Optical waveguide device and manufacturing method therefor, and signal detection system

Abstract

An optical waveguide device (10) and a manufacturing method therefor, and a signal detection system, which relate to the technical field of optical waveguide sensing. The optical waveguide device (10) comprises an optical splitter waveguide chip (100), a plurality of first optical fibers (210), an optical transceiver waveguide chip (300), a plurality of second optical fibers (220) and a photodetector array (400), wherein the optical splitter waveguide chip (100) is used for being coupled to a laser source and the plurality of first optical fibers (210), and is configured to send, to the first optical fibers (210) on a one-to-one correspondence basis, a plurality of pieces of detection light received from the laser source; the optical transceiver waveguide chip (300) is used for being coupled to the plurality of first optical fibers (210), a detection element and the plurality of second optical fibers (220), and is configured to send, to the second optical fibers (220) on a one-to-one correspondence basis, a plurality of pieces of reflected light passing through the detection element; and the photodetector array (400) is coupled to and aligned with the plurality of second optical fibers (220), so as to correspondingly receive the reflected light.

Description

Optical waveguide device, manufacturing method thereof and signal detection system TECHNICAL FIELD

[0001] The present application relates to the field of optical waveguide sensing technology, and in particular to an optical waveguide device, a manufacturing method thereof and a signal detection system. BACKGROUND

[0002] Optical fiber sensing technology is a sensing technology that uses optical fiber as a medium and light as a carrier to perceive and transmit external signals. When light is transmitted in the optical fiber, changes in the external environment will cause corresponding changes in various characteristics of the transmitted light. By monitoring the changes in the light wave parameters, information about the external environment of the optical fiber can be obtained, thereby achieving sensing.

[0003] In the related technology, multiple incident light paths, multiple exit light paths and reflection light paths corresponding to the multiple incident light paths are integrated on a piece of optical chip. The probe light propagates forward in each incident light path and enters the exit light path. When the probe light meets the detection element, the detection element reflects the light information carrying the temperature information back. The reflected light information enters the reflection light path again and is sent to the photodetector by the reflection light path. The photodetector receives the reflected light information carrying the temperature information and compares it with the probe light emitted by the probe light source. The temperature value can be obtained according to the center wavelength shift, and the temperature measurement is completed.

[0004] However, this distributed temperature detection makes the number of incident light paths, exit light paths and reflection light paths integrated on the whole optical chip extremely large, and the optical path structure of the whole chip is very complex, with a low yield. If part of the optical path structure is damaged during use, the whole chip needs to be replaced, which is costly. SUMMARY

[0005] The present application aims to at least solve the technical problem in the prior art that the number of incident light paths, exit light paths and reflection light paths integrated on the whole optical chip is extremely large, the optical path structure of the whole chip is very complex, the yield is low, and if part of the optical path structure is damaged during use, the whole chip needs to be replaced, which is costly. To this end, the present application provides an optical waveguide device, a manufacturing method thereof and a signal detection system.

[0006] In a first aspect, the present application provides an optical waveguide device, comprising: an optical branching waveguide chip, a plurality of first optical fibers, an optical transceiver waveguide chip, a plurality of second optical fibers and a photodetector array.

[0007] The optical branching waveguide chip is configured to be coupled to a laser source and a plurality of first optical fibers, and is configured to transmit the probe light received from the laser source to the first optical fibers one by one.

[0008] The optical transceiver waveguide chip is configured to transmit the reflected light one by one from the plurality of the probe elements to the plurality of the second optical fibers.

[0009] The photodetector array is coupled and aligned with the plurality of the second optical fibers to correspondingly receive the reflected light.

[0010] By adopting the above technical solutions, the optical branching waveguide chip and the optical transceiver waveguide chip are separated, and the coupling efficiency therebetween is optimized, the optical path structure on a single chip can be simplified, and the product yield is improved; even if part of the optical path structure is damaged during use, only the corresponding damaged chip needs to be replaced, which also reduces the maintenance cost; in addition, compared with the related art, the photodetector array does not need to be attached to the optical chip, but is coupled and aligned with the plurality of the second optical fibers, so that the photodetector array is not limited to a specific installation position, and the installation difficulty of the plurality of the second optical fibers is low, and the coupling efficiency is high.

