Die level test system and control method thereof

Abstract

According to one aspect of the present invention, provided are a die level test system and a control method thereof, the die level test system comprising: at least one sorter chamber module having at least one chuck base on which is mounted a mobile chuck on which a plurality of dies sawed off from a wafer are mounted, wherein each of the dies is transferred from a film body, on which the plurality of dies sawed off from the wafer are mounted, to the mobile chuck mounted on the chuck base; at least one test chamber module having at least one chuck base on which the mobile chuck is mounted, wherein the mobile chuck, on which the die is mounted, is received from the sorter chamber module, and the die mounted on the mobile chuck is tested; a loader module for loading and unloading the mobile chuck into and from the sorter chamber module and the test chamber module; and a control unit for controlling the sorter chamber module, the test chamber module, and the loader module.

Description

Die level test system and control method thereof

[0001] The present invention relates to a die level test system and a control method thereof, and more particularly, to a die level test system capable of quickly and accurately testing a die on which a wafer has been sawed, and a control method thereof.

[0002] Previously, products were manufactured through a packaging process following the dicing process, which separates wafers into individual die units.

[0003] Therefore, before the sawing operation to separate the wafer into die units, the wafer was tested at the wafer level and then the product manufacturing operation was performed.

[0004] However, recently, the method of manufacturing products by dicing wafers and stacking the separated dies is mainly used.

[0005] In the past, a burn-in test was performed on the entire wafer to check for defects in the wafer, and then each wafer was separated into individual units and packaged to manufacture the product. However, as semiconductor chip products become more sophisticated, the number of chips contained within a package has increased, and if a defect occurs in some of the chips contained within the package, there are increasing cases in which the entire semiconductor package becomes defective.

[0006] Therefore, there is a need for a device that performs testing at the die level, rather than the wafer level. However, since a single wafer is divided into multiple dies, testing each of these dies requires a significant amount of time.

[0007] The present invention is intended to solve the above problems, and an object of the present invention is to provide a die level test system and a control method thereof capable of testing multiple dies at the die level in a shorter period of time.

[0008] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0009] According to one aspect of the present invention, a die level test system is provided, comprising: at least one sorter chamber module having at least one chuck base on which a plurality of dies having a wafer sawed thereon are mounted, and each die is moved from a film body having a plurality of dies having a wafer sawed thereon to the mobile chuck mounted on the chuck base; at least one test chamber module having at least one chuck base on which the mobile chuck is mounted, and receiving the mobile chuck having the die mounted thereon from the sorter chamber module and testing the die mounted on the mobile chuck; a loader module for loading and unloading the mobile chuck into and from the sorter chamber module and the test chamber module; and a control unit for controlling the sorter chamber module, the test chamber module, and the loader module.

[0010] The sorter chamber module and the test chamber module may be arranged on one side of the loader module.

[0011] The test chamber modules can be placed on both sides of the loader module.

[0012] The above loader module may be integrated with the above sorter chamber module.

[0013] The sorter chamber module and the test chamber module may be arranged on one side of the loader module, and the test chamber module may be arranged on both sides of the sorter chamber module.

[0014] The above sorter chamber module and the above test chamber module can be arranged in a single layer.

[0015] The above sorter chamber module and the above test chamber module can be arranged in multiple layers.

[0016] The above film body may include a film on which a plurality of dies having wafers sawed thereon are placed; a frame that is joined to the edge of the film and maintains tension on the film;

[0017] The above sorter chamber module may include a first chamber having an entrance formed on one side through which the film body and the mobile chuck are introduced and removed, and forming a receiving space; a lower base disposed on the lower side of the first chamber and arranged to be movable in one and the other directions; a first chuck base provided on the lower base for lifting and lowering a film body or a mobile chuck introduced into the first chamber; a second chuck base provided on the lower base for lifting and lowering the film body transferred from the first chuck base; a transfer unit for transferring the film body mounted on the first chuck base to the second chuck base; and a picker for picking up a plurality of dies placed on the film body mounted on the second chuck base and placing them on an upper surface of the mobile chuck mounted on the first chuck base.

[0018] It may include an aligner for precisely adjusting the placement position of the die placed on the above mobile chuck.

[0019] The above picker can pick up at least some or all of the plurality of dies arranged on the film body at one time.

[0020] The test chamber module may include a second chamber having an inspection entrance formed therein for introducing and removing a mobile chuck having a plurality of dies mounted thereon, and forming an inspection space; a third chuck base disposed on the lower side of the second chamber and supporting the mobile chucks introduced into the second chamber in a movable manner; and a probe card disposed on the upper side of the second chamber and contacting each die mounted on the mobile chuck mounted on the third chuck base to test the characteristics of each die.

[0021] Meanwhile, according to another aspect of the present invention, a control method for a die level test system is provided, including a film loading step in which a loader module loads a film body on which a plurality of dies are mounted onto a first chuck base of a sorter chamber module; a film transfer step in which the film body mounted on the first chuck base within the sorter chamber module is transferred to a second chuck base; a mobile chuck loading step in which the loader module loads a mobile chuck onto the first chuck base of the sorter chamber module; a die transfer step in which a picker of the loader module mounts a plurality of dies mounted on a film body on the second chuck base onto a mobile chuck on the first chuck base; a mobile chuck transfer step in which the loader module removes the mobile chuck on which the dies are mounted from the sorter chamber module and transfers it to a third chuck base of a test chamber module; and a test step in which a probe card of the test chamber module contacts each die placed on the mobile chuck mounted on the third chuck base to perform a test.

[0022] After the above die transfer step, an alignment step for aligning the positions of each die mounted on the mobile chuck may be further included.

[0023] According to the above configuration, the die level test system and its control method according to the present invention can perform testing at the die level rather than the wafer level, thereby increasing the yield of the final package produced.

[0024] Additionally, since multiple dies can be tested at once rather than testing each die individually, the time required for testing is reduced, which has the effect of shortening the process time.

