Printed circuit board module, potted printed circuit board module, and method for potting a printed circuit board module

Abstract

The invention relates to a printed circuit board module (100) comprising: - a printed circuit board (10) which extends along a first axis (X) and has an axial first printed circuit board end (11), an axial second printed circuit board end (12), and a first axial gap (13) which is parallel to the first axis (X) and has a first axial gap length (14) of a first axial gap opening (15) and a first axial gap end (16) such that the printed circuit board (10) is divided into a potting portion (A) and a first free portion (B1) by the first axial gap (13), and - a potting box (30) which extends along the first axis (X) and has an axial box opening (31), a box wall (32), and an axial box base (33), the box wall (32) extending along the first axis (X) over an axial box wall length (34) and the axial box wall length (34) being greater than or equal to the first axial gap length (14).

Description

[0001] Printed circuit board module, potted printed circuit board module and method for potting a printed circuit board module

[0002] The invention relates to a printed circuit board module, a potted printed circuit board module and a method for potting a printed circuit board module.

[0003] In analytical measurement technology, particularly in water management, environmental analysis, and industrial applications (e.g., food technology, biotechnology, and pharmaceuticals), as well as for a wide variety of laboratory applications, measured parameters such as pH, conductivity, temperature, and the concentration of analytes (e.g., ions or dissolved gases) in a gaseous or liquid medium are of great importance. These parameters can be acquired and / or monitored using electrochemical sensors, such as optical, potentiometric, amperometric, voltammetric, or coulometric sensors, or conductivity sensors.

[0004] It is crucial that the sensors function reliably even under extreme operating conditions. For this reason, the electronic components of these sensors require special protection.

[0005] In the prior art, potting compounds are known for protecting the electronic components of sensors.

[0006] However, these state-of-the-art potting methods have the disadvantage that a potting frame must be placed on the printed circuit board (PCB) to which the electronic components are mounted before potting, which increases the complexity of the PCB design. In particular, the potting frame must lie directly and flush on the PCB so that no potting compound seeps between the PCB and the frame into areas of the PCB that are not to be potted.

[0007] It is therefore an object of the invention to propose a printed circuit board module which does not exhibit the described disadvantages of the prior art. This object is achieved according to the invention by a printed circuit board module according to claim 1.

[0008] The printed circuit board module according to the invention comprises: a printed circuit board extending along a first axis and having an axial first end and an axial second end, as well as an axial first gap parallel to the first axis with an axial first gap length, an axial first gap opening, and an axial first gap end, such that the printed circuit board is divided by the axial first gap into a potting section and a first free section; a potting cup extending along the first axis and having an axial cup opening, a cup wall, and an axial cup bottom, wherein the cup wall extends along the first axis over an axial cup wall length and the axial cup wall length is greater than or equal to the axial first gap length; and wherein the potting cup is suitable for being inserted axially into the axial first gap through the axial first gap opening with the cup wall.so that the potting section can be inserted into the potting cup through the axial cup opening, a potting compound suitable for being arranged in the potting cup and enclosing the potting section.

[0009] The circuit board module according to the invention makes it possible to completely dispense with a potting frame, without risking potting of areas of the circuit board that are not intended to be potted. This simplifies the manufacturing process of the circuit board module, increases the reliability of the manufacturing process, and simultaneously reduces costs.

[0010] According to one embodiment of the invention, the cup wall has an axial first bearing surface extending in a first plane defined by the first axis and a second axis arranged radially to the first axis, wherein the axial first bearing surface is suitable for contacting a free rear face of the first free section. According to a further embodiment of the invention, the potting cup has an axial first guide rail extending parallel to the first axis, which is arranged such that the axial first guide rail is suitable for contacting a free front face of the free section.

[0011] According to one embodiment of the invention, the potting section has a potting front and a potting back and is bounded parallel to a second axis by a first edge and a second edge and parallel to the first axis by a third edge, wherein the cup wall is suitable to touch the first edge and the second edge and the cup bottom is suitable to touch the third edge, so that a first cavity enclosing the potting front and / or a second cavity enclosing the potting back can be formed by the potting cup and the potting section.

[0012] According to one embodiment of the invention, the first edge, the second edge and the third edge are suitable for being bonded to the potting cup.

[0013] According to one embodiment of the invention, the circuit board has an axial second gap parallel to the first axis, with an axial second gap length, an axial second gap opening, and an axial second gap end, wherein the axial first gap and the axial second gap are spaced apart from each other by a gap distance, wherein the potting cup is suitable for being inserted axially into the axial second gap with the cup wall through the axial second gap opening, so that the potting section can be inserted into the potting cup through the axial cup opening.

