Screen assembly and electronic device

Abstract

The present application relates to the technical field of display, and discloses a screen assembly and an electronic device. The screen assembly comprises a display panel. The display panel comprises a display area and a non-display area. The display panel is provided with a first wire and a second wire. The first wire extends from a first area of the non-display area to the display area. The second wire extends from a second area of the non-display area to the display area. The first wire is a source driving wire and the second wire is a gate driving wire and a power supply control wire, or the first wire is a source driving wire and a gate driving wire and the second wire is a power supply control wire, or the first wire is a source driving wire and a power supply control wire and the second wire is a gate driving wire. The first area and the second area are arranged on two opposite sides or two adjacent sides of the display area. In this way, the wiring space for a source driving wire can be increased, thereby improving resolution while ensuring a narrow bezel design of a display panel.

Description

Screen assembly and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202410904285.5, filed on July 5, 2024, and entitled "Screen assembly and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, in particular to a screen assembly and an electronic device. BACKGROUND

[0003] In an electronic device, most of the wirings of a display screen are usually arranged at a frame position of the electronic device. At present, in order to meet the design requirement of narrow frame of the electronic device, the wiring space of the display screen is limited. For example, a source driving chip is arranged at a lower frame position of the electronic device, and the source driving chip is mainly used for controlling a pixel circuit in the display screen. There are more wirings led out from the source driving chip to the pixel circuit, including power control wirings, gate driving wirings and source driving wirings.

[0004] Among them, the power control wirings are mainly used for providing power control signals for the pixel circuit, the gate driving wirings are mainly used for providing gate driving signals for the pixel circuit, and the source driving wirings are mainly used for providing source driving signals for the pixel circuit. Since the frame size of the electronic device is fixed, it is necessary to reasonably arrange the above-mentioned power control wirings, gate driving wirings and source driving wirings in the limited space. Among them, the number of source driving wirings is related to the number of pixels of the display screen. The fewer the number of source driving wirings, the fewer the number of pixels of the display screen, and accordingly, the lower the resolution of the display screen. Therefore, if the narrow frame design requirement is met by reducing the source driving wirings, the resolution of the screen will be reduced. SUMMARY

[0005] The present application provides a screen assembly and an electronic device, which are used for increasing the wiring space of the source driving wirings, and thus improving the resolution while ensuring the narrow frame design of the display panel.

[0006] In a first aspect, the present application provides a screen assembly, comprising a display panel, the display panel comprising a display area and a non-display area, and the display panel being provided with a first trace and a second trace; wherein the first trace extends from a first region of the non-display area to the display area and is electrically connected to a pixel unit of the display area; the second trace extends from a second region of the non-display area to the display area and is electrically connected to the pixel unit of the display area; wherein the first trace is a source driving trace, the second trace is a gate driving trace and a power control trace, or the first trace is a source driving trace and a gate driving trace, the second trace is a power control trace, or the first trace is a source driving trace and a power control trace, the second trace is a gate driving trace; the first region and the second region are arranged on opposite sides of the display area, or the first region and the second region are arranged on adjacent sides of the display area.

[0007] According to the embodiments of the present application, the first trace extends from the first region of the non-display area to the display area, and the second trace extends from the second region of the non-display area to the display area, which can increase the wiring space of the first trace in the first region, thereby increasing the number of the first traces, improving the number of pixels controlled by the first traces, and further improving the resolution. In addition, the screen assembly provided by the present application does not need to reduce the number of source driving traces in order to match the frame size compared with the structure using a multiplexer, thereby ensuring the charging time of each channel, maintaining the circuit voltage, and ensuring the refresh rate. Moreover, the number of source driving traces can be increased while maintaining the narrow frame design, thereby improving the resolution of the display panel while ensuring the refresh rate.

[0008] In some embodiments of the above first aspect, the first trace is a source driving trace, and the second trace is a gate driving trace and a power control trace.

[0009] In this way, the trace in the first region is only provided with a source driving trace, and the gate driving trace and the power control trace are arranged in the second region, thereby increasing the wiring space of the source driving trace, and thus the number of source driving traces can be increased, thereby improving the number of pixels controlled by the source driving traces and further improving the resolution.

[0010] In some embodiments of the above first aspect, the non-display area is located in a frame area of the display panel, the frame area comprising an upper frame area, a lower frame area and a side frame area; the first region and the second region are two regions arranged opposite to each other along the width direction of the display panel; wherein the first region is located in the lower frame area, and the second region is located in the upper frame area.

[0011] In this way, the wiring space of the source drive wires in the lower frame area can be increased, so that the number of source drive wires in the lower frame area can be increased, and the resolution of the display panel can be improved.

[0012] In some embodiments of the first aspect, the screen assembly further comprises a source drive chip, and the first region is provided with first pads, and the first wires are connected to the source drive chip through the one-to-one corresponding first pads.

[0013] In this way, the first pads connect the source drive chip to the first region, so that the first wires can provide driving signals for the pixel units.

[0014] In some embodiments of the first aspect, the first pads correspond to the source drive pins of the source drive chip one by one.

[0015] In this way, the source drive pins on the source drive chip are connected to the source drive wires, and the source drive wires are connected to the pixel units through the first pads to provide source drive signals for the pixel units.

[0016] In some embodiments of the first aspect, the screen assembly further comprises a first circuit board, and the second region is provided with second pads, and the second wires are connected to the first circuit board through the one-to-one corresponding second pads.

[0017] In this way, one end of each second wire connected to the second pads is located in the second region, and the other end of each second wire is connected to the pixel units located in the display area. In the second wires, the gate drive wires are used to provide gate drive signals in the pixel units, and the power control wires are used to control power control signals in the pixel units, so that each pixel in the pixel units can be driven and controlled by the wires to provide a display image.

[0018] In some embodiments of the first aspect, the first circuit board is provided with a level shifter, and the level shifter is connected to the gate drive wires.

[0019] In this way, the level shifter can be connected through the gate drive pads and the gate drive wires to replace the level shifter originally arranged inside the source drive chip, so that the gate drive is changed from the original built-in driving mode to an external driving mode, and the gate drive is ensured to be normally performed.

[0020] In some embodiments of the first aspect, the screen assembly further comprises a second circuit board; and the source drive chip is arranged on the second circuit board, and the first region is connected to the second circuit board and the source drive chip through the first pads; or the first region is further provided with third pads, and the first region is connected to the second circuit board through the third pads.

[0021] In some embodiments of the first aspect, the first circuit board is provided with a first connector, and the first connector is connected with the second trace; the screen assembly further comprises a third circuit board connected with the second circuit board and the main board respectively, and the third circuit board is provided with a second connector; the second connector is electrically connected with the main board through the third circuit board and the main board, and is used for receiving the power supply signal provided by the main board; and the first connector and the second connector are used for snap-fit connection, so that the second connector provides the power supply signal to the second trace through the first connector.

[0022] In this way, the first connector can be connected with the power supply control trace and the gate drive trace, and the second connector can receive the power supply signal; when the first connector and the second connector are electrically connected, the power supply control trace and the gate drive trace can receive the power supply signal, thereby ensuring the normal driving of the pixel.

[0023] In some embodiments of the first aspect, the first circuit board comprises a first part extending along a length direction of the display panel, and a third part and a fourth part extending along a width direction of the display panel; a first end of the third part and a first end of the fourth part are connected with the first part, and a second end of the third part and a second end of the fourth part are connected with the second area; the length direction is perpendicular to the width direction.

[0024] In this way, the first circuit board is connected with the display panel through the third part and the fourth part, so as to connect the second pad and the second trace with the display panel, thereby providing the driving signal for the display area.

[0025] In some embodiments of the first aspect, the first circuit board comprises a first part extending along a length direction of the display panel, and a third part, a fourth part, a fifth part and a sixth part extending along a width direction of the display panel; a first end of the third part, a first end of the fourth part, a first end of the fifth part and a first end of the sixth part are connected with the first part, and a second end of the third part, a second end of the fourth part, a second end of the fifth part and a second end of the sixth part are connected with the second area; the length direction is perpendicular to the width direction.

