Manufacturing apparatus for semiconductor device and method for manufacturing same

Abstract

A manufacturing apparatus (10) for a semiconductor device is provided with: a chip holder (12) for holding a dicing tape (110), to which a plurality of chips (100) are attached, in a posture in which the plurality of chips (100) face downward in a gravity direction; and a pickup tool (20) for picking up, in a non-contact manner, a target chip (100a), which is one of the plurality of chips (100), from a lower side of the chip holder (12).

Description

Semiconductor device manufacturing apparatus and manufacturing method

[0001] This specification discloses a semiconductor device manufacturing apparatus and manufacturing method that picks up a target chip in a non-contact manner.

[0002] In recent years, in order to further reduce the size and increase the density of semiconductor devices, there has been a demand for technology for holding chips without contact. For example, Patent Document 1 discloses a non-contact chuck that uses ultrasonic vibrations to hold a workpiece (chip) without contact. It is also conceivable that such a non-contact chuck could be used as a pick-up tool for picking up chips from a dicing tape.

[0003] JP 2006-73654 A JP 2002-184721 A

[0004] However, non-contact chucks typically have a small force that attracts the chip, making it difficult to properly peel the chip from the dicing tape using only the force of the non-contact chuck.

[0005] Patent Document 2 discloses a technique for making a chuck table that holds a wafer stand vertically on the ground, but does not suggest anything about picking up chips.

[0006] Therefore, this specification discloses a semiconductor device manufacturing apparatus and manufacturing method that can appropriately pick up target chips in a non-contact manner.

[0007] The semiconductor device manufacturing apparatus disclosed in this specification is characterized by comprising a chip holder that holds a dicing tape having a plurality of chips attached thereto in a position in which the plurality of chips face downward in the direction of gravity, and a pickup tool that picks up a target chip, which is one of the plurality of chips, from below the chip holder in a non-contact manner.

[0008] In this case, the device may further include a bonding tool that receives the target chip from the pickup tool and bonds it to a substrate, and the pickup tool may hand over the target chip to the bonding tool without moving up and down after picking it up.

[0009] Furthermore, the device may further include a movable stage that sucks some of the plurality of chips via the dicing tape, and the movable stage may not suck the target chip but may suck chips surrounding the target chip.

[0010] The pickup tool may also have a holding surface that holds the target chip, a vibration source that applies ultrasonic vibrations to the holding surface to impart ultrasonic holding force to the target chip, and a suction source that sucks the target chip onto the holding surface.

[0011] Furthermore, after picking up the target chip, the pickup tool may transfer the target chip to the bonding tool while keeping the ultrasonic holding force and the suction force of the suction source constant.

[0012] The apparatus may further include a controller for controlling the drive of the pickup tool, the controller pre-storing the weight of the tip and controlling the suction force of the pickup tool in accordance with the weight of the tip.

[0013] The method for manufacturing a semiconductor device disclosed in this specification is characterized in that a dicing tape having a plurality of chips attached thereto is held by a chip holder in an orientation in which the plurality of chips face downward in the direction of gravity, and a pickup tool is used to pick up a target chip, which is one of the plurality of chips, from below the chip holder in a non-contact manner.

[0014] According to the technology disclosed in this specification, the weight of the target chip can be used as an assist force for picking up, so that the target chip can be picked up appropriately without contact.

[0015] It is a schematic diagram showing the configuration of a manufacturing apparatus. It is a diagram showing the configuration of a pickup tool. It is a diagram showing how to pick up a target chip. It is a schematic diagram showing how to pick up a target chip from picking up to transferring. It is a schematic diagram showing a manufacturing apparatus of a comparative example.

[0016] A semiconductor device manufacturing apparatus 10 will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing the configuration of the manufacturing apparatus 10. The manufacturing apparatus 10 manufactures a semiconductor device by bonding a chip 100 to a substrate. During this manufacturing process, the chips 100 are picked up one by one from a chip supply unit 11 by a pickup tool 20 and transferred to a bonding tool 26. The bonding tool 26 manufactures the semiconductor device by bonding the chip 100 to a substrate (neither of which is shown) placed on a stage.

[0017] In the chip supply unit 11, a plurality of chips 100 are attached to a dicing tape 110. The dicing tape 110 is a sheet material having an adhesive layer formed on one side and having moderate elasticity. The wafer attached to this dicing tape 110 is cut and separated to form a plurality of chips 100.