[0025] In addition, since the die can be moved and tested as a mobile chuck unit while placed on the mobile chuck, there is no need to re-place each die as the chamber is moved, which has the effect of further reducing the time required for testing.

[0026] In addition, the sorter chamber module and test chamber module can be freely arranged according to the required test capacity, which can increase the freedom of system installation.

[0027] In addition, the components that perform the test and the components that perform the work of moving the die to the mobile chuck are each separately provided, so that while the die is being tested in the test chamber module, the die of the film body can be moved to the mobile chuck in the sorter chamber module to perform the work for the next test, which has the effect of shortening the test time.

[0028] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0029] FIG. 1 is a drawing illustrating a die level test chuck applied to a die level test system according to one embodiment of the present invention.

[0030] FIG. 2 is a diagram illustrating an example of a die level test system according to one embodiment of the present invention.

[0031] FIG. 3 is a drawing illustrating an example of a film body used in a die level test system according to one embodiment of the present invention.

[0032] FIG. 4 is a drawing illustrating a film body being loaded into a sorter chamber module in a die level test system according to one embodiment of the present invention.

[0033] FIG. 5 is a drawing showing the transport section of the sorter chamber module lowered in a die level test system according to one embodiment of the present invention.

[0034] FIG. 6 is a drawing showing a film body placed on a transport section of a sorter chamber module in a die level test system according to one embodiment of the present invention.

[0035] Figure 7 is a drawing showing the film body placed on the transport section illustrated in Figure 6 from a different angle.

[0036] FIG. 8 is a drawing showing a die level test system according to one embodiment of the present invention, in which a mobile chuck is mounted on a first chuck base of a sorter chamber module and a film body is mounted on a second chuck base.

[0037] FIG. 9 is a drawing illustrating a die being picked up by a picker from a film body placed on a second chuck base in a die level test system according to one embodiment of the present invention.

[0038] FIG. 10 is a drawing illustrating a die picked by a picker in a die level test system according to one embodiment of the present invention being placed on a mobile chuck mounted on a first chuck base.

[0039] FIG. 11 is a drawing illustrating a mobile chuck on which a die is placed being removed from a sorter chamber module in a die level test system according to one embodiment of the present invention.

[0040] FIG. 12 is a drawing sequentially illustrating a process in which a picker picks up a die placed on a film body and places it on a mobile chuck in a die level test system according to one embodiment of the present invention.

[0041] FIG. 13 is a plan view illustrating a mobile chuck on which a die is placed in a die level test system according to one embodiment of the present invention.

[0042] FIG. 14 is a drawing illustrating a process in which a mobile chuck on which a die is placed is removed from a sorter chamber module and transferred to a test chamber module in a die level test system according to one embodiment of the present invention.

[0043] FIG. 15 is a drawing illustrating a mobile chuck with a die placed in a test chamber module being brought in and tested in a die level test system according to one embodiment of the present invention.

[0044] FIG. 16 is a drawing showing an arrangement of a test chamber module, a sorter chamber module, and a loader module of a die level test system according to one embodiment of the present invention.

[0045] FIGS. 17 to 19 are drawings illustrating various arrangements of a test chamber module, a sorter chamber module, and a loader module of a die level test system according to one embodiment of the present invention.

[0046] FIG. 20 is a flowchart illustrating a control method of a die level test system according to one embodiment of the present invention.

[0047] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein.

[0048] In order to clearly explain the present invention, parts that are not related to the description are omitted from the drawings, and the same reference numerals are given to the same or similar components throughout the specification.

[0049] The words and terms used in this specification and claims should not be construed as limited to their conventional or dictionary meanings, but rather should be interpreted in a way that is consistent with the technical concept of the present invention, based on the principles by which inventors can define terms and concepts to best describe their inventions. Therefore, the embodiments described in this specification and the configurations depicted in the drawings correspond to preferred embodiments of the present invention and do not represent all of the technical concepts of the present invention. Therefore, the configurations may have various equivalents and variations that can replace them at the time of filing of the present invention.

[0050] In this specification, terms such as "include" or "have" are intended to describe the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood as not excluding in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. When a component is said to be "in front of," "behind," "above," or "below" another component, unless there are special circumstances, it includes not only the case where it is arranged "in front of," "behind," "above," or "below" the other component in direct contact, but also the case where another component is arranged in between. Furthermore, when a component is said to be "connected" to another component, unless there are special circumstances, it includes the cases where it is directly connected to the other component as well as the case where it is indirectly connected to the other component.

[0051] Hereinafter, a die level test system according to one embodiment of the present invention will be described with reference to the drawings.

[0052]

[0053] Fig. 1 is a perspective view of a die level test chuck (1) applied to a die level test system according to one embodiment of the present invention. Referring to Fig. 1, the die level test chuck (1) may include a mobile chuck (11) and a chuck base (12).

[0054] For example, the mobile chuck (11) may have a circular plate shape. However, this is merely an example, and the shape of the mobile chuck (11) is not limited thereto. The mobile chuck (11) may be formed of a circular plate (110). In this case, a plurality of alignment patterns (111) may be formed on the plate (110). However, the shape of the plate (110) is not limited thereto.

[0055] The upper surface of the above plate (110) may be parallel to a plane defined by a first direction (DR1) and a second direction (DR2) intersecting the first direction (DR1). The upper surface of the plate (110) may correspond to the upper surface of the mobile chuck (11).

[0056] Hereinafter, a direction substantially perpendicular to the plane defined by the first direction (DR1) and the second direction (DR2) is defined as a third direction (DR3). The third direction (DR3) serves as a reference for distinguishing the plane and the back surface of each member. The third direction (DR3) may be substantially a direction perpendicular to the plate (110). In this specification, “on the plane” may be defined as a state viewed from the third direction (DR3). Hereinafter, the first to third directions (DR1, DR2, DR3) refer to the same drawing reference numerals as the directions indicated by the first to third direction axes, respectively.

