Method for producing a surface profile on a substrate, system for a method of this type and control program

Abstract

A method for producing a surface profile on a substrate (3), in particular in the context of producing an electrical and / or optical component, comprising: providing the substrate (3); positioning a first quantity (101) of an embossing material on the substrate (3); positioning a second quantity (102) of an embossing material or of a further embossing material on the substrate (3); forming the surface profile by means of an embossing die element (4, 4', 4'', 0 4'' ') or an exposure masking, which acts on the embossing material and / or the further embossing material, wherein a mixing of the first quantity (101) with the second quantity (102) is controlled by the positioning of the first quantity (101) and the second quantity (102).

Description

[0001]MÜLLERSCHUPFNER & PARTNER REV Group E. Thallner GmbH MSP Ref: 45612 PT-WO PM / SK Method for producing a surface profile on a substrate, equipment for such a method and control program. The present invention relates to a method for producing a surface profile on a substrate, equipment for such a method and a control program. In the technical field of manufacturing electronic components, it is well known to use inkjet printing processes to distribute embossing material on a substrate in order to subsequently create a surface profile by means of an embossing die element, by pressing the embossing die element into the embossing material. The substrates with surface profiles produced in this way are then parts of an electronic component, for example a chip. In inkjet printing, small, uniform droplets are produced which are spatially resolved andinkjet printing is a digital printing process in which the printing is digitally controlled. Inkjet printing of a wide variety of materials is currently being developed as a resource-efficient digital structuring method that allows for the contactless and localized application of numerous different materials. These materials include, for example, polymers, metals, and ceramics, which can be applied using specially developed inks. One application area is electronic circuit boards, which are manufactured using printing technology. Another application area that leverages the advantages of reproducible and automated material application is nanoimprint lithography (NIL). In NIL inkjet technology, liquid, especially UV-curable, material is used.A varnish, used as an embossing material, is applied in minute quantities to a surface from a printhead with at least one nozzle element. In the following, the terms embossing compound, embossing material, and (inkjet) ink are used synonymously. For example, in US 10,180,623 B2, droplets of an embossing material are applied to a substrate using the inkjet process. After sufficient proximity and contact with the embossing die, the droplets are spread onto the substrate surface, forming a film of embossing material. To achieve a more homogeneous film thickness, US 10,180,623 B2 adapts the horizontal and vertical distances between the droplets to the elevations and depressions of the die structure. In US 2008 / 0160196 A1, a varnish is applied to the substrate surface in spatially separated, 2D areas of varying sizes using inkjet technology. The size and shape of the areasThe required amount of lacquer varies depending on the embossing die, which has raised areas of varying widths but the same height. In publication WO 2023 / 141583 A2, substrates are produced from which electrical and / or optical components are manufactured. The embossing die has structured areas with raised areas of varying heights. Using inkjet printing, the number of droplets applied to a corresponding area on the substrate is adjusted to the height of the raised areas on the embossing die. Small droplet volumes allow for a higher droplet density in areas where more lacquer is required. A particular problem is that the residual layer thickness changes after embossing in areas with different heights of the embossed structures. Droplet volumes in the lower picoliter range are used in WO 2023 / 141583 A2 to control the variation in residual layer thickness.to minimize thickness). The lacquer applied by inkjet printing is applied contactlessly in the form of individual drops. The drops are applied two-dimensionally to the substrate surface. If the distance between the drops is small, the drops merge, creating 2D areas or lacquer patterns that are used for the subsequent process. In the prior art, the 2D areas where more lacquer is required are larger, or the droplet density is higher. The different areas border each other. A flow of the embossing compound is to be expected at the adjacent areas. Based on this, the present invention aims to improve the provision of the embossing material in such a way that the probability of embossing defects is reduced. The present invention solves this problem with a method according to claim 1, an apparatus according to claim 13, and a control program according to claim 14.14. Advantageous embodiments of the invention are specified in the dependent claims. The invention also encompasses all combinations of at least two features specified in the description, in the claims, and / or in the drawings. Where value ranges are specified, values ​​lying within the stated limits are also deemed disclosed and may be claimed in any combination. According to a first aspect of the present invention, a method for producing a surface profile on or to a substrate, particularly in the context of manufacturing an electrical and / or optical component, is provided, comprising: - providing the substrate, - positioning a first quantity of an embossing material on the substrate, - positioning a second quantity of an embossing material or a further embossing material on the substrate, - realizing the surface profile by means of an embossing die element or an exposure masking.The process acts on the embossing material and / or the further embossing material, whereby the mixing of the first quantity with the second quantity is controlled by positioning the first quantity and the second quantity, in particular by delaying this mixing. Specifically, the first quantity and the second quantity are positioned such that they remain unmixed until mixing is initiated by a treatment agent or the embossing element, or that a continuous layer of embossing material is provided. The mixing of the embossing material is specifically manipulated by positioning the first quantity and the second quantity. Specifically, mixing is controlled by adjusting the timing and / or extent of the mixing through the targeted, and in particular individual, positioning of the first quantity and the second quantity. For example, the volume and shape can be used to control the mixing.and / or the distance between two adjacent quantities during positioning is used for targeted adjustment. In particular, it is provided that the mixing of the first and second quantities is deliberately delayed so that sufficient embossing material remains in the desired target area to create sharp contours in the surface profile when embossing with the embossing die element. At the same time, it is ensured that the substrate is coated or wetted as evenly and completely as possible by positioning the first and second quantities accordingly, if necessary. The first and second quantities preferably refer to a subset of a multitude of different quantities of embossing material. When quantities of embossing material are generally mentioned, the specifications apply to all quantities of embossing material, especially to the first and second quantities. In contrast to the prior art, it is provided, for