Electronic device comprising antenna

Abstract

According to embodiments, an electronic device is provided. The electronic device may comprise: a display for the front surface; a frame for the side surface; a printed circuit board (PCB) including a first surface facing the front surface and a second surface facing the rear surface; an antenna radiator including a conductive portion, a feeding portion extending from the conductive portion, and a ground portion extending from the conductive portion; a first connection portion contacting the feeding portion of the antenna radiator on the second surface of the PCB; and a second connection portion contacting the ground portion of the antenna radiator on the second surface of the PCB. The antenna radiator may be disposed such that, when the second surface of the PCB is viewed, the feeding portion and the ground portion are adjacent to a first side of the electronic device, and at least a portion of the conductive portion is adjacent to a second side of the electronic device opposite to the first side.

Description

Electronic device including an antenna

[0001] The descriptions below relate to electronic devices that include antennas.

[0002] Electronic devices may utilize antennas to transmit signals. For example, wearable electronic devices, such as smart watches, may include an antenna used for communication with external electronic devices. In addition to the antenna, multiple electronic components for various functions of the wearable electronic device may be positioned within the housing of the wearable electronic device.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, an electronic device is provided. The electronic device includes a display for a front surface; a frame for a side surface; a printed circuit board (PCB), the PCB including a first surface facing the front surface and a second surface facing the rear surface; an antenna radiator, the antenna radiator including a conductive portion, a feeding portion located at one end of the antenna radiator, and a ground portion located at the other end of the antenna radiator, and a first connection portion contacting the feeding portion of the antenna radiator on a second surface of the PCB; and a second connection portion contacting the ground portion of the antenna radiator on the second surface of the PCB. The antenna radiator may be arranged such that, when facing the second surface of the PCB, the feeding portion and the ground portion are adjacent to a first side of the electronic device, and at least a portion of the conductive portion is adjacent to a second side of the electronic device opposite the first side. At least a portion of the conductive portion may be disposed adjacent to the first portion or the second portion among the first portion for connecting to the member for wearing the electronic device, the second portion for connecting to the member for wearing the electronic device, and the side portion between the first portion and the second portion in the frame.

[0005] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a display for a front surface; and a frame for a side surface; a printed circuit board (PCB), the PCB including a first surface facing the front surface and a second surface facing the rear surface; an antenna radiator; a first wireless communication circuit disposed on the PCB; and a second wireless communication circuit disposed on the PCB. A first end of the antenna radiator may be electrically connected to the first wireless communication circuit, and a second end of the antenna radiator may be electrically connected to a ground of the PCB. A first portion of the frame may be electrically connected to the second wireless communication circuit, and a second portion of the frame may be electrically connected to a ground of the PCB. At least a portion of the antenna radiator may be disposed to be spaced apart from the second surface of the PCB. The frame may include a first portion for connecting to a wearable member of the electronic device, a second portion for connecting to a wearable member of the electronic device, and a side portion between the first portion and the second portion. The region located farthest from the second end of the antenna radiator may be arranged adjacent to the first portion or the second portion of the frame.

[0006] Figure 1 is a front perspective view of an exemplary electronic device.

[0007] Figure 2 is a rear perspective view of an exemplary electronic device.

[0008] Figure 3 is a perspective view of an exemplary electronic device.

[0009] Figure 4 shows examples of components of an electronic device.

[0010] Fig. 5 shows an example of an antenna radiator of an electronic device.

[0011] Figure 6 shows an example of a connection portion between an antenna radiator and a printed circuit board (PCB).

[0012] Fig. 7a shows an example of the connection structure between the antenna radiator and the PCB.

[0013] Figure 7b shows an example of performance according to the ground portion of the antenna radiator.

[0014] Fig. 7c shows an example of a switching circuit for the ground portion.

[0015] Fig. 7d shows an example of time constant control using a switching circuit for the ground portion.

[0016] Figures 8a, 8b, and 8c are drawings for explaining the radiation pattern of the antenna radiator.

[0017] Figure 9 is a cross-sectional view of an exemplary electronic device.

[0018] Figures 10a and 10b show radiation performance according to the connection position of the ground and metal frame of the PCB.

[0019] Figures 11a, 11b, and 11c show the radiation performance of an antenna radiator including an additional conductive portion.

[0020] Fig. 12 shows an example of an antenna radiator using a flexible printed circuit board (FPCB) for a sensor circuit.

[0021] Figure 13 is a block diagram of an electronic device within a network environment.

[0022] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0023] In the various embodiments of the present disclosure described below, a hardware approach is described as an example. However, in the various embodiments of the present disclosure, hardware and

[0024] Since the various embodiments of the present disclosure include techniques that utilize software, they do not exclude software-based approaches.

[0025] Terms referring to parts of electronic devices used in the following description (e.g., substrate, printed circuit board (PCB), flexible PCB (FPCB), printed board assembly (PBA), module, antenna, antenna element, circuit, processor, chip, component, or device), terms referring to antennas (e.g., antenna radiator, radiator, conductive part, conductive line pattern, coil, conductive member, radiating member, radiating material, radiating part, antenna structure, antenna structure), terms referring to the location of components (e.g., part, location, area, point), terms referring to the shape of components (e.g., structure, structure, support, contact, or protrusion), terms referring to connections between structures (e.g., connecting part, contact part, supporting part, connecting member, contact member, supporting member, contact, contact structure, conductive member, or assembly), terms referring to open structures (e.g., slot, slit, or opening), terms referring to circuits (e.g., PCB, FPCB, signal line, ground line), Feeding lines, data lines, RF signal lines, antenna lines, RF paths, RF modules, RF circuits, splitters, dividers, couplers, or combiners are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... object', or '... body' used below may mean at least one shape structure or a unit that processes a function.

[0026] In addition, in the present disclosure, expressions such as more than or less than may be used to determine whether a specific condition is satisfied or fulfilled, but this is only a description to express an example and does not exclude descriptions such as more than or less than. A condition described as 'more than' may be replaced with 'more than', a condition described as 'less than' may be replaced with 'less than', and a condition described as 'more than and less than' may be replaced with 'more than and less than'. In addition, hereinafter, 'A' to 'B' mean at least one of the elements from A to (including A) and from B to (including B). Hereinafter, 'C' and / or 'D' mean at least one of 'C' or 'D', that is, including {'C', 'D', 'C' and 'D'}. In addition, hereinafter, the meaning of 'about E' may be replaced with a value within a margin of error of ±5% or ±10% based on E.

[0027] Figure 1 is a front perspective view of an exemplary electronic device. Figure 2 is a rear perspective view of an exemplary electronic device. According to one embodiment, the electronic device may include a wearable device worn on a portion of a user's body. For example, the wearable device may be referred to as a wrist-wearable electronic device or a smartwatch.

[0028] Referring to FIGS. 1 and 2 , an electronic device (100) according to one embodiment (e.g., electronic device (1301) of FIG. 13 ) may include a housing (110) forming a front surface (110A), a rear surface (110B), and a side surface (110C) surrounding a space between the front surface (110A) and the rear surface (110B), and a fastening member (150, 160) (e.g., a strap) connected to at least a portion of the housing (110) and configured to detachably fasten the electronic device (100) to a part of a user's body (e.g., a wrist, etc.). The straps may be fastened to each other through the fastening member, thereby fastening the wearable device to a part of the user's body (e.g., a wrist). In FIGS. 1 and 2 , the fastening member is illustrated as being disposed at an end of one of the straps and inserted into a fastening hole included in another one of the straps, but is not limited thereto.

[0029] The housing (110) may refer to a structure forming at least a portion of the front (110A), the back (110B), and the side (110C). In one embodiment, the front (110A) may be formed by a front plate (101) at least a portion of which is formed substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The back (110B) may be formed by a substantially opaque back plate (107). The back plate (107) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (110C) may be formed by a frame (106) coupled to the front plate (101) and the back plate (107). The frame (106) may be formed of metal. The frame (106) may be referred to as a 'metal frame', a 'side member', or a 'side bezel structure'.

[0030] The above-mentioned fastening member (150, 160) may be formed of various materials and shapes. For example, the fastening member (150, 160) may be formed of a woven material, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the above-mentioned materials, such that an integral or multiple unit links can flow with each other.

[0031] According to one embodiment, the electronic device (100) may include at least one of a display (120), an audio module (e.g., an audio output module (1355) and / or an audio module (1370) of FIG. 13), a sensor module (111), key input devices (102, 103, 104), and a connector hole (109). In some embodiments, the electronic device (100) may omit at least one of the components (e.g., the key input devices (102, 103, 104), the connector hole (109), or the sensor module (111)), or may additionally include other components.

[0032] The display (120) may be exposed, for example, through a significant portion of the front plate (101). The shape of the display (120) may correspond to the shape of the front plate (101), and may be in various shapes such as circular, oval, or polygonal. The display (120) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0033] The above audio module may include a microphone hole (105) and a speaker hole (108). A microphone may be placed inside the microphone hole (105) to acquire external sounds. The microphone may include multiple microphones to detect the direction of sounds, but is not limited thereto. The speaker hole (108) may be used as an external speaker and a receiver for calls. In some embodiments, the speaker hole (108) may be integrated into the microphone hole (105) so that the speaker hole (108) and the microphone hole (105) are implemented as a single hole, or a speaker may be included without the speaker hole (108) (e.g., a piezo speaker).

