheet 19 is separated into two pieces. However, it is not necessary that there be multiple insulating sheets 19 for one elastic member 18B. For example, the insulating sheet 19 disposed between the elastic member 18B and the connector shell 16s and the insulating sheet 19 disposed between the elastic member 18B and the metal housing 172 may be a single sheet. In this case, one insulating sheet 19 may be curved or bent and wrapped around the elastic member 18B, thereby disposing the insulating sheets 19 on the upper and lower surfaces of the elastic member 18B. Using a single insulating sheet 19 makes it easier to assemble the terminal device 10.

[0170] In the second embodiment, the second metal coupled to the connector shell 16s at high frequency is the metal casing 172. However, the second metal is not limited to the metal casing 172. The second metal may be a metal other than the metal casing 172. For example, the second metal may be a metal (e.g., sheet metal) having the same potential as the ground. In this case, the metal having the same potential as the ground may be a conductor electrically connected to the metal casing 172 (e.g., a highly conductive metal in contact with the metal casing 172) or a conductor electrically connected to a ground pattern on the circuit board (e.g., a highly conductive metal in contact with the ground pattern). The second metal may also be a ground (ground pattern) on the circuit board. Note that when the second metal is the ground on the circuit board, the circuit board may be different from the circuit board 171 on which the connector 16 is mounted. This example will be described in detail in the fourth embodiment.

[0171] Otherwise, the wired communication interface structure according to the second embodiment is the same as the wired communication interface structure according to the first embodiment. The description of the wired communication interface structure shown in the first embodiment can also be applied to the wired communication interface structure according to the second embodiment, as appropriate. In this case, the description of "elastic member 18A" is replaced with "elastic member 18B" as appropriate.

[0172] 17A and 17B are diagrams showing a wired communication interface structure according to a third embodiment. Specifically, Fig. 17A is a perspective view of the wired communication interface structure according to the third embodiment, and Fig. 17B is a side view of the wired communication interface structure according to the third embodiment. In Fig. 17A and 17B, some of the elements constituting the wired communication interface structure are shown disassembled.

[0173] As shown in FIGS. 17A and 17B , the wired communication interface structure according to the third embodiment includes a connector shell 16s (first metal), a substrate 171 (first substrate), a substrate 173 (second substrate), an elastic member 18A, and an insulating sheet 19.

[0174] The wired communication interface structure according to the third embodiment is the same as the wired communication interface structure according to the first embodiment, except that the metal housing 172 is replaced with a substrate 173. Therefore, a description of the elements other than the substrate 173 (the connector shell 16s, the substrate 171, the elastic member 18A, and the insulating sheet 19) will be omitted.

[0175] The substrate 173 is an electronic substrate such as a flexible substrate or an FR4 substrate. The substrate 173 is a substrate different from the substrate 171 on which the connector 16 is mounted. A pattern 173a (ground pattern) serving as a ground is formed on the substrate 173. In the third embodiment, the pattern 173a serves as the second metal.

[0176] In the third embodiment, the elastic member 18A is disposed between the connector shell 16s (first metal) and the pattern 173a (second metal). In the third embodiment, similar to the first embodiment, an insulating sheet 19 is disposed between the elastic member 18A and the connector shell 16s and between the elastic member 18A and the pattern 173a. The insulating sheet 19 provides insulation between the elastic member 18A and the connector shell 16s and between the elastic member 18A and the pattern 173a. In the example shown in FIGS. 17A and 17B , the substrate 173 and the insulating sheet 19 are separated from other structures to facilitate understanding of the structure. However, in reality, the substrate 173 and the insulating sheet 19 are stacked on the elastic member 18A.

[0177] According to this embodiment, the connector shell 16s (first metal) is high-frequency coupled to the pattern 173a (second metal) via the elastic member 18A, thereby suppressing communication noise emitted from the connector 16. As a result, deterioration in the radio wave receiving function of the terminal device 10 is suppressed.

[0178] Additionally, an elastic member 18A is disposed between the connector shell 16s (first metal) and the pattern 173a (second metal). Pressure from the elastic member 18A ensures contact (surface contact) between the lower surface (conductive member 182) of the elastic member 18A and the insulating sheet 19, and between the upper surface of the connector shell 16s and the insulating sheet 19. In other words, the connector shell 16s and the elastic member 18A (conductive member 182) are reliably capacitively coupled. Pressure from the elastic member 18A also ensures contact (surface contact) between the upper surface (conductive member 182) of the elastic member 18A and the insulating sheet 19, and between the pattern 173a and the insulating sheet 19. In other words, the pattern 173a and the elastic member 18A (conductive member 182) are reliably capacitively coupled. As a result, communication noise radiated from the connector 16 can be accurately absorbed by the pattern 173a.

[0179] Moreover, the elastic member 18A can absorb mechanical tolerances, making it easy to assemble the terminal device 10.

[0180] Note that the insulating sheet 19 does not necessarily need to be disposed on the terminal device 10 to high-frequency couple the connector shell 16s and the pattern 173a. For example, at least one of the one or more insulating sheets 19 provided on the terminal device 10 (wired interface structure) may be replaced with an insulating layer other than the insulating sheet 19. In this case, the insulating layer may be an insulating coating provided on the connector shell 16s and / or the pattern 173a. The insulating coating may be formed by an insulating coating process (e.g., anodizing). Furthermore, a resist applied to the substrate 173 may serve as an insulating layer between the elastic member 18A and the pattern 173a (i.e., instead of the insulating sheet 19 on the substrate 173 side). Alternatively, the insulating layer may be air (clearance). This also allows the connector shell 16s and the pattern 173a to be high-frequency coupled via the elastic member 18A. Note that the insulating sheet 19 may be disposed in addition to an insulating layer (e.g., an insulating coating). The term "insulating sheet 19" mentioned above or below can be replaced with "insulating layer." The insulating sheet 19 is also a type of insulating layer.

[0181] Otherwise, the wired communication interface structure according to the third embodiment is the same as the wired communication interface structure according to the first embodiment. The description of the wired communication interface structure shown in the first embodiment can also be applied to the wired communication interface structure according to the third embodiment, as appropriate. In this case, the description "metal casing 172" is replaced with "pattern 173a" or "substrate 173" as appropriate.

