Radio frequency module structure, power amplifier, and electronic device

Abstract

A radio frequency module structure, a power amplifier, and an electronic device. The radio frequency module structure comprises an upper cover plate, a lower cover plate, an enclosure frame, and at least one partition plate; the upper cover plate and the lower cover plate are stacked vertically and spaced apart from each other; the enclosure frame is connected to the upper cover plate and the lower cover plate; and the partition plate is arranged in the enclosure frame and located between the upper cover plate and the lower cover plate, at least one of the upper cover plate, the lower cover plate, or the enclosure frame is connected to the partition plate, and at least one surface on two sides of the partition plate is provided with a metallization layer. The enclosure frame is connected to the upper cover plate and the lower cover plate, the upper cover plate, the lower cover plate, and the enclosure frame may define a cavity, and the partition plate is located in the cavity. The partition plate may separate radio frequency circuits accommodated in the cavity, reducing the interference effect between the radio frequency circuits separated on two sides of the partition plate, and weakening positive feedback oscillation of the radio frequency circuits in the radio frequency module structure.

Description

RF module structure, power amplifier and electronic equipment

[0001] This application claims priority to Chinese Patent Application No. 202410943128.5, filed on July 12, 2024, entitled "RF Module Structure, Power Amplifier and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of radio frequency technology, and in particular to a radio frequency module structure, a power amplifier, and an electronic device. Background Technology

[0003] The radio frequency (RF) module is a core component of a wireless base station. It houses the RF circuitry, which amplifies the signal. Essentially, the RF circuitry is an energy converter that transforms the DC power supplied by the power source into the required AC power.

[0004] As radio frequency (RF) module structures tend to become smaller, it is difficult to further reduce the size of RF module structures because RF circuits require a certain area. In addition, reducing the size of RF module structures can easily cause positive feedback oscillations in the RF circuits within the RF module structure. Summary of the Invention

[0005] This application provides a radio frequency module structure, a power amplifier, and an electronic device with strong anti-interference capabilities.

[0006] In a first aspect, this application discloses a radio frequency (RF) module structure, which includes an upper cover plate, a lower cover plate, a frame, and at least one partition plate; the upper cover plate and the lower cover plate are stacked vertically and spaced apart; the upper cover plate and the lower cover plate may be partially stacked vertically, and the frame connects the upper cover plate and the lower cover plate; the partition plate is disposed within the frame and between the upper cover plate and the lower cover plate, and at least one of the upper cover plate, the lower cover plate, or the frame is connected to the partition plate, and at least one surface on both sides of the partition plate is provided with a metallization layer.

[0007] The solution disclosed herein, in which the upper and lower cover plates are stacked vertically and spaced apart, and the frame connects the upper and lower cover plates, forms a cavity. The partition is disposed within the frame and between the upper and lower cover plates, thus placing the partition within the cavity. The partition can separate the radio frequency circuits housed within the cavity. It should be noted that the metallization layer on the partition can shield signals, reducing interference between the radio frequency circuits separated on either side of the partition and weakening positive feedback oscillations within the radio frequency module structure.

[0008] Because the partition can reduce the interference between the radio frequency circuits separated on both sides of the partition, the radio frequency circuits separated on both sides of the partition can be placed closer together in space, which can effectively save the volume of the radio frequency module structure.

[0009] In one feasible implementation, the partition is a circuit board or a plastic plate with a metallized layer formed on at least one side surface.

[0010] The solution disclosed herein, if the partition is a circuit board, can be electrically connected to the radio frequency (RF) circuit, allowing for more flexible spatial arrangement of the RF circuit within the cavity. If the partition is a plastic plate with a metallized layer formed on at least one side surface, the partition can also reduce interference between the RF circuits separated on both sides of the partition, and the manufacturing cost of the partition is relatively low.

[0011] In one possible implementation, the frame is a circuit board or a plastic board with a metallized layer formed on at least one side surface.

[0012] The solution disclosed herein, if the frame is a circuit board, can be electrically connected to the radio frequency (RF) circuit, allowing for more flexible spatial arrangement of the RF circuit within the cavity. If the plastic plate with a metallized layer on at least one side of the frame can reduce interference between the RF circuits inside and outside the cavity, the manufacturing cost of the frame is also relatively low.

[0013] In one feasible implementation, the upper cover plate and the lower cover plate are connected in communication via the frame.

[0014] The solution disclosed herein achieves communication connection between the upper and lower cover plates through the frame, eliminating the need for other connecting devices to enable communication between the upper and lower cover plates, thus saving the volume of the RF module.

[0015] In one feasible implementation, the partition includes at least one first partition connected to the inner surface of the frame, the first partition being located between the upper cover and the lower cover, the first partition being spaced apart from the upper cover in the vertical direction, and the first partition being spaced apart from the lower cover in the vertical direction.

