Probe card assembly and manufacturing method thereof

Abstract

The present invention provides a probe card assembly having probe pins arranged at narrow intervals and capable of maintaining a constant interval despite a temperature change of an element to be inspected. According to the present invention, the probe card assembly comprises: a circuit board to which a signal for electrical inspection of an element to be inspected is applied; a frame substrate coupled to one surface of the circuit board and having a plurality of openings formed therethrough; a conductive medium provided in the openings and electrically connected to the circuit board; a probe substrate coupled to the conductive medium; and a probe pin member coupled to the opposite side of the conductive medium on the probe substrate.

Description

Probe card assembly and manufacturing method thereof

[0001] The present invention relates to a probe card assembly for inspecting a target element and a method for manufacturing the probe card assembly.

[0002] During the semiconductor manufacturing process, inspection target devices are formed on a wafer, and electrical testing is performed on each inspection target device. To apply electrical signals to each inspection target device, a probe card contacts the wafer and applies the signals. The probe card applies the inspection signal by contacting the wafer's electrodes underneath, and transmits the response signal to the tester.

[0003] Meanwhile, in the case of high-bandwidth devices such as HBM (high bandwidth memory) and extremely high-temperature tests such as automotive semiconductors, multiple electrodes are positioned relative to the same area, and the area of ​​each electrode is also narrow. Therefore, the spacing between probe pins must be tight and the deviation must also be precisely maintained. Furthermore, because the gap between electrodes changes with the test temperature of the device under test, it is important to ensure that the gap between probe pins can accurately contact the electrode pads despite the temperature deviation.

[0004] Accordingly, the present invention provides a probe card assembly having probe pins that can maintain a constant spacing despite temperature changes while being arranged at a narrow interval and that are structurally electrically connected at the shortest distance, thereby improving high-performance mechanical, thermal, and electrical functions, and a method for manufacturing a probe card assembly by dividing the probe pins into more highly integrated multiple components for easy assembly and individual repair.

[0005] The problems solved by the present invention are not limited to those mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the description below.

[0006] A probe card assembly according to one aspect of the present invention includes: a circuit board to which a signal for electrical inspection of a device to be inspected is applied; a frame board coupled to one surface of the circuit board and having a plurality of openings formed therein; a conductive medium provided in the opening and electrically connected to the circuit board; a probe board coupled to the conductive medium; and a probe pin member coupled to an opposite side of the conductive medium on the probe board. The probe board is coupled to the frame board using a bonding material made of an epoxy material.

[0007] In an embodiment of the present invention, the bonding material may be attached along the periphery of the edge of the probe substrate.

[0008] In an embodiment of the present invention, a plurality of the bonding materials may be spaced apart and attached along the edge periphery of the probe substrate.

[0009] In an embodiment of the present invention, the bonding material may be attached to a central connecting portion extending in a straight line across the center from both sides of the edge of the probe substrate and the side of the opening in the frame substrate.

[0010] In an embodiment of the present invention, a separation prevention screw that prevents the probe substrate from being separated from the frame substrate may be coupled between the probe substrate and the frame substrate.

[0011] In an embodiment of the present invention, the bonding material may be attached along an edge of the probe substrate, and the anti-separation screws may be coupled in pairs at positions facing each other in a straight direction on the probe substrate.

[0012] In an embodiment of the present invention, the bonding material may be attached along an edge of the probe substrate, and the anti-separation screws may be coupled in pairs at positions diagonally opposite to each other on the probe substrate.

[0013] In an embodiment of the present invention, the bonding material is attached to a central connecting portion extending in a straight line across the center from the side of the opening in the frame substrate, and the anti-separation screws can be coupled in a pair at positions facing each other in a straight direction in the probe substrate.

[0014] In an embodiment of the present invention, the bonding material is attached to a central connecting portion extending in a straight line across the center from the edge corner of the probe substrate and the side of the opening in the frame substrate, and the anti-separation screws can be coupled in a pair at positions facing each other in a straight direction on the probe substrate.

[0015] A method for manufacturing a probe card assembly according to the present invention comprises the steps of: cutting a base substrate into die units to form the probe substrate; fixing the probe substrate to the frame substrate through the bonding material; bonding the probe pin to the probe substrate; connecting the probe substrate and the circuit board through the conductive medium; and bonding a reinforcing material to the circuit board and the frame substrate through a flatness adjustment screw.

[0016] In an embodiment of the present invention, the step of fixing the probe substrate to the frame substrate through the bonding material may include the step of irradiating light with the bonding material to first fix the probe substrate to the frame substrate; and the step of applying heat with the bonding material to secondarily fix the probe substrate to the frame substrate.

[0017] According to another aspect of the present invention, a probe card assembly includes: a circuit board to which a signal for electrical inspection of a device to be inspected is applied; a frame board coupled to one surface of the circuit board and having a plurality of openings formed therein; a conductive medium provided in the openings and electrically connected to the circuit board; a probe board coupled to the conductive medium; and a probe pin member coupled to an opposite side of the conductive medium on the probe board. The probe board is coupled to the frame board via a probe board coupling member.

[0018] In an embodiment of the present invention, the probe substrate joining member can be joined to the fastening hole of the frame substrate while being joined to the rear surface of the probe substrate.

[0019] In an embodiment of the present invention, the probe substrate bonding member can be bonded to the back surface of the probe substrate by solder.

[0020] In an embodiment of the present invention, the probe substrate bonding member can be bonded to an edge corner of the probe substrate.

[0021] In an embodiment of the present invention, the probe substrate coupling member may be provided as a double coupling screw, and the double coupling screw may include an upper screw soldered to the rear surface of the probe substrate and a lower screw fixed to the frame substrate and coupled with the upper screw.

[0022] In an embodiment of the present invention, a bonding material made of an epoxy material for fixing the probe substrate, the probe substrate bonding member, and the frame substrate can be attached.

[0023] In an embodiment of the present invention, the probe substrate coupling member is coupled to a central connecting portion extending in a straight line across the central portion of the probe substrate and a side of the opening in the frame substrate, and a pair of anti-separation screws that prevent the probe substrate from being separated from the frame substrate can be coupled to the probe substrate in a pair at positions facing each other in a straight direction.

[0024] A method for manufacturing a probe card assembly according to the present invention comprises the steps of: cutting a base substrate into die units to form the probe substrate; fixing the probe substrate to the frame substrate through a probe substrate joining member; joining the probe pin member to the probe substrate; connecting the probe substrate and the circuit board through the conductive medium; and joining a reinforcing member to the circuit board and the frame substrate through a flatness adjustment screw.

[0025] In an embodiment of the present invention, the step of fixing the probe substrate to the frame substrate through the probe substrate bonding member may include the step of first fixing the probe substrate bonding member to the probe substrate by solder, which is a bonding material; and the step of secondarily fixing the probe substrate, in a state where the probe substrate bonding member is bonded, to the frame substrate by irradiating light or heat with an adhesive material.

[0026] In an embodiment of the present invention, the probe pin member may be a two-dimensional micro-electro-mechanical system (MEMS) structure patterned from a metal plate.

[0027] In an embodiment of the present invention, the probe pin member extends in a first horizontal direction, and a plurality of the probe pin members can be bonded along a second horizontal direction perpendicular to the first horizontal direction on the probe substrate.

[0028] In an embodiment of the present invention, the probe pin member may include a joint portion extending in the first horizontal direction and joined to the probe substrate; a vertical extension portion extending in a vertical direction perpendicular to the first horizontal direction and the second horizontal direction from the joint portion; a horizontal extension portion extending in the first horizontal direction from the vertical extension portion; and a probe tip portion protruding in the vertical direction from an end of the horizontal extension portion.

[0029] In an embodiment of the present invention, the joint, the vertical extension, and the horizontal extension may include a nickel-boron (NiB) alloy and a cyanide gold (CyAu) material, and the probe tip may include a rhodium (Rh) material.

[0030] In an embodiment of the present invention, a plurality of the probe pin members are bonded to the probe substrate by a solder-type bonding material, and the bonding material may include a gold-tin (AuSn) alloy.

[0031] In an embodiment of the present invention, the probe pin member is bonded via a solder ball made of the solder-type bonding material applied to a bonding pad of the probe substrate, the bonding pad is a metal pad that contacts the probe pin member, and a polyimide thin film layer may be applied between the solder balls on the upper portion of the bonding pad.

[0032] In an embodiment of the present invention, the probe pin member may be coupled to the probe substrate such that the vertical extension portion is positioned on an outer portion of the probe substrate or such that the vertical extension portion is positioned on an inner side of the probe substrate and the probe tip portion is positioned on an outer side of the probe substrate.

[0033] In an embodiment of the present invention, the opening of the frame substrate may have a size and shape corresponding to the size and shape of the element to be inspected.

[0034] In an embodiment of the present invention, the probe substrate may include a polyimide thin film layer formed on a laminated ceramic substrate having a size and shape corresponding to the inspection target element.

[0035] In an embodiment of the present invention, the probe substrate may include: a ceramic layer; a bonding pad connected to the probe pin member on the front surface of the ceramic layer; a polyimide thin film layer applied to a portion of an upper portion of the bonding pad; and a rear pad in contact with the conductive medium on the rear surface of the ceramic layer.

[0036] In an embodiment of the present invention, the opening of the frame substrate and the probe substrate may be grouped in units of the same size and shape as the element to be inspected, or 1 / N times or N times (N is an integer greater than or equal to 2) the element to be inspected.

[0037] In an embodiment of the present invention, the opening of the frame substrate and the probe substrate may be grouped in units of the same size and shape as the element to be inspected, or 1 / N times or N times (N is an integer greater than or equal to 2) the element to be inspected.

[0038] In an embodiment of the present invention, the frame substrate may be composed of a ceramic or metal material.

