Scrubbing apparatus

Abstract

A scrubbing apparatus according to the present invention comprises: a scrubbing chamber defining a scrubbing space; a separation wall separating the scrubbing space into a first sub-space and a second sub-space; a spray nozzle disposed in the first sub-space for spraying a first cleaning solution into the first sub-space; a first scrubbing plate fixed to the separation wall; a cleaning solution supply nozzle for supplying a second cleaning solution to the upper surface of the first scrubbing plate; a cleaning solution storage tank; and a plurality of first scrubbing holes passing through the first scrubbing plate, wherein a portion of impurities contained in the gas is dissolved in the first cleaning solution in the first sub-space, and another portion of the impurities contained in the gas is dissolved in the second cleaning solution on the upper surface of the first scrubbing plate after the gas ascends through the plurality of first scrubbing holes in the second sub-space.

Description

scrubbing device

[0001] The present invention relates to a scrubbing device. Specifically, it relates to a scrubbing device that improves scrubbing efficiency by increasing the contact area between a cleaning liquid and a gas.

[0002]

[0003] Modern industry generates a wide variety of air pollutants. In particular, the semiconductor manufacturing process uses a variety of chemicals. Many of these chemicals have very low permissible human concentrations. Therefore, removing and controlling air pollutants from the gases emitted by the semiconductor industry is a critical issue.

[0004] Current air pollution control equipment includes dust collectors and scrubbers. Their efficiency is determined by the type of pollutant being treated. Scrubbers are widely used because they can simultaneously treat dust, exhaust gases, and high-temperature gases.

[0005] Specifically, scrubbers are classified into dry, wet, and plasma types depending on the method of treating the exhaust gas, and wet scrubbers are used in a process that brings the exhaust gas into contact with a liquid to dissolve water-soluble components in the gas into the liquid phase.

[0006] Wet scrubbers typically use a cleaning solution to effectively remove harmful components from the exhaust gas. The cleaning solution neutralizes and removes harmful components upon contact with them, so it's crucial to select a solution that best reacts with the harmful components in the exhaust gas. The performance of a wet scrubber depends on the ability of the cleaning solution to effectively contact the exhaust gas. Therefore, conventional methods involve installing a filler to ensure sufficient contact between the cleaning solution and the exhaust gas, and installing spray nozzles to supply fine-particle water.

[0007] Recently, a technology has been studied that can improve the contact area between the scrubbing solution containing the cleaning agent and the exhaust gas.

[0008]

[0009] The technical problem to be solved by the present invention is to provide a scrubbing device that improves scrubbing efficiency by increasing the contact area between the cleaning liquid and the gas.

[0010] The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0011]

[0012] According to some embodiments of the present invention for achieving the above technical problem, a scrubbing device includes a scrubbing chamber defining a scrubbing space for scrubbing impurities contained in a gas, a separation wall dividing the scrubbing space into a first sub-space and a second sub-space, a spray nozzle disposed in the first sub-space for spraying a first cleaning liquid into the first sub-space, a first scrubbing plate disposed in the second sub-space and fixed to the separation wall, a cleaning liquid supply nozzle disposed in an upper portion of the second sub-space for supplying a second cleaning liquid to an upper surface of the first scrubbing plate, a cleaning liquid storage tank installed in a lower portion of the scrubbing chamber for storing the first cleaning liquid in which the impurities are dissolved and the second cleaning liquid in which the impurities are dissolved, and a plurality of first scrubbing holes penetrating the first scrubbing plate, wherein some of the impurities contained in the gas are dissolved in the first cleaning liquid in the first sub-space, and other parts of the impurities contained in the gas are dissolved in the first scrubbing liquid in the first sub-space, after the gas rises and passes through the plurality of first scrubbing holes in the second sub-space. It is dissolved in the second cleaning liquid on the upper surface of the first scrubbing plate.

[0013] In some embodiments, the dissolution of another portion of the impurities contained in the gas into the second cleaning liquid comprises the gas passing upwardly through the first scrubbing hole to form bubbles within the second cleaning liquid on the upper surface of the first scrubbing plate, and the impurities dissolving at the contact surface of the bubbles and the second cleaning liquid.

[0014] By creating bubbles within the second cleaning solution, the contact area between the gas and the second cleaning solution can be increased. Accordingly, the efficiency of the scrubbing process can be improved.

[0015] In some embodiments, the first impurity dissolved in the first cleaning solution in the first subspace and the second impurity dissolved in the second cleaning solution in the second subspace are different from each other, and the first cleaning solution is different from the second cleaning solution.

[0016] In some embodiments, the first cleaning solution has viscosity and the second cleaning solution does not have viscosity. Therefore, the first impurity can be well dissolved in the first cleaning solution, and the second impurity can be well dissolved in the second cleaning solution.

[0017] In some embodiments, the size of the particles of the first impurity dissolved in the first cleaning solution and the size of the particles of the second impurity dissolved in the second cleaning solution are different from each other.

[0018] A scrubbing device according to some embodiments further comprises a second scrubbing plate disposed in the second sub-space, fixed to the separation wall, and disposed on a lower surface opposite to an upper surface of the first scrubbing plate, and a plurality of second scrubbing holes penetrating the second scrubbing plate, wherein the first scrubbing plate and the second scrubbing plate are arranged in a zigzag pattern.

[0019] In some embodiments, the second cleaning liquid flows in a first direction from the upper surface of the first scrubbing plate and is discharged to the upper surface of the second scrubbing plate, the second cleaning liquid flows in a -first direction from the upper surface of the second scrubbing plate, and the lower surface of the first scrubbing plate and the upper surface of the second scrubbing plate face each other.

[0020] A scrubbing device according to some embodiments further comprises a third scrubbing plate disposed in the second sub-space, fixed to the separation wall, and disposed on a lower surface opposite to an upper surface of the second scrubbing plate, and a plurality of third scrubbing holes penetrating the third scrubbing plate, wherein the second scrubbing plate and the third scrubbing plate are arranged in a zigzag manner, and the first scrubbing plate and the third scrubbing plate overlap each other in a vertical direction.

[0021] A scrubbing device according to some embodiments further comprises a second scrubbing plate disposed in the second sub-space and disposed on a lower surface opposite to an upper surface of the first scrubbing plate, and a plurality of second scrubbing holes penetrating the second scrubbing plate, wherein the shapes of the first scrubbing plate and the shapes of the second scrubbing plate are different from each other, the first scrubbing plate has an opening exposing at least a portion of the upper surface of the second scrubbing plate, and the second scrubbing plate extends in the third direction and is spaced apart from the separating wall.

[0022] In some embodiments, the second cleaning liquid flows from the upper surface of the first scrubbing plate toward the opening and is discharged to the upper surface of the second scrubbing plate, the second cleaning liquid flows in a direction opposite to the opening from the upper surface of the second scrubbing plate, and the lower surface of the first scrubbing plate and the upper surface of the second scrubbing plate face each other.

[0023] In some embodiments, the separating wall has at least one of a bar shape, an 'ㄱ' shape, or a 'ㄷ' shape in plan view.

[0024] In some embodiments, the cleaning solution storage tank includes a first tank and a second tank that are separated from each other, and the first cleaning solution with the impurities dissolved therein is stored in the first tank, and the second cleaning solution with the impurities dissolved therein is stored in the second tank.

[0025] In some embodiments, the spray nozzle sprays the first cleaning liquid in a first direction, the first direction being parallel to the extension direction of the first scrubbing plate. The direction in which the gas flows and the direction in which the first cleaning liquid is sprayed may be different. Accordingly, the scrubbing efficiency can be improved.

[0026] In some embodiments, the spray nozzle sprays the first cleaning liquid in a first direction, the first direction intersecting the extension direction of the first scrubbing plate and the extension direction of the separating wall, respectively. The direction in which the gas flows and the direction in which the first cleaning liquid is sprayed may be different. Accordingly, the scrubbing efficiency can be improved.

[0027] Specific details of other embodiments are included in the description and drawings of the invention.

[0028]

[0029] The scrubbing device of the present invention comprises at least one scrubbing plate. Scrubbing holes are formed within the scrubbing plate, penetrating the scrubbing plate. As gas rises and passes through the scrubbing holes, bubbles may be formed within the cleaning liquid flowing over the upper surface of the scrubbing plate.

[0030] As the bubbles are formed, the contact area between the cleaning solution and the gas increases. This increased contact area allows more hydrophilic impurities in the gas to dissolve in the cleaning solution. Consequently, the gas, free of contaminants (impurities), can be discharged outside the scrubbing device.

[0031]

[0032] FIG. 1 is a drawing briefly illustrating a scrubbing system including a scrubbing device according to some embodiments of the present invention.

