3D microcrystalline heat dissipation device

Abstract

A 3D microcrystalline heat dissipation device, provided with a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity which are attached to each other. The capillary phase change heat conduction cavity is of a sealed structure. A liquid inlet tube and a liquid outlet tube are sealedly connected to the liquid flow heat dissipation cavity. The liquid flow heat dissipation cavity is an immersion-type microcrystalline liquid flow heat dissipation cavity. A microcrystalline copper powder electroplated layer is provided on the bottom surface of an inner cavity of the immersion-type microcrystalline liquid flow heat dissipation cavity. In the 3D microcrystalline heat dissipation device, gas-liquid phase change is carried out by means of a refrigerant inside the capillary phase change heat conduction cavity, so that heat of a heat source is conducted to the liquid flow heat dissipation cavity, and then the heat is carried to the outside by the flowing refrigerant in the liquid flow heat dissipation cavity, thereby achieving an efficient heat dissipation effect.

Description

3D microcrystal heat dissipation device TECHNICAL FIELD

[0001] The utility model relates to electronic product heat dissipation technical field, especially in 3D microcrystal heat dissipation device. BACKGROUND

[0002] With the high -speed development of computer technology, especially artificial intelligence, automatic control and so on, the working performance of the module or component or device that matches is also greatly promoted. For example, the chip of AI technology, in order to match the artificial intelligence performance, the operation amount of chip is greatly improved, accordingly, the heat of chip is also significantly improved. The heat dissipation problem of this kind of large heat heat source becomes an important research topic.

[0003] The heat dissipation mode of heat source is mainly through the heat dissipation fin to increase the heat dissipation area. In order to improve the heat dissipation efficiency, in the prior art, there is a way to increase the air cooling to improve the heat exchange efficiency. In addition, through liquid cooling is also one of the ways used in recent years for large heat heat source, and the liquid cooling utilizes the heat conduction performance of liquid to absorb and transfer heat, and reduces the temperature of the equipment. However, the heat dissipation device of liquid cooling and heat source are mainly through the metal plate to conduct heat, and the heat of the heat source needs to be conducted to the refrigerant through the metal plate to conduct heat so as to take away the heat through the flow of refrigerant. The metal plate has poor heat conduction capacity, which leads to low overall heat dissipation efficiency and cannot meet the requirements of technical development on heat dissipation efficiency.

[0004] With the development of technology, the concept of three-dimensional heat dissipation device for large heat heat source electronic product is proposed. The three-dimensional heat dissipation device in the prior art is usually in contact with the heat source through a heat conduction seat, and a plurality of heat dissipation columns or heat dissipation pipes are distributed on the heat conduction seat. The heat of the heat source is transmitted through the contact between the heat conduction seat and the heat source, and the heat of the heat source is dissipated through the heat dissipation column or the heat dissipation pipe.

[0005] Therefore, in view of the deficiencies of the prior art, it is necessary to provide a 3D microcrystal heat dissipation device suitable for AI chip and other large heat heat sources to solve the deficiencies of the prior art. INVENTION CONTENTS

[0006] The utility model aims at avoiding the deficiencies of the prior art and provides a 3D microcrystal heat dissipation device. The 3D microcrystal heat dissipation device conducts the heat of the heat source to the liquid flow heat dissipation cavity through the gas-liquid phase change of the capillary phase change heat conduction cavity, and then the liquid flow heat dissipation cavity quickly takes out the heat outside through the flowing refrigerant, realizing the heat dissipation effect.

[0007] The above-mentioned purpose of the utility model is realized through the following technical measures:

[0008] A 3D microcrystal heat dissipation device is provided, which is provided with a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity.

[0009] The capillary phase-change heat conduction cavity is in a sealed structure, and the liquid flow heat dissipation cavity is sealingly connected with an inlet pipe and an outlet pipe.

[0010] Preferably, the liquid flow heat dissipation cavity is an immersed microcrystal structure liquid flow heat dissipation cavity.

[0011] Preferably, the bottom surface of the inner cavity of the immersed microcrystal structure liquid flow heat dissipation cavity is provided with a microcrystal copper powder electroplating layer.

[0012] Part or all of the lower wall surface of the liquid flow heat dissipation cavity is provided with a microcrystal copper powder electroplating layer, and the upper wall surface of the liquid flow heat dissipation cavity is not provided with a microcrystal copper powder electroplating layer.

