Flexible circuit board and electronic device comprising same

Abstract

An electronic device according to various embodiments of the present disclosure may comprise: a first housing; a second housing; a hinge part for rotatably coupling the first housing and the second housing; and a flexible printed circuit board extending from the first housing to the second housing through the hinge part. The flexible printed circuit board can include at least one flexible circuit layer and a shield layer stacked on the flexible circuit layer. The shield layer can include a metal foil and a conductive adhesive layer for bonding the metal foil and the flexible circuit layer.

Description

Flexible circuit board and electronic device including same

[0001] The present disclosure relates to a printed circuit board, and more particularly, to a flexible circuit board and an electronic device including the same.

[0002] An electronic device may include a circuit board on which various electrical components are arranged. Among the components arranged on the circuit board, components such as switches, fingerprint sensors, cameras, and antennas may be arranged and oriented in various directions within the electronic device. Accordingly, the circuit board on which the above components are arranged may be positioned in a bendable or folded state within the electronic device. Furthermore, if the electronic device is a foldable electronic device having a plurality of foldable housings, the circuit board connecting the plurality of housings may be configured to be bendable (or foldable). A circuit board requiring bending may include, for example, a flexible printed circuit board (FPCB) in which a flexible conductive layer is laminated on a flexible base. The flexible printed circuit board may connect the plurality of housings through a hinge portion of the foldable electronic device. The flexible printed circuit board may include a shielding layer to shield electromagnetic interference (EMI) from the circuitry of the flexible printed circuit board.

[0003] Portable electronic devices may require water resistance. The hinge that enables the folding of foldable electronic devices requires tolerances for mechanical movement, which can lead to water ingress into the hinge. Flexible printed circuit boards passing through the hinge can be corroded by water entering the hinge. Corrosion can be accelerated by water containing chloride ions, such as salt water or tap water.

[0004] When using foldable electronic devices, cracks may occur in the shielding layer of flexible printed circuit boards. These cracks can trigger a chain reaction of cracks in adjacent circuit layers. Corrosion can begin from these cracks in the circuit layers, and this corrosion can be accelerated in saltwater environments.

[0005] According to various embodiments of the present disclosure, an electronic device having reduced occurrence of cracks and corrosion in a flexible printed circuit board can be provided.

[0006] An electronic device according to various embodiments of the present disclosure may include a first housing, a second housing, and a hinge portion that rotatably couples the first housing and the second housing.

[0007] The electronic device may include a flexible printed circuit board extending from the first housing through the hinge portion to the second housing. The flexible printed circuit board may include at least one flexible circuit layer. The flexible printed circuit board may include a shield layer laminated on the flexible circuit layer. The shield layer may include a metal foil. The shield layer may include a conductive adhesive layer that bonds the metal foil and the flexible circuit layer.

[0008] A flexible printed circuit board according to various embodiments of the present disclosure may include at least one flexible circuit layer and a shield layer laminated on the flexible circuit layer. The shield layer may include a metal foil and a conductive adhesive layer that bonds the metal foil and the flexible circuit layer.

[0009] According to various embodiments of the present disclosure, since the shield layer includes a soft metal foil having a thickness of 1 micrometer or less and generating a stress of 30 MPa or less when 2% tensile strain is applied, even if a crack occurs in the metal foil, damage to the flexible circuit layer adjacent to the shield layer can be reduced.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0011] FIGS. 2A, 2B, 2C, 2D, and 2E are diagrams illustrating electronic devices according to various embodiments of the present disclosure.

[0012] FIG. 3A is a diagram illustrating an electronic device according to various embodiments of the present disclosure.

[0013] FIG. 3b is a diagram illustrating an electronic device according to various embodiments of the present disclosure.

[0014] FIG. 3c is a cross-sectional view of an electronic device according to various embodiments of the present disclosure.

[0015] FIG. 4a is a cross-sectional view showing a flexible printed circuit board according to various embodiments of the present invention.

[0016] FIG. 4b is a cross-sectional view showing a flexible printed circuit board according to various embodiments of the present invention.

[0017] FIG. 5a is a drawing showing a bending state of a flexible printed circuit board according to various embodiments.

[0018] FIG. 5b is a graph showing stress-strain curves of a shield layer of a flexible printed circuit board according to various embodiments and a flexible printed circuit board of a comparative example.

[0019] Figure 6a is a plan view showing the shape of a metal foil according to various embodiments.

[0020] FIG. 6b is a cross-sectional view showing a flexible printed circuit board according to various embodiments.

[0021] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described in this document.

[0022] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0023] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0024] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0025] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0026] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0027] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0028] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0029] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0030] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0031] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0032] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0033] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0034] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0035] FIGS. 2A, 2B, 2C, 2D, and 2E are diagrams illustrating an electronic device (200) according to various embodiments of the present disclosure.

[0036] FIG. 2A is a perspective view of an electronic device in a flat state (or unfolded state) according to various embodiments of the present disclosure. FIG. 2B is a plan view illustrating a front side of an electronic device in a flat state according to one embodiment of the present disclosure. FIG. 2C is a plan view illustrating a rear side of an electronic device in a unfolded state according to one embodiment of the present disclosure. FIG. 2D is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure. FIG. 2E is a perspective view of an electronic device in an intermediate state according to one embodiment of the present disclosure.