[0033] Fig. 2 is an exemplary perspective view for explaining the scrubbing device of Fig. 1.

[0034] Fig. 3 is an exemplary cross-sectional view for explaining the scrubbing device of Fig. 1.

[0035] Figure 4 is an enlarged view of area P of Figure 3.

[0036] Fig. 5 is an exemplary plan view for explaining the scrubbing device of Fig. 1.

[0037] FIGS. 6 to 13 are drawings each illustrating a scrubbing device according to some other embodiments of the present invention.

[0038] FIGS. 14 and 15 are drawings for explaining an operating method of a scrubbing device according to some embodiments of the present invention.

[0039]

[0040] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described in detail below together with the attached drawings. However, the present invention is not limited to the embodiments described below, but can be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

[0041] In addition, the terminology used in this specification is used to describe embodiments and is not intended to limit and / or restrict the disclosed invention. The singular expression includes plural expression unless the context clearly indicates otherwise. In this specification, the terms "comprise" or "have" and the like are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0042] Additionally, terms including ordinal numbers such as “first,” “second,” etc. used herein may be used to describe various components, but the components are not limited by the terms, and the terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term “and / or” includes any combination of a plurality of related listed items or any item among a plurality of related listed items.

[0043] Meanwhile, the terms “upper”, “lower”, “side wall”, “top surface” and “lower surface” used in the description below are defined based on the drawing, and the shape and position of each component are not limited by these terms.

[0044] The terminology used herein is for the purpose of describing embodiments only and is not intended to limit the present invention. In this specification, the singular also includes the plural unless the context clearly dictates otherwise. As used herein, the terms "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components, steps, operations, and / or elements.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in their common sense to those of ordinary skill in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0046] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. In describing with reference to the attached drawings, identical or corresponding components are given the same reference numerals regardless of the drawing symbols, and redundant descriptions thereof will be omitted.

[0047]

[0048] Hereinafter, a scrubbing system (1000) including a scrubbing device (20) according to some embodiments of the present invention will first be described with reference to FIG. 1. FIG. 1 is a drawing for briefly explaining a scrubbing system including a scrubbing device according to some embodiments of the present invention.

[0049] Referring to FIG. 1, a scrubbing system (1000) according to some embodiments of the present invention may include a process chamber (10), a scrubbing device (20), an exhaust gas discharge chamber (30), and a cleaning solution discharge chamber (40).

[0050] The process chamber (10) may be a chamber utilized in various industrial fields. The various industrial fields may be a plant field, a battery field, a thermal power plant field, a steel field, a semiconductor field, a chemical field, and / or an oil and gas plant field.

[0051] If the scrubbing system (1000) is utilized in the semiconductor field, the process chamber (10) may be a chamber where semiconductor processes are performed. To manufacture a semiconductor device, various semiconductor processes must be performed on a wafer. For example, a film must be deposited on the wafer (deposition process), and the film must be etched (etch process) to form a pattern included in the semiconductor device. Furthermore, after the deposition process and / or etching process are performed, a cleaning process must be performed to clean the wafer and / or the process chamber (10).

[0052] The deposition process may include, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), and / or atomic layer deposition (ALD). The etching process may include, for example, a dry etching process, a wet etching process, and / or an ashing process. The cleaning process may include, for example, a wet cleaning process, a dry cleaning process, and / or a vapor cleaning process.

[0053] If the scrubbing system (1000) is utilized in the oil and gas plant industry, the process chamber (10) may be a chamber in which a plant process is performed.

[0054] When various processes are performed within a process chamber (10), byproducts may be generated. These byproducts may contain substances harmful to the human body. If these byproducts contain substances harmful to the human body, they must be removed and discharged. A scrubbing device (20) can be used to remove substances harmful to the human body from the byproducts generated within the process chamber (10).

[0055] A first pipe (11) may be arranged between the process chamber (10) and the scrubbing device (20). One end of the first pipe (11) may be connected to the process chamber (10), and the other end of the first pipe (11) may be connected to the scrubbing device (20). Gas (G) discharged from the process chamber (10) may be provided to the scrubbing device (20) through the first pipe (11) (see drawing reference numeral 50). The gas (G) may contain impurities. The impurities may be substances harmful to the human body. The impurities may include hydrophilic substances and may also include dust having large particles.

[0056] In some embodiments, a first valve (12) may be connected to the first pipe (11). The first valve (12) may control the pressure and flow rate of gas (G) provided to the scrubbing device (20) through the first pipe (11).

[0057] The scrubbing device (20) can scrub the gas (G) provided from the process chamber (10). Impurities contained in the gas (G) can be dissolved in a cleaning solution and stored in a cleaning solution discharge chamber (40). The gas (G') from which impurities have been removed can be stored in an exhaust gas discharge chamber (30). A detailed description of the scrubbing device (20) will be described later with reference to FIGS. 2 to 13.

[0058] The cleaning solution discharge chamber (40) can be connected to the scrubbing device (20). The cleaning solution discharge chamber (40) and the scrubbing device (20) can be connected to each other through a second pipe (21). One end of the second pipe (21) can be connected to the scrubbing device (20), and the other end of the second pipe (21) can be connected to the cleaning solution discharge chamber (40). Through the second pipe (21), the cleaning solution (S) in which impurities are dissolved can move from the scrubbing device (20) to the cleaning solution discharge chamber (40) (see drawing reference numeral 60).

[0059] In some embodiments, a second valve (22) may be connected to the second pipe (21). The second valve (22) may control the pressure and flow rate of the cleaning solution (S) containing dissolved impurities provided to the cleaning solution discharge chamber (40) through the second pipe (21).

[0060] The exhaust gas discharge chamber (30) may be connected to the scrubbing device (20). The exhaust gas discharge chamber (30) and the scrubbing device (20) may be connected to each other through a third pipe (23). One end of the third pipe (23) may be connected to the scrubbing device (20), and the other end of the third pipe (23) may be connected to the exhaust gas discharge chamber (30). Through the third pipe (23), the gas (G') from which impurities have been removed may move from the scrubbing device (20) to the exhaust gas discharge chamber (30) (see drawing reference numeral 70).

[0061] In some embodiments, a third valve (24) may be connected to the third pipe (23). The third valve (24) may control the pressure and flow rate of the impurity-free gas (G') provided to the exhaust gas discharge chamber (30) through the third pipe (23).

[0062] In some embodiments, the scrubbing device (20) may further include a gas inlet (25) and a gas outlet (26). Gas (G) may be introduced into the scrubbing device (20) through the gas inlet (25). Gas (G') from which impurities have been removed may be discharged to the outside of the scrubbing device (20) through the gas outlet (26).

[0063] When a scrubbing device (20) according to some embodiments of the present invention is utilized in the aforementioned industrial fields, contaminants generated after a process can be effectively separated and removed. Consequently, environmental pollution problems can be reduced.

[0064]

[0065] Hereinafter, a scrubbing device according to some embodiments of the present invention will be described in detail with reference to FIGS. 2 to 5.

[0066] Fig. 2 is an exemplary perspective view for explaining the scrubbing device of Fig. 1. Fig. 3 is an exemplary cross-sectional view for explaining the scrubbing device of Fig. 1. Fig. 4 is an enlarged view of area P of Fig. 3. Fig. 5 is an exemplary plan view for explaining the scrubbing device of Fig. 1.

[0067] Referring to FIGS. 2 to 5, a scrubbing device (20) according to some embodiments of the present invention may include a scrubbing chamber (210), a separating wall (220), a first scrubbing plate (230), a second scrubbing plate (240), a third scrubbing plate (250), a spray nozzle (221), a cleaning solution supply nozzle (223), and a demister (260).

[0068] First, a scrubbing chamber (210) may be provided. The scrubbing chamber (210) may be an external housing of the scrubbing device (20). A gas (G in FIG. 1) may be provided into the scrubbing chamber (210). The gas may contain impurities. For example, the gas (G in FIG. 1) may be provided into the scrubbing chamber (210) through a gas inlet (25 in FIG. 1). The gas inlet may be formed on an upper wall of the scrubbing chamber (210) or on a side wall of the scrubbing chamber (210). In addition, the gas inlet may be formed on an upper or lower portion of the scrubbing chamber (210).

[0069] Impurities contained in the gas (G in FIG. 1) may be dissolved in the cleaning liquid inside the scrubbing chamber (210). The scrubbing chamber (210) may define a scrubbing space (215). The scrubbing space (215) may be a space where a scrubbing process is performed, in which impurities contained in the gas (G in FIG. 1) are dissolved in the cleaning liquid.

[0070] In some embodiments, the scrubbing space (215) may include a first sub-space (215a) and a second sub-space (215b). The first sub-space (215a) and the second sub-space (215b) may be separated by a separation wall (220). The first sub-space (215a) and the second sub-space (215b) may be defined by the separation wall (220).

