Antenna packaging structure and manufacturing method therefor

Abstract

The present invention provides an antenna packaging structure and a manufacturing method therefor. The manufacturing method comprises the following steps: providing an electrical connection base layer comprising a redistribution layer; providing an antenna composite structure layer comprising a first antenna layer, an intermediate antenna layer and a second antenna layer which are arranged in sequence, wherein the first antenna layer is provided with a first antenna unit, the intermediate antenna layer is provided with an air hole, the second antenna layer is provided with a second antenna unit, and the first antenna unit and the second antenna unit are arranged oppositely on two sides of the air hole to form a first air antenna; and placing the antenna composite structure layer above the electrical connection base layer and connecting the first antenna layer and the redistribution layer. In the manufacturing method, the redistribution layer and the antenna composite structure layer are separately manufactured and then are connected, thereby obtaining an air-coupled antenna structure having good reliability and sealing performance while effectively ensuring the overall performance of the antenna packaging structure. The antenna packaging structure is a multi-layer composite structure provided with an air cavity inside, and the anti-interference performance of signal transmission and the reliability of the overall structure are good.

Description

An antenna packaging structure and a manufacturing method thereof TECHNICAL FIELD

[0001] The present application belongs to the field of wireless communication and antenna packaging structure and manufacturing technology, and relates to an antenna packaging structure and a manufacturing method thereof. BACKGROUND

[0002] The antenna packaging structure refers to the packaging technology of integrating the antenna with other parts of the electronic device, which plays a crucial role in the performance, reliability and miniaturization of the antenna.

[0003] The multilayer antenna packaging structure is one of the key technologies to realize high-performance and miniaturized wireless communication devices. In some cases, the packaged antenna usually adopts a multilayer structure, which usually includes multiple layers of dielectric materials and metal layers to achieve more compact size and higher design freedom. These structural layers include antenna layers, RF circuit layers, shielding layers, etc. When designing, the transmission path and attenuation of signals between different layers need to be considered to improve signal integrity and reduce signal attenuation, while also considering avoiding mutual interference between different layers to ensure the overall performance of the system.

[0004] In short, the multilayer antenna packaging structure is an important direction for the development of future wireless communication technology. Through careful design of the multilayer structure, high-performance, miniaturized and cost-effective wireless communication devices can be realized. However, the current multilayer antenna packaging structure has poor structural reliability, which leads to a situation where its service life is shorter than the designed life, which seriously restricts the large-scale application of the multilayer antenna packaging structure.

[0005] Therefore, how to provide an antenna packaging structure and a manufacturing method thereof to improve the reliability of the multilayer antenna packaging structure has become an important technical problem to be solved by the technical personnel in the field.

[0006] It should be noted that the above introduction to the technical background is only to facilitate a clear and complete description of the technical solutions of the present application, and to facilitate the understanding of the technical personnel in the field. The above technical solutions cannot be considered as known by the technical personnel in the field only because they are described in the background section of the present application. SUMMARY

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide an antenna packaging structure and a manufacturing method thereof to solve the problem that the service life of the multilayer antenna packaging structure is shorter than the designed life due to poor structural reliability, which seriously restricts the large-scale application of the multilayer antenna packaging structure.

[0008] To achieve the above-mentioned purpose and other related purposes, the present application provides a manufacturing method of an antenna packaging structure, comprising the following steps:

[0009] providing an electrical connection base layer, the electrical connection base layer comprising a redistribution layer;

[0010] providing an antenna composite structure layer, the antenna composite structure layer comprising a first antenna layer, an intermediate antenna layer and a second antenna layer arranged in sequence, the first antenna layer being provided with a first antenna element, the intermediate antenna layer being provided with an air hole, the second antenna layer being provided with a second antenna element, the first antenna element and the second antenna element being arranged on opposite sides of the air hole to form a first air antenna;

[0011] arranging the antenna composite structure layer above the electrical connection base layer and connecting the first antenna layer and the redistribution layer.

[0012] Optionally, the antenna composite structure layer further comprises a first frame layer and a second frame layer, the first frame layer being arranged between the first antenna layer and the intermediate antenna layer to form a first air cavity, the second frame layer being arranged between the intermediate antenna layer and the second antenna layer to form a second air cavity, the first air cavity and the second air cavity being communicated via the air hole.

[0013] Optionally, providing the antenna composite structure layer comprises the steps of:

[0014] providing the first antenna layer and arranging the first antenna layer with a side provided with the first antenna element facing upwards;

[0015] forming the first frame layer above the first antenna layer, the first frame layer exposing the first antenna element;

[0016] providing the intermediate antenna layer and arranging the intermediate antenna layer above the first frame layer, the air hole exposing at least a part of the first antenna element;

[0017] forming the second frame layer above the intermediate antenna layer, the second frame layer exposing the air hole;

[0018] providing the second antenna layer and arranging the second antenna layer above the second frame layer with a side provided with the second antenna element facing the first antenna layer, at least a part of the second antenna element being opposite to at least a part of the first antenna element.

