Display panel and manufacturing method therefor, and display device

Abstract

A display panel (10) and a manufacturing method therefor, and a display device. The display panel (10) comprises a first substrate (11), a second substrate (12), liquid crystals (41) and a sealant (20), wherein the first substrate (11) is arranged opposite the second substrate (12); the sealant (20) is connected between the first substrate (11) and the second substrate (12); the liquid crystals (41) are arranged in a space enclosed by the first substrate (11), the second substrate (12) and the sealant (20); and the sealant (20) contains an epoxy resin polymer and acrylic, with the curing rate of the epoxy resin polymer being less than or equal to 50%.

Description

Display panel, manufacturing method thereof and display device TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] Consumers have higher and higher requirements for display panels, which not only reflects in higher and higher requirements for optical specifications in the conventional sense, but also reflects in higher and higher requirements for reliability specifications of display panels.

[0003] At present, in the transportation and use process of the display panel, water vapor is easy to enter the inside of the display panel, causing the display panel to display abnormally, for example, causing the display panel to be black. SUMMARY

[0004] Embodiments of the present application provide a display panel, a manufacturing method thereof and a display device, which can reduce the probability of display panel producing adverse phenomena due to water vapor invasion, and improve the stability of the display panel.

[0005] Embodiments of the present application provide a display panel, comprising:

[0006] a first substrate;

[0007] a second substrate, disposed opposite to the first substrate;

[0008] a frame glue, connected between the first substrate and the second substrate; and

[0009] a liquid crystal, disposed in a space enclosed by the first substrate, the second substrate and the frame glue;

[0010] wherein the frame glue comprises an epoxy resin polymer and acrylic, and the curing rate of the epoxy resin polymer is less than or equal to 50%.

[0011] In order to achieve the above-mentioned purposes, embodiments of the present application further provide a manufacturing method of a display panel, comprising the following steps:

[0012] forming a frame glue intermediate on a first substrate;

[0013] disposing a liquid crystal on the first substrate, wherein the liquid crystal is located in an area enclosed by the frame glue intermediate;

[0014] disposing a second substrate on the first substrate;

[0015] The frame glue intermediate connected between the first substrate and the second substrate is subjected to a curing process, wherein the frame glue formed after the curing process of the frame glue intermediate comprises an epoxy resin polymer and acrylic, and the curing rate of the epoxy resin polymer is less than or equal to 50%.

[0016] According to the above-mentioned purposes of the present application, the embodiments of the present application further provide a display device, which comprises a display panel, wherein the display panel comprises:

[0017] a first substrate;

[0018] a second substrate, which is arranged opposite to the first substrate;

[0019] a frame glue, which is connected between the first substrate and the second substrate; and

[0020] a liquid crystal, which is arranged in a space enclosed by the first substrate, the second substrate and the frame glue.

[0021] The frame glue comprises an epoxy resin polymer and acrylic, and the curing rate of the epoxy resin polymer is less than or equal to 50%. BRIEF DESCRIPTION OF DRAWINGS

[0022] FIG. 1 is a schematic diagram of a structure of a display panel according to an embodiment of the present application;

[0023] FIG. 2 is a schematic diagram of a force direction of a display panel according to an embodiment of the present application;

[0024] FIG. 3 is a schematic diagram of another force direction of a display panel according to an embodiment of the present application;

[0025] FIG. 4 is a schematic diagram of another structure of a display panel according to an embodiment of the present application;

[0026] FIG. 5 is a flowchart of a manufacturing method of a display panel according to an embodiment of the present application. Embodiments of the present application

[0027] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0028] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0029] Embodiments of the present application provide a display panel 10, which comprises a first substrate 11, a second substrate 12, liquid crystals 41 and a frame glue 20.

[0030] The first substrate 11 and the second substrate 12 are oppositely arranged, the frame glue 20 is connected between the first substrate 11 and the second substrate 12, and the liquid crystals 41 are arranged in the space enclosed by the first substrate 11, the second substrate 12 and the frame glue 20.