[0037] Referring to FIGS. 2A to 2E, the electronic device (200) may include first and second housings (210, 220) (e.g., a foldable housing structure) that are foldably coupled to each other based on a hinge device (e.g., the hinge device (240) of FIG. 2B). In one embodiment, the hinge device (e.g., the hinge device (240) of FIG. 2B) may be arranged in the X-axis direction or the Y-axis direction. In one embodiment, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) arranged in a region (e.g., a recess) formed by the first and second housings (210, 220). In one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides with respect to the folding axis (F) as the center, and may have a shape that is substantially symmetrical with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (210) and the second housing (220) may vary depending on the state of the electronic device (200). For example, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the electronic device is in a flat state or unfolded state, a folded state, or an intermediate state.

[0038] In one embodiment, the first housing (210) may include a first surface (211) facing a first direction (e.g., a front direction) (z-axis direction) in an unfolded state of the electronic device (200) and a second surface (212) facing a second direction (e.g., a rear direction) (-z-axis direction) opposite to the first surface (211). In one embodiment, the second housing (220) may include a third surface (221) facing a first direction (z-axis direction) and a fourth surface (222) facing a second direction (-z-axis direction) in an unfolded state of the electronic device (200). In one embodiment, in the unfolded state of the electronic device (200), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may face substantially the same first direction (z-axis direction). In one embodiment, in the folded state of the electronic device (200), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may face each other. In one embodiment, in the unfolded state of the electronic device (200), the second side (212) of the first housing (210) and the fourth side (222) of the second housing (220) may face substantially the same second direction (-z-axis direction). In one embodiment, in the folded state of the electronic device (200), the second side (212) of the first housing and the fourth side (222) of the second housing (220) may face in opposite directions. For example, in the folded state of the electronic device (200), the second side (212) may face the first direction (z-axis direction) and the fourth side (222) may face the second direction (-z-axis direction). In this case, the first display (230) may not be visible from the outside (in folding mode). In one embodiment, the electronic device (200) may be folded such that the second side (112) of the first housing (210) and the fourth side (222) of the second housing (220) face each other. In this case, the first display (230) may be arranged to be visible from the outside (out folding mode).

[0039] According to one embodiment, the first housing (210) (e.g., the first housing structure) may include a first side member (213) that at least partially forms an exterior of the electronic device (200) and a first rear cover (214) that is coupled to the first side member (213) and forms at least a portion of a second side (212) of the electronic device (200). In one embodiment, the first side member (213) may include a first side surface (213a), a second side surface (213b) extending from one end of the first side surface (213a), and a third side surface (213c) extending from the other end of the first side surface (213a). In one embodiment, the first side member (213) may be formed into a rectangular (e.g., square or rectangular) shape through the first side (213a), the second side (213b), and the third side (213c).

[0040] According to one embodiment, the second housing (220) (e.g., the second housing structure) may include a second side member (223) that at least partially forms an exterior of the electronic device (200) and a second rear cover (224) that is coupled to the second side member (223) and forms at least a portion of a fourth side (222) of the electronic device (200). In one embodiment, the second side member (223) may include a fourth side (223a), a fifth side (223b) extending from one end of the fourth side (223a), and a sixth side (223c) extending from the other end of the fourth side (223a). In one embodiment, the second side member (223) may be formed into a rectangular shape through the fourth side (223a), the fifth side (223b), and the sixth side (223c).

[0041] According to one embodiment, the first and second housings (210, 220) are not limited to the shapes and combinations shown, and may be implemented by other shapes or combinations and / or combinations of parts. In one embodiment, the first side member (213) may be formed integrally with the first rear cover (214), and the second side member (223) may be formed integrally with the second rear cover (224).

[0042] According to one embodiment, in the unfolded state of the electronic device (200), the second side (213b) of the first side member (213) and the fifth side (223b) of the second side member (223) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (200), the third side (213c) of the first side member (213) and the sixth side (223c) of the second side member (223) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (200), the sum of the lengths of the second side (213b) and the fifth side (223b) may be configured to be longer than the lengths of the first side (213a) and / or the fourth side (223a). In one embodiment, in the unfolded state of the electronic device (200), the sum of the lengths of the third side (213c) and the sixth side (223c) may be configured to be longer than the lengths of the first side (213a) and / or the fourth side (223a).

[0043] Referring to FIGS. 2d and 2e, the first side member (213) and / or the second side member (223) may be formed of metal or may further include a polymer that is injected into the metal. In one embodiment, the first side member (213) and / or the second side member (223) may also include at least one conductive portion (216 and / or 226) that is electrically segmented via at least one segment (2161, 2162 and / or 2261, 2262) formed of polymer. In such a case, the at least one conductive portion (216 and / or 226) may be used as at least a portion of an antenna that operates in at least one designated band (e.g., a legacy band) by being electrically connected to a wireless communication circuit included in the electronic device (200).