[0071] A separating wall (220) may be positioned inside the scrubbing chamber (210). In some embodiments, the separating wall (220) may be attached to an upper wall of the scrubbing chamber (210). The separating wall (220) may extend from the upper wall of the scrubbing chamber (210) in a second direction (D2). The second direction (D2) may be a direction perpendicular to the ground.

[0072] In some embodiments, the separating wall (220) may have a bar shape in a plan view. The separating wall (220) may extend in a third direction (D3) in a plan view. One end of the separating wall (220) may be in contact with and connected to the third inner wall (210SW3) of the scrubbing chamber (210), and the other end of the separating wall (220) may be in contact with and connected to the fourth inner wall (210SW4) of the scrubbing chamber (210). The separating wall (220) may include a long side extending in the third direction (D3) and a short side extending in the first direction (D1), but the technical idea of ​​the present invention is not limited thereto.

[0073] The separation wall (220) can define a first sub-space (215a) and a second sub-space (215b). The separation wall (220) can separate the scrubbing space (215) into a first sub-space (215a) and a second sub-space (215b).

[0074] A first scrubbing process may be performed in a first sub-space (215a). A second scrubbing process may be performed in a second sub-space (215b). The first scrubbing process may be a process in which a first impurity is dissolved in a first cleaning solution (225). The second scrubbing process may be a process in which a second impurity is dissolved in a second cleaning solution (227). The first impurity and the second impurity may be included in a gas (G in FIG. 1) provided from the process chamber (10).

[0075] In some embodiments, the first cleaning solution (225) may be the same as or different from the second cleaning solution (227). Similarly, the first impurity and the second impurity may be the same as or different from each other. This will be described later.

[0076] In this specification, the first direction (D1) and the third direction (D3) may intersect with each other. The first direction (D1) and the second direction (D2) may intersect with each other. The second direction (D2) and the third direction (D3) may intersect with each other. That is, in this specification, the first direction (D1), the second direction (D2), and the third direction (D3) may be substantially perpendicular to each other.

[0077] A first scrubbing plate (230), a second scrubbing plate (240), and a third scrubbing plate (250) may be arranged inside the scrubbing space (215). Specifically, the first scrubbing plate (230), the second scrubbing plate (240), and the third scrubbing plate (250) may be arranged inside the second sub-space (215b).

[0078] In FIGS. 2 to 5, the scrubbing device (20) of the present invention is illustrated as including three scrubbing plates, but the technical concept of the present invention is not limited thereto. The scrubbing device (20) according to some embodiments of the present invention may include at least one scrubbing plate. That is, the scrubbing plates may be arranged one or two, or of course, four or more.

[0079] The first scrubbing plate (230) may be disposed at the lowest position among the scrubbing plates disposed inside the second sub-space (215b). One end of the first scrubbing plate (230) may be connected to and fixed to the partition wall (220). Specifically, one end of the first scrubbing plate (230) may be connected to and fixed to a side wall of the partition wall (220) facing the second sub-space (215b). The first scrubbing plate (230) may be connected to the partition wall (220) and extend in a first direction (D1) intersecting the partition wall (220). More specifically, the first scrubbing plate (230) may be placed on a plane along which the first direction (D1) and the third direction (D3) extend.

[0080] In some embodiments, another portion of the first scrubbing plate (230) may be connected and fixed to the inner walls of the scrubbing chamber (210). Specifically, the scrubbing chamber (210) may include a first inner wall (210SW1), a second inner wall (210SW2), a third inner wall (210SW3), and a fourth inner wall (210SW4).

[0081] The first inner wall (210SW1) of the scrubbing chamber (210) may face the separating wall (220). The first inner wall (210SW1) of the scrubbing chamber (210) and the separating wall (220) may define a first sub-space (215a). The second inner wall (210SW2) of the scrubbing chamber (210) may face the first inner wall (210SW1) of the scrubbing chamber (210) in the first direction (D1).

[0082] The second inner wall (210SW2) and the separation wall (220) of the scrubbing chamber (210) can define a second sub-space (215b). The third inner wall (210SW3) and the fourth inner wall (210SW4) of the scrubbing chamber (210) can be connected to the first inner wall (210SW1) and the second inner wall (210SW2), respectively. The third inner wall (210SW3) of the scrubbing chamber (210) can face the fourth inner wall (210SW4) of the scrubbing chamber (210) in a third direction (D3).

[0083] In some embodiments, the first scrubbing plate (230) may be connected to the separating wall (220) in the second sub-space (215b), the third inner wall (210SW3) of the scrubbing chamber (210), and the fourth inner wall (210SW4) of the scrubbing chamber (210).

[0084] However, the first scrubbing plate (230) may not be connected to and fixed to the second inner wall (210SW2) of the scrubbing chamber (210). The first scrubbing plate (230) may be spaced apart from the second inner wall (210SW2) of the scrubbing chamber (210) in the first direction (D1). The space from the other end of the first scrubbing plate (230) to the second inner wall (210SW2) of the scrubbing chamber (210) may be a space in which the second cleaning liquid (227), which will be described later, flows downward (for example, in the second direction (D2)).

[0085] The scrubbing device (20) according to some embodiments may further include a first scrubbing hole (230H) and a first scrubbing wall (235).

[0086] The first scrubbing hole (230H) may be formed inside the first scrubbing plate (230). The first scrubbing hole (230H) may extend from the lower surface of the first scrubbing plate (230) to the upper surface of the first scrubbing plate (230). That is, the first scrubbing hole (230H) may penetrate the first scrubbing plate (230) in the second direction (D2). Gas (G in FIG. 1) may rise in the second direction (D2) by passing through the first scrubbing hole (230H) (see reference numeral 230u).

[0087] The upper surface of the first scrubbing plate (230) can face the demister (260) to be described later, and the lower surface of the first scrubbing plate (230) can face the cleaning solution storage tank (270) to be described later.

[0088] A first scrubbing wall (235) may be attached to the other end of the first scrubbing plate (230). The first scrubbing wall (235) may be interposed between the first scrubbing plate (230) and the second inner wall (210SW2) of the scrubbing chamber (210). The first scrubbing wall (235) may extend in a second direction (D2). In some embodiments, a portion of the first scrubbing wall (235) may protrude from the upper surface of the first scrubbing plate (230) in the second direction (D2). Another portion of the first scrubbing wall (235) may protrude from the lower surface of the first scrubbing plate (230) in the second direction (D2).

[0089] The length in the second direction (D2) of the portion protruding in the second direction (D2) from the upper surface of the first scrubbing plate (230) among the first scrubbing walls (235) may be smaller than the length in the second direction (D2) of the portion protruding in the second direction (D2) from the lower surface of the first scrubbing plate (230), but the technical idea of ​​the present invention is not limited thereto.

[0090] In some embodiments, at least a portion of the first scrubbing plate (230) of the first scrubbing wall (235) protruding in the second direction (D2) from the lower surface thereof may be placed in the cleaning solution (275) in which impurities are dissolved, but the technical idea of ​​the present invention is not limited thereto.

[0091] The second scrubbing plate (240) may be disposed on the first scrubbing plate (230). Specifically, the second scrubbing plate (240) may be disposed on the upper surface of the first scrubbing plate (230). One end of the second scrubbing plate (240) may be connected to and fixed to the second inner wall (210SW2) of the scrubbing chamber (210). The second scrubbing plate (240) may be connected to the second inner wall (210SW2) of the scrubbing chamber (210) and may extend in a first direction (D1) intersecting the second inner wall (210SW2) of the scrubbing chamber (210). More specifically, the second scrubbing plate (240) may be placed on a plane in which the first direction (D1) and the third direction (D3) extend.

[0092] Likewise, the second scrubbing plate (240) can be connected and fixed to the third inner wall (210SW3) of the scrubbing chamber (210) and the fourth inner wall (210SW4) of the scrubbing chamber (210).

[0093] However, the other end of the second scrubbing plate (240) may not be connected and fixed to the separating wall (220). The other end of the second scrubbing plate (240) may be spaced apart from the side wall of the separating wall (220) in the first direction (D1). The space from the other end of the second scrubbing plate (240) to the separating wall (220) may be a space in which the second cleaning liquid (227), which will be described later, flows downward (for example, in the second direction (D2)).

[0094] The scrubbing device (20) according to some embodiments may further include a second scrubbing hole (240H) and a second scrubbing wall (245).

[0095] The second scrubbing hole (240H) may be formed inside the second scrubbing plate (240). The second scrubbing hole (240H) may extend from the lower surface of the second scrubbing plate (240) to the upper surface of the second scrubbing plate (240). The second scrubbing hole (240H) may penetrate the second scrubbing plate (240) in the second direction (D2). Gas (G in FIG. 1) may rise in the second direction (D2) by passing through the second scrubbing hole (240H).