[0019] Optionally, the material of the first frame layer comprises a dry film, and / or the material of the second frame layer comprises a dry film.

[0020] Optionally, the intermediate antenna layer further comprises an intermediate antenna unit, the intermediate antenna unit is disposed on the inner wall of the air hole and has an air gap therein, and the intermediate antenna unit and the air gap form a second air antenna.

[0021] Optionally, forming the intermediate antenna layer comprises the following steps:

[0022] providing an intermediate substrate;

[0023] forming an air hole in the intermediate substrate;

[0024] carrying out electroplating to form the intermediate antenna unit based on the inner wall of the air hole.

[0025] Optionally, the method for connecting the first antenna layer and the redistribution layer comprises at least one of a hybrid bonding method and a thermal compression bonding method.

[0026] Optionally, the electrically connecting base layer further comprises a support layer, and the support layer is located below the redistribution layer.

[0027] Optionally, the manufacturing method further comprises the following steps:

[0028] removing the support layer to expose one side of the redistribution layer away from the antenna composite structure layer;

[0029] disposing a functional chip on one side of the redistribution layer away from the antenna composite structure layer, and the functional chip is electrically connected to the redistribution layer and the antenna composite structure layer.

[0030] Optionally, the electrically connecting base layer further comprises a release layer between the redistribution layer and the support layer, and the method for removing the support layer comprises laser debonding based on the release layer to separate the support layer from the redistribution layer.

[0031] The application further provides an antenna packaging structure, comprising:

[0032] a redistribution layer;

[0033] an antenna composite structure layer located above the redistribution layer and connected to the redistribution layer, the antenna composite structure layer comprising a first antenna layer, an intermediate antenna layer and a second antenna layer disposed in sequence, the first antenna layer being provided with a first antenna unit, the intermediate antenna layer being provided with an air hole, and the second antenna layer being provided with a second antenna unit, the first antenna unit and the second antenna unit being disposed on two sides of the air hole to form a first air antenna.

[0034] Optionally, the antenna composite structure layer further comprises a first frame layer and a second frame layer, the first frame layer is located between the first antenna layer and the intermediate antenna layer to form a first air cavity, the second frame layer is located between the intermediate antenna layer and the second antenna layer to form a second air cavity, and the first air cavity and the second air cavity are communicated through the air hole.

[0035] Optionally, the material of the first frame layer comprises a dry film, and / or the material of the second frame layer comprises a dry film.

[0036] Optionally, the intermediate antenna layer further comprises an intermediate antenna unit, the intermediate antenna unit is arranged on the inner wall of the air hole and has an air gap in the intermediate antenna unit, and the intermediate antenna unit and the air gap form a second air antenna.

[0037] Optionally, the connection method of the first antenna layer and the redistribution layer comprises at least one of a hybrid bonding method and a hot-press bonding method.

[0038] Optionally, the antenna packaging structure further comprises a functional chip, the functional chip is arranged on the side of the redistribution layer away from the antenna composite structure layer, and the functional chip is electrically connected to the antenna composite structure layer based on the redistribution layer.

[0039] As described above, the manufacturing method of the antenna packaging structure of the present application, by separately manufacturing the redistribution layer and the antenna composite structure layer, and then connecting the antenna composite structure layer to the redistribution layer, can effectively guarantee the overall performance of the antenna packaging structure while obtaining an air-coupled antenna structure with good reliability and sealing performance. The overall manufacturing process has simple process steps and is easy to realize large-scale production. According to actual needs, the size of the air hole in the intermediate antenna layer of the antenna composite structure layer can be accurately controlled to further manufacture an antenna packaging structure with a horizontal air-coupled antenna, effectively expanding the application scenarios and fields of the antenna packaging structure. The antenna packaging structure of the present application comprises a redistribution layer and an antenna composite structure layer connected thereto, which is sequentially provided with a first antenna layer, an intermediate antenna layer and a second antenna layer. The antenna units in the first antenna layer and the second antenna layer are arranged opposite to each other in the vertical direction based on the air hole in the intermediate antenna layer to achieve effective radiation of the transmitted signals in the vertical direction. The overall antenna packaging structure is a multi-layer composite structure with an air cavity inside, and the anti-interference performance of the signal transmission process and the overall structural reliability are good. By accurately controlling the size of the air cavity to manufacture antenna units on the inner wall of the air cavity, a horizontal air antenna is constructed to further realize effective radiation of the transmitted signals in the horizontal direction, expanding the application scenarios of the antenna packaging structure. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 shows the step flow chart of the manufacturing method of the antenna packaging structure of the present application.

[0041] Figure 2 shows a cross-sectional view of the structure obtained after performing step S1 in the method of manufacturing the antenna package structure of the present application.

