Electronic device including antenna structure using internal structure

Abstract

This electronic device comprises: a housing including a front plate and a rear plate; a support plate disposed between the front plate and the rear plate, a support plate including a first opening, which passes through the support plate, a second opening, which passes through the support plate at a position adjacent to the first opening and is aligned with the first opening in a first direction, a first separation portion and a second separation portion, which extend in a region between the first opening and the second opening, and an insulating portion, which mechanically connects the first separation portion and the second separation portion while electrically insulating the first separation portion and the second separation portion; and a printed circuit board disposed on the support plate and electrically connected to the support plate in the region between the first opening and the second opening. At least a portion of the support plate around the first opening or the second opening is configured to function as an antenna and perform wireless communication in a first frequency band.

Description

Electronic device including an antenna structure utilizing an internal structure

[0001] The present disclosure relates to an electronic device. More specifically, the present disclosure relates to an electronic device including an antenna structure utilizing an internal structure.

[0002] Typically, electronic devices can refer to anything from home appliances to electronic organizers, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems that perform specific functions based on the programs they are installed with. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single mobile communication terminal is now equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, or even functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0003] Miniaturized, multi-functional electronic devices, such as smartphones, can provide a more convenient user experience by maintaining stable communication conditions in mobile environments. For example, a single electronic device can perform commercial communications across multiple frequency bands and incorporate wireless communication capabilities for different communication protocols, such as Wi-Fi and near field communication. Research is ongoing to add additional operable frequency bands, depending on the communication protocol, and electronic devices can incorporate wireless communication capabilities based on additional communication protocols, such as millimeter wave or ultra-wideband communication. By performing wireless communication in these additional frequency bands or based on these additional communication protocols, electronic devices can provide a more stable wireless connection environment and significantly improved communication speeds.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] In one aspect of the present disclosure, an electronic device is provided. The electronic device comprises a housing including a front plate and a rear plate arranged to face in an opposite direction of the front plate, a support plate arranged in a space between the front plate and the rear plate, the support plate including a first opening provided to pass through the support plate, a second opening provided to pass through the support plate at a position adjacent to the first opening and aligned along a first direction with the first opening, a first separator extending in an area between the first opening and the second opening, and an insulating portion mechanically connecting the first separator and the second separator but electrically insulating them, a printed circuit board arranged on the support plate and electrically connected to the support plate in an area between the first opening and the second opening, wherein at least a portion of the support plate is configured to function as an antenna around the first opening or the second opening and is configured to perform wireless communication in a first frequency band.

[0006] In another aspect of the present disclosure, an electronic device is provided. The electronic device includes a housing including a front plate and a rear plate arranged to face in an opposite direction of the front plate, a support plate arranged in a space between the front plate and the rear plate, a first opening provided to pass through the support plate, a second opening provided to pass through the support plate at a position adjacent to the first opening and aligned with the first opening along a first direction, a printed circuit board disposed on the support plate and electrically connected to the support plate in a region between the first opening and the second opening, at least one processor, and a memory storing instructions, wherein the instructions, when individually or collectively executed by the at least one processor, are configured to cause the electronic device to perform wireless communication in a first frequency band using at least a portion of the support plate around the first opening or the second opening.

[0007] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes a housing including a front plate and a rear plate disposed opposite to the front plate, a first support member disposed in a space between the front plate and the rear plate and including a coupling boss provided on one surface, a first opening provided to pass through the first support member at a position adjacent to the coupling boss, a second opening provided to pass through the first support member at a position adjacent to at least the first opening among the coupling boss and the first opening, the second opening being aligned along a first direction with the first opening, a printed circuit board supported by the coupling boss and disposed on the first support member and electrically connected to the first support member through the coupling boss, at least one processor, and a memory storing instructions. In one embodiment, the instructions, when individually or collectively executed by the at least one processor, may be configured to cause the electronic device to perform wireless communication in a first frequency band using at least a portion of the first support member around the first opening or the second opening.

[0008] According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes a housing including a front plate and a rear plate disposed in a direction opposite to the front plate, a first support member disposed in a space between the front plate and the rear plate and including a coupling boss provided on one surface, a first opening provided to pass through the first support member at a position adjacent to the coupling boss, a second opening provided to pass through the first support member at a position adjacent to at least the first opening among the coupling boss and the first opening, the second opening being aligned along a first direction with the first opening, a printed circuit board disposed on the first support member and supported by the coupling boss and electrically connected to the first support member through the coupling boss, a side structure configured to at least partially surround the space between the front plate and the rear plate, a radiation conductor that is a part of the side structure and electrically insulated from another part of the side structure, and a flange that protrudes from an inner surface of the radiation conductor and is electrically connected to the printed circuit board. In one embodiment, the first support member may be configured to perform wireless communication in a first frequency band using at least a portion of the first support member around the first opening or the second opening, and the second frequency band may be configured to perform wireless communication in a second frequency band using the radiating conductor.

[0009] The above-described aspects or other aspects, configurations and / or advantages of the embodiments of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment of the present disclosure.

[0011] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0013] FIG. 4 is an exploded perspective view showing the front side of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 6 is a drawing showing an electronic device according to one embodiment of the present disclosure, taken along line A-A' of FIG. 2.

[0016] FIG. 7 is a drawing illustrating an electrical connection structure implemented inside an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 8 is a drawing illustrating an electrical connection structure implemented inside an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 9 is a plan view showing a first support member of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 10 is an enlarged view of a portion 'E' of FIG. 9 among the first support members of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 11 is a drawing showing an antenna structure implemented inside an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 12 is a drawing showing an antenna structure implemented inside an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 13 is a drawing showing an antenna structure implemented inside an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 14 is a drawing showing an antenna structure implemented inside an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 15 is a drawing showing the shape or arrangement of a power supply pad of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 16 is a drawing showing the shape or arrangement of a power supply pad of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 17 is a drawing showing the shape or arrangement of a power supply pad of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 18 is a drawing showing the shape or arrangement of a power supply pad of an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 19 is a drawing showing the shape or arrangement of a power supply pad of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 20 is an enlarged view of a portion 'E2' of FIG. 9 among the first support members of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 21 is a drawing for explaining a connection state of a connection member(s) of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 22 is a drawing for explaining the connection state of the connection member(s) in an electronic device according to one embodiment of the present disclosure, and is a drawing shown by cutting along the line B-B' of FIG. 20.

[0032] FIG. 23 is a graph illustrating the performance of an antenna implemented inside an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 24 is a drawing for explaining an implementation example of a connecting member(s) of an electronic device according to one embodiment of the present disclosure.

[0034] FIG. 25 is a drawing for explaining a connection state of a connection member(s) of an electronic device according to one embodiment of the present disclosure.

[0035] FIG. 26 is a drawing for explaining the connection state of the connection member(s) in an electronic device according to one embodiment of the present disclosure, and is a drawing taken along the line C-C' of FIG. 24.

[0036] FIG. 27 is a graph for explaining the performance according to the power supply method of an antenna implemented inside an electronic device according to one embodiment of the present disclosure.

[0037] FIG. 28 is a graph for explaining the performance or operating frequency band of an antenna implemented inside an electronic device according to one embodiment of the present disclosure.

[0038] FIG. 29 is a drawing for explaining an example of implementing an antenna using a second support member inside an electronic device according to one embodiment of the present disclosure.

[0039] FIG. 30 is an enlarged view of a portion 'E2' of FIG. 9 among the first support members of an electronic device according to one embodiment of the present disclosure.

[0040] FIG. 31 is a drawing showing a printed circuit board and / or electronic components arranged on a first support member of an electronic device according to one embodiment of the present disclosure.

[0041] FIG. 32 is an enlarged view of a portion 'E3' of FIG. 9 among the first support members of an electronic device according to one embodiment of the present disclosure.

[0042] Throughout the attached drawings, like reference numbers will be understood to refer to like parts, components and / or structures.

[0043] As electronic devices become smaller and / or lighter, they can be more convenient to carry and use, even in mobile environments. Since the antennas of electronic devices can generate electromagnetic fields during operation, they can be installed in spaces or locations that minimize electromagnetic interference and ensure a stable communication environment. However, as electronic devices become smaller and / or lighter and the integration of various electrical / electronic components increases, it can be difficult to position antennas that support different communication protocols or antennas that support multiple frequency bands. For example, it can be difficult to secure antennas for securing additional frequency bands or antennas for wireless communication according to additional communication protocols.

[0044] One embodiment of the present disclosure is intended to at least resolve the above-described problems and / or disadvantages and provide at least the advantages described below, and may provide an electronic device including an antenna structure implemented using an internal structure such as a support member.

[0045] One embodiment of the present disclosure can provide an electronic device including an antenna structure that facilitates securing a resonant frequency in an additional frequency band.

[0046] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0047] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0048] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0049] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0050] FIG. 1 is a block diagram of an electronic device (1001) within a network environment (1000) according to one embodiment of the present disclosure. Referring to FIG. 1 , in the network environment (1000), the electronic device (1001) may communicate with the electronic device (1002) via a first network (1098) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1004) or the server (1008) via a second network (1099) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1001) may communicate with the electronic device (1004) via the server (1008). According to one embodiment, the electronic device (1001) may include a processor (1020), a memory (1030), an input module (1050), an audio output module (1055), a display module (1060), an audio module (1070), a sensor module (1076), an interface (1077), a connection terminal (1078), a haptic module (1079), a camera module (1080), a power management module (1088), a battery (1089), a communication module (1090), a subscriber identification module (1096), or an antenna module (1097). In one embodiment, the electronic device (1001) may omit at least one of these components (e.g., the connection terminal (1078)), or may have one or more other components added. In one embodiment, some of these components (e.g., sensor module (1076), camera module (1080), or antenna module (1097)) may be integrated into one component (e.g., display module (1060)).

[0051] The processor (1020) may, for example, execute software (e.g., a program (1040)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1001) connected to the processor (1020) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1020) may store commands or data received from other components (e.g., a sensor module (1076) or a communication module (1090)) in the volatile memory (1032), process the commands or data stored in the volatile memory (1032), and store the resulting data in the non-volatile memory (1034) (e.g., an internal memory (1036) and / or an external memory (1038)). According to one embodiment, the processor (1020) may include a main processor (1021) (e.g., a central processing unit or an application processor), or an auxiliary processor (1023) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1021). For example, when the electronic device (1001) includes the main processor (1021) and the auxiliary processor (1023), the auxiliary processor (1023) may be configured to use less power than the main processor (1021) or to be specialized for a given function. The auxiliary processor (1023) may be implemented separately from the main processor (1021) or as a part thereof.

[0052] The auxiliary processor (1023) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1060), the sensor module (1076), or the communication module (1090)) of the electronic device (1001), for example, on behalf of the main processor (1021) while the main processor (1021) is in an inactive (e.g., sleep) state, or together with the main processor (1021) while the main processor (1021) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1023) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1080) or a communication module (1090)). In one embodiment, the auxiliary processor (1023) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1001) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1008)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0053] The memory (1030) can store various data used by at least one component (e.g., the processor (1020) or the sensor module (1076)) of the electronic device (1001). The data can include, for example, software (e.g., the program (1040)) and input data or output data for commands related thereto. The memory (1030) can include volatile memory (1032) or non-volatile memory (1034).

[0054] The program (1040) may be stored as software in memory (1030) and may include, for example, an operating system (1042), middleware (1044), or an application (1046).

[0055] The input module (1050) can receive commands or data to be used in a component of the electronic device (1001) (e.g., a processor (1020)) from an external source (e.g., a user) of the electronic device (1001). The input module (1050) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0056] The audio output module (1055) can output audio signals to the outside of the electronic device (1001). The audio output module (1055) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0057] The display module (1060) can visually provide information to an external party (e.g., a user) of the electronic device (1001). The display module (1060) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1060) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0058] The audio module (1070) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1070) can acquire sound through the input module (1050), output sound through the sound output module (1055), or an external electronic device (e.g., electronic device (1002)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1001).

[0059] The sensor module (1076) can detect the operating status (e.g., power or temperature) of the electronic device (1001) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1076) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] The interface (1077) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1001) to an external electronic device (e.g., the electronic device (1002)). In one embodiment, the interface (1077) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0061] The connection terminal (1078) may include a connector through which the electronic device (1001) may be physically connected to an external electronic device (e.g., electronic device (1002)). According to one embodiment, the connection terminal (1078) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0062] The haptic module (1079) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1079) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0063] The camera module (1080) can capture still images and videos. According to one embodiment, the camera module (1080) may include one or more lenses, image sensors, image signal processors, or flashes.

[0064] The power management module (1088) can manage power supplied to the electronic device (1001). According to one embodiment, the power management module (1088) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0065] A battery (1089) may power at least one component of the electronic device (1001). In one embodiment, the battery (1089) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0066] The communication module (1090) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1001) and an external electronic device (e.g., electronic device (1002), electronic device (1004), or server (1008)), and the performance of communication through the established communication channel. The communication module (1090) may operate independently from the processor (1020) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1090) may include a wireless communication module (1092) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1094) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (1098) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1099) (e.g., a long-range communication network such as a legacy cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1092) can verify or authenticate the electronic device (1001) within a communication network such as the first network (1098) or the second network (1099) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1096).

[0067] The wireless communication module (1092) can support a 5G network and next-generation communication technologies following the 4th generation (4G) network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1092) can support, for example, a high-frequency band (e.g., millimeter wave (mmWave) band) to achieve a high data transmission rate. The wireless communication module (1092) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1092) may support various requirements specified in the electronic device (1001), an external electronic device (e.g., the electronic device (1004)), or a network system (e.g., the second network (1099)). According to one embodiment, the wireless communication module (1092) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0068] The antenna module (1097) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1097) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1098) or the second network (1099), may be selected from the plurality of antennas by, for example, the communication module (1090). A signal or power may be transmitted or received between the communication module (1090) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1097).

