Piezoelectric acoustic device and electronic apparatus

Abstract

Provided in the present disclosure are a piezoelectric acoustic device and an electronic apparatus. The piezoelectric acoustic device comprises a housing, and a vibration plate and a driving source assembly, which are accommodated in the housing, wherein the vibration plate is connected to the driving source assembly by means of buffer rubber; and the driving source assembly is used for driving, under the action of the buffer rubber, the vibration plate to integrally vibrate like a flat plate. In the present invention, transmission between the driving source assembly and the vibration plate is performed by means of the buffer rubber, such that the bending motion of the driving source assembly is converted into the parallel motion of the vibration plate, thereby achieving the purpose of compensating for high-frequency sound and improving the acoustic performance of the piezoelectric acoustic device.

Description

Piezoelectric acoustic device and electronic device

[0001] The present application claims priority to the patent application with the application number 202411004140.6, the application date of 2024.07.25, and the application creation name of "Complementary storage circuit and memory". TECHNICAL FIELD

[0002] The present disclosure relates to the technical field of loudspeakers, and more particularly, to a piezoelectric acoustic device and an electronic device. BACKGROUND

[0003] At present, the suspension system of the voice coil type driven earphone unit is generally in a membrane structure. Due to the thin membrane, it is easy to deform, and in low frequency, it has obvious deformation to push the air vibration, thereby having better low-frequency acoustic response. However, due to the size characteristics of the thin membrane structure, in high frequency, the vibration mode will change from the low-frequency flat push (piston) type movement to chaotic irregular vibration, and the ability to push the air will also decrease rapidly, resulting in poor high-frequency acoustic performance.

[0004] The existing piezoelectric high-frequency acoustic compensation structure is generally mechanically hard-connected to the ceramic on the thick metal frame. This structure uses the contraction and expansion of the energized ceramic to drive the bending deformation of the metal frame to drive the air vibration to realize sound emission. Although the bending stiffness of the ceramic and the metal is large, the resonance point is high, and the hard connection of the ceramic and the metal frame can provide very high acoustic frequency compensation. However, the hard connection of the ceramic and the metal frame greatly limits the deformation release of the ceramic sheet, and most of the energy in the ceramic is converted into the deformation difference between the metal frame, thereby limiting the degree of frequency compensation and affecting the high-frequency compensation effect.

[0005] Therefore, there is an urgent need for a piezoelectric acoustic device that can reduce the energy loss between the ceramic and the thick metal sheet, reduce the starting point of high-frequency compensation, and improve the height of the output sound pressure level. SUMMARY

[0006] In view of the above problems, the purpose of the present disclosure is to provide a piezoelectric acoustic device and an electronic device to solve the problems of single judgment basis of existing vehicle-mounted sensors, inability to identify environmental noise and special sound, etc., resulting in sensor misjudgment, affecting user experience, etc.

[0007] The piezoelectric acoustic device provided by the present disclosure includes a shell, a vibration plate and a driving source assembly accommodated in the shell, and the vibration plate and the driving source assembly are connected through a buffer glue. The driving source assembly is used to drive the vibration plate to perform a whole vibration similar to a flat plate under the action of the buffer glue.

[0008] In addition, the optional technical scheme is that the driving source assembly comprises a ceramic sheet and a connecting sheet which are attached to each other; wherein the connecting sheet is attached to the center of the vibrating plate by the buffer glue; the ceramic sheet and the connecting sheet are fixedly connected by point gluing, and the ceramic sheet is located on the side of the connecting sheet away from the vibrating plate.

[0009] In addition, the optional technical scheme is that the EI ratio of the connecting sheet and the ceramic sheet is greater than 0.7 and less than 1.3; wherein E represents Young's modulus, and I represents the sectional moment of inertia.

[0010] In addition, the optional technical scheme is that the buffer glue comprises silica gel, butyn class glue, polyurethane class glue, acrylic class glue and epoxy glue, and the thickness of the buffer glue is greater than 0.05 mm and less than 2 mm.

[0011] In addition, the optional technical scheme is that the vibrating plate is circular, rectangular or symmetrically cut two arc shapes on the basis of a circular shape; the shape of the driving source assembly is circular, rectangular or elliptical.

[0012] In addition, the optional technical scheme is that the connecting sheet and the ceramic sheet are of the same shape, and the connecting sheet and the ceramic sheet are respectively provided with at least one layer.

[0013] In addition, the optional technical scheme is that when the driving source assembly is rectangular, the aspect ratio of the rectangular driving source assembly is greater than 3 / 2 and less than 5 / 1.

[0014] In addition, the optional technical scheme is that when the vibrating plate is circular and the driving source assembly is rectangular: in the direction of the center of the vibrating plate, the distance between the rectangular vertex of the driving source assembly and the periphery of the vibrating plate is greater than or equal to half the length of the short side of the driving source assembly and less than half the length of the long side of the driving source assembly.