[0057] A plurality of vacuum suction holes (110a) may be formed on the upper surface of the plate (110). The vacuum suction holes (110a) are connected to an external vacuum pump, and when the vacuum pump is operated, the vacuum suction holes (110a) can be converted into a vacuum state. Accordingly, a plurality of dies (218) described later can be suction-fixed on the upper surface of the mobile chuck (11).

[0058] At this time, the die (218) may be a wafer that has been sawed and divided. That is, a plurality of divided dies (218) are mounted on the mobile chuck (11). In addition, the die (218) may be transported while attached to a film body (220) described below for the convenience of transport, or may be mounted on the mobile chuck (11) while separated from the film body (220).

[0059] The above vacuum suction holes (110a) may be arranged in multiple numbers in the first direction (DR1) and the second direction (DR2). The vacuum suction holes (110a) may be arranged in multiple rows and multiple columns. The shape of the vacuum suction holes (110a) may be changed to various shapes and sizes as needed. For example, the vacuum suction holes (110a) may have a shape corresponding to a circle. However, the present invention is not limited thereto, and the shape and arrangement interval of the vacuum suction holes (110a) may be changed depending on the area of ​​the die (218), the spacing, etc.

[0060] The alignment pattern (111) may be arranged on the upper surface of the plate (110). The alignment pattern (111) may be arranged adjacent to each vacuum suction hole (110a) or may be arranged next to a row or column of the vacuum suction holes (110a) on the upper surface of the plate (110).

[0061] As the alignment pattern (111) is adjacent to the vacuum suction hole (110a), when each die (218) is placed on the vacuum suction hole (110a), the die (218) can be aligned with the alignment pattern (111) as a reference, making it easy to arrange the die (218) in an accurate position.

[0062] The above chuck base (12) can be placed under the mobile chuck (11). The mobile chuck (11) is mounted on the upper side of the chuck base (12) and can be detached from the chuck base (12). That is, the mobile chuck (11) is detachably mounted on the chuck base (12), and the chuck base (12) supports the mobile chuck (11).

[0063] When the number and arrangement of the above dies (218) are changed, the mobile chuck (11) must be replaced with one in which a vacuum suction hole (110a) corresponding to the changed arrangement of the dies (218) is formed. At this time, the inspection process of the dies (218) can be performed by replacing only the mobile chuck (11) without changing the chuck base (12). Accordingly, even if the arrangement shape of the dies (218) is changed, a combination of dies (218) having various arrangement shapes can be inspected quickly and easily. In addition, when it is necessary to transport the dies (218) during the test process of the dies (218), the transport of the dies (218) is possible by transporting the mobile chuck (11) on which each dies (218) are seated, so that there is no need to transport a plurality of dies (218) individually, and thus the process time can be significantly reduced.

[0064] As the mobile chuck (11) is installed on the upper side of the chuck base (12) and makes direct contact, heat generated from the die (218) can be conducted to the mobile chuck (11) and the chuck base (12).

[0065] The chuck base (12) may include a temperature sensor (121) and a temperature controller (122). The chuck base (12) may measure heat conducted from the die (218) through the temperature sensor (121) to estimate the temperature of the die (218).

[0066] Additionally, the chuck base (12) can cool the die (218) through a temperature controller (122) or generate heat to heat the die (218).

[0067] In addition, the chuck base (12) may be installed in various devices and locations other than the sorter chamber module (21) or test chamber module (23) described below or the sorter chamber module (21) or test chamber module (23), and may be positioned so that the mobile chuck (11) is placed in a required location.

[0068] At this time, the parts where one or more mobile chucks (11) and one or more chuck bases (12) come into contact with each other can be made to have a common shape, so that inspection of various arrangements and types of dies can be performed simultaneously.

[0069]

[0070] Fig. 2 is a plan view of a die level test system (2) including a chuck (1) for die level testing illustrated in Fig. 1. Referring to Fig. 2, the die level test system (2) may include a sorter chamber module (21), a loader module (22), a test chamber module (23), and a control unit (24).

[0071] The sorter chamber module (21) can place a die (218) on a mobile chuck (11). The loader module (22) can transfer the mobile chuck (11) from the sorter chamber module (21) to the test chamber module (23). The test chamber module (23) can inspect the electrical characteristics of the die (218) placed on the upper surface of the mobile chuck (11) using a probe tip (234). In addition, the control unit (24) can control the sorter chamber module (21), the loader module (22), and the test chamber module (23).

[0072] The process of placing a die (218) on the upper surface of a mobile chuck (11) within a sorter chamber module (21) and the process of inspecting the electrical characteristics of the die (218) within a test chamber module (23) are described in detail below.

[0073] In the description of the present embodiment, the loader module (22) is illustrated as having a robot arm shape for convenience of explanation. However, in the present invention, the loader module (22) does not necessarily have to have a robot arm shape, and any structure may be applied as long as it is a device that can load and unload the film body (220) and the mobile chuck (11) into and out of the sorter chamber module (21) and the test chamber module (23) or move them up, down, left, and right. In addition, the loader module (22) may be equipped to unload or stack the film body (220) and the mobile chuck (11) from a cassette (not illustrated). Although not illustrated in the drawing, the loader module (22) may be equipped with a pre-aligner (not illustrated) that aligns the die (218) placed on the film body (220) described later in advance.

[0074] Fig. 3 is a drawing showing a film body (220) supplied into the sorter chamber module (21). For the convenience of transport, a die (218) sawed from a wafer can be brought into the sorter chamber module (21) while being placed on a thin film (217), as shown in Fig. 3. In addition, a thin frame (219) having rigidity is coupled to the edge of the film (217) to fix the edge of the film (217) and maintain the tension of the film (217), and can serve as a support point that is held or supported during transport.

