EFEM apparatus for wafer hardness testing

Abstract

The present application relates to the field of chip testing apparatuses, and in particular to an EFEM apparatus for wafer hardness testing, comprising a wafer transfer machine and a wafer hardness test machine, wherein the wafer transfer machine and the wafer hardness test machine are arranged side by side, and the wafer transfer machine and the wafer hardness test machine are provided with window channels in communication with each other; the wafer transfer machine comprises a loadport mechanism for loading wafer cassettes and a manipulator mechanism for handling wafers; and the wafer hardness test machine comprises a hardness tester for performing hardness tests on wafers, a moving platform, and a bearing platform mounted on the moving platform and used for fixing wafers, the moving platform being capable of driving the bearing platform to move in a horizontal plane. The present application has the effect of improving wafer testing efficiency.

Description

EFEM device for wafer hardness test TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing equipment, and particularly relates to an EFEM device for wafer hardness test. BACKGROUND

[0002] In the semiconductor industry, a wafer is a key substrate for chip manufacturing, and its performance is directly related to the quality of the final chip. With the continuous progress of technology, the requirements for various performance indicators of the wafer are increasingly stringent, and hardness is a crucial one. At present, in order to test the anti-violence attack capability of the wafer, the industry mainly uses the probe of a hardness tester to press the wafer to perform hardness test.

[0003] However, the existing test method mostly relies on manual operation, which is not only low in efficiency, but also has a high error rate and human factor interference. Therefore, there is an urgent need for a device capable of automatically performing wafer hardness test to improve the test efficiency and accuracy. SUMMARY

[0004] In order to improve the wafer test efficiency and accuracy, the present application provides an EFEM device for wafer hardness test.

[0005] The present application provides an equipment front end module (EFEM) device for wafer hardness test, which comprises a wafer wafer transfer machine and a wafer hardness tester, and the wafer wafer transfer machine and the wafer hardness tester are arranged side by side, and a window channel is formed in the wafer wafer transfer machine and the wafer hardness tester; the wafer wafer transfer machine comprises a load port mechanism for loading a wafer box and a mechanical hand mechanism for carrying a wafer, and the wafer hardness tester comprises a hardness tester for testing the hardness of the wafer, a moving platform and a bearing platform mounted on the moving platform for fixing the wafer, and the moving platform is configured to drive the bearing platform to move in a horizontal plane.

[0006] By adopting the above technical scheme, during the wafer hardness test, the wafer box is placed on the load port mechanism, and the Mapping operation is performed by the load port mechanism, then the mechanical hand mechanism automatically grabs the wafer and moves it to the wafer hardness tester through the window channel, and at the same time, the moving assembly drives the bearing platform to approach the mechanical hand mechanism to pick up the wafer. After the wafer is placed on the bearing platform, the moving assembly drives the bearing platform to approach the hardness tester to perform hardness test. The process does not require manual intervention and is automatically completed, thereby improving the test efficiency and the accuracy of the test results.

[0007] Optionally, an air floating platform is arranged below the moving platform, and the air floating platform is used to block the vibration of other mechanisms from being transmitted to the moving platform.

[0008] By adopting the technical scheme, the vibration of other mechanisms is blocked by the air floating platform from being transmitted to the moving platform, and the accuracy of the wafer hardness test result is further improved.

[0009] Optionally, the air floating platform is arranged apart from a machine table of the wafer hardness tester.

[0010] By adopting the technical scheme, the air floating platform is arranged apart from the wafer hardness tester, and the transmission of the vibration is further blocked.

[0011] Optionally, the bearing platform comprises a suction device, the suction device comprises a disc-shaped suction platform, the suction platform is provided with a plurality of suction holes, and the plurality of suction holes are arranged in a radial direction of the suction platform.

[0012] By adopting the technical scheme, the suction holes are provided with negative pressure by the vacuum pump, so that the wafer can be adsorbed and fixed. Meanwhile, the plurality of suction holes are arranged in the radial direction of the suction platform, and each group of suction holes is provided with a vacuum pump. By controlling the operation of different vacuum pumps, the suction platform can adsorb and fix wafers of different sizes.

[0013] Optionally, the suction platform is provided with a conversion assembly, the conversion assembly comprises a conversion piece, the conversion piece is in a whole cylindrical rod structure, the conversion piece is rotationally connected in the suction platform, the conversion piece is provided with a connecting cavity in the inside, the conversion piece is provided with a connecting hole in communication with the connecting cavity, a plurality of groups of connecting holes are arranged corresponding to the suction holes, and the plurality of groups of connecting holes are arranged in a circumferential direction of the conversion piece. Rotation of the conversion piece can make different groups of connecting holes and the suction holes communicate.