[0018] The plurality of chips 100 are held by the chip holder 12 while being attached to the dicing tape 110. The chip holder 12 is, for example, a wafer ring 14. The wafer ring 14 is a ring-shaped member that holds the dicing tape 110 while surrounding the plurality of chips 100 (i.e., wafer). Here, as shown in FIG. 1 , in this example, the chip holder 12 holds the dicing tape 110 in an orientation in which the plurality of chips 100 face downward in the direction of gravity. The reason for arranging the chip holder 12 in such an orientation will be described later.

[0019] A pickup tool 20 and a camera 34 are arranged below the chip holder 12. The pickup tool 20 picks up a chip to be picked up (hereinafter referred to as a "target chip 100a") from the dicing tape 110 and transfers it to the bonding tool 26. The pickup tool 20 is movable in the horizontal and vertical directions. Here, the pickup tool 20 in this example holds the target chip 100a in a non-contact manner. The detailed configuration of this pickup tool 20 will be described later.

[0020] The camera 34 captures an image of the plurality of chips 100 held by the chip holder 12. The controller 28 calculates the position and inclination of each of the plurality of chips 100 in the horizontal plane based on the image acquired by the camera 34.

[0021] A movable stage 22 is disposed on the opposite side of the chip 100 across the dicing tape 110. The movable stage 22 sucks some of the chips 100 via the dicing tape 110. That is, suction holes 24 are formed in some parts of the movable stage 22, and the chips 100 are sucked by applying negative pressure to the suction holes 24 using a pump or the like. In this example, the movable stage 22 does not suck the target chip 100a, but sucks the chips 100 surrounding the target chip 100a. Note that the target chip 100a, i.e., the chip 100 to be picked up, is sequentially switched during the manufacturing process of the semiconductor device. The movable stage 22 changes its position depending on the switching of the target chip 100a. The provision of such a movable stage 22 effectively prevents chips 100 other than the target chip 100a from being accidentally peeled off from the dicing tape 110.

[0022] The bonding tool 26 bonds the chip 100 received from the pickup tool 20 to the substrate. In this example, the bonding tool 26 receives the chip 100 from the pickup tool 20 with the electrode surface 102 of the chip 100 facing the substrate, i.e., in a face-down state, and bonds it to the substrate.

[0023] The controller 28 controls the operation of the manufacturing apparatus 10. For example, the controller 28 controls the operation of the vibration source 36 and the suction source 42, which will be described later. The controller 28 also detects the position of the chip 100 based on an image captured by the camera 34, and controls the positions of the pickup tool 20 and the bonding tool 26. The controller 28 is physically a computer having a processor 30 and a memory 32. Although the controller 28 is illustrated in FIG. 1 as a single computer, the controller 28 may be configured by combining multiple physically separated computers.

[0024] Next, the configuration of the pickup tool 20 will be described in detail with reference to Fig. 2. As described above, the pickup tool 20 holds the chip 100 in a non-contact manner. As shown in Fig. 2, the pickup tool 20 includes a vibration source 36 and a suction source 42. The upper end surface of the pickup tool 20 functions as a holding surface 46 that holds the chip 100.

[0025] Suction holes 48 are formed in the holding surface 46. The suction holes 48 are fluidly connected to a suction source 42 via a suction path 50. The suction source 42 is, for example, a vacuum pump. The suction source 42 applies negative pressure to the suction holes 48 via the suction path 50. This negative pressure causes the chip 100 to be sucked onto the holding surface 46.

[0026] The pressure sensor 44 detects the pressure in the suction path 50. The controller 28 determines whether the target chip 100a has been successfully picked up based on the detected pressure output from the pressure sensor 44. That is, when the target chip 100a is not present on the holding surface 46, the detected pressure is close to atmospheric pressure. On the other hand, when the target chip 100a is picked up by the pickup tool 20 and the chip 100 approaches the holding surface 46, the detected pressure drops sharply. When the detected pressure drops sharply, the controller 28 determines that the target chip 100a has been successfully picked up.

[0027] The vibration source 36 has an ultrasonic vibrator 38 on the holding surface 46. The vibration source 36 includes, for example, the ultrasonic vibrator 38 and an AC power supply 40. The ultrasonic vibrator 38 is a vibration generating source that generates longitudinal vibrations upon receiving a drive signal, which is a voltage signal. The ultrasonic vibrator 38 includes, for example, lead zirconate titanate (commonly known as PZT) that vibrates upon receiving an AC voltage. The ultrasonic vibrator 38 is a bolt-tightened Langevin vibrator (commonly known as a BLT or BL vibrator) in which the PZT is sandwiched between metal blocks and tightened with screws (bolts). The AC power supply 40 applies an AC voltage of a frequency corresponding to a predetermined resonant frequency to the ultrasonic vibrator 38.