example, thatThe relative positioning of the first and second quantities is such that, before the surface profile is embedded with the embossing die element, the first and second quantities are mixed in such a way that a sufficient amount of embossing material is present in the transition area between the area of ​​the first and second quantities for the embossing process. This advantageously prevents the embossing process from producing sharp contours in the embossing material because the embossing material provided here has flowed out of the area during mixing. A person skilled in the art understands "time-delayed" in particular to mean that at least one measure is taken that results in the mixing being delayed compared to applying the first and second quantities without this measure. Preferably, this is achieved by appropriately positioning the first and second quantities.The mixing of the second quantity is delayed, particularly because the distance between the first and second quantities has increased. The term "embossing material" is not limited to embossing achieved through mechanical action on the material. In the context of this invention, the skilled person understands "embossing material" to mean any material that can change its surface structure, and in particular form a surface profile, through the action of an optical, chemical, or mechanical means. Preferably, the embossing material is lacquer. It is particularly preferred that the first and second quantities are placed or applied to the substrate using an inkjet process, in particular by placing drops of embossing material on the substrate, especially its substrate surface. It is particularly intended that the first and second quantities of embossing material are essentiallyThe material remains dimensionally stable until embossing with the die element. Essentially dimensionally stable means that the first and second quantities approach each other and at least make contact, but height differences within the first and second quantities, respectively, are largely preserved. Preferably, the treatment is designed to induce mixing, preferably in a localized manner. For example, it is conceivable that only a portion of the embossing material is treated with the treatment agent to achieve premature mixing in that area, e.g., to create a continuous layer of embossing material. Mixing then occurs with a time delay in the untreated areas. In particular, the time between treatment and embossing with the die element is defined, especially so that, for example, a change in the geometry of the first and second quantities caused by the treatment is thus minimized.The process is designed so that the embossing die element acts on the embossing compound before excessive mixing occurs. By coordinating the timing with the flow behavior of the first and second quantities, it is then possible to ensure that a sufficient quantity of embossing compound is present even in critical areas of the surface profile to be embossed. The present invention thus enables better results to be achieved with complex surface profiles, where the topography and the height of the printed and pre-processed embossing material have a strong influence on subsequent processes. For example, the present invention enables better embossing results when embossing with complexly structured embossing dies and reduces embossing defects as well as problems with uneven residual layer thicknesses of the embossing material. For this purpose, an improved method for applying embossing material using inkjet technology is employed. In particular, an improvedA method is used for applying and treating area-selective amounts of embossing material with varying heights on a substrate surface, resulting in a complete substrate coating with embossing material. This creates seamless steps between amounts of embossing material with different heights and / or different heights and inclinations in preparation for NIL, lithography, or other further applications or processing. The height of the printed and pre-processed amounts of embossing material varies locally and is prepared for the application, for example, adapted to the die geometry of a nano-imprint die. In particular, a distance between area-selective amounts of embossing material of varying heights and / or different heights and inclinations applied to a substrate surface using the inkjet process is determined and / or defined in advance and used in such a way that, after treatment, especially within the context ofIn a preliminary process, particularly after a heating-out, a substrate coating with embossing material is formed, creating seamless steps between the quantities of embossing material with different heights and / or different heights and inclinations. Preferably, the first quantity and / or a second quantity has an inclined profile on a side facing away from the substrate relative to the main plane of the substrate. The height and / or inclination of the applied quantities of embossing material is largely maintained until embossing with the die element. Preferably, the surface profile has height differences that are less than 1 µm, more preferably less than 500 nm, even more preferably less than 250 nm, and particularly preferably less than 100 nm. This is particularly advantageous for small structures in the surface profile, especially structures with height differences up to 500 nm, more preferably 250 nm, and particularly preferably less than 100 nm.down to 100 nm is advantageous. For example, a nanometer profile is used. The flow behavior of the first and second quantities of embossing material, based on the material properties of the embossing material and the substrate, changes during the treatment in a preliminary process due to the influence of temperature, radiation, pressure, etc. This change is preferably determined in a preparatory test step and taken into account during the subsequent positioning of the first and second quantities by introducing a corresponding distance between them when positioning them on the substrate. During the treatment, the previously determined distance between the quantities of embossing material decreases, so that the different quantities of embossing material touch, in particular without mixing. This allows a full-surface embossing material layer with defined properties to be formed.Height profiles are created, i.e., a substantially dimensionally stable distribution of embossing material. In other words, no mixing occurs in the adjacent areas of the neighboring quantities of embossing material that would lead to a change in the height, slope, or curvature of the applied zones (and thus to undefined transition zones). Preferably, a treatment agent is applied mechanically, optically, and / or chemically to the first and / or second quantity. Preferably, the treatment is carried out as part of a pre-process before embossing. In particular, it is a treatment that the substrate and / or the first and second quantities undergo anyway as part of the embossing process. Pre-processes or treatments include heating and / or compression caused by the embossing die.This results in the spreading of the embossing material on the substrate surface. In another embodiment, compression can be achieved using a lithography mask or any type of mask. Further preprocessing steps can include, for example, plasma treatment of the embossing material. The aforementioned preprocessing steps, such as baking and / or plasma treatment, can also be considered as standalone and independent processing of an (inkjet) ink, a lacquer, or a polymer. The first and second quantities can be applied directly after a curing step, for example, without further processing steps on the material. Preferably, the