RPS assembly and substrate processing device

Abstract

The present invention relates to an RPS assembly and a substrate processing device comprising: a chamber for providing an accommodation space in which a substrate is processed; and a remote plasma source (RPS) arranged at the outer lower part of the chamber to supply plasma to the inside of the chamber. Accordingly, the inside of the chamber can be effectively cleaned, even in high-temperature processes.

Description

RPS assembly and substrate processing equipment

[0001] The present invention relates to an RPS assembly and a substrate processing device, and more specifically, to an RPS assembly and a substrate processing device capable of effectively cleaning the inside of a chamber even during a high-temperature process.

[0002] A substrate processing device according to a prior art deposits a thin film of a predetermined thickness on one surface of a substrate, for example, the upper surface of the substrate. In this case, when the thin film is deposited overlappingly on the upper surface of the substrate, the stress of the thin film may cause bowing of the substrate.

[0003] When the substrate bows in this way, it becomes difficult to position the substrate in the correct position during subsequent substrate processing processes. In particular, the precision of substrate processing processes is increasing day by day, and this bowing phenomenon reduces the precision of the processing process. Therefore, in order to prevent the aforementioned substrate bowing phenomenon, a thin film of a predetermined thickness is deposited on the lower surface of the substrate to prevent the bowing phenomenon.

[0004] When cleaning the interior of the chamber in the aforementioned substrate processing device, a cleaning gas, such as NF3, may be supplied in the form of a remote plasma. However, the cleaning gas may react with components within the chamber, generating byproducts such as particles. In particular, when the temperature within the chamber is heated above the temperature at which byproducts are generated, byproducts may be generated, resulting in the generation of particles.

[0005] The present invention aims to solve the above problems by providing a substrate processing device capable of effectively cleaning the inside of a chamber even during a high-temperature process.

[0006] The above-described object of the present invention can be achieved by a substrate processing device characterized by having a chamber providing a receiving space in which a processing process for a substrate is performed, and an RPS (Remote Plasma Source) provided at the outer lower portion of the chamber and providing remote plasma to the inside of the chamber.

[0007] Here, a substrate support unit provided at the lower part of the chamber to support the substrate, a lower shower head provided on the inside of the substrate support unit to supply process gas, cleaning gas or remote plasma, and a lifting and lowering unit for lifting and lowering the RPS, the substrate support unit and the lower shower head up and down may be provided.

[0008] In addition, the above-mentioned lifting unit raises and lowers the substrate support and the lower shower head, and the RPS can be raised and lowered in conjunction with the substrate support and the lower shower head.

[0009] Furthermore, the lifting unit may include a lift plate to which the RPS, the substrate support, and the lower shower head are connected, an LM guide connected to the lift plate and moving the lift plate up and down, and a driving unit that provides driving force to the LM guide.

[0010] In this case, the LM guides are configured as a pair, and the pair of LM guides can be symmetrically arranged around the remote plasma connecting pipe connecting the RPS and the lower shower head.

[0011] In addition, a power transmission unit that transmits the driving force of the above driving unit to the pair of LM guides may be further provided.

[0012] In this case, the power transmission unit may include a first switching unit that switches the direction of the driving force of the driving unit, and a second switching unit that is connected to the first switching unit and the LM guide and switches the direction of the driving force transmitted from the first switching unit again.

[0013] Meanwhile, the remote plasma connecting tube can be connected to the lower part of the chamber through an elongated and contracted bellows.

[0014] Furthermore, the LM guide is connected, and a tilting plate is connected to the lower part of the chamber and tilted, and a tilting unit for tilting the tilting plate is further provided, and the bellows can be arranged to penetrate the tilting plate.

[0015] Meanwhile, the upper part of the bellows is connected to the lower surface of the chamber, the lower part of the bellows is connected to the elevating plate, and the driving bar of the substrate support part and the remote plasma connecting pipe can be connected to the elevating plate, respectively.

[0016] In addition, a tilting plate connected to the lower part of the chamber and a tilting unit for tilting the tilting plate are further provided, and the LM guide can be connected to the tilting plate.

[0017] Meanwhile, the above-described object of the present invention can be achieved by an RPS assembly characterized by having an RPS that is provided on the outer lower part of a chamber, provides remote plasma into the chamber, and is provided to be able to move up and down together with a substrate support part or a lower shower head inside the chamber, and an elevation unit that raises and lowers the RPS up and down together with the substrate support part or the lower shower head.

[0018] Here, the lifting unit may be provided with a lift plate to which the RPS, the substrate support member or the lower shower head is connected, an LM guide connected to the lift plate and moving the lift plate up and down, and a driving unit that provides driving force to the LM guide.