[0028] Driving the vibration source 36 causes the holding surface 46 to ultrasonically vibrate in the axial direction. The ultrasonic vibration of the holding surface 46 forms an ultrasonic squeeze film Sf between the holding surface 46 and a plane (e.g., an end face of the target chip 100a) closely facing the holding surface 46. The squeeze film Sf holds the target chip 100a on the holding surface 46 while keeping it spaced apart from the holding surface 46.

[0029] The controller 28 controls the driving of the vibration source 36 and the suction source 42 so that the holding surface 46 can hold the target chip 100a without contact. That is, as described above, when an alternating voltage is applied to the ultrasonic vibrator 38, the holding surface 46 undergoes ultrasonic vibration. When the target chip 100a is brought close to the holding surface 46 while this ultrasonic vibration is occurring, an ultrasonic squeeze effect occurs between the holding surface 46 and the target chip 100a. The ultrasonic squeeze effect is an effect in which, when one of two flat plates facing each other across a minute gap is vibrated, a pressure higher than the external pressure is generated within the gap due to the influence of viscosity within the gap. When this ultrasonic squeeze effect occurs, an air film, i.e., an ultrasonic squeeze film Sf, is formed between the target chip 100a and the holding surface 46, which prevents contact between the two, and a holding force is generated to hold the target chip 100a on the holding surface 46.

[0030] Here, the holding force generated by ultrasonic vibration (hereinafter referred to as "ultrasonic holding force") occurs in both a direction perpendicular to the holding surface 46 and a direction parallel to the holding surface 46 (i.e., the planar direction). That is, when the ultrasonic squeeze effect occurs, a force acts on the target chip 100a, lifting the target chip 100a from the holding surface 46. Furthermore, when the ultrasonic squeeze effect occurs, the target chip 100a attempts to remain within the vibration plane. Therefore, even if the target chip 100a is temporarily displaced in the planar direction due to an external force, the target chip 100a moves in the planar direction so that its entirety is positioned within the vibration plane, and attempts to return to a state facing the holding surface 46. In other words, by generating the ultrasonic squeeze effect, self-alignment that automatically corrects the planar position of the target chip 100a becomes possible.

[0031] The thickness of the ultrasonic squeeze film Sf, i.e., the amount of lift of the target chip 100a from the holding surface 46, increases as the ultrasonic energy increases. Also, the ultrasonic holding force increases as the ultrasonic energy increases.

[0032] In this example, to assist this ultrasonic holding force, a suction force due to negative pressure is also generated on the holding surface 46. With the target chip 100a floating above the holding surface 46, the controller 28 controls the driving of the suction source 42 and the vibration source 36 so that this suction force, the ultrasonic holding force, and gravity acting on the target chip 100a are balanced.

[0033] In this way, by using ultrasonic vibrations to hold the chip 100 in a non-contact manner with the pickup tool 20, it is possible to prevent foreign matter from adhering to the target chip 100a and also to reduce the mechanical load acting on the target chip 100a, thereby enabling higher quality bonding.

[0034] However, in the case of a non-contact pickup tool 20, there is a problem in that it is difficult to peel the target chip 100a from the dicing tape 110. In other words, when peeling the target chip 100a from the dicing tape 110, it is naturally necessary to attract the target chip 100a by the pickup tool 20. However, in the case of a contact pickup tool 20, the force that attracts the target chip 100a is small, and therefore the target chip 100a cannot be peeled from the dicing tape 110.

[0035] Therefore, for example, it is conceivable to peel the target chip 100a from the dicing tape 110 by poking the target chip 100a from the back side of the dicing tape 110 with a pin. However, in this case, the mechanical load acting on the target chip 100a increases, which may result in damage to the target chip 100a. Another possible solution is to use a dicing tape 110 with low adhesive strength. However, in this case, there is a problem in that the types of dicing tape 110 that can be used are limited.

[0036] Therefore, in this example, in order to properly peel off the target chips 100a with the non-contact pickup tool 20, multiple chips 100 are held facing downward in the direction of gravity, as shown in FIG. 1. The pickup tool 20 then picks up the target chips 100a from the lower side of the chip holder 12. With this configuration, the target chips 100a can be properly peeled off from the dicing tape 110. This will be explained in comparison with a comparative example.