[0075] Hereinafter, the film (217) on which the die (218) is placed and the frame (219) that fixes the film (217) will be referred to as a film body (220). The film body (220) on which the die (218) is placed is supplied in a stacked manner in a cassette (not shown) not shown in the drawing, and the loader module (22) can take the film body (220) out of the cassette (not shown) and load it into the sorter chamber module (21) described later. Alternatively, the film body (220) on which the die (218) that has been tested can be loaded back into the cassette (not shown) and stored.

[0076] Figures 4 to 11 are cross-sectional views illustrating the sorter chamber module (21) of Figure 2. In addition, Figure 12 is a drawing illustrating a process in which a die (218) is transferred from the film body (220) to the mobile chuck (11). In addition, Figure 13 is a plan view illustrating a mobile chuck (11) in which a plurality of dies (218) are arranged.

[0077] As shown in FIGS. 2 and 4, a die level test system (2) according to one embodiment of the present invention may include a sorter chamber module (21), a test chamber module (23), a loader module (22), and a control unit (24).

[0078] The above-mentioned sorter chamber module (21) is provided with one or more mobile chucks (11) on which a plurality of dies (218) on which wafers are sawed are mounted, or chuck bases (12) on which a film body (220) is mounted, so that each die (218) can be moved and placed from the film body (220) on which a plurality of dies (218) on which wafers are sawed are mounted to the mobile chuck (11) mounted on the chuck base (12).

[0079] The test chamber module (23) is equipped with one or more chuck bases (12) on which the mobile chuck (11) is mounted, and can receive the mobile chuck (11) on which the die (218) is mounted from the sorter chamber module (21) and test the die (218) mounted on the mobile chuck (11). The loader module (22) can be equipped to load and unload the mobile chuck (11) into and out of the sorter chamber module (21) and the test chamber module (23).

[0080] In addition, the control unit (24) may be provided to control the sorter chamber module (21), the test chamber module (23), and the loader module (22).

[0081] As illustrated in FIG. 4, the sorter chamber module (21) may include a first chamber (210), an upper base (211), a picker (212), a transfer unit (213), a first lower base (214), a first chuck base (215), and a second chuck base (216).

[0082] The first chamber (210) may form an accommodation space (2101) therein. An upper base (211), a picker (212), a transfer unit (213), a first lower base (214), a first chuck base (215), and a second chuck base (216) may be accommodated within the accommodation space (2101). An entrance (2102) may be formed at one side of the first chamber (210). The entrance (2102) may connect the outside of the first chamber (210) and the accommodation space (2101). Accordingly, the film body (220) and the mobile chuck (11) may be introduced into or taken out of the accommodation space (2101) through the entrance (2102).

[0083] The upper base (211) may be arranged on the upper side of the first chamber (210), so that the picker (212) and the transfer unit (213) may be arranged to face the first chuck base (215) and the second chuck base (216) in the third direction (DR3).

[0084] The picker (212) may be provided to pick up or place a die (218) placed on a film (217). A plurality of dies (218) may be placed on the film (217), and in this case, the picker (212) may be provided to pick up at least some or all of the plurality of dies (218) placed on the film (217). That is, the picker (212) may include at least one expandable and absorbent column (212b) to pick up one or more dies (218) at a time or multiple dies or all of them. Each column (212b) may be expanded in the vertical direction (DR3) to pick up one die (218).

[0085] The above picker (212) is placed on the upper base (211) and can face the first chuck base (215) and the second chuck base (216) in the third direction (DR3). The picker (212) can be reciprocated in the third direction (DR3). As the picker (212) is reciprocated in the third direction (DR3), the distance between the picker (212) and the first chuck base (215), and between the picker (212) and the second chuck base (216) can be varied.

[0086] The above-mentioned transfer unit (213) may be placed on the upper base (211). The transfer unit (213) may face the first chuck base (215) and the second chuck base (216) in the third direction (DR3). The transfer unit (213) may be raised and lowered in the third direction (DR3). Accordingly, the distance between the transfer unit (213) and the first chuck base (215), and the distance between the transfer unit (213) and the second chuck base (216) may be variable.

[0087] The above-mentioned transfer unit (213) may include a pair of arms (2131) extending downward from the upper base (211) and having forks (2132) bent horizontally at the lower end, as illustrated in FIG. 7. At this time, the forks (2132) may be bent and extended in a direction facing each other.

[0088] In addition, the arm (2131) may be provided on the upper base (211) so as to be able to move up and down in the third direction (DR3). At this time, the fork (2132) may be bent toward the second direction (DR2) and may be formed to be parallel to the first direction (DR1).

[0089] In addition, the gap between the pair of arms (2131) may be wider than the maximum diameter of the frame (219) of the film body (220), and the gap between the ends of the pair of forks (2132) may be formed to be smaller than the outer diameter of the frame (219) and wider than the diameter of the film (217).

[0090] Returning to FIG. 4, the first lower base (214) may be positioned at the bottom of the receiving space (2101). The first lower base (214) may be positioned below the picker (212) and the conveyor (213).

[0091] The first lower base (214) can face the picker (212) and the conveyor (213) in the third direction (DR3). In addition, the first lower base (214) can be reciprocated in the first direction (DR1).

[0092] Accordingly, the first lower base (214) can be moved to overlap with the picker (212) or the transfer unit (213) in the third direction (DR3), or can be moved to overlap or not overlap with the picker (212). The first chuck base (215) can be placed on the first lower base (214). For example, the first chuck base (215) can be placed on the upper surface of the first lower base (214). When the first lower base (214) reciprocates in the first direction (DR1), the first chuck base (215) placed on the first lower base (214) can also reciprocate in the first direction (DR1).

[0093] That is, the first chuck base (215) may be positioned at the lower side of the picker (212) or at the lower side of the transport unit (213) depending on the movement of the first lower base (214).

