Electronic device including heat dissipation seat and cushion

Abstract

An electronic device according to an embodiment comprises: a housing; a display; a first encapsulation film disposed on the housing; a heat dissipation sheet positioned below the display and disposed on a first portion of the first encapsulation film; a cushion positioned below the display, disposed on a second portion of the first encapsulation film, and spaced apart from the heat dissipation sheet; and a second encapsulation film covering the heat dissipation sheet and partially covering the cushion. Various other embodiments may also be possible.

Description

Electronic devices including heat-dissipating sheets and cushions

[0001] The present disclosure relates to an electronic device including a heat dissipating sheet and cushion.

[0002] An electronic device may include housing parts that are rotatably coupled and a flexible display. Depending on the rotation of the housing parts, a portion of the flexible display may bend. The electronic device may include a cushion to protect the flexible display. The cushion may be positioned beneath the flexible display.

[0003] Electronic devices may include electronic components that provide various functions. When these electronic components operate, heat may be generated. To dissipate the heat generated by these electronic components, the electronic device may include a heat-dissipating sheet.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] An electronic device is provided. The electronic device may include a housing. The electronic device may include a display. The electronic device may include a first sealing film disposed on the housing. The electronic device may include a heat dissipation sheet positioned below the display and disposed on a first portion of the first sealing film. The electronic device may include a cushion positioned below the display and disposed on a second portion of the first sealing film, and spaced apart from the heat dissipation sheet. The electronic device may include a second sealing film covering the heat dissipation sheet and partially covering the cushion.

[0006] An electronic device is provided. The electronic device may include a foldable housing including a first housing part and a second housing part rotatably coupled to the first housing part. The electronic device may include a flexible display disposed on the foldable housing. The electronic device may include an encapsulation structure disposed between the foldable housing and the flexible display. The encapsulation structure may include a first encapsulation film disposed on the foldable housing, a heat dissipation sheet positioned below the flexible display and disposed on a first portion of the first encapsulation film, a cushion positioned below the flexible display and disposed on a second portion of the first encapsulation film, and spaced apart from the heat dissipation sheet, and a second encapsulation film that at least partially covers the heat dissipation sheet and the cushion.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0008] FIG. 2A illustrates an example of an unfolded state of an electronic device according to one embodiment.

[0009] FIG. 2b illustrates an example of a folded state of an electronic device according to one embodiment.

[0010] FIG. 2c is an exploded view of an electronic device according to one embodiment.

[0011] Figures 3a and 3b illustrate the interior of an electronic device according to one embodiment.

[0012] Fig. 4 is a cross-sectional view of the electronic device of Fig. 3a taken along line A-A'.

[0013] Figure 5a illustrates a bag structure according to one embodiment.

[0014] Figure 5b is an exploded perspective view of a bag structure according to one embodiment.

[0015] Figure 6a is a plan view of a bag structure according to one embodiment.

[0016] Fig. 6b is a cross-sectional view taken along line B-B' of the bag structure of Fig. 6a.

[0017] Figure 7a is a plan view of a bag structure according to one embodiment.

[0018] Fig. 7b is a cross-sectional view taken along line C-C' of the bag structure of Fig. 7a.

[0019] Figure 8 illustrates an example of a bag structure in which a cushion is placed on a second bag film.

[0020] FIG. 9 illustrates a bag structure according to one embodiment including a shielding sheet.

[0021] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0022] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] FIG. 2A illustrates an example of an unfolded state of an electronic device according to one embodiment. FIG. 2B illustrates an example of a folded state of an electronic device according to one embodiment. FIG. 2C is an exploded view of an electronic device according to one embodiment.

[0045] Referring to FIGS. 2A, 2B, and 2C, an electronic device (101) according to one embodiment may include a foldable housing (201), a display (230) (e.g., the display module (160) of FIG. 1), or one or more cameras (240).

[0046] According to one embodiment, the foldable housing (201) may define the exterior surface of the electronic device (101). For example, the foldable housing (201) may be a physical exterior surface of the electronic device (101) that is exposed to the outside and may accommodate components disposed inside the electronic device (101). At least a portion of the components for implementing the function of the electronic device (101) may be disposed inside the foldable housing (201). According to one embodiment, the foldable housing (201) may include a first housing part (210), a second housing part (220), and a hinge assembly (250).

[0047] According to one embodiment, the first housing part (210) may include a first surface (211), a second surface (212) opposite the first surface (211), and a first side surface (213) that at least partially surrounds an edge of the first surface (211) and an edge of the second surface (212). For example, the first surface (211) may be referred to as a front exterior surface of the first housing part (210), and the second surface (212) may be referred to as a rear exterior surface of the first housing part (210). The first side surface (213) may be connected to a periphery of the first surface (211) and an edge of the second surface (212). The first surface (211), the second surface (212), and the first side surface (213) may form an interior space of the first housing part (210). For example, at least one component may be placed within a space surrounded by the first surface (211), the second surface (212), and the first side surface (213).

[0048] According to one embodiment, the second housing part (220) may include a third face (221), a fourth face (222) opposite the third face (221), and a second side (223) that at least partially surrounds an edge of the third face (221) and an edge of the fourth face (222). For example, the third face (221) may be referred to as a front side of the second housing part (220), and the fourth face (222) may be referred to as a back side of the second housing part (220). The second side (223) may be connected to an edge of the third face (221) and an edge of the fourth face (222). The third face (221), the fourth face (222), and the second side (223) may form an interior space of the second housing part (220). For example, at least one component may be placed within a space surrounded by the third side (221), the fourth side (222), and the second side (223).

[0049] According to one embodiment, the display (230) may be configured to display visual information. For example, the display (230) may include a display area comprising a plurality of pixels. For example, the active area may be referred to as an active area that displays visual information.

[0050] According to one embodiment, the display (230) may include a first planar portion (231), a second planar portion (232), and a bending portion (233) disposed between the first planar portion (231) and the second planar portion (232). The electronic device (101) may further include a cover display (235) distinct from the display (230). The cover display (235) may be referred to as a sub-display.

[0051] According to one embodiment, the first planar portion (231) may be supported by the first housing part (210). The second planar portion (232) may be supported by the second housing part (220). The first planar portion (231) and the second planar portion (232) may be substantially flat, independent of the state of the electronic device (101). The bending portion (233) may be configured to bend based on the rotation of the first housing part (210) and the second housing part (220). For example, in the unfolded state in which the first housing part (210) and the second housing part (220) are unfolded, the bending portion (233) may be substantially flat. In the folded state or intermediate state in which the first housing part (210) and the second housing part (220) are folded, the bending portion (233) may be at least partially bent. The display (230) may be a flexible display including a bendable bending portion (233).

[0052] According to one embodiment, one or more cameras (240) may be configured to acquire an image based on receiving light from a subject outside the electronic device (101). For example, the one or more cameras (240) may include first cameras (241), second cameras (242), and / or third cameras (243). For example, the first cameras (241) may be disposed within a first housing part (210). For example, the first housing part (210) may include at least one opening (241a) that overlaps the first cameras (241) when the electronic device (101) is viewed from above. The first cameras (241) may acquire an image based on receiving light from outside the electronic device (101) through the at least one opening (241a).

[0053] According to one embodiment, the second camera (242) may be disposed within the second housing part (220). The second housing part (220) may include at least one opening (242a) that overlaps the second camera (242) when the electronic device (101) is viewed from above. The second camera (242) may acquire an image based on receiving light from the outside of the electronic device (101) through the at least one opening (242a).

[0054] In one embodiment, the third camera (243) may be positioned within the first housing part (210). For example, the first planar portion (231) of the display (230) may include at least one opening that overlaps the third camera (243) when the display (230) is viewed from above. The third camera (243) may acquire an image based on receiving light from outside the display (230) through the at least one opening.