[0034] The sensor module (111) can generate an electric signal or data value corresponding to the internal operating state of the electronic device (100) or the external environmental state. The sensor module (111) can include, for example, a sensor module (111) (e.g., a heart rate monitor (HRM) sensor) arranged on the rear surface (110B) of the housing (110). The electronic device (100) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The key input devices (102, 103, 104) may include a wheel key (102) disposed on the front surface (110A) of the housing (110) and rotatable in at least one direction, and key buttons (102, 103) disposed on the side surface (110C) of the housing (110). The wheel key (102) may have a shape corresponding to the shape of the front plate (101). In other embodiments, the electronic device (100) may not include some or all of the above-mentioned key input devices (102, 103, 104). For example, the electronic device (100) may not include the wheel key (102), and the wheel key (102) that is not included may be implemented in another form, such as a soft key, on the display (120).

[0036] The connector hole (109) can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device. The electronic device (100) may further include a connector cover (not shown) that covers at least a portion of the connector hole (109) and blocks the inflow of external foreign substances into the connector hole, for example. In another embodiment, the electronic device (100) may not include the connector hole (109), in which case the electronic device (100) may transmit and receive power and / or data with the external electronic device using wireless communication.

[0037] The fastening member (150, 160) can be detachably fastened to at least a portion of the housing (110) using the locking member (151, 161). The fastening member (150, 160) can include at least one of a fixing member (152), a fixing member fastening hole (153), a band guide member (154), and a band fastening ring (155).

[0038] The fixing member (152) may be configured to fix the housing (110) and the fastening members (150, 160) to a part of the user's body (e.g., wrist, etc.). The fastening member fastening hole (153) may correspond to the fastening member (152) to fasten the housing (110) and the fastening members (150, 160) to a part of the user's body. The band guide member (154) may be configured to limit the range of motion of the fastening member (152) when the fastening member (152) is fastened to the fastening member fastening hole (153), thereby allowing the fastening members (150, 160) to be fastened in close contact with a part of the user's body. The band fixing ring (155) may limit the range of motion of the fastening members (150, 160) when the fastening member (152) and the fastening member fastening hole (153) are fastened.

[0039] FIG. 3 is an exploded perspective view of an exemplary electronic device (e.g., electronic device (100)). A first direction (D1) illustrated in FIG. 3 may indicate a direction toward the front of the electronic device (100). A second direction (D2) may indicate a direction toward the rear of the electronic device (100). The second direction (D2) illustrated in FIG. 3 may be an opposite direction to the first direction (D1). Hereinafter, the front direction may be a direction toward the front of the electronic device (100) and may correspond to the first direction (D1). The rear direction may be a direction toward the rear of the electronic device (100) and may correspond to the second direction (D2). Hereinafter, redundant descriptions of components having the same reference numerals as the aforementioned components may be omitted.

[0040] Referring to FIG. 3, the electronic device (100) may include a display (120). The display (120) may face the front. For example, a front plate (e.g., the front plate (101) of FIG. 1) of the electronic device (100) positioned in front of the display (120) may form the front of the electronic device (100). A rear plate (e.g., the rear plate (107) of FIG. 1) of the electronic device (100) may form the rear of the electronic device (100). The electronic device (100) may include a frame (106). The frame (106) may be a side bezel structure and may form a side of the electronic device (100). A front plate (e.g., the front plate (101) of FIG. 1) of the electronic device (100) may form the front of the electronic device (100).

[0041] According to one embodiment, the electronic device (100) may include a conductive plate (320). The conductive plate (320) may be disposed between the display (120) and the battery (325). The conductive plate (320) may be used to reduce the influence of electromagnetic waves generated from the battery (325) on the display (120). The conductive plate (320) may be disposed behind the display (120) and in front of the battery (325) which is disposed above the bracket (330). The conductive plate (320) may be referred to as a bracket plate, a battery plate, a battery suspension (stainless steel, SUS) suspension plate, and / or equivalent technical / structural terms in addition to the conductive plate. The electronic device (100) may include the battery (325). The battery (325) is a device for supplying power to at least one component of the electronic device (100), and may include, for example, a rechargeable secondary battery. The battery (325) may be accommodated in a space formed within the bracket (330).

[0042] The electronic device (100) may include a bracket (330). For example, the bracket (330) may be disposed within the frame (106). The bracket (330) may be positioned between the display (120) and a printed circuit board (PCB) (340). For example, the display (120) may be disposed on one side of the bracket (e.g., a side facing a first direction (D1)), and the PCB (340) may be disposed on the other side (e.g., a side facing a second direction (D2)). The bracket (330) may support the display (120) and the printed circuit PCB (340). The bracket (330) may be formed of a metallic material and / or a non-metallic (e.g., a polymer) material.

[0043] The electronic device (100) may include a printed circuit board (PCB) (340). The PCB (340) may include a first side (e.g., a side facing a first direction (D1)) and a second side (e.g., a side facing a second direction (D2)). A processor (e.g., a processor (1320) of FIG. 13), a memory (e.g., a memory (1330) of FIG. 13), and / or an interface (e.g., an interface (1377) of FIG. 13) may be mounted on the PCB (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor, a sensor processor, or a communication processor. The memory may include, for example, a volatile memory or a nonvolatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface), an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. A wireless communication circuit for transmitting or receiving a wireless signal may be disposed on the PCB (340). For example, the wireless communication circuit may include a wireless communication circuit for processing a signal in a cellular frequency band. As an example, the wireless communication circuit may include a wireless communication circuit configured to process a signal in a low frequency band (e.g., less than about 1.2 GHz) (e.g., Band 14). As an example, the wireless communication circuit may include a wireless communication circuit configured to process a signal in an intermediate frequency band (e.g., more than about 1.2 GHz and less than 2.3 GHz). As an example, the wireless communication circuit may include a wireless communication circuit configured to process a signal in a high frequency band (e.g., about 2.The wireless communication circuit may include a wireless communication circuit configured to process signals of a frequency band (e.g., 2.3 GHz or higher) of 3 GHz or higher. For example, the wireless communication circuit may include a wireless communication circuit for processing signals of a global positioning system (GPS) frequency band (e.g., L1 band, L5 band).

[0044] The electronic device (100) may include a non-conductive support portion (350). The non-conductive support portion (350) may be positioned in a space corresponding to the second direction (D2) from the PCB (340). The non-conductive support portion (350) may be used to support components at the rear of the electronic device (100).

[0045] According to one embodiment, the electronic device (100) may include an antenna radiator (360). The antenna radiator (360) may include a conductive member. The electronic device (100) may be configured to transmit a signal or receive a signal through the antenna radiator (360). A signal provided from a PCB (340) may be supplied to the antenna radiator (360). The antenna radiator (360) may be electrically connected to a ground of the PCB (340). According to one embodiment, the antenna radiator (360) may function as an inverted F antenna (IFA) type antenna.

[0046] According to one embodiment, the electronic device (100) may include a sensor circuit (380). The sensor circuit (380) may be referred to as a sensor module. The sensor circuit (380) may be referred to as the sensor module (111) of FIG. 1. The sensor circuit (380) may be used to detect biometric information of a user. For example, the sensor circuit (380) may include an optical sensor for detecting a heart rate and / or oxygen saturation of a user in contact with a plate (not shown) on the rear surface of the electronic device (100). As an example, the sensor circuit (380) may include a heart rate monitor (HRM) module.

[0047] An electronic device according to embodiments of the present disclosure (e.g., the electronic device (100) of FIGS. 1, 2, and 3) can transmit a wireless signal. The electronic device (100) can transmit or receive a signal through an antenna radiator (e.g., the antenna radiator (360) of FIG. 3). For example, the electronic device (100) can transmit or receive a signal of a specific frequency band through the antenna radiator (360). As an example, the frequency band may be a low frequency band below about 1.2 GHz. The low frequency band may include Band 14 (FDD (frequency division duplex), UL: 788-798 MHz (megahertz), DL: 758-768 MHz). In the present disclosure, the arrangement and circuit technology of the antenna radiator (360) of the electronic device (100) for providing high radiation performance in the frequency band are described.

[0048] FIG. 4 illustrates examples of components of an electronic device (e.g., electronic device (100)). For the components of FIG. 4, reference may be made to the descriptions of FIGS. 1, 2, and 3. Like reference numerals may indicate like descriptions.

[0049] Referring to FIG. 4, an electronic device (100) according to one embodiment may include a front plate (101), a frame (106), a display (120), a conductive plate (320), a battery (325), a PCB (340), and / or a non-conductive support portion (350). FIG. 4 may illustrate a cross-section of a laminated structure of the electronic device (100). The frame (106) may form a side surface of the electronic device (100). For example, a first portion (106a) and a second portion (106b) of the frame (106) may represent the left and right sides of the electronic device (100), respectively. Components of the electronic device (100) (e.g., the battery (325) or the PCB (340)) may be arranged within a space formed by the frame (106). The first direction (D1) of FIG. 3 may be the (+) z-axis direction. The second direction (D2) of FIG. 3 may be the (-) z-axis direction. The PCB (340) may include a first surface (441) facing the front (e.g., a surface facing the (+) z-axis direction) and a second surface (442) facing the rear (e.g., a surface facing the (-) z-axis direction). A non-conductive support portion (350) may be disposed behind the second surface (442) of the PCB (340). Hereinafter, an area corresponding to the second surface (442) of the PCB (340) (e.g., a surface facing the (-) z-axis among the surfaces of the PCB (340)) may be referred to as a rear area. The non-conductive support portion (350) and the antenna radiator (360) may be disposed in the rear area.