first quantity is larger than the second quantity. The height of the printed and preprocessed quantities of embossing material thus varies locally and is adapted, for example, to the die geometry of a nanoimprint die or to a mask geometry. The first and second quantities can be of any size (area) and shape, i.e.,Geometry. The first and / or second quantity of embossing material is controlled by applying drops of different volumes and / or by the droplet density (resolution) and / or by applying multiple layers. This provides a first quantity and a second quantity of embossing material with different volumes, in particular with different heights. Preferably, the embossing die element has a height profile. By means of the method, it is possible to ensure that sufficient embossing material is present in areas with a pronounced height profile to fill the corresponding recesses in the profile of the embossing die element. In a first embodiment of the present invention, the quantity of embossing material is not controlled by the area of ​​the dropleted sub-areas on the substrate surface, but by applying drops of different volumes.so that the number of drops and the size and shape of the dropleted areas can remain identical. The amount of embossing material is increased by applying larger drops or drops with increasing volumes. This allows identical areas with embossing material to be created on the substrate surface using inkjet printing, but containing different amounts of embossing material. In particular, this creates height profiles, i.e., 3D areas that occupy the same area on the substrate surface but have different amounts of ink and therefore different heights. In an alternative embodiment, the amount of embossing material is controlled by the droplet density (resolution). In another embodiment, the amount of embossing material is controlled by applying multiple layers. In yet another embodiment, the amount of ink is controlled by a combination of the above-mentioned methods.Methods controlled: droplet volume and / or droplet density and / or application of multiple layers of embossing material, in particular lacquer. In a preferred embodiment, the first and second quantities have any size (area) and shape, i.e., geometry. In a further embodiment, quantities of embossing material are applied which can be of different sizes and have different heights and different inclinations, i.e., changing heights. In particular, it is provided that the distance between the first and second quantities and / or a volume of the first quantity and / or a volume of the second quantity is adapted to the height profile of the embossing die element. Preferably, the quantities of embossing material arranged side by side and / or one after the other, which are adapted, for example, to the die structuring of an embossing die element for a subsequent nanoimprint process, are not applied directly adjacent to one another, but with aThe precisely defined distance between the determined embossing material is applied using inkjet printing. Specifically, the first and second quantities of embossing material are applied at a distance determined in a preparatory test step in such a way that, after treatment, particularly pretreatment, the change in height of the different quantities of embossing material on the substrate surface remains largely unchanged and transferable to further process steps. During pretreatment, the distance between the quantities of embossing material, determined beforehand and taken into account during inkjet printing, decreases. This allows the different quantities of embossing material, for example, the first and second quantities, to touch without mixing, thus creating the most complete possible layer of embossing material.A lacquer layer with a precisely defined height profile is created. For this purpose, the first and second quantities of embossing material are applied at a predetermined distance, with the first and second quantities differing in volume. Preferably, the distance between the first and second quantities is set such that they remain essentially unmixed until they are blended by the treatment agent. The distance varies depending on the material properties of the embossing material and the properties of the substrate surface and must be determined for each embossing material-substrate combination. The distance is chosen so that the quantities of embossing material do not touch during application and only come into contact after at least one treatment within a pre-process, for example, a heating step, a plasma treatment, or an embossing step. The contacting of theZones are created, for example, by a merging caused by higher temperatures or interaction with radiation, and / or by spreading caused by the pressure of the embossing die or a (lithography) mask after contact. It is preferred that the flow and / or mixing behavior of the first quantity and / or the second quantity be determined in the preparatory test step. Since inkjet printing is digitally controlled, the required distance is determined by gradually changing the distance between test-printed embossing material zones in a preparatory test step and pre-storing them in a digital image. For example, several equally sized square zones of embossing material are printed successively. Alternatively, any shape and size can be selected for the test zones. The distance between printed areas increases, for example, gradually. These values ​​can be digitally modified.and adjusted. For example, the number of pixels between each pair of digital test images corresponding to test zones is increased incrementally. For each embossing material composition developed for inkjet printing in combination with a selected substrate, the embossing material must be printed as a test to determine the appropriate spacing. The selection of the spacing depends in particular on the material properties of the embossing materials developed for inkjet applications and on the material properties of the substrate surface. The varnishes can be NIL varnishes, lithographic varnishes (e.g., positive or negative varnishes), or polymerizable, curable embossing materials or polymers for other applications. After applying an embossing material to a selected substrate (embossing material-substrate combination) according to the digital test image, a spacing can initially be determined by observing the backflow behavior of theEmbossing materials are determined. The digital representation of the zones and the actual, corresponding zones applied to the substrate are compared. The actual, corresponding zones applied to the substrate are then subjected to the selected preprocesses, and after analyzing the changes in the spread of the coating zones, the suitable spacing for the planned process is determined. In a first embodiment, equal quantities are applied, and the spacing is varied. In a second embodiment, the spacing is varied, and the quantities of embossing material are also increased from zone to zone. The amount of embossing material, which can be controlled, for example, by different droplet sizes and / or droplet densities, can also be varied. The distances between sample zones on the substrate surface vary from 0 µm (contact) to a few mm. After the sample embossing material zones are printed onto the corresponding substrate...If pre-processes such as a bake-off can be carried out under the same conditions as the subsequent process to analyze any spatial or topographical changes in the zones, particularly the distances between them, resulting from these pre-processes. The distances between zones on the substrate are measured, and the differences between the digital representation of the zones and the actual, corresponding zones applied