[0015] In addition, the optional technical scheme is that the position of the point gluing is uniformly or symmetrically distributed between the ceramic sheet and the connecting sheet.

[0016] In addition, the optional technical scheme is that the connecting sheet is a metal sheet, an acrylic sheet or a nylon sheet; and the vibrating plate is an acrylic plate, a nylon plate or a metal plate.

[0017] In addition, the optional technical scheme is that when the shape of the vibrating plate is the shape of symmetrically cutting two arc shapes on the basis of a circular shape, the shell is a circular structure, the edge of the vibrating plate is fixed inside the shell, and the cut gap of the two arc shapes forms a sound hole; when the vibrating plate is circular, the shell is a circular structure, the edge of the vibrating plate is fixed inside the shell, and a sound hole which is in communication with the outside is arranged on the shell.

[0018] In another aspect, the present disclosure also provides an electronic device comprising the piezoelectric acoustic device.

[0019] With the piezoelectric acoustic device and the electronic device, the driving source assembly and the vibration plate are connected through the buffer glue, the mechanical transmission between the driving source assembly and the vibration plate can be realized through the buffer glue, compared with the bending vibration of the existing vibration plate, the vibration plate can be made to vibrate as a whole under the action of the buffer glue, and then the air vibration is pushed to sound by the translation of the vibration plate, the energy loss between the driving source assemblies can be reduced, the height of the output sound pressure level can be improved, the starting point of high frequency compensation can be reduced, and the acoustic performance of the piezoelectric acoustic device can be improved.

[0020] To achieve the above and related objects, one or more aspects of the present disclosure include features that will be explained in detail later. The following description and drawings explain certain exemplary aspects of the present disclosure in detail. However, these aspects indicate only some of the various ways in which the principles of the present disclosure can be used. In addition, the present disclosure is intended to include all such aspects and their equivalents. BRIEF DESCRIPTION OF DRAWINGS

[0021] Other objects and results of the present disclosure will be more clearly understood and appreciated by reference to the following description in conjunction with the accompanying drawings, and will become more apparent with a fuller understanding of the present disclosure. In the drawings:

[0022] Fig. 1 is a cross-sectional view of a combined structure of a driving source assembly and a vibration plate according to an embodiment of the present disclosure;

[0023] Fig. 2 is a top view of a combined structure of a driving source assembly and a vibration plate according to an embodiment of the present disclosure;

[0024] Fig. 3 is a top view of a combined structure of a driving source assembly and a vibration plate according to another embodiment of the present disclosure;

[0025] Fig. 4 is a partial cross-sectional view of a piezoelectric acoustic device according to an embodiment of the present disclosure.

[0026] The reference signs therein include: vibration plate 1, buffer glue 2, connecting sheet 3, ceramic sheet 4, housing 5, sound hole 6.

[0027] The same reference signs in all the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0028] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It can be evident, however, that such embodiment(s) can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

[0029] In the description of the present disclosure, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present disclosure.

[0030] To describe the piezoelectric acoustic device and the method for using the same in detail, the specific embodiments of the present disclosure will be described in detail below in combination with the drawings.

[0031] Fig. 1 and Fig. 2 respectively show the combined schematic structure of the driving source assembly and the vibration plate from different angles according to the embodiments of the present disclosure, and Fig. 4 shows the partial cross-sectional structure of the piezoelectric acoustic device according to the embodiments of the present disclosure.

[0032] As shown in Fig. 1, Fig. 2 and Fig. 4 together, the piezoelectric acoustic device of the embodiments of the present disclosure comprises a shell 5 and a vibration plate 1 and a driving source assembly accommodated in the shell 5, and the vibration plate 1 and the driving source assembly are connected through a soft buffer glue 2, so that the driving assembly can drive the vibration plate 1 to perform overall vibration like a flat plate under the action of the buffer glue 2, in other words, the vibration plate 1 can reduce its bending to perform overall translation under the action of the buffer glue 2, thereby improving the high frequency compensation capability of the device.

[0033] Among them, the driving source assembly comprises a ceramic sheet 4 and a connecting sheet 3 which are attached to each other, and in the assembly process, one side of the connecting sheet 3 can be attached to the center of the vibration plate 1 through the buffer glue 2, the ceramic sheet 4 and the connecting sheet 3 are fixedly connected through multiple points of glue, and the ceramic sheet 4 is located on the side of the connecting sheet 3 away from the vibration plate 1, and the buffer glue 2 is used to elastically connect between the driving source assembly and the vibration plate 1, so as to convert the bending motion of the driving source assembly into parallel motion of the vibration plate; and the connecting sheet 3 and the ceramic sheet 4 are connected through multiple positions of glue, which can reduce the energy loss between the ceramic sheet 4 and the connecting sheet 3, improve the height of the output sound pressure level, and improve the high frequency compensation capability of the piezoelectric acoustic device.

