Work machine and lead component mounting method

Abstract

This work machine in which a lead of a lead component held by a holding tool having a pusher is inserted into a through-hole of a substrate, and the holding tool is raised while the pusher is pushing the component body of the lead component after the pusher has pushed the component body toward the substrate.

Description

Work machine and lead component mounting method

[0001] The present invention relates to a work machine or the like that inserts leads of a lead component held by a holder into through holes in a substrate.

[0002] The following patent document describes a technique for inserting leads of a lead component held by a holder into through holes in a substrate.

[0003] International Publication No. 2013 / 183123

[0004] An object of the present specification is to properly insert the leads of a lead component held by a holder into through holes in a substrate.

[0005] In order to solve the above problems, this specification discloses a work machine in which the leads of a lead component held by a holder having a pusher are inserted into through holes in a substrate, the pusher pushes the component body of the lead component toward the substrate, and then the holder rises while the pusher is still pushing the component body.

[0006] Furthermore, in order to solve the above-mentioned problems, this specification discloses a lead component mounting method for mounting a lead component on a substrate by performing the following steps: a lead insertion step in which a holder having a pusher inserts the lead of a lead component held by the holder into a through-hole in a substrate and stops the insertion; a lead component pushing step in which, after the lead insertion step, the pusher of the stopped holder pushes the component body of the lead component whose lead has been inserted into the through-hole in the substrate toward the substrate; a holder lifting step in which, after the lead component pushing step, the holder lifts while the pusher is pushing the component body; and a holder stopping step in which, after the holder lifting step, the lifting of the holder stops with the pusher in contact with the component body.

[0007] According to the present disclosure, after the pusher pushes the component body of the lead component toward the substrate, the holder rises while the pusher is still pushing the component body, thereby allowing the leads of the lead component held by the holder to be properly inserted into the through holes in the substrate.

[0008] 1 is a perspective view of a component mounter. 2 is a perspective view of a component mounting device of the component mounter. 3 is a side view of a component holder. 4 is a front view of the component holder. 5 is a side view of the component holder. 6 is a perspective view of a transport device and a clinching device. 7 is a perspective view of the clinching device. 8 is a perspective view of a clinching unit. 9 is a perspective view of a bending body. 10 is a block diagram of a control device. 11 is a schematic view of a lead component having leads inserted into through holes in a circuit substrate. 12 is a schematic view of a lead component having leads inserted into through holes in a circuit substrate. 13 is a schematic view of a lead component having leads inserted into through holes in a circuit substrate. 14 is a schematic view of a lead component having leads inserted into through holes in a circuit substrate. 15 is a schematic view of a lead component having leads inserted into through holes in a circuit substrate.

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as modes for carrying out the present invention.

[0010] 1 shows a component mounter 10. The component mounter 10 is a device for performing the operation of mounting components on a circuit board 12. The component mounter 10 includes a device main body 20, a substrate transport / holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a bulk component supply device 32, a clinching device (see FIG. 6) 34, and a control device (see FIG. 10) 36. The circuit board 12 may be a circuit board or a substrate with a three-dimensional structure, and the circuit board may be a printed wiring board or a printed circuit board.

[0011] The device main body 20 is composed of a frame 40 and a beam 42 suspended from the frame 40. The substrate transport and holding device 22 is disposed in the center of the frame 40 in the front-to-rear direction and includes a transport device 50 and a clamping device 52. The transport device 50 transports the circuit board 12, and the clamping device 52 holds the circuit board 12. As a result, the substrate transport and holding device 22 transports the circuit board 12 and securely holds the circuit board 12 at a predetermined position. In the following description, the transport direction of the circuit board 12 is referred to as the X-direction, the horizontal direction perpendicular to that direction is referred to as the Y-direction, and the vertical direction is referred to as the Z-direction. In other words, the width direction of the component mounter 10 is the X-direction, and the front-to-rear direction is the Y-direction.

