Vapor chamber composite manufacturing method and laminate manufacturing method

Abstract

The present invention provides a technology for solving a vapor-chamber-related problem that is likely to occur when bonding a vapor chamber and an electronic component.　A vapor chamber composite manufacturing method includes: a step for preparing a vapor chamber 4 having a hydraulic fluid sealed in a space part 4a provided thereinside, a bonding material 5A, an electronic component 6, and a cover material T2 having an opening H; a step for preparing a first preparation article P1 in which the bonding material 5A is provided on the surface of the vapor chamber 4, the electronic component 6 is provided on the surface of the bonding material 5A, and the cover material T2 is provided on the surface of the vapor chamber 4 at a position where an edge portion H1 for defining the opening H is not in contact with the bonding material 5A and the electronic component 6; a step for applying pressure by isotropic pressing, and applying heat to the first preparation article P1 to thereby bond the vapor chamber 4 and the electronic component 6 by means of the bonding material 5A; and a step for removing the cover material T2 from the vapor chamber 4.

Description

Method for manufacturing vapor chamber composite and method for manufacturing laminate

[0001] The present invention relates to a method for manufacturing a vapor chamber composite and a method for manufacturing a laminate.

[0002] In recent years, there has been an increase in the use of electronic components that pass large currents, such as high-brightness LEDs and power semiconductors. Because these types of electronic components can conduct large currents, they can reach high temperatures (e.g., 300°C or higher) during operation. For this reason, it is important to ensure sufficient heat dissipation when using these types of electronic components.

[0003] Conventionally, a laminate has been known as a means for dissipating heat from electronic components, in which a base substrate, an insulating layer, and a circuit pattern are laminated, and electronic components can be mounted on the circuit pattern (see, for example, Patent Document 1). With such a laminate, heat generated in the electronic components can be conducted from the circuit pattern through the insulating layer to the base substrate, and then dissipated from the base substrate into the air.

[0004] Also known is a technology that uses a vapor chamber, which has a heat diffusion function, to efficiently conduct heat generated by electronic components to an insulating layer in order to improve heat dissipation. A vapor chamber has a working fluid sealed in a space provided inside, and the working fluid evaporates due to heat from a heat source and moves through the space, thereby effectively diffusing heat. Patent Document 2 discloses a laminate in which an electronic component is provided in a vapor chamber that functions as a circuit for the electronic component, and the vapor chamber is provided on the surface of an insulating layer. With this laminate, heat from the electronic component is diffused over a wide area in the surface direction by the vapor chamber, increasing the heat transfer area, thereby efficiently conducting heat to the insulating layer and improving heat dissipation.

[0005] JP 2002-012653 A JP 2021-197534 A JP 2008-010703 A

[0006] Solder has been widely used as a bonding material when mounting electronic components on circuit patterns. Sintered materials containing metal nanoparticles, such as Ag nanoparticles or Cu nanoparticles, have also been used as materials with better heat resistance than solder (see, for example, Patent Document 3). However, when attempting to mount electronic components on a vapor chamber using such bonding materials, depending on the temperature required for bonding, the pressure in the space of the vapor chamber may increase, potentially causing the vapor chamber to burst.

[0007] Furthermore, in order to sinter the metal nanoparticles contained in the sintered material, it is necessary to apply a high load to the sintered material in a high-temperature environment. In other words, to join a vapor chamber and an electronic component using a sintered material, the electronic component must be pressurized with a high load while the sintered material is interposed between the vapor chamber and the electronic component. However, because a space is provided inside the vapor chamber, there is a risk that the surface of the vapor chamber will be dented by the pressurization.

[0008] In view of the above, an object of the present invention is to provide a technology that can solve problems related to vapor chambers that may have conventionally occurred when joining a vapor chamber to an electronic component.

[0009] One method for manufacturing a vapor chamber composite of the present invention includes the steps of: preparing a vapor chamber having a working fluid sealed in a space provided inside, a bonding material, an electronic component, and a cover member having an opening; preparing a first preparatory item in which the bonding material is provided on the surface of the vapor chamber, the electronic component is provided on the surface of the bonding material, and the cover member is provided on the surface of the vapor chamber in a position where the edges defining the opening are not in contact with the bonding material and the electronic component; applying pressure and heat to the first preparatory item by isostatic pressing to bond the vapor chamber and the electronic component with the molten bonding material; and removing the cover member from the vapor chamber to which the electronic component has been bonded.

[0010] Furthermore, one method for manufacturing a vapor chamber composite of the present invention includes the steps of preparing a vapor chamber having a working fluid sealed in a space provided inside, a bonding material, and an electronic component; preparing a second preparation item having the bonding material provided on the surface of the vapor chamber and the electronic component provided on the surface of the bonding material; and applying pressure and heat to the second preparation item using an isostatic press to bond the vapor chamber and the electronic component with the molten bonding material and apply pressure to at least the surface and side surfaces of the vapor chamber.

[0011] According to the manufacturing method of the vapor chamber composite of the present invention, problems such as dents on the surface of the vapor chamber and rupture of the vapor chamber can be solved.

[0012] A diagram showing a laminate manufactured by an embodiment of a method for manufacturing a laminate according to the present invention. A diagram showing the flow of a method for manufacturing a vapor chamber composite constituting the laminate shown in FIG. 1. A diagram showing the flow of a method for manufacturing a laminate that follows the method for manufacturing the vapor chamber composite shown in FIG. 2. A diagram related to the method for manufacturing the vapor chamber composite shown in FIG. 1 (a diagram related to the first step). A diagram related to the method for manufacturing the vapor chamber composite shown in FIG. 1 (a diagram related to the second step). A diagram related to the method for manufacturing the vapor chamber composite shown in FIG. 1 (a diagram related to the third step). A diagram related to the method for manufacturing the vapor chamber composite shown in FIG. 1 (a diagram related to the fourth step). A diagram related to the method for manufacturing the vapor chamber composite shown in FIG. 1 (a diagram related to the fifth step). A diagram related to a modification of FIG. 4D. A diagram related to a further modification of FIG. 4D. A diagram related to a further modification of FIG. 4D. A diagram showing the flow in another embodiment of the method for manufacturing a laminate according to the present invention. A diagram related to the manufacturing method shown in FIG. 6 (a diagram related to the 21st step). A diagram related to the manufacturing method shown in FIG. 6 (a diagram related to the 22nd step). A diagram related to another embodiment of the electronic component shown in FIG. 1. A diagram related to the method for manufacturing a vapor chamber composite provided with the electronic component shown in FIG. 8 (a diagram related to the third step). A diagram related to the method for manufacturing a vapor chamber composite provided with the electronic component shown in FIG. 8 (a diagram related to the fourth step). A diagram related to the method for manufacturing a vapor chamber composite provided with the electronic component shown in FIG. 8 (a diagram related to the fifth step). A diagram showing a laminate provided with the electronic component shown in FIG. 8.