[0016] The solution disclosed herein, due to the connection of the inner surface of the frame by the partition and the first partition being located between the upper cover plate and the lower cover plate, can divide the cavity enclosed by the upper cover plate, the lower cover plate and the frame into chambers arranged in the vertical direction. This allows the RF module structure to effectively utilize the space in the vertical direction. When accommodating the same number of RF circuits or peripheral circuits, the area of ​​the RF circuits in the horizontal plane can be reduced. The application of the RF module structure in electronic devices is conducive to promoting the miniaturization of electronic devices.

[0017] In one feasible implementation, the first partition is connected to the inner surface of the frame on all four sides, which can improve the signal shielding effect of the first partition in the cavity.

[0018] In one feasible implementation, at least one side of the first partition has a gap between it and the inner surface of the frame.

[0019] In one feasible implementation, the partition includes at least one second partition, which is connected to at least one of the upper cover plate and the lower cover plate in the vertical direction, and is spaced apart from the inner surface of the frame in the horizontal direction.

[0020] The solution disclosed herein allows the second partition to separate radio frequency circuits arranged in the left-right direction, thereby reducing mutual interference between radio frequency circuits located on the left and right sides of the second partition.

[0021] In one feasible implementation, the second partition is connected to the upper cover plate and the lower cover plate on both sides in the vertical direction, respectively, to reduce the mutual interference of the radio frequency circuits located on the left and right sides of the second partition.

[0022] In one possible implementation, the second partition has a gap with one of the upper or lower cover plates on one side in the vertical direction.

[0023] In one feasible implementation, the partition includes at least one third partition, which is connected to at least one of the upper cover plate and the lower cover plate in the vertical direction, and the third partition is spaced apart from the inner surface of the frame in the front-back direction.

[0024] The solution disclosed herein allows the third partition to separate radio frequency circuits arranged in the front-to-back direction, thereby reducing mutual interference between radio frequency circuits located on the front and back sides of the third partition.

[0025] In one possible implementation, the partition includes at least one second partition, the first partition being connected to the inner surface of the frame; the second partition being connected in the vertical direction to at least one of the upper cover plate and the lower cover plate.

[0026] The scheme disclosed herein allows the first and second partitions to divide the cavity into multiple chambers, which facilitates the flexible arrangement of radio frequency circuits within the cavity.

[0027] In one feasible implementation, the partition further includes at least one second partition, the first partition being connected to the inner surface of the frame, and the second partition being connected in the vertical direction to at least one of the upper cover plate, the lower cover plate, and the first partition plate.

[0028] In one feasible implementation, the number of the first partitions is two or more, and the partitions further include at least one second partition, which is connected between two adjacent first partitions in the vertical direction.

[0029] In one feasible implementation, the partition further includes at least one first partition, which is connected to the inner surface of the frame in the left-right direction, and the second partition is connected to at least one of the upper cover plate and the lower cover plate in the up-down direction.

[0030] In one feasible implementation, the number of second partitions is two or more, and the partitions further include at least one first partition, wherein in the left-right direction, the first partition is connected between two adjacent second partitions.

[0031] In one feasible implementation, the radio frequency module structure is used to house multiple radio frequency circuits, each of which is housed in a different cavity within the radio frequency module structure, and the radio frequency circuits are disposed and electrically connected to at least one of the upper cover plate, partition plate, lower cover plate, or enclosure.

[0032] The scheme disclosed herein houses different radio frequency (RF) circuits in each chamber, and the partitions reduce mutual interference between the various RF circuits located within the chambers. The partitions also reduce the spacing between RF circuits, which is beneficial for the miniaturization of the RF module structure. Furthermore, the partitions can support the RF circuits, facilitating flexible layout of the RF circuits within the RF module structure.

[0033] In one feasible implementation, the RF module structure is further used to house peripheral circuits, which are disposed and electrically connected to the partition. The partition can support the peripheral circuits, allowing the RF module structure to accommodate more peripheral circuits, thus making more efficient use of the space within the RF module structure and promoting the miniaturization of power amplifiers or electronic devices. It should be noted that the application of the RF module structure to power amplifiers or electronic devices will occupy space in the power amplifier or electronic device; however, by miniaturizing the RF module structure, the size of the power amplifier or electronic device can be correspondingly reduced.

[0034] Secondly, this application provides a power amplifier, which includes a radio frequency (RF) circuit and the RF module structure described in the first aspect, wherein the RF module structure is used to house the RF circuit.