[0019] In addition, the LM guides may be arranged symmetrically in multiple units to distribute the load of the RPS, and the multiple LM guides may be arranged symmetrically around a remote plasma connecting pipe connecting the RPS and the lower shower head, or the RPS and the substrate support.

[0020] Furthermore, a power transmission unit that transmits the driving force of the driving unit to the plurality of LM guides may be further provided.

[0021] In this case, the power transmission unit may include a first switching unit that switches the direction of the driving force of the driving unit, and a second switching unit that is connected to the first switching unit and the LM guide and switches the direction of the driving force transmitted from the first switching unit again.

[0022] Meanwhile, the plurality of LM guides may be connected, and a tilting plate connected to the lower part of the chamber and tilted, and a tilting unit for tilting the tilting plate may be further provided.

[0023] In addition, the substrate support member or the lower shower head driving bar and the remote plasma connecting pipe may further be provided with a lifting plate.

[0024] According to the present invention having the above-described configuration, remote plasma can be provided through the lower shower head to effectively clean the central portion of the upper heater or the lower shower head.

[0025] In addition, according to the present invention, a relatively heavy RPS can be stably raised and lowered together with a lower shower head.

[0026] Figure 1 is a cross-sectional view of a substrate processing device according to one embodiment of the present invention, viewed from the front;

[0027] Figure 2 is a top perspective view showing the lifting / lowering unit together with the RPS and lower shower head in Figure 1;

[0028] Figure 3 is a drawing of Figure 2 viewed from the front.

[0029] Figure 4 is a perspective view showing RPS;

[0030] Figure 5 is a drawing showing a state in which the RPS, the lifting / lowering plate, the lower shower head, and the substrate support part are raised by the driving of the lifting / lowering unit in the state of the substrate processing device of Figure 1.

[0031] Figure 6 is a perspective view of the tilting drive unit of the substrate processing device.

[0032] Fig. 7 is a cross-sectional view taken along line 'Ⅶ-Ⅶ' of Fig. 6.

[0033] Hereinafter, the structure of a substrate processing device (1000) according to an embodiment of the present invention will be examined in detail with reference to the drawings.

[0034] Fig. 1 is a cross-sectional view of a substrate processing device (1000) according to one embodiment of the present invention, viewed from the front. It should be noted that Fig. 1 schematically illustrates each component of the substrate processing device (1000) for convenience of explanation.

[0035] Referring to FIG. 1, the substrate processing device (1000) may be equipped with a chamber (300) that provides a receiving space (310) in which a processing process for a substrate (S) is performed, and an RPS (Remote Plasma Source) (850) (see FIG. 2) that is provided on the outer lower side of the chamber (300) and provides remote plasma to the inside of the chamber (300).

[0036] In addition, the substrate processing device (1000) may further include a substrate support unit (400) provided at the lower portion of the chamber (300) to support the substrate (S), a lower shower head (430) provided on the inside of the substrate support unit (400) to supply process gas, cleaning gas, or remote plasma, and a lifting / lowering unit (500) that raises and lowers the RPS (850), the substrate support unit (400), and the lower shower head (430) up and down.

[0037] The above substrate processing device (1000) may be equipped with an upper heater (200) that supplies purge gas, etc. to the upper portion of the substrate (S), and further may be equipped with a lower shower head (430) that supplies process gas, etc. to the lower portion of the substrate (S).

[0038] In this configuration, when cleaning the interior of the chamber (300), the substrate processing device according to the prior art supplies cleaning gas, for example, NF3, in the form of remote plasma through an upper heater made of AlN material.

[0039] In this way, when supplying cleaning gas through the upper heater, particle byproducts are not a problem in chambers that have undergone low-temperature processes of approximately 400°C or less. However, in recent chambers that have undergone high-temperature processes of approximately 400°C or more, the upper heater made of AlN is subject to high temperatures, and when supplying NF3 or the like, AlF or the like may be generated inside the upper heater, which may cause particle problems.

[0040] To address this, prior art substrate processing devices have employed a technique for supplying cleaning gas along the side of the upper heater from the upper portion of the chamber. However, this method has a problem in that the supplied cleaning gas is directly exhausted through the exhaust port at the bottom of the chamber and is not supplied to the center of the upper heater or lower showerhead. This results in a longer cleaning time for cleaning the center of the upper heater or lower showerhead, and furthermore, there is a problem in that the surface of the upper heater or lower showerhead is not cleaned uniformly.

[0041] In addition, in the case of another substrate processing device according to the prior art, the temperature of the upper heater was lowered to below 400°C in a chamber that had undergone a high-temperature process of approximately 400°C or higher to clean the inside of the chamber, thereby preventing AlF, etc. from being generated in the aforementioned upper heater. However, this method required time to lower the temperature of the upper heater to perform the cleaning process and then raise the temperature of the upper heater to the process temperature, that is, a temperature of approximately 400°C or higher, which significantly reduced the throughput of the substrate processing device.

