Electronic element housing package, electronic module, and electronic device

Abstract

This electronic element housing package is provided with an optical waveguide substrate and an external substrate. The optical waveguide substrate has a first base substrate, a first layer, a first electrode, and an optical waveguide. The first base substrate has a first upper surface and a first side surface. The first layer has a second side surface positioned so as to be spaced from the first side surface, and is positioned on the first upper surface. The first electrode is positioned above the first upper surface. The external substrate has a second base substrate and a second electrode. The second base substrate has a first lower surface at least partially facing the first upper surface. The second electrode is positioned below the first lower surface and is electrically connected to the first electrode. The optical waveguide substrate and the external substrate are fixed to each other by a fixing material. The fixing material is in contact with at least the first side surface and also in contact with the second side surface.

Description

Package for storing electronic elements, electronic module, and electronic device

[0001] The present disclosure relates to a package for housing an electronic element, an electronic module, and an electronic device.

[0002] A conventional optical waveguide substrate used in a light source module of an electronic device such as a head-mounted display is disclosed in Patent Document 1. An external substrate such as a printed circuit board is connected to electrodes of the optical waveguide substrate.

[0003] Japanese Patent Application Laid-Open No. 2005-266657

[0004] The package for storing an electronic element according to the present disclosure comprises an optical waveguide substrate and an external substrate, wherein the optical waveguide substrate has a first base substrate, a first layer, a first electrode, and an optical waveguide, wherein the first base substrate has a first upper surface and a first side surface, wherein the first layer has a second side surface spaced from the first side surface and is located on the first upper surface, wherein the first electrode is located above the first upper surface, wherein the external substrate has a second base substrate and a second electrode, wherein the second base substrate has a first lower surface at least partially facing the first upper surface, wherein the second electrode is located below the first lower surface and is electrically connected to the first electrode, and wherein the optical waveguide substrate and the external substrate are fixed to each other by a fixing material, wherein the fixing material is in contact with at least the first side surface and also in contact with the second side surface.

[0005] Furthermore, an electronic module according to the present disclosure includes: a package for housing an electronic element; an electronic element electrically connected to the first electrode; and a lid that covers the electronic element.

[0006] Furthermore, an electronic device according to the present disclosure includes an electronic module and a display unit, wherein the electronic element is a light-emitting element, and the display unit performs display using light emitted from the electronic module.

[0007] According to the present disclosure, it is possible to obtain an electronic element housing package, an electronic module, and an electronic device in which an optical waveguide substrate and an external substrate can be firmly connected.

[0008] FIG. 7 is a perspective view of an electronic element storage package according to an embodiment of the present disclosure. FIG. 8 is a cross-sectional end view of the electronic element storage package taken along the line A-A in FIG. 1. FIG. 9 is a cross-sectional end view of the main part B in FIG. 2. FIG. 10 is a plan view of the optical waveguide substrate in the main part B in FIG. 2. FIG. 11 is a diagram illustrating the shape of a first electrode in a plan view. FIG. 12 is a rear view of the external substrate in the main part B in FIG. 2. FIG. 13 is a plan view showing a transparent covering member in the main part B in FIG. 2. FIG. 14 is a cross-sectional end view of the electronic element storage package taken along the line C-C in FIG. 1. FIG. 15 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, for the sake of convenience, the drawings below show simplified views of the main components necessary for explaining the embodiments. Therefore, the embodiments of the present disclosure may include any components not shown in the drawings. Furthermore, the drawings do not necessarily faithfully represent the dimensional proportions of the actual components.

[0010] Regarding directions, the direction toward the first upper surface 11a as viewed from the first base substrate 11 is defined as "upward." Note that directions in this disclosure do not refer to directions in actual use. For convenience, each direction is expressed using an orthogonal coordinate system XYZ, with the upward direction being the positive side of the Z direction. In this disclosure, "planar view" refers to a view from above (the positive side of the Z direction) of the electronic element housing package 1, and includes a planar perspective view.