[0042] Figure 3 shows a cross-sectional view of the structure obtained after providing the first antenna layer in the method of manufacturing the antenna package structure of the present application.

[0043] Figure 4 shows a cross-sectional view of the structure obtained after forming air holes in the intermediate substrate in the method of manufacturing the antenna package structure of the present application.

[0044] Figure 5 shows a cross-sectional view of the structure obtained after forming the intermediate antenna layer in the method of manufacturing the antenna package structure of the present application.

[0045] Figure 6 shows a cross-sectional view of the structure obtained after performing step S2 in the method of manufacturing the antenna package structure of the present application.

[0046] Figure 7 shows a cross-sectional view of the structure obtained after performing step S3 in the method of manufacturing the antenna package structure of the present application.

[0047] Figure 8 shows a cross-sectional view of the structure obtained after removing the support layer in the method of manufacturing the antenna package structure of the present application.

[0048] Figure 9 shows a cross-sectional view of the antenna package structure of the present application in Example 2.

[0049] Figure 10 shows a cross-sectional view of the antenna package structure of the present application in Example 3.

[0050] 10 electrically connecting base layer 11 re-wiring layer 111 dielectric layer 112 electrically connecting unit 12 support layer 13 releasing layer 20 antenna composite structure layer 21 first antenna layer 211 first antenna unit 212 first substrate 213 metal connecting unit 22 intermediate antenna layer 221 air hole 222 intermediate antenna unit 223 air gap 224 intermediate substrate 23 second antenna layer 231 second antenna unit 24 first frame layer 241 first air cavity 25 second frame layer 251 second air cavity 30 functional chip S1-S3 step DETAILED DESCRIPTION

[0051] Other advantages and benefits of the present application will become apparent to those skilled in the art upon consideration of the disclosure or can be learned by practice of the application. The present application can be realized and achieved by means of the structures and combinations particularly pointed out in the specification and claims hereof. Various modifications in detail of the application can be made without departing from the spirit thereof, the application is to cover and embrace any and all such modifications and changes as come within the scope and spirit of the present application.

[0052] Please refer to FIGS. 1-10. It is to be noted that the diagrams provided in the embodiments only schematically illustrate the basic concept of the present application, and thus only the components related to the present application are shown in the diagrams, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and ratio of the components in actual implementation can be arbitrarily changed, and the layout of the components can be more complex.

[0053] Embodiment One

[0054] The present embodiment provides a manufacturing method of an antenna packaging structure. Please refer to FIG. 1, which shows a flowchart of the manufacturing method, including the following steps:

[0055] S1: providing an electrically connecting base layer, wherein the electrically connecting base layer includes a redistribution layer;

[0056] S2: providing an antenna composite structure layer, wherein the antenna composite structure layer includes a first antenna layer, an intermediate antenna layer and a second antenna layer arranged in sequence, the first antenna layer is provided with a first antenna unit, the intermediate antenna layer is provided with an air hole, the second antenna layer is provided with a second antenna unit, and the first antenna unit and the second antenna unit are arranged on both sides of the air hole to form a first air antenna;

[0057] S3: placing the antenna composite structure layer above the electrically connecting base layer and connecting the first antenna layer and the redistribution layer.

[0058] First, please refer to FIG. 2, step S1 is performed to provide an electrically connecting base layer 10, wherein the electrically connecting base layer 10 includes a redistribution layer 11.

[0059] For example, the redistribution layer 11 includes a dielectric layer 111 and an electrically connecting unit 112 embedded in the dielectric layer 111, and the material of the dielectric layer 111 includes PI. Further, the redistribution layer 11 includes at least one of a single-layer structure and a multi-layer structure.

[0060] For example, the electrically connecting base layer 10 further includes a support layer 12 located below the redistribution layer 11, and the support layer 12 is used to provide a supporting effect for the manufacturing and connection of the redistribution layer 11. In the present embodiment, the support layer 12 includes a glass substrate.

[0061] As an example, the electrically connecting base layer 10 further comprises a release layer 13 between the redistribution layer 11 and the support layer 12, the material of the release layer 13 comprises PI. The release layer serves as an intermediate layer between the support layer and the redistribution layer to facilitate the subsequent smooth separation of the two without damaging the electrically connecting layer and the support layer structure, which can ensure the structure of the electrically connecting layer is not affected, and the structure integrity of the support layer is ensured to realize recycling and reduce production cost.

[0062] The formation of the electrically connecting base layer 10 comprises the following steps: providing a support layer 12, sequentially forming a release layer 13 and a dielectric layer 111 above the support layer 12, the dielectric layer 111 is formed by coating; patterning the dielectric layer 111 to form a filling opening; forming a conductive material layer above the dielectric layer 111, the conductive material layer also fills into the filling opening; planarizing the conductive material layer and retaining the part in the filling opening as an electrically connecting unit 112.