[0050] The electronic device (100) can transmit a signal through an antenna. According to one embodiment, the electronic device (100) can use at least a portion of the frame (106) as the antenna. For example, the electronic device (100) can receive a signal in a GPS frequency band through the frame (106). If the electronic device (100) attempts to transmit or receive a signal in a specific frequency range (e.g., a low frequency band, a frequency range including Band 14) through the frame (106), the signal in the GPS frequency band may cause electromagnetic interference with the signal. Therefore, the electronic device (100) may be required to have a separate antenna radiator in order to transmit a signal in a specific frequency range. The electronic device (100) according to embodiments of the present disclosure may use an antenna radiator (360) disposed in a rear area as the antenna radiator. According to one embodiment, the electronic device (100) may include a frame (106) and an antenna radiator (360) as an antenna for transmitting a signal. A wireless signal provided through a power feed unit (401) may be transmitted to the antenna radiator (360). The antenna radiator (360) may be configured to radiate a wireless signal from the power feed unit (401) to the outside. For example, the electronic device (100) may use the antenna radiator (360) to transmit a signal of a cellular frequency band of a first range (e.g., a low frequency band below about 1.2 GHz). As an example, the cellular frequency band of the first range may include Band 14. The electronic device (100) may use the frame (106) to transmit a signal of a cellular frequency band of a second range (e.g., an intermediate frequency band above about 1.2 GHz and below about 2.3 GHz, a high frequency band above about 2.3 GHz). For example, the electronic device (100) may utilize an antenna radiator (360) to transmit signals in a cellular frequency band of a specific range (e.g., a low frequency band below about 1.2 GHz).The electronic device (100) may utilize a frame (106) to transmit a signal in a GPS frequency band. For example, the GPS frequency band may include the L5 band (e.g., 1176.56 MHz).

[0051] According to one embodiment, the antenna radiator (360) may be electrically connected to the ground (402) of the PCB (340). The antenna radiator (360) may include an area connected to the ground (402) in order to function as an inverted F antenna (IFA) type antenna. According to one embodiment, the antenna radiator (360) may include an area connected to the feed unit (401) and the ground (402) in a position adjacent to one side of the electronic device (100) (e.g., the first side (411), or the side facing the (-) x-axis direction), and may include an open area in a position adjacent to the other side of the electronic device (100) (e.g., the second side (412), or the side facing the (+) x-axis direction). For the IFA type antenna, each component of the antenna radiator (360) is described through FIG. 5.

[0052] FIG. 5 illustrates an example of an antenna radiator (e.g., antenna radiator (360)) of an electronic device (e.g., electronic device (100)). Like reference numerals may represent like descriptions.

[0053] Referring to FIG. 5, the electronic device (100) may include an antenna radiator (360). The antenna radiator (360) may include a conductive member. The antenna radiator (360) may include a feeding portion (510) located at one end (hereinafter, a first end) of the antenna radiator (360) and a ground portion (520) located at the other end (hereinafter, a second end) of the antenna radiator (360). The feeding portion (510) of the antenna radiator (360) may be electrically connected to a feeding unit (501). The electronic device (100) may be configured to radiate an RF signal to the outside by feeding the RF signal from the feeding unit (501) (e.g., the feeding unit (401) of FIG. 4, or a feeding line connected to a wireless communication circuit on a PCB (340)) to the antenna radiator (360). In addition, the electronic device (100) may be configured to transmit a wireless signal received through the antenna radiator (360) to the feeder (501). According to embodiments of the present disclosure, the ground portion (520) of the antenna radiator (360) may be electrically connected to the ground (502) (e.g., the ground (402) of FIG. 4 , or the ground layer of the PCB (340)). In order to sufficiently secure the radiation performance of the antenna radiator (360) within the limited space of the electronic device (100), an IFA type antenna may be used. For the IFA type antenna, the ground portion (520) may be electrically connected to the ground (502) (e.g., an area connected to the ground layer of the PCB (340)) through a connecting member (e.g., a C-clip, a conductive pattern). The ground portion (520) may be referred to as a ground point of the IFA type antenna. For the above IFA type antenna, the feeding portion (510) of the antenna radiator (360) may be electrically connected to the feeding portion (501) of the electronic device (100) (e.g., a feeding line connected to a wireless communication circuit on a PCB (340)). The above-mentioned area may be referred to as a feeding point of the IFA type antenna.For the IFA type antenna, the antenna radiator (360) may include an open area (533). For example, the open area (533) may refer to an area including an end point on the side opposite to the side where a ground point or a feed point is formed among the antenna radiators (360). The end point may be referred to as an open point of the IFA type antenna. For example, a separate feed point or a ground point may not be formed within the open area (533). At least a portion of the antenna radiator (360) may have an area in a plane (e.g., an xy plane). The antenna radiator (360) may correspond to a planar inverted F antenna (PIFA) type antenna as an example of an IFA type antenna. In one embodiment, the antenna radiator (360) may be implemented as a flexible printed circuit board (FPCB).

[0054] According to one embodiment, the antenna radiator (360) may include a feed portion (510), a ground portion (520), and a conductive portion (530). The feed portion (510) may correspond to a first end of the antenna radiator (360). The feed portion (510) may be electrically connected to a wireless communication circuit of a PCB (340). The wireless communication circuit may be configured to transmit a signal in a frequency band (e.g., a low frequency band, about 600 MHz to 1.2 GHz) for transmission through the antenna radiator (360). The feed portion (510) may be formed to extend from the conductive portion (530). The feed portion (510) may be electrically connected to a component of the PCB (340) (e.g., a wireless communication circuit on a second surface). For this purpose, the power supply portion (510) may be disposed between the non-conductive support portion (350) and the second surface of the PCB (340). The ground portion (520) may be electrically connected to the ground of the electronic device (100). The ground portion (520) may correspond to the second end of the antenna radiator (360). The ground may correspond to at least one of the ground of the PCB (340), the frame (106), the bracket (330), and / or the metal substrate of the display (120). For example, the ground portion (530) may be electrically connected to the ground of the PCB (340), and the ground of the PCB (340) may be connected to a portion of the frame (106). The ground portion (520) may be formed to extend from the conductive portion (530). The ground portion (520) may be electrically connected to a component of the PCB (340) (e.g., a wireless communication circuit on the second surface). For this purpose, the ground portion (520) may be positioned between the non-conductive support portion (350) and the second surface of the PCB (340). The conductive portion (530) may refer to a portion formed between the power supply portion (510) and the ground portion (520).For example, a part of the conductive portion (530) may be placed behind (e.g., in the (-) z-axis direction) the non-conductive support portion (350). To this end, a part of the antenna radiator (360) may pass through at least one hole (not shown) of the non-conductive support portion (350). For example, at least a part of the conductive portion (530) or the feed portion (510) may pass through a hole (not shown) of the non-conductive support portion (350). For example, at least a part of the conductive portion (530) or the ground portion (520) may pass through a hole (not shown) of the non-conductive support portion (350).

[0055] In order to function as an IFA type antenna, the antenna radiator (360) may be required to have sufficient length. For resonance and radiation efficiency, the wavelength of the transmitted signal may be When the IFA type antenna is said to be, the length from the ground point (the end connected to the ground in the IFA antenna) to the open point (the open end in the IFA antenna) is / 4 (hereinafter, IFA antenna length or PIFA antenna length) may be required. For example, in order to transmit a signal with a frequency of 800 MHz, an IFA antenna length of about 93.75 mm or more may be required. In order to secure the corresponding antenna length within the limited space of the electronic device (100), the conductive portion (530) of the antenna radiator (360) may be arranged such that one area (e.g., open area (533)) of the conductive portion (530) is adjacent to one side (e.g., the first side (411) of FIG. 4) of the electronic device (100) adjacent to the feed portion (510) and the ground portion (520) and the opposite side (e.g., the second side (412) of FIG. 4). For example, the feed portion (510) and the ground portion (520) may be adjacent to the first side (411) of the electronic device (100). A portion of the conductive portion (530) may be disposed on a second side (412) of the electronic device (100) opposite to the first side of the electronic device (100). For example, the first side (411) may face upward (e.g., in the (-) x-axis direction) and the second side (412) may face downward (e.g., in the (+) x-axis direction) with respect to a plane (e.g., an xy plane). The feeding portion (510) may correspond to a feeding point of an IFA type antenna. The ground portion (520) may correspond to a grounding point of an IFA type antenna. An open area (533) of the conductive portion (530) may correspond to an open point of an IFA antenna. When looking at the second side (e.g., the second side (442) of FIG. 4) of the PCB (340), the antenna radiator (360) may be arranged such that the feed portion (510) and the ground portion (520) are adjacent to the first side (411) and at least a portion of the conductive portion (530) is adjacent to the second side (412) opposite to the first side (411). The feed portion (510) and the ground portion (520) may be connected to the second side (442) of the PCB (340).Accordingly, the power supply portion (510) and the ground portion (520) can be arranged adjacent to the first side (411) of the electronic device (100). The distance from the ground point (e.g., the ground portion (520)) to the open point is approx. / 4 or more is required, an area of ​​the conductive portion (530) corresponding to the open point may be arranged adjacent to the second side (412) of the electronic device (100). As an example, the shape of the conductive portion (530) may correspond to a 'U' shape. At least a portion of the antenna radiator (360) may include a 'U' shape.