[0069] In one embodiment, the antenna module (1097) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0070] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0071] According to one embodiment, commands or data may be transmitted or received between the electronic device (1001) and an external electronic device (1004) via a server (1008) connected to a second network (1099). Each of the external electronic devices (1002 or 1004) may be the same or a different type of device as the electronic device (1001). According to one embodiment, all or part of the operations executed in the electronic device (1001) may be executed in one or more of the external electronic devices (1002, 1004, or 1008). For example, when the electronic device (1001) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1001) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1001). The electronic device (1001) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1001) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (1004) may include an Internet of Things (IoT) device. The server (1008) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1004) or server (1008) may be included in the second network (1099). The electronic device (1001) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0072] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0073] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to encompass various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together with the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0074] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0075] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0076] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM) or directly between two user devices (e.g., smartphones), online (e.g., by download or upload). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0077] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0078] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. For example, the front of the electronic device and / or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device and / or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. In one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the rectangular coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, depending on the design specifications of the electronic device or the user's usage habits, the orthogonal coordinate system may be defined differently from that in the present disclosure.

[0079] FIG. 2 is a perspective view showing the front side of an electronic device (100) according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device (100) illustrated in FIG. 2 according to one embodiment of the present disclosure.

[0080] Referring to FIGS. 2 and 3, an electronic device (100) according to one embodiment (e.g., the electronic device (1001) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C). According to one embodiment, the first side (110A) may be formed by a front plate (102) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (102) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0081] Although not shown, the front plate (102) may include a seamlessly extending region(s) that curves toward the rear plate (111) at least along a portion of an edge. In one embodiment, the front plate (102) (or the rear plate (111)) may include only one of the curved and extending regions toward the rear plate (111) (or the front plate (102)) at one edge of the first surface (110A). In some embodiments, the front plate (102) or the rear plate (111) may be substantially flat. For example, the curved and extending region may not be included. When the curved and extending region is included, the thickness of the electronic device (100) in the portion that includes the curved and extending region may be smaller than that of other portions.

[0082] According to one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (104), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (108), a second connector hole (109)). In one embodiment, the electronic device (100) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include another component.

[0083] The display (101) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (102)). In one embodiment, at least a portion of the display (101) may be visually exposed through the front plate (102) forming the first surface (110A) or through a portion of a side surface (110C). In one embodiment, the corners of the display (101) may be formed to be substantially the same as the adjacent outer shape of the front plate (102). In one embodiment (not shown), in order to expand the area where the display (101) is visually exposed, the gap between the outer edge of the display (101) and the outer edge of the front plate (102) may be formed to be substantially the same.

[0084] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (101), and at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In one embodiment (not shown), at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (101). In one embodiment (not shown), the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In one embodiment, when the front plate (102) or the rear plate (111) includes a curved and extended area(s), at least a portion of the sensor module (e.g., the first sensor module (104), the third sensor module (119)) and / or at least a portion of the key input device (117) may be disposed in the curved and extended area(s).

[0085] The audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0086] The sensor module can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module may include, for example, a first sensor module (104) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (101)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (100) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0087] The camera module may include a first camera device (105) disposed on a first surface (110A) of the electronic device (100), a second camera device (112) disposed on a second surface (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one surface of the electronic device (100). In one embodiment, the flash (113) may emit infrared light, and infrared light emitted by the flash (113) and reflected by a subject may be received via the third sensor module (119). The electronic device (100) or the processor of the electronic device (100) (e.g., the processor (1020) of FIG. 1) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (119).

[0088] The key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (100) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0089] The light emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light emitting element (106) may provide, for example, status information of the electronic device (100) in the form of light. In one embodiment, the light emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light emitting element (106) may include, for example, a light emitting diode (LED), an infrared LED, and a xenon lamp.

[0090] The connector hole (e.g., the first connector hole (108), the second connector hole (109)) may include a first connector hole (108) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0091] FIG. 4 is an exploded perspective view showing a front side of an electronic device (200) (e.g., the electronic device (100) illustrated in FIG. 2) according to one embodiment of the present disclosure. FIG. 5 is an exploded perspective view showing a rear side of an electronic device (200) (e.g., the electronic device (100) illustrated in FIG. 2) according to one embodiment of the present disclosure.

[0092] Referring to FIGS. 4 and 5, the electronic device (200) (e.g., the electronic device (1001, 1002, 1004, 100) of FIG. 1, FIG. 2 or FIG. 3) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (102) of FIG. 1), a display (230) (e.g., the display (101) of FIG. 1), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna (not shown) (e.g., the antenna module (1097) of FIG. 1), a camera assembly (207) and a rear plate (280) (e.g., the rear plate (111) of FIG. 3). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include another component. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (100) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0093] The first support member (211) may be disposed inside the electronic device (200) and connected to the side structure (210), or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., a processor (1020) of FIG. 1), a memory (e.g., a memory (1030) of FIG. 1), and / or an interface (e.g., an interface (1077) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the processor and / or memory may refer to one of the circuit devices mounted on an integrated circuit chip.

[0094] In one embodiment, the first support member (211) and the side structure (210) may be combined and referred to as a front case or a portion of the housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (200), for example, the side structure (210), the front plate (220), and / or the rear plate (280). In one embodiment, the 'front or rear surface of the housing (201)' may refer to the first surface (110A) of FIG. 2 or the second surface (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0095] The display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0096] The memory may include, for example, volatile memory or non-volatile memory.

[0097] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0098] The second support member (260) may include, for example, an upper support member (260a) and / or a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround the printed circuit board (240) together with a portion of the first support member (211). For example, the printed circuit board (240) may be substantially disposed between the first support member (211) and the second support member (260) (e.g., the upper support member (260a). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electric / electronic components may be disposed on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, at least one shield can (249) may be disposed on the printed circuit board (240). For example, the shield can (249) may provide an electromagnetic shielding environment to a portion or space on the printed circuit board (240). In one embodiment, the shield can (249) may be disposed to surround at least a portion of an integrated circuit chip on which a processor, a memory, and / or a communication module are mounted.

[0099] In one embodiment, the lower support member (260b) can be utilized as a structure for arranging electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) can be arranged on an additional printed circuit board (not shown). For example, the lower support member (260b) can be arranged to surround the additional printed circuit board together with another portion of the first support member (211). A speaker module or interface arranged on an additional printed circuit board or lower support member (260b) not shown may be arranged corresponding to an audio module (e.g., a microphone hole (103) or a speaker hole (e.g., an external speaker hole (107) or a call receiver hole (114))) or a connector hole (e.g., a first connector hole (108) or a second connector hole (109)) of FIG. 2.

[0100] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

[0101] Although not shown, the antenna may include a conductive pattern implemented on the surface of the first support member (211) and / or the surface of the second support member (260), for example, through a laser direct structuring (LDS) process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion of the first support member (211), or a combination thereof.

[0102] The camera assembly (207) may include at least one camera module. Within the electronic device (200), the camera assembly (207) may receive at least a portion of light incident through optical holes or camera windows (212a, 212b, 212c, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with any one of the camera windows (212a, 212b, 212c, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0103] In examining the embodiments described below, the configuration of the electronic devices (1001, 1002, 1004, 100, 200) described above may be referred to. Even if not directly mentioned, the configuration of the embodiments described above may be similarly applied to the embodiments described below. The orthogonal coordinate system referred to in the embodiments described above and / or below is an example for the sake of brevity of explanation, and may be defined differently depending on the shape of the electronic device to be actually manufactured (e.g., bar type, foldable type, rollable type, and / or slide type), the user's usage habits, and / or the orientation direction of the electronic device. In the embodiments described below, reference numbers in the drawings for configurations that can be easily understood through the embodiments described above may be assigned the same number or may be omitted, and even if reference numbers are assigned, a detailed description may be omitted.

[0104] FIG. 6 is a diagram illustrating an electronic device (300) (e.g., electronic devices (1001, 1002, 1004, 100, 200) of FIGS. 1 to 5) cut along line A-A' of FIG. 2 according to one embodiment of the present disclosure. FIG. 7 is a diagram illustrating an electrical connection structure implemented inside an electronic device (300) according to one embodiment of the present disclosure. FIG. 8 is a diagram illustrating an electrical connection structure implemented inside an electronic device (300) according to one embodiment of the present disclosure.

[0105] Referring to FIGS. 6 to 8, the electronic device (300) may perform wireless communication by utilizing a portion of a structure (e.g., the first support member (211, 311) of FIGS. 4 to 7) disposed inside a housing (e.g., the housing (201) of FIG. 4 or 5). For example, a portion of the internal structure may be electrically connected to a printed circuit board (340) (e.g., the printed circuit board (240) of FIG. 4 or 5). Here, the phrase “a portion of the internal structure is electrically connected to the printed circuit board” may refer to the fact that a portion of the internal structure includes an electrically conductive material, and at least a portion of the portion of the internal structure including the electrically conductive material is electrically connected to a wireless communication circuit (e.g., the communication module (1090) of FIG. 1 or the wireless communication circuit (WCC) of FIG. 24) so ​​as to function as an antenna. In one embodiment, the memory (1030) may store instructions executed by at least one processor (1020), and the processor (1020) may be configured to cause the electronic device (300) to perform wireless communication in a designated frequency band by executing the instruction(s) using the internal structure. In one embodiment, when electrically connected to the printed circuit board (340), the internal structure may provide multiple resonant frequencies. In one embodiment, the internal structure may provide multiple resonant frequencies when performing wireless communication of the same communication protocol.

[0106] According to one embodiment, the electronic device (300) can perform wireless communication using at least a portion of the side structure (210) (e.g., the side structure (210) of FIGS. 4 to 6) separately from the internal structure. In one embodiment, wireless communication using the side structure (210) can be performed independently of wireless communication using the internal structure. Here, the phrase “the internal structure or the side structure is used for wireless communication” may refer to at least a portion of the internal structure (e.g., the first support member (211, 311) of FIGS. 4 to 7) or at least a portion of the side structure (210) including an electrically conductive material. In one embodiment, when a portion of the side structure (210) is used for wireless communication, the portion may be electrically insulated from, but mechanically connected or coupled to, the remaining portion of the side structure (210).

[0107] According to one embodiment, an electronic device (300) includes a housing (201), a first support member (311), openings (311a, 311b) provided to pass through the first support member (311), a printed circuit board (340), at least one processor (e.g., processor (1020) of FIG. 1) (or communication circuitry (e.g., communication module (1090) of FIG. 1)), and / or memory (e.g., memory (1030) of FIG. 1), and is capable of performing wireless communication in a first frequency band using at least a portion of the first support member (311) around the openings (311a, 311b). In one embodiment, a first opening (311a) passing through the first support member (311) and a second opening (311b) passing through the first support member (311) at a position adjacent to the first opening (311a) may be provided. In one embodiment, when the first opening (311a) and the second opening (311b) are provided, a plurality of resonant frequencies can be implemented depending on the relative sizes of the first opening (311a) and the second opening (311b). For example, for convenience of explanation, 'performing wireless communication in the first frequency band using at least a portion of the first support member' is mentioned, but 'the first frequency band' can be understood to mean including a configuration that performs wireless communication of the same communication protocol but forms two different resonant frequencies.

[0108] According to one embodiment, the housing (201) may include a front plate (e.g., the front plate (220) of FIG. 4 or 5) and a back plate (e.g., the back plate (280) of FIG. 4 or 5) arranged to face in an opposite direction of the front plate. In one embodiment, the space between the front plate (220) and the back plate (280) may be provided as a space for accommodating or arranging electrical / electronic components, such as a printed circuit board (340) (e.g., the printed circuit board (240) of FIG. 4 or 5). As in the above-described embodiment, the 'housing' may refer to a structure that can be visually or tactilely recognized by a user in the appearance of the electronic device (300). For example, the housing (201) may further include a side structure (210) (e.g., the side structure (210) of FIG. 4 or 5) surrounding the space between the front plate (220) and the back plate (280). In one embodiment, when the first support member (311) is integrally formed with the side structure (210), the first support member (311) may be understood to be a part of the housing (201) even if it is not visually or tactilely perceived by a user. For example, although the first support member (311) may be described as a separate component from the housing (201), this is for the sake of brevity of description and the housing (201) may be understood to include the first support member (311).

[0109] According to one embodiment, the first support member (311) is disposed in a space between the front plate (220) and the rear plate (280), and may include a coupling boss (311c) provided on one surface. In one embodiment, the first support member (311) has a plate shape substantially similar to the front plate (220) or the rear plate (280), and may include openings (opening(s)) (e.g., a first opening (311a) or a second opening (311b)), recess(es), and / or partition(s) depending on the arrangement of electrical / electronic components therein. For example, the first support member (311) may have a plate shape including a recessed or protruding portion on the surface. In one embodiment, the first support member (311) may be one of internal structures that may be used for wireless communication, and may at least partially include an electrically conductive material. For example, the first support member (311) may function as an antenna or a radiating conductor by at least partially comprising an electrically conductive material.

[0110] According to one embodiment, the fastening boss (311c) is a structure protruding from one surface of the first support member (311), and may support, for example, a printed circuit board (340). In one embodiment, a plurality of fastening bosses (311c) may be provided on one surface (or both surfaces) of the first support member (311). In one embodiment, the fastening boss (311c) is described as a part of the first support member (311), but may be a structure for forming a gap between the first support member (311) and the printed circuit board (340). For example, by being supported by the fastening boss (311c) of the printed circuit board (340), a gap may be formed between the first support member (311) and the printed circuit board (340) by the height of the fastening boss (311c) (e.g., the height protruding from one surface of the first support member (311). In one embodiment, the gap between the first support member (311) and the printed circuit board (340) may provide space for electrical / electronic components disposed on the printed circuit board (340) to be positioned.

[0111] According to one embodiment, the electronic device (300) may include openings (311a, 311b) provided to penetrate a support member (e.g., a first support member (311)). The openings (311a, 311b) may be understood as, for example, a portion of the first support member (311). In the illustrated embodiment, a first opening (311a) provided to penetrate the first support member (311) at a designated location and a second opening (311b) provided to penetrate the first support member (311) at a location adjacent to the first opening (311a) may be exemplified. In one embodiment, the first opening (311a) and the second opening (311b) may be understood to be aligned along a first direction (D1), for example, a direction parallel to the Y-axis of FIG. 5 . However, in the embodiment(s) of the present disclosure, the number and alignment direction of the openings (311a, 311b) of the first support member (311) may be implemented differently depending on the arrangement of the component(s) inside, so it should be noted that the 'first direction (D1)' is not limited to the direction parallel to the Y-axis of FIG. 5. For example, the 'alignment direction of the first opening (311a) and the second opening (311b)' mentioned in the embodiment(s) of the present disclosure may be understood to include a direction parallel to the Y-axis of FIG. 5, a direction parallel to the X-axis of FIG. 5, and / or a direction inclined rather than perpendicular to the Y-axis.