[0094] The above first chuck base (215) may include a first support member (2151), a first stage (2152), and a plurality of first lifts (2153).

[0095] The first support member (2151) may be placed on the upper surface of the first lower base (214). The first support member (2151) may be formed in the form of a column extending in the third direction (DR3).

[0096] The first stage (2152) may be placed on the first support (2151). The upper surface of the first stage (2152) may be parallel to a plane defined by the first direction (DR1) and the second direction (DR2). A film body (220) or a mobile chuck (11), which will be described later, may be mounted on the upper surface of the first stage (2152).

[0097] A plurality of first lifts (2153) that reciprocate in a third direction (DR3) may be arranged on the edge of the first stage (2152). The first lifts (2153) may reciprocate in the third direction (DR3) from the first stage (2152) and may be raised and lowered in the up and down direction. At this time, the width of the plurality of first lifts (2153) in the second direction (DR2) may be narrower than the spacing between the forks (2132).

[0098] The second chuck base (216) may be placed on the first lower base (214). For example, the second chuck base (216) may be placed on the first lower base (214). The first chuck base (215) and the second chuck base (216) may be arranged in the first direction (DR1). As the second chuck base (216) is placed on the first lower base (214), when the first lower base (214) reciprocates in the first direction (DR1), the second chuck base (216) may reciprocate in the first direction (DR1).

[0099] The second chuck base (216) may include a second support member (2161) and a second stage (2162). The second support member (2161) may have a columnar shape extending in a third direction (DR3). The second support member (2161) may be moved up and down in the third direction (DR3). The second stage (2162) may be placed on the second support member (2161).

[0100] The upper surface of the second stage (2162) may be parallel to a plane defined by the first direction (DR1) and the second direction (DR2). The second stage (2162) may support the film body (220). In addition, the width of the second stage (2162) in the second direction (DR2) may be narrower than the spacing between the forks (2132).

[0101] Additionally, a sorter aligner (212a) for precisely fine-tuning the positions of a plurality of dies (218) placed on the mobile chuck (11) may be provided in the first chamber (210).

[0102] The first chuck base (215) and the second chuck base (216) may be one of the chuck bases (12) on which the mobile chuck (11) introduced into the first chamber (210) is mounted. The chuck base (12) may adsorb and fix the mounted mobile chuck (11) by vacuum pressure or the like, or may be provided to cool the mobile chuck (11) or heat the mobile chuck (11).

[0103] As shown in FIG. 4, a film body (220) having a die (218) arranged thereon can be introduced into the first chamber (210) through the entrance (2102).

[0104] The film body (220) provided in the receiving space (2101) of the first chamber (210) can be placed on the first chuck base (215).

[0105] The film (217) of the above film body (220) has a predetermined adhesive strength due to the properties of the material itself or as a means such as an adhesive, and can fix the die (218) placed on the film (217). Accordingly, the die (218) can be prevented from being separated from the film (217) due to external vibration or impact. In addition, the adhesive strength can have a strength adjusted so that the die (218) can be easily separated from the film (217).

[0106] Meanwhile, when the film body (220) is loaded onto the first chuck base (215), the first lift (2153) may be raised and protruded upward in the third direction (DR3). The film body (220) may be placed and secured on the first lift (2153) protruding upward. At this time, the first lift (2153) may support the frame (219) of the film body (220).

[0107] After the film body (220) is placed on the first lift (2153), as shown in FIG. 5, the transport unit (213) can be lowered downward from the upper base (211) toward the first lower base (214).

[0108] In this state, as shown in FIG. 6, the first lower base (214) is moved to one side in the first direction (DR1) and toward the transfer unit (213), and accordingly, the first chuck base (215), the second chuck base (216) and the film body (220) can also be transferred toward the transfer unit (213).

[0109] Meanwhile, as illustrated in FIGS. 6 and 7, the transport unit (213) is composed of a pair of arms (2131) and a fork (2132) as described above, and as the film body (220) moves in the first direction (DR1), the film body (220) is drawn between the pair of arms (2131) and above the fork (2132), and in that state, the first lift (2153) can be lowered.

[0110] As the first lift (2153) is lowered, the film body (220) can be placed in a state where the frame (219) is placed on the fork (2132) of the transport unit (213), as shown in FIG. 7.

[0111] After the film body (220) is placed on the transfer unit (213), as shown in FIG. 8, the first lower base (214) is moved to the other side in the first direction (DR1), and accordingly, the second chuck base (216) can also be moved in the first direction (DR1) and placed below the transfer unit (213).

[0112] After the second chuck base (216) is placed under the transfer unit (213), the second support unit (2161) is raised upwards to raise the second stage (2162) upwards, thereby supporting the film body (220) supported on the transfer unit (213) on the lower side.

[0113] As shown in FIG. 9 and FIG. 12(a), after the second stage (2162) supports the film body (220), the first lower base (214) is moved in the first direction (DR1) so that the second chuck base (216) supporting the film body (220) can be positioned directly below the picker (212).

[0114] In addition, as shown in FIG. 9 and FIG. 12(b), after the second chuck base (216) is positioned directly below the picker (212), the second support member (2161) can be further raised so that the die (218) of the film body (220) mounted on the second stage (2162) can be raised before coming into contact with the picker (212).

[0115] And, the picker (212) can pick up the dies (218) on the film body (220) one by one as each column (212b) is stretched. That is, the die (218) to be picked up can be picked up after its position is adjusted so that it is located directly below the picker (212) to be picked up.

[0116] To this end, the first lower base (214) may be provided to be horizontally movable not only in the first direction (DR1) but also in the second direction (DR2). Of course, the present invention is not limited thereto, and the first lower base (214) may be provided to move in the first direction (DR1), and the first support (2151) or the second stage (2152), and the second support (2161) or the second stage (2162) may be provided to move in the second direction (DR2).

[0117] This process can be repeated until each die (218) is picked up by the picker (212).