to the substrate can thus be taken into account. If the distances change before and after a pre-process, such as a bake-off, the appropriate distance can be determined using a test print. The preferred distance is chosen so that the zones do not initially touch after application with inkjet printing. Only after the pre-processes, during which the embossing material can still change, does a continuous and seamless layer of embossing material with different zones emerge.Steps are created between zones of different heights. The pre-determined distance between area-selective amounts of embossing material of varying heights applied to a substrate surface using inkjet technology is used to create a complete substrate coating with embossing material after a pre-processing step, resulting in seamless steps between amounts of embossing material of different heights. The height and / or slope of the applied zones are largely preserved. In particular, the height ratios of the applied zones are maintained. In other words, no mixing occurs in the adjacent zones that would lead to a change in the height or slope of the applied zones. The first and / or second amount remain essentially dimensionally stable. The pre-determined, optimal application pattern of the embossing material thus enables an improvement in the quality of embossing material applications. For higherIn a first embodiment, larger inkjet droplets are applied to the embossing material layer thickness. The droplet size for a specific zone determines the height or layer thickness of that zone. Preferably, between 1 and 7 dpd (drops per dot) are applied. The droplet volume is preferably between 1 pL and 1 nL. In an alternative embodiment, the amount of embossing material can be controlled by the resolution or droplet density (dpi: drops per inch). In another alternative embodiment, the amount of embossing material can be controlled by multiple coatings without changing the droplet size and / or droplet density. In a further embodiment, combinations of the above-mentioned embodiments are used to control the amount of embossing material. For the sample printed amounts of embossing material used to determine the distance, several hundred droplets are applied.Droplets coalesce to form the amount of embossing material. Surface tension, viscosity, and other material properties of the embossing material, as well as the material properties of the substrate surface (with or without pretreatment, coating, etc.), influence how the droplets merge or how the embossing material flows together (reflow). For example, the spreading, coalescence, and adhesion of the embossing material are influenced by the material properties of the substrate surface. For better results in inkjet printing, different substrate materials can be pretreated and tested. Examples of surface treatments include wet chemical pretreatment or plasma treatment for cleaning and / or activating the substrate surface. Plasma treatment can, for example, modify the wettability of the substrate surface. The substrate surface can also be coated with a primer. The primers are selected according to the requirements of theThe coating composite is selected depending on the substrate material and the embossing material. In another embodiment, the substrate surface is coated with a metal, an alloy, a nitride compound, an oxide compound, or a semiconductor. By surface treatment of the substrate surface, the spread of the individual embossing material droplets can be influenced, in particular delayed. Substrates can also be substrates coated with one or more layers or multilayer systems. Substrates include, among others, support substrates, product substrates, substrate stacks, and wafers. The substrates can have any desired shape. The following embossing materials, for example, can be used and applied with inkjet printing: NIL lacquers (UV lacquers and thermal lacquers), positive and negative photoresists, and polymers (including non-photosensitive polymers). Inkjet technology enables area-selective coating.A precisely determined small gap between quantities of embossing material of varying thicknesses is used to achieve the appropriate embossing material topography after preprocessing. Preprocessing the applied quantities of varying thicknesses closes the pre-selected gap between the zones, creating a seamless, stepped transition between the zones in preparation for the subsequent process, depending on the varnish application. The solvent content of the varnish applied with inkjet printing is adjusted to the requirements of the inkjet printing process. Soft baking of the varnish after application can be used to reduce the solvent content or remove any residual solvent. This makes the varnish more stable, harder, and improves adhesion to the substrate surface. Soft baking also reduces embossing defects, such as those caused by gas inclusions, during subsequent nano-imprinting of the applied varnish.The baking process is preferably carried out at temperatures between room temperature and 250°C. If a coating is temperature-sensitive, the solvent can alternatively be removed by pressure reduction (vacuum). The device can advantageously be operated in a vacuum or at ambient pressure under inert gas. Further pretreatment of the coating on the substrate can, for example, be plasma treatment. Plasma treatment can be used to clean the surface or to modify the coating surface. In a first application, for example, after a baking step, the embossing material is applied using a structured embossing die element, in particular a nanoimprint die. Nanoimprint lithography (NIL) is a molding process in which nanostructures (and / or microstructures) are transferred from a die into curable materials, e.g., a coating. This allows for high-resolution surface structuring.NIL processes are generally divided into thermal and UV-based NIL processes. UV-NIL allows for lower contact pressures and can be performed at room temperature. NIL can be advantageously combined with inkjet printing processes. Drop-on-demand (DoD) inkjet technologies are preferred. Inkjet digital printing enables precise control of the amount and placement of the varnish on a substrate. This precise control, coupled with the consideration of local varnish changes due to the material properties of the varnish and the substrate during pretreatment, allows for highly precise varnish application in the subsequent NIL process. Due to the viscosity of the embossing material, especially the varnish, on the substrate surface, the spaces between the structured die are completely filled with varnish during embossing through capillary action.Area-selective coating using inkjet technology allows the amount of varnish to be adjusted to the gaps between dies and unusual topographies for improved embossing results. The viscosity of the embossing material (at room temperature) is between 1 and 30,000 cp, preferably between 1 and 300 cp, and even more preferably between 1 and 20 cp. The viscosity of the varnish can be further modified by heating, if required. Temperature changes can be achieved, for example, by controlling the temperature in the printhead, by controlling the temperature of the varnish in the pumping system itself (reservoir and / or lines), or by using a temperature-controlled substrate holder. These methods are known to those skilled in the art and are not described in detail here. UV-curing embossing materials crosslink to form a stable polymer upon exposure to UV radiation (curing). Thermally curing varnishes crosslink at higher temperatures. In a second application, the (photo)varnish is exposed viaAn exposure mask for photolithographic structuring. Positive resists require a pre-bake step. The negative resist polymerizes