[0011] In the following description, expressions such as "constant," "orthogonal," "vertical," "parallel," or "equal" may be used. These expressions do not necessarily mean "constant," "orthogonal," "vertical," "parallel," or "equal" in their strict sense. In other words, these expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc. Numerical ranges expressed using "to" include the numerical values ​​before and after the range as the lower and upper limits, respectively.

[0012] Optical waveguide substrates are used as light sources for, for example, head-mounted displays, augmented reality (AR) glasses, etc. Portable devices such as head-mounted displays and AR glasses may be exposed to harsh environments, such as being dropped or vibrated. Therefore, a strong connection between the optical waveguide substrate and an external substrate is required.

[0013] The package for storing an electronic element, the electronic module, and the electronic device according to the present disclosure can firmly connect an optical waveguide substrate to an external substrate. The package for storing an electronic element, the electronic module, and the electronic device according to the present disclosure will be described in detail below.

[0014] [Package for Storing Electronic Elements] As shown in FIGS. 1 to 3 , the package for storing electronic elements 1 includes an optical waveguide substrate 10 and an external substrate 20. The optical waveguide substrate 10 includes a first base substrate 11, a first layer 12, a first electrode 13, and an optical waveguide 14. The external substrate 20 includes a second base substrate 21 and a second electrode 22. The external substrate 20 may be a printed circuit board (PCB). The printed circuit board may be flexible, and may be a so-called flexible printed circuit board (FPC). If the external substrate 20 is an FPC, the external substrate 20 can be easily handled, improving the degree of freedom in design. The external substrate 20 may be in contact with the optical waveguide 14 or may be separated from it. In addition, the second base substrate 21 may have one or more electrodes on the surface opposite to the surface on which the second electrode 22 is located, and the electrodes may be connected to the second electrode 22 by vias that penetrate the second base substrate 21.

[0015] The first base substrate 11 has a first upper surface 11 a and a first side surface 11 b. The first side surface 11 b may be located on the opposite side to the output end 142 b of the optical waveguide 14 as shown in FIG. 2 , or may be located adjacent to the surface on which the output end 142 b of the optical waveguide 14 is located.

[0016] The material of the first base substrate 11 may be conductive silicon, or insulating ceramic or resin. Examples of ceramic include aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, silicon nitride sintered body, and glass ceramic sintered body. Examples of resin include epoxy resin, polyimide resin, polyester resin, acrylic resin, phenolic resin, and fluororesin.

[0017] As shown in Figure 3 and other figures, the first layer 12 has a second side surface 12a spaced apart from the first side surface 11b and is located on the first upper surface 11a. The optical waveguide substrate 10 and the external substrate 20 are fixed to each other by a fixing material 24. The fixing material 24 is in contact with at least the first side surface 11b and also the second side surface 12a. The fixing material 24 being in contact with the second side surface 12a also allows the fixing material 24 to penetrate between the first base substrate 11 and the second base substrate 21, thereby strengthening the bond between the optical waveguide substrate 10 and the external substrate 20 compared to when the fixing material 24 is not in contact with the second side surface 12a. This reduces the possibility of the electrical connection between the first electrode 13 and the second electrode 22 being disconnected.

[0018] The fixing material 24 is, for example, an insulating resin adhesive. Examples of resin adhesives include acrylic resin adhesives, urethane resin adhesives, epoxy resin adhesives, phenol resin adhesives, polyimide resin adhesives, and silicone adhesives. The fixing material 24 that fixes the optical waveguide substrate 10 and the external substrate 20 may include a partial void.

[0019] 3 and 4, the dimension d1 between the first side surface 11b and the second side surface 12a is, for example, 0.05 to 5 mm. A fixing material 24 may be located between the first side surface 11b and the second side surface 12a. The second side surface 12a may or may not be perpendicular to the first upper surface 11a. The second side surface 12a may or may not be parallel to the first side surface 11b.

[0020] The first layer 12 and the first base substrate 11 may be integral. In this case, the material of the first layer 12 is the same as the material of the first base substrate 11.

[0021] The first layer 12 and the first base substrate 11 may be separate bodies. In this case, the material of the first layer 12 may be the same as or different from the material of the first base substrate 11.