[0055] According to one embodiment, the second camera (242) and the third camera (243) may be positioned below (e.g., in the -z direction) the display (230) or the cover display (235). For example, the second camera (242) and / or the third camera (243) may include an under-display camera (UDC) and / or a punch-hole camera.

[0056] According to one embodiment, the first housing part (210) and the second housing part (220) may be rotatably coupled. For example, the second housing part (220) may be rotatably coupled to the first housing part (210) via a hinge assembly (250).

[0057] According to one embodiment, the hinge assembly (250) can rotatably connect the first housing part (210) and the second housing part (220). The hinge assembly (250) can be disposed between the first housing part (210) and the second housing part (220) of the electronic device (101) so that the electronic device (101) can be folded. The hinge assembly (250) can change the electronic device (101) from an unfolded state to a folded state. The hinge assembly (250) can change the electronic device (101) from a folded state to an unfolded state. For example, the hinge assembly (250) can maintain the electronic device (101) in an intermediate state between the unfolded state and the folded state.

[0058] In one embodiment, the unfolded state may be referred to as a state in which the first direction in which the first planar portion (231) faces and the second direction in which the second planar portion (232) faces are substantially the same. The folded state may be referred to as a state in which the first direction is substantially opposite to the second direction. When the electronic device (101) is in the folded state, the first housing part (210) and the second housing part (220) may be covered or overlapped.

[0059] According to one embodiment, when the electronic device (101) is in a folded state and an intermediate state, the first direction and the second direction may be different from each other. For example, when the electronic device (101) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the electronic device (101) is in an intermediate state, the first direction may form an angle (e.g., an angle greater than 0 degrees and less than 180 degrees) with respect to the second direction.

[0060] For example, the electronic device (101) may include at least one conductive portion (214a, 224a) and at least one non-conductive portion (214b, 224b) included within the first side (213) and / or the third side (223). For example, the at least one conductive portion (214a, 224a) may be separated from other conductive portions within the first side (213) and / or the third side (223) by contacting the at least one non-conductive portion (214b, 224b). In one embodiment, the at least one conductive portion (214a, 224a) may operate as an antenna radiator for use in communicating with an external electronic device.

[0061] Referring to FIG. 2C, the hinge assembly (250) may include a hinge cover (251), a first hinge plate (252), a second hinge plate (253), and a plurality of hinge modules (254). The hinge cover (251) may at least partially surround the components of the hinge assembly (250) and form an outer surface of the hinge assembly (250). The hinge cover (251) may be at least partially exposed to the outside of the electronic device (101) through a space between the first housing part (210) and the second housing part (220) when the electronic device (101) is in a folded state. When the electronic device (101) is in an unfolded state, the hinge cover (251) may be covered by the first housing part (210) and the second housing part (220) and may not be exposed to the outside of the electronic device (101).

[0062] In one embodiment, the first hinge plate (252) and the second hinge plate (253) may be operatively coupled with the first housing part (210) and the second housing part (220), respectively, thereby rotatably connecting the first housing part (210) and the second housing part (220). For example, the first hinge plate (252) may be operatively coupled with the first support member (215) of the first housing part (210), and the second hinge plate (253) may be operatively coupled with the second support member (227) of the second housing part (220). As the first hinge plate (252) and the second hinge plate (253) are operatively coupled to the first support member (215) and the second support member (227), respectively, the first housing part (210) and the second housing part (220) can be rotated according to the rotation of the first hinge plate (252) and the second hinge plate (253).

[0063] According to one embodiment, the plurality of hinge modules (254) can rotate the first hinge plate (252) and the second hinge plate (253). For example, the plurality of hinge modules (254) can include gears that are interlocked with each other and can rotate. The first hinge plate (252) and the second hinge plate (253) can rotate based on the rotational motion of the gears of the plurality of hinge modules (254).

[0064] According to one embodiment, the first housing part (210) may include a first support member (215) and a rear cover (216). The first support member (215) may be disposed inside the first housing part (210) and may support at least one component disposed inside the first housing part (210). The rear cover (216) may at least partially form a second surface (222) of the first housing part (210). For example, the second housing part (220) may include a second support member (227). The second support member (227) may be disposed inside the second housing part (220) and may support at least one component disposed inside the second housing part (220). For example, the cover display (235) may be disposed below (e.g., in the -z direction) the second support member (227).

[0065] An electronic device (101) according to one embodiment may include, in addition to the one or more cameras (240) described above, a plurality of electronic components for implementing various functions. For example, the electronic device (101) may include a first printed circuit board (261), a second printed circuit board (262), a flexible printed circuit board (263), and / or a battery (189). The electronic components described above are merely exemplary and are not limited thereto.

[0066] For example, the first printed circuit board (261) and the second printed circuit board (262) may each provide electrical connections between components within the electronic device (101). For example, the first printed circuit board (261) may be disposed within the first housing part (210), and the second printed circuit board (262) may be disposed within the second housing part (220). The first printed circuit board (261) may provide electrical connections between electronic components disposed within the first housing part (210). The second printed circuit board (262) may provide electrical connections between electronic components disposed within the second housing part (220). The flexible printed circuit board (263) may electrically connect the first printed circuit board (261) and the second printed circuit board (262). For example, a flexible printed circuit board (263) may extend from a first printed circuit board (261) across the hinge assembly (250) to a second printed circuit board (262). For example, the flexible printed circuit board (263) may at least partially overlap the hinge assembly (250).

[0067] According to one embodiment, the battery (189) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery and / or a rechargeable secondary battery.

[0068] According to one embodiment, the electronic device (101) may include a plurality of antennas (ANT1, ANT2, ANT3, or ANT4) to be used for communication with an external electronic device. For example, the electronic device (101) may include a main antenna (ANT1), a sub antenna (ANT2), an ultra-wide band (UWB) antenna (ANT3), and / or an antenna for short-range wireless communication (ANT4). However, the present invention is not limited thereto.

[0069] Hereinafter, one or more components to be described with reference to the drawings may be implemented together with components of the electronic device (101) described with reference to FIGS. 2A, 2B, and 2C. The same reference numerals are assigned to components identical to those described above, and redundant descriptions may be omitted.

[0070] Figures 3a and 3b illustrate the interior of an electronic device according to one embodiment.

[0071] FIG. 3A is a front view of an electronic device (101) with a display (e.g., display (230) of FIG. 2A) removed.

[0072] An electronic device according to one embodiment (e.g., the electronic device (101) of FIGS. 1 and 2A) may include a housing that defines the exterior of the electronic device (101). The housing may include a foldable housing (201) configured to be folded or unfolded. For example, the foldable housing (201) may include a first housing part (210) and a second housing part (220). The first housing part (210) and the second housing part (220) may be rotatably coupled to each other via a hinge assembly (250). For example, the hinge assembly (250) may include a first hinge plate (252) coupled to the first housing part (210) and a second hinge plate (253) coupled to the second housing part (220). The second hinge plate (253) may be rotatable relative to the first hinge plate (252). When an external force causing rotation is applied to the first housing part (210) and / or the second housing part (220), the first hinge plate (252) and / or the second hinge plate (253) may be rotated. By the rotation of the first hinge plate (252) and / or the second hinge plate (253), the first housing part (210) and / or the second housing part (220) may be rotated, thereby changing the state of the electronic device (101).

[0073] According to one embodiment, the first housing part (210) may include a first support member (215), and the second housing part (220) may include a second support member (227). The first support member (215) may support electronic components disposed within the first housing part (210). The second support member (227) may support electronic components disposed within the second housing part (220).