[0182] 18A and 18B are diagrams showing a wired communication interface structure according to a fourth embodiment. Specifically, Fig. 18A is a perspective view of the wired communication interface structure according to the fourth embodiment, and Fig. 18B is a side view of the wired communication interface structure according to the fourth embodiment. In Fig. 18A and 18B, some of the elements constituting the wired communication interface structure are shown disassembled.

[0183] As shown in FIGS. 18A and 18B , the wired communication interface structure according to the fourth embodiment includes a connector shell 16s (first metal), a substrate 171 (first substrate), a substrate 173 (second substrate), an elastic member 18B (metal spring), and an insulating sheet 19.

[0184] The wired communication interface structure according to the fourth embodiment is the same as the wired communication interface structure according to the second embodiment, except that the metal housing 172 is replaced with a substrate 173. Therefore, a description of the elements other than the substrate 173 (the connector shell 16s, the substrate 171, the elastic member 18B, and the insulating sheet 19) will be omitted.

[0185] The substrate 173 is an electronic substrate such as a flexible substrate or an FR4 substrate. The substrate 173 is a substrate different from the substrate 171 on which the connector 16 is mounted. A pattern 173a (ground pattern) that serves as a ground is formed on the substrate 173. In the fourth embodiment, the pattern 173a serves as the second metal.

[0186] In the fourth embodiment, the elastic member 18B is disposed between the connector shell 16s (first metal) and the pattern 173a (second metal). In the fourth embodiment, similar to the second embodiment, an insulating sheet 19 is disposed between the elastic member 18B and the connector shell 16s and between the elastic member 18B and the pattern 173a. The insulating sheet 19 provides insulation between the elastic member 18B and the connector shell 16s and between the elastic member 18B and the pattern 173a. In the example shown in FIGS. 18A and 18B, the substrate 173 is separated from other components to facilitate understanding of the structure. However, in practice, the substrate 173 is stacked on the insulating sheet 19 above the elastic member 18B.

[0187] According to this embodiment, the connector shell 16s (first metal) is high-frequency coupled to the pattern 173a (second metal) via the elastic member 18B, thereby suppressing communication noise emitted from the connector 16. As a result, deterioration in the radio wave receiving function of the terminal device 10 is suppressed.

[0188] Additionally, an elastic member 18B is disposed between the connector shell 16s (first metal) and the pattern 173a (second metal). Pressure from the elastic member 18B ensures contact (surface contact) between the bottom surface of the elastic member 18B and the insulating sheet 19, and between the top surface of the connector shell 16s and the insulating sheet 19. In other words, the connector shell 16s and the elastic member 18B are reliably capacitively coupled. Pressure from the elastic member 18B also ensures contact (surface contact) between the top surface of the elastic member 18B and the insulating sheet 19, and between the pattern 173a and the insulating sheet 19. In other words, the pattern 173a and the elastic member 18B are reliably capacitively coupled. As a result, communication noise radiated from the connector 16 can be accurately absorbed by the pattern 173a.

[0189] Moreover, the elastic member 18B can absorb mechanical tolerances, making it easy to assemble the terminal device 10.

[0190] Note that the insulating sheet 19 does not necessarily need to be disposed on the terminal device 10 (wired interface structure) when high-frequency coupling is performed between the connector shell 16s and the pattern 173a. For example, at least one of the one or more insulating sheets 19 provided on the terminal device 10 (wired interface structure) may be replaced with an insulating layer other than the insulating sheet 19. In this case, the insulating layer may be an insulating coating provided on the connector shell 16s and / or the pattern 173a. Alternatively, the insulating layer may be an insulating coating provided on the surface of the elastic member 18B (at least the contact surface with the connector shell 16s and / or the pattern 173a). The insulating coating may be formed by an insulating coating process (e.g., anodizing). Alternatively, a resist applied to the substrate 173 may serve as an insulating layer between the elastic member 18B and the pattern 173a (i.e., instead of the insulating sheet 19 on the substrate 173 side). Alternatively, the insulating layer may be air (clearance). This also allows the connector shell 16s and the pattern 173a to be high-frequency coupled via the elastic member 18B. Note that an insulating sheet 19 may be disposed in addition to an insulating layer (e.g., an insulating coating). The term "insulating sheet 19" described above or below can be replaced with "insulating layer." The insulating sheet 19 is also a type of insulating layer.

[0191] In the fourth embodiment, the elastic member 18B is a separate object from the connector shell 16s (first metal) and the pattern 173a (second metal). However, the elastic member 18B may be integral with the connector shell 16s or the pattern 173a. For example, the elastic member 18B may be a spring-like protrusion provided on a part of the connector shell 16s or a spring-like protrusion provided on a part of the pattern 173a. In this case, the spring-like protrusion may be part of the metal constituting the connector shell 16s or part of the metal constituting the pattern 173a. In other words, the spring-like protrusion may be a deformed part of the metal constituting the connector shell 16s or a deformed part of the metal constituting the metal housing 172.

[0192] Otherwise, the wired communication interface structure according to the fourth embodiment is the same as the wired communication interface structure according to the second embodiment. The description of the wired communication interface structure shown in the second embodiment can also be applied to the wired communication interface structure according to the fourth embodiment, as appropriate. In this case, the description "metal casing 172" is replaced with "pattern 173a" or "substrate 173" as appropriate.

[0193] 19A and 19B are diagrams showing a wired communication interface structure according to a fifth embodiment. Specifically, Fig. 19A is a perspective view of the wired communication interface structure according to the fifth embodiment, and Fig. 19B is a side view of the wired communication interface structure according to the fifth embodiment. In Fig. 19A and 19B, some of the elements constituting the wired communication interface structure are shown disassembled.

[0194] As shown in FIGS. 19A and 19B , the wired communication interface structure according to the fifth embodiment includes a connector shell 16s (first metal), a substrate 171 (first substrate), a substrate 173 (second substrate), and an elastic member 18A.

[0195] The wired communication interface structure according to the fifth embodiment is the same as the wired communication interface structure according to the first embodiment, except that the metal housing 172 is replaced with a substrate 173 and that there is no insulating sheet 19. Therefore, a description of the elements other than the substrate 173 (the connector shell 16s, the substrate 171, and the elastic member 18A) will be omitted.