[0013] Hereinafter, an embodiment of a method for manufacturing a vapor chamber composite and a method for manufacturing a laminate according to the present invention will be described with reference to the accompanying drawings. Note that the diagrams shown in the accompanying drawings are schematic, and the thickness, width, ratio between parts, etc. of each part may be different from those actually implemented.

[0014] 1 is a diagram showing a laminate 1, which is one embodiment of a laminate according to the present invention. The laminate 1 includes a base substrate 2, an insulating layer 3, a vapor chamber 4, a bonding layer 5, and an electronic component 6. The vapor chamber 4, the bonding layer 5, and the electronic component 6 constitute a vapor chamber composite 7.

[0015] The base substrate 2 is formed of a metal such as copper, aluminum, or iron (which may be a single metal or an alloy). The base substrate 2 may have a single-layer structure or a multi-layer structure, and may be composed of a single member or a combination of multiple members. The base substrate 2 of this embodiment is a plate shaped to be rectangular in plan view, but it may also be a heat sink provided with comb-shaped fins. The base substrate 2 may be provided with through-holes for fixing the base substrate 2 to another member with screws or the like. The base substrate 2 may also include a structure that improves the effect of dissipating heat to the outside, such as a metal plate with a heat pipe embedded inside.

[0016] The insulating layer 3 is formed of an insulating material and is provided so as to cover the surface (upper surface) of the base substrate 2. The insulating layer 3 may cover the entire surface of the base substrate 2, or may cover only a part of the surface.

[0017] The insulating layer 3 is formed from a resin composition containing a thermosetting resin. Examples of the thermosetting resin include epoxy resin, phenol resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, cyanate resin, etc. One type of thermosetting resin may be used alone, or two or more types may be used in combination.

[0018] As the epoxy resin, any monomer, oligomer, or polymer having two or more epoxy groups in one molecule can be used, regardless of its molecular weight or molecular structure. Specific examples of such epoxy resins include bisphenol-type epoxy resins such as bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol E-type epoxy resin, bisphenol S-type epoxy resin, hydrogenated bisphenol A-type epoxy resin, bisphenol M-type epoxy resin (4,4'-(1,3-phenylenediisopridiene)bisphenol-type epoxy resin), bisphenol P-type epoxy resin (4,4'-(1,4-phenylenediisopridiene)bisphenol-type epoxy resin), and bisphenol Z-type epoxy resin (4,4'-cyclohexidienebisphenol-type epoxy resin); novolac-type epoxy resins such as phenol novolac-type epoxy resin, brominated phenol novolac-type epoxy resin, cresol novolac-type epoxy resin, tetraphenol-group ethane-type novolac-type epoxy resin, and novolac-type epoxy resin having a condensed ring aromatic hydrocarbon structure; biphenyl-type epoxy resin; and xylylene-type epoxy resin. aralkyl-type epoxy resins such as naphthylene ether-type epoxy resins, naphthol-type epoxy resins, naphthalene-type epoxy resins, naphthalenediol-type epoxy resins, difunctional to tetrafunctional epoxy-type naphthalene resins, binaphthyl-type epoxy resins, and naphthalene aralkyl-type epoxy resins; epoxy resins having a naphthalene skeleton such as naphthylene ether-type epoxy resins, naphthol-type epoxy resins, naphthalene-type epoxy resins, binaphthyl-type epoxy resins, and naphthalene aralkyl-type epoxy resins; anthracene-type epoxy resins; phenoxy-type epoxy resins; dicyclopentadiene-type epoxy resins; norbornene-type epoxy resins; adamantane-type epoxy resins; fluorene-type epoxy resins, phosphorus-containing epoxy resins, alicyclic epoxy resins, aliphatic linear epoxy resins, bisphenol A novolac-type epoxy resins, bixylenol-type epoxy resins, triphenolmethane-type epoxy resins, trihydroxyphenylmethane-type epoxy resins, tetraphenylolethane-type epoxy resins, and heterocyclic epoxy resins such as triglycidyl isocyanurate;Examples of the epoxy resin include glycidyl amines such as N,N,N',N'-tetraglycidyl meta-xylenediamine, N,N,N',N'-tetraglycidyl bisaminomethylcyclohexane, and N,N-diglycidylaniline, copolymers of glycidyl (meth)acrylate and compounds having an ethylenically unsaturated double bond, epoxy resins having a butadiene structure, diglycidyl ethers of bisphenols, diglycidyl ethers of naphthalenediol, and glycidyl ethers of phenols. One type of epoxy resin may be used alone, or two or more types may be used in combination.

[0019] A curing agent is blended into the resin composition of this embodiment. The curing agent is selected depending on the type of thermosetting resin, and is not particularly limited as long as it reacts with the thermosetting resin. For example, when an epoxy resin is used, examples of the curing agent include an amine-based curing agent, an imidazole-based curing agent, and a phenol-based curing agent.

[0020] The resin composition of this embodiment also contains a filler (inorganic filler). The filler preferably has excellent insulating properties and high thermal conductivity, and examples thereof include aluminum oxide, silica, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide. One type of filler may be used alone, or two or more types may be used in combination.

[0021] Furthermore, the resin composition of this embodiment contains a curing accelerator. The curing accelerator is not particularly limited, and examples thereof include benzoxazine compounds, borate complexes, organometallic salts such as zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, cobalt bisacetylacetonate (cobalt(II)), and cobalt triacetylacetonate (cobalt(III)), phenolic compounds such as phenol, bisphenol A, and nonylphenol, tertiary amines, tertiary amine salts, phosphines, and phosphonium salts.

[0022] The resin composition of this embodiment also contains a solvent. The solvent is not particularly limited, and examples thereof include N-methylpyrrolidone, dimethylacetamide, tetrafluoroisopropanol, methyl ethyl ketone, ethylene diglycol acetate, propylene glycol monomethyl ether acetate, methyl isobutyl ketone, ethylene glycol monomethyl ether, tetrahydrofuran, chloroform, toluene, xylene, acetone, dioxane, and dimethyl sulfoxide.

[0023] The resin composition may contain additives such as stabilizers, ion scavengers, and flexibility enhancers.

[0024] The vapor chamber 4 is formed from a material that is electrically conductive and has high thermal conductivity (e.g., copper or aluminum). The vapor chamber 4 of this embodiment is a flat plate shaped to be rectangular in plan view and made of copper, which has relatively high thermal conductivity. A space 4a is provided inside the vapor chamber 4. To provide the space 4a in the vapor chamber 4, for example, a plate-shaped member located on the surface side (top side) of the vapor chamber 4 and another member that forms a cylindrical shape with a bottom are prepared, and these members are fixed together by welding, adhesive, or the like.