[0035] Thirdly, this application provides an electronic device, the electronic device including the radio frequency module structure as described in the first aspect, wherein the antenna is electrically connected to the radio frequency module structure. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0037] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0038] Figure 2 is a schematic diagram of the structure of a power amplifier provided in an embodiment of this application;

[0039] Figure 3a is a schematic diagram of a radio frequency module structure provided in an embodiment of this application;

[0040] Figure 3b is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0041] Figure 4 is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0042] Figure 5 is a structural schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0043] Figure 6a is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0044] Figure 6b is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0045] Figure 6c is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0046] Figure 6d is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0047] Figure 7a is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0048] Figure 7b is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0049] Figure 7c is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0050] Figure 7d is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0051] Figure 8 is a structural schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0052] Figure 9 is a schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0053] Figure 10 is a structural schematic diagram of another radio frequency module structure provided in an embodiment of this application;

[0054] Figure 11 is a schematic diagram of another radio frequency module structure provided in an embodiment of this application. 1. Electronic device; 11. Modulation module; 12. Frequency conversion module; 13. Power amplifier; 14. Filtering module; 15. Antenna; 100. Radio frequency module structure; 110. Upper cover plate; 120. Lower cover plate; 130. Frame; 141. First partition plate; 142. Second partition plate; 150. Cavity; 151. Chamber; 160. Gap; 170. Transceiver unit; 180. Heat dissipation fins; 200. Radio frequency circuit; 210. Active device; 220. Matching circuit; 300. Peripheral circuit. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0056] Radio frequency (RF) module structures are used to house RF circuits, and RF modules can shield RF circuit interference signals. As RF power amplifiers become smaller, the space for RF module structures is gradually decreasing. If RF circuits are placed too close to each other or to other circuits, interference can easily occur within the RF power amplifier.

[0057] In view of this, this application discloses a radio frequency module structure and electronic device that can reduce signal interference between circuits and is miniaturized.

[0058] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0059] Please refer to Figure 1. An embodiment of this application provides an electronic device 1, which includes a power amplifier 13. Optionally, the electronic device also includes an antenna 15, which is electrically connected to the power amplifier 13. The power amplifier 13 amplifies electrical signals, and the antenna 15 converts the electrical signals into wireless signals. In this application, after receiving an electrical signal, the power amplifier 13 amplifies the signal and then converts the amplified signal into a wireless signal via the antenna 15. The antenna 15 then transmits the wireless signal to a target terminal. The target terminal can be a base station or a terminal, etc.

[0060] The electronic device 1 may further include a modulation module 11, a frequency conversion module 12, and a filtering module 14. The modulation module 11, frequency conversion module 12, power amplifier 13, filtering module 14, and antenna 15 are connected sequentially. The modulation module 11 modulates the electrical signal, the frequency conversion module 12 changes the frequency of the electrical signal, the power amplifier 13 amplifies the electrical signal, and the filtering module 14 filters out noise contained in the electrical signal. During signal transmission, the modulation module 11 adjusts the electrical signal of the electronic device 1 and then sends the modulated electrical signal to the frequency conversion module 12. The frequency conversion module 12 performs frequency conversion on the electrical signal and then sends the frequency-converted electrical signal to the power amplifier 13. The power amplifier 13 amplifies the electrical signal and sends the amplified electrical signal to the filtering module 14. The filtering module 14 filters out noise contained in the electrical signal and then sends the filtered electrical signal to the antenna 15. The antenna 15 converts the electrical signal into a wireless signal and then transmits it to the target end.

[0061] Please refer to Figure 2. The power amplifier 13 includes an RF module structure 100 and an RF circuit 200. The RF circuit 200 is housed in the RF module structure 100 and is electrically connected to the RF module structure 100.

[0062] In the embodiments provided in this application, the radio frequency circuit 200 can be an amplifier circuit, which includes an active device 210 and a matching circuit 220. The active device 210 is connected to the matching circuit 220. The matching circuit 220 can adjust the total impedance of the active device 210. To facilitate understanding of the function of the matching circuit 220, we take the connection of the active device 210 to a load as an example. When the impedance of the load is equal to the total impedance of the active device 210, the amplifier circuit can output a larger power. In order to enable the amplifier circuit to output a larger power, the matching circuit 220 can adjust the total impedance of the active device 210 so that the total impedance of the active device 210 is equal to the impedance of the load. It should be noted that the load can be an antenna 15.

[0063] Referring to Figure 2, the power amplifier 13 has multiple radio frequency circuits 200 connected together, which can realize multi-stage amplification of electrical signals. In some embodiments, the power amplifier 13 may also include peripheral circuits 300, which are connected to the active device 210 and can control the switching of the active device 210.

[0064] In some embodiments, please refer to FIG3a, the radio frequency module structure 100 includes an upper cover plate 110, a lower cover plate 120, a frame 130 and at least one partition.

[0065] For ease of understanding, we define the up-down direction as the Z-axis and the left-right direction as the X-axis.