[0014] By adopting the technical scheme, rotation of the conversion piece makes the connecting holes at different positions of the conversion piece communicate with the corresponding suction holes. The negative pressure pump is always connected with the connecting cavity, and different groups of suction holes can adsorb the wafer by rotating the conversion piece, so that the wafer of different sizes can be adsorbed and fixed, the equipment structure is simplified, and the equipment cost is reduced.

[0015] Optionally, the conversion piece is divided in a length direction of the conversion piece to form a plurality of spliced rods, and the plurality of spliced rods correspond to the plurality of groups of suction holes.

[0016] By adopting the technical scheme, the conversion piece is divided to form a plurality of spliced rods which can rotate independently, so that the worker can make one group or two groups of suction holes work or two groups of suction holes at different positions work by rotating the spliced rods, more schemes for adsorbing the wafer are provided for the worker, and the worker is facilitated to fix the wafer.

[0017] Optionally, the conversion assembly further comprises a plurality of control members, each of the plurality of control members comprising a cylindrical connecting barrel, one end of the connecting barrel being connected to the splicing rod, the other end of the connecting barrel extending to the outside of the adsorption platform, and the plurality of connecting barrels being sleeved with each other.

[0018] By adopting the above technical solution, the cylindrical connecting barrels are sleeved with each other, so that the connecting barrels can rotate independently. The connecting barrels extend to the outside of the adsorption platform, and the staff can adjust the rotation of the splicing rod by rotating the connecting barrels outside the adsorption platform, thereby facilitating the staff to adjust the position of the connecting hole.

[0019] Optionally, each of the plurality of control members further comprises a torsion ring, the torsion ring being sleeved with the end of the connecting barrel away from the adsorption platform, and a on-off assembly being arranged on the torsion ring, the on-off assembly being used for connecting or disconnecting adjacent torsion rings.

[0020] By adopting the above technical solution, during use of the adsorption platform, when it is necessary to rotate a plurality of splicing rods synchronously, the adjacent torsion rings can be connected through the on-off assembly, so that the plurality of torsion rings are connected with each other, and then the plurality of torsion rings can be rotated synchronously to facilitate the rotation of the plurality of splicing rods. When it is necessary to adjust a single splicing rod, the connection between the adjacent torsion rings can be disconnected through the on-off assembly.

[0021] Optionally, the on-off assembly comprises a plug rod and a reset member, a plug hole being formed in the torsion ring, the plug rod being slidingly fitted in the plug hole along the length direction of the connecting barrel, and the plug rod being moved away from the torsion ring to enable the plug rod to enter the plug hole in the adjacent torsion ring, and the reset member being used for keeping the plug rod moving towards the torsion ring.

[0022] By adopting the above technical solution, the plug rod is moved to the outside of the plug hole, the plug rod is inserted into the plug hole of the adjacent torsion ring, and then the plug rod in the adjacent torsion ring is driven to continue moving, and the above process is repeated to realize the quick connection between the plurality of torsion rings.

[0023] Optionally, the on-off assembly is provided with a plurality of groups corresponding to the number of splicing rods, and the plurality of groups of on-off assemblies are uniformly and spacedly arranged around the rotation axis of the splicing rod.

[0024] By adopting the above technical solution, the plurality of groups of on-off assemblies improve the stability of the connected adjacent torsion rings, and at the same time, during adjustment of the splicing rod, the on-off assemblies on the adjacent torsion rings can always correspond after the splicing rod is rotated by a specific angle, thereby reducing the situation that the on-off assemblies on the adjacent two torsion rings are staggered to cause the adjacent torsion rings to be unable to be connected.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. The wafer conveying machine and the wafer hardness testing machine are placed side by side, and a window channel is provided, so that the mechanical hand device can carry the wafer from the wafer conveying machine to the wafer hardness testing machine for hardness detection. This process does not require human intervention, thus improving the wafer testing efficiency.

[0027] 2. The air floating platform exists as an independent stand, which is embedded in the overall device and maintains a mutual independent relationship with the device in position without any interaction. In this way, the vibration generated by the movement of the remaining mechanisms on the device can be reduced to the air floating platform, thereby avoiding affecting the test results of the hardness tester. BRIEF DESCRIPTION OF DRAWINGS

[0028] Fig. 1 is a schematic diagram of the overall structure of the first embodiment of the present application.

