Integrated controller and thermal management system including same

Abstract

The present invention relates to an integrated controller for integrally controlling a high-voltage electrical component and a low-voltage electrical component, and a thermal management system including same. In one embodiment, the integrated controller comprises: an MCU which receives an upper-level control signal and outputs a control signal for controlling the high-voltage electrical component and the low-voltage electrical component; a communication unit which transmits the upper-level control signal to the MCU; a high-voltage power circuit which supplies high-voltage power to the high-voltage electrical component; and a low-voltage power circuit which supplies low-voltage power to the low-voltage electrical component and the communication unit, wherein the MCU can output both a first control signal for controlling the high-voltage electrical component and a second control signal for controlling the low-voltage electrical component.

Description

Integrated controller and thermal management system including the same

[0001] The present disclosure relates to an integrated controller that controls high-voltage electrical components and low-voltage electrical components in an integrated manner, and a vehicle thermal management system including the same.

[0002] Vehicle thermal management systems may incorporate heat pump systems, which function to lower temperatures, such as air conditioning. A heat pump system may consist of a refrigerant cycle, including a compressor, evaporator, condenser, and expansion valve. The refrigerant cycle may also include various valves to control the direction of the refrigerant flow.

[0003] To increase the driving range of electric vehicles, the application of thermal management systems, such as heat pump systems, is essential. To control these heat pump systems, controllers were provided for high-voltage electrical components (e.g., compressors, heaters), which utilize both high- and low-voltage circuits, and controllers for low-voltage electrical components (e.g., refrigerant modules, coolant modules, low-voltage cooling fans), which utilize only low-voltage circuits.

[0004] However, when high-voltage electrical equipment controllers and low-voltage electrical equipment controllers are configured separately, products from multiple manufacturers can be mixed, making it difficult to improve the performance and ensure reliability of the thermal management system. In addition, there was a problem in that the overall cost of the system increased because each product had to be purchased individually.

[0005] [Prior Art Literature]

[0006] (Patent Document 1) Korean Patent Publication No. 10-2023-0081005 (published on June 7, 2023)

[0007] According to one aspect of the present disclosure, an integrated controller can be provided that simplifies software and optimizes circuitry.

[0008] Additionally, it is possible to provide an integrated controller with reduced manufacturing cost and reduced overall packaging of the system.

[0009] Additionally, a thermal management system with optimized cycle performance can be provided.

[0010] In addition, it is possible to provide a thermal management system that is advantageous in improving the performance and reliability of the system and maintaining the security of system control technology.

[0011] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0012] An integrated controller according to the present disclosure is an integrated controller for controlling high-voltage electrical equipment and low-voltage electrical equipment in an integrated manner, comprising: an MCU for receiving an upper control signal and outputting a control signal for controlling the high-voltage electrical equipment and the low-voltage electrical equipment; a communication unit for transmitting the upper control signal to the MCU; a high-voltage power supply circuit for supplying high-voltage power to the high-voltage electrical equipment; and a low-voltage power supply circuit for supplying low-voltage power to the low-voltage electrical equipment and the communication unit; wherein the MCU can output both a first control signal for controlling the high-voltage electrical equipment and a second control signal for controlling the low-voltage electrical equipment.

[0013] The above MCU can be powered from either the high voltage power circuit or the low voltage power circuit.

[0014] The device further includes a switching element disposed on the high-voltage power circuit; and a driver chip disposed on the low-voltage power circuit; wherein the switching element controls the high-voltage electrical component through the first control signal, and the driver chip controls the low-voltage electrical component through the second control signal.

[0015] The above switching element can operate by receiving high voltage power from the high voltage power circuit, and the driver chip can operate by receiving low voltage power from the low voltage power circuit.

[0016] The present invention further includes a gate driver disposed on the low-voltage power circuit and provided in front of the switching element, wherein the gate driver can control the operation of the switching element by receiving low-voltage power from the low-voltage power circuit.

[0017] The above high voltage power circuit may further include a high voltage EMC filter or a high voltage DC link arranged in front of the above switching element.

[0018] It further includes an SMPS that converts the voltage of the low-voltage power supply into a predetermined output voltage, and the voltage output from the SMPS can be supplied to the gate driver.

[0019] The above driver chips are provided in multiple numbers, and the MCU can output second control signals corresponding to the multiple driver chips, respectively.

[0020] The above switching elements are provided in multiple numbers, and the MCU can output first control signals corresponding to the multiple switching elements, respectively.

[0021] The above low-voltage power circuit further includes a low-voltage DC link, and power output from the low-voltage DC link can be supplied to the driver chip.

[0022] The above communication unit may further include a communication circuit arranged in front of the MCU to transmit the upper control signal to the MCU.

[0023] The above MCU, communication unit, high voltage power circuit, and low voltage power circuit can all be provided on one PCB.

[0024] The housing may include a housing that accommodates the PCB, and the housing may be provided with a high-voltage connector that applies high-voltage power to the high-voltage power circuit, and a low-voltage connector that applies low-voltage power to the low-voltage power circuit.

[0025] A thermal management system of a vehicle according to the present disclosure includes a refrigerant module through which refrigerant circulates; a coolant module through which coolant circulates; a heater for heating the coolant; a compressor for compressing the refrigerant; and an integrated controller for controlling the refrigerant module, the coolant module, the heater, and the compressor in an integrated manner; wherein the integrated controller may include an MCU for receiving an upper control signal and outputting a first control signal for controlling the heater or the compressor and a second control signal for controlling the refrigerant module or the coolant module; a communication unit for transmitting the upper control signal and the first and second control signals; a high-voltage power circuit for supplying high-voltage power to the compressor and the heater; and a low-voltage power circuit for supplying low-voltage power to the refrigerant module, the coolant module, and the communication unit.