[0039] In an embodiment of the present invention, the frame substrate may have a coefficient of thermal expansion (CTE) of 0 to 1.5 ppm / K with respect to the inspection target element.

[0040] In an embodiment of the present invention, the frame substrate may have a coefficient of thermal expansion (CTE) of 3 to 4.5 ppm / K with respect to the element to be inspected.

[0041] In an embodiment of the present invention, a separation prevention screw that prevents the probe substrate from being separated from the frame substrate may be coupled between the probe substrate and the frame substrate.

[0042] In an embodiment of the present invention, the probe substrate coupling member is coupled to a central connecting portion extending in a straight line across the central portion of the probe substrate and a side of the opening in the frame substrate, and the anti-separation screws can be coupled in pairs at positions facing each other in a straight direction on the probe substrate.

[0043] In an embodiment of the present invention, the step of bonding the probe pin member to the probe substrate may include the steps of: applying a solder-type bonding material in the form of balls having a diameter of 10 to 100 micrometers to the probe substrate; positioning the probe pin member on the probe substrate using a pick-and-place device; and fixing the probe pin member to the probe substrate by irradiating heat or light while the probe pin member is in contact with the probe substrate.

[0044] In an embodiment of the present invention, the method for manufacturing a probe card assembly may further include a step of replacing the probe pin member when the position of the probe pin member bonded to the probe substrate is incorrect.

[0045] In an embodiment of the present invention, the step of replacing the probe pin may include the step of irradiating heat or light to a bonding material of a probe pin member at a position requiring replacement to melt solder of the bonding material, thereby separating the probe pin member from the probe substrate; and the step of bonding another probe pin member to the position of the probe pin separated from the probe substrate.

[0046] According to the present invention, a probe card assembly can be provided in which a probe board is connected to a circuit board through a conductive medium provided in an opening formed in a frame board, and has probe pins that can maintain a constant gap despite temperature changes, and in which heat transferred from a device to be inspected to the probe card assembly can be effectively discharged through the frame board.

[0047] In addition, the space transformer is divided into several parts for easy assembly and individual repair, and the probe substrate and frame substrate are joined by an epoxy-based bonding material, so that horizontal fluidity can be provided to respond to a certain degree of thermal deformation while still allowing accurate contact.

[0048] This effectively shortens the heating time required for the probe pin member to directly contact the wafer to achieve thermal equilibrium to reach the test temperature, and fundamentally blocks changes in thermal alignment due to temperature caused by a brief separation from the heat source during the test, thereby maintaining high-precision thermal alignment.

[0049] The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0050] Figures 1 and 2 illustrate the structure of a probe card assembly.

[0051] Figures 3 and 4 illustrate examples of the shape of the frame substrate.

[0052] Figure 5 illustrates an example of a frame substrate to which a machinable ceramic material is applied.

[0053] Figure 6 illustrates the structure of a frame substrate made of a machinable ceramic material.

[0054] Figures 7 and 8 illustrate examples of frame substrates to which probe substrates are coupled.

[0055] Figure 9 illustrates an exemplary cross-section of a frame substrate.

[0056] Figure 10 illustrates an example of a probe pin member coupled to a probe substrate.

[0057] Figure 11 illustrates the process of bonding a probe pin member to a probe substrate.

[0058] Figure 12 shows an example of a method of bonding a probe pin member and a probe substrate.

[0059] Figure 13 illustrates an example of a process in which a probe pin member is bonded and repaired to a probe substrate using laser light.

[0060] Figures 14 and 15 illustrate an example of a method of arranging a probe pin member coupled to a probe substrate.

[0061] Figures 16 and 17 illustrate other examples of arrangements of probe pin members coupled to a probe substrate.

[0062] Figure 18 is a flowchart showing a method for manufacturing a probe card assembly.

[0063] Figures 19 and 20 illustrate examples of the manufacturing process of a probe card assembly.

[0064] Figure 21 shows an example of a method of joining a probe pin member, a probe substrate, and a frame substrate.

[0065] Figure 22 is a drawing showing a probe card assembly in which probe pin members are arranged.

[0066] Figure 23 is a drawing showing the process of attaching a probe pin member to a probe substrate.

[0067] Figure 24 illustrates an example of a structure in which a probe substrate and a frame substrate are joined through a bonding material.

[0068] Figure 25 shows a cross-section of part AA' in Figure 24 (a).

[0069] Figure 26 shows a cross-section of the BB' portion in (d) of Figure 24.

[0070] Figure 27 shows a cross-section of the CC' portion in (e) of Figure 24.

[0071] Fig. 28 shows an example of a joint structure using an anti-separation screw.

[0072] Figure 29 is a flowchart showing a method for manufacturing a probe card assembly having a structure in which a probe substrate and a frame substrate are joined through a bonding material.

[0073] Figure 30 shows an example of a manufacturing process of a probe card assembly having a structure in which a probe substrate and a frame substrate are joined through a bonding material.

[0074] Figure 31 illustrates an example of a structure in which a probe substrate and a frame substrate are joined through a probe substrate joining member.

[0075] Figure 32 shows a cross-section of the AA' portion in (b) of Figure 31.

[0076] Figure 33 shows a cross-section of the BB' portion in (c) of Figure 31.

[0077] Figure 34 illustrates an example of a structure in which a probe substrate and a frame substrate are joined through a probe substrate joining member and a joining material of epoxy material.

[0078] Figure 35 shows a manufacturing process of a probe card assembly in which a probe substrate and a frame substrate are joined through a probe substrate joining member and a joining material of epoxy material.

[0079] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein.

[0080] In order to clearly explain the present invention, parts that are not related to the description are omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0081] In addition, in various embodiments, components having the same configuration are described only in representative embodiments using the same symbols, and in other embodiments, only configurations different from the representative embodiments are described.

[0082] Throughout the specification, when a part is said to be "connected (or coupled)" with another part, this includes not only cases where it is "directly connected (or coupled)" but also cases where it is "indirectly connected (or coupled)" with other elements in between. Furthermore, when a part is said to "include" a component, this does not mean that it excludes other components, but rather that it may include other components, unless otherwise specifically stated.

[0083] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0084] Hereinafter, a probe card assembly (1) according to the present invention will be described. Figures 1 and 2 illustrate the structure of the probe card assembly (1) according to the present invention. Figure 2 is a more enlarged view of Figure 1. The probe card assembly (1) can apply an electrical signal by contacting a wafer (2) on which inspection target elements are formed, and can provide a response signal transmitted from the inspection target elements of the wafer (2) to a tester.

[0085] A probe card assembly (1) according to the present invention includes a circuit board (10) to which a signal for electrical inspection of a target element is applied, a frame board (20) coupled to one surface of the circuit board (10) and having a plurality of openings (20-OP) formed therein, a conductive medium (30) provided in the openings (20-OP) and electrically connected to the circuit board (10), a probe board (40) coupled to the conductive medium (30), and a probe pin member (50) coupled to an opposite side of the conductive medium (30) on the probe board (40).

[0086] The probe card assembly (1) according to the present invention replaces the space transformer, which is an expensive, large-area single component with a limited thermal expansion value and difficult to repair, of a conventional laminated ceramic space transformer, and has upper and lower conductive media (30) positioned in an opening of a frame substrate (20), and a probe substrate (40) and a circuit board (10) can be electrically connected through the conductive media (30). A probe pin member (50) mounted on the probe substrate (40) and the upper and lower conductive media (30) are electrically connected. When the probe pin member (50) comes into contact with a pad of a test target element formed on a wafer (2), the wafer (2) and a tester can be electrically connected through the probe pin member (50), the conductive media (30), and the circuit board (10).

[0087] In the present invention, the conductive medium (30), the probe substrate (40), and the probe pin member (50) structurally electrically connect the wafer (2) on which the inspection target elements are formed with the shortest distance, thereby improving high-performance mechanical / thermal / electrical functions and enabling a space transformer that is easy to assemble and individually repair by dividing it into several more highly integrated parts.

[0088] A reinforcing member (60) is placed on the opposite side of the frame substrate (20) on the circuit board (10), and the frame substrate (20) and the probe substrate (40) are fixedly coupled to the reinforcing member (60) via flatness adjustment screws (80). The reinforcing member (60) is coupled to the upper portion of the circuit board (10). The reinforcing member (60) ensures that the probe card assembly (1) remains flat in a certain shape. The probe substrate (40) and the frame substrate (20) are coupled by a probe substrate coupling member (70). The reinforcing member (60), the circuit board (10), and the frame substrate (20) are coupled by flatness adjustment screws (80).

[0089] FIG. 3 and FIG. 4 illustrate examples of the shape of the frame substrate (20). FIG. 3 illustrates a representative example of the frame substrate (20), and FIG. 4 illustrates another example of the frame substrate (20). As illustrated in FIG. 3, the frame substrate (20) is a plate having a circular or nearly circular polygonal shape, and has a plurality of openings (20-OP) formed therein. The openings (20-OP) of the frame substrate (20) may have a size and shape corresponding to the size and shape of the device under test (DUT). Alternatively, according to the TRE (Tester Resource Enhancement) technique, the openings may be grouped up to x1 / 4, x1 / 2, x1, x2, x3, x4, x6, x8, ... x16, x24 times or more of the device under test (DUT), and may have an expanded size and shape corresponding to the wafer test technique of the test target, as illustrated in FIG. 4. That is, the opening (20-OP) of the frame substrate (20) and the probe substrate (40) may be grouped in units of the same size and shape as the device under test (DUT), or 1 / N times or N times (N is an integer greater than or equal to 2) the size and shape of the device under test (DUT).