[0031] The frame glue 20 comprises an epoxy resin polymer and an acrylic, and the curing rate of the epoxy resin polymer is less than or equal to 50%.

[0032] In the implementation process, the present application can reduce the elastic modulus of the frame glue 20 by reducing the curing rate of the epoxy resin polymer in the frame glue 20, increase the flexibility of the frame glue 20, effectively reduce the probability of micro-cracks at the connecting interface between the frame glue 20 and the first substrate 11 and the second substrate 12, reduce the probability of water vapor intrusion into the display panel 10 at the connecting interface between the frame glue 20 and the first substrate 11 and the second substrate 12, improve the water resistance of the display panel 10, reduce the probability of adverse phenomena caused by water vapor intrusion in the display panel 10, and improve the stability of the display panel 10.

[0033] In an embodiment of the present application, the curing rate of the epoxy resin polymer is greater than or equal to 40%.

[0034] In an embodiment of the present application, the curing rate of the epoxy resin polymer is less than the curing rate of the acrylic.

[0035] In an embodiment of the present application, the curing rate of the acrylic is greater than or equal to 85% and less than or equal to 92%.

[0036] In an embodiment of the present application, the elastic modulus of the frame glue is greater than or equal to 3.1 Gpa and less than or equal to 3.4 Gpa.

[0037] In an embodiment of the present application, the moisture permeability of the frame glue is less than or equal to 57 g / m 2 .

[0038] In an embodiment of the present application, the frame glue intermediate body comprises an acrylic small molecule, an epoxy resin, a photo initiator, and a thermal initiator.

[0039] The curing process on the frame glue intermediate body connected between the first substrate and the second substrate comprises:

[0040] The photo curing process on the frame glue intermediate body, at least part of the acrylic small molecule is polymerized;

[0041] The thermal curing process on the frame glue intermediate body, part of the epoxy resin is polymerized.

[0042] In an embodiment of the present application, the temperature of the thermal curing process is less than or equal to 120°C, and the duration of the thermal curing process is less than 50 min.

[0043] In an embodiment of the present application, in the step of curing the frame glue intermediate body connected between the first substrate and the second substrate, the curing rate of the epoxy resin polymer is greater than or equal to 40%, the curing rate of the acrylic is greater than or equal to 85% and less than or equal to 92%.

[0044] Specifically, in some embodiments, the display panel 10 comprises the first substrate 11 and the second substrate 12 arranged oppositely, the frame glue 20 arranged between the first substrate 11 and the second substrate 12, the liquid crystal 41 arranged between the first substrate 11 and the second substrate 12, and the first polarizer 31 and the second polarizer 32 arranged on the first substrate 11 and the second substrate 12 respectively.

[0045] In some embodiments, the frame glue 20 is connected between the first substrate 11 and the second substrate 12, and the frame glue 20 is connected to the circumferential side of the first substrate 11 and the second substrate 12 to form a space between the first substrate 11 and the second substrate 12, and the liquid crystal 41 is arranged in the space.

[0046] In some embodiments, the first polarizer 31 is arranged on the side of the first substrate 11 away from the second substrate 12, and the second polarizer 32 is arranged on the side of the second substrate 12 away from the first substrate 11.

[0047] It should be noted that the frame glue 20 is bonded between the first substrate 11 and the second substrate 12, and can play a role of encapsulation, protection and water resistance for the area between the first substrate 11 and the second substrate 12; please combine FIG. 1, FIG. 2 and FIG. 3, the display panel 10 is easily affected by stress during use or processing, for example, when the first polarizer 31 and the second polarizer 32 shrink due to heat, it will cause the first substrate 11 and the second substrate 12 to also shrink and deform, and then cause the frame glue 20 connected between the first substrate 11 and the second substrate 12 to move, extrude, deform, twist and other adverse phenomena, and microcracks are easily generated at the interface between the frame glue 20 and the first substrate 11 and the second substrate 12, so that water vapor invades into the inside of the display panel 10 from the microcracks, causing the display panel 10 to have display quality problems such as black screen.