[0011] In an embodiment, further comprising: a box body;

[0012] The optical branching waveguide chip, the plurality of the first optical fibers, the optical transceiver waveguide chip, the plurality of the second optical fibers, and the photodetector array are all arranged in the box body, and a wall surface of the box body is provided with a clamping groove for clamping the optical branching waveguide chip and the optical transceiver waveguide chip.

[0013] By adopting the above technical solutions, the clamping groove in the box body allows the optical branching waveguide chip and the optical transceiver waveguide chip to be installed in a modular form. This modular design allows the optical branching waveguide chip and the optical transceiver waveguide chip to be installed and replaced as independent units, thereby simplifying the maintenance and upgrading process.

[0014] In an embodiment, the optical branching waveguide chip and the optical transceiver waveguide chip are both arranged on a side wall surface of the box body.

[0015] By adopting the above technical solutions, the side wall surface of the box body can leave more space in the center region of the box body for arranging other components, such as the photodetector array, the circuit board, or other control hardware. This helps to more efficiently manage space, which is particularly important in size-limited applications.

[0016] In an embodiment, the box body includes: a box body, a baffle, and a first fixing structure.

[0017] At least one side wall of the box body is provided with a notch, and the baffle is arranged in the notch and detachably connected to the box body through the first fixing structure; and the optical branching waveguide chip and the optical transceiver waveguide chip are arranged on the baffle or the inner bottom surface of the box body.

[0018] By adopting the above technical solution, the optical branching waveguide chip and the optical transceiver waveguide chip are mounted on the detachable baffle, which means that the whole baffle can be taken out as a module unit for convenient external operation and maintenance without complex manual operation in a narrow space.

[0019] In an embodiment, the optical branching waveguide chip comprises: a primary coupling module and at least two secondary coupling modules.

[0020] The primary coupling module comprises at least two primary branch ports for receiving probe light emitted from the laser source correspondingly;

[0021] Each secondary coupling module is coupled to a primary branch port of the primary coupling module, and the secondary coupling module comprises at least two secondary branch ports for transmitting the received probe light to the first optical fiber correspondingly.

[0022] By adopting the above technical solution, the primary coupling module first receives the probe light from the laser source, and then distributes the optical signal to each first optical fiber through the secondary coupling module. This hierarchical method allows each coupling stage to be optimized to meet different output requirements.

[0023] In an embodiment, the optical transceiver waveguide chip comprises: a plurality of incident light paths, a plurality of exit light paths corresponding to the number of incident light paths, and a plurality of reflection light paths;

[0024] The first optical fiber is in communication with the incident light path one-to-one, the incident light path is in communication with the exit light path, and the exit light path is used for transmitting the probe light to the detection element;

[0025] The exit light path is in communication with the reflection light path, and the reflection light path is used for transmitting a plurality of reflected lights of the detection element to the second optical fiber one-to-one.

[0026] By adopting the above technical solution, if the detection element is a fiber grating, the fiber grating will present different structures under the influence of thermal expansion and contraction or force. The probe light propagates from the incident light path to the exit light path, and then propagates from the exit light path to the structure, which will be reflected. The information (reflected light) carrying temperature / force is transmitted to the second optical fiber one-to-one through the reflection light path.

[0027] In an embodiment, further comprising a filter.

[0028] A plurality of the second optical fibers are coupled to the filter and inserted into the photodetector array through the filter, and the filter is used to reduce the non-target light waves from entering the photodetector array.

[0029] By using the above technical solution, the main function of the filter is to prevent non-target light waves (stray light) from entering the photodetector array. Non-target light waves may come from ambient light or other light sources inside the device, which may interfere with the accuracy and reliability of the photodetector.

[0030] In an embodiment, further comprising an FPC flexible flat cable and a plug.

[0031] The FPC flexible flat cable is installed on the photodetector array, and the plug is installed on one end of the FPC flexible flat cable away from the photodetector array, and the plug is used to plug into the signal detection device.

[0032] In an embodiment, the present application provides a signal detection system, comprising:

[0033] A laser source;

[0034] An optical waveguide device, the laser source is used to send detection light to the optical branching waveguide chip;

[0035] A plurality of measurement optical fibers, the number of the measurement optical fibers corresponds to the number of the first optical fibers, and each of the measurement optical fibers is provided with a detection element.