[0013] Preferably, part or all of the lower wall surface of the liquid flow heat dissipation cavity is provided with a microcrystal copper powder electroplating layer.

[0014] Part or all of the lower wall surface of the liquid flow heat dissipation cavity is provided with a microcrystal copper powder electroplating layer, and part or all of the upper wall surface of the liquid flow heat dissipation cavity is provided with a microcrystal copper powder electroplating layer.

[0015] The 3D microcrystal heat dissipation device is provided with a lower cover, a middle partition plate and an upper cover, the middle partition plate is sealingly covered on the lower cover to form the capillary phase-change heat conduction cavity, and the upper cover is sealingly buckled on the middle partition plate from the top to form the liquid flow heat dissipation cavity.

[0016] Preferably, the middle partition plate is provided with a plate body and a plurality of flow resistance pieces for delaying the flow speed of refrigerant and increasing the heat dissipation area, all the flow resistance pieces are fixedly connected to the upper surface of the plate body, and the flow resistance pieces are located in the interior of the liquid flow heat dissipation cavity.

[0017] Preferably, part or all of the plate body is provided with a microcrystal copper powder electroplating layer, and the outer surfaces of all or part of the flow resistance pieces are provided with a microcrystal copper powder electroplating layer.

[0018] Preferably, the middle partition plate is further provided with a first toothed fin heat dissipation piece, the first toothed fin heat dissipation piece is fixedly connected to the upper surface of the plate body of the middle partition plate, and the first toothed fin heat dissipation piece is located in the interior of the liquid flow heat dissipation cavity.

[0019] Preferably, the upper cover is provided with a cover body and a flow resistance piece for delaying the flow speed of refrigerant, the flow resistance piece is welded or integrally connected to the upper surface of the plate body, and the flow resistance piece is located in the interior of the liquid flow heat dissipation cavity.

[0020] Preferably, part or all of the cover body is provided with a microcrystal copper powder electroplating layer, and the outer surfaces of all or part of the flow resistance pieces are provided with or not provided with a microcrystal copper powder electroplating layer.

[0021] Preferably, the upper cover is further provided with a second toothed fin heat dissipation piece, the second toothed fin heat dissipation piece is fixedly connected to the upper surface of the cover body of the upper cover.

[0022] The utility model discloses a 3D microcrystalline heat dissipation device, still set up for radiating heat heat pipe, the heat pipe fixed connection in the inside of liquid flow heat dissipation cavity, the both ends of heat pipe are closed, the inner wall surface of heat pipe is provided with microcrystalline copper powder electroplated layer, and the inside of heat pipe is in vacuum state and fills with refrigerant.

[0023] Preferably, the outer surface of the heat pipe is provided with a microcrystalline copper powder electroplated layer; or the outer surface of the heat pipe is not provided with a microcrystalline copper powder electroplated layer.

[0024] Preferably, the inner wall surface of the capillary phase change heat conduction cavity is provided with a microcrystalline copper powder electroplated layer, and the capillary phase change heat conduction cavity is in a vacuum state and filled with refrigerant.

[0025] The utility model discloses a 3D microcrystalline heat dissipation device, which is provided with a capillary phase change heat conduction cavity and a liquid flow heat dissipation cavity that are attached to each other; the capillary phase change heat conduction cavity is in a sealed structure, and the liquid flow heat dissipation cavity is sealingly connected with an inlet pipe and an outlet pipe. The 3D microcrystalline heat dissipation device conducts heat from a heat source to the liquid flow heat dissipation cavity through the refrigerant in the capillary phase change heat conduction cavity, and then conducts the heat out of the device through the flowing refrigerant in the liquid flow heat dissipation cavity, thereby achieving high-efficiency heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0026] The utility model is further described with reference to the drawings, but the content in the drawings does not constitute any limitation on the utility model.

[0027] Fig. 1 is a perspective view of the 3D microcrystalline heat dissipation device.

[0028] Fig. 2 is a cross-sectional view of the 3D microcrystalline heat dissipation device of Example 1.

[0029] Fig. 3 is a cross-sectional view of the 3D microcrystalline heat dissipation device of Example 2.

[0030] Fig. 4 is a cross-sectional view of the 3D microcrystalline heat dissipation device of Example 3.

