Touch panel and touch apparatus

Abstract

A touch panel and a touch apparatus, relating to the technical field of touch display. The touch panel comprises a display substrate and a touch layer which are stacked. The display substrate comprises a base substrate, a plurality of pixel units, a plurality of first conductive pattern groups, and a first encapsulation insulating layer. The touch layer comprises a first touch insulating layer, a first touch tracing layer, a second touch insulating layer, and a second touch tracing layer. A transfer pattern included in at least one of the first touch tracing layer and the second touch tracing layer is not only electrically connected to a touch signal line, but also electrically connected to a first conductive pattern group by means of the first opening in the first encapsulation insulating layer, thereby achieving touch signal transmission. Moreover, because the touch insulating layer material of at least one of the first touch insulating layer and the second touch insulating layer comprises an organic material, the overall bending performance of the touch layer is better, thereby improving the bending performance of the touch panel and facilitating the implementation of a foldable product.

Description

Touch panel and touch device Technical Field

[0001] This application relates to the field of touch display technology, and in particular to a touch panel and touch device. Background Technology

[0002] To make display panels lighter and thinner to fit foldable and rollable products, flexible multi-layer on cell (FMLOC) touch panels were developed.

[0003] Summary of the Invention

[0004] This application provides a touch panel and a touch device, the technical solution of which is as follows:

[0005] On one hand, a touch panel is provided, the touch panel comprising: a display substrate and a touch layer stacked thereon; the display substrate comprising:

[0006] A substrate having a display area and a peripheral area surrounding the display area, the peripheral area including a bending area and a first transition area, the bending area being disposed away from the display area relative to the first transition area;

[0007] Multiple pixel units, the multiple pixel units being located in the display area;

[0008] A plurality of first conductive pattern groups are spaced apart, and the plurality of first conductive pattern groups are located in the first transition area;

[0009] And a first encapsulation insulating layer located on the side of the plurality of first conductive pattern groups away from the substrate, the first encapsulation insulating layer being located in the peripheral region, the first encapsulation insulating layer having a plurality of first openings, each of the first openings being for exposing at least a portion of one of the first conductive pattern groups;

[0010] The touch layer includes: a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer sequentially stacked along a side away from the display substrate; the orthographic projections of the first touch insulating layer, the first touch wiring layer, the second touch insulating layer, and the second touch wiring layer on the substrate are located in the display area and the peripheral area; the first touch wiring layer and the second touch wiring layer include touch signal lines;

[0011] Wherein, at least one of the first touch trace layer and the second touch trace layer includes a transition pattern, the transition pattern being electrically connected to the touch signal line; the transition pattern being electrically connected to the first conductive pattern group through the first opening; the material of at least one of the first touch insulating layer and the second touch insulating layer includes an organic material.

[0012] Optionally, the first touch insulating layer has a plurality of second openings, each second opening being used to expose at least a portion of one of the first conductive pattern groups;

[0013] The first touch trace layer includes a first transition pattern. The side of the first transition pattern away from the display area is located on the side of the first opening away from the display area and on the side of the second opening away from the display area. The side of the first transition pattern close to the display area is located on the side of the first opening close to the display area and on the side of the second opening close to the display area. The first transition pattern is electrically connected to the first conductive pattern group through the first opening and the second opening.

[0014] The second touch insulating layer exposes at least a portion of the first adapter pattern;

[0015] The second touch trace layer includes a second transition pattern, which is electrically connected to the portion of the first transition pattern exposed by the second touch insulating layer.

[0016] Both the first adapter pattern and the second adapter pattern are connected to the touch signal line.

[0017] Optionally, the material of the first encapsulation insulating layer includes an inorganic material, the material of the first touch insulating layer includes an inorganic material, and the material of the second touch insulating layer includes an organic material; the first opening and the second opening are prepared by the same process, the orthographic projection of the second opening on the substrate overlaps with the orthographic projection of the first opening on the substrate, and the area of ​​the orthographic projection of the second opening on the substrate is equal to the area of ​​the orthographic projection of the first opening on the substrate.

[0018] The second touch insulating layer covers the side of the first adapter pattern away from the display area, and the second touch insulating layer has a plurality of third openings for exposing at least a portion of the first adapter pattern, and the second adapter pattern is electrically connected to the first adapter pattern through the third openings;

[0019] The orthographic projection of the second opening on the substrate is located within the orthographic projection of the third opening on the substrate, and the area of ​​the orthographic projection of the second opening on the substrate is smaller than the area of ​​the orthographic projection of the third opening on the substrate.

[0020] Optionally, the material of the first encapsulation insulating layer includes an inorganic material, the material of the first touch insulating layer includes an organic material, and the material of the second touch insulating layer includes an inorganic material; the first opening and the second opening are prepared using two different processes respectively;

[0021] The boundary of the second touch insulating layer away from the display area is located on the side of the first transition area closer to the display area, and the second transition pattern and the first transition pattern are directly electrically connected in the first transition area; the boundary of the second transition pattern away from the display area is further away from the display area than the boundary of the first transition pattern away from the display area.

[0022] Optionally, the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate;

[0023] The first touch insulating layer covers the edge of the first opening in the first encapsulation insulating layer.

[0024] Optionally, the material of the first encapsulation insulating layer includes inorganic materials, and the materials of both the first touch insulating layer and the second touch insulating layer include organic materials;

[0025] The second touch insulating layer covers the side of the first adapter pattern away from the display area, and the second touch insulating layer has a plurality of third openings; the third openings are used to expose at least a portion of the first adapter pattern, and the second adapter pattern is electrically connected to the first adapter pattern through the third openings;

[0026] The orthographic projection of at least one of the third opening and the second opening onto the substrate covers the orthographic projection of the first opening onto the substrate, and the area of ​​the orthographic projection of the at least one opening onto the substrate is greater than the area of ​​the orthographic projection of the first opening onto the substrate.

[0027] Optionally, the orthographic projection of the third opening on the substrate covers the orthographic projection of the second opening on the substrate, and the area of ​​the orthographic projection of the third opening on the substrate is larger than the area of ​​the orthographic projection of the second opening on the substrate.

[0028] The orthographic projection of the second opening on the substrate covers the orthographic projection of the first opening on the substrate, and the area of ​​the orthographic projection of the second opening on the substrate is larger than the area of ​​the orthographic projection of the first opening on the substrate.

[0029] Optionally, the first touch insulating layer has a plurality of second openings, each second opening being used to expose at least a portion of one of the first conductive pattern groups;

[0030] The second touch insulating layer exposes at least a portion of the first conductive pattern group;

[0031] The second touch trace layer includes a second transition pattern, which is electrically connected to the first conductive pattern group through the second opening and the first opening, and is connected to the touch signal line.

[0032] Optionally, the material of the first encapsulation insulating layer includes an inorganic material, the material of the first touch insulating layer includes an organic material, and the material of the second touch insulating layer includes an inorganic material; the first opening in the first encapsulation insulating layer is prepared after the second opening in the first touch insulating layer is prepared, and the first opening and the boundary of the second touch insulating layer away from the display area are prepared by the same process;

[0033] The orthographic projection of the second opening on the substrate overlaps with the orthographic projection of the first opening on the substrate, and the area of ​​the orthographic projection of the second opening on the substrate is equal to the area of ​​the orthographic projection of the first opening on the substrate.

[0034] The boundary of the second touch insulating layer away from the display area is located on the side of the first transition area close to the display area, and the second transition pattern and the first conductive pattern group are directly electrically connected in the first transition area.

[0035] Optionally, the touch layer further includes a third touch insulating layer located on the side of the second touch trace layer away from the display substrate;

[0036] The orthographic projection of the third touch insulating layer on the substrate covers the orthographic projection of the second transition pattern on the substrate, and the boundary of the third touch insulating layer away from the display area is located on the side of the second transition pattern away from the display area.

[0037] Optionally, the first touch insulating layer has a plurality of second openings, each second opening being used to expose at least a portion of one of the first conductive pattern groups;

[0038] The first touch trace layer includes a first transition pattern. The side of the first transition pattern away from the display area is located on the side of the first opening away from the display area and on the side of the second opening away from the display area. The side of the first transition pattern close to the display area is located on the side of the first opening close to the display area and on the side of the second opening close to the display area. The first transition pattern is electrically connected to the first conductive pattern group through the first opening and the second opening.

[0039] The orthographic projection of the second touch insulating layer on the substrate covers the orthographic projection of the first transition pattern on the substrate;

[0040] The first adapter pattern is connected to the touch signal line.

[0041] Optionally, the material of the first encapsulation insulating layer includes an inorganic material; the material of the first touch insulating layer includes an organic material; the material of the second touch insulating layer includes an inorganic material, or the material of the second touch insulating layer includes an organic material; the first opening and the second opening are prepared using two different processes respectively;

[0042] The orthographic projection of the second opening on the substrate lies within the orthographic projection of the first opening on the substrate, and the area of ​​the orthographic projection of the second opening on the substrate is smaller than the area of ​​the orthographic projection of the first opening on the substrate; or,

[0043] The orthographic projection of the second opening on the substrate covers the orthographic projection of the first opening on the substrate, and the area of ​​the orthographic projection of the second opening on the substrate is larger than the area of ​​the orthographic projection of the first opening on the substrate.

[0044] Optionally, the touch layer further includes a third touch insulating layer located on the side of the second touch trace layer away from the display substrate;

[0045] The orthographic projection of the third touch insulating layer on the substrate covers the orthographic projection of the touch signal lines and touch electrode lines in the second touch wiring layer on the substrate, and the boundary of the third touch insulating layer away from the display area is located on the side of the touch signal lines and touch electrode lines in the second touch wiring layer away from the display area.

[0046] Optionally, the touch panel further includes a color filter substrate located on the side of the touch layer away from the display substrate;

[0047] The color filter substrate includes: a color conversion component and an insulating protective layer located on the side of the color conversion component away from the display substrate; the orthographic projection of the insulating protective layer on the substrate covers the orthographic projection of the color conversion component on the substrate.

[0048] The color conversion component includes a barrier structure and a color conversion part. The barrier structure is used to define a plurality of accommodating spaces, each accommodating space corresponding to the light-emitting area of ​​a pixel unit. The color conversion part is located within the accommodating space and is used to convert the color of the light emitted by the pixel unit.

[0049] Optionally, the orthographic projection of the color conversion component on the substrate is located in the display area, and the orthographic projection of the insulating protective layer on the substrate is located in both the display area and the peripheral area;

[0050] The insulating protective layer is made of organic materials.

[0051] Optionally, the surrounding area further includes a second transition area and a pad area, wherein the second transition area is disposed away from the display area relative to the bending area, and the pad area is disposed away from the display area relative to the second transition area;

[0052] The first conductive pattern group includes a plurality of conductive patterns stacked sequentially, wherein at least a portion of the orthographic projection of the target conductive pattern in the plurality of conductive patterns on the substrate is located in the bending region and the second transition region; the touch layer includes a plurality of connection pattern groups spaced apart, wherein each connection pattern group includes at least one connection pattern, wherein the orthographic projection of at least one connection pattern on the substrate is located in the second transition region and the pad region, and the portion of at least one connection pattern located in the second transition region is electrically connected to the portion of the target conductive pattern located in the second transition region;

[0053] The display substrate further includes a plurality of second conductive pattern groups located on one side of the substrate and spaced apart, the plurality of second conductive pattern groups being located in the pad area; the portion of the connecting pattern group located in the pad area is electrically connected to the second conductive pattern groups, the portion of the second conductive pattern group and the portion of the connecting pattern group located in the pad area being used to form a connection interface, the connection interface being used to connect to the driving circuit in the touch panel, the connection interface being used to receive touch signals from the driving circuit.

[0054] Optionally, the display substrate includes: a first source / drain layer, a passivation layer, a first planarization layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, and a first encapsulation insulating layer, which are sequentially stacked on the substrate in a direction away from the substrate; the plurality of conductive patterns include a first conductive pattern located on the second source / drain layer and a second conductive pattern located on the third source / drain layer.