[0026] The above MCU can be powered from either the high voltage power circuit or the low voltage power circuit.

[0027] The refrigerant module may include a plurality of valves for controlling the flow direction of the refrigerant, and the MCU may further include a plurality of driver chips for outputting a plurality of second control signals corresponding to the plurality of valves and individually receiving the plurality of second control signals to individually control and drive the plurality of valves.

[0028] The above cooling water module includes a water pump that applies pressure to cooling water and a plurality of valves that control the flow direction of the cooling water, and the MCU may further include a plurality of driver chips that output a plurality of second control signals corresponding to the water pump and the valves, respectively, and individually receive the plurality of second control signals to individually control and drive the water pump and the valves.

[0029] The MCU may further include a low-voltage cooling fan, and the MCU may further include a driver chip that outputs a second control signal corresponding to the low-voltage cooling fan and receives the second control signal to control and drive the low-voltage cooling fan.

[0030] According to one embodiment of the present disclosure, the software of the integrated controller can be simplified and the circuit can be optimized.

[0031] In addition, the power management elements of low-voltage electrical equipment can be implemented within a high-voltage SMPS, thereby optimizing the power management of high-voltage electrical equipment and low-voltage electrical equipment.

[0032] Additionally, by integrating redundant components on the PCB and controlling them with a single MCU, the manufacturing cost of the integrated controller can be reduced and the overall packaging of the system can be reduced.

[0033] Additionally, the cycle performance of the thermal management system can be optimized.

[0034] Additionally, it can be advantageous to improve the performance and reliability of the thermal management system and maintain the security of system control technology.

[0035] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention pertains from this specification and the attached drawings.

[0036] Figure 1 is a conceptual diagram showing an integrated controller that controls high-voltage electrical components and low-voltage electrical components in an integrated manner.

[0037] Figure 2 schematically illustrates the system of the integrated controller.

[0038] Figure 3 illustrates an example in which control signals output from a single MCU are transmitted to multiple switching elements and driver chips.

[0039] Figure 4 is a schematic diagram of a thermal management system according to the first embodiment of the present disclosure.

[0040] Figure 5 is a schematic diagram of a thermal management system according to a second embodiment of the present disclosure.

[0041] Figure 6 is a schematic diagram of a thermal management system according to a third embodiment of the present disclosure.

[0042] Figure 7 is a schematic diagram of a thermal management system according to the fourth embodiment of the present disclosure.

[0043] Figure 8 is a schematic diagram of a thermal management system according to the fifth embodiment of the present disclosure.

[0044] Figure 9 is a schematic diagram of a thermal management system according to the sixth embodiment of the present disclosure.

[0045] Fig. 10 is a schematic diagram of a thermal management system according to the seventh embodiment of the present disclosure.

[0046] Fig. 11 is a schematic diagram of a thermal management system according to the eighth embodiment of the present disclosure.

[0047] Fig. 12 is a schematic diagram of a thermal management system according to the ninth embodiment of the present disclosure.

[0048] Fig. 13 is a schematic diagram of a thermal management system according to the tenth embodiment of the present disclosure.

[0049] Fig. 14 is a schematic diagram of a thermal management system according to the 11th embodiment of the present disclosure.

[0050] Fig. 15 is a schematic diagram of a thermal management system according to the 12th embodiment of the present disclosure.

[0051] Hereinafter, the present disclosure will be described in detail with reference to the attached drawings. However, these are merely exemplary and the present disclosure is not limited to the specific embodiments described as examples.

[0052] An integrated controller according to an example of the present disclosure can be applied to vehicles, including hybrid electric vehicles, fuel-cell vehicles, and pure electric vehicles. It can also be applied to thermal management systems employing refrigerant cycles.

[0053] Hereinafter, an integrated controller (1000) according to an example of the present disclosure will be described with reference to FIGS. 1 to 3. FIG. 1 is a conceptual diagram showing that the integrated controller (1000) controls high-voltage electrical components and low-voltage electrical components in an integrated manner, FIG. 2 schematically shows a circuit of the integrated controller (1000), and FIG. 3 shows an example in which each control signal is individually transmitted to a plurality of switching elements and driver chips. In FIGS. 1 to 3, a circuit to which power is supplied is depicted as a solid line, and a circuit to which a communication signal for controlling each component and element is transmitted is depicted as a dotted line. In FIG. 2, an area to which high-voltage power is supplied is depicted as a white area, and an area to which low-voltage power is supplied is depicted as a gray area.

[0054] An integrated controller (1000) according to an example of the present disclosure may largely include an MCU (100), a high voltage power circuit (200), a low voltage power circuit (400), and a communication unit (300).

[0055] The MCU (Micro Controller Unit, 100) is a processor that controls high-voltage and low-voltage electrical components in an integrated manner. The MCU (100) can receive an upper control signal (S0) from the outside and output lower control signals for controlling the high-voltage and low-voltage electrical components. Specifically, the MCU (100) can output both a first control signal (S1) for controlling the high-voltage electrical component and a second control signal (S2) for controlling the low-voltage electrical component.

[0056] In Fig. 2, the MCU (100) is exemplarily illustrated as being placed on a low-voltage power circuit, but the MCU (100) may be selectively placed on either the low-voltage power circuit or the high-voltage power circuit depending on the required voltage. That is, the MCU (100) may operate by receiving power from either the high-voltage power circuit or the low-voltage power circuit, thereby outputting the first control signal (S1) and the second control signal (S2). In this way, the placement location of the MCU (100) may be appropriately designed and changed depending on the required voltage of the MCU (100).