[0031] Fig. 5 is a cross-sectional view of the 3D microcrystalline heat dissipation device of Example 4.

[0032] Fig. 6 is a perspective view of the baffle with a rectangular parallelepiped-shaped flow resistance member.

[0033] Fig. 7 is a perspective view of the baffle with a prism-shaped flow resistance member.

[0034] Fig. 8 is a perspective view of the baffle with a cylindrical flow resistance member.

[0035] Fig. 9 is a perspective view of the baffle with an irregular flow resistance member.

[0036] Fig. 10 is a cross-sectional view of the 3D microcrystalline heat dissipation device of Example 5.

[0037] Fig. 11 is a perspective view of the upper cover.

[0038] Fig. 12 is a sectional view of the 3D microcrystal heat dissipation device of Example 6.

[0039] Fig. 13 is a sectional view of the 3D microcrystal heat dissipation device of Example 7.

[0040] Fig. 14 is a sectional view of the 3D microcrystal heat dissipation device of Example 8.

[0041] Fig. 15 is a sectional view of the 3D microcrystal heat dissipation device of Example 9.

[0042] Fig. 16 is a sectional view of the 3D microcrystal heat dissipation device of Example 10.

[0043] Fig. 17 is a sectional view of the 3D microcrystal heat dissipation device of Example 11.

[0044] Fig. 18 is a sectional view of the 3D microcrystal heat dissipation device of Example 11.

[0045] Fig. 19 is a sectional view of the 3D microcrystal heat dissipation device of Example 12.

[0046] In Figs. 1-19, there are:

[0047] the capillary phase-change heat conduction cavity 10, the liquid flow heat dissipation cavity 20,

[0048] the upper cover 100, the cover body 110, the liquid inlet pipe 120, the liquid outlet pipe 130, the flow resistance sheet 140, the second gullet heat dissipation sheet 150,

[0049] the middle partition plate 200, the plate body 210, the flow resistance member 220, the first gullet heat dissipation sheet 230,

[0050] the lower cover 300, the heat pipe 400, the microcrystal copper powder electroplating layer 500. DETAILED DESCRIPTION

[0051] The technical solutions of the present application are further described in connection with the following examples.

[0052] Example 1

[0053] A 3D microcrystal heat dissipation device, as shown in Figs. 1 and 2, is provided with a capillary phase-change heat conduction cavity 10 and a liquid flow heat dissipation cavity 20 which are attached to each other; the capillary phase-change heat conduction cavity 10 is in a sealed structure, and the liquid flow heat dissipation cavity 20 is sealingly connected with a liquid inlet pipe 120 and a liquid outlet pipe 130.

[0054] The 3D microcrystal heat dissipation device is provided with a lower cover 300, a middle partition plate 200 and an upper cover 100, the middle partition plate 200 is sealed and covered on the lower cover 300 to form a capillary phase change heat conduction cavity 10, and the upper cover 100 is sealed and buckled on the middle partition plate 200 from the top to form a liquid flow heat dissipation cavity 20.

[0055] The liquid flow heat dissipation cavity 20 of the utility model can quickly take away the heat of the middle partition plate 200 through the flowing refrigerant. The refrigerant in the liquid flow heat dissipation cavity 20 can be water, alcohol, acetone, R12, freon or other components, etc. In the embodiment, the refrigerant in the liquid flow heat dissipation cavity 20 is freon, and the refrigerant in the capillary phase change heat conduction cavity 10 is water. The refrigerant in the liquid flow heat dissipation cavity 20 can be the same as or different from the refrigerant in the capillary phase change heat conduction cavity 10, and is determined according to the actual situation.

[0056] It should be noted that the lower surface of the lower cover 300 of the 3D microcrystal heat dissipation device is attached to the heat source when the 3D microcrystal heat dissipation device is used.

[0057] The inner wall surface of the capillary phase change heat conduction cavity 10 is provided with a microcrystal copper powder electroplating layer 500, and the capillary phase change heat conduction cavity 10 is in a vacuum state and filled with refrigerant.