[0025] The space 4a contains a working fluid that evaporates when heated, dissipates heat, and condenses by dissipating heat. The wick 4b, which has a structure with fine irregularities, allows the working fluid to permeate and generate capillary force. This configuration evaporates the working fluid due to heat from a heat source transmitted to the front side of the vapor chamber 4, and the evaporated working fluid moves within the space 4a, thereby diffusing the heat. Furthermore, the diffused vapor dissipates heat and condenses, returning to working fluid. The working fluid that permeates the wick 4b is then returned to the vicinity of the heat source provided on the front side of the vapor chamber 4 by capillary force. This repeated evaporation and condensation of the working fluid effectively diffuses heat from the heat source along the surface of the vapor chamber 4. Although not shown, the space 4a may also be provided with reinforcing columns connecting the front (top) and back (bottom) sides of the vapor chamber 4.

[0026] The bonding layer 5 is interposed between the surface of the vapor chamber 4 and the back surface of the electronic component 6 and functions to bond the vapor chamber 4 and the electronic component 6. In this embodiment, the bonding layer 5 is formed from a bonding material 5A shown in FIG. 4A. The bonding material 5A of this embodiment is a sintered material containing metal nanoparticles such as Ag nanoparticles or Cu nanoparticles, and is subjected to pressure and heat during bonding. In the case of a sintered material, the metal nanoparticles are sintered by applying a predetermined pressure and heating at a predetermined temperature, forming the bonding layer 5. The bonding layer 5 may also be formed from a bonding material 5B (see FIG. 5B), which, like solder, does not generally require pressure but is bonded by heating at a predetermined temperature. Sintered materials have a higher melting point and superior heat resistance than general solder, so it is preferable to use a bonding material 5A such as a sintered material when using electronic components 6 that reach temperatures exceeding the melting point of solder during operation.

[0027] The electronic component 6 is a component that performs a predetermined operation when energized, or a component that converts energy such as light into electrical energy. While there is no limitation on the type of electronic component 6, the technology according to the present invention is particularly suitable for use with electronic components 6 that become hot during operation. Examples of such electronic components 6 include high-brightness LEDs and power semiconductors (e.g., IGBTs (insulated gate bipolar transistors), MOSFETs (metal-oxide-semiconductor field-effect transistors), and diodes) that pass a large current during operation. The electronic component 6 of this embodiment has a metal portion on its underside, and this metal portion is bonded to the surface of the vapor chamber 4 with a bonding layer 5. This metal portion may function to dissipate heat generated by the electronic component 6 to the outside, or may function as an electrode (e.g., a collector electrode or a drain electrode when the electronic component 6 is a power semiconductor) for electrically connecting the electronic component 6 and the vapor chamber 4. The electronic component 6 may have a rectangular parallelepiped outer shape like a chip component (see FIG. 1 ), or may have external terminals 16b extending outward, like the electronic component 16 shown in FIG. 8 . The electronic component 16 shown in FIG. 8 will be described later.

[0028] Next, a method for manufacturing the laminate 1 will be described with reference to the drawings. In the following description, the first step, the second step, and so on will be described in that order, but the present invention is not limited to performing the steps in this order, and the order may be reversed as long as each step is effective, or each step may be performed simultaneously.

[0029] First, the first step shown in FIGS. 2 and 4A is performed. In this first step, a bonding material 5A is provided on the surface of the vapor chamber 4. The bonding material 5A in this embodiment is a sintered material containing Ag nanoparticles. In the embodiment shown in FIG. 4A, a metal mask T1 having through holes corresponding to the position and size of the bonding material 5A to be provided is prepared. The metal mask T1 is then placed on the surface of the vapor chamber 4. The bonding material 5A applied to the surface of the metal mask T1 is then poured into the through holes using a squeegee or the like. The metal mask T1 is then removed, thereby providing the bonding material 5A in a predetermined position and shape on the surface of the vapor chamber 4. The shape of the bonding material 5A corresponds to the shape of the electronic component 6 (the shape of the electrodes on the electronic component 6), and is, for example, a square with sides measuring 5 to 10 mm in plan view. The thickness of the bonding material 5A is, for example, approximately 100 μm. Note that the method for providing the bonding material 5A is not limited to the above; for example, a method in which the bonding material 5A is dispensed from a dispenser may also be used. Then, if necessary, the bonding material 5A provided on the surface of the vapor chamber 4 is pre-dried.

[0030] In the second step, as shown in FIGS. 2 and 4B , an electronic component 6 is provided on the surface of the bonding material 5A. This step is performed, for example, by a chip mounter. Specifically, the electronic component 6 is picked up from a tray or the like using a suction nozzle of the chip mounter, and then the electronic component 6 is placed on the surface of the bonding material 5A while applying a slight load. The thickness of the electronic component 6 is, for example, approximately 300 μm. While the outer edges of the electronic component 6 and the bonding material 5A are aligned in FIG. 4B , the relationship between the two is not limited to that shown in the figure; the outer edge of the bonding material 5A may be located either outside or inside the outer edge of the electronic component 6.

[0031] In the third step, a first preparation P1 is prepared, in which a cover member T2 is provided on the surface of the vapor chamber 4, as shown in FIGS. 2 and 4C . In this embodiment, the cover member T2 is made of metal, such as SUS or SKD. In this embodiment, the cover member T2 is flat and covers only the surface of the vapor chamber 4, leaving the sides of the vapor chamber 4 exposed. The cover member T2 may also be a member that covers the surface and sides of the vapor chamber 4 (e.g., a cylindrical member with a lid). The cover member T2 has an opening H where the bonding material 5A and the electronic component 6 are provided. In this embodiment, the size of the cover member T2 in a plan view is approximately the same as that of the vapor chamber 4, but it may be smaller or larger than the vapor chamber 4. As described below, the vapor chamber 4 has the function of preventing the vapor chamber 4 from becoming dented (particularly at the portion where the space 4a is provided) when pressure is applied. Therefore, it is preferable that the cover member T2 be larger than the space 4a in a plan view and be positioned so as to cover the area of ​​the surface of the vapor chamber 4 where the space 4a is located. Furthermore, it is preferable that a positioning mechanism be provided between the vapor chamber 4 and the cover member T2 for aligning them in a plan view. The positioning mechanism may, for example, be such that the outer shapes of the vapor chamber 4 and the cover member T2 are the same and the cover member T2 is placed on the vapor chamber 4 so that the outer edges of both are aligned. Alternatively, the positioning mechanism may be such that a positioning protrusion is provided on either the front surface of the vapor chamber 4 or the back surface of the cover member T2, and a positioning recess into which the positioning protrusion is inserted is provided on the other. Furthermore, although the above description has been given with the electronic component 6 being placed on the bonding material 5A and then the cover member T2 is placed on the vapor chamber 4, the electronic component 6 may also be placed on the bonding material 5A after the cover member T2 is placed on the vapor chamber 4.