[0055] The passivation layer is made of inorganic materials, and the boundary of the passivation layer away from the display area is located on the side of the first transition area closer to the display area;

[0056] The first planarization layer, the second planarization layer, and the third planarization layer are made of organic materials. The second planarization layer has a first via that exposes at least a portion of the first conductive pattern, and the second conductive pattern and the first conductive pattern are connected through the first via. The third planarization layer has a second via that exposes at least a portion of the second conductive pattern, and the second conductive pattern is used for electrical connection with a transition pattern in the touch layer.

[0057] Optionally, the pixel unit includes a pixel circuit and a light-emitting unit, the pixel circuit including a plurality of thin-film transistors and at least one storage capacitor; the display substrate further includes a buffer layer, an active layer, a gate insulating layer, a gate layer and an interlayer dielectric layer sequentially stacked between the substrate and the passivation layer and in a direction away from the substrate, and an anode layer, a pixel defining layer, a light-emitting layer, a cathode layer and an encapsulation film layer sequentially stacked on the side of the third planarization layer away from the substrate and in a direction away from the substrate.

[0058] The buffer layer, the active layer, the gate insulating layer, the gate layer, the interlayer dielectric layer, the first source-drain layer, the passivation layer, the first planarization layer, the second source-drain layer, the second planarization layer, the third source-drain layer, and the third planarization layer are used to form the pixel circuit of the plurality of pixel units.

[0059] The anode layer, the pixel defining layer, the light-emitting layer, and the cathode layer are used to form the light-emitting unit of the plurality of pixel units;

[0060] The encapsulation film layer includes a first encapsulation insulating layer and a second encapsulation insulating layer. The first encapsulation insulating layer includes a first sub-encapsulation insulating layer and a second sub-encapsulation insulating layer. The second encapsulation insulating layer is located between the first sub-encapsulation insulating layer and the second sub-encapsulation insulating layer, and is located at least in the display area. The material of the first encapsulation insulating layer includes inorganic materials, and the material of the second encapsulation insulating layer includes organic materials.

[0061] Optionally, one of the first touch trace layer and the second touch trace layer includes a bridging electrode of a plurality of first touch electrodes, and the other touch electrode layer includes a main electrode of a plurality of first touch electrodes and a plurality of second touch electrodes; the first touch electrodes and the second touch electrodes are insulated from each other.

[0062] The portion of the second touch insulating layer located in the display area includes multiple third vias, through which the main electrode is electrically connected to the bridging electrode.

[0063] On the other hand, a touch device is provided, the touch device comprising: a power supply component and a touch panel as described above;

[0064] The power supply component is connected to the touch panel and is used to supply power to the touch panel. Attached Figure Description

[0065] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0066] Figure 1 is a top view of a touch panel provided in an embodiment of this application;

[0067] Figure 2 is a top view of another touch panel provided in an embodiment of this application;

[0068] Figure 3 is a partial cross-sectional view of a touch panel provided in an embodiment of this application;

[0069] Figure 4 is a partial cross-sectional view of a touch layer provided in an embodiment of this application;

[0070] Figure 5 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0071] Figure 6 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0072] Figure 7 is a partial top view of a passivation layer and a second source / drain layer provided in an embodiment of this application;

[0073] Figure 8 is a partial top view of a passivation layer, a second source / drain layer, and a second planarization layer provided in an embodiment of this application.

[0074] Figure 9 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer and a third source / drain layer provided in an embodiment of this application.

[0075] Figure 10 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, and a third planarization layer provided in an embodiment of this application.

[0076] Figure 11 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, and a first touch insulating layer provided in an embodiment of this application.

[0077] Figure 12 is a partial top view of a passivation layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, and a first touch wiring layer provided in an embodiment of this application.

[0078] Figure 13 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, and a second touch insulating layer provided in an embodiment of this application.

[0079] Figure 14 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer provided in an embodiment of this application.

[0080] Figure 15 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, a second touch wiring layer, and a third touch insulating layer provided in an embodiment of this application.

[0081] Figure 16 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0082] Figure 17 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, and a first encapsulation insulating layer provided in an embodiment of this application.

[0083] Figure 18 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, and a first touch insulating layer provided in an embodiment of this application.

[0084] Figure 19 is a partial top view of a passivation layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, and a first touch wiring layer provided in an embodiment of this application.

[0085] Figure 20 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, and a second touch insulating layer provided in an embodiment of this application.

[0086] Figure 21 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer provided in an embodiment of this application.

[0087] Figure 22 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, a second touch wiring layer, and a third touch insulating layer provided in an embodiment of this application.

[0088] Figure 23 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0089] Figure 24 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, and a first encapsulation insulating layer provided in an embodiment of this application.

[0090] Figure 25 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, and a first touch insulating layer provided in an embodiment of this application.

[0091] Figure 26 is a partial top view of a passivation layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, and a first touch wiring layer provided in an embodiment of this application.

[0092] Figure 27 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, and a second touch insulating layer provided in an embodiment of this application.

[0093] Figure 28 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer provided in an embodiment of this application.

[0094] Figure 29 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, a second touch wiring layer, and a third touch insulating layer provided in an embodiment of this application.

[0095] Figure 30 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0096] Figure 31 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, and a first encapsulation insulating layer provided in an embodiment of this application.

[0097] Figure 32 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, and a first touch insulating layer provided in an embodiment of this application.

[0098] Figure 33 is a partial top view of a passivation layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, and a first touch wiring layer provided in an embodiment of this application.

[0099] Figure 34 is a partial top view of a passivation layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, and a second touch insulating layer provided in an embodiment of this application.

[0100] Figure 35 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer provided in an embodiment of this application.

[0101] Figure 36 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, a second touch wiring layer, and a third touch insulating layer provided in an embodiment of this application.

[0102] Figure 37 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0103] Figure 38 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, and a first encapsulation insulating layer provided in an embodiment of this application.

[0104] Figure 39 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, and a first touch insulating layer provided in an embodiment of this application.

[0105] Figure 40 is a partial top view of a passivation layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, and a first touch wiring layer provided in an embodiment of this application.

[0106] Figure 41 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, and a second touch insulating layer provided in an embodiment of this application.

[0107] Figure 42 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer provided in an embodiment of this application.

[0108] Figure 43 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, a second touch wiring layer, and a third touch insulating layer provided in an embodiment of this application.

[0109] Figure 44 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0110] Figure 45 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, and a first encapsulation insulating layer provided in an embodiment of this application.

[0111] Figure 46 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, and a first touch insulating layer provided in an embodiment of this application.

[0112] Figure 47 is a partial top view of a passivation layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, and a first touch wiring layer provided in an embodiment of this application.

[0113] Figure 48 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, and a second touch insulating layer provided in an embodiment of this application.

[0114] Figure 49 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer provided in an embodiment of this application.

[0115] Figure 50 is a partial top view of a passivation layer, a second source / drain layer, a second planarization layer, a third source / drain layer, a third planarization layer, a first encapsulation insulating layer, a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, a second touch wiring layer, and a third touch insulating layer provided in an embodiment of this application.

[0116] Figure 51 is a partial cross-sectional view of another touch panel provided in an embodiment of this application;

[0117] Figure 52 is a schematic diagram of a touch device provided in an embodiment of this application. Detailed Implementation

[0118] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0119] Figure 1 is a top view of a touch panel provided in an embodiment of this application. Figure 2 is a top view of another touch panel provided in an embodiment of this application. Figure 3 is a partial cross-sectional view of a touch panel provided in an embodiment of this application. Referring to Figures 1 to 3, the touch panel 100 includes a display substrate 101 and a touch layer 102 stacked together.

[0120] The display substrate 101 includes: a substrate 1011, a plurality of pixel units 1012, a plurality of first conductive pattern groups 1013, and a first encapsulation insulating layer 1014. Referring to FIG2, the substrate 1011 has a display area 1011a and a peripheral area 1011b surrounding the display area 1011a. The peripheral area 1011b includes a first transition area b1 and a bending area b2, the bending area b2 being disposed away from the display area 1011a relative to the first transition area b1. That is, the first transition area b1 is located between the bending area b2 and the display area 1011a.

[0121] In this embodiment, a plurality of pixel units 1012 are located in display area 1011a, and first conductive pattern groups 1013 are spaced apart and located in first transition area b1. Referring to FIG3, a first encapsulation insulating layer 1014 is located on the side of the plurality of first conductive pattern groups 1013 away from the substrate 1011. The first encapsulation insulating layer 1014 is located in peripheral area 1011b, and the first encapsulation insulating layer 1014 has a plurality of first openings K1, each first opening K1 for exposing at least a portion of a first conductive pattern group 1013.

[0122] Referring to Figure 3, the touch layer 102 includes: a first touch insulating layer 1021, a first touch wiring layer 1022, a second touch insulating layer 1023, and a second touch wiring layer 1024, sequentially stacked along the side away from the display substrate 101. The orthographic projections of the first touch insulating layer 1021, the first touch wiring layer 1022, the second touch insulating layer 1023, and the second touch wiring layer 1024 onto the substrate 1011 are located in the display area 1011a and the peripheral area 1011b. The first touch wiring layer 1022 can also be referred to as the first touch metal layer (Touch metal layer A, TMA) of the touch panel 100, and the second touch wiring layer 1024 can also be referred to as the second touch metal layer (Touch metal layer B, TMB) of the touch panel 100.

[0123] In this embodiment of the application, referring to Figures 2 and 4, one of the touch electrode layers in the first touch wiring layer 1022 and the second touch wiring layer 1024 (taking the first touch wiring layer 1022 as an example in Figure 4) includes bridging electrodes s12 of multiple first touch electrodes s1. The other touch electrode layer in the first touch wiring layer 1022 and the second touch wiring layer 1024 (taking the second touch wiring layer 1024 as an example in Figure 4) includes main electrodes s11 of multiple first touch electrodes s1 and multiple second touch electrodes s2. The portion of the second touch insulating layer 1023 located in the display area 1011a includes multiple third vias G3, and the bridging electrodes s12 and the main electrodes s11 are electrically connected through the third vias G3 in the second touch insulating layer 1023.

[0124] Optionally, one of the first touch electrode s1 and the second touch electrode s2 is a transmitting (TX) electrode and the other is a sensing (RX) electrode.

[0125] Referring to Figure 4, the touch panel 100 includes a plurality of first touch electrodes s1 arranged along a first direction X, and a plurality of second touch electrodes s2 arranged along a second direction Y. Furthermore, the bridging electrodes s12 of the first touch electrodes s1 are located in the region where the orthographic projections of the second touch electrodes s2 overlap. The first direction X and the second direction Y intersect, for example, the first direction X and the second direction Y are perpendicular. Optionally, the first direction X can be the pixel column direction of the display substrate 101, and the second direction Y can be the pixel row direction of the display substrate 101.

[0126] Referring to Figure 4, the touch layer 102 may further include multiple touch signal lines. Each touch signal line is connected to a touch electrode. For example, a portion of the multiple touch signal lines s3 are connected to the first touch electrode s1, and another portion of the touch signal lines s3 are connected to the second touch electrode s2. The touch signal lines s3 may be located in at least one of the first touch routing layer 1022 and the second touch routing layer 1024.

[0127] Furthermore, at least one of the first touch trace layer 1022 and the second touch trace layer 1024 includes a transition pattern. The transition pattern is connected to the touch signal line. Additionally, the transition pattern is electrically connected to the first conductive pattern group 1013 through the first opening K1.

[0128] In this embodiment, at least one of the first touch insulating layer 1021 and the second touch insulating layer 1023 is made of an organic material. For example, the first touch insulating layer 1021 is made of an organic material. Alternatively, the second touch insulating layer 1023 is made of an organic material. Or, both the first touch insulating layer 1021 and the second touch insulating layer 1023 may be made of organic materials.