[0034] The buffer glue 2 can be soft silica gel, vinyl-based glue, polyurethane-based glue, acrylic-based glue or epoxy glue, etc., and the thickness of the buffer glue 2 can be set to be greater than 0.05 mm and less than 2 mm, so that the mechanical transmission between the driving source assembly and the vibrating plate 1 can be realized. If the thickness of the glue layer is too large, the driving effect of the driving source assembly will be poor, and if the thickness of the glue layer is too small, the translation effect of the vibrating plate 1 will be affected. Therefore, the thickness of the glue layer is set to be greater than 0.05 mm and less than 2 mm, so that the translation effect of the vibrating plate 1 can be ensured, and the high-frequency compensation starting point can be reduced.

[0035] In addition, the vibrating plate 1 in the embodiment of the present disclosure can be circular, rectangular or symmetrical cut two arc-shaped structures on the basis of the circular structure, as shown in FIG. 3, which is a top view of the driving source assembly and vibrating plate combination structure according to another embodiment of the present disclosure. After removing two symmetrical structures on the basis of the circular structure, a structure similar to a bucket is formed. The vibrating plate 1' is formed by improving the structure of the circular vibrating plate. The gap formed by cutting the vibrating plate 1' can be used as a sound outlet hole, so that the process of setting a sound outlet hole on the shell 5 is omitted. In addition, the vibrating plate is partially cut, which can also reduce the degree of constraint of the vibrating plate, so that the exploration space of the high-frequency compensation can be expanded.

[0036] In other words, in the piezoelectric acoustic device of the present disclosure, when the shape of the vibrating plate is symmetrical cut two arc-shaped shapes on the basis of the circular shape, the shell is a circular structure, the edge of the vibrating plate is fixed inside the shell, and the gap of the two cut arc shapes forms a sound outlet hole. As shown in FIG. 4, when the vibrating plate 1 is circular, the shell 5 is a circular structure, the edge of the vibrating plate 1 is fixed inside the shell 5 through the elastic glue with a certain elasticity, and the sound outlet hole 6 is provided on the shell 5 to communicate with the outside. The elastic glue can be the same as the buffer glue 2.

[0037] Further, the shape of the driving source assembly can be circular, rectangular or elliptical. Preferably, the shape of the driving source assembly is set to be a rectangular structure, because the rectangular structure has better bending ability, which can efficiently convert the electrical energy of the ceramic sheet 4 into bending elastic deformation energy. When the driving source assembly is rectangular, the aspect ratio of the rectangular driving source assembly is greater than 3 / 2 and less than 5 / 1. When the size of the driving source assembly is too large, the driving effect will be poor due to the driving rigidity. When the size of the driving source assembly is too small, the driving power will be insufficient, which will also reduce the vibration effect. Therefore, the aspect ratio of the rectangular driving source assembly can be set to be greater than 3 / 2 and less than 5 / 1, so that the driving effect can be effectively ensured.

[0038] In one specific embodiment of the present disclosure, when the vibrating plate is circular and the driving source assembly is rectangular, in order to ensure the best driving effect, the distance between the rectangular vertex of the driving source assembly and the periphery of the vibrating plate in the direction of the center of the vibrating plate is greater than or equal to half the length of the short side of the driving source assembly and less than half the length of the long side of the driving source assembly, as shown in FIG. 2, the distance d between the rectangular vertex of the driving source assembly and the periphery of the vibrating plate is greater than b and less than the size of a.

[0039] In addition, the bending stiffness of the ceramic sheet 4 and the connecting sheet 3 in the embodiment of the present disclosure is matched, that is, the EI product of the ceramic sheet 4 and the connecting sheet 3 is similar or the same, E represents the Young's modulus of the material, I represents the cross-sectional moment of inertia of the sheet, preferably, the EI ratio of the connecting sheet and the ceramic sheet can be greater than 0.7 and less than 1.3, which can reduce the deformation energy loss between the ceramic sheet 4 and the connecting sheet 3, the resonance point of the ceramic sheet and the connecting sheet is higher, and the compensated frequency range can be biased to the high frequency range of tens of K. The connecting sheet 3 is not limited to stainless steel sheet, aluminum alloy sheet, copper sheet, metal sheet, acrylic sheet or nylon sheet, the material of the vibrating plate 1 can be selected from acrylic plate, nylon plate or metal plate, or the same material as the connecting plate, and the connecting sheet 3 and the ceramic sheet 4 have the same shape, and the two are connected by multiple point gluing, the position of the point gluing can be uniformly or symmetrically distributed between the ceramic sheet 4 and the connecting sheet 3, and the size of several point gluing is about 5 microns, which can be strongly connected by hard glue.