[0196] The substrate 173 is an electronic substrate such as a flexible substrate or an FR4 substrate. The substrate 173 is a substrate different from the substrate 171 on which the connector 16 is mounted. The substrate 173 is formed with a pattern 173a (ground pattern) that serves as a ground, and a pattern 173b that is separated from the ground (pattern 173a). In the fifth embodiment, the pattern 173a serves as the second metal. The patterns 173a and 173b are connected by one or more capacitors 173c. In other words, the patterns 173a and 173b are capacitively coupled by the one or more capacitors 173c.

[0197] The pattern 173b has an opening 173d for electrical connection with the elastic member 18A. The opening 173d is, for example, a resist opening. The opening 173d may be realized by removing the resist. Solder may be applied to the opening 173d. In the example of FIG. 19B , a conductor (e.g., solder) disposed in the resist opening on the substrate 173 is defined as the opening 173d, but part or all of the pattern 173b may also be considered to be the opening 173d. For example, a portion of the pattern 173b not covered by the resist may also be considered to be the opening 173d. The opening 173d is not necessarily required as long as high-frequency coupling (or electrical connection) between the elastic member 18A and the pattern 173b is ensured.

[0198] In the fifth embodiment, the elastic member 18A is disposed between the connector shell 16s (first metal) and the pattern 173b (or the opening 173d). In the fifth embodiment, the insulating sheet 19 is not disposed between the elastic member 18A and the connector shell 16s, nor between the elastic member 18A and the pattern 173b (or the opening 173d). In other words, the elastic member 18A is electrically conductive with both the connector shell 16s and the pattern 173b.

[0199] 19A and 19B, the substrate 173 is separated from other structures to make it easier to understand the structure. However, in reality, the substrate 173 is stacked on the elastic member 18A so that the pattern 173b (or the opening 173d) is located on the upper surface of the elastic member 18A.

[0200] According to this embodiment, the connector shell 16s (first metal) is high-frequency coupled to the pattern 173a (second metal) via the elastic member 18A, the pattern 173b, and the capacitor 173c, thereby suppressing communication noise emitted from the connector 16. As a result, deterioration in the radio wave receiving function of the terminal device 10 is suppressed.

[0201] Additionally, an elastic member 18A is disposed between the connector shell 16s (first metal) and the pattern 173b. Pressure from the elastic member 18A ensures that the lower surface (conductive member 182) of the elastic member 18A and the upper surface of the connector shell 16s are in contact (surface contact). Pressure from the elastic member 18A also ensures that the upper surface (conductive member 182) of the elastic member 18A and the pattern 173b (or the opening 173d) are in contact (surface contact). That is, the connector shell 16s (first metal) and the pattern 173a (second metal) are reliably capacitively coupled via the elastic member 18A (conductive member 182), the pattern 173b, and the capacitor 173c. As a result, communication noise radiated from the connector 16 can be accurately absorbed by the pattern 173a.

[0202] Moreover, the elastic member 18A can absorb mechanical tolerances, making it easy to assemble the terminal device 10.

[0203] 19A and 19B, an insulating layer (e.g., insulating sheet 19) is not provided in terminal device 10, but an insulating layer may be provided in terminal device 10. In this case, the insulating layer may be provided between connector shell 16s and elastic member 18A, or between pattern 173b and elastic member 18A. This also allows high-frequency coupling between connector shell 16s and pattern 173a via elastic member 18A.

[0204] In the fifth embodiment, the second metal is the pattern 173a. However, the second metal is not limited to the pattern 173a. For example, the second metal may be the metal housing 172. The elastic member 18A may be connected to the metal housing 172 (the second metal) via a capacitor.

[0205] Otherwise, the wired communication interface structure according to the fifth embodiment is the same as the wired communication interface structure according to the first embodiment. The description of the wired communication interface structure shown in the first embodiment can also be applied to the wired communication interface structure according to the fifth embodiment, as appropriate. In this case, the description of "metal housing 172" is replaced with "pattern 173a," "pattern 173b," "opening 173d," or "substrate 173," as appropriate.

[0206] 20A and 20B are diagrams showing a wired communication interface structure according to a sixth embodiment. Specifically, Fig. 20A is a perspective view of the wired communication interface structure according to the sixth embodiment, and Fig. 20B is a side view of the wired communication interface structure according to the sixth embodiment. In Fig. 20A and Fig. 20B, some of the elements constituting the wired communication interface structure are shown disassembled.

[0207] As shown in FIGS. 20A and 20B , the wired communication interface structure according to the sixth embodiment includes a connector shell 16s (first metal), a substrate 171 (first substrate), a substrate 173 (second substrate), and an elastic member 18B (metal spring).

[0208] The wired communication interface structure according to the sixth embodiment is the same as the wired communication interface structure according to the second embodiment, except that the metal housing 172 is replaced with a substrate 173 and that there is no insulating sheet 19. Therefore, a description of the elements other than the substrate 173 (the connector shell 16s, the substrate 171, and the elastic member 18B) will be omitted.

[0209] The substrate 173 is an electronic substrate such as a flexible substrate or an FR4 substrate. The substrate 173 is a substrate different from the substrate 171 on which the connector 16 is mounted. The substrate 173 is formed with a pattern 173a (ground pattern) that serves as a ground, and a pattern 173b that is separated from the ground (pattern 173a). In the fifth embodiment, the pattern 173a serves as the second metal. The patterns 173a and 173b are connected by one or more capacitors 173c. In other words, the patterns 173a and 173b are capacitively coupled by the one or more capacitors 173c.

[0210] The pattern 173b has an opening 173d for electrical connection with the elastic member 18B. The opening 173d is, for example, a resist opening. The opening 173d may be realized by removing the resist. Solder may be applied to the opening 173d. In the example of FIG. 20B , a conductor (e.g., solder) disposed in the resist opening on the substrate 173 is defined as the opening 173d, but part or all of the pattern 173b may also be considered to be the opening 173d. For example, a portion of the pattern 173b not covered by the resist may also be considered to be the opening 173d. The opening 173d is not necessarily required as long as high-frequency coupling (or electrical connection) between the elastic member 18B and the pattern 173b is ensured.