[0029] Fig. 2 is a schematic diagram of the structure of the wafer conveying machine of the first embodiment of the present application.

[0030] Fig. 3 is a schematic diagram of the structure of the wafer hardness testing machine of the first embodiment of the present application.

[0031] Fig. 4 is a schematic diagram of the structure of the adsorption platform of the second embodiment of the present application.

[0032] Fig. 5 is a schematic diagram of the structure of the conversion assembly of the second embodiment of the present application.

[0033] Fig. 6 is an enlarged view of part A of Fig. 5 of the second embodiment of the present application.

[0034] Fig. 7 is a schematic diagram of the structure of the control member of the second embodiment of the present application.

[0035] Fig. 1 is a schematic view of an EFEM device for wafer hardness testing; Fig. 2 is a schematic view of a wafer hardness tester; Fig. 3 is a schematic view of a wafer aligner; Fig. 4 is a schematic view of a wafer transfer machine; Fig. 5 is a schematic view of a wafer transfer machine; Fig. 6 is a schematic view of a wafer transfer machine; Fig. 7 is a schematic view of a wafer transfer machine. DETAILED DESCRIPTION

[0036] The present application is further described in detail below with reference to Figs. 1-7.

[0037] Embodiment 1

[0038] The present application discloses an EFEM device for wafer hardness testing.

[0039] Referring to Fig. 1, an EFEM device for wafer hardness testing includes two independent devices, a wafer transfer machine 1 and a wafer hardness tester 2. The wafer transfer machine 1 is used to transfer the wafer box to calibrate the wafer position, and the wafer hardness tester 2 is used to test the wafer hardness. The same window passage 16 is provided on the shell of the two devices, so that the inside of the shell of the two devices is connected to each other, and the smooth transmission of the wafer after splicing is realized. At the same time, in order to maintain the beauty and regularity of the overall structure, the wafer transfer machine 1 and the wafer hardness tester 2 are set to have the same height and width of the device size. The wafer transfer machine 1 and the wafer hardness tester 2 are controlled by PLC program to work, the wafer transfer machine 1 transports the wafer to the specified position on the wafer hardness tester 2 after the wafer position is glued, and the wafer hardness tester 2 detects the hardness of the wafer. The process does not need manual intervention, thereby improving the test efficiency and accuracy.

[0040] Referring to FIG. 1 and FIG. 2, the wafer transfer machine 1 comprises a loadport mechanism 11 for loading a wafer cassette, a wafer aligner 12 for aligning a wafer, an OCR camera 13 for reading a code, and a mechanical hand mechanism 14 for transferring a wafer. The OCR camera 13 can be lifted in a vertical direction to adapt to the reading of codes of wafers of different sizes. In the present embodiment, the lifting of the OCR camera 13 is directly driven by a pneumatic cylinder. During the operation of the wafer transfer machine 1, a worker places a wafer cassette on the loadport mechanism 11, and the loadport mechanism 11 performs a mapping operation. Then, the mechanical hand mechanism 14 carries the wafer to the wafer aligner 12 for alignment, and the OCR camera 13 performs a code reading operation on the wafer. Then, the wafer can be carried by the mechanical hand mechanism 14 to the wafer hardness tester 2 for wafer hardness testing.

[0041] Referring to FIG. 1 and FIG. 2, a flexible pad 15 is laid around the mechanical hand mechanism 14, so that the wafer will not fall to the ground when it is separated from the mechanical hand mechanism 14 due to special circumstances, thereby reducing the wafer breakage rate.

[0042] Referring to FIG. 1 and FIG. 3, the wafer hardness tester 2 comprises an air floating platform 21, a moving platform 22, and a hardness tester 23. The moving platform 22 and the hardness tester 23 are installed on the air floating platform 21. The moving platform 22 is provided with a bearing platform 24 for fixing a wafer. The mechanical hand mechanism 14 places the wafer on the bearing platform 24, which then fixes the wafer, and the hardness tester 23 detects the hardness of the wafer. Here, the air floating platform 21 has a vibration isolation effect, and the model can be ZTP09-06(-K). This reduces the situation where the vibration of the equipment is transmitted to the wafer, resulting in inaccurate wafer hardness test results.