[0048] The frame glue 20 includes an epoxy resin polymer and an acrylic, and the frame glue 20 can be obtained by polymerization of epoxy resin and acrylic. In the embodiments of the present application, the curing rate of the epoxy resin polymer in the frame glue 20 is less than or equal to 50%. That is, by reducing the curing rate of the epoxy resin polymer, the embodiments of the present application can reduce the elastic modulus of the frame glue 20, increase the flexibility of the frame glue 20, and thus effectively reduce the probability of microcracks at the connection interface between the frame glue 20 and the first substrate 11 and the second substrate 12, reduce the probability of invasion into the display panel 10 at the connection interface between the frame glue 20 and the first substrate 11 and the second substrate 12, improve the water resistance of the display panel 10, reduce the probability of adverse phenomena caused by water vapor invasion of the display panel 10, and improve the stability of the display panel 10.

[0049] In some embodiments, the curing rate of the epoxy resin polymer is greater than or equal to 40%, for example, it can be 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49% or 50%. The embodiments of the present application need to maintain the mechanical strength of the frame glue 20 while improving the flexibility of the frame glue 20, therefore, the curing rate of the epoxy resin polymer also needs to be greater than or equal to 40% to avoid that the frame glue 20 cannot be stably connected between the first substrate 11 and the second substrate 12 due to insufficient mechanical strength.

[0050] In some embodiments, the curing rate of the epoxy resin polymer is less than the curing rate of the acrylic, and the curing rate of the acrylic is maintained in the embodiments of the present application to ensure the mechanical strength and stability of the frame seal 20. The curing rate of the acrylic is greater than or equal to 85% and less than or equal to 92%, for example, 85%, 86%, 87%, 88%, 89%, 90%, 91%, or 92%.

[0051] It should be noted that the raw material components of the frame seal 20 include epoxy resin, acrylic small molecules, photoinitiator, and thermal initiator. The embodiments of the present application reduce the curing rate of the epoxy resin polymer to improve the flexibility of the frame seal 20, without reducing the curing rate of the acrylic to improve the flexibility of the frame seal 20. In the curing process of the frame seal 20, which generally includes two stages of photocuring and thermal curing, the acrylic small molecules mainly undergo polymerization reaction in the photocuring stage. It has been found through verification that if the curing rate of the acrylic small molecules is reduced, the photoinitiator will precipitate, thereby contaminating the liquid crystal 41. Therefore, by increasing the curing rate of the acrylic and reducing the curing rate of the epoxy resin in the embodiments of the present application, the precipitation of the photoinitiator can be effectively reduced, the probability of contamination of the liquid crystal 41 can be reduced, and the flexibility of the frame seal 20 can be increased, and the probability of micro-cracks at the interface between the frame seal 20 and the first substrate 11 and the second substrate 12 can be reduced, and the probability of water vapor entering the display panel 10 can be reduced.

[0052] In some embodiments, the epoxy resin can be one or a combination of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol H type epoxy resin, phenolic epoxy resin, multifunctional glycidyl ether epoxy resin, multifunctional glycidyl amine epoxy resin, and halogenated epoxy resin.

[0053] In some embodiments, the elastic modulus of the frame seal 20 is greater than or equal to 3.1 Gpa and less than or equal to 3.4 Gpa, for example, 3.1 Gpa, 3.2 Gpa, 3.3 Gpa, or 3.4 Gpa.

[0054] In some embodiments, the moisture permeability of the frame seal 20 is less than or equal to 57 g / m 2 . It should be noted that the moisture permeability of the frame seal 20 at 85°C and 85% humidity is less than or equal to 57 g / m 2 .