[0211] In the sixth embodiment, the elastic member 18B (metal spring) is disposed between the connector shell 16s (first metal) and the pattern 173b (or the opening 173d). In the example shown in FIGS. 20A and 20B , the elastic member 18B is solder-mounted to the pattern 173b (or the opening 173d). Note that the method of fixing the elastic member 18B is not limited to solder mounting, as long as high-frequency coupling (or conduction) between the elastic member 18B and the pattern 173b is ensured. For example, the elastic member 18B may be fixed to the pattern 173b (or the opening 173d) using a structure not shown. Alternatively, the elastic member 18B may be fixed to the connector shell 16s.

[0212] In the sixth embodiment, the insulating sheet 19 is not disposed between the elastic member 18B and the connector shell 16s, nor between the elastic member 18B and the pattern 173b (or the opening 173d). In other words, the elastic member 18B is electrically connected to both the connector shell 16s and the pattern 173b. Therefore, the elastic member 18B (metal spring) does not need to have a flat surface. In the example shown in FIG. 15, the elastic member 18B has a flat surface 183. １ and the flat portion 183 ２ In the example shown in FIG. 16, the elastic member 18B does not have to have a metal plate 185. １ and metal plate 185 ２ It is not necessary to have

[0213] 20A and 20B, the substrate 173 and the elastic member 18B are separated from other structures to make the structure easier to understand. However, in reality, the substrate 173 and the elastic member 18B are stacked on the connector shell 16s so that the lower end of the elastic member 18B is positioned on the upper surface of the connector shell 16s.

[0214] According to this embodiment, the connector shell 16s (first metal) is high-frequency coupled to the pattern 173a (second metal) via the elastic member 18B, the pattern 173b, and the capacitor 173c, thereby suppressing communication noise emitted from the connector 16. As a result, deterioration in the radio wave receiving function of the terminal device 10 is suppressed.

[0215] Additionally, an elastic member 18B is disposed between the connector shell 16s (first metal) and the pattern 173b. Pressure from the elastic member 18B ensures that the elastic member 18B and the upper surface of the connector shell 16s are in contact with each other. That is, the connector shell 16s (first metal) and the pattern 173a (second metal) are reliably capacitively coupled via the elastic member 18B, the pattern 173b, and the capacitor 173c. As a result, communication noise radiated from the connector 16 can be accurately absorbed by the pattern 173a.

[0216] Moreover, the elastic member 18B can absorb mechanical tolerances, making it easy to assemble the terminal device 10.

[0217] 20A and 20B, an insulating layer (e.g., insulating sheet 19) is not provided on the terminal device 10, but an insulating layer may be provided on the terminal device 10. In this case, the insulating layer may be provided between at least one of the connector shell 16s and the elastic member 18B and the pattern 173b and the elastic member 18B. In this case, the elastic member 18B (metal spring) may have a flat portion on the portion where the insulating layer is provided (e.g., the portion in contact with the insulating sheet 19). In the example shown in FIG. 15, the elastic member 18B has a flat portion 183. １ and / or the flat portion 183 ２ In the example shown in FIG. 16, the elastic member 18B may have a metal plate 185. １ and / or metal plate 185 ２ This also allows the connector shell 16s and the pattern 173a to be high-frequency coupled via the elastic member 18B.

[0218] In the sixth embodiment, the elastic member 18B is a separate object from the connector shell 16s (first metal) and the pattern 173b (or the opening 173d). However, the elastic member 18B may be integral with the connector shell 16s or the pattern 173b (or the opening 173d). For example, the elastic member 18B may be a spring-like protrusion provided on a part of the connector shell 16s, or a spring-like protrusion provided on a part of the pattern 173b (or the opening 173d). In this case, the spring-like protrusion may be part of the metal constituting the connector shell 16s, or may be part of the metal constituting the pattern 173b (or the opening 173d). In other words, the spring-like protrusion may be a deformed part of the metal constituting the connector shell 16s, or may be a deformed part of the metal constituting the pattern 173b (or the opening 173d).

[0219] In the sixth embodiment, the second metal is the pattern 173a. However, the second metal is not limited to the pattern 173a. For example, the second metal may be the metal housing 172. The elastic member 18B may be connected to the metal housing 172 (the second metal) via a capacitor.

[0220] Otherwise, the wired communication interface structure according to the sixth embodiment is the same as the wired communication interface structure according to the second embodiment. The description of the wired communication interface structure shown in the second embodiment can also be applied to the wired communication interface structure according to the sixth embodiment, as appropriate. In this case, the description "metal casing 172" is replaced with "pattern 173a" or "substrate 173" as appropriate.

[0221] 3-7. Seventh Example In the fifth and sixth examples, a capacitor (e.g., capacitor 173c) is provided between the second metal (e.g., pattern 173a) and the elastic member (e.g., elastic member 18A or elastic member 18B). However, the location where the capacitor is provided is not limited to between the second metal and the elastic member. The capacitor may be provided between the first metal (e.g., connector shell 16s) and the elastic member (e.g., elastic member 18A or elastic member 18B). In other words, the elastic member may be capacitively coupled to at least one of the first metal and the second metal by being connected to at least one of the first metal and the second metal via a capacitor.

[0222] 21A and 21B are diagrams showing a wired communication interface structure according to a seventh embodiment. Specifically, Fig. 21A is a perspective view of the wired communication interface structure according to the seventh embodiment, and Fig. 21B is a side view of the wired communication interface structure according to the seventh embodiment. In Fig. 21A and 21B, some of the elements constituting the wired communication interface structure are shown disassembled.

[0223] As shown in Figures 21A and 21B, the wired communication interface structure of the seventh embodiment includes a connector shell 16s (first metal), a substrate 171, a metal housing 172 (second metal), an elastic member 18B (metal spring), and a resin case 174.

[0224] Of the multiple elements included in the wired communication interface structure according to the seventh example, the elements other than the resin case 174 are the same as the elements described in the first to sixth embodiments. Therefore, a description of the elements other than the resin case 174 (the connector shell 16s, the substrate 171, the metal housing 172, and the elastic member 18B) will be omitted.