[0022] The material of the first layer 12 may be the same as or different from the material of the clad 141 of the optical waveguide 14. When the material of the first layer 12 is the same as the material of the clad 141 of the optical waveguide 14, the first layer 12 and the clad 141 may be integral.

[0023] The first layer 12 may have insulating properties. By positioning the insulating first layer 12 between the first base substrate 11 and the first electrode 13, it is possible to use a material with low insulating properties or a conductive material, such as silicon, for the first base substrate 11.

[0024] The first electrode 13 is located above the first upper surface 11a. Being located above the first upper surface 11a does not necessarily mean being located in contact with the first upper surface 11a. As shown in Fig. 3 and other figures, the first electrode 13 may be located on the first layer 12, for example. The material of the first electrode 13 may be any one of Ti, Pt, Au, and Al, or an alloy of these metals, etc.

[0025] The first electrode 13 may be spaced from the second side surface 12 a in a plan view, which reduces the possibility of the first electrode 13 being damaged even if the first layer 12 is chipped. The first electrode 13 may extend in a direction away from the second side surface 12 a.

[0026] As shown in FIG. 4 and other figures, the first electrode 13 may have a linear portion 13c that is linear in plan view and a circular portion 13d that is connected to the linear portion 13c and is circular in plan view. The diameter of the circular portion 13d may be greater than the width of the linear portion 13c. The circular portion 13d may be located midway along the linear portion 13c. A conductive bonding material 25 such as solder may be applied to the circular portion 13d when connecting the first electrode 13 and the second electrode 22. When the region of the electrode to which the conductive bonding material 25 is applied is circular, the possibility of the electrode peeling off or the substrate warping due to stress generated when the conductive bonding material hardens or warping of the first base substrate 11 is reduced compared to when the region is rectangular.

[0027] The first electrode 13 may have multiple layers. As shown in FIG. 3 and other figures, the multiple layers may be, for example, two layers, an upper layer electrode 13b and a lower layer electrode 13a. The first electrode 13 may have multiple layers, particularly in the bonding region with the second electrode 22. For example, if the first electrode 13 has a circular portion 13d, the circular portion 13d may be composed of multiple layers. If the circular portion 13d includes an upper layer electrode 13b and a lower layer electrode 13a, both the upper layer electrode 13b and the lower layer electrode 13a may be circular in plan view. The thickness of the electrode is partially increased in the portion having multiple layers. Having the first electrode 13 partially having multiple layers and a partially increased thickness facilitates connection with the second electrode 22. Furthermore, having the first electrode 13 have multiple layers allows different materials to be used for each layer. For example, a metal suitable for forming wiring may be used for the lower layer electrode 13a, and a metal such as Au that has high wettability with the conductive bonding material 25 may be used for the upper layer electrode 13b. In addition, in a plan view, the outer edge of the upper layer electrode 13b may be spaced from the outer edge of the lower layer electrode 13a. More specifically, in a plan view, the outer edge of the upper layer electrode 13b may be located more inward than the outer edge of the lower layer electrode 13a.

[0028] 4 and other figures, the optical waveguide substrate 10 may include a plurality of first electrodes 13. The plurality of first electrodes 13 may be arranged in a direction along the second side surface 12a.

[0029] Each of the plurality of first electrodes 13 may have a linear portion 13c and a circular portion 13d. In this case, the plurality of circular portions 13d may be arranged alternately in a staggered pattern in a plan view. This allows the distance between each of the first electrodes 13 to be smaller than when the plurality of circular portions 13d are arranged in a straight line in the Y direction. This configuration also allows the plurality of circular portions 13d to be larger.

[0030] As shown in Fig. 5, when multiple circular portions 13d are arranged alternately in a staggered pattern, the centers of the circular portions 13d of adjacent first electrodes 13 may be offset in the direction in which the linear portions 13c extend (the X direction in Fig. 5). Dimension d2 in Fig. 5 indicates the offset between the centers of the circular portions 13d of adjacent first electrodes 13 in the direction in which the linear portions 13c extend. Furthermore, the circular portions 13d of adjacent first electrodes 13 may partially overlap in the direction in which the linear portions 13c extend. Dimension d3 in Fig. 5 indicates the overlap between the circular portions 13d of adjacent first electrodes 13 in the direction in which the linear portions 13c extend.

