Easy-to-assemble high-current composite circuit board and manufacturing process therefor

Abstract

Disclosed in the present invention are an easy-to-assemble high-current composite circuit board and a manufacturing process therefor. The easy-to-assemble high-current composite circuit board comprises a bottom plate assembly, the bottom plate assembly successively consisting of an outer housing, an insulating plate, a composite circuit board and an insulating encapsulation layer from top to bottom; the composite circuit board is provided with insulating recesses, and mounting holes used for conducting electricity; the outer housing and the insulating plate are provided with through holes at positions corresponding to the mounting holes. The present invention has a simple structure, in which the bottom plate assembly made of the composite circuit board has a better load-bearing effect, conductive posts are riveted onto the composite circuit board by means of a riveting technology, and then connection leads are screwed and fixed to the upper ends of the conductive posts by means of conductive screws, such that components and the composite circuit board are electrically connected; using this structure can simplify assembly processes and improve assembly efficiency. In addition, testing can be performed right after the conductive posts are riveted, which effectively avoids the situation that defects of bottom plate assemblies are not found until components are assembled, thus reducing the generation of defective products and the rework maintenance rate, ensuring the pass rate of finished products, and reducing production costs of enterprises.

Description

An easy-to-assemble high-current composite circuit board and its manufacturing process Technical Field

[0001] This invention relates to the field of electrical control equipment technology, and in particular to an easy-to-assemble high-current composite circuit board and its manufacturing process. Background Technology

[0002] Electrical control boxes are widely used in electrical control equipment across various industries. They are applicable to low-voltage power distribution equipment in various large-scale production and manufacturing equipment, engineering machinery devices, new energy-related equipment, high-speed rail and ships, building construction and elevators.

[0003] Currently, traditional electrical control boxes on the market are manufactured by manually installing and fixing electrical components into the box, and then routing and connecting electrical circuits according to the electrical schematic diagram. The entire installation process is completed by workers manually routing and connecting the wires. This method of assembly is not only inefficient, but also increases the labor intensity of workers. With prolonged work, wiring errors are prone to occur, leading to installation mistakes. This results in high raw material consumption, increased labor costs, and the use of connecting wires to route the wires, which creates multiple wire bundles inside, resulting in a large product size that cannot be reduced in size.

[0004] Currently, some electrical components on the market use PCBs to replace traditional wiring for connection. This allows electrical components to be connected to the PCB via wires, reducing wiring. Soldering is then used to bond the wires to the PCB, further reducing internal wiring bundles and minimizing size. However, this assembly method requires the assistance of another person when soldering the wires to the PCB. One person holds the electrical component upright from the front, while the other performs the soldering from the back. Although this structure can speed up production and assembly, it results in high labor costs. Furthermore, the product needs to be tested after soldering, and if the test fails, disassembly and reassembly are very troublesome and can easily lead to material scrap. For high-current circuit boards, soldering can easily result in weak welds, leading to insufficient connection stability and poor reliability.

[0005] Therefore, a new technical solution needs to be researched to address the above problems.

[0006] Summary of the Invention

[0007] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide an easy-to-assemble high-current composite circuit board and its manufacturing process.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] An easy-to-assemble high-current composite circuit board includes a base plate assembly, which consists of a housing, an insulating plate, a composite circuit board, and an insulating encapsulation layer from top to bottom. The composite circuit board has insulating grooves and mounting holes for conducting electricity. The housing and the insulating plate have through holes corresponding to the positions of the mounting holes.

[0010] As a preferred embodiment, the composite circuit board is made by sequentially stacking and pressing a metal layer, an adhesive layer, and a polymer insulating layer, wherein the metal layer is formed into insulating grooves and mounting holes by milling and cutting.

[0011] As a preferred embodiment, the insulating groove is filled with a sealing layer for insulation and protection, the sealing layer comprising a sealing sheet preformed from insulating material or formed by flow filling of liquid insulating material.