[0042] Hereinafter, a substrate processing device according to an embodiment of the present invention for solving the aforementioned problems will be examined.

[0043] Specifically, the chamber (300) can provide a receiving space (310) on the inside where various components required for a deposition process on a substrate are received.

[0044] One side of the chamber (300) may be provided with an opening (not shown) through which a substrate is loaded into or unloaded from the receiving space (310), and a door (not shown) may be provided in the above-described opening.

[0045] The upper portion of the chamber (300) may be provided with an upper heater (200) that supplies a purge gas, such as an inert gas, toward the upper surface of the substrate (S). An upper supply path (220) through which the purge gas is supplied may be connected to the upper portion of the chamber (300). The purge gas supplied along the upper supply path (220) may be supplied downward through the upper heater (200).

[0046] The purge gas supplied from the upper heater (200) is supplied toward the lower receiving space (310), thereby preventing the cleaning gas or remote plasma supplied from the lower shower head (430) from flowing into the upper heater (200).

[0047] For example, the upper heater (200) may be provided with a heater (not shown) on the inside, and a plurality of supply holes (not shown) for supplying purge gas may be formed. The substrate (S) and the receiving space (310) may be heated to a predetermined process temperature by the heater. In addition, the purge gas supplied through the upper supply path (220) may be supplied downward through the supply holes.

[0048] Meanwhile, the upper heater (200) may be manufactured from a ceramic material such as AlN in response to a high-temperature process for the substrate (S). In addition, the upper heater (200) may be heated to a temperature (e.g., 400 degrees Celsius or higher) higher than a temperature at which fluorine (F) contained in a cleaning gas or cleaning radical reacts to generate a byproduct during a process for the substrate (S).

[0049] Meanwhile, the upper heater (200), the lower shower head (430), and the substrate support member (400) may be provided to be able to move relative to each other. In this case, the lower shower head (430) moves together with the substrate support member (400), so the upper heater (200) and the substrate support member (400) may be provided to be able to move relative to each other.

[0050] The upper heater (200) and the substrate support member (400) may both be configured to be able to move up and down, or at least one of the upper heater (200) and the lower substrate support member (400) may be provided to be able to move up and down.

[0051] For example, the substrate support member (400) may be provided so as to be able to move up and down at the bottom of the receiving space (310) and may support the edge of the lower surface of the substrate (S). The lower shower head (430) described above may be provided on the inside of the substrate support member (400), and cleaning gas or remote plasma may be supplied by the lower shower head (430).

[0052] The lower shower head (430) may be provided with a lower shower head plate (431) and a lower plate (450) connected to the lower portion of the lower shower head plate (431). A heat exchange path (not shown) for temperature control may be formed in the lower plate (450). In this case, a second buffer space (432) may be provided between the lower shower head plate (431) and the lower plate (450).

[0053] In addition, the driving bar (470) may extend downward from the lower plate (450). The driving bar (470) is connected to the raising / lowering unit (500) described below, so that the driving bar (470), the substrate support part (400), and the lower shower head (430) may move up and down by the driving of the raising / lowering unit (500).

[0054] Meanwhile, although not shown in the drawing, the second buffer space may be provided on the inside of the lower shower head plate (431). Furthermore, although not shown in the drawing, a baffle or blocking plate for gas dispersion may be inserted between the lower shower head plate (431) and the lower plate (450) or in the second buffer space (432).

[0055] In addition, a lift pin (433) (see FIG. 2) that secures the substrate (S) to the substrate support member (400) can be positioned on the lower shower head plate (431) so as to be able to move up and down.

[0056] The above substrate support member (400) may be provided with a substrate holder (410) that supports the edge of the lower surface of the substrate, and may be provided with the aforementioned lower shower head (430) on the inside of the substrate holder (410). In this case, the lower portion of the substrate holder (410) may be supported by a fixing member (420) connected to the lower plate (450).

[0057] The above substrate holder (410) may be formed to extend upward from the fixing member (420), and may have a shape in which the upper end of the substrate holder (410) is bent inward.

[0058] At this time, the fixing portion (420) may be provided in multiple numbers and spaced apart at predetermined intervals along the outer circumference of the lower plate (450). That is, when the fixing portion (420) is provided in multiple numbers, the space between adjacent fixing portions (420) may be opened downwards to communicate with the interior of the chamber (300). Accordingly, the space between the side surface of the lower shower head (430), the side surface of the lower plate (450), and the inner surface of the substrate holder (410) may form an exhaust path (422).

[0059] In this case, some of the process gas supplied from the lower shower head (430) is discharged to the lower part of the chamber (300) through the exhaust path (422) and can be exhausted to the outside of the chamber (300) through an exhaust unit (not shown) provided at the lower part of the chamber (300).