[0031] 8 , when the optical waveguide substrate 10 includes a plurality of first electrodes 13, the fixing material 24 may be positioned between at least some of the plurality of first electrodes 13, or may be positioned between all of the plurality of first electrodes 13. This increases the contact area between the fixing material 24 and the optical waveguide substrate 10, further improving the bonding strength. In addition, the possibility of dust or moisture getting between the first electrodes 13 is reduced, reducing the possibility of short-circuiting between the first electrodes 13.

[0032] The second base substrate 21 has a first lower surface 21a at least part of which faces the first upper surface 11a. The second base substrate 21 is made of a material such as a resin.

[0033] The second electrode 22 is located below the first lower surface 21a and is electrically connected to the first electrode 13. The material of the second electrode 22 is, for example, Cu or a Cu alloy.

[0034] 6, the external substrate 20 may include a plurality of second electrodes 22. Each of the plurality of second electrodes 22 is electrically connected to the first electrode 13.

[0035] The first electrode 13 and the second electrode 22 may be electrically connected via a conductive bonding material 25. The electrical connection via the conductive bonding material 25 may be, for example, a connection by solder bonding, anisotropic conducting paste (ACP) bonding, anisotropic conducting film (ACF) bonding, or the like.

[0036] 7 and 8 , when the external substrate 20 includes a plurality of second electrodes 22, the fixing material 24 may be positioned between at least some of the plurality of second electrodes 22, or may be positioned between all of the plurality of second electrodes 22. This increases the contact area between the fixing material 24 and the external substrate 20, further improving the bonding strength. In addition, the possibility of dust or moisture getting between the second electrodes 22 is reduced, reducing the possibility of short-circuiting between the second electrodes 22.

[0037] The external substrate 20 may have a covering member 23 that covers at least a portion of the second electrode 22. This protects the second electrode 22. The covering member 23 is made of, for example, resin. The covering member 23 has a thickness of, for example, 5 to 30 μm.

[0038] 7 , the covering member 23 may be spaced from the first base substrate 11 in a plan view. In other words, the covering member 23 does not have to overlap the first base substrate 11 in a plan view. This reduces the possibility that the covering member 23 will run onto the first base substrate 11 even if the mounting position of the external substrate 20 is shifted. This reduces the possibility that the electrical connection by the conductive bonding material 25 will be obstructed and the first electrode 13 and the second electrode 22 will not be properly connected.

[0039] 3 and other figures, the fixing material 24 may also be in contact with the covering member 23. This further improves the bonding strength between the optical waveguide substrate 10 and the external substrate 20. Furthermore, by positioning the fixing material 24 in contact with the covering member 23 as well, it becomes easier to prevent the second electrodes 22 from being exposed. This reduces the possibility of dust or moisture adhering to the second electrodes 22 from the outside and causing a short circuit between the second electrodes 22.

[0040] When there is a gap between the covering member 23 and the first base substrate 11 in a plan view, the dimension d4 between the covering member 23 and the first base substrate 11 in a plan view may be 1 mm or less. This eliminates the need to use an unnecessarily large amount of fixing material 24 when the fixing material 24 is also in contact with the covering member 23. This makes it easier to control the application of the fluid fixing material 24.

[0041] The covering member 23 may be bonded to the second base substrate 21 and the second electrode 22 via an adhesive layer having a thickness of, for example, about 10 to 60 μm.

[0042] The optical waveguide 14 may be located above the first base substrate 11 or below the first base substrate 11. As shown in FIG. 1 etc., the optical waveguide 14 may be located on the first upper surface 11a of the first base substrate 11. The optical waveguide 14 may also be located on the first layer 12. In other words, the first layer 12 may be located so as to extend between the first base substrate 11 and the optical waveguide 14.

[0043] The optical waveguide 14 may have a clad 141 and a core 142 capable of transmitting light and located within the clad 141. The core 142 has an incident end 142a and an exit end 142b exposed from the clad 141, and may be located so as to penetrate through the clad 141 from the incident end 142a to the exit end 142b.