[0057] The first control signal (S1) and the second control signal (S2) output from the MCU (100) can control high-voltage electrical components and low-voltage electrical components, respectively, through components (gate drivers, driver chips, etc.) placed in the high-voltage power circuit or the low-voltage power circuit.

[0058] According to the present disclosure, instead of controlling high-voltage and low-voltage electrical components separately with separate MCUs, high-voltage and low-voltage electrical components can be integrated and controlled through a single MCU. Therefore, the integrated controller according to the present disclosure has the advantages of simplifying software and optimizing circuitry.

[0059] For example, high-voltage electrical components may include electric compressors, high-voltage motors, and water heaters that require high-voltage power. Low-voltage electrical components may include low-voltage cooling fans, coolant modules, refrigerant modules, and valves, sensors, and water pumps included therein that require low-voltage power.

[0060] As illustrated in FIG. 3, a circuit board may be equipped with one MCU (100), a plurality of switching elements (210_1, …, 210_n), and a plurality of driver chips (430_1, …, 430_n). Each of the plurality of switching elements may be configured to receive a control signal (S1_1, …, S1_n) from one MCU (100) and control each of the high-voltage electrical components, and each of the plurality of driver chips may be configured to receive a control signal (S2_1, …, S2_n) from one MCU (100) and control each of the low-voltage electrical components. More specifically, the MCU receives an upper control signal (S0) from a vehicle-side upper controller, and transmits a lower control signal to each of the plurality of switching elements and driver chips based on the received upper control signal. Each switching element and each driver chip controls the high-voltage electrical components that each switching element is responsible for and the low-voltage electrical components that each driver chip is responsible for based on the lower control signals received from the MCU.

[0061] In detail, the low-voltage electrical equipment subject to integrated control in this example may include a first low-voltage electrical equipment, a second low-voltage electrical equipment, and a third low-voltage electrical equipment.

[0062] The first low-voltage electrical components are low-voltage electrical components that constitute the refrigerant module (20A), and may include a refrigerant multi-valve (3Way V / V), an electric expansion valve (H / P EXV, 3Way EXV), and may further include a pressure-temperature sensor (P / T Sensor).

[0063] The second low-voltage electrical components are low-voltage electrical components that constitute the cooling water module (20B), and may include an electric water pump (EWP), a multi-valve for cooling water (Multi V / V), and may further include a water level sensor (W / L Sensor) and a water pump.

[0064] The MCU (100) receives information about the coolant level (Level sensing) from the water level sensor, and receives information about the pressure and temperature of the refrigerant (Pressure / Temp sensing) from the pressure sensor. The MCU (100) can generate a control signal based on the information and transmit the control signal to each driver chip. The water level sensor and the pressure / temperature sensor can be connected to the regulator of the circuit board (120) and receive power from the regulator.

[0065] The third low-voltage electrical component is a low-voltage electrical component different from the first and second low-voltage electrical components, and may be a low-voltage cooling fan (20C) or a low-voltage heater (e.g., PCT heater, etc.). The electric water pump, the coolant multi-valve, the refrigerant multi-valve, and the electric expansion valve of the coolant module and the refrigerant module may each be configured as one or two or more.

[0066] Hereinafter, a communication unit (300) will be described. The communication unit (300) may include various communication elements that transmit an upper control signal (S0) to the MCU (100) and transmit a control signal output by the MCU (100) to a lower level to drive electrical components. In this case, the upper control signal (S0) may correspond to a signal that includes both a signal for controlling high-voltage electrical components and a signal for controlling low-voltage electrical components.

[0067] The communication unit (300) may include a communication circuit (320) arranged in front of the MCU (100) to transmit an upper control signal to the MCU (100). The communication circuit (320) may be commonly used to control high-voltage electrical equipment and low-voltage electrical equipment.

[0068] Additionally, the communication unit (300) may include a communication EMC filter. The communication EMC filter (350) may be provided at the front end of the communication circuit (320). By providing the communication EMC filter (350), the upper control signal (S0) can be transmitted without noise. Like the communication circuit (320), the communication EMC filter (350) may also be commonly used to control high-voltage electrical equipment and low-voltage electrical equipment.

[0069] According to one example of the present disclosure, there is no need to separately equip each electrical component to control a communication circuit or EMC filter for communication, thereby reducing the number of components and manufacturing costs, and reducing the overall packaging of the system. Furthermore, by controlling high-voltage and low-voltage electrical components with a single MCU, system optimization is facilitated, system control reliability is ensured, and system control technology leakage is prevented.

[0070] Below, the high voltage power circuit (200) is described.

[0071] A high voltage power circuit (200) can supply high voltage power to high voltage electrical equipment. The voltage of the high voltage power supply can be 300 V or higher, and can correspond to, for example, a voltage of 400 V or 800 V.

[0072] For example, a high-voltage power circuit (200) may include a switching element (210) for operating power of a high-voltage electrical component, a high-voltage EMC filter (250) for filtering noise, a high-voltage DC link (220) for stably supplying DC power to a high-voltage electrical component, etc.

[0073] The operation of the switching element (210) can be controlled by a gate driver (230) to be described later, and the gate driver (230) can be arranged at the rear end of the MCU (100) and receive the first control signal (S1) output by the MCU (100). In addition, the gate driver (230) can be arranged adjacent to the switching element (210) to operate the switching element (210).

[0074] An isolator may be further provided between the MCU (100) and the gate driver (230), thereby blocking signals flowing in the reverse direction and stabilizing the operation of the switching element (210).