[0012] The component mounting device 24 is disposed on the beam 42 and has two work heads 60, 62 and a work head moving device 64. The work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The two work heads 60, 62 are moved together to any position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. As shown in FIG. 2, the work heads 60, 62 are detachably attached to sliders 74, 76, and the Z-direction moving device 72 moves the sliders 74, 76 individually in the vertical direction. In other words, the work heads 60, 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] As shown in Fig. 2, a component holder 78 is attached to the lower end surfaces of the work heads 60, 62. The component holder 78 holds the leads of lead components, and as shown in Figs. 3 to 5, includes a main body 80, a pair of claws 82, an auxiliary plate 84, an opening / closing device (see Fig. 10) 86, a pusher 88, and an air cylinder (see Fig. 10) 90. Fig. 3 is a side view of the component holder 78, Fig. 4 is a front view of the component holder 78, and Fig. 5 is a side view of the component holder 78 holding a lead component 92.

[0014] The pair of claws 82 are held by the main body 80 so that they can swing. Operation of the opening / closing device 86 causes the pair of claws 82 to swing, moving their tips closer to or farther apart. Recesses (not shown) of a size corresponding to the diameter of the leads 94 of the lead component 92 are formed inside the pair of claws 82. The auxiliary plate 84 is positioned between the pair of claws 82 and swings together with the pair of claws 82. At this time, the auxiliary plate 84 enters between the pair of leads 94 of the lead component 92. As the pair of claws 82 approach the auxiliary plate 84, each of the pair of leads 94 of the lead component 92 is sandwiched from both sides by the recesses of the claws 82 and the auxiliary plate 84. As a result, the lead component 92 is held by the pair of claws 82 at the base ends of the leads 94, i.e., the ends of the lead component 92 closest to the component main body 96, as shown in FIG. 5 .

[0015] The pusher 88 is held by the main body 80 so as to be movable in the vertical direction, and is biased upward by the elastic force of a coil spring (not shown). The pusher 88 is lowered by the operation of an air cylinder 90. When the pusher 88 descends, it comes into contact with the component body 96 of the lead component 92 held by the pair of claws 82, and presses the lead component 92 downward. In other words, the pusher 88 is positioned above the lead component 92 held by the pair of claws 82 due to the elastic force of the coil spring, and is lowered by the force of the air, pressing the lead component 92 held by the pair of claws 82 downward. The range of elevation of the pusher 88 is restricted by a stopper (not shown).

[0016] 2, the mark camera 26 is attached to the slider 74 facing downward, and moves in the X, Y, and Z directions together with the work head 60. This allows the mark camera 26 to capture an image of any position on the frame 40. As shown in FIG. 1, the part camera 28 is disposed on the frame 40 between the substrate material conveying and holding device 22 and the part supplying device 30 facing upward. This allows the part camera 28 to capture an image of a part held by a part holder 78 of the work heads 60, 62.

[0017] The component supply device 30 is disposed at one end of the frame 40 in the front-to-rear direction. The component supply device 30 has a tray-type component supply device 97 and a feeder-type component supply device (see FIG. 10) 98. The tray-type component supply device 97 is a device that supplies components placed on a tray. The feeder-type component supply device 98 is a device that supplies components using a tape feeder (not shown) or a stick feeder (not shown).

[0018] The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-to-rear direction. The bulk component supply device 32 aligns multiple components scattered loosely and supplies the aligned components. In other words, it aligns multiple components in any orientation into a predetermined orientation and supplies the components in the predetermined orientation. Components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

[0019] As shown in FIG. 6 , the clinching device 34 is disposed between a pair of conveying lanes 99 (only one of the pair of conveying lanes is shown in FIG. 6 ) of the conveying device 50. As shown in FIG. 7 , the clinching device 34 includes a clinching unit 100 and a unit moving device 102. The clinching unit 100 is a device that bends leads 94 inserted into through holes (see FIG. 11 ) formed in the circuit board 12 held by the clamping device 52. As shown in FIG. 8 , the clinching unit 100 includes a unit main body 110 and a pair of slide bodies 112. A slide rail 116 is disposed at the upper end of the unit main body 110 so as to extend linearly, and the pair of slide bodies 112 are slidably supported by the slide rail 116. This allows the pair of slide bodies 112 to approach and move away from each other linearly. The distance between the pair of slide bodies 112 is controlled by driving an electromagnetic motor 118 (see FIG. 10).