[0044] The material of the clad 141 and the core 142 may be a light-transmitting material. Specifically, the material of the clad 141 and the core 142 may be, for example, glass, resin, or the like. More specifically, the material of the clad 141 may be silicon dioxide (SiO ２ ), and the material of the core 142 may be silicon oxynitride (SiON), also known as silicon oxynitride.

[0045] The refractive index of the core 142 is greater than the refractive index of the clad 141. The difference in refractive index between the core 142 and the clad 141 depends on the structure, such as the shape of each core 142, but can be set to, for example, about 0.01 to 2.0. This provides an optical waveguide 14 in which light propagates along the core 142.

[0046] The cross-sectional shape of the core 142 perpendicular to the extending direction may be rectangular, trapezoidal, or other shape. The width and height of the core 142 are, for example, about 2 to 10 μm, and may or may not be constant from the incident end 142 a to the output end 142 b. The core 142 may be linear from the incident end 142 a to the output end 142 b, or may have a curved portion.

[0047] The core 142 may be one or more. The number of cores 142 is, for example, the same as the number of light-emitting elements. The multiple cores 142 may be spaced apart from one another, connected to one another on the side of the emitting ends 142b, or merging together along the way. When the multiple cores 142 are spaced apart from one another, the emitting ends 142b of the multiple cores 142 may be spaced apart from one another and aligned facing the same direction.

[0048] The cladding 141 may have a protrusion that protrudes above the core 142 along the core 142. The height of the protrusion may be, for example, about the same as the height of the core 142, 2 to 10 μm.

[0049] As shown in FIG. 1 and other figures, the clad 141 may have a recess 141a capable of accommodating the electronic element 31. In this case, one end of the core 142 may be exposed in the recess 141a. The end of the core 142 exposed in the recess 141a serves as a light incident end 142a. In this case, the first electrode 13 may extend from the outside of the recess 141a to the inside of the recess 141a and be electrically connected to the second electrode 22 outside the recess 141a. By having the recess 141a in the clad 141 capable of accommodating the electronic element 31, the electronic element 31 can be easily sealed without using a separate box for accommodating the optical waveguide 14 and the electronic element 31. This makes it easier to miniaturize the electronic element storage package 1.

[0050] 2, the recess 141a is open to the positive side of the cladding 141 in the Z direction, and does not necessarily have to be open to the negative side of the cladding 141 in the Z direction. The recess 141a may also penetrate the cladding 141 in the Z direction. The shape of the recess 141a in plan view may be rectangular or may have another shape.

[0051] The optical waveguide substrate 10 may have a box that encloses the first base substrate 11, the optical waveguide 14, etc. The box encloses, for example, the optical waveguide 14 except for the upper side (the positive side in the Z direction). The material of the box may be silicon, ceramic, resin, etc. The material of the box may be the same as the material of the first base substrate 11, or may not be the same.

[0052] The box body may have a window located in the direction of emission of light from the core 142. The window may be a member that simply transmits light, or may be a member that can convert the emitted light into parallel light instead of a lens.

[0053] [Electronic Module] As shown in FIG. 1 etc., an electronic module 30 may include an electronic element housing package 1, an electronic element 31, a lid 32, and a lens.

[0054] The electronic element 31 may be electrically connected to the first electrode 13. The electronic element 31 and the first electrode 13 may be electrically connected by, for example, a brazing material, a conductive adhesive, a bonding wire 33, or the like. When the clad 141 has a recess 141a, the electronic element 31 may be located inside the recess 141a in a plan view. There may be one or more electronic elements 31.

[0055] The electronic element 31 may be, for example, a light-emitting element, specifically a laser diode (LD). The light-emitting element emits light at a predetermined wavelength and can cause the light to be incident on the incident end 142a of the core 142. The electronic element 31 may also be a light-receiving element. In this case, the electronic module 30 may be configured so that the light-receiving element receives light input from outside the electronic module 30 through the core 142. The light may also include electromagnetic waves other than visible light, such as infrared light, as long as the light has a wavelength that can be transmitted by the optical waveguide 14. Accordingly, the electronic element 31 may be a temperature-measuring element that measures temperature. The temperature-measuring element may be, for example, a thermistor. Alternatively, the electronic element 31 may be, for example, a photodiode.