[0032] When the cover member T2 is placed on the surface of the vapor chamber 4, the opening H is positioned so that the edge H1 defining the opening H does not come into contact with the bonding material 5A and the electronic component 6. In this embodiment, the gap g between the bonding material 5A and the edge H1 and the electronic component 6 is approximately 1 mm. Here, the gap g refers to the gap from the edge H1 to the closer outer edge when the outer edge of the bonding material 5A and the outer edge of the electronic component 6 are misaligned. That is, for example, when the area of ​​the bonding material 5A in a plan view is larger than the area of ​​the electronic component 6 and the outer edge of the bonding material 5A is closer to the edge H1 than the electronic component 6, the gap g is the gap between the outer edge of the bonding material 5A and the edge H1. Note that if the gap g is too small, the edge H1 may come into contact with the bonding material 5A and the electronic component 6. If the gap g is too large, the surface of the vapor chamber 4 is largely exposed from the opening H, which may cause the vapor chamber 4 to dent when pressure is applied, as described below. After extensive investigation into this point, it was found that to prevent such problems, the gap g is preferably 0.1 mm or more and 10 mm or less. It was also found that the lower limit of this range is more preferably 0.5 mm, and even more preferably 1.0 mm, and the upper limit of this range is more preferably 7.0 mm, and even more preferably 5.0 mm. Note that when the side surfaces of the electronic component 6 are covered with resin and the bonding material 5A is located inside the side surfaces of the electronic component 6, even if the edge H1 contacts the side surfaces of the electronic component 6, the edge H1 and the bonding material 5A are not in contact with each other, and the load on the core of the electronic component 6 located inside the resin is kept to an extent that it is not affected. Therefore, the edge H1 may contact the side surfaces of the electronic component 6 (i.e., in this case, the gap g may be 0 mm).

[0033] The thickness t of the cover member T2 is approximately 1 mm in this embodiment. If the thickness t of the cover member T2 is too thin, the rigidity of the cover member T2 may decrease, and the effect of suppressing depressions in the vapor chamber 4 may not be sufficiently achieved. Furthermore, if the thickness t is too thick, the weight may increase, which may affect handling. Furthermore, if the depth from the surface of the cover member T2 to the surface of the electronic component 6 becomes too large, depending on the pressure medium described below, the surface of the electronic component 6 may not be sufficiently pressurized when pressure is applied, and the pressure applied to the bonding material 5A may be insufficient. After extensive investigation into this point, it was found that to prevent such problems, the thickness t is preferably 0.1 mm or more and 10 mm or less. It was also found that the lower limit of this range is more preferably 0.5 mm, and even more preferably 1.0 mm, and the upper limit of this range is more preferably 7.0 mm, and even more preferably 5.0 mm.

[0034] In the fourth step, pressure and heat are applied to the first preparatory item P1 by isostatic pressing, as shown in Figures 2 and 4D. To perform the isostatic pressing, for example, a pressure vessel and a pressurized medium (which may be a gas such as air, a fluid such as water, oil, or a liquid (including gelatinous liquids) such as molten resin, or an elastically deformable solid such as rubber) are prepared. The first preparatory item P1 is then placed in the pressure vessel, and the pressurized medium is pressurized (for example, the pressure vessel may be composed of a pressure vessel body and a lid, and the pressurized medium contained in the pressure vessel body may be pressurized by pushing down the lid, or the pressurized medium may be fed into the pressure vessel using a pump or the like) and heated (the interior of the pressure vessel may be heated using a heater or the heated pressurized medium may be fed). This allows the portions of the first preparatory item P1 in contact with the pressurized medium to be pressurized and heated with equal pressure. The pressure inside the pressure vessel is, for example, 10 MPa to 30 MPa, the temperature inside the pressure vessel is, for example, 250°C to 300°C, and the pressurization and heating time is, for example, 1 minute to 20 minutes. In this case, the first preparation P1 may be covered with a flexible film (for example, a fluororesin film with excellent peelability). When a molten resin or the like is used as the pressurization medium, using such a film makes it possible to easily remove the molten resin or the like after the fourth step is completed.

[0035] The isostatic pressing may be performed using an autoclave. The autoclave is a method in which the first preparatory item P1 is placed in a pressure vessel, the first preparatory item P1 is covered with a film (bagging film), the inside of the film is evacuated, and the outside of the film is pressurized and heated with the above-mentioned pressure medium. The autoclave can also be used to pressurize and heat the first preparatory item P1 through the film.

[0036] In the fourth step, isostatic pressing is used, so pressure is applied evenly to the first preparatory item P1. Furthermore, because the surface of the vapor chamber 4 in the first preparatory item P1 is covered with the cover member T2, the pressure of the pressurized medium is distributed across the surface of the vapor chamber 4. The bonding material 5A used in this embodiment is a sintered material, which requires high pressure to bond the vapor chamber 4 and the electronic component 6. However, since the pressure is not applied locally to the vapor chamber 4, the surface of the vapor chamber 4 can be prevented from becoming concave. Furthermore, in the first preparatory item P1, the electronic component 6 is exposed through an opening H in the cover member T2, and the pressure and heat of the pressurized medium are applied to the surface (top surface) of the electronic component 6. Therefore, the bonding material 5A is pressurized and heated through the electronic component 6, so that the bonding material 5A can be sintered to bond the vapor chamber 4 and the electronic component 6.

[0037] Furthermore, heating the first preparation P1 also heats the space 4a of the vapor chamber 4, increasing the pressure in the space 4a. In particular, because the first preparation P1 uses the bonding material 5A, a high temperature must be applied to sinter the bonding material 5A. This significantly increases the pressure in the space 4a, causing the vapor chamber 4 to deform outward and potentially burst. Meanwhile, in this embodiment, the pressure of the pressurized medium is applied to the surface of the vapor chamber 4 via the cover member T2. Furthermore, since the cover member T2 in this embodiment is flat and the side surfaces of the vapor chamber 4 are exposed and not covered by the cover member T2, the pressure of the pressurized medium is applied directly to the side surfaces of the vapor chamber 4. In this way, pressure is applied to the surface and side surfaces of the vapor chamber 4 inward, effectively preventing the vapor chamber 4 from bursting.

[0038] The configuration of the pressure vessel, etc. described above can be replaced with that shown in Figure 4D by that shown in Figure 5A. That is, as shown in Figure 5A, the fourth step can be performed using a configuration in which the areas of the first preparatory item P1 that come into contact with the pressurized medium are the surface (top surface) of the cover member T2 and the surface (top surface) of the electronic component 6 exposed through the opening H, and the pressurized medium does not come into contact with the side surfaces of the first preparatory item P1. For example, when the vapor chamber 4 is highly rigid and unlikely to burst, the electronic component 6 can be joined to the vapor chamber 4 without any problems related to the vapor chamber 4, even using a construction method in which pressure is not applied to the side surfaces of the vapor chamber 4, as shown in Figure 5A.