[0037] 5 is a schematic diagram showing a manufacturing apparatus 10* of the comparative example. In the manufacturing apparatus 10* of the comparative example, a chip holder 12* holds a dicing tape 110 in an orientation in which the chips 100 face upward in the direction of gravity. A pickup tool 20* picks up a target chip 100a from above the chip holder 12*.

[0038] The lower part of Figure 3 shows the pickup of the target chip 100a using the comparative manufacturing apparatus 10*. As shown in the lower part of Figure 3, in this case, the target chip 100a is subjected to the adhesive force Fv of the dicing tape 110, the weight Fg of the target chip 100a, and the attractive force Fp of the pickup tool 20*. In the case of the comparative manufacturing apparatus 10*, the adhesive force Fv and the weight Fg are directed downward in the direction of gravity, and the attractive force Fp is directed upward in the direction of gravity. In order to peel the target chip 100a from the dicing tape 110, the attractive force Fp must exceed the resultant force of the adhesive force Fv and the weight Fg. However, as mentioned repeatedly, in the case of the non-contact pickup tool 20, the attractive force Fp is small, making it difficult to peel the target chip 100a from the dicing tape 110.

[0039] The upper part of Figure 3 shows how the target chip 100a is picked up by the manufacturing apparatus 10 of this example. As shown in the upper part of Figure 3, in this case, the adhesive force Fv is directed upward in the direction of gravity, and the weight Fg and attractive force Fp are directed downward in the direction of gravity. In other words, the attractive force Fp of the pickup tool 20 and the weight Fg are directed in the same direction, and the weight Fg assists in peeling the target chip 100a. As a result, even if the attractive force Fp is small, the target chip 100a can be properly peeled from the dicing tape 110.

[0040] As is clear from the above explanation, by holding multiple chips 100 facing downward in the direction of gravity, even the non-contact pickup tool 20 can properly pick up the target chips 100a. In particular, the manufacturing apparatus 10* of the comparative example had difficulty picking up large, heavy chips 100. However, the manufacturing apparatus 10 of this example can easily pick up such large, heavy chips 100.

[0041] Incidentally, minute foreign matter 120 may be generated as the pickup tool 20 moves or the target chip 100a is peeled off. In the case of the manufacturing apparatus 10* of the comparative example, as shown in the lower part of Figure 3, such foreign matter 120 may fall toward the dicing tape 110 and adhere to the chip 100. The adhesion of the foreign matter 120 to the chip 100 may result in a deterioration in the quality of the semiconductor device.

[0042] On the other hand, in the case of the manufacturing apparatus 10 of this example, as shown in the upper part of Fig. 3, the minute foreign matter 120 falls in a direction away from the dicing tape 110. This effectively prevents the foreign matter 120 from adhering to the chip 100, and ultimately prevents a deterioration in the quality of the semiconductor device.

[0043] 1, in the manufacturing apparatus 10 of this example, the pickup tool 20 picks up the target chip 100a in the same posture as when the target chip 100a is transferred to the bonding tool 26. This effectively prevents the target chip 100a from shifting in position or falling off. This will be described with reference to FIG.

[0044] FIG. 4 is a schematic diagram showing the process from picking up the target chip 100a to transferring it. In the case of the manufacturing apparatus 10* of the comparative example, as shown in the lower part of FIG. 4 and as repeatedly described above, the pickup tool 20* picks up the target chip 100a from above (S1). The pickup tool 20* then turns upside down to transfer the target chip 100a to the bonding tool 26 (S2). For example, the pickup tool 20* rotates around the rotation axis 52 shown in FIG. 5 to turn it upside down. The pickup tool 20* then moves to a transfer position (S4) and transfers the target chip 100a to the bonding tool 26.

[0045] In other words, the manufacturing apparatus 10* of the comparative example always required the pickup tool 20* to be inverted. During this inversion, the target chip 100a may be displaced or fall off the holding surface 46 due to centrifugal or inertial forces. When the ultrasonic squeeze film Sf is formed, even if slight misalignment occurs, the self-alignment function automatically corrects the misalignment. However, because correcting this misalignment takes some time, the pickup tool 20* must be temporarily stopped (S3) after being inverted. Furthermore, the holding surface 46 may be imaged with the camera 34 to confirm that the target chip 100a has not fallen off. In this case, the pickup tool 20* must also be stopped (S3) after being inverted. As a result, the manufacturing apparatus 10* of the comparative example increases the time required to transfer the target chip 100a, potentially increasing the lead time for semiconductor device manufacturing.