through exposure followed by a pre-bake step. Not all resists for lithographic applications require a pre-bake step. In another embodiment, structuring of the resist can be carried out without a mask using maskless lithography, for example, using MLE (Maskless Exposure Technology). The curing step is important in many applications for the accurate reproduction and maintenance of complex geometric structures. The embossing materials are used, for example, for optoelectronic applications. Miniaturized, compact, and complex microlens designs are fabricated on substrates for augmented reality and / or virtual reality, enabling the further development of applications in the field of AR / VR. Another object of the present invention is aA system for carrying out a method according to one of the preceding claims, comprising: - a substrate holder, - a nozzle element for placing embossing material on a substrate, and - a control device for determining the position of a first quantity of embossing material and a second quantity of embossing material. All described advantages and properties of the invention can be transferred analogously to the device and vice versa. The system particularly comprises a module group with a common working chamber that can be sealed off from the ambient atmosphere if required. The modules, e.g., inkjet module, imprint module, and unloading module, can be arranged in a cluster or star configuration around a central module with a motion device (robot system). Demolding can take place directly in the imprint stage. Alternatively, inkjet printing can be carried out separately from the embossing process in a separate module. Bakeout can be performed directly in theThe process can be carried out in an inkjet module or in a separate module. If the temperature-sensitive lacquer is pretreated by means of pressure reduction (vacuum), an evacuable module can be used. The device can advantageously be operated in a vacuum or at ambient pressure under inert gas. Due to the predefined distance between embossing material zones with different heights, a closed and step-shaped transition of the embossing material zones is created either after preprocessing, for example after baking out, or at the latest after contact of the embossing die with the embossing material, through the intrinsic deformation of the embossing material. By adapting the height of the embossing material zones to the structural properties of the embossing die element and by ensuring complete and topography-preserving coverage of the substrate surface by the pre-determined optimal application pattern after contact of the nanoimprint die with the embossing material, the pre-determined optimal application pattern is applied.The embossing material allows for a uniform and minimal residual layer thickness on the finished embossed polymer after the embossing process. A further aspect of the present invention is a control program for controlling a device according to the invention. All described advantages and properties of the device according to the invention can be transferred analogously to the control program and vice versa. In particular, the control program is executed on a processor, especially a microprocessor, for example, a computer. Further advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the drawings. These show: Figure 1a: a digital image as a template for inkjet printing; Figure 1b: a top view of the embossing material zones applied to a substrate surface by inkjet printing based on the digital template according to Figure 1a; Figure 2a: a highly magnified andSimplified cross-sectional view of multiple embossing material zones according to Prior Art, where larger embossing material zones are applied using inkjet printing for larger quantities of embossing material; Figure 2b: a highly magnified and simplified cross-sectional view of multiple embossing material zones, where the droplet size is increased for embossing material zones of different heights for larger quantities of embossing material; Figure 3a: a cross-sectional view of three directly adjacent zones of embossing material of different heights applied to a substrate using inkjet technology; Figure 3b: the formation of gradients between adjacent zones of embossing material according to Figure 3a of different heights due to the flow of the embossing material; Figure 3c: a cross-sectional view of three non-contacting zones of embossing material of different heights applied to a substrate using inkjet technology, after determining the [missing information] for the subsequent [missing information].Formation of a continuous and stepped change in the height of the embossing material at the necessary distance D1, Figure 3d: a continuous and stepped embossing material height according to Figure 3c on a substrate after pretreatment of the embossing material, Figure 3e: a cross-sectional view of several non-contacting zones on embossing material with different heights and different slopes, applied to a substrate using inkjet technology, Figure 3f: a continuous embossing material height and slope according to Figure 3e on a substrate after pretreatment of the embossing material, Figure 4a: an embossing die element with a die structure in a first embodiment, Figure 4b: an embossing die element with a die structure in a second embodiment, Figure 4c: an embossing die element with a die structure in a third embodiment and Figure 4d: an embossing die element with a stamp structure in a fourthImplementation. In the figures, identical components or components with the same function are marked with the same reference numerals. Figures 1a and 1b relate to a preparatory test step for a method for generating a surface profile according to a first exemplary embodiment of the present invention. This preparatory test step serves in particular the purpose of determining the flow behavior of the drops of embossing material, especially lacquer, on the substrate when they are placed on a substrate 3 by means of an inkjet process, i.e., an inkjet printing process. Since the inkjet process is digitally controlled, a target distance between sample-printed drops of the embossing material is changed stepwise to determine the resulting distance between drops of the embossing material. For this purpose, the target distance for printing is first stored in advance in a digital template according to Figure 1a and / orFigure 1a shows a digital template with several equally sized square zones 1 with increasing spacing. The zones can assume any shape and / or size. An embossing material developed for inkjet printing, in particular a varnish, is printed onto a substrate 3 using an inkjet printer in a preparatory test step, according to the digital template. Figure 1b shows a top view of the embossing materials applied by inkjet printing based on the digital template according to Figure 1a onto a selected substrate surface, arranged in embossing material zones 2. In Figure 1b, several equally sized square zones 2 with embossing material are printed one after the other. The distance D1 between embossing material zones 2 changes incrementally according to the digital template. At the smallest digital distance, the equally sized square embossing material zones 2 touch. If the distances D1 are too small, two embossing material zones can already touch each other.The flow behavior of the embossing material directly after application depends on the properties of the embossing material and the properties of the substrate surface. The embossing material test zones are preferably treated with a treatment agent in the preparatory test step, preferably a treatment that the embossing material on the substrate 3 also undergoes before the application of an embossing die