[0039] In the cover member T2 shown in Figures 4C and 4D, the opening H on the surface of the cover member T2 is edge-shaped. However, as shown in Figure 5C, the cover member T2 may have an inclined surface S that expands in diameter from the back surface of the cover member T2 to the front surface at the opening H on the surface of the cover member T2. If the opening area of ​​the opening H is relatively small and the height difference between the surface of the electronic component 6 located inside the opening H and the surface of the cover member T2 is relatively large, even when using isostatic pressing, there is a risk that the pressure applied to the electronic component 6 will be insufficient and the bonding material 5A will not be sufficiently pressed. On the other hand, if the inclined surface S is provided as in the cover member T2 shown in Figure 5C, the bonding material 5A can be sufficiently pressed through the electronic component 6 located inside the opening H, allowing the bonding material 5A to be sintered as intended. Note that this inclined surface S may also be applied to the cover member T2 shown in Figure 5A.

[0040] 2 and 4E, in the fifth step, the cover member T2 is removed from the first preparation P1 after the isostatic pressing, thereby forming a vapor chamber composite 7 in which the vapor chamber 4, the bonding layer 5, and the electronic component 6 are stacked in this order.

[0041] In the above-described embodiment, the bonding material 5A used to form the bonding layer 5 was a sintered material or the like, which requires pressure and heat for bonding. However, depending on the type of electronic component 6, a bonding material 5B such as solder, which basically requires no pressure and is bonded by heating at a predetermined temperature, can also be used. The bonding material 5B shown in FIG. 5B is solder. To form the vapor chamber composite 7 using the bonding material 5B, the above-described first and second steps are performed to provide the bonding material 5B on the surface of the vapor chamber 4, and the electronic component 6 is then provided on the surface of the bonding material 5B. The above-described cover member T2 prevents dents in the surface of the vapor chamber 4 when high pressure is required for bonding, such as with a sintered material. However, since the bonding material 5B does not generally require pressure for bonding, the third step of placing the cover member T2 is omitted in the embodiment shown in FIG. 5B. The fourth step of applying pressure and heat to the second preparation P2 formed in this manner using an isostatic press is performed, as shown in FIG. 5B. As mentioned above, there is no need to apply special pressure when melting the bonding material 5B such as solder, but the pressure from the pressurizing medium in the fourth step is applied to the surface and sides of the vapor chamber 4, which effectively contributes to preventing the vapor chamber 4 from bursting when the pressure in the space 4a increases due to heating.

[0042] The vapor chamber composite 7 manufactured by such a method is formed into the laminate 1 shown in FIG. 1 by carrying out, for example, the sixth to fifteenth steps shown in FIG.

[0043] In the sixth step, the thermosetting resin and the curing agent are placed in a container and stirred at a predetermined temperature for a predetermined time. This allows the thermosetting resin and the curing agent to react with each other. Depending on the stirring temperature and stirring time, the thermosetting resin and the curing agent reacting in the sixth step can be made into a prepolymer state. However, this can be selected appropriately depending on the degree of curing of the thermosetting resin in the steps described below, and it is not necessarily necessary to make the thermosetting resin and the curing agent into a prepolymer state in the sixth step.

[0044] In the seventh step, the stirred thermosetting resin is mixed with the curing agent, filler, curing accelerator, and solvent to produce a resin composition. The resin composition in the seventh step is in a semi-cured state.

[0045] In the eighth step, the produced resin composition is applied to the surface of a thin substrate and then dried to volatilize the solvent. The substrate is not particularly limited as long as it can be peeled from the resin composition in the step described below, and as an example, a long PET sheet can be used. There are also no particular restrictions on carrying out the eighth step, but when using an apparatus equipped with a delivery section from which the long substrate is delivered, a coating section provided downstream in the delivery direction that applies the resin composition to the front side of the substrate, and a heating section provided upstream in the delivery direction that heats the passing resin composition at a predetermined temperature, the application and drying of the resin composition can be carried out continuously, which is advantageous in that the eighth step can be carried out efficiently.

[0046] In the ninth step, the long substrate coated with the resin composition is cut to a predetermined size to form a sheet material in which the resin composition and the substrate are laminated. Note that if a substrate cut to a predetermined size in advance is used in the eighth step, the ninth step can be omitted.

[0047] In step 10, the resin composition applied to the substrate is heated at a predetermined temperature for a predetermined time. This increases the molecular weight (weight average molecular weight) of the semi-cured resin composition. Although the molecular weight of the resin composition increases in steps after step 10, increasing the molecular weight of the resin composition in advance in step 10 can shorten the overall time required to manufacture the laminate 1. Furthermore, if the molecular weight of the resin composition required has already been secured in a step prior to step 10, step 10 may be omitted. One specific example of performing step 10 involves preparing multiple sheets of the above-described resin composition and substrate laminated together and heating them together in a heating furnace.

[0048] In step 11, a compressive force is applied to the semi-cured resin composition. Before step 11, the resin composition contains many voids due to the drying in step 8. However, by performing step 11, the density is increased, reducing the voids. Consequently, when the resin composition is formed into an insulating layer through the steps described below, high insulating properties can be obtained. One specific example of performing step 11 involves overlapping the above-described sheet material (shaped to the size of the surface of the base substrate 2) on the surface of the base substrate 2 shown in FIG. 1 with the resin composition in contact with the base substrate 2, placing this in, for example, a vacuum press, and then pressing the overlapped base substrate 2 and sheet material together while the interior of the press is in a vacuum atmosphere and at a predetermined temperature. This allows the semi-cured resin composition to be transferred to the base substrate 2 and apply a compressive force to the resin composition. Note that the base substrate 2 is not necessarily required for step 11; for example, a separately prepared substrate and the above-described sheet material may be overlapped and pressed together, or a single sheet material may be pressed.

[0049] By performing the step of curing the semi-cured resin composition (step 13) described below, gas can be released from the resin composition. However, the inventors of the present application have found that if the resin composition is too cured, performing step 13 may not sufficiently release gas from the resin composition. Furthermore, even if step 13 is performed when the resin composition has a low density and contains many voids internally, it may be difficult to completely reduce the voids to a level that allows for sufficient voltage resistance. In light of these issues, extensive research has been conducted on the optimal ranges for the molecular weight (weight-average molecular weight) and density of the resin composition. It has been found that good results are obtained when the increase in the weight-average molecular weight of the resin composition is 30% or less after step 11 (after applying compressive force) relative to the value before step 11 (before applying compressive force). Further research on the increase in the weight-average molecular weight of the resin composition has been conducted. It has been found that a rate of increase of 25% or less provides better results, and a rate of increase of 20% or less provides even better results. Furthermore, good results were obtained when the density of the resin composition was 85% or more after step 11 (after applying compressive force) based on the actual density of the finally formed insulating layer. Further investigation of the density of the weight-average molecular weight of the resin composition revealed that better results were obtained when it was 90% or more, and even better results were obtained when it was 95% or more. The weight-average molecular weight is a polystyrene-equivalent value measured by GPC (gel permeation chromatography).