[0058] It should be noted that the microcrystal copper powder electroplating layer 500 of the utility model is obtained from the copper powder metal plating layer, metal substrate, energy-saving anti-explosion 3D microcrystal heat dissipation device and preparation process of CN107557825B. Moreover, a column or a supporting rib is arranged in the capillary phase change heat conduction cavity 10, and the column and the supporting rib are welded or integrally connected to the inner surface of the capillary phase change heat conduction cavity 10. The heat dissipation principle of the capillary phase change heat conduction cavity 10 of the utility model is the same as that of CN107557825B, that is, in a non-heated state, the refrigerant liquid of the capillary phase change heat conduction cavity 10 is immersed in the copper powder metal plating layer and is basically in a saturated state. When the capillary phase change heat conduction cavity 10 is heated by a heat source, the refrigerant of the copper powder metal plating layer of the lower cover 300 is heated and evaporated, part of the vapor reaches the middle partition plate 200 and is cooled, and part of the vapor meets the copper powder metal plating layer on the surface of the column or the supporting rib and is cooled, and condenses and flows back to the lower cover 300 along the column or the supporting rib, so as to realize the heat dissipation circulation from the lower wall surface to the upper wall surface. The structure of the capillary phase change heat conduction cavity 10 of the utility model does not belong to the invention, and is the same as the copper powder metal plating layer and the inner cavity of the 3D microcrystal heat dissipation device having the refrigerant gas-liquid phase change function in the prior art. The utility model is based on the 3D microcrystal heat dissipation device and further increases a liquid flow heat dissipation cavity 20.

[0059] It should be noted that the refrigerant enters the liquid flow heat dissipation cavity 20 from the liquid inlet pipe 120, and then is discharged from the liquid outlet pipe 130, and the heat absorbed by the capillary phase change heat conduction cavity 10 from the heat source is quickly taken away. Compared with the prior art 3D microcrystalline heat dissipation device only provided with a microcrystalline copper powder electroplating layer 500, the heat dissipation effect of the present application is further improved.

[0060] The 3D microcrystalline heat dissipation device conducts heat from the heat source to the liquid flow heat dissipation cavity 20 through the gas-liquid phase change of the refrigerant inside the capillary phase change heat conduction cavity 10, and then takes the heat out of the outside through the flowing refrigerant in the liquid flow heat dissipation cavity 20, realizing high-efficiency heat dissipation effect.

[0061] Embodiment 2

[0062] A 3D microcrystalline heat dissipation device, as shown in FIG. 3, has the same other features as Embodiment 1, and further has the following features: the liquid flow heat dissipation cavity 20 of the present embodiment is a submerged microcrystalline structure liquid flow heat dissipation cavity; the bottom surface position of the inner cavity of the submerged microcrystalline structure liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer 500.

[0063] Specifically, the lower wall surface part or the whole of the liquid flow heat dissipation cavity 20 of the present embodiment is provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with a microcrystalline copper powder electroplating layer 500. The specific embodiment is that the lower wall surface of the liquid flow heat dissipation cavity 20 is provided with a microcrystalline copper powder electroplating layer 500.

[0064] It should be noted that the microcrystalline copper powder electroplating layer 500 of the present embodiment has many gaps, and these gap positions absorb refrigerant. When the heat is absorbed by the middle partition plate 200, the capillary phenomenon of the microcrystalline copper powder electroplating layer 500 will expel the refrigerant outward, push the refrigerant to move, make the refrigerant flow outward and be discharged from the liquid outlet, and new refrigerant is supplemented into the gap inside the microcrystalline copper powder electroplating layer 500, so the heat of the middle partition plate 200 can be quickly taken away.

[0065] It has been verified through implementation that, under the same conditions, the heat dissipation efficiency of the 3D microcrystalline heat dissipation device of the present embodiment is improved by 35% compared with the 3D microcrystalline heat dissipation device of Embodiment 1.

[0066] Embodiment 3

[0067] A 3D microcrystalline heat dissipation device, as shown in FIG. 4, has the same other features as Embodiment 2, and further has the following features: the lower wall surface of the liquid flow heat dissipation cavity 20 is provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is provided with a microcrystalline copper powder electroplating layer 500.

[0068] Compared with the embodiment 2, the embodiment is characterized in that the microcrystalline copper powder electroplating layer 500 is arranged on the upper wall surface and the lower wall surface of the liquid flow heat dissipation cavity 20, so that the coverage area of the microcrystalline copper powder electroplating layer 500 is further expanded, and the heat dissipation effect is further improved.