[0112] In one embodiment, as mentioned above, the printed circuit board (340) may be disposed on the first support member (311) supported by the fastening boss (311c). Although the fastening boss (311c) is described as being a part of the first support member (311), it may be understood that the printed circuit board (340) is disposed at a specified height from one surface of the first support member (311) by the height of the fastening boss (311c). In one embodiment, the printed circuit board (340) may be electrically connected to the first support member (311) through the fastening boss (311c). For example, at least the fastening boss (311c) of the first support member (311) may be understood to include an electrically conductive material.

[0113] In one embodiment, the fastening boss (311c) may be positioned adjacent to the first opening (311a). In one embodiment, when the fastening boss (311c) is positioned adjacent to the first opening (311a), a portion of the first support member (311) forming a periphery of the first opening (311a) may substantially include an electrically conductive material. For example, the first support member (311) may include an electrically conductive material in the fastening boss (311c) and a portion that is connected to the fastening boss (311c) and defines the first opening (311a). Thus, among the first support member (311), at least a portion of the periphery of the first opening (311a) and / or the fastening boss (311c) may function as an antenna (or a radiation conductor).

[0114] According to one embodiment, the electronic device (300) may further include a fastening member (359a)(s). The fastening member (359a) may be fastened to a first support member (311) (e.g., a fastening boss (311c)) by, for example, penetrating a fastening hole (343b) provided in a printed circuit board (340). In one embodiment, when the printed circuit board (340) is electrically connected to the first support member (311) through the fastening boss (311c), an insulating member (359b) may be further provided on an inner wall of the fastening hole (343b) and / or an outer peripheral surface of the fastening member (359a). For example, when the printed circuit board (340) is electrically connected to the first support member (311) via the fastening boss (311c), the fastening member (359a) fastened to the fastening boss (311c) may be electrically insulated with respect to the inner wall of the fastening hole (343b) and / or the fastening boss (311c). In one embodiment, when the fastening member (359a) is a bolt or a screw, the head of the fastening member (359a) may be electrically connected to the ground conductor of the printed circuit board (340).

[0115] In one embodiment, a second opening (311b) adjacent to a first opening (311a) may be arranged adjacent to a fastening boss (311c). In one embodiment, when the first opening (311a) and the second opening (311b) are defined as being aligned along a first direction (D1), the fastening boss (311c) may be arranged on one side of the first opening (311a) or on one side of the second opening (311b) in a second direction (D2) intersecting the first direction (D1). When the second opening (311b) is arranged adjacent to the fastening boss (311c), the first support member (311) may include an electrically conductive material at least in a portion of a periphery of the second opening (311b). For example, by including an electrically conductive material in the portion defining the second opening (311b), the first support member (311) can provide an antenna that extends further from the first opening (311a) portion, or an antenna that is independent of the first opening (311a) portion. For example, a portion of the first support member (311) provided as an internal structure can implement antenna(s) by electrically connecting the fastening boss (311c), a portion of the first support member (311) surrounding the first opening (311a), and / or a portion of the first support member (311) surrounding the second opening (311b) to the printed circuit board (340).

[0116] According to one embodiment, when a fastening boss (311c) is provided adjacent to the periphery of the first opening (311a) and / or the second opening (311b), and / or when the first support member (311) and the printed circuit board (340) are electrically connected through the fastening boss (311c), the electronic device (300) may be configured to perform wireless communication in the first frequency band using a portion of the first support member (311). Here, the term “electrically connected” may be understood to include not only a structure in which the fastening boss (311c) is in direct contact with the feed pads (341a, 341b) described below, but also a structure in which the fastening boss (311c) and the feed pads (341a, 341b) are arranged within a specified distance to form an electromagnetic coupling even though they are not in direct contact. In one embodiment, the memory (1030) may store instructions configured to cause the electronic device (300) to perform wireless communication using at least a portion of the first support member (311) around the first opening (311a) or the second opening (311b), and these instructions may be executed by each of the processors (1020) or by a combination of processors.

[0117] In one embodiment, the first opening (311a) may provide a space for arranging a camera module (371) (e.g., the camera device (105, 112) of FIG. 2 or 3), and / or the second opening (311b) may provide a space for arranging a sensor module (373) (e.g., the first sensor module (104) of FIG. 2). The sensor module (373) arranged in the second opening (311b) may include a sensor for detecting an operating environment, such as a proximity sensor or an illuminance sensor. In one embodiment, when utilizing the periphery of the camera and / or sensor openings (311a, 311b) as an antenna, the first support member (311) may form a resonant frequency in a frequency band of approximately 6.5 GHz and / or a frequency band of approximately 8 GHz.

[0118] According to one embodiment, the resonant frequency formed by the first support member (311) providing the openings (311a, 311b) may vary depending on the specifications of the electronic device to be actually manufactured. For example, depending on the sizes of the first openings (311a) and the second openings (311b), the resonant frequency may be formed in a frequency band other than the 6.5 GHz frequency band and / or the approximately 8 GHz frequency band. In one embodiment, as the sizes of the openings (311a, 311b) increase, the resonant frequency may decrease. In one embodiment, as the distance from the fastening boss (311c) increases, the electrical length provided by the electrically conductive portion around the openings (311a, 311b) increases, and the resonant frequency provided by the internal structure (e.g., the first support member (311)) as a radiation conductor may decrease. For example, when implementing an antenna or a radiating conductor using an internal structure, the size and relative position of the openings (311a, 311b)(s) and / or the electrical length provided by the path from the fastening boss (311c) to the openings (311a, 311b) (e.g., the electrically conductive portion around the openings (311a, 311b)) may be taken into consideration. Accordingly, depending on the specifications of the electronic device (300) to be actually manufactured, the antenna using the first support member (311) may form a resonant frequency in an arbitrarily selected frequency band.

[0119] According to one embodiment, the printed circuit board (340) may include a fill-cut area (343a) and at least one feed pad (341a, 341b) provided within the fill-cut area (343a). For example, the feed pad (341a, 341b)(s) may be spaced apart from or directly in contact with the fastening boss (311c). In one embodiment, when the printed circuit board (340) is a multilayer circuit board, the phrase 'at least one feed pad is provided within the fill-cut area' may refer to a structure in which the feed pad (341a, 341b)(s) is disposed in a layer disposed internally among a plurality of layers, and other conductive layers (and / or insulating layers) are removed from a portion corresponding to the feed pad (341a, 341b)(s). In one embodiment, the phrase "the power supply pads (341a, 341b) are arranged to face the fastening boss (311c)" may refer to the fact that the power supply pads (341a, 341b) are not in direct contact with the fastening boss (311c), but are arranged within a distance capable of forming an electromagnetic coupling or coupling supply. In one embodiment, in a structure in which the power supply pads (341a, 341b) are arranged to face the fastening boss (311c), an insulating material may be provided between the power supply pads (341a, 341b) and the fastening boss (311c).

[0120] According to one embodiment, the fastening hole (343b) may be provided substantially penetrating the fill-cut region (343a). In one embodiment, the power supply pad (341a, 341b)(s) may be arranged adjacent to the fastening hole (343b). Here, the phrase “arranged adjacent to the fastening hole” may be understood to include a structure arranged not to be in direct contact with the fastening hole (343b). In one embodiment, the power supply pad (341a, 341b)(s) may be arranged at a specified distance from the fastening hole (343b). For example, the power supply pad (341a, 341b)(s) may be arranged to be in direct contact with or form an electromagnetic coupling with the fastening boss (311c) without being in direct contact with the fastening boss (311c). In one embodiment, a plurality of feed pads (341a, 341b) may be provided, in which case the feed pads (341a, 341b) may be understood to be arranged around the fastening hole (343b). In one embodiment, as will be described with reference to FIG. 12, the feed pads (341a, 341b) may include an extending portion extending in one direction (e.g., an extending portion (541c, 541d) of FIG. 15), which may be arranged substantially side by side with the first opening (311a) or the second opening (311b). For example, the number, shape, and / or arrangement position of the feed pads (341a, 341b)(s) may vary depending on the specifications of the electronic device to be actually manufactured.

[0121] According to one embodiment, the printed circuit board (340) may include a first switching element (349b) that connects the power supply pads (341a, 341b)(s) and the communication circuit (communication module (1090) of FIG. 1). For example, at least one power supply pad (341a, 341b) may be electrically connected to the communication circuit and / or at least one processor via the first switching element (349b). In FIG. 7 or FIG. 8, the communication circuit may be understood as being mounted on an integrated circuit chip (349a) disposed on the printed circuit board (340). It should be noted that the first switching element (349b) may include, for example, a duplexer (DPX), a multiplexer (MPX), a single pole double through (SPDT) switch, or a double pole double through (DPDT) switch, but is not limited to the types of switches mentioned. The first switching element (349b) can be used, for example, to separate the paths of a transmission signal and a reception signal, or to select a power supply pad (341a, 341b) to be used for transmission and reception in a structure in which a plurality of power supply pads (341a, 341b) are provided. Accordingly, the electronic device (300) can use the first switching element (349b) to select a frequency at which to perform a wireless signal transmission and reception operation or a current wireless communication.

[0122] FIG. 9 is a plan view showing a first support member (411) (e.g., the first support members (211, 311) of FIGS. 4 to 7) of an electronic device (e.g., the electronic device (300) of FIG. 6) according to one embodiment of the present disclosure. FIG. 10 is a drawing showing an enlarged portion of 'E' of FIG. 9 among the first support members (411) of the electronic device (300) according to one embodiment of the present disclosure.

[0123] Referring to FIGS. 9 and 10 , the electronic device (300) may include a side structure (410) (e.g., the side structure (210) of FIGS. 4 to 6 ) and a first support member (411) (e.g., the first support member (311) of FIG. 6 ). In one embodiment, the side structure (410) and the first support member (411) may include an electrically conductive material. In the illustrated embodiment, at least a portion of the dark area may be an example of an area of ​​the side structure (410) and the first support member (411) that includes an electrically conductive material. In one embodiment, the bright areas where no shading is applied may illustrate openings (311a, 311b, 419)(s) provided by the first support member (411) (e.g., the first opening (311a) and the second opening (311b) of FIG. 6) and / or a void between the side structure (410) and the first support member (411). In one embodiment, the void between the side structure (410) and the first support member (411) may be at least partially filled with an electrically insulating material, such as a polymer, to mechanically connect the side structure (410) and the first support member (411).

[0124] In one embodiment, the side structure (410) may have a closed curve shape or a polygonal shape that substantially surrounds the perimeter of the first support member (411). For example, the side structure (410) may be arranged to at least partially surround a space between a front plate (e.g., the front plate (220) of FIGS. 4 to 6) and a rear plate (e.g., the rear plate (280) of FIGS. 4 to 6). In one embodiment, the side structure (410) may include a first frame (410a), a second frame (410b), and / or a third frame (410c) arranged to form a closed curve trajectory. In one embodiment, the number of frames forming the side structure (410) may differ from the illustrated configuration depending on an actual product. In one embodiment, the first frame (410a), the second frame (410b), and / or the third frame (410c) may be exemplified as a portion of the side structure (410) that substantially comprises an electrically conductive material.

[0125] In one embodiment, a void space may be disposed between an end of the first frame (410a) and an end of the second frame (410b), and / or between an end of the second frame (410b) and an end of the third frame (410c). For example, when the first frame (410a), the second frame (410b), and / or the third frame (410c) include an electrically conductive material, the second frame (410b) may be electrically insulated from the first frame (410a) and / or from the third frame (410c). Although not shown, the space between the first frame (410a) and the second frame (410b), and / or the space between the second frame (410b) and the third frame (410c) may be filled with an electrically insulating material, thereby electrically insulating the second frame (410b) from the first frame (410a) or from the third frame (410c) while mechanically connecting (or coupling) the second frame (410b) to the first frame (410a) and / or the third frame (410c). In one embodiment, the electrically insulating structure that mechanically connects (or couples) the second frame (410b) to the first frame (410a) and / or the third frame (410c) may be understood as a part of the side structure (410).

[0126] In one embodiment, a portion of the side structure (410) (e.g., the second frame (410b)) may be provided as a structure that surrounds a portion of the first opening (311a) or defines a portion of the first opening (311a). For example, a portion of the inner side of the second frame (410b) may be provided as an inner wall of the first opening (311a). In one embodiment, the first support member (411) may include a plurality of openings (311a, 311b, 419), and a portion of an opening (e.g., the first opening (311a)) provided at a position adjacent to the side structure (410) among the plurality of openings (311a, 311b, 419) may be understood to be defined by the second frame (410b).

[0127] In one embodiment, the first support member (411) may be provided with a fastening boss (311c) at a first position adjacent to a selected opening(s) among the plurality of openings (311a, 311b, 419). For example, when a printed circuit board (340) is disposed on the fastening boss (311c), a portion of the first support member (411) around the selected opening(s) may function as an antenna or a radiating conductor. In one embodiment, when the printed circuit board (340) is disposed on the fastening boss (311c) and a portion of the first support member (411) around the selected opening(s) is electrically connected to a communication circuit to implement an antenna or a radiating conductor, the fastening boss (311c) may function as a portion of a power supply path (or a power supply point). For the sake of brevity, the drawings illustrate fastening bosses (311c) positioned adjacent to the first opening (311a) and the second opening (311b), but it should be noted that the embodiments of the present disclosure are not limited thereto. For example, additional fastening bosses (or bosses) adjacent to at least one of the openings indicated by reference numeral '419' may be provided, and an antenna may be implemented around the opening adjacent to the additional fastening boss. In one embodiment, the first support member (411) may further provide a second fastening boss (411c) positioned adjacent to the first opening (311a) and the second opening (311b).

[0128] According to one embodiment, the side structure (410) or the housing (201) may include flanges (F)(s) protruding from the inner surface of, for example, the first frame (410a), the second frame (410b), and / or the third frame (410c). When the space between the side structure (410) and the first support member (411) includes an insulating material filled therein, at least a portion of the flanges (F)(s) may be in contact with or embedded in the insulating structure. For example, the flanges (F)(s) may increase the bonding strength between the electrically conductive portion and the insulating structure and improve the mechanical stability of the electronic device (300).