[0060] Meanwhile, a concave portion (416) may be formed at the upper end of the substrate holder (410). Accordingly, when the substrate is placed on the substrate holder (410), the substrate is inserted into the concave portion (416) to support the lower surface of the edge of the substrate.

[0061] Meanwhile, cleaning gas or remote plasma can be supplied to the lower shower head (430) through the lower supply passage (474) passing through the drive bar (470).

[0062] As described above, when the substrate support member (400) and the lower shower head (430) are provided to be able to move up and down, and remote plasma is provided toward the lower shower head (430), according to the substrate processing device of the prior art, an elastic member such as a bellows may be connected to the lower part of the chamber (300) for the upper and lower movement of the lower shower head (430). In addition, the RPS (Remote Plasma Source) that provides remote plasma must be connected to the lower part of the lower shower head (430) through the bellows. However, such a bellows structure is generally made of a material such as Al, but such a material has a disadvantage in that it is vulnerable to corrosion by cleaning gas.

[0063] Accordingly, in the present invention, when the lower shower head (430) and the substrate support part (400) are provided to be able to move up and down as shown in FIG. 1, the RPS (Remote Plasma Source) (850) can be provided to be able to move up and down together with the lower shower head (430) and the substrate support part (400).

[0064] Specifically, the substrate processing device (1000) according to the present embodiment may be equipped with a lifting and lowering unit (500) that raises and lowers the RPS (850), the substrate support unit (400), and the lower shower head (430) up and down.

[0065] FIG. 2 is a top perspective view showing the elevation unit (500) together with the RPS (850) and the lower shower head (430), omitting the illustration of the chamber (300) and the substrate support member (400), and FIG. 3 is a front view of FIG. 2.

[0066] Referring to FIGS. 1 to 3, the lifting unit (500) may include a lift plate (650) to which the RPS (850), the substrate support member (400) and the lower shower head (430) are connected, a linear motion guide (LM guide) (610, 620) connected to the lift plate (650) and moving the lift plate (650) up and down, and a driving unit (660) that provides driving force to the LM guide (610, 620).

[0067] For example, the drive bar (470) extending downward from the lower shower head (430) may protrude outward through the opening (302) of the base of the chamber (300). In this case, the lower end of the drive bar (470) may be connected to the elevation plate (720).

[0068] In this case, a bellows (900) surrounding the driving bar (470) may be provided. The bellows (900) may be configured to be able to expand and contract. The upper end of the bellows (900) may be connected to the lower surface of the chamber (300), and the lower end of the bellows (900) may be connected to the elevating plate (720).

[0069] Therefore, even when the lifting / lowering plate (720) is raised / lowered by the lifting / lowering unit (500), the internal pressure of the chamber (300) can be maintained by the bellows (900).

[0070] Meanwhile, the substrate processing device (1000) may be equipped with a tilting plate (510) connected to the lower portion of the chamber (300) to tilt the substrate support member (400) and the lower shower head (430), and a tilting unit (120, 520) to tilt the tilting plate (510).

[0071] In this case, the driving bar (470) may be positioned to pass through the through hole (512) of the tilting plate (510). That is, the driving bar (470) may pass through the tilting plate (510) and be connected to the elevating plate (720) described above. In addition, the bellows (900) may also pass through the through hole (512) of the tilting plate (510) and be connected to the elevating plate (720).

[0072] In addition, the LM guide (610, 620) of the elevating unit (500) may be connected to the tilting plate (510). That is, the upper end of the LM guide (610, 620) may be connected to the lower end of the tilting plate (510). Furthermore, the side of the LM guide (610, 620) of the elevating unit (500) may be connected to the aforementioned lift plate (650).

[0073] Meanwhile, the LM guides (610, 620) may be configured in multiple units to raise and lower the aforementioned RPS (850) and distribute the load of the RPS (850). For example, as illustrated in the drawing, the LM guides (610, 620) may be configured in pairs.

[0074] In this case, the pair of LM guides (610, 620) can be symmetrically arranged around the remote plasma connection pipe (710) connecting the RPS (850) and the lower shower head (430).

[0075] That is, the lift plate (650) is movably connected to the LM guide (610, 620), and the RPS (850) can be connected to the lift plate (650).

[0076] Figure 4 is a perspective view illustrating the RPS (850).

[0077] Referring to FIGS. 2 to 4, a support member (800) may be connected to the lift plate (650), and support members (810) may be provided on both sides of the support member (800). The support member (800) may be bent in an 'L' shape to support the RPS (850). In this case, the RPS (850) may be connected to the support member (800) by means of connecting brackets (812, 814). In addition, the support members (810) may fix both sides of the RPS (850).