[0026] In this way, the combination strength of the display panel and the first circuit board can be improved, and the gate drive trace and / or the power supply control trace can be led out from the upper frame area and extended to the display area, so as to control the pixel unit and further improve the display effect.

[0027] In some embodiments of the first aspect, the display panel includes a filter plate and a substrate stacked along a thickness direction, the thickness direction being perpendicular to a length direction and a width direction of the display panel respectively; the filter plate has a smaller orthographic projection area in a first plane than the substrate; the orthographic projection area of the filter plate in the first plane includes a display area, and the orthographic projection area of the substrate in the first plane includes the display area and a non-display area; the first plane is perpendicular to the thickness direction.

[0028] In some embodiments of the first aspect, the first region includes a first bending area extending along the length direction of the display panel; and when the first bending area is not bent, the first bending area divides the first region into a first sub-region and a second sub-region arranged along the width direction of the display panel, the first sub-region being closer to the display area than the second sub-region; the first pad is arranged in the second sub-region, and the first trace extends to the display area via the second sub-region, the first bending area and the first sub-region.

[0029] In this way, the second sub-region can be folded from the front to the back at a certain angle and with a certain radius, thereby achieving a narrow-frame design.

[0030] In some embodiments of the first aspect, the second region includes a second bending area extending along the length direction of the display panel; and when the second bending area is not bent, the second bending area divides the second region into a third sub-region and a fourth sub-region arranged along the width direction of the display panel, the third sub-region being closer to the display area than the fourth sub-region; the second pad is arranged in the fourth sub-region, and the second trace extends to the display area via the fourth sub-region, the second bending area and the third sub-region.

[0031] In this way, the fourth sub-region can be folded from the front to the back at a certain angle and with a certain radius, thereby achieving a narrow-frame design.

[0032] In a second aspect, the present application provides an electronic device including a housing and a screen assembly according to any one of the embodiments of the present application, the screen assembly being arranged on the housing.

[0033] In some embodiments of the first aspect, the electronic device further includes a mainboard electrically connected to the screen assembly; the mainboard includes a battery, and the battery provides a power signal to a first connector on the screen assembly through a second connector on the screen assembly, so that the first connector provides the power signal to the second trace.

[0034] The beneficial effects of the second aspect can be referred to the related descriptions of various embodiments of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the present application, the drawings used in the embodiments description will be briefly introduced.

[0036] FIG. 1A shows a front structure schematic diagram of a tablet 20 in landscape mode according to some embodiments of the present application;

[0037] FIG. 1B shows a cross-sectional view of the tablet 20 along the direction of AA' in FIG. 1A according to some embodiments of the present application;

[0038] FIG. 2A shows a side view of a screen assembly 200a according to some embodiments of the present application;

[0039] FIG. 2B shows a front view of the screen assembly 200a according to some embodiments of the present application;

[0040] FIG. 2C shows a partial internal wiring schematic diagram of the screen assembly 200a according to some embodiments of the present application;

[0041] FIG. 3A shows a side view of a screen assembly 200a' according to some embodiments of the present application;

[0042] FIG. 3B shows a front view of the screen assembly 200a' according to some embodiments of the present application;

[0043] FIG. 3C shows a partial internal wiring schematic diagram of the screen assembly 200a' according to some embodiments of the present application;

[0044] FIG. 4 shows a front view of a screen assembly 200a" according to some embodiments of the present application;

[0045] FIG. 5A shows a side view of a screen assembly 200b according to some embodiments of the present application;

[0046] FIG. 5B shows a front view of the screen assembly 200b according to some embodiments of the present application;

[0047] FIG. 5C shows a partial internal wiring schematic diagram of the screen assembly 200b according to some embodiments of the present application;

[0048] FIG. 6A shows a side view of a screen assembly 200b' according to some embodiments of the present application;

[0049] FIG. 6B shows a front view of the screen assembly 200b' according to some embodiments of the present application;

[0050] FIG. 6C shows a partial internal wiring schematic diagram of the screen assembly 200b' according to some embodiments of the present application;

[0051] FIG. 7A illustrates a side view of a screen assembly 200c, according to some embodiments of the present application;

[0052] FIG. 7B illustrates a front view of a screen assembly 200c, according to some embodiments of the present application;

[0053] FIG. 7C illustrates a partial internal wiring diagram of a screen assembly 200c, according to some embodiments of the present application;

[0054] FIG. 8A illustrates a side view of a screen assembly 200c', according to some embodiments of the present application;

[0055] FIG. 8B illustrates a front view of a screen assembly 200c', according to some embodiments of the present application;

[0056] FIG. 8C illustrates a partial internal wiring diagram of a screen assembly 200c', according to some embodiments of the present application;

[0057] FIG. 9 illustrates a hardware structure diagram of a tablet 20, according to some embodiments of the present application. DETAILED DESCRIPTION

[0058] Illustrative embodiments of the present application include, but are not limited to, screen assemblies and electronic devices.

[0059] It should be understood that the technical solutions provided by the present application can be applied to any electronic device including a screen. The electronic device includes, but is not limited to, a mobile phone, a tablet, a personal computer, an electronic watch, an electronic bracelet, a camera, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a television, and the like. The type and form of the electronic device are not limited in the embodiments of the present application.

[0060] It should be noted that the orientation terms such as "upper", "lower", "left", "right" and the like in the present application are exemplary orientations of the screen assembly, and do not indicate or imply that the components referred to must have a specific orientation. The orientation can be changed accordingly according to actual use, and should not be construed as a limitation of the present application. In addition, the length direction described in the embodiments of the present application can be the length direction of the display panel, i.e., the x direction in the drawings, the width direction can be the width direction of the display panel, i.e., the y direction in the drawings, and the thickness direction can be the thickness direction of the display panel, i.e., the z direction in the drawings.

[0061] In addition, generally, the side of the electronic device facing the user in the use state is referred to as the front of the electronic device, and the side of the electronic device facing away from the user in the use state is referred to as the back of the electronic device.

[0062] The technical solutions of the present application are described below with the electronic device being a tablet 20 as an example in combination with the drawings.

[0063] Please refer to FIG. 1A and FIG. 1B, FIG. 1A is a schematic diagram of a tablet 20 provided by an embodiment of the present application, and FIG. 1B is a sectional view of the tablet 20 along the direction of AA' in FIG. 1A.

[0064] It should be noted that FIG. 1A shows the use state of the tablet 20 in the default use direction of the user, and the default use direction of the tablet 20 in the embodiment of the present application is also the landscape direction of the tablet 20.

[0065] In the above use state, the "upper frame area" mentioned in the embodiment of the present application can include the non-display area above the display area in the screen assembly 200 in FIG. 1A, the "lower frame area" mentioned in the embodiment of the present application can include the non-display area below the display area in the screen assembly 200 in FIG. 1A, and the "side frame area" mentioned in the embodiment of the present application can include the non-display area on the left and right sides of the display area in the screen assembly 200 in FIG. 1A.

[0066] It should be noted that the front structure view of the screen assembly in the tablet shown in the following embodiments and drawings of the present application is in the same use direction as the tablet shown in FIG. 1A, and the use direction of the tablet will not be described in the following embodiments.

[0067] In addition, in other electronic devices, the "upper frame area", "lower frame area" and "side frame area" can refer to the non-display area above, below and on the left and right sides of the display area in the front view of the electronic device in the default use direction defined in the design of the electronic device, or in the use direction of the electronic device most frequently used by the user. For example, when the electronic device is a mobile phone, the "upper frame area", "lower frame area" and "side frame area" refer to the non-display area above, below and on the left and right sides of the display area in the default use direction of the mobile phone, that is, in the portrait use state of the mobile phone.

[0068] Continuing to refer to FIG. 1A and FIG. 1B, the tablet 20 includes a screen assembly 200 and a housing 300, wherein the screen assembly 200 is arranged on the housing 300.

[0069] The front of the screen assembly 200 includes an active area (AA) and a non-active area surrounding the active area, and the user can observe the picture displayed in the active area, and the non-active area belongs to the frame area of the tablet 20.

[0070] FIG. 2A and FIG. 2B show a side view and a front view of a screen assembly 200a according to some embodiments. It should be noted that the screen assembly 200a can be an example of the screen assembly 200 described above, that is, the overall structure of the electronic device in which the screen assembly 200a is located can refer to the structure shown in FIG. 1A and FIG. 1B.