[0069] Embodiment 4

[0070] A 3D microcrystalline heat dissipation device is shown in Fig. 5, and other features are the same as those of the embodiment 1, and is further characterized in that the middle partition plate 200 is provided with a plate body 210 and a plurality of flow resistance members 220 for delaying the flow rate of the refrigerant and increasing the heat dissipation area, all the flow resistance members 220 are welded or integrally connected to the upper surface of the plate body 210, and the flow resistance members 220 are located inside the liquid flow heat dissipation cavity 20. The flow resistance members 220 of the embodiment are integrally connected to the upper surface of the plate body 210, the lower wall surface of the liquid flow heat dissipation cavity 20 is entirely provided with the microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with the microcrystalline copper powder electroplating layer 500. The plate body 210 of the embodiment is entirely provided with the microcrystalline copper powder electroplating layer 500, and the outer surfaces of all the flow resistance members 220 are provided with the microcrystalline copper powder electroplating layer 500.

[0071] It should be noted that the flow resistance members 220 of the embodiment can also be partially provided with the microcrystalline copper powder electroplating layer 500, and the other part is not provided with the microcrystalline copper powder electroplating layer 500.

[0072] It should be noted that the microcrystalline copper powder electroplating layer 500 of the liquid flow heat dissipation cavity 20 has the same effect as that of the embodiment 2. The flow resistance members 220 of the embodiment have the effect of resisting the flow of the refrigerant, prolonging the flow time of the refrigerant in the liquid flow heat dissipation cavity 20, and increasing the surface area of the middle partition plate 200, thereby improving the heat conduction effect with the refrigerant.

[0073] The shape of the flow resistance members 220 of the embodiment is cylindrical. It should be further noted that the shape of the flow resistance members 220 of the utility model is not limited to the cylindrical shape in the embodiment, and can be cylindrical, prismatic, cuboid, or other irregular shapes, as shown in Figs. 6 to 9, as long as the shape can resist the flow of the refrigerant.

[0074] Compared with the embodiment 2, the embodiment prolongs the flow time of the refrigerant in the liquid flow heat dissipation cavity 20 by increasing the flow resistance members 220, and increases the contact time of the refrigerant with the liquid flow heat dissipation cavity 20. At the same time, the flow resistance members 220 can increase the surface area and improve the contact area with the refrigerant, thereby further improving the heat dissipation effect.

[0075] Embodiment 5

[0076] A 3D microcrystal heat dissipation device, as shown in FIG. 10 and FIG. 11, has the same features as those of the embodiment 1, and further has the following features: the upper cover 100 is provided with a cover body 110 and a flow resistance sheet 140 for delaying the flow rate of the refrigerant, the flow resistance sheet 140 is fixedly connected to the upper surface of the inner side of the cover body 110, and the flow resistance sheet 140 is located inside the liquid flow heat dissipation cavity 20.

[0077] It should be noted that the flow resistance sheet 140 plays a role of flow resistance to the refrigerant, and prolongs the flow time of the refrigerant in the liquid flow heat dissipation cavity 20.

[0078] Compared with the embodiment 1, the embodiment prolongs the flow time of the refrigerant in the liquid flow heat dissipation cavity 20 by adding the flow resistance sheet 140, and increases the contact time of the refrigerant with the liquid flow heat dissipation cavity 20, thereby further improving the heat dissipation effect.

[0079] Embodiment 6

[0080] A 3D microcrystal heat dissipation device, as shown in FIG. 12, has the same features as those of the embodiment 1, and further has the following features: the upper cover 100 is further provided with a second toothed fin 150, and the second toothed fin 150 is fixedly connected to the upper surface of the cover body 110 of the upper cover 100.

[0081] It should be noted that the second toothed fin 150 has a plurality of parallel metal sheets, and the second toothed fin 150 is prepared by a shovel. The second toothed fin 150 plays a role of increasing the surface area of the upper cover 100, so that the heat is quickly conducted to the external environment.

[0082] The embodiment increases the second toothed fin 150 on the upper cover 100, so that the liquid flow heat dissipation cavity can take away the heat not only by the flowing refrigerant, but also by the air cooling effect of the second toothed fin 150.