[0075] The switching element (210) can supply high-voltage power to high-voltage electrical equipment through a switching operation. The switching element (210) can correspond to, for example, an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal Oxide Silicon Field Effect Transistor), etc. The IGBT can operate in a high-voltage range of 300 V or higher, and is therefore suitable for high-efficiency, high-speed power systems.

[0076] The gate driver (230) can receive a first control signal (S1) and apply a gate voltage that matches the data sheet of the switching element (210) to the switching element (210), thereby controlling the on / off of the switching element (210).

[0077] Meanwhile, the operating power of the gate driver (230) may be supplied from the low-voltage power circuit (400). An SMPS (Switching Mode Power Supply, 410) may be further provided in front of the gate driver (230), and the SMPS (410) may receive power and convert it into a predetermined output voltage. For example, the SMPS (410) may receive low-voltage power from the low-voltage power circuit (400), convert it into high-voltage power, and supply the converted power as the operating power of the gate driver (230). Therefore, the SMPS (410) may be disposed in the low-voltage power circuit area, but it may be preferable in terms of circuit optimization to be disposed adjacent to the high-voltage power circuit area.

[0078] Below, a high-voltage EMC filter (250) and a high-voltage DC link (220) are described.

[0079] A high-voltage EMC filter (250) can reduce electromagnetic interference generated in a high-voltage power circuit. The high-voltage EMC filter (250) can be positioned after a high-voltage connector, which will be described later. This is advantageous in that it can filter out noise directly at the input of the high-voltage power supply, thereby preventing noise from spreading throughout the entire system and protecting sensitive circuits within the system. According to one example of the present disclosure, the provision of a high-voltage EMC filter provides the advantage of blocking noise and improving system stability.

[0080] The high-voltage DC link (220) can temporarily store energy using a capacitor and supply a stable voltage by alleviating fluctuations in the high-voltage power supply.

[0081] For example, the high-voltage DC link (220) can be placed after the aforementioned high-voltage EMC filter (250). After the high-voltage EMC filter (250) primarily blocks high-frequency noise, the high-voltage DC link (220) can additionally filter the remaining noise to supply high-voltage power with improved quality, thereby improving the stability of the system.

[0082] Below, the low voltage power circuit (400) is described.

[0083] A low-voltage power supply circuit (400) can supply low-voltage power to a low-voltage electrical component, an MCU (100), a communication unit (300), a gate driver (230), or a driver chip (430). For example, the voltage of the low-voltage power supply can be a voltage of 12 V or 48 V.

[0084] The low-voltage power circuit (400) may include a driver chip (430) that receives a second control signal (S2), and may further include a regulator (460) for stably supplying driving power to communication elements of the MCU (100) and the communication unit (300), a low-voltage DC link (420) for stably supplying DC power to the driver chip (430), or a low-voltage EMC filter (450) for noise removal.

[0085] Hereinafter, the driver chip (430) will be described. The driver chip (430) is placed at the rear end of the MCU (100) and can receive the second control signal (S2), and can also be placed adjacent to low-voltage electrical equipment to control and drive the low-voltage electrical equipment.

[0086] The driver chip (430) can receive a second control signal (S2) from the MCU (100) and control and drive the low-voltage electrical component. Unlike the gate driver (310) arranged in front of the switching element (210) of the high-voltage electrical component (10), a separate gate driver may not be provided in front of the driver chip (430) of the low-voltage electrical component (20). That is, the driver chip (430) can directly receive and drive the output signal of the MCU (100). This configuration can provide a driving environment optimized for the characteristics of each electrical component, thereby improving the reliability and efficiency of the system.

[0087] Below, a low-voltage EMC filter (450) and a low-voltage DC link (420) are described.

[0088] A low-voltage EMC filter (450) can reduce electromagnetic interference generated in a low-voltage power circuit. Like the aforementioned high-voltage EMC filter (250), the low-voltage EMC filter (450) may be preferably placed at the rear of a low-voltage connector for noise filtering and system stability.

[0089] The low-voltage DC link (420) is arranged at the front end of the driver chip (430) and can supply voltage to the driver chip (430). The DC link can store power in a capacitor and output it as needed, thereby stably supplying a predetermined voltage to the driver chip (430). Similar to the high-voltage EMC filter (250) and the high-voltage DC link (220) described above, it may be preferable for the low-voltage DC link (420) to be arranged at the rear end of the low-voltage EMC filter from the perspectives of noise filtering and system stability.

[0090] Meanwhile, the aforementioned MCU (100), communication unit (300), high-voltage power circuit (200), and low-voltage power circuit (400) can all be provided on a single PCB. The integrated controller according to the present disclosure can prevent duplication of identical configurations and reduce the number of parts and manufacturing costs by integrating and implementing overlapping elements or circuits on a single PCB.

[0091] Furthermore, the integrated controller (1000) according to the present disclosure may further include a housing that accommodates a PCB. The housing may be provided with a high-voltage connector (70) that applies high-voltage power to a high-voltage power circuit (200) and a low-voltage connector (80) that applies low-voltage power to a low-voltage power circuit.

[0092] A high voltage connector (70) and a low voltage connector (80) may be provided one by one, and high voltage and low voltage may be applied to each connector, so that an appropriate voltage can be applied to each component or circuit on the PCB. Accordingly, the integrated controller (1000) according to the present disclosure can implement integrated power supply of components, circuits, and high voltage and low voltage components on the PCB, thereby optimizing the circuit and improving usability.

[0093] The method by which each electrical component is controlled will be described below with reference to Fig. 3. Fig. 3 illustrates an example in which control signals output from a single MCU are transmitted to multiple switching elements and driver chips.

[0094] The MCU (100) can receive an upper control signal (S0) and output both a first control signal (S1) and a second control signal (S2).