[0071] As shown in FIG. 2A, the screen assembly 200a includes a display panel including a substrate 201 and a color filter (CF) 202 stacked along a thickness direction (z direction) thereof, specifically, a portion of the substrate 201 and the CF plate 202 are stacked along the z direction, the portion is a double-layer region 203, a portion of the substrate 201 which is not stacked with the CF plate 202 is a single-layer region 204, and the single-layer region 204 is located in a lower frame area. The double-layer region 203 includes a display area (FIG. 2B). For example, a projection area of the double-layer region 203 in a plane perpendicular to the z direction contains a projection area of the display area (FIG. 2B) in the plane perpendicular to the z direction, in addition, the projection area of the double-layer region 203 in the plane perpendicular to the z direction can also contain a projection area of a portion of a non-display area in the plane perpendicular to the z direction, for example, a region of the double-layer region 203 surrounding the display area belongs to the non-display area. All of the single-layer region 204 belongs to the non-display area, for example, a projection area of the single-layer region 204 in a plane perpendicular to the z direction is located in a projection area of the non-display area in the plane perpendicular to the z direction.

[0072] As shown in FIG. 2B, the single-layer region 204 of the substrate 201 is provided with a plurality of pads, for example, a plurality of pads 211 / 212 / 213 arranged along a length direction (x direction), and the screen assembly 200a further includes a flexible printed circuit (FPC) 208 and a source driving chip 209. The source driving chip 209 is disposed on the FPC plate 208 and connected with the single-layer region 204 of the substrate 201 through the pads 211 / 212 / 213.

[0073] In addition, the source driving chip 209 is provided with a plurality of pins (not shown), each pin is connected with a wire, that is, the wire is drawn out from the source driving chip 209. The plurality of pads on the single-layer region 204 of the substrate 201 correspond to the plurality of pins of the source driving chip 209 one by one, and each pad is electrically connected with the corresponding pin, so that each pin of the source driving chip 209 is connected to the corresponding wire through the corresponding pad.

[0074] Specifically, one end of each trace connected with each pin is located in the single-layer area 204 and connected with the corresponding source driving pin through a one-to-one corresponding pad, and the other end of each trace is connected to the pixel unit located in the double-layer area 203. Among them, the pixel unit is located in the display area. For example, the single-layer area 204 is provided with a plurality of source driving pads 211, a plurality of gate driving pads 212 and a plurality of power control pads 213. Among them, the source driving pins on the source driving chip 209 are connected with the source driving traces, the source driving traces are connected with the pixel units through the source driving pads 211, used to provide the source driving signal in the pixel unit, the gate driving pins are connected with the gate driving traces, the gate driving traces are connected with the pixel units through the gate driving pads 212, used to provide the gate driving signal in the pixel unit, and the power control pins are connected with the power control traces, the power control traces are connected with the pixel units through the power control pads 213, used to control the power control signal in the pixel unit.

[0075] The screen assembly 200a further comprises a printed circuit board (PCB) 206 and a mainboard connector 207 disposed on the PCB 206, the mainboard connector 207 being used to electrically connect the mainboard with the PCB 206. Among them, the single-layer area 204 and the FPC board 208, the PCB 206, the mainboard connector 207 and the source driving chip 209 below all belong to the non-display area of the lower frame area.

[0076] Therefore, it can be understood that the source driving pins on the source driving chip 209 are connected with the source driving traces through a one-to-one corresponding pad, the gate driving pins are connected with the gate driving traces through a one-to-one corresponding pad, the power control pins are connected with the power control traces through a one-to-one corresponding pad, and each trace is connected to the pixel unit, thereby controlling the driving input signal of the pixel unit, and further realizing the control of the picture displayed in the display area.

[0077] FIG. 2C shows a schematic diagram of internal traces of a screen assembly 200a according to some embodiments. It can be understood that FIG. 2C only shows a schematic diagram of the right half of the screen assembly 200a, and the traces of the left half are symmetrical to those of the right half.

[0078] Each pad corresponding to each pin pair of the source drive chip 209 in FIG. 2C is connected with a wire extending along the width direction (y direction). In the double-layer area 203, the area around the edge profile of the display area is a non-display area. The source drive pad 211 corresponding to the source drive pin pair is connected with the source drive wire, the source drive wire extends to the display area along the y direction and extends to the column circuit in the pixel unit. The gate drive pad 212 corresponding to the gate drive pin is connected with the gate drive wire, the power control pad 213 corresponding to the power control pin is connected with the power control wire, and the gate drive wire and the power control wire both extend to the non-display area along the y direction and extend to the display area from the non-display area, wherein the gate drive wire extends to the row circuit in the pixel unit.

[0079] In the above screen assembly 200a, all the source drive wires, gate drive wires and power control wires pass through the single-layer area 204 of the lower frame area, and since the size of the lower frame area of the shell is fixed, the wire space in the lower frame area is also fixed, that is, the total number of wires is limited. Due to the demand of gate drive and power supply, the number of gate drive wires and power control wires cannot be reduced, and therefore, in some technical solutions, in order to meet the narrow frame design requirement of the lower frame area, the number of source drive wires is reduced. The reduction of the number of source drive wires leads to the reduction of the number of pixels that can be controlled, which in turn leads to the reduction of the resolution of the display area.

[0080] Based on this, the embodiment of the present application provides a screen assembly, which changes the mode of the gate drive wire and / or the power control wire. For example, the gate drive wire and the power control wire are no longer led out through the pins of the source drive chip located in the lower frame area, but are led out from other frame areas, for example, as shown in FIG. 3C, they can be led out from the non-display area located in the upper frame area and extend to the display area to realize the control of the pixel unit in the display area. Therefore, only source drive pins are arranged on the source drive chip in the lower frame area, the wiring space of the source drive wire is increased, the number of source drive wires can be increased, and the resolution of the screen is improved.

[0081] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0082] In order to facilitate the description, first introduce three structure types of display panel involved in the embodiment of the present application.

[0083] The packaging technology of the display screen includes a chip on flex (COF) packaging process, a chip on glass (COG) packaging process and a chip on panel (COP) packaging process. The structure shown in FIGS. 2A-2C adopts the COF packaging process. At present, in the above packaging processes, the wires in the display screen are concentrated in the lower frame area. The specific structures of the three technologies are described as follows.

[0084] The COG packaging process is to directly bind the integrated circuit (IC) and the wires under the screen on the glass substrate. It should be noted that the structures adopting the COG process in the embodiments of the present application are applicable to liquid crystal display (LCD), hard screen organic electroluminescence display (OLED), and hybrid OLED.

[0085] The COF packaging process is to place the chip on the FPC board of flexible material, and then fold it under the screen, thereby further saving space and reducing the size of the lower frame area. It should be noted that the structures adopting the COF process in the embodiments of the present application are applicable to LCD, hard screen OLED, hybrid OLED and flexible OLED.

[0086] Compared with the COF and COG processes, the COP packaging process directly bends a part of the screen of flexible material backward, thereby further reducing the frame area and realizing the visual effect close to "frameless". It should be noted that the structures adopting the COP process in the embodiments of the present application are applicable to flexible OLED.

[0087] It should be noted that the display panel structures applicable to the embodiments of the present application are not limited to the above COG, COF and COP structures, and other display panels such as MiniLED and MicroLED can also be used as needed, and the present application does not limit the types and structures of the display panels.

[0088] The first embodiment of the screen assembly of the present application will be described in detail below with reference to FIGS. 3A-3C to improve the above problems existing in FIGS. 2A-2C.

[0089] FIG. 3A and FIG. 3B show a front view and a side view of a screen assembly 200a' according to some embodiments. In the screen assembly 200a', a COF packaging process is adopted. It should be noted that the screen assembly 200a' can be an example of the screen assembly 200 described above, i.e., the overall structure of the electronic device in which the screen assembly 200a' is located can refer to the structure shown in FIG. 1A and FIG. 1B.