[0074] According to one embodiment, the electronic device (101) may include a display (230). As described above, the display (230) may be a flexible display. The display (230) may include a first planar portion (e.g., the first planar portion (231) of FIG. 2A), a second planar portion (e.g., the second planar portion (232) of FIG. 2A), and a bending portion (e.g., the bending portion (233) of FIG. 2A). The first planar portion (231) may be supported by a first support member (215) below the first planar portion (231) (e.g., in the -z direction). The second planar portion (232) may be supported by a second support member (227) below the second planar portion (232). The bending portion (233) can be configured to bend based on the rotation of the first housing part (210) and the second housing part (220).

[0075] To enable the bending portion (233) to bend, the glass window disposed on the front surface of the display (230) may be omitted, or an ultra-thin glass (UTG) having a very thin thickness may be disposed on the front surface of the display (230). Since the glass window is omitted or the UTG is disposed on the front surface of the display (230), the display (230) may be easily damaged by impact. For example, since the first support member (215) and the second support member (227) disposed under the display (230) are rigid, damage to the display (230) may occur due to contact between the display (230) and the support members (215, 227).

[0076] An electronic device (101) according to one embodiment may include components for absorbing impact applied to the display (230) from below the display (230) (e.g., in the -z direction).

[0077] An electronic device (101) according to one embodiment may include a waterproof tape (320). For example, the waterproof tape (320) may include a first waterproof tape (321) and a second waterproof tape (322). The first waterproof tape (321) disposed on the first support member (215) and the second waterproof tape (322) disposed on the second support member (227) may be formed of an elastic material. The first waterproof tape (321) and the second waterproof tape (322) may be disposed between the foldable housing (201) and the display (230). The first waterproof tape (321) may absorb impact applied to the first flat portion (231) of the display (230). The second waterproof tape (322) may absorb impact applied to the second flat portion (232) of the display (230). For example, a polymer member (331) for absorbing impact may be placed on the first support member (215). The polymer member (331) may be formed of polyethylene. A polymer member (332) for absorbing impact may be placed on the first hinge plate (252) and the second hinge plate (253). The polymer member (332) may be formed of thermoplastic polyurethane (TPU).

[0078] An electronic device (101) according to one embodiment may include a heat dissipation member (310) configured to dissipate heat generated from electronic components. For example, the heat dissipation member (310) may be a heat dissipation sheet (e.g., a heat dissipation sheet (420) of FIG. 4) formed of graphite having high thermal conductivity. The heat dissipation member (310) may diffuse heat within the electronic device (101) and reduce a temperature rise of the electronic device (101). The main function of the heat dissipation member (310) is to dissipate heat from the electronic device (101), but since the heat dissipation member (310) is less rigid than the first support member (215) and the second support member (227), shock absorption by the heat dissipation member (310) may also be possible.

[0079] FIG. 3b is a rear view of the electronic device (101) with the cover display (e.g., the cover display (235) of FIG. 2c) and the rear cover (e.g., the rear cover (216) of FIG. 2c) removed.

[0080] Referring to FIG. 3B, an electronic device (101) according to one embodiment may include a printed circuit board (261). The printed circuit board (261) may be disposed on a first support member (215). The printed circuit board (261) may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. The printed circuit board (261) may provide electrical connections between various electronic components disposed on the printed circuit board (261) and / or disposed outside the printed circuit board (261) by using wires and conductive vias formed on the conductive layers.

[0081] According to one embodiment, heat generated from electronic components disposed on a printed circuit board (261) can be dissipated by a heat dissipation member (e.g., a heat dissipation member (310) of FIG. 3A). The heat generated when the electronic components disposed on the printed circuit board (261) operate can be conducted to the heat dissipation member (310) through the printed circuit board (261) and the first support member (215), and can be dissipated through the heat dissipation member (310) to the outside of the electronic device (101). The heat dissipation member (310) can reduce the temperature of the electronic device (101), thereby reducing damage to electronic components and performance degradation due to overheating. For example, electronic components that generate heat may include, but are not limited to, a main processor (120) (e.g., an application processor (AP) and / or a power management circuit (340). For example, a heat dissipation sheet (e.g., a heat dissipation sheet (420) of FIG. 4) may be configured to dissipate heat generated from the main processor (120) and / or the power management circuit (340).

[0082] Referring again to FIG. 3A, the heat dissipation member (310) may be formed from a material having high thermal conductivity so as to conduct and release heat. As described above, the heat dissipation member (310) may include a sheet formed from graphite. Graphite may be suitable as a material for forming the heat dissipation member (310) because it has flexibility, high durability, and high thermal conductivity. Because graphite has a single crystal, it has low bursting strength and low tensile strength. As graphite has low bursting strength and low tensile strength, graphite may be easily broken. In order to prevent and / or reduce graphite dust from diffusing into the interior of the electronic device (101), the graphite sheet may be placed inside the electronic device (101) in the form of an encapsulation structure (e.g., an encapsulation structure (400) of FIG. 4) wrapped by an encapsulation film. For example, the encapsulation structure (400) may include an upper film (e.g., a second encapsulation film (440) of FIG. 4) and a lower film (e.g., a first encapsulation film (410) of FIG. 4) wrapping the graphite sheet. The graphite sheet may be placed between the upper film and the lower film, and the edges of the upper film and the lower film may be attached to each other.

[0083] The heat dissipation member (310) including the graphite sheet is less rigid than the first support member (215) and the second support member (227), but has lower elasticity than the components for absorbing shock (e.g., the polymer members (331, 332) of FIG. 3A), and therefore may not be able to sufficiently absorb shock applied to the display (230). Since the boundary portion of the encapsulation structure (400) is formed in a form in which the upper film and the lower film are attached to each other, it may not be able to substantially absorb shock applied to the display (e.g., the display (230) of FIG. 2A) from the outside. The shock may cause damage to the display (230), thereby deteriorating the quality of visual information displayed on the display (230).

[0084] An electronic device (101) according to one embodiment may include a sealing structure (400) capable of dissipating heat generated from electronic components (e.g., a main processor (e.g., processor (120) of FIG. 1) and / or a power management circuit (e.g., power management circuit (340) of FIG. 3b)) and absorbing shock applied to a display (230). Hereinafter, the sealing structure (400) will be described.

[0085] Fig. 4 is a cross-sectional view of the electronic device of Fig. 3a taken along line A-A'.

[0086] Referring to FIG. 4, an electronic device (101) according to one embodiment may include a bag structure (400). The bag structure (400) may include a first bag film (410), a heat dissipation sheet (420), a cushion (430), and a second bag film (440).

[0087] According to one embodiment, the first encapsulating film (410) may be disposed on the structure of the foldable housing (201). For example, the first encapsulating film (410) may be disposed on the first support member (215). The first encapsulating film (410) may be referred to as a lower film.

[0088] According to one embodiment, the heat dissipation sheet (420) may be disposed on the first portion (411) of the first sealing film (410). The heat dissipation sheet (420) being disposed on the first portion (411) of the first sealing film (410) may refer to the heat dissipation sheet (420) being disposed not on the entire area of ​​the first sealing film (410), but on a partial area (e.g., the first portion (411)) of the first sealing film (410). The heat dissipation sheet (420) may be positioned below the display (230) (e.g., in the -z direction). The heat dissipation sheet (420) may be formed of a material having high thermal conductivity. For example, the heat dissipation sheet (420) may be, but is not limited to, the graphite sheet described above.

[0089] According to one embodiment, the cushion (430) may be disposed on the second portion (412) of the first bagging film (410). The cushion (430) being disposed on the second portion (412) of the first bagging film (410) may be referred to as being disposed on another portion (e.g., the second portion (412)) of the first bagging film (410) that is different from the portion (e.g., the first portion (411)) of the first bagging film (410) on which the heat dissipation sheet (420) is disposed.