[0225] The resin case 174 is a case made of resin that surrounds the connector 16. The resin case 174 is provided in the terminal device 10, for example, to protect the connector 16. The resin case 174 may also be referred to as a resin cover 174. Note that a case made of a material other than resin may be used instead of the resin case 174. For example, a metal case or a ceramic case may be used instead of the resin case 174. In this case, the "resin case 174" described above or below may be replaced with a "metal case (metal cover)", a "ceramic case (ceramic cover)", or a "case (cover)" as appropriate.

[0226] Patterns are formed on the resin case 174 on both the surface facing the connector 16 and the opposite surface. In the example of FIGS. 21A and 21B , a pattern 174b1 is formed on the surface facing the connector 16 (the bottom surface in the illustrated example), and patterns 174b2 and 174b3 are formed on the opposite surface (the top surface in the illustrated example). These patterns may be formed, for example, by MID (Molded Interconnect Device) technology, such as LDS (Laser Direct Structuring). The patterns 174b1 and 174b3 are connected by a via 174h, and the patterns 174b3 and 174b1 are connected by one or more capacitors 174c. That is, the patterns 174b1 and 174b2 are capacitively coupled by one or more capacitors 174c.

[0227] In the example of Figures 21A and 21B, a plurality of elastic members 18B (metal springs) are used in the wired communication interface structure. Specifically, two elastic members 18B (elastic members 18B １ and elastic member 18B ２ 21A and 21B, the elastic member 18B １ is disposed between the connector shell 16s (first metal) and the pattern 174b1, and another elastic member 18B ２ is disposed between the metal housing 172 (second metal) and the pattern 174b2.

[0228] Note that, as long as the electrical continuity (or high-frequency coupling) between the connector shell 16s (first metal) and the pattern 174b1 and the electrical continuity (or high-frequency coupling) between the metal housing 172 (second metal) and the pattern 174b2 are ensured, the method of arranging the elastic member 18B is not limited to a specific method. For example, １ One end of the elastic member 18B may be fixed to the connector shell 16s (first metal). １ The other end of the elastic member 18B may contact the pattern 174b1. Also, for example, one end of the elastic member 18B may be fixed to the metal housing 172 (second metal). Then, when the metal housing 172 (second metal) is laminated on the resin case 174, the other end of the elastic member 18B may contact the pattern 174b1.

[0229] In the example of FIGS. 21A and 21B, in order to make it easier to understand the structure, the metal housing 172 and the elastic member 18B ２ However, in reality, the metal housing 172 and the elastic member 18B are spaced apart from other structures. ２ is the elastic member 18B ２ The lower end of the pattern 174b is placed on the resin case 174 so as to be positioned on the pattern 174b2.

[0230] According to this embodiment, the connector shell 16s (first metal) is high-frequency coupled to the metal housing 172 (second metal) via the capacitor 174c, thereby suppressing communication noise emitted from the connector 16. As a result, degradation in the performance of the radio wave receiving function of the terminal device 10 is suppressed.

[0231] Furthermore, the pressure from the elastic member 18B ensures that the elastic member 18B and the connector shell 16s and / or the pattern 174b1 are in contact with each other. The pressure from the elastic member 18B also ensures that the elastic member 18B and the metal housing 172 and / or the pattern 174b1 are in contact with each other. That is, the connector shell 16s (first metal) and the metal housing 172 (second metal) are reliably capacitively coupled. As a result, wired communication noise radiated from the connector 16 can be accurately absorbed by the pattern 173a.

[0232] Moreover, the elastic member 18B can absorb mechanical tolerances, making it easy to assemble the terminal device 10.

[0233] 21A and 21B, the elastic member 18B is provided both between the connector shell 16s (first metal) and the capacitor 174c and between the metal housing 172 (second metal) and the capacitor 174c. The elastic member 18B does not have to be provided between either the connector shell 16s (first metal) and the capacitor 174c or the metal housing 172 (second metal) and the capacitor 174c.

[0234] For example, an elastic member 18B is provided between the connector shell 16s (first metal) and the capacitor 174c. １ In this case, the metal housing 172 (second metal) and the capacitor 174c may be directly or indirectly connected and electrically connected. １ In addition, between the connector shell 16s (first metal) and the elastic member 18B １ A capacitor may also be provided between the connector shell 16s (first metal) and the elastic member 18B. １ may be capacitively coupled by a capacitor.

[0235] For example, an elastic member 18B is provided between the metal housing 172 (second metal) and the capacitor 174c. ２ In this case, the connector shell 16s (first metal) and the capacitor 174c may be directly or indirectly connected and electrically connected. ２ In addition, between the metal housing 172 (second metal) and the elastic member 18B ２ A capacitor may also be provided between the metal housing 172 (second metal) and the elastic member 18B. １ may be capacitively coupled by a capacitor.

[0236] 21A and 21B, an insulating layer (for example, an insulating sheet 19) is not provided on the terminal device 10, but an insulating layer may be provided on the terminal device 10. In this case, the insulating layer is formed by insulating the connector shell 16s and the elastic member 18B. １ between the pattern 174b1 and the elastic member 18B, between the metal housing 172 and the elastic member 18B, ２ and between the pattern 174b2 and the elastic member 18B. In this case, the elastic member 18B (metal spring) may have a flat portion at a portion where an insulating layer is provided (for example, a portion in contact with the insulating sheet 19). In the example shown in FIG. 15, the elastic member 18B has a flat portion 183 １ and / or the flat portion 183 ２ In the example shown in FIG. 16, the elastic member 18B may have a metal plate 185. １ and / or metal plate 185 ２ This also allows the connector shell 16s and the pattern 173a to be high-frequency coupled via the elastic member 18B.

[0237] In the seventh embodiment, the elastic member 18B １ is a separate object from the connector shell 16s (first metal) and the pattern 174b1. １The elastic member 18B may be integral with the connector shell 16s or may be integral with the pattern 174b1. １ may be a spring-like protrusion provided on a part of connector shell 16s, or may be a spring-like protrusion provided on a part of pattern 174b1. In this case, the spring-like protrusion may be a part of the metal that constitutes connector shell 16s, or may be a part of the metal that constitutes pattern 174b1. In other words, the spring-like protrusion may be a deformed part of the metal that constitutes connector shell 16s, or may be a deformed part of the metal that constitutes pattern 174b1.