[0090] In the screen assembly 200a', the substrate 201 includes a connection area 217 (an example of the second area of the present application) in the upper frame area, on which a FPC board 218 is connected, and the gate drive traces and power control traces (an example of the second traces of the present application) are led out from the pads on the FPC board 218 and connected to the pixel units in the display area, so that the wiring space of the source drive traces (an example of the first traces of the present application) in the single-layer area 204 (an example of the first area of the present application) in the lower frame area is increased. Thus, the number of source drive pads and corresponding traces can be increased, thereby increasing the number of traces controlled pixels and further improving the resolution.

[0091] In the screen assembly 200a', the connection area 217 and the single-layer area 204 are arranged on opposite sides of the display area along the y direction.

[0092] Specifically, as shown in FIG. 3A, the screen assembly 200a' includes a display panel, which includes a substrate 201 and a CF board 202 (an example of the filter board of the present application) stacked along the thickness direction (z direction), a portion of the substrate 201 and the CF board 202 are overlapped along the z direction, and the overlapped portion is a double-layer area 203. In the portion of the substrate 201 which is not overlapped with the CF board 202, the portion in the lower frame area is a single-layer area 204, and the portion in the upper frame area is a connection area 217. The double-layer area 203 includes a display area (FIG. 3B), for example, the projection area of the double-layer area 203 in a plane perpendicular to the z direction contains the projection area of the display area (FIG. 3B) in the plane perpendicular to the z direction. The single-layer area 204 and the connection area 217 both belong to a non-display area, for example, the projection area of the single-layer area 204 and the connection area 217 in a plane perpendicular to the z direction are both located in the projection area of the non-display area in the plane perpendicular to the z direction.

[0093] In some embodiments, the projection area of the CF board 202 in a plane (an example of the first plane of the present application) perpendicular to the z direction is smaller than the projection area of the substrate 201 in the plane perpendicular to the z direction; the projection area of the CF board 202 in the plane perpendicular to the z direction includes the display area, and the projection area of the substrate 201 in the plane perpendicular to the z direction includes the display area and the non-display area.

[0094] In some embodiments, the substrate 201 can be a thin film transistor (TFT) substrate.

[0095] In some embodiments, it can be understood that the connection area 217 can be obtained by extending the substrate 201 upward for a distance, that is, the connection area 217 is the same as the single-layer area 204, both of which are single-layer structures in the z direction. It should be noted that in other embodiments, the connection area 217 can also be obtained by other means.

[0096] As shown in FIG. 3B, the single-layer area 204 and the connection area 217 of the substrate 201 are both provided with a plurality of pads, for example, the single-layer area 204 is provided with a plurality of source drive pads 211 (an example of the first pad of the present application) arranged along the length direction (x direction), and the connection area 217 is provided with a plurality of gate drive pads 212 and power control pads 213 (an example of the second pad of the present application) arranged along the length direction (x direction). The screen assembly 200a' further includes an FPC board 208 (an example of the second circuit board of the present application), an FPC board 218 (an example of the first circuit board of the present application), and a source drive chip 209. The source drive chip 209 is arranged on the FPC board 208, and the FPC board 208 is connected to the single-layer area 204 of the substrate 201 through the source drive pads 211. The gate drive pads 212 and the power control pads 213 are arranged on the connection area 217, and the FPC board 218 is connected to the connection area 217 of the substrate 201 through the gate drive pads 212 and the power control pads 213.

[0097] In addition, the source drive chip 209 is provided with a plurality of source drive pins (not shown), each of which is connected to a source drive trace, that is, the source drive traces are drawn out from the source drive chip 209. The single-layer area 204 of the substrate 201 is provided with a plurality of source drive pads 211 corresponding to the source drive pins one by one, and each pad is electrically connected to the corresponding pin, so that each source drive pin of the source drive chip 209 is connected to the corresponding source drive trace through the corresponding source drive pad 211. The gate drive pads 212 and the power control pads 213 on the connection area 217 of the substrate 201 are used to connect the corresponding gate drive traces and power control traces.

[0098] Specifically, one end of each source drive trace connected with each source drive pin is located in the single-layer area 204, and is connected with the corresponding source drive pin through a one-to-one corresponding pad. The other end of each source drive trace is connected to the pixel unit located in the double-layer area 203. For example, a plurality of source drive pads 211 are arranged on the single-layer area 204. Among them, the source drive pins on the source drive chip 209 are connected with the source drive traces, and the source drive traces are connected to the pixel unit to provide the source drive signal in the pixel unit.

[0099] One end of each gate drive trace and power control trace connected with each gate drive pad 212 and power control pad 213 is located in the connection area 217, and the other end of each gate drive trace and power control trace is connected to the pixel unit located in the double-layer area 203. The gate drive trace is used to provide the gate drive signal in the pixel unit, and the power control trace is used to control the power control signal in the pixel unit, so that each pixel in the pixel unit can be driven by each trace to provide a display picture.

[0100] In some embodiments, the screen assembly 200a' further includes a PCB board 206 (an example of a third circuit board of the present application) and a main board connector 207 arranged on the PCB board 206, and the PCB board 206 is connected with the FPC board 208. Among them, the single-layer area 204 and the following FPC board 208, PCB board 206, main board connector 207, source drive chip 209 all belong to the non-display area of the lower frame area.

[0101] In some embodiments, continuing to refer to FIG. 3B, specifically, the FPC board 218 includes a first part 218a extending along the x direction, and a third part 218c and a fourth part 218d extending along the y direction. One end of the third part 218c and one end of the fourth part 218d are connected with the first part 218a, and the other end of the third part 218c and the other end of the fourth part 218d can be connected with the connection area 217. Among them, the third part 218c and the fourth part 218d are connected with the gate drive pad 212 and / or the power control pad 213, and are connected with the connection area 217 through the gate drive pad 212 and / or the power control pad 213. Thus, the first part 218a can connect the third part 218c and the fourth part 218d, thereby constituting the whole of the FPC board 218. The whole of the FPC board 218 is connected with the connection area 217 through the third part 218c and the fourth part 218d, thereby enabling the FPC board 218 to be connected with the display area. Thus, the gate drive trace and the power control trace can be led out from the pad on the FPC board 218, and the traces can be connected to the pixel unit in the display area, thereby increasing the wiring space of the source drive trace in the lower frame area.

[0102] In some embodiments, the screen assembly 200a' further comprises a connector 219 (an example of the first connector of the present application) and a connector 220 (an example of the second connector of the present application). Specifically, one of the connector 219 and the connector 220 is a connector male head, and the other is a connector female seat. For example, the connector 219 can be a connector male head, and the connector 220 can be a connector female seat. The connector male head 219 is arranged on the FPC board 218, and the connector female seat 220 is arranged in the PCB board 206. The connector male head 219 can be connected to the power control trace and / or the gate drive trace through the FPC board 218, and the connector female seat 220 is electrically connected to the main board through the PCB board 206 and is used to receive the power signal provided by the battery in the main board. When the connector 219 and the connector 220 are connected by buckling, the connector 220 provides the power signal to the connector 219, so that the connector 219 provides the power signal to the power control trace and / or the gate drive trace.

[0103] Specifically, the connector 219 can be arranged at the end of the second part 218b of the FPC board 218. And the end of the second part 218b can extend to the lower side of the substrate 201, so that the connector 219 and the connector 220 can be directly buckled to achieve electrical connection. Alternatively, the connector 219 can be arranged on the first part 218a of the FPC board 218, and the electrical connection between the connector 219 and the connector 220 can be achieved through a connection circuit board (such as an FPC board, not shown in the figure). The connector 219 and the connector 220 can be directly soldered on the connection circuit board, or the two ends of the connection circuit board can be provided with two connection ends, which can be buckled and connected with the connector 219 and the connector 220. The traces of the connection circuit board can be arranged on the back of the screen assembly 200a'.

[0104] In some embodiments, the screen assembly 200a' further comprises a level shifter 221 to connect the gate drive trace and provide the gate drive signal. The level shifter 221 is arranged on the FPC board 218. The level shifter 221 can be connected through the gate drive pad 212 and the gate drive trace to replace the level shifter originally arranged inside the source drive chip 209, so as to change the gate drive from the original built-in driving mode to an external driving mode, and ensure the normal operation of the gate drive.

[0105] Specifically, the level shifter 221 can be arranged on the third part 218c and / or the fourth part 218d of the FPC board 218.