[0020] A pair of bending bodies 120 are fixed to the upper surfaces of the pair of slide bodies 112. As shown in FIG. 9 , each of the pair of bending bodies 120 is composed of a main body 122, a bending rod 124, and a support pin 126. The main body 122 is generally rectangular parallelepiped-shaped and is fixed to the upper surface of the slide body 112. The bending rod 124 is generally rod-shaped and is erected on the upper surfaces of the pair of main bodies 122 so that the pair of bending rods 124 face each other. A notch 130 is formed at the upper end of each bending rod 124. The notch 130 opens to the top end surface and two adjacent side surfaces of the bending rod 124. The notch 130 of each bending rod 124 is formed so as to face in opposite directions. A strain gauge 132 is disposed near the center of the bending rod 124 in the vertical direction. The strain gauge 132 is generally in the form of a thin film and is attached to the side of the bending rod 124. The strain gauge 132 has a metal thin film resistor (not shown), and by detecting changes in the electrical resistance of the resistor due to deformation, the amount of strain of the resistor, i.e., the amount of displacement, is calculated. In this way, the strain gauge 132 detects the strain, deformation, etc. of the bending rod 124. Furthermore, the support pin 126 is erected on the top surface of the main body 122 next to the bending rod 124. The length of the support pin 126 is several millimeters longer than the length of the bending rod 124. Therefore, the upper end of the support pin 126 extends slightly upward beyond the upper end of the bending rod 124.

[0021] As shown in FIG. 7 , the unit moving device 102 includes an X-direction moving device 150, a Y-direction moving device 152, a Z-direction moving device 154, and a rotation device 156. The X-direction moving device 150 includes a slide rail 160 and an X-slider 162. The slide rail 160 is disposed so as to extend in the X direction, and the X-slider 162 is slidably held on the slide rail 160. The X-slider 162 moves in the X direction by driving an electromagnetic motor (see FIG. 10 ) 164. The Y-direction moving device 152 includes a slide rail 166 and a Y-slider 168. The slide rail 166 is disposed on the X-slider 162 so as to extend in the Y direction, and the Y-slider 168 is slidably held on the slide rail 166. The Y-slider 168 moves in the Y direction by driving an electromagnetic motor (see FIG. 10 ) 170. Z-direction movement device 154 includes a slide rail 172 and a Z slider 174. Slide rail 172 is disposed on Y slider 168 so as to extend in the Z direction, and Z slider 174 is slidably held on slide rail 172. Z slider 174 is moved in the Z direction by the drive of an electromagnetic motor 176 (see FIG. 10).

[0022] The rotation device 156 also has a generally disk-shaped rotation table 178. The rotation table 178 is supported by a Z-slider 174 so as to be rotatable about its vertical axis, and is rotated by driving an electromagnetic motor (see FIG. 10 ) 180. The clinch unit 100 is disposed on the rotation table 178. With this structure, the clinch unit 100 can be moved to any position and positioned at a predetermined position by the X-direction movement device 150, the Y-direction movement device 152, and the Z-direction movement device 154, and can also be rotated at any angle and positioned at a predetermined angle by the rotation device 156. This allows the clinch unit 100 to be positioned at any position and angle below the circuit board 12 held by the clamp device 52.

[0023] As shown in FIG. 10 , the control device 36 includes a controller 190, multiple drive circuits 192, and an image processing device 196. The multiple drive circuits 192 are connected to the transport device 50, clamp device 52, work heads 60 and 62, work head moving device 64, tray-type component supply device 97, feeder-type component supply device 98, bulk component supply device 32, and electromagnetic motors 118, 164, 170, 176, and 180. The controller 190, which includes a CPU, ROM, RAM, and other components, is primarily a computer and is connected to the multiple drive circuits 192. This allows the controller 190 to control the operation of the substrate transport and holding device 22, component mounting device 24, and other components. The controller 190 is also connected to the image processing device 196. The image processing device 196 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 190 acquires various information from the image data. The controller 190 is also connected to the strain gauges 132. As described above, the strain gauge 132 detects the amount of displacement based on the electrical resistance caused by the deformation of the resistor. Therefore, the strain gauge 132 outputs the detected amount of displacement to the controller 190, and the controller 190 detects the strain, deformation, etc. of the bending rod 124 based on the acquired amount of displacement.

