Inspecting machine, component mounting machine, board production system, and inspection method

Abstract

An appearance inspecting machine 50 (inspecting machine) acquires positional relationship information (positional displacement amount d) indicating a positional relationship between an outer shape and a bump pattern P (pattern) of a component Wp in a component recognition image Im2 (pre-mounting component image) from a component mounting machine 10 for mounting the component Wp on a board 1. Here, the component recognition image Im2 is acquired by the component mounting machine 10 imaging a front surface Sa of the component Wp, which has the front surface Sa (first surface) on which the bump pattern P is provided, and a rear surface Sb (second surface) on the opposite side to the front surface Sa. Therefore, the appearance inspecting machine 50 can confirm a central position Cp (position) of the bump pattern P of the component Wp (steps S303 to S306) without imaging the bump pattern P using a camera. As a result, the appearance inspecting machine 50 can perform an appropriate inspection of the position of the bump pattern P of the component Wp.

Description

Inspection machine, component mounting machine, board production system, and inspection method

[0001] The present invention relates to a technique for inspecting components mounted on a board.

[0002] Patent Document 1 discloses a component mounter that mounts components having patterns such as bumps on a substrate. The components are mounted on the substrate with their patterns facing the substrate. This component mounter also has a function for inspecting the components mounted on the substrate. This inspection checks whether the position of the pattern of the components mounted on the substrate is appropriate. Specifically, the position of the pattern of the components mounted on the substrate is checked based on an image of the component pattern before mounting on the substrate and an image of the component mounted on the substrate.

[0003] Patent No. 6855148

[0004] In production sites using component mounters, there are cases where the boards removed from the mounters are further inspected by an inspection machine. In contrast, the mounters can capture images of component patterns using a camera before mounting the components on the board. On the other hand, inspection machines inspect the boards mounted on them after being removed from the mounters, so they cannot capture images of the component patterns using a camera. This makes it difficult for the inspection machine to properly inspect the position of the component patterns.

[0005] The present invention has been made in view of the above-mentioned problems, and has as its object to provide a technique that enables an inspection machine to perform appropriate inspection of the position of a component pattern.

[0006] The inspection machine according to the present invention includes a board loading section that loads a board on which a component has been mounted from a component mounting machine that images the first surface of a component having a first surface with a pattern and a second surface opposite the first surface to obtain a pre-mounting component image, and then mounts the component on the board with the first surface facing the board; an information acquisition section that acquires, from the component mounting machine, positional relationship information that indicates the positional relationship between the outline of the component and the pattern in the pre-mounting component image; an inspection camera that images the second surface of the component mounted on the board loaded by the board loading section to obtain a post-mounting component image; and a calculation section that performs inspection of the component mounted on the board based on the positional relationship information and the post-mounting component image obtained by the information acquisition section.

[0007] The component mounting machine of the present invention comprises a component supply unit that supplies components having a first surface on which a pattern is provided and a second surface opposite the first surface, a mounting head that transfers the components from the component supply unit to a board, a component recognition camera that images the first surface of the component before it is transferred to the board to obtain a pre-mounting component image, and an information transmission unit that transmits positional relationship information that indicates the positional relationship between the component's outline and the pattern in the pre-mounting component image to an inspection machine that inspects the components mounted on the board.

[0008] The board production system of the present invention includes a component mounter and an inspection machine. The component mounter has a component supply unit that supplies components having a first surface on which a pattern is provided and a second surface opposite the first surface, a mounting head that transfers the components from the component supply unit to a board, a component recognition camera that images the first surface of the component before it is transferred to the board to obtain a pre-mounted component image, and an information transmission unit that transmits positional relationship information that indicates the positional relationship between the outline of the component and the pattern in the pre-mounted component image to an inspection machine that inspects the components mounted on the board. The inspection machine has a board loading unit that loads boards on which components have been mounted from the component mounter, an information acquisition unit that acquires the positional relationship information from the information transmission unit, an inspection camera that images the second surface of the components mounted on the board loaded by the board loading unit to obtain a post-mounted component image, and a calculation unit that inspects the components mounted on the board based on the positional relationship information and the post-mounted component image acquired by the information acquisition unit.

[0009] The inspection method according to the present invention includes the steps of: acquiring, by an inspection machine, positional relationship information indicating the positional relationship between the outline of the component and the pattern in the pre-mounting component image from a component mounter that images the first surface of a component having a first surface on which a pattern is formed and a second surface opposite the first surface to acquire a pre-mounting component image; mounting the component on a board with the first surface facing the board; acquiring, by the inspection machine, positional relationship information indicating the positional relationship between the pattern and the outline of the component in the pre-mounting component image; imaging the second surface of the component mounted on the board to acquire a post-mounting component image; and inspecting the component mounted on the board based on the positional relationship information and the post-mounting component image.

[0010] According to the present invention (inspection machine, component mounter, board production system, and inspection method) configured as described above, the inspection machine acquires positional relationship information indicating the positional relationship between the component's outline and its pattern in a pre-mounting component image from a component mounter that mounts components on a board. Here, the pre-mounting component image is acquired by the component mounter capturing an image of the first surface of a component having a first surface on which a pattern is formed and a second surface opposite the first surface. Therefore, the inspection machine can confirm the position of the component pattern without capturing an image of the component pattern with a camera. As a result, the inspection machine can perform appropriate inspection of the position of the component pattern.

[0011] The inspection machine may also be configured so that the information acquisition unit acquires, as position-related information, an outline reference position deviation amount, which is the amount of positional deviation of the pattern relative to the outline of the component, calculated by the component mounter based on the pre-mounting component image, and the calculation unit calculates a mounted component outline position, which is the position of the outline of the component mounted on the board, based on the mounted component image, and calculates a mounted component pattern position, which is the position of the pattern of the component mounted on the board, based on the mounted component outline position and the outline reference position deviation amount, and inspects the component mounted on the board based on the mounted component pattern position. In this configuration, the inspection machine acquires the outline reference position deviation amount, which is the amount of positional deviation of the pattern relative to the outline of the component. Therefore, the inspection machine can confirm the position of the component pattern without capturing an image of the component pattern with a camera. As a result, the inspection machine can perform appropriate inspection of the position of the component pattern.

[0012] The inspection machine may also be configured so that the information acquisition unit acquires the center position of the component outline and the center position of the pattern calculated by the component mounter based on the pre-mounting component image as positional relationship information, the calculation unit calculates the amount of deviation of the pattern relative to the component outline based on the center position of the component outline and the center position of the pattern, calculates the mounted component outline position, which is the position of the outline of the component mounted on the board, based on the mounted component image, and calculates the mounted component pattern position, which is the position of the pattern of the component mounted on the board, based on the mounted component outline position and the amount of deviation of the outline reference position, and inspects the component mounted on the board based on the mounted component pattern position. In this configuration, the inspection machine acquires the center position of the component outline and the center position of the pattern. Therefore, the inspection machine can confirm the position of the component pattern without capturing an image of the component pattern with a camera. As a result, the inspection machine can perform appropriate inspection of the position of the component pattern.