[0012] As a preferred embodiment, the insulating board, insulating encapsulation layer, and sealing layer are made of epoxy resin material; the polymer material insulating layer is made of epoxy resin, fiberglass board, bakelite board, silicone board, or plastic board.

[0013] As a preferred embodiment, the metal layer is made of copper plate, alloy copper plate or alloy aluminum plate, the adhesive layer is made of prepreg, the thickness of the metal layer is 0.2mm-3mm, the thickness of the polymer insulating layer is 0.5mm-5mm, and the total thickness of the composite circuit board is 0.9mm-8.2mm.

[0014] As a preferred embodiment, the device also includes a conductive post, which consists of an upper end and a lower end. The diameter of the lower end is smaller than that of the upper end. The lower end of the conductive post passes through the through holes of the outer shell and the insulating plate and the mounting holes of the composite circuit board in sequence to be fixedly installed on the base plate assembly. The upper end face of the upper end of the conductive post is provided with an internal threaded hole extending from top to bottom.

[0015] As a preferred embodiment, the conductive post is installed and fixed to the base plate assembly by riveting technology, so that the lower end of the conductive post is fixed to the lower end face of the composite circuit board by riveting.

[0016] As a preferred embodiment, the device also includes components and connecting wires. The components are mounted and fixed on the base plate assembly, and the connecting wires are located between the components and the conductive posts. One end of the connecting wire is connected and fixed to the components, and the other end is screwed into the internal threaded hole of the conductive post by a conductive screw, thereby achieving a conductive state.

[0017] A manufacturing process for an easy-to-assemble high-current composite circuit board.

[0018] S1: Material preparation, composite circuit board pressing and molding, the metal layer, adhesive layer and polymer material insulation layer are pressed together by a pressing device to form them into a whole board;

[0019] S2: Composite circuit board processing. The metal plate of the composite circuit board is milled and cut using a CNC milling machine to form insulating grooves and mounting holes.

[0020] S3: By placing a sealing layer into the insulating groove on the composite circuit board, the sealing layer can be prepared in advance or injected into the insulating groove by a fluid method;

[0021] S4: The outer casing of the laser equipment is laser-cut and then processed into shape using sheet metal processing equipment;

[0022] S5: Print circuit markings and related information on the molded outer casing;

[0023] S6: Install conductive posts. According to the pre-drilled mounting holes, use a riveting machine to rivet the conductive posts onto the composite circuit board, so that the lower end of the conductive posts is riveted and fixed together with the composite circuit board to form a conductive function.

[0024] S7: Assembly of the base plate assembly: The insulating board and the composite circuit board with the riveted conductive posts are placed into the outer shell for stacking and assembly. Then, adhesive material is provided at the connection between the composite circuit board and the inner end face of the outer shell for bonding and stabilization.

[0025] S8: Preliminary test and inspection, by conducting an electrical test on the base plate assembly with conductive posts to check for short circuits and other issues;

[0026] S9: After the initial test is completed, apply adhesive to the riveted surfaces of the qualified base plate components for insulation protection.

[0027] S10: Install the components according to the pre-drilled holes, and keep a certain distance between adjacent components to facilitate heat dissipation;

[0028] S11: Install the connecting wire, connect one end of the connecting wire to the component and fix the two together, then place the other end on the conductive post, and screw the conductive screw through it to fix it on the conductive post, so that they form a complete electrical conduction state.

[0029] S12: Finished product testing, retesting the assembled finished parts to screen out defective products;

[0030] S13: Packaging and boxing.

[0031] As a preferred option, once the base plate assembly in S9 is manufactured, it can be either immediately assembled or stored in a warehouse for later use.