[0043] The moving platform 22 is further composed of an X-axis movement mechanism 221, a Y-axis movement mechanism 222, and a Z-axis movement mechanism 223, which are all installed on the air floating platform 21 to ensure the stability and accuracy of the test. The X-axis, Y-axis, and Z-axis all adopt a gear plus synchronous belt transmission mode and are precisely controlled by a servo motor, thereby realizing high-precision movement of the moving platform 22, so that the bearing platform 24 can approach or move away from the mechanical hand mechanism 14, take the wafer, and move the wafer to the lower side of the hardness tester 23. In other embodiments, the X-axis movement mechanism 221, the Y-axis movement mechanism 222, and the Z-axis movement mechanism 223 can also be linear modules.

[0044] Referring to FIGS. 1 and 3, the bearing platform 24 is rotationally connected to the moving platform 22 to facilitate adjustment of the position of the bearing platform 24. The bearing platform 24 is positioned by a pin locking mechanism (not shown in the drawings) in which a pin that is slidably connected to the moving platform 22 is inserted into a corresponding limiting hole in the bearing platform 24. The pin locking mechanism can be uniformly provided with multiple pins around the rotation axis of the bearing platform 24.

[0045] Referring to FIGS. 1 and 3, in the present embodiment, the X-axis movement mechanism 221 is mounted on the Z-axis movement mechanism 223, and the Y-axis movement mechanism 222 is mounted on the X-axis movement mechanism 221. The bearing platform 24 includes a rotating plate and a suction device. The rotating plate is rotationally connected to the Y-axis movement mechanism 222, and the suction device is mounted on the rotating plate and used to suction a wafer. The bearing platform 24 is rotationally connected to the moving platform 22.

[0046] Referring to FIGS. 1 and 3, the suction device includes a suction mechanism and a suction platform 241. The suction platform 241 is in a disc type structure and used to place a wafer. A plurality of groups of suction holes 242 are formed in the suction platform 241 and arranged along the radial direction of the suction platform 241. Each group of suction holes 242 includes three rows of suction holes 242 that are uniformly spaced around the axis of the suction platform 241. Each row of suction holes 242 includes a plurality of suction holes 242 arranged along the radial direction of the suction platform 241. The suction mechanism is provided with two groups of suction holes 242. The suction mechanism is used to generate negative pressure inside the suction holes 242. In the present embodiment, the suction mechanism (not shown in the drawings) can be a vacuum pump connected to the suction holes 242. A jacking cylinder is arranged below the suction platform 241. The jacking cylinder is fixedly connected to the rotating plate, and the piston rod of the jacking cylinder is connected to the suction platform 241. During the process of picking up a wafer, the moving platform 22 drives the suction platform 241 to approach the mechanical hand mechanism 14. Then, the jacking cylinder drives the suction platform 241 to rise and approach the wafer. Then, the wafer is suctioned by the vacuum chuck, and the wafer is picked up.

[0047] Referring to FIGS. 1 and 3, a support is arranged below the air floating platform 21. An embedded hole 3 is arranged on the machine table of the wafer hardness tester 2. The support is embeddedly mounted in the embedded hole 3 and supported on the ground. The support is arranged in a gap with the machine table of the wafer hardness tester 2 to block the transmission of vibration of the wafer hardness tester 2 and other mechanisms to the air floating platform 21, thereby improving the accuracy of the wafer hardness test results.

[0048] The implementation principle of the EFEM device for wafer hardness testing in the present embodiment is that the mechanical hand mechanism 14 and the moving platform 22 cooperate with each other to realize the transmission of a wafer from the wafer transfer machine 1 to the wafer hardness tester 2, realize automatic calibration of the wafer and automatic testing of the wafer hardness, and thereby improve the efficiency and accuracy of wafer testing.

[0049] Embodiment 2

[0050] Referring to FIG. 4 and FIG. 5, the difference between this embodiment and embodiment 1 is that the structure of the adsorption platform 241 is different. Meanwhile, the adsorption mechanism in this application is arranged as a group. In this embodiment, the adsorption platform 241 is provided with a conversion assembly 4. For the convenience of description, define a plurality of groups of adsorption holes 242 as the first hole group, the second hole group, the third hole group, …, the Nth hole group, and the conversion assembly 4 is used to make the adsorption mechanism communicate with any one of the hole groups. In this way, the structure of the equipment can be simplified, and the cost of the equipment can be reduced.