[0095] In order to comprehensively control at least one high-voltage electrical component and at least one low-voltage electrical component, a plurality of first control signals (S1_1, …, S1_n) and / or second control signals (S2_1, …, S2_n) may each be output.

[0096] For example, the MCU (100) can output first control signals (S1_1, S1_2) for controlling a compressor (10A) and a heater (10B) corresponding to high-voltage electrical components, respectively, and can output second control signals (S2_1, S2_2, S2_3) for controlling a refrigerant module (20A), a cooling water module (20B), and a low-voltage cooling fan (20C) corresponding to low-voltage electrical components, respectively.

[0097] The circuit board may be provided with a plurality of switching elements (210_1, …, 210_n) that receive a plurality of first control signals (S1_1, …, S1_n) and control each high-voltage electrical device, and may be provided with a plurality of driver chips (430_1, …, 430_n) that receive a plurality of second control signals (S2_1, …, S2_n) and control each low-voltage electrical device.

[0098] Hereinafter, an embodiment of a thermal management system to which an integrated controller according to the present disclosure is applied will be described in more detail with reference to FIGS. 4 to 15, and each drawing exemplarily shows various application forms of the present invention.

[0099] The thermal management system according to the present disclosure may be a thermal management system for a vehicle utilizing a refrigerant and / or coolant. The thermal management system may be applied to vehicles, including hybrid electric vehicles, fuel-cell vehicles, and pure electric vehicles. It may also be applied to thermal management fields utilizing refrigerant cycles and / or coolant cycles.

[0100] Hereinafter, descriptions of the thermal management system according to an example of the present disclosure will be described, omitting any descriptions that overlap with the description of the integrated controller (1000) described above.

[0101]

[0102] <Example 1>

[0103] Figure 4 is a schematic diagram of a thermal management system according to the first embodiment of the present disclosure.

[0104] According to a first embodiment of the present disclosure, a thermal management system may include a refrigerant module (20A) through which refrigerant circulates, a cooling water module (20B) through which cooling water circulates, a heater (10B) for heating the cooling water, and a compressor (10A) for compressing the refrigerant. For example, the compressor (10A) and the heater (10B) may correspond to high-voltage electrical components, and the refrigerant module (20A) and the cooling water module (20B) may correspond to low-voltage electrical components.

[0105] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A) and a heater (10B), which are high-voltage electrical components, and can output a second control signal (S2) for controlling a refrigerant module (20A) and a cooling water module (20B), which are low-voltage electrical components.

[0106] For example, the first control signal (S1) can be distinguished into a signal for controlling the compressor (10A) and a signal for controlling the heater (10B). The distinguished signals are received by each switching element (210_1, 210_2), and each switching element (210_1, 210_2) can individually control the operations of the compressor (10A) and the heater (10B) through the corresponding signals.

[0107] Meanwhile, the refrigerant module (20A) may include at least one valve (e.g., a 3-way valve, an expansion valve, a solenoid valve, etc.) for controlling the flow direction of the refrigerant or controlling the pressure and temperature of the refrigerant, and a sensor (e.g., a pressure sensor, a flow sensor, a temperature sensor, etc.) for measuring the state of the refrigerant. The cooling water module (20B) may include a water pump for applying pressure to the cooling water, and a valve for controlling the flow direction of the cooling water. At least one water pump and one valve may be provided.

[0108] The number of individual second control signals (S2_1, …, S2_n) outputted by the second control signal (S2) can be determined according to the number of valves and / or sensors in the refrigerant module (20A) that is the control target and the number of water pumps and / or valves in the cooling water module (20B). A plurality of driver chips (430_1, …, 430_n) can each receive the outputted second control signals (S2_1, …, S2_n) and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0109] <Example 2>

[0110] Figure 5 is a schematic diagram of a thermal management system according to a second embodiment of the present disclosure.

[0111] According to the second embodiment of the present disclosure, the thermal management system may include a refrigerant module (20A) through which refrigerant circulates, and a compressor (10A) for compressing the refrigerant.

[0112] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A), which is a high-voltage electrical component, and can output a second control signal (S2) for controlling a refrigerant module (20A), which is a low-voltage electrical component.

[0113] For example, the first control signal (S1) is received by the switching element (210), and the switching element (210) can control the operation of the compressor (10A). Meanwhile, the number of individual second control signals (S2_1, ..., S2_n) outputted by the second control signal (S2) can be determined according to the number of valves and / or sensors in the refrigerant module (20A) that is the control target. The plurality of driver chips (430_1, ..., 430_n) can each receive the outputted second control signals (S2_1, ..., S2_n), and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0114] <Example 3>

[0115] Figure 6 is a schematic diagram of a thermal management system according to a third embodiment of the present disclosure.

[0116] According to a third embodiment of the present disclosure, the thermal management system may include a refrigerant module (20A) through which refrigerant circulates, a cooling water module (20B) through which cooling water circulates, and a compressor (10A) through which refrigerant is compressed.

[0117] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A), which is a high-voltage electrical component, and can output a second control signal (S2) for controlling a refrigerant module (20A) and a cooling water module (20B), which are low-voltage electrical components.

[0118] For example, the first control signal (S1) is received by the switching element (210), and the switching element (210) can control the operation of the compressor (10A). Meanwhile, the number of individual second control signals (S2_1, ..., S2_n) outputted by the second control signal (S2) can be determined according to the number of valves and / or sensors in the refrigerant module (20A) that is the control target and the number of water pumps and / or valves in the cooling water module (20B). The plurality of driver chips (430_1, ..., 430_n) can each receive the outputted second control signals (S2_1, ..., S2_n), and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0119] <Example 4>

[0120] Figure 7 is a schematic diagram of a thermal management system according to the fourth embodiment of the present disclosure.