[0078] The above RPS (850) generates remote plasma and can supply it to the lower shower head (430) through an intermediate connecting pipe (712) connected to the RPS (850) and a remote plasma connecting pipe (710) connected to the intermediate connecting pipe (712).

[0079] In this case, it may also be considered to manufacture the remote plasma connection pipe (710) in the form of a flexible bellows. However, bellows are generally manufactured from a flexible stainless steel material, but such stainless steel has a disadvantage of being highly corrosive to plasma. Therefore, the remote plasma connection pipe (710) may be manufactured from an aluminum material, which has low corrosiveness to the plasma provided from the RPS (850). Such aluminum has a disadvantage in that it is difficult to manufacture it in a form with elasticity like a bellows due to its low flexibility.

[0080] Accordingly, in the present invention, the remote plasma connecting pipe (710) forming a movement path for providing remote plasma is not manufactured in a bellows shape, but the RPS (850) itself is configured in a rising and falling manner, and the remote plasma connecting pipe (710) can be manufactured as a non-flexible rigid part by being manufactured from aluminum or the like.

[0081] In this case, when the bellows (900) is used to raise and lower the RPS (850), the remote plasma connection pipe (710) can be connected to the lower surface of the raising and lowering plate (720). Therefore, as described above, when the driving bar (470) is connected to the upper surface of the raising and lowering plate (720), the remote plasma connection pipe (710) and the lower supply path (474) of the driving bar (470) can be communicated with each other through the raising and lowering plate (720). In addition, it can be said that the remote plasma connection pipe (710) is connected to the lower portion of the chamber (300) through the bellows (900).

[0082] Meanwhile, referring again to FIGS. 1 to 3, when the LM guides (610, 620) are configured as a pair, the pair of LM guides (610, 620) can be symmetrically arranged around the remote plasma connection pipe (710) connecting the RPS (850) and the lower shower head (430).

[0083] For example, the first LM guide (610) and the second LM guide (620) may be symmetrically arranged with the remote plasma connecting pipe (710) as the center. The upper ends of the first LM guide (610) and the second LM guide (620) may be connected to the tilting plate (510) as described above. In addition, the lift plate (650) may be connected to the first elevating / lowering part (612) of the first LM guide (610) and the second elevating / lowering part (622) of the second LM guide (620).

[0084] In this case, a bracket (not shown) that matches the movements of the first raising / lowering unit (612) and the lift plate (650) may be provided between the first raising / lowering unit (612) and the lift plate (650). Similarly, a bracket (not shown) that matches the movements of the second raising / lowering unit (622) and the lift plate (650) may be provided between the second raising / lowering unit (622) and the lift plate (650).

[0085] Therefore, when the first elevation unit (612) and the second elevation unit (622) are raised and lowered by the driving of the first LM guide (610) and the second LM guide (620), the lift plate (650) is also raised and lowered, and thereby the RPS (850) can also be raised and lowered. The first elevation unit (612) can be raised and lowered up and down along the first driving shaft (613) provided on the inside of the first LM guide (610). Similarly, although not shown, the second elevation unit (622) can be raised and lowered up and down along the second driving shaft (not shown) provided on the inside of the second LM guide (620).

[0086] In addition, the RPS (850), the lower shower head (430), and the substrate support member (400) are connected to each other through the remote plasma connection pipe (710), the elevation plate (720), and the driving bar (470). Therefore, the lower shower head (430) and the substrate support member (400) can be raised and lowered together with the RPS (850) by driving the first LM guide (610) and the second LM guide (620).

[0087] Furthermore, although not shown in the drawing, in cases where it is difficult to support the load of the lower shower head (430) with only the rigidity of the remote plasma connection pipe (710), the lifting plate (720) may be directly connected to the lift plate (650) so that the lifting and lowering are matched.

[0088] Meanwhile, the above-mentioned lifting unit (500) may be equipped with a driving unit (660) that provides driving force to the above-mentioned LM guide (610, 620). The driving unit (660) may be composed of a motor, etc.

[0089] In this case, a power transmission unit (670, 630, 640) that transmits the driving force of the driving unit (660) to the pair of LM guides (610, 620) may be provided. That is, in the case of providing a pair of LM guides (610, 620), in order to transmit the driving force by a single driving unit (660), a power transmission unit (670, 630, 640) that distributes and transmits the driving force of the driving unit (660) to the pair of LM guides (610, 620) is required.

[0090] For example, the power transmission unit (640, 630, 640) may include a first switching unit (670) that switches the direction of the driving force of the driving unit (660), and a second switching unit (630, 640) that is connected to the first switching unit (670) and the LM guide (610, 620) and switches the direction of the driving force transmitted from the first switching unit (670) again.

[0091] The configuration of the first switching unit (670) and the second switching unit (630, 640) described above is schematically illustrated in FIG. 1 and more specifically illustrated in FIGS. 2 and 3.