[0056] Fig. 6 illustrates an example of a connection portion between an antenna radiator (e.g., antenna radiator (360)) and a printed circuit board (PCB) (e.g., PCB (340)). Fig. 6 describes a connection structure between the antenna radiator (360) and the PCB (340). The same reference numbers may indicate the same description.

[0057] Referring to FIG. 6, the electronic device (100) may include a first connection portion (610) and a second connection portion (620). Each of the first connection portion (610) and the second connection portion (620) may be referred to as a connection member, a conductive member, a contact member, a contact portion, a contact, a feeding contact, an antenna contact, and / or equivalent technical / structural terms in addition to the connection portion. For example, each of the first connection portion (610) and the second connection portion (620) may include a C-clip. The first connection portion (610) may be used to connect the PCB (340) and the feeding portion (510) of the antenna radiator (360). For example, the first connection portion (610) may electrically connect a feeding line from a wireless communication circuit of the PCB (340) and the feeding portion (510). The second connecting portion (620) can be used to connect the PCB (340) and the ground portion (520) of the antenna radiator (360). For example, the second connecting portion (620) can electrically connect the ground layer of the PCB (340) and the ground portion (520).

[0058] According to one embodiment, the first connection portion (610) may be disposed on a second surface (e.g., the second surface (442) of FIG. 4) of the PCB (340) (e.g., the surface facing the (-) z-axis). The first connection portion (610) may be in contact with the feeding portion (510) of the antenna radiator (360). RF signals from the feeding portion (e.g., the feeding portion (501) of FIG. 5) disposed on the PCB (340) may be fed to the conductive portion (530) through the first connection portion (610). The second connection portion (620) may be disposed on a second surface (442) of the PCB (340) (e.g., the surface facing the (-) z-axis). The second connection portion (620) may be in contact with the ground portion (520) of the antenna radiator (360). The antenna radiator (360) can function as a radiator of an IFA type antenna by connecting the power supply portion (510) to the power supply portion (501) through the first connection portion (610) and connecting the ground portion (520) to the ground (502) through the second connection portion (620).

[0059] As illustrated in FIG. 6, a distance between the conductive portion (530) and the second side (442) of the PCB (340) in one axis (e.g., the z-axis) may be greater than a distance between the feeding portion (510) and the conductive portion (520) from the second side (442) of the PCB (340). For example, at least a portion of the conductive portion (530) may be disposed on a portion of a non-conductive support portion (e.g., the non-conductive support portion (350)). The portion may have a surface facing the (-) z-axis. The feeding portion (510) may extend from the conductive portion (530). For example, the conductive portion (530) may be connected to the feeding portion (510) by passing through a hole (not shown) in the non-conductive support portion (350). The ground portion (520) may extend from the conductive portion (530). For example, the conductive portion (530) can be connected to the ground portion (520) through a hole (not shown) of the non-conductive support portion (350).

[0060] Fig. 7a shows an example of a connection structure between an antenna radiator (e.g., antenna radiator (360)) and a PCB (e.g., PCB (340)). The same reference numbers may indicate the same description.

[0061] Referring to FIG. 7A, the electronic device (100) may include a first connection portion (610) and a second connection portion (620). For example, the first connection portion (610) may include a C-clip. The second connection portion (620) may include a C-clip. The first connection portion (610) may be used to connect the PCB (340) and the feeding portion (510) of the antenna radiator (360). The second connection portion (620) may be used to connect the PCB (340) and the ground portion (520) of the antenna radiator (360). Through the first connection portion (610) and the second connection portion (620), the antenna radiator (360) and the PCB (340) may be connected in a loop shape.

[0062] According to one embodiment, the antenna radiator (360) may be disposed on a rear surface area of ​​the electronic device (100) (e.g., an area facing the second surface (442) of the PCB (340). For target performance, the antenna radiator (360) may have a loop shape in which one end is connected to ground and the other end is open, for the operating characteristics of a PIFA type antenna. In order to function as a PIFA type antenna, the other end of the antenna radiator (360) (e.g., the ground portion (520)) may be shorted to ground. In order to function as a PIFA type antenna, the antenna radiator (360) may have a feed point (e.g., the feed portion (510)) that is separated from the shorting point. The conductive portion (530) may refer to a portion formed between the feed portion (510) and the ground portion (520). As a non-limiting example, the conductive portion (530) may be formed integrally with the feed portion (510) and the ground portion (520). A portion of the conductive portion (530) may be adjacent to a side of the electronic device (100) opposite to the side to which the feed portion (510) and the ground portion (520) are adjacent, in order to secure a length for resonance in an IFA type antenna. For example, the feed portion (510) and the ground portion (520) may be adjacent to a first side of the electronic device (100) (e.g., a portion facing the (-) x-axis, the first side (411) of FIG. 4). A portion of the conductive portion (530) may be disposed on a second side of the electronic device (100) opposite to the first side of the electronic device (100) (e.g., a portion facing the (+) x-axis, the second side (412) of FIG. 4). In one embodiment, when looking at the second side (442) of the PCB (340), the shape of the conductive portion (530) may correspond to a 'U' shape. In one embodiment, when looking at the second side (442) of the PCB (340), at least a portion of the antenna radiator (360) may have a 'U' shape.For example, the antenna radiator (360) may be formed in a loop shape with an open end.

[0063] The antenna radiator (360) and the PCB (340) can be connected through a first connection portion (610) and a second connection portion (620). The conductive portion formed from the power supply portion (510) in contact with the first connection portion (610) to the ground portion (520) in contact with the second connection portion (620) through the conductive portion (530) can have a 'U' shape. The antenna radiator (360) can have a 'U' shape in which the side (e.g., the first side (411)) connected to the PCB (340) is open. By connecting one end of the antenna radiator (360) to the ground (i.e., by being short-circuited), the antenna radiator (360) can function as an IFA type antenna. Since at least a portion of the antenna radiator (360) has an area in one plane (e.g., xy plane), the antenna radiator (360) may correspond to a planar inverted F antenna (PIFA) type antenna. As the PIFA type antenna is implemented through shorting one end of the antenna radiator (360) within a limited area of ​​the electronic device (100), the required radiation performance can be secured. The performance according to the PIFA type antenna is described in detail through FIG. 7b.

[0064] In FIG. 7A, a C-clip is exemplified as a connecting member for electrical connection between the antenna radiator (360) and the PCB (340), but embodiments of the present disclosure are not limited thereto. For example, a separate conductive pattern and / or conductive BI may be used instead of the C-clip as the first connecting portion (610) or the second connecting portion (620).

[0065] Fig. 7b illustrates an example of performance according to the ground portion of an antenna radiator (e.g., antenna radiator (360)). Like reference numerals may indicate like descriptions. Fig. 7b illustrates a performance comparison between a monopole type antenna and a PIFA type antenna.

[0066] Referring to FIG. 7B, a graph (700) may represent total efficiency (or may be referred to as antenna efficiency) with respect to frequency. The total efficiency may represent the ratio of radiated power to the total power consumed by the antenna. The horizontal axis of the graph (700) represents frequency (unit: GHz (gigahertz)) and the vertical axis of the graph (700) represents total efficiency (unit: dB (decibel)). A line (751) represents the radiation performance of a conductive member when one end of the conductive member is not connected to the ground of the PCB (340). If one end of the conductive member is not connected to the ground, the conductive member can be used as a radiator of a monopole type antenna. For example, the line (751) may represent the total efficiency with respect to frequency when the end corresponding to the ground portion (520) of the antenna radiator (360) has an open structure. Line (752) represents the radiation performance of a conductive member (e.g., antenna radiator (360)) when one end (e.g., ground portion (520)) of the conductive member is connected to the ground of the PCB (340). As one end of the conductive member is connected to the ground of the PCB (340), the conductive member can be used as a radiator of a PIFA type antenna. For example, line (752) can represent the overall efficiency for frequency when the end corresponding to the ground portion (520) of the antenna radiator (360) has a structure in which it is shorted to the ground. As an example, the electronic device (100) can transmit a signal in Band 14 (FDD, UL: 788-798 MHz, DL: 758-768 MHz). Referring to graph (700), it can be confirmed that line (752) exhibits higher overall efficiency than line (751) in the corresponding frequency band. To obtain high overall efficiency in the frequency band, one end (e.g., ground portion (520)) of a conductive member (e.g., antenna radiator (360)) may be short-circuited.The required efficiency can be secured as the above conductive member functions as a PIFA type antenna.

[0067] Fig. 7c illustrates an example of a switching circuit for a ground portion (e.g., ground portion (520)). Like reference numerals may indicate like descriptions.

[0068] Referring to FIG. 7C, the electronic device (100) may include an antenna radiator (360). A wireless signal (720) may be provided to the antenna radiator (360) from a source (710) (e.g., a wireless communication circuit on a PCB (340)). The wireless signal (720) may be provided to a feeding portion (510) of the antenna radiator (360). A ground portion (520) of the antenna radiator (360) may be connected to a ground (750) (e.g., a metal portion of the frame (106), the display (120), or the bracket (330)) through a ground path (740) (e.g., a via or a ground line). Through this connection structure, the antenna radiator (360) may function as a radiator of a PIFA type antenna. For wideband in low frequency band, the antenna radiator (360) may be electrically connected to a switching circuit (730). A ground portion (520) of the antenna radiator (360) may be connected to a ground of a PCB (340) via a connecting member (e.g., a second connecting portion (620)). The ground of the PCB (340) may be connected to a ground (750) via a ground path (740). The switching circuit (730) may be electrically connected to the ground path (740). For example, the switching circuit (730) may be disposed on the PCB (340). According to one embodiment, the switching circuit (730) may include a plurality of elements (e.g., a first element (731), a second element (732), a third element (733), and / or a fourth element (734)). Instead of the ground portion (520) being directly connected to the ground (750), the ground portion (520) can be connected to the ground via a switching circuit (730) through a component, thereby performing impedance matching. The switching circuit (730) can electrically connect one of the plurality of components to the ground portion (520). Depending on the operation of the switching circuit (730), the impedance matching at the ground portion (520) can vary.Depending on the operation of the switching circuit (730), the time constant value for resonance may change. The electronic device (100) may shift resonance by changing the time constant value.