[0063] Please refer to FIG. 3 to FIG. 6 again, step S2 is performed to provide an antenna composite structure layer 20, as shown in FIG. 6, the antenna composite structure layer 20 comprises a first antenna layer 21, an intermediate antenna layer 22 and a second antenna layer 23 which are sequentially arranged (vertically arranged), the first antenna layer 21 is provided with a first antenna unit 211, the intermediate antenna layer 22 is provided with an air hole 221, the second antenna layer 23 is provided with a second antenna unit 231, the first antenna unit 211 and the second antenna unit 231 are oppositely arranged on both sides (vertically on both sides) of the air hole 221 to form a first air antenna (i.e. double-sided vertical air antenna structure, please refer to FIG. 9).

[0064] As an example, the number of the first antenna unit 211, the second antenna unit 231 and the air hole 221 is multiple, the number of the first antenna unit 211 and the second antenna unit 231 is equal to or less than the number of the air hole 221, and correspondingly, the number of the first air antenna is consistent with the number of the first antenna unit 211 and the second antenna unit 231.

[0065] As an example, as shown in FIG. 6, the antenna composite structure layer 20 further comprises a first frame layer 24 and a second frame layer 25, the first frame layer 24 is located between the first antenna layer 21 and the intermediate antenna layer 22 to form a first air cavity 241, the second frame layer 25 is located between the intermediate antenna layer 22 and the second antenna layer 23 to form a second air cavity 251, the first air cavity 241 and the second air cavity 251 are communicated through the air hole 221.

[0066] As an example, the material of the first frame layer 24 includes a dry film, and / or the material of the second frame layer 25 includes a dry film. In this embodiment, the material of the first frame layer and the second frame layer is a dry film, which has certain mechanical strength and chemical stability and can be used as a frame. Since the antenna packaging structure of this embodiment is a multi-layer composite structure and needs to be constructed as a structure with a gap inside, the traditional coating and exposure process cannot be used, otherwise the glue will enter the air holes inside the antenna packaging structure, and it cannot be easily removed completely in the subsequent manufacturing process, resulting in the performance of the final manufactured antenna packaging structure being much lower than the expected performance. Of course, in other embodiments, the material of the frame layer can also be other suitable materials that do not use liquid film forming such as coating.

[0067] Further, the thickness of the first frame layer 24 is in the range of 20-50 μm, including but not limited to 25 μm, 30 μm, 35 μm, 40 μm, and / or the thickness of the second frame layer 25 is in the range of 20-50 μm, including but not limited to 25 μm, 30 μm, 35 μm, 40 μm. The first frame layer and the second frame layer are reasonably adjusted to meet the actual performance requirements of the first air antenna inside the antenna packaging structure.

[0068] As an example, as shown in FIG. 6, the antenna composite structure layer 20 is provided by the following steps:

[0069] The first antenna layer 21 is provided, and one side of the first antenna layer 21 provided with the first antenna unit 211 is placed upward;

[0070] The first frame layer 24 is formed above the first antenna layer 21, and the first frame layer 24 exposes the first antenna unit 211;

[0071] The intermediate antenna layer 22 is provided and arranged above the first frame layer 24, and the air hole 221 exposes at least a part of the first antenna unit 211;

[0072] The second frame layer 25 is formed above the intermediate antenna layer 22, and the second frame layer 25 exposes the air hole 221;

[0073] The second antenna layer 23 is provided, and one side of the second antenna layer 23 provided with the second antenna unit 231 is arranged above the second frame layer 25, and at least a part of the second antenna unit 231 is opposite to at least a part of the first antenna unit 211.

[0074] As an example, the connection between the intermediate antenna layer 22 and the first frame layer 24 includes at least one of bonding, thermal compression bonding, direct bonding; the connection between the second antenna layer 23 and the second frame layer 25 includes at least one of bonding, thermal compression bonding, direct bonding, and of course, the connection between the above-mentioned structure layers can also select other appropriate ways under the premise of ensuring the stability of the connection.

[0075] As an example, as shown in FIG. 3, a cross-sectional structure diagram of the first antenna layer is shown, the first antenna layer 21 further includes a first substrate 212, the first antenna unit 211 is arranged on the first substrate 212, further, the first antenna unit 211 is connected to the upper surface of the first substrate 212, or the first antenna unit 211 is partially embedded in the first substrate 212 and partially protrudes out of the first substrate 212, or the first antenna unit 211 is completely embedded in the first substrate 212 and only one surface is exposed, in this embodiment, the first antenna unit 211 corresponds to the third case, which can effectively reduce the overall volume of the packaging structure and improve the integration on the basis of realizing signal transmission, and of course, the detailed structure between the first antenna unit and the first substrate can be adjusted based on actual needs in other embodiments.

[0076] As an example, as shown in FIG. 3, the first antenna layer 21 further includes a metal connection unit 213, the metal connection unit 213 is embedded in the first substrate 212 and connected with the first antenna unit 211, and the metal connection unit is used to realize the electrical connection between the antenna composite structure layer 20 and the redistribution layer 10.