[0050] In the twelfth step, the substrate is peeled off from the semi-cured resin composition transferred to the base substrate 2, or if the resin composition has not been transferred to the base substrate 2, the substrate is peeled off from the resin composition after transferring it. Then, by superimposing the vapor chamber composite 7 on the surface of the resin composition transferred to the surface of the base substrate 2, a first laminate preparatory product is formed in which the vapor chamber composite 7 is provided on the surface of the semi-cured resin composition.

[0051] In step 13, pressure and heat are applied to the first laminate preparatory item by isostatic pressing. This hardens the semi-cured resin composition laminated on the first laminate preparatory item, thereby bonding the base substrate 2 and the vapor chamber composite 7. The isostatic pressing may be performed using a pressure vessel and a pressurizing medium, as with the first preparatory item P1 described above, or may be performed in an autoclave.

[0052] Then, in step 14, the resin composition is fully cured. One specific example of how step 14 can be performed is to place the first laminate preparatory product after step 13 in a heating furnace and heat it at a predetermined temperature for a predetermined time. This allows the resin composition of the first laminate preparatory product to be fully cured. Note that step 14 is performed when the resin composition has not been fully cured in step 13; if the resin composition has been fully cured in step 13, step 14 is omitted.

[0053] In the fifteenth step, the laminate 1 on which the resin composition has been fully cured and the insulating layer 3 has been formed is washed and subjected to various inspections.

[0054] In the laminate 1 manufactured by this method, heat from the electronic components 6 is diffused over a wide area in the planar direction by the vapor chamber 4, allowing the heat to be efficiently conducted to the insulating layer 3, thereby improving heat dissipation.

[0055] In manufacturing the laminate 1, steps 21 and 22 shown in FIG. 6 may be carried out instead of steps 1 to 15 described above.

[0056] 6 and 7A, in step 21, a bonding material 5A is provided on the surface of the vapor chamber 4, for example, in the same manner as in steps 1 to 3 described above, an electronic component 6 is provided on the surface of the bonding material 5A, and a cover member T2 is provided on the surface of the vapor chamber 4 at a position where the edge H1 defining the opening H is not in contact with the bonding material 5A and the electronic component 6. Furthermore, for example, a semi-cured resin composition is provided on the surface of the base substrate 2 in the same manner as steps 6 to 12 described above. Then, by providing the vapor chamber 4 provided with the bonding material 5A, the electronic component 6, and the cover member T2 on the surface of the resin composition, the second laminate preparation LP2 shown in FIG. 7A is prepared.

[0057] 6 and 7B, in step 22, pressure and heat are applied to the second laminate preparation LP2 by isostatic pressing. This sinters the bonding material 5A to bond the vapor chamber 4 and the electronic component 6, and hardens the semi-cured resin composition to bond the base substrate 2 and the vapor chamber 4. The cover member T2 is then removed to produce the laminate 1. The isostatic pressing may be performed using a pressure vessel and a pressurizing medium, as with the first preparation P1 described above, or may be performed in an autoclave.

[0058] In performing steps 21 and 22, a bonding material 5B such as solder may be used depending on the type of electronic component 6. As described above, the cover member T2 prevents dents on the surface of the vapor chamber 4 when high pressure is required during bonding, such as with sintered materials. Therefore, when using the bonding material 5B, the step of providing the cover member T2 on the surface of the vapor chamber 4 can be omitted. In this case, although not shown, in step 21, a semi-cured resin composition is provided on the surface of the base substrate 2, and a bonding material 5B (solder) and a vapor chamber 4 provided with the electronic component 6 are provided on the surface of the resin composition, thereby preparing a third laminate preparation. Note that the third laminate preparation has a configuration similar to that of the second laminate preparation LP2 shown in FIG. 7A , with the cover member T2 omitted. Then, in step 22, pressure and heat are applied to the third laminate preparation using an isostatic press, thereby preventing the vapor chamber 4 from bursting, melting the bonding material 5B to bond the vapor chamber 4 and the electronic component 6, and hardening the semi-cured resin composition to bond the base substrate 2 and the vapor chamber 4, thereby producing the laminate 1.

[0059] The method for manufacturing a laminate according to the present invention can also be applied to the case where an electronic component 16, such as the electronic component 16 shown in Fig. 8, is provided with external terminals 16b extending outward from the outer surface of the electronic component 16. This point will be described with reference to Figs. 8 to 9D.

[0060] The electronic component 16 shown in FIG. 8 has three external terminals 16b extending outward from the side surfaces of a rectangular parallelepiped main body 16a. The external terminals 16b are, for example, an emitter electrode, a collector electrode, a base electrode, a source electrode, a drain electrode, and a gate electrode when the electronic component 16 is a power semiconductor. A metal portion 16c is provided on the underside of the main body 16a. Similar to the metal portion provided on the back surface (lower surface) of the electronic component 16, the metal portion 16c functions to release heat generated by the electronic component 16 to the outside and to serve as an electrode for electrically connecting the electronic component 16 to the vapor chamber 4. The back surface (lower surface) of the external terminal 16b is located higher than the back surface (lower surface) of the metal portion 16c.

[0061] When manufacturing the laminate 1A shown in FIG. 9D using such electronic components 16, the above-described steps 1 to 15 may be performed. In step 1, the bonding material 5A, such as a sintered material, or the bonding material 5B, such as solder, may be provided on the surface of the vapor chamber 4. After providing the bonding materials 5A and 5B on the surface of the vapor chamber 4, steps 2 and 3 are performed to provide the electronic components 16 on the surfaces of the bonding materials 5A and 5B, as shown in FIG. 9A, and then provide a cover member T3 on the surface of the vapor chamber 4, thereby forming a first preparation P1A. The cover member T3 is divided into multiple cover portions (cover portions T3a and T3b in this embodiment), and an opening H is formed by combining the cover portions T3a and T3b. Here, the cover portion T3b is located below the external terminal 16b as shown in FIG. 9A. Furthermore, the cover portion T3b can be slid horizontally relative to the vapor chamber 4 in the state shown in FIG. 9A. In this embodiment, as in the embodiment shown in Figure 4C, the edge H1 defining the opening H is not in contact with the above-mentioned bonding materials 5A, 5B and the main body portion 16a of the electronic component 16, and the range of the gap g is the same as in the embodiment shown in Figure 4C (i.e., the gap g is 0.1 mm or more and 10 mm or less, and the preferred range is also the same), but if the electronic component 16 is a resin-sealed product and the outer surface of the main body portion 16a is covered with resin, the gap g may be 0 mm.