[0024] With the above-described configuration, the component mounter 10 mounts components onto the circuit board 12 held by the substrate conveying and holding device 22. The component mounter 10 is capable of mounting various components onto the circuit board 12, but the following describes the case where a lead component 92 is mounted onto the circuit board 12.

[0025] Specifically, the conveying device 50 of the substrate conveying and holding device 22 conveys the circuit board 12 to the work position, where the clamping device 52 securely holds the circuit board 12. Next, the mark camera 26 moves above the circuit board 12 and captures an image of the circuit board 12. This allows the controller 190 to acquire information regarding the holding position of the circuit board 12, etc. Additionally, the component supply device 30 or the bulk component supply device 32 supplies lead components 92 at a predetermined supply position. Then, either the work head 60, 62 moves above the component supply position, and the component holder 78 uses the claws 82 to hold the leads 94 of the lead components 92.

[0026] Next, the work heads 60, 62 holding the lead component 92 move above the part camera 28, which captures an image of the lead component 92 held by the component holder 78. This allows the controller 190 to acquire information regarding the component holding position, etc. Next, the work heads 60, 62 holding the lead component 92 move above the circuit board 12, correcting any errors in the holding position of the circuit board 12, errors in the holding position of the component, etc. Then, the leads 94 of the lead component 92 held by the component holder 78 are inserted into the through-holes 104 formed in the circuit board 12. At this time, the clinch unit 100 is moving below the circuit board 12.

[0027] Specifically, in the clinch unit 100, the pair of sliders 112 are moved and positioned by the operation of the electromagnetic motor 118 so that the distance between the notched holes 130 of the pair of bending rods 124 is the same as the distance between the two through holes 104 formed in the circuit board 12. In addition, the rotation device 156 is operated to position the pair of bending rods 124 so that the direction in which the two through holes 104 of the circuit board 12 are aligned coincides with the direction in which the notched holes 130 of the pair of bending rods 124 are aligned.

[0028] Then, by operating the X-direction moving device 150 and the Y-direction moving device 152, the clinch unit 100 is moved and positioned so that the coordinates in the X and Y directions of the notched holes 130 in the bending rod 124 coincide with the coordinates in the X and Y directions of the through-holes 104 in the circuit board 12. As a result, by moving the clinch unit 100 along the X and Y directions, the notched holes 130 in the pair of bending rods 124 and the two through-holes 104 in the circuit board 12 are positioned so that they overlap in the vertical direction.

[0029] Next, the clinch unit 100 is raised and positioned by operation of the Z-direction movement device 154 so that the upper ends of the support pins 126 contact the underside of the circuit board 12 or are positioned close to and slightly below the underside of the circuit board 12. In this way, by controlling the operations of the X-direction movement device 150, the Y-direction movement device 152, the Z-direction movement device 154, and the rotation device 156, the clinch unit 100 is positioned below the circuit board 12 with the notched holes 130 of the pair of bending rods 124 and the two through-holes 104 of the circuit board 12 aligned in the vertical direction.

[0030] Then, the Z-direction moving device 72 is operated to lower the work heads 60, 62, thereby inserting the leads 94 of the lead component 92 held by the component holder 78 into the through-holes 104 of the circuit board 12 and stopping the insertion. At this time, the component holder 78 releases the leads 94 from the claws 82, and the pusher 88 of the component holder 78 descends, pressing the lead component 92 toward the circuit board 12. As a result, the component holder 78 inserts the leads 94 of the lead component 92 all the way into the through-holes 104, and the bottom surface of the component body 96 contacts the top surface of the circuit board 12. Note that when the component holder 78 presses the lead component 92 with the pusher 88, the circuit board 12 is pressed downward, but the support pins 126 support the bottom surface of the circuit board 12.

[0031] When the component holder 78 inserts the leads 94 of the lead component 92 into the through-holes 104 of the circuit board 12 in this manner, the lower ends of the leads 94 are inserted into the notched holes 130 of the bent rods 124, as shown in FIG. 11 . The pair of sliding bodies 112 then slide apart due to the operation of the electromagnetic motor 118. At this time, the pair of bending rods 124 also slide apart along with the pair of sliding bodies 112, causing the pair of leads 94 to come into contact with the inner walls defining the pair of notched holes 130 and bend apart from each other. This prevents the leads 94 from slipping out of the through-holes 104, and mounts the lead component 92 on the circuit board 12. Note that, as shown in FIG. 8 , a support pin 126 is also fixed to the main body 122 to which the bending rods 124 are fixed. Therefore, when the sliding body 112 slides, not only the bending rods 124 but also the support pins 126 slide together with the sliding body 112.