[0032] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0033] This invention features a simple structure and convenient and quick operation. The base plate assembly made of composite circuit board has better load-bearing capacity. Conductive posts are riveted to the composite circuit board using riveting technology, and connecting wires are then screwed and fixed to the upper end of the conductive posts using conductive screws, thus forming an electrical connection between the components and the composite circuit board. This structure simplifies the assembly process, improves assembly efficiency, and offers good safety and reliability. Furthermore, testing can be performed immediately after riveting the conductive posts, effectively avoiding the discovery of defects in the base plate assembly after component assembly, reducing the generation of defective products and rework rates, ensuring a high pass rate for finished products, and lowering production costs for enterprises.

[0034] 1. Replacing the traditional PCB with a composite circuit board enhances the load-bearing capacity of the base plate assembly, enabling it to withstand the weight and current of more components. The composite circuit board features slots and holes to provide electrical conductivity, while insulating material within the slots provides insulation and protection against short circuits. The base plate assembly is constructed with a four-layer structure: an outer shell, an insulating board, the composite circuit board, and an insulating encapsulation layer. Electrical symbols, component names, and serial numbers are printed on the upper surface of the outer shell, facilitating subsequent assembly and improving efficiency. Furthermore, the base plate assembly can be pre-assembled and transported to the assembly workshop when needed, reducing overall assembly time and further improving production efficiency.

[0035] 2. The conductive posts are made of copper, which has good conductivity. They are fixed to the composite circuit board by riveting technology. The upper inner end of the conductive post is also provided with internal thread, so that the connecting wires can be quickly screwed together to the conductive post by conductive screws with locking function, thereby forming a conductive effect and having good reliability and stability.

[0036] 3. The components used are connected to the conductive posts by multiple connecting wires to achieve electrical connection, which enables the components to be quickly assembled and disassembled, improves assembly efficiency, and also enables non-destructive assembly and disassembly, reducing the scrap of parts.

[0037] 4. During the assembly process, multiple insulation layers are used for protection, which can effectively protect the internal composite circuit board and the connection stability and safety of components, and has good dustproof, waterproof, moisture-proof, corrosion-proof, anti-aging and vibration-proof effects.

[0038] 5. The composite circuit boards used are made of copper, copper alloy, or aluminum alloy, all of which can withstand high current operation, making the base plate assembly more selective and applicable to meet the usage needs and application scenarios of different customers.

[0039] 6. The total thickness of the selected composite circuit board is 0.9mm-8.2mm, of which the thickness of the metal layer is 0.2mm-3mm and the thickness of the polymer material insulation layer is 0.5mm-5mm. By using different thicknesses, it can meet the needs of different application scenarios. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 is a schematic diagram of the overall structure of the bottom component of the present invention.

[0042] Figure 2 is a top view of the base plate assembly of the present invention.

[0043] Figure 3 is a cross-sectional schematic diagram of the base plate assembly of the present invention.

[0044] Figure 4 is a top view of the composite circuit board structure of the present invention.

[0045] Figure 5 is an exploded view of the composite circuit board of the present invention.

[0046] Figure 6 is a schematic diagram of the electrical component assembly structure of the present invention.

[0047] Figure 7 is an exploded view of the electrical components of the present invention.

[0048] The following are the labeling elements in the figure:

[0049] 100. Base plate assembly; 110. Housing; 120. Insulating board; 130. Composite circuit board; 131. Metal layer; 132. Adhesive layer; 133. Polymer insulating layer; 134. Insulating groove; 135. Mounting hole; 136. Sealing layer; 140. Insulating encapsulation layer; 150. Through hole; 200. Conductive post; 210. Upper end; 211. Internal threaded hole; 220. Lower end; 300. Component; 400. Connecting wire. Detailed Implementation

[0050] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0051] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0052] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0054] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0055] Referring to Figures 1-3: An easily assembled high-current composite circuit board includes a base plate assembly 100. The base plate assembly 100 is composed of a housing 110, an insulating plate 120, a composite circuit board 130, and an insulating encapsulation layer 140 from top to bottom. The composite circuit board 130 has an insulating groove 134 and a mounting hole 135 for conducting electricity. The housing 110 and the insulating plate 120 have through holes 150 corresponding to the positions of the mounting holes 135.