[0083] Embodiment 7

[0084] A 3D microcrystal heat dissipation device, as shown in FIG. 13, has the same features as those of the embodiment 1, and further has the following features: the middle partition plate 200 is provided with a plate body 210, a plurality of flow resistance members 220 for delaying the flow rate of the refrigerant and increasing the heat dissipation area, and a first toothed fin 230, all the flow resistance members 220 are welded to the upper surface of the plate body 210, and the flow resistance members 220 are located inside the liquid flow heat dissipation cavity 20, and the first toothed fin 230 is fixedly connected to the lower surface of the plate body 210 of the middle partition plate 200, and the first toothed fin 230 is located inside the liquid flow heat dissipation cavity 20.

[0085] The lower wall surface of the liquid flow heat dissipation cavity 20 is provided with a microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with the microcrystalline copper powder electroplating layer 500. Specifically, the lower wall surface of the liquid flow heat dissipation cavity 20 except the first toothed fin 230 is uniformly provided with the microcrystalline copper powder electroplating layer 500, and the outer surface of the flow resistance piece 220 is also provided with the microcrystalline copper powder electroplating layer 500.

[0086] The first toothed fin 230 of the embodiment has a plurality of parallel metal sheets, and is prepared by a shovel. The first toothed fin 230 plays a role of resisting flow of the refrigerant, prolongs the flow time of the refrigerant in the liquid flow heat dissipation cavity 20, and increases the surface area of the partition plate 200. The outer surface of the first toothed fin 230 of the embodiment is not provided with the microcrystalline copper powder electroplating layer 500.

[0087] The embodiment simultaneously sets the flow resistance piece 220 and the first toothed fin 230 in the liquid flow heat dissipation cavity 20, simultaneously prolongs the flow time of the refrigerant in the liquid flow heat dissipation cavity 20 by the flow resistance piece 220 and the first toothed fin 230, and improves the heat exchange time with the refrigerant.

[0088] Embodiment 8

[0089] A 3D microcrystalline heat dissipation device, as shown in FIG. 14, has the same features as Embodiment 1, and further has the following features: the upper cover 100 is provided with a cover body 110 and a flow resistance piece 140 for slowing down the flow speed of the refrigerant, the flow resistance piece 140 is fixedly connected to the upper surface of the inner side of the cover body 110, and specifically the flow resistance piece 140 is located in the interior of the liquid flow heat dissipation cavity 20.

[0090] The partition plate 200 is provided with a plate body 210 and a plurality of flow resistance pieces 220 for slowing down the flow speed of the refrigerant and increasing the heat dissipation area, all the flow resistance pieces 220 are fixedly connected to the upper surface of the plate, and the flow resistance pieces 220 are located in the interior of the liquid flow heat dissipation cavity 20.

[0091] The embodiment further sets a heat pipe 400 for heat dissipation, the heat pipe 400 is fixedly connected to the interior of the liquid flow heat dissipation cavity 20, both ends of the heat pipe 400 are closed, the inner wall surface of the heat pipe 400 is provided with a microcrystalline copper powder electroplating layer 500, the interior of the heat pipe 400 is in a vacuum state and filled with the refrigerant. The lower wall surface of the liquid flow heat dissipation cavity 20 is entirely provided with the microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with the microcrystalline copper powder electroplating layer 500.

[0092] The outer surface of the heat pipe 400 is provided with the microcrystalline copper powder electroplating layer 500, or the outer surface of the heat pipe 400 is not provided with the microcrystalline copper powder electroplating layer 500. In the embodiment, the outer surface of the heat pipe 400 is provided with the microcrystalline copper powder electroplating layer 500, compared with not being provided with the microcrystalline copper powder electroplating layer 500, the microcrystalline copper powder electroplating layer 500 is added on the outer surface of the heat pipe 400, the coverage of the microcrystalline copper powder electroplating layer 500 can be further improved, and the heat dissipation effect is further improved.

[0093] It should be noted that the lower wall surface of the liquid flow heat dissipation cavity 20 is provided with the microcrystalline copper powder electroplating layer 500. It should be further noted that the heat pipe 400 plays a role in blocking the flow of the refrigerant, prolongs the flow time of the refrigerant in the liquid flow heat dissipation cavity 20, and the heat pipe 400 can also bring the heat source heat to the refrigerant of the capillary phase change heat conduction cavity 10 through the refrigerant gas-liquid phase change, like the capillary phase change heat conduction cavity 10.