[0090] The frame substrate (20) may be composed of a metal and / or ceramic material. The frame substrate (20) has high mechanical strength to maintain the mechanical position of the probe substrate (40) according to the coefficient of thermal expansion (CTE) or to allow the heat transferred by the probe pin member (50) to contact the wafer (2) on which the device under test (DUT) is formed to be efficiently discharged. The opening (20-OP) has a size and shape into which a conductive medium (30) can be inserted. The frame substrate (20) may be composed of a material having a very low coefficient of thermal expansion of 0.5 or less. Alternatively, the frame substrate (20) may have a coefficient of thermal expansion that can maintain a level similar to the expansion of the silicon wafer (2) at the test temperature. Thus, the gap between the probe pin members (50) can be maintained equal to the electrode formed on the wafer in accordance with the deformation of the wafer (2) due to heat. That is, the frame substrate (20) may have a coefficient of thermal expansion (CTE) that is the same as or similar to the device under test (DUT), or may have a coefficient of thermal expansion greater than 0 and less than 1. For example, the frame substrate (20) may have a very low coefficient of thermal expansion (CTE) of 0 to 1.5 ppm / K. Alternatively, the frame substrate (20) may have a coefficient of thermal expansion (CTE) of 3 to 4.5 ppm / K.

[0091] In the case of a precision alignment wafer test such as an extremely high temperature test for automotive semiconductors or a high bandwidth memory (HBM) wafer level test that requires little thermal change, the frame substrate (20) that determines the mechanical position of the probe substrate (40) per probe substrate (40) may be made of a metal material having an extremely low coefficient of thermal expansion of about 0.X ppm. This effectively shortens the heating time required for the probe pin member (50) to directly contact the wafer to reach a thermal equilibrium state up to the test temperature, or fundamentally blocks thermal alignment changes due to a brief separation from the heat source during the test, thereby maintaining high thermal precision alignment. The probe substrate (40) may be made of a ceramic layer having the same coefficient of thermal expansion as the device under test (DUT). For example, the probe substrate (40) may have a coefficient of thermal expansion of 3 to 4.5 ppm / K.

[0092] In this case, when cleaning the tip of the multi-touch down or probe card assembly (1) for testing all inspection target elements of a wafer, there is no thermal contact with the wafer as a heat source for a while, and the probe card assembly (1) remains as it is, so that a separate heating time of the probe card assembly (1) due to alignment change is not required for quick testing even when the wafer of the same device is replaced. In the present invention, the material of the frame substrate (20) may be composed of a special metal material with high thermal conductivity and zero CTE, or a similar metal series such as Invar or Super Invar. In another case, the CTE of the frame substrate (20) may be selected from a material with a wide CTE selection spectrum to suit a dual temperature test with a certain temperature range such as hot dual or hot / cold dual.

[0093] Referring to Fig. 4, a circuit board (10) is coupled to the lower portion of a reinforcing member (60), and the reinforcing member (60), the circuit board (10), and the frame board (20) are fixed by a flatness adjustment screw (80). A conductive medium (30) is inserted into an opening (20-OP) of the frame board (20), and the probe board (40) and the circuit board (10) can be electrically connected by the conductive medium (30). The probe board (40) can be coupled to the frame board (20) by a probe board coupling member (70). The probe board coupling member (70) is a heat sink conductor that is a thermally conductive material, or a separation prevention screw or a similar mechanism that prevents the probe board (40) from being detached. A probe pin member (50) is bonded to the probe board (40), and the probe pin member (50) and the conductive medium (30) can be electrically connected to each other.

[0094] The conductive medium (30) may have conductors (34, 36) extending in the vertical direction centered on the medium block (32). The conductive medium (30) may be composed of a printed circuit board (PCB), wire, or flexible PCB that performs electrical connection.

[0095] The frame substrate (20) can be modified according to the conductive medium (30) and the probe substrate (40). As shown in (a) of Fig. 4, the frame substrate (20) can be a substrate to which a spherical conductive medium (30) can be coupled as a pin-shaped interposer. As shown in (b1) and (b2) of Fig. 4, the frame substrate (20) has each opening (20-OP) formed, and a 1 DUT module interposer corresponding to one device under test (DUT) can be coupled as a conductive medium (30) to each opening (20-OP). As shown in (c1) and (c2) of Fig. 4, the frame substrate (20) can have an opening (20-OP) to which a 2 DUT module interposer or a group DUT interposer corresponding to two or more devices under test (DUT) can be coupled as a conductive medium (30). Additionally, as shown in (d) of FIG. 4, the frame substrate (20) may have an opening (20-OP) into which a section interposer divided into a certain area can be combined as a conductive medium (30).

[0096] The frame substrate (20) may be composed of ceramic. If the frame substrate (20) is made of a metal material, a special coating is required for insulation, corrosion prevention, or epoxy bonding, depending on the bonding structure with the conductive medium (30). This special coating may be selectively applied depending on the purpose, in accordance with the epoxy properties for bonding the frame substrate (20) and the probe substrate (40).

[0097] In an embodiment of the present invention, the frame substrate (20) may be composed of a machinable ceramic that has excellent mechanical properties among ceramics and allows for special ultra-precision machining. The machinable ceramic may have a structure as shown in FIG. 5 due to its function as an insulator and ultra-precision machinability. As shown in (a) of FIG. 5, the frame substrate (20) and the probe substrate (40) may be bonded using an epoxy (EP) adhesive. In addition, since the frame substrate (20) composed of the machinable ceramic is itself an insulator, a plating pattern may be formed on the outside. Accordingly, as shown in (b) of FIG. 5, the probe substrate (40) may be bonded through the plating pattern (20P) formed on the outside of the frame substrate (20). For example, the probe substrate (40) may be bonded to a portion where the plating pattern (20P) is formed using a flip-chip bonding method.

[0098] Fig. 6 illustrates the structure of a frame substrate (20) made of a machinable ceramic material. (a) of Fig. 6 is an enlarged view of a portion where a probe substrate (40) and a probe pin member (50) are coupled to the frame substrate (20), and (b) of Fig. 6 is a view showing a structure where a plurality of probe substrates (40) and probe pin members (50) are coupled to the frame substrate (20). Referring to (a) of Fig. 6, a micro-hole (MH) is formed at a portion where the probe substrate (40) is coupled to the frame substrate (20) made of a machinable ceramic material, and the probe substrate (40), the probe pin member (50), and the conductive medium (30) can be electrically connected through the micro-hole (MH). In addition, a screw hole (SH) can be formed outside the area where the micro-hole (MH) is formed, and a through hole (TH) can be formed outside the screw hole (SH).

[0099] As a result, by applying a frame substrate (20) composed of a machinable ceramic, the performance of the conductive medium (30) can be improved from a typical hundreds of micro area to a tens of micro area in pitch conversion, which is its main role as a space converter, thereby implementing a more integrated structure. The machinable ceramic can also have a very low coefficient of thermal expansion (CTE) of 0.X ppm. Alternatively, the material of the frame substrate (20) can be selected depending on the device under test (DUT) or test temperature so as to have a CTE similar to that of a silicon wafer.

[0100] FIG. 7 and FIG. 8 illustrate examples of a frame substrate (20) to which a probe substrate (40) is coupled. FIG. 7 illustrates a case where a probe substrate (40) is coupled to the frame substrate (20) of FIG. 3, and FIG. 8 illustrates another example in which a probe substrate (40) is coupled to the frame substrate (20). As illustrated in FIG. 1 and FIG. 2, a conductive medium (30) is inserted into an opening (20-OP) formed in the frame substrate (20), and the frame substrate (20) and the circuit board (10) can be electrically connected through the conductive medium (30). The probe substrate (40) may have a size and shape that are the same as or similar to the size of each die formed on the wafer (2). That is, the probe substrate (40) may have a size and shape corresponding to a device under test (DUT). For example, the probe substrate (40) may have a size that is about 50% to 200% of the device under test (DUT).

[0101] As shown in (a1) and (a2) of FIG. 8, the probe substrate (40) may be coupled to the frame substrate (20) so that each probe substrate (40) corresponds to one device under test (DUT). As shown in (b) of FIG. 8, the probe substrate (40) may be coupled to the frame substrate (20) so that each probe substrate (40) corresponds to multiple devices under test (DUT). As shown in (c1) and (c2) of FIG. 8, the probe substrate (40) may be coupled to the frame substrate (20) so that it corresponds to a group of devices under test (DUT). As shown in (d) of FIG. 8, the probe substrate (40) corresponding to a certain area may be coupled to the frame substrate (20).

[0102] Fig. 9 illustrates an exemplary cross-section of a frame substrate (20). The frame substrate (20) may be composed of a single layer of a metal or ceramic material, but may also be composed of multiple layers as illustrated in (a) to (c) of Figs. As illustrated in (a) of Fig. 9, the frame substrate (20) may be composed of a combination of a first layer (20A) of a metal or ceramic material and a second layer (20B) of a metal or ceramic material. As illustrated in (b) of Fig. 9, a ground layer (20GND) may be formed between the first layer (20A) and the second layer (20B). As illustrated in (c) of Fig. 9, a heater layer (20HT) for temperature control may be formed between the first layer (20A) and the second layer (20B).

[0103] A heater for controlling the temperature of the frame substrate (20) may be coupled to the frame substrate (20). The heater may be a heater rod or a heating wire coupled to the inner or outer side of the frame substrate (20). The frame substrate (20) may be deformed by heat provided from the heater. A plurality of heaters may be provided in the central region and the edge region of the frame substrate (20). For example, one heater may be provided in the central region, and a plurality of heaters may be provided in a concentric arrangement along the edge region. In addition, a plurality of heaters may be provided in a concentric arrangement in the middle region between the central region and the edge region of the frame substrate (20).