[0129] In one embodiment, one of the flanges (F) may be electrically connected to a communication circuit of the printed circuit board (340) (e.g., a communication module (1090) of FIG. 1 or an integrated circuit chip (349a) of FIG. 7), and / or another one of the flanges (F) may be electrically connected to ground. A portion that is electrically insulated from other portions of the side structure (410) and electrically connected to the communication circuit and / or at least one processor through one of the flanges (F) may function as a radiation conductor. In the illustrated embodiment, one of the flanges (F) protruding from the second frame (410b) may be implemented as a radiation conductor by being electrically connected to a power supply or a communication circuit. In one embodiment, another of the flanges (F) protruding from the second frame (410b) implemented as a radiation conductor may be electrically connected to ground.

[0130] According to one embodiment, a side structure (410), for example, a first opening (311a) and a second opening (311b) may be provided in the first support member (411) in an aligned state along the first direction (D1) from the second frame (410b). In one embodiment, a separation bar (413) (e.g., the separation bar (413) of FIG. 11) may be provided between the first opening (311a) and the second opening (311b). For example, the separation bar (413) may be understood as a structure that simultaneously defines a portion of the first opening (311a) and a portion of the second opening (311b). In one embodiment, the first support member (411) may substantially include an electrically conductive material around the first opening (311a) and the second opening (311b). For example, when a communication circuit is connected to a first location (e.g., a fastening boss (311c)(s)) adjacent to the first opening (311a) and the second opening (311b), the peripheral portion of the first opening (311a) and / or the peripheral portion of the second opening (311b) of the first support member (411) can function as an antenna.

[0131] In one embodiment, the first location, for example, the fastening boss (311c), may be understood as being aligned substantially side by side with a portion of the first opening (311a) in a direction intersecting the first direction (D1). In one embodiment, the fastening boss (311c) may be understood as being aligned substantially side by side with a portion of the second opening (311b) in a direction intersecting the first direction (D1). Here, the 'direction intersecting the first direction (D1)' may be understood to include a second direction (D2) substantially perpendicular to the first direction (D1), and in one embodiment, may refer to a direction inclined by a specified angle rather than perpendicular (or parallel) to the first direction (D1). In one embodiment, when it is desired to implement the peripheral portion of the openings (311a, 311b, 419) as a radiation conductor, the position of the fastening boss (311c) for the first opening (311a) and / or the position of the fastening boss (311c) for the second opening (311b) can be appropriately selected depending on the size of the openings (311a, 311b, 419) and the resonant frequency to be secured.

[0132] In one embodiment, when the fastening boss (311c) is positioned adjacent to one end of the separating bar (413), the first support member (411) may further include a second fastening boss (411c) positioned at a second position adjacent to the other end of the separating bar (413). In one embodiment, similar to how the fastening boss (311c) is electromagnetically connected to the communication circuit, the second fastening boss (411c) may be electromagnetically connected to the communication circuit. In one embodiment, an additional pad positioned adjacent to the second fastening boss (411c) within the printed circuit board (340) electrically connected to the communication circuit may be implemented similarly to the power supply pads (341a, 341b) of FIG. 7, and the additional pad corresponding to the second fastening boss (411c) will be further described with reference to FIGS. 11 to 14.

[0133] In one embodiment, the first opening (311a) may be disposed at a first distance (L1) from the second frame (410b), the second opening (311b) may be disposed at a second distance (L2) from the second frame (410b), and / or the fastening boss (311c) may be disposed at a third distance (L3) from the second frame (410b). Here, the first distance (L1), the second distance (L2), and / or the third distance (L3) may be defined as a distance measured from an outer surface of the second frame (410b) along a first direction (D1). In one embodiment, the first distance (L1), the second distance (L2), and / or the third distance (L3) may be defined as a distance measured from an inner surface of the second frame (410b) along the first direction (D1). In one embodiment, the distance between the first opening (311a) and the second frame (410b) may be understood as zero when defined as a distance from the inner surface of the second frame (410b), but may vary depending on the position of the first opening (311a). For example, the second frame (410b) may be understood as defining a portion of the first opening (311a).

[0134] In one embodiment, the third distance (L3) may be greater than the first distance (L1) and less than the second distance (L2). In one embodiment, the third distance (L3) may be greater than the width of the first opening (311a) or the length of the first opening (311a). In one embodiment, when the third distance (L3) is less than the second distance (L2) and greater than the width (or length) of the first opening (311a), the fastening boss (311c) may be understood to be arranged adjacent to one end of the separating bar (413). In one embodiment, the fastening boss (311c) may partially overlap the first opening (311a) or partially overlap the second opening (311b) in a second direction (D2) perpendicular to the first direction (D1). For example, when viewed in the plan view illustrated in FIG. 10, the diameter of the fastening boss (311c) may be implemented in various ways. In one embodiment, the diameter of the fastening boss (311c) can be appropriately selected to achieve a stable electrical connection (electromagnetic coupling or direct contact) with a printed circuit board (e.g., power supply pads (341a, 341b)(s)).

[0135] FIG. 11 is a drawing showing an antenna structure (597a) implemented inside an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) according to one embodiment of the present disclosure.

[0136] Referring to FIG. 11, a dividing bar (413) may be substantially a portion of the first support member (411) and may extend in a direction intersecting the first direction (D1) and be disposed between the first opening (311a) and the second opening (311b). In one embodiment, a fastening boss (e.g., fastening boss (311c) of FIGS. 6, 7, and / or 10) and / or a feed pad (541) (e.g., feed pads (341a, 341b) of FIG. 7 or 8)(s) may be disposed adjacent to one of the two ends of the dividing bar (413). In one embodiment, a second fastening boss (e.g., second fastening boss (411c) of FIG. 10) may be disposed adjacent to the other of the two ends of the dividing bar (413). The configuration of the second fastening boss (411c) may be similar to the fastening boss (311c) of FIG. 7, and may differ from the fastening boss (311c) of FIG. 7 in its position. In the illustrated embodiment, the dividing bar (413) may include a first dividing portion (413a) adjacent to the fastening boss (311c) (or the power supply pad (541)), a second dividing portion (413b) adjacent to the second fastening boss (411c) (or the additional pad (543)), and a connecting portion (413c) that mechanically connects the first dividing portion (413a) and the second dividing portion (413b). In one embodiment, the connecting portion (413c) may include a polymer material to function as an insulating portion that mechanically connects the first dividing portion (413a) and the second dividing portion (413b) while electrically insulating them. In one embodiment, the connecting portion (413c) may be made of a substantially electrically conductive material.

[0137] According to one embodiment, the separation bar (413) may be understood to extend in a direction intersecting the first direction (D1) between the fastening boss (311c) and the second fastening boss (411c). In one embodiment, the second fastening boss (411c) may be electrically connected to the printed circuit board (340) by including an electrically conductive material. Although not shown, in order to be electrically connected to the second fastening boss (411c), the printed circuit board (340) may include additional pad(s) (543) corresponding to the second fastening boss (411c) and / or additional fill-cut areas. The additional pad(s) (543) and / or additional fill-cut areas for connection to the second fastening boss (411c) may be similar to the power supply pad(s) (341a, 341b)(s) and / or fill-cut areas (343a) of FIG. 7. In one embodiment, the additional pad (543) may be understood as a ground pad(s) electrically connected to a ground conductor of the printed circuit board (340). As will be described with reference to FIG. 13, the additional pad (543) may be electrically connected to a communication circuit (e.g., an integrated circuit chip (349a) of FIG. 7), in which case the additional pad (543) may be understood as an independent supply pad(s) with respect to the supply pad(s) (341a, 341b) of FIG. 7. In one embodiment, the fastening boss (311c) (e.g., the supply pad (541)) and the second fastening boss (411c) (e.g., the additional pad (543)) may be positioned within a specified distance from the first opening (311a) and / or the second opening (311b).

[0138] In one embodiment, the printed circuit board (340) may include a single power supply pad (541) at a location corresponding to the fastening boss (311c). When an electrical signal (e.g., a wireless communication signal) is applied to the first support member (411) through the power supply pad (541), a current flow path (C1, C2) is generated on the first support member (411) around the first opening (311a) and / or the second opening (311b), thereby allowing the wireless communication signal to be received or radiated. In one embodiment, when the sizes of the first opening (311a) and the second opening (311b) are different, wireless communication using the first support member (411) may be implemented in at least two frequency bands. For example, the aforementioned “first frequency band” may be understood to refer to two different frequency bands. For example, when the fastening boss (311c) and / or the power supply pad (541) are electrically connected to the communication circuit, the additional pad (543) may connect the second fastening boss (411c) to the ground conductor of the printed circuit board (340). In this case, the additional pad (543) may be understood as a single ground pad.

[0139] FIG. 12 is a drawing showing an antenna structure (597b) implemented inside an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) according to one embodiment of the present disclosure.

[0140] Compared to the embodiment of FIG. 11, the antenna structure (597b) of FIG. 12 may differ in its structure by further including a plurality of feed pads (541a, 541b) (e.g., a first feed pad (541a) and a second feed pad (541b)) and extending portion(s) (541c, 541d). Therefore, the omitted components in the description of the antenna structure (597b) of FIG. 12 can be easily understood by referring to the embodiment of FIG. 11. Referring to FIG. 12, when including a plurality of feed pads (541a, 541b), the antenna structure (597b) may include a first switching element (349b) (e.g., the first switching element (349b) of FIG. 7 or 8) to select a feed pad (541a, 541b) to be connected to a communication circuit or at least one processor (e.g., an integrated circuit chip (349a)), or to adjust the characteristics (or matching characteristics) of a transmission line from the communication circuit to the feed pad (541a, 541b)(s).

[0141] According to one embodiment, the antenna structure (597b) may include a plurality (e.g., two) of feed pads (541a, 541b) corresponding to one fastening boss (e.g., the second fastening boss (411c) of FIG. 11). In one embodiment, the feed pads (541a, 541b) may be understood as having a generally circular shape and arranged along a circumferential direction. In one embodiment, the extension portions (541c, 541d) may be understood as extending from each of the feed pads (541a, 541b) in parallel with the first opening (311a) (or the second opening (311b)). For convenience of explanation, the power supply pads (541a, 541b)(s) and the extensions (541c, 541d)(s) are described separately, but it can be understood that the extensions (541c, 541d)(s) are actually part of the power supply pads (541a, 541b)(s).

[0142] In one embodiment, when the printed circuit board (340) is implemented as a multilayer circuit board, the extensions (541c, 541d)(s) may be disposed on the same layer as the first power supply pad (541a) and / or the second power supply pad (541b). In one embodiment, when the printed circuit board (340) is implemented as a multilayer circuit board, the extensions (541c, 541d)(s) may be disposed on a different layer from the first power supply pad (541a) and / or the second power supply pad (541b). In one embodiment, when disposed on different layers, the extensions (541c, 541d)(s) may be electrically connected to the first power supply pad (541a) and / or the second power supply pad (541b) through via conductor(s) not shown. Regardless of the layer on which the extensions (541c, 541d)(s) are arranged, the first power supply pad (541a) and the second power supply pad (541b) may be arranged on the same layer within the printed circuit board (340). The layer on which the first power supply pad (541a), the second power supply pad (541b), and / or the extensions (541c, 541d)(s) are arranged may be appropriately selected according to the specifications of the electronic device to be actually manufactured (e.g., the electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6). For example, the first power supply pad (541a), the second power supply pad (541b), and / or the extensions (541c, 541d)(s) may be arranged on different layers within the printed circuit board (340).

[0143] FIG. 13 is a drawing showing an antenna structure (597c) implemented inside an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) according to one embodiment of the present disclosure.

[0144] Compared to the embodiment of FIG. 12, the antenna structure (597c) of FIG. 13 may differ in that the additional pad (543) includes a third feed pad (543a) and a fourth feed pad (543b), and is electrically connected to a communication circuit (e.g., an integrated circuit chip (349a)) via a second switching element (349c). Therefore, the omitted components in the description of the antenna structure (597c) of FIG. 13 can be easily understood by referring to the embodiment of FIG. 12.

[0145] Referring to FIG. 13, the third power supply pad (543a) and the fourth power supply pad (543b) provided as additional pads (543) may have a generally circular arc shape and may be arranged along the circumferential direction. In one embodiment, the second switching element (349c) may electrically connect the second fastening boss (e.g., the second fastening boss (411c) of FIG. 10) corresponding to the third power supply pad (543a) and the fourth power supply pad (543b) and / or the additional pad (543) to the communication circuit or the processor. In one embodiment, the second switching element (349c) may include a DPX, an MPX, an SPDT switch, or a DPDT switch, but is not limited to the types of switches mentioned. In one embodiment, the electronic device (300) may include a second switching element (349c) to select which of the third power supply pad (543a) and the fourth power supply pad (543b) is to be connected to the communication circuit (or at least one processor), or to adjust the characteristics (or matching characteristics) of a transmission line from the communication circuit to the additional pad (543).

[0146] According to one embodiment, resonant frequencies may be implemented in different frequency bands depending on the combination of the transmission line implemented by the first switching element (349b) and the transmission line implemented by the second switching element (349c). For example, when the antenna structure (597a) of FIG. 11 forms resonant frequencies in two bands, the antenna structure (597c) of FIG. 13 may form resonant frequencies in three or more bands. However, in a state where the manufacturing specifications (e.g., the positions and sizes of the openings (311a, 311b), the positions of the fastening bosses (311c) (or the second fastening bosses (411c)) for the openings (311a, 311b)) have already been determined, the number of additionally secured resonant frequencies may not be proportional to the number of added switching elements.

[0147] FIG. 14 is a drawing showing an antenna structure (597d) implemented inside an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) according to one embodiment of the present disclosure.

[0148] Compared to the embodiment of FIG. 13, the antenna structure (597d) of FIG. 14 may differ in that the separation bar (513) does not include an insulating structure and is implemented by an electrically conductive material between the fastening boss (311c) and the second fastening boss (411c), or between the feeding pad (541)(s) and the additional pad (543). Therefore, the omitted components in the description of the antenna structure (597d) of FIG. 14 can be easily understood by referring to the embodiment of FIG. 13.