[0055] In some embodiments, referring to FIG. 4, the display panel 10 further comprises a thin film transistor array layer (not shown in the figure) disposed on the first substrate 11 close to the second substrate 12, an insulating layer 51 covering the thin film transistor array layer, a first alignment layer 52 disposed on the insulating layer 51 away from the first substrate 11, and a post spacer 42 disposed on the first alignment layer 52 close to the second substrate 12, and the post spacer 42 is used to support the first substrate 11 and the second substrate 12 to maintain the cell gap of the liquid crystal 41; the display panel 10 further comprises a color film layer 53 disposed on the second substrate 12 close to the first substrate 11, a common electrode layer 54 disposed on the color film layer 53 away from the second substrate 12, and a second alignment layer 55 disposed on the common electrode layer 54 away from the color film layer 53.

[0056] As described above, by reducing the curing rate of the epoxy resin polymer in the frame glue 20, the elastic modulus of the frame glue 20 can be reduced, and the flexibility of the frame glue 20 can be increased, thereby effectively reducing the probability of micro-cracks at the connection interface between the frame glue 20 and the first substrate 11 and the second substrate 12, reducing the probability of water vapor invading the display panel 10 at the connection interface between the frame glue 20 and the first substrate 11 and the second substrate 12, improving the water resistance of the display panel 10, reducing the probability of adverse phenomena caused by water vapor invasion of the display panel 10, and improving the stability of the display panel 10.

[0057] In addition, the embodiments of the present application also provide a manufacturing method of a display panel, which can be the manufacturing method of the display panel 10 shown in FIG. 1 in the above embodiments, and the manufacturing method of the display panel 10 comprises the following steps:

[0058] forming a frame glue intermediate on the first substrate 11;

[0059] disposing a liquid crystal 41 on the first substrate 11, wherein the liquid crystal 41 is located in the area surrounded by the frame glue intermediate;

[0060] forming a second substrate 12 on the first substrate 11;

[0061] performing curing treatment on the frame glue intermediate connected between the first substrate 11 and the second substrate 12, wherein the frame glue 20 formed after the curing treatment of the frame glue intermediate comprises an epoxy resin polymer and an acrylic, and the curing rate of the epoxy resin polymer is less than or equal to 50%.

[0062] The present application can reduce the modulus of elasticity of the frame adhesive 20 by reducing the curing rate of the epoxy resin polymer in the frame adhesive 20, thereby increasing the flexibility of the frame adhesive 20, effectively reducing the probability of micro-cracks at the connecting interface between the frame adhesive 20 and the first substrate 11 and the second substrate 12, reducing the probability of water vapor intrusion into the display panel 10 at the connecting interface between the frame adhesive 20 and the first substrate 11 and the second substrate 12, improving the water resistance of the display panel 10, reducing the probability of adverse phenomena caused by water vapor intrusion in the display panel 10, and improving the stability of the display panel 10.

[0063] Please continue to refer to FIG. 1, FIG. 4 and FIG. 5, the manufacturing method of the display panel 10 includes the following steps:

[0064] S10, forming a frame adhesive intermediate on the first substrate 11.

[0065] S20, disposing a liquid crystal 41 on the first substrate 11, wherein the liquid crystal 41 is located in the area surrounded by the frame adhesive intermediate.

[0066] S30, disposing a second substrate 12 on the first substrate 11.

[0067] S40, curing the frame adhesive intermediate connected between the first substrate 11 and the second substrate 12, wherein the frame adhesive 20 formed after the curing treatment of the frame adhesive intermediate includes an epoxy resin polymer and an acrylic, and the curing rate of the epoxy resin polymer is less than or equal to 50%.

[0068] Specifically, in step S10, the first substrate 11 is provided; in some embodiments, the first substrate 11 is provided with a thin film transistor array layer, an insulating layer 51, a first alignment layer 52 and a post spacer 42.

[0069] The frame adhesive intermediate is formed around the side of the first substrate 11 with the first alignment layer 52, and the frame adhesive intermediate forms a surrounding area on the first substrate 11.