[0032] Furthermore, the clinch unit 100 can attach the lead components 92 not only with the pair of leads 94 bent in directions away from each other, but also with the pair of leads 94 bent in directions toward each other. Specifically, when the clinch unit 100 moves below the through-hole 104 of the circuit board 12, the pair of sliders 112 are moved and positioned by operation of the electromagnetic motor 118 so that the distance between the pair of bending rods 124 is longer than the distance between the two through-holes 104 of the circuit board 12. Furthermore, the clinch unit 100 is moved and positioned by operation of the X-direction moving device 150 and the Y-direction moving device 152 so that the coordinates in the X and Y directions of the pair of bending rods 124 sandwich the coordinates in the X and Y directions of the two through-holes 104 of the circuit board 12. Furthermore, by operating the Z-direction moving device 154, the clinch unit 100 is raised and positioned so that the upper ends of the support pins 126 contact the lower surface of the circuit board 12 or are positioned close to and slightly below the lower surface of the circuit board 12.

[0033] Next, the Z-direction moving device 72 is operated to lower the work heads 60, 62, causing the component holder 78 to insert the leads 94 of the lead component 92 into the through-holes 104 of the circuit board 12 and stop. The pusher 88 of the component holder 78 is then lowered, pressing the lead component 92 toward the circuit board 12. As a result, as shown in FIG. 12 , the lower ends of the pair of leads 94 are inserted between the pair of bending rods 124. The electromagnetic motor 118 then operates to slide the pair of sliding bodies 112 toward each other. At this time, the pair of bending rods 124 also slide toward each other along with the pair of sliding bodies 112, causing the pair of leads 94 to come into contact with the outer wall surfaces of the pair of bending rods 124 and bend toward each other. This allows the lead component 92 to be mounted with the pair of leads 94 bent toward each other.

[0034] Furthermore, the clinch unit 100 can not only attach the lead component 92 to the circuit board 12 with the pair of leads 94 bent in directions that move them apart or towards each other, but can also attach the lead component 92 to the circuit board 12 with the pair of leads 94 bent in the same direction. Specifically, when the controller 190 moves the clinch unit 100 below the through-hole 104 of the circuit board 12, it operates the electromagnetic motor 118 to move and position the pair of sliders 112 so that the distance between the pair of bending rods 124 is longer than the distance between the two through-holes 104 of the circuit board 12. The controller 190 also operates the X-direction movement device 150 and the Y-direction movement device 152 to move and position the clinch unit 100 so that the coordinates in the X and Y directions of the notched holes 130 of one of the pair of bending rods 124 are aligned with the coordinates in the X and Y directions of one of the two through holes 104 in the circuit board 12, and the coordinates in the X and Y directions of the other of the pair of bending rods 124 are positioned outside the coordinates in the X and Y directions of the other of the two through holes 104 in the circuit board 12. The controller 190 also operates the Z-direction movement device 154 to lift and position the clinch unit 100 so that the upper ends of the support pins 126 are in contact with the underside of the circuit board 12 or are positioned close to and slightly below the underside of the circuit board 12.

[0035] Next, the controller 190 activates the Z-direction moving device 72 to lower the work heads 60, 62, thereby inserting the leads 94 of the lead component 92 held by the component holder 78 into the through-holes 104 of the circuit board 12, and then stops the lowering of the work heads 60, 62. The pusher 88 of the component holder 78 then lowers, pressing the lead component 92 toward the circuit board 12. As a result, as shown in FIG. 13 , one lower end of the pair of leads 94 is inserted into one of the notched holes 130 of the pair of bending rods 124, and the other lower end of the pair of leads 94 faces the outer wall surface of the other bending rod 124 where the notched hole 130 is not formed. The controller 190 then activates the X-direction moving device 150 and the Y-direction moving device 152 to move the clinch unit 100 so as to move the pair of bending rods 124 from one side to the other. At this time, as the pair of bending rods 124 both move in one direction, one of the pair of leads 94 comes into contact with the inner wall surface defining one of the notched holes 130 of the pair of bending rods 124, and the other of the pair of leads 94 comes into contact with the outer wall surface of the other of the pair of bending rods 124, thereby bending the pair of leads 94 in one direction. This allows the lead component 92 to be mounted on the circuit board 12 with the pair of leads 94 bent in the same direction.