[0077] Further, the first antenna layer 21 includes the following steps: providing a first substrate 212; forming a first mask layer (not shown in the figure) on the first substrate 212 (on the first surface of the first substrate 212) and patterning the first mask layer; based on the first mask layer after patterning, the first substrate 212 is etched for the first time to form a first opening; the first antenna unit 211 is formed in the first opening; the first substrate 212 forming the first antenna structure is inverted; a second mask layer (not shown in the figure) is formed on the first substrate 212 (on the second surface of the first substrate 212) and the second mask layer is patterned; based on the second mask layer after patterning, the second substrate is etched to form a second opening, the second opening exposes at least a part of the first antenna unit 211; the metal connection unit 213 is formed in the second opening, and the above-mentioned steps further include the step of removing the first mask layer and the second mask layer. Of course, the above-mentioned manufacturing steps are only described as an example, and in other embodiments, other appropriate methods can also be used to manufacture the first antenna layer.

[0078] As an example, the material of the first substrate 212 includes glass, the thickness of the first substrate 212 ranges from 100 to 300 μm, including but not limited to 120 μm, 150 μm, 200 μm and 250 μm, the thickness of the first antenna unit 211 ranges from 5 to 15 μm, including but not limited to 8 μm, 10 μm and 12 μm, the reason for using glass as the main structure of the antenna layer is that glass has a good dissipation factor (DF value), which can reduce signal interference and attenuation, sufficient rigidity and good solder matching thermal expansion coefficient, which can well bear the antenna units attached thereto to have good structure and use stability.

[0079] As an example, forming the first frame layer 24 includes the following steps: peeling off the dry film from its protective film and uniformly pressing and pasting it on the first antenna layer 21; exposing and developing the dry film to pattern the dry film to obtain the first frame layer 24, the projection of the first frame layer 24 on the first antenna layer 21 surrounds all the first antenna units 211 in the first antenna layer 21 to form the first air cavity 241 in the subsequent structure, the steps of forming the second frame layer 25 are similar and will not be repeated.

[0080] As an example, referring to FIG. 3 and FIG. 6, the second antenna layer 23 further includes a second substrate (not labeled), the second antenna unit 231 is arranged on the second substrate, further, the positional relationship between the second antenna unit 231 and the second substrate is basically similar to the positional relationship between the first antenna unit 211 and the first substrate 212, which will not be repeated, and is set based on actual needs.

[0081] As an example, the material of the second substrate includes glass, the thickness of the second substrate ranges from 100 to 300 μm, including but not limited to 120 μm, 150 μm, 200 μm and 250 μm, the thickness of the second antenna unit 231 ranges from 5 to 15 μm, including but not limited to 8 μm, 10 μm and 12 μm.

[0082] As an example, referring to FIG. 4 and FIG. 5, the intermediate antenna layer 22 includes an intermediate substrate 224, and the air hole 221 vertically penetrates the intermediate substrate 224.

[0083] As an example, the width dimension (shown as w in FIG. 4) of the air hole 221 is 100 to 5000 μm, including but not limited to 300 μm, 500 μm, 800 μm, 2000 μm, 3000 μm and 4000 μm.

[0084] In an example, as shown in FIG. 5, the intermediate antenna layer 22 further comprises an intermediate antenna unit 222, which is disposed on the inner wall of the air hole 221 and has an air gap 223 therein, and the intermediate antenna unit 222 and the air gap 223 form a second air antenna. The air gap 223 is equivalent to the space formed after the air hole 221 is reduced after partially filling the intermediate antenna unit 222 on the inner wall of the air hole 221. It should be noted that when the second air antenna structure needs to be constructed, the width of the air hole needs to be reasonably set based on the working performance (such as bandwidth) of the second air antenna, and is preferably 200-5000 μm, including but not limited to 1200 μm, 2400 μm, etc. In addition, when the intermediate antenna unit 222 is provided, the first air antenna is formed based on the first antenna unit 211, the air gap 223, and the second antenna unit 231.

[0085] Further, referring to FIGS. 4 and 5, when the intermediate antenna layer 22 further comprises an intermediate antenna unit 222, forming the intermediate antenna layer 22 comprises the following steps: as shown in FIG. 4, providing an intermediate substrate 224; forming an air hole 221 in the intermediate substrate 224 (in this step, the horizontal size w of the air hole needs to be accurately controlled); as shown in FIG. 5, electroplating to form the intermediate antenna unit 222 based on the inner wall of the air hole 221, and the intermediate antenna unit 222 will also be partially attached to the surfaces on both sides of the opening of the air hole 221 due to the characteristics of the electroplating process.

[0086] As an example, the material of the intermediate substrate 224 includes glass, the thickness of the intermediate substrate 224 ranges from 100 to 800 μm, including but not limited to 200 μm, 300 μm, 500 μm, and 600 μm, and the thickness of the intermediate antenna unit 22 ranges from 5 to 15 μm, including but not limited to 8 μm, 10 μm, and 12 μm.