[0070] In some embodiments, the frame adhesive intermediate includes acrylic small molecules, epoxy resin, photoinitiator and thermal initiator, wherein the mass fraction of the acrylic small molecules in the frame adhesive intermediate is 10% to 50%, the mass fraction of the epoxy resin in the frame adhesive intermediate is 10% to 50%, the mass fraction of the photoinitiator in the frame adhesive intermediate is 1% to 5%, and the mass fraction of the thermal initiator in the frame adhesive intermediate is 5% to 15%.

[0071] In some embodiments, the epoxy resin is one or a combination of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol H epoxy resin, phenolic epoxy resin, multifunctional glycidyl ether epoxy resin, multifunctional glycidyl amine epoxy resin, and halogenated epoxy resin.

[0072] In some embodiments, the photoinitiator comprises at least one of the following compounds:

[0073] 。

[0074] In some embodiments, the thermal initiator comprises at least one of the following compounds:

[0075] 。

[0076] In step S20, a liquid crystal 41 is formed on the first substrate 11, and the liquid crystal 41 is located in the enclosed area of the frame glue intermediate.

[0077] In step S30, a second substrate 12 is provided; in some embodiments, the second substrate 12 is provided with a color film layer 53, a common electrode layer 54, and a second alignment layer 55.

[0078] The second substrate 12 is formed on the side of the first substrate 11 provided with the frame glue intermediate, and the second substrate 12 is connected to the first substrate 11 through the frame glue intermediate, and the liquid crystal 41 is located in the space enclosed by the first substrate 11, the second substrate 12, and the frame glue intermediate.

[0079] In other embodiments, the first substrate 11 can also be provided with a color film layer, a common electrode layer, and a second alignment layer, and the second substrate 12 can be provided with a thin film transistor array layer, an insulating layer, a first alignment layer, and a spacer.

[0080] Further, in step S40, the frame glue intermediate connected between the first substrate 11 and the second substrate 12 is subjected to a curing process, so that the frame glue intermediate is cured to form the frame glue 20, and the frame glue 20 is connected between the first substrate 11 and the second substrate 12.

[0081] In some embodiments, the process of curing the frame glue intermediate includes photo-curing and thermal curing of the frame glue intermediate.

[0082] The photo-curing of the frame glue intermediate causes at least part of the acrylic small molecules to polymerize to form acrylic macromolecules, so that the frame glue intermediate is basically shaped and has a certain adhesion.

[0083] The frame adhesive intermediate is subjected to a heat curing process, part of the epoxy resin is polymerized, and part of the unreacted acrylic small molecules is also polymerized to form an acrylic polymer, so that the frame adhesive intermediate reacts to form the frame adhesive 20, and the frame adhesive 20 has stronger adhesion, and the first substrate 11 and the second substrate 12 are bonded together.

[0084] In some embodiments, the light curing process has a light accumulation amount less than or equal to 3000 mj, the heat curing process has a temperature less than or equal to 120°C, and the heat curing process has a time length less than 50 min. Generally, the temperature of the frame adhesive during the heat curing process is greater than 120°C, and the time length is greater than or equal to 50 min, so that the epoxy resin in the frame adhesive is fully polymerized. However, the embodiments of the present application need to obtain an epoxy resin polymer with a smaller curing rate, and therefore, the temperature and time length of the heat curing process are reduced in the embodiments of the present application.

[0085] In some embodiments, in the step of subjecting the frame adhesive intermediate to a curing process, the curing rate of the epoxy resin polymer is greater than or equal to 40% and less than or equal to 50%, for example, it can be 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49% or 50%. The embodiments of the present application need to maintain the mechanical strength of the frame adhesive 20 while improving the flexibility of the frame adhesive 20, and therefore, the curing rate of the epoxy resin polymer needs to be greater than or equal to 40% to avoid the frame adhesive 20 from being unable to stably connect between the first substrate 11 and the second substrate 12 due to insufficient mechanical strength.