[0106] In some embodiments, the source drive chip 209 can adopt a chip with an internal structure matching the resolution of the display area, to adapt to the demand after the resolution of the display area is improved.

[0107] FIG. 3C shows a schematic diagram of internal wirings of the screen assembly 200a' according to some embodiments. It can be understood that FIG. 3C only shows a schematic diagram of the right half of the screen assembly 200a', and the wirings of the left half of the screen assembly 200a' can be symmetric to the wirings of the right half of the screen assembly 200a'.

[0108] Each of the source drive pads 211 on the FPC plate 208 is connected to a source drive wiring, and each of the gate drive pads 212 on the FPC plate 218 is connected to a gate drive wiring, and each of the power control pads 213 is connected to a power control wiring. The source drive wirings extend in the width direction (y direction) to each column of pixels in the pixel unit to control the column of pixels, and the gate drive wirings and the power control wirings both extend in the y direction to the non-display area and extend in the length direction (x direction) from the non-display area to the display area (not shown). Specifically, the gate drive wirings extend to each row of pixels in the pixel unit to control the row of pixels.

[0109] Continuing as shown in FIG. 3C, in some embodiments, it should be noted that the gate drive pads 212 and the power control pads 213 can be arranged along the extension direction of the FPC plate 218, for example, can be arranged along the x direction, and the arrangement order of the gate drive pads 212 and the power control pads 213 is not limited.

[0110] In some other embodiments of the present application, the connection area 217 can also be arranged in the side bezel area, and correspondingly, the FPC plate 218 and the pads thereon can also be arranged in the side bezel area. So that the source drive wirings and / or the power control wirings extend from the side bezel area to the pixel unit in the display area. Further, the accommodation space of the source drive wirings in the lower bezel area is increased, the number of source drive wirings is increased, and the resolution is improved.

[0111] Specifically, the FPC plate 218 can be arranged in the left bezel area and / or the right bezel area. It should be noted that the left bezel area and the right bezel area constitute the side bezel area, and specifically can be the left bezel area and the right bezel area shown in any front view of the drawings of the embodiments of the present application.

[0112] For example, the FPC plate 218 can be arranged in the left bezel area and the right bezel area of the screen assembly 200a' at the same time, and the gate drive wirings can extend from the left bezel area and the right bezel area to the display area, and the power control wirings can also extend from the left bezel area and the right bezel area to the display area. That is, the connection area 217 and the single-layer area 204 can be arranged on two sides adjacent to the display area.

[0113] In some embodiments of the present application, the layout of the wires can be as follows: the source drive wires and the gate drive wires (an example of the first wires of the present application) extend from the source drive chip 209 in the lower frame area to the display area, i.e. the source drive wires and the gate drive wires are led out from the single layer area 204. Correspondingly, the source drive pads and the gate drive pads are arranged on the single layer area 204 to connect the source drive wires and the gate drive wires. Thus, the space originally occupied by the source drive wires and the corresponding pads / pins in the lower frame area can be used to arrange more source drive wires and the corresponding pads / pins, so that the number of source drive wires can be increased, and thus the resolution of the screen can be improved.

[0114] In some embodiments of the present application, the layout of the wires can be as follows: the source drive wires and the gate drive wires (an example of the first wires of the present application) extend from the source drive chip 209 in the lower frame area to the display area, i.e. the source drive wires and the gate drive wires are led out from the single layer area 204. Correspondingly, the source drive pads and the gate drive pads are arranged on the single layer area 204 to connect the source drive wires and the gate drive wires. Thus, the space originally occupied by the source drive wires and the corresponding pads / pins in the lower frame area can be used to arrange more source drive wires and the corresponding pads / pins, so that the number of source drive wires can be increased, and thus the resolution of the screen can be improved.

[0115] In some embodiments, it can be understood that after the wires are arranged, the pixel units need to be tested for display. During the testing process, the gate drive wires and / or the power control wires led out from the upper frame area or the side frame area can extend from the non-display area to the lower frame area and be connected to the test pads (not shown) in the lower frame area through the test wires, so as to ensure that the test function is not affected. Moreover, after the testing is completed, the test wires connected to the test pads can be removed, and thus the entire testing process is completed.

[0116] Specifically, the test wires connected to the test pads can be removed through an LED module dicing process. The dicing process refers to the second cutting in the semiconductor packaging process, and in the dicing process, the length of the wires can be adjusted according to the requirements.

[0117] Currently, in the resolution improvement solution, a multiplexer is usually used to control two signal channels through one source driving wire, so as to reduce the number of source driving wires and improve the resolution. The multiplexer (MUX) is a multiple-input, single-output combination logic circuit. An n-input multiplexer is an n-way digital switch, which can select an output from n inputs to a common output according to the channel selection control signal. However, due to the time-division multiplexing feature of the multiplexer, different channel signals connected by one source driving wire need to be transmitted at different times, which leads to a decrease in circuit voltage. Specifically, for example, before using the multiplexer, one source driving wire charges one signal channel for m time, and after using the multiplexer, one source driving wire charges two signal channels for m time, i.e. one signal channel is charged for m / 2 time. Therefore, the decrease in charging time leads to a decrease in circuit voltage, and further leads to a decrease in refresh rate, which cannot meet the high refresh rate requirement of the screen.

[0118] The screen assembly 200a' provided in the present application does not need to reduce the number of source driving wires to match the frame size compared with the structure using the multiplexer, so as to ensure the charging time of each channel, maintain the circuit voltage, and ensure the refresh rate. In addition, the number of source driving wires can be increased while maintaining the narrow frame design, so as to improve the resolution of the display panel while ensuring the refresh rate.

[0119] In addition, since part of the wires in the lower frame region are moved to other regions in the present application, the size of the lower frame region can be further reduced with or without increasing the number of source driving wires. It can be understood that, since most of the wire pins and display-related elements in the original display panel are arranged in the lower frame region, the lower frame region needs a larger size design compared with the frame region of other regions. Therefore, by using the screen assembly provided in the embodiments of the present application, the size design of the lower frame region can be improved, and the resolution of the electronic device can be increased and the display performance thereof can be improved while maintaining or reducing the size of the lower frame region.

[0120] FIG. 4 shows a front view of a screen assembly 200a" according to some embodiments. It should be noted that the screen assembly 200a" can be an example of the screen assembly 200 described above, i.e. the overall structure of the electronic device in which the screen assembly 200a" is located can refer to the structures shown in FIGS. 1A and 1B.

[0121] The screen assembly 200a" and the screen assembly 200a' are different in that the FPC plate 218' in the screen assembly 200a" includes a first portion 218a extending along the x direction, and a second portion 218b, a third portion 218c, a fourth portion 218d, a fifth portion 218e, and a sixth portion 218f extending along the y direction. The third portion 218c, the fourth portion 218d, the fifth portion 218e, and the sixth portion 218f are located on the same side of the first portion 218a and are arranged in sequence along the extension direction of the first portion 218a. The FPC plate 218 is connected through the third portion 218c, the fourth portion 218d, the fifth portion 218e, the sixth portion 218f, and the connection area 217. The FPC plate 218' is connected to the connection area 217 through four portions, which can provide gate drive and / or power control for the pixel circuit in the display area, thereby further improving the bonding strength and the tightness of the combination of the FPC plate 218 and the connection area 217, so that the FPC plate 218 and the connection area 217 are stably connected to the substrate 201, and the gate drive wire and / or the power control wire are led out from the upper frame area and extended to the display area to control the pixel unit, thereby further improving the display effect.

[0122] Specifically, in the FPC plate 218', one end of the second portion 218b, one end of the third portion 218c, one end of the fourth portion 218d, one end of the fifth portion 218e, and one end of the sixth portion 218f are connected to the first portion 218a, and the other end of the third portion 218c, the other end of the fourth portion 218d, the other end of the fifth portion 218e, and the other end of the sixth portion 218f can be connected to the connection area 217. The third portion 218c and the sixth portion 218f can be connected to the connection area 217 through the gate drive pad 212 and / or the power control pad 213.

[0123] In some embodiments, the connector 219 can be arranged on the second portion 218b of the FPC plate 218.