[0087] Referring to FIG. 7, in step S3, the antenna composite structure layer 20 is placed above the electrically connected base layer 10, and the first antenna layer 21 and the redistribution layer 11 are connected.

[0088] As an example, the method for connecting the first antenna layer 21 and the redistribution layer 11 comprises at least one of a hybrid bonding method and a thermal compression bonding method.

[0089] As an example, referring to FIGS. 8-9, the manufacturing method further comprises the following steps:

[0090] As shown in FIG. 8, the support layer 12 is removed to expose the side of the redistribution layer 11 facing away from the antenna composite structure layer 20;

[0091] As an example, in the case of providing the release layer 13, the method for removing the support layer 12 includes laser debonding based on the release layer 13 to separate the support layer 12 from the redistribution layer 11. Specifically, the laser debonding is performed by applying a laser beam to the release layer 13 to soften the release layer 13 to fall off from the redistribution layer 11 to remove the support layer 12. The laser debonding is selected for the following reasons: the laser debonding has high accuracy and controllability, and can be performed at room temperature without causing negative effects on the redistribution layer 11 and other structure layers. Although the thermal debonding, chemical debonding, thermal slip debonding, and mechanical peeling can also achieve the purpose of removing the support layer 12, the dielectric layer 111 in the redistribution layer 11 is prone to warping and reliability problems when subjected to high-temperature process environment for multiple times. In addition, although not shown in the embodiment, the antenna packaging structure also includes other material layers that are sensitive to high-temperature environment. Therefore, the methods requiring high-temperature conditions are not suitable for removing the support layer 12 in the embodiment. The mechanical peeling and chemical debonding are prone to cause damage or destruction to other structure layers. Therefore, the laser debonding is preferred in the embodiment.

[0092] As shown in FIG. 9, the functional chip 30 is arranged on the redistribution layer 11 away from the antenna composite structure layer 20, and the functional chip 30 is electrically connected to the redistribution layer 11 and the antenna composite structure layer 20. In the embodiment, the functional chip 30 is a radio frequency antenna, and in other embodiments, the functional chip 30 can also be other suitable chips according to actual needs.

[0093] Further, as shown in FIG. 9, the functional chip 30 is connected to the redistribution layer 11 in the flip chip mode, which can simplify the internal electrical connection structure of the antenna packaging structure and reduce interference and loss in the signal transmission process.

[0094] Further, the manufacturing method further includes the step of forming a conductive bump on the redistribution layer 11 away from the antenna composite structure layer 20 to facilitate subsequent electrical connection between the antenna packaging structure and an external functional structure.

[0095] The manufacturing method of the antenna packaging structure of the embodiment can effectively avoid the problem of warping deformation of the redistribution layer caused by excessive thermal stress due to repeated high-temperature baking of the dielectric layer in the redistribution layer during the entire manufacturing process of the antenna packaging structure, while avoiding the mismatch between the thermal expansion coefficients of the dielectric layer and the electrically connected units embedded therein, thereby ensuring the overall performance of the antenna packaging structure. On the other hand, the antenna composite structure layer in a multi-layer composite structure is formed by separately manufacturing the first antenna layer, the intermediate antenna layer, and the second antenna layer, and then stacking and connecting the three structure layers, and in this process, the dry film is used as a frame layer to cooperate with the antenna layer to obtain an air-coupled antenna structure with good reliability and sealing. The overall manufacturing process has simple process steps and is easy to realize large-scale production. In addition, the size of the air hole in the intermediate antenna layer of the antenna composite structure layer can be accurately controlled according to actual needs to further manufacture an antenna packaging structure with a horizontal air-coupled antenna, effectively expanding the application scenarios and fields of the antenna packaging structure.

[0096] Embodiment two

[0097] The antenna packaging structure of the embodiment is manufactured by the method of embodiment one or other suitable methods. Referring to FIG. 9, the antenna packaging structure includes a redistribution layer 11 and an antenna composite structure layer 20.

[0098] Specifically, the antenna composite structure layer 20 is located above and connected to the redistribution layer 11. The antenna composite structure layer 20 includes a first antenna layer 21, an intermediate antenna layer 22, and a second antenna layer 23 arranged in sequence. The first antenna layer 21 is provided with a first antenna unit 211. The intermediate antenna layer 22 is provided with an air hole 221. The second antenna layer 23 is provided with a second antenna unit 231. The first antenna unit 211 and the second antenna unit 231 are arranged on opposite sides of the air hole 221 to form a first air antenna (I shown in FIG. 9).

[0099] As an example, the antenna composite structure layer 20 further includes a first frame layer 24 and a second frame layer 25. The first frame layer 24 is located between the first antenna layer 21 and the intermediate antenna layer 22 to form a first air cavity 241. The second frame layer 25 is located between the intermediate antenna layer 22 and the second antenna layer 23 to form a second air cavity 251. The first air cavity 241 and the second air cavity 251 are communicated via the air hole 221.