[0046] Furthermore, when the pickup tool 20* is inverted, inertial and centrifugal forces act on the target chip 100a, changing the angular relationship between the target chip 100a and the direction of gravity. To stably hold the target chip 100a in a non-contact manner under these conditions, the comparative manufacturing apparatus 10* must adjust the ultrasonic holding force and suction force according to the rotation angle and rotation speed. As a result, the comparative manufacturing apparatus 10* requires complicated control of the vibration source 36 and suction source 42.

[0047] On the other hand, in the case of the manufacturing apparatus 10 of this example, as shown in the upper part of Figure 4, the target chip 100a is picked up in the same posture as when it is transferred (S1). Therefore, the pickup tool 20 can be moved to the transfer position without inverting (S4). This effectively prevents the target chip 100a from shifting or falling off. Furthermore, with the manufacturing apparatus 10 of this example, turning upside down (S2) or temporarily stopping (S3) is not necessary, so the time required for these processes can be reduced, further shortening the lead time.

[0048] Furthermore, in the case of the manufacturing apparatus 10 of this example, since the pickup tool 20 is not turned upside down, after pickup, the target chip 100a can be transferred to the bonding tool 26 while maintaining constant ultrasonic holding force and suction force. As a result, control of the vibration source 36 and suction source 42 can be simplified.

[0049] As mentioned previously, in the manufacturing apparatus 10 disclosed in this specification, the weight Fg of the target chip 100a acts as a pickup assist force. Furthermore, the adhesive force Fv that attempts to secure the target chip 100a to the dicing tape 110 is proportional to the contact area between the target chip 100a and the dicing tape 110. Therefore, the suction force used during pickup may be changed depending on the weight Fg and contact area of ​​the target chip 100a. To enable such suction force control, the controller 28 may store the weight Fg and contact area of ​​the chip 100 in advance.

[0050] Furthermore, the configurations described so far are all examples, and other configurations may be changed as long as the configuration of claim 1 is included. For example, the movable stage 22 may be omitted as long as it is possible to prevent the chip 100 from falling off unintentionally.

[0051] 10, 10* Manufacturing apparatus, 11 Chip supply unit, 12, 12* Chip holder, 14 Wafer ring, 20, 20* Pickup tool, 22 Movable stage, 24 Suction hole, 26 Bonding tool, 28 Controller, 30 Processor, 32 Memory, 34 Camera, 36 Vibration source, 38 Ultrasonic vibrator, 40 AC power supply, 42 Suction source, 44 Pressure sensor, 46 Holding surface, 48 Suction hole, 50 Suction path, 52 Rotation axis, 100 Chip, 100a Target chip, 102 Electrode surface, 110 Dicing tape, 120 Foreign matter, Sf Squeeze film.

Claims

1. A semiconductor device manufacturing device comprising: a chip holder that holds a dicing tape having a plurality of chips attached thereto in an orientation in which the plurality of chips face downward in the direction of gravity; and a pickup tool that picks up a target chip, which is one of the plurality of chips, from below the chip holder in a non-contact manner.

2. The semiconductor device manufacturing apparatus according to claim 1, further comprising a bonding tool that receives the target chip from the pickup tool and bonds it to a substrate, and after picking up the target chip, the pickup tool passes the target chip to the bonding tool without moving up and down.

3. The semiconductor device manufacturing apparatus according to claim 1, further comprising a movable stage that sucks up some of the plurality of chips via the dicing tape, wherein the movable stage does not suck up the target chip, but instead sucks up chips around the target chip.

4. A semiconductor device manufacturing apparatus according to claim 1, characterized in that the pickup tool has: a holding surface that holds the target chip; a vibration source that applies ultrasonic vibrations to the holding surface to impart ultrasonic holding force to the target chip; and a suction source that sucks the target chip onto the holding surface.

5. A semiconductor device manufacturing apparatus according to claim 4, wherein the pickup tool, after picking up the target chip, passes the target chip to a bonding tool while keeping the ultrasonic holding force and the suction force of the suction source constant.

6. The semiconductor device manufacturing apparatus according to claim 1, further comprising a controller for controlling the operation of the pickup tool, wherein the controller stores the weight of the chip in advance and controls the suction force of the pickup tool in accordance with the weight of the chip.

7. A method for manufacturing a semiconductor device, comprising: holding a dicing tape having a plurality of chips attached thereto with a chip holder in an orientation in which the plurality of chips face downward in the direction of gravity; and using a pickup tool to pick up a target chip, which is one of the plurality of chips, from below the chip holder in a non-contact manner.

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