[0036] In an embodiment, the present application provides a manufacturing method of an optical waveguide device,

[0037] Providing a box body, and clamping the optical branching waveguide chip and the optical transceiver waveguide chip in the box body respectively;

[0038] Connecting the optical branching waveguide chip and the optical transceiver waveguide chip through a plurality of first optical fibers, and sending a plurality of detection lights received by the optical branching waveguide chip from the laser source to the first optical fibers one by one;

[0039] Under the premise that the detection element is provided in the measurement optical fiber, connecting the optical transceiver waveguide chip with a plurality of second optical fibers and a plurality of measurement optical fibers respectively, and the optical transceiver waveguide chip is configured to send a plurality of reflected lights of the detection element to the second optical fibers one by one;

[0040] Installing a photodetector array in the box body, and the photodetector array is coupled and aligned with a plurality of the second optical fibers to correspondingly receive the reflected light.

[0041] In summary, the present application includes at least one of the following beneficial technical effects: separating the optical branching waveguide chip and the optical transceiver waveguide chip, optimizing the coupling efficiency therebetween, simplifying the optical path structure on a single chip, improving product yield, even if part of the optical path structure is damaged during use, only the corresponding damaged chip needs to be replaced, which also reduces maintenance costs, and compared with the related art, the photoelectric detector array of the present application does not need to be attached to the optical chip, but is coupled and aligned with the plurality of second optical fibers, so that the photoelectric detector array is not limited to a specific installation position, and the installation difficulty of the plurality of second optical fibers is low, and the coupling efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0042] Fig. 1 is a structural schematic diagram of an optical waveguide device provided by an embodiment of the present application;

[0043] Fig. 2 is a structural schematic diagram of an optical branching waveguide chip provided by an embodiment of the present application;

[0044] Fig. 3 is a structural schematic diagram of an optical transceiver waveguide chip provided by an embodiment of the present application;

[0045] Fig. 4 is a structural schematic diagram of an optical waveguide device provided by an embodiment of the present application;

[0046] Fig. 5 is a structural schematic diagram of an optical waveguide device provided by an embodiment of the present application;

[0047] Fig. 6 is a structural schematic diagram of an optical waveguide device provided by an embodiment of the present application;

[0048] Fig. 7 is a structural schematic diagram of an optical waveguide device provided by an embodiment of the present application.

[0049] Fig. 7 is a structural schematic diagram of an optical waveguide device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0050] Embodiments of the present application are described below in detail with reference to the accompanying drawings, wherein like or similar elements are denoted by the same or similar reference signs throughout the drawings. The embodiments described below are exemplary only, and are not intended to limit the present application.

[0051] First, in order to facilitate the description of the relative position relationship and the set point of each mechanism in the present application, the implementation scenario of the embodiments of the present application is described below.

[0052] The optical waveguide device 10, the manufacturing method thereof and the signal detection system according to the embodiments of the present application are described below with reference to FIGS. 1-7.

[0053] As shown in FIG. 1, the optical waveguide device 10 includes an optical branching waveguide chip 100, a plurality of first optical fibers 210, an optical transceiver waveguide chip 300, a plurality of second optical fibers 220 and a photodetector array 400.

[0054] The optical branching waveguide chip 100 is configured to be coupled to a laser source and the plurality of first optical fibers 210, and is configured to transmit the probe light received from the laser source to the first optical fibers 210 one by one.

[0055] The optical branching waveguide chip 100 is configured to effectively distribute the probe light from the laser source to the plurality of first optical fibers 210. The design of such branching is to ensure that each first optical fiber 210 can receive uniform and stable optical signals.

[0056] The optical transceiver waveguide chip 300 is configured to be coupled to the plurality of first optical fibers 210, a detection element and the plurality of second optical fibers 220, and is configured to transmit the plurality of reflected lights of the detection element to the second optical fibers 220 one by one.

[0057] The optical transceiver waveguide chip 300 receives the probe light from the first optical fibers 210, and reflects the probe light through the detection element to the corresponding second optical fibers 220.

[0058] In actual implementation, the detection element includes but is not limited to a fiber grating.

[0059] The photodetector array 400 is coupled and aligned with the plurality of second optical fibers 220 to correspondingly receive the reflected light.

[0060] The photodetector array 400 is configured to correspondingly receive the optical signals (reflected light) reflected from the second optical fibers 220, which carry information of the target environment (such as temperature, pressure, etc.). The photodetector array 400 converts the received optical signals into electrical signals.