[0044] According to one embodiment, the first rear cover (214) and / or the second rear cover (224) may be formed by, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0045] In one embodiment, the first display (230) may be arranged to extend from a first side (211) of the first housing (210) across a hinge device (e.g., hinge device (240) of FIG. 2B) to at least a portion of a third side (221) of the second housing (220). In one embodiment, the first display (230) may include a first region (230a) substantially corresponding to the first side (211), a second region (230b) substantially corresponding to the second side (212), and a third region (230c) (e.g., a bendable region or hinge portion) connecting the first region (230a) and the second region (230b). In one embodiment, the third region (230c) may be disposed at a position corresponding to a hinge device (e.g., hinge device (240) of FIG. 2B) as part of the first region (230a) and / or the second region (230b). In one embodiment, the electronic device (200) may include a hinge housing (241) (e.g., hinge cover) that supports the hinge device (e.g., hinge device (240) of FIG. 2B). In one embodiment, the hinge housing (241) may be disposed so as to be exposed to the outside when the electronic device (200) is in a folded state, and may be inserted into the internal space of the first housing (210) and the internal space of the second housing (220) when the electronic device (200) is in an unfolded state, thereby being invisible from the outside.

[0046] According to one embodiment, the electronic device (200) may include a second display (231) (e.g., a sub-display) that is arranged separately from the first display (230). In one embodiment, the second display (231) may be arranged so as to be at least partially exposed on the second side (212) of the first housing (210). In one embodiment, when the electronic device (200) is in a folded state, the second display (231) may replace at least a portion of the display function of the first display (230) to display at least a portion of status information of the electronic device (200). In one embodiment, the second display (231) may be arranged so as to be visible from the outside through at least a portion of the first rear cover (214). In one embodiment, the second display (231) may also be arranged on the fourth side (222) of the second housing (220). In this case, the second display (231) may be arranged to be visible from the outside through at least a portion of the second rear cover (224).

[0047] According to one embodiment, the electronic device (200) may include at least one of an input device (203) (e.g., a microphone), an audio output device (201, 202), a sensor module (204), a camera device (205, 208), a key input device (206), or a connector port (207). In the illustrated embodiment, the input device (203) (e.g., a microphone), an audio output device (201, 202), a sensor module (204), a camera device (205, 208), a key input device (206), or a connector port (207) is illustrated as a hole or a circular element formed in the first housing (210) or the second housing (220), but this is an exemplary illustration for description and is not limited thereto. According to one embodiment, the input device (203) may include at least one microphone (203) disposed in the second housing (220). In one embodiment, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. In one embodiment, the plurality of microphones (203) may be arranged at appropriate locations in the first housing (210) and / or the second housing (220). In one embodiment, the audio output device (201, 202) may include at least one speaker (201, 202). In one embodiment, the at least one speaker (201, 202) may include a call receiver (201) arranged in the first housing (210) and a speaker (202) arranged in the second housing (220). In one embodiment, the input device (203), the audio output device (201, 202), and the connector port (207) are arranged in a space provided in the first housing (210) and / or the second housing (220) of the electronic device (200), and can be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In one embodiment, at least one connector port (207) can be used to transmit and receive power and / or data with an external electronic device.In one embodiment, at least one connector port (e.g., an ear jack hole) may accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with an external electronic device. In one embodiment, the holes formed in the first housing (210) and / or the second housing (220) may be shared for the input device (203) and the audio output devices (201, 202). In one embodiment, the audio output devices (201, 202) may include a speaker (e.g., a piezo speaker) that is not exposed through the holes formed in the first housing (210) and / or the second housing (220).

[0048] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. In one embodiment, the sensor module (204) may detect an external environment through a first surface (211) of the first housing (210). In one embodiment, the electronic device (200) may further include at least one sensor module arranged to detect the external environment through a second surface (212) of the first housing (210). In one embodiment, the sensor module (204) (e.g., an illuminance sensor) may be arranged under the first display (230) to detect the external environment through the first display (230). In one embodiment, the sensor module (204) may include at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an ambient light sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an ambient light sensor (204).

[0049] According to one embodiment, the camera devices (205, 208) may include a first camera device (205) (e.g., a front camera device) disposed on a first side (211) of the first housing (210) and a second camera device (208) disposed on a second side (212) of the first housing (210). In one embodiment, the electronic device (200) may further include a flash (209) disposed near the second camera device (208). In one embodiment, the camera devices (205, 208) may include at least one lens, an image sensor, and / or an image signal processor. In one embodiment, the camera device (205, 208) may be arranged such that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and two or more image sensors are positioned on one side (e.g., a first side (211), a second side (212), a third side (221), or a fourth side (222)) of the electronic device (200). In one embodiment, the camera device (205, 208) may also include lenses and / or image sensors for time of flight (TOF).

[0050] According to one embodiment, the key input device (206) (e.g., a key button) may be disposed on a third side (213c) of the first side member (213) of the first housing (210). In one embodiment, the key input device (206) may also be disposed on at least one of the other sides (213a, 213b) of the first housing (210) and / or the sides (223a, 223b, 223c) of the second housing (220). In one embodiment, the electronic device (200) may not include some or all of the key input devices (206), and the key input devices (206) that are not included may be implemented in another form, such as a soft key, on the first display (230). In one embodiment, the key input device (206) may be implemented using a pressure sensor included in the first display (230).