[0013] The inspection machine may also be configured so that the information acquisition unit acquires a pre-mounting component image as position-related information, the calculation unit calculates the center position of the component's outline and the center position of the pattern based on the pre-mounting component image, calculates an outline reference position deviation amount, which is the amount of positional deviation of the pattern from the component's outline, based on the center position of the component's outline and the center position of the pattern, calculates a mounted component outline position, which is the position of the outline of the component mounted on the board, based on the mounted component image, calculates a mounted component pattern position, which is the position of the pattern of the component mounted on the board, based on the mounted component outline position and the outline reference position deviation amount, and inspects the component mounted on the board based on the mounted component pattern position. Therefore, the inspection machine can confirm the position of the component pattern without capturing an image of the component pattern with a camera. As a result, the inspection machine can perform appropriate inspection of the position of the component pattern.

[0014] The inspection machine may also be configured so that the pattern has solder bumps, and the calculation unit performs an inspection by measuring the amount of misalignment between the solder bumps of a component mounted on the board and the electrodes on the board. In this configuration, the inspection machine can confirm the position of the bumps of the component without capturing an image of the bumps with a camera. As a result, the inspection machine can appropriately inspect for misalignment of the bumps of the component relative to the electrodes on the board.

[0015] The inspection machine may also be configured so that the information acquisition unit acquires from the component mounter inspection results indicating the results of an inspection of the components mounted on the board based on images of the components mounted on the board taken by the component mounter and pre-mounting component images. In this configuration, the inspection machine can refer to the mounter inspection results.

[0016] The inspection machine may also be configured to further include a notification unit that notifies an operator, and the calculation unit may cause the notification unit to execute notification when a difference between the inspection machine inspection result, which is the result of the inspection of the components mounted on the board performed by the calculation unit, and the mounting machine inspection result is equal to or greater than a predetermined value. With this configuration, it becomes possible for the operator to notice abnormalities related to component mounting in the component mounter or on the transport path for the board from the component mounter to the inspection machine.

[0017] The inspection machine may also be configured so that the board loading unit loads the board that has been transported from the mounter and then passed through a reflow furnace, which performs reflow on the board. With this configuration, the inspection machine can perform appropriate inspection of the position of the pattern of the component that has undergone reflow.

[0018] According to the present invention, it is possible to perform appropriate inspection of the position of the pattern of the component in an inspection machine.

[0019] 11A . A block diagram showing an example of a board production system according to the present invention. A plan view schematically showing an example of a component mounter according to the present invention. A block diagram showing the electrical configuration of the component mounter of FIG. 2. A diagram schematically showing an example of a component to be mounted by the component mounter of FIG. 2. A flowchart showing a first example of component mounting performed by the component mounter of FIG. 2. A flowchart showing a first example of positional related information transmission processing. A diagram schematically showing the contents of calculations performed in the first example of the positional related information transmission processing of FIG. 6. A block diagram schematically illustrating a visual inspection machine. A flowchart showing a first example of component inspection performed by the visual inspection machine of FIG. 8. A diagram schematically showing the contents of calculations performed in the first example of component inspection of FIG. 9. A flowchart showing a second example of positional related information transmission processing. A flowchart showing a process of reading out positional related information performed by the visual inspection machine in response to the positional related information transmission processing of FIG. 11A. A flowchart showing a third example of positional related information transmission processing. A flowchart showing a process of reading out positional related information performed by the visual inspection machine in response to the positional related information transmission processing of FIG. 12A. A flowchart showing a second example of component mounting performed by the component mounter of FIG. 2. 13B is a flowchart showing an example of a simple inspection performed in the second example of component mounting of FIG. 13A. FIG. 13C is a flowchart showing a second example of component inspection performed by the visual inspection machine of FIG.

[0020] FIG. 1 is a block diagram showing an example of a board production system according to the present invention. The board production system S in FIG. 1 includes a component mounter 10, a reflow furnace 11, and a visual inspection machine 50 arranged in series in a board transport direction X. Boards transported in the board transport direction X are transported to these machines in order. That is, as will be described later with reference to FIG. 2 , the component mounter 10 mounts components Wp on a board 1 transported from the upstream side in the board transport direction X, and then transports the board 1 toward the reflow furnace 11 downstream in the board transport direction X. The reflow furnace 11 performs reflow, which heats the board 1 transported from the component mounter 10, and then transports the board 1 toward the visual inspection machine 50 downstream in the board transport direction X. The visual inspection machine 50 inspects the appearance of the board 1 transported from the reflow furnace 11, and then transports the board 1 downstream in the board transport direction X.

[0021] The board 1 is transported from the component mounter 10 to the reflow furnace 11 by a conveyor 12 arranged between the component mounter 10 and the reflow furnace 11, and the board 1 is transported from the reflow furnace 11 to the visual inspection machine 50 by a conveyor 12 between the reflow furnace 11 and the visual inspection machine 50. The number of component mounters 10 provided in the board production system S is not limited to one, and multiple component mounters 10 may be arranged in series in the board transport direction X.

[0022] Fig. 2 is a plan view schematically showing an example of a component mounter according to the present invention. Fig. 3 is a block diagram showing the electrical configuration of the component mounter of Fig. 2. As shown in Fig. 2, this specification appropriately uses XYZ orthogonal coordinate axes consisting of a board transport direction X, a width direction Y, and a vertical direction Z. The board transport direction X and the width direction Y are parallel to the horizontal direction and perpendicular to each other, and the vertical direction Z is perpendicular to the board transport direction X and the width direction Y.

[0023] This mounter 10 mounts components Wp on a board 1 that has been carried in from the upstream side in the board transport direction X, and then carries the board out downstream in the board transport direction X. A plurality of mounting target points 1a are provided on the top surface of the board 1, and a control unit 100 provided in the mounter 10 controls each unit of the mounter 10 to mount components Wp at each mounting target point 1a.

[0024] 3, the control unit 100 has an arithmetic unit 110, which is a processor that performs arithmetic functions for controlling the entire mounter 10, an image processing unit 120 that performs image processing based on commands from the arithmetic unit 110, and a drive control unit 130 that controls drive mechanisms such as motors based on commands from the arithmetic unit 110. The control unit 100 also has a memory unit 140 and a communication unit 150. The memory unit 140 is a storage device such as an SSD (Solid State Drive), and the communication unit 150 communicates wirelessly or via a wire with a communication unit 530 of the visual inspection machine 50, which will be described later.

[0025] This component mounter 10 is equipped with a transport unit 2 that transports a board 1 in a board transport direction X. This transport unit 2 has two mounting work positions 21 aligned in the board transport direction X, and transports the board 1 from the upstream side of the board transport direction X to each mounting work position 21. In addition, the transport unit 2 transports the board 1, on which components Wp have been mounted at each mounting work position 21, from each mounting work position 21 to the downstream side of the board transport direction X.