[0061] In actual implementation, the photodetector array 400 can be composed of N miniature photodiode chips and a printed circuit board (PCB), and is coupled to the plurality of second optical fibers 220 through end face coupling.

[0062] The related art integrates high-density optical path structures on a piece of optical chip, which leads to complex optical chip structure, reduces yield in the manufacturing process, and increases maintenance cost when part of the optical path structure of the optical chip is damaged.

[0063] In the above embodiment of the present application, the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 are separated, and the coupling efficiency between them is optimized, which simplifies the optical path structure on a single chip and improves product yield, and even if part of the optical path structure is damaged during use, only the corresponding damaged chip needs to be replaced, thereby reducing maintenance cost.

[0064] It should be noted that, for example, when the optical branching waveguide chip 100 is damaged, the plurality of first optical fibers 210 connected to the optical branching waveguide chip 100 are cut off with an optical fiber cutter, and a new optical branching waveguide chip 100 is used to replace the damaged optical branching waveguide chip 100, and finally an optical fiber fusion machine is used to perform optical fiber fusion between the new optical branching waveguide chip 100 and the plurality of first optical fibers 210.

[0065] In addition, the related art integrates high-density optical path structures on a piece of optical chip, and when the photodetector array 400 is coupled to the optical chip, the photodetector array 400 needs to be attached to a specific position of the optical chip, and the position control needs to be very accurate, and the coupling efficiency is greatly affected by the position control, and the installation difficulty is high.

[0066] In the above embodiment of the present application, the photodetector array 400 does not need to be attached to the optical chip, but the plurality of second optical fibers 220 are coupled and aligned with the photodetector array 400, for example, the side end face of the photodetector array 400 is coupled to the plurality of second optical fibers 220, which design on the one hand the photodetector array 400 is not limited to a specific installation position, and the installation difficulty of the plurality of second optical fibers 220 is low and the coupling efficiency is high, and on the other hand, even if the photodetector array 400 is damaged, only the plurality of second optical fibers 220 need to be pulled out of the photodetector array 400, and a new photodetector array 400 can be replaced, and the whole operation process is convenient.

[0067] In summary, the optical waveguide device 10 provided by the embodiment of the present application separates the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300, optimizes the coupling efficiency therebetween, can simplify the optical path structure on a single chip, and improves the product yield; even if part of the optical path structure is damaged during use, only the corresponding damaged chip needs to be replaced, which also reduces the maintenance cost; in addition, compared with the related art, the photoelectric detector array 400 does not need to be attached to the optical chip, but is coupled and aligned with the plurality of second optical fibers 220, so that the photoelectric detector array 400 is not limited to a specific installation position, and the installation difficulty of the plurality of second optical fibers 220 is low and the coupling efficiency is high.

[0068] As shown in FIG. 2, in some embodiments, the optical branching waveguide chip 100 includes a first coupling module 110 and at least two second coupling modules 120;

[0069] The first coupling module 110 includes at least two first branch ports 111 for corresponding receiving probe light emitted from a laser source;

[0070] Each second coupling module 120 is coupled to a first branch port 111 of the first coupling module 110, and the second coupling module 120 includes at least two second branch ports 121 for corresponding sending the received probe light to the first optical fiber 210.

[0071] In the embodiment, the first coupling module 110 first receives the probe light from the laser source, and then distributes the optical signal to each first optical fiber 210 through the second coupling module 120. This hierarchical method allows each coupling stage to be optimized to meet different output requirements.

[0072] As shown in FIG. 2, in actual execution, the optical branching waveguide chip 100 includes a first coupling module 110, two second coupling modules 120, four third coupling modules 130, and eight fourth coupling modules 140.

[0073] The first coupling module 110 includes at least two first branch ports 111 for corresponding receiving probe light emitted from a laser source;

[0074] Each second coupling module 120 is coupled to a first branch port 111 of the first coupling module 110, and the second coupling module 120 includes at least two second branch ports 121;

[0075] Each third coupling module 130 is coupled to a second branch port 121 of the second coupling module 120, and the third coupling module 130 includes two third branch ports 131;

[0076] Each fourth coupling module 140 is coupled to a third branch port 131 of the third coupling module 130, and the fourth coupling module 140 includes two third branch ports 131 for sending the received probe light to the first optical fiber 210 correspondingly.