[0056] Referring to Figures 4-5: In this embodiment, the composite circuit board 130 is made by stacking and pressing a metal layer 131, an adhesive layer 132 and a polymer insulating layer 133 in sequence. The metal layer 131 is formed by milling and cutting to create an insulating groove 134 and a mounting hole 135, so that the metal layer 131 has a thinning area and a usable area. The thinning area is the processed insulating groove 134.

[0057] Furthermore, the insulating groove 134 is filled with a sealing layer 136 for insulation protection. The sealing layer 136 includes a sealing sheet pre-formed from insulating material or a liquid insulating material flow-filled and formed. By pre-forming the sealing sheet, the sealing sheet can be placed into the insulating groove 134 for insulation protection after the insulating groove 134 is processed. Alternatively, liquid insulating material can be injected into the insulating groove 134 to uniformly fill the insulating groove 134 and form the sealing layer 136 to achieve the effect of insulation protection.

[0058] In this embodiment, the insulating board 120, the insulating encapsulation layer 140, and the sealing layer 136 are made of epoxy resin material, which has a good insulating protection effect; the polymer material insulating layer 133 is made of epoxy resin, fiberglass board, bakelite board, silicone board, or plastic board, which can play an insulating role in isolating the upper and lower layers, avoiding the formation of conductivity between the two, which could lead to short circuits or other situations.

[0059] In this embodiment, the metal layer 131 is made of copper plate, alloy copper plate or alloy aluminum plate, the adhesive layer 132 is made of prepreg, the metal layer 131 has a thickness of 0.2mm-3mm, the polymer insulating layer 133 has a thickness of 0.5mm-5mm, and the composite circuit board 130 has a total thickness of 0.9mm-8.2mm.

[0060] Specifically, the composite circuit board 130 can be made of a material of appropriate thickness according to the application requirements. For example, a thin composite circuit board 130 can be assembled with a 0.2mm thick metal layer 131 and a 0.5mm thick polymer insulating layer 133, so that the overall thickness of the composite circuit board 130 is 0.9mm, which is suitable for products with limited space. Alternatively, a composite circuit board 130 of conventional thickness can be selected, with a 1mm thick metal layer 131 and a 2mm thick polymer insulating layer 133, so that the composite circuit board 130 can meet daily use. If it is necessary to carry more and larger current components 300, a relatively thicker composite circuit board 130 can be selected, such as a 3mm thick metal layer 131 and a 5mm thick polymer insulating layer 133, so that it can carry more and heavier components 300 with larger current, and the insulation protection effect is correspondingly increased.

[0061] In this embodiment, a conductive post 200 is also included. The conductive post 200 is composed of an upper end 210 and a lower end 220. The diameter of the lower end 220 is smaller than that of the upper end 210. The lower end 220 of the conductive post 200 passes through the through holes 150 of the outer shell 110 and the insulating plate 120 and the mounting holes 135 of the composite circuit board 130 in sequence and is fixedly installed on the base plate assembly 100. The upper end face of the upper end 210 of the conductive post 200 is provided with an internal threaded hole 211 extending from top to bottom.

[0062] In this embodiment, the conductive post 200 is installed and fixed on the base plate assembly 100 by riveting technology, so that the lower end 220 of the conductive post 200 is fixed to the lower end face of the composite circuit board 130 by riveting.

[0063] Referring to Figures 6-7: In this embodiment, the system also includes a component 300 and a connecting wire 400. The component 300 is mounted and fixed on the base plate assembly 100. The connecting wire 400 is disposed between the component 300 and the conductive post 200. One end of the connecting wire 400 is connected and fixed to the component 300, and the other end is screwed into the internal threaded hole 211 of the conductive post 200 by a conductive screw, thereby achieving a conductive state.