[0056] The lid 32 may be located above the electronic element 31. When the clad 141 has a recess 141a as shown in Fig. 1 , the lid 32 may be located on the clad 141, covering the electronic element 31, so as to seal the inside of the recess 141a. When the optical waveguide substrate 10 has a box that encloses the first base substrate 11, the optical waveguide 14, etc., the lid 32 may be located on the box, covering the electronic element 31.

[0057] The lid 32 may be flat, or may have a minute recess corresponding to the protrusion of the clad 141. For example, when the top of the electronic element 31 is located higher than the top of the clad 141, the lid 32 may have a recess on its lower surface (the surface on the lower side in the Z direction) as shown in FIG.

[0058] The material of the lid 32 may be, for example, glass, silicon, or metal. Examples of glass include quartz, borosilicate, and sapphire. Examples of metal include aluminum, copper, iron, and alloys such as Fe—Ni—Co. When the lid 32 is made of metal, the lid 32 may have a plating layer on its surface. Examples of the material of the plating layer include gold and nickel.

[0059] A ring-shaped conductor may be positioned between the lid 32 and the optical waveguide substrate 10. By joining the lid 32 and the electronic element housing package 1 with the conductor sandwiched therebetween, airtightness is improved compared to when they are directly joined with a resin-based adhesive.

[0060] The lens may be positioned in the direction in which light is emitted from the optical waveguide 14. The lens may be, for example, a convex lens, a diffractive lens, a rod lens, a ball lens, etc. The lens may be a component having a function of converting the light emitted from the optical waveguide 14 into parallel light.

[0061] [Electronic Device] The electronic device 40 may include the electronic module 30 and a display unit 41. The electronic device 40 may be, for example, AR glasses, a head-up display, a projector, or the like.

[0062] For example, when the electronic device 40 is an AR glass, the electronic device 40 may further include temples 42 and a control unit 43, as shown in FIG. 9 . In this case, the electronic module 30 may be located inside the temples 42. The temples 42 may be bendable or non-bendable. If the temples 42 are bendable, the electronic module 30 may not emit light when bent.

[0063] The display unit 41 may perform display using light emitted from the electronic module 30. The display unit 41 may have a scanning mirror 411 and a light guide unit 412. The scanning mirror 411 is, for example, a MEMS (Micro-Electro Mechanical Systems) mirror, and scans the light emitted from the electronic module 30. The scanned light is input to a light guide plate, a half mirror, or the like of the light guide unit 412. The scanning mirror 411 may be located inside the temple 42.

[0064] The light guide unit 412 may have a light guide plate or a half mirror as described above, and may be able to project incident light onto the user's eyeball. The light guide unit 412 may be optically transparent. For example, the light guide unit 412 may be a waveguide type, a half mirror type, or the like, allowing the user to view the projected image by superimposing it on the actual image transmitted through the display unit 41. If the light guide unit 412 is a half mirror type, the light guide unit 412 may be separated from the glass surface. The light guide unit 412 may be transparent, or may be colored to block part of the transmitted light.

[0065] The projection image data is not particularly limited, but may be received from the outside via wireless communication or the like, or may be generated by the control unit 43 based on measurement results of a sensor provided in the AR glasses or the like. In addition, these types of image data may be used in combination.

[0066] The control unit 43 has, for example, a CPU, RAM, non-volatile memory, etc., and performs control processing related to image display. In addition to the above, the control unit 43 may also have an LD driver for controlling the LD, a MEMS driver for scanning and controlling the MEMS mirror, etc. The control unit 43 may be located inside or on the side of the temple 42, or may be located externally via a cable.

[0067] The glass surface including the light guide section 412 may be separate on the left and right as shown in Figure 9, or may be a single glass surface. The glass surface may have a large curved surface, particularly in the case of a half mirror system.