[0077] In this way, the probe light is input from the optical branching waveguide chip 100 and output from the 16 third branch ports 131 of the optical branching waveguide chip 100.

[0078] As shown in FIG. 3, in some embodiments, the optical transceiver waveguide chip 300 includes a plurality of incident light paths 310, a plurality of exit light paths 320 and a plurality of reflection light paths 330 corresponding to the plurality of incident light paths 310;

[0079] The first optical fiber 210 is in communication with the incident light path 310 one-to-one, the incident light path 310 is in communication with the exit light path 320, and the exit light path 320 is used to send the probe light to the detection element;

[0080] The exit light path 320 is in communication with the reflection light path 330, and the reflection light path 330 is used to send the plurality of reflected lights of the detection element to the second optical fiber 220 one-to-one.

[0081] In this embodiment, if the detection element is a fiber grating, the fiber grating will exhibit different structures under the influence of thermal expansion and contraction or stress. When the probe light propagates from the incident light path 310 to the exit light path 320 and then propagates from the exit light path 320 to the structure, reflection occurs, and the information (reflected light) carrying the temperature / stress is sent to the second optical fiber 220 one-to-one through the reflection light path 330.

[0082] As shown in FIG. 4, in some embodiments, the optical waveguide device 10 further includes a filter 600.

[0083] A plurality of second optical fibers 220 are coupled to the filter 600 and inserted into the photodetector array 400 through the filter 600, and the filter 600 is used to reduce the entry of non-target light waves into the photodetector array 400.

[0084] In this embodiment, the main function of the filter 600 is to prevent non-target light waves (stray light) from entering the photodetector array 400. Non-target light waves may come from ambient light or other light sources inside the device, which may interfere with the accuracy and reliability of the photodetector.

[0085] In actual implementation, the filter 600 includes but is not limited to a narrowband filter 600, a bandstop filter 600, and a bandpass filter 600, etc.

[0086] As shown in FIG. 5, in some embodiments, the optical waveguide device 10 further includes a box body 500.

[0087] The optical branching waveguide chip 100, the plurality of first optical fibers 210, the optical transceiver waveguide chip 300, the plurality of second optical fibers 220, and the photodetector array 400 are all arranged inside the box body 500, and the wall surface of the box body 500 is provided with a clamping groove for clamping the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300.

[0088] In this embodiment, the clamping groove in the box body 500 allows the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 to be installed in a modular form. This modular design enables the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 to be installed and replaced as independent units, thereby simplifying the maintenance and upgrading process.

[0089] In actual implementation, the filter 600 is also arranged inside the box body 500.

[0090] As shown in FIG. 5, in some embodiments, the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 are both arranged on the side wall surface of the box body 500.

[0091] In this embodiment, the use of the side wall surface of the box body 500 allows more space in the central region of the box body 500 to be left for arranging other components, such as the photodetector array 400, a circuit board, or other control hardware. This helps to more efficiently manage space, which is particularly important in size-limited applications.

[0092] As shown in FIG. 6, in some embodiments, the box body 500 includes a box body 510, a baffle 520, and a first fixing structure 530.

[0093] At least one side wall of the box body 510 is provided with a gap 511, and the baffle 520 is correspondingly arranged at the gap 511 and detachably connected with the box body 510 through the first fixing structure 530; the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 are arranged on the baffle 520 or arranged on the inner bottom surface of the box body 510.

[0094] Since the box body 500 has a certain depth and the internal space of the box body 500 is limited, when replacing the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300, the maintenance personnel may not be able to easily reach into the internal space of the box body 500, which is not conducive to replacement.

[0095] In this embodiment, the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 are installed on the detachable baffle 520, which means that the entire baffle 520 can be removed and replaced as a modular unit. This modular design enables the maintenance personnel to take out the entire baffle 520 from the box body 500 for more convenient external operation and maintenance, without the need for complex manual operation in a narrow space.

[0096] As shown in FIG. 7, in some embodiments, the optical waveguide device 10 further comprises: an FPC flexible flat cable 710 and a plug 720.

[0097] The FPC flexible flat cable 710 is mounted to the photodetector array 400, and the plug 720 is mounted to an end of the FPC flexible flat cable 710 away from the photodetector array 400, and the plug 720 is used to plug into a signal detection device.