[0121] According to the fourth embodiment of the present disclosure, the thermal management system may include a cooling water module (20B) through which cooling water circulates and a heater (10B) that heats the cooling water.

[0122] The MCU (100) can output a first control signal (S1) for controlling a heater (10B), which is a high-voltage electrical component, and can output a second control signal (S2) for controlling a cooling water module (20B), which is a low-voltage electrical component.

[0123] For example, the first control signal (S1) is received by the switching element (210), and the switching element (210) can control the operation of the heater (10B). Meanwhile, the number of individual second control signals (S2_1, ..., S2_n) outputted by the second control signal (S2) can be determined according to the number of water pumps and / or valves in the cooling water module (20B) that is the control target. The plurality of driver chips (430_1, ..., 430_n) can each receive the outputted second control signals (S2_1, ..., S2_n), and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0124] <Example 5>

[0125] Figure 8 is a schematic diagram of a thermal management system according to the fifth embodiment of the present disclosure.

[0126] According to the fifth embodiment of the present disclosure, the thermal management system may include a refrigerant module (20A) through which refrigerant circulates, a compressor (10A) for compressing the refrigerant, and a heater (10B) for heating cooling water.

[0127] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A) and a heater (10B), which are high-voltage electrical components, and can output a second control signal (S2) for controlling a refrigerant module (20A), which is a low-voltage electrical component.

[0128] For example, the first control signal (S1) can be distinguished into a signal for controlling the compressor (10A) and a signal for controlling the heater (10B). The distinguished signals (S1_1, S1_2) are received by each switching element (210_1, 210_2), and each switching element (210_1, 210_2) can individually control the operations of the compressor (10A) and the heater (10B) through the corresponding signals.

[0129] Meanwhile, the number of individual second control signals (S2_1, …, S2_n) outputted may be determined according to the number of valves and / or sensors in the refrigerant module (20A) that is the control target. A plurality of driver chips (430_1, …, 430_n) may each receive the output second control signals (S2_1, …, S2_n) and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0130] <Example 6>

[0131] Figure 9 is a schematic diagram of a thermal management system according to the sixth embodiment of the present disclosure.

[0132] According to the sixth embodiment of the present disclosure, the thermal management system may include a cooling water module (20B) through which cooling water circulates, a compressor (10A) for compressing refrigerant, and a heater (10B) for heating the cooling water.

[0133] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A) and a heater (10B), which are high-voltage electrical components, and can output a second control signal (S2) for controlling a cooling water module (20B), which is a low-voltage electrical component.

[0134] For example, the first control signal (S1) can be distinguished into a signal for controlling the compressor (10A) and a signal for controlling the heater (10B). The distinguished signals (S1_1, S1_2) are received by each switching element (210_1, 210_2), and each switching element (210_1, 210_2) can individually control the operations of the compressor (10A) and the heater (10B) through the corresponding signals.

[0135] Meanwhile, the number of individual second control signals (S2_1, …, S2_n) outputted may be determined according to the number of valves and / or sensors in the cooling water module (20B) that is the control target. A plurality of driver chips (430_1, …, 430_n) may each receive the outputted second control signals (S2_1, …, S2_n) and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0136] <Example 7>

[0137] Fig. 10 is a schematic diagram of a thermal management system according to the seventh embodiment of the present disclosure.

[0138] According to the seventh embodiment of the present disclosure, the thermal management system may include a refrigerant module (20A) through which refrigerant circulates, a cooling water module (20B) through which cooling water circulates, a low-voltage cooling fan (20C), a compressor (10A) for compressing the refrigerant, and a heater (10B) for heating the cooling water. For example, the compressor (10A) and the heater (10B) may correspond to high-voltage electrical components, and the refrigerant module (20A), the cooling water module (20B), and the low-voltage cooling fan (20C) may correspond to low-voltage electrical components.

[0139] The MCU (100) can output a first control signal (S1) for controlling the compressor (10A) and heater (10B), which are high-voltage electrical components, and can output a second control signal (S2) for controlling the refrigerant module (20A), the cooling water module (20B), and the low-voltage cooling fan (20C), which are low-voltage electrical components.

[0140] For example, the first control signal (S1) can be distinguished into a signal for controlling the compressor (10A) and a signal for controlling the heater (10B). The distinguished signals are received by each switching element (210_1, 210_2), and each switching element (210_1, 210_2) can individually control the operations of the compressor (10A) and the heater (10B) through the corresponding signals.

[0141] Meanwhile, the number of individual second control signals (S2_1, …, S2_n) outputted by the second control signal (S2) may be determined according to the number of valves and / or sensors in the refrigerant module (20A) being controlled, the number of water pumps and / or valves in the coolant module (20B), and the configuration of the low-voltage cooling fan (20C). A plurality of driver chips (430_1, …, 430_n) may each receive the second control signals (S2_1, …, S2_n) being outputted, and may individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0142] <Example 8>

[0143] Fig. 11 is a schematic diagram of a thermal management system according to the eighth embodiment of the present disclosure.

[0144] According to the eighth embodiment of the present disclosure, a thermal management system may include a refrigerant module (20A) through which refrigerant circulates, a low-voltage cooling fan (20C), and a compressor (10A) for compressing the refrigerant. For example, the compressor (10A) may correspond to a high-voltage electrical component, and the refrigerant module (20A) and the low-voltage cooling fan (20C) may correspond to low-voltage electrical components.