[0069] Fig. 7d illustrates an example of time constant control using a switching circuit (e.g., switching circuit (730)) for a ground portion (e.g., ground portion (520)). Like reference numerals may represent like descriptions.

[0070] Referring to FIG. 7D, a graph (760) may represent total efficiency with respect to frequency. The horizontal axis of the graph (760) represents frequency (unit: GHz) and the vertical axis of the graph (760) represents total efficiency (unit: dB). The electronic device (100) may include an antenna radiator (360). The antenna radiator (360) may function as a radiator of a PIFA type antenna. To adjust the time constant of the antenna radiator (360) at the ground, the electronic device (100) may include a switching circuit (730). Depending on the operation of the switching circuit (730), an inductor and / or capacitance in a ground path (e.g., ground path (740)) may change. As the inductor and / or capacitance change, a time constant value for resonance of the antenna radiator (360) may change. For example, referring to graph (760), the resonance can shift (770) depending on which element is connected to the ground path (740) in the switching circuit (730).

[0071] FIGS. 8A, 8B, and 8C are drawings for explaining the radiation pattern of an antenna radiator (e.g., antenna radiator (360)). The same reference numbers may indicate the same description.

[0072] Referring to FIG. 8A, an example (800) illustrates a PCB (340) and an antenna radiator (360) when viewed from a second side of the PCB (340) of the electronic device (100) (e.g., a side of the PCB (340) facing the (-) z-axis, the second side (442) of FIG. 4). The antenna radiator (360) may include a conductive portion (510), a ground portion (520), and a conductive portion (530).

[0073] Referring to Fig. 8b, example (850) represents a radiation pattern of an antenna radiator (360). A relatively strong radiation pattern can be confirmed from the feeding portion (510) to a region (877) of the conductive portion (530). The region (877) of the conductive portion (530) can be referred to as an open point in a PIFA type antenna. RF signals provided from the feeding portion (510) can be transmitted to the region (877) through the conductive portion (530). The RF signals can be radiated to the outside through the conductive portion (530).

[0074] Referring to FIG. 8C, a user may wear an electronic device (100). The electronic device (100) may include an antenna radiator (360). Considering the feeding direction of the antenna radiator (360) in example (850), the signal intensity in one area (877) of the conductive portion (530) may be relatively stronger than the signal intensity in another area of ​​the conductive portion (530). If a part (803) of the body of the user wearing the electronic device (100) (e.g., a hand) is located in an area where the signal intensity is strong, the radiated signal may be affected.

[0075] In one embodiment, a portion of the conductive portion (530) of the antenna radiator (360) may be positioned adjacent to a specific portion of the frame (106). For example, the electronic device (100) may include at least one fastening member (e.g., fastening member (150, 160) of FIG. 1). The frame (106) may include a first portion (811) for wearing the electronic device (100) (or may be referred to as a first strap portion), a second portion (812) for wearing the electronic device (100) (or may be referred to as a second strap portion), and a side portion (813) between the first portion (811) and the second portion (812). As an example, the first portion (811) may be coupled with the fastening member (150). The second portion (812) may be coupled with the fastening member (160). For example, the fastening member (150) may be a strap. The fastening member (150) and the fastening member (160) are illustrated as separate members, but one part of one member may be connected to the first part (811) and the other part of the member may be connected to the second part (812). When looking at the display of the electronic device (100), the first part (811) may be adjacent to the first side of the electronic device (100). When looking at the display of the electronic device (100), the first part (811) may be adjacent to the second side of the electronic device (100). For example, with respect to one plane (e.g., an xy plane), the first side may face upward (e.g., in the (-) x-axis direction) and the second side may face downward (e.g., in the (+) x-axis direction). The antenna radiator (360) may function as a PIFA type antenna. A portion of the conductive portion (530) may be adjacent to the first portion (811) or the second portion (812) among the first portion (811), the second portion (812), and the side portion (813). A signal radiated from the side portion (813) may be influenced by a part of the user's body (803) (e.g., a hand or an arm).To reduce this influence, a portion of the conductive portion (530) (e.g., a region (877) of FIG. 8B) may be positioned adjacent to the first portion (811) or the second portion (812). The antenna radiator (360) may be positioned such that the portion of the conductive portion (530) faces an open direction (e.g., a (-) axis direction, a (+) x-axis direction) rather than a direction in which a part of the body (803) is located. For example, the portion may include an open area (i.e., an open point) in a PIFA type antenna. For example, the portion of the conductive portion (530) may include a point of the conductive portion (530) that is farthest from the ground portion (520) of the antenna radiator (360). For example, a portion of the conductive portion (530) may include a point of the conductive portion (530) that is furthest from the feed portion (510) of the antenna radiator (360). For example, a portion of the conductive portion (530) may include a point of the conductive portion (530) that is furthest from the area that includes the feed portion (510) and the ground portion (520) of the antenna radiator (360).

[0076] FIG. 9 is a cross-sectional view of an exemplary electronic device (e.g., electronic device (100)). Like reference numerals may represent like descriptions.

[0077] Referring to FIG. 9, an example (900) is a drawing of an electronic device (100) viewed in the (-) x-axis direction. The electronic device (100) may include a PCB (340). An example (950) is a drawing of a region of the electronic device (100) including an antenna radiator (360) viewed in the (-) x-axis direction. The electronic device (100) may include a non-conductive support portion (350). A portion of the non-conductive support portion (350) may include a surface facing one direction (e.g., the (-) z-axis direction). At least a portion of the antenna radiator (360) (e.g., the conductive portion (530)) may be disposed on the portion. For example, the conductive portion (530) may be disposed to radiate a signal toward the (-) z-axis direction. The (-) z-axis direction may be referred to as a rear direction. The electronic device (101) may include a rear plate (107) positioned toward the rear. For example, the rear plate (107) may come into contact with a part of the user's body (e.g., a wrist) when the user wears the electronic device (101). The user's biometric data may be measured through a sensor (e.g., a heart rate monitor (HRM) module) positioned on the rear plate (107).

[0078] Although not shown in FIG. 9, the feed portion (510) and the ground portion (520) of the antenna radiator (360), which are connected to the conductive portion (530), may be coupled to the PCB (340). For example, the antenna radiator (360) may be formed of FPCB. The antenna radiator (360) may pass through a hole (not shown) of the non-conductive support portion (350). A portion of the antenna radiator (360) may pass through the hole of the non-conductive support portion (350) and then be connected to the PCB (340) through a connecting member (e.g., the first connecting portion (610)). Another portion of the antenna radiator (360) may pass through the hole of the non-conductive support portion (350) and then be connected to the PCB (340) through a connecting member (e.g., the second connecting portion (620)).

[0079] Figures 10a and 10b illustrate radiation performance according to the connection location between the ground of a PCB (e.g., PCB (340)) and a metal frame. The same reference numbers may indicate the same description.

[0080] Referring to FIG. 10A, the electronic device (100) may include a frame (106), a PCB (340), and an antenna radiator (360). The antenna radiator (360) may include a feeding portion (510), a ground portion (520), and a conductive portion (530) for connecting the feeding portion (510) and the ground portion (520). The electronic device (100) may include a feeding portion (501) and a ground (502). The feeding portion (510) of the antenna radiator (360) may be electrically connected to the feeding portion (501) of the PCB (340). The ground portion (520) of the antenna radiator (360) may be electrically connected to the ground (502) of the PCB (340). For example, the power supply (501) may be understood as a portion of a power supply line connected to a wireless communication circuit on the second side of the PCB (340) (e.g., the second side (442) of the PCB (340) in FIG. 4). The ground (502) may be understood as a portion on the second side (442) of the PCB (340) that is connected via a ground path (e.g., a ground path (740)) that is connected to the ground layer of the PCB (340).

[0081] The ground (502) of the PCB (340) can be electrically connected to another conductor (e.g., the frame (106)) that provides a reference potential. For example, for the ground (502) of the PCB (340), the PCB (340) can be connected to the frame (106) at one point. For example, among the multiple layers of the PCB (340), at least one layer (hereinafter, the ground layer) can be connected to the frame (106) at one point. The ground layer can be electrically connected to the ground (502) of the PCB (340). Example (1001) shows that the PCB (340) and the frame (106) are grounded at a first area (1011) corresponding to approximately the 5 o'clock direction when the (-) x-axis direction is assumed to be 12 o'clock based on a plane. Example (1002) shows that the PCB (340) and the frame (106) are grounded in the second region (1012) corresponding to approximately 1 o'clock when the (-) x-axis direction is assumed to be 12 o'clock with respect to one plane. Example (1003) shows that the PCB (340) and the frame (106) are grounded in the first region (1011) corresponding to approximately 5 o'clock and the third region (1013) corresponding to approximately 7 o'clock when the (-) x-axis direction is assumed to be 12 o'clock with respect to one plane. Example (1004) shows that the PCB (340) and the frame (106) are grounded in the first region (1011) corresponding to approximately 5 o'clock, the second region (1012) corresponding to approximately 1 o'clock, and the third region (1013) corresponding to approximately 7 o'clock when the (-) x-axis direction is assumed to be 12 o'clock with respect to one plane.