[0129] Because organic materials have good flexibility and bending performance, setting the material of at least one of the first touch insulating layers 1021 and the second touch insulating layer 1023 to include organic materials can improve the overall bending performance of the touch layer 102, thereby enhancing the bending performance of the touch panel and facilitating the realization of foldable products.

[0130] In this embodiment, the main function of the bending area b2 is to allow the portion of the peripheral area 1011b away from the bending area b2 to be bent to the back side of the display area 1011a, thereby reducing the width of the bezel of the touch panel 100 and achieving a narrow bezel product. Since the first touch insulating layer 1021 and the second touch insulating layer 1023 can be located in the bending area b2 in addition to the first transition area b1, the material of at least one of the first touch insulating layers 1021 and the second touch insulating layer 1023 can include organic materials, which can improve the bending performance of the bending area b2.

[0131] In summary, this application provides a touch panel comprising a display substrate and a touch layer stacked together. The display substrate includes a substrate, multiple pixel units, multiple first conductive pattern groups, and a first encapsulation insulating layer. The touch layer includes a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer. At least one of the first and second touch wiring layers includes a transition pattern that is not only electrically connected to touch signal lines but also electrically connected to the first conductive pattern groups through a first opening in the first encapsulation insulating layer, thereby enabling touch signal transmission. Furthermore, since at least one of the first and second touch insulating layers is made of organic materials, the overall bending performance of the touch layer is improved, thus enhancing the bending performance of the touch panel and facilitating the creation of foldable products.

[0132] In this embodiment of the application, referring to FIG2, the peripheral area 1011b further includes a second transition area b3 and a pad area b4. The second transition area b3 is disposed away from the display area 1011a relative to the bending area b2, and the pad area b4 is disposed away from the display area 1011a relative to the second transition area b3.

[0133] Referring to Figure 5, the first conductive pattern group 1013 includes a plurality of first conductive patterns (10131 and 10132) stacked sequentially. At least a portion of the orthographic projection of the target first conductive pattern M among the plurality of first conductive patterns (10131 and 10132) onto the substrate 1011 is located in the second transition area b3. The touch layer 102 includes a plurality of connection pattern groups 1025 spaced apart. The connection pattern group 1025 includes at least one connection pattern (e.g., 10251 and 10252). The orthographic projection of at least one connection pattern 10251 onto the substrate 1011 is located in the second transition area b3 and the pad area b4. The portion of at least one connection pattern 10251 located in the second transition area b3 is electrically connected to the target first conductive pattern M.

[0134] The display substrate 101 also includes a plurality of second conductive pattern groups 1015 disposed at intervals on one side of the substrate 1011. The plurality of second conductive pattern groups 1015 are located in the pad area b4. A portion of the connecting pattern group 1025 located in the pad area b4 is electrically connected to the second conductive pattern group 1015. The second conductive pattern group 1015 and the portion of the connecting pattern group 1025 located in the pad area b4 constitute a connection interface J. The connection interface J is used to connect to a driving circuit in the touch panel and to receive touch signals from the driving circuit. Optionally, referring to FIG. 5, the second conductive pattern group 1015 includes a plurality of stacked second conductive patterns (10151 and 10152).

[0135] In this embodiment, the bending area b2 is replaced by a film layer (such as the second source-drain layer SD2) in the display substrate 101. The film layer in the display substrate 101 is an intermediate film layer of the touch panel 100 and has high stability. Therefore, using a film layer with high stability to realize the signal transmission of the bending area b2 and the bending of the bending area b2 can ensure the overall stability and reliability of the touch panel 100.

[0136] In addition, the film layer in the display substrate 101 is replaced by two touch wiring layers after crossing the bending region b2 to achieve signal transmission. The layout design of the film layer in the display substrate 101 is usually quite complex. Therefore, by replacing the film layer with two touch wiring layers, the complexity of the layout of the film layer in the display substrate 101 can be reduced.

[0137] Optionally, the driving circuit can be integrated onto a flexible circuit board. The flexible circuit board can be connected to the connection pattern group 1025 of the connection interface J, and then transmit touch signals to the touch electrodes through the connection pattern group 1025, the first conductive pattern group 1013, the adapter pattern, and the touch signal line. The connection interface J is bonded to the touch panel with the flexible circuit board, and the area where the connection interface J is located can be called FOP (flexible printed circuit on panel).

[0138] Figure 6 is a partial structural schematic diagram of the display substrate provided in an embodiment of this application. Referring to Figures 3 and 5, the display substrate 101 includes: a first source-drain layer (SD1) n6, a passivation layer (PVX) n7, a first planarization layer (PLN1) n8, a second source-drain layer (SD2) n9, a second planarization layer (PLN2) n10, a third source-drain layer (SD3) n11, a third planarization layer (PLN3) n12, and a first encapsulation insulating layer 1014, all located on the substrate 1011 and away from the substrate 1011.

[0139] Figure 6 shows an example of a display substrate 101 including three source and drain layers. The first conductive pattern group 1013 includes multiple first conductive patterns, which may include two first conductive patterns, wherein the first first conductive pattern 10131 is located in the second source and drain layer n9, and the second first conductive pattern 10132 is located in the third source and drain layer n11.

[0140] Alternatively, in the first conductive pattern group 1013, the first first conductive pattern 10131 is located in the first source-drain layer, and the second first conductive pattern 10132 is located in the second source-drain layer. Or, in the first conductive pattern group 1013, the first first conductive pattern 10131 is located in the first source-drain layer, and the second first conductive pattern 10132 is located in the third source-drain layer.

[0141] If the display substrate 101 includes two source-drain layers, and the first conductive pattern group 1013 includes two first conductive patterns, then the first first conductive pattern 10131 in the first conductive pattern group 1013 is located in the first source-drain layer, and the second first conductive pattern 10131 is located in the second source-drain layer. If the display substrate includes one source-drain layer, and the first conductive pattern group 1013 includes two first conductive patterns, then the first first conductive pattern 10131 is located in the gate layer, and the second first conductive pattern 10131 is located in the source-drain layer. Alternatively, the two first conductive patterns included in the first conductive pattern group 1013 can be located in any two conductive layers.

[0142] Alternatively, the first conductive pattern group 1013 may include a first conductive pattern, which may be located in any conductive layer of the display substrate shown in FIG6. This application embodiment does not limit this.

[0143] Alternatively, the first conductive pattern group 1013 may include three first conductive patterns, which are respectively located in the first source-drain layer, the second source-drain layer, and the third source-drain layer. Alternatively, the three first conductive patterns 10131 included in the first conductive pattern group may be located in any three conductive layers; this embodiment does not limit this.

[0144] In this embodiment, the passivation layer n7 is made of an inorganic material, and the boundary of the passivation layer n7 away from the display area 1011a is located on the side of the first transition area b1 near the display area 1011a. The first planarization layer n8, the second planarization layer n10, and the third planarization layer n12 are made of organic materials. The second planarization layer n10 has a first via G1, which exposes at least a portion of a first first conductive pattern 10131, and a second first conductive pattern 10132 is connected to the first first conductive pattern 10131 through the first via G1. The third planarization layer n12 has a second via G2, which exposes at least a portion of the second first conductive pattern 10132, and the second first conductive pattern 10132 can be electrically connected to the transition pattern in the touch layer 102.

[0145] In this embodiment, at least one of the first touch routing layers 1022 and the second touch routing layer 1024 includes a transition pattern in three ways: 1. The first touch routing layer 1022 includes a first transition pattern 10221, and the second touch routing layer 1024 includes a second transition pattern 10241; 2. The first touch routing layer 1022 includes the first transition pattern 10221; 3. The second touch routing layer 1024 includes the second transition pattern 10241. This embodiment will describe these three scenarios in detail.

[0146] As a first alternative implementation, referring to FIG3, the first touch insulating layer 1021 has a plurality of second openings K2, each second opening K2 for exposing at least a portion of the first conductive pattern group 1013. The first touch wiring layer 1022 includes a first transition pattern 10221. The first transition pattern 10221 is located on one side of the display area 1011a, on the side of the first opening K1 away from the display area 1011a, and on the side of the second opening K2 away from the display area 1011a. The side of the first transition pattern 10221 closest to the display area 1011a is located on the side of the first opening K1 closest to the display area 1011a, and on the side of the second opening K2 closest to the display area 1011a. The first transition pattern 10221 is electrically connected to the first conductive pattern group 1013 through the first opening K1 and the second opening K2.

[0147] The second touch insulating layer 1023 exposes at least a portion of the first transition pattern 10221. The second touch wiring layer 1024 includes a second transition pattern 10241, which is electrically connected to the portion of the first transition pattern 10221 exposed by the second touch insulating layer 1023. Specifically, the second touch insulating layer 1023 exposing at least a portion of the first transition pattern 10221 can mean that the boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first transition pattern 10221 closest to the display area 1011a, or that the boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first transition pattern 10221 away from the display area 1011a, and that the second touch insulating layer 1023 has an opening to expose the first transition pattern 10221.

[0148] In this case, both the first adapter pattern 10221 and the second adapter pattern 10241 are connected to the touch signal line. That is, the first adapter pattern 10221 and the second adapter pattern 10241 work together to transmit touch signals to the touch signal line.

[0149] Optionally, the first implementation can be illustrated using the following three schemes as examples. To clearly illustrate the relationship between the various structures, the embodiments of this application illustrate the sequential stacking of the various film layers.

[0150] In the first scheme, referring to Figures 7 to 15, each newly added layer is represented by a bold dashed line. Figure 3 is a cross-sectional view of Figure 15 along the AA' direction. Combining Figure 3 and Figures 7 to 15, the material of the first encapsulation insulating layer (denoted as CVD in Figures 7 to 15) 1014 includes inorganic materials, the material of the first touch insulating layer (denoted as barrier in Figures 7 to 15) 1021 includes inorganic materials, and the material of the second touch insulating layer (denoted as OC1 in Figures 7 to 15) 1023 includes organic materials.

[0151] Optionally, the inorganic material may include at least one inorganic oxide selected from SiNx (silicon nitride), SiOx (silicon oxide), and SiOxNy (silicon oxynitride). The organic material may include optical (OC) adhesive.

[0152] In this case, the fabrication process of each layer comprising the touch layer 102 includes:

[0153] 1. Form the first touch insulating film (barrier film).

[0154] 2. Inorganic material etching is performed on the touch barrier layer mask (TBL Mask) in touch layer 102 to ensure that the underlying first conductive pattern group 1013 is exposed and can contact the subsequently formed first transition pattern 10221. That is, this stage not only etches the first touch insulating film (the etched first touch insulating film is called the first touch insulating layer 1021, which includes the second opening K2), but also etches the first encapsulation insulating film (the etched first encapsulation insulating film is called the first encapsulation insulating layer 1014, which includes the first opening K1). In other words, the first opening K1 and the second opening K2 are prepared using the same process. The dimensions of the first opening K1 and the second opening K2 can be 14.5 μm × 36 μm.

[0155] 3. Form the first touch trace film, which is a solid metal layer.

[0156] 4. The first touch trace film is etched using a TMA Mask. The etched first touch trace film is called the first touch trace layer 1022. The first touch trace layer 1022 includes a first transition pattern 10221, which is connected to the underlying first conductive pattern group 1013 through a first opening K1 and a second opening K2. Furthermore, the first transition pattern 10221 also protects the underlying first conductive pattern group 1013, preventing it from being etched during the etching process. Optionally, the sidewalls of the vias exposed in the third planarization layer n12 that form the first conductive pattern group 1013 are sloped, and the width of the orthographic projection of the slope onto the substrate 1011 is approximately 2 μm. Thus, to prevent the boundary of the first transition pattern 10221 on the side away from the display area 1011a from being located on the slope, the boundary of the first transition pattern 10221 on the side away from the display area 1011a can be extended outward by more than 8μm relative to the second opening K2. This ensures that after the first transition pattern 10221 crosses the slope, its boundary on the side away from the display area 1011a is located above the flat area of ​​the third flattening layer n12, effectively preventing the first transition pattern 10221 from tilting and causing abnormal etching morphology, and avoiding over-etching or conductive material residue.