[0064] Specifically, the components 300 used include electronic components 300 and electrical components 300, which are selected and used according to the usage requirements of different scenarios to meet different customer needs.

[0065] Furthermore, this product is suitable for installation and use in electrical boxes or cabinets, replacing the traditional wiring method, making assembly and use more convenient and faster, and capable of withstanding greater current.

[0066] A manufacturing process for an easy-to-assemble high-current composite circuit board.

[0067] S1: Material preparation: The metal layer 131, adhesive layer 132 and polymer material insulating layer 133 are pressed together by a pressing device to form a whole composite circuit board 130.

[0068] S2: The composite circuit board 130 is processed by milling and cutting the metal plate of the composite circuit board 130 using a CNC milling machine to form an insulating groove 134 and a mounting hole 135.

[0069] S3: By placing a sealing layer 136 into the insulating groove 134 on the composite circuit board 130, the sealing layer 136 can be prepared in advance or injected into the insulating groove 134 by a fluid method.

[0070] S4: Laser cutting is performed on the outer shell 110 using laser equipment, and through holes 150 are machined on the outer shell 110. Then, the outer shell 110 is machined and shaped using sheet metal processing equipment.

[0071] S5: Print circuit markings and related information on the upper surface of the molded outer casing 110;

[0072] S6: Install conductive post 200. According to the pre-drilled mounting hole 135, use a riveting machine to rivet the conductive post 200 onto the composite circuit board 130, so that the lower end of the conductive post 200 is riveted and fixed together with the composite circuit board 130 to form a conductive function.

[0073] S7: Assembly of the base plate assembly 100: The insulating plate 120 and the composite circuit board 130 with the riveted conductive posts 200 are sequentially placed into the housing 110 for stacking and assembly. Then, an adhesive material for bonding and stabilizing is provided at the connection between the composite circuit board 130 and the inner end face of the housing 110, so that the two can be connected and stabilized in the housing 110 by the adhesive material. The adhesive material includes glue made of adhesive and adhesive tape with adhesive.

[0074] S8: Preliminary test and inspection: By conducting an energization test on the base plate assembly 100 with conductive posts 200 installed, check for short circuits and other issues.

[0075] S9: After the initial test is completed, apply glue to the riveting surface of the qualified base plate assembly 100 to form an insulating encapsulation layer 140, which serves as an insulating protection layer.

[0076] S10: Install the components 300 according to the pre-drilled holes, and keep a certain distance between adjacent components 300 to facilitate heat dissipation;

[0077] S11: Install the connecting wire 400, connect one end of the connecting wire 400 to the component 300, and fix the two together. Then place the other end on the conductive post 200, and screw it onto the conductive post 200 through the conductive screw to make them form a complete electrical conduction state.

[0078] S12: Finished product testing. By retesting the assembled finished parts, defective products are further screened out to prevent defective products from leaving the factory.

[0079] S13: Packaging and boxing.

[0080] In this embodiment, after the base plate assembly 100 in S9 is manufactured, it can be either used immediately for assembly or placed in a warehouse for later use.

[0081] The above are merely preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present invention.

Claims

1. An easily assembled high-current composite circuit board, characterized in that: It includes a base plate assembly, which consists of a housing, an insulating plate, a composite circuit board, and an insulating encapsulation layer from top to bottom. The composite circuit board has insulating grooves and mounting holes for conducting electricity. The housing and the insulating plate have through holes corresponding to the positions of the mounting holes.

2. The easily assembled high-current composite circuit board according to claim 1, characterized in that: The composite circuit board is made by laminating a metal layer, an adhesive layer and a polymer insulating layer in sequence. The metal layer is formed by milling and cutting to create insulating grooves and mounting holes.

3. The easily assembled high-current composite circuit board according to claim 2, characterized in that: The insulating groove is filled with a sealing layer for insulation and protection, the sealing layer comprising a sealing sheet preformed from insulating material or formed by flowing filling of liquid insulating material.