[0118] Of course, the present invention is not limited thereto, and at least some or all of the dies (218) mounted on the film body (220) can be picked up by absorption at once. That is, some or a plurality of the dies (218) mounted on the film body (220) can be picked up at once, or all of them can be picked up at once.

[0119] For example, among the dies (218) mounted on the film body (220), the dies (218) whose positions match those of the picker (212) are picked up at once, and the dies (218) whose positions do not match those of the picker (212) can be picked up after the positions of the second chuck base (216) or the picker (212) are adjusted, or after the positions of the dies (218) are adjusted by the sorter aligner (212a).

[0120] After the picker (212) picks a plurality of dies (218), the second support member (2161) and the second stage (2162) can be lowered as shown in (c) of FIG. 12.

[0121] Meanwhile, as illustrated in FIG. 8, while the second chuck base (216) moves and supports the film body (220) from the transfer unit (213), the mobile chuck (11) can be brought into and seated inside the first chamber (210) on the first chuck base (215).

[0122] The above mobile chuck (11) can be loaded onto the first stage (2152) of the first chuck base (215) by a loader module (22), etc. After the picker (212) picks a plurality of dies (218), as shown in FIGS. 10 and 12(d), the first lower base (214) moves to one side in the first direction (DR1), so that the first stage (2152) on which the mobile chuck (11) is mounted can be positioned directly below the picker (212) that has picked the dies (218).

[0123] And, as shown in FIG. 10 and FIG. 12(e), the first support member (2151) can be raised so that the mobile chuck (11) can be raised until it comes into contact with the lower surface of the die (218) that is adsorbed on the picker (212).

[0124] And as each column of the picker (212) expands, the adsorption of the die (218) is stopped, so that the die (218) can be placed on the mobile chuck (11).

[0125] At this time, the picker (212) may individually place the plurality of adsorbed dies (218) one by one, or may place the plurality of dies (218) or all of the adsorbed dies (218) at once.

[0126] When the picker (212) places the die (218), the positions where each die (218) is placed can be aligned one by one, or when the positions where the dies (218) are placed in each column of the picker (212) and the mobile chuck (11) match, multiple dies or all dies can be placed at once.

[0127] When the above die (218) is placed on the upper surface of the mobile chuck (11), the position of each die (218) can be determined based on the alignment pattern (111). Although not shown, the sorter chamber module (21) may further include a vision camera. The vision camera may acquire position information of each die (218) and the alignment pattern (111), and based on the position information, may align or correct the relative position between each die (218) and the alignment pattern (111), as shown in FIG. 6. For example, at least one of the vertices of the die (218) may be aligned to overlap the center of the alignment pattern (111). By the alignment pattern (111), the die (218) can be easily arranged on the upper surface of the mobile chuck (11).

[0128] In addition, the sorter aligner (212a) can finely adjust the position of the die (218) mounted on the mobile chuck (11) so that each die (218) is placed in the correct position.

[0129] The picker (212) absorbs multiple dies (218) from the film body (220) at once and places them on the mobile chuck (11) in the absorbed state, so that the relative positions between the multiple dies (218) can be maintained as is, thereby improving the precision of arrangement, and minimizing the need for fine-precision alignment work in the future, thereby improving the work speed.

[0130] Each of the above dies (218) can be arranged to correspond to the arrangement of the vacuum suction holes (110a). When the arrangement of the dies (218) is completed, a vacuum pump (not shown) connected to the outside of the mobile chuck (11) is operated so that each die (218) can be fixed on the upper surface of the mobile chuck (11).

[0131] After the placement of the die (218) on the mobile chuck (11) is completed, as shown in FIG. 12(f) and FIG. 14, the first lift (2153) may be lowered so that the mobile chuck (11) may be lowered, and then the mobile chuck (11) on which the die (218) has been placed may be taken out of the sorter chamber module (21) by the loader module (22) or the like, as shown in FIG. 11, and then moved to the test chamber module (23). At this time, vacuum pressure is applied to the mobile chuck (11) from the outside through the loader module (22) or the like, so that the vacuum suction hole (110a) is maintained in a vacuum state, thereby preventing the position of the die (218) from being moved due to shaking or impact generated during the movement of the mobile chuck (11).

[0132] As illustrated in FIG. 15, the test chamber module (23) may include a second chamber (230), a second lower base (231), a third chuck base (235), a third support (232), a probe card (233), and a probe tip (234).

[0133] The second chamber (230) forms an inspection space (230a) that can accommodate a second lower base (231), a third support member (232), a probe card (233), and a probe tip (234), and an inspection entrance (230b) can be formed on one side. The inspection entrance (230b) can connect the inspection space (230a) and the outside of the test chamber module (23).

[0134] In Fig. 15, for convenience of explanation, the probe tip (234) is illustrated as being one, but a plurality of probe tips (234) may be provided as needed. Preferably, the number of probe tips (234) is greater than the number of dies (218) mounted on the mobile chuck (11), so that a plurality of dies (218) placed on the mobile chuck (11) can be inspected at once.

[0135] The mobile chuck (11) on which the die (218) is installed can be brought into or taken out of the inspection space (230a) through the inspection entrance (230b). The second lower base (231) can be placed at the bottom within the inspection space (230a), and the third support member (232) can be placed on the second lower base (231).

[0136] The third support member (232) can reciprocate in a third direction (DR3) that is up and down on the second lower base (231). The third chuck base (235) can be placed on the third support member (232). The mobile chuck (11) can be placed on the third chuck base (235) by the loader module (22).

[0137] As the third chuck base (235) and the mobile chuck (11) are in direct contact, and the die (218) is in direct contact with the mobile chuck (11), heat generated from the die (218) can be conducted to the mobile chuck (11) and the third chuck base (235).