[0092] Referring to FIGS. 2 and 3, the driving unit (660) may be connected to the lower portion of the first switching unit (670). The driving force of the driving unit (660) is transmitted to the first switching unit (670), and the driving force may be distributed to both sides by the first switching unit (670). For this purpose, a worm gear (not shown) or a screw gear (not shown) may be provided on the inside of the first switching unit (670). However, the specific configuration of the first switching unit (670) is not limited.

[0093] The second switching units (630, 640) described above may be arranged on both sides of the first switching unit (670). That is, the second switching units (630, 640) may be arranged below each of the pair of LM guides (610, 620), and the first switching unit (670) may be arranged between the pair of second switching units (630, 640). However, the arrangement structure of the first switching unit (670) and the second switching unit (630, 640) is merely an example and may be applied in various modified forms.

[0094] The driving force transmitted to the pair of second switching units (630, 640) by the first switching unit (670) can be changed in direction once again and transmitted toward the pair of LM guides (610, 620). That is, the direction of the driving force can be changed and transmitted again toward the pair of LM guides (610, 620) by the pair of second switching units (630, 640). For this purpose, a bevel gear (not shown) or the like may be provided on the inside of the pair of second switching units (630, 640), but the specific configuration is not limited thereto. Meanwhile, an intermediate driving unit (632, 642) that transmits the driving force of the pair of second switching units (630, 640) toward the pair of LM guides (610, 620) may be further provided.

[0095] FIG. 5 illustrates a state in which the RPS (850), the lift plate (650), the elevation plate (720), the lower shower head (430), and the substrate support unit (400) are raised by the operation of the elevation unit (500) in the state of the substrate processing device (1000) of FIG. 1.

[0096] Referring to FIG. 5, when the driving unit (660) is driven, the driving force of the driving unit (660) is transmitted to the pair of LM guides (610, 620) through the first switching unit (670) and the pair of second switching units (630, 640).

[0097] When the above pair of LM guides (610, 620) are driven, the lift plate (650) moves up and down, and thereby the RPS (850), the lifting and lowering plate (720), the lower shower head (430), and the substrate support part (400) can move up and down in conjunction with each other.

[0098] As described above, when the elevating plate (720) is raised and lowered, a bellows (900) is placed between the elevating plate (720) and the chamber (300), so that the pressure inside the chamber (300) can be maintained.

[0099] Meanwhile, FIGS. 6 and 7 correspond to drawings explaining the operation of the tilting drive unit described above.

[0100] Figure 6 is a perspective view of the tilting driving unit (120) of the substrate processing device (1000).

[0101] Referring to FIG. 1 and FIG. 6, the substrate processing device (1000) may be equipped with a tilting plate (510) connected to the lower portion of the chamber (300) and a tilting unit (120, 520) that tilts the tilting plate (510).

[0102] Here, the tilting unit (120, 520) may be provided with a tilting driving unit (120) that rotates the tilting plate (510) and a tilting connecting unit (520) that rotatably supports one side of the tilting plate (510).

[0103] For example, a tilting housing (110) may be connected to the lower portion of the chamber (300), and the tilting plate (510) may be connected to the tilting housing (110) in a tiltable manner. In this case, the tilting driving unit (120) may be connected to the tilting housing (110).

[0104] Specifically, one side of the tilting plate (510) is connected to the tilting housing (110), and the other side of the tilting plate (510) is connected to the tilting connection part (520). The tilting connection part (520) may have a support bar (522) connected to the lower part of the chamber (300) and a rotation part (524) connected to an end of the support bar (522). The rotation part (524) may be formed in a spherical, semicircular, or curved shape.

[0105] Accordingly, when the tilting drive unit (120) is driven to move one side of the tilting plate (510) up and down, the entire tilting plate (510) can be tilted by rotating around the tilting connection unit (520).

[0106] In addition, the tilting drive unit (120) may be equipped with a first adjustment unit (102) that rotates the tilting plate (510) up and down a predetermined distance and a second adjustment unit (104) that prevents the tilting plate (510) from moving upward due to negative pressure inside the chamber (300).

[0107] That is, the first adjustment unit (102) rotates one side of the tilting plate (510) up and down to adjust the rotation angle of the tilting plate (510).

[0108] The first adjustment unit (102) may be provided in a tilting housing (110) connected to the lower portion of the chamber (300) as illustrated in FIG. 6. The tilting housing (110) is fixed to the lower portion of the chamber (300) and has a groove (112) formed therein into which one side of the tilting plate (510) is inserted. In a state where one side of the tilting plate (510) is inserted into the groove (112), one side of the tilting plate (510) is slightly rotated up and down by the first adjustment unit (102) described above, or the tilting plate (510) is prevented from rising and the height of the tilting plate (510) is fixed by the second adjustment unit (104).