[0036] In this way, the clinch unit 100 can bend the pair of leads 94 in either the direction of approaching or the direction of separating by bringing the bending rod 124 into contact with the leads 94 inserted into the through-holes 104 of the circuit board 12. As described above, the bending rod 124 is provided with a strain gauge 132, and strain, deformation, etc. of the bending rod 124 can be detected based on the detection value of the strain gauge 132. Therefore, when the controller 190 determines whether the clinch unit 100 has bent the leads 94, it does so based on the detection value of the strain gauge 132.

[0037] Specifically, when the electromagnetic motor 118 is operated to bring the bending rod 124 into contact with the leads 94 and bend it, or when the X-direction moving device 150 and the Y-direction moving device 152 are operated to bring the bending rod 124 into contact with the leads 94 and bend it, the controller 190 determines whether the detection value of the strain gauge 132 is equal to or greater than a predetermined value. At this time, if the detection value of the strain gauge 132 is equal to or greater than the predetermined value, the controller 190 determines that the bending rod 124 is distorted, deformed, etc., and that the bending rod 124 has come into contact with the leads 94 and bent them. On the other hand, if the detection value of the strain gauge 132 is less than the predetermined value, the controller 190 determines that the bending rod 124 is not distorted, deformed, etc., and that the bending rod 124 is not in contact with the leads 94 and has not bent them. If the controller 190 determines that the bending rod 124 has bent the lead 94, the component mounter 10 continues the component mounting operation, and if the controller 190 determines that the bending rod 124 has not bent the lead 94, the component mounter 10 stops the component mounting operation and reports an error.

[0038] However, when the component holder 78 inserts the leads 94 of the lead component 92 into the through-hole 104 of the circuit board 12, the pusher 88 presses the lead component 92 toward the circuit board 12, which may cause the circuit board 12 to warp downward. In such a case, the underside of the circuit board 12 may come into contact with the bending rod 124, which may result in erroneous detection by the strain gauge 132. Specifically, when the component holder 78 inserts the leads 94 of the lead component 92 into the through-hole 104 of the circuit board 12 and the pusher 88 presses the lead component 92 toward the circuit board 12, the lower end of the pusher 88 descends to the first height 200, as shown in FIG. 14 , allowing the leads 94 of the lead component 92 pressed toward the circuit board 12 by the pusher 88 to be inserted all the way into the through-hole 104 of the circuit board 12. Note that first height 200 is a height above the upper surface of circuit board 12 by a distance corresponding to the height dimension of component body 96 of lead component 92. However, in order to reliably insert leads 94 all the way into through-hole 104 of circuit board 12, the lower end of pusher 88 that pushes lead component 92 must be lowered to second height 210, which is below first height 200, as shown in Figure 15. In this way, by lowering the lower end of pusher 88 to second height 210, leads 94 of lead component 92 can be reliably inserted all the way into through-hole 104 of circuit board 12.

[0039] However, when the lower end of the pusher 88 descends to a second height 210 below the first height 200, the circuit board 12 is pushed downward by the lead components 92 and warps downward. At this time, the lower surface of the circuit board 12 comes into contact with the upper end of the bending rod 124. Although the support pin 126 is omitted in the figure, a support pin 126 is provided next to the bending rod 124 and supports the lower surface of the circuit board 12. However, the circuit board 12 warps in areas not supported by the support pin 126, and therefore the lower surface of the circuit board 12 not supported by the support pin 126 comes into contact with the upper end of the bending rod 124.