[0090] According to one embodiment, the cushion (430) may be positioned under the display (230) and configured to absorb impact on the display (230). The cushion (430) may be formed of a material having elasticity, such as a sponge, to mitigate impact applied to the display (230). When an impact is applied to the display (230), the impact may be transmitted from the display (230) to the cushion (430), and the cushion (430) may absorb the impact and deform. By deforming the cushion (430), the impact may be absorbed, thereby reducing damage to the display (230). Since the cushion (430) has elasticity, it may be restored to its original shape.

[0091] In one embodiment, the cushion (430) may be spaced apart from the heat-radiating sheet (420). If the heat-radiating sheet (420) and the cushion (430) are not spaced apart but come into contact with each other, the shock absorption effect of the cushion (430) and the heat-radiating effect of the heat-radiating sheet (420) may be reduced, and it may be difficult to form a bag structure (400) wrapped with bag films. As the cushion (430) is spaced apart from the heat-radiating sheet (420), a gap may be formed between the heat-radiating sheet (420) and the cushion (430).

[0092] In one embodiment, the second encapsulating film (440) may cover the heat-radiating sheet (420). The second encapsulating film (440) may be referred to as an upper film. For example, the heat-radiating sheet (420) may be completely covered by the second encapsulating film (440). When the second encapsulating film (440) is attached to the first encapsulating film (410), the heat-radiating sheet (420) may be wrapped by the first encapsulating film (410) and the second encapsulating film (440). The heat-radiating sheet (420) is wrapped by the first sealing film (410) and the second sealing film (440), and as the heat-radiating sheet (420) is placed between the first sealing film (410) and the second sealing film (440), the heat-radiating sheet (420) can be referred to as not being exposed to the outside of the first sealing film (410) and the second sealing film (440).

[0093] As described above, since the graphite forming the heat-dissipating sheet (420) is easily broken, impact may cause graphite dust. If the dust spreads inside the electronic device (101), the dust may enter the electronic components and cause damage or malfunction of the electronic components. According to one embodiment, the heat-dissipating sheet (420) may be disposed on the first sealing film (410) and covered by the second sealing film (440), thereby being wrapped by the first sealing film (410) and the second sealing film (440). Even if the graphite forming the heat-dissipating sheet (420) is broken, the graphite dust may not leak out of the sealing structure (400) within the space wrapped by the first sealing film (410) and the second sealing film (440). The first bag film (410) and the second bag film (440) may be formed of a polymer. For example, the first bag film (410) and the second bag film (440) may be formed of polyethylene terephthalate (PET), but are not limited thereto.

[0094] In one embodiment, the second bagging film (440) may partially cover the cushion (430). The second bagging film (440) partially covering the cushion (430) may refer to a portion of the cushion (430) being exposed between the first bagging film (410) and the second bagging film (440). For example, one side (431) of the cushion (430) may be aligned with the boundary between the first bagging film (410) and the second bagging film (440). Since one side (431) of the cushion (430) is aligned with the boundary between the first bagging film (410) and the second bagging film (440), the second portion (412) of the first bagging film (410) on which the cushion (430) is disposed for attachment to the second bagging film (440) may not protrude from the cushion (430). If the first sealing film (410) and the second sealing film (440) completely wrap the cushion (430), the first sealing film (410) may protrude outward from one side (431) of the cushion (430), and the second sealing film (440) may be attached to the protruding portion of the first sealing film (410). In this case, the boundary of the sealing structure (400) where the cushion (430) is not arranged may expand, thereby increasing the area where the display (230) cannot be protected by the cushion (430). In one embodiment, since the second sealing film (440) partially covers the cushion (430), and a portion of the cushion (430) is exposed between the first sealing film (410) and the second sealing film (440), the area where the display (230) cannot be protected by the cushion (430) may be reduced.

[0095] In one embodiment, the bag structure (400) may be disposed on the first support member (215). For example, the first support member (215) may include a first side (215a) facing the display (230) and a second side (215b) opposite the first side (215a). The first side (215a) may face the +z direction, and the second side (215b) may face the -z direction. For example, the bag structure (400) may be disposed on the first side (215a) of the first support member (215) facing the display (230).

[0096] In one embodiment, the cushion (430) may be positioned adjacent to the first hinge plate (252). For example, the distance between the first hinge plate (252) and the cushion (430) may be closer than the distance between the first hinge plate (252) and the heat dissipation sheet (420). As the cushion (430) is positioned adjacent to the first hinge plate (252), the distance (e.g., the first distance (D1)) between the edge of the first support member (215) facing the first hinge plate (252) and the bag structure (400) may be relatively reduced.

[0097] As described above, the heat-radiating sheet (420) may be wrapped by the first sealing film (410) and the second sealing film (440). To prevent the material (e.g., graphite) forming the heat-radiating sheet (420) from leaking out of the sealing structure (400), the heat-radiating sheet (420) may be disposed between the first sealing film (410) and the second sealing film (440), so as not to be exposed to the outside of the sealing structure (400). To prevent the heat-radiating sheet (420) from being exposed to the outside of the sealing structure (400), the first sealing film (410) and the second sealing film (440) may be attached to each other on the outside of the heat-radiating sheet (420). For example, the first sealing film (410) disposed on the first support member (215) includes a third portion (413) (e.g., the third portion (413) of FIG. 6B) protruding from the first portion (411) on which the heat-radiating sheet (420) is disposed, and the second sealing film (440) can be attached to the protruding third portion (413). Since the third portion (413) to which the first sealing film (410) and the second sealing film (440) are attached is located on the outer side of the heat-radiating sheet (420), the distance (e.g., the second distance) between the edge of the first support member (215) facing the first hinge plate (252) and the sealing structure (400) can be relatively increased. For example, when the bag structure (400) does not include a cushion (430), the distance (e.g., the second distance) between the edge of the first support member (215) facing the first hinge plate (252) and the bag structure (400) may be about 0.8 mm or more.

[0098] In one embodiment, since the cushion (430) is not completely covered by the second sealing film (440), one side (431) of the cushion (430) may be exposed between the first sealing film (410) and the second sealing film (440). Since the material forming the cushion (430) does not generate dust, unlike the heat-dissipating sheet (420), it may not be completely covered by the first sealing film (410) and the second sealing film (440). At the edge of the sealing structure (400) where the cushion (430) is placed, the first sealing film (410) and the second sealing film (440) may not be attached to each other. Since the first bag film (410) and the second bag film (440) are not attached to each other at the edge of the bag structure (400) where the cushion (430) is placed, the portion where the first bag film (410) and the second bag film (440) protrude from the cushion (430) may not be necessary.

[0099] In one embodiment, since the first bag film (410) and the second bag film (440) are not attached to the edge of the bag structure (400) where the cushion (430) is arranged, the distance (e.g., the first distance (D1)) between the edge of the first support member (215) facing the first hinge plate (252) and the bag structure (400) can be relatively reduced. For example, within FIG. 4, the distance (e.g., the first distance (D1)) between the edge of the first support member (215) facing the first hinge plate (252) and the bag structure (400) can be about 0.3 mm or less.

[0100] In one embodiment, since the first distance (D1) is shorter than the second distance, the area on which the heat dissipation sheet (420) can be placed and the area on which the cushion (430) can be placed can increase. For example, the encapsulation structure (400) according to one embodiment can have a heat dissipation sheet (420) and a cushion (430) having relatively large areas. The encapsulation structure (400) according to one embodiment can absorb impact over a relatively large area through the cushion (430) having a relatively large area, thereby reducing damage to the display (230). The encapsulation structure (400) according to one embodiment can be configured to effectively dissipate heat generated from electronic components through the heat dissipation sheet (420) having a relatively large area. In one embodiment, since the cushion (430) is placed adjacent to the first hinge plate (252), the impact absorption effect and the heat dissipation effect can be improved.