[0094] In the embodiment, the flow blocking piece 220 and the heat pipe 400 are arranged in the liquid flow heat dissipation cavity 20 at the same time, the flow blocking piece 220 and the heat pipe 400 prolong the flow time of the refrigerant in the liquid flow heat dissipation cavity 20 at the same time, the heat exchange time with the refrigerant is improved, and the refrigerant gas-liquid phase change is carried out in the heat pipe 400, and the heat dissipation effect is further improved.

[0095] Embodiment 9

[0096] A 3D microcrystalline heat dissipation device, as shown in FIG. 15, has the same other features as embodiment 1, and further has the following features: the upper cover 100 is provided with a cover body 110, a flow blocking piece 140 for delaying the flow rate of the refrigerant, and a second toothed heat dissipation fin 150, the flow blocking piece 140 is fixedly connected to the inner upper surface of the cover body 110, and the flow blocking piece 140 is located in the interior of the liquid flow heat dissipation cavity 20, and the second toothed heat dissipation fin 150 is fixedly connected to the upper surface of the cover body 110 of the upper cover 100.

[0097] The middle partition plate 200 is provided with a plate body 210 and a plurality of flow blocking pieces 220 for delaying the flow rate of the refrigerant and increasing the heat dissipation area, all the flow blocking pieces 220 are fixedly connected to the upper surface of the plate, and the flow blocking pieces 220 are located in the interior of the liquid flow heat dissipation cavity 20. The lower wall surface of the liquid flow heat dissipation cavity 20 is provided with the microcrystalline copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with the microcrystalline copper powder electroplating layer 500.

[0098] It is verified through implementation that, under the same conditions, the heat dissipation efficiency of the 3D microcrystalline heat dissipation device of the embodiment is improved by more than 68% compared with the 3D microcrystalline heat dissipation device of embodiment 1.

[0099] Embodiment 10

[0100] A 3D microcrystal heat dissipation device, as shown in Figure 16, other features are the same as example 1, also has the following characteristics: the upper cover 100 is provided with a cover body 110 and a second notched fin 150, the flow blocking piece 140 is fixedly connected to the lower surface of the cover body 110, and the second notched fin 150 is fixedly connected to the upper surface of the cover body 110 of the upper cover 100.

[0101] The middle partition plate 200 is provided with a plate body 210 and a plurality of flow blocking pieces 220 for delaying the flow rate of the refrigerant and increasing the heat dissipation area, all the flow blocking pieces 220 are fixedly connected to the upper surface of the plate, and the flow blocking pieces 220 are located inside the liquid flow heat dissipation cavity 20. The lower wall surface of the liquid flow heat dissipation cavity 20 is provided with a microcrystal copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is not provided with a microcrystal copper powder electroplating layer 500.

[0102] The second notched fin 150 is added to the upper cover 100, so that the liquid flow heat dissipation cavity can take away heat not only through the flowing refrigerant but also through the air cooling effect of the second notched fin 150.

[0103] Example 11

[0104] A 3D microcrystal heat dissipation device, as shown in Figure 17, other features are the same as example 9, the difference is that the lower surface of the lower cover 300 can be convex downward, and the convex part can be attached to the heat source, as shown in Figure 17; the lower surface of the lower cover 300 is concave upward, as shown in Figure 18, the concave part can be embedded with the heat source, and the specific shape of the lower cover 300 of the utility model can be determined according to the actual application scene, so as to be attached to the heat source and ensure the heat dissipation effect.

[0105] The lower cover 300 of the embodiment can be adjusted according to the position of the heat source, which is convenient for being attached to the heat source.

[0106] Example 12

[0107] A 3D microcrystal heat dissipation device, as shown in Figure 19, other features are the same as example 9, the difference is that: the outer surface of all or part of the flow blocking piece 140 of the utility model is provided with a microcrystal copper powder electroplating layer 500. The embodiment is that all the flow blocking pieces 140 are provided with a microcrystal copper powder electroplating layer 500, compared with part of the flow blocking pieces 140 provided with a microcrystal copper powder electroplating layer 500, the coverage of the microcrystal copper powder electroplating layer 500 can be further improved by providing the microcrystal copper powder electroplating layer 500 on all the flow blocking pieces 140, so as to further improve the heat dissipation effect.

[0108] The lower wall surface of the liquid flow heat dissipation cavity 20 is provided with a microcrystal copper powder electroplating layer 500, and the upper wall surface of the liquid flow heat dissipation cavity 20 is provided with a microcrystal copper powder electroplating layer 500.