element 4. Possible treatments include, for example, a heating step, plasma treatment, and / or simply the application of a mask or an embossing die 4, 4', 4'', 4'''. The changes in the geometric shape of the embossing material, in particular its lateral extent or area, and thus also the distance between embossing material zones 2 after application and / or after application and treatment, are determined in advance in the preparatory test step to ascertain a desired distance between embossing material zones for the subsequent process.The distance between the embossing material zones is determined. If the distance is too small, the mixing becomes too extensive, resulting in embossing material gradients of varying heights between the zones. If the distance is too large, the embossing material zones will not touch even after treatment, and a complete substrate coating with the embossing material will not be achieved. For each embossing material-substrate combination, the actual distance between printed embossing material zones is preferably determined in a preliminary test step for the specified target distances (from the digital template). The digital values ​​for placing the drops of embossing material, i.e., a first quantity 101 of embossing material and / or a second quantity 102 of embossing material, are modified, adjusted, and selected accordingly. This pre-determined distance between the area-selective quantities of embossing material applied using inkjet technology is then used to determine the optimal placement of the embossing material.The application of embossing material to substrate surfaces of varying heights and / or slopes is such that, after at least one treatment, a surface-covering substrate coating with embossing material is created, in particular seamless steps between quantities of embossing material of different heights. The height and / or slope of the applied quantities of embossing material is preferably largely maintained. In other words, by considering and incorporating the behavior of the embossing material before and during treatment, no mixing occurs in the adjacent zones that would lead to a change in the height or slope of the applied zones. Figure 2a shows a greatly enlarged and simplified cross-sectional view of a first quantity 101 of embossing material, a second quantity 102 of embossing material, and a third quantity 103 of embossing material, as known from the prior art, wherein larger quantities are used for larger areas.Embossing material is applied to a substrate 3 using inkjet printing, particularly for nanoimprint lithography (NIL) applications. In this and subsequent figures, different sizes of first quantities 101, second quantities 102, and third quantities 103 are shown. This is only an example. The first quantity 101, 201, the second quantity 102, 202, and / or the third quantity 103, 203 can also be equal. The amount of embossing material in the inkjet printing is controlled by the droplet size and / or the droplet density, or by placing multiple drops in one zone. Figure 2b shows a highly magnified and simplified cross-sectional view of a first quantity 201 of embossing material, a second quantity 202 of embossing material, and a third quantity 203 of embossing material, where the droplet size is increased for larger quantities of embossing material. A change in droplet size and / or droplet density is used, for example, for the formation of embossing material zones with different properties.Heights according to Figure 2b are used. Figure 3a shows a cross-sectional view of a first quantity 201', a second quantity 202', and a third quantity 203' of embossing material with different heights H1, H2, H3, which were applied to a substrate 3 using the inkjet process and are arranged directly next to each other. Due to the flowing or mixing of the first quantity 201', the second quantity 202', and / or the third quantity 203' in adjacent areas during preprocessing, directly adjacent areas can overlap, so that intermediate areas with linearly decreasing or increasing amounts of embossing material are created, as shown in Figure 3b. Due to the mixing, a height step, which separates quantities of embossing materials with different heights, is present on the substrate surface as a slope and not as a clean edge. Process errors occur more frequently in these areas, since an accurate and reproducible result is not possible after a single process. In aIn an alternative embodiment, where a surface profile with slopes, i.e., areas with decreasing or increasing amounts of embossing material, is required, the creation of such sloped areas can be deliberately achieved by reducing the distance until a first quantity and a second quantity are in contact. A combination of intermediate areas without mixing and intermediate areas with intended mixing is also possible. Figure 3c shows a first quantity 201 of embossing material, a second quantity 202 of embossing material, and a third quantity 203 of embossing material, each with different heights H1, H2, H3, which are applied with a pre-determined distance D1 between the quantities of embossing material. The preferred distance D1 according to Figure 3c is selected such that the quantities of embossing material, i.e., for example, the first quantity and the second quantity of embossing material, do not initially touch after application by inkjet printing. Only afterA treatment, which allows the embossing material to undergo further plastic changes, results in a continuous and preferably gapless layer of embossing material comprising different zones, with gapless and reproducible steps between the amounts of embossing material of varying heights H1, H2, H3 being formed as shown in Figure 3d. In a preferred embodiment, the area-selective amounts of embossing material 201, 201', 202, 202', 203, 203' applied to the substrate 3 by the inkjet process are made of the same embossing material. In a further embodiment, the amounts of embossing material differ with respect to their material composition; in particular, a first amount of embossing material and a second amount of embossing material are applied, the first and second being different from each other. Functional materials can also be applied by inkjet printing to incorporate additional functions into theto introduce printed zones. The embossing materials and / or polymers developed for inkjet printing can also be additionally modified with functional fillers. If different embossing materials are applied in a first quantity (201) of one embossing material and a second quantity (202) of another embossing material, quantities of the same height can also be applied. By considering and incorporating the behavior of the embossing materials before and during treatment at the adjacent zones, no mixing occurs that would lead to a blending of the materials. Any combination of area-selective quantities of embossing material 201, 201', 202, 202', 203, 203' applied to the substrate 3 with the same and / or different heights using the inkjet process is possible. After application and during treatment of the applied quantities of embossing materials according to Figure 3c, the predefinedThe distance between the quantities of embossing material is such that the different quantities of embossing material touch, as shown in Figure 3d, thus creating a full-surface layer of embossing material, preferably with a precisely defined height profile. The previously determined distance D1 from Figure 3c between area-selective quantities of embossing material of different heights applied to a substrate surface using an inkjet process is used in such a way that, after at least one treatment, a surface-covering substrate coating with embossing material is created, with