[0068] The electronic device 40, which is an AR glass, may be a head-mounted display having a band, a support, etc. for wearing on a person's head instead of the temples 42.

[0069] The electronic device 40 may also have a communication unit, a battery, etc. When the electronic device 40 is an AR glass, the communication unit, the battery, etc. may be located inside or on the side of the temple 42, or may be located outside via a cable.

[0070] Further examples of embodiments of the electronic element housing package, electronic module, and electronic device according to the present disclosure will be described below.

[0071] (1) One embodiment of an electronic element storage package according to the present disclosure comprises: an optical waveguide substrate; and an external substrate; the optical waveguide substrate has a first base substrate, a first layer, a first electrode, and an optical waveguide; the first base substrate has a first upper surface and a first side surface; the first layer has a second side surface spaced from the first side surface and is located on the first upper surface; the first electrode is located above the first upper surface; the external substrate has a second base substrate and a second electrode; the second base substrate has a first lower surface at least partially facing the first upper surface; the second electrode is located below the first lower surface and is electrically connected to the first electrode; the optical waveguide substrate and the external substrate are fixed to each other by a fixing material; and the fixing material is in contact with at least the first side surface and also in contact with the second side surface.

[0072] (2) One embodiment of the electronic element storage package according to the present disclosure is the package for storing an electronic element according to (1) above, in which the first layer and the first base substrate are integral with each other.

[0073] (3) One embodiment of the electronic element storage package according to the present disclosure is the package for storing an electronic element according to (1) above, in which the first layer and the first base substrate are separate bodies.

[0074] (4) One embodiment of the package for storing electronic elements according to the present disclosure is a package for storing electronic elements according to any one of (1) to (3) above, comprising a plurality of the first electrodes and a plurality of the second electrodes, and the fixing material is also located between at least any of the plurality of second electrodes.

[0075] (5) One embodiment of the package for storing an electronic element according to the present disclosure is the package for storing an electronic element according to any one of (1) to (4) above, wherein the first layer has insulating properties.

[0076] (6) One embodiment of the package for storing an electronic element according to the present disclosure is the package for storing an electronic element according to any one of (1) to (5) above, wherein the optical waveguide has a clad and a core located within the clad and capable of transmitting light, the clad has a recess capable of accommodating an electronic element, one end of the core is exposed in the recess, and the first electrode extends from the outside of the recess to the inside of the recess and is electrically connected to the second electrode outside the recess.

[0077] (7) One embodiment of the package for storing an electronic element according to the present disclosure is the package for storing an electronic element according to any one of (1) to (6) above, wherein the first electrode has a linear portion that is linear in a planar view and a circular portion that is connected to the linear portion and is circular in a planar view, and the diameter of the circular portion is larger than the width of the linear portion.

[0078] (8) One embodiment of the package for storing an electronic element according to the present disclosure is the package for storing an electronic element according to (7) above, in which the first electrode has a plurality of layers.

[0079] (9) One embodiment of the electronic element storage package according to the present disclosure is the package for storing an electronic element according to (8) above, wherein the circular portion is made up of the plurality of layers.

[0080] (10) One embodiment of the package for storing an electronic element according to the present disclosure is the package for storing an electronic element according to any one of (7) to (9) above, comprising a plurality of the first electrodes and a plurality of the second electrodes, each of the plurality of first electrodes having the linear portion and the circular portion, and in a planar view, the plurality of circular portions are positioned alternately in a staggered pattern.

[0081] (11) One embodiment of the package for storing an electronic element according to the present disclosure is the package for storing an electronic element according to any one of (1) to (10) above, wherein the external substrate has a covering member that covers at least a portion of the second electrode.

[0082] (12) One embodiment of the electronic element storage package according to the present disclosure is the package for storing an electronic element according to (11) above, in which the fixing material is also in contact with the covering member.

[0083] (13) One embodiment of the electronic element storage package according to the present disclosure is the package for storing an electronic element according to (11) or (12) above, in which the covering member is spaced apart from the first base substrate in plan view.

[0084] (14) One embodiment of an electronic module according to the present disclosure comprises the package for housing an electronic element according to (13) above, an electronic element electrically connected to the first electrode, and a lid covering the electronic element.