[0101] According to one embodiment, as the heat-dissipating sheet (420) and the cushion (430) are disposed between the first bag film (410) and the second bag film (440), the gap (e.g., the first gap (G1)) between the heat-dissipating sheet (420) and the cushion (430) can be relatively reduced. For example, when the cushion (430) is not disposed between the first bag film (410) and the second bag film (440), but is disposed outside the bag structure (400), the gap (e.g., the second gap) between the heat-dissipating sheet (420) and the bag film can be relatively increased.

[0102] When the cushion (430) is placed outside the bag structure (400), the gap (e.g., the second gap) between the cushion (430) and the heat-radiating sheet (420) can be relatively increased. As described above, so that the heat-radiating sheet (420) is not exposed to the outside of the bag structure (400), the first bag film (410) and the second bag film (440) can be attached to each other on the outside of the heat-radiating sheet (420). For example, the first bag film (410) placed on the first support member (215) includes a portion (e.g., a third portion (413)) that protrudes from the first portion (411) on which the heat-radiating sheet (420) is placed, and the second bag film (440) can be attached to the protruding portion. Since the portions where the first sealing film (410) and the second sealing film (440) are attached are located on the outside of the heat-radiating sheet (420), the gap (e.g., second gap) between the heat-radiating sheet (420) positioned inside the sealing structure (400) and the cushion (430) positioned outside the sealing structure (400) can be relatively increased. For example, when the cushion (430) is positioned outside the sealing structure (400), the gap (e.g., second gap) between the heat-radiating sheet (420) and the cushion (430) can be approximately 1.5 mm.

[0103] According to one embodiment, the bag structure (400) may include a cushion (430). As described above, the cushion (430) may be placed on the second portion (412) of the first bag film (410) and may be partially covered by the second bag film (440). As the cushion (430) is included within the bag structure (400), the gap (e.g., the first gap (G1)) between the heat dissipation sheet (420) and the cushion (430) may be reduced. When the cushion (430) is placed between the first sealing film (410) and the second sealing film (440), since the portion where the first sealing film (410) and the second sealing film (440) are attached is not located between the heat-radiating sheet (420) and the sealing structure (400), the gap (e.g., the first gap (G1)) between the heat-radiating sheet (420) and the cushion (430) may be relatively small. For example, the gap (e.g., the first gap (G1)) between the heat-radiating sheet (420) and the cushion (430) may be about 1.0 mm or less (e.g., about 0.5 mm).

[0104] In one embodiment, since the first gap (G1) is shorter than the second gap, the area on which the heat-dissipating sheet (420) can be placed and the area on which the cushion (430) can be placed can increase. For example, the encapsulation structure (400) according to one embodiment illustrated in FIG. 4 can have a heat-dissipating sheet (420) and a cushion (430) having relatively large areas. The encapsulation structure (400) according to one embodiment can absorb impact over a relatively large area through the cushion (430) having a relatively large area, thereby reducing damage to the display (230). The encapsulation structure (400) according to one embodiment can be configured to effectively dissipate heat generated from electronic components through the heat-dissipating sheet (420) having a relatively large area. In one embodiment, when the cushion (430) is placed within the encapsulation structure (400), the impact absorption effect and the heat dissipation effect can be improved.

[0105] Fig. 5a illustrates a bag structure according to one embodiment. Fig. 5b is an exploded perspective view of a bag structure according to one embodiment.

[0106] Referring to FIGS. 5A and 5B, the bag structure (400) may have an exterior formed by a first bag film (410), a second bag film (440), and a cushion (430). A heat-radiating sheet (420) and a cushion (430) may be placed between the first bag film (410) and the second bag film (440). The heat-radiating sheet (420) may not be exposed to the outside of the bag structure (400) by being wrapped by the first bag film (410) and the second bag film (440). Due to impact, the heat-radiating material (e.g., graphite) forming the heat-radiating sheet (420) may be broken, and dust from the heat-radiating material may be generated. Even if dust from the heat-dissipating material is generated, the heat-dissipating sheet (420) can remain inside the sealing structure (400) without leaking out of the sealing structure (400) because it is wrapped by the first sealing film (410) and the second sealing film (440). According to one embodiment, since the dust from the heat-dissipating material does not leak out of the heat-dissipating structure, damage and malfunction of electronic components caused by the dust from the heat-dissipating material can be reduced.

[0107] According to one embodiment, the cushion (430) may have elasticity. When an impact is applied to the display (e.g., the display (230) of FIG. 4), the impact may be transmitted to the cushion (430) positioned under the display (230). The cushion (430) having elasticity may absorb the impact, which may cause a deformation of the shape of the cushion (430). Since the cushion (430) may absorb the impact under the display (230), damage to the display (230) caused by an impact between the flexible display (230) and the rigid foldable housing (e.g., the foldable housing (201) of FIG. 2A) (e.g., the first support member (e.g., the first support member (215) of FIG. 4)) may be reduced.

[0108] In one embodiment, the bag structure (400) may have a length in one direction (e.g., the y-axis direction). For example, the bag structure (400) may be disposed adjacent to the first hinge plate (252) on the first support member (215), and the bag structure (400) may extend in the one direction corresponding to the extension direction of the first hinge plate (252). The bag structure (400) may be disposed adjacent to an edge of the first support member (215) facing the first hinge plate (252) and configured to absorb impact on a bending portion of the display (230) (e.g., the bending portion (233) of FIG. 2A). The bending portion (233) of the display (230) may be less susceptible to impact than the first flat portion (231) and the second flat portion (232) because it is configured to bend based on the rotation of the first housing part (e.g., the first housing part (210) of FIG. 3A) and the second housing part (e.g., the second housing part (220) of FIG. 3A). The encapsulation structure (400) disposed adjacent to the first hinge plate (252) may be disposed close to the bending portion (233) of the display (230), thereby absorbing impact on the bending portion (233) of the display (230), thereby reducing damage to the bending portion (233).

[0109] According to one embodiment, the heat-radiating sheet (420) may be surrounded by a first sealing film (410), a second sealing film (440), and a cushion (430). Since the heat-radiating sheet (420) is surrounded by the first sealing film (410), the second sealing film (440), and the cushion (430), it may not be exposed to the outside of the sealing structure (400). Even if dust of the heat-radiating material (e.g., a graphite sheet) forming the heat-radiating sheet (420) is generated by an impact, since the heat-radiating sheet (420) is surrounded by the first sealing film (410), the second sealing film (440), and the cushion (430), the dust of the heat-radiating material may not leak out to the outside of the sealing structure (400). According to one embodiment, damage to electronic components caused by dust of the heat-radiating material may be reduced.

[0110] Fig. 6a is a plan view of a bag structure according to one embodiment. Fig. 6b is a cross-sectional view of the bag structure of Fig. 6a taken along line B-B'.

[0111] Referring to FIG. 6A, the cushion (430) may be positioned to surround a portion of the heat dissipation sheet (420). As described above, the cushion (430) may be spaced apart from the heat dissipation sheet (420). The cushion (430) may be spaced apart from the edge of the heat dissipation sheet (420) and may partially surround the heat dissipation sheet (420).

[0112] In one embodiment, the heat-dissipating sheet (420) may have a roughly rectangular shape. Since the first sealing film (e.g., the first sealing film (410) of FIG. 4) and the second sealing film (e.g., the second sealing film (440) of FIG. 4) wrap the heat-dissipating sheet (420) so that the heat-dissipating material (e.g., graphite) forming the heat-dissipating sheet (420) does not leak out of the sealing structure (400), the heat-dissipating sheet (420) may be spaced apart from the edges of the first sealing film (410) and the second sealing film (440). Since one side of the cushion (430) is exposed through the edge of the sealing structure (400), the edge of the cushion (430) may be in contact with the edges of the first sealing film (410) and the second sealing film (440). The cushion (430) may be positioned adjacent to two sides of the heat dissipation sheet (420) having a roughly rectangular shape. As illustrated in FIG. 6A, the cushion (430) may have a roughly L-shape, but is not limited thereto.