[0109] Fig. 7 is a cross-sectional view taken along line 'Ⅶ-Ⅶ' of Fig. 6.

[0110] Referring to FIG. 7, the first adjustment unit (102) may be equipped with a tilting drive unit (120) having a cam member (130) that applies a predetermined force to the tilting plate (510) and a rotational shaft (122) that is connected to the cam member (130) at a predetermined distance from the center of rotation of the cam member (130) and rotates the cam member (130).

[0111] A tilting driving unit (120) such as a motor is provided in the tilting housing (110), and a rotational shaft (122) extended from the tilting driving unit (120) is connected to the cam member (130). At this time, the rotational center of the cam member (130) and the rotational shaft (122) of the tilting driving unit (120) are connected at a predetermined distance (d). In Fig. 7, line ⓐ is an imaginary line extended from the center of the rotational axis (122) of the tilting driving unit (120), and line ⓑ corresponds to an imaginary line extended from the rotational center of the cam member (130).

[0112] That is, the rotational axis (122) of the tilting drive unit (120) is not connected to the rotational center of the cam member (130), but the rotational axis (122) of the tilting drive unit (120) is connected to a point spaced a predetermined distance from the rotational center of the cam member (130). In the structure as described above, when the rotational axis (122) rotates by the driving of the tilting drive unit (120), the cam member (130) also rotates in conjunction.

[0113] In this case, since the center of rotation of the cam member (130) is positioned apart from the center of the rotation axis (122), when the cam member (130) rotates, the distance between the outer periphery of the cam member (130) and the rotation axis (122) changes. That is, when the cam member (130) rotates, the outer periphery of the cam member (130) does not form a constant circular trajectory, but rather forms an irregular trajectory in which the distance from the rotation axis (122) changes. Accordingly, when the distance between the outer periphery of the cam member (130) and the rotation axis (122) becomes relatively far, the tilting plate (510) can be raised upwards to rotate, and conversely, when the distance between the outer periphery of the cam member (130) and the rotation axis (122) becomes relatively short, the tilting plate (510) is lowered downwards to rotate.

[0114] At this time, a bearing part (140) may be further provided between the cam member (130) and the tilting plate (510), which surrounds the outer circumference of the cam member (130) and applies a predetermined force to the tilting plate (510). The bearing part (140) prevents the cam member (130) from directly contacting the push bar (150) described below, thereby preventing wear of the cam member (130) or the push bar (150).

[0115] Furthermore, the substrate processing device (1000) may further include a push bar (150) that has one end in contact with the outer periphery of the bearing part (140) and applies a predetermined force to the tilting plate (510) by rotation of the bearing part (140).

[0116] The above push bar (150) is provided to be able to move up and down by penetrating a linear bush (160) that passes through an opening (114) provided on the other side of the tilting housing (110). When the push bar (150) moves up and down by the rotation of the cam member (130), the linear bush (160) guides the up and down movement of the push bar (150). Therefore, when the bearing member (140) rotates together by the rotation of the cam member (130), the push bar (150) moves up and down to raise and lower the tilting plate (510) and rotate it.

[0117] In addition, the push bar (150) supports the tilting plate (510) to prevent the tilting plate (510) from sagging. That is, when the cam member (130) does not rotate, the cam member (130) is fixed by engaging with the rotation shaft (122), so that the height of the upper end of the push bar (150) is fixed to support the tilting plate (510) and prevent sagging.

[0118] Meanwhile, a reducer (124) may be positioned between the cam member (130) and the rotational shaft (122). The reducer (124) reduces the rotational force of the rotational shaft (122) and transmits it to the cam member (130). In this case, the reduction ratio of the reducer (124) may be determined in response to the maximum distance that the tilting plate (510) can be raised or lowered.

[0119] Meanwhile, the aforementioned RPS (850) may be provided in an assembly form together with the lifting / lowering unit (500) and connected to the lower part of the chamber (300).

[0120] For example, the RPS assembly may be provided on the outer lower part of the chamber (300) to provide remote plasma into the chamber (300), and may include an RPS (850) that is provided to be able to move up and down together with a substrate support member (400) or a lower shower head (430) inside the chamber (300), and an elevation unit (500) that raises and lowers the RPS (850) up and down together with the substrate support member (400) or the lower shower head (430).

[0121] The above RPS assembly may further include the aforementioned tilting plate (510) and the tilting unit (120, 520), and may further include the elevating plate (720).

[0122] Furthermore, the present invention provides a separate raising / lowering unit (500) for raising / lowering the RPS (850). If a member such as a spring or cylinder is connected to the RPS (850) to reduce the load, the RPS (850) can be raised / lowered by a driving unit (not shown) for raising / lowering the lower shower head (430) or the substrate support member (400) without providing a separate raising / lowering unit (500).

