Display screen, display module, and electronic device

Abstract

A display screen (10), a display module (100), and an electronic device (1000). The display screen (10) comprises a vapor chamber layer (11) and a display stack (12); the display stack (12) comprises a display region (121) and a bending region (122), wherein the bending region (122) is connected to the display region (121); the vapor chamber layer (11) comprises a first cover plate (111), a second cover plate (112), a capillary structure (113), and a cooling medium (114), wherein the first cover plate (111) and the second cover plate (112) are fixedly connected to each other and define a sealed cavity (115), the capillary structure (113) is fixed in the sealed cavity (115), the cooling medium (114) is provided in the sealed cavity (115), and the first cover plate (111) is fixedly connected to a non-display surface (1212) of the display region (121); part of the bending region (122) bypasses the first cover plate (111) and is fixedly connected to the side of the first cover plate (111) distant from the display region (121), or part of the bending region (122) bypasses the first cover plate (111) and the second cover plate (112) and is fixedly connected to the side of the second cover plate (112) distant from the display region (121). On the one hand, the display screen (10) not only has a display function, but also incorporates a heat dissipation function. On the other hand, the display screen (10) achieves the effect of reduced weight and thickness, and can also greatly improve the heat dissipation effect by increasing the heat dissipation area.

Description

Display screens, display modules and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202411014648.4, filed on July 25, 2024, with the invention entitled "Display screen, display module and electronic device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a display screen, display module, and electronic device. Background Technology

[0003] With the development of mobile internet and smart technology, people increasingly need lightweight and portable terminal devices, thus placing higher demands on overall weight and thickness. At the same time, high-performance terminal devices often generate a significant amount of heat, making heat dissipation a crucial factor for users. Therefore, developing a terminal device that achieves weight and thinness reduction while also significantly improving heat dissipation is urgently needed. Summary of the Invention

[0004] The purpose of this application is to provide a display screen, a display module, and an electronic device, which can achieve both weight and thinning of the display screen, and can also significantly improve heat dissipation by increasing the heat dissipation area.

[0005] In a first aspect, this application provides a display screen. The display screen includes a heat dissipation layer and a display stack, the display stack including a display area and a bending area, the bending area being connected to the display area;

[0006] The heat dissipation layer includes a first cover plate, a second cover plate, a capillary structure, and a cooling medium. The first cover plate and the second cover plate are fixedly connected and form a sealed cavity. The capillary structure is fixed inside the sealed cavity, and the cooling medium is disposed inside the sealed cavity. The first cover plate is fixedly connected to the non-display surface of the display area.

[0007] A portion of the bending area bypasses the first cover plate and is fixedly connected to the side of the first cover plate away from the display area, or a portion of the bending area bypasses both the first and second cover plates and is fixedly connected to the side of the second cover plate away from the display area.

[0008] It is understood that in this embodiment, by fixing the first cover plate of the heat dissipation layer to the non-display surface of the display area of ​​the display stack, the heat dissipation layer and the display stack can be integrated into a single unit, i.e., a display screen. Therefore, compared to traditional display screens, the display screen of this embodiment integrates a heat dissipation layer. In this way, the display screen not only has a display function but also incorporates a heat dissipation function. The display screen of this embodiment has a "multi-purpose" effect.

[0009] Understandably, since the display screen integrates a heat dissipation layer, the procurement of materials for electronic devices only requires purchasing the display screen and protective cover as a single component, eliminating the need to separately procure the heat dissipation plate. Therefore, this implementation reduces the number of material suppliers, thereby reducing investment costs.