[0113] Referring to Fig. 6b, a heat-radiating sheet (420) and a cushion (430) may be placed between the first sealing film (410) and the second sealing film (440). Since the cushion (430) is placed to surround a portion of the heat-radiating sheet (420), the cushion (430) may face a portion of an edge of the heat-radiating sheet (420). For example, one side (421) of the heat-radiating sheet (420) may face the cushion (430), and the other side (422) of the heat-radiating sheet (420) opposite to the one side (421) may not face the cushion (430).

[0114] According to one embodiment, the first sealing film (410) and the second sealing film (440) may be attached to each other at portions protruding from the other side (422) of the heat-radiating sheet (420) that do not face the cushion (430). For example, the first sealing film (410) may include a third portion (413) protruding from the other side of the heat-radiating sheet (420), and the second sealing film (440) may be attached on the third portion (413) of the first sealing film (410) protruding from the other side of the heat-radiating sheet (420). When the first sealing film (410) and the second sealing film (440) are attached, the heat-radiating sheet (420) may be wrapped by the first sealing film (410) and the second sealing film (440).

[0115] In one embodiment, one side of the cushion (430) may be exposed between the first bagging film (410) and the second bagging film (440). One side (431) of the cushion (430) may be aligned with the boundary between the first bagging film (410) and the second bagging film (440). The other side (432) of the cushion (430), which is opposite to the one side (431) of the cushion (430) exposed between the first bagging film (410) and the second bagging film (440), may face one side (421) of the heat-radiating sheet (420). The gap between the one side (421) of the heat-radiating sheet (420) and the other side (432) of the cushion (430) may correspond to the gap between the heat-radiating sheet (420) and the cushion (430) (e.g., the first gap (G1) of FIG. 4). For example, the gap may be, but is not limited to, about 1.0 mm or less (e.g., about 0.5 mm).

[0116] In one embodiment, as the cushion (430) is arranged to surround a portion of the heat-radiating sheet (420), a portion where the first sealing film (410) and the second sealing film (440) are attached to each other can be formed. In the embodiment illustrated in FIGS. 6A and 6B , the heat-radiating sheet (420) can be wrapped by the first sealing film (410), the second sealing film (440), and the cushion (430). As the heat-radiating sheet (420) is wrapped by the first sealing film (410), the second sealing film (440), and the cushion (430), the heat-radiating material (e.g., graphite) forming the heat-radiating sheet (420) can be prevented from leaking out of the sealing structure (400). Even if the heat-radiating sheet (420) is broken by impact and dust of the heat-radiating material is generated, since the heat-radiating sheet (420) is wrapped by the first sealing film (410), the second sealing film (440), and the cushion (430), the dust of the heat-radiating material does not leak out of the sealing structure (400) but can remain inside the sealing structure (400).

[0117] Fig. 7a is a plan view of a bag structure according to one embodiment. Fig. 7b is a cross-sectional view taken along line C-C' of the bag structure of Fig. 7a.

[0118] Referring to FIG. 7a, the cushion (430) may be positioned to entirely surround the heat dissipation sheet (420). The cushion (430) may be spaced from the edge of the heat dissipation sheet (420) and entirely surround the edge of the heat dissipation sheet (420).

[0119] According to one embodiment, the heat-dissipating sheet (420) may have a roughly rectangular shape. To prevent the heat-dissipating material (e.g., graphite) forming the heat-dissipating sheet (420) from leaking out of the encapsulating structure (400), the heat-dissipating sheet (420) may not be exposed to the outside of the encapsulating structure (400). Since one side (431) of the cushion (430) is exposed through the edge of the encapsulating structure (400), the edge of the cushion (430) may be in full contact with the edges of the first encapsulating film (410) and the second encapsulating film (440). The cushion (430) may be arranged adjacent to the four sides of the heat-dissipating sheet (420) having a roughly rectangular shape. As illustrated in FIG. 7A, the cushion (430) may have a roughly square ring shape, but is not limited thereto.

[0120] Referring to Fig. 7b, a heat-radiating sheet (420) and a cushion (430) may be placed between the first sealing film (410) and the second sealing film (440). Since the cushion (430) is placed to entirely surround the heat-radiating sheet (420), the cushion (430) may face an edge of the heat-radiating sheet (420). For example, one side (421) of the heat-radiating sheet (420) may face the cushion (430), and the other side (422) of the heat-radiating sheet (420) opposite to the one side may also face the cushion (430).

[0121] In one embodiment, the first sealing film (410) and the second sealing film (440) may not be attached to each other. For example, the first sealing film (410) may be placed below (e.g., in the -z direction) the heat-dissipating sheet (420) and the cushion (430). The first sealing film (410) may be in contact with the lower surface of the heat-dissipating sheet (420) and the lower surface of the cushion (430). The second sealing film (440) may be placed above (e.g., in the +z direction) the heat-dissipating sheet (420) and the cushion (430). The second sealing film (440) may be in contact with the upper surface of the heat-dissipating sheet (420) and the lower surface of the cushion (430). Even if the first sealing film (410) and the second sealing film (440) are not attached to each other, the heat-radiating sheet (420) can be placed within the sealing structure (400) because the cushion (430) entirely surrounds the heat-radiating sheet (420). For example, the outer surface of the heat-radiating sheet (420) can face the inner surface of the cushion (430).

[0122] According to one embodiment, as the cushion (430) is arranged to entirely surround the heat-radiating sheet (420), the heat-radiating sheet (420) may be wrapped by the first sealing film (410), the second sealing film (440), and the cushion (430). As the heat-radiating sheet (420) is wrapped by the first sealing film (410), the second sealing film (440), and the cushion (430), the heat-radiating material (e.g., graphite) forming the heat-radiating sheet (420) may not leak out of the sealing structure (400). Even if the heat-radiating sheet (420) is broken by impact and dust of the heat-radiating material is generated, since the heat-radiating sheet (420) is wrapped by the first sealing film (410), the second sealing film (440), and the cushion (430), the dust of the heat-radiating material does not leak out of the sealing structure (400) but can remain inside the sealing structure (400).

[0123] Figure 8 illustrates an example of a bag structure in which a cushion is placed on a second bag film.

[0124] Referring to FIG. 8, the cushion (430) may be placed outside the first sealing film (410) and the second sealing film (440). For example, the heat-radiating sheet (420) may be wrapped by the first sealing film (410) and the second sealing film (440). The first sealing film (410) may be placed below the heat-radiating sheet (420) (e.g., in the -z direction), and the second sealing film (440) may be placed above the heat-radiating sheet (420) (e.g., in the +z direction). The first sealing film (410) and the second sealing film (440) may protrude from the heat-radiating sheet (420) and be attached to each other.

[0125] For example, the first sealing film (410) may include a third portion (413) extending from a first portion (411) where the heat-radiating sheet (420) is disposed and spaced apart from the heat-radiating sheet (420). The third portion (413) may not be in contact with the heat-radiating sheet (420). The second sealing film (440) may extend from a portion in contact with the heat-radiating sheet (420) and be attached to the third portion (413) of the first sealing film (410). As the first sealing film (410) and the second sealing film (440) are attached to each other, the heat-radiating sheet (420) between the first sealing film (410) and the second sealing film (440) may be disposed inside the sealing structure (400).