[0096] The upper surface of the second scrubbing plate (240) can face the demister (260) to be described later, and the lower surface of the second scrubbing plate (240) can face the upper surface of the first scrubbing plate (230).

[0097] A second scrubbing wall (245) may be attached to the other end of the second scrubbing plate (240). The second scrubbing wall (245) may be interposed between the second scrubbing plate (240) and the separating wall (220). The second scrubbing wall (245) may extend in a second direction (D2). In some embodiments, a portion of the second scrubbing wall (245) may protrude from the upper surface of the second scrubbing plate (240) in the second direction (D2). Another portion of the second scrubbing wall (245) may protrude from the lower surface of the second scrubbing plate (240) in the second direction (D2).

[0098] The length in the second direction (D2) of the portion protruding in the second direction (D2) from the upper surface of the second scrubbing plate (240) among the second scrubbing walls (245) may be shorter than the length in the second direction (D2) of the portion protruding in the second direction (D2) from the lower surface of the second scrubbing plate (240), but the technical idea of ​​the present invention is not limited thereto.

[0099] In some embodiments, the first scrubbing plate (230) and the second scrubbing plate (240) do not completely overlap in the second direction (D2). The first scrubbing plate (230) and the second scrubbing plate (240) may be arranged in a zigzag manner. Accordingly, the second cleaning liquid (227) that flows downward past the second scrubbing wall (245) may be discharged onto the upper surface of the first scrubbing plate (230). In other words, the center of the first scrubbing plate (230) and the center of the second scrubbing plate (240) may be offset from each other.

[0100] The third scrubbing plate (250) may be placed on the second scrubbing plate (240). Specifically, the third scrubbing plate (250) may be placed on the upper surface of the second scrubbing plate (240). One end of the third scrubbing plate (250) may be connected to and fixed to the separating wall (220).

[0101] Specifically, one end of the third scrubbing plate (250) may be connected to and fixed to a side wall of the partition wall (220) facing the second sub-space (215b). The third scrubbing plate (250) may be connected to the partition wall (220) and may extend in a first direction (D1) intersecting the partition wall (220). More specifically, the third scrubbing plate (250) may be placed on a plane along which the first direction (D1) and the third direction (D3) extend. Similarly, the third scrubbing plate (250) may be connected to and fixed to a third inner side wall (210SW3) of the scrubbing chamber (210) and a fourth inner side wall (210SW4) of the scrubbing chamber (210).

[0102] However, the other end of the third scrubbing plate (250) may not be connected to and fixed to the second inner wall (210SW2) of the scrubbing chamber (210). The other end of the third scrubbing plate (250) may be spaced apart from the second inner wall (210SW2) of the scrubbing chamber (210) in the first direction (D1). The space from the other end of the third scrubbing plate (250) to the second inner wall (210SW2) of the scrubbing chamber (210) may be a space in which the second cleaning liquid (227), which will be described later, flows downward (for example, in the second direction (D2)).

[0103] The scrubbing device (20) according to some embodiments may further include a third scrubbing hole (250H) and a third scrubbing wall (255).

[0104] The third scrubbing hole (250H) may be formed inside the third scrubbing plate (250). The third scrubbing hole (250H) may extend from the lower surface of the third scrubbing plate (250) to the upper surface of the third scrubbing plate (250). The third scrubbing hole (250H) may penetrate the third scrubbing plate (250) in the second direction (D2). Gas (G in FIG. 1) may rise in the second direction (D2) by passing through the third scrubbing hole (250H).

[0105] The upper surface of the third scrubbing plate (250) can face the demister (260) to be described later, and the lower surface of the third scrubbing plate (250) can face the upper surface of the second scrubbing plate (240).

[0106] The third scrubbing wall (255) can be attached to the other end of the third scrubbing plate (250). The third scrubbing wall (255) can be interposed between the third scrubbing plate (250) and the second inner wall (210SW2) of the scrubbing chamber (210). The third scrubbing wall (255) can extend in the second direction (D2).

[0107] In some embodiments, a portion of the third scrubbing wall (255) may protrude in the second direction (D2) from the upper surface of the third scrubbing plate (250). Another portion of the third scrubbing wall (255) may protrude in the second direction (D2) from the lower surface of the third scrubbing plate (250).

[0108] The length in the second direction (D2) of the portion protruding in the second direction (D2) from the upper surface of the third scrubbing plate (250) among the third scrubbing walls (255) may be smaller than the length in the second direction (D2) of the portion protruding in the second direction (D2) from the lower surface of the third scrubbing plate (250), but the technical idea of ​​the present invention is not limited thereto.

[0109] In some embodiments, the third scrubbing plate (250) and the second scrubbing plate (240) do not completely overlap in the second direction (D2). The third scrubbing plate (250) and the second scrubbing plate (240) may be arranged in a zigzag manner. The second cleaning liquid (227) that flows downward past the third scrubbing wall (255) may be discharged onto the upper surface of the second scrubbing plate (240). In other words, the center of the third scrubbing plate (250) and the center of the second scrubbing plate (240) may be offset from each other.

[0110] However, the third scrubbing plate (250) and the first scrubbing plate (230) can completely overlap in the second direction (D2). That is, the center of the third scrubbing plate (250) and the center of the first scrubbing plate (230) can overlap in the second direction (D2).

[0111] In some embodiments, the first to third scrubbing holes (230H, 240H, 250H) may completely overlap in the second direction (D2). However, the technical idea of ​​the present invention is not limited thereto. It goes without saying that the first to third scrubbing holes (230H, 240H, 250H) may not completely overlap in the second direction (D2), and may only partially overlap.

[0112] The cleaning solution supply nozzle (223) may be placed inside the scrubbing chamber (210). The cleaning solution supply nozzle (223) may be connected to the upper portion of the scrubbing chamber (210) and may extend in the second direction (D2). The cleaning solution supply nozzle (223) may be connected to a pipe (not shown) installed outside the scrubbing chamber (210). The cleaning solution supply nozzle (223) may supply a second cleaning solution (227) to the second sub-space (215b). The second cleaning solution (227) may be supplied from the cleaning solution supply nozzle (223) and discharged to the upper surface of the third scrubbing plate (250).

[0113] The second cleaning solution (227) may be, for example, water. However, the technical idea of ​​the present invention is not limited thereto.

[0114] The second cleaning liquid (227) may be discharged onto the upper surface of the third scrubbing plate (250) and then flow from the upper surface of the third scrubbing plate (250) toward the third scrubbing wall (255) while the second scrubbing process is being performed. At this time, the second cleaning liquid (227) does not flow downward through the third scrubbing hole (250H). The second cleaning liquid (227) may flow beyond the third scrubbing wall (255) to the lower portion of the scrubbing chamber (210).

[0115] The above second scrubbing process may mean a process in which some of the impurities contained in the gas in the second sub-space (215b) are dissolved in the second cleaning liquid (227).

[0116] The second cleaning liquid (227) that has passed the third scrubbing wall (255) is discharged again to the upper surface of the second scrubbing plate (240). The second cleaning liquid (227) can flow from the upper surface of the second scrubbing plate (240) toward the second scrubbing wall (245) while the second scrubbing process is being performed. At this time, the second cleaning liquid (227) does not flow downward through the second scrubbing hole (240H). The second cleaning liquid (227) can flow to the lower part of the scrubbing chamber (210) by passing the second scrubbing wall (245).

[0117] Likewise, the second cleaning liquid (227) that has passed the second scrubbing wall (245) is discharged again to the upper surface of the first scrubbing plate (230). The second cleaning liquid (227) can flow from the upper surface of the first scrubbing plate (230) toward the first scrubbing wall (235) while the second scrubbing process is performed. At this time, the second cleaning liquid (227) does not flow downward through the first scrubbing hole (230H). The second cleaning liquid (227) can flow to the lower part of the scrubbing chamber (210) by passing the first scrubbing wall (235).

[0118] Finally, the second cleaning liquid (227) that has passed the first scrubbing wall (235) may be stored in a cleaning liquid storage tank (270) provided at the bottom of the scrubbing chamber (210). The cleaning liquid storage tank (270) may store a cleaning liquid (275) in which impurities are dissolved. For example, the cleaning liquid (275) in which impurities are dissolved may be a solution in which a hydrophilic gas is dissolved in the second cleaning liquid (227). In addition, the cleaning liquid (275) in which impurities are dissolved may be a solution in which a hydrophilic gas and / or dust are dissolved in the first cleaning liquid (225).

[0119] In some embodiments, the hydrophilic gas may be isopropyl alcohol (IPA) and / or ammonia, but the technical idea of ​​the present invention is not limited thereto.