[0051] Referring to FIG. 4 and FIG. 5, the conversion assembly 4 includes a conversion piece 41, which is in a cylindrical structure as a whole. The conversion piece 41 is arranged along the arrangement direction of the plurality of groups of adsorption holes 242, that is, along the radial direction of the adsorption platform 241. The adsorption platform 241 is provided with a rotating cavity 43, and the conversion piece 41 is rotationally connected in the rotating cavity 43, and the side wall of the conversion piece 41 is attached to the side wall of the rotating cavity 43. The conversion piece 41 is internally provided with a connecting cavity 42, and two groups of connecting holes 45 are provided on the side wall of the conversion piece 41 corresponding to the two groups of adsorption holes 242 and at the radial position of the adsorption platform 241. The connecting holes 45 are in communication with the inside of the connecting cavity 42, and the two groups of connecting holes 45 are located on different generatrices of the conversion piece 41. That is, only one group of connecting holes 45 can correspondingly communicate with the adsorption holes 242 in the normal state, and the other group of connecting holes 45 is staggered with the adsorption holes 242.

[0052] Referring to FIG. 4 and FIG. 5, the adsorption platform 241 is provided with a negative pressure cavity 46 below, and the adsorption mechanism is in communication with the negative pressure cavity 46 to generate negative pressure in the negative pressure cavity 46. The opening on one side of the connecting cavity 42 is in communication with the negative pressure cavity 46, so that negative pressure is generated in the connecting cavity 42, and then negative pressure is generated in the adsorption holes 242 to realize the adsorption of the wafer. Meanwhile, rotating the conversion piece 41 can make the connecting holes 45 at different positions correspond to the adsorption holes 242, so as to realize the adsorption of wafers of different sizes.

[0053] Referring to FIG. 4 and FIG. 5, the conversion piece 41 includes an inner ring 413 and an outer ring 412, and the outer ring 412 is sleeved outside the inner ring 413 and is arranged in a spaced manner with the inner ring 413 to form the connecting cavity 42. The side of the conversion piece 41 away from the negative pressure cavity 46 is welded with a blocking plate 414 to seal one end of the connecting cavity 42 away from the negative pressure cavity 46, and at the same time realize the fixed connection between the inner ring 413 and the outer ring 412. In order to strengthen the connection between the inner ring 413 and the outer ring 412, a long strip-shaped rib plate can be arranged between the inner ring 413 and the outer ring 412 along the length direction of the conversion piece 41, and the rib plate is welded on both sides with the inner ring 413 and the outer ring 412.

[0054] Referring to FIG. 4 and FIG. 5, the conversion piece 41 is divided into multiple splicing rods 411 corresponding to multiple groups of adsorption holes 242 along the length direction of the conversion piece 41. By rotating the splicing rods 411, the relative positions of the multiple groups of connecting holes 45 on the conversion piece 41 can be changed, so that the multiple groups of connecting holes 45 are simultaneously communicated with the multiple groups of adsorption holes 242, or a single group of connecting holes 45 is communicated with a single group of adsorption holes 242, thereby providing more ways for the staff to fix the wafers.

[0055] Referring to FIG. 5 and FIG. 6, the conversion assembly 4 further comprises multiple control pieces 44 corresponding to the splicing rods 411, for driving the splicing rods 411 to rotate. The multiple control pieces 44 corresponding to the splicing rods 411 are coaxially arranged with the splicing rods 411, and one end of the control piece 44 is welded to the splicing rod 411, and the other end extends to the outside of the adsorption platform 241. The control piece 44 away from the negative pressure cavity 46 is sleeved outside the control piece 44 close to the negative pressure cavity 46. The multiple control pieces 44 are sequentially defined as a first control piece 44, a second control piece 44, a third control piece 44, and an Nth control piece 44 from the side away from the negative pressure cavity 46 to the side away from the negative pressure cavity 46 along the radial direction of the adsorption platform 241, and the splicing rods 411 in this direction are sequentially defined as a first splicing rod 411, a second splicing rod 411, a third splicing rod 411, and an Nth splicing rod 411. One end of the control piece 44 is coaxially welded to the splicing rod 411 away from the negative pressure cavity 46, and the other end extends to the outside of the adsorption platform 241. The control piece 441 of the second control piece 44 passes through the control piece 441 of the first control piece 44 and the first splicing rod 411, and is coaxially welded to the second splicing rod 411, and the connection of the control piece 441 of the Nth control piece 44 and the Nth splicing rod 411 is completed in the same way. The torsion ring 442 is sleeved on the end of the control piece 441 away from the negative pressure cavity 46, and the outer walls of the multiple torsion rings 442 are flush. Rotating the torsion ring 442 can drive the control piece 441 to rotate, and in turn drive the splicing rod 411 to rotate, thereby adjusting the rotation of the splicing rod 411.