[0051] According to one embodiment, some of the camera devices (205, 208) (e.g., the first camera device (205)) or the sensor module (204) may be arranged to be exposed through the first display (230). In one embodiment, the first camera device (205) or the sensor module (204) may be optically exposed to the outside through an opening (e.g., a through hole) at least partially formed in the first display (230) in the internal space of the electronic device (200). In one embodiment, at least a portion of the sensor module (204) may be arranged so as not to be visually exposed through the first display (230) in the internal space of the electronic device (200). Referring to FIG. 2B, the electronic device (200) may be operable to maintain at least one designated folding angle in an intermediate state through a hinge device (e.g., the hinge device (240) of FIG. 2B). In this case, the electronic device (200) can control the first display (230) to display different contents in the display area corresponding to the first side (211) and the display area corresponding to the third side (221). In one embodiment, the electronic device (200) can operate in a substantially unfolded state (e.g., unfolded state of FIG. 2a) and / or a substantially folded state (e.g., folded state of FIG. 2d) based on a certain folding angle (e.g., angle between the first housing (210) and the second housing (220) when the electronic device (200) is in an intermediate state) through a hinge device (e.g., hinge device (240) of FIG. 2b). In one embodiment, the electronic device (200) can be operated to transition from an unfolded state (e.g., the unfolded state of FIG. 2a) to an unfolded state (e.g., the unfolded state of FIG. 2a) when a pressure is applied in the unfolding direction (B1 direction) from an unfolded state at a constant folding angle through a hinge device (e.g., the hinge device (240) of FIG. 2b).In one embodiment, the electronic device (200) can be operated to transition to a folded state (e.g., the folded state of FIG. 2d) when a pressure is applied in the folding direction (B2 direction) from an unfolded state at a certain folding angle through a hinge device (e.g., the hinge device (240) of FIG. 2b). In one embodiment, the electronic device (200) can be operated to maintain an unfolded state (not shown) at various folding angles through a hinge device (e.g., the hinge device (240) of FIG. 2b) (free stop function).

[0052] FIG. 3A is a diagram illustrating an electronic device (300) according to various embodiments of the present disclosure.

[0053] FIG. 3b is a diagram illustrating an electronic device (300) according to various embodiments of the present disclosure.

[0054] FIG. 3c is a cross-sectional view of an electronic device (300) according to various embodiments of the present disclosure.

[0055] Referring to FIGS. 3A and 3B, an electronic device (300) according to various embodiments of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2A to 2E) may include a plurality of housings (e.g., a first housing, a second housing, and / or a third housing). The electronic device (300) may be a foldable electronic device. For example, the electronic device (300) may be a foldable electronic device (300a) in which a first housing (310) and a second housing (320) are foldably coupled to each other with respect to a folding axis (F1). Also, for example, the electronic device (300) may be a foldable electronic device (400a) in which a first housing (410) and a second housing (420) are foldably coupled to each other with respect to a folding axis (F2), and a second housing (420) and a third housing (480) are foldably coupled to each other with respect to a folding axis (F3). Printed circuit boards may be positioned in the plurality of housings. For example, a first printed circuit board (350) may be positioned in the first housing (310), and a second printed circuit board (360) may be positioned in the second housing (320). Also, for example, a first printed circuit board (450) may be positioned in the first housing (410), a second printed circuit board (460) may be positioned in the second housing (420), and a third printed circuit board (470) may be positioned in the third housing (480).

[0056] In various embodiments, a processor (110, see FIG. 1) and / or a memory (120, see FIG. 1) may be disposed on a first printed circuit board (350, 450), a second printed circuit board (360, 460), and / or a third circuit board (470). The processor (110, see FIG. 1) may include a main processor (111, see FIG. 1) (e.g., a central processing unit or processor) or auxiliary processors (112 to 119, see FIG. 1) operable independently or in conjunction therewith (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). The memory (120, see FIG. 1) may include a volatile memory (121, see FIG. 1) or a nonvolatile memory (122, see FIG. 1).

[0057] The electronic device (300) may include at least one flexible printed circuit board (501). For example, the electronic device (300a) may include a first flexible printed circuit board (330). Further, for example, the electronic device (400a) may include a first flexible printed circuit board (430) and a second flexible printed circuit board (440). The at least one flexible printed circuit board (501) may form an electrical connection between a plurality of housings. For example, the first flexible printed circuit boards (330, 430) may extend from the first housing (310, 410) to the second housing (320, 420). Further, for example, the second flexible printed circuit board (440) may extend from the second housing (420) to the third housing (480).

[0058] In various embodiments, one end of the first flexible printed circuit board (330, 430) may be connected to the first printed circuit board (350, 450), and the other end of the first flexible printed circuit board (330, 430) may be connected to the second printed circuit board (360, 460). The first flexible printed circuit board (330, 430) may electrically connect the first printed circuit board (350, 450) and the second printed circuit board (360, 460). In addition, one end of the second flexible printed circuit board (440) of the foldable electronic device (400a) including the third housing (380) and the third housing (380) may be connected to the second printed circuit board (460), and the other end of the second flexible printed circuit board (440) may be connected to the third printed circuit board (470). The second flexible printed circuit board (440) may electrically connect the second printed circuit board (460) and the third printed circuit board (470).

[0059] In various embodiments, the electronic device (300) may include a hinge portion positioned between a plurality of housings. For example, the foldable electronic device (300a) may include a hinge portion (301a) positioned between a first housing (310) and a second housing (320). In addition, for example, the foldable electronic device (400a) may include a hinge portion (401a) positioned between the first housing (410) and the second housing (420) and a hinge portion (401b) positioned between the second housing (420) and the third housing (430). A hinge that rotatably connects the plurality of housings may be positioned in the hinge portions (301a, 401a, 401b). In various embodiments, the first flexible printed circuit board (330, 430) may extend from the first housing (310, 410) through the hinge portion (301a, 401a) to the second housing (320, 420). Additionally, in various embodiments, the second flexible printed circuit board (440) may extend from the second housing (420) through the hinge portion (401b) to the third housing (480).