[0157] 5. Form a second touch insulating film (denoted as OC1), the second touch insulating film layer is a whole layer of organic material.

[0158] 6. The second touch insulating film is etched using an OC1 Mask. The etched second touch insulating film is called the second touch insulating layer 1023. The second touch insulating layer 1023 has a third opening K3. The size of the third opening K3 on one side is more than 4μm larger than that of the second opening K2, to ensure that all openings in the transition area can be exposed.

[0159] 7. Form a second touch trace film, which is a solid metal layer.

[0160] 8. The second touch trace film is etched using a TMB Mask. The etched second touch trace film is called the second touch trace layer 1024. The second touch trace layer 1024 includes a second transition pattern 10241. The orthographic projection of the second transition pattern 10241 on the substrate 1011 covers the orthographic projection of the third opening K3 on the substrate 1011, preventing damage to the underlying first transition pattern 10221 during TMB etching. The second transition pattern 10241 contacts the first transition pattern 10221 through the third opening K3.

[0161] It should be noted that, referring to Figures 7 to 15, the passivation layer n7, the first planarization layer n8, the second planarization layer n10, the third planarization layer n12, the first encapsulation insulating layer 1014, the first touch insulating layer 1021, and the second touch insulating layer 1023 have filled patterns in the cut-out areas, and the areas without filled patterns are areas with solid material.

[0162] For the third planarization layer n12, it can be etched using a halftone mask, resulting in a first etched region and a second etched region. The first etched region is fully etched (through, exposing the underlying film layer), and the second etched region is partially etched (not through, only thinned). The partially etched region retains some material from the third planarization layer n12, and its thickness is less than that of the non-etched region. This allows the third planarization layer n12 to decompose a single high film layer discontinuity into two non-overlapping, low discontinuities, ensuring the effectiveness of subsequent film layer ramp-up formation and guaranteeing product yield.

[0163] In this embodiment, the first opening K1 and the second opening K2 are fabricated using the same process. The same process can refer to using the same mask for exposure, development, and etching. In this case, the orthographic projection of the second opening K2 onto the substrate 1011 overlaps with the orthographic projection of the first opening K1 onto the substrate 1011, and the area of ​​the second opening K2 onto the substrate 1011 is equal to the area of ​​the first opening K1 onto the substrate 1011. Alternatively, due to process errors, the size of the second opening K2 may be larger than the size of the first opening K1; this embodiment does not limit this possibility.

[0164] The second touch insulating layer 1023 covers the side of the first transition pattern 10221 away from the display area 1011a, and the second touch insulating layer 1023 has a plurality of third openings K3 for exposing at least a portion of the first transition pattern 10221. The second transition pattern 10241 is electrically connected to the first transition pattern 10221 through the third openings K3.

[0165] The orthographic projection of the second opening K2 on the substrate 1011 is located within the orthographic projection of the third opening K3 on the substrate 1011, and the area of ​​the orthographic projection of the second opening K2 on the substrate 1011 is smaller than the area of ​​the orthographic projection of the third opening K3 on the substrate 1011.

[0166] The second scheme, referring to Figures 16 to 22, uses a bold dashed line to represent each newly added layer. Figure 16 is a cross-sectional view of Figure 22 along the BB' direction. Referring to Figures 16 to 22, the material of the first encapsulation insulating layer (denoted as CVD in Figures 17 to 22) 1014 includes inorganic materials, the material of the first touch insulating layer (denoted as OCO in Figures 17 to 22) 1021 includes organic materials, and the material of the second touch insulating layer (denoted as TLD in Figures 17 to 22) 1023 includes inorganic materials.

[0167] In the second scheme, the design of passivation layer n7, first planarization layer n8, second source / drain layer n9, second planarization layer n10, third source / drain layer n11, and third planarization layer n12 can be the same as in the first scheme. Its partial top view can be referred to Figures 7 to 10 in the first scheme.

[0168] Optionally, the inorganic material may include at least one inorganic oxide selected from SiNx (silicon nitride), SiOx (silicon oxide), and SiOxNy (silicon oxynitride). The organic material may include optical (OC) adhesive.

[0169] In this case, the fabrication process of each layer comprising the touch layer 102 includes:

[0170] 1. The first encapsulation insulating film is etched using a TBL Mask to remove the inorganic material located in the transition area of ​​the first encapsulation insulating film. The etched first encapsulation insulating film is called the first encapsulation insulating layer 1014. The first encapsulation insulating layer 1014 includes a first opening K1.

[0171] 2. Form a first touch insulating film (denoted as OC0), the first touch insulating film being a single layer of organic material.

[0172] 3. The first touch insulating film is etched using an OCO mask, and the etched first touch insulating film is called the first touch insulating layer 1021. The first touch insulating layer 1021 includes a second opening K2. The size of the second opening K2 can be smaller than the size of the first opening K1, that is, the orthographic projection of the second opening K2 on the substrate 1011 is located within the orthographic projection of the first opening K1 on the substrate 1011, and the first touch insulating layer 1021 covers the edge of the first opening K1 in the first encapsulation insulating layer 1014. This achieves the effect of organic material encapsulating inorganic material. Since organic material itself has stronger adhesion, the edge of organic material can also play a buffering role if it is impacted, which is safer than a design where organic and inorganic materials are flush. Optionally, the size of one side of the second opening K2 is reduced by more than 4μm compared to the first opening K1 to ensure that the first touch insulating layer 1021 encapsulates the first encapsulation insulating layer 1014. Furthermore, the width of the minimum position of the second opening K2 in the orthographic projection on the substrate 1011 needs to be greater than 8μm to ensure that the second opening K2 can be exposed normally.

[0173] 4. Form the first touch trace film, which is a solid metal layer.

[0174] 5. The first touch trace film is etched using a TMA Mask. The etched first touch trace film is called the first touch trace layer 1022. The first touch trace layer 1022 includes a first transition pattern 10221, which is connected to the lower first conductive pattern group 1013 through a first opening K1 and a second opening K2.

[0175] 6. Form a second touch insulating film, which is a single layer of inorganic material. The second touch insulating film can be referred to as the dielectric layer (TLD) of the touch screen panel (TSP).

[0176] 7. The second touch insulating film is etched using a TLD Mask. The etched second touch insulating film is called the second touch insulating layer 1023. The boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first transition area b1 near the display area 1011a. That is, the etching at this stage can be a large-area large-hole etching to remove all the inorganic material of the second touch insulating film in the transition area.

[0177] 8. Form a second touch trace film, which is a solid metal layer.

[0178] 9. The second touch trace film is etched using a TMB Mask. The etched second touch trace film is called the second touch trace layer 1024. The second touch trace layer 1024 includes a second transition pattern 10241. The boundary of the second transition pattern 10241 away from the display area 1011a is further away from the display area 1011a than the boundary of the first transition pattern 10221 away from the display area 1011a. That is, the second transition pattern 10241 covers the boundary of the first transition pattern 10221, preventing the etching at this stage from damaging the first transition pattern 10221.

[0179] It should be noted that the passivation layer n7, the first planarization layer n8, the second planarization layer n10, the third planarization layer n12, the first encapsulation insulating layer 1014, the first touch insulating layer 1021, and the second touch insulating layer 1023 have filled patterns in the areas that are cut-out regions, and areas without filled patterns are areas with solid material. The design of the third planarization layer n12 can be the same as in the first scheme described above; please refer to the description in the first scheme for details.

[0180] In this embodiment, the first opening K1 and the second opening K2 are prepared using two different processes. These two different processes can refer to using different masks for exposure, development, and etching. Referring to Figure 16, the orthographic projection of the second opening K2 onto the substrate 1011 can lie within the orthographic projection of the first opening K1 onto the substrate 1011, and the first touch insulating layer 1021 covers the edge of the first opening K1 in the first encapsulation insulating layer 1014. This allows the first touch insulating layer 1021 (organic material) to wrap around the edge of the first encapsulation insulating layer 1014 (inorganic material), improving the cushioning effect during impact and thus enhancing safety.

[0181] Of course, if the size of the first opening K1 is relatively small, then in order to ensure that the second opening K2 can be exposed, the size of the second opening K2 can be larger than the size of the first opening K1. That is, the orthographic projection of the second opening K2 on the substrate 1011 can cover the orthographic projection of the first opening K1 on the substrate 1011, meaning that the first touch insulating layer 1021 does not need to wrap around and cover the edge of the first encapsulation insulating layer 1014. In other words, when designing the relationship between the sizes of the first opening K1 and the second opening K2, exposure can be given priority, and organic materials can wrap inorganic materials while ensuring that the openings can be exposed.

[0182] The third scheme, referring to Figures 23 to 29, uses a bold dashed line to represent each newly added layer. Figure 23 is a cross-sectional view of Figure 29 along the CC' direction. Referring to Figures 23 to 29, the material of the first encapsulation insulating layer (denoted as CVD in Figures 24 to 29) 1014 includes inorganic materials, while the materials of the first touch insulating layer (denoted as OC0 in Figures 24 to 29) 1021 and the second touch insulating layer (denoted as OC1 in Figures 24 to 29) 1023 include organic materials.

[0183] In the third scheme, the design of passivation layer n7, first planarization layer n8, second source / drain layer n9, second planarization layer n10, third source / drain layer n11, and third planarization layer n12 can be the same as that of the first scheme. Its partial top view can be referred to Figures 7 to 10 of the first scheme.

[0184] Optionally, the inorganic material may include at least one inorganic oxide selected from SiNx (silicon nitride), SiOx (silicon oxide), and SiOxNy (silicon oxynitride). The organic material may include optical (OC) adhesive.

[0185] In this case, the fabrication process of each layer comprising the touch layer 102 includes:

[0186] 1. The first encapsulation insulating film is etched using a TBL Mask to remove the inorganic material located in the transition area of ​​the first encapsulation insulating film. The etched first encapsulation insulating film is called the first encapsulation insulating layer 1014. The first encapsulation insulating layer 1014 includes a first opening K1.

[0187] 2. Form a first touch insulating film (denoted as OC0), the first touch insulating film being a single layer of organic material.

[0188] 3. The first touch insulating film is etched using an OCO Mask. The etched first touch insulating film is called the first touch insulating layer 1021. The first touch insulating layer 1021 includes a second opening K2.

[0189] 4. Form the first touch trace film, which is a solid metal layer.

[0190] 5. The first touch trace film is etched using a TMA Mask. The etched first touch trace film is called the first touch trace layer 1022. The first touch trace layer 1022 includes a first transition pattern 10221. The first transition pattern 10221 is connected to the lower first conductive pattern group 1013 through a first opening K1 and a second opening K2.

[0191] 6. Form a second touch insulating film (denoted as OC1), which is a whole layer of organic material.

[0192] 7. The second touch insulating film is etched using an OC1 Mask. The etched second touch insulating film is called the second touch insulating layer 1023. The second touch insulating layer 1023 covers the side of the first transition pattern 10221 away from the display area 1011a, and the second touch insulating layer 1023 has a plurality of third openings K3. The third openings K3 are used to expose at least a portion of the first transition pattern 10221 so that the subsequently formed second transition pattern 10241 is electrically connected to the first transition pattern 10221 through the third openings K3.

[0193] 8. Form a second touch trace film, which is a solid metal layer.

[0194] 9. The second touch trace film is etched using a TMB Mask. The etched second touch trace film is called the second touch trace layer 1024. The second touch trace layer 1024 includes a second transition pattern 10241, which contacts the first transition pattern 10221 through a third opening K3. The boundary of the second transition pattern 10241 on the side away from the display area 1011a is located above the second touch insulating layer 1023, which can prevent the first transition pattern 10221 below from being exposed and damaged.