[0062] 9B, a step of applying pressure and heat to the first preparatory item P1A by isostatic pressing is carried out to bond the vapor chamber 4 and the electronic component 16 with the bonding materials 5A and 5B. When pressure is applied to the first preparatory item P1A, pressure is also applied to the external terminals 16b. However, because the cover member T3b is located below the external terminals 16b and the lower surfaces of the external terminals 16b are supported by the upper surface of the cover member T3b, problems such as bending of the external terminals 16b can be prevented. Furthermore, the cover member T3 prevents dents in the surface of the vapor chamber 4, and pressure applied toward the inside of the vapor chamber 4 can prevent the vapor chamber 4 from bursting.

[0063] Thereafter, in step 5, the cover member T3 is removed from the first preparation P1A to form the vapor chamber composite 7A as shown in Fig. 9C. As described above, the cover member T3 is composed of the cover portion T3a and the cover portion T3b, and the cover portion T3b can be slid horizontally relative to the vapor chamber 4, so the external terminal 16b does not get in the way when the cover portion T3b is removed from the first preparation P1A.

[0064] The vapor chamber composite 7A manufactured in this manner is formed into the laminate 1A shown in FIG. 9D by carrying out the sixth to fifteenth steps described above.

[0065] Although not shown, the laminate 1A may be manufactured by performing the above-described steps 21 and 22. That is, in step 21, a semi-cured resin composition is applied to the surface of the base substrate 2, and a vapor chamber 4 provided with bonding materials 5A and 5B, an electronic component 16, and a cover member T3 is provided on the surface of the resin composition, thereby preparing a second laminate preparatory product. In step 22, pressure and heat are applied to the second laminate preparatory product using an isostatic press, thereby bonding the vapor chamber 4 and the electronic component 16 with the bonding materials 5A and 5B, curing the semi-cured resin composition to bond the base substrate 2 and the vapor chamber 4, and then removing the cover member T3, thereby manufacturing the laminate 1A.

[0066] (Additional Note) In one aspect, the present specification discloses the following technology.

[0067] (Technology 1) A method for manufacturing a vapor chamber composite, comprising: a step of preparing a vapor chamber having a working fluid sealed in a space provided inside, a bonding material, an electronic component, and a cover member having an opening; a step of preparing a first preparatory item in which the bonding material is provided on a surface of the vapor chamber, the electronic component is provided on a surface of the bonding material, and the cover member is provided on the surface of the vapor chamber in a position where an edge portion defining the opening is not in contact with the bonding material and the electronic component; a step of applying pressure and heat to the first preparatory item by isostatic pressing, thereby bonding the vapor chamber and the electronic component with the bonding material; and a step of removing the cover member from the vapor chamber to which the electronic component has been bonded.

[0068] This technology allows the vapor chamber and electronic components to be bonded well with a bonding material. Furthermore, pressure is applied evenly to the first preparation by isostatic pressing, and the pressure is distributed across the surface of the vapor chamber, which is covered by the cover member, preventing the surface of the vapor chamber from becoming dented even when high pressure is applied.

[0069] (Technology 2) The method for manufacturing a vapor chamber composite according to Technology 1, wherein pressure is applied to at least the surface of the electronic component, the surface of the cover member, and the side surface of the vapor chamber by the isostatic press.

[0070] This technology allows the vapor chamber and electronic component to be bonded well with a bonding material, and also prevents the vapor chamber from bursting even when the pressure in the space in the vapor chamber increases due to heating.

[0071] (Technology 3) The method for manufacturing a vapor chamber composite according to Technology 1 or 2, wherein the gap between the bonding material and the electronic component and the edge portion is 0.1 mm or more and 10 mm or less.

[0072] This technology can more effectively prevent the surface of the vapor chamber from becoming dented.

[0073] (Technology 4) A method for manufacturing a vapor chamber composite described in any of Technologies 1 to 3, wherein the portion of the surface of the cover member where the opening is provided has an inclined surface that expands in diameter from the back surface to the front surface of the cover member.

[0074] This technology allows sufficient pressure to be applied to the bonding material and electronic components located inside the opening, allowing the bonding material to sinter as intended.

[0075] (Technology 5) A method for manufacturing a vapor chamber composite according to any one of technologies 1 to 4, wherein the electronic component has an external terminal extending outward, and the surface of the cover member supports the back surface of the external terminal.

[0076] With this technique, even when pressure is applied to the external terminals by isostatic pressing, the external terminals are supported by the cover member, thereby preventing problems such as bending of the external terminals.

[0077] (Technology 6) A method for manufacturing a vapor chamber composite, comprising the steps of: preparing a vapor chamber having a working fluid sealed in a space provided inside, a bonding material, and an electronic component; preparing a second preparation item having the bonding material provided on the surface of the vapor chamber and the electronic component provided on the surface of the bonding material; and applying pressure and heat to the second preparation item by isostatic pressing, thereby bonding the vapor chamber and the electronic component with the bonding material and applying pressure to at least the surface and side of the vapor chamber.

[0078] This technology makes it possible to prevent the vapor chamber from bursting even when the pressure in the space in the vapor chamber increases due to heating.

[0079] (Technology 7) A method for manufacturing a laminate, comprising the steps of: preparing a base substrate, a semi-cured resin composition, and a vapor chamber composite manufactured by the manufacturing method described in any one of Technologies 1 to 6; preparing a first laminate preparation in which the resin composition is provided on the surface of the base substrate and the vapor chamber composite is provided on the surface of the resin composition; and applying pressure and heat to the first laminate preparation by isostatic pressing to harden the resin composition and bond the base substrate and the vapor chamber composite.

[0080] This technology allows the vapor chamber to diffuse heat generated by electronic components over a wide area in the planar direction, allowing the heat to be efficiently conducted to the insulating layer and more effectively dissipated from the base substrate into the air.

[0081] (Technology 8) A method for manufacturing a laminate, comprising: a step of preparing a base substrate, a semi-cured resin composition, a vapor chamber having a space provided therein and filled with a working fluid, a bonding material, an electronic component, and a cover member having an opening; a step of preparing a second laminate preparatory product in which the resin composition is provided on a surface of the base substrate, the vapor chamber is provided on a surface of the resin composition, the bonding material is provided on a surface of the vapor chamber, the electronic component is provided on a surface of the bonding material, and the cover member is provided on the surface of the vapor chamber at a position where an edge portion defining the opening is not in contact with the bonding material and the electronic component; a step of applying pressure and heat to the second laminate preparatory product by isostatic pressing to bond the vapor chamber and the electronic component with the bonding material and curing the resin composition to bond the base substrate and the vapor chamber; and a step of removing the cover member from the vapor chamber to which the electronic component is bonded.

[0082] With this technology, pressure is applied evenly to the second laminate preparation by isostatic pressing, and the pressure is distributed across the surface of the vapor chamber covered by the cover member, preventing the surface of the vapor chamber from becoming dented even when high pressure is applied. Furthermore, the pressure and heat from the isostatic pressing can bond the vapor chamber and electronic component with a bonding material, and the semi-cured resin composition can be hardened to bond the base substrate and vapor chamber.