seamless steps between the quantities of embossing material of different heights H1, H2, H3. The height H1, H2, H3 of the applied quantities remains almost unchanged, especially in the areas of height variation. In other words, no mixing occurs at the adjacent quantities of embossing material that would lead to a change in the height of the applied zones. The previously determined, optimalThe application pattern of the quantities of embossing material thus makes it possible to improve the quality of embossing material applications for complex applications. Even embossing material zones with a defined increase or decrease in height due to a sloping or inclined surface with arbitrary, changing angles would lose their defined inclination without considering the changes to the embossing material in adjacent areas caused by treatments in upstream processes. Figure 3e shows a cross-sectional view of several non-contacting quantities 201'', 202'', 203'' of embossing material with different heights H1, H2, H3 and different inclinations, applied to a substrate 3 using an inkjet process at a distance D2. The surface inclination of a fourth quantity of embossing material 204'' from Figure 3e, for example, has an angle ^. The individual quantities 201'', 202'', 203'', 204'' of embossing material can have different angles.exhibit. During the pretreatment of the applied quantities of embossing material according to Figure 3e, the previously considered distance between the quantities of embossing material decreases, resulting in seamless contact between the quantities of embossing material according to Figure 3f, whereby the embossing material height and the embossing material slope of the different quantities of embossing material are almost maintained, even at the respective edge zones of the individual quantities of embossing material. The area of ​​the embossing material coating corresponding to the fourth quantity 204'' of embossing material from Figure 3e, for example, still has the defined and reproducible slope with angle ^. In a further embodiment, the first quantity (101) and / or the second quantity (102) have a curved profile on a side facing away from the substrate (3). The profile of the curved profile can, for example, be convex, concave, or arbitrarily selected. To produce aFor surface profiles, combinations of embossing material quantities with any desired profile can be used. The first quantity (101) and the second quantity (102) of embossing material can, for example, have an inclined, curved, or flat profile and can be combined as desired. The precise control of quantity and placement, coupled with the consideration of local changes in the embossing material due to the material properties of the embossing material and the substrate during treatment, enables highly precise application of the embossing material. The embossing material can, for example, be used directly after a curing step or subjected to further processing steps such as a NIL process or a lithography process. The adapted area-selective coating with embossing material zones of varying height, inclination, and / or curvature enables highly precise and virtually error-free transfer.of complex structures during nanoimprinting, independent of the structure sizes and heights of a nanoimprint die and independent of the fill factor. In addition to changes in the embossing material caused by pre-processes, the exposure of the embossing material during the curing step after embossing can also influence the geometric accuracy and mechanical behavior of the cured embossing material. High dimensional accuracy can be achieved by optimizing the resolution of the printed embossing material, the processes, and adapting the printing designs. Figure 4a shows an embossing die element 4, 4', 4'', 4''', in particular a nanoimprint die with a die structure in a first embodiment. In Figure 4a, the structures of the imprint die are all identical and have the same depth and width. Figure 4b shows an embossing die element 4, 4', 4'', 4''', in particular a nanoimprint die with a die structure in asecond embodiment. In Figure 4b, the structures of the imprint die have the same depth but different widths. Figure 4c shows an embossing die element 4, 4', 4'', 4''', in particular a nanoimprint die with a die structure in a third embodiment. In Figure 4c, the structures of the imprint die have the same width but different depths. Figure 4d shows an embossing die element 4, 4', 4'', 4''', in particular a nanoimprint die with a die structure in a fourth embodiment with complex structures with unusual topographies. Any combination of Figures 4a to 4d is possible. The embodiments shown in Figures 4a to 4d are only exemplary and not limiting. The adapted area-selective coating with quantities of embossing material with different heights and / or slopes enables a highly precise and virtually error-free transfer of complex die structures, in particular according toFigures 4c and 4d show that the nano-embossing process is independent of the structure sizes and heights of an embossing die element 4, 4', 4'', 4''' and independent of the fill factor. Furthermore, the nano-embossed structures have a uniform residual layer thickness. The adapted area-selective coating according to the invention is suitable for applications requiring complex topographies. One application is, for example, the fabrication of lattice structures for augmented / virtual reality (AR / VR) gratings with complex topographies and narrow gaps. The embossing die elements 4, 4', 4'', 4''' according to Figures 4a to 4d are used in a device to carry out a nano-embossing process. The structured die (for example, in wafer format) is contacted with a substrate that has been pre-printed and pre-treated with embossing material using inkjet technology. In UV-NIL, for example, the structured stamp is used whenRoom temperature pressed into the flowable embossing material, the embossing material crosslinks to form a stable polymer upon exposure to UV radiation. Depending on the embossing material, curing is preferably carried out by UV light. More generally, curing can be achieved by electromagnetic radiation, heat, electricity, magnetic fields, or other methods. Curing is preferably based on polymerization of the base material. This polymerization is initiated by a so-called initiator. Nano-imprint lithography and NIL devices are known to those skilled in the art and are therefore not described in detail. An inkjet system for printing embossing material can advantageously be combined with a NIL device. The inkjet printing can be carried out separately from the embossing process in a separate module. Optionally, the solvent can then be (partially) evaporated in a bake-out step (bake-out module).The substrate is then transferred to an embossing module. A system typically comprises a group of modules with a shared workspace that can be sealed off from the ambient atmosphere if required. The modules can be arranged in a cluster or star configuration around a central module containing a motion unit (robot system). By integrating inkjet technology into lithography and nanoimprint lithography processes, the quality of the processed embossing materials can be further enhanced by leveraging the high precision, droplet placement accuracy, and uniformity of inkjet technology, as well as by analyzing the measurable changes in the printed embossing material during preprocessing. Reference Mark List: 1 Digital Image 2 Embossing Material Zone 3 Substrate 4, 4', 4'', 4''' Embossing Die Element 101, 201, 201', 202'', 203''' First Quantity 102, 202, 202', 202'', 202''' Second Quantity 103, 203, 203', 203'', 203''' Third Quantity 204 FourthDistanceH1, H2, H3 HeightD1, D2 Distance α Winkel