[0149] Referring to FIG. 14, when the separating bar (513) does not include an insulating structure, the first support member (411) can form a current flow path (C1, C2) of a closed-loop structure around the first opening (311a) or around the second opening (311b). For example, the first support member (411) can implement two loop antenna structures. In one embodiment, even if the first support member (411) provides a current flow path (C1, C2) of a closed-loop structure, the current flow path (C1, C2) can be modified depending on the structure of the feeding pad (541), the structure of the additional pad (543), and / or the operating states of the switching elements (349b, 349c), and by combining the operations of the switching elements (349b, 349c), resonant frequencies can be secured in different bands.

[0150] In one embodiment, the antenna structure implemented around the openings (311a, 311b) on the first support member (411) may have directivity. For example, the antenna structure may provide good wireless communication quality in a specific direction and provide relatively poor quality wireless communication performance in other directions. In one embodiment, even if the antenna structure provides good wireless communication quality in all directions, the wireless communication quality in some directional directions may be degraded depending on the actual deployment environment (e.g., due to interference with other components deployed in the vicinity). For example, even if the antenna structure is the same, the communication quality may vary depending on the characteristics (e.g., directivity) of the antenna structure itself or the deployment environment. In one embodiment, by varying the shape and arrangement of the feed pad (e.g., the feed pad (341a, 341b) of FIG. 7) in consideration of the communication characteristics or deployment environment of the antenna structure, the omnidirectionality of the antenna structure can be improved while providing good wireless communication performance. The shape and arrangement of the power supply pads (341a, 341b) will be examined with reference to FIGS. 15 to 19.

[0151] FIG. 15 is a drawing showing the shape or arrangement of a power supply pad (641; 641a, 641b) of an electronic device (e.g., electronic devices 1001, 1002, 1004, 100, 200, 300 of FIGS. 1 to 6) according to one embodiment of the present disclosure. FIG. 16 is a drawing showing the shape or arrangement of a power supply pad (641; 641a, 641b) of an electronic device (e.g., electronic devices 1001, 1002, 1004, 100, 200, 300 of FIGS. 1 to 6) according to one embodiment of the present disclosure. FIG. 17 is a diagram showing the shape or arrangement of a power supply pad (641) of an electronic device (e.g., electronic devices 1001, 1002, 1004, 100, 200, 300 of FIGS. 1 to 6 ) according to one embodiment of the present disclosure. FIG. 18 is a diagram showing the shape or arrangement of a power supply pad (641; 641a, 641b) of an electronic device (e.g., electronic devices 1001, 1002, 1004, 100, 200, 300 of FIGS. 1 to 6 ) according to one embodiment of the present disclosure. FIG. 19 is a diagram showing the shape or arrangement of a power supply pad (641) of an electronic device (e.g., electronic devices 1001, 1002, 1004, 100, 200, 300 of FIGS. 1 to 6 ) according to one embodiment of the present disclosure.

[0152] Referring to FIGS. 15 to 19, the power supply pads (641; 641a, 641b)(s) are generally circular or polygonal in shape and can be positioned at a specified distance from the fastening hole (643) (e.g., the fastening hole (343b) of FIG. 7). For example, although not given a reference number, the power supply pads (641; 641a, 641b)(s) can be circular or polygonal plates that provide an opening area large enough to sufficiently accommodate the fastening hole (643). In one embodiment, the power supply pad (641; 641a, 641b)(s) may be implemented by arranging a plurality of pads (641a, 641b) around the fastening hole (643) as illustrated in FIGS. 15, 16 and / or 18, or may be arranged as a single pad substantially surrounding the fastening hole (643) as illustrated in FIGS. 17 and / or 19. For example, the number and shape of the power supply pad (641; 641a, 641b)(s) arranged around one fastening hole (643) are not limited to the illustrated embodiment, and may be appropriately selected in consideration of the specifications and internal structure of a device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) in which the antenna structure is actually to be deployed.

[0153] FIG. 20 is an enlarged view of a portion 'E2' of FIG. 9 among the first support members of an electronic device according to an embodiment of the present disclosure. FIG. 21 is a view for explaining a connection state of a connecting member(s) of an electronic device according to an embodiment of the present disclosure. FIG. 22 is a view for explaining a connection state of a connecting member(s) in an electronic device according to an embodiment of the present disclosure, and is a view taken along line B-B' of FIG. 20.

[0154] In examining an embodiment with reference to FIGS. 20 to 22, the same reference numerals may be assigned to or omitted for components similar to those of the preceding embodiment, and detailed descriptions thereof may also be omitted. At least some of the components of the embodiment described below may be selectively combined with or replaced with those of the preceding embodiment to implement additional embodiments. For example, in the embodiment described below, one of the first contact member or the second contact member provided as a connecting member may be selectively combined with or replaced with a pad of the preceding embodiment (e.g., the power supply pad (541) or the additional pad (543) of FIG. 11) to implement additional embodiments.

[0155] Referring to FIGS. 20 to 22, an electronic device (e.g., the electronic device (200, 300) of FIGS. 4 to 7) may include a side structure (e.g., the side structure (410) of FIG. 9 or the second frame (410b)) and a first support member (411) (e.g., the first support member (311) of FIG. 6). In one embodiment, the side structure (410) and the first support member (411) of FIG. 20 may be substantially identical to the side structure (410) and / or the first support member (411) of FIG. 9. The first support member (411) may include, for example, openings (311a, 311b) provided to penetrate both surfaces (e.g., the first opening (311a) and the second opening (311b) of FIG. 6).

[0156] According to one embodiment, the printed circuit board (340) may be placed on the first support member (411) within a space surrounded by the side structure (410). For example, a portion of the side structure (410) (e.g., the flange (F) and / or a portion of the first support member (411) (e.g., the separation bar (413)) may be arranged to at least partially overlap the printed circuit board (340). For example, the printed circuit board (340) may be understood to be arranged substantially within the space provided by the first support member (411) and / or the side structure (410). In one embodiment, when the first support member (411) and / or the side structure (410) at least partially comprise an electrically conductive material, the printed circuit board (340) may be electrically connected to the first support member (411) and / or the side structure (410), such that a portion of the first support member (411) and / or a portion of the side structure (410) (e.g., the second frame (410b)) may function as an antenna. In one embodiment, a portion of the first support member (411) may be electrically connected to the first frequency band. When configured to perform wireless communication, a portion of the side structure (410) may be configured to perform wireless communication in a second frequency band different from the first frequency band.

[0157] According to one embodiment, when a portion of the side structure (410) functions as an antenna for performing wireless communication, the communication circuit may be electrically connected to the side structure (410) via the flange (F). For example, the communication circuit may be disposed on or electrically connected to the printed circuit board (340). FIG. 20 illustrates, in one embodiment, a flange (F) extending from the second frame (410b) is disposed to partially overlap the printed circuit board (340), and the printed circuit board (340) and the second frame (410b) may be electrically connected at this overlapping portion. Although not illustrated, the electronic device (300) may include at least one connecting member disposed on the printed circuit board (340) to electrically connect the printed circuit board (340) and the second frame (410b). The connecting member(s) may include, for example, a contact member (e.g., an elastic member such as a C-clip) or an electrically conductive pad as described above (e.g., the power supply pad (541) of FIG. 11).

[0158] In one embodiment, when a portion of the first support member (411) functions as an antenna for performing wireless communication, the printed circuit board (340) and / or the communication circuit may be electrically connected to the first support member (411) in a region between the first opening (311a) and the second opening (311b). For example, when the communication circuit is electrically connected to the first support member (411) in a region between the first opening (311a) and the second opening (311b), at least a portion of the peripheral region of the first opening (311a) and / or the second opening (311b) of the first support member (411) may function as an antenna for performing wireless communication. In the embodiments of FIGS. 20 to 22, the communication circuit may be electrically connected to the first support member (411) via a separation bar (413) (e.g., the separation bar (413) of FIG. 10). The separating bar (e.g., the first separating portion (413a) and the second separating portion (413b)) may be understood as a structure that is, for example, a part of the first support member (411) and is positioned between the first opening (311a) and the second opening (311b), and that defines a portion of an edge of the first opening (311a) or the second opening (311b). In one embodiment, when the separating bar (413) includes the first separating portion (413a) and the second separating portion (413b) that are mechanically connected by an insulating portion (e.g., a connecting portion (413c)) but are electrically insulated, the printed circuit board (340) may be electrically connected to the first support member (411) through at least one of the first separating portion (413a) and the second separating portion (413b).

[0159] According to one embodiment, when at least a portion of the peripheral area of ​​the first opening (311a) and / or the second opening (311b) functions as an antenna for performing wireless communication, the first separator (413a) may be electrically connected to a communication circuit, and the second separator (413b) may be electrically connected to a ground. In one embodiment, in a structure in which the first separator (413a) is electrically connected to the communication circuit, and the second separator (413b) is electrically connected to a ground, a flange (F) adjacent to the first opening may be electrically connected to a common ground with the second separator (413b). For example, a loop antenna may be implemented in the peripheral area of ​​the first opening (311a) and / or the second opening (311b). In one embodiment, when electrically connecting the flange (F) to the ground, a matching circuit (MC) and / or a switching circuit may be arranged on the connection path. In one embodiment, a matching circuit (MC) and / or a switching circuit may be used to adjust or set the resonant frequency of the antenna secured in the periphery area of ​​the first opening (311a) and / or the second opening (311b).

[0160] According to one embodiment, by using the shape or size of the first opening (311a) and / or the second opening (311b), or by arranging an additional slit (or an additional segmented structure similar to the separator bar (413)) at the edge of the first opening (311a) and / or the second opening (311b), the current distribution around the first opening (311a) and / or the second opening (311b) can be changed, and a frequency for wireless communication or an additional resonant frequency required in the design specifications can be secured. In one embodiment, in a miniaturized electronic device, when the peripheral area of ​​the first opening (311a) and / or the second opening (311b) is implemented as an antenna, a resonant frequency of approximately 2 GHz or more can be secured. In one embodiment, when utilizing the shape or size of the first opening (311a) and / or the second opening (311b), when additional slits are placed at the edges of the first opening (311a) and / or the second opening (311b), additional resonant frequencies can be secured in a low frequency band ranging from about 600 MHz to about 1.5 GHz.

[0161] In one embodiment, the first opening (311a) and / or the second opening (311b) may be positioned to substantially overlap a display (e.g., the display (230) of FIG. 5). In one embodiment, a portion of the first opening (311a) may not overlap the display (230) at a location adjacent to an edge of the display (230) or the second frame (410b). For example, a gap may be formed between the display (230) and the second frame (410b) on the first opening (311a). When a portion of the first support member (411) functions as an antenna around the first opening (311a) and / or the second opening (311b), a wireless signal may be radiated into the external space through the gap between the display (230) and the second frame (410b).

[0162] In the embodiments of FIGS. 20 to 22, the separation bar (413) includes a first separation portion (413a) and a second separation portion (413b), and a configuration in which a plurality of connecting members (e.g., contact members (741; 741a, 741b)) are provided on the printed circuit board (340) and electrically connected to the first support member (411) may be exemplified. However, the embodiment(s) of the present disclosure are not limited thereto, and one connecting member may be provided on the printed circuit board (340) and electrically connected to one of the first separation portion (413a) and the second division portion (413b), so that a portion of the first support member (411) (e.g., at least a portion of a peripheral area of ​​the first opening (311a) and the second opening (311b)) may function as an antenna. In Fig. 20, the points indicated as 'CP1' and 'CP2' can be understood as points where the connecting member is placed or points that come into contact with the connecting member. In one embodiment, the resonant frequency secured in the peripheral area of ​​the first opening (311a) and the second opening (311b) can be set according to the position of the connecting member(s), the length of the first separating portion (413a) and / or the second separating portion (413b), and the size or relative position of the first opening (311a) and / or the second opening (311b). For example, the connecting member(s) can function as a feeding terminal that applies an electric signal (e.g., a wireless communication signal) to the first support member (411), and at least a part of the peripheral area of ​​the first opening (311a) and the second opening (311b) can function as a radiation conductor. The 'peripheral area of ​​the first opening (311a) and the second opening (311b)' mentioned in the embodiment(s) of the present disclosure may be understood to include the first separating portion (413a) and / or the second separating portion (413b).

[0163] Referring to FIG. 21, it can be understood that the connecting member(s) (e.g., contact members (741)) are arranged on the first support member (411) (e.g., the first separating portion (413a) and / or the second separating portion (413b)). However, the embodiment of the present disclosure is not limited thereto, and the connecting member(s) may be one of the electrical components arranged substantially on the printed circuit board (340). For example, FIG. 21 may be illustrated by omitting the printed circuit board (340) in order to illustrate the arrangement structure of the connecting member(s). In one embodiment, the connecting member(s) may be an elastic member made of an electrically conductive material. For example, the connecting member(s) may be implemented as a plate spring structure by bending a flat plate made of a metal material. When the printed circuit board (340) is placed on the first support member (411) and / or the separation bar (413), the gap between the printed circuit board (340) and the first separation member (413a) (or the second separation member (413b)) may be smaller than the height of the connecting member(s) (e.g., the contact members (741)).

[0164] According to one embodiment, when the printed circuit board (340) is assembled on the first support member (411) with the contact members (741)(s) disposed, the contact members (741)(s) may accumulate elastic force while being lowered to a height corresponding to the gap between the printed circuit board (340) and the first separating portion (413a) (or the second separating portion (413b)). In one embodiment, the elastic force accumulated in the contact members (741)(s) may stably maintain a state in which a part of the contact members (741)(s) is supported by the printed circuit board (340) while the other part is in contact with the first separating portion (413a) (or the second separating portion (413b)). For example, the contact members (741)(s) may be electrically connected to the first separating portion (413a) or the second separating portion (413b) while being disposed on the printed circuit board (340). As will be described with reference to FIGS. 24 to 26, the connecting member(s) may be implemented by electrically conductive pads (e.g., electrically conductive pads (841; 841a, 841b)(s) of FIGS. 24 to 26) configured to form an electromagnetic coupling without directly contacting the separating bar (413). For example, it should be noted that the structure in which the connecting member(s) directly contacts the separating bar (413) does not limit the embodiment(s) of the present disclosure. In describing the embodiment(s) of the present disclosure, among the implementation examples of the connecting member(s), a configuration in which the connecting member(s) directly contacts the separating bar (413) may be referred to as a 'contact member'.