[0066] The upper cover plate 110 and the lower cover plate 120 are stacked vertically and spaced apart. Only a portion of the upper cover plate 110 and lower cover plate 120 may be stacked vertically. The upper cover plate 110 can be a circuit board (PCB), and its outer surface may have a copper-clad layer (metallization layer), while its inner surface may have metal traces. The inner surface of the upper cover plate 110 refers to the side of the upper cover plate 110 closest to the lower cover plate 120, and the inner surface of the upper cover plate 110 refers to the side of the upper cover plate 110 away from the lower cover plate 120. The lower cover plate 120 can also be a circuit board, and its outer surface may have a copper-clad layer (metallization layer), while its inner surface may have metal traces. The inner surface of the lower cover plate 120 refers to the side surface of the lower cover plate 120 that is close to the upper cover plate 110, and the inner surface of the upper cover plate 110 refers to the side surface of the upper cover plate 110 that is away from the lower cover plate 120.

[0067] The frame 130 connects the upper cover plate 110 and the lower cover plate 120. The frame 130 can be a semi-enclosed or fully enclosed structure. If the frame 130 is fully enclosed, it forms a circle. If the frame 130 is semi-enclosed, there can be a gap 160 between the two ends of the frame 130.

[0068] In the embodiments provided in this application, the frame 130, the upper cover plate 110, and the lower cover plate 120 form a cavity 150, wherein the frame 130, the upper cover plate 110, and the lower cover plate 120 may be provided with windows communicating with the cavity 150. In some embodiments, the frame 130 is connected between the upper cover plate 110 and the lower cover plate 120. In some embodiments, the upper cover plate 110 and the lower cover plate 120 are disposed within the frame 130. It should be noted that the upper cover plate 110 and the lower cover plate 120 being disposed within the frame 130 means that the upper cover plate 110 and the lower cover plate 120 are located in the space surrounded or partially surrounded by the frame 130.

[0069] A partition is disposed within the frame 130 and between the upper cover plate 110 and the lower cover plate 120. At least one of the upper cover plate 110, the lower cover plate 120, or the frame 130 is connected to the partition. The partition can divide the cavity 150 into two or more chambers 151. At least one surface on both sides of the partition is provided with a metallization layer. The metallization layer can completely cover one surface of the partition, or it can cover a portion of one side of the partition. The partition can be a circuit board or a plastic plate with a metallization layer formed on one side. The partition serves to shield electrical signals. For example, multiple radio frequency circuits 200 are disposed within the cavity 150, and the partition separates each radio frequency circuit 200. The partition can shield the interference signals of each radio frequency circuit 200, and it is understood that the partition can reduce mutual interference between the radio frequency circuits 200. In the embodiments provided in this application, a metallization layer is formed on the inner or outer surface of the frame 130. The metallization layer may completely cover the inner or outer surface of the frame 130, or it may cover only a portion of the inner or outer surface of the frame 130. The frame 130 is a circuit board or a plastic board with a metallization layer formed on at least one side. The frame 130 can also shield interference signals from the radio frequency circuit 200, reducing the leakage of interference signals from the radio frequency circuit 200 outside the cavity 150.

[0070] In the embodiments provided in this application, when the partition is disposed within the frame 130 and between the upper cover plate 110 and the lower cover plate 120, the partition can be parallel to the horizontal plane, or the partition can have a certain angle with the horizontal plane. The partition can be disposed vertically, or the partition can have a certain angle in the vertical direction.

[0071] The frame 130 can be a hollow cuboid, a hollow cylinder, or other irregular cubes. This application does not limit the specific shape of the frame 130.

[0072] The frame 130 can be a single-piece circuit board, or it can be constructed from multiple circuit boards. For example, the frame 130 may include four circuit boards connected on one side to form the frame 130. The circuits on the four circuit boards can be electrically connected to each other, and the four circuit boards can also be insulated from each other. The number of circuit boards forming the frame 130 can also be two, three, five, or more; this application does not impose a particular limitation on the number of circuit boards forming the frame 130.

[0073] In the embodiments provided in this application, the upper cover plate 110 and the lower cover plate 120 need to be electrically connected. In some embodiments, the upper cover plate 110 and the lower cover plate 120 are connected by a frame 130. This connection eliminates the need for other connecting devices, thus saving space in the RF module. In some embodiments, the upper cover plate 110 and the lower cover plate 120 are connected by an electrical connection device, which can be located either inside or outside the frame 130.

[0074] Taking the frame 130 as an example of a circuit board, the outer surface of the frame 130 is provided with a copper-clad layer (metallization layer), and the inner surface of the frame 130 is provided with metal traces. The upper cover plate 110 and the lower cover plate 120 are connected for communication through the metal traces. The metal traces can be formed by processing the copper-clad layer disposed on the inner surface of the circuit board.