[0086] In some embodiments, the curing rate of the epoxy resin polymer is less than the curing rate of the acrylic. Since the curing rate of the epoxy resin has been reduced in the embodiments of the present application, in order to ensure the mechanical strength and stability of the frame adhesive 20, the curing rate of the acrylic is at least maintained from being reduced in the embodiments of the present application. The curing rate of the acrylic is greater than or equal to 85% and less than or equal to 92%, for example, it can be 85%, 86%, 87%, 88%, 89%, 90%, 91% or 92%.

[0087] It should be noted that the raw material components of the frame glue 20 include epoxy resin, acrylic small molecule, photoinitiator and thermal initiator. The embodiments of the present application improve the flexibility of the frame glue 20 by reducing the curing rate of the epoxy resin polymer, without improving the flexibility of the frame glue 20 by reducing the curing rate of the acrylic. In the curing process of the frame glue 20, which generally includes two stages of photocuring and thermal curing, the acrylic small molecule mainly undergoes polymerization reaction in the photocuring stage. It is found through verification that if the curing rate of the acrylic small molecule is reduced, the photoinitiator will precipitate, thereby polluting the liquid crystal 41. Therefore, in the embodiments of the present application, by making the acrylic have a larger curing rate and reducing the curing rate of the epoxy resin, the precipitation of the photoinitiator can be effectively reduced, the probability of pollution of the liquid crystal 41 can be reduced, and on this basis, the flexibility of the frame glue 20 can be increased, and the probability of micro-cracks at the interface between the frame glue 20 and the first substrate 11 and the second substrate 12 can be reduced, and the probability of water vapor entering the display panel 10 can be reduced.

[0088] In some embodiments, the curing rate provided by the embodiments of the present application can be determined according to the infrared spectrum of the cured frame glue and raw glue; wherein the determination of the curing rate of the frame glue according to the infrared spectrum of the cured frame glue and raw glue can specifically include: integrating the characteristic functional group peaks in the infrared spectrum of the cured frame glue sample and the raw glue respectively, and then calculating, the calculation formula is as follows:

[0089]

[0090] Wherein, X represents the curing rate of the frame glue, S1 represents the peak area of the target characteristic functional group of the frame glue sample, S2 represents the peak area of the reference functional group of the frame glue sample, S3 represents the peak area of the target characteristic functional group of the raw glue, and S4 represents the peak area of the reference functional group of the raw glue. The reference peak functional group is a benzene ring, and the target peak functional group can be an epoxy group or an acrylic group (acrylic).

[0091] In addition, the embodiments of the present application provide comparative examples 1, 2 and 3, and examples 1 to 6 to verify the performance of the above-mentioned frame glue 20.

[0092] In comparative example 1, the light curing treatment SUV light accumulation amount is 3000 mj, the temperature in the thermal curing treatment process is 120°C, the duration of the thermal curing treatment is 50 min, and the performance of the frame glue in comparative example 1 is tested.

[0093] In comparative example 2, the light curing treatment SUV light accumulation amount is 3000 mj, the temperature in the thermal curing treatment process is 120°C, the duration of the thermal curing treatment is 50 min, and the performance of the frame glue in comparative example 2 is tested.

[0094] In Comparative Example 3, the light curing treatment SUV light accumulation amount was 1500 mj, the temperature during the heat curing treatment was 120°C, the heat curing treatment time was 50 min, and the performance of the frame glue in Comparative Example 3 was tested.

[0095] In Example 1, the light curing treatment SUV light accumulation amount was 3000 mj, the temperature during the heat curing treatment was 120°C, the heat curing treatment time was 30 min, and the performance of the frame glue in Example 1 was tested.

[0096] In Example 2, the light curing treatment SUV light accumulation amount was 3000 mj, the temperature during the heat curing treatment was 120°C, the heat curing treatment time was 30 min, and the performance of the frame glue in Example 2 was tested.