[0165] According to one embodiment, when a plurality of connecting members are provided, a first contact member (741a) among the connecting members may be arranged corresponding to the first separating portion (413a), and a second contact member (741b) may be arranged corresponding to the second separating portion (413b). In one embodiment, the first contact member (741a) may function as a power supply terminal for providing a power supply or a wireless communication signal. In one embodiment, when the first contact member (741a) functions as a power supply terminal, the second contact member (741b) may be understood to be provided for grounding. For example, the second contact member (741b) may be electrically connected to a ground conductor (e.g., the ground conductor (GC) of FIG. 24) provided within the printed circuit board (340). In one embodiment, the second contact member (741b) may be provided as a power supply terminal, and the first contact member (741a) may be provided as a ground terminal. As mentioned above, the printed circuit board (340) may be provided with one connecting member (e.g., one of the first contact member (741a) and the second contact member (741b)) that may be electrically connected to a corresponding one of the first separating portion (413a) and the second separating portion (413b). The number and position of the connecting members may be appropriately selected in consideration of the structure or resonant frequency of the antenna to be implemented in the peripheral area of ​​the first opening (311a) and / or the second opening (311b).

[0166] According to one embodiment, in a structure in which at least a portion of the peripheral area of ​​the first opening (311a) and / or the second opening (311b) is implemented as an antenna, when an insulating structure is added to the first support member (411) and / or the side structure (410), a resonant frequency can be additionally secured or the implemented resonant frequency can be adjusted. In one embodiment, the side structure (410) (e.g., the second frame (410b)) can be understood as a structure that surrounds a portion of the first opening (311a). In FIG. 20, a point indicated as 'P1' or 'P2' can be implemented as an insulating portion (e.g., the connecting portion (413c) of FIG. 11). In one embodiment, a path sequentially passing through points P2 and P1, bypassing the first opening (311a) from the first separator (413a), may function as a structure that determines the electrical length of a radiating conductor (e.g., a portion of the first support member (411)). For example, when an insulating structure similar to a connecting portion (413c) is provided at either point P2 or point P1, the electronic device (300) may adjust the resonant frequency of an antenna implemented in the peripheral area of ​​the first opening (311a) or secure an additional resonant frequency. A configuration in which an additional resonant frequency is secured will be discussed again with reference to FIG. 28.

[0167] FIG. 23 is a graph illustrating the performance of an antenna implemented inside an electronic device according to one embodiment of the present disclosure.

[0168] Referring to FIG. 23, the graph indicated as 'RS1' may illustrate the results of measuring radiation efficiency in a range of approximately 4.5 to 8.0 GHz when any one of the first frame (410a), the second frame (410b), and / or the third frame (410c) is implemented as an antenna. In FIG. 23, the graph indicated as 'RS2' may illustrate the results of measuring radiation efficiency in a range of approximately 4.5 to 8.0 GHz when an antenna for wireless communication is implemented using a portion of the first support member (411) (e.g., at least a portion of the area surrounding the first opening (311a) and / or the second opening (311b)). In general, it can be expected that the wireless communication performance will be better when the antenna (e.g., the radiation conductor) is arranged at the edge of the electronic device (300) or substantially exposed to the external space. As illustrated in FIG. 23, although there may be some deviation depending on the frequency band, the antenna of the embodiment(s) of the present disclosure (e.g., the antenna implemented in the periphery area of ​​the openings (311a, 311b) provided in the first support member (411)) can provide wireless communication performance similar to that of an antenna implemented by a portion of the side structure (410). For example, the embodiment(s) of the present disclosure can provide improved design freedom in implementing wireless communication functions of miniaturized electronic devices.

[0169] According to one embodiment, when the printed circuit board (340) and the support member (e.g., the first support member (411) of FIG. 21) are electrically connected, unlike the contact member (741)(s) of FIG. 21, electrically conductive pads (841; 841a, 841b) may be provided as the connection member(s). For example, by forming electromagnetic coupling between the printed circuit board (340) and the first support member (411), at least a portion of the area surrounding the first opening (311a) and / or the second opening (311b) may function as a radiation conductor. In one embodiment, the portion of the first support member (411) that forms the electromagnetic coupling may be the area between the first opening (311a) and the second opening (311b). In one embodiment, electromagnetic coupling may be formed between the first separator (413a) and the printed circuit board (340), and / or between the second separator (413b) and the printed circuit board (340). In one embodiment, the printed circuit board (340) may form electromagnetic coupling with the first support member (411) by including at least one electrically conductive pad (841). A configuration in which at least a portion of the first support member (411) is implemented as an antenna by utilizing electromagnetic coupling will be described with reference to FIGS. 24 to 26.

[0170] FIG. 24 is a drawing for explaining an implementation example of a connecting member(s) of an electronic device according to an embodiment of the present disclosure. FIG. 25 is a drawing for explaining a connection state of a connecting member(s) of an electronic device according to an embodiment of the present disclosure. FIG. 26 is a drawing for explaining a connection state of a connecting member(s) in an electronic device according to an embodiment of the present disclosure, and is a drawing shown by cutting along line C-C' of FIG. 24.

[0171] Referring to FIGS. 24 to 26, the printed circuit board (340) may include at least one electrically conductive pad (841; 841a, 841b). The electrically conductive pad (841)(s) may be disposed on the printed circuit board (340) similarly to the power supply pads (341a, 341b) of FIG. 7, for example. In one embodiment, the electrically conductive pad (841)(s) may be disposed to face a corresponding one of the first separator (413a) and the second separator (413b). For example, the electrically conductive pad (841)(s) may form an electromagnetic coupling with a corresponding one of the first separator (413a) and the second separator (413b). As a result, the printed circuit board (340) and the first support member (411) may be electrically connected by the electromagnetic coupling.

[0172] According to one embodiment, when a plurality of electrically conductive pads (841) are provided, the first electrically conductive pad (841a) may be disposed to face one of the first separating portion (413a) and the second separating portion (413b), and the second electrically conductive pad (841b) may be disposed to face the other of the first separating portion (413a) and the second separating portion (413b). However, the embodiment(s) of the present disclosure are not limited thereto, and either the first electrically conductive pad (841a) or the second electrically conductive pad (841b) may be omitted in consideration of the manufacturing specifications of the electronic device (300) or the specifications of the antenna to be implemented. In one embodiment, the first electrically conductive pad (841a) may form an electromagnetic coupling with the first separator (413a) for supplying power (or a power supply signal), and the second electrically conductive pad (841b) may form an electromagnetic coupling with the second separator (413b) for grounding. In one embodiment, when used to supply power (or a power supply signal), the first electrically conductive pad (841a) may be electrically connected to a wireless communication circuit (WCC). In one embodiment, the second electrically conductive pad (841b) may be understood as being electrically connected to a ground conductor (GC) (or ground plane) provided on the printed circuit board (340).

[0173] In one embodiment, the electrically conductive pads (841; 841a, 841b)(s) may be arranged to substantially face a corresponding one of the first separator (413a) and / or the second separator (413b). In one embodiment, in the printed circuit board (340), the area between the electrically conductive pads (841)(s) and the first separator (413a) (and / or the second separator (413b)) may be provided as a fill-cut area (e.g., the fill-cut area (343a) of FIG. 7). For example, when the printed circuit board (340) is arranged on the first support member (411), the area between the electrically conductive pads (841)(s) and the first separator (413a) (and / or the second separator (413b)) may be substantially free of electrically conductive material.

[0174] According to one embodiment, in the structure forming the electromagnetic coupling, the first support member (411), the first separating portion (413a) and / or the second separating portion (413b) may further include extending portions (813a, 813b) corresponding to the electrically conductive pads (841). The extending portions (813a, 813b) may be understood as being, for example, a part of the first separating portion (413a) and / or the second separating portion (413b). In one embodiment, the smaller the gap between the two electrically conductive structures and / or the larger the area of ​​the two electrically conductive structures facing each other, the higher the efficiency of the electromagnetic coupling. For example, by providing the extensions (813a, 813b)(s), the electromagnetic coupling efficiency between the electrically conductive pads (841; 841a, 841b)(s) and the first support member (411) can be increased.

[0175] According to one embodiment, the first support member (411) may be provided with a first extension (813a) extending (or extended) from the first separating portion (413a), and / or a second extension (813b) extending (or extended) from the second separating portion (413b). In one embodiment, the first electrically conductive pad (841a) may be disposed substantially facing the first extension (813a), and / or the second electrically conductive pad (841b) may be disposed substantially facing the second extension (813b). For example, by forming an electromagnetic coupling in the region between the first opening (311a) and the second opening (311b), a power supply signal may be provided to one side (e.g., the first separating part (413a)) of an insulating part (e.g., the connecting part (413) of FIG. 25), and / or the other side (e.g., the second separating part (413b)) of the insulating part may be electrically connected to the ground conductor (GC). In the illustrated embodiment, the 'electrical connection' may be implemented by the electromagnetic coupling.

[0176] FIG. 27 is a graph for explaining the performance according to the power supply method of an antenna implemented inside an electronic device according to one embodiment of the present disclosure.

[0177] Referring to FIG. 27, the graph indicated as 'RD' illustrates the overall radiation efficiency when the printed circuit board (340) and the first support member (411) are electrically connected by the contact members (741; 741a, 741b) of FIG. 21 so that a portion of the first support member (411) operates as an antenna, and the graph indicated as 'RC' can illustrate the overall radiation efficiency when the printed circuit board (340) and the first support member (411) are electrically connected by the electrically conductive pads (841; 841a, 841b) of FIG. 25 so that a portion of the first support member (411) operates as an antenna. For example, when a portion of the first support member (411) is implemented as an antenna, it can be understood that the radiation efficiency of the method using the direct feeding structure of FIG. 21 and the radiation efficiency of the method using the indirect feeding structure of FIG. 25 are illustrated in FIG. 27. As illustrated in Fig. 27, when the printed circuit board (340) and the first support member (411) are electrically connected in the area between the first opening (311a) and the second opening (311b) so that a portion of the first support member (411) is implemented as an antenna, it can be seen that the radiation efficiency in the direct feeding structure and the indirect feeding structure are similar.

[0178] According to one embodiment, when implementing an antenna using at least a portion of the area surrounding the first opening (311a) and / or the second opening (311b), it may be easy to adjust the resonant frequency and / or secure an additional resonant frequency. For example, by adjusting the electrical length along which current or wireless signal power can be distributed in the area surrounding the first opening (311a) and / or the second opening (311b), the resonant frequency may be adjusted or an additional resonant frequency may be secured. This will be described with reference to FIG. 28 along with FIG. 20.

[0179] FIG. 28 is a graph for explaining the performance or operating frequency band of an antenna implemented inside an electronic device according to one embodiment of the present disclosure.

[0180] In Fig. 28, the graph indicated as 'RN' may illustrate the overall radiation efficiency when a part of the first support member (411) is implemented as an antenna as in the above-described embodiment, but an insulating structure is not provided at points P1 and P2 of the side structure (410) of Fig. 20 (e.g., the second frame (410b)). In Fig. 28, the graph indicated as 'RP1' and / or 'RP2' may illustrate the overall radiation efficiency when a part of the first support member (411) is implemented as an antenna as in the above-described embodiment, but an insulating structure is provided at either point P1 or P2 of the side structure (410) of Fig. 20 (e.g., the second frame (410b)). 'Providing an insulating structure at either point P1 or point P2' means, for example, that when implementing the separator (413) of FIG. 11, a connection portion (413c) is provided to mechanically connect the first separator (413a) and the second separator (413b) but electrically insulate them, which may be similar to or substantially the same as the structure.

[0181] Referring to FIG. 28, it can be seen that an antenna without an insulating structure provides a radiation efficiency of about -10 dB or more in a frequency band of about 4.5 GHz or more. In one embodiment, when a portion of the first support member (411) is implemented as an antenna, but an insulating structure is disposed at either point P1 or point P2 of the side structure (e.g., the second frame) of FIG. 20, it can be seen that a radiation efficiency of about -10 dB or more is additionally provided in a frequency band of about 2 GHz. For example, by arranging an insulating structure disposed on a portion of a structure defining a perimeter area of ​​the first opening (311a), the resonant frequency of the antenna can be adjusted or an additional resonant frequency can be secured while implementing at least a portion of the perimeter area of ​​the first opening as an antenna. Although not shown, a slit extending inwardly from the edge of the first opening (311a) and / or the edge of the second opening (311b) of FIG. 20 may be added to the first support member (411) to adjust the resonant frequency or secure additional resonant frequencies. In one embodiment, the size or shape of the first opening (311a) and / or the second opening (311b) of FIG. 20 may be changed to adjust the resonant frequency or secure additional resonant frequencies.

[0182] According to one embodiment, when the flat structure is disposed within the electronic device (300), and / or when the flat structure includes opening(s), at least a portion of the flat structure may be implemented as an antenna. A structure in which the flat structure within the electronic device (300) is implemented as an antenna will be described with reference to FIG. 29.

[0183] FIG. 29 is a drawing for explaining an example of implementing an antenna using a second support member inside an electronic device according to one embodiment of the present disclosure.

[0184] Referring to FIG. 29, a second support member (960) (e.g., the second support member (260) of FIG. 4 or 6) may be disposed inside the electronic device (300) to face a first support member (e.g., the first support member (411) of FIG. 20) with a printed circuit board (340) therebetween. The second support member (960) may function, for example, as one of the support plates inside the electronic device (300). In one embodiment, the second support member (690) may include a third opening (911a) and / or a fourth opening (911b). For example, the second support member (960) may include a third opening (911a) and a fourth opening (911b), similar to the first opening (311a) and / or the second opening (311b) of FIG. 20, and a third separator (913a) and a fourth separator (914b) may be provided in the area between the third opening (911a) and the fourth opening (911b).

[0185] According to one embodiment, when implementing a portion of the second support member (960) as an antenna, the electronic device (300) and / or the printed circuit board (340) may include a third contact member (941a) and a fourth contact member (941b). For example, the third contact member (941a) may be configured to contact (or be electrically connected to) the third separator (913a), and the fourth contact member (941b) may be configured to contact (or be electrically connected to) the fourth separator (913b). In one embodiment, when implementing a portion of the second support member (960) as an antenna, the resonant frequency may be adjusted or an additional resonant frequency may be secured depending on the shape or size of the third opening (911a) and / or the fourth opening (911b).