[0124] In some embodiments, the level shifter 221 can be arranged on the third portion 218c and / or the sixth portion 218f of the FPC plate 218.

[0125] In some embodiments, the FPC plate 218' and the connection area 217 can also be arranged on the left and right sides of the display area, i.e., in the side frame area. For specific descriptions, please refer to the above related descriptions, which are not repeated here.

[0126] It should be noted that in some other embodiments of the present application, the FPC board connected with the connection area 217 can also have different structural arrangements, and different numbers of gate drive pads and / or power control pads can be arranged thereon according to requirements, which are not limited herein. Correspondingly, the pads connected therewith can also be arranged at other positions, so as to control the pixel units through the wires.

[0127] In addition, for other structural arrangements in the screen assembly 200a” and the corresponding effect implementation, reference can be made to the other related paragraphs of the screen assembly 200a’ in the above embodiments, which will not be described herein.

[0128] In order to better introduce the second embodiment of the screen assembly provided in the present application, the structure of a screen assembly 200b currently adopted will be introduced first in combination with FIGS. 5A-5C.

[0129] FIGS. 5A and 5B show a side view and a front view of a screen assembly 200b according to some embodiments. Among them, the screen assembly 200b adopts a COG packaging process. It should be noted that the screen assembly 200b can be an example of the screen assembly 200 described above, that is, the overall structure of the electronic device in which the screen assembly 200b is located can refer to the structure shown in FIGS. 1A and 1B.

[0130] As shown in FIG. 5A, as described above, the difference between the COG packaging process and the COF packaging process lies in the different positions of the source drive chip in the lower frame area. Among them, the source drive chip 209 shown in FIG. 2A is located on the FPC board 208, while the source drive chip 209 shown in FIG. 5A is arranged on the single-layer area 204, and no other chip is arranged on the FPC board 208.

[0131] As shown in FIG. 5B, specifically, in the screen assembly 200b, the single-layer area 204 of the substrate 201 is provided with a plurality of pads 211 / 212 / 213 arranged along the length direction (x direction), and the source drive chip 209 is connected with the single-layer area 204 through the pads 211 / 212 / 213. The single-layer area 204 is also provided with a plurality of pads 210 (an example of the third pad of the present application) arranged along the length direction (x direction), and the FPC board 208 is connected with the single-layer area 204 through the pads 210.

[0132] The other structures in the screen assembly 200b are the same as those in the screen assembly 200a, that is, including a display panel, the display panel includes the substrate 201, the CF board 202, and is divided into a double-layer area 203 and a single-layer area 204, and the double-layer area 203 includes a display area. Among them, the specific description can refer to the description in the screen assembly 200a described above, which will not be described herein.

[0133] Therefore, it can be understood that the source driving chip 209 in the screen assembly 200b is the same as that in the screen assembly 200a, and the source driving signal, the gate driving signal and the power control signal of the pixel unit are controlled by leading out the respective wires from the source driving chip on the screen assembly 200b and connecting to the pixel unit through the corresponding pads, so as to realize the control of the picture in the display area.

[0134] FIG. 5C shows a schematic diagram of internal wires of a screen assembly 200b according to some embodiments. It can be understood that FIG. 5C only shows a schematic diagram of the right half of the screen assembly 200b, and the wires of the left half are symmetrical to those of the right half.

[0135] Each pad 211 / 212 / 213 corresponding to each pin of the source driving chip 209 in FIG. 5C is connected to a wire extending in the width direction (y direction). The specific wire extension direction is the same as that in the screen assembly 200a, which will not be repeated here.

[0136] In addition, the source driving chip 209 is also electrically connected to the FPC board 208 through the wire connected to the pad 210.

[0137] In the above screen assembly 200b, all the source driving wires, the gate driving wires and the power control wires pass through the single layer area 204 of the lower frame area. Therefore, like the screen assembly 200a, the number of source driving wires is limited in the screen assembly 200b, which leads to the decrease of the resolution of the display area.

[0138] Based on this, the second embodiment of the screen assembly of the present application will be described in detail below in combination with FIGS. 6A-6C to improve the above-mentioned problems existing in FIGS. 5A-5C.

[0139] FIGS. 6A and 6B show a front view and a side view of a screen assembly 200b' according to some embodiments. The screen assembly 200b' adopts the COG packaging process. It should be noted that the screen assembly 200b' can be an example of the screen assembly 200 described above, that is, the overall structure of the electronic device in which the screen assembly 200b' is located can refer to the structure shown in FIGS. 1A and 1B.

[0140] In the screen assembly 200b', a connection area 217 is provided in the upper frame area, and an FPC board 218 is connected to the connection area 217. The gate driving wires and the power control wires are led out from the pads on the FPC board 218 and connected to the pixel units in the display area, so that the wiring space of the source driving wires located in the single layer area 204 of the lower frame area is increased. Thus, the screen assembly 200b' can improve the resolution of the display screen.

[0141] The screen assembly 200b' is different from the screen assembly 200a' only in encapsulation process. Therefore, the specific structure of the screen assembly 200b' can be described with reference to the description of the screen assembly 200a' above, and the difference is only that the source drive chip 209 is arranged on the single layer area 204, and the source drive chip 209 is connected with the single layer area 204 of the substrate 201 through the source drive pads 211. In addition, a plurality of pads 210 arranged along the length direction (x direction) are further arranged on the single layer area 204, and the FPC board 208 is connected with the single layer area 204 through the pads 210.

[0142] In some other embodiments of the present application, the FPC board connected with the connecting area 217 in the screen assembly 200b' can also be arranged in the same structure as the FPC board 218' in FIG. 4 (not shown), and the related structure can be described with reference to the FPC board 218' above, which will not be described here.

[0143] FIG. 6C shows a schematic diagram of internal wiring of a screen assembly 200b' according to some embodiments. It can be understood that FIG. 6C only shows a schematic diagram of the right half of the screen assembly 200b', and the wiring of the left half can be a symmetrical structure with the wiring of the right half.

[0144] The source drive wiring mode connected by each source drive pad 211 on the single layer area 204 in FIG. 6C, and the gate drive wiring mode connected by each gate drive pad 212 on the connecting area 217, and the power control wiring mode connected by each power control pad 213, are the same as the wiring modes in the screen assembly 200a', and can be described with reference to the above description, which will not be described here.

[0145] In addition, the pads 210 on the single layer area 204 are electrically connected with the source drive chip 209 through one-to-one corresponding wiring. Since the pads 210 are connected with the FPC board 208, the FPC board 208 is electrically connected with the source drive chip 209.

[0146] The screen assembly 200b' provided by the present application is the same as the screen assembly 200a' above, and the number of source drive wirings does not need to be reduced in order to match the size of the frame, so that the resolution of the display panel is improved while the refresh rate is ensured. In addition, the size of the lower frame can be further reduced without increasing or increasing the number of source drive wirings.

[0147] In order to better introduce the third embodiment of the screen assembly provided by the present application, the structure of a screen assembly 200c currently used will be introduced first in combination with FIGS. 7A-7C.

[0148] FIG. 7A and FIG. 7B show a side view and a front view of a screen assembly 200c according to some embodiments. In the screen assembly 200c, a COP packaging process is adopted. It should be noted that the screen assembly 200c can be an example of the screen assembly 200 described above, i.e., the overall structure of the electronic device in which the screen assembly 200c is located can refer to the structure shown in FIG. 1A and FIG. 1B.

[0149] As shown in FIG. 7A, as described above, the difference between the COP packaging process and the COF / COG packaging process is that, in the screen assembly 200c shown in FIG. 7A, the display area is directly arranged on the display panel, i.e., the substrate 201, and correspondingly, in the front surface of the substrate 201, the part other than the display area is a non-display area. In addition, the substrate 201 has a flexible characteristic, and the non-display area thereon further includes a bending area 215. The structure below the bending area 215 can be folded from the front surface to the back surface at a certain angle and with a certain radius, thereby realizing a narrow-frame design.

[0150] In some embodiments, the bending area 215 is located below the display area, i.e., in the lower frame area, and extends along the x direction. The structure below the bending area 215 includes part of the substrate 201 and the source driving chip 209 and the FPC board 208 connected thereto.