[0145] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A), which is a high-voltage electrical component, and can output a second control signal (S2) for controlling a refrigerant module (20A) and a low-voltage cooling fan (20C), which are low-voltage electrical components.

[0146] For example, for example, the first control signal (S1) is received by the switching element (210), and the switching element (210) can control the operation of the compressor (10A).

[0147] Meanwhile, the number of individual second control signals (S2_1, …, S2_n) outputted by the second control signal (S2) can be determined depending on the number of valves and / or sensors in the refrigerant module (20A) that is the control target and the configuration of the low-voltage cooling fan (20C). A plurality of driver chips (430_1, …, 430_n) can each receive the second control signals (S2_1, …, S2_n) that are outputted and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0148] <Example 9>

[0149] Fig. 12 is a schematic diagram of a thermal management system according to the ninth embodiment of the present disclosure.

[0150] According to the ninth embodiment of the present disclosure, the thermal management system may include a refrigerant module (20A) through which refrigerant circulates, a cooling water module (20B) through which cooling water circulates, a low-voltage cooling fan (20C), and a compressor (10A) for compressing the refrigerant. For example, the compressor (10A) may correspond to a high-voltage electrical component, and the refrigerant module (20A), the cooling water module (20B), and the low-voltage cooling fan (20C) may correspond to low-voltage electrical components.

[0151] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A), which is a high-voltage electrical component, and can output a second control signal (S2) for controlling a refrigerant module (20A), a cooling water module (20B), and a low-voltage cooling fan (20C), which are low-voltage electrical components.

[0152] For example, for example, the first control signal (S1) is received by the switching element (210), and the switching element (210) can control the operation of the compressor (10A).

[0153] Meanwhile, the number of individual second control signals (S2_1, …, S2_n) outputted by the second control signal (S2) may be determined according to the number of valves and / or sensors in the refrigerant module (20A) being controlled, the number of water pumps, valves and / or sensors in the coolant module (20B), and the configuration of the low-voltage cooling fan (20C). A plurality of driver chips (430_1, …, 430_n) may each receive the second control signals (S2_1, …, S2_n) being outputted, and may individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0154] <Example 10>

[0155] Fig. 13 is a schematic diagram of a thermal management system according to the tenth embodiment of the present disclosure.

[0156] According to the tenth embodiment of the present disclosure, the thermal management system may include a cooling water module (20B) through which cooling water circulates, a low-voltage cooling fan (20C), and a heater (10B) that heats the cooling water. For example, the heater (10B) may correspond to a high-voltage electrical component, and the cooling water module (20B) and the low-voltage cooling fan (20C) may correspond to low-voltage electrical components.

[0157] The MCU (100) can output a first control signal (S1) for controlling a heater (10B), which is a high-voltage electrical component, and can output a second control signal (S2) for controlling a cooling water module (20B) and a low-voltage cooling fan (20C), which are low-voltage electrical components.

[0158] For example, for example, the first control signal (S1) is received by the switching element (210), and the switching element (210) can control the operation of the heater (10B).

[0159] Meanwhile, the number of individual second control signals (S2_1, …, S2_n) outputted by the second control signal (S2) can be determined according to the number of water pumps, valves and / or sensors in the coolant module (20B) that is the control target and the configuration of the low-voltage cooling fan (20C). A plurality of driver chips (430_1, …, 430_n) can each receive the second control signals (S2_1, …, S2_n) that are outputted and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0160] <Example 11>

[0161] Fig. 14 is a schematic diagram of a thermal management system according to the 11th embodiment of the present disclosure.

[0162] According to the eleventh embodiment of the present disclosure, a thermal management system may include a refrigerant module (20A) through which refrigerant circulates, a low-voltage cooling fan (20C), a heater (10B) for heating cooling water, and a compressor (10A) for compressing refrigerant. For example, the compressor (10A) and the heater (10B) may correspond to high-voltage electrical components, and the refrigerant module (20A) and the low-voltage cooling fan (20C) may correspond to low-voltage electrical components.

[0163] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A) and a heater (10B), which are high-voltage electrical components, and can output a second control signal (S2) for controlling a refrigerant module (20A) and a low-voltage cooling fan (20C), which are low-voltage electrical components.

[0164] For example, the first control signal (S1) can be distinguished into a signal for controlling the compressor (10A) and a signal for controlling the heater (10B). The distinguished signals are received by each switching element (210_1, 210_2), and each switching element (210_1, 210_2) can individually control the operations of the compressor (10A) and the heater (10B) through the corresponding signals.

[0165] Meanwhile, the number of individual second control signals (S2_1, …, S2_n) outputted by the second control signal (S2) can be determined depending on the number of valves and / or sensors in the refrigerant module (20A) that is the control target and the configuration of the low-voltage cooling fan (20C). A plurality of driver chips (430_1, …, 430_n) can each receive the second control signals (S2_1, …, S2_n) that are outputted and individually control the operation of low-voltage electrical components corresponding to each control target through the received signals.

[0166] <Example 12>

[0167] Fig. 15 is a schematic diagram of a thermal management system according to the 12th embodiment of the present disclosure.

[0168] According to the twelfth embodiment of the present disclosure, the thermal management system may include a cooling water module (20B) through which cooling water circulates, a low-voltage cooling fan (20C), a heater (10B) for heating the cooling water, and a compressor (10A) for compressing a refrigerant. For example, the compressor (10A) and the heater (10B) may correspond to high-voltage electrical components, and the cooling water module (20B) and the low-voltage cooling fan (20C) may correspond to low-voltage electrical components.

[0169] The MCU (100) can output a first control signal (S1) for controlling a compressor (10A) and a heater (10B), which are high-voltage electrical components, and can output a second control signal (S2) for controlling a cooling water module (20B) and a low-voltage cooling fan (20C), which are low-voltage electrical components.