[0014] According to one embodiment of the invention, the circuit board has a first plug contact in the first free section.

[0015] According to one embodiment of the invention, the circuit board has a first light source in the first free section. The aforementioned problem is also solved by an encapsulated circuit board module according to claim 9.

[0016] The potted circuit board module according to the invention comprises a circuit board module according to the invention, wherein the potting cup with the cup wall is axially inserted into the axial first gap through the axial first gap opening and the potting is arranged in the potting cup and surrounds the potting section.

[0017] The above-mentioned problem is also solved by a method for potting a printed circuit board module according to claim 10.

[0018] The method according to the invention comprises:

[0019] Providing a printed circuit board module according to the invention,

[0020] Inserting the potting cup into the axial first gap and the axial second gap of the circuit board, so that a first cavity is formed around the potting section of the circuit board,

[0021] Pouring the first cavity with a single pour.

[0022] The invention is explained in more detail with reference to the following description of figures. The figures show:

[0023] - Fig. 1 : a perspective view of a circuit board according to the invention,

[0024] - Fig. 2: a perspective view of a potting cup according to the invention,

[0025] - Fig. 3: a perspective view of a printed circuit board module according to the invention,

[0026] - Fig. 4: a perspective view of an encapsulated printed circuit board module according to the invention.

[0027] A printed circuit board module 100 according to the invention comprises a printed circuit board 10, a potting cup 30 and a potting 40.

[0028] Figure 4 shows an example of a potted circuit board module 200, i.e. a

[0029] Printed circuit board module 100, in which all components are assembled and potted. The printed circuit board 10 (Figure 1) extends along a first axis X and comprises an axial first printed circuit board end 11 and an axial second printed circuit board end 12, as well as an axial first gap 13 parallel to the first axis X with an axial first gap length 14, an axial first gap opening 15, and an axial first gap end 16, such that the printed circuit board 10 is divided by the axial first gap 13 into a potted section A and a first free section B1.

[0030] The potting cup 30 (Figure 2) extends along the first axis X and has an axial cup opening 31, a cup wall 32, and an axial cup bottom 33. The cup wall 32 extends along the first axis X over an axial cup wall length 34, and the axial cup wall length 34 is greater than or equal to the axial first gap length 14. The potting cup 30 is suitable for being inserted axially through the axial first gap opening 15 into the axial first gap 13, so that the potting section A can be inserted into the potting cup 30 through the axial cup opening 31. The potting section A is arranged in the potting cup 30, and the free section B1 is arranged outside the potting cup 30. This means that the wall thickness of the cup wall 32 is adapted to be equal to or less than the gap width of the axial first gap 13.The gap width is, of course, perpendicular to the first axis X. The gap width is therefore defined by the distance between the first free section B1 and the grouted section A.

[0031] The cup wall 32 preferably has an axial first bearing surface 35, which extends in a first plane E1 defined by the first axis X and a second axis Y arranged radially to the first axis X. The axial first bearing surface 35 is suitable for contacting a free rear face B1 R of the first free section B1. This allows the first free section B1 to be supported by the bearing surface 35 when the circuit board 10 is inserted into the potting cup 30. This prevents the circuit board 10 from breaking if forces act on the first free section B1. In fact, the circuit board 10 is significantly weakened mechanically by the axial first gap 13, at least in the area of ​​the connection between the first free section B1 and the potting section A, so that breakage at this connection area is possible when force is applied.As exemplified in Figure 2, the potting cup 30 preferably has an axial first guide rail 36 extending parallel to the first axis X, which is arranged such that the axial first guide rail 36 is suitable for contacting a free front face B1V of the free section B1. The axial first guide rail 36 is parallel to the support surface 35. The axial first guide rail 36 is spaced from the support surface 35 by a distance which essentially corresponds to the thickness of the circuit board 10. This allows the circuit board 10 to be ideally clamped or held in the region of the first free section B1 between the support surface 35 and the axial first guide rail 36. Thanks to the axial first guide rail 36, movement of the first free section B1 in a direction orthogonal to the first plane E1 (in a direction of a third axis Z) is also prevented.This thus stabilizes the first free section B1.

[0032] According to an optional embodiment of the invention, the potting section A has a potting front AV and a potting back AR and is bounded parallel to the second axis Y by a first edge 21 and a second edge 22, and along the first axis X by a third edge 23. The cup wall 32 is suitable for contacting the first edge 21 and the second edge 22, and the cup bottom 33 is suitable for contacting the third edge 23, such that a first cavity K1 enclosing the potting front AV and / or a second cavity K2 enclosing the potting back AR can be formed by the potting cup 30 and the potting section A (see Figure 3). In other words, the shape of the potting section A is complementary to the shape of the cup wall 32 and the cup bottom 33.