[0100] As an example, the material of the first frame layer 24 comprises a dry film, and / or the material of the second frame layer 25 comprises a dry film.

[0101] As an example, the connection method of the first antenna layer 21 and the re-wiring layer 11 comprises at least one of a hybrid bonding method and a thermal compression bonding method.

[0102] As an example, the width of the air hole 221 is 100-5000 μm, including but not limited to 300 μm, 500 μm, 800 μm, 2000 μm, 3000 μm and 4000 μm.

[0103] As an example, the antenna packaging structure further comprises a functional chip 30, which is arranged on the side of the re-wiring layer 11 away from the antenna composite structure layer 20, and the functional chip 30 is electrically connected to the antenna composite structure layer 20 based on the re-wiring layer 11.

[0104] The antenna packaging structure of the embodiment comprises a re-wiring layer and an antenna composite structure layer connected thereto, which is sequentially provided with a first antenna layer, an intermediate antenna layer and a second antenna layer, wherein the antenna units in the first antenna layer and the second antenna layer are oppositely arranged in the vertical direction based on the air hole in the intermediate antenna layer to achieve effective radiation of the transmitted signal in the vertical direction, and the overall antenna packaging structure is a multi-layer composite structure with an air cavity inside, and the anti-interference performance and overall structural reliability of the signal transmission process are good.

[0105] Embodiment three

[0106] The embodiment provides an antenna packaging structure, and the difference between the embodiment and embodiment two is that the first air antenna (i.e. double-sided vertical antenna structure) composed of a first antenna unit, an air hole and a second antenna unit is only included in embodiment two, and the second air antenna (i.e. horizontal coupling antenna structure) composed of an intermediate antenna unit and an air gap is further included in the embodiment. Please refer to FIG. 10, which shows that the antenna packaging structure comprises a re-wiring layer 11 and an antenna composite structure layer 20.

[0107] Specifically, as shown in FIG. 10, the antenna composite structure layer 20 is located above the re-wiring layer 11 and connected to the re-wiring layer 11, and the antenna composite structure layer 20 comprises a first antenna layer 21, an intermediate antenna layer 22 and a second antenna layer 23 arranged in sequence, the first antenna layer 21 is provided with a first antenna unit 211, the intermediate antenna layer 22 is provided with an air hole 221, the second antenna layer 23 is provided with a second antenna unit 231, and the first antenna unit 211 and the second antenna unit 231 are oppositely arranged on both sides of the air hole 221 to form a first air antenna.

[0108] As an example, the intermediate antenna layer 22 further comprises a first intermediate antenna unit 222, which is arranged on the inner wall of the air hole 221 and has an air gap 223 therein, and the first intermediate antenna unit 222 and the air gap 223 form a second air antenna (II in FIG. 10).

[0109] The antenna packaging structure of the embodiment further realizes effective radiation of the transmitted signal in the horizontal direction and expands the application scenarios of the antenna packaging structure by precisely controlling the size of the air cavity to further manufacture the intermediate antenna unit on the inner wall of the air cavity and constructing the second air antenna (i.e., the horizontal air antenna) composed of the intermediate antenna unit and the air gap in the intermediate antenna unit in the horizontal direction.

[0110] In summary, the manufacturing method of the antenna packaging structure of the present application realizes the air coupling antenna structure with good reliability and sealing performance while effectively ensuring the overall performance of the antenna packaging structure by separately manufacturing the redistribution layer and the antenna composite structure layer and then connecting the antenna composite structure layer to the redistribution layer. The overall manufacturing process has simple process steps and is easy to realize large-scale production. The antenna packaging structure with the horizontal air coupling antenna can be further manufactured by precisely controlling the size of the air hole of the intermediate antenna layer in the antenna composite structure layer according to actual needs, effectively expanding the application scenarios and fields of the antenna packaging structure. The antenna packaging structure of the present application comprises a redistribution layer and an antenna composite structure layer connected to the redistribution layer, which is sequentially provided with a first antenna layer, an intermediate antenna layer, and a second antenna layer. The antenna units in the first antenna layer and the second antenna layer are oppositely arranged in the vertical direction based on the air hole in the intermediate antenna layer to realize effective radiation of the transmitted signal in the vertical direction. The overall antenna packaging structure has a multilayer composite structure with an air cavity inside, and the anti-interference performance in the signal transmission process and the overall structural reliability are good. The antenna unit is manufactured on the inner wall of the air cavity by precisely controlling the size of the air cavity, thereby constructing the horizontal air antenna and further realizing effective radiation of the transmitted signal in the horizontal direction, which expands the application scenarios of the antenna packaging structure. Therefore, the present application effectively overcomes the various shortcomings in the prior art and has high industrial utilization value.