[0085] (15) One embodiment of an electronic device according to the present disclosure includes the electronic module of (14) above; and a display unit, wherein the electronic element is a light-emitting element, and the display unit displays using light emitted from the electronic module.

[0086] In addition, the details shown in the above embodiments can be modified as appropriate without departing from the spirit of the present disclosure. The scope of the present disclosure includes the scope of the invention described in the claims and its equivalents. Various combinations of the embodiments are not limited to the examples of the above embodiments. Furthermore, combinations of the embodiments with each other are also possible.

[0087] 1 Package for housing electronic element 10 Optical waveguide substrate 11 First base substrate 11a First upper surface 11b First side surface 12 First layer 12a Second side surface 13 First electrode 13a Lower layer electrode 13b Upper layer electrode 13c Straight portion 13d Circular portion 14 Optical waveguide 141 Cladding 141a Recess 142 Core 142a Incident end 142b Emitting end 20 External substrate 21 Second base substrate 21a First lower surface 22 Second electrode 23 Covering member 24 Fixing material 25 Conductive bonding material 30 Electronic module 31 Electronic element 32 Lid 33 Bonding wire 40 Electronic device 41 Display unit 411 Scanning mirror 412 Light guide unit 42 Temple 43 Control unit

Claims

an optical waveguide substrate and an external substrate; the optical waveguide substrate includes a first base substrate, a first layer, a first electrode, and an optical waveguide; the first base substrate has a first top surface and a first side surface; the first layer has a second side surface spaced apart from the first side surface and is located on the first top surface; the first electrode is located above the first upper surface; the external substrate includes a second base substrate and a second electrode; the second base substrate has a first lower surface at least partially facing the first upper surface, the second electrode is located below the first lower surface and is electrically connected to the first electrode; the optical waveguide substrate and the external substrate are fixed to each other by a fixing material; The fixing member is in contact with at least the first side surface and also in contact with the second side surface. A package for storing electronic elements. 　 the first layer and the first base substrate are integral; The package for housing an electronic device according to claim 1 . 　 the first layer and the first base substrate are separate bodies; The package for housing an electronic device according to claim 1 . 　 a plurality of the first electrodes and a plurality of the second electrodes; The fixing material is also located between at least any of the plurality of second electrodes. The package for housing an electronic element according to any one of claims 1 to 3. 　 The first layer has insulating properties. The package for housing an electronic element according to any one of claims 1 to 4. 　 the optical waveguide has a clad and a core located within the clad and capable of transmitting light; the clad has a recess capable of accommodating an electronic element; One end of the core is exposed in the recess, the first electrode extends from the outside of the recess to the inside of the recess and is electrically connected to the second electrode outside the recess; The package for housing an electronic element according to any one of claims 1 to 5. 　 the first electrode has a linear portion that is linear in a plan view, and a circular portion that is connected to the linear portion and is circular in a plan view, The diameter of the circular portion is greater than the width of the linear portion. The package for housing an electronic element according to any one of claims 1 to 6. 　 the first electrode has a plurality of layers; The package for housing an electronic element according to claim 7. 　 The circular portion is composed of the plurality of layers. The package for housing an electronic device according to claim 8 . 　 a plurality of the first electrodes and a plurality of the second electrodes; Each of the plurality of first electrodes has the linear portion and the circular portion, In a plan view, the plurality of circular portions are arranged alternately in a staggered pattern. The package for housing an electronic element according to any one of claims 7 to 9. 　 the external substrate has a covering member that covers at least a portion of the second electrode. The package for housing an electronic element according to any one of claims 1 to 10. The fixing material is also in contact with the covering member. The package for housing an electronic device according to claim 11. 　 In a plan view, the covering member is spaced from the first base substrate. The package for housing an electronic element according to claim 11 or 12. 　 The electronic element storage package according to claim 13; an electronic element electrically connected to the first electrode; and a lid that covers the electronic element. Electronic module. 　 an electronic module according to claim 14; a display unit, the electronic element is a light-emitting element, the display unit performs display using light emitted from the electronic module. Electronic devices.

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