[0060] Referring to FIG. 3c, a hinge portion (e.g., hinge portion (301a)) may have a certain level of mechanical tolerance to implement folding of a plurality of housings (e.g., first housing (310), second housing (320)). The hinge portion may include a water passage area (302a), which is an area through which moisture can enter and exit, due to the tolerance. A flexible printed circuit board (501) (e.g., a first flexible printed circuit board (330) may extend from a first housing (310) to a second housing (320) through a hinge portion. In various embodiments, a waterproof member (302) may be disposed in an area where the first flexible printed circuit board (330) passes through the boundary of the water passage area (302a) to seal the water passage area (302a). The description of the hinge portion (301a) may be applied to the hinge portions (401a, 401b) of FIG. 3b, unless otherwise contradictory.

[0061] FIG. 4a is a cross-sectional view showing a flexible printed circuit board (501) according to various embodiments of the present invention.

[0062] FIG. 4b is a cross-sectional view showing a flexible printed circuit board (501) according to various embodiments of the present invention.

[0063] Fig. 4a is a cross-sectional view along the WW direction of Fig. 3a, and Fig. 4b is a cross-sectional view along the VV direction of Fig. 3a.

[0064] Referring to FIGS. 4A and 4B , a flexible printed circuit board (501) according to various embodiments may include one or more flexible circuit layers (510). The flexible circuit layer (510) may include a flexible insulating layer (511) made of a flexible non-conductive material (e.g., polyimide film) and at least one flexible conductor layer (512) laminated on the flexible insulating layer (511). In various embodiments, the flexible circuit layer (510) may include a single-sided flexible copper clad laminate (FCCL) and / or a double-sided FCCL. In various embodiments, a coverlay layer (514) and a coverlay adhesive layer (513) that adheres the coverlay layer (514) to the flexible conductor layer (512) and the flexible insulating layer (511) may be positioned on the flexible conductor layer (512). Power and / or signals can be transmitted between electrical components of an electronic device through the flexible conductor layer (512).

[0065] In various embodiments, the flexible printed circuit board (501) may include a flexible part (501a) and a rigid part (501b) having relatively high rigidity compared to the flexible part (501a). The rigid part (501b) may include a rigid insulating layer (505) positioned on the flexible circuit layer (510). The rigid insulating layer (505) may include, for example, a rigid resin matrix and a reinforcing material (e.g., inorganic particles and / or fibers) dispersed in the resin matrix. In various embodiments, the rigid insulating layer (505) may be formed by curing a resin of a prepreg in which the reinforcing material and the resin are mixed.

[0066] In various embodiments, a circuit layer (506) may be disposed on the rigid insulating layer (505). The circuit layer (506) may include a ground circuit. In various embodiments, the circuit layer (506) may be electrically connected to electrical components (e.g., resistors, chip capacitors, and / or integrated circuits) positioned on the rigid portion (501b). In various embodiments, the circuit layer (506) may include a substrate layer (507) of a non-conductive material (e.g., polyimide) and a conductive layer (508) laminated to the substrate layer (507).

[0067] In various embodiments, the flexible portion (501a) may include an air gap (519). The air gap (519) may be positioned between the plurality of flexible circuit layers (510) of the flexible portion (501a). For example, at least some of the plurality of flexible circuit layers (510) of the flexible portion (501a) may not be bonded to each other. The air gap (519) may be a member that enhances the flexibility of the flexible portion (501a).

[0068] In various embodiments, the flexible printed circuit board (501) may include a shield layer (520). The shield layer (520) may be a layer that shields the flexible circuit layer (510) of the flexible printed circuit board (501) from electromagnetic interference (EMI). The shield layer (520) may be disposed on the flexible circuit layer (510). In various embodiments, the shield layer (520) may be disposed on the outermost flexible circuit layer (510) among the flexible circuit layers (510) in the thickness direction in the flexible portion (501a).

[0069] In various embodiments, the shield layer (520) may include a metal foil (521), a conductive adhesive layer (522), and a protective layer (523). The metal foil (521) may be a layer that provides electromagnetic interference (EMI) shielding for the flexible circuit layer (510). The metal foil (521) may be a thin plate made of copper, silver, aluminum, or a similar metal or alloy material. In various embodiments, the thickness of the metal foil (521) may be 1 micrometer or less. In various embodiments, the metal foil (521) may include a rolled metal material. For example, the metal foil (521) may be a rolled copper foil. The effects depending on the thickness and material of the metal foil (521) will be described in more detail below.

[0070] The conductive adhesive layer (522) has electrical conductivity and may be a portion for attaching the metal foil (521) to the flexible circuit layer (510) of the flexible portion (501a) and the conductor layer (508) of the rigid portion (501b). For example, the conductive adhesive layer (522) may include an adhesive and conductive particles (e.g., metal particles, carbon fibers, graphite, and / or graphene) dispersed in the adhesive matrix.