[0075] In some embodiments, referring again to FIG3a, the partition includes at least one first partition 141, the first partition 141 being connected to the inner surface of the frame 130, the first partition 141 being located between the upper cover plate 110 and the lower cover plate 120, the first partition 141 being spaced apart from the upper cover plate 110 in the vertical direction, and the first partition 141 being spaced apart from the lower cover plate 120 in the vertical direction.

[0076] The first partition 141 can be parallel to the horizontal plane, or it can have an angle greater than or less than zero with the horizontal plane. There can be one or more first partitions 141. When there is one first partition 141, the first partition 141 divides the cavity 150 into upper and lower chambers 151. When there are two or more first partitions 141, please refer to Figure 3b. Adjacent first partitions 141 are spaced apart. Two or more first partitions 141 divide the cavity 150 into multiple chambers 151 distributed in the vertical direction.

[0077] Referring to Figure 4, chamber 151 can be used to house radio frequency (RF) circuits 200 and / or peripheral circuits 300. Different RF circuits 200 are disposed in different chambers 151. The RF circuits 200 are disposed on at least one of the upper cover plate 110, lower cover plate 120, first partition plate 141, or frame 130. The first partition plate 141 can reduce the positive feedback oscillations of the RF circuits 200 and reduce the mutual interference of the various RF circuits 200 in the RF module structure 100.

[0078] In some embodiments, referring to FIG5, at least one side of the first partition 141 has a gap 160 between it and the inner surface of the frame 130. The two adjacent chambers 151 separated by the first partition 141 can communicate with each other. The first partition 141 can still reduce the positive feedback oscillation of the radio frequency circuit 200. The gap 160 between the first partition 141 and the inner surface of the frame 130 can facilitate the electrical connection of the peripheral circuits 300 or the radio frequency circuit 200 in the two adjacent chambers 151.

[0079] In some embodiments, the first partition 141 is connected to the inner surface of the frame 130 on all four sides, and the two adjacent chambers 151 separated by the first partition 141 are not in communication, which can further reduce the positive feedback oscillation of the radio frequency circuit 200.

[0080] Please refer to Figure 6a. The partition includes at least one second partition 142. The second partition 142 is connected to at least one of the upper cover plate 110 and the lower cover plate 120 in the vertical direction, and is spaced from the inner surface of the frame 130 in the horizontal direction. The second partition 142 can be arranged vertically, and the second partition 142 can also have an angle greater than or less than zero with the vertical direction.

[0081] The number of second partitions 142 can be one or more. When there is only one second partition 142, it divides the cavity 150 into two chambers 151, left and right. Referring to Figure 6b, when there are two or more second partitions 142, adjacent second partitions 142 are spaced apart, and two or more second partitions 142 divide the cavity 150 into multiple chambers 151 distributed along the left-right direction. The chambers 151 can accommodate radio frequency (RF) circuits 200 and / or peripheral circuits 300. Different RF circuits 200 are disposed in different chambers 151, and the RF circuits 200 are disposed on at least one of the upper cover plate 110, lower cover plate 120, second partitions 142, or frame 130. The second partitions 142 can reduce positive feedback oscillations in the RF circuits 200 and decrease mutual interference between the various RF circuits 200 in the RF module structure 100.

[0082] In some embodiments, the second partition 142 has a gap 160 between one side of the upper cover plate 110 or the lower cover plate 120 in the vertical direction. For example, referring to FIG. 6c, the upper side of the second partition 142 is connected to the upper cover plate 110, and the lower side of the second partition 142 has a gap 160 with the lower partition plate. Alternatively, referring to FIG. 6d, the lower side of the second partition 142 is connected to the lower cover plate 120, and the upper side of the second partition 142 has a gap 160 with the upper partition plate. The two adjacent chambers 151 separated by the second partition 142 can communicate with each other. The second partition 142 can still reduce the positive feedback oscillation of the radio frequency circuit 200. The gap 160 between the second partition 142 and the upper cover plate 110 facilitates the electrical connection of the peripheral circuits 300 or the radio frequency circuit 200 in these two adjacent chambers 151. The gap 160 between the second partition 142 and the lower cover 120 facilitates the electrical connection of the peripheral circuits 300 or radio frequency circuits 200 in the two adjacent chambers 151.