[0097] In Example 3, the light curing treatment SUV light accumulation amount was 3000 mj, the temperature during the heat curing treatment was 120°C, the heat curing treatment time was 30 min, and the performance of the frame glue in Example 3 was tested.

[0098] In Example 4, the light curing treatment SUV light accumulation amount was 1500 mj, the temperature during the heat curing treatment was 120°C, the heat curing treatment time was 30 min, and the performance of the frame glue in Example 4 was tested.

[0099] In Example 5, the light curing treatment SUV light accumulation amount was 1500 mj, the temperature during the heat curing treatment was 120°C, the heat curing treatment time was 30 min, and the performance of the frame glue in Example 5 was tested.

[0100] In Example 6, the light curing treatment SUV light accumulation amount was 1500 mj, the temperature during the heat curing treatment was 120°C, the heat curing treatment time was 30 min, and the performance of the frame glue in Example 6 was tested.

[0101] Through the testing of Comparative Examples 1, 2 and 3 and Examples 1 to 6, the following Table 1 data was obtained.

[0102] Table 1 test result table

[0103]

[0104] Among them, the elasticity of the frame glue in the above comparative examples and examples can be tested by DMA (dynamic mechanical analysis).

[0105] Then, the force test method: using a simple glass cross, a fixed size of frame glue is coated at the cross position, and the tensile force of the frame glue under different conditions is tested by using the needle method.

[0106] Moisture permeability test method: prepare a frame adhesive film with a thickness less than 300 um, fix the frame adhesive film in a moisture permeable cup, put 10g CaCl2 in the moisture permeable cup, and place it in a high temperature and high humidity (85℃ / 85%RH), weigh every 24 hours, fit the T0 / T24… / T168 weight data to form a linear trend, calculate the moisture permeability, moisture permeability = 24*K(fitting slope)*D(actual film thickness) / 300, unit: g / m 2 wherein K refers to the slope of the linear trend made by the mass change of CaCl2 collected at different times, and D refers to the actual film thickness of the frame adhesive film prepared for testing moisture permeability.

[0107] As can be seen from the above table one, by the processing time in the heat curing process in the embodiments of the present application, the curing rate of the epoxy resin polymer can be effectively reduced, and the water vapor test under three conditions shows that the frame adhesive 20 provided by the embodiments of the present application can effectively improve the water resistance of the display panel 10.

[0108] In summary, by reducing the curing rate of the epoxy resin polymer in the frame adhesive 20, the elastic modulus of the frame adhesive 20 can be reduced, the flexibility of the frame adhesive 20 can be increased, the probability of micro-cracks at the connecting interface between the frame adhesive 20 and the first substrate 11 and the second substrate 12 can be effectively reduced, the probability of water vapor invading the display panel 10 at the connecting interface between the frame adhesive 20 and the first substrate 11 and the second substrate 12 can be reduced, the water resistance of the display panel 10 is improved, the probability of adverse phenomena caused by water vapor invasion of the display panel 10 is reduced, and the stability of the display panel 10 is improved.

[0109] In addition, the embodiments of the present application also provide a display device, which comprises the display panel or is made of the display panel prepared by the manufacturing method of the display panel.

[0110] In some embodiments, the display device further comprises a backlight module, and the display panel is arranged on the light emitting side of the backlight module.

[0111] It can be understood that, since the display device provided by the embodiments of the present application contains the same display panel as in the above embodiments, the display device has the same beneficial effects as the display panel, which will not be described here.

[0112] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0113] The display panel, the manufacturing method thereof and the display device provided by the embodiments of the present application are described in detail above, and the principles and implementation manners of the present application are described by applying specific examples. The above embodiment descriptions are only used to help understand the technical solutions of the present application and the core ideas thereof. It should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features thereof can be replaced equivalently, and the modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, comprising: a first substrate; a second substrate, disposed opposite to the first substrate; a sealant, connected between the first substrate and the second substrate; and a liquid crystal, disposed in a space enclosed by the first substrate, the second substrate and the sealant; wherein the sealant comprises an epoxy resin polymer and an acrylic, and a curing rate of the epoxy resin polymer is less than or equal to 50%. The curing rate of the epoxy resin polymer is greater than or equal to 40%.