[0195] It should be noted that the passivation layer n7, the first planarization layer n8, the second planarization layer n10, the third planarization layer n12, the first encapsulation insulating layer 1014, the first touch insulating layer 1021, and the second touch insulating layer 1023 have filled patterns in the areas that are cut-out regions, and areas without filled patterns are areas with solid material. The design of the third planarization layer n12 can be the same as in the first scheme described above; please refer to the description in the first scheme for details.

[0196] In this embodiment, to ensure that each opening can be exposed, the orthographic projection of at least one of the third opening K3 and the second opening K2 onto the substrate 1011 overlaps the orthographic projection of the first opening K1 onto the substrate 1011. The area of ​​the orthographic projection of at least one opening onto the substrate 1011 is larger than the area of ​​the orthographic projection of the first opening K1 onto the substrate 1011. That is, the size of at least one of the third opening K3 and the second opening K2 is larger than the size of the first opening K1.

[0197] Optionally, the size of the third opening K3 is larger than the size of the first opening K1, and the size of the second opening K2 is smaller than the size of the first opening K1. Alternatively, the size of the third opening K3 is smaller than the size of the first opening K1, and the size of the second opening K2 is larger than the size of the first opening K1. Or, both the size of the third opening K3 and the size of the second opening K2 are larger than the size of the first opening K1.

[0198] For example, referring to Figure 29, the size of the second opening K2 can be larger than the size of the first opening K1, and the size of the third opening K3 can be larger than the size of the second opening K2. That is, the orthographic projection of the second opening K2 onto the substrate 1011 overlaps the orthographic projection of the first opening K1 onto the substrate 1011, and the area of ​​the orthographic projection of the second opening K2 onto the substrate 1011 is larger than the area of ​​the orthographic projection of the first opening K1 onto the substrate 1011. Similarly, the orthographic projection of the third opening K3 onto the substrate 1011 overlaps the orthographic projection of the second opening K2 onto the substrate 1011, and the area of ​​the orthographic projection of the third opening K3 onto the substrate 1011 is larger than the area of ​​the orthographic projection of the second opening K2 onto the substrate 1011.

[0199] In other words, the sizes of the first opening K1, the second opening K2, and the third opening K3 gradually increase (the openings are larger at the top and smaller at the bottom) to prevent any opening from being underexposed. For example, if the width of the first adapter pattern 10221 ranges from 14μm to 28μm (e.g., 18.3μm), then the size of the third opening K3 can be 8μm × 30μm to ensure that the third opening K3 can be exposed.

[0200] Optionally, the widths of the first opening K1, the second opening K2, the third opening K3, and the second transition pattern 10241 (or the first transition pattern 10221) need to increase sequentially, while the length is less important (and can usually increase sequentially as well). For example, the width of the first opening K1 ranges from 7 μm to 10 μm. The width of the second opening K2 ranges from 15 μm to 18 μm. The width of the third opening K3 ranges from 23 μm to 26 μm. The width of the second transition pattern 10241 ranges from 31 μm to 34 μm.

[0201] For example, the width of the first opening K1 is 7μm, and the length of the first opening K1 is 31.5μm, meaning the dimensions of the first opening K1 are 7μm × 31.5μm. The width of the second opening K2 is 15μm, and the length of the second opening K2 is 39.5μm, meaning the dimensions of the second opening K2 are 15μm × 39.5μm. The width of the third opening K3 is 23μm, and the length of the third opening K3 is 47.5μm, meaning the dimensions of the third opening K3 are 23μm × 47.5μm. The width of the second transition pattern 10241 is 31μm, the length of the second transition pattern 10241 is 55.5μm, and the dimensions of the second transition pattern 10241 are 31μm × 55.5μm. In other words, the dimensions of the first opening K1 < the dimensions of the second opening K2 < the dimensions of the third opening K3 < the dimensions of the second transition pattern 10241.

[0202] As a second alternative implementation, referring to FIG30, the first touch insulating layer 1021 has a plurality of second openings K2, each second opening K2 being used to expose at least a portion of the first conductive pattern group 1013.

[0203] The second touch insulating layer 1023 exposes at least a portion of a first conductive pattern group 1013. The second touch wiring layer 1024 includes a second transition pattern 10241, which is electrically connected to the first conductive pattern group 1013 through a second opening K2 and a first opening K1, and is connected to a touch signal line. Specifically, the second touch insulating layer 1023 exposing at least a portion of the first conductive pattern group 1013 can mean that the boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first opening K1 and the second opening K2 near the display area 1011a; or, the boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first opening K1 and the second opening K2 away from the display area 1011a, and the second touch insulating layer 1023 has openings to expose the first conductive pattern group 1013.

[0204] In this case, the second adapter pattern 10241 is connected to the touch signal line. That is, the touch signal is transmitted to the touch signal line through the second adapter pattern 10241.

[0205] Optionally, the second implementation can be illustrated using the following scheme as an example. To clearly illustrate the relationship between the various structures, this embodiment illustrates the arrangement of the film layers stacked sequentially.

[0206] In the first scheme, referring to Figures 30 to 36, each newly added layer is represented by a bold dashed line. Figure 30 is a cross-sectional view of Figure 36 along the DD' direction. Referring to Figures 30 to 36, the material of the first encapsulation insulating layer (denoted as CVD in Figures 31 to 36) 1014 includes inorganic materials, the material of the first touch insulating layer (denoted as OCO in Figures 31 to 36) 1021 includes organic materials, and the material of the second touch insulating layer (denoted as TLD in Figures 31 to 36) 1023 includes inorganic materials.

[0207] The design of the passivation layer n7, the first planarization layer n8, the second source-drain layer n9, the second planarization layer n10, the third source-drain layer n11, and the third planarization layer n12 in this scheme can be the same as the first scheme in the first implementation method described above. Its partial top view can be referred to Figures 7 to 10.

[0208] Optionally, the inorganic material may include at least one inorganic oxide selected from SiNx (silicon nitride), SiOx (silicon oxide), and SiOxNy (silicon oxynitride). The organic material may include optical (OC) adhesive.

[0209] In this case, the fabrication process of each layer comprising the touch layer 102 includes:

[0210] 1. Form a first touch insulating film (denoted as OC0), the first touch insulating film being a single layer of organic material.

[0211] 2. The first touch insulating film is etched using an OCO Mask. The etched first touch insulating film is called the first touch insulating layer 1021. The first touch insulating layer 1021 includes a second opening K2, which exposes the underlying first encapsulation insulating film (at this time, the first opening K1 has not yet been formed).

[0212] 3. Form the first touch trace film, which is a solid metal layer.

[0213] 4. The first touch trace film is etched using a TMA Mask. The etched first touch trace film is called the first touch trace layer 1022. Since the first encapsulation insulating film below has not yet been etched to form the first opening K1 before this step, the material of the first touch trace film in the transition area needs to be etched away during the etching of the first touch trace film so that the first opening K1 can be formed in subsequent processes.

[0214] 5. Form a second touch insulating film, which is a single layer of inorganic material.

[0215] 6. The second touch insulating film is etched using a TLD Mask. The etched second touch insulating film is called the second touch insulating layer 1023. The boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first transition area b1 closest to the display area 1011a. During this stage, material of the first encapsulation insulating film not covered by the first touch insulating layer 1021 can be etched away. The etched first encapsulation insulating film is called the first encapsulation insulating layer 1014. The first encapsulation insulating layer 1014 includes a first opening K1, which exposes at least a portion of the first first conductive pattern 10131. The boundaries of the first encapsulation insulating layer 1014 and the first touch insulating layer 1021 can be flush. That is, the orthographic projection of the second opening K2 on the substrate 1011 overlaps with the orthographic projection of the first opening K1 on the substrate 1011, and the area of ​​the orthographic projection of the second opening K2 on the substrate 1011 is equal to the area of ​​the orthographic projection of the first opening K1 on the substrate 1011.

[0216] 7. Form a second touch trace film, which is a solid metal layer.

[0217] 8. The second touch trace film is etched using a TMB Mask. The etched second touch trace film is called the second touch trace layer 1024. The second touch trace layer 1024 includes a second transition pattern 10241. The second transition pattern 10241 is electrically connected to the first conductive pattern group 1013 through the third opening K3, the second opening K2 and the first opening K1, for example, it is electrically connected to the second first conductive pattern 10132 in the first conductive pattern group 1013.

[0218] It should be noted that the passivation layer n7, the first planarization layer n8, the second planarization layer n10, the third planarization layer n12, the first encapsulation insulating layer 1014, the first touch insulating layer 1021, and the second touch insulating layer 1023 have filled patterns in the areas that are cut-out regions, and areas without filled patterns are areas with solid material. The design of the third planarization layer n12 can be the same as the first scheme in the first implementation method described above, and for details, please refer to the description in the first scheme of the first implementation method.

[0219] In this embodiment, the first opening K1 in the first encapsulation insulating layer 1014 is prepared after the second opening K2 in the first touch insulating layer 1021, and the first opening K1 and the boundary of the second touch insulating layer 1023 away from the display area 1011a are prepared using the same process. The same process can refer to using the same mask for exposure, development, and etching.

[0220] In this case, the orthographic projection of the second opening K2 on the substrate 1011 overlaps with the orthographic projection of the first opening K1 on the substrate 1011, and the area of ​​the second opening K2 on the substrate 1011 is equal to the area of ​​the first opening K1 on the substrate 1011.

[0221] The boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first transition area b1 close to the display area 1011a, and the second transition pattern 10241 is directly electrically connected to the first conductive pattern group 1013 in the first transition area b1.

[0222] Alternatively, the second touch insulating layer 1023 covers the side of the first transition pattern 10221 away from the display area 1011a, and the second touch insulating layer 1023 has a plurality of third openings K3 for exposing at least a portion of the first transition pattern 10221. The second transition pattern 10241 is electrically connected to the first transition pattern 10221 through the third openings K3.

[0223] The orthographic projection of the second opening K2 on the substrate 1011 is located within the orthographic projection of the third opening K3 on the substrate 1011, and the area of ​​the orthographic projection of the second opening K2 on the substrate 1011 is smaller than the area of ​​the orthographic projection of the third opening K3 on the substrate 1011.

[0224] In each of the first and second implementations described above, referring to FIG3 and FIGS7 to 36, the touch layer 102 further includes a third touch insulating layer 1025 located on the side of the second touch wiring layer 1024 away from the display substrate 101. The third touch insulating layer 1025 is located in the display area 1011a and the peripheral area 1011b. The orthographic projection of the third touch insulating layer 1025 on the substrate 1011 covers the orthographic projection of the second transition pattern 10241 on the substrate 1011, and the boundary of the third touch insulating layer 1025 away from the display area 1011a is located on the side of the second transition pattern 10241 away from the display area 1011a. This avoids the edges of the second transition pattern 10241 being exposed and affected by other film layers.

[0225] Optionally, considering manufacturing capabilities, the coverage size of the third touch insulating layer 1025 covering the second transition pattern 10241 can be greater than or equal to 2 μm. The coverage size can refer to the distance between the boundary of the third touch insulating layer 1025 away from the display area 1011a and the boundary of the second transition pattern 10241 away from the display area 1011a.

[0226] Optionally, when the touch layer 102 includes a third touch insulating layer 1025, the fabrication process of the touch layer 102 in the above embodiments further includes: 1. Forming a third touch insulating film (denoted as TOC), wherein the third touch insulating film is a single layer of organic material. 2. Etching the third touch insulating film using a TOC Mask, wherein the etched third touch insulating film is called the third touch insulating layer 1025, and the third touch insulating layer 1025 covers the second transition pattern 10241.

[0227] For the first scheme in the first optional implementation method mentioned above, the masks used in the fabrication process of the touch layer 102 include: TBL Mask, TMA Mask, OC1 Mask, TMB Mask and TOC Mask, that is, a total of 5 masks, and the fabrication process can be called 5Mask process.