[0040] In this manner, when the bending rod 124 slides to bend the leads 94 inserted into the through holes 104 of the circuit board 12 while the lower surface of the circuit board 12 is in contact with the tip of the bending rod 124, a load is applied to the tip of the bending rod 124 that is in contact with the lower surface of the circuit board 12, causing distortion, deformation, etc. in the bending rod 124. For this reason, when the bending rod 124 slides to bend the leads 94 inserted into the through holes 104 of the circuit board 12 while the lower surface of the circuit board 12 is in contact with the tip of the bending rod 124, the detection value of the strain gauge 132 becomes equal to or greater than a predetermined value, and the controller 190 determines that the bending rod 124 has bent the leads 94. In other words, when the bending rod 124 slides to bend the leads 94 while the lower surface of the circuit board 12 is in contact with the tip of the bending rod 124, the controller 190 determines that the bending rod 124 has bent the leads 94 based on the detection value of the strain gauge 132, even if the bending rod 124 does not bend the leads 94. In such a case, even though the leads 94 are not bent appropriately, the mounter 10 does not notify of the error, which is undesirable.

[0041] Furthermore, the bottom surface of the circuit board 12, which is warped downward, is supported by support pins 126, and a large load is applied to the support pins 126 that support the bottom surface of the circuit board 12. As shown in FIG. 8 , the support pins 126 are fixed to the main body 122 to which the bending rods 124 are fixed, and therefore, when the slider 112 slides, the support pins 126 also slide together with the bending rods 124. In other words, when the bending rods 124 are slid to bend the leads 94 inserted into the through holes 104 of the circuit board 12, the support pins 126 also slide together with the bending rods 124. At this time, the tips of the support pins 126 are in contact with the bottom surface of the circuit board 12, and a large load is applied to the support pins 126 from the circuit board 12, so there is a risk that the bottom surface of the circuit board 12 will be damaged by the tips of the support pins 126.

[0042] In consideration of this, the pusher 88 is lowered to the second height 210 to insert the leads 94 of the lead component 92 all the way into the through-holes 104 of the circuit board 12, and after the component holder 78 is raised, the clinch unit 100 performs the bending operation on the leads 94 inserted into the through-holes 104 of the circuit board 12. Specifically, as shown in FIG. 15 , the pusher 88 is lowered to the second height 210 so that the working heads 60, 62, which are stopped at fixed positions, can insert the leads 94 of the lead component 92 all the way into the through-holes 104 of the circuit board 12. Next, the working heads 60, 62 to which the component holder 78 is attached are raised by operation of the Z-direction moving device 72. At this time, the working heads 60, 62 are raised by a distance L that is the difference between the first height 200 and the second height 210. The difference distance L between the first height 200 and the second height 210 can be calculated based on the height dimension of the component body 96 of the lead component 92, the thickness dimension of the circuit board 12, the amount of descent of the pusher 88, etc.

[0043] In this way, by raising the work heads 60, 62 by the distance L, which is the difference between the first height 200 and the second height 210, the lower end of the pusher 88 rises to the first height 200 as shown in FIG. 14 , and the warping of the circuit board 12 is eliminated. The lower surface of the circuit board 12 moves away from the upper ends of the bending rods 124. The lower surface of the circuit board 12 also moves away from the upper ends of the support pins 126. Alternatively, although the lower surface of the circuit board 12 contacts the upper ends of the support pins 126, almost no load is applied to the support pins 126. Furthermore, by raising the lower end of the pusher 88 to the first height 200, although the lower end of the pusher 88 contacts the component body 96 of the lead component 92, the pusher 88 applies almost no load to the component body 96.

[0044] Note that when the lower end of the pusher 88 is lowered to the second height 210, the pusher 88 is pushing against the component body 96 of the lead component 92, causing the circuit board 12 to warp downward. Then, when the working heads 60, 62 are raised by the distance L and the lower end of the pusher 88 is raised to the first height 200, the warping of the circuit board 12 is resolved, and although the lower end of the pusher 88 is in contact with the component body 96 of the lead component 92, the pusher 88 is applying almost no load to the component body 96. Therefore, while the working heads 60, 62 are raised by the distance L and before the lower end of the pusher 88 is raised to the first height 200, the circuit board 12 is warped downward, and the pusher 88 is pushing against the component body 96 of the lead component 92. In other words, the pusher 88 is pushing the component body 96, causing the circuit board 12 to bend, and the working heads 60, 62 rise while the pusher 88 is pushing the component body 96 of the lead component 92. In other words, the working heads 60, 62 rise while a force is being applied to the circuit board 12. Then, the working heads 60, 62 stop rising while the pusher 88 is in contact with the component body 96 of the lead component 92. In other words, the working heads 60, 62 stop rising before the pusher 88 separates from the component body 96 of the lead component 92.