[0026] The mounter 10 also includes a component supply mechanism 3 that supplies components Wp. The components Wp supplied by the component supply mechanism 3 are dies (bare chips) of diced wafers W. In other words, the component supply mechanism 3 has a wafer storage section 31 that can store multiple wafers W, and a wafer drawer section 33 that draws the wafers W from the wafer storage section 31 to a component supply position 32. The wafer storage section 31 raises and lowers, in the vertical direction Z, a rack that stores multiple wafer holders Wh, each holding a wafer W, arranged in the vertical direction Z, to position one wafer holder Wh at a height that allows the wafer drawer section 33 to receive the wafer W, and then pushes the wafer holder Wh into the wafer drawer section 33.

[0027] The wafer pull-out unit 33 includes a wafer support table 331 that supports the wafer holder Wh, fixed rails 332 that support the wafer support table 331 so that it can move in the width direction Y, a ball screw 333 that is provided in the width direction Y and attached to the wafer support table 331, and a Y-axis motor 334 that drives the ball screw 333. Therefore, by rotating the ball screw 333 using the Y-axis motor 334, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332. As shown in FIG. 2 , the wafer storage unit 31 and the component supply position 32 are disposed on either side of the transport unit 2 in the width direction Y, and the wafer support table 331 passes below the transport unit 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at a receiving position adjacent to the wafer storage unit 31, and moves from the receiving position to the component supply position 32 to pull out the wafer W to the component supply position 32.

[0028] The component supply mechanism 3 further includes a component take-out unit 35 that takes out a component Wp from the component supply position 32. The component take-out unit 35 includes a take-out head 36 that takes out a component Wp from the component supply position 32, and the take-out head 36 is movable in the X and Y directions. Specifically, the component take-out unit 35 includes a support member 351 that supports the take-out head 36 movably in the board transport direction X, and an X-axis motor 352 that is provided in the board transport direction X and drives a ball screw attached to the take-out head 36. Therefore, the drive control unit 130 can move the take-out head 36 in the board transport direction X by rotating the X-axis motor 352. The component take-out unit 35 also includes a fixed rail 353 that supports the support member 351 movably in the width direction Y, a ball screw 354 that is provided in the width direction Y and attached to the fixed rail 353, and a Y-axis motor 355 that drives the ball screw 354. Therefore, the drive control unit 130 can move the take-out head 36 together with the support member 351 in the width direction Y by rotating the Y-axis motor 355 .

[0029] The take-out head 36 has a bracket 361 extending in the substrate transport direction X and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 rotates about a rotation axis parallel to the substrate transport direction X to be positioned at either a suction position facing downward or a delivery position facing upward (position in FIG. 2). The bracket 361 can be raised and lowered together with each nozzle 362.

[0030] Furthermore, the component removal unit 35 has a movable camera 356 that uses an image sensor to capture images of the components Wp at the component supply positions 32 from above, and this movable camera 356 is movable in the X and Y directions. That is, in the component removal unit 35, the movable camera 356 is supported by a support member 351 so as to be movable in the board transport direction X. The component removal unit 35 also has an X-axis motor 357 that is provided in the board transport direction X and drives a ball screw attached to the movable camera 356. Therefore, the drive control unit 130 can move the movable camera 356 in the board transport direction X by rotating the X-axis motor 357, and can move the movable camera 356 together with the support member 351 in the width direction Y by rotating the Y-axis motor 355.

[0031] The component supply mechanism 3 supplies components Wp as follows. That is, the drive control unit 130 moves the movable camera 356 above a component Wp to be supplied from among the multiple components Wp at the component supply position 32. The movable camera 356 then captures an image of the component Wp and transfers the captured image to the image processing unit 120, which then recognizes the position of the component Wp from the captured image. The drive control unit 130 then drives the nozzle 362 based on the recognition results from the image processing unit 120, thereby positioning the nozzle 362 at the suction position to face the component Wp from above, and then lowers the nozzle 362 to contact the component Wp. The drive control unit 130 then applies negative pressure to the nozzle 362 while raising it, thereby picking up the component Wp from the component supply position 32. The drive control unit 130 then positions the nozzle 362 at the delivery position to supply the component Wp.

[0032] The mounter 10 includes two mounting units 4A and 4B that mount the components Wp supplied by the component supply mechanism 3 onto the board 1. These two mounting units 4A and 4B are provided in a one-to-one correspondence with the two mounting work positions 21. Each mounting unit 4A and 4B includes a support member 41 that is movable along a fixed rail provided on the ceiling of the mounter 10 in the width direction Y, and a mounting head 42 that is supported by the support member 41 and is movable in the board transport direction X. The mounter 10 further includes an X-axis motor 43 that is provided in the board transport direction X and drives a ball screw attached to the mounting head 42, and a Y-axis motor 44 that is provided in the width direction Y and attached to the support member 41. Therefore, the drive control unit 130 can move the mounting head 42 in the board transport direction X by rotating the X-axis motor 43, and can move the mounting head 42 along the board transport direction X by rotating the Y-axis motor 44.

[0033] When picking up the component Wp, the mounting head 42 of each mounting unit 4A, 4B moves above the take-out head 36, positions the nozzle 421 from above to face the component Wp held by the nozzle 362 located at the delivery position, and then lowers the nozzle 421 to contact the component Wp. Next, the component supply mechanism 3 releases the negative pressure on the nozzle 362, and the mounting units 4A, 4B apply negative pressure to the nozzle 421, causing the nozzle 421 to pick up the component Wp and then raises the nozzle 421 while still applying negative pressure. In this way, the mounting head 42 picks up the component Wp with the nozzle 421.

[0034] The component supply mechanism 3 has two nozzles 362, and can supply two components Wp simultaneously using these nozzles 362. On the other hand, the mounting head 42 has two nozzles 421 corresponding to the two nozzles 362 of the component supply mechanism 3, and can simultaneously pick up two components Wp supplied by the component supply mechanism 3 using the two nozzles 421. However, it is not essential to simultaneously supply and pick up two components Wp.

[0035] Furthermore, each mounting unit 4 has a movable camera 45 that is provided facing downward. The movable camera 45 uses an image sensor to capture images of the components Wp supplied by the component supply mechanism 3 and the components Wp mounted on the board 1 from above. This movable camera 45 is attached to the mounting head 42, and the drive control unit 130 can move the movable camera 45 in the X and Y directions in the same way as the mounting head 42 by rotating the X-axis motor 43 and the Y-axis motor 44.

[0036] The mounter 10 also includes a fixed camera 5 provided for each mounting section 4A, 4B. The fixed camera 5 faces upward and is fixed to a base, and as will be described later, captures an image of the component Wp located above from below using an image sensor. In this way, the mounter 10 configures an imaging unit IU that includes the mobile camera 45, the fixed camera 5, and the mobile camera 356.