[0238] In the seventh embodiment, the elastic member 18B ２ is a separate object from the metal housing 172 (second metal) and the pattern 174b2. ２ The elastic member 18B may be integral with the connector shell 16s or may be integral with the pattern 174b2. ２ may be a spring-like protrusion provided on a part of metal housing 172, or may be a spring-like protrusion provided on a part of pattern 174b2. In this case, the spring-like protrusion may be a part of the metal that constitutes metal housing 172, or may be a part of the metal that constitutes pattern 174b2. In other words, the spring-like protrusion may be a deformed part of the metal that constitutes connector shell 16s, or may be a deformed part of the metal that constitutes pattern 174b2.

[0239] Furthermore, in the seventh embodiment, the second metal is the metal housing 172. However, the second metal is not limited to the metal housing 172. For example, the second metal may be a ground pattern provided on a substrate (e.g., the pattern 173a provided on the substrate 173 described above). In this case, the description of the metal housing 172 described above can be replaced with the pattern 173a (or the substrate 173) as appropriate.

[0240] Furthermore, in the seventh embodiment, the elastic member is elastic member 18B (metal spring). However, the elastic member is not limited to elastic member 18B (metal spring) and may be, for example, elastic member 18A (conductive gasket). In this case, the above description of elastic member 18B can be appropriately replaced with elastic member 18A. Note that when multiple elastic members are used in a wired communication interface structure, the multiple elastic members may include different types of elastic members. For example, when two elastic members are used in a wired communication interface structure, one of the elastic members may be elastic member 18A (conductive gasket) and the other elastic member may be elastic member 18B (metal spring).

[0241] Additionally, the explanations of the wired communication interface structures shown in the first to sixth embodiments can also be applied to the wired communication interface structure according to the seventh embodiment, as appropriate.

[0242] <<4. Modifications>> The above-described embodiment is merely an example, and various modifications and applications are possible.

[0243] For example, in the above-described embodiments (e.g., the first to seventh examples), the elastic member (elastic member 18A or elastic member 18B) is a conductive gasket or a metal spring. However, the elastic member is not limited to a conductive gasket or a metal spring. For example, the elastic member may be rubber having conductivity (conductive rubber) or a cushion having conductivity (conductive cushion). Of course, the elastic member may be any other conductive structure having elasticity.

[0244] For example, in the above-described embodiments (e.g., the first to seventh examples), the second metal is a metal housing (e.g., the metal housing 172) or a ground pattern (e.g., the pattern 173a provided on the substrate 173). However, the second metal is not limited to a metal housing and a ground pattern. For example, the second metal may be a metal plate provided on an electronic device.

[0245] Furthermore, in the above-described embodiments (e.g., the first to seventh examples), the elastic member (elastic member 18A or elastic member 18B) is disposed on the upper surface of the connector shell 16s (positive direction of the Z axis). However, the position of the elastic member is not limited to the upper surface of the connector shell 16s. For example, the elastic member may be disposed on the side of the connector shell 16s. For example, the elastic member may be disposed on the left side of the connector shell 16s (positive direction of the X axis), on the right side of the connector shell 16s (negative direction of the X axis), or on the rear side of the connector shell 16s (positive direction of the Y axis). In this case, the terms "upper surface" and "lower surface" used in the description of the above-described embodiments are replaced with "left side surface," "right side surface," or "rear side surface," as appropriate.

[0246] In the above-described embodiments (e.g., the first to seventh examples), one elastic member (elastic member 18A or 18B) is disposed on one connector shell 16s. However, multiple elastic members may be disposed on one connector shell 16s. For example, they may be disposed on multiple surfaces of the connector shell 16s (e.g., multiple surfaces selected from the top, left, right, and rear surfaces). In this case, the multiple elastic members may include different types of elastic members. For example, the multiple elastic members may include multiple elastic members selected from conductive gaskets, metal springs, conductive rubber, and conductive cushions. The connector shell 16s may be high-frequency coupled to one or more second metals (e.g., one or more metal housings and / or one or more ground patterns) via the multiple elastic members. This can further suppress communication noise emitted from the connector shell 16s.

[0247] Furthermore, in the above-described embodiments (e.g., the first to fourth examples), the first metal (e.g., the connector shell 16s) and the insulating sheet 19 are in direct contact with each other. However, a conductor that is electrically conductive with the first metal may be disposed between the first metal and the insulating sheet 19. For example, a highly conductive metal (e.g., a metal plate) such as iron, copper, aluminum, magnesium, or nickel may be disposed between the first metal and the insulating sheet 19. This also allows the first metal and the second metal to be high-frequency coupled via the elastic member 18A.

[0248] Furthermore, in the above-described embodiments (e.g., the first to fourth examples), the second metal (e.g., the metal housing 172 or the pattern 173a) and the insulating sheet 19 are in direct contact with each other. However, a conductor that is electrically conductive with the second metal may be disposed between the second metal and the insulating sheet 19. For example, a highly conductive metal (e.g., sheet metal) such as iron, copper, aluminum, magnesium, or nickel may be disposed between the second metal and the insulating sheet 19. This also allows the connector shell 16s and the second metal to be high-frequency coupled via the elastic member 18A.

[0249] Furthermore, in the above-described embodiments (e.g., the fifth and sixth examples), the first metal (e.g., the connector shell 16s) and the elastic member (e.g., the elastic member 18A or the elastic member 18B) are in direct contact with each other. However, a conductor that is electrically conductive with the first metal may be disposed between the first metal and the elastic member. For example, a highly conductive metal (e.g., a metal plate) such as iron, copper, aluminum, magnesium, or nickel may be disposed between the first metal and the elastic member. This also allows the first metal and the second metal to be high-frequency coupled via the elastic member 18A.