[0033] The first edge 21, the second edge 22, and the third edge 23 are suitable for bonding to the potting cup 30. This has the advantage that the first cavity K1 and the second cavity K2 within the potting cup 30 are thus fluid-tightly separated from each other. The potting cup 30 can therefore, for example, be filled with potting compound 40 only in the first cavity K1. Alternatively, the two cavities can be filled with different potting materials. It should be noted that the second edge 22 is shown in Figure 1 in an axial second gap 17. However, if the circuit board 10 has only one gap, as mentioned in the embodiment described so far (not shown), then the second edge 22 naturally forms an axial end of the circuit board 10 in the direction of the second axis Y.

[0034] According to an optional embodiment of the invention, which is illustrated by way of example in Figure 1, the circuit board 10 has an axial second gap 17 parallel to the first axis X, with an axial second gap length 18, an axial second gap opening 19, and an axial second gap end 20. The axial first gap 13 and the axial second gap 17 are spaced apart from each other by a gap spacing 24. The potting cup 30 is suitable for being inserted axially into the axial second gap 17 through the axial second gap opening 19 with its cup wall 32, so that the potting section A can be inserted into the potting cup 30 through the axial cup opening 31. All features described above with respect to the axial first gap 13 are preferably identical for the axial second gap 17.The potting cup 30, in particular the cup wall 32, has a shape which allows the potting cup 30 to be inserted into the axial first gap 13 and the axial second gap 17.

[0035] Preferably, the circuit board 10 has a first plug contact 50 in the first free section B1 (see Figure 1 and Figure 3).

[0036] Preferably, the circuit board 10 has a first light source 51 in the first free section B1 (see Figure 1 and Figure 3).

[0037] The potting compound 40 is suitable for being placed in the potting cup 30 and encasing the potting section A. The potting compound 40 is thus suitable for being placed in the potting cup 30 such that the potting section A is encased by the potting compound 40, while the open section B1 remains free of the potting compound. The potting compound 40 is a non-electrically conductive material that is liquid at certain temperatures and solid at room temperature. When the potting compound 40 is placed in the potting cup 30, it has a potting height along the first axis X. The potting height is less than or equal to the axial cup wall length 34. Therefore, the potting cup will not overflow. This ensures that components located on the circuit board 10 in the first open section B1 do not come into contact with the potting compound.

[0038] Figure 4 shows a potted circuit board module 200 with the circuit board module 100 described above. The potting cup 30 was inserted axially through the first axial slot opening 15 into the first axial slot 13 with its cup wall 32, and the potting compound 40 was arranged in the potting cup 30 so that the potting compound 40 encloses the potting section A. The first plug contact 50 is connected to a display 53. A central plug contact 52 protrudes from the potting cup 30 along the first axis X.

[0039] The following describes a method for potting a printed circuit board module 100.

[0040] First, the circuit board module 100 described above is deployed.

[0041] Then the potting cup 30 is inserted into the axial first gap 13 and the axial second gap 17 of the circuit board 10, so that at least one first cavity K1 is formed around the potting section A of the circuit board 10.

[0042] Finally, the first cavity K1 is filled with a casting compound 40. The casting compound 40 is filled to a maximum of the cup opening 31, i.e., along the first axis X, to a maximum axial casting height equal to the cup wall length 34.

[0043] Since the potting compound 40 is located inside the potting cup 30, and the free section B1 is located outside the potting cup 30, the free section B1 is not enclosed by the potting compound 40. Therefore, a potting frame can be completely omitted, as sensitive electronic components can be located on the free section B1 and thus do not come into contact with the potting compound 40. Reference numeral list