[0082] Referring to FIG. 10b, a graph (1050) may represent total efficiency for frequency. The horizontal axis of the graph (1050) represents frequency (unit: GHz) and the vertical axis of the graph (1050) represents total efficiency (unit: dB). The electronic device (100) may include an antenna radiator (360). The antenna radiator (360) may function as a radiator of a PIFA type antenna. A first line (1001) represents total efficiency corresponding to the first example (1001) of FIG. 10a. A second line (1002) represents total efficiency corresponding to the second example (1002) of FIG. 10a. A third line (1003) represents total efficiency corresponding to the third example (1003) of FIG. 10a. The fourth line (1004) represents the overall efficiency corresponding to the fourth example (1004) of Fig. 10a. The fifth line (1005) represents the overall efficiency when the PCB (340) connected to the antenna radiator (360) of Fig. 10a is not grounded to the frame (106).

[0083] Referring to the graph (1050), it can be confirmed that the resonant frequency shifts as the grounding position between the PCB (340) and the frame (106) changes. A design that considers the shift of the resonant frequency and the improvement of the isolation between antennas (e.g., a metal antenna using the frame (106) and a PIFA antenna using the antenna radiator (360)) through the change of the grounding position can be used. As an example, let us assume that the frequency of the target frequency band is approximately 1.2 GHz. The highest overall efficiency performance can be confirmed in the second example (1002). The overall efficiency performance can be increased as the position of the ground (502) on the PCB (340) connected to the ground portion (520) of the antenna radiator (360) is close to the position where the PCB (340) and the frame (106) are grounded. In one embodiment, the ground (e.g., ground layer) of the PCB (340) may be grounded to a portion extending from a portion of the frame (106). The portion of the frame to be grounded may be within a critical range from the ground portion (520) when looking at a second side of the PCB (340) (e.g., a side of the PCB (340) facing the (-) z-axis, the second side (442) of the PCB (340) in FIG. 4).

[0084] Figures 11a, 11b, and 11c illustrate the radiation performance of an antenna radiator (e.g., antenna radiator (360)) including an additional conductive portion. Like reference numerals may represent like descriptions.

[0085] Referring to FIG. 11A, the electronic device (100) may include an antenna radiator (360). The antenna radiator (360) may include a conductive portion (510), a ground portion (520), a conductive portion (530), and an additional conductive portion (1130). A first region (1131) of the additional conductive portion (1130) may be connected to the conductive portion (530). A second region (1132) of the additional conductive portion (1130) may be connected to the conductive portion (530).

[0086] Referring to FIG. 11b, example (1150) illustrates a radiation pattern of an antenna radiator (360). A radiation pattern having a certain signal intensity or higher can be confirmed not only in the conductive portion (530) but also in an area adjacent to an additional conductive portion (1130) in the feeding portion (510). The antenna radiator (360) can have an expanded radiation pattern through a shape that divides the paths of the conductor through which the current applied to the feeding portion (510) can flow (e.g., a closed loop shape).

[0087] Referring to FIG. 11C, a graph (1170) may represent radiation efficiency and total efficiency with respect to frequency. Radiation efficiency may represent the ratio of radiated power to power input to the antenna. Total efficiency may represent the ratio of radiated power to total power consumed by the antenna. For example, the total efficiency may be determined as a value obtained by multiplying the radiation efficiency by the impedance matching efficiency. The horizontal axis of the graph (1050) represents frequency (unit: GHz) and the vertical axis of the graph (1170) represents total efficiency (unit: dB). A first line (1181) represents the radiation efficiency of an antenna radiator (360) (e.g., the antenna radiator (360) of FIG. 5) that includes only a feeding portion (510), a ground portion (520), and a conductive portion (530) without including an additional conductive portion (1130). The second line (1182) represents the radiation efficiency of an antenna radiator (360) including a feed portion (510), a ground portion (520), a conductive portion (530), and an additional conductive portion (1130) (e.g., the antenna radiator (360) of FIGS. 11A and 11B). The third line (1191) represents the overall efficiency of an antenna radiator (360) including only a feed portion (510), a ground portion (520), and a conductive portion (530) without including an additional conductive portion (1130) (e.g., the antenna radiator (360) of FIG. 5). The fourth line (1192) represents the overall efficiency of the antenna radiator (360) (e.g., the antenna radiator (360) of FIGS. 11A and 11B) including the feed portion (510), the ground portion (520), the conductive portion (530), and the additional conductive portion (1130).

[0088] Comparing the first line (1181) and the second line (1182) in the graph (1170), it can be confirmed that the radiation efficiency increases as the additional conductive portion (1130) is included. Comparing the third line (1191) and the fourth line (1192) in the graph (1170), it can be confirmed that the overall efficiency increases as the additional conductive portion (1130) is included.

[0089] Fig. 12 illustrates an example of an antenna radiator (e.g., antenna radiator (360)) using a flexible printed circuit board (FPCB) for a sensor circuit. The same reference numbers may indicate the same description.

[0090] Referring to FIG. 12, the electronic device (100) may include a sensor circuit (380). For example, the sensor circuit (380) may include a heart rate monitor (HRM) module. A processing circuit (e.g., a processor (1320) of FIG. 13) may be disposed on a PCB (340). The electronic device (100) may include components for electrical connection between the processing circuit and the sensor circuit (380). For example, the electronic device (100) may include an FPCB (1260) connected to the sensor circuit (380). According to one embodiment, as in example (1210), the FPCB (1260) connected to the sensor circuit (380) may be used as an antenna radiator (360). In other words, one area of ​​the FPCB (1260) for the sensor circuit (380) (e.g., HRM module) may be connected to the power supply part (501) of the PCB (340) and one end may be connected to the ground (502) of the PCB (340). At least a portion of the FPCB (1260) may have a 'U' shape. In addition, according to one embodiment, as in example (1250), at least a portion of the FPCB (1260) may be used to electrically connect the sensor circuit (380) and the processing circuit on the PCB (340). The FPCB (1260) is an antenna radiator (360), and in a PIFA type antenna, the antenna length (e.g., the distance from the ground part to the open point) is / 4) may have a conductive portion having a length to secure a power supply portion (510), a ground portion (520), and a shape for connecting a sensor circuit (380) and a processing circuit.

[0091] In the present disclosure, a structure in which an antenna radiator (360) is arranged on a rear area of ​​an electronic device (100) is described through FIGS. 1 to 12. The antenna radiator (360) may be configured to radiate in a rear direction (e.g., a direction in which a user's body touches it). The antenna radiator (360) may be coupled to a PCB (340) to form a loop. The antenna radiator (360) has a single feed structure, and since an end of the antenna radiator (360) is electrically connected to the ground, it may function as a PIFA type antenna. Even if the positions of the feed portion (510) and the ground portion (520) are swapped, or the antenna radiator (360) rotates around the center of the electronic device (100), unlike the drawings illustrated through FIGS. 1 to 12, it may be understood as an embodiment of the present disclosure. This is because, if the end of the antenna radiator (360) in a single-feed structure is connected to ground and includes a 'U'-shaped conductive portion (530), it can function as a PIFA type antenna within a restricted space.

[0092] In embodiments, an electronic device (100) is provided. The electronic device (100) includes a display (120) for a front surface; a frame (106) for a side surface; a printed circuit board (PCB) (340), the PCB (340) including a first surface (441) facing the front surface and a second surface (442) facing the rear surface; an antenna radiator (360), the antenna radiator (360) including a conductive portion (530), a feeding portion (510) located at one end of the antenna radiator (360), and a ground portion (520) located at the other end of the antenna radiator (360), and a first connecting portion (610) contacting the feeding portion (510) of the antenna radiator (360) on the second surface of the PCB (340); And it may include a second connection portion (620) that contacts the ground portion (520) of the antenna radiator (360) on the second surface of the PCB (340). The antenna radiator (360) may be arranged such that, when looking at the second surface of the PCB (340), the feeding portion (510) and the ground portion (520) are adjacent to the first side of the electronic device (100), and at least a portion of the conductive portion (530) is adjacent to the second side of the electronic device (100) opposite to the first side. At least a part of the conductive portion may be arranged adjacent to the first portion or the second portion among a first portion (e.g., a portion connected to the fastening member (e.g., a strap)) for connecting to a member for wearing the electronic device (e.g., a fastening member (150)), a second portion (e.g., a portion connected to the fastening member (e.g., a strap)) for connecting to a member for wearing the electronic device (e.g., a fastening member (160)), and a side portion between the first portion and the second portion.