[0056] Referring to FIG. 5 and FIG. 7, the torsion ring 442 is provided with a switching assembly 5, in combination with FIG. 6, the switching assembly 5 includes a plug rod 51, and the torsion ring 442 is provided with a plug hole 53 penetrating along the axial direction of the torsion ring 442. The plug rod 51 is slidably arranged in the plug hole 53 along the direction parallel to the axial direction of the torsion ring 442. The two ends of the plug rod 51 are flush with the two end faces of the torsion ring 442. Moving the plug rod 51 away from the adsorption platform 241, the plug rod 51 can be inserted into the plug hole 53 on the adjacent torsion ring 442, and the plug rod 51 on the adjacent torsion ring 442 is driven to move. In this way, the connection between the plurality of torsion rings 442 is achieved, so that the worker can rotate a plurality of splicing rods 411 at the same time, and further provides a way for the worker to adjust the splicing rod 411.

[0057] Referring to FIG. 5 and FIG. 6, the switching assembly 5 further includes a reset member 52, which is used to apply a force to the plug rod 51 to move the plug rod 51 towards the adsorption platform 241, so that the plug rod 51 can be automatically reset after the worker stops applying force to the plug rod 51, and the plurality of torsion rings 442 are disconnected.

[0058] Referring to FIG. 5 and FIG. 6, in the normal state, the connecting holes 45 on the plurality of splicing rods 411 are uniformly and circumferentially arranged on the splicing rod 411. Therefore, in the embodiment, the switching assembly 5 is uniformly and circumferentially arranged in multiple groups on the torsion ring 442. In the embodiment, the number of splicing rods 411 is three, and the included angle between the connecting holes 45 on the adjacent two splicing rods 411 is 120°. Therefore, in the embodiment, the switching assembly 5 is arranged in three groups along the circumference of the torsion ring 442, so that the switching assembly 5 on the adjacent two torsion rings 442 can correspond to any one of the connecting holes 45 and the adsorption hole 242. At the same time, the plurality of plug rods 51 simultaneously connecting the adjacent torsion rings 442 can improve the stability of the connected torsion rings 442.

[0059] Referring to FIG. 5 and FIG. 6, the adsorption platform 241 is provided with a control mechanism 6, and the control mechanism 6 is located between the torsion ring 442 and the adsorption platform 241. The control mechanism 6 is used to drive the plug rod 51 to move. The control mechanism 6 includes a control ring 61 rotatably connected to the adsorption platform 241. The control ring 61 is in a cylindrical structure, one end of which is rotatably connected to the adsorption platform 241 about the axial direction of the control ring 61, and the other end abuts against the torsion ring 442. The control ring 61 is provided with three control rods 62 corresponding to the plug rod 51. The control rod 62 is slidably connected to the control ring 61. Sliding the control rod 62 can make the control rod 62 inserted into the plug hole 53, and drive the plug rod 51 to move. In this state, rotating the control ring 61 can drive the plurality of torsion rings 442 to rotate synchronously.

[0060] Referring to FIGS. 5 and 6, the control mechanism 6 further comprises a linkage ring 63 located on the side of the control rod 62 away from the torsion ring 442. The linkage ring 63 is sleeved on the control ring 61 and can slide in a direction parallel to the sliding direction of the control rod 62. The end of the control rod 62 close to the linkage ring 63 is welded on the linkage ring 63, and moving the linkage ring 63 can drive the plurality of control rods 62 to move, which facilitates the worker to adjust the positions of the plurality of control rods 62.

[0061] Referring to FIGS. 5 and 6, the control mechanism 6 further comprises a clamping assembly 64 comprising a clamping ring 641 and a clamping rod 642, which is welded on the outer sidewall of the linkage ring 63 in a radial direction of the linkage ring 63. The clamping ring 641 is sleeved on the control ring 61 and located on the side of the linkage ring 63 away from the adsorption platform 241. The clamping ring 641 is provided with a clamping groove 643 comprising a circumferential part and an axial part, both of which are rectangular grooves. The axial part is arranged along the axis direction of the connecting ring, and the circumferential part is arranged along the circumferential direction of the clamping ring 641. The end of the axial part and the end of the circumferential part are connected to each other to form an L-shaped groove. The side of the axial part close to the adsorption platform 241 is provided with an opening, and moving the linkage ring 63 towards the clamping ring 641 can drive the clamping rod 642 to enter the axial part. After the clamping rod 642 corresponds to the circumferential part, rotating the clamping ring 641 can make the clamping rod 642 enter the circumferential part, thereby limiting the movement of the linkage ring 63, so that the worker does not need to continuously apply force to the linkage ring 63 in the process of synchronously controlling the plurality of torsion rings 442, facilitating the worker to rotate the plurality of torsion rings 442.