[0083] In the embodiments provided in this application, the first partition 141 and the second partition 142 can be combined to divide the cavity 150 into multiple chambers 151. Each chamber 151 can be enclosed by two inward-facing first partitions 141 and two adjacent second partitions 142. Alternatively, each chamber 151 can be enclosed by a frame 130, the first partition 141, the second partition 142, and a top cover plate 110. Another possible configurations include: a frame 130, the first partition 141, the second partition 142, and a bottom cover plate 120; a frame 130, the first partition 141, and the bottom cover plate 120; a frame 130, the first partition 141, and the top cover plate 110; or a frame 130, two first partitions 141, and one second partition 142. The chamber 151 can also be formed by an upper cover plate 110, two second partitions 142, and a first partition 141, or by a lower cover plate 120, two second partitions 142, and a first partition 141. The chamber 151 is divided by the first partition 141 and the second partition 142 disposed in the cavity 150. The chamber 151 can be formed by a combination of the frame 130, the upper cover plate 110, the lower cover plate 120, and at least one of the first partitions 141 and the second partition 142. This application does not exhaustively list the components that form the chamber 151 or the number of components.

[0084] In the embodiments provided in this application, the chamber 151 can be a closed space or a semi-closed space, wherein two adjacent semi-closed chambers 151 can be interconnected.

[0085] In some embodiments, the second partition 142 is connected to the upper cover plate 110 and the lower cover plate 120 on both sides in the vertical direction.

[0086] In some embodiments, the second partition 142 is connected to the inner surface of the frame 130 on at least one side in the front-rear direction. It can be understood that the second partition 142 is connected to the inner surface of the frame 130 on both sides in the front-rear direction; or, the front side of the second partition 142 is connected to the inner surface of the frame 130, and the rear side of the second partition 142 has a gap 160 with the inner surface of the frame 130; or, the rear side of the second partition 142 is connected to the inner surface of the frame 130, and the front side of the second partition 142 has a gap 160 with the inner surface of the frame 130.

[0087] In the embodiments provided in this application, the partition includes at least one third partition. The third partition is connected to at least one of the upper cover plate 110 and the lower cover plate 120 in the vertical direction, and is spaced apart from the inner surface of the frame 130 in the front-back direction. The number of third partitions can be one or more. When there is only one third partition, it divides the cavity 150 into two chambers 151. When there are two or more third partitions, adjacent third partitions are spaced apart, and two or more third partitions divide the cavity 150 into multiple chambers 151 distributed along the front-back direction. The chambers 151 can be used to house the radio frequency circuit 200 and / or peripheral circuits 300. Different radio frequency circuits 200 are disposed in different chambers 151. The radio frequency circuits 200 are disposed on at least one of the upper cover plate 110, the lower cover plate 120, the third partition, or the frame 130. The third partition can reduce the positive feedback oscillations of the radio frequency circuit 200 and reduce the mutual interference between the various radio frequency circuits 200 in the radio frequency module structure 100.

[0088] In the embodiments provided in this application, the third partition can be combined with the first partition 141 and disposed within the cavity 150, dividing the cavity 150 into multiple chambers 151. The third partition can also be combined with the second partition 142 and disposed within the cavity 150, dividing the cavity 150 into multiple chambers 151. Furthermore, the third partition can also be combined with the first partition 141 and the second partition 142 and disposed within the cavity 150, dividing the cavity 150 into multiple chambers 151.

[0089] In the embodiments provided in this application, please refer to FIG7a. At least one first partition 141 and at least one second partition 142 can be provided in the cavity 150. The first partition 141 is connected to the inner surface of the frame 130, and the second partition 142 is connected to at least one of the upper cover plate 110, the lower cover plate 120, and the first partition 141 in the vertical direction. In a feasible embodiment, please refer to FIG7b. The first partition 141 is connected to the inner surface of the frame 130 on all four sides. The second partition 142 is connected to the upper cover plate 110 on one side in the vertical direction and to the first partition 141 on one side in the vertical direction. The second partition 142 is also connected to the first partition 141. In this case, the first partition 141 and the second partition 142 can divide the cavity 150 into a plurality of closed chambers 151. Please refer to Figure 7c. The first partition 141 is connected to the inner surface of the frame 130 on all four sides. The second partition 142 is connected to the lower cover plate 120 on one side in the vertical direction. The second partition 142 is also connected to the first partition 141 on one side in the vertical direction. In another feasible implementation, please refer to Figure 7d. The first partition 141 is connected to the inner surface of the frame 130. At least one side of the first partition 141 is spaced from the inner surface of the frame 130. The second partition 142 is connected to the upper cover plate 110 and the lower cover plate 120 in the vertical direction, or the second partition 142 is connected to one of the upper cover plate 110 and the lower cover plate 120. In this case, the cavity 151 separated by the first partition 141 and the second partition 142 is a semi-closed cavity 151. In one feasible implementation, the first partition 141 is connected to the inner surface of the frame 130 on all four sides, and the second partition 142 is spaced apart from the upper cover plate 110 or the lower cover plate 120. The first partition 141 and the second partition 142 can divide the cavity 150 into a semi-enclosed chamber 151. The first partition 141 and the second partition 142 can divide the cavity 150 into multiple chambers 151, which is beneficial for the flexible arrangement of the radio frequency circuit 200 in the cavity 150.