[0037] 4 is a diagram schematically illustrating an example of a component to be mounted by the component mounter of FIG. 2. The diagram illustrates a component Wp supplied to the component supply position 32. The surface Sa and back surface Sb (the surface opposite to the surface Sa) of the component Wp are both rectangular. However, the shape of the component Wp is not limited to this example. A plurality of bumps B (solder bumps) are arranged in a matrix on the surface Sa of the component Wp, and these bumps B form a bump pattern P.

[0038] 2, each component Wp is placed with its front surface Sa facing upward, and the take-out head 36 picks up the component Wp by suctioning the front surface Sa of the component Wp with the nozzle 362 positioned at the suction position. The take-out head 36 then supplies the component Wp by rotating the nozzle 362 from the suction position to the delivery position. As the nozzle 362 rotates, the component Wp is inverted, and the component Wp is supplied with its back surface Sb facing upward. Therefore, the mounting head 42 picks up the component Wp by suctioning the back surface Sb of the component Wp with the nozzle 421.

[0039] Fig. 5 is a flowchart showing a first example of component mounting executed by the component mounter of Fig. 2. The flowchart of Fig. 5 is executed by the calculation unit 110 controlling each unit of the component mounter 10. Furthermore, since the two mounting units 4A and 4B operate in common, the following description will not distinguish between them.

[0040] 5 starts, the transport unit 2 carries the board 1 into the mounting work position 21 (step S101). In step S102, board recognition is performed on the board 1 carried into the mounting work position 21. Specifically, the mobile camera 45 faces the fiducial mark attached to the board 1 from above and captures an image of the fiducial mark to obtain a board recognition image Im1. This board recognition image Im1 is transmitted from the mobile camera 45 to the image processing unit 120, and the image processing unit 120 recognizes the position of the board 1 based on the board recognition image Im1.

[0041] In step S103, the nozzle 362 of the component supply mechanism 3 supplies the component Wp to the delivery position. In step S104, the nozzle 421 of the mounting head 42 picks up the component Wp supplied to the delivery position. In step S105, component recognition is performed for the component Wp picked up by the nozzle 421. Specifically, the nozzle 421 picking up the component Wp moves toward the fixed camera 5, and the component Wp faces the fixed camera 5 from above. The fixed camera 5 then captures an image of the surface Sa of the component Wp from below, thereby obtaining a component recognition image Im2. This component recognition image Im2 is transmitted from the fixed camera 5 to the image processing unit 120, and the image processing unit 120 recognizes the position of the component Wp based on the component recognition image Im2.

[0042] Next, the nozzle 421 that picks up the component Wp moves toward the mounting target point 1a of the component Wp and mounts the component Wp at the mounting target point 1a (step S106). The position of the nozzle 421 when mounting the component Wp is controlled by the drive control unit 130 according to the position of the component Wp recognized based on the component recognition image Im2. Steps S103 to S106 are repeated until mounting of the component Wp at all planned mounting target points 1a is completed (until step S107 returns "YES"). When mounting of the component Wp at all planned mounting target points 1a is completed (step S107 returns "YES"), the transport unit 2 transports the board 1 out of the mounting operation position 21 in the board transport direction X (step S108).

[0043] Furthermore, when the fixed camera 5 captures the component recognition image Im2, the calculation unit 110 executes a positional relation information transmission process. Fig. 6 is a flowchart showing a first example of the positional relation information transmission process, and Fig. 7 is a diagram schematically showing the content of the calculation executed in the first example of the positional relation information transmission process in Fig. 6. Note that the calculation unit 110 causes the image processing unit 120 to execute steps S201 to S204 in Fig. 6, and causes the communication unit 150 to execute step S205.

[0044] In step S201, the image processing unit 120 acquires a component recognition image Im2 captured by the fixed camera 5 from the fixed camera 5. As shown in the "Step S201" section of Fig. 7, the component recognition image Im2 shows the surface Sa of the component Wp captured from below by the fixed camera 5. In other words, the component recognition image Im2 shows the outer shape So of the component Wp (in other words, the outline) and the bump pattern P composed of a plurality of bumps B.

[0045] In step S202, the image processing unit 120 calculates the center position Co (x and y coordinates) of the outline So of the part Wp shown in the part recognition image Im2. For example, the geometric center of gravity of the outline So of the part Wp can be calculated as the center position Co.

[0046] In step S203, the image processing unit 120 calculates the center position Cp (xy coordinates) of the bump pattern P shown in the component recognition image Im2. For example, the geometric center of gravity of the bump pattern P can be calculated as the center position Cp. The geometric center of gravity of the bump pattern P may also be calculated as the geometric center of gravity of the geometric centers of gravity of the multiple bumps B that make up the bump pattern P. Alternatively, the center position Cp may be calculated as the geometric center of gravity of a rectangle (the rectangle illustrated by the dashed lines in FIG. 7 ) that circumscribes the bump pattern P and is formed by four sides.

[0047] In step S204, the image processing unit 120 calculates the amount of misalignment d between the center position Co of the outline So of the component Wp and the center position Cp of the bump pattern P. The amount of misalignment d is, for example, a vector quantity. However, the amount of misalignment d may also be a scalar quantity. In this way, the amount of misalignment d of the center position Cp of the bump pattern P relative to the center position Co of the outline So of the component Wp is calculated based on the component recognition image Im2.

[0048] In step S205, the communication unit 150 transmits the positional deviation amount d calculated in step S204 to the communication unit 530 of the visual inspection machine 50 as position-related information.

[0049] The board 1 that has been carried out from the component mounter 10 is carried into the visual inspection machine 50 via the reflow furnace 11. Next, the visual inspection machine 50 will be described in detail.

[0050] Fig. 8 is a block diagram showing a schematic example of a visual inspection machine. The visual inspection machine 50 shown in Fig. 8 includes a transport conveyor 61, an inspection head 62, a drive mechanism 63, and a control unit 500. The control unit 500 controls the transport conveyor 61, the inspection head 62, and the drive mechanism 63 to inspect the visual appearance of the board 1. A component Wp is mounted on the surface 1s of the board 1, and this component Wp is the object of inspection.

[0051] The transport conveyor 61 transports the board 1 along the board transport direction X. Specifically, the transport conveyor 61 transports the board 1 before inspection to an inspection position 611 in the visual inspection machine 50 and holds the board 1 horizontally at the inspection position 611. In this manner, the board 1 is fixed at the inspection position 611 with the front surface 1s of the board 1 on which the component Wp is mounted facing upward. On this board 1, the component Wp is mounted on the mounting target point 1a of the board 1 with the back surface Sb of the component Wp facing upward (the opposite side of the board 1) and the front surface Sa of the component Wp facing downward (toward the board 1). When inspection of the component Wp mounted on the board 1 is completed, the transport conveyor 61 transports the inspected board 1 from the inspection position 611 to the downstream side of the board transport direction X, out of the visual inspection machine 50.