[0138] The third chuck base (235) may be one of the chuck bases (12) that support the mobile chuck (11). The third chuck base (235) may control the heat of the die (218) by cooling or heating the mobile chuck (11) while supporting the mobile chuck (11).

[0139] The above probe card (233) may be placed above the second lower base (231) and the third support (232) within the second chamber (230). The probe card (233) may face the second lower base (231) and the third support (232) in a third direction (DR3).

[0140] The above probe tip (234) may be placed on the lower surface of the probe card (233) facing the second lower base (231). The probe tip (234) may extend downward from the probe card (233). The probe card (233) may be a device that connects the die (218) and a tester (not shown) to inspect the operation of the die (218). After the probe tip (234) connected to the probe card (233) contacts the die (218), electricity is sent to the die (218), and depending on the returned signal, whether the die (218) is defective or not can be selected.

[0141] When the third support member (232) is raised upward, the die (218) placed on the upper surface of the mobile chuck (11) can be tested by coming into contact with the probe tip (234).

[0142] After the test is completed, the mobile chuck (11) on which the tested die (218) is placed is transferred from the test chamber module (23) to the sorter chamber module (21) by the loader module (22), and the die (218) placed on the mobile chuck (11) can be transferred to the film body (220) in the reverse order to the order described above.

[0143] In addition, the film body (220) on which the die (218) that has completed the test is placed can be transferred from the sorter chamber module (21) to a cassette (not shown) by the loader module (22) and stored.

[0144]

[0145] Below are drawings illustrating various arrangement configurations of each module of a die level test system (2) according to one embodiment of the present invention. The die level test system (2) according to the present invention may have various arrangement configurations depending on the required processing volume or speed, etc.

[0146] For example, as illustrated in FIG. 16, the sorter chamber module (21) and the test chamber module (23) may be arranged on one side of the loader module (22). That is, the loader module (22) may take out a film body (220) from a cassette and load it into the sorter chamber module (21), and the mobile chuck (11) may also be loaded into the sorter chamber module (21) to move the die (218) mounted on the film body (220) to the mobile chuck (11).

[0147] And, the mobile chuck (11) on which the die (218) is installed can be transferred to the test chamber module (23) by the loader module (22) to perform a test.

[0148] In addition, after the test is completed, the mobile chuck (11) is moved from the test chamber module (23) to the sorter chamber module (21) by the loader module (22), and then the plurality of dies (218) mounted on the mobile chuck (11) within the sorter chamber module (21) are moved to the film body (220), and the film body (220) can be moved to a cassette by the loader module (22) and stored.

[0149] Meanwhile, as illustrated in (a) of Fig. 17, the sorter chamber module (21) and the test chamber module (23) may be arranged in a single layer. Alternatively, as illustrated in (b) of Fig. 17, the test chamber modules (23) may be arranged in multiple layers. In this way, when multiple test chamber modules (23) are arranged in multiple layers, the effect of shortening the test time can be expected when the test process takes a long time.

[0150] Alternatively, in the case where it takes a long time to move the die (218) from the film body (220) to the mobile chuck (11) in the sorter chamber module (21), as shown in (c) of FIG. 17, a plurality of sorter chamber modules (21) may be arranged to shorten the time to move the die (218) from the film body (220) to the mobile chuck (11) or from the mobile chuck (11) to the film body (220). In this way, when the test chamber modules (23) or the sorter chamber modules (21) are arranged in multiple layers, a frame (219) may be provided to support each module.

[0151] Alternatively, as shown in FIG. 18 (a), the loader module (22) may be positioned within the sorter chamber module (21) and placed on both sides of the sorter chamber module (21), or as shown in FIG. 18 (b), the loader module (22) may be placed separately, the sorter chamber module (21) may be placed on one side of the loader module (22), and the test chamber modules (23) may be placed on both sides of the sorter chamber module (21).

[0152] Alternatively, as illustrated in FIG. 19 (a), a plurality of test chamber modules (23) and a sorter chamber module (21) may be arranged on one side of the loader module (22), or as illustrated in FIG. 19 (b), a plurality of test chamber modules (23) may be arranged on one side of the loader module (22), and the sorter chamber module (21) may be arranged on the other side of the loader module (22).

[0153] Accordingly, considering the time required to move the die (218) from the film body (220) to the mobile chuck (11) or from the mobile chuck (11) to the film body (220), the time required for testing, the area of ​​the work site, etc., various arrangements are possible, so that the degree of freedom of arrangement is high. At this time, the parts where the mobile chuck (11) and the chuck base (12) come into contact with each other can be formed to have a common shape, and the chuck base (12) can be arranged in one or more sorter chamber modules (21) and one or more test chamber modules (23) so that multiple processes and tests can be performed simultaneously at one time, and inspections of various arrangements and types of dies can be performed simultaneously.

[0154]

[0155] Hereinafter, a control method of the die level test system described above will be described. The control method of the die level test system according to the present embodiment may include a film loading step (S110), a film transport step (S120), a mobile chuck loading step (S130), a die transport step (S140), an alignment step (S150), a mobile chuck transport step (S160), and a test step (S170), as illustrated in FIG. 20.

[0156] The above film loading step (S110) is a step in which the loader module (22) loads the film (220) on which a plurality of dies (218) are mounted onto the first chuck base (215) of the sorter chamber module (21). As illustrated in FIG. 4, the loader module (22) can load the film (220) on which the dies (218) are mounted onto the cassette and mount it onto the first chuck base (215) of the sorter chamber module (21).

[0157] The above film transfer step (S120) is a step of transferring the film (220) placed on the first chuck base (215) within the sorter chamber module (21) to the second chuck base (216). As illustrated in FIGS. 5 to 8, the film (220) loaded onto the first chuck base (215) can be transferred to the second chuck base (216) via the transfer unit (213).

[0158] The above mobile chuck loading step (S130) may be a step in which the loader module (22) loads the mobile chuck (11) into the first chuck base (215) of the sorter chamber module (21), as illustrated in FIG. 8.