4. The easily assembled high-current composite circuit board according to claim 3, characterized in that: The insulating board, insulating encapsulation layer, and sealing layer are made of epoxy resin material; the polymer material insulating layer is made of epoxy resin, fiberglass board, bakelite board, silicone board, or plastic board.

5. The easily assembled high-current composite circuit board according to claim 2, characterized in that: The metal layer is made of copper plate, alloy copper plate or alloy aluminum plate, the adhesive layer is made of prepreg, the metal layer thickness is 0.2mm-3mm, the polymer material insulation layer thickness is 0.5mm-5mm, and the total thickness of the composite circuit board is 0.9mm-8.2mm.

6. The easily assembled high-current composite circuit board according to claim 1, characterized in that: It also includes a conductive post, which consists of an upper end and a lower end. The diameter of the lower end is smaller than that of the upper end. The lower end of the conductive post passes through the through holes of the outer shell and the insulating plate and the mounting holes of the composite circuit board in sequence to be fixedly installed on the base plate assembly. The upper end face of the upper end of the conductive post is provided with an internal threaded hole extending from top to bottom.

7. The easily assembled high-current composite circuit board according to claim 6, characterized in that: The conductive post is installed and fixed to the base plate assembly by riveting technology, so that the lower end of the conductive post is fixed to the lower end face of the composite circuit board by riveting.

8. The easily assembled high-current composite circuit board according to claim 6, characterized in that: It also includes components and connecting wires. The components are mounted and fixed on the base plate assembly. The connecting wires are located between the components and the conductive posts. One end of the connecting wire is connected and fixed to the components, and the other end is screwed into the internal thread hole of the conductive post by a conductive screw, thereby achieving a conductive state.

9. A manufacturing process for an easily assembled high-current composite circuit board, comprising the easily assembled high-current composite circuit board according to any one of claims 1-8, characterized in that: S1: Material preparation, composite circuit board pressing and molding, the metal layer, adhesive layer and polymer material insulation layer are pressed together by a pressing device to form them into a whole board; S2: Composite circuit board processing. The metal plate of the composite circuit board is milled and cut using a CNC milling machine to form insulating grooves and mounting holes. S3: By placing a sealing layer into the insulating groove on the composite circuit board, the sealing layer can be prepared in advance or injected into the insulating groove by a fluid method; S4: The outer casing of the laser equipment is laser-cut and then processed into shape using sheet metal processing equipment; S5: Print circuit markings and related information on the molded outer casing; S6: Install conductive posts. According to the pre-drilled mounting holes, use a riveting machine to rivet the conductive posts onto the composite circuit board, so that the lower end of the conductive posts is riveted and fixed together with the composite circuit board to form a conductive function. S7: Assembly of the base plate assembly: The insulating board and the composite circuit board with the riveted conductive posts are placed into the outer shell for stacking and assembly. Then, adhesive material for bonding and stabilizing is provided at the connection between the composite circuit board and the inner end face of the outer shell. S8: Preliminary test and inspection, by conducting an electrical test on the base plate assembly with conductive posts to check for short circuits and other issues; S9: After the initial test is completed, apply adhesive to the riveted surfaces of the qualified base plate components for insulation protection. S10: Install the components according to the pre-drilled holes, and keep a certain distance between adjacent components to facilitate heat dissipation; S11: Install the connecting wire, connect one end of the connecting wire to the component and fix the two together, then place the other end on the conductive post, and screw the conductive screw through it to fix it on the conductive post, so that they form a complete electrical conduction state. S12: Finished product testing, retesting the assembled finished parts to screen out defective products; S13: Packaging and boxing.

10. The manufacturing process of the easily assembled high-current composite circuit board according to claim 9, characterized in that: Once the base plate assembly in S9 is manufactured, it can be used immediately for assembly or stored in a warehouse for later use.

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