[0071] In various embodiments, the conductivity of the conductive adhesive layer (522) may be anisotropic. The conductivity of the conductive adhesive layer (522) may be relatively high in the thickness direction (e.g., the z-axis direction). For example, the conductive adhesive layer (522) may include conductive particles (e.g., carbon fibers, graphite, and / or graphene) dispersed within the adhesive, and the conductive particles may be oriented such that the direction of high conductivity is at least partially aligned with respect to the thickness direction of the conductive adhesive layer (522). Additionally, for example, the conductive particles of the conductive adhesive layer (522) may be arranged such that they are in electrical contact with each other with respect to the thickness direction of the conductive adhesive layer (522).

[0072] In various embodiments, the metal foil (521) may be grounded. For example, the conductive layer (508) of the rigid portion (501b) may form a ground circuit, and the metal foil (521) may be electrically connected to the conductive layer (508) via the conductive adhesive layer (522). By grounding the metal foil (521) of the shield layer (520), the metal foil (521) may provide electromagnetic shielding for the flexible circuit layer (510).

[0073] In various embodiments, the shield layer (520) may include a protective layer (523). The protective layer (523) may be a layer that protects the metal foil (521) against external physical damage. The protective layer (523) may include, for example, a soft polymer and a hard coating layer positioned on the soft polymer layer.

[0074] FIG. 5a is a drawing showing a bending state of a flexible printed circuit board (501) according to various embodiments.

[0075] FIG. 5b is a graph showing stress-strain curves of a shield layer (520) of a flexible printed circuit board (501) according to various embodiments and a flexible printed circuit board (501) of a comparative example.

[0076] Figure 5a is illustrated with some layers omitted for clarity. Planes S1 and S2 are illustrated to indicate the distribution of strain.

[0077] Referring to FIG. 5A, when a strain is applied to a flexible printed circuit board (501), stress may be generated in various layers of the flexible printed circuit board (501). For example, when a bending strain is applied to the flexible printed circuit board (501), tensile strain may be generated on the outside centered on the neutral point (S3), and compressive strain may be generated on the inside. Each layer of the flexible printed circuit board (501) subjected to the above-described strain may receive a stress corresponding to the strain. The magnitude of the stress may vary depending on the stiffness of each layer. The stiffness of each layer may be determined by factors such as the material and structure of each layer.

[0078] When deformation is applied to the flexible printed circuit board (501), a large strain may be applied to a layer located on the outside of the flexible printed circuit board (501), for example, a shield layer (520). In such an environment, a crack may occur in the metal foil (521) of the shield layer (520). When a crack occurs in the metal foil (521), the metal foil (521) may have a harmful effect on a layer adjacent to the shield layer (520). For example, when the folding and unfolding operations of the foldable electronic device are repeated, the cracked portion of the metal foil (521) may bend toward the coverlay layer (514) due to the stress generated in the metal foil (521), thereby poking and damaging the coverlay layer (514). Additionally, for example, the stress accumulated in the metal foil (521) may be transferred to the coverlay layer (514) when a crack occurs in the metal foil (521), thereby causing a crack in the coverlay layer (514). When the coverlay layer (514) is damaged, a corrosive element such as salt water may easily penetrate into the flexible conductor layer (512) located under the coverlay layer (514). The corrosion may directly damage the circuits of the flexible printed circuit board (501). In addition, the corrosion may damage the circuits of the flexible printed circuit board (501) by causing a crack in the flexible conductor layer (512) through pitting.

[0079] When the thickness of the metal foil (521) is thin, the rigidity of the metal foil (521) is reduced, so the harmful effect of the crack of the metal foil (521) on the coverlay layer (514) can be reduced. For example, the thickness of the metal foil (521) can be 1 micrometer or less.

[0080] In various embodiments, the metal foil (521) may be a rolled material. For example, the metal foil (521) may be a rolled copper foil. In a thickness range of 1 micrometer or less, the rolled metal foil (521) may have relatively superior conductivity due to its larger grain size compared to that manufactured by electrolysis or other methods, and thus may have relatively superior electromagnetic interference (EMI) shielding capabilities. In addition, the metal foil (521) manufactured by rolling has a low surface roughness, and thus the risk of cracking and damage to the coverlay layer (514) when cracks occur may be reduced.

[0081] Referring to FIG. 5b, according to an embodiment of the present disclosure, a shield layer (520) including an electrolytic copper foil having a thickness of 1 micrometer as a metal foil (521) can receive a stress of 30 MPa or less when a strain of 2% is applied. Empirically, a shield layer (520) that is subjected to a stress of 30 MPa or less can prevent damage to the coverlay layer (514) even if a crack occurs in the metal foil (521).

[0082] In the comparative example, the shield layer including the electrolytic metal foil manufactured to have EMI shielding performance equivalent to the 1 micrometer electrolytic copper foil of the embodiment of the present disclosure may have a stress magnitude of about 44 MPa according to 2% strain, which is higher than that of the present invention. In order to have equivalent EMI shielding performance, the thickness of the electrolytic metal foil of the comparative example may be thicker than that of the rolled copper foil according to the embodiment of the present disclosure. Therefore, the electrolytic copper foil of the comparative example may be subjected to a high stress under the same strain, and thus may have a relatively high risk of damaging the coverlay layer (514) adjacent to the shield layer (520).

[0083] A folding life test was conducted on a flexible printed circuit board (501) including a shield layer (520) of an embodiment and a comparative example of the present disclosure, and the results are shown in Table 1.