[0098] In actual implementation, the FPC flexible flat cable 710 can extend from the outer bottom surface of the box body 510 of the box 500, and compared with the traditional PCB hard connection, the FPC flexible flat cable 710 provides greater flexibility. This flexibility reduces the stress concentration caused by internal or external mechanical vibration and movement of the device, especially in the connection part between the photodetector array 400 and the signal processing device. The flexible flat cable can withstand a certain bending and twisting without being easily broken like a hard connection.

[0099] In actual implementation, the signal detection device includes but is not limited to a spectrum analyzer.

[0100] The present application also provides a signal detection system, comprising: a laser source, the optical waveguide device 10 and a measurement optical fiber.

[0101] The laser source is used to send detection light to the optical branching waveguide chip 100.

[0102] The number of measurement optical fibers corresponds to the number of first optical fibers 210 one-to-one, and each measurement optical fiber is provided with a detection element.

[0103] The present application also provides a manufacturing method of the optical waveguide device 10, comprising: step 110, step 120, step 130 and step 140.

[0104] Step 110, providing a box 500, and respectively clamping the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 in the box 500;

[0105] Step 120, connecting the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 through a plurality of first optical fibers 210, and making the optical branching waveguide chip 100 send a plurality of detection lights received from the laser source to the first optical fibers 210 one-to-one;

[0106] Step 130, under the premise that the optical transceiver waveguide chip 300 is provided with a detection element in the measurement optical fiber, connecting the optical transceiver waveguide chip 300 to a plurality of second optical fibers 220 and a plurality of measurement optical fibers, and the optical transceiver waveguide chip 300 is configured to send a plurality of reflected lights of the detection element to the second optical fibers 220 one-to-one;

[0107] Step 140, install the photodetector array 400 in the box body 500, and the photodetector array 400 is coupled and aligned with the plurality of second optical fibers 220 to correspond to receive reflected light.

[0108] The related art integrates the optical path structure on a piece of optical chip at high density, which leads to complex optical chip structure, reduces the yield in the manufacturing process, and increases the maintenance cost when part of the optical path structure of the optical chip is damaged.

[0109] In the above embodiment of the present application, the optical branching waveguide chip 100 and the optical transceiver waveguide chip 300 are separated, and the coupling efficiency between them is optimized, which simplifies the optical path structure on a single chip and improves the product yield on the one hand, and even if part of the optical path structure is damaged during use, only the corresponding damaged chip needs to be replaced, which also reduces the maintenance cost.

[0110] It should be noted that, for example, when the optical branching waveguide chip 100 is damaged, the plurality of first optical fibers 210 connected to the optical branching waveguide chip 100 are cut off with an optical fiber cutter, and a new optical branching waveguide chip 100 is used to replace the damaged optical branching waveguide chip 100, and finally the new optical branching waveguide chip 100 is optically spliced with the plurality of first optical fibers 210 by using a fiber fusion machine.

[0111] In addition, the related art integrates the optical path structure on a piece of optical chip at high density, and when the photodetector array 400 is coupled to the optical chip, the photodetector array 400 needs to be attached to a specific position of the optical chip, and the position control needs to be very accurate, and the coupling efficiency is greatly affected by the position control, and the installation difficulty is high.

[0112] In the above embodiment of the present application, the photodetector array 400 does not need to be attached to the optical chip, but the plurality of second optical fibers 220 are coupled and aligned with the photodetector array 400, such as the side end surface of the photodetector array 400 is coupled to the plurality of second optical fibers 220, which design on the one hand the photodetector array 400 is not limited to a specific installation position, and the installation difficulty of the plurality of second optical fibers 220 is low, and the coupling efficiency is high; on the other hand, even if the photodetector array 400 is damaged, only the plurality of second optical fibers 220 need to be pulled out of the photodetector array 400, and a new photodetector array 400 can be replaced, and the whole operation process is convenient.

[0113] The above are the preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: any equivalent changes made on the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. An optical waveguide device, characterized by, The application relates to a light splitting waveguide chip (100), a plurality of first optical fibers (210), a light transceiving waveguide chip (300), a plurality of second optical fibers (220) and a photodetector array (400). The light splitting waveguide chip (100) is used for coupling to a laser source and a plurality of the first optical fibers (210), and is configured to transmit probe light received from the laser source to the first optical fibers (210) one by one. The light transceiving waveguide chip (300) is used for coupling to a plurality of the first optical fibers (210), a probe element and a plurality of the second optical fibers (220), and is configured to transmit a plurality of reflected lights of the probe element to the second optical fibers (220) one by one. The photodetector array (400) is coupled and aligned with a plurality of the second optical fibers (220) to correspondingly receive the reflected lights. The application further relates to a box body (500).