[0111] The above embodiments only exemplarily illustrate the principles and effects of the present application and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. A method for fabricating an antenna packaging structure, characterized in that, The method comprises the following steps: providing an electrical connection base layer, the electrical connection base layer comprising a rewiring layer; providing an antenna composite structure layer, the antenna composite structure layer comprising a first antenna layer, an intermediate antenna layer and a second antenna layer arranged in sequence, the first antenna layer being provided with a first antenna unit, the intermediate antenna layer being provided with an air hole, the second antenna layer being provided with a second antenna unit, the first antenna unit and the second antenna unit being arranged on opposite sides of the air hole to form a first air antenna; arranging the antenna composite structure layer above the electrical connection base layer and connecting the first antenna layer and the rewiring layer.

2. The method of claim 1, wherein: The antenna composite structure layer further comprises a first frame layer and a second frame layer, the first frame layer being arranged between the first antenna layer and the intermediate antenna layer to form a first air cavity, the second frame layer being arranged between the intermediate antenna layer and the second antenna layer to form a second air cavity, the first air cavity and the second air cavity being communicated through the air hole.

3. The method of claim 2, wherein: The step of providing the antenna composite structure layer comprises the following steps: providing the first antenna layer and arranging the first antenna layer with the first antenna unit upward; forming the first frame layer above the first antenna layer, the first frame layer exposing the first antenna unit; providing the intermediate antenna layer and arranging the intermediate antenna layer above the first frame layer, the air hole exposing at least part of the first antenna unit; forming the second frame layer above the intermediate antenna layer, the second frame layer exposing the air hole; providing the second antenna layer and arranging the second antenna layer with the second antenna unit above the second frame layer, at least part of the second antenna unit being opposite to at least part of the first antenna unit.

4. The method of claim 2, wherein: The material of the first frame layer comprises a dry film, and / or the material of the second frame layer comprises a dry film.

5. The method of claim 1, wherein: The intermediate antenna layer further comprises an intermediate antenna unit, the intermediate antenna unit being arranged on the inner wall of the air hole and having an air gap in the intermediate antenna unit, the intermediate antenna unit and the air gap forming a second air antenna.

6. The method of claim 5, wherein the antenna package structure is formed by: The step of forming the intermediate antenna layer comprises the following steps: providing an intermediate substrate; forming an air hole in the intermediate substrate; carrying out electroplating to form the intermediate antenna unit based on the inner wall of the air hole.

7. The method of claim 1, wherein: The method of connecting the first antenna layer and the rewiring layer comprises at least one of a hybrid bonding method and a thermal compression bonding method.

8. The method of claim 1, wherein: The electrical connection base layer further comprises a support layer, the support layer being arranged below the rewiring layer.

9. The method of claim 8, wherein the antenna package structure is formed by a process comprising: The manufacturing method further comprises the following steps: removing the support layer to expose one side of the rewiring layer away from the antenna composite structure layer; arranging a functional chip on one side of the rewiring layer away from the antenna composite structure layer, the functional chip being electrically connected to the rewiring layer and the antenna composite structure layer.

10. The method of claim 9, wherein: The electrically connected base layer further comprises a release layer between the redistribution layer and the support layer, and the method for removing the support layer comprises laser debonding based on the release layer to separate the support layer from the redistribution layer.

11. An antenna package structure, characterized by, The antenna package structure comprises: a redistribution layer; an antenna composite structure layer above and connected to the redistribution layer, the antenna composite structure layer comprising a first antenna layer, an intermediate antenna layer and a second antenna layer arranged in sequence, the first antenna layer being provided with a first antenna unit, the intermediate antenna layer being provided with an air hole, the second antenna layer being provided with a second antenna unit, the first antenna unit and the second antenna unit being arranged on both sides of the air hole to form a first air antenna.

12. The antenna package structure of claim 11, wherein: The antenna composite structure layer further comprises a first frame layer and a second frame layer, the first frame layer being between the first antenna layer and the intermediate antenna layer to form a first air cavity, the second frame layer being between the intermediate antenna layer and the second antenna layer to form a second air cavity, the first air cavity and the second air cavity being communicated through the air hole.

13. The antenna package structure of claim 12, wherein: The material of the first frame layer comprises a dry film, and / or the material of the second frame layer comprises a dry film.

14. The antenna package structure of claim 11, wherein: The intermediate antenna layer further comprises an intermediate antenna unit, the intermediate antenna unit being arranged on the inner wall of the air hole and having an air gap therein, the intermediate antenna unit and the air gap forming a second air antenna.

15. The antenna package structure of claim 11, wherein: The connection method of the first antenna layer and the redistribution layer comprises at least one of a hybrid bonding method and a hot-press bonding method.

16. The antenna package structure of claim 11, wherein: The antenna package structure further comprises a functional chip, the functional chip being arranged on the side of the redistribution layer away from the antenna composite structure layer, the functional chip being electrically connected to the antenna composite structure layer based on the redistribution layer.

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