[0044] 10 ladder map

[0045] 11 axial first circuit board end

[0046] 12 axial second circuit board end

[0047] 13 axial first gap

[0048] 14 axial first gap length

[0049] 15 axial first gap opening

[0050] 16 axial first slit end

[0051] 17 axial second gap

[0052] 18 axial second gap length

[0053] 19 axial second gap opening

[0054] 20 axial second column end

[0055] 21 first edge

[0056] 22 second edge

[0057] 23 third edge

[0058] 24 gap spacing

[0059] 30 pouring cups

[0060] 31 axial cup opening

[0061] 32 cup wall

[0062] 33 Cup bottom

[0063] 34 cup wall length

[0064] 35 mm contact area

[0065] 36 axial first guide rail

[0066] 40 potting

[0067] 50 first plug contact

[0068] 51 first light source

[0069] 52 central connector 53 display

[0070] 100 circuit board modules

[0071] 200 potted circuit board modules

[0072] A casting section

[0073] AV potting front

[0074] AR potting back

[0075] B1 first free section

[0076] B1 R Free back

[0077] B1V Free Front

[0078] B2 second free section

[0079] E1 first level

[0080] K1 first cavity

[0081] K2 second cavity

[0082] X first axis

[0083] Y second axis

[0084] Z third axis

Claims

Patent claims 1. Circuit board module (100) comprising: - a printed circuit board (10) extending along a first axis (X) and having an axial first printed circuit board end (11) and an axial second printed circuit board end (12) as well as an axial first gap (13) parallel to the first axis (X) with an axial first gap length (14) an axial first gap opening (15) and with an axial first gap end (16) such that the printed circuit board (10) is divided by the axial first gap (13) into a potting section (A) and a first free section (B1), - a potting cup (30) extending along the first axis (X) and having an axial cup opening (31), a cup wall (32), and an axial cup bottom (33), wherein the cup wall (32) extends along the first axis (X) over an axial cup wall length (34), and the axial cup wall length (34) is greater than or equal to the axial first gap length (14), wherein the potting cup (30) is suitable for being inserted axially into the axial first gap (13) through the axial first gap opening (15) with the cup wall (32), such that the potting section (A) is arranged in the potting cup (30) and the free section (B1) is arranged outside the potting cup (30), - a potting compound (40) suitable for being arranged in the potting cup (30) such that the potting section (A) is enclosed by the potting compound (40) and the free section (B1) remains free from the potting compound (40).

2. Printed circuit board module (100) according to claim 1, wherein the cup wall (32) has an axial first support surface (35) which extends in a first plane (E1) which is spanned by the first axis (X) and a second axis (Y) arranged radially to the first axis (X), wherein the axial first support surface (35) is suitable to contact a free rear side (B1 R) of the first free section (B1 ).

3. Printed circuit board module (100) according to claim 2, wherein the potting cup (30) has an axial first guide rail extending parallel to the first axis (X). (36) which is arranged such that the axial first guide rail (36) is suitable to touch a free front face (B1V) of the free section (B1 ).

4. Printed circuit board module (100) according to one of the preceding claims, wherein the potting section (A) has a potting front (AV) and a potting back (AR) and is bounded parallel to a second axis (Y) by a first edge (21) and a second edge (22) and parallel to the first axis (X) by a third edge (23), wherein the cup wall (32) is suitable for contacting the first edge (21) and the second edge (22) and the cup bottom (33) is suitable for contacting the third edge (23), such that a first cavity (K1) enclosing the potting front (AV) and / or a second cavity (K2) enclosing the potting back (AR) can be formed by the potting cup (30) and the potting section (A).

5. Printed circuit board module (100) according to claim 4, wherein the first edge (21), the second edge (22) and the third edge (23) are suitable for being bonded to the potting cup (30).

6. Printed circuit board module (100) according to one of the preceding claims, wherein the printed circuit board (10) has an axial second gap (17) parallel to the first axis (X) with an axial second gap length (18) of an axial second gap opening (19) and with an axial second gap end (20), wherein the axial first gap (13) and the axial second gap (17) are spaced apart from each other by a gap distance (24), wherein the potting cup (30) is suitable for being inserted axially into the axial second gap (17) with the cup wall (32) through the axial second gap opening (19), so that the potting section (A) can be inserted into the potting cup (30) through the axial cup opening (31).

7. Printed circuit board module (100) according to one of the preceding claims, wherein the printed circuit board (10) has a first plug contact (50) in the first free section (B1).

8. Printed circuit board module (100) according to one of the preceding claims, wherein the printed circuit board (10) has a first light source (51) in the first free section (B1).

9. Encapsulated printed circuit board module (200) comprising a printed circuit board module (100) according to one of the preceding claims, wherein the encapsulation cup (30) with the cup wall (32) is inserted axially through the axial first slot opening (15) into the axial first slot (13) of the printed circuit board (10) and the encapsulation (40) is arranged in the encapsulation cup (30) and surrounds the encapsulation section (A).

10. Encapsulated printed circuit board module (200) according to claim 9, wherein the encapsulation (40) has an encapsulation height along the first axis (X) and the encapsulation height is less than or equal to the axial cup wall length (34).

11. Method for potting a printed circuit board module (100) comprising: - Providing a printed circuit board module (100) according to any one of claims 1 to 8, - Inserting the potting cup (30) into the axial first gap (13) and the axial second gap (17) of the circuit board (10), so that a first cavity (K1 ) is formed around the potting section (A) of the circuit board (10), - Casting of the first cavity (K1) with a casting (40).

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