[0159] At this time, the loader module (22) can bring the mobile chuck (11) from outside the sorter chamber module (21) to the first chuck base (215) of the sorter chamber module (21). Of course, it is not limited to this, and a separate device that provides the mobile chuck (11) to the first chuck base (215) inside the sorter chamber module (21) may be provided.

[0160] The above die transfer step (S140) is a step in which the picker (212) of the sorter chamber module (21) places a plurality of dies (218) placed on the film body (220) on the second chuck base (216) on the mobile chuck (11) on the first chuck base (215), as shown in FIGS. 9 to 10 and FIG. 12.

[0161] The above alignment step (S150) is a step for aligning the positions of each die (218) mounted on the mobile chuck (11). If the positions of each die (218) can be positioned sufficiently precisely in the die transfer step (S140), the alignment step (S150) may be omitted.

[0162] The above mobile chuck transfer step (S160) is a step in which the loader module (22) removes the mobile chuck (11) on which the die (218) has been completely installed from the sorter chamber module (21) and transfers it to the third chuck base (235) of the test chamber module (23), as shown in FIGS. 11 and 14.

[0163] In addition, the test step (S170) is a step in which, as illustrated in FIG. 15, the probe card (233) of the test chamber module (23) is brought into contact with each die (218) placed on the mobile chuck (11) mounted on the third chuck base (235) to perform a test. In the test step (S170), the probe card (233) is brought into contact with each die (218) to perform necessary tests such as a burn-in test.

[0164] After the test is completed, the mobile chuck (11) on which the tested die (218) is placed is transferred from the test chamber module (23) to the sorter chamber module (21) by the loader module (22), and the die (218) placed on the mobile chuck (11) can be transferred to the film body (220) in the reverse order to the order described above.

[0165] In addition, the film body (220) on which the die (218) that has completed the test is placed can be transferred from the sorter chamber module (21) to a cassette (not shown) by the loader module (22) and stored in the cassette.

[0166] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

Claims

1. At least one chuck base having a mobile chuck on which a plurality of dies having a wafer sawed thereon are mounted, and at least one sorter chamber module for moving and placing each die from a film body having a plurality of dies having a wafer sawed thereon to the mobile chuck mounted on the chuck base; At least one chuck base on which the mobile chuck is mounted is provided, and at least one test chamber module receives the mobile chuck on which the die is mounted from the sorter chamber module and tests the die mounted on the mobile chuck; A loader module for loading and unloading a mobile chuck into and out of the sorter chamber module and the test chamber module; A control unit that controls the sorter chamber module, the test chamber module, and the loader module; A die level test system including:

2. In paragraph 1, A die level test system, wherein the sorter chamber module and the test chamber module are arranged on one side of the loader module.

3. In paragraph 2, A die level test system, wherein the test chamber modules are arranged on both sides of the sorter chamber module.

4. In paragraph 3, The above loader module is a die level test system integrated with the above sorter chamber module.

5. In paragraph 1, A die level test system, wherein the sorter chamber module and the test chamber module are arranged on one side of the loader module, and the test chamber modules are arranged on both sides of the sorter chamber module.

6. In paragraph 1, A die level test system, wherein the above sorter chamber module and the above test chamber module are arranged in a single layer.

7. In paragraph 1, A die level test system, wherein the above sorter chamber module and the above test chamber module are arranged in multiple layers.

8. In paragraph 1, The above film body is, A film on which multiple dies are stacked after sawing the wafer; A frame coupled to the edge of the film to maintain tension on the film; A die level test system including:

9. In paragraph 1, The above sorter chamber module, A first chamber having an entrance formed on one side through which the film body and the mobile chuck are introduced and removed, and forming a receiving space; A lower base disposed at the lower side of the first chamber and arranged to be movable in one and the other direction; A first chuck base provided on the lower base and capable of lifting and lowering a film body or mobile chuck brought into the first chamber; A second chuck base provided on the lower base and capable of lifting and lowering the film transferred from the first chuck base; A transfer unit that transfers the film body mounted on the first chuck base to the second chuck base; A picker that picks up a plurality of dies placed on a film body mounted on the second chuck base and places them on the upper surface of a mobile chuck mounted on the first chuck base; A die level test system including:

10. In paragraph 9, A die level test system including an aligner for precisely adjusting the placement position of a die placed on the mobile chuck.

11. In paragraph 9, A die level test system in which the picker picks up at least some or all of a plurality of dies arranged on the film body at one time.

12. In paragraph 1, The above test chamber module, A second chamber forming an inspection space, in which an inspection entrance is formed through which a mobile chuck having multiple dies installed is brought in and taken out; A third chuck base is disposed on the lower side of the second chamber and supports the mobile chuck introduced into the second chamber in a movable manner; A probe card disposed on the upper side of the second chamber and in contact with each die mounted on the mobile chuck mounted on the third chuck base to test the characteristics of each die; A die level test system including:

13. Film loading step in which the loader module loads a film body with multiple dies installed onto the first chuck base of the sorter chamber module; A film transfer step for transferring a film mounted on the first chuck base within the above sorter chamber module to a second chuck base; A mobile chuck loading step in which the loader module loads the mobile chuck into the first chuck base of the sorter chamber module; A die transfer step in which a picker of the loader module places a plurality of dies placed on a film body on the second chuck base onto a mobile chuck on the first chuck base; A mobile chuck transfer step in which the loader module removes the mobile chuck, on which the die has been installed, from the sorter chamber module and transfers it to the third chuck base of the test chamber module; A test step in which the probe card of the above test chamber module comes into contact with each die placed on a mobile chuck mounted on the third chuck base to perform a test; A control method for a die level test system, including:

14. In paragraph 1, After the above die transfer step, An alignment step for aligning the positions of each die mounted on the mobile chuck; A control method for a die level test system, further comprising:

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