[0052] The inspection head 62 has an inspection camera 621 arranged above the inspection position 611. The optical axis of the inspection camera 621 is parallel to the vertical direction Z, and the inspection camera 621 faces from above the surface 1 s of the board 1, which is held horizontally at the inspection position 611 by the transport conveyor 61. The inspection camera 621 has an imaging field of view V, and can image the range of the board 1 within the imaging field of view V. The resolution of the inspection camera 621 is higher than the resolution of each of the movable camera 356 and the fixed camera 5 that the mounter 10 is equipped with.

[0053] The inspection head 62 also has an illumination 623 that irradiates the imaging field of view V with illumination light. The illumination 623 has, for example, R (red), G (green), and B (blue) LEDs (Light-Emitting Diodes), and irradiates the imaging field of view V with white illumination light from above.

[0054] The drive mechanism 63 supports the inspection head 62 and drives the inspection head 62 by a motor in the board transport direction X, the width direction Y, and the vertical direction Z. By driving the drive mechanism 63, the inspection head 62 moves above the board 1 at the inspection position 611, and can capture a part of the board 1 in the imaging field of view V.

[0055] The control unit 500 has a calculation unit 510, a memory unit 520, and a communication unit 530. The calculation unit 510 is a processor such as a CPU (Central Processing Unit), the memory unit 520 is a storage device such as an SSD (Solid State Drive), and the communication unit 530 communicates with the communication unit 150 of the mounter 10 wirelessly or via a wired connection. The calculation unit 510 controls the visual inspection machine 50, thereby performing inspection. The control unit 500 has an imaging control unit 540 that controls the inspection camera 621, an illumination control unit 550 that controls the illumination 623, and a drive control unit 560 that controls the drive mechanism 63. The control unit 500 also has a display 570 that displays a screen to the operator.

[0056] When the transport conveyor 61 carries the board 1 into the inspection position 611, the calculation unit 510 controls the drive mechanism 63 using the drive control unit 560 to drive the inspection head 62, thereby causing the inspection head 62 to face the component Wp to be inspected among the multiple components Wp mounted on the board 1. As a result, the inspection range including the component Wp and a portion of the surface 1 s of the board 1 surrounding the component Wp falls within the imaging field of view V of the inspection camera 621.

[0057] Fig. 9 is a flowchart showing a first example of component inspection performed by the visual inspection machine of Fig. 8, and Fig. 10 is a diagram schematically showing the content of calculations performed in the first example of component inspection of Fig. 9. The flowchart of Fig. 9 is executed by the calculation unit 510 controlling each unit of the visual inspection machine 50.

[0058] 9 starts, the transport conveyor 61 carries the board 1 into the inspection position 611 (step S301). In step S302, board recognition is performed on the board 1 carried into the inspection position 611. Specifically, the inspection camera 621 faces the fiducial mark attached to the board 1 from above and captures an image of the fiducial mark to obtain a board recognition image Ii1. This board recognition image Ii1 is transmitted from the inspection camera 621 to the calculation unit 510 via the image capture control unit 540, and the calculation unit 510 recognizes the position of the board 1 based on the board recognition image Ii1.

[0059] In step S303, the inspection camera 621 captures an image of the component Wp. That is, the inspection head 62 faces the component Wp to be inspected from above and places the component Wp within the imaging field of view V of the inspection head 62. The inspection head 62 then captures an image of the component Wp within the imaging field of view V from above to obtain a component inspection image Ii2. As shown in the "Step S303" section of FIG. 10 , the component inspection image Ii2 shows the back surface Sb of the component Wp captured by the inspection camera 621. That is, the component inspection image Ii2 shows the outline So of the component Wp. In contrast, the bump pattern P, which is composed of multiple bumps B, is hidden by the component Wp and is therefore not shown in the component inspection image Ii2.

[0060] In step S304, the calculation unit 510 calculates the center position Co (x-y coordinates) of the outline So of the part Wp shown in the part inspection image Ii2. For example, the geometric center of gravity of the outline So of the part Wp can be calculated as the center position Co.

[0061] In step S305, the calculation unit 510 executes a process of reading out the positional relation information. That is, as described above, the communication unit 530 of the visual inspection machine 50 receives the positional relation information from the communication unit 150 of the mounter 10. The positional relation information (positional deviation amount d) received by the communication unit 530 is stored in the storage unit 520. In step S305, the calculation unit 510 reads out the positional relation information (positional deviation amount d) stored in the storage unit 520.

[0062] In step S306, the calculation unit 510 calculates the center position Cp of the bump pattern P of the component Wp mounted on the board 1 (i.e., the component Wp to be inspected) based on the center position Co of the outer shape So of the component Wp obtained from the component inspection image Ii2 and the positional relation information (positional deviation amount d) received from the component mounter 10. In other words, the position shifted by the positional deviation amount d acquired in step S305 from the center position Co calculated based on the component inspection image Ii2 in step S304 is calculated as the center position Cp of the bump pattern P (step S306). Note that in the column "Step S306" in FIG. 10, the bump pattern P hidden by the component Wp is indicated by a dashed line.

[0063] In step S307, the calculation unit 510 calculates, as the mounting position deviation, the amount of positional deviation between the center position of the mounting target point 1a on which the component Wp is mounted and the center position Cp of the bump pattern P calculated in step S306. The center position of the mounting target point 1a is, for example, the center position (geometric center of gravity) of multiple electrodes provided at the mounting target point 1a corresponding to multiple bumps B, and is stored in advance in the storage unit 520. In other words, if there is no mounting position deviation, the position of the bump B and the position of the electrode corresponding to that bump B will match.

[0064] Steps S303 to S307 are repeatedly executed until they are completed (until step S308 is "YES") for all components Wp mounted on the board 1. Then, when steps S303 to S307 are completed for all components Wp (step S308 is "YES"), the transport conveyor 61 transports the board 1 downstream in the board transport direction X from the inspection position 611 (step S309).

[0065] In step S310, the calculation unit 510 displays a screen showing the results of the inspection of the component Wp executed in steps S303 to S308 on the display 570. For example, this screen shows whether or not there is any component Wp whose mounting position deviation amount calculated in step S307 is equal to or greater than a predetermined value.

[0066] According to the embodiment described above, the visual inspection machine 50 (inspection machine) acquires positional relationship information (positional deviation amount d) from the component mounter 10 that mounts the component Wp on the board 1. This positional relationship information indicates the positional relationship between the outer shape of the component Wp and the bump pattern P (pattern) in the component recognition image Im2 (pre-mounting component image). The component recognition image Im2 is acquired by the component mounter 10 capturing an image of the front surface Sa of the component Wp, which has a front surface Sa (first surface) on which the bump pattern P is provided and a back surface Sb (second surface) opposite the front surface Sa. Therefore, the visual inspection machine 50 can confirm the center position Cp (position) of the bump pattern P of the component Wp without capturing an image of the bump pattern P of the component Wp with a camera (steps S303 to S306). As a result, the visual inspection machine 50 can appropriately inspect the position of the bump pattern P of the component Wp.