[0120] A demister (260) may be placed above the scrubbing chamber (210). The demister (260) may be used to remove moisture from the gas after the first scrubbing process and the second scrubbing process are performed. After the first scrubbing process and the second scrubbing process are performed, a gas (G' in FIG. 1) from which impurities have been removed may be provided. That is, moisture may be removed from the gas (G' in FIG. 1) from which impurities have been removed after the first scrubbing process and the second scrubbing process are performed using the demister (260).

[0121] The demister (260) can be connected to the gas exhaust port (26). The gas filtered through the demister (260) can be discharged to the outside of the scrubbing chamber (210) through the gas exhaust port (26).

[0122] When using a scrubbing device (20) according to certain embodiments, gases harmful to the human body (e.g., impurities) can be dissolved in the cleaning solution. Accordingly, gases harmful to the human body can be removed from byproducts generated after various processes in various industrial fields and discharged outside the scrubbing chamber (210).

[0123] In some embodiments, the first sub-space (215a) may be defined by a first inner wall (210SW1) of the scrubbing chamber (210) and a separating wall (220). For example, the first sub-space (215a) may be defined by a first inner wall (210SW1) of the scrubbing chamber (210), a third inner wall (210SW3) of the scrubbing chamber (210), a fourth inner wall (210SW4) of the scrubbing chamber (210), and a separating wall (220). The first inner wall (210SW1) of the scrubbing chamber (210) may face the separating wall (220).

[0124] The first scrubbing process may be performed in the first sub-space (215a). The first scrubbing process may refer to a process in which some of the impurities contained in the gas in the first sub-space (215a) are dissolved in the first cleaning liquid (225).

[0125] In some embodiments, the first cleaning liquid (225) may be provided into the interior of the scrubbing chamber (210) through a spray nozzle (221). The first cleaning liquid (225) may be provided into the first sub-space (215a) through the spray nozzle (221).

[0126] The first cleaning liquid (225) is provided from the upper part to the lower part of the first sub-space (215a), and while the gas (G in FIG. 1) flows from the upper part to the lower part of the first sub-space (215a), at least some of the impurities contained in the gas may be dissolved in the first cleaning liquid (225). In some embodiments, the first cleaning liquid (225) may include water. However, the technical idea of ​​the present invention is not limited thereto. In other embodiments, the first cleaning liquid (225) may not be water. The first cleaning liquid (225) may include a viscous substance.

[0127] In some embodiments, the spray nozzle (221) may be a spray nozzle. The spray nozzle (221) may supply the first cleaning liquid (225) with small particles to the first sub-space (215a). Accordingly, the contact area between the first cleaning liquid (225) and the gas may be improved. Accordingly, a scrubbing device (20) with improved scrubbing efficiency may be provided.

[0128] The spray nozzle (221) may be installed at the top of the scrubbing chamber (210). Although not shown, the spray nozzle (221) may be connected to a pipe installed outside the scrubbing chamber (210).

[0129] In some embodiments, the spray nozzle (221) and the cleaning solution supply nozzle (223) may be connected to the cleaning solution storage tank (270) via a pipe (not shown) that is connected to the cleaning solution storage tank (270), respectively. That is, the first cleaning solution (225) provided to the first sub-space (215a) through the spray nozzle (221) may be a cleaning solution (275) in which impurities stored in the cleaning solution storage tank (270) are dissolved. Similarly, the second cleaning solution (227) provided to the second sub-space (215b) through the cleaning solution supply nozzle (223) may be a cleaning solution (275) in which impurities stored in the cleaning solution storage tank (270) are dissolved.

[0130] In this way, when using the scrubbing device (20) of the present invention, the cleaning liquid can be recycled, and accordingly, the amount of cleaning liquid used in the scrubbing process can be reduced.

[0131] In some embodiments, the first cleaning solution (225) may be different from the second cleaning solution (227). For example, the first cleaning solution (225) may be a viscous material, and the second cleaning solution (227) may be a non-viscous material.

[0132] In this case, the first impurity dissolved in the first cleaning solution (225) and the second impurity dissolved in the second cleaning solution (227) may be different from each other. For example, the particle size of the first impurity dissolved in the first cleaning solution (225) may be larger than the particle size of the second impurity dissolved in the second cleaning solution (227). For example, the first impurity may be dust, and the second impurity may be a hydrophilic gas. However, the technical idea of ​​the present invention is not limited thereto.

[0133] In other words, the first scrubbing process performed in the first sub-space (215a) and the second scrubbing process performed in the second sub-space (215b) may be different from each other. However, the technical idea of ​​the present invention is not limited thereto.

[0134] In some embodiments, a gas inlet may be installed on one side of the first sub-space (215a). A gas (G in FIG. 1) to be introduced into the interior of the scrubbing chamber (210) may be introduced into the interior of the scrubbing chamber (210) through the gas inlet. The gas inlet may be connected to a first pipe (11), and since the other side of the first pipe (11) is connected to a process chamber (10 in FIG. 1), the gas (G in FIG. 1) introduced into the gas inlet may be provided from the process chamber.

[0135] In some embodiments, a negative pressure may be provided to the scrubbing space (215) through the gas inlet and the gas outlet (26). For example, the pressure at the gas inlet and the pressure at the gas outlet (26) may be different from each other. Accordingly, the gas (G in FIG. 1) may flow from the gas inlet toward the gas outlet (26). The first scrubbing process and the second scrubbing process may be performed by utilizing the difference between the pressure at the gas inlet and the pressure at the gas outlet (26).

[0136] In some embodiments, the first sub-space (215a) and the second sub-space (215b) may be connected to each other at the bottom of the scrubbing chamber (210). The first sub-space (215a) and the second sub-space (215b) may be connected to each other above the cleaning solution storage tank (270).

[0137] That is, the gas introduced into the first sub-space (215a) can flow from the upper part of the first sub-space (215a) to the lower part of the first sub-space (215a) and be introduced into the second sub-space (215b) from the lower part of the scrubbing chamber (210). In the second sub-space (215b), the gas (G in FIG. 1) can rise in the second direction (D2).

[0138] When using a scrubbing device (20) according to some embodiments, the contact area of ​​a gas in contact with a cleaning liquid can be improved. Specifically, the contact area between the cleaning liquid and the gas can be improved by forming bubbles within the cleaning liquid.

[0139] For example, in FIG. 4, gas (G in FIG. 1) can pass through the first scrubbing hole (230H) and rise in the second direction (D2) (see drawing symbol 230u).

[0140] After the gas (G in FIG. 1) passes upwardly through the first scrubbing hole (230H), a bubble (BBL) may be formed on the upper surface of the first scrubbing plate (230). The bubble (BBL) may be formed inside the second cleaning liquid (227). At the portion where the bubble (BBL) and the second cleaning liquid (227) come into contact, impurities contained in the gas may be dissolved in the second cleaning liquid (227).

[0141] Although not shown, the gas (G in FIG. 1) may rise in the second direction (D2) after passing through the first scrubbing hole (230H) and then passing through the second scrubbing hole (240H). After the gas (G in FIG. 1) passes through the second scrubbing hole (240H) and then bubbles may be formed on the upper surface of the second scrubbing plate (240). Similarly, the gas (G in FIG. 1) may rise in the second direction (D2) after passing through the second scrubbing hole (240H) and then passing through the third scrubbing hole (250H). After the gas (G in FIG. 1) passes through the third scrubbing hole (250H) and then bubbles may be formed on the upper surface of the third scrubbing plate (250).

[0142] When bubbles (BBL) are formed within the second cleaning solution (227), the contact area between the gas and the cleaning solution can be improved. Accordingly, a scrubbing device (20) with improved scrubbing efficiency can be provided.

[0143]

[0144] Hereinafter, a scrubbing device according to several other embodiments of the present invention will be described with reference to FIGS. 6 to 13. For convenience of explanation, any content overlapping with that described using FIGS. 2 to 5 will be briefly described or omitted.

[0145] FIGS. 6 to 13 are drawings for explaining scrubbing devices according to some other embodiments of the present invention. For reference, FIGS. 6, 7, 8, 9, 10, and 11 may each be cross-sectional views of scrubbing devices according to some other embodiments of the present invention, and FIGS. 12 and 13 may each be plan views of scrubbing devices according to some other embodiments of the present invention.

[0146] First, referring to FIG. 6, a scrubbing device (20) according to some embodiments may include a cleaning solution storage tank including a first tank (270a) and a second tank (270b).

[0147] The first tank (270a) and the second tank (270b) can be physically separated. The first tank (270a) can be placed at the bottom of the first sub-space (215a), and the second tank (270b) can be placed at the bottom of the second sub-space (215b).