[0104] Fig. 10 illustrates an example of a probe pin member (50) coupled to a probe substrate (40). Fig. 11 is a drawing for explaining an exemplary shape of the probe pin member (50). As shown in (a) of Fig. 10, a probe pin member (50) having a shape elongated in the horizontal direction (X) may be coupled to the probe substrate (40). Alternatively, as shown in (b) of Fig. 10, a probe pin member (50) having a shape elongated in the vertical direction (Z) may be coupled to the probe substrate (40). The probe pin member (50) may have a MEMS (micro electro mechanical system) structure manufactured by a micro process similar to a semiconductor manufacturing process. The probe pin member (50) may be implemented as a two-dimensional MEMS element or a three-dimensional MEMS element. The probe pin members (50) may be arranged in a staggered manner, as shown in (c) of Fig. 9.

[0105] Fig. 11 illustrates a process of bonding a probe pin member (50) to a probe substrate (40). Referring to Fig. 11, a MEMS probe pin member (50) formed on a two-dimensional substrate can be bonded to a multi-layered ceramic (MLC) substrate. The probe pin member (50) extends in a first horizontal direction (X), and a plurality of the probe pin members (50) are bonded along a second horizontal direction (Y) perpendicular to the first horizontal direction (X) on a probe substrate (40), and includes a bonding portion (51) extending in the first horizontal direction (X) and bonded to the probe substrate (40), a vertical extension portion (52) extending from the bonding portion (51) in a vertical direction (Z) perpendicular to the first horizontal direction (X) and the second horizontal direction (Y), a horizontal extension portion (53) extending from the vertical extension portion (52) in the first horizontal direction (X), and a probe tip portion (54) protruding in the vertical direction (Z) from an end of the horizontal extension portion (53). The probe pin member (50) can be bonded by irradiating laser light while the probe pin member (50) is in contact with the MLC substrate (probe substrate (40)).

[0106] Fig. 12 illustrates an example of a method of bonding a probe pin member (50) and a probe substrate (40). Figs. 12 (a) to 12 (e) each illustrate an example of a structure in which the probe pin member (50) is bonded to the front surface (the surface that the probe plate member (50) contacts) of the probe substrate (40). The probe substrate (40) may include a ceramic layer (40C), a bonding pad (41) connected to the probe pin member (50) on the front surface of the ceramic layer (40C), a polyimide thin film layer (42) applied to a portion of the upper portion of the bonding pad (41), and a rear pad (not shown) that contacts the conductive medium (30) on the rear surface (the surface that contacts the conductive medium (30)) of the ceramic layer (40C).

[0107] Referring to (a) of Fig. 12, bonding pads (41) are arranged in a row on the front surface of the ceramic layer (40C) of the probe substrate (40), and solder balls (SB) are applied at regular intervals on the upper portions of the bonding pads (41). Meanwhile, a polyimide thin film layer (42) is applied to the space between the solder balls (SB). That is, the probe pin member (50) is bonded through the solder balls (SB) made of a solder-type bonding material applied to the bonding pads (41) of the probe substrate (40), the bonding pads (41) are metal pads that come into contact with the probe pin member (50), and a polyimide thin film layer (42) can be applied between the solder balls (SB) on the upper portions of the bonding pads (41).

[0108] Referring to (b) of Fig. 12, a via hole (VH) for electrical connection between the conductive medium (30) and the probe pin member (50) can be formed through the opposite rear-side pad in some area of ​​the bonding pad (41). The conductive medium (30) and the probe pin member (50) can be electrically connected by penetrating the ceramic layer (40C) of the probe pin member (50) through the via hole (VH). As shown in (c) of Fig. 12, the probe pin member (50) can be bonded across a plurality of bonding pads (41). As shown in (d) of Fig. 12, solder balls (SB) are applied to different areas of each bonding pad (41), so that the probe pin member (50) can be bonded to the bonding pad (41) of the probe substrate (40). As shown in (e) of Fig. 12, the probe pin member (50) can be bonded to the bonding pad (41) of the probe substrate (40) through a high temperature (e.g., 240°C) solder.

[0109] The probe pin member (50) may be composed of a nickel-boron (NiB) alloy and a gold cyanide (CyAu) material for the entire body including the joint (51), vertical extension (52), and horizontal extension (53) to improve the fatigue life of the probe pin in a high-temperature test environment, and the probe tip (55) protruding in the vertical direction (Z) from the end of the horizontal extension (53) may be composed of rhodium (Rh). That is, in the probe pin member (50), the joint (51), the vertical extension (52), and the horizontal extension (53) may include a nickel-boron (NiB) alloy and a gold cyanide (CyAu) material, and the probe tip (54) may include a rhodium (Rh) material.

[0110] When a plurality of probe pin members (50) are bonded to the entire surface of the probe substrate (40), the bonding material is bonded to the probe substrate (40) by solder for mechanical and electrical bonding, and specifically, the bonding material for improving solder fatigue life in a high-temperature test environment may be composed of a gold-tin (AuSn) alloy, a tin-antimony (SnSb) alloy, etc. That is, a plurality of probe pin members (50) are bonded to the probe substrate (40) by a solder-type bonding material, and the bonding material may include a gold-tin (AuSn) alloy. In addition, the shape of the probe pin members (50) on the probe substrate (40) may be one and the same shape, or for high integration, various types having the same mechanical performance but different shapes may be bonded to form a composite configuration on the probe substrate (40).

[0111] The pad on the upper surface of the probe substrate (40) that is bonded to the probe pin member (50) through solder, which is a bonding material, has a lower bonding strength as it becomes more concentrated, and is more vulnerable, especially at high temperatures. To improve this problem, only a part where the solder ball (SB), the metal bonding pad (41), and the probe pin member (50) are bonded may be exposed, and the remaining area may be covered with a polyimide thin film layer (42). Alternatively, the bonding strength of the bonding pad (41) may be increased by connecting the two bonding pads (41) with vias, and additionally, even if the bonding pad (41) falls off, a repair bonding pad (41) identical to the one below may be provided.

[0112] Alternatively, a staggered method that effectively utilizes small-scale jetting of AuSn with high bonding strength to reduce the solder area of ​​the basic probe joint (51) can be used to expand the width of the pad, which is a weak direction in terms of bonding strength, thereby forming a bonding pad that maintains high-temperature high integration and bonding strength.

[0113] In the process of bonding an individual probe pin member (50) to a probe substrate (40), solder, which is a bonding material, can be applied to the upper surface of a bonding pad (41) on the upper surface of the probe substrate (40) in the form of balls of several tens of micrometers in a certain size. The solder is applied to each individual mounting position in units of the quantified balls. The amount of solder ball (SB) applied is calculated by considering the size of the bonding portion (51) on the probe pin member (50), the size of the bonding pad (41) on the upper surface of the probe substrate (40), and the solder fillet height.

[0114] Fig. 13 (a) illustrates an example of a process in which a probe pin member (50) is bonded to a probe substrate (40) via laser light (L). A pick and place device (PP) grips the probe pin member (50) and positions it at a specific position on the upper surface of the bonding pad (41), and irradiates heat or laser light (L) to the joint portion (51) of the probe pin member (50) and the solder (SD) applied to the upper end of the bonding pad (41), thereby bonding the probe substrate (40) and the probe pin member (50). In Fig. 13, a fan-out via is formed on one side of the bonding pad (41). In Fig. 13 (b), when the position of the probe pin member bonded to the probe substrate is incorrect, the probe pin member is separated from the probe substrate by irradiating heat or light to the bonding material of the probe pin member at the position where the probe pin member needs to be replaced so that the solder of the bonding material melts, and then another probe pin member is replaced and bonded to the position of the probe pin separated from the probe substrate.

[0115] FIG. 14 and FIG. 15 illustrate an example of a method of arranging a probe pin member coupled to a probe substrate. Referring to FIG. 14, a probe pin member (50) is coupled to a probe substrate (40) and includes a joint portion (51) formed in a horizontal direction (X), a vertical extension portion (52) extending in a vertical direction (Z) from the joint portion (51), a horizontal extension portion (53) bent in the horizontal direction (X) from the vertical extension portion (52), and a probe tip portion (54) protruding in the vertical direction (Z) from the horizontal extension portion (53). As shown in (a) of FIG. 14, the probe pin member (50) may be coupled to the probe substrate (40) in a form in which the joint portions (51) are adjacent to each other in the central region of the probe substrate (40). At this time, the arrangement of the probe pin member (50) may be positioned within the region of the probe substrate (40) as shown in (a) of FIG. 15. Alternatively, as shown in (b) of FIG. 14, the probe pin member (50) may be coupled to the probe substrate (40) in a form in which the joint (51) is coupled to the edge area of ​​the probe substrate (40) and the vertical extension (52) protrudes outward. The form in which the probe pin member (50) is coupled to the probe substrate (40) may be determined according to the arrangement and spacing of the electrodes. At this time, as shown in (b) of FIG. 15, a part of the probe pin member (50) may protrude outside the area of ​​the probe substrate (40).

[0116] As a result, the entire probe pin member (50) may be positioned inside the probe substrate (40), or the joint portion (51) or the probe tip portion (54) of some of the probe pin members (50) may be positioned outside the probe substrate (40). That is, the probe pin member (50) may be coupled to the probe substrate (40) such that only a portion (half-overlapping shape) of the vertical extension portion (52) is positioned outside the probe substrate (40), or the vertical extension portion (52) is positioned inside the probe substrate (40) and the probe tip portion (54) is positioned outside the probe substrate (40).

[0117] FIG. 16 and FIG. 17 illustrate another example of the arrangement of the probe pin member (50) coupled to the probe substrate (40). As shown in (a) of FIG. 16, the probe pin member (50) may be coupled to the probe substrate (40) in a range where the probe tip is positioned toward the outside of the probe substrate (40) and located within the area of ​​the probe substrate (40). At this time, as shown in (a) of FIG. 17, the probe pin member (50) may be arranged at various angles and in a circle within the area of ​​the probe substrate (40). Alternatively, as shown in (b) of FIG. 16, the probe pin member (50) may be coupled to the probe substrate (40) in a range where the probe tip is positioned outside of the probe substrate (40) and located outside the area of ​​the probe substrate (40). At this time, as shown in (b) of Fig. 17, the probe pin member (50) can be arranged at various angles and in a circular manner with a part of the probe pin member (50) protruding outside the area of ​​the probe substrate (40).