[0151] Specifically, the substrate 201 below the bending area 215 is provided with a plurality of pads 211 / 212 / 213 arranged along the length direction (x direction), and the source driving chip 209 is connected to the substrate 201 through the pads 211 / 212 / 213. The substrate 201 below the bending area 215 is further provided with a plurality of pads 210 arranged along the length direction (x direction), and the FPC board 208 is connected to the substrate 201 through the pads 210.

[0152] FIG. 7C shows a schematic diagram of internal wiring of the screen assembly 200c according to some embodiments. It can be understood that FIG. 7C only shows a schematic diagram of the right half of the screen assembly 200c, and the wiring of the left half is a symmetrical structure with the wiring of the right half.

[0153] Each pad 211 / 212 / 213 corresponding to each pin of the source driving chip 209 in FIG. 7C is connected to a wire extending along the width direction (y direction). The specific wiring arrangement is the same as that in the screen assembly 200a and 200b, which will not be described here.

[0154] In addition, the source driving chip 209 is further electrically connected to the FPC board 208 through the wires connected to the pads 210.

[0155] In the screen assembly 200c described above, all the source drive lines, the gate drive lines and the power control lines extend from the lower bezel area into the display area. Therefore, as in the screen assemblies 200a and 200b, the number of source drive lines is limited in the screen assembly 200c, which results in a decrease in the resolution of the display area.

[0156] Based on this, a third embodiment of the screen assembly of the present application is described in detail below in combination with FIGS. 8A-8C to improve the above-mentioned problems existing in FIGS. 7A-7C.

[0157] FIGS. 8A and 8B show front and side views of a screen assembly 200c', according to some embodiments. The screen assembly 200c' adopts a COP packaging process. It should be noted that the screen assembly 200c' can be an example of the screen assembly 200 described above, i.e., the overall structure of the electronic device in which the screen assembly 200c' is located can refer to the structures shown in FIGS. 1A and 1B.

[0158] As in the screen assemblies 200a' and 200b', in the screen assembly 200c', a connection area 217 is provided in the upper bezel area, and an FPC board 218 is connected to the connection area 217. The gate drive lines and the power control lines are led out from the pads on the FPC board 218 and connected to the pixel units in the display area, thus improving the resolution of the display screen.

[0159] The screen assembly 200c' is different from the screen assemblies 200a' and 200b' only in the packaging process, and thus the specific structure of the screen assembly 200c' can refer to the description of the screen assembly 200a' described above. The difference is that the screen assembly 200c' does not provide a CF board, and the substrate 201 includes a bending area 215 (an example of the first bending area of the present application) located in the non-display area of the lower bezel area and extending along the x direction, and a bending area 216 (an example of the second bending area of the present application) located in the non-display area of the upper bezel area and extending along the x direction. The source drive chip 209 is arranged on the substrate 201 below the bending area 215, and the source drive chip 209 is connected to the substrate 201 below the bending area 215 through the source drive pads 211. In addition, a plurality of pads 210 arranged along the length direction (x direction) are further provided on the substrate 201 below the bending area 215, and the FPC board 208 is connected to the substrate 201 through the pads 210.

[0160] In the non-display area of the lower bezel area, the first sub-area is the area above the bending area 215, and the second sub-area is the area below the bending area 215. The first trace extends to the display area via the second sub-area, the bending area 215, and the first sub-area. In the non-display area of the upper bezel area, the third sub-area is the area below the bending area 216, and the fourth sub-area is the area above the bending area 216. The second trace extends to the display area via the fourth sub-area, the bending area 216, and the third sub-area.

[0161] Specifically, the structure below the bending area 215 and the structure above the bending area 216 can be folded from the front side to the back side at a certain angle and with a certain radius, so as to achieve the design of a narrow bezel.

[0162] In some embodiments, the connection area 217 and the FPC plate 218 are arranged above the bending area 216. The related arrangement of the pads and traces on the connection area 217 and the FPC plate 218 can refer to the description of the screen assembly 200a' above.

[0163] FIG. 8C shows a schematic diagram of internal traces of a screen assembly 200c' according to some embodiments. It can be understood that FIG. 8C only shows a schematic diagram of the right half of the screen assembly 200c', and the traces of the left half of the screen assembly 200c' can be a symmetrical structure with the traces of the right half.

[0164] The manner in which the source drive traces connected to each source drive pad 211 on the substrate 201 in FIG. 8C, and the manner in which the gate drive traces connected to each gate drive pad 212 on the connection area 217 and the manner in which the power control traces connected to each power control pad 213 are the same as those of the screen assembly 200a'. For details, refer to the description above, which will not be repeated here.

[0165] The screen assembly 200c' provided in the present application is the same as the screen assemblies 200a' and 200b' described above, and can improve the resolution of the display panel while ensuring the refresh rate. In addition, the size of the lower bezel area can be further reduced without increasing or increasing the number of source drive traces.

[0166] FIG. 9 shows a schematic diagram of a structure of a tablet 20 according to some embodiments of the present application. The electronic device includes a housing and a screen assembly described in any of the above embodiments. The screen assembly is arranged on the housing. It should be noted that the embodiments of the present application can also be applied to any electronic device provided with a screen. The applicable electronic device is described above and will not be repeated here.

[0167] In some embodiments, the power supply principle of the tablet 20 is described below in combination with FIG. 3B: the electronic device further includes a mainboard (not shown), which is electrically connected with the screen assembly 200a' through a mainboard connector 207 provided on the PCB 206; wherein the mainboard includes a battery. When the connector male head 219 and the connector female seat 220 are electrically connected, the battery can provide a power supply signal to the gate drive wire and / or the power supply drive wire connected with the connector 219, so as to drive the pixel units in the display area. It should be noted that the power supply principle of the tablet 20 described above is applicable to any one of the embodiments corresponding to FIGS. 3A-4, 6A-6C, 8A-8C in the present application.

[0168] In the screen assembly and the electronic device described above, by arranging part of the wire in the original lower frame area of the display panel in other areas of the display panel, the wiring space of the source drive wire in the lower frame area is increased. In the case where the size of the lower frame area does not increase, a larger number of source drive wires can be accommodated, thereby improving the resolution of the display panel and simultaneously meeting the narrow frame design requirement.

[0169] The tablet 20 described above can include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a loudspeaker 170A, a receiver 170B, a microphone 170C, a headset jack 170D, a sensor module 180, a key 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 can include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0170] It can be understood that the structure shown in the embodiments of the present application does not constitute a specific limitation on the tablet 20. In other embodiments of the present application, the tablet 20 can include more or fewer components than shown, or combine certain components, or split certain components, or different component arrangements. The components shown can be implemented in hardware, software, or a combination of software and hardware.

[0171] The processor 110 can include one or more processing units, for example: the processor 110 can include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units can be independent devices or integrated in one or more processors.

[0172] The processor 110 can also be provided with a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory can hold instructions or data that the processor 110 has just used or is recycling. If the processor 110 needs to use the instructions or data again, it can call them directly from the memory. This avoids repeated access and reduces the waiting time of the processor 110, thus improving the efficiency of the system.

[0173] In some embodiments, the processor 110 can include one or more interfaces. The interfaces can include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0174] In some embodiments, the charging management module 140 is configured to receive a charging input from a charger.

[0175] In some embodiments, the power management module 141 is configured to connect the battery 142, and the charging management module 140 is configured to connect the processor 110.

[0176] In some embodiments, the wireless communication function of the tablet 20 can be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor, and the baseband processor, etc.

[0177] In some embodiments, the antenna 1 and the antenna 2 are configured to transmit and receive electromagnetic wave signals. Each antenna in the tablet 20 can be configured to cover a single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization of the antennas. For example, the antenna 1 can be multiplexed as a diversity antenna for wireless local area networks. In some other embodiments, the antennas can be used in combination with a tuning switch.

[0178] In some embodiments, the mobile communication module 150 can provide a solution for wireless communication including 2G / 3G / 4G / 5G, etc. applied on the tablet 20.

[0179] In some embodiments, the modem processor can include a modulator and a demodulator.