[0045] Then, after the working heads 60, 62 stop rising, the bending rod 124 slides to bend the leads 94 inserted into the through holes 104 of the circuit board 12. At this time, the lower surface of the circuit board 12 and the tip of the bending rod 124 do not come into contact with each other, preventing erroneous detection by the strain gauge 132. Furthermore, when the bending rod 124 operates to bend the leads 94 inserted into the through holes 104 of the circuit board 12, the lower surface of the circuit board 12 and the upper ends of the support pins 126 are separated from each other. Alternatively, the lower surface of the circuit board 12 and the upper ends of the support pins 126 are in contact with each other with almost no load applied to the support pins 126. Therefore, even if the support pins 126 slide together with the bending rod 124 when bending the leads 94 inserted into the through holes 104 of the circuit board 12, the support pins 126 are prevented from damaging the lower surface of the circuit board 12.

[0046] The component mounter 10 is an example of a work machine. The circuit board 12 is an example of a substrate. The component holder 78 is an example of a holder. The pusher 88 is an example of a pusher. The lead component 92 is an example of a lead component. The lead 94 is an example of a lead. The component body 96 is an example of a component body. The through hole 104 is an example of a through hole.

[0047] The present invention is not limited to the above-described embodiment, and various modifications and improvements can be made based on the knowledge of those skilled in the art. Specifically, for example, the above-described embodiment employs a clinch unit 100 that bends the leads 94 of the lead component 92. However, a cut-and-clinch unit that cuts and bends the leads 94 of the lead component 92 may also be employed. That is, in the above-described embodiment, the working head is raised by a distance L and then stopped, after which the clinch unit 100 bends the leads inserted into the through-holes of the circuit board 12. However, the clinch unit may also cut and bend the leads. Furthermore, after the working head is raised by a distance L and then stopped, a solder application device, instead of the clinch unit 100, may apply solder to the leads inserted into the through-holes of the circuit board 12.

[0048] Furthermore, in the above embodiment, the working head is raised by a distance L, which is the difference between the first height 200 and the second height 210, but even if the working head is raised by a distance longer or shorter than L, the same effect can be achieved as when the working head is raised by the distance L, as long as the lower surface of the circuit board 12 is separated from the tip of the bent rod 124. However, it is desirable to stop raising the working head before the lower end of the pusher 88 separates from the component body 96 of the lead component 92.

[0049] In the above embodiment, the pusher 88 presses the lead parts by the operation of an air cylinder, that is, by the force of air, but the lead parts may also be pressed by elastic force, motor force, or the like.

[0050] In the above embodiment, the component holder 78 holds the leads 94 of the lead component 92, but it may also hold the component body 96. The present invention is also applicable to cases where a suction nozzle holds a lead component and mounts it on a circuit board.

[0051] 10: Component mounter (working machine) 12: Circuit substrate (substrate) 78: Component holder (holder) 88: Pusher 92: Lead component 94: Lead 96: Component body 104: Through hole

Claims

1. A work machine in which the leads of a lead component held by a holder having a pusher are inserted into through holes in a substrate, the pusher pushes the component body of the lead component toward the substrate, and then the holder rises while the pusher is still pushing the component body.

2. A work machine according to claim 1, wherein the holder rises while the pusher is pushing the component body, and the rise of the holder stops when the pusher is in contact with the component body.

3. A work machine according to claim 1 or 2, wherein the pusher pushes the component body toward the board by air force.

4. A lead component mounting method for mounting a lead component on a substrate by carrying out the following steps: a lead insertion step in which a holder having a pusher inserts the lead of a lead component held by the holder into a through-hole in a substrate and stops the holder; a lead component pushing step in which, after the lead insertion step, the pusher of the stopped holder pushes the component body of the lead component whose lead has been inserted into the through-hole in the substrate toward the substrate; a holder lifting step in which, after the lead component pushing step, the holder lifts while the pusher is pressing the component body; and a holder stopping step in which, after the holder lifting step, the lifting of the holder stops with the pusher in contact with the component body.

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