[0118] Fig. 18 is a flowchart showing a method for manufacturing a probe card assembly (1). The method for manufacturing a probe card assembly (1) according to the present invention includes a step (S1810) of cutting a base substrate (BP) into die units to form a probe substrate (40), a step (S1820) of mounting a probe substrate joining member (70) on the probe substrate (40), a step (S1830) of fixing the probe substrate (40) to the frame substrate (20) via the probe substrate joining member (70), a step (S1840) of bonding a probe pin member (50) to the probe substrate (40), a step (S1850) of connecting the probe substrate (40) and the circuit board (10) via a conductive medium (30), and a step (S1860) of bonding a reinforcing member (60) to the circuit board (10) and the frame substrate (20) via a flatness adjustment screw (80).

[0119] Referring to FIG. 19, in step S1810, a base substrate (BP) is cut into individual unit sizes to prepare a probe substrate (40) ((a), (b) of FIG. 19). In step S1820, a probe substrate joining member (70) is fixedly mounted on the probe substrate (40) ((c) of FIG. 19). The probe substrate joining member (70) may be composed of an alloy material (AuSn) of gold (Au) and tin (Sn).

[0120] In step S1830, the probe substrate (40) is coupled to the frame substrate (20) via the probe substrate coupling member (70). As shown in (d) of FIG. 19, a fastening hole into which the probe substrate coupling member (70) can be inserted is formed around the opening (20-OP) of the frame substrate (20), and grooves for fastening the probe substrate coupling member (70) are formed at both ends of the hole. When the probe substrate coupling member (70) is inserted into the fastening hole of the frame substrate (20), an epoxy material coupling material (EP1) for temporary bonding is applied to the edge of the probe substrate (40). As shown in (e) of FIG. 19, an epoxy material coupling material (EP2) is applied to the groove on the opposite side of the probe substrate (40) in the frame substrate (20) so that the probe substrate coupling member (70) is fixed to the frame substrate (20).

[0121] In step S1840, the probe pin member (50) is bonded to the probe substrate (40). As illustrated in (f) of FIG. 19, the probe pin member (50) and other components may be attached to the probe substrate (40). Thereafter, in step S1850, a conductive medium (30) is mounted in the opening (20-OP) of the frame substrate (20), and the probe substrate (40) and the circuit board (10) are connected through the conductive medium (30) ((g) of FIG. 19). In step S1860, a reinforcing member (60) is bonded to the circuit board (10) and the frame substrate (20) through a flatness adjustment screw (80), thereby manufacturing a probe card assembly (1) having the same shape as FIGS. 1 and 2.

[0122] The step (S1840) of bonding the probe pin member (50) to the probe substrate (40) may include a step of applying a solder-type bonding material in the form of balls having a diameter of 10 to 100 micrometers to the probe substrate (40) (see FIG. 12), a step of positioning the probe pin member (50) on the probe substrate (40) using a pick-and-place device (PP) (see FIG. 13), and a step of fixing the probe pin member (50) to the probe substrate (40) by irradiating heat or light (L) while the probe pin member (50) is in contact with the probe substrate (40).

[0123] The step of fixing the probe substrate (40) to the frame substrate (20) may include a step of first fixing the probe substrate (40) to the frame substrate (20) by irradiating light (L) with a bonding material, and a step of secondarily fixing the probe substrate (40) to the frame substrate (20) by applying heat with a bonding material.

[0124] As in the present invention, after the base substrate (BP) is cut into individual probe units to manufacture the probe substrate (40), the probe pin member (50) is bonded to the probe substrate (40). In general, when the probe pin member (50) is bonded to the base substrate (BP) and then the base substrate (BP) is cut, there is a possibility that the alignment of the probe pin member (50) may be misaligned during the cutting process of the base substrate (BP). As in the present invention, by cutting the base substrate (BP) to form the probe substrate (40) and then bonding the probe pin member (50) to the probe substrate (40), a probe card assembly (1) having a constant shape in which the gaps between the probe pin members (50) are aligned can be manufactured.

[0125] Fig. 20 illustrates another example of the manufacturing process of the probe card assembly (1). Compared to Fig. 19, as shown in (d) of Fig. 20, a press-fit sleeve (72) is coupled to a groove on the opposite side of a probe substrate (40) in a frame substrate (20), and as shown in (e) of Fig. 20, a probe substrate joining member (70) is inserted into a fastening hole of the frame substrate (20), and then, as shown in (f) of Fig. 20, solder (SLD) is hardened between the press-fit sleeve (72) and the probe substrate joining member (70), thereby fixing the press-fit sleeve (72) and the probe substrate joining member (70). Other processes can be performed in the same manner as in Fig. 19.

[0126] Fig. 21 illustrates an example of a method of joining a probe pin member (50), a probe substrate (40), and a frame substrate (20). As shown in (a) of Fig. 21, a probe pin member (50) is joined to a probe substrate (40), and a frame substrate (20) with a probe substrate joining member (70) mounted thereon can be joined to the probe substrate (40) via a bonding material (EP1).

[0127] As shown in (b) of Fig. 21, when a probe pin member (50) and a probe board joining member (70) are fixedly mounted on both sides of a probe board (40) and the probe board joining member (70) is inserted into a frame board (20), the probe board (40) and the frame board (20) can be fixed to each other via a bonding material (EP1). As another example, as shown in (c) of Fig. 21, the probe pin member (50) can be joined to the probe board (40) in a state where the probe board (40) is fixed to the frame board (20) via a probe board joining member (70) and a bonding material (EP1). As another example, as shown in (d) of Fig. 21, the probe pin member (50) can be joined to the probe board (40) in a state where the probe board joining member (70) is inserted, and the probe board (40) can be fixed to the frame board (20) via a bonding material (EP1). In addition to this, various manufacturing methods can be applied.

[0128] Fig. 22 is a drawing showing the structure of a probe card assembly (1) in which probe pin members (50) are arranged. According to the present invention, the probe pin members (50) may be a two-dimensional MEMS (micro-electro-mechanical system) structure patterned from a metal plate. The probe pin members (50) are two-dimensional structures having a certain shape. The probe pin members (50) can be manufactured through a two-dimensional patterning process on a metal plate.

[0129] As illustrated in FIG. 22, a probe pin array composed of a plurality of probe pin members (50) having the same shape or mechanical performance but different shapes can be bonded side by side to a probe substrate (40). Two probe pin arrays can be bonded to one probe substrate (40), and each probe pin array can be bonded in a shape symmetrical to each other. When the probe pin member (50) has a shape extending in a first horizontal direction (X direction), a plurality of probe pin members (50) can be bonded along a second horizontal direction (Y direction) perpendicular to the first horizontal direction (X direction) on the probe substrate (40). A plurality of probe pin members (50) arranged in parallel along the second horizontal direction (Y direction) form one probe pin array, and a plurality of probe pin members (50) arranged in an opposite position and arranged in parallel along the second horizontal direction (Y) form another probe pin array, and two probe pin arrays can be bonded to one probe substrate (40).

[0130] The probe pin member (50) includes a joint portion (51) extending in a first horizontal direction (X direction) and bonded to a probe substrate (40), a vertical extension portion (52) extending from the joint portion (51) in a vertical direction (Z direction) perpendicular to the first horizontal direction (X direction) and the second horizontal direction (Y direction), a horizontal extension portion (53) extending from the vertical extension portion (52) in the first horizontal direction (X direction), and a probe tip portion (54) protruding in the vertical direction (Z direction) from the end of the horizontal extension portion (53). As illustrated in FIG. 22, the joint portion (51) of the probe pin member (50) is bonded to the probe substrate (40) in the first horizontal direction (X direction), and a shape similar to the letter 'ㄷ' and having mechanical elasticity is formed through the vertical extension portion (52) and the horizontal extension portion (53), and the probe tip portion (54) is formed at the end to contact a terminal of a wafer to be inspected. As a result, the overall probe pin density can be determined by the probe pin array size and area rather than the probe substrate (40), which is advantageous for high integration.

[0131] FIG. 23 is a drawing showing the process of bonding a probe pin member (50) to a probe substrate. Referring to FIG. 23, the probe tip portion (54) of the probe pin member (50) is bonded in a posture in which it protrudes outwardly from the probe substrate (40), contrary to that shown in FIGS. 1 and 2. Referring to FIG. 23, a probe substrate (40) having a shorter length in the first horizontal direction (X direction) than that of FIGS. 1 and 2 is applied. In FIG. 23, the probe pin member (50) is bonded to the probe substrate (40) so that the vertical extension portion (52) of the probe pin member (50) is positioned on the inner side of the probe substrate (40) and the probe tip portion (54) is positioned on the outer side of the probe substrate (40). When the probe pin member (50) is bonded to the probe substrate (40) in a state in which the probe substrate (40) is bonded to the frame substrate (20) as shown in FIG. 23, it is possible to accommodate various electrode arrangements of a wafer to be inspected. In addition, the method of manufacturing the probe card assembly (1) in module units in which the probe substrate (40) and the probe pin member (50) are joined requires separately removing unnecessary probe pin members (50) from the edge area of ​​the wafer to be inspected or manufacturing multiple types of module units, but in the case where the probe pin member (50) is joined to the probe substrate (40) in a state where the probe substrate (40) is joined to the frame substrate (20) as shown in FIG. 23, the probe pin member (50) only needs to be joined to the necessary part of the probe substrate (40) in the edge area, so the probe card assembly (1) can be manufactured more efficiently.In addition, in the method of manufacturing the probe card assembly (1) in module units in which the probe substrate (40) and the probe pin member (50) are joined, there is a limitation in the equipment handling space for joining the module units, but in the case of joining the probe pin member (50) to the probe substrate (40) in a state in which the probe substrate (40) is joined to the frame substrate (20) as shown in FIG. 23, the probe substrate (40) without the probe pin member (50) can be first attached to the frame substrate (20), so the limitation in the equipment handling space is eliminated.