[0180] In some embodiments, the wireless communication module 160 can provide a solution for wireless communication including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR) technology, etc. applied on the tablet 20. The wireless communication module 160 can be one or more devices integrated with at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, performs frequency modulation and filtering processing on the electromagnetic wave signals, and sends the processed signals to the processor 110. The wireless communication module 160 can also receive signals to be sent from the processor 110, perform frequency modulation, amplification, and convert the signals to electromagnetic wave radiation via the antenna 2.

[0181] In some embodiments, the antennas 1 and the mobile communication module 150 of the tablet 20 are coupled, and the antennas 2 and the wireless communication module 160 are coupled, so that the tablet 20 can communicate with a network and other devices through wireless communication technologies. The wireless communication technologies can include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies, etc. The GNSS can include global positioning system (GPS), global navigation satellite system (GLONASS), beidou navigation satellite system (BDS), quasi-zenith satellite system (QZSS), and / or satellite based augmentation systems (SBAS).

[0182] In some embodiments, the tablet 20 implements a display function through a GPU, a display screen 194, an application processor, etc.

[0183] In some embodiments, the display screen 194 is used to display images, videos, etc.

[0184] In some embodiments, the tablet 20 can implement a shooting function through an ISP, a camera 193, a video codec, a GPU, a display screen 194, an application processor, etc.

[0185] In some embodiments, the camera 193 is used to capture still images or videos.

[0186] In some embodiments, the external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the tablet 20.

[0187] In some embodiments, the internal memory 121 can be used to store computer executable program codes, which include instructions.

[0188] In some embodiments, the tablet 20 can implement audio functions through the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the earphone interface 170D, and the application processor, etc. For example, music playing, recording, etc.

[0189] In some embodiments, the audio module 170 is used to convert digital audio information into analog audio signals output, and also used to convert analog audio input into digital audio signals.

[0190] In some embodiments, the speaker 170A, also called "loudspeaker", is used to convert audio electrical signals into sound signals.

[0191] In some embodiments, the receiver 170B, also called "earpiece", is used to convert audio electrical signals into sound signals.

[0192] In some embodiments, the microphone 170C, also called "microphone", "sounder", is used to convert sound signals into electrical signals.

[0193] In some embodiments, the earphone interface 170D is used to connect wired earphones.

[0194] In some embodiments, the keys 190 include power-on keys, volume keys, etc.

[0195] In some embodiments, the motor 191 can generate vibration prompts.

[0196] In some embodiments, the indicator 192 can be an indicator light, which can be used to indicate charging status, power changes, and also can be used to indicate messages, missed calls, notifications, etc.

[0197] In some embodiments, the SIM card interface 195 is used to connect SIM cards.

[0198] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the description provided herein. A person of ordinary skill in the art will recognize that elements from the various embodiments can be combined or eliminated to create other embodiments, which can not be shown explicitly herein. Only exemplary embodiments are described herein; the words "comprise," "belong," "contain," "have," "include," "possess," "retain," "involve," and "contain" and variations thereof are used synonymously if the applications where context does not dictate otherwise. It is intended that each of the elements discussed in this description is optional unless otherwise required by context. It is also intended that the scope of the present application is not limited to the specific embodiments described herein, but only by the claims that follow, including any equivalents.

[0199] While the application has been illustrated and described in the context of certain illustrative embodiments, it will be understood by those skilled in the art that various changes in form and detail can be made without departing from the scope of the application.

Claims

1. A screen assembly, characterized by The display panel comprises a display area and a non-display area, and is provided with a first wire and a second wire. The first wire extends from a first area of the non-display area to the display area and is electrically connected to a pixel unit of the display area. The second wire extends from a second area of the non-display area to the display area and is electrically connected to a pixel unit of the display area. The first wire is a source driving wire, the second wire is a gate driving wire and a power control wire, or the first wire is a source driving wire and a gate driving wire, and the second wire is a power control wire, or the first wire is a source driving wire and a power control wire, and the second wire is a gate driving wire. The first area and the second area are arranged on opposite sides of the display area, or the first area and the second area are arranged on adjacent sides of the display area.

2. The screen assembly of claim 1, wherein, The first wire is a source driving wire, and the second wire is a gate driving wire and a power control wire.

3. The screen assembly of claim 1, wherein, The non-display area is located in a frame area of the display panel, and the frame area comprises an upper frame area, a lower frame area and a side frame area. The first area is located in the lower frame area, and the second area is located in the upper frame area.

4. The screen assembly of claim 2, wherein, The screen assembly further comprises a source driving chip, the first area is provided with a first pad, and the first wire is connected to the source driving chip through the one-to-one corresponding first pad.

5. The screen assembly of claim 4, wherein, The first pad corresponds to a source driving pin of the source driving chip.

6. The screen assembly of claim 4, wherein, The screen assembly further comprises a first circuit board, the second area is provided with a second pad, and the second wire is connected to the first circuit board through the one-to-one corresponding second pad.

7. The screen assembly of claim 6, wherein, The first circuit board is provided with a level shifter, and the level shifter is connected to the gate driving wire.

8. The screen assembly of claim 6, wherein, The screen assembly further comprises a second circuit board. The source driving chip is arranged on the second circuit board, and the first area is connected to the second circuit board and the source driving chip through the first pad. Alternatively, the first area is further provided with a third pad, and the first area is connected to the second circuit board through the third pad.

9. The screen assembly of claim 8, wherein, The first circuit board is provided with a first connector, and the first connector is connected to the second wire. The screen assembly further comprises a third circuit board, the third circuit board is connected to the second circuit board and a main board respectively, the third circuit board is provided with a second connector, the second connector is electrically connected to the main board through the third circuit board and the main board, and is used to receive a power signal provided by the main board. The first connector and the second connector are used for snap-fit connection, so that the second connector provides the power signal to the second wire through the first connector.

10. The screen assembly of claim 6, wherein, The first circuit board comprises a first portion extending along a length direction of the display panel, and a third portion and a fourth portion extending along a width direction of the display panel; The first end of the third portion and the first end of the fourth portion are connected with the first portion, and the second end of the third portion and the second end of the fourth portion are connected with the second region; The length direction is perpendicular to the width direction.

11. The screen assembly of claim 6, wherein, The first circuit board comprises a first portion extending along a length direction of the display panel, and a third portion, a fourth portion, a fifth portion and a sixth portion extending along a width direction of the display panel; The first end of the third portion, the first end of the fourth portion, the first end of the fifth portion and the first end of the sixth portion are connected with the first portion, and the second end of the third portion, the second end of the fourth portion, the second end of the fifth portion and the second end of the sixth portion are connected with the second region; The length direction is perpendicular to the width direction.

12. The screen assembly of claim 1, wherein, The display panel comprises a filter plate and a substrate stacked along a thickness direction, the thickness direction being perpendicular to a length direction and a width direction of the display panel respectively; The filter plate has a projection area in a first plane smaller than a projection area of the substrate in the first plane; The projection area of the filter plate in the first plane comprises the display area, and the projection area of the substrate in the first plane comprises the display area and the non-display area; and the first plane is perpendicular to the thickness direction.

13. The screen assembly of claim 4, wherein, The first region comprises a first bending area extending along the length direction of the display panel; and When the first bending area is not bent, the first bending area divides the first region into a first sub-region and a second sub-region arranged along the width direction of the display panel, the first sub-region being closer to the display area than the second sub-region; The first pad is arranged in the second sub-region, and the first trace extends to the display area via the second sub-region, the first bending area and the first sub-region.

14. The screen assembly of claim 6, wherein, The second region comprises a second bending area extending along the length direction of the display panel; and When the second bending area is not bent, the second bending area divides the second region into a third sub-region and a fourth sub-region arranged along the width direction of the display panel, the third sub-region being closer to the display area than the fourth sub-region; The second pad is arranged in the fourth sub-region, and the second trace extends to the display area via the fourth sub-region, the second bending area and the third sub-region.

15. An electronic device, comprising: A screen assembly as claimed in any one of claims 1 to 14 is provided on a housing.

16. The electronic device of claim 15, wherein, The electronic device also comprises a mainboard electrically connected with the screen assembly; wherein the mainboard comprises a battery which provides a power signal to a first connector on the screen assembly through a second connector on the screen assembly, so that the first connector provides the power signal to the second trace.

Images