[0062] Referring to FIGS. 5 and 6, for the convenience of description, the rotating direction of the clamping rod 642 entering the circumferential part when the clamping ring 641 rotates is defined as a positive direction. The clamping assembly 64 further comprises a resilient member 65 for keeping the clamping ring 641 in a positive rotating trend. In the present embodiment, the resilient member 65 is a volute spring, one end of which is welded with the control ring 61 and the other end is welded with the clamping ring 641. Under the action of the resilient member 65, the clamping rod 642 can stably be in the circumferential part, improving the stability of limiting the linkage ring 63.

[0063] Referring to FIGS. 5 and 6, the sidewall close to the circumferential part of the axial part is provided with a guide inclined surface 66, which is inclined away from the axial part from the side away from the adsorption platform 241 to the side close to the adsorption platform 241 in a direction parallel to the sliding direction of the linkage ring 63. When the linkage ring 63 moves towards the clamping ring 641, the clamping ring 641 automatically rotates under the action of the guide inclined surface 66, guiding the clamping rod 642 to enter the axial part. When the clamping ring 641 corresponds to the circumferential part, the clamping ring 641 automatically rotates under the action of the resilient member 65, making the clamping rod 642 enter the circumferential part.

[0064] Referring to FIG. 4 and FIG. 5, the adsorption platform 241 is provided with a locking assembly 7 for limiting the rotation of the splicing rod 411, the locking assembly 7 comprises a limiting rod 71, a sliding groove is formed in the side wall of the rotating cavity 43, the limiting rod 71 is slidingly connected in the sliding groove along the radial direction of the conversion piece 41, a limiting groove 73 is formed in the outer side wall of the outer ring 412 corresponding to the limiting rod 71, the sliding limiting rod 71 can make the limiting rod 71 inserted into the limiting groove 73, thereby limiting the rotation of the conversion piece 41 and improving the stability of the communication between the connecting hole 45 and the adsorption hole 242. The limiting groove 73 is also uniformly and spacedly arranged three along the circumference of the splicing rod 411. So that when any group of connecting holes 45 is connected with the adsorption hole 242, it can be in a relatively stable state. The locking assembly 7 further comprises a compression member 72, the compression member 72 is used for making the limiting rod 71 keep the tendency of moving towards the direction close to the splicing rod 411, in the embodiment, the compression member 72 is a compression spring, the compression spring is located in the sliding groove, and one end of the compression spring is welded with the limiting rod 71, and the other end of the compression spring is welded with the side wall of the sliding groove.

[0065] Referring to FIG. 4 and FIG. 5, the end of the limiting rod 71 close to the splicing rod 411 is provided with a spherical surface, so that when the splicing rod 411 is subjected to sufficient force, under the action of the spherical surface, the limiting rod 71 can be separated from the limiting groove 73, which facilitates the rotation of the splicing rod 411 by the staff, and at the same time, it can be stably in a certain state without external force.

[0066] Referring to FIG. 4 and FIG. 5, the conversion assembly 4 is uniformly provided with three groups around the circumference of the adsorption platform 241, so as to correspond to the multiple rows of adsorption holes 242 in the same group of adsorption holes 242. In order to facilitate the adjustment of multiple conversion pieces 41, the adsorption platform 241 is provided with a bevel gear set 8, the bevel gear set 8 comprises a large bevel gear ring 81 rotatingly sleeved outside the adsorption platform 241 and a small bevel gear 82 fixedly sleeved on the control ring 61, the small bevel gear 82 is meshed with the large bevel gear ring 81, so that the large bevel gear ring 81 can synchronously drive multiple small bevel gears 82 to rotate, thereby realizing the synchronous adjustment of the rotation of multiple conversion pieces 41.

[0067] The implementation principle of the EFEM device for wafer hardness test in the embodiment of the application is that the rotation of the conversion piece 41 can make the negative pressure cavity 46 communicated with the adsorption holes 242 at different positions, thereby realizing the adsorption of wafers of different gears, and simultaneously, multiple adsorption mechanisms do not need to be arranged, which simplifies the device structure and reduces the device cost.