[0132] Meanwhile, according to an embodiment of the present invention, the probe substrate (40) can be attached to the frame substrate (20) by a bonding material (100) made of epoxy. Epoxy is a thermosetting polymer composed of epoxide resin and a hardener (or curing agent). Epoxy can strongly adhere to various materials (metal, wood, glass, fiber-reinforced plastic, etc.), has high chemical resistance, high mechanical strength and durability after curing, and high electrical insulation and heat resistance, so that it can be utilized for bonding between the probe substrate (40) and the frame substrate (20). In particular, it is preferable that the bonding material (100) made of epoxy has rigidity in the vertical direction (Z direction) while allowing flexibility in the first and second horizontal directions (X and Y directions) between the probe substrate (40) and the frame substrate (20).

[0133] In bonding a probe substrate (40) and a frame substrate (20) using a bonding material (100) made of an epoxy material, the distance between the bonding materials (100), the application height of the bonding material (100), and the application area of ​​the bonding material (100) can be determined by considering the size and spacing between electrodes on the wafer to be inspected, the thermal change rate of the wafer to be inspected, the thermal change rate of the probe substrate (40) and the frame substrate (20), etc. In addition, an epoxy material that satisfies the above-described conditions of the temperature-dependent shear stress coefficient of the epoxy constituting the bonding material (100), the temperature-dependent shear strength, the temperature-dependent tensile strength, the glass transition temperature (Tg) and melting temperature (Tm) (Tg < Tm) of the epoxy, and the CTE (coefficient of thermal expansion) of the epoxy can be used as the bonding material (100).

[0134] Fig. 24 illustrates an example of a structure in which a probe substrate (40) and a frame substrate (20) are bonded together through a bonding material (100). As illustrated in (a) to (f) of Fig. 24, a probe substrate (40) is bonded around each opening (20-OP) of the frame substrate (20). The probe substrate (40) can be bonded to the frame substrate (20) by a bonding material (100) made of an epoxy material. The opening (20-OP) of the frame substrate (20) has a size and shape corresponding to the size and shape of a device under test (DUT). The probe substrate (40) has a size and shape corresponding to the device under test (DUT) and may include a polyimide thin film layer formed on a multilayer ceramic substrate (MLC substrate).

[0135] As illustrated in (a) of Fig. 24, a bonding material (100) is attached along the edge periphery of the probe substrate. A plurality of bonding materials (100) may be attached spaced apart along the edge periphery of the probe substrate (40). The size of the bonding materials (100) and the gap between the bonding materials (100) may be set in consideration of the force generated when the probe pin member (50) presses the element to be inspected, the force exerted by the upper and lower conductive media (30), and deformation due to heat.

[0136] As shown in (b) of Fig. 24, a central connecting portion (20-CP) is formed along the first horizontal direction (X direction) at the center of the opening (20-OP) of the frame substrate (20), and a bonding material (100) can be applied to the central connecting portion (20-CP). The bonding material (100) can be attached to the upper and lower sides of the edge of the probe substrate (40) and the central connecting portion (20-CP) extending in a straight line across the center from the side of the opening (20-OP) in the frame substrate (20).

[0137] Meanwhile, a separation prevention screw (200) that prevents the probe substrate (40) from being separated from the frame substrate (20) may be coupled between the probe substrate (40) and the frame substrate (20). The separation prevention screw (200) is simply to prevent the probe substrate (40) from being completely separated from the frame substrate (20).

[0138] As shown in (c) of Fig. 24, a bonding material (100) is attached along the edge of the probe substrate (40), and anti-separation screws (200) can be coupled as a pair at positions facing each other in a straight direction on the probe substrate (40). Referring to (c) of Fig. 24, a bonding material (100) is applied to the corners of the upper edge region and the lower edge region of the probe substrate (40), a bonding material (100) is applied in a straight line to the left edge region and the right edge region of the probe substrate (40), and anti-separation screws (200) can be coupled to the center of the upper edge region and the center of the lower edge region of the probe substrate (40), respectively.

[0139] As shown in (d) of Fig. 24, a bonding material (100) is attached along the edge of the probe substrate (40), and anti-separation screws (200) can be coupled in pairs at positions diagonally opposite to each other on the probe substrate (40). Referring to (d) of Fig. 24, a bonding material (100) is applied to the corners of the upper right edge region and the lower left edge region of the probe substrate (40), a bonding material (100) is applied in a straight line to the left edge region and the right edge region of the probe substrate (40), and anti-separation screws (200) can be coupled to the upper left edge and the lower right edge of the probe substrate (40), respectively.

[0140] As shown in (e) of Fig. 24, the bonding material (100) is attached to a central connecting portion (20-CP) extending in a straight line across the center from the side of the opening (20-OP) in the frame substrate (20), and anti-separation screws (200) can be coupled in a pair at positions facing each other in a straight direction on the probe substrate (40). Referring to (e) of Fig. 24, the bonding material (100) is attached to a central connecting portion (20-CP) extending in a straight line across the center from the side of the opening (20-OP) in the frame substrate (20), and anti-separation screws (200) can be coupled to the center of the upper edge and the center of the lower edge of the probe substrate (40), respectively.

[0141] As shown in (f) of FIG. 24, the bonding material (100) is attached to the edge corners of the probe substrate (40) and the center connecting portions (20-CP) extending in a straight line across the center from the side of the opening (20-OP) in the frame substrate (20), and the anti-separation screws (200) can be coupled in pairs at positions facing each other in a straight direction in the probe substrate (40). Referring to (e) of FIG. 24, the bonding material (100) is applied to four edge corners of the probe substrate (40), and is attached to the center connecting portions (20-CP) extending in a straight line across the center from the side of the opening (20-OP) in the frame substrate (20), and the anti-separation screws (200) can be coupled to the center of the upper edge and the center of the lower edge of the probe substrate (40), respectively.

[0142] Fig. 25 illustrates a cross-section taken along line AA' in Fig. 24 (a). Referring to Fig. 25, a probe substrate (40) is bonded to the upper portion of a frame substrate (20) in which an opening (20-OP) is formed via a bonding material (100). A probe pin member (50) is bonded to the upper surface of the probe substrate (40). A bonding pad (40P) for bonding with the bonding material (100) is formed on the edge of the lower surface of the probe substrate (40).

[0143] Fig. 26 illustrates a cross-section of a portion BB' in (d) of Fig. 24. Referring to Fig. 26, a probe substrate (40) is joined to the upper portion of a frame substrate (20) in which an opening (20-OP) is formed via a bonding material (100) and a detachment prevention screw (200). A probe pin member (50) is joined to the upper surface of the probe substrate (40). A bonding pad (40P) is formed at a portion of the lower surface edge of the probe substrate (40) that is in contact with the bonding material (100).

[0144] Fig. 27 illustrates a cross-section of the CC' portion in (e) of Fig. 23. Referring to Fig. 26, a probe substrate (40) is coupled to the upper portion of a frame substrate (20) in which an opening (20-OP) is formed via a bonding material (100) and a detachment prevention screw (200). A bonding material (100) is attached to the upper portion of a central connecting portion (20-CP) extending in a straight line across the center from the side of the opening (20-OP) in the frame substrate (20), and a detachment prevention screw (200) is coupled to the probe substrate (40) and the frame substrate (20) at an edge portion of the frame substrate (20). A bonding pad (40P) is formed at a portion of the lower surface of the probe substrate (40) that is bonded to the bonding material (100) at the center.

[0145] Fig. 28 illustrates an example of a bonding structure using a detachment prevention screw (200). The detachment prevention screw (200) is a component that serves to keep the probe substrate (40) from being detached from the frame substrate (20) when the bonding strength of the bonding material (100) is weakened due to long-term use. The detachment prevention screw (200) can be joined to the lower surface of the probe substrate (40) while being inserted and fastened to the frame substrate (20) as shown in (a) of Fig. 27. The detachment prevention screw (200) can have a flange that passes through the through-hole of the probe substrate (40) and is fixed to the upper surface of the probe substrate (40) while being inserted and fastened to the frame substrate (20) as shown in (b) of Fig. 27. The detachment prevention screw (200) can have a flange that is joined to the lower surface of the probe substrate (40) while being inserted and fastened to the frame substrate (20) as shown in (c) of Fig. 27. The anti-separation screw (200) may have a catch that catches on the edge while protruding outward from the probe substrate (40) when inserted and fastened to the frame substrate (20), as shown in (d) of FIG. 27. The anti-separation screw (200) may be configured as a double screw having a lower screw having a receiving hole inserted and fastened to the frame substrate (20), as shown in (e) of FIG. 27, and an upper screw having a portion inserted into the receiving hole of the lower screw and a flange coupled to the lower surface of the probe substrate (40). The anti-separation screw (200) may be configured as a double screw including an upper screw having a receiving hole coupled to the lower surface of the probe substrate (40), and a lower screw having a portion inserted into the receiving hole of the upper screw when inserted and fastened to the frame substrate (20), as shown in (f) of FIG.

[0146] Fig. 29 is a flowchart showing a method for manufacturing a probe card assembly (1) having a structure in which a probe substrate (40) and a frame substrate (20) are joined through a bonding material (100). The method for manufacturing a probe card assembly (1) according to the present invention includes a step (S2910) of cutting a base substrate into die units to form a probe substrate (40), a step (S2920) of fixing the probe substrate (40) to the frame substrate (20) through a bonding material (100), a step (S2930) of joining a probe pin member (50) to the probe substrate (40), a step (S2940) of connecting the probe substrate (40) and the circuit board (10) through a conductive medium (30), and a step (S2950) of joining a reinforcing member (60) to the circuit board (10) and the frame substrate (20) through a flatness adjustment screw (80).