[0186] FIG. 30 is an enlarged view of a portion 'E2' of FIG. 9 among the first support members of an electronic device according to one embodiment of the present disclosure. FIG. 31 is a view showing a printed circuit board and / or electronic components arranged on the first support member of an electronic device according to one embodiment of the present disclosure.

[0187] Referring to FIGS. 30 and 31, an electronic device (e.g., electronic device (300) of FIG. 6) may include an electronic component, for example, a camera module (499), disposed in a first opening (311a). In one embodiment, the camera module (499) may be electrically connected to the printed circuit board (340) by including a flexible printed circuit board (499a) disposed across a separator bar, for example, a first separator (413a) and / or a second separator (413b). In one embodiment, when the flexible printed circuit board (499a) is arranged across the first separator (413a) and / or the second separator (413b), a contact member (e.g., a contact member (741; 741a, 741b) of FIG. 12) or a pad (e.g., an electrically conductive pad (841; 841a, 841b) of FIG. 26) may be provided. For example, the flexible printed circuit board (499a) may be electrically connected to the first separator (413a) and / or the second separator (413b), or may form an electromagnetic coupling with the first separator (413a) and / or the second separator (413b). In one embodiment, the printed circuit board (340) and / or the communication circuitry is electrically connected to the first separator (413a) and / or the second separator (413b) via the flexible printed circuit board (499a), thereby enabling wireless communication to be performed using at least a portion of the first support member (411) around the first opening (311a) and / or the second opening (311b).

[0188] FIG. 32 is an enlarged view of a portion 'E3' of FIG. 9 among the first support members of an electronic device according to one embodiment of the present disclosure.

[0189] Referring to FIG. 32, the electronic device (300) and / or the first support member (411) may include a third opening (311c) and a fourth opening (311d) positioned at different locations than the first opening (311a) or the second opening (311b) of the above-described embodiment. In one embodiment, regardless of whether the antenna is implemented around the first opening (311a) or the second opening (311b), the electronic device (300) may include an antenna implemented by another portion of the first support member (411) around the third opening (311c) and / or the fourth opening (311d). For example, a third separating bar (413e) and / or a fourth separating bar (413d) may be provided between the third opening (311c) and the fourth opening (311d), and the third separating bar (413e) and / or the fourth separating bar (413d) may be electrically connected to a printed circuit board (e.g., a printed circuit board (340) of FIG. 22) or a communication circuit at at least one of the contact points (CP3, CP4). For example, any one of the contact points (CP3, CP4) may be understood as a power supply point. In one embodiment, when any one of the contact points (CP3, CP4) is used as a power supply point, the other one of the contact points (CP3, CP4) may be used as a ground point. For example, any one of the contact points (CP3, CP4) may be electrically connected to the communication circuit, and the other one of the contact points (CP3, CP4) may be electrically connected to the ground.

[0190] As described above, the electronic device according to the embodiment(s) of the present disclosure can implement an antenna structure using internal structures such as support members. For example, by utilizing structures for arranging various components, such as printed circuit boards, as radiation conductors, additional resonant frequencies can be easily secured while suppressing design changes to the internal structure. The effects obtainable from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description of the embodiment(s) described above.

[0191] According to one embodiment of the present disclosure, an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) comprises a housing (e.g., housing (201) of FIGS. 4 to 6) including a front plate (e.g., front plate (220) of FIGS. 4 to 6) and a rear plate (e.g., rear plate (280) of FIGS. 4 to 6) arranged opposite to the front plate, a support plate (e.g., first support member (211, 311, 411) of FIGS. 4, 5, 6, 7, 9, 10 and / or 20) arranged in a space between the front plate and the rear plate, and a first opening (first opening) provided to penetrate the support plate (e.g., first opening of FIGS. 6, 7, 9, 10 and / or 20) The support plate including a first opening (311a) of 20), a second opening (e.g., a second opening (311b) of FIGS. 6, 7, 9, 10 and / or 20) provided to penetrate the support plate at a position adjacent to the first opening and aligned along a first direction (e.g., a first direction (D1) of FIG. 9 or 10) together with the first opening, a first separating portion (e.g., a first separating portion (413a) of FIG. 20) and a second separating portion (e.g., a second separating portion (413b) of FIG. 20) extending in an area between the first opening and the second opening, and an insulating portion (e.g., a connecting portion (413c) of FIG. 20) that mechanically connects the first separating portion and the second separating portion but electrically insulates them, the support plate being disposed on the support plate and electrically connecting the first opening and the second opening with the support plate. A connected printed circuit board (e.g., printed circuit board (240, 340) of FIGS. 4 to 7 and / or FIG. 20) may be included. In one embodiment, at least a portion of the support plate around the first opening or the second opening may be configured to function as an antenna to perform wireless communication in a first frequency band.

[0192] According to one embodiment, the printed circuit board may be electrically connected to the support plate through at least one of the first separator or the second separator.

[0193] In one embodiment, the printed circuit board may include at least one connecting member disposed on one surface thereof. In one embodiment, the at least one connecting member may be electrically connected to at least one of the first separating portion or the second separating portion.

[0194] According to one embodiment, the printed circuit board may further include a first contact member (e.g., a first contact member (741a) of FIG. 21) disposed on one surface and electrically connected to one of the first separator and the second separator for power supply, and a second contact member (e.g., a second contact member (741b) of FIG. 21) disposed on one surface and electrically connected to the other of the first separator and the second separator for grounding.

[0195] In one embodiment, the printed circuit board may further include at least one electrically conductive pad (e.g., the electrically conductive pad (841) of FIG. 25) disposed to face a corresponding one of the first separator and the second separator. In one embodiment, the at least one electrically conductive pad may be configured to form an electromagnetic coupling with a corresponding one of the first separator and the second separator.

[0196] According to one embodiment, the printed circuit board may further include a first electrically conductive pad (e.g., the first electrically conductive pad (841a) of FIG. 25) configured to form an electromagnetic coupling with one of the first separator and the second separator for power supply, and a second electrically conductive pad (e.g., the second electrically conductive pad (841b) of FIG. 25) configured to form an electromagnetic coupling with the other of the first separator and the second separator for grounding.

[0197] According to one embodiment, the electronic device as described above may further include a side structure configured to at least partially surround a space between the front plate and the rear plate (e.g., the side structure (210, 410) of FIGS. 4 to 6, 9 and / or 10), a radiation conductor that is part of the side structure and electrically insulated from other parts of the side structure (e.g., the second frame (410b) of FIG. 20), and a flange that protrudes from an inner surface of the radiation conductor and is electrically connected to the printed circuit board (e.g., the flange (F) of FIG. 20). In one embodiment, the radiation conductor may be configured to function as an additional antenna and configured to perform wireless communication in a second frequency band different from the first frequency band.

[0198] In one embodiment, the radiating conductor may be configured to define or surround a portion of the first opening.

[0199] In one embodiment, the first opening may be positioned at a first distance (e.g., the first distance L1 in FIG. 10) from the radiating conductor along the first direction, and the second opening may be positioned at a second distance (e.g., the second distance L2 in FIG. 10) from the radiating conductor along the first direction. In one embodiment, the second distance may be greater than the first distance.

[0200] According to one embodiment, the electronic device as described above may further include a camera module (e.g., camera module (371) of FIG. 6) disposed in the first opening, and a sensor module (e.g., sensor module (373) of FIG. 6) disposed in the second opening.

[0201] According to one embodiment of the present disclosure, an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) comprises a housing (e.g., housing (201) of FIGS. 4 to 6) including a front plate (e.g., front plate (220) of FIGS. 4 to 6) and a rear plate (e.g., rear plate (280) of FIGS. 4 to 6) arranged opposite to the front plate, a support plate (e.g., first support member (211, 311, 411) of FIGS. 4, 5, 6, 7, 9, 10 and / or 20) arranged in a space between the front plate and the rear plate, and a first opening (first opening) provided to penetrate the support plate (e.g., first opening of FIGS. 6, 7, 9, 10 and / or 20) 20), a second opening (e.g., the second opening (311b) of FIGS. 6, 7, 9, 10 and / or 20) provided to penetrate the support plate at a position adjacent to the first opening and aligned along a first direction (D1) with the first opening, a printed circuit board disposed on the support plate and electrically connected to the support plate in an area between the first opening and the second opening, at least one processor (e.g., the processor 1020 of FIG. 1), and a memory (e.g., the memory 1030 of FIG. 1) for storing instructions. In one embodiment, the instructions, when individually or collectively executed by the at least one processor, may be configured to cause the electronic device to perform wireless communication in a first frequency band using at least a portion of the support plate around the first opening or the second opening.

[0202] In one embodiment, the support plate may further include a dividing bar (e.g., dividing bar (413) of FIG. 10) extending in a direction intersecting the first direction and positioned between the first opening and the second opening. In one embodiment, the printed circuit board may be electrically connected to the support plate through the dividing bar.

[0203] In one embodiment, the printed circuit board may include at least one connecting member disposed on one surface thereof. In one embodiment, the at least one connecting member may be electrically connected to the separating bar.

[0204] According to one embodiment, the separating bar may include a first separating portion (e.g., the first separating portion (413a) of FIG. 20) extending in an area between the first opening and the second opening, a second separating portion (e.g., the second separating portion (413b) of FIG. 20), and an insulating portion (e.g., the connecting portion (413c) of FIG. 20) that mechanically connects the first separating portion and the second separating portion while electrically insulating them.

[0205] According to one embodiment, the printed circuit board may further include a power supply contact member (e.g., a first contact member (741a) of FIG. 21) disposed on one surface and electrically connected to one of the first separator and the second separator, and a ground contact member (e.g., a second contact member (741b) of FIG. 21) disposed on one surface and electrically connected to the other of the first separator and the second separator.

[0206] In one embodiment, the printed circuit board may further include at least one electrically conductive pad (e.g., the electrically conductive pad (841) of FIG. 25) disposed to face a corresponding one of the first separator and the second separator. In one embodiment, the at least one electrically conductive pad may be configured to form an electromagnetic coupling with a corresponding one of the first separator and the second separator.

[0207] According to one embodiment, the electronic device as described above may further include a side structure configured to at least partially surround a space between the front plate and the rear plate (e.g., the side structure (210, 410) of FIGS. 4 to 6, 9 and / or 10), a radiation conductor that is part of the side structure and electrically insulated from other parts of the side structure (e.g., the second frame (410b) of FIG. 20), and a flange that protrudes from an inner surface of the radiation conductor and is electrically connected to the printed circuit board (e.g., the flange (F) of FIG. 20). In one embodiment, the instructions, when individually or collectively executed by the at least one processor, may be configured to cause the electronic device to perform wireless communication in a second frequency band using the radiation conductor.

[0208] In one embodiment, the radiating conductor may be configured to define or surround a portion of the first opening.

[0209] In one embodiment, the first opening may be positioned at a first distance (e.g., the first distance L1 in FIG. 10) from the radiating conductor along the first direction, and the second opening may be positioned at a second distance (e.g., the second distance L2 in FIG. 10) from the radiating conductor along the first direction. In one embodiment, the second distance may be greater than the first distance.

[0210] According to one embodiment, the electronic device as described above may further include a camera module (e.g., camera module (371) of FIG. 6) disposed in the first opening, and a sensor module (e.g., sensor module (373) of FIG. 6) disposed in the second opening.

[0211] According to one embodiment of the present disclosure, an electronic device (e.g., electronic devices 1001, 1002, 1004, 100, 200, 300 of FIGS. 1 to 6) comprises a first supporting member (e.g., the first supporting member (211, 311, 411) of FIGS. 4, 5, 6, 7, 9 and / or 10) including a coupling boss (e.g., the coupling boss (311c) of FIGS. 6, 7, 9 and / or 10) provided on one surface thereof, a first opening (first opening) provided to penetrate the first supporting member at a position adjacent to the coupling boss (e.g., the first opening (311a) of FIGS. 6, 7, 9 and / or 10), at least one of the coupling boss and the first opening is provided to penetrate the first supporting member at a position adjacent to the first opening, The electronic device may include a second opening (e.g., the second opening (311b) of FIGS. 6, 7, 9 and / or 10) aligned along a first direction (e.g., the first direction (D1) of FIG. 9 or 10) with the first opening, a printed circuit board (e.g., the printed circuit board (240, 340) of FIGS. 4 to 7) disposed on the first support member and supported by the fastening boss and electrically connected to the first support member through the fastening boss, at least one processor (e.g., the processor 1020 of FIG. 1), and a memory (e.g., the memory 1030 of FIG. 1) storing instructions. In one embodiment, the instructions, when individually or collectively executed by the at least one processor, may be configured to cause the electronic device to perform wireless communication in a first frequency band using at least a portion of the first support member around the first opening or the second opening.

[0212] In one embodiment, the printed circuit board can form an electromagnetic coupling with the fastening boss and / or the first support member by including at least one feed pad provided on the inside thereof. For example, when at least a portion of the first support member performs wireless communication around the first opening and / or the second opening, the at least one feed pad and / or the fastening boss can function as a path or structure through which a wireless communication signal is transmitted. In one embodiment, the printed circuit board can be fastened to the fastening boss by a fastening member, such as a screw. The fastening member that penetrates the printed circuit board and is fastened to the fastening boss can be, for example, electrically insulated from the at least one feed pad.

[0213] In one embodiment, when the printed circuit board is a multi-layered circuit board, at least one power supply pad may be provided as an inner layer of the printed circuit board. In one embodiment, when the printed circuit board is placed on the first support member, the at least one power supply pad may be aligned at a position facing the fastening boss. In one embodiment, when the at least one power supply pad is aligned at a position facing the fastening boss, an area between at least one power supply pad of the printed circuit board and the fastening boss may be implemented as a fill-cut area in which a conductive material is substantially removed.

