1025results about "Dough embossing machines" patented technology

A method for making an imprint mold uses sidewall spacer line doubling, but without the need to transfer the sidewall spacer patterns into the mold substrate. A base layer is deposited on the mold substrate, followed by deposition and patterning of a mandrel layer into stripes with tops and sidewalls. A layer of spacer material is deposited on the tops and sidewalls of the mandrel stripes and on the base layer between the mandrel stripes. The spacer material on the tops of the mandrel stripes and on the base layer between the mandrel stripes is then removed. The mandrel stripes are then etched away, leaving stripes of sidewall spacer material on the base layer. The resulting mold is a substrate with pillars of sidewall spacer material patterned as stripes and extending from the substrate, with the sidewall spacers serving as the mold features for imprinting.

A method for making apertures in a web comprising providing a precursor web material; providing a pair of counter-rotating, intermeshing rollers, wherein a first roller comprises circumferentially-extending ridges and grooves, and a second roller comprises teeth being tapered from a base and a tip, the teeth being joined to the second roller at the base, the base of the tooth having a cross-sectional length dimension greater than a cross-sectional width dimension; and moving the web material through a nip of the counter-rotating, intermeshing rollers; wherein apertures are formed in the precursor web material as the teeth on one of the rollers intermesh with grooves on the other of the rollers.

Provided are methods and devices for transfer printing of semiconductor elements to a receiving surface. In an aspect, the printing is by conformal contact between an elastomeric stamp inked with the semiconductor elements and a receiving surface, and during stamp removal, a shear offset is applied between the stamp and the receiving surface. The shear-offset printing process achieves high printing transfer yields with good placement accuracy. Process parameter selection during transfer printing, including time varying stamp-backing pressure application and vertical displacement, yields substantially constant delamination rates with attendant transfer printing improvement.

A pattern forming apparatus maintaining alignment between a mold and a substrate. The pattern forming apparatus includes a press pressing the mold against the substrate in a pressing direction, and a mechanism to maintain orientation of the mold and the substrate perpendicular to the pressing direction.

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Provided are an optimized tool apparatus and methods for dry transfer printing of semiconductor elements with high yield and good placement accuracy. The tool apparatus comprises a vacuum coupled fast peel apparatus that provides high pickup yield of the semiconductor elements. In an aspect, this vacuum coupled apparatus provides high pickup rates during pickup of the semiconductor elements from a donor / source wafer. Provided is a tool apparatus for dry transfer printing with a reinforced composite stamp having a thin glass-backing. The tool apparatus also comprises a pressure regulated micro-chamber which provides precise control of a composite stamp lamination and de-lamination. In an aspect, the micro-chamber has an internal cavity volume that is variably controlled, thereby providing precise control of the force on the stamp, and corresponding separation velocity, and improved semiconductor element pick-up and / or placement.

The present invention is directed to a template having a body including a surface with first and second regions. The first region has first wetting characteristics for a given material and the second region has second wetting characteristics for the given material. The first wetting characteristics differ from the second wetting characteristics. Specifically, the first region is formed from a surface treatment layer with a first surface energy to provide the first wetting characteristics. The second region is exposed portions of the body, typically quartz of fused silica, having a second surface energy associated therewith. The second surface energy is greater than the first surface energy to provide the second region with the second wetting characteristics.

A method for making apertures in a web comprising providing a precursor web material; providing a pair of counter-rotating, intermeshing rollers, wherein a first roller comprises circumferentially-extending ridges and grooves, and a second roller comprises teeth being tapered from a base and a tip, the teeth being joined to the second roller at the base, the base of the tooth having a cross-sectional length dimension greater than a cross-sectional width dimension; and moving the web material through a nip of the counter-rotating, intermeshing rollers; wherein apertures are formed in the precursor web material as the teeth on one of the rollers intermesh with grooves on the other of the rollers.

The present invention is directed to a template having a body including a surface with first and second regions. The first region has first wetting characteristics for a given material and the second region has second wetting characteristics for the given material. The first wetting characteristics differ from the second wetting characteristics. Specifically, the first region is formed from a surface treatment layer with a first surface energy to provide the first wetting characteristics. The second region is exposed portions of the body, typically quartz of fused silica, having a second surface energy associated therewith. The second surface energy is greater than the first surface energy to provide the second region with the second wetting characteristics.

A method of thermo-mechanically forming macrotextures in a microtextured film wherein a heat shield is utilized to thermally insulate the microtexture during the forming process.

An imprint process comprises the step of aligning a substrate, supported on a first support member, with a template, supported on a second support member. The substrate has at least one essentially plane surface provided with a moldable film. The template has at least one essentially plane surface provided with a relief pattern. The relief pattern is adapted to interact with the moldable film. The process further comprises the step of arranging a sealing gasket between the template and the second support member, such that a pressure cavity is defined by the second support member, the template and the sealing gasket. The process also comprises the step of applying a static gas pressure to the pressure cavity, in order to provide a pressure between the template and the substrate. The pressure is sufficient to form a pattern in the moldable film. An imprint device is also disclosed.

The present invention includes a template comprising a plurality of protrusions and a plurality of recessions with a distance between a zenith of any of the plurality of protrusions and a nadir of any one of the plurality of recessions being less than 250 nm.

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

The present invention is directed towards a method of expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.