[0040] Further, the connecting sheet 3 and the ceramic sheet 4 can be respectively provided with at least one layer, and the multiple layers of ceramic sheets can be connected by hard glue point gluing or integrally formed in the sintering process, and the driving force of the piezoelectric acoustic device can be improved by the multiple layers of ceramic sheets, thereby realizing the high frequency compensation effect.

[0041] Corresponding to the above piezoelectric acoustic device, the present disclosure also provides an electronic device comprising the above piezoelectric acoustic device. Specifically, the embodiments of the above electronic device can refer to the description in the piezoelectric acoustic device embodiments, which will not be described here.

[0042] According to the piezoelectric acoustic device and the electronic device of the present disclosure, the connecting sheet in the driving source assembly is attached to the center of the vibrating plate by the buffer glue, and the ceramic sheet and the connecting sheet are fixedly connected by the hard point gluing at multiple positions, which can realize the mechanical transmission between the driving source assembly and the vibrating plate by the buffer glue, realize the overall translation of the vibrating plate, and then push the air vibration to make sound through the translation of the vibrating plate, while reducing the energy loss between the ceramic sheet and the connecting sheet by the point gluing connection, improving the height of the output sound pressure level, and reducing the starting point of the high frequency compensation, thereby improving the acoustic performance of the piezoelectric acoustic device.

[0043] The piezoelectric acoustic device and the electronic apparatus according to the present disclosure are described above with reference to the drawings by way of example. However, it should be understood by those skilled in the art that various improvements can be made to the piezoelectric acoustic device and the electronic apparatus proposed in the present disclosure without departing from the content of the present disclosure. Therefore, the protection scope of the present disclosure should be determined by the content of the appended claims.

Claims

1. A piezoelectric acoustic device, comprising a housing, a vibration plate and a driving source assembly accommodated in the housing; characterized in that, the vibration plate and the driving source assembly are connected through a buffer glue; wherein, the driving source assembly is used to drive the vibration plate to perform a whole vibration like a flat plate under the action of the buffer glue.

2. The piezoelectric acoustic device of claim 1, wherein, the driving source assembly comprises a ceramic sheet and a connecting sheet which are attached to each other; wherein, the connecting sheet is attached to the center of the vibration plate through the buffer glue; the ceramic sheet and the connecting sheet are fixedly connected through dispensing, and the ceramic sheet is located on the side of the connecting sheet away from the vibration plate. 3.The piezoelectric acoustic device according to claim 1, characterized in that, the EI ratio of the connecting sheet to the ceramic sheet is greater than 0.7 and less than 1.3; wherein, E represents Young's modulus, and I represents the sectional moment of inertia. 4.The piezoelectric acoustic device according to claim 1, characterized in that, the buffer glue comprises silica gel, VMQ glue, polyurethane glue, acrylic glue and epoxy glue, and the thickness of the buffer glue is greater than 0.05 mm and less than 2 mm. 5.The piezoelectric acoustic device according to claim 1, characterized in that, the vibration plate is circular, rectangular or symmetrically cut two arc shapes on the basis of a circular shape; the shape of the driving source assembly is circular, rectangular or elliptical. 6.The piezoelectric acoustic device according to claim 5, characterized in that, the connecting sheet and the ceramic sheet are the same shape, and the connecting sheet and the ceramic sheet are respectively provided with at least one layer. 7.The piezoelectric acoustic device according to claim 5, characterized in that, when the driving source assembly is rectangular, the aspect ratio of the rectangular driving source assembly is greater than 3 / 2 and less than 5 / 1.

8. The piezoelectric acoustic device of claim 5, wherein, when the vibration plate is circular and the driving source assembly is rectangular: in the direction of the center of the vibration plate, the distance between the rectangular vertex of the driving source assembly and the periphery of the vibration plate is greater than or equal to half the length of the short side of the driving source assembly and less than half the length of the long side of the driving source assembly. 9.The piezoelectric acoustic device according to claim 1, characterized in that, the position of the dispensing is uniformly or symmetrically distributed between the ceramic sheet and the connecting sheet. 10.The piezoelectric acoustic device according to claim 1, characterized in that, the connecting sheet is a metal sheet, an acrylic sheet or a nylon sheet; the vibration plate is an acrylic plate, a nylon plate or a metal plate. 11.The piezoelectric acoustic device according to claim 5, characterized in that, when the shape of the vibration plate is the shape of symmetrically cutting two arc shapes on the basis of a circular shape, the housing is a circular structure, the edge of the vibration plate is fixed inside the housing, and the cutout of the two arc shapes forms a sound hole; when the vibration plate is circular, the housing is a circular structure, the edge of the vibration plate is fixed inside the housing, and a sound hole which is in communication with the outside is provided on the housing.

12. An electronic device, comprising: The piezoelectric acoustic device according to any one of claims 1-11.

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