[0214] According to one embodiment of the present disclosure, an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) comprises a housing (e.g., housing (201) of FIGS. 4 to 6) including a front plate (e.g., front plate (220) of FIGS. 4 to 6) and a rear plate (e.g., rear plate (280) of FIGS. 4 to 6) arranged in an opposite direction of the front plate), a first support member (e.g., first support member (211, 311, 411) of FIGS. 4, 5, 6, 7, 9, and / or 10) disposed in a space between the front plate and the rear plate and including a coupling boss (e.g., coupling boss (311c) of FIGS. 6, 7, 9, and / or 10) provided on one surface, A first opening (e.g., the first opening (311a) of FIG. 6, FIG. 7, FIG. 9 and / or FIG. 10) provided to penetrate the first support member at a position adjacent to the fastening boss, a second opening (e.g., the second opening (311b) of FIG. 6, FIG. 7, FIG. 9 and / or FIG. 10) provided to penetrate the first support member at a position adjacent to at least the first opening among the fastening boss and the first opening, and aligned along a first direction (e.g., the first direction (D1) of FIG. 9 or FIG. 10) together with the first opening, a printed circuit board (e.g., the printed circuit board (240, 340) of FIGS. 4 to 7) supported by the fastening boss and disposed on the first support member and electrically connected to the first support member through the fastening boss, at least one processor (e.g., the processor (1020) of FIG. 1), and a memory (e.g., It may include the memory (1030) of FIG. 1.In one embodiment, the instructions, when individually or collectively executed by the at least one processor, may be configured to cause the electronic device to perform wireless communication in a first frequency band using at least a portion of the first support member around the first opening or the second opening.

[0215] According to one embodiment, the electronic device as described above may further include a side structure configured to at least partially surround a space between the front plate and the rear plate (e.g., the side structure (210, 410) of FIGS. 4 to 6, 9 and / or 10), a radiation conductor that is part of the side structure and electrically insulated from another portion of the side structure (e.g., the second frame (410b) of FIGS. 9 and / or 10), and a flange that protrudes from an inner surface of the radiation conductor and is electrically connected to the printed circuit board (e.g., the flange (F) of FIGS. 9 and / or 10). In one embodiment, the instructions, when individually or collectively executed by the at least one processor, may be configured to cause the electronic device to perform wireless communication in a second frequency band using the radiation conductor.

[0216] In one embodiment, the radiating conductor may be configured to define or surround a portion of the first opening.

[0217] In one embodiment, the first opening may be disposed at a first distance (e.g., the first distance L1 in FIG. 10) from the radiating conductor in the first direction, the second opening may be disposed at a second distance (e.g., the second distance L2 in FIG. 10) from the radiating conductor in the first direction, and the fastening boss may be disposed at a third distance (e.g., the third distance L3 in FIG. 10) from the radiating conductor in the first direction. In one embodiment, the third distance may be greater than the first distance and less than the second distance.

[0218] According to one embodiment, the printed circuit board may include a fill-cut area provided corresponding to the fastening boss (e.g., fill-cut area (343a) of FIG. 7), and at least one feeding pad provided within the fill-cut area and positioned facing or in direct contact with the fastening boss (e.g., feeding pads (341a, 341b) of FIG. 7).

[0219] According to one embodiment, the at least one power supply pad may be electrically connected to a communication circuit (e.g., a communication module (1090) of FIG. 1 or an integrated circuit chip (349a) of FIG. 7) or the at least one processor via a first switching element (e.g., a first switching element (349b) of FIG. 7 or FIG. 8).

[0220] According to one embodiment, the at least one power supply pad may include an extending portion (e.g., extending portions 541c, 541d of FIG. 12) arranged parallel to the first opening or the second opening.

[0221] In one embodiment, the printed circuit board may further include a fastening hole (e.g., fastening hole (343b) of FIG. 7) provided to penetrate the fill-cut region. In one embodiment, the at least one power supply pad may be positioned adjacent to the fastening hole.

[0222] According to one embodiment, the electronic device as described above may further include a fastening member (e.g., fastening member (359a) of FIG. 7) configured to penetrate the fastening hole and be fastened to the fastening boss, and an insulating member (e.g., insulating member (359b) of FIG. 7) disposed between the inner wall of the fastening hole and the fastening member.

[0223] In one embodiment, the first support member may further include a dividing bar (e.g., dividing bar (413) of FIG. 10) extending in a direction intersecting the first direction and positioned between the first opening and the second opening. In one embodiment, the fastening boss may be positioned adjacent to one of the two ends of the dividing bar.

[0224] According to one embodiment, the first support member may further include a second fastening boss (e.g., the second fastening boss (411c) of FIG. 10) disposed adjacent to the other end of the separating bar on one side and electrically connected to the printed circuit board.

[0225] According to one embodiment, the separating bar may include a first separating portion (e.g., a first separating portion (413a) of FIG. 11) disposed adjacent to the fastening boss, a second separating portion (e.g., a second separating portion (413b) of FIG. 11) adjacent to the second fastening boss, and an insulating portion (e.g., a connecting portion (413c) of FIG. 11) that mechanically connects the first separating portion and the second separating portion while electrically insulating them.

[0226] According to one embodiment, the second fastening boss may be electrically connected to the communication circuit or the at least one processor via a second switching element (e.g., the second switching element (349c) of FIG. 13).

[0227] According to one embodiment, the electronic device as described above may further include a camera module (e.g., camera module (371) of FIG. 6) disposed in the first opening, and a sensor module (e.g., sensor module (373) of FIG. 6) disposed in the second opening.

[0228] According to one embodiment of the present disclosure, an electronic device (e.g., electronic devices (1001, 1002, 1004, 100, 200, 300) of FIGS. 1 to 6) comprises a housing (e.g., housing (201) of FIGS. 4 to 6) including a front plate (e.g., front plate (220) of FIGS. 4 to 6) and a rear plate (e.g., rear plate (280) of FIGS. 4 to 6) arranged in an opposite direction of the front plate), a first support member (e.g., first support member (211, 311, 411) of FIGS. 4, 5, 6, 7, 9, and / or 10) disposed in a space between the front plate and the rear plate and including a coupling boss (e.g., coupling boss (311c) of FIGS. 6, 7, 9, and / or 10) provided on one surface, A first opening (e.g., the first opening (311a) of FIG. 6, FIG. 7, FIG. 9 and / or FIG. 10) provided to penetrate the first support member at a position adjacent to the fastening boss, a second opening (e.g., the second opening (311b) of FIG. 6, FIG. 7, FIG. 9 and / or FIG. 10) provided to penetrate the first support member at a position adjacent to at least the first opening among the fastening boss and the first opening, and aligned along a first direction (e.g., the first direction (D1) of FIG. 9 or FIG. 10) together with the first opening, a printed circuit board (e.g., the printed circuit board (240, 340) of FIG. 4 to FIG. 7) supported by the fastening boss and disposed on the first support member and electrically connected to the first support member through the fastening boss, a side structure (e.g., the first opening (311a) of FIG. 6, FIG. 7, FIG. 9 and / or FIG. 10) configured to at least partially surround a space between the front plate and the rear plate 6, a side structure (210, 410) of FIG. 9 and / or FIG. 10), a radiation conductor that is part of the side structure and electrically insulated from another part of the side structure (e.g., the second frame (410b) of FIG. 9 and / or FIG. 10),And may include a flange (e.g., flange (F) of FIG. 9 and / or FIG. 10) protruding from the inner surface of the radiation conductor and electrically connected to the printed circuit board. In one embodiment, the first support member may be configured to perform wireless communication in a first frequency band using at least a portion of the first support member around the first opening or the second opening, and may be configured to perform wireless communication in a second frequency band using the radiation conductor.

[0229] In one embodiment, the radiating conductor may be configured to define or surround a portion of the first opening.

[0230] According to one embodiment, the printed circuit board may include a fill-cut area provided corresponding to the fastening boss (e.g., fill-cut area (343a) of FIG. 7), and at least one feeding pad provided within the fill-cut area and positioned facing or in direct contact with the fastening boss (e.g., feeding pads (341a, 341b) of FIG. 7).

[0231] According to one embodiment, the at least one power supply pad may be electrically connected to a communication circuit (e.g., a communication module (1090) of FIG. 1 or an integrated circuit chip (349a) of FIG. 7) or at least one processor (e.g., a processor (1020) of FIG. 1) via a first switching element (e.g., a first switching element (349b) of FIG. 7 or FIG. 8).

[0232] According to one embodiment, the electronic device as described above may further include a fastening hole provided to penetrate the fill-cut area (e.g., fastening hole (343b) of FIG. 7), a fastening member configured to penetrate the fastening hole and be fastened to the fastening boss (e.g., fastening member (359a) of FIG. 7), and an insulating member disposed between an inner wall of the fastening hole and the fastening member (e.g., insulating member (359b) of FIG. 7). In one embodiment, the at least one power supply pad may be disposed adjacent to the fastening hole.

[0233] According to one embodiment, the electronic device as described above may further include a camera module (371) disposed in the first opening, and a sensor module (373) disposed in the second opening.

[0234] In the above-described embodiment, the structure implemented in the first support member (e.g., the first support member (211, 311) of FIG. 5 or FIG. 6) has been described, but when the second support member (260) of FIG. 4 or FIG. 5 (e.g., the upper support member (260a)) includes opening(s), at least a portion of the second support member may be implemented as an antenna or a radiation conductor. In the above-described embodiment, the numerical values ​​mentioned with respect to the frequency band or radiation efficiency are exemplary, and the embodiment(s) of the present disclosure are not limited thereto. The resonant frequency of the antenna implemented through the embodiment(s) of the present disclosure and / or the radiation efficiency at the corresponding resonant frequency may be appropriately selected according to the specifications of the antenna to be actually manufactured and / or the electronic device including the same.

[0235] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In electronic devices (1001; 1002; 1004; 100; 200; 300), A housing (201) including a front plate (220) and a rear plate (280) arranged to face in the opposite direction of the front plate; A support plate placed in the space between the front plate and the rear plate, A first opening (311a) provided to penetrate the above support plate, A second opening (311b) provided to penetrate the support plate at a position adjacent to the first opening and aligned along the first direction (D1) together with the first opening, A first separating portion (413a) and a second separating portion (413b) extending from the area between the first opening and the second opening, The support plate (211, 260a, 260b, 311; 411) including an insulating portion (413c) that mechanically connects the first separating portion and the second separating portion but electrically insulates them; A printed circuit board (340) is disposed on the support plate and is electrically connected to the support plate in an area between the first opening and the second opening, An electronic device configured to perform wireless communication in a first frequency band, wherein at least a portion of the support plate is configured to function as an antenna around the first opening or the second opening.

2. An electronic device according to claim 1, wherein the printed circuit board is electrically connected to the support plate through at least one of the first separator or the second separator.

3. In paragraph 1 or 2, The printed circuit board includes at least one connecting member arranged on one surface thereof, An electronic device wherein at least one connecting member is electrically connected to at least one of the first separating member or the second separating member.

4. In the first or second paragraph, the printed circuit board, A first contact member (741a) arranged on one side and electrically connected to one of the first separator and the second separator for power supply; and An electronic device further comprising a second contact member (741b) disposed on one side and electrically connected to the other of the first separator and the second separator for grounding.

5. In paragraph 1 or 2, The printed circuit board further includes at least one electrically conductive pad (841) arranged to face a corresponding one of the first separator and the second separator, An electronic device wherein said at least one electrically conductive pad is configured to form an electromagnetic coupling with a corresponding one of said first separator and said second separator.

6. In the first or second paragraph, the printed circuit board, A first electrically conductive pad (841a) configured to form an electromagnetic coupling with one of the first separator and the second separator for power supply; and An electronic device further comprising a second electrically conductive pad (841b) configured to form an electromagnetic coupling with the other of the first separator and the second separator for grounding.

7. In any one of paragraphs 1 to 6, A side structure (210; 410) configured to at least partially surround the space between the front plate and the rear plate; A radiation conductor (410b) that is part of the side structure and electrically insulated from other parts of the side structure; and Further comprising a flange (F) protruding from the inner surface of the above-mentioned radiation conductor and electrically connected to the above-mentioned printed circuit board, An electronic device wherein the above-mentioned radiating conductor is configured to function as an additional antenna and is configured to perform wireless communication in a second frequency band different from the first frequency band.

8. An electronic device according to claim 7, wherein the radiating conductor is configured to define or surround a portion of the first opening.

9. In the 7th or 8th paragraph, the first opening is arranged at a first distance (L1) from the radiation conductor along the first direction, The second opening is positioned at a second distance (L2) from the radiating conductor along the first direction, An electronic device wherein the second distance is greater than the first distance.

10. In any one of paragraphs 1 to 9, A camera module (371) arranged in the first opening; and An electronic device further comprising a sensor module (373) disposed in the second opening.

11. In electronic devices (1001; 1002; 1004; 100; 200; 300), A housing (201) including a front plate (220) and a rear plate (280) arranged to face in the opposite direction of the front plate; A support plate (211, 260a, 260b, 311; 411) arranged in the space between the front plate and the rear plate; A first opening (311a) provided to penetrate the above support plate; A second opening (311b) provided to penetrate the support plate at a position adjacent to the first opening and aligned along the first direction (D1) together with the first opening; A printed circuit board disposed on the support plate and electrically connected to the support plate in an area between the first opening and the second opening; At least one processor (1020); and Includes a memory (1030) for storing commands, An electronic device wherein the instructions, when individually or collectively executed by the at least one processor, cause the electronic device to perform wireless communication in a first frequency band using at least a portion of the support plate around the first opening or the second opening.

12. In paragraph 11, The above support plate further includes a dividing bar (413) extending in a direction crossing the first direction and arranged between the first opening and the second opening, The above printed circuit board is an electronic device electrically connected to the support plate through the above separation bar.

13. In paragraph 12, The printed circuit board includes at least one connecting member arranged on one surface thereof, An electronic device wherein at least one connecting member is electrically connected to the separating bar.

14. In any one of paragraphs 11 to 13, A side structure (210; 410) configured to at least partially surround the space between the front plate and the rear plate; A radiation conductor (410b) that is part of the side structure and electrically insulated from other parts of the side structure; and Further comprising a flange (F) protruding from the inner surface of the above-mentioned radiation conductor and electrically connected to the above-mentioned printed circuit board, An electronic device wherein the above instructions, when individually or collectively executed by the at least one processor, cause the electronic device to perform wireless communication in a second frequency band using the radiating conductor.

15. An electronic device according to claim 14, wherein the radiating conductor is configured to define or surround a portion of the first opening.

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