[0090] In the embodiments provided in this application, please refer to Figure 8. Two or more first partitions 141 and at least one second partition 142 are disposed within the cavity 150. Each first partition 141 is connected to the inner surface of the frame 130, with adjacent first partitions 141 spaced apart. The second partition 142 connects between two adjacent first partitions 141. Specifically, the second partition 142 is connected to one of the two first partitions 141 on one side in the vertical direction, or the second partition 142 is connected to both first partitions 141 on both sides in the vertical direction.

[0091] In the embodiments provided in this application, at least one first partition 141 and at least one second partition 142 are disposed within the cavity 150. The first partition 141 is connected to the inner surface of the frame 130 in the left-right direction, and the second partition 142 is connected to at least one of the upper cover plate 110 and the lower cover plate 120 in the up-down direction. In one possible implementation, the second partition 142 may be connected between the upper cover plate 110 and the first partition 141, or the second partition 142 may be connected between the lower cover plate 120 and the first partition 141. When the second partition 142 can be connected between the upper cover plate 110 and the first partition 141, in some embodiments, one side of the second partition 142 is connected to one of the first partition plate 141 or the upper cover plate 110 in the up-down direction. In some embodiments, both sides of the second partition 142 are connected to the first partition plate 141 and the upper cover plate 110 respectively in the up-down direction. When the second partition 142 can be connected between the lower cover plate 120 and the first partition 141, in some embodiments, one side of the second partition 142 is connected to either the first partition 141 or the lower cover plate 120 in the vertical direction. In some embodiments, both sides of the second partition 142 are connected to the first partition 141 and the lower cover plate 120, respectively, in the vertical direction.

[0092] In the RF module structure 100 provided in this application, as shown in Figure 9, at least one first partition 141 and two or more second partitions 142 are disposed in the cavity 150. Each pair of adjacent second partitions 142 is spaced apart, and the first partition 141 is connected between adjacent pairs of second partitions 142. In one feasible implementation, in the left-right direction, one side of the first partition 141 is connected to one of the two adjacent second partitions 142. In another feasible implementation, in the left-right direction, both sides of the first partition 141 are respectively connected to two second partitions 142.

[0093] In the embodiments provided in this application, the radio frequency module structure 100 is used to accommodate multiple radio frequency circuits 200. The upper cover plate 110, lower cover plate 120, and frame 130 form a cavity 150, which can be closed or semi-closed. A closed cavity 150 refers to a cavity 150 that cannot communicate with the outside world. A semi-closed cavity 150 refers to a cavity 150 that can communicate with the outside world; for example, the upper cover plate 110, lower cover plate 120, and frame 130 may have windows, or the frame 130 may be semi-enclosed. The cavity 150 can accommodate the radio frequency circuits 200 and peripheral circuits 300, and can also be filled with insulating material, which can completely fill the cavity 150.

[0094] In the embodiments provided in this application, a partition divides the cavity 150 into multiple chambers 151, and multiple radio frequency circuits 200 are respectively housed in the multiple chambers 151. Specifically, different radio frequency circuits 200 are respectively disposed in different chambers 151. It is understood that each chamber 151 only houses one radio frequency circuit 200. The radio frequency circuit 200 located in the chamber 151 is disposed and connected to at least one of the partition, the upper cover plate 110, the lower cover plate 120, and the frame 130. In this application, the partition may include a first partition 141, a second partition 142, and a third partition; the radio frequency circuit 200 located in the chamber 151 can be disposed in the first partition 141 and electrically connected to the first partition 141, the radio frequency circuit 200 located in the chamber 151 can be disposed in the second partition 142 and electrically connected to the second partition 142, and the radio frequency circuit 200 located in the chamber 151 can be disposed in the third partition and electrically connected to the third partition.

[0095] In the embodiments provided in this application, please refer to Figure 10. The RF module structure 100 can accommodate peripheral circuits 300, which are disposed in the cavity 150. The peripheral circuits 300 can be disposed on a partition and electrically connected to the partition. It should be noted that by providing a partition in the RF module structure 100, since the partition can support the peripheral circuits 300, the RF module structure 100 can accommodate more peripheral circuits 300, making more effective use of the space in the RF module structure 100 and promoting the miniaturization of the power amplifier 13 or electronic device 1. It should be noted that when the RF module structure 100 is applied to the power amplifier 13 or electronic device 1, it will occupy the space of the power amplifier 13 or electronic device 1. As the RF module structure 100 is reduced in size, the size of the power amplifier 13 or electronic device 1 can be reduced accordingly.