[0093] In embodiments, an electronic device (100) is provided. The electronic device (100) includes a display (120) for a front surface; a frame (106) for a side surface; a printed circuit board (PCB) (340), the PCB (340) including a first surface (441) facing the front surface and a second surface (442) facing the rear surface; an antenna radiator (360), the antenna radiator (360) including a conductive portion (530), a feeding portion (510) extending from the conductive portion (530), and a ground portion (520) extending from the conductive portion (530), and a first connection portion (610) contacting the feeding portion (510) of the antenna radiator (360) on a second surface of the PCB (340); And it may include a second connection portion (620) that contacts the ground portion (520) of the antenna radiator (360) on the second surface of the PCB (340). The antenna radiator (360) may be arranged such that, when looking at the second surface of the PCB (340), the feeding portion (510) and the ground portion (520) are adjacent to the first side of the electronic device (100), and at least a portion of the conductive portion (530) is adjacent to the second side of the electronic device (100) opposite to the first side. At least a part of the conductive portion may be arranged adjacent to the first portion or the second portion among a first portion (e.g., a portion connected to the fastening member (e.g., a strap)) for connecting to a member for wearing the electronic device (e.g., a fastening member (150)), a second portion (e.g., a portion connected to the fastening member (e.g., a strap)) for connecting to a member for wearing the electronic device (e.g., a fastening member (160)), and a side portion between the first portion and the second portion.

[0094] For example, the electronic device (100) may include a wireless communication circuit arranged on the PCB (340). The feeding portion (510) of the antenna radiator (360) may be electrically connected to the wireless communication circuit through the first connection portion (610). The ground portion (520) of the antenna radiator (360) may be electrically connected to the ground of the PCB (340) through the second connection portion (620). At least a portion of the antenna radiator (360) may be arranged to be spaced apart from the second surface of the PCB (340).

[0095] For example, the electronic device (100) may include a global positioning system (GPS) processing circuit. The wireless communication circuit may be configured to transmit or receive signals in a cellular frequency band via the antenna radiator (360). The GPS processing circuit may be configured to receive GPS signals via at least a portion of the frame (106).

[0096] For example, the electronic device (100) may include a second wireless communication circuit. The wireless communication circuit may be configured to transmit or receive signals in a frequency band of a first frequency range through the antenna radiator (360). The second wireless communication circuit may be configured to transmit or receive signals in a frequency band of a second frequency range higher than the first frequency range through at least a portion of the frame (106). The first frequency range may include Band 14. For example, the ground of the PCB (340) may be grounded at a portion extending from a portion of the frame (106). The portion of the frame (106) may be located within a critical range from the ground portion (520) of the antenna radiator (360) when looking at the second surface of the PCB (340).

[0097] For example, the electronic device (100) may include a switching circuit for a ground portion (520) of the antenna radiator (360). The switching circuit may be configured to electrically connect one of a plurality of elements to the ground portion (520).

[0098] For example, the electronic device (100) may include a non-conductive support portion. The non-conductive support portion may be disposed between the PCB (340) and the conductive portion (530). The feed portion (510) of the antenna radiator (360) may be connected to a portion that extends from the conductive portion (530) and passes through a hole of the non-conductive support portion. The ground portion (520) of the antenna radiator (360) may be connected to a portion that extends from the conductive portion (530) and passes through another hole of the non-conductive support portion. For example, the electronic device (100) may be disposed in front of the display (120) and may include a first plate for the front of the electronic device (100); a sensor circuit used for heart rate monitoring (HRM); and a second plate for the back of the electronic device (100).

[0099] For example, at least a portion of the antenna radiator (360) may be used to electrically connect the sensor circuit and the processing circuit on the PCB (340). For example, the frame (106) may include a first portion for wearing the electronic device (100), a second portion for wearing the electronic device (100), and a side portion between the first portion and the second portion. At least a portion of the antenna radiator (360) may be disposed adjacent to the first portion or the second portion among the first portion, the second portion, and the side portion of the frame (106).

[0100] For example, the first side may correspond to the first portion of the frame, and the second side may correspond to the second portion of the frame.

[0101] For example, the antenna radiator (360) may include an additional conductive portion (530) formed to extend from each of the first region and the second region of the conductive portion (530). The additional conductive portion (530) may be positioned to be spaced apart from the second side of the PCB (340). When looking at the second side of the PCB (340), the additional conductive portion (530) may be adjacent to the second side opposite the first side.

[0102] For example, at least a portion of the antenna radiator (360) may have a 'U' shape.

[0103] For example, the antenna radiator (360) may include a flexible printed circuit board (FPCB). The height of at least a portion of the conductive portion (530) from the PCB (340) may be higher than the height of the power supply portion (510) from the PCB (340) and the height of the ground portion (520) from the PCB (340).

[0104] For example, the distance between the area closest to the second side among the conductive portions (530) of the antenna radiator (360) and the ground portion (520) of the antenna radiator (360) may be at least 1 / 4 of the wavelength of the signal radiated through the antenna radiator (360).

[0105] In embodiments, an electronic device (100) is provided. The electronic device (100) may include a display (120) for a front surface; and a frame (106) for a side surface; a printed circuit board (PCB) (340), the PCB (340) including a first surface (441) facing the front surface and a second surface (442) facing the rear surface; an antenna radiator (360); a first wireless communication circuit disposed on the PCB (340); and a second wireless communication circuit disposed on the PCB (340). A first end (e.g., a power supply portion (510)) of the antenna radiator (360) may be electrically connected to the first wireless communication circuit, and a second end (e.g., a ground portion (520)) of the antenna radiator (360) may be electrically connected to a ground of the PCB (340). A first portion of the frame (106) may be electrically connected to the second wireless communication circuit, and a second portion of the frame (106) may be electrically connected to the ground of the PCB (340). At least a portion of the antenna radiator (360) may be arranged to be spaced apart from the second surface of the PCB (340). The frame may include a first portion for connecting to a wearable member of the electronic device, a second portion for connecting to a wearable member of the electronic device, and a side portion between the first portion and the second portion. A region of the antenna radiator that is furthest from the second end may be arranged to be adjacent to the first portion or the second portion of the frame.

[0106] For example, the first wireless communication circuit may be configured to transmit or receive signals in a frequency band of a first frequency range via the antenna radiator (360). The second wireless communication circuit may be configured to transmit or receive signals in a frequency band of a second frequency range higher than the first frequency range via at least a portion of the frame (106). The first frequency range may include Band 14.

[0107] For example, the electronic device (100) may include a switching circuit for the ground of the PCB (340) and the second end (e.g., ground portion (520)) of the antenna radiator (360). The switching circuit may be configured to electrically connect one of a plurality of elements to the second end (e.g., ground portion (520)).

[0108] For example, the electronic device (100) may include a global positioning system (GPS) processing circuit. The GPS processing circuit may be configured to receive GPS signals through at least a portion of the frame (106).

[0109] For example, the frame (106) may include a first portion for wearing the electronic device (100), a second portion for wearing the electronic device (100), and a side portion between the first portion and the second portion. The antenna radiator (360) may be arranged such that, when looking at the second surface of the PCB (340), the first end (e.g., the feeding portion (510)) and the second end (e.g., the ground portion (520)) of the antenna radiator (360) are adjacent to the first portion, and at least a portion of the antenna radiator (360) is adjacent to the second portion.

[0110] For example, the first portion may correspond to a first side of the electronic device, and the second portion may correspond to a second side of the electronic device opposite to the first side. The first end and the second end may be adjacent to the first portion in the frame.

[0111] For example, the antenna radiator (360) may be a flexible printed circuit board (FPCB). The height of at least a portion of the antenna radiator (360) from the PCB (340) may be higher than the height of the first end (e.g., the feeding portion (510)) from the PCB (340) and the height of the second end (e.g., the ground portion (520)) from the PCB (340).

[0112] The electronic device (100) described above with reference to FIGS. 1 to 12 may be understood as an example of an electronic device described below. Hereinafter, possible components of the electronic device or components of an electronic device connectable to the electronic device are described with reference to FIG. 13.

[0113] Figure 13 is a block diagram of an electronic device within a network environment.

[0114] Referring to FIG. 13, in a network environment (1300), an electronic device (1301) may communicate with an electronic device (1302) via a first network (1398) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1304) or a server (1308) via a second network (1399) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1301) may communicate with the electronic device (1304) via the server (1308). According to one embodiment, the electronic device (1301) may include a processor (1320), a memory (1330), an input module (1350), an audio output module (1355), a display module (1360), an audio module (1370), a sensor module (1376), an interface (1377), a connection terminal (1378), a haptic module (1379), a camera module (1380), a power management module (1388), a battery (1389), a communication module (1390), a subscriber identification module (1396), or an antenna module (1397). In some embodiments, the electronic device (1301) may omit at least one of these components (e.g., the connection terminal (1378)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1376), camera module (1380), or antenna module (1397)) may be integrated into a single component (e.g., display module (1360)).

[0115] The processor (1320) may, for example, execute software (e.g., a program (1340)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1301) connected to the processor (1320) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1320) may store commands or data received from other components (e.g., a sensor module (1376) or a communication module (1390)) in a volatile memory (1332), process the commands or data stored in the volatile memory (1332), and store result data in a non-volatile memory (1334). According to one embodiment, the processor (1320) may include a main processor (1321) (e.g., a central processing unit or an application processor) or a secondary processor (1323) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1321). For example, when the electronic device (1301) includes the main processor (1321) and the secondary processor (1323), the secondary processor (1323) may be configured to use less power than the main processor (1321) or to be specialized for a given function. The secondary processor (1323) may be implemented separately from the main processor (1321) or as a part thereof.