[0083] (Technology 9) The method for producing a laminate according to Technology 8, wherein the cover member has an inclined surface whose diameter increases from the rear surface to the front surface at a portion where the opening is provided on the surface of the cover member.

[0084] This technology allows sufficient pressure to be applied to the bonding material and electronic components located inside the opening, allowing the bonding material to sinter as intended.

[0085] (Technology 10) The method for manufacturing a laminate according to Technology 8 or 9, wherein the electronic component includes external terminals extending outward, and a surface of the cover member supports a back surface of the external terminals.

[0086] With this technique, even when pressure is applied to the external terminals by isostatic pressing, the external terminals are supported by the cover member, thereby preventing problems such as bending of the external terminals.

[0087] (Technology 11) A method for manufacturing a laminate, comprising: a step of preparing a base substrate, a semi-cured resin composition, a vapor chamber having a space provided therein and filled with a working fluid, a bonding material, and an electronic component; a step of preparing a third laminate preparatory product in which the resin composition is provided on a surface of the base substrate, the vapor chamber is provided on a surface of the resin composition, the bonding material is provided on a surface of the vapor chamber, and the electronic component is provided on a surface of the bonding material; and a step of applying pressure and heat to the third laminate preparatory product by isostatic pressing to bond the vapor chamber and the electronic component with the bonding material, and also applying pressure to at least the surface and side of the vapor chamber, and curing the resin composition to bond the base substrate and the vapor chamber.

[0088] This technology can prevent the vapor chamber from bursting even when the pressure in the space inside the vapor chamber increases due to heating. Furthermore, the pressure and heat from the isostatic press can bond the vapor chamber and electronic component with a bonding material, and the semi-cured resin composition can be cured to bond the base substrate and vapor chamber.

[0089] Although one embodiment of the present invention has been described above, the present invention is not limited to this specific embodiment. Unless otherwise specified in the above description, various modifications and variations are possible within the spirit and scope of the present invention as defined in the claims. For example, the configurations of the above-described embodiment can be added or deleted as appropriate, and the configurations of one embodiment can be incorporated into other embodiments. Furthermore, the effects of the above-described embodiment are merely examples of the effects that can be obtained from the present invention. In other words, the effects of the present invention are not limited to the above-described effects, and additional effects may be obtained in addition to the above-described effects.

[0090] 1, 1A: Laminate 2: Base substrate 4: Vapor chamber 4a: Space portion 5A, 5B: Bonding material 6: Electronic component 7, 7A: Vapor chamber composite 16: Electronic component 16b: External terminal H: Opening H1: Edge portion P1, P1A: First preparation P2: Second preparation S: Inclined surface T2, T3: Cover member g: Gap

Claims

1. A method for manufacturing a vapor chamber composite, comprising the steps of: preparing a vapor chamber having a working fluid sealed in a space provided inside, a bonding material, an electronic component, and a cover member having an opening; preparing a first preparatory item in which the bonding material is provided on the surface of the vapor chamber, the electronic component is provided on the surface of the bonding material, and the cover member is provided on the surface of the vapor chamber in a position where the edges that define the opening are not in contact with the bonding material and the electronic component; applying pressure and heat to the first preparatory item using an isostatic press to bond the vapor chamber and the electronic component with the bonding material; and removing the cover member from the vapor chamber to which the electronic component has been bonded.

2. A method for manufacturing a vapor chamber composite as described in claim 1, wherein pressure is applied by the isostatic press to at least the surface of the electronic component, the surface of the cover member, and the side surface of the vapor chamber.

3. A method for manufacturing a vapor chamber composite as described in claim 1, wherein the gap between the bonding material and the electronic component and the edge is 0.1 mm or more and 10 mm or less.

4. A method for manufacturing a vapor chamber composite as described in claim 1, wherein the portion of the surface of the cover member where the opening is provided has an inclined surface that widens in diameter from the back surface to the front surface of the cover member.

5. A method for manufacturing a vapor chamber composite as described in claim 1, wherein the electronic component has an external terminal extending outward, and the surface of the cover member supports the back surface of the external terminal.

6. A method for manufacturing a vapor chamber composite, comprising the steps of: preparing a vapor chamber having a working fluid sealed in a space provided inside, a bonding material, and an electronic component; preparing a second preparation having the bonding material provided on the surface of the vapor chamber and the electronic component provided on the surface of the bonding material; and applying pressure and heat to the second preparation using an isostatic press to bond the vapor chamber and the electronic component with the bonding material and apply pressure to at least the surface and side of the vapor chamber.

7. A method for manufacturing a laminate, comprising the steps of: preparing a base substrate, a semi-cured resin composition, and a vapor chamber composite manufactured by the manufacturing method described in any one of claims 1 to 6; preparing a first laminate preparation in which the resin composition is provided on the surface of the base substrate and the vapor chamber composite is provided on the surface of the resin composition; and applying pressure and heat to the first laminate preparation by isostatic pressing, thereby curing the resin composition and bonding the base substrate and the vapor chamber composite.

8. A method for manufacturing a laminate, comprising: a step of preparing a base substrate, a semi-cured resin composition, a vapor chamber having a space provided therein and filled with a working fluid, a bonding material, an electronic component, and a cover member having an opening; a step of preparing a second laminate preparatory item in which the resin composition is provided on a surface of the base substrate, the vapor chamber is provided on a surface of the resin composition, the bonding material is provided on a surface of the vapor chamber, the electronic component is provided on a surface of the bonding material, and the cover member is provided on the surface of the vapor chamber in a position where the edges defining the opening are not in contact with the bonding material and the electronic component; a step of applying pressure and heat to the second laminate preparatory item by isostatic pressing to bond the vapor chamber and the electronic component with the bonding material and harden the resin composition to bond the base substrate and the vapor chamber; and a step of removing the cover member from the vapor chamber to which the electronic component has been bonded.

9. The method for manufacturing a laminate according to claim 8, wherein the cover member has an inclined surface whose diameter increases from the rear surface to the front surface at the portion where the opening is provided on the surface of the cover member.

10. The method for manufacturing a laminate according to claim 8, wherein the electronic component has external terminals extending outward, and the surface of the cover member supports the back surfaces of the external terminals.

11. A method for manufacturing a laminate, comprising: a step of preparing a base substrate, a semi-cured resin composition, a vapor chamber having a space therein and filled with a working fluid, a bonding material, and an electronic component; a step of preparing a third laminate preparation in which the resin composition is provided on the surface of the base substrate, the vapor chamber is provided on the surface of the resin composition, the bonding material is provided on the surface of the vapor chamber, and the electronic component is provided on the surface of the bonding material; and a step of applying pressure and heat to the third laminate preparation by isostatic pressing to bond the vapor chamber and the electronic component with the bonding material, and applying pressure to at least the surface and side of the vapor chamber, and curing the resin composition to bond the base substrate and the vapor chamber.

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