[0250] Furthermore, in the above-described embodiments (e.g., the fifth and sixth examples), the pattern 173b (or the opening 173d) and the elastic member (e.g., the elastic member 18A or the elastic member 18B) are in direct contact with each other. However, a conductor that is electrically connected to the pattern 173b (or the opening 173d) may be disposed between the pattern 173b (or the opening 173d) and the elastic member. For example, a highly conductive metal (e.g., a metal plate) such as iron, copper, aluminum, magnesium, or nickel may be disposed between the pattern 173b (or the opening 173d) and the elastic member. This also enables high-frequency coupling between the first metal and the second metal via the elastic member 18A.

[0251] Furthermore, in the above-described embodiments (for example, the fifth and sixth examples), the conductive member 182 is in contact with the entire upper and lower surfaces of the cushion 181. However, the conductive member 182 does not necessarily have to be in contact with the entire upper and lower surfaces of the cushion 181. For example, like the conductive member shown in FIG. 3 (conductive woven fabric in the example of FIG. 3), there may be portions of the upper and lower surfaces of the cushion 181 that are not in contact with the conductive member 182.

[0252] Furthermore, in the above-described embodiments (e.g., the fifth to sixth examples), the elastic member is indirectly connected to the second metal (e.g., pattern 173a) via a capacitor. In the examples of FIGS. 19A to 20B, pattern 173b or the like is provided between the elastic member (e.g., elastic member 18A or elastic member 18B) and the capacitor (e.g., capacitor 173c). However, the elastic member may be directly connected to the second metal via one or more capacitors. For example, one or more capacitors may be directly connected to both the elastic member and the second metal without via pattern 173b or the like. The elastic member and the second metal may then be directly capacitively coupled by one or more capacitors without via pattern 173b or the like.

[0253] In addition to or instead of the second metal, the elastic member may be connected to a first metal (e.g., connector shell 16s) via one or more capacitors. In this case, the elastic member may also be directly connected to the first metal via one or more capacitors. That is, one or more capacitors may be directly connected to both the elastic member and the first metal without using a pattern or the like. Of course, the elastic member may also be indirectly connected to the first metal via one or more capacitors.

[0254] Furthermore, in the above-described embodiments (for example, the third to sixth examples), the substrate 171 (first substrate) and the substrate 173 (second substrate) are illustrated as separate substrates. However, the substrate 171 (first substrate) and the substrate 173 (second substrate) do not necessarily have to be separate substrates. For example, the substrate 171 (first substrate) and the substrate 173 (second substrate) may be configured as the same substrate (flexible substrate or rigid-flexible substrate). In this case, the substrate 171 (first substrate) and the substrate 173 (second substrate) may be different parts of the same substrate. The substrate 171 (first substrate) and the substrate 173 (second substrate) may be connected by a flexible portion (not shown).

[0255] <<5. Conclusion>> As described above, the electronic device (e.g., the terminal device 10) of this embodiment includes a first metal that constitutes part or all of the connector shell 16s, a second metal that serves as ground (e.g., the metal housing 172 and / or the pattern 173a), and a conductive elastic member (e.g., the elastic member 18A and / or the elastic member 18B). The elastic member is disposed between the first metal and the second metal so as to couple the first metal and the second metal at high frequencies.

[0256] This allows the connector shell 16s to be coupled to a stable surrounding ground at high frequency, thereby suppressing communication noise emitted from the connector 16. As a result, performance degradation of the radio wave receiving function (e.g., deterioration of radio wave receiving sensitivity and / or communication failure) is suppressed.

[0257] Furthermore, the elastic member can absorb mechanical tolerances, making it easy to assemble the electronic device, thereby reducing the manufacturing cost of the electronic device while preventing degradation of the radio wave receiving function.

[0258] Although the embodiments of the present disclosure have been described above, the technical scope of the present disclosure is not limited to the above-described embodiments, and various modifications are possible within the scope of the gist of the present disclosure. Furthermore, components of different embodiments and modifications may be combined as appropriate.

[0259] Furthermore, the effects of each embodiment described in this specification are merely examples and are not intended to be limiting, and other effects may also be obtained.

[0260] The present technology may also be configured as follows. (1) An electronic device comprising: a first metal constituting a part or all of a connector shell; a second metal serving as ground; and an elastic member having electrical conductivity and disposed between the first metal and the second metal such that the first metal and the second metal are high-frequency coupled. (2) The electronic device according to (1), in which the elastic member high-frequency couples with at least one of the first metal and the second metal such that the first metal and the second metal are high-frequency coupled. (3) The electronic device according to (2), in which the elastic member high-frequency couples with both the first metal and the second metal. (4) The electronic device according to (2), in which the elastic member high-frequency couples with one of the first metal and the second metal and is electrically conductive with the other of the first metal and the second metal. (5) The electronic device according to any one of (2) to (4), in which the high-frequency coupling is capacitive coupling. (6) The electronic device according to (5), wherein an insulating sheet is disposed between the elastic member and the first metal and between the elastic member and the second metal, and the elastic member is capacitively coupled to both the first metal and the second metal by being spaced apart from both the first metal and the second metal by the insulating sheets. (7) The electronic device according to (6), wherein the insulating sheet disposed between the elastic member and the first metal and the insulating sheet disposed between the elastic member and the second metal are an integrated sheet. (8) The electronic device according to (5), wherein an insulating sheet is disposed between the elastic member and one of the first metal and the second metal, and the elastic member is capacitively coupled to one of the first metal and the second metal by being spaced apart from one of the first metal and the second metal by the insulating sheet, and the elastic member is electrically conductive with the other of the first metal and the second metal. (9) The electronic device according to (8), wherein the elastic member is in contact with the other of the first metal and the second metal, thereby establishing electrical conduction with the other of the first metal and the second metal. (10) The electronic device according to any one of (6) to (9), wherein the insulating sheet is a resin sheet.(11) The electronic device according to any one of (6) to (10), wherein the second metal is a part or all of a housing of the electronic device. (12) The electronic device according to any one of (6) to (10), comprising: a first substrate on which the connector shell is mounted; and a second substrate, wherein the second metal is a ground pattern provided on the second substrate. (13) The electronic device according to (5), wherein the elastic member is directly or indirectly connected to at least one of the first metal and the second metal via a capacitor, thereby capacitively coupling the first metal and the second metal. (14) The electronic device according to (13), wherein an insulating sheet is disposed between the elastic member and the first metal, and the elastic member is capacitively coupled to the first metal by being separated from the first metal by the insulating sheet. (15) The electronic device according to (13), wherein the elastic member is electrically connected to the first metal by contacting the first metal. (16) The electronic device according to any one of (13) to (15), comprising: a first substrate on which the connector shell is mounted; and a second substrate; the second substrate comprising a first pattern serving as ground and a second pattern separate from the first pattern; the second metal is the first pattern; the first pattern and the second pattern are connected via the capacitor; and the elastic member is capacitively coupled to the first pattern by being electrically connected to the second pattern. (17) The electronic device according to any one of (2) to (16), wherein the elastic member is a gasket, a cushion, rubber, or a metal spring. (18) The electronic device according to any one of (1) to (17), wherein the electronic device is a wireless communication device. (19) The electronic device according to (18), wherein the electronic device is a smartphone. (20) The electronic device according to any one of (1) to (19), wherein the connector shell is a USB connector shell.