[0067] The communication unit 530 (information acquisition unit) also acquires, as position-related information, the positional deviation d (outline reference position deviation) of the bump pattern P relative to the outline So of the component Wp, which the component mounter 10 calculated based on the component recognition image Im2. The calculation unit 510 then calculates the center position Co (mounted component outline position) of the outline So of the component Wp mounted on the board 1 based on the component inspection image Ii2 (post-mounted component image) (step S304). Furthermore, the calculation unit 510 calculates the center position Cp (mounted component pattern position) of the bump pattern P of the component Wp mounted on the board 1 based on the center position Co of the outline So of the component Wp calculated from the component inspection image Ii2 and the positional deviation d of the bump pattern P relative to the outline So of the component Wp received from the component mounter 10 (step S306). The calculation unit 510 then inspects the component Wp mounted on the board 1 based on the calculated center position Cp of the bump pattern P (step S307). With this configuration, the visual inspection machine 50 acquires the positional deviation d (outline reference position deviation amount) of the bump pattern P relative to the outline So of the component Wp from the component mounter 10. Therefore, the visual inspection machine 50 can confirm the position (center position Cp) of the bump pattern P of the component Wp without capturing an image of the bump pattern P with a camera (steps S303 to S306). As a result, the visual inspection machine 50 can perform an appropriate inspection of the position of the bump pattern P of the component Wp.

[0068] The bump pattern P also has bumps B (solder bumps). The calculation unit 510 then performs an inspection to measure the amount of misalignment between the bumps B of the component Wp mounted on the substrate 1 and the electrodes provided at the mounting target points 1a on the substrate 1 (step S307). With this configuration, the visual inspection machine 50 can confirm the positions of the bumps B of the component Wp without capturing an image of the bumps B with a camera. As a result, the visual inspection machine 50 can appropriately inspect the misalignment of the bumps B of the component Wp relative to the electrodes on the substrate 1.

[0069] Furthermore, the transport conveyor 61 (substrate loading section) loads the substrate 1 that has been transported from the component mounter 10 and then passed through a reflow furnace 11 that performs reflow on the substrate 1. With this configuration, it becomes possible for the appearance inspection machine 50 to perform an appropriate inspection of the positions of the bump patterns P of the components Wp that have undergone reflow.

[0070] Incidentally, the content calculated in the component mounter 10 in the positional relation information transmission process of Fig. 6 may be changed, for example, as follows. Fig. 11A is a flowchart showing a second example of the positional relation information transmission process, and Fig. 11B is a flowchart showing the positional relation information readout process executed by the visual inspection machine in response to the positional relation information transmission process of Fig. 11A. In other words, the flowchart of Fig. 11B is executed in step S305 of the component inspection of Fig. 9.

[0071] 11A , the calculation unit 110 of the mounter 10 executes steps S201 to S203. Then, the communication unit 150 of the mounter 10 transmits the center position Co of the outer shape So of the component Wp calculated in step S202 and the center position Cp of the bump pattern P calculated in step S203 as positional relationship information to the communication unit 530 of the visual inspection machine 50. In the visual inspection machine 50, the communication unit 530 stores the positional relationship information (center position Co and center position Cp) received. In this way, the visual inspection machine 50 acquires the center position Co and center position Cp calculated by the mounter 10 based on the component recognition image Im2.

[0072] In step S305 of the component inspection performed by the visual inspection machine 50, the calculation unit 510 reads the center position Co and the center position Cp from the storage unit 520 (step S206). Then, the calculation unit 510 calculates the amount of positional deviation d between the center position Co and the center position Cp (step S204). The subsequent steps S306 and S307 are performed based on the amount of positional deviation d thus calculated.

[0073] In this modification, the communication unit 530 (information acquisition unit) acquires, as positional relationship information, the center position Co of the outline So of the component Wp and the center position Cp of the bump pattern P, which the component mounter 10 calculated based on the component recognition image Im2 (pre-mounting component image). In response, the calculation unit 510 calculates the positional deviation d (outline reference position deviation) of the bump pattern P relative to the outline So of the component Wp based on the center position Co of the outline So of the component Wp and the center position Cp of the bump pattern P (step S204). The calculation unit 510 also calculates the center position Co (mounted component outline position) of the outline So of the component Wp mounted on the board 1 based on the component inspection image Ii2 (post-mounting component image). Furthermore, the calculation unit 510 calculates the center position Cp (mounted component pattern position) of the bump pattern P of the component Wp mounted on the substrate 1 based on the center position Co and the positional deviation d (step S306), and performs inspection of the component Wp mounted on the substrate 1 based on the center position Cp of the bump pattern P (step S307). In this configuration, the appearance inspection machine 50 acquires the center position Co of the outer shape So of the component Wp and the center position Cp of the bump pattern P from the component mounter 10. Therefore, the appearance inspection machine 50 can confirm the position of the bump pattern P of the component Wp without capturing an image of the bump pattern P of the component Wp with a camera. As a result, the appearance inspection machine 50 can perform appropriate inspection of the position of the bump pattern P of the component Wp.

[0074] Fig. 12A is a flowchart showing a third example of the positional related information transmission process, and Fig. 12B is a flowchart showing the positional related information readout process executed by the visual inspection machine in response to the positional related information transmission process of Fig. 12A. In other words, the flowchart of Fig. 12B is executed in step S305 of the component inspection of Fig. 9.

[0075] 12A , the calculation unit 110 of the mounter 10 executes step S201. Then, the communication unit 150 of the mounter 10 transmits the component recognition image Im2 acquired in step S201 as positional relation information to the communication unit 530 of the appearance inspection machine 50. In the appearance inspection machine 50, the communication unit 530 stores the positional relation information (component recognition image Im2) received in the storage unit 520.

[0076] In step S305 of component inspection performed by the visual inspection machine 50, the calculation unit 510 reads the component recognition image Im2 from the storage unit 520 (step S207). The calculation unit 510 then calculates the center position Co of the outline So of the component Wp shown in the component recognition image Im2 (step S202). The calculation unit 510 also calculates the center position Cp of the bump pattern P shown in the component recognition image Im2 (step S203). The calculation unit 510 then calculates the amount of positional deviation d between the center position Co and the center position Cp (step S204). The subsequent steps S306 and S307 are performed based on the calculated amount of positional deviation d.