[0084] Test Conditions Comparison Example Example Improvement Dose High temperature (60℃) 74,000 times 116,000 times 56% High load (±90℃) 66,000 times 90,000 times 36% Salt water 20,000 times 200,000 times or more 1000% or more

[0085] Referring to Table 1, the flexible printed circuit board (501) according to the embodiment of the present disclosure has a folding life improved by 56% in a high temperature environment and by 36% in a high load condition under harsh conditions compared to the comparative example. In addition, it can be seen that the flexible printed circuit board (501) of the comparative example has a folding life of 20,000 times in an environment exposed to salt water, which means that there is a relatively high possibility of defects when applied to a foldable electronic device, whereas the flexible printed circuit board (501) according to the embodiment of the present disclosure has secured a good lifespan of 200,000 times in a salt water environment. Fig. 6a is a plan view showing the shape of a metal foil (521) according to various embodiments.

[0086] FIG. 6b is a cross-sectional view showing a flexible printed circuit board (501) according to various embodiments.

[0087] Referring to FIGS. 6A and 6B, the metal foil (521) of the flexible printed circuit board (501) may include one or more through holes (524). The through holes (524) may be openings that penetrate the metal foil (521) in the thickness direction of the metal foil (521) (e.g., the Z-axis direction). In various embodiments, the through holes (524) may be formed by penetrating the metal foil (521) or by penetrating the metal foil (521) and the conductive adhesive layer (522).

[0088] In various embodiments, the metal foil (521) of the shield layer (520) can have an impedance that matches the frequency of an electrical signal transmitted through the flexible conductor layer (512) between it and the flexible conductor layer (512) of the flexible circuit layer (510). In various embodiments, the area and shape of the metal foil (521) of the shield layer (520) can be set to have a specific capacitance and inductance between it and the flexible conductor layer (512). For example, the capacitance and inductance between the flexible conductor layer (512) and the metal foil (521) can be adjusted by adjusting the size and arrangement of the through holes (524) formed in the metal foil (521). Therefore, the reflectance of a signal transmitted through the flexible conductor layer (512) can be minimized through impedance matching.

[0089] In various embodiments, the through-hole (524) of the metal foil (521) can release gas generated in other layers (e.g., the flexible circuit layer (510) and / or the conductive adhesive layer (522)). For example, the through-hole (524) can be a degassing hole of the flexible printed circuit board (501) or can be formed in conjunction with a degassing hole. In the usage environment of the flexible printed circuit board (501), gas can be generated from the materials constituting each layer, and such gas can cause separation between the mutually bonded layers of the flexible printed circuit board (501) by generating bubbles. Therefore, the metal foil (521) can prevent the accumulation of bubbles by releasing such gas by including the through-hole (524). In various embodiments, the through-hole (524) can be formed by penetrating the metal foil (521) and the protective layer (523).

[0090] In various embodiments, the through hole (524) of the metal foil (521) can further reduce the stress applied to the metal foil (521) when deformation is applied to the metal foil (521) by lowering the rigidity of the metal foil (521). Accordingly, when a crack occurs in the metal foil (521), the harmful effect applied to other layers adjacent to the shield layer (520) can be further reduced.

[0091] An electronic device according to various embodiments of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2A to 2E) may include a first housing (310, 410), a second housing (320, 420), and a hinge portion (301a, 401a) that rotatably couples the first housing (310, 410) and the second housing (320, 420). The electronic device may include a flexible printed circuit board (501) that extends from the first housing (310, 410) through the hinge portion (301a, 401a) to the second housing (320, 420). The flexible printed circuit board (501) may include at least one flexible circuit layer (510). The flexible printed circuit board (501) may include a shield layer (520) laminated on the flexible circuit layer (510). The shield layer (520) may include a metal foil (521). The shield layer (520) may include a conductive adhesive layer (522) that bonds the metal foil (521) and the flexible circuit layer (510).

[0092] In various embodiments, the thickness of the metal foil (521) may be 1 micrometer or less.

[0093] In various embodiments, the metal foil (521) may be a rolled metal material.

[0094] In various embodiments, the metal foil (521) may be rolled copper foil.

[0095] In various embodiments, the shield layer (520) may be configured to be subjected to a stress of 30 MPa or less when a tensile strain of 2% is applied.

[0096] In various embodiments, the shield layer (520) may further include a protective layer (523) positioned opposite the flexible circuit layer (510).

[0097] In various embodiments, the flexible printed circuit board (501) may include a flexible portion (501a) and a rigid portion (501b) having higher rigidity than the flexible portion (501a).

[0098] The above-mentioned rigid portion (501b) may include a rigid insulating layer (505) laminated on the flexible circuit layer (510) and a conductor layer (508) disposed on the rigid insulating layer (505).

[0099] In various embodiments, the conductor layer (508) is configured to be connected to a ground electrode, and the shield layer (520) can extend from the flexible portion (501a) onto the conductor layer (508) of the rigid portion (501b) and be electrically connected to the conductor layer (508).

[0100] In various embodiments, the conductive adhesive layer (522) may include an adhesive and conductive particles dispersed within the adhesive and arranged to have relatively high electrical conductivity in the thickness direction of the flexible circuit board.