[0096] In the embodiments provided in this application, please refer to Figure 11. The radio frequency module unit further includes a transceiver unit 170 (FRX board). The transceiver unit 170 is connected to the side of the upper cover plate 110 away from the lower cover plate 120. The side of the lower cover plate 120 away from the upper cover plate 110 is provided with multiple heat dissipation teeth 180. The transceiver unit 170 is used to receive or transmit signals, and the heat dissipation teeth 180 are used to dissipate heat from the lower cover plate 120.

[0097] The terms "first," "second," "third," "fourth," and various numerical designations used herein are merely for descriptive convenience and are not intended to limit the scope of this application.

[0098] It should be understood that in the various embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0099] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A radio frequency module structure, characterized in that, Includes an upper cover, a lower cover, a frame, and at least one partition; The upper cover plate and the lower cover plate are stacked vertically and spaced apart from each other; The frame connects the upper cover plate and the lower cover plate; The partition is disposed within the frame and between the upper cover plate and the lower cover plate. At least one of the upper cover plate, the lower cover plate, or the frame is connected to the partition. At least one surface on both sides of the partition is provided with a metallized layer.

2. The radio frequency module structure as described in claim 1, characterized in that, The partition is a circuit board or a plastic plate with a metallized layer formed on at least one side surface.

3. The radio frequency module structure as described in claim 1 or 2, characterized in that, The frame is a circuit board or a plastic board with a metallized layer formed on at least one side surface.

4. The radio frequency module structure as described in any one of claims 1-3, characterized in that, The upper cover plate and the lower cover plate are connected through the frame.

5. The radio frequency module structure as described in any one of claims 1-4, characterized in that, The partition includes at least one first partition, which is connected to the inner surface of the frame. The first partition is located between the upper cover and the lower cover, and is spaced apart from the upper cover in the vertical direction and from the lower cover in the vertical direction.

6. The radio frequency module structure as described in claim 5, characterized in that, The first partition is connected to the inner surface of the frame on all four sides.

7. The radio frequency module structure as described in claim 5, characterized in that, At least one side of the first partition has a gap between it and the inner surface of the frame.

8. The radio frequency module structure as described in any one of claims 1-7, characterized in that, The partition includes at least one second partition, which is connected to at least one of the upper cover plate and the lower cover plate in the vertical direction, and is spaced apart from the inner surface of the frame in the horizontal direction.

9. The radio frequency module structure as described in claim 8, characterized in that, The second partition is connected to the upper cover plate and the lower cover plate on both sides in the vertical direction, respectively.

10. The radio frequency module structure as described in claim 8, characterized in that, The second partition has a gap with one of the upper or lower cover plates on one side in the vertical direction.

11. The radio frequency module structure according to any one of claims 1-10, characterized in that, The partition includes at least one third partition, which is connected to at least one of the upper cover plate and the lower cover plate in the vertical direction, and is spaced from the inner surface of the frame in the front-back direction.

12. The radio frequency module structure as described in claim 5, characterized in that, The partition includes at least one second partition, the first partition is connected to the inner surface of the frame, and the second partition is connected to at least one of the upper cover plate and the lower cover plate in the vertical direction.

13. The radio frequency module structure as described in claim 5, characterized in that, The partition also includes at least one second partition, the first partition being connected to the inner surface of the frame, and the second partition being connected in the vertical direction to at least one of the upper cover plate, the lower cover plate, and the first partition plate.

14. The radio frequency module structure as described in claim 5, characterized in that, The number of the first partition is two or more, and the partition further includes at least one second partition, wherein in the vertical direction, the second partition is connected between two adjacent first partitions.

15. The radio frequency module structure as described in claim 8, characterized in that, The partition also includes at least one first partition, which is connected to the inner surface of the frame in the left-right direction, and in the up-down direction, the second partition is connected to at least one of the upper cover plate and the lower cover plate.

16. The radio frequency module structure as described in claim 8, characterized in that, The number of the second partition is two or more, and the partition also includes at least one first partition, wherein in the left-right direction, the first partition is connected between two adjacent second partitions.

17. The radio frequency module structure according to any one of claims 1-16, characterized in that, The radio frequency module structure is used to house multiple radio frequency circuits, each of which is housed in a different cavity within the radio frequency module structure, and the radio frequency circuit is disposed and electrically connected to at least one of the upper cover plate, partition plate, lower cover plate, or enclosure frame.

18. The radio frequency module structure according to any one of claims 1-17, characterized in that, The radio frequency module structure is also used to house peripheral circuits, which are disposed on and electrically connected to the partition.

19. A power amplifier, characterized in that, The power amplifier includes a radio frequency (RF) circuit and an RF module structure as described in any one of claims 1-18, wherein the RF module structure is used to house the RF circuit.

20. An electronic device, characterized in that, The electronic device includes the radio frequency module structure as described in any one of claims 1-18.

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