[0077] In this modification, the communication unit 530 (information acquisition unit) acquires the component recognition image Im2 (pre-mounting component image) as position-related information. The calculation unit 510 then calculates the center position Co of the outline So of the component Wp and the center position Cp of the bump pattern P based on the component recognition image Im2 (steps S202 and S203). The calculation unit 510 also calculates the misalignment amount d (outline reference position misalignment amount), which is the amount of misalignment of the bump pattern P relative to the outline So of the component Wp, based on the center position Co of the outline So of the component Wp and the center position Cp of the bump pattern P (step S204). Furthermore, the calculation unit 510 calculates the center position Co (mounted component outline position), which is the position of the outline So of the component Wp mounted on the board 1, based on the component inspection image Ii2 (post-mounting component image) (step S304). The calculation unit 510 also calculates the center position Cp (mounted component pattern position) of the bump pattern P of the component Wp mounted on the substrate 1 based on the center position Co and the positional deviation d (step S306). The calculation unit 510 then inspects the component Wp mounted on the substrate 1 based on the center position Cp of the bump pattern P (step S307). Therefore, the visual inspection machine 50 can confirm the position of the bump pattern P of the component Wp without capturing an image of the bump pattern P with a camera. As a result, the visual inspection machine 50 can perform appropriate inspection of the position of the bump pattern P of the component Wp.

[0078] Fig. 13A is a flowchart showing a second example of component mounting performed by the component mounter of Fig. 2, Fig. 13B is a flowchart showing an example of a simple inspection performed in the second example of component mounting of Fig. 13A, and Fig. 14 is a flowchart showing a second example of component inspection performed by the visual inspection machine of Fig. 8. The difference between the second example of Fig. 13A and the first example of Fig. 5 is the presence or absence of steps S109 and S110, and the difference between the second example of Fig. 14 and the first example of Fig. 9 is the presence or absence of steps S311 and S312. Here, the differences will be mainly described, and similar points will be denoted by corresponding reference numerals and description thereof will be omitted as appropriate.

[0079] 13A, once the component Wp is mounted on the board 1 by the component mounter 10 (step S106), a simple inspection (FIG. 13B) is performed in step S109. This simple inspection is performed under the control of the calculation unit 110 of the component mounter 10. In step S401, the calculation unit 110 performs the same processes as steps S202 to S204 in FIG. 6 on the component recognition image Im2 acquired in step S105 for the component Wp that is the target of the simple inspection, thereby calculating the amount of positional deviation d between the center position Co and the center position Cp indicated by the component recognition image Im2.

[0080] In step S402, the mobile camera 45 faces the component Wp, which is the subject of the simplified inspection, from above and captures an image of the component Wp to obtain a simplified inspection image. This simplified inspection image shows the back surface Sb of the component Wp, similar to the component inspection image Ii2 shown in the "Step S303" section of FIG. 10 . The calculation unit 110 then calculates the center position Co of the outline So shown in the simplified inspection image (step S403). In step S404, the calculation unit 110 calculates the center position Cp of the bump pattern P of the component Wp mounted on the board 1 based on the center position Co calculated in step S403 and the positional deviation d calculated in step S401.

[0081] In step S405, the calculation unit 110 calculates, as the mounting position deviation amount, the amount of positional deviation between the center position of the mounting target point 1a on which the component Wp is mounted and the center position Cp of the bump pattern P calculated in step S404. The mounting position deviation amount calculated in this way is stored in the storage unit 140 as a simple inspection result.

[0082] Once the simplified inspection of step S109 is completed in this manner, the process proceeds to step S107 in FIG. 13A. Steps S103 to S106 and S109 are repeated until they are completed for all planned mounting target points 1a (until step S107 returns "YES"). When steps S103 to S106 and S109 are completed for all planned mounting target points 1a (step S107 returns "YES"), communication unit 150 transmits the results of the simplified inspection to communication unit 530 of visual inspection machine 50 (step S110). Then, transport unit 2 transports board 1 from mounting operation position 21 in board transport direction X (step S108).

[0083] 14 , after steps S303 to S307 are completed for all components Wp ("YES" in step S308), the calculation unit 510 calculates the difference between the mounting position misalignment amount determined in step S307 by the visual inspection machine 50 and the mounting position misalignment amount indicated by the simplified inspection results received from the component mounter 10 for each component Wp, and checks whether there are any components Wp for which the difference is equal to or greater than a threshold. If there are any components Wp for which the difference is equal to or greater than a threshold, the calculation unit 510 determines that notification to the operator is necessary ("YES" in step S311) and displays a screen on the display 570 showing the components Wp for which the difference is equal to or greater than the threshold (step S312). On the other hand, if there are no components Wp for which the difference is equal to or greater than the threshold, the calculation unit 510 determines that notification to the operator is unnecessary ("NO" in step S311).

[0084] In the above example, the communication unit 530 (information acquisition unit) receives the simplified inspection result (mounter inspection result) from the communication unit 150 of the mounter 10 (step S110). This simplified inspection result indicates the result of an inspection of the component Wp mounted on the board 1 by the mounter 10 based on a simplified inspection image of the component Wp mounted on the board 1 captured by the mobile camera 45 and the component recognition image Im2. With this configuration, the simplified inspection result can be referenced in the visual inspection machine 50.

[0085] The system is also provided with a display 570 (notification unit) that notifies the operator. In response, if the difference between the mounting position deviation amount (inspection machine inspection result) calculated by the calculation unit 510 in step S307 and the mounting position deviation amount indicated by the simplified inspection result is equal to or greater than a threshold value, the calculation unit 510 causes the display 570 to execute a notification (steps S311 and S312). This configuration allows the operator to notice abnormalities related to component mounting in the component mounter 10 or on the transport path of the board 1 from the component mounter 10 to the visual inspection machine 50 (in other words, various abnormalities that may cause changes in the mounting position between the time the simplified inspection is performed by the component mounter 10 and the time the component inspection is performed by the visual inspection machine 50).

[0086] As described above, in the above embodiment, the bump pattern P corresponds to an example of a "pattern" of the present invention, the front surface Sa corresponds to an example of a "first surface" of the present invention, the back surface Sb corresponds to an example of a "second surface" of the present invention, the component Wp corresponds to an example of a "component" of the present invention, the component recognition image Im2 corresponds to an example of a "pre-mounting component image" of the present invention, the component mounter 10 corresponds to an example of a "component mounter" of the present invention, the transport conveyor 61 corresponds to an example of a "board carry-in section" of the present invention, the positional deviation amount d, the center position Co and the center position Cp, or the component recognition image Im2 corresponds to an example of "position-related information" of the present invention, the communication unit 530 corresponds to an example of an "information acquisition unit" of the present invention, the component inspection image Ii2 corresponds to an example of a "post-mounting component image" of the present invention, the inspection camera 621 corresponds to an example of an "inspection camera" of the present invention, the calculation unit 510 corresponds to an example of a "calculation unit" of the present invention, and the appearance inspection machine 50 corresponds to an "inspection machine" of the present invention. ", the positional deviation amount d corresponds to an example of the "outer shape reference position deviation amount" of the present invention, the center position Co of the outer shape So of the component Wp shown in the component inspection image Ii2 corresponds to an example of the "mounted component outer shape position" of the present invention, the center position Cp of the bump pattern P corresponds to an example of the "mounted component pattern position" of the present invention, the bump B corresponds to an example of a "solder bump" of the present invention, the simplified inspection result corresponds to an example of the "mounting machine inspection result" of the present invention, the communication unit 530 corresponds to an example of the "notification unit" of the present invention, the reflow furnace 11 corresponds to an example of the "reflow furnace" of the present invention, the component supply mechanism 3 corresponds to an example of the "component supply unit" of the present invention, the removal head 36 corresponds to an example of the "mounting head" of the present invention, the fixed camera 5 corresponds to an example of the "component recognition camera" of the present invention, the communication unit 150 corresponds to an example of the "information transmission unit" of the present invention, and the board production system S corresponds to an example of the "board production system" of the present invention.