[0261] The present technology can also be configured as follows. (A1) An electronic device comprising: a first metal that serves as a connector shell; a second metal that serves as ground; and a conductive elastic member having elasticity and disposed between the first metal and the second metal, wherein the elastic member and at least one of the first metal or the second metal are insulated in terms of direct current and coupled at high frequencies. (A2) The electronic device according to (A1), wherein the elastic member is a conductive gasket, cushion, rubber, or metal spring. (A3) The electronic device according to (A1) or (A2), wherein the second metal is a housing of the electronic device. (A4) The electronic device according to (A1) or (A2), wherein the second metal is a substrate provided in the electronic device. (A5) The electronic device according to any one of (A1) to (A4), wherein the insulation and the high-frequency coupling are achieved by an insulating sheet. (A6) The electronic device according to any one of (A1) to (A4), wherein the insulation and the high-frequency coupling are achieved by a capacitor mounted on a substrate. (A7) The electronic device according to any one of (A1) to (A6), wherein the electronic device is a communications device. (A8) The electronic device according to (A7), wherein the electronic device is a smartphone. (A9) The electronic device according to any one of (A1) to (A8), wherein the connector shell is a USB 3.X connector shell.

[0262] REFERENCE SIGNS LIST 1 Communication system 10 Terminal device 20 Base station 11, 21 Wireless communication unit 111, 211 Antenna 12, 22 Memory unit 13, 23 Control unit 14, 24 Sensor unit 15, 25 Wired communication interface 16, 26 Connector 16p Terminal 16s Connector shell 171, 173 Substrate 171a, 171b, 173a, 173b, 174b1, 174b2, 174b3 Pattern 172 Metal housing 173c Capacitor 173d Opening 174 Resin case 174h Via 18A, 18B Elastic member 181 Cushion 182 Conductive member 183 Planar portion 184 Coil spring 185 Metal plate 19 Insulating sheet

Claims

1. An electronic device comprising: a first metal that constitutes part or all of a connector shell; a second metal that serves as ground; and a conductive elastic member that is disposed between the first metal and the second metal so as to couple the first metal and the second metal at high frequency.

2. The electronic device according to claim 1, wherein the elastic member is high-frequency coupled to at least one of the first metal and the second metal so that the first metal and the second metal are high-frequency coupled.

3. The electronic device according to claim 2, wherein the elastic member is high-frequency coupled to both the first metal and the second metal.

4. The electronic device according to claim 2, wherein the elastic member is high-frequency coupled to one of the first metal and the second metal, and is electrically connected to the other of the first metal and the second metal.

5. The electronic device according to claim 2, wherein the high-frequency coupling is capacitive coupling.

6. The electronic device according to claim 5, wherein an insulating sheet is disposed between the elastic member and the first metal and between the elastic member and the second metal, and the elastic member is separated from both the first metal and the second metal by the insulating sheets, thereby capacitively coupling with both the first metal and the second metal.

7. The electronic device according to claim 6, wherein the insulating sheet disposed between the elastic member and the first metal and the insulating sheet disposed between the elastic member and the second metal are an integral sheet.

8. The electronic device according to claim 5, wherein an insulating sheet is disposed between the elastic member and one of the first metal and the second metal, the elastic member is capacitively coupled to one of the first metal and the second metal by being spaced apart from the one of the first metal and the second metal by the insulating sheet, and the elastic member is electrically conductive with the other of the first metal and the second metal.

9. The electronic device according to claim 8, wherein the elastic member is in contact with the other of the first metal and the second metal, thereby establishing electrical conduction with the other of the first metal and the second metal.

10. The electronic device according to claim 6, wherein the insulating sheet is a resin sheet.

11. The electronic device according to claim 6, wherein the second metal is a part or the whole of the housing of the electronic device.

12. The electronic device according to claim 6, comprising a first substrate on which the connector shell is mounted and a second substrate, and the second metal is a ground pattern provided on the second substrate.

13. The electronic device according to claim 5, wherein the elastic member is directly or indirectly connected to at least one of the first metal and the second metal via a capacitor, thereby capacitively coupling the first metal and the second metal.

14. The electronic device according to claim 13, wherein an insulating sheet is disposed between the elastic member and the first metal, and the elastic member is capacitively coupled to the first metal by being spaced apart from the first metal by the insulating sheet.

15. The electronic device according to claim 13, wherein the elastic member is in contact with the first metal, thereby establishing electrical conduction with the first metal.

16. The electronic device according to claim 13, comprising a first substrate on which the connector shell is mounted and a second substrate, wherein the second substrate comprises a first pattern serving as ground and a second pattern separate from the first pattern, wherein the second metal is the first pattern, wherein the first pattern and the second pattern are connected via the capacitor, and wherein the elastic member is capacitively coupled to the first pattern by being electrically connected to the second pattern.

17. The electronic device according to claim 2, wherein the elastic member is a gasket, a cushion, rubber, or a metal spring.

18. The electronic device of claim 1, wherein the electronic device is a wireless communication device.

19. The electronic device according to claim 18, wherein the electronic device is a smartphone.

20. The electronic device according to claim 1, wherein the connector shell is a USB connector shell.

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