[0126] For example, the cushion (430) may be placed on the second sealing film (440). The cushion (430) may be placed on the portion (441) of the second sealing film (440) attached to the third portion (413) of the first sealing film (410). When the cushion (430) is placed on the portion (442) of the second sealing film (440) that is in contact with the heat dissipation sheet (420), the distance between the display (e.g., the display (230) of FIG. 2A) and the support member (e.g., the first support member (215) or the second support member (227) of FIG. 2C) increases, thereby increasing the thickness of the electronic device (101). The cushion (430) may be placed on a portion (441) of the second sealing film (440) that does not overlap the heat-dissipating sheet (420) in order to reduce an increase in the thickness of the electronic device (101). If the cushion (430) is not placed on the second sealing film (440) but is placed outside the sealing structure (400), the gap between the heat-dissipating sheet (420) and the sealing structure (400) may increase. If the gap increases, the area of ​​the heat-dissipating sheet (420) and the area of ​​the cushion (430) may decrease, thereby reducing the shock absorption effect by the cushion (430) and the heat dissipation effect by the heat-dissipating sheet (420). For the shock absorption effect and the heat dissipation effect, the cushion (430) may be placed on the second sealing film (440). When the cushion (430) is placed on the second bag film (440), the gap between the heat dissipation sheet (420) and the cushion (430) may be smaller than when the cushion (430) is placed outside the bag structure (400).

[0127] FIG. 9 illustrates a bag structure according to one embodiment including a shielding sheet.

[0128] The aforementioned bag structure (e.g., bag structure (400) of FIG. 4) has been described as including a heat-dissipating sheet (e.g., heat-dissipating sheet (420) of FIG. 4), but the heat-dissipating sheet (420) may be replaced with a shielding sheet (920) of FIG. 9.

[0129] Referring to FIG. 9, an electronic device (101) according to one embodiment may include another encapsulation structure (900). The another encapsulation structure (900) may have a structure substantially identical to the aforementioned encapsulation structure (400). For example, except that in the aforementioned encapsulation structure (400), the heat dissipation sheet (420) is replaced with a shielding sheet (920), the another encapsulation structure (900) may be substantially identical to the aforementioned encapsulation structure (400).

[0130] According to one embodiment, another bag structure (900) may include a third bag film (910), a shielding sheet (920), another cushion (930), and a fourth bag film (940).

[0131] According to one embodiment, the third bagging film (910) may be disposed on a foldable housing (e.g., the foldable housing (201) of FIG. 3A). For example, the third bagging film (910) may be disposed on a first support member (e.g., the first support member (215) of FIG. 3A) of a first housing part (e.g., the first housing part (210) of FIG. 3A) or a second support member (e.g., the second support member (227) of FIG. 3A) of a second housing part (e.g., the second housing part (220) of FIG. 3A).

[0132] According to one embodiment, a shielding sheet (920) may be disposed on a first portion (911) of a third sealing film (910). The shielding sheet (920) may be configured to shield a magnetic field emitted from electronic components of the electronic device (101). The shielding sheet (920) may be configured to reduce interference between electronic components and reduce noise and malfunction of the electronic components by shielding the magnetic field. For example, the shielding sheet (920) may include a magnetic metal powder (MMP). For example, the magnetic metal powder may include at least one selected from iron, aluminum, nickel, silicon, or a combination thereof. For example, the shielding sheet (920) may include, but is not limited to, a ferromagnetic material (e.g., steel plate cold commercial (SPCC)) or an aspirated radiation shield (ARS).

[0133] In one embodiment, another cushion (930) may be placed on the second portion (912) of the third bag film (910). The other cushion (930) may be spaced apart from the shielding sheet (920). The other cushion (930) included within the other bag structure (900) may be substantially identical to the cushion described above (e.g., cushion (430) of FIG. 4).

[0134] In one embodiment, the fourth bag film (940) may cover the shielding sheet (920) and partially cover the other cushion (930). For example, the shielding sheet (920) may be positioned between the third bag film (910) and the fourth bag film (940) so as not to be exposed to the outside of the third bag film (910) and the fourth bag film (940). The other cushion (930) may be exposed between the third bag film (910) and the fourth bag film (940). For example, the other cushion (930) may be positioned so as to entirely surround the shielding sheet (920). The lower surface of the shielding sheet (920) may be in contact with the third sealing film (910), the upper surface of the shielding sheet (920) may be in contact with the fourth sealing film (940), and the side surface of the shielding sheet (920) may be surrounded by another cushion (930). The shielding material (e.g., MMP) forming the shielding sheet (920) may be surrounded by the third sealing film (910), the fourth sealing film (940), and the other cushion (930), thereby preventing it from leaking out of the other sealing structure (900). As illustrated in FIG. 9, the other cushion (930) may be arranged to entirely surround the shielding sheet (920), but is not limited thereto. For example, another cushion (930) may surround a portion of the shielding sheet (920), and the third bag film (910) and the fourth bag film (940) may be attached to each other by protruding outward from the shielding sheet (920).

[0135] In one embodiment, since the other bag structure (900) includes the shielding sheet (920) and the other cushion (930), the gap (e.g., the third gap (G3)) between the shielding sheet (920) and the other cushion (930) can be reduced. As the third gap (G3) is reduced, the area of ​​the shielding sheet (920) and the area of ​​the other cushion (930) can be increased. As the area of ​​the shielding sheet (920) and the area of ​​the other cushion (930) are increased, the magnetic field shielding effect of the shielding sheet (920) and the shock absorption effect of the other cushion (930) can be improved.

[0136] Referring again to FIG. 3A, an electronic device (101) according to one embodiment may include magnets (951, 952) for fixing a first housing part (210) and a second housing part (220) in a folded state in which the first housing part (210) and the second housing part (220) overlap each other. For example, a first magnet (951) may be placed within the first housing part (210), and a second magnet (952) may be placed within the second housing part (220). The second magnet (952) may be paired with the first magnet (951). As the first housing part (210) and the second housing part (220) rotate, the first magnet (951) and the second magnet (952) may come closer to each other, and an attractive force may act between the first magnet (951) and the second magnet (952). The attractive force may be configured to maintain the electronic device (101) in a folded state by fixing the first housing part (210) and the second housing part (220). A user may change the electronic device (101) from a folded state to an unfolded state by applying an external force greater than the attractive force to the electronic device (101) in the folded state.

[0137] Since the magnets (951, 952) form a magnetic field, when the magnetic field electromagnetically interacts with electronic components of the electronic device (101) disposed around the magnets (951, 952), noise may be caused to the electronic components or malfunctions may be caused. According to one embodiment, another encapsulating structure (900) including a shielding sheet (920) may be arranged around the magnets (951, 952) to reduce the influence of the magnetic field formed from the magnets (951, 952) on the electronic components. Another encapsulating structure (900) may include another cushion (930), and thus may be configured to absorb impact applied to the display (e.g., the display (230) of FIG. 2A), thereby reducing damage to the display (230). In addition, another encapsulating structure (900) may be arranged around a component that forms a magnetic field.

[0138] An electronic device (101) is provided. The electronic device (101) may include a housing (201). The electronic device (101) may include a display (230). The electronic device (101) may include a first sealing film (410) disposed on the housing (201). The electronic device (101) may include a heat dissipation sheet (420) positioned below the display (230) and disposed on a first portion (411) of the first sealing film (410). The electronic device (101) may include a cushion (430) positioned below the display (230), disposed on a second portion (412) of the first sealing film (410), and spaced apart from the heat dissipation sheet (420). The electronic device (101) may include a second sealing film (440) that covers the heat dissipation sheet (420) and partially covers the cushion (430).

[0139] According to one embodiment, the gap between the heat dissipation sheet (420) and the cushion (430) (e.g., the first gap (G1) in FIG. 4) may be 1 mm or less.