[0147] Fig. 30 shows an example of a manufacturing process of a probe card assembly (1) having a structure in which a probe substrate (40) and a frame substrate (20) are bonded through a bonding material (100). As illustrated in (a) of Fig. 30, after the frame substrate (20) and the probe substrate (40) are bonded through the bonding material (100), a probe pin member (50) is bonded to the probe substrate (40). In the process in which the frame substrate (20) and the probe substrate (40) are bonded through the bonding material (100), light energy and heat energy may be applied to harden the bonding material (100) of an epoxy material. By irradiating light onto the bonding material (100) by a light source (1100) located below the frame substrate (20), the surface of the bonding material (100) is hardened, through which the bonding position of the frame substrate (20) and the probe substrate (40) can be determined. Thereafter, heat is applied to the bonding material (100) by a heat source (or heater) (1200) so that the frame substrate (20) and the probe substrate (40) can be completely bonded, thereby hardening the entire bonding material (100), and thus the frame substrate (20) and the probe substrate (40) are completely bonded.

[0148] That is, the step of fixing the probe substrate (40) to the frame substrate (20) through the bonding material (100) may include a step of first fixing the probe substrate (40) to the frame substrate (20) by irradiating light with the bonding material (100), and a step of secondarily fixing the probe substrate (40) to the frame substrate (20) by applying heat with the bonding material (100).

[0149] As illustrated in (b) of FIG. 30, the probe pin member (50) may be first bonded to the probe substrate (40), and then the frame substrate (20) and the probe substrate (40) may be bonded through the bonding material (100). At this time, light is irradiated to the bonding material (100) by a light source (1100) located below the frame substrate (20), thereby hardening the surface of the bonding material (100), and thereby the bonding position of the frame substrate (20) and the probe substrate (40) may be determined. Thereafter, heat is applied to the bonding material (100) by a heat source (or heater) (1200) so that the frame substrate (20) and the probe substrate (40) can be completely bonded, thereby hardening the entire bonding material (100), and thus the frame substrate (20) and the probe substrate (40) are completely bonded.

[0150] Fig. 31 illustrates an example of a structure in which a probe substrate (40) and a frame substrate (20) are coupled through a probe substrate coupling member (70). As illustrated in Figs. 1 and 2, the probe substrate (40) and the frame substrate (20) can be coupled by a probe substrate coupling member (70) corresponding to a mechanical fixing mechanism. Similarly to what was described above, a separation prevention screw (200) for preventing the probe substrate (40) from being detached from the frame substrate (20) together with the probe substrate coupling member (70) can be coupled together with the probe substrate coupling member (70). The manufacturing process of the probe card assembly (1) according to the present embodiment can be performed in a similar manner to that described through Fig. 11.

[0151] Referring to (a) of FIG. 31, the probe substrate joining member (70) is joined to a central connecting portion (20-CP) extending in a straight line across the center of the probe substrate (40) and the side of the opening (20-OP) in the frame substrate (20), and the anti-separation screws (200) can be joined as a pair at positions facing each other in a straight direction on the probe substrate (40). In (a) of FIG. 31, the central connecting portions (20-CP) extending in a straight line across the center of the probe substrate (40) and the side of the opening (20-OP) in the frame substrate (20) are joined by the probe substrate joining member (70), and the anti-separation screws (200) can be joined to the center of the upper and lower edges of the probe substrate (40) and the upper and lower sides of the opening (20-OP) of the frame substrate (20), respectively.

[0152] Referring to (b) of Fig. 31, the probe substrate joining member (70) can be joined to the edge corner of the probe substrate (40). In (b) of Fig. 31, the probe substrate (40) and the frame substrate (20) can be fixed by joining the probe substrate joining member (70) to the upper left, upper right, lower left, and lower right of the probe substrate (40), respectively.

[0153] Fig. 32 illustrates a cross-section taken along line AA' in Fig. 31 (b). Referring to Fig. 32, a probe substrate joining member (70) is inserted and mounted into a frame substrate (20) having an opening (20-OP) formed therein, and the probe substrate joining member (70) is bonded to the rear surface of the probe substrate (40). That is, the probe substrate joining member (70) is bonded to the rear surface of the probe substrate (40) and is fastened to the fastening hole of the frame substrate (20). A bonding pad (40P) for bonding with a bonding material (100) is formed at the edge of the lower surface of the probe substrate (40). The probe substrate joining member (70) can be bonded to the rear surface of the probe substrate (40) by solder (SD).

[0154] Referring to (c) of Fig. 31, the probe substrate joining member (70) is provided as a double coupling screw (400), and the double coupling screw (400) can be joined to the edge corner of the probe substrate (40). In (c) of Fig. 31, the probe substrate (40) and the frame substrate (20) can be fixed by joining the double coupling screws (400) to the upper left, upper right, lower left, and lower right of the probe substrate (40), respectively.

[0155] Fig. 33 shows a cross-section of the BB' portion in (c) of Fig. 31. The double-joint screw (400) includes an upper screw (410) that is solder-joined to the back surface of the probe substrate (40) and a lower screw (420) that is fixed to the frame substrate (20) and is coupled with the upper screw (410). Referring to Fig. 26, the lower screw (420) is inserted and mounted into the frame substrate (20) in which an opening (20-OP) is formed, and the upper screw (410) is coupled to the back surface of the probe substrate (40). That is, the upper screw (410) is coupled to the back surface of the probe substrate (40), the lower screw (420) is coupled to the fastening hole of the frame substrate (20), and the frame substrate (20) and the probe substrate (40) are fixed by the coupling of the upper screw (410) and the lower screw (420). A bonding pad (40P) for bonding with a bonding material (100) is formed on the lower edge of the probe substrate (40). The upper screw (410) can be bonded to the rear surface of the probe substrate (40) by solder (SD).

[0156] Fig. 34 illustrates an example of a structure in which a probe substrate (40) and a frame substrate (20) are joined together through a probe substrate joining member (70) and a joining material (100) made of an epoxy material. As illustrated in Fig. 34, a joining material (100) made of an epoxy material for fixing the probe substrate (40), the probe substrate joining member (70), and the frame substrate (20) can be attached. The probe substrate joining member (70) is inserted and mounted into a frame substrate (20) in which an opening (20-OP) is formed, and the probe substrate joining member (70) is joined to the rear surface of the probe substrate (40). That is, the probe substrate joining member (70) is joined to the rear surface of the probe substrate (40) and joined to the fastening hole of the frame substrate (20). A joining pad (40P) for bonding with the joining material (100) is formed on an edge of the lower surface of the probe substrate (40). The probe substrate joining member (70) can be joined to the back surface of the probe substrate (40) by solder (SD). Additionally, a joining material (100) can be applied to the outside of the probe substrate joining member (70), thereby firmly joining the probe substrate (40) and the frame substrate (20).

[0157] Figure 35 shows a manufacturing process of a probe card assembly (1) in which a probe substrate (40) and a frame substrate (20) are joined through a probe substrate joining member (70) and an epoxy material joining material (100).

[0158] As shown in (a) of Fig. 35, a probe pin member (50) is coupled to a probe substrate (40), and a frame substrate (20) equipped with a probe substrate coupling member (70) can be coupled to the probe substrate (40) via a bonding material (100). At this time, light energy and heat energy can be applied to harden the bonding material (100) of epoxy material. By irradiating light onto the bonding material (100) by a light source (1100) located at the bottom of the frame substrate (20), the surface of the bonding material (100) is hardened, and thereafter, by applying heat to the bonding material (100) by a heat source (1200), the entire bonding material (100) can be hardened.

[0159] As shown in (b) of FIG. 35, when a probe pin member (50) and a probe board joining member (70) are fixedly mounted on both sides of a probe board (40) and the probe board joining member (70) is inserted into a frame board (20), the probe board (40) and the frame board (20) can be fixed to each other through a joining material (100). As another example, as shown in (c) of FIG. 35, in a state where the probe board (40) is fixed to the frame board (20) through the probe board joining member (70) and the joining material (100), the probe pin member (50) can be bonded to the probe board (40). As another example, as shown in (d) of FIG. 35, in a state where the probe pin member (50) is bonded to the probe board (40), the probe board (40) can be fixed to the frame board (20) into which the probe board joining member (70) is inserted through a joining material (100). Similarly, in (b) to (d) of Fig. 35, light is irradiated to the bonding material (100) by a light source (1100) located at the bottom of the frame substrate (20), thereby hardening the surface of the bonding material (100), and then heat is applied to the bonding material (100) by a heat source (1200), thereby hardening the entire bonding material (100).

[0160] According to an embodiment of the present invention, the method for manufacturing a probe card assembly (1) may further include a step of replacing the probe pin member (50) when the position of the probe pin member (50) bonded to the probe substrate (40) is incorrect.

[0161] The step of replacing a probe pin includes a step of detaching the probe pin member from the probe substrate by irradiating heat or light to the bonding material of the probe pin member (50) at the position requiring replacement so that the solder of the bonding material melts, and a step of attaching another probe pin member to the position of the probe pin member (50) detached from the probe substrate (40).

[0162] The present embodiments and drawings attached to the present specification only clearly illustrate a part of the technical idea included in the present invention, and it will be obvious that all modified examples and specific embodiments that can be easily inferred by a person skilled in the art within the scope of the technical idea included in the specification and drawings of the present invention are included in the scope of the rights of the present invention.

[0163] Therefore, the idea of ​​the present invention should not be limited to the described embodiments, and all things that are equivalent or equivalent to the claims described below as well as the claims are considered to fall within the scope of the idea of ​​the present invention.