2. The display panel of claim 1, wherein, The curing rate of the epoxy resin polymer is less than the curing rate of the acrylic.

3. The display panel of claim 1, wherein, The curing rate of the acrylic is greater than or equal to 85% and less than or equal to 92%.

4. The display panel of claim 1, wherein, The elastic modulus of the sealant is greater than or equal to 3.1 Gpa and less than or equal to 3.4 Gpa.

5. The display panel according to any one of claims 1 to 4, wherein, 7.A method for manufacturing a display panel, comprising the steps of:

6. The display panel according to any one of claims 1 to 4, wherein, The moisture permeability of the frame seal is less than or equal to 57 g / m 2 . forming a sealant intermediate on a first substrate; disposing a liquid crystal on the first substrate, wherein the liquid crystal is located in an area enclosed by the sealant intermediate; disposing a second substrate on the first substrate; and curing the sealant intermediate connected between the first substrate and the second substrate, wherein the sealant formed after the curing of the sealant intermediate comprises an epoxy resin polymer and an acrylic, and a curing rate of the epoxy resin polymer is less than or equal to 50%. The sealant intermediate comprises an acrylic small molecule, an epoxy resin, a photo initiator and a thermal initiator.

8. The method of manufacturing a display panel according to claim 7, wherein The curing of the sealant intermediate connected between the first substrate and the second substrate comprises: photo-curing the sealant intermediate, at least part of the acrylic small molecule is polymerized; and thermal-curing the sealant intermediate, part of the epoxy resin is polymerized. The temperature of the thermal-curing is less than or equal to 120℃, and the time of the thermal-curing is less than 50 minutes.

9. The method of manufacturing a display panel according to claim 8, wherein, The light dose of the photo-curing is less than or equal to 3000 mj.

10. The method of manufacturing a display panel according to claim 8, wherein, In the step of curing the sealant intermediate connected between the first substrate and the second substrate, the curing rate of the epoxy resin polymer is greater than or equal to 40%, and the curing rate of the acrylic is greater than or equal to 85% and less than or equal to 92%.

11. The method of manufacturing a display panel according to claim 7, wherein, The curing rate of the epoxy resin polymer is less than the curing rate of the acrylic.

12. The method of manufacturing a display panel according to claim 7, wherein, The elastic modulus of the sealant is greater than or equal to 3.1 Gpa and less than or equal to 3.4 Gpa.

13. The method of manufacturing a display panel according to claim 7, wherein, 15.A display device, comprising a display panel, the display panel comprising:

14. The method of manufacturing a display panel according to claim 7, wherein, The moisture permeability of the frame seal is less than or equal to 57 g / m 2 . a first substrate; a second substrate, disposed opposite to the first substrate; a sealant, connected between the first substrate and the second substrate; and a liquid crystal, disposed in a space enclosed by the first substrate, the second substrate and the sealant; wherein the sealant comprises an epoxy resin polymer and an acrylic, and a curing rate of the epoxy resin polymer is less than or equal to 50%. The curing rate of the epoxy resin polymer is greater than or equal to 40%. The curing rate of the epoxy resin polymer is less than the curing rate of the acrylic.

16. The display device of claim 15, wherein, The curing rate of the acrylic is greater than or equal to 85% and less than or equal to 92%.

17. The display device of claim 15, wherein, The elastic modulus of the sealant is greater than or equal to 3.1 Gpa and less than or equal to 3.4 Gpa.

18. The display device of claim 15, wherein, ​ 19. The display device of claim 15, wherein, The frame glue has an elastic modulus greater than or equal to 3.1 Gpa and less than or equal to 3.4 Gpa.

20. The display device of claim 15, wherein, The moisture permeability of the frame seal is less than or equal to 57 g / m 2 .

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