[0123] While the present invention has been described above with reference to preferred embodiments, those skilled in the art will appreciate that various modifications and variations can be made to the present invention without departing from the spirit and scope of the invention as defined in the claims below. Therefore, any modified implementation that fundamentally includes the elements of the claims should be considered within the technical scope of the present invention.

[0124] According to the invention, remote plasma can be provided through the lower shower head to effectively clean the upper heater or the central portion of the lower shower head.

[0125] In addition, according to the present invention, a relatively heavy RPS can be stably raised and lowered together with a lower shower head.

Claims

1. A chamber providing a receiving space where a processing process for a substrate is performed; and A substrate processing device characterized by comprising an RPS (Remote Plasma Source) provided at the outer lower portion of the chamber and providing remote plasma to the inside of the chamber.

2. In paragraph 1, It further comprises a substrate support part provided at the lower part of the chamber to support the substrate, and a lower shower head provided on the inside of the substrate support part to supply process gas, cleaning gas, or remote plasma. A substrate processing device characterized by having a lifting and lowering unit that raises and lowers the RPS, the substrate support member, and the lower shower head.

3. In paragraph 2, A substrate processing device characterized in that the above-mentioned lifting and lowering unit raises and lowers the substrate support unit and the lower shower head, and the RPS raises and lowers in conjunction with the substrate support unit and the lower shower head.

4. In paragraph 2, The above-mentioned ascending and descending unit A lift plate to which the RPS, the substrate support, and the lower shower head are connected; An LM guide connected to the above lift plate and moving the lift plate up and down; A substrate processing device characterized by comprising a driving unit that provides driving force to the above LM guide.

5. In paragraph 4, The above LM guides are composed of a pair, A substrate processing device characterized in that the pair of LM guides are symmetrically arranged around a remote plasma connecting pipe connecting the RPS and the lower shower head.

6. In paragraph 5, A substrate processing device characterized in that it further comprises a power transmission unit that transmits the driving force of the above driving unit to the pair of LM guides.

7. In paragraph 6, The above power transmission unit A substrate processing device characterized by comprising a first switching unit that switches the direction of the driving force of the driving unit, and a second switching unit that is connected to the first switching unit and the LM guide and switches the direction of the driving force transmitted from the first switching unit again.

8. In paragraph 5, A substrate processing device characterized in that the above remote plasma connecting tube is connected to the lower part of the chamber through an expanding and contracting bellows.

9. In paragraph 8, The above LM guide is connected, and a tilting plate connected to the lower part of the chamber and tilted, and a tilting unit for tilting the tilting plate are further provided. A substrate processing device characterized in that the bellows is arranged to penetrate the tilting plate.

10. In paragraph 8, The upper part of the bellows is connected to the lower part of the chamber, and the lower part of the bellows is connected to the elevating plate. A substrate processing device characterized in that the driving bar of the substrate support part and the remote plasma connecting pipe are each connected to the elevating plate.

11. In paragraph 4, It further comprises a tilting plate connected to the lower part of the chamber and a tilting unit that tilts the tilting plate, A substrate processing device characterized in that the above LM guide is connected to the above tilting plate.

12. An RPS provided on the outer lower part of the chamber to provide remote plasma into the chamber and to be able to move up and down together with the substrate support part or lower shower head inside the chamber; and An RPS assembly characterized by comprising a lifting unit that raises and lowers the RPS up and down together with the substrate support member or the lower shower head.

13. In paragraph 12, The above-mentioned ascending and descending unit An RPS assembly characterized by comprising: a lift plate to which the RPS, the substrate support member or the lower shower head are connected; an LM guide connected to the lift plate and moving the lift plate up and down; and a driving unit providing driving force to the LM guide.

14. In paragraph 13, The above LM guides are arranged symmetrically in multiple units to distribute the load of the RPS. An RPS assembly characterized in that the plurality of LM guides are symmetrically arranged around a remote plasma connecting pipe connecting the RPS and the lower shower head, or the RPS and the substrate support.

15. In paragraph 14, An RPS assembly characterized in that it further comprises a power transmission unit that transmits the driving force of the driving unit to the plurality of LM guides.

16. In paragraph 15, The above power transmission unit An RPS assembly characterized by comprising a first switching unit that switches the direction of the driving force of the driving unit, and a second switching unit that is connected to the first switching unit and the LM guide and switches the direction of the driving force transmitted from the first switching unit again.

17. In paragraph 14, An RPS assembly characterized in that the above plurality of LM guides are connected, and further comprises a tilting plate connected to the lower part of the chamber and tilted, and a tilting unit that tilts the tilting plate.

18. In paragraph 14, An RPS assembly characterized in that it further comprises a lifting plate to which the driving bar of the substrate support part or the lower shower head and the remote plasma connecting pipe are connected.

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