[0109] Compared with the embodiment 3, the embodiment can increase the flow time of the refrigerant by the flow blocking piece 140, and the flow blocking piece 140 of the embodiment is further provided with the microcrystalline copper powder electroplating layer 500, so that the coverage area of the microcrystalline copper powder electroplating layer 500 is further expanded, and the heat dissipation effect is further improved.

[0110] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the scope of protection of the present application. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present application.

Claims

1. A 3D microcrystalline heat dissipation device, characterized in that: The capillary phase change heat conduction cavity and the liquid flow heat dissipation cavity are arranged in mutual adhesion; The capillary phase change heat conduction cavity is in a sealed structure, and the liquid flow heat dissipation cavity is sealingly connected with the liquid inlet pipe and the liquid outlet pipe.

2. The 3D microcrystal heat dissipation device according to claim 1, characterized in that: The liquid flow heat dissipation cavity is an immersed microcrystalline structure liquid flow heat dissipation cavity. The bottom surface of the inner cavity of the immersed microcrystalline structure liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer.

3. The 3D microcrystal heat dissipation device according to claim 2, characterized in that: Part or all of the lower wall surface of the liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer, and part or all of the upper wall surface of the liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer. Part or all of the lower wall surface of the liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer, and part or all of the upper wall surface of the liquid flow heat dissipation cavity is provided with a microcrystalline copper powder electroplating layer. The lower cover, the middle partition plate and the upper cover are arranged, the middle partition plate is sealingly covered on the lower cover to form the capillary phase change heat conduction cavity, and the upper cover is sealingly buckled on the middle partition plate from the top to form the liquid flow heat dissipation cavity.

4. The 3D microcrystal heat dissipating device according to any one of claims 1 to 3, characterized in that: The middle partition plate is provided with a plate body and a plurality of flow resistance pieces for delaying the flow speed of the refrigerant and increasing the heat dissipation area, the flow resistance pieces are welded or integrally connected to the upper surface of the plate body, and the flow resistance pieces are located in the interior of the liquid flow heat dissipation cavity.

5. The 3D microcrystal heat dissipation device according to claim 4, characterized in that: Part or all of the plate body is provided with a microcrystalline copper powder electroplating layer, and the outer surfaces of all or part of the flow resistance pieces are provided with a microcrystalline copper powder electroplating layer. The middle partition plate is further provided with a first toothed fin, the first toothed fin is fixedly connected to the upper surface of the plate body of the middle partition plate, and the first toothed fin is located in the interior of the liquid flow heat dissipation cavity.

6. The 3D microcrystal heat dissipation device according to claim 4, characterized in that: A heat pipe for heat dissipation is further arranged, the heat pipe is fixedly connected to the interior of the liquid flow heat dissipation cavity, both ends of the heat pipe are closed, the inner wall surface of the heat pipe is provided with a microcrystalline copper powder electroplating layer, the interior of the heat pipe is in a vacuum state and is filled with refrigerant; 7. The 3D microcrystal heat dissipating device according to claim 4, wherein: The outer surface of the heat pipe is provided with a microcrystalline copper powder electroplating layer; or the outer surface of the heat pipe is not provided with a microcrystalline copper powder electroplating layer. The upper cover is provided with a cover body and a flow resistance piece for delaying the flow speed of the refrigerant, the flow resistance piece is fixedly connected to the upper surface of the inner side of the cover body, and the flow resistance piece is located in the interior of the liquid flow heat dissipation cavity.

8. The 3D microcrystal heat dissipating device according to claim 4, wherein: Part or all of the cover body is provided with a microcrystalline copper powder electroplating layer, and the outer surfaces of all or part of the flow resistance pieces are provided with or not provided with a microcrystalline copper powder electroplating layer. The upper cover is further provided with a second toothed fin, the second toothed fin is fixedly connected to the upper surface of the cover body of the upper cover.

9. The 3D microcrystal heat dissipating device according to claim 4, wherein: The inner wall surface of the capillary phase change heat conduction cavity is provided with a microcrystalline copper powder electroplating layer, and the interior of the capillary phase change heat conduction cavity is in a vacuum state and is filled with refrigerant.

10. The 3D microcrystal heat dissipating device according to any one of claims 1 to 3, characterized in that: ​

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