[0228] For the second option in the first optional implementation method mentioned above, the masks used in the fabrication process of the touch layer 102 include: TBL Mask, OCO Mask, TMA Mask, TLD Mask, TMB Mask and TOC Mask, that is, a total of 6 masks, and the fabrication process can be called 6Mask process.

[0229] For the third option in the first optional implementation method mentioned above, the masks used in the fabrication process of the touch layer 102 include: TBL Mask, OC0 Mask, TMA Mask, OC1 Mask, TMB Mask and TOC Mask, that is, a total of 6 masks, and the fabrication process can be called 6Mask process.

[0230] For the first scheme in the second optional implementation method mentioned above, the masks used in the fabrication process of the touch layer 102 include: OCO Mask, TMA Mask, TLD Mask, TMB Mask and TOC Mask, that is, a total of 5 masks, and the fabrication process can be called 5Mask process.

[0231] As a third alternative implementation, referring to FIG37, the first touch insulating layer 1021 has a plurality of second openings K2, each second opening K2 for exposing at least a portion of the first conductive pattern group 1013. The first touch wiring layer 1022 includes a first transition pattern 10221. The first transition pattern 10221 is located on one side of the display area 1011a, on the side of the first opening K1 away from the display area 1011a, and on the side of the second opening K2 away from the display area 1011a. The side of the first transition pattern 10221 closest to the display area 1011a is located on the side of the first opening K1 closest to the display area 1011a, and on the side of the second opening K2 closest to the display area 1011a. The first transition pattern 10221 is electrically connected to the first conductive pattern group 1013 through the first opening K1 and the second opening K2.

[0232] The orthographic projection of the second touch insulating layer 1023 on the substrate 1011 covers the orthographic projection of the first transition pattern 10221 on the substrate 1011. In this case, the second touch insulating layer 1023 will not expose the underlying first transition pattern 10221, so the second touch wiring layer 1024 does not need to have a second transition pattern 10241. The first transition pattern 10221 is connected to the touch signal line, that is, the touch signal is transmitted to the touch signal line through the first transition pattern 10221.

[0233] Optionally, the third implementation can be illustrated using the following two schemes as examples. To clearly illustrate the relationship between the various structures, the embodiments of this application illustrate the sequential stacking of the various film layers.

[0234] In the first scheme, referring to Figures 37 to 43, each newly added layer is represented by a bold dashed line. Figure 37 is a cross-sectional view of Figure 43 along the EE' direction. Referring to Figures 37 to 43, the material of the first encapsulation insulating layer (denoted as CVD in Figures 38 to 43) 1014 includes inorganic materials, the material of the first touch insulating layer (denoted as OCO in Figures 38 to 43) 1021 includes organic materials, and the material of the second touch insulating layer (denoted as TLD in Figures 38 to 43) 1023 includes inorganic materials.

[0235] The design of the passivation layer n7, the first planarization layer n8, the second source-drain layer n9, the second planarization layer n10, the third source-drain layer n11, and the third planarization layer n12 in this scheme can be the same as the first scheme in the first implementation method described above. Its partial top view can be referred to Figures 7 to 10.

[0236] Optionally, the inorganic material may include at least one inorganic oxide selected from SiNx (silicon nitride), SiOx (silicon oxide), and SiOxNy (silicon oxynitride). The organic material may include optical (OC) adhesive.

[0237] In this case, the fabrication process of each layer comprising the touch layer 102 includes:

[0238] 1. The first encapsulation insulating film is etched using a TBL Mask to remove the inorganic material located in the transition area of ​​the first encapsulation insulating film. The etched first encapsulation insulating film is called the first encapsulation insulating layer 1014. The first encapsulation insulating layer 1014 includes a first opening K1.

[0239] 2. Form a first touch insulating film (denoted as OC0), the first touch insulating film being a single layer of organic material.

[0240] 3. The first touch insulating film is etched using an OCO mask, and the etched first touch insulating film is called the first touch insulating layer 1021. The first touch insulating layer 1021 includes a second opening K2. The size of the second opening K2 can be smaller than the size of the first opening K1, that is, the orthographic projection of the second opening K2 on the substrate 1011 is located within the orthographic projection of the first opening K1 on the substrate 1011, and the first touch insulating layer 1021 covers the edge of the first opening K1 in the first encapsulation insulating layer 1014. This achieves the effect of organic material encapsulating inorganic material. Since organic material itself has stronger adhesion, the edge of organic material can also play a buffering role if it is impacted, which is safer than a design where organic and inorganic materials are flush. Optionally, the size of one side of the second opening K2 is reduced by more than 4μm compared to the first opening K1 to ensure that the first touch insulating layer 1021 encapsulates the first encapsulation insulating layer 1014. Furthermore, the width of the minimum position of the second opening K2 in the orthographic projection on the substrate 1011 needs to be greater than 8μm to ensure that the second opening K2 can be exposed normally.

[0241] 4. Form the first touch trace film, which is a solid metal layer.

[0242] 5. The first touch trace film is etched using a TMA Mask. The etched first touch trace film is called the first touch trace layer 1022. The first touch trace layer 1022 includes a first transition pattern 10221, which is connected to the lower first conductive pattern group 1013 through a first opening K1 and a second opening K2.

[0243] 6. Form a second touch insulating film, which is a single layer of inorganic material.

[0244] 7. The second touch insulating film is etched using a TLD Mask. The etched second touch insulating film is called the second touch insulating layer 1023. The boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first transition area b1 away from the display area 1011a. The etching at this stage is used to form the third via G3 for electrical connection between the bridging electrode and the main electrode in the display area 1011a.

[0245] 8. Form a second touch trace film, which is a solid metal layer.

[0246] 9. The second touch trace film is etched using a TMB Mask. The etched second touch trace film is called the second touch trace layer 1024. The second touch trace layer 1024 does not need to include the second transition pattern 10241.

[0247] It should be noted that the passivation layer n7, the first planarization layer n8, the second planarization layer n10, the third planarization layer n12, the first encapsulation insulating layer 1014, the first touch insulating layer 1021, and the second touch insulating layer 1023 have filled patterns in the areas that are cut-out regions, and areas without filled patterns are areas with solid material. The design of the third planarization layer n12 can be the same as the first scheme in the first implementation method described above, and for details, please refer to the description in the first scheme of the first implementation method.

[0248] In this embodiment, the first opening K1 and the second opening K2 are prepared using two different processes. These two different processes can refer to using different masks for exposure, development, and etching. Referring to Figure 37, the orthographic projection of the second opening K2 onto the substrate 1011 can lie within the orthographic projection of the first opening K1 onto the substrate 1011, and the first touch insulating layer 1021 covers the edge of the first opening K1 in the first encapsulation insulating layer 1014. This allows the first touch insulating layer 1021 (organic material) to wrap around the edge of the first encapsulation insulating layer 1014 (inorganic material), improving the cushioning effect during impacts and thus enhancing safety.

[0249] Of course, if the size of the first opening K1 is relatively small, then in order to ensure that the second opening K2 can be exposed, the size of the second opening K2 can be larger than the size of the first opening K1. That is, the orthographic projection of the second opening K2 on the substrate 1011 can cover the orthographic projection of the first opening K1 on the substrate 1011, meaning that the first touch insulating layer 1021 does not need to wrap around and cover the edge of the first encapsulation insulating layer 1014. In other words, when designing the relationship between the sizes of the first opening K1 and the second opening K2, exposure can be given priority, and organic materials can wrap inorganic materials while ensuring that the openings can be exposed.

[0250] That is, the orthographic projection of the second opening K2 on the substrate 1011 can either cover the orthographic projection of the first opening K1 on the substrate 1011 (the first touch insulating layer 1021 exposes the edge of the first opening K1 in the first encapsulation insulating layer 1014), or it can be located within the orthographic projection of the first opening K1 on the substrate 1011 (the first touch insulating layer 1021 wraps around and covers the edge of the first opening K1 in the first encapsulation insulating layer 1014). This application does not limit this aspect.

[0251] The second approach, referring to Figures 44 to 50, uses bold dashed lines to represent each newly added layer. Figure 44 is a cross-sectional view of Figure 50 along the FF' direction. Referring to Figures 44 to 50, the first encapsulation insulating layer (denoted as CVD in Figures 45 to 50) 1014 is made of inorganic materials, the first touch insulating layer (denoted as OC0 in Figures 45 to 50) 1021 is made of organic materials, and the second touch insulating layer (denoted as OC1 in Figures 45 to 50) 1023 is made of organic materials.

[0252] The design of the passivation layer n7, the first planarization layer n8, the second source-drain layer n9, the second planarization layer n10, the third source-drain layer n11, and the third planarization layer n12 in this scheme can be the same as the first scheme in the first implementation method described above. Its partial top view can be referred to Figures 7 to 10.

[0253] Optionally, the inorganic material may include at least one inorganic oxide selected from SiNx (silicon nitride), SiOx (silicon oxide), and SiOxNy (silicon oxynitride). The organic material may include optical (OC) adhesive.

[0254] In this case, the fabrication process of each layer comprising the touch layer 102 includes:

[0255] 1. The first encapsulation insulating film is etched using a TBL Mask to remove the inorganic material located in the transition area of ​​the first encapsulation insulating film. The etched first encapsulation insulating film is called the first encapsulation insulating layer 1014. The first encapsulation insulating layer 1014 includes a first opening K1.

[0256] 2. Form a first touch insulating film (denoted as OC0), the first touch insulating film being a single layer of organic material.

[0257] 3. The first touch insulating film is etched using an OCO Mask. The etched first touch insulating film is called the first touch insulating layer 1021. The first touch insulating layer 1021 includes a second opening K2.

[0258] 4. Form the first touch trace film, which is a solid metal layer.

[0259] 5. The first touch trace film is etched using a TMA Mask. The etched first touch trace film is called the first touch trace layer 1022. The first touch trace layer 1022 includes a first transition pattern 10221, which is connected to the lower first conductive pattern group 1013 through a first opening K1 and a second opening K2.

[0260] 6. Form a second touch insulating film (denoted as OC1), which is a whole layer of organic material.

[0261] 7. The second touch insulating film is etched using an OC1 Mask. The etched second touch insulating film is called the second touch insulating layer 1023. The boundary of the second touch insulating layer 1023 away from the display area 1011a is located on the side of the first transition area b1 away from the display area 1011a. This stage of etching is used to form vias for electrical connection between the bridging electrode and the main electrode in the display area 1011a.

[0262] 8. Form a second touch trace film, which is a solid metal layer.

[0263] 9. The second touch trace film is etched using a TMB Mask. The etched second touch trace film is called the second touch trace layer 1024. The second touch trace layer 1024 does not need to include the second transition pattern 10241.

[0264] It should be noted that the passivation layer n7, the first planarization layer n8, the second planarization layer n10, the third planarization layer n12, the first encapsulation insulating layer 1014, the first touch insulating layer 1021, and the second touch insulating layer 1023 have filled patterns in the areas that are cut-out regions, and areas without filled patterns are areas with solid material. The design of the third planarization layer n12 can be the same as the first scheme in the first implementation method described above, and for details, please refer to the description in the first scheme of the first implementation method.

[0265] In this embodiment, referring to FIG44, the orthographic projection of the second opening K2 on the substrate 1011 can cover the orthographic projection of the first opening K1 on the substrate 1011 (the first touch insulating layer 1021 exposes the edge of the first opening K1 in the first encapsulation insulating layer 1014). Alternatively, the orthographic projection of the second opening K2 on the substrate 1011 can also be located within the orthographic projection of the first opening K1 on the substrate 1011 (the first touch insulating layer 1021 wraps around and covers the edge of the first opening K1 in the first encapsulation insulating layer 1014). This embodiment does not limit this aspect.