2. The optical waveguide device according to claim 1, characterized by The light splitting waveguide chip (100), the plurality of the first optical fibers (210), the light transceiving waveguide chip (300), the plurality of the second optical fibers (220) and the photodetector array (400) are arranged in the box body (500), and a wall surface of the box body (500) is provided with a clamping groove for clamping the light splitting waveguide chip (100) and the light transceiving waveguide chip (300). The light splitting waveguide chip (100) and the light transceiving waveguide chip (300) are arranged on a side wall surface of the box body (500). The box body (500) comprises a box body (510), a baffle (520) and a first fixing structure (530).

3. The optical waveguide device of claim 2, wherein, At least one side wall of the box body (510) is provided with a gap (511), the baffle (520) is arranged in the gap (511) and is detachably connected with the box body (510) through the first fixing structure (530), and the light splitting waveguide chip (100) and the light transceiving waveguide chip (300) are arranged on the baffle (520) or an inner bottom surface of the box body (510).

4. The optical waveguide device of claim 2, wherein, The light splitting waveguide chip (100) comprises a primary coupling module (110) and at least two secondary coupling modules (120). The primary coupling module (110) comprises at least two primary branch ports (111) for correspondingly receiving probe light emitted from the laser source.

5. The optical waveguide device of claim 1, wherein, Each secondary coupling module (120) is coupled to a primary branch port (111) of the primary coupling module (110), and the secondary coupling module (120) comprises at least two secondary branch ports (121) for correspondingly transmitting the received probe light to the first optical fibers (210). The light transceiving waveguide chip (300) comprises a plurality of incident light paths (310), a plurality of exit light paths (320) and a plurality of reflected light paths (330) corresponding in number to the plurality of incident light paths (310). ​ 6. The optical waveguide device of claim 1, wherein, ​ The first optical fiber (210) is in one-to-one correspondence with the incident light path (310), the incident light path (310) is in communication with the outgoing light path (320), and the outgoing light path (320) is used to send the probe light to the detection element; The outgoing light path (320) is in communication with the reflected light path (330), and the reflected light path (330) is used to send the multiple reflected lights of the detection element to the second optical fiber (220) in one-to-one correspondence.

7. An optical waveguide device according to any one of claims 1-6, c h a r a c t e r i z e d in that Further comprising: A filter (600); A plurality of the second optical fiber (220) is coupled to the filter (600) and is inserted into the photodetector array (400) through the filter (600), and the filter (600) is used to reduce the entry of non-target light waves into the photodetector array (400).

8. The optical waveguide device according to any one of claims 1 to 6, wherein Further comprising: an FPC flexible flat cable (710) and a plug (720); The FPC flexible flat cable (710) is installed on the photodetector array (400), and the plug (720) is installed on the end of the FPC flexible flat cable (710) away from the photodetector array (400), and the plug (720) is used to be plugged into the signal detection device.

9. A signal detection system, comprising: A laser source; The optical waveguide device according to any one of claims 1-8, the laser source is used to send probe light to the optical branching waveguide chip (100); A plurality of measurement optical fibers, the number of measurement optical fibers is in one-to-one correspondence with the number of first optical fibers (210), and each of the measurement optical fibers is provided with a detection element.

10. A method of fabricating an optical waveguide device, characterized by, Including: The optical branching waveguide chip (100) and the optical transceiver waveguide chip (300) are connected by a plurality of first optical fibers (210), and the optical branching waveguide chip (100) sends the multiple probe lights received from the laser source to the first optical fiber (210) in one-to-one correspondence; Under the premise that the detection element is provided in the measurement optical fiber, the optical transceiver waveguide chip (300) is connected with a plurality of second optical fibers (220) and a plurality of measurement optical fibers, respectively, and the optical transceiver waveguide chip (300) is configured to send the multiple reflected lights of the detection element to the second optical fiber (220) in one-to-one correspondence; The photodetector array (400) is coupled and aligned with a plurality of the second optical fiber (220) to correspondingly receive the reflected light.

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