[0148] In some embodiments, the first cleaning solution (225) and the second cleaning solution (227) may be different. In this case, the first impurity dissolved in the first cleaning solution (225) and the second impurity dissolved in the second cleaning solution (227) may also be different. The first cleaning solution (275a) in which the first impurity is dissolved and the second cleaning solution (275b) in which the second impurity is dissolved need to be stored in different tanks. This is because the first cleaning solution (275a) in which the first impurity is dissolved and the second cleaning solution (275b) in which the second impurity is dissolved must not be mixed so that they can be recycled and used in the scrubbing process later.

[0149] Therefore, the first tank (270a) and the second tank (270b) can be physically separated.

[0150] In some embodiments, the first cleaning solution (275a) containing the first impurity dissolved therein stored in the first tank (270a) may be supplied to the first sub-space (215a) through the spray nozzle (221). Similarly, the second cleaning solution (275b) containing the second impurity dissolved therein stored in the second tank (270b) may be supplied to the second sub-space (215b) through the cleaning solution supply nozzle (223). However, the technical idea of ​​the present invention is not limited thereto.

[0151] In some embodiments, although not shown, the scrubbing device (20) may further include a sub-cleaning liquid supply nozzle. The sub-cleaning liquid supply nozzle may be positioned at the top of the scrubbing chamber (210). The sub-cleaning liquid supply nozzle may supply the cleaning liquid to the upper surface of the third scrubbing plate (250).

[0152] The above-described sub-cleaning liquid supply nozzle can supply a cleaning liquid with small particles onto the upper surface of the third scrubbing plate (250). Accordingly, the contact area between the cleaning liquid and the gas can be improved. Accordingly, a scrubbing device (20) with improved scrubbing efficiency can be provided.

[0153] Referring to FIG. 7, the spray nozzle (221) can spray the first cleaning liquid (225) in a first direction (D1). The direction in which the first cleaning liquid (225) is sprayed can be parallel to the direction in which the scrubbing plates (230, 240, 250) extend. The direction in which the first cleaning liquid (225) is sprayed can intersect with the second direction (D2). The direction in which the first cleaning liquid (225) is sprayed can intersect with the direction in which the gas flows (e.g., the second direction (D2)).

[0154] Specifically, the scrubbing device (20) according to some embodiments may further include a pipe disposed above the scrubbing chamber (210) and extending in a second direction (D2) within the first sub-space (215a). A spray nozzle (221) may be connected to the pipe and directed in the first direction (D1).

[0155] The first cleaning liquid (225) can be sprayed in a first direction (D1) in the first sub-space (215a). The gas (G in FIG. 1) can descend in a second direction (D2) in the first sub-space (215a). That is, the direction in which the first cleaning liquid (225) is sprayed and the direction in which the gas (G in FIG. 1) moves can be substantially perpendicular. Since the first cleaning liquid (225) is not sprayed in the second direction (D2), the contact time between the first cleaning liquid (225) and the gas (G in FIG. 1) can be substantially improved, and accordingly, a scrubbing device (20) with increased efficiency can be provided.

[0156] Referring to FIG. 8, the spray nozzle (221) can spray the first cleaning liquid (225) in a fourth direction (D4). The fourth direction (D4) can be any direction between the second direction (D2) and the first direction (D1). That is, the first cleaning liquid (225) can be sprayed in any direction intersecting the first direction (D1) and the second direction (D2).

[0157] Specifically, the scrubbing device (20) according to some embodiments may further include a pipe disposed at the top of the scrubbing chamber (210) and extending in a second direction (D2). A spray nozzle (221) may be connected to the pipe and directed in a fourth direction (D4).

[0158] The first cleaning liquid (225) can be sprayed in a fourth direction (D4) intersecting the first direction (D1) and the second direction (D2) in the first sub-space (215a). The gas (G in FIG. 1) can descend in the second direction (D2) in the first sub-space (215a). That is, the direction in which the first cleaning liquid (225) is sprayed and the direction in which the gas (G in FIG. 1) moves can intersect. Since the first cleaning liquid (225) is not sprayed in the second direction (D2), the contact time between the first cleaning liquid (225) and the gas (G in FIG. 1) can be substantially improved, and accordingly, a scrubbing device (20) with increased efficiency can be provided.

[0159] More specifically, the first cleaning liquid (225) is sprayed in both the second direction (D2) and the first direction (D1). Since the first cleaning liquid (225) is sprayed in a direction opposite to the direction in which the gas flows (e.g., the second direction (D2)), the contact time between the first cleaning liquid (225) and the gas can be further improved.

[0160] Referring to FIG. 9, a scrubbing device (20) according to some embodiments may include two scrubbing plates (230, 240). That is, the scrubbing device (20) may include a first scrubbing plate (230) and a second scrubbing plate (240).

[0161] A second scrubbing plate (240) may be placed on the first scrubbing plate (230). The second scrubbing plate (240) may be placed on the upper surface of the first scrubbing plate (230). The first scrubbing plate (230) may be placed on the lower surface of the second scrubbing plate (240). No other scrubbing plate may be placed on the upper surface of the second scrubbing plate (240).

[0162] In some embodiments, the second cleaning liquid (227) may be supplied from the cleaning liquid supply nozzle (223) and discharged to the upper surface of the second scrubbing plate (240). Specifically, the second cleaning liquid (227) may be discharged to an area of ​​the upper surface of the second scrubbing plate (240) adjacent to the second inner wall (210SW2) of the scrubbing chamber (210). The second cleaning liquid (227) may be discharged to an area of ​​the upper surface of the second scrubbing plate (240) that is furthest from the second scrubbing wall (245).

[0163] The discharged second cleaning liquid (227) can flow from the upper surface of the second scrubbing plate (240) toward the second scrubbing wall (245) while the second scrubbing process is being performed. The second cleaning liquid (227) can flow downwards over the second scrubbing wall (245). At this time, the second cleaning liquid (227) does not flow downwards through the second scrubbing hole (240H). The second cleaning liquid (227) that flows downwards over the second scrubbing wall (245) can be discharged onto the upper surface of the first scrubbing plate (230).

[0164] Likewise, the second cleaning liquid (227) may flow from the upper surface of the first scrubbing plate (230) toward the first scrubbing wall (235) while the second scrubbing process is being performed. At this time, the second cleaning liquid (227) does not flow downward through the first scrubbing hole (230H). The second cleaning liquid (227) may flow beyond the first scrubbing wall (235) to the lower portion of the scrubbing chamber (210).

[0165] The scrubbing device (20) illustrated in FIG. 9 includes only two scrubbing plates (230, 240). Therefore, the height of the scrubbing device (20) in the second direction (D2) can be reduced. That is, when using the scrubbing device (20) according to some embodiments of the present invention, space efficiency can be improved.

[0166] Referring to FIG. 10, in a scrubbing device (20) according to some embodiments, the shape of the first scrubbing plate (230) and the shape of the second scrubbing plate (240) may be different from each other.

[0167] For example, the two ends of the first scrubbing plate (230) may be spaced apart from the separating wall (220) and the second inner wall (210SW2), respectively. Specifically, the first scrubbing plate (230) may not be in contact with and connected to both the separating wall (220) and the second inner wall (210SW2). Although not shown, the first scrubbing plate (230) may be in contact with and connected to the third inner wall (210SW3) and the fourth inner wall (210SW4). The first scrubbing plate (230) may extend in the third direction (D3).

[0168] A pair of first scrubbing walls (235) may be arranged at one end and the other end of the first scrubbing plate (230). Some of the pair of first scrubbing walls (235) may be interposed between the first scrubbing plate (230) and the separating wall (220). Others of the pair of first scrubbing walls (235) may be interposed between the first scrubbing plate (230) and the second inner wall (210SW2).

[0169] The space between the first scrubbing wall (235) and the separation wall (220) and the space between the first scrubbing wall (235) and the second inner wall (210SW2) may each be a space in which the second cleaning liquid (227) flows downward (for example, in the second direction (D2)).

[0170] On the other hand, both ends of the second scrubbing plate (240) may be connected to and in contact with the separating wall (220) and the second inner wall (210SW2), respectively. The second scrubbing plate (240) may have a structure in which the central portion is open.

[0171] That is, the second scrubbing plate (240) may have an opening. The opening may be formed in the central portion of the second scrubbing plate (240) and may extend in a third direction (D3). The opening may expose at least a portion of the upper surface of the first scrubbing plate (230). That is, the opening may overlap at least a portion of the upper surface of the first scrubbing plate (230) in the second direction (D2).

[0172] A pair of second scrubbing walls (245) may each be arranged in the central portion of the second scrubbing plate (240). A pair of second scrubbing walls (245) may each be arranged in the opening.