[0266] In each of the above-described third implementation schemes, referring to Figures 37 to 43, the touch layer 102 further includes a third touch insulating layer 1025 located on the side of the second touch wiring layer 1024 away from the display substrate 101. The third touch insulating layer 1025 is located in the display area 1011a and the peripheral area 1011b. The orthographic projection of the third touch insulating layer 1025 onto the substrate 1011 covers the orthographic projection of the touch signal lines of the second touch wiring layer 1024 onto the substrate 1011, and the boundary of the third touch insulating layer 1025 away from the display area 1011a is located on the side of the touch signal lines away from the display area 1011a. This avoids the edges of the touch signal lines being exposed and affected by other film layers.

[0267] Optionally, considering manufacturing capabilities, the coverage size of the third insulating layer covering the touch signal line can be greater than or equal to 2μm. The coverage size can refer to the distance between the boundary of the third touch insulating layer 1025 away from the display area 1011a and the boundary of the touch signal line away from the display area 1011a.

[0268] Optionally, when the touch layer 102 includes a third insulating layer, the fabrication process of the touch layer 102 in the above embodiments further includes: 1. Forming a third touch insulating film (denoted as TOC), wherein the third touch insulating film is a single layer of organic material. 2. Etching the third touch insulating film using a TOC Mask, wherein the etched third touch insulating film is called the third touch insulating layer 1025, and the third touch insulating layer 1025 covers the touch signal lines.

[0269] For the first scheme in the third optional implementation method mentioned above, the masks used in the fabrication process of the touch layer 102 include: TBL Mask, OCO Mask, TMA Mask, TLD Mask, TMB Mask and TOC Mask, that is, a total of 6 masks, and the fabrication process can be called 6Mask process.

[0270] For the second option in the third optional implementation method mentioned above, the masks used in the fabrication process of the touch layer 102 include: TBL Mask, OC0 Mask, TMA Mask, OC1 Mask, TMB Mask and TOC Mask, that is, a total of 6 masks, and the fabrication process can be called 6Mask process.

[0271] For the second and third implementations described above, since only one touch wiring layer includes the transition pattern, the complexity of the film layer stacking structure in the first transition area b1 can be reduced. Furthermore, for the first touch wiring layer 1022 and the second touch wiring layer 1024, it is not necessary to overlap them in the first transition area b1; instead, the touch electrodes can be overlapped in the display area 1011a.

[0272] Furthermore, regarding the second scheme in the third implementation described above, since the second touch insulating layer 1023 does not require a third opening K3, the widths of the first opening K1 and the second opening K2 can be appropriately increased. For example, the width of the first opening K1 can range from 7 μm to 23 μm, and the width of the second opening K2 can range from 15 μm to 31 μm.

[0273] In this embodiment, referring to FIG6, the touch panel 100 further includes a color filter substrate 103 located on the side of the touch layer 102 away from the display substrate 101. The color filter substrate 103 includes a color conversion component 1031 and an insulating protective layer 1032 located on the side of the color conversion component 1031 away from the display substrate 101. The orthographic projection of the insulating protective layer 1032 on the substrate 1011 covers the orthographic projection of the color conversion component 1031 on the substrate 1011.

[0274] Optionally, the orthographic projection of the color conversion component 1031 onto the substrate 1011 is located in the display area 1011a. The orthographic projection of the insulating protective layer 1032 onto the substrate 1011 is located in both the display area 1011a and the surrounding area 1011b. The material of the insulating protective layer 1032 may include organic materials, such as OC adhesive.

[0275] Based on the various solutions of the above embodiments, a color filter substrate 103 can be provided. In addition to the color filter substrate 103, an insulating protective layer 1032 can be provided on the peripheral area 1011b in Figures 3, 16, 23, 30, 37, and 44. For example, Figure 51 shows an additional insulating protective layer 1032 added to Figure 3. The insulating protective layer 1032 is located on the side of the third touch insulating layer 1025 away from the substrate 1011.

[0276] Optionally, referring to Figure 6, the color conversion component 1031 includes a barrier structure 10311 and a color conversion unit 10312. The barrier structure 10311 defines a plurality of accommodating spaces, each accommodating space corresponding to the light-emitting area of ​​a pixel unit 1012. The color conversion unit 10312 is located within the accommodating space and is used to convert the color of the light emitted by the pixel unit 1012.

[0277] In this embodiment, the pixel unit 1012 includes a pixel circuit and a light-emitting unit. The pixel circuit includes a plurality of thin-film transistors and at least one storage capacitor. Optionally, the pixel circuit may include seven thin-film transistors and one storage capacitor, i.e., a 7T1C pixel circuit. Alternatively, the pixel circuit may include other numbers of thin-film transistors and other numbers of storage capacitors. This embodiment does not limit the number of thin-film transistors or the number of storage capacitors included in the pixel circuit.

[0278] Each thin-film transistor includes a gate, a source, and a drain. Multiple thin-film transistors in a pixel circuit are interconnected to drive the light-emitting unit to emit light.

[0279] Referring to FIG6, the display substrate 101 further includes: a buffer layer n1, an active layer n2, a gate insulating layer n3, a gate layer n4 and an interlayer dielectric layer n5, which are stacked sequentially between the substrate 1011 and the passivation layer n7 and in a direction away from the substrate 1011; and an anode layer n13, a pixel defining layer n14, a light emitting layer n15, a cathode layer n16 and an encapsulation film layer n17, which are stacked sequentially on the side of the third planarization layer n12 away from the substrate 1011 and in a direction away from the substrate 1011.

[0280] The buffer layer n1, active layer n2, gate insulating layer n3, gate layer n4, interlayer dielectric layer n5, first source-drain layer n6, passivation layer n7, first planarization layer n8, second source-drain layer n9, second planarization layer n10, third source-drain layer n11, and third planarization layer n12 are used to form a pixel circuit for multiple pixel units 1012.

[0281] The anode layer n13, the pixel defining layer n14, the light-emitting layer n15, and the cathode layer n16 are used to form the light-emitting unit of the plurality of pixel units 1012.

[0282] The active layer n2 includes multiple active patterns corresponding to multiple thin-film transistors, each active pattern including a source region, a drain region, and a channel region. The gate layer n4 includes multiple gate patterns corresponding to multiple thin-film transistors, and the orthographic projections of each gate pattern on the substrate 1011 overlap with the orthographic projections of the active patterns on the substrate 1011. The portion of the active pattern located in the overlapping region constitutes the channel region.

[0283] The first source-drain layer n6 includes the source and drain of multiple thin-film transistors. The source is connected to the source region in the active layer n2 through vias in the interlayer dielectric layer n5 and the gate insulating layer n3. The drain is connected to the drain region in the active layer n2 through vias in the interlayer dielectric layer n5 and the gate insulating layer n3.

[0284] The second source-drain layer n9 includes a plurality of first connection portions n91, and the third source-drain layer n11 includes a plurality of second connection portions n111. The first connection portions n91 are connected through vias in the first planarization layer n8 and the passivation layer n7 and the pattern in the first source-drain layer n6. The second connection portions n111 are connected through vias in the second planarization layer n10 and the first connection portions n91.

[0285] The anode layer n13 includes multiple anode patterns, which can be connected via vias in the third planarization layer n12 and a second connection portion n111. The pixel defining layer n14 has multiple cutout areas, each cutout area exposing at least a portion of an anode pattern. The light-emitting layer n15 includes multiple light-emitting patterns, each light-emitting pattern contacting and connected to the anode pattern exposed in a cutout area. The cathode layer n16 and the multiple light-emitting patterns included in the light-emitting layer n15 are contacted and connected.

[0286] The encapsulation film layer n17 includes a first encapsulation insulating layer 1014 and a second encapsulation insulating layer n172. The first encapsulation insulating layer 1014 includes a first sub-encapsulation insulating layer n171 and a second sub-encapsulation insulating layer n173. The second encapsulation insulating layer is located between the first sub-encapsulation insulating layer n171 and the second sub-encapsulation insulating layer n173, and is located at least in the display area 1011a. The material of the first encapsulation insulating layer 1014 includes an inorganic material, and the material of the second encapsulation insulating layer includes an organic material.

[0287] For example, the first sub-encapsulation insulating layer n171 and the second sub-encapsulation insulating layer n173 may be made of one or more inorganic oxides such as SiNx, SiOx, and SiOxNy. The second encapsulation insulating layer n172 may be made of a resin material. The resin may be a thermoplastic resin or a thermosetting resin, where the thermoplastic resin may include acrylic (PMMA) resin and the thermosetting resin may include epoxy resin.

[0288] Optionally, the second encapsulation insulating layer n172 can be fabricated using inkjet printing (IJP). The first sub-encapsulation insulating layer n171 and the second sub-encapsulation insulating layer n173 can be fabricated using chemical vapor deposition (CVD). The first encapsulation insulating layer 1014 can be referred to as the CVD layer.

[0289] In summary, this application provides a touch panel comprising a display substrate and a touch layer stacked together. The display substrate includes a substrate, multiple pixel units, multiple first conductive pattern groups, and a first encapsulation insulating layer. The touch layer includes a first touch insulating layer, a first touch wiring layer, a second touch insulating layer, and a second touch wiring layer. At least one of the first and second touch wiring layers includes a transition pattern that is not only electrically connected to touch signal lines but also electrically connected to the first conductive pattern groups through a first opening in the first encapsulation insulating layer, thereby enabling touch signal transmission. Furthermore, since at least one of the first and second touch insulating layers is made of organic materials, the overall bending performance of the touch layer is improved, thus enhancing the bending performance of the touch panel and facilitating the creation of foldable products.

[0290] Figure 52 is a schematic diagram of a touch device provided in an embodiment of this application. Referring to Figure 52, the touch device includes a power supply component 200 and a touch panel 100 as provided in the above embodiment. The power supply component 200 is connected to the touch panel 100 and is used to supply power to the touch panel 100.

[0291] Optionally, the touch device can be an organic light-emitting diode (OLED) display device. The touch device can be any suitable display device, including but not limited to mobile phones, tablets, televisions, monitors, laptops, digital photo frames, navigators, and e-readers—any product or component with a display function.

[0292] Since the touch device can have essentially the same technical effects as the touch panel described in the previous embodiments, for the sake of brevity, the technical effects of the touch device will not be described again here.

[0293] The terminology used in the embodiments section of this application is for explaining the embodiments of this application only and is not intended to limit this application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains.

[0294] The terminology used in the embodiments section of this application is for illustrative purposes only and is not intended to limit the application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar words used in the patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "an" or "a" and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" and similar words mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. The terms "connected" or "linked" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0295] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