Claims

Claims 1. A method for producing a surface profile on or to a substrate (3), in particular in the context of manufacturing an electrical and / or optical component, comprising: - providing the substrate (3), - positioning a first quantity (101) of an embossing material on the substrate (3), - positioning a second quantity (102) of an embossing material or a further embossing material on the substrate (3), - realizing the surface profile by means of an embossing die element (4, 4', 4'', 4''') or an exposure masking element, which acts on the embossing material and / or the further embossing material, wherein a mixing of the first quantity (101) with the second quantity (102) is achieved by positioning the first quantity (101) and the second quantity (102).

2. The method according to claim 1, wherein the mixing of the first quantity (101) with the second quantity (102) is delayed by positioning the first quantity (101) and the second quantity (102). 3.

4. A method according to any one of the preceding claims, wherein the flow and / or mixing behavior of the first quantity (101) and / or the second quantity (102) is determined in a preparatory test step.

5. A method according to any one of the preceding claims, wherein the first quantity (101) is larger than the second quantity (102).

6. A method according to any one of the preceding claims, wherein a distance (D1) between the first quantity (101) and the second quantity (102) is set such that the first quantity (101) and the second quantity (102) remain unmixed until mixing is induced by a treatment agent.

6. A method according to any one of the preceding claims, wherein a treatment agent acts mechanically, optically, and / or chemically on the first quantity (101) and / or the second quantity (102).

7. A method according to any one of the preceding claims, wherein the first quantity (101) and / or the second quantity (102) is applied by means of an inkjet process.

8. A method according to any one of the preceding claims, wherein the embossing die element (4, 4', 4'', 4''') has a height profile.

9. A method according to claim 8, wherein a volume of the first quantity (101) and / or a volume of the second quantity (102) is adapted to the height profile of the embossing die element (4, 4', 4'', 4''').

10. A method according to any one of the preceding claims, wherein a position for the first quantity (101) and / or the second quantity (102) is determined by a control device. 11.A method according to any one of the preceding claims, wherein the first quantity (101) and / or the second quantity (102) has an inclined or curved profile on a side facing away from the substrate (3) relative to the main extension plane of the substrate (3).

12. A method according to any one of the preceding claims, wherein the surface profile has height differences that are less than 500 nm, preferably less than 250 nm, and particularly preferably less than 100 nm.

13. An apparatus for carrying out a method according to any one of the preceding claims, comprising: - a substrate holder, - a nozzle element for placing embossing material on a substrate (3), and - a control device for determining a position of a first quantity (101) of embossing material and a second quantity (102) of embossing material.

14. A control program for a control device for controlling an apparatus according to claim 13.

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