[0140] According to one embodiment, the cushion (430) may be arranged to entirely surround the heat dissipation sheet (420).

[0141] According to one embodiment, the cushion (430) may be arranged to partially surround the heat dissipation sheet (420). The second sealing film (440) may include a portion connected to the first sealing film (410).

[0142] According to one embodiment, the portion of the second bag film (440) connected to the first bag film (410) may be attached to a third portion (413) of the first bag film (410), which is different from the first portion (411) of the first bag film (410) on which the heat dissipation sheet (420) is disposed and the second portion (412) of the first bag film (410) on which the cushion (430) is disposed.

[0143] According to one embodiment, a portion of the cushion (430) may be exposed between the first bag film (410) and the second bag film (440).

[0144] According to one embodiment, the housing (201) may be a foldable housing (201) including a first housing part (210) and a second housing part (220) rotatably coupled to the first housing part (210). The display (230) may be a flexible display (230).

[0145] According to one embodiment, the first housing part (210) may include a support member (215) including a first side (215a) facing the flexible display (230) and a second side (215b) opposite to the first side (215a) and in contact with an electronic component. The first sealing film (410) may be disposed on the first side (215a) of the support member (215).

[0146] According to one embodiment, the electronic component may include an application processor (AP) (120) or a power management circuit (340). The heat dissipation sheet (420) may be configured to dissipate heat generated from the AP (120) or the power management circuit (340).

[0147] According to one embodiment, the electronic device (101) may further include a hinge assembly (250) including hinge plates that rotatably connect the first housing part (210) and the second housing part (220). The hinge plates may include a first hinge plate (252) coupled to the first housing part (210), and a second hinge plate (253) coupled to the second housing part (220). The cushion (430) may be arranged adjacent to the first hinge plate (252).

[0148] According to one embodiment, the distance between the edge of the support member (215) facing the first hinge plate (252) and the cushion (430) may be 0.3 mm or less.

[0149] According to one embodiment, the flexible display (230) may include a first planar portion (231) supported by the first housing part (210), a second planar portion (232) supported by the second housing part (220), and a bending portion (233) between the first planar portion (231) and the second planar portion (232) configured to bend based on rotation of the first housing part (210) and the second housing part (220).

[0150] According to one embodiment, the heat dissipation sheet (420) may be surrounded by the first sealing film (410), the cushion (430), and the second sealing film (440).

[0151] According to one embodiment, the electronic device (101) may further include a third sealing film (910) disposed on the housing (201). The electronic device (101) may further include a shielding sheet (920) disposed on a first portion (411) of the third sealing film (910) for shielding a magnetic field. The electronic device (101) may further include another cushion (930) disposed on a second portion (412) of the third sealing film (910) and spaced apart from the shielding sheet (920). The electronic device (101) may further include a fourth sealing film (940) covering the shielding sheet (920) and partially covering the other cushion (930).

[0152] According to one embodiment, the electronic device (101) may further include a waterproof tape (320) disposed between the housing (201) and the display (230).

[0153] An electronic device (101) is provided. The electronic device (101) may include a foldable housing (201) including a first housing part (210) and a second housing part (220) rotatably coupled to the first housing part (210). The electronic device (101) may include a flexible display (230) disposed on the foldable housing (201). The electronic device (101) may include a sealing structure (400) disposed between the foldable housing (201) and the flexible display (230). The above-described bag structure (400) may include a first bag film (410) disposed on the foldable housing (201), a heat dissipation sheet (420) positioned below the flexible display (230) and disposed on a first portion (411) of the first bag film (410), a cushion (430) positioned below the flexible display (230) and disposed on a second portion (412) of the first bag film (410) and spaced apart from the heat dissipation sheet (420), and a second bag film (440) that at least partially covers the heat dissipation sheet (420) and the cushion (430).

[0154] According to one embodiment, the electronic device (101) may further include a hinge assembly (250) including hinge plates that rotatably connect the first housing part (210) and the second housing part (220). The hinge plates may include a first hinge plate (252) coupled to the first housing part (210) and a second hinge plate (253) coupled to the second housing part (220). The first housing part (210) may include a support member (215) that contacts an electronic component disposed within the first housing part (210). The sealing structure (400) may be disposed on the support member (215) so as to be adjacent to the first hinge plate (252).

[0155] According to one embodiment, the distance between the edge of the support member facing the first hinge plate (252) and the cushion (430) may be 0.3 mm or less.

[0156] According to one embodiment, the gap between the heat dissipation sheet (420) and the cushion (430) (e.g., the first gap (G1) in FIG. 4) may be 1 mm or less.

[0157] According to one embodiment, the cushion (430) may be positioned to at least partially surround the heat dissipation sheet (420).

[0158] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0159] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0160] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0161] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0162] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0163] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, housing; display; A first sealing film disposed on the housing; A heat dissipation sheet positioned below the display and arranged on the first portion of the first bag film; A cushion positioned below the display, placed on the second portion of the first bag film, and spaced apart from the heat dissipation sheet; and A second sealing film covering the heat-dissipating sheet and partially covering the cushion, Electronic devices.

2. In paragraph 1, The gap between the above heat dissipation sheet and the above cushion is Less than 1mm, Electronic devices.

3. In paragraph 1 or 2, The above cushion is, Arranged to entirely surround the above heat-radiating sheet, Electronic devices.

4. In any one of paragraphs 1 to 3, The above cushion is, It is arranged so as to partially surround the above heat dissipation sheet, The above second bag film, Including a portion attached to the first bag film, Electronic devices.

5. In paragraph 4, The above part of the second bag film attached to the above first bag film, Attached to a third part of the first bag film, which is different from the first part of the first bag film on which the heat-dissipating sheet is placed and the second part of the first bag film on which the cushion is placed, Electronic devices.

6. In any one of paragraphs 1 to 5, Some of the above cushions are, Exposed between the first bag film and the second bag film, Electronic devices.

7. In any one of paragraphs 1 to 6, The above housing, A foldable housing comprising a first housing part and a second housing part rotatably coupled to the first housing part, The above display is, Flexible display, Electronic devices.

8. In paragraph 7, The above first housing part, A support member including a first side facing the flexible display and a second side opposite to the first side and in contact with an electronic component, The above first bag film, arranged on the first surface of the above support member, Electronic devices.

9. In paragraph 8, The above electronic components are, Includes an AP (application processor) or power management circuit, The above heat dissipation sheet, configured to dissipate heat generated from the AP or the power management circuit; Electronic devices.

10. In paragraph 8, Further comprising a hinge assembly including hinge plates rotatably connecting the first housing part and the second housing part, The above hinge plates, A first hinge plate coupled to the first housing part, and A second hinge plate coupled to the second housing part, The above cushion is, Positioned adjacent to the first hinge plate, Electronic devices.

11. In paragraph 10, The distance between the edge of the support member facing the first hinge plate and the cushion is Less than 0.3mm, Electronic devices.

12. In paragraph 7, The above flexible display, A first flat portion supported by the first housing part, a second flat portion supported by the second housing part, and Including a bending portion between the first planar portion and the second planar portion, configured to bend based on rotation of the first housing part and the second housing part; Electronic devices.

13. In any one of paragraphs 1 to 12, The above heat dissipation sheet, Surrounded by the first bag film, the cushion, and the second bag film, Electronic devices.

14. In any one of paragraphs 1 to 13, A third bag film disposed on the housing; A shielding sheet placed on the first part of the third bag film and for shielding a magnetic field; Another cushion placed on the second part of the third bag film and spaced apart from the shielding sheet; and Further comprising a fourth bag film covering the above shielding sheet and partially covering the other cushion; Electronic devices.

15. In any one of paragraphs 1 to 14, Further comprising a waterproof tape disposed between the housing and the display. Electronic devices.

Images