[0173] A pair of second scrubbing walls (245) may be spaced apart from each other in a first direction (D1). The space between the pair of second scrubbing walls (245) may be a space through which the second cleaning liquid (227) flows downward (e.g., in the second direction (D2)). That is, the second cleaning liquid (227) may flow downward through the opening.

[0174] In some embodiments, the second cleaning liquid (227) may be discharged to both ends of the second scrubbing plate (240). For example, the second cleaning liquid (227) may be discharged to an area adjacent to the separating wall (220) of the second scrubbing plate (240) and an area adjacent to the second inner wall (210SW2) of the second scrubbing plate (240).

[0175] The second cleaning liquid (227) discharged to the upper surface of the second scrubbing plate (240) can flow to the central portion of the second scrubbing plate (240). The second cleaning liquid (227) discharged to the upper surface of the second scrubbing plate (240) can flow to the opening. While the second cleaning liquid (227) flows to the central portion of the second scrubbing plate (240), impurities can be dissolved in the second cleaning liquid (227). The second cleaning liquid (227) can be discharged to the upper surface of the first scrubbing plate (230) over the second scrubbing wall (245). The second cleaning liquid (227) discharged to the upper surface of the first scrubbing plate (230) can flow to both ends of the first scrubbing plate (230).

[0176] In Fig. 10, the scrubbing device (20) is illustrated as including two scrubbing plates, but the technical idea of ​​the present invention is not limited thereto. If the scrubbing device (20) includes three scrubbing plates, the shape of the third scrubbing plate may be identical to the shape of the first scrubbing plate (230). The third scrubbing plate may be placed on the second scrubbing plate (240).

[0177] If the scrubbing device (20) includes four scrubbing plates, the shape of the third scrubbing plate may be the same as the shape of the first scrubbing plate (230), and the shape of the fourth scrubbing plate may be the same as the shape of the second scrubbing plate (240). The third scrubbing plate may be disposed on the second scrubbing plate (240), and the fourth scrubbing plate may be disposed on the third scrubbing plate.

[0178] Referring to FIG. 11, a scrubbing device (20) according to some embodiments may include one scrubbing plate (230). That is, the scrubbing device (20) may include a first scrubbing plate (230).

[0179] In some embodiments, the second cleaning liquid (227) may be supplied from the cleaning liquid supply nozzle (223) and discharged to the upper surface of the first scrubbing plate (230). Specifically, the second cleaning liquid (227) may be discharged to an area adjacent to the separating wall (220) on the upper surface of the first scrubbing plate (230). The second cleaning liquid (227) may be discharged to an area farthest from the first scrubbing wall (235) on the upper surface of the first scrubbing plate (230).

[0180] The second cleaning liquid (227) may flow from the upper surface of the first scrubbing plate (230) toward the first scrubbing wall (235) while the second scrubbing process is being performed. At this time, the second cleaning liquid (227) does not flow downward through the first scrubbing hole (230H). The second cleaning liquid (227) may flow beyond the first scrubbing wall (235) to the lower portion of the scrubbing chamber (210).

[0181] The scrubbing device (20) illustrated in FIG. 11 includes only one scrubbing plate (230). Therefore, the height of the scrubbing device (20) in the second direction (D2) can be reduced. That is, when using the scrubbing device (20) according to some other embodiments of the present invention, space efficiency can be further improved.

[0182] Referring to FIG. 12, the separation wall (220) may have an 'ㄱ' shape in a plan view. For example, in a plan view, a part of the separation wall (220) may extend in a third direction (D3), and another part of the separation wall (220) may extend in a first direction (D1). One end of the separation wall (220) may be in contact with and connected to the fourth inner wall (210SW4) of the scrubbing chamber (210), and the other end of the separation wall (220) may be in contact with and connected to the second inner wall (210SW2) of the scrubbing chamber (210). That is, in FIG. 11, the separation wall (220) may have an 'ㄱ' shape that is rotated counterclockwise.

[0183] In some embodiments, the first sub-space (215a) may also have an 'ㄱ' shape in a planar view. The first sub-space (215a) may have an 'ㄱ' shape rotated counterclockwise in a planar view. The first sub-space (215a) may be defined by the first inner wall (210SW1) of the scrubbing chamber (210), the third inner wall (210SW3) of the scrubbing chamber (210), and the separation wall (220) in a planar view. As the first sub-space (215a) is formed wider, the first impurities may be dissolved more in the first cleaning solution in the first sub-space (215a).

[0184] Referring to Fig. 13, the separation wall (220) may have a 'ㄷ' shape in a plan view. For example, in a plan view, a part of the separation wall (220) may extend in a third direction (D3), and another part of the separation wall (220) may extend in a first direction (D1). Another part of the separation wall (220) may extend in the first direction (D1).

[0185] One end of the separating wall (220) may be connected to and in contact with the second inner wall (210SW2) of the scrubbing chamber (210), and the other end of the separating wall (220) may also be connected to and in contact with the second inner wall (210SW2) of the scrubbing chamber (210). That is, in FIG. 12, the separating wall (220) may have a 'ㄷ' shape rotated counterclockwise.

[0186] In some embodiments, the first sub-space (215a) may also have a 'ㄷ' shape in a planar view. The first sub-space (215a) may have a 'ㄷ' shape rotated counterclockwise in a planar view.

[0187] The first sub-space (215a) may be defined by the first inner wall (210SW1) of the scrubbing chamber (210) from a planar perspective, the third inner wall (210SW3) of the scrubbing chamber (210), the fourth inner wall (210SW4) of the scrubbing chamber (210), and the separation wall (220). As the first sub-space (215a) is formed wider, the first impurities may be dissolved more in the first cleaning liquid in the first sub-space (215a).

[0188]

[0189] Hereinafter, an operating method of a scrubbing device according to some embodiments of the present invention will be described with reference to FIGS. 14 and 15. For reference, FIG. 14 may be an exemplary flowchart for explaining an operating method of a scrubbing device according to some embodiments of the present invention.

[0190] FIGS. 14 and 15 are drawings for explaining an operating method of a scrubbing device according to some embodiments of the present invention.

[0191] First, referring to FIG. 14, an operating method of a scrubbing device according to some embodiments of the present invention may include providing a gas containing impurities to a scrubbing chamber (S100), spraying a first cleaning liquid in a first sub-space to dissolve some of the impurities in the first cleaning liquid (S200), providing a second cleaning liquid in a second sub-space on an upper surface of a scrubbing plate (S300), allowing the gas to rise and pass through a scrubbing hole so that the impurities contained in the gas are dissolved in the second cleaning liquid on the upper surface of the scrubbing plate (S400), and discharging the gas from which the impurities have been removed to the outside of the scrubbing chamber (S500). The concentration of the impurities contained in the gas discharged to the outside of the scrubbing chamber may be very low.

[0192] Specifically, referring to FIGS. 1 and 15, a gas (G) containing impurities can be provided from a process chamber (10) to a scrubbing device (20). The gas (G) containing impurities can pass through a first pipe (11) and be introduced into the interior of the scrubbing device (20) through a gas inlet (25) (see drawing reference numeral 310).

[0193] A gas (G) containing impurities can be introduced into the first sub-space (215a). For example, the gas (G) containing impurities can move to the lower part of the first sub-space (215a) (see drawing symbol 310).

[0194] In some embodiments, a first scrubbing process may be performed in a first sub-space (215a).

[0195] Specifically, a first cleaning liquid (225) may be supplied to the first sub-space (215a) through a spray nozzle (221) (see drawing reference numeral 410). The first cleaning liquid (225) may be water, but the technical concept of the present invention is not limited thereto. As another example, the first cleaning liquid (225) may be a viscous substance.

[0196] In Fig. 15, the first cleaning liquid (225) is depicted as being sprayed vertically in the second direction (D2), but the technical idea of ​​the present invention is not limited thereto. As depicted in Fig. 7, the first cleaning liquid (225) may also be sprayed in the first direction (D1). Furthermore, as depicted in Fig. 8, the first cleaning liquid (225) may be sprayed in any direction intersecting the first direction (D1) and the second direction (D2).

[0197] The spray nozzle (221) can supply a first cleaning liquid (225) having small particles. As the gas (G) containing impurities moves to the lower part of the first sub-space (215a), the impurities contained in the gas (G) can be dissolved in the first cleaning liquid (225). The first scrubbing process may be a process in which the impurities contained in the gas (G) are dissolved in the first cleaning liquid (225).

[0198] The gas (G) from which some of the impurities have been removed may be supplied to a second sub-space (215b) (see drawing reference numeral 310). A second scrubbing process may be performed in the second sub-space (215b). The second scrubbing process may be a process in which the impurities contained in the gas (G) are dissolved in a second cleaning solution (227).