[0068] The above are the preferred embodiments of the application, which do not limit the protection scope of the application, therefore: all equivalent changes made according to the structure, shape and principle of the application should be covered within the protection scope of the application.

Claims

1. An EFEM device for wafer hardness testing, comprising a wafer transfer machine (1) and a wafer hardness tester (2), characterized in that: The wafer conveying machine (1) and the wafer hardness testing machine (2) are arranged side by side, and a window channel (16) is formed in the wafer conveying machine (1) and the wafer hardness testing machine (2) and is in communication with each other; the wafer conveying machine (1) comprises a loading port mechanism (11) for loading a wafer box and a mechanical hand mechanism (14) for conveying wafers, and the wafer hardness testing machine (2) comprises a hardness tester (23) for testing the hardness of wafers, a moving platform (22), and a bearing platform (24) for fixing wafers installed on the moving platform (22), and the moving platform (22) is configured to drive the bearing platform (24) to move in a horizontal plane.

2. The EFEM apparatus for wafer hardness testing of claim 1, wherein: A gas floating platform (21) is arranged below the moving platform (22), and the gas floating platform (21) is used to block the vibration of other mechanisms from being transmitted to the moving platform (22).

3. The EFEM apparatus for wafer hardness testing of claim 2, wherein: The gas floating platform (21) is arranged apart from the machine table of the wafer hardness testing machine (2).

4. The EFEM apparatus for wafer hardness testing of any of claims 1-3, wherein: The bearing platform (24) comprises a suction device, the suction device comprises a disc-shaped suction platform (241), a suction hole (242) is formed in the suction platform (241), and a plurality of groups of suction holes (242) are arranged radially on the suction platform (241).

5. The EFEM apparatus for wafer hardness testing of claim 4, wherein: A conversion assembly (4) is arranged on the suction platform (241), the conversion assembly (4) comprises a conversion piece (41), the conversion piece (41) is in the form of a cylindrical rod as a whole, the conversion piece (41) is rotatably connected inside the suction platform (241), a connecting cavity (42) is formed in the conversion piece (41), a connecting hole (45) is formed in the conversion piece (41) and is in communication with the connecting cavity (42), a plurality of groups of connecting holes (45) are arranged corresponding to the suction holes (242), and a plurality of groups of connecting holes (45) are arranged in a circumferential direction of the conversion piece (41), and rotating the conversion piece (41) can make different groups of connecting holes (45) communicate with the suction holes (242).

6. The EFEM apparatus for wafer hardness testing of claim 5, wherein: The conversion piece (41) is divided into a plurality of spliced rods (411) along the length direction of the conversion piece (41), and the plurality of spliced rods (411) correspond to a plurality of groups of suction holes (242).

7. The EFEM apparatus for wafer hardness testing of claim 6, wherein: The conversion assembly (4) further comprises a plurality of control pieces (44), each of the plurality of control pieces (44) comprises a cylindrical connecting cylinder (441), one end of the connecting cylinder (441) is connected to the plurality of spliced rods (411), the other end of the connecting cylinder (441) extends to the outside of the suction platform (241), and a plurality of connecting cylinders (441) are sleeved with each other.

8. The EFEM apparatus for wafer hardness testing of claim 7, wherein: Each of the plurality of control pieces (44) further comprises a torsion ring (442), the torsion ring (442) is sleeved on the end of the connecting cylinder (441) away from the suction platform (241), and an on-off assembly (5) is arranged on the torsion ring (442), and the on-off assembly (5) is used to connect or disconnect adjacent torsion rings (442).

9. The EFEM apparatus for wafer hardness testing of claim 8, wherein: The on-off assembly (5) comprises an insertion rod (51) and a reset member (52), an insertion hole (53) is formed in the torsion ring (442), the insertion rod (51) is slidingly fitted in the insertion hole (53) along the length direction of the connecting barrel (441), sliding the insertion rod (51) away from the torsion ring (442) can make the insertion rod (51) enter the insertion hole (53) on the adjacent torsion ring (442), and the reset member (52) is used for keeping the insertion rod (51) moving towards the torsion ring (442).

10. The EFEM apparatus for wafer hardness testing of claim 9, wherein: The on-off assembly (5) is provided with multiple groups corresponding to the number of the spliced rods (411), and multiple groups of the on-off assemblies (5) are uniformly and spacedly arranged around the rotation axes of the multiple spliced rods (411).

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