[0116] The auxiliary processor (1323) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1360), the sensor module (1376), or the communication module (1390)) of the electronic device (1301), for example, on behalf of the main processor (1321) while the main processor (1321) is in an inactive (e.g., sleep) state, or together with the main processor (1321) while the main processor (1321) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1323) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1380) or a communication module (1390)). In one embodiment, the auxiliary processor (1323) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1301) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1308)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0117] The memory (1330) can store various data used by at least one component (e.g., the processor (1320) or the sensor module (1376)) of the electronic device (1301). The data can include, for example, software (e.g., the program (1340)) and input data or output data for commands related thereto. The memory (1330) can include a volatile memory (1332) or a non-volatile memory (1334).

[0118] The program (1340) may be stored as software in memory (1330) and may include, for example, an operating system (1342), middleware (1344), or an application (1346).

[0119] The input module (1350) can receive commands or data to be used in a component of the electronic device (1301) (e.g., a processor (1320)) from an external source (e.g., a user) of the electronic device (1301). The input module (1350) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0120] The audio output module (1355) can output audio signals to the outside of the electronic device (1301). The audio output module (1355) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0121] The display module (1360) can visually provide information to an external device (e.g., a user) of the electronic device (1301). The display module (1360) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1360) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0122] The audio module (1370) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1370) can acquire sound through the input module (1350), output sound through the sound output module (1355), or an external electronic device (e.g., electronic device (1302)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1301).

[0123] The sensor module (1376) can detect the operating status (e.g., power or temperature) of the electronic device (1301) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1376) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0124] The interface (1377) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1301) with an external electronic device (e.g., the electronic device (1302)). In one embodiment, the interface (1377) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0125] The connection terminal (1378) may include a connector through which the electronic device (1301) may be physically connected to an external electronic device (e.g., the electronic device (1302)). According to one embodiment, the connection terminal (1378) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0126] The haptic module (1379) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1379) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0127] The camera module (1380) can capture still images and videos. According to one embodiment, the camera module (1380) may include one or more lenses, image sensors, image signal processors, or flashes.

[0128] The power management module (1388) can manage power supplied to the electronic device (1301). According to one embodiment, the power management module (1388) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0129] A battery (1389) may power at least one component of the electronic device (1301). In one embodiment, the battery (1389) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0130] The communication module (1390) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1301) and an external electronic device (e.g., electronic device (1302), electronic device (1304), or server (1308)), and the performance of communication through the established communication channel. The communication module (1390) may operate independently from the processor (1320) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1390) may include a wireless communication module (1392) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1394) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1304) via a first network (1398) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1399) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1392) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1396) to verify or authenticate the electronic device (1301) within a communication network such as the first network (1398) or the second network (1399).

[0131] The wireless communication module (1392) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1392) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1392) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1392) may support various requirements specified in the electronic device (1301), an external electronic device (e.g., the electronic device (1304)), or a network system (e.g., the second network (1399)). According to one embodiment, the wireless communication module (1392) may support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC implementation.

[0132] The antenna module (1397) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1397) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1397) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1398) or the second network (1399), may be selected from the plurality of antennas by, for example, the communication module (1390). A signal or power may be transmitted or received between the communication module (1390) and the external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1397).

[0133] According to various embodiments, the antenna module (1397) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0134] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0135] According to one embodiment, commands or data may be transmitted or received between the electronic device (1301) and an external electronic device (1304) via a server (1308) connected to a second network (1399). Each of the external electronic devices (1302, or 104) may be the same or a different type of device as the electronic device (1301). According to one embodiment, all or part of the operations executed in the electronic device (1301) may be executed in one or more of the external electronic devices (1302, 104, or 108). For example, when the electronic device (1301) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1301) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1301). The electronic device (1301) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1301) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1304) may include an Internet of Things (IoT) device. The server (1308) may be an intelligent server utilizing machine learning and / or a neural network.In one embodiment, an external electronic device (1304) or server (1308) may be included in the second network (1399). The electronic device (1301) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0136] In the present disclosure, an electronic device including two or more antennas (e.g., an antenna using a frame (106), an antenna using a display (120), and a PIFA type antenna using an antenna radiator (360) arranged on a rear area) is described. The electronic device may include a wearable device (e.g., a smart watch, a smart ring, a smart band). One end of the antenna radiator (360) is connected to the ground, and the antenna radiator (360) has a U-shape, so that sufficient radiation efficiency and overall efficiency can be provided within a restricted space. In addition, a wideband antenna of a low frequency band (e.g., a frequency band below about 1.2 GHz) can be implemented through a switching circuit (730) connected to the ground portion (520).

[0137] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0138] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0139] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0140] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0141] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0142] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0143] Various embodiments of the present document may be implemented as software (e.g., a program (1340)) including one or more instructions stored in a storage medium (e.g., an internal memory (1336) or an external memory (1338)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (1320)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0144] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0145] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, Display for the front; Frame for the sides; A printed circuit board (PCB), wherein the PCB includes a first side facing the front and a second side facing the rear; An antenna radiator, wherein the antenna radiator comprises a conductive portion, a feeding portion located at one end of the antenna radiator, and a ground portion located at the other end of the antenna radiator, A first connecting portion that contacts the feeding portion of the antenna radiator on the second surface of the PCB; and A second connecting portion that contacts the ground portion of the antenna radiator on the second surface of the PCB, The antenna radiator is arranged such that, when looking at the second surface of the PCB, the feeding portion and the ground portion are adjacent to the first side of the electronic device, and at least a portion of the conductive portion is adjacent to the second side of the electronic device opposite to the first side. At least a part of the conductive portion is disposed adjacent to the first part or the second part among the first part for connecting with the member for wearing the electronic device, the second part for connecting with the member for wearing the electronic device, and the side part between the first part and the second part, in the frame. Electronic devices.

2. In claim 1, Includes a wireless communication circuit arranged on the PCB, The feeding portion of the above antenna radiator is electrically connected to the wireless communication circuit through the first connecting portion, The ground portion of the above antenna radiator is electrically connected to the ground of the PCB through the second connecting portion, At least a portion of the antenna radiator is positioned so as to be spaced apart from the second surface of the PCB. Electronic devices.

3. In claim 2, It further includes a GPS (global positioning system) processing circuit, The above wireless communication circuit is configured to transmit or receive signals in a cellular frequency band through the antenna radiator, The GPS processing circuit is configured to receive GPS signals through at least a portion of the frame, Electronic devices.

4. In claim 2, Further comprising a second wireless communication circuit, The above wireless communication circuit is configured to transmit or receive signals in a frequency band of a first frequency range through the antenna radiator, The second wireless communication circuit is configured to transmit or receive signals in a frequency band of a second frequency range higher than the first frequency range through at least a portion of the frame, The first frequency range includes Band 14, Electronic devices.

5. In claim 2, The ground of the above PCB is grounded to a portion extending from a part of the above frame, A portion of the above frame is located within a critical range from the ground portion of the antenna radiator when looking at the second surface of the PCB. Electronic devices.

6. In claim 1, Further comprising a switching circuit for the ground portion of the above antenna radiator, The above switching circuit is configured to electrically connect one of the plurality of elements to the ground portion, Electronic devices.

7. In claim 1, Includes a non-challenging support portion, The non-conductive support portion is disposed between the PCB and the conductive portion, The feeding portion of the antenna radiator is connected to a portion extending from the conductive portion and passing through a hole of the non-conductive support portion, The ground portion of the antenna radiator is connected to a portion extending from the conductive portion and passing through another hole of the non-conductive support portion. Electronic devices.

8. In claim 7, A first plate disposed in front of the display and for the front side of the electronic device; A sensor circuit used for heart rate monitoring (HRM); and Further comprising a second plate for the rear of the electronic device; Electronic devices.

9. In claim 8, At least a portion of the antenna radiator is used to electrically connect the sensor circuit and the processing circuit on the PCB, Electronic devices.

10. In claim 1, The above first side corresponds to the above first part of the above frame, The second side corresponds to the second part of the frame, Electronic devices.

11. In claim 1, The antenna radiator includes an additional conductive portion formed to extend from each of the first and second regions of the conductive portion, The above additional conductive portion is positioned so as to be spaced apart from the second surface of the PCB, When looking at the second side of the PCB, the additional conductive portion is adjacent to the second side opposite to the first side. Electronic devices.

12. In claim 1, At least a portion of the above antenna radiator has a 'U' shape, Electronic devices.

13. In claim 1, The above antenna radiator includes a flexible printed circuit board (FPCB), The height of at least a portion of the conductive portion from the PCB is higher than the height of the power supply portion from the PCB and the height of the ground portion from the PCB. Electronic devices.

14. In claim 1, The distance between the area closest to the second side among the conductive portions of the antenna radiator and the ground portion of the antenna radiator is at least 1 / 4 of the wavelength of the signal radiated through the antenna radiator. Electronic devices.

15. In electronic devices, Display for the front; and Frame for the sides; A printed circuit board (PCB), wherein the PCB includes a first side facing the front and a second side facing the rear; antenna radiator; A first wireless communication circuit arranged on the PCB; and Including a second wireless communication circuit arranged on the PCB, A first end of the antenna radiator is electrically connected to the first wireless communication circuit, and a second end of the antenna radiator is electrically connected to the ground of the PCB, The first part of the frame is electrically connected to the second wireless communication circuit, and the second part of the frame is electrically connected to the ground of the PCB, At least a portion of the antenna radiator is positioned so as to be spaced apart from the second surface of the PCB, The frame includes a first portion for connecting with a member for wearing the electronic device, a second portion for connecting with the member for wearing the electronic device, and a side portion between the first portion and the second portion, The area located farthest from the second end of the antenna radiator is arranged adjacent to the first part or the second part of the frame. Electronic devices.

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