[0087] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, the specific configuration of the component mounter 10 or the visual inspection machine 50 can be modified in various ways. For example, the visual inspection machine 50 may further include a function for acquiring a three-dimensional image of the component Wp.

[0088] DESCRIPTION OF SYMBOLS 10...Component mounter 11...Reflow furnace 150...Communication unit 3...Component supply mechanism 36...Removal head 5...Fixed camera 50...Appearance inspection machine 510...Calculation unit 530...Communication unit 61...Transport conveyor 621...Inspection camera B...Bump Co...Center position Cp...Center position Ii2...Component inspection image Im2...Component recognition image P...Bump pattern S...Substrate production system Sa...Front surface Sb...Back surface So...Outline Wp...Component d...Positional deviation amount

Claims

1. An inspection machine comprising: a board loading unit that loads a board on which a component has been mounted from a component mounter that images a first surface of a component having a pattern and a second surface opposite the first surface to obtain a pre-mounting component image, and then mounts the component on the board with the first surface facing the board; an information acquisition unit that acquires positional relationship information from the component mounter that indicates the positional relationship between the outline of the component and the pattern in the pre-mounting component image; an inspection camera that images the second surface of the component mounted on the board loaded by the board loading unit to obtain a post-mounting component image; and a calculation unit that inspects the component mounted on the board based on the positional relationship information and the post-mounting component image obtained by the information acquisition unit.

2. The inspection machine described in claim 1, wherein the information acquisition unit acquires as the position-related information an amount of deviation from the outline of the component, which is the amount of deviation of the pattern from the outline of the component, calculated by the component mounter based on the pre-mounting component image, and the calculation unit calculates a mounted component outline position, which is the position of the outline of the component mounted on the board, based on the mounted component image, calculates a mounted component pattern position, which is the position of the pattern of the component mounted on the board, based on the mounted component outline position and the amount of deviation from the outline reference position, and inspects the component mounted on the board based on the mounted component pattern position.

3. The inspection machine according to claim 1, wherein the information acquisition unit acquires the center position of the component's outline and the center position of the pattern calculated by the component mounter based on the pre-mounting component image as the positional relationship information; the calculation unit calculates an outline reference position deviation amount, which is the amount of positional deviation of the pattern from the component's outline, based on the center position of the component's outline and the center position of the pattern; calculates a mounted component outline position, which is the position of the outline of the component mounted on the board, based on the mounted component image; calculates a mounted component pattern position, which is the position of the pattern of the component mounted on the board, based on the mounted component outline position and the outline reference position deviation amount; and inspects the component mounted on the board based on the mounted component pattern position.

4. The inspection machine described in claim 1, wherein the information acquisition unit acquires the pre-mounting component image as the position-related information, and the calculation unit calculates the center position of the component's outline and the center position of the pattern based on the pre-mounting component image, calculates an outline reference position deviation amount, which is the amount of positional deviation of the pattern from the component's outline, based on the center position of the component's outline and the center position of the pattern, calculates a mounted component outline position, which is the position of the outline of the component mounted on the board, based on the mounted component image, calculates a mounted component pattern position, which is the position of the pattern of the component mounted on the board, based on the mounted component outline position and the outline reference position deviation amount, and inspects the component mounted on the board based on the mounted component pattern position.

5. An inspection machine according to any one of claims 1 to 4, wherein the pattern has solder bumps, and the calculation unit performs the inspection by measuring the amount of misalignment between the solder bumps of the component mounted on the board and electrodes provided on the board.

6. An inspection machine as described in any one of claims 1 to 5, wherein the information acquisition unit acquires from the component mounter a mounter inspection result indicating the result of inspecting the component mounted on the board based on an image captured by the component mounter of the component mounted on the board and the pre-mounting component image.

7. An inspection machine according to claim 6, further comprising a notification unit that notifies an operator, wherein the calculation unit causes the notification unit to execute a notification when the difference between the inspection machine inspection result, which is the result of the inspection of the components mounted on the board performed by the calculation unit, and the mounting machine inspection result is equal to or greater than a predetermined value.

8. An inspection machine according to any one of claims 1 to 7, wherein the board loading section loads the board after it has been transported from the component mounting machine and passed through a reflow furnace that performs reflow on the board.

9. A component mounter comprising: a component supply unit that supplies components having a first surface on which a pattern is provided and a second surface opposite to the first surface; a mounting head that transfers the components from the component supply unit to a board; a component recognition camera that captures an image of the first surface of the component before it is transferred to the board to obtain a pre-mounted component image; and an information transmission unit that transmits positional information indicating the positional relationship between the outline of the component and the pattern in the pre-mounted component image to an inspection machine that inspects the component mounted on the board.

10. A board production system comprising: a component mounter; and an inspection machine, wherein the component mounter has a component supply unit that supplies components having a first surface on which a pattern is formed and a second surface opposite to the first surface; a mounting head that transfers the components from the component supply unit to a board; a component recognition camera that captures an image of the first surface of the component to obtain a pre-mounted component image before it is transferred to the board; and an information transmission unit that transmits positional information that indicates the positional relationship between the outline of the component and the pattern in the pre-mounted component image to an inspection machine that inspects the components mounted on the board, and the inspection machine has a board carry-in unit that carries in the board on which the components are mounted from the component mounter, an information acquisition unit that acquires the positional information from the information transmission unit, an inspection camera that captures an image of the second surface of the component mounted on the board carried in by the board carry-in unit to obtain a post-mounted component image, and a calculation unit that inspects the components mounted on the board based on the positional information and the post-mounted component image acquired by the information acquisition unit.

11. An inspection method comprising the steps of: capturing an image of a first surface of a component having a pattern and a second surface opposite the first surface to obtain a pre-mounting component image; and then, from a component mounter that mounts the component on a board with the first surface facing the board, obtaining positional relationship information indicating the positional relationship between the component's outline and the pattern in the pre-mounting component image; capturing an image of the second surface of the component mounted on the board to obtain a post-mounting component image; and inspecting the component mounted on the board based on the positional relationship information and the post-mounting component image.

Images