[0199] In some embodiments, the impurities scrubbed in the first scrubbing process and the impurities scrubbed in the second scrubbing process may be the same or different.

[0200] While the second scrubbing process is being performed, the cleaning liquid supply nozzle (223) can supply the second cleaning liquid (227) to the upper surface of the third scrubbing plate (250) (see drawing reference numeral 420). The initially supplied second cleaning liquid (227) can flow downward through the third scrubbing hole (250H), the second scrubbing hole (240H), and the first scrubbing hole (230H). That is, in the initial state, the second cleaning liquid (227) can flow downward through the scrubbing holes (250H, 240H, 230H).

[0201] While the second scrubbing process is being performed, the gas (G) can rise in the second direction (D2). The gas (G) can pass through the first scrubbing hole (230H) and rise in the second direction (D2).

[0202] Specifically, referring to FIG. 4, the gas (G) may pass upwardly through the first scrubbing hole (230H). The gas (G) may rise in the second direction (D2) to form bubbles (BBL) within the second cleaning liquid (227). Impurities contained in the gas (G) may be dissolved in the second cleaning liquid (227) at the contact surface where the bubbles (BBL) and the second cleaning liquid (227) come into contact.

[0203] While the second scrubbing process is being performed, the second cleaning liquid (227) does not flow downward through the scrubbing holes (250H, 240H, 230H). This may be due to the pressure of the gas (G) rising through the scrubbing holes (250H, 240H, 230H).

[0204] While the second scrubbing process is being performed, the second cleaning liquid (227) may flow from the upper surface of the third scrubbing plate (250) toward the third scrubbing wall (255), and may flow over the third scrubbing wall (255) to the upper surface of the second scrubbing plate (240) (see drawing reference numeral 430). In addition, the second cleaning liquid (227) may flow from the upper surface of the second scrubbing plate (240) toward the second scrubbing wall (245), and may flow over the second scrubbing wall (245) to the upper surface of the first scrubbing plate (230) (see drawing reference numeral 440). Additionally, the second cleaning liquid (227) can flow from the upper surface of the first scrubbing plate (230) toward the first scrubbing wall (235) and flow beyond the first scrubbing wall (235) to the lower portion of the scrubbing chamber (210) (see drawing symbol 450).

[0205] The first cleaning liquid (225) provided from the first sub-space (215a) can be stored in the cleaning liquid storage tank (270) after the first scrubbing process is performed. The second cleaning liquid (227) that has passed the first scrubbing month (235) can be stored in the second cleaning liquid storage tank (270) after the second scrubbing process is performed. The cleaning liquid storage tank (270) can store the cleaning liquid (275) in which impurities are dissolved. The cleaning liquid (275) in which impurities are dissolved can include the first cleaning liquid in which impurities are dissolved and the second cleaning liquid in which impurities are dissolved.

[0206] While the second cleaning liquid (227) flows in the above direction, the gas (G) may pass through the scrubbing holes (250H, 240H, 230H) and rise in the second direction (D2). As the gas (G) passes through the scrubbing holes (250H, 240H, 230H), bubbles may be formed within the second cleaning liquid (227).

[0207] Specifically, the gas (G) can pass upwardly through the first scrubbing hole (230H) (see drawing symbol 320). Subsequently, the gas (G) can pass upwardly through the second scrubbing hole (240H) (see drawing symbol 330). Subsequently, the gas (G) can pass upwardly through the third scrubbing hole (250H) (see drawing symbol 340).

[0208] As the gas (G) passes upward through the scrubbing holes (250H, 240H, 230H), impurities can be dissolved in the second cleaning liquid (227).

[0209] Next, the gas (G') from which impurities have been removed can pass through the demister (260) and be discharged outside the scrubbing chamber (210) (see drawing symbol 350). The gas (G') discharged through the gas discharge port (26) may have almost no impurities remaining.

[0210] Although embodiments of the present invention have been described with reference to the attached drawings, the present invention is not limited to the above embodiments, but can be manufactured in various different forms. Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential characteristics of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A scrubbing chamber defining a scrubbing space for scrubbing impurities contained in the gas; A dividing wall dividing the above scrubbing space into a first sub-space and a second sub-space; A spray nozzle arranged in the first sub-space and spraying a first cleaning solution into the first sub-space; A first scrubbing plate disposed in the second sub-space and fixed to the separation wall; A cleaning solution supply nozzle arranged on the upper portion of the second sub-space and supplying a second cleaning solution to the upper surface of the first scrubbing plate; A cleaning solution storage tank installed at the bottom of the scrubbing chamber, in which the first cleaning solution with the impurities dissolved and the second cleaning solution with the impurities dissolved are stored; and comprising a plurality of first scrubbing holes penetrating the first scrubbing plate, Some of the impurities contained in the gas are dissolved in the first cleaning liquid in the first sub-space, A scrubbing device wherein another portion of the impurities contained in the gas is dissolved in the second cleaning liquid on the upper surface of the first scrubbing plate after the gas passes upward through the plurality of first scrubbing holes in the second sub-space.

2. In paragraph 1, Some of the other impurities contained in the gas are dissolved in the second cleaning liquid. The gas rises and passes through the first scrubbing hole, and bubbles are formed inside the second cleaning liquid on the upper surface of the first scrubbing plate. A scrubbing device, comprising dissolving the impurities at the contact surface of the bubble and the second cleaning liquid.

3. In paragraph 1, The first impurity dissolved in the first cleaning solution in the first sub-space and the second impurity dissolved in the second cleaning solution in the second sub-space are different from each other, A scrubbing device wherein the first cleaning liquid is different from the second cleaning liquid.

4. In paragraph 3, A scrubbing device wherein the first cleaning liquid has viscosity and the second cleaning liquid does not have viscosity.

5. In paragraph 3, A scrubbing device in which the particle sizes of the first impurity dissolved in the first cleaning solution and the particle sizes of the second impurity dissolved in the second cleaning solution are different from each other.

6. In paragraph 1, A second scrubbing plate disposed in the second sub-space and disposed on a lower surface facing the upper surface of the first scrubbing plate, Further comprising a plurality of second scrubbing holes penetrating the second scrubbing plate, A scrubbing device, wherein the first scrubbing plate and the second scrubbing plate are arranged in a zigzag pattern.

7. In paragraph 6, The second cleaning liquid flows in the first direction from the upper surface of the first scrubbing plate and is discharged to the upper surface of the second scrubbing plate, The second cleaning liquid flows in the -first direction on the upper surface of the second scrubbing plate, A scrubbing device in which the lower surface of the first scrubbing plate and the upper surface of the second scrubbing plate face each other.

8. In paragraph 6, A third scrubbing plate disposed in the second sub-space, fixed to the separation wall, and disposed on the lower surface facing the upper surface of the second scrubbing plate; Further comprising a plurality of third scrubbing holes penetrating the third scrubbing plate, The second scrubbing plate and the third scrubbing plate are arranged in a zigzag pattern, A scrubbing device wherein the first scrubbing plate and the third scrubbing plate overlap each other in a vertical direction.

9. In paragraph 1, A second scrubbing plate disposed in the second sub-space and disposed on a lower surface facing the upper surface of the first scrubbing plate, Further comprising a plurality of second scrubbing holes penetrating the second scrubbing plate, The shape of the first scrubbing plate and the shape of the second scrubbing plate are different from each other, The first scrubbing plate has an opening exposing at least a portion of the upper surface of the second scrubbing plate, The second scrubbing plate is a scrubbing device spaced apart from the separating wall.

10. In paragraph 9, The second cleaning liquid flows from the upper surface of the first scrubbing plate toward the opening and is discharged to the upper surface of the second scrubbing plate, The second cleaning liquid flows in a direction opposite to the opening on the upper surface of the second scrubbing plate, A scrubbing device in which the lower surface of the first scrubbing plate and the upper surface of the second scrubbing plate face each other.

11. In paragraph 1, A scrubbing device wherein the above-mentioned separation wall has at least one of a bar shape, an 'ㄱ' shape, or a 'ㄷ' shape in a planar view.

12. In paragraph 1, The above cleaning solution storage tank includes a first tank and a second tank which are separated from each other, The first cleaning solution in which the impurities are dissolved is stored in the first tank, A scrubbing device in which the second cleaning liquid in which the impurities are dissolved is stored in the second tank.

13. In paragraph 1, The above spray nozzle sprays the first cleaning liquid in the first direction, A scrubbing device, wherein the first direction is parallel to the extension direction of the first scrubbing plate.

14. In paragraph 1, The above spray nozzle sprays the first cleaning liquid in the first direction, A scrubbing device wherein the first direction intersects the extension direction of the first scrubbing plate and the extension direction of the separating wall, respectively.

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