[0170] For example, the first control signal (S1) can be distinguished into a signal for controlling the compressor (10A) and a signal for controlling the heater (10B). The distinguished signals are received by each switching element (210_1, 210_2), and each switching element (210_1, 210_2) can individually control the operations of the compressor (10A) and the heater (10B) through the corresponding signals.

[0171] Meanwhile, the number of individual second control signals (S2_1, ..., S2_n) outputted may be determined according to the number of water pumps, valves and / or sensors in the coolant module (20B) that is the control target and the configuration of the low-voltage cooling fan (20C). A plurality of driver chips (430_1, ..., 430_n) may each receive the second control signals (S2_1, ..., S2_n) that are outputted and individually control the operation of low-voltage electrical components corresponding to each control target through the received signal. As described above, the present disclosure can provide various advantages such as securing cost competitiveness, facilitating system optimization, and improving system reliability by configuring an integrated controller that integrates and controls high-voltage electrical components and low-voltage electrical components.

[0172] While the embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential features thereof. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.

Claims

1. An integrated controller that controls high-voltage and low-voltage electrical components. An MCU that receives an upper control signal and outputs a control signal for controlling the high-voltage electrical equipment and the low-voltage electrical equipment; A communication unit for transmitting the above upper control signal to the MCU; A high voltage power circuit that supplies high voltage power to the above high voltage electrical equipment; and A low voltage power circuit for supplying low voltage power to the low voltage electrical components and the communication unit; The above MCU outputs both a first control signal for controlling the high-voltage electrical equipment and a second control signal for controlling the low-voltage electrical equipment. Integrated controller.

2. In paragraph 1, The above MCU is powered from one of the high voltage power circuit or the low voltage power circuit, Integrated controller.

3. In paragraph 1, A switching element disposed on the high voltage power circuit; and Further comprising a driver chip disposed on the low voltage power circuit; The switching element controls the high-voltage electrical component through the first control signal, and the driver chip controls the low-voltage electrical component through the second control signal. Integrated controller.

4. In paragraph 3, The above switching element operates by receiving high voltage power from the high voltage power circuit, and the driver chip operates by receiving low voltage power from the low voltage power circuit. Integrated controller.

5. In paragraph 4, Further comprising a gate driver disposed on the low voltage power circuit and provided in front of the switching element, The above gate driver receives low voltage power from the low voltage power circuit and controls the operation of the switching element. Integrated controller.

6. In paragraph 4, The above high voltage power circuit further includes a high voltage EMC filter or a high voltage DC link arranged in front of the switching element. Integrated controller.

7. In paragraph 5, Further comprising an SMPS that converts the voltage of the above low voltage power supply into a predetermined output voltage, The voltage output from the above SMPS is supplied to the gate driver. Integrated controller.

8. In paragraph 3, The above driver chips are provided in multiple numbers, The above MCU outputs second control signals corresponding to a plurality of the above driver chips, Integrated controller.

9. In paragraph 8, The above switching elements are provided in multiple numbers, The above MCU outputs first control signals corresponding to a plurality of the above switching elements, respectively. Integrated controller.

10. In paragraph 3, The above low voltage power circuit further includes a DC link for low voltage, The power output from the DC link for the above low voltage is supplied to the driver chip. Integrated controller.

11. In paragraph 1, The above communication unit further includes a communication circuit arranged in front of the MCU to transmit the upper control signal to the MCU. Integrated controller.

12. In paragraph 1, The above MCU, communication unit, high voltage power circuit, and low voltage power circuit are all provided on one PCB. Integrated controller.

13. In paragraph 12, including a housing that accommodates the PCB; The above housing is provided with a high-voltage connector for applying high-voltage power to the high-voltage power circuit, and a low-voltage connector for applying low-voltage power to the low-voltage power circuit. Integrated controller.

14. As a vehicle thermal management system, Refrigerant module in which refrigerant circulates; Coolant module through which coolant circulates; A heater that heats the coolant; a compressor that compresses the refrigerant; and An integrated controller that controls the refrigerant module, cooling water module, heater and compressor in an integrated manner; The above integrated controller, An MCU that receives an upper control signal and outputs a first control signal for controlling the heater or compressor and a second control signal for controlling the refrigerant module or cooling water module; A communication unit that transmits the upper control signal and the first and second control signals; A high voltage power circuit for supplying high voltage power to the above compressor and heater; A low voltage power circuit for supplying low voltage power to the refrigerant module, the cooling water module, and the communication unit; Thermal management system.

15. In paragraph 14, The above MCU is powered from one of the high voltage power circuit or the low voltage power circuit, Thermal management system.

16. In paragraph 14, The above refrigerant module includes a plurality of valves for controlling the flow direction of the refrigerant, The above MCU outputs a plurality of second control signals corresponding to the plurality of valves, Further comprising a plurality of driver chips that individually receive the plurality of second control signals and individually control and drive the plurality of valves. Thermal management system.

17. In paragraph 14, The above cooling water module includes a water pump that applies pressure to the cooling water and a plurality of valves that control the flow direction of the cooling water, The above MCU outputs a plurality of second control signals corresponding to the water pump and valve, respectively, Further comprising a plurality of driver chips that individually receive the plurality of second control signals and individually control and drive the water pump and valve. Thermal management system.

18. In paragraph 14, Includes additional low voltage cooling fans, The above MCU outputs a second control signal corresponding to the low-voltage cooling fan, Further comprising a driver chip that receives the second control signal and controls and drives the low-voltage cooling fan. Thermal management system.

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