[0101] In various embodiments, the metal foil (521) may include at least one through hole (524) formed on a surface of the metal foil (521) facing the thickness direction of the flexible circuit board.

[0102] A flexible printed circuit board according to various embodiments of the present disclosure may include at least one flexible circuit layer (510) and a shield layer (520) laminated on the flexible circuit layer (510). The shield layer (520) may include a metal foil (521) and a conductive adhesive layer (522) that adheres the metal foil (521) and the flexible circuit layer (510).

[0103] In various embodiments, the thickness of the metal foil (521) may be 1 micrometer or less.

[0104] In various embodiments, the metal foil (521) may be a rolled metal material.

[0105] In various embodiments, the metal foil (521) may be rolled copper foil.

[0106] In various embodiments, the shield layer (520) may be configured to be subjected to a stress of 30 MPa or less when a tensile strain of 2% is applied.

[0107] In various embodiments, the shield layer (520) may further include a protective layer (523) positioned opposite the flexible circuit layer (510).

[0108] In various embodiments, the flexible printed circuit board (501) may include a flexible portion (501a) and a rigid portion (501b) having higher rigidity than the flexible portion (501a).

[0109] The above-mentioned rigid portion (501b) may include a rigid insulating layer (505) laminated on the flexible circuit layer (510) and a conductor layer (508) disposed on the rigid insulating layer (505).

[0110] In various embodiments, the conductor layer (508) is configured to be connected to a ground electrode, and the shield layer (520) can extend from the flexible portion (501a) onto the conductor layer (508) of the rigid portion (501b) and be electrically connected to the conductor layer (508).

[0111] In various embodiments, the conductive adhesive layer (522) may include an adhesive and conductive particles dispersed within the adhesive and arranged to have relatively high electrical conductivity in the thickness direction of the flexible circuit board.

[0112] In various embodiments, the metal foil (521) may include at least one through hole (524) formed on a surface of the metal foil (521) facing the thickness direction of the flexible circuit board.

[0113] It will be appreciated that all of the embodiments and their technical features described above can be combined with each other in any and all combinations, as long as there is no potential conflict between the two embodiments or features. That is, any and all combinations of two or more of the embodiments described above are contemplated and encompassed within the present disclosure. One or more features of any embodiment may be incorporated into any other embodiment, providing corresponding advantages or benefits.

[0114] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, 1st housing; Second housing; and A hinge portion that rotatably connects the first housing and the second housing; and A flexible printed circuit board (501) extending from the first housing through the hinge portion to the second housing, The above flexible printed circuit board (501) is At least one flexible circuit layer (510); and It includes a shield layer (520) laminated on the above flexible circuit layer (510), An electronic device in which the shield layer (520) includes a metal foil (521) and a conductive adhesive layer (522) that adheres the metal foil (521) and the flexible circuit layer (510).

2. In paragraph 1, An electronic device in which the thickness of the above metal foil (521) is 1 micrometer or less.

3. In paragraph 1, The above metal foil (521) is an electronic device made of rolled metal material.

4. In paragraph 3, The above metal foil (521) is an electronic device made of rolled copper foil.

5. In paragraph 1, The above shield layer (520) is an electronic device configured to apply a stress of 30 MPa or less when a tensile strain of 2% is applied.

6. In paragraph 1, An electronic device wherein the shield layer (520) further includes a protective layer (523) positioned in the opposite direction of the flexible circuit layer (510).

7. In paragraph 1, The above flexible printed circuit board (501) is Flexible section (501a); and It has a rigid part (501b) having higher rigidity than the flexible part (501a). The above hard part (501b) is A rigid insulating layer (505) laminated on the flexible circuit layer (510); and An electronic device comprising a conductor layer (508) disposed on the rigid insulating layer (505).

8. In paragraph 7, The above conductor layer (508) is configured to be connected to the ground electrode. An electronic device in which the shield layer (520) extends from the flexible portion (501a) onto the conductor layer (508) of the rigid portion (501b) and is electrically connected to the conductor layer (508).

9. In paragraph 8, The above conductive adhesive layer (522) is adhesive; and An electronic device comprising conductive particles dispersed within the adhesive and arranged to have relatively high electrical conductivity in the thickness direction of the flexible circuit board.

10. In paragraph 1, An electronic device in which the metal foil (521) includes at least one through hole (524) formed on a surface of the metal foil (521) facing the thickness direction of the flexible circuit board.

11. In a flexible printed circuit board (501) of an electronic device including a first housing and a second housing, At least one flexible circuit layer (510); and It includes a shield layer (520) laminated on the above flexible circuit layer (510), The shield layer (520) is a flexible printed circuit board including a metal foil (521) and a conductive adhesive layer (522) that bonds the metal foil (521) and the flexible circuit layer (510).

12. In paragraph 11, A flexible printed circuit board having a thickness of the above metal foil (521) of 1 micrometer or less.

13. In paragraph 11, The above shield layer (520) is a flexible printed circuit board configured to be subjected to a stress of 30 MPa or less when a tensile strain of 2% is applied.

14. In paragraph 11, A flexible printed circuit board, wherein the shield layer (520) further includes a protective layer (523) positioned in the opposite direction of the flexible circuit layer (510).

15. In paragraph 11, A flexible printed circuit board including at least one through hole (524) formed on the surface of the metal foil (521) facing the thickness direction of the flexible circuit board.

Images