A touch panel characterized by comprising: The touch panel comprises a display substrate and a touch layer which are arranged in a stack; the display substrate comprises: a substrate substrate having a display area and a peripheral area surrounding the display area, the peripheral area comprising a bending area and a first adapter area, the bending area being arranged away from the display area relative to the first adapter area; a plurality of pixel units located in the display area; a plurality of first conductive pattern groups arranged at intervals, the plurality of first conductive pattern groups being located in the first adapter area; and a first encapsulation insulating layer located on a side of the plurality of first conductive pattern groups away from the substrate substrate, the first encapsulation insulating layer being located in the peripheral area, the first encapsulation insulating layer having a plurality of first openings, each of the first openings being used to expose at least part of one of the first conductive pattern groups; the touch layer comprises, in sequence from a side away from the display substrate, a first touch insulating layer, a first touch trace layer, a second touch insulating layer, and a second touch trace layer; the first touch insulating layer, the first touch trace layer, the second touch insulating layer, and the second touch trace layer have their orthographic projections on the substrate substrate located in the display area and the peripheral area; the first touch trace layer and the second touch trace layer comprise touch signal lines; wherein at least one of the first touch trace layer and the second touch trace layer comprises an adapter pattern, the adapter pattern being electrically connected with the touch signal lines; the adapter pattern is electrically connected through the first openings and the first conductive pattern groups; at least one of the first touch insulating layer and the second touch insulating layer comprises an organic material. The touch panel according to claim 1, wherein the first touch insulating layer has a plurality of second openings, each of the second openings being used to expose at least part of one of the first conductive pattern groups; the first touch trace layer comprises a first adapter pattern, a side of the first adapter pattern away from the display area being located on a side of the first opening away from the display area and on a side of the second opening away from the display area, a side of the first adapter pattern close to the display area being located on a side of the first opening close to the display area and on a side of the second opening close to the display area, the first adapter pattern being electrically connected through the first openings and the second openings and the first conductive pattern groups; the second touch insulating layer exposes at least part of the first adapter pattern; the second touch trace layer comprises a second adapter pattern, the second adapter pattern being electrically connected with the part of the first adapter pattern exposed by the second touch insulating layer; wherein the first adapter pattern and the second adapter pattern are both connected with the touch signal lines. ​ The touch panel according to claim 2, wherein The material of the first encapsulation insulating layer comprises inorganic material, the material of the first touch insulating layer comprises inorganic material, and the material of the second touch insulating layer comprises organic material; the first opening and the second opening are prepared by using the same process, the orthographic projection of the second opening on the substrate and the orthographic projection of the first opening on the substrate overlap, and the area of the orthographic projection of the second opening on the substrate is equal to the area of the orthographic projection of the first opening on the substrate; The second touch insulating layer covers the side of the first transfer pattern away from the display area, and the second touch insulating layer has a plurality of third openings for exposing at least part of the first transfer pattern, and the second transfer pattern is electrically connected with the first transfer pattern through the third openings; The orthographic projection of the second opening on the substrate is located in the orthographic projection of the third opening on the substrate, and the area of the orthographic projection of the second opening on the substrate is smaller than the area of the orthographic projection of the third opening on the substrate. The touch panel according to claim 2, wherein The material of the first encapsulation insulating layer comprises inorganic material, the material of the first touch insulating layer comprises organic material, and the material of the second touch insulating layer comprises inorganic material; the first opening and the second opening are prepared by using two different processes respectively; The boundary of the second touch insulating layer away from the display area is located on the side of the first transfer region close to the display area, and the second transfer pattern is directly electrically connected with the first transfer pattern in the first transfer region; The boundary of the second transfer pattern away from the display area is farther away from the display area than the boundary of the first transfer pattern away from the display area. The touch panel according to claim 4, wherein The orthographic projection of the second opening on the substrate is located in the orthographic projection of the first opening on the substrate; The first touch insulating layer covers the edge of the first opening in the first encapsulation insulating layer. The touch panel according to claim 2, wherein The material of the first encapsulation insulating layer comprises inorganic material, and the material of the first touch insulating layer and the material of the second touch insulating layer both comprise organic material; The second touch insulating layer covers the side of the first transfer pattern away from the display area, and the second touch insulating layer has a plurality of third openings; the third openings are used for exposing at least part of the first transfer pattern, and the second transfer pattern is electrically connected with the first transfer pattern through the third openings; The orthographic projection of at least one of the third opening and the second opening on the substrate covers the orthographic projection of the first opening on the substrate, and the area of the orthographic projection of the at least one opening on the substrate is greater than the area of the orthographic projection of the first opening on the substrate. The touch panel according to claim 6, wherein The orthographic projection of the third opening on the substrate covers the orthographic projection of the second opening on the substrate, and the area of the orthographic projection of the third opening on the substrate is greater than the area of the orthographic projection of the second opening on the substrate. A projection of the second opening on the substrate substrate covers a projection of the first opening on the substrate substrate, and an area of the projection of the second opening on the substrate substrate is greater than an area of the projection of the first opening on the substrate substrate. The touch panel according to claim 1, wherein The first touch insulation layer has a plurality of second openings, each of the second openings being configured to expose at least part of one of the first conductive pattern groups; The second touch insulation layer exposes at least part of one of the first conductive pattern groups; The second touch trace layer includes a second transfer pattern, the second transfer pattern being electrically connected to the first conductive pattern groups through the second openings and the first openings, the second transfer pattern being electrically connected to The touch signal lines. The touch panel according to claim 8, wherein The material of the first encapsulation insulation layer includes an inorganic material, the material of the first touch insulation layer includes an organic material, and the material of the second touch insulation layer includes an inorganic material; the first opening in the first encapsulation insulation layer is formed after the second opening in the first touch insulation layer is formed, and the first opening and the second touch insulation layer are formed by the same process away from the boundary of the display area; The projection of the second opening on the substrate substrate and the projection of the first opening on the substrate substrate overlap, and an area of the projection of the second opening on the substrate substrate is equal to an area of the projection of the first opening on the substrate substrate; The second touch insulation layer is located on a side of the first transfer area away from the display area, and the second transfer pattern is directly electrically connected to the first conductive pattern groups in the first transfer area. The touch panel according to any one of claims 2 to 9, wherein The touch layer further includes a third touch insulation layer located on a side of the second touch trace layer away from the display substrate; The projection of the third touch insulation layer on the substrate substrate covers the projection of the second transfer pattern on the substrate substrate, and the boundary of the third touch insulation layer away from the display area is located on a side of the second transfer pattern away from the display area. The touch panel according to claim 1, wherein The first touch insulation layer has a plurality of second openings, each of the second openings being configured to expose at least part of one of the first conductive pattern groups; The first touch trace layer includes a first transfer pattern, a side of the first transfer pattern away from the display area is located on a side of the first opening away from the display area and on a side of the second opening away from the display area, a side of the first transfer pattern close to the display area is located on a side of the first opening close to the display area and on a side of the second opening close to the display area, and the first transfer pattern is electrically connected to the first conductive pattern groups through the first opening and the second opening; The projection of the second touch insulation layer on the substrate substrate covers the projection of the first transfer pattern on The substrate substrate; The first transfer pattern is electrically connected to the touch signal lines. The touch panel according to claim 11, wherein The material of the first encapsulation insulating layer comprises inorganic material; the material of the first touch insulating layer comprises organic material; the material of the second touch insulating layer comprises inorganic material, or the material of the second touch insulating layer comprises organic material; the first opening and the second opening are prepared by different processes respectively; The orthographic projection of the second opening on the substrate substrate is located in the orthographic projection of the first opening on the substrate substrate, and the area of the orthographic projection of the second opening on the substrate substrate is smaller than the area of the orthographic projection of the first opening on the substrate substrate; or, The orthographic projection of the second opening on the substrate substrate covers the orthographic projection of the first opening on the substrate substrate, and the area of the orthographic projection of the second opening on the substrate substrate is greater than the area of the orthographic projection of the first opening on the substrate substrate. The touch panel according to claim 11 or 12, wherein The touch layer further comprises: a third touch insulating layer located on the side of the second touch trace layer away from the display substrate; The orthographic projection of the third touch insulating layer on the substrate substrate covers the orthographic projection of the touch signal lines and the touch electrode lines in the second touch trace layer on the substrate substrate, and the boundary of the third touch insulating layer away from the display area is located on the side of the touch signal lines and the touch electrode lines in the second touch trace layer away from the display area. The touch panel according to any one of claims 1 to 9, and 11 to 12, wherein The touch panel further comprises: a color film substrate located on the side of the touch layer away from the display substrate; The color film substrate comprises: a color conversion assembly and an insulating protective layer located on the side of the color conversion assembly away from the display substrate; the orthographic projection of the insulating protective layer on the substrate substrate covers the orthographic projection of the color conversion assembly on the substrate substrate; The color conversion assembly comprises: a barrier structure for defining a plurality of accommodation spaces, each of which corresponds to the light-emitting area of a pixel unit, and a color conversion part located in the accommodation space for converting the color of the light emitted by the pixel unit. The touch panel according to claim 14, wherein The orthographic projection of the color conversion assembly on the substrate substrate is located in the display area, and the orthographic projection of the insulating protective layer on the substrate substrate is located in the display area and the peripheral area; The material of the insulating protective layer comprises organic material. The touch panel according to any one of claims 1 to 9, and 11 to 12, wherein The peripheral area further comprises a second transition area and a pad area, the second transition area is arranged away from the display area relative to the bending area, and the pad area is arranged away from the display area relative to the second transition area; The first conductive pattern group comprises a plurality of conductive patterns stacked in sequence, and the orthographic projection of a target conductive pattern in the plurality of conductive patterns on the substrate substrate at least partially projects on the bending area and the second transition area; the touch layer comprises a plurality of connection pattern groups arranged at intervals, each of the connection pattern groups comprises at least one connection pattern, the orthographic projection of at least one of the connection patterns on the substrate substrate is located in the second transition area and the pad area, and the part of at least one of the connection patterns located in the second transition area is electrically connected with the part of the target conductive pattern located in the second transition area. The display substrate further comprises a plurality of second conductive pattern groups located on one side of the substrate and spaced apart, the plurality of second conductive pattern groups are located in the pad area; the connection pattern group is electrically connected to the second conductive pattern group and the part of the pad area, the second conductive pattern group and the part of the pad area are used to form a connection interface, the connection interface is used to connect with the driving circuit in the touch panel, and the connection interface is used to receive the touch signal from the driving circuit. The touch panel according to claim 16, wherein The display substrate comprises: a first source-drain layer, a passivation layer, a first planarization layer, a second source-drain layer, a second planarization layer, a third source-drain layer, a third planarization layer and the first encapsulation insulating layer which are sequentially stacked on the substrate and away from the substrate; the plurality of conductive patterns comprises a first conductive pattern located in the second source-drain layer and a second conductive pattern located in the third source-drain layer; The material of the passivation layer comprises inorganic material, and the passivation layer is located on the side of the first transition area close to the display area away from the boundary of the display area; The materials of the first planarization layer, the second planarization layer and the third planarization layer comprise organic material, The second planarization layer has a first via hole, the first via hole exposes at least part of the first conductive pattern, and the second conductive pattern and the first conductive pattern are connected through the first via hole; the third planarization layer has a second via hole, the second via hole exposes at least part of the second conductive pattern, and the second conductive pattern is used to electrically connect with the transition pattern in the touch layer. The touch panel according to claim 17, wherein The pixel unit comprises a pixel circuit and a light emitting unit, the pixel circuit comprises a plurality of thin film transistors and at least one storage capacitor; the display substrate further comprises a buffer layer, an active layer, a gate insulating layer, a gate layer and an interlayer dielectric layer which are sequentially stacked between the substrate and the passivation layer and away from the substrate; an anode layer, a pixel definition layer, a light emitting layer, a cathode layer and an encapsulation film layer which are sequentially stacked on the side of the third planarization layer away from the substrate and away from the substrate; The buffer layer, the active layer, the gate insulating layer, the gate layer, the interlayer dielectric layer, the first source-drain layer, the passivation layer, the first planarization layer, the second source-drain layer, the second planarization layer, the third source-drain layer and the third planarization layer are used to form the pixel circuit of the plurality of pixel units; The anode layer, the pixel definition layer, the light emitting layer and the cathode layer are used to form the light emitting unit of the plurality of pixel units; The encapsulation film layer comprises the first encapsulation insulating layer and the second encapsulation insulating layer, the first encapsulation insulating layer comprises a first sub-encapsulation insulating layer and a second sub-encapsulation insulating layer, the second encapsulation insulating layer is located between the first sub-encapsulation insulating layer and the second sub-encapsulation insulating layer and at least in the display area; the material of the first encapsulation insulating layer comprises inorganic material, and the material of the second encapsulation insulating layer comprises organic material. The touch panel according to any one of claims 1 to 9, and 11 to 12, wherein One of the first touch wire layer and the second touch wire layer comprises a plurality of bridge electrodes of a first touch electrode, and the other of the first touch wire layer and the second touch wire layer comprises a plurality of main body electrodes of the first touch electrode and a plurality of second touch electrodes; the first touch electrode and the second touch electrode are insulated from each other; The second touch insulating layer is located at a part of the display area and comprises a plurality of third vias, and the main body electrodes are electrically connected to the bridge electrodes through the third vias. A touch device, characterized in that The touch device comprises a power supply assembly and the touch panel as claimed in any one of claims 1 to 19. The power supply assembly and the touch panel are connected to supply power to the touch panel.

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