Claims

1. A circuit board to which signals for electrical inspection of the target element are applied; A frame substrate bonded to one side of the circuit board and having a plurality of openings formed therein; A conductive medium provided in the above opening and electrically connected to the circuit board; a probe substrate coupled to the above-mentioned challenge medium; and Including a probe pin member coupled to the opposite side of the conductive medium on the probe substrate, The above probe substrate is bonded to the frame substrate through a bonding material of epoxy material, The above frame substrate is composed of a ceramic or metal material having a coefficient of thermal expansion (CTE) of less than 1.5 ppm / K, A probe card assembly in which the probe substrate has a size and shape corresponding to the inspection target element, and the mechanical position is determined by the frame substrate.

2. In paragraph 1, A probe card assembly in which a plurality of the above bonding materials are spaced apart and attached along the edge perimeter of the above probe substrate.

3. In paragraph 1, A probe card assembly wherein the bonding material is attached to a central connecting portion extending in a straight line across the center of the probe substrate on both sides of the edge of the probe substrate and the side of the opening in the frame substrate.

4. In paragraph 1, A probe card assembly in which a separation prevention screw that prevents the probe substrate from being separated from the frame substrate is coupled between the probe substrate and the frame substrate.

5. In paragraph 4, The above bonding material is attached along the edge of the probe substrate, The above anti-separation screws are a probe card assembly that is joined in pairs at positions that are opposite to each other in a straight direction on the probe substrate.

6. In paragraph 4, The above bonding material is attached to a central connecting portion extending in a straight line across the center from the side of the opening in the frame substrate, The above anti-separation screws are a probe card assembly that is joined in pairs at positions that are opposite to each other in a straight direction on the probe substrate.

7. In paragraph 4, The above bonding material is attached to a central connecting portion extending in a straight line across the center from the edge corner of the probe substrate and the side of the opening in the frame substrate, The above anti-separation screws are a probe card assembly that is joined in pairs at positions that are opposite to each other in a straight direction on the probe substrate.

8. In the manufacturing method of the probe card assembly according to Article 1, A step of forming the probe substrate by cutting the base substrate into die units; A step of fixing the probe substrate to the frame substrate through the bonding material; A step of bonding the probe pin member to the probe substrate; A step of connecting the probe substrate and the circuit substrate through the challenge medium; and A method for manufacturing a probe card assembly, comprising the step of bonding a reinforcing member to the circuit board and the frame board via a flatness adjustment screw.

9. In paragraph 8, The step of fixing the probe substrate to the frame substrate through the bonding material is: A step of first fixing the probe substrate to the frame substrate by irradiating light with the above bonding material; and A method for manufacturing a probe card assembly, comprising the step of secondarily fixing the probe substrate to the frame substrate by applying heat to the bonding material.

10. Circuit board to which signals for electrical inspection of the target element are applied; A frame substrate bonded to one side of the circuit board and having a plurality of openings formed therein; A conductive medium provided in the above opening and electrically connected to the circuit board; a probe substrate coupled to the above-mentioned challenge medium; and Including a probe pin member coupled to the opposite side of the conductive medium on the probe substrate, The above probe substrate is coupled to the frame substrate through a probe substrate coupling member, The above frame substrate is composed of a ceramic or metal material having a coefficient of thermal expansion (CTE) of less than 1.5 ppm / K, A probe card assembly in which the probe substrate has a size and shape corresponding to the inspection target element, and the mechanical position is determined by the frame substrate.

11. In paragraph 10, A probe card assembly in which the probe substrate joining member is joined to the rear surface of the probe substrate and is joined to the fastening hole of the frame substrate.

12. In paragraph 11, The probe board joining member is a probe card assembly that is joined to the back of the probe board by solder.

13. In paragraph 10, The probe board joining member is a probe card assembly joined to an edge corner of the probe board.

14. In paragraph 10, The above probe substrate bonding member is provided with a double bonding screw, A probe card assembly comprising a double-joint screw, the upper screw being soldered to the rear surface of the probe substrate and a lower screw being fixed to the frame substrate and coupled with the upper screw.

15. In paragraph 10, A probe card assembly to which an epoxy material bonding material for fixing the probe substrate, the probe substrate bonding member, and the frame substrate are attached.

16. In paragraph 10, The probe substrate joining member is joined to a central connecting portion extending in a straight line across the central portion of the probe substrate and the side of the opening in the frame substrate, A probe card assembly in which a pair of anti-separation screws are coupled at opposite positions in a straight direction on the probe substrate to prevent the probe substrate from separating from the frame substrate.

17. In the manufacturing method of the probe card assembly according to Article 10, A step of forming the probe substrate by cutting the base substrate into die units; A step of fixing the probe substrate to the frame substrate through the probe substrate joining member; A step of bonding the probe pin member to the probe substrate; A step of connecting the probe substrate and the circuit substrate through the challenge medium; and A method for manufacturing a probe card assembly, comprising the step of bonding a reinforcing member to the circuit board and the frame board via a flatness adjustment screw.

18. In paragraph 17, The step of fixing the probe substrate to the frame substrate through the probe substrate joining member is: A step of first fixing the probe substrate bonding member to the substrate by solder, which is a bonding material; and A method for manufacturing a probe card assembly, comprising a step of secondarily fixing the probe substrate, in a state where the probe substrate bonding member is bonded, to the frame substrate by irradiating light or heat with an adhesive material.

19. In paragraph 1 or paragraph 10, The above probe pin member is a probe card assembly which is a two-dimensional MEMS (micro-electro-mechanical system) structure patterned from a metal plate.

20. In paragraph 19, The above probe pin member extends in the first horizontal direction, A probe card assembly in which a plurality of the above probe pin members are bonded in a second horizontal direction perpendicular to the first horizontal direction on the probe substrate.

21. In paragraph 20, The above probe pin member, A joint extending in the first horizontal direction and bonded to the probe substrate; A vertical extension extending from the above joint in a vertical direction perpendicular to the first horizontal direction and the second horizontal direction; a horizontal extension extending in the first horizontal direction from the vertical extension; and A probe card assembly including a probe tip portion protruding in the vertical direction from the end of the horizontal extension portion.

22. In paragraph 21, The above joint, the vertical extension, and the horizontal extension include nickel-boron (NiB) alloy and cyanide gold (CyAu) materials, The above probe tip portion is a probe card assembly including a rhodium (Rh) material.

23. In paragraph 1 or paragraph 10, A plurality of the above probe pin members are bonded to the probe substrate by a solder-type bonding material, The above bonding material is a probe card assembly comprising a gold-tin (AuSn) alloy.

24. In paragraph 23, The above probe pin member is bonded via a solder ball composed of the solder-type bonding material applied to the bonding pad of the probe substrate, A probe card assembly in which the bonding pad is a metal pad that comes into contact with the probe pin member, and a polyimide thin film layer is applied between the solder balls on the upper portion of the bonding pad.

25. In paragraph 24, A probe card assembly in which the probe pin member is coupled to the probe substrate such that the vertical extension portion is positioned on an outer portion of the probe substrate or such that the vertical extension portion is positioned on an inner portion of the probe substrate and the probe tip portion is positioned toward the outside of the probe substrate.

26. In paragraph 1 or paragraph 1, The probe substrate is a probe card assembly including a polyimide thin film layer formed on the laminated ceramic substrate.

27. In paragraph 1 or paragraph 10, The above probe substrate is, ceramic layer; A bonding pad connected to the probe pin member on the front surface of the ceramic layer; A polyimide thin film layer applied to an upper portion of the above bonding pad; and A probe card assembly comprising a backside pad that contacts the conductive medium on the backside of the ceramic layer.

28. In paragraph 27, The opening of the above frame substrate and the above probe substrate, A probe card assembly having the same size and shape as the above inspection target element, or grouped in units of 1 / N times or N times (N is an integer greater than or equal to 2) the above inspection target element.

29. In paragraph 1 or paragraph 10, A probe card assembly in which a separation prevention screw that prevents the probe substrate from being separated from the frame substrate is coupled between the probe substrate and the frame substrate.

30. In paragraph 8 or paragraph 17, The step of bonding the probe pin member to the probe substrate is: A step of applying a solder-type bonding material in the form of balls having a diameter of 10 to 100 micrometers to the probe substrate; A step of positioning the probe pin on the probe substrate using a pick and place equipment; A method for manufacturing a probe card assembly, comprising a step of fixing the probe pin to the probe substrate by irradiating heat or light while the probe pin is in contact with the probe substrate.

31. In paragraph 8 or paragraph 17, A method for manufacturing a probe card assembly, further comprising a step of replacing the probe pin member when the position of the probe pin bonded to the probe substrate is incorrect.

32. In paragraph 31, The steps for replacing the above probe pin member are: A step of separating the probe pin member from the probe substrate by irradiating heat or light to the bonding material of the probe pin member at the location requiring replacement so that the solder of the bonding material melts; and A method for manufacturing a probe card assembly, comprising the step of bonding another probe pin member to a position of the probe pin member separated from the probe substrate.

33. Circuit board to which signals for electrical inspection of the target element are applied; A frame substrate bonded to one side of the circuit board and having a plurality of openings formed therein; A conductive medium provided in the above opening and electrically connected to the circuit board; a probe substrate coupled to the above-mentioned challenge medium; and Including a probe pin member coupled to the opposite side of the conductive medium on the probe substrate, The above probe substrate is bonded to the frame substrate through an epoxy material bonding material or a probe substrate bonding member, The above frame substrate is, A metal or ceramic layer having a coefficient of thermal expansion (CTE) of 3 to 4.5 ppm / K; and Including a heater for temperature control of the above metal or ceramic layer, A probe card assembly in which the probe substrate has a size and shape corresponding to the inspection target element, and the mechanical position is determined by the frame substrate.

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