[0010] It is understandable that by fixing the first cover plate of the heat spreader layer to the non-display surface of the display area of ​​the display stack, the heat spreader layer is directly used to support the display stack, thereby improving the overall strength of the display stack and preventing damage. Clearly, the heat spreader layer in this embodiment can serve both a heat spreader function and a support function. The heat spreader layer in this embodiment has a "multi-purpose" effect. Furthermore, in this embodiment, since the heat spreader layer can directly support the display stack, the display screen of this embodiment does not need to be provided with rolled pure copper and a second backing adhesive; that is, the display screen of this embodiment can omit the rolled pure copper and the second backing adhesive. In terms of mass, the display screen of this embodiment can at least save the mass of the rolled pure copper and the second backing adhesive, thus facilitating a lighter display screen design. In terms of thickness, the display screen of this embodiment can at least save the thickness of the rolled pure copper and the second backing adhesive, thus facilitating a thinner display screen design. When the display screen is applied to display modules and electronic devices, it also facilitates the lightweight and thinner design of the display modules and electronic devices.

[0011] For example, the display screen of this embodiment can reduce its weight by more than 2.1g and its thickness by more than 0.05mm, which is very beneficial for the lightweight and thinner design of display modules and electronic devices.

[0012] It is understood that because the display screen of this embodiment can omit the need for rolled pure copper and a second backing adhesive, the saved mass and space of the display screen can be used to increase the mass and space of the heat dissipation layer. For example, the saved space of the display screen can be used to increase the volume of the sealing cavity of the heat dissipation layer. The saved mass of the display screen can be used to increase the mass of the cooling medium of the heat dissipation layer. In this way, the heat dissipation capacity of the display screen can be greatly improved.

[0013] It is understandable that, since the heat dissipation layer is formed directly during the formation of the display screen, in this embodiment, the heat dissipation layer can be formed on the non-display surface of the display area before the step of fixing the bending area to the non-display surface of the display area. Then, the bending area is fixed to the side of the first cover plate away from the display area, or fixed to the side of the second cover plate away from the display area. In this way, the heat dissipation layer in this embodiment will not interfere with the portion of the bending area connected to the display area during its formation. The heat dissipation layer in this embodiment can be laid over a large area on the non-display surface of the display area. Therefore, the area of ​​the heat dissipation layer in this embodiment can be set sufficiently large. The heat dissipation capacity of the heat dissipation layer in this embodiment is better.

[0014] It is understandable that when the display module of this embodiment is applied to an electronic device, since the heat dissipation layer of this embodiment can be laid over a large area on the non-display surface of the display area, the heat dissipation layer can cover most of the functional components inside the electronic device. In this way, the heat generated by most of the functional components can be conducted to the heat dissipation layer with a shorter path and dissipated through the heat dissipation layer, thereby greatly improving the heat dissipation effect of the electronic device.

[0015] It is understandable that this embodiment integrates the heat dissipation layer into the display screen to form a new stacked structure. This allows the heat dissipation layer to support the display stack, ensuring the reliability of the display screen. It also enables the display screen to be reduced in weight and thinner. Furthermore, by increasing the heat dissipation area, the heat dissipation effect can be greatly improved, thereby meeting users' iterative needs for electronic devices and promoting product sales.

[0016] In one possible implementation, a portion of the first cover plate extends relative to the second cover plate to form a first protrusion; a portion of the bending area bypasses the first cover plate and is fixedly connected to the side of the first protrusion away from the display area.

[0017] It is understandable that by setting a portion of the first cover plate to extend relative to the second cover plate and forming a first protrusion, the bending area can be conveniently fixedly connected to the first cover plate.

[0018] In one possible implementation, the display screen includes an adhesive layer, and the first cover plate is fixedly connected to the non-display surface of the display area via the adhesive layer. It is understood that the connection method between the first cover plate and the non-display surface of the display area is relatively simple.

[0019] In one possible implementation, the display screen includes a first adhesive layer, a PET layer, and a second adhesive layer, wherein the PET layer is connected between the first adhesive layer and the second adhesive layer; the first adhesive layer is fixedly connected to the non-display surface of the display area, and the second adhesive layer is fixedly connected to the first cover plate.

[0020] It is understood that, in this embodiment, by setting a PET layer between the first adhesive layer and the second adhesive layer, and then using the first adhesive layer to fixally connect to the non-display surface of the display area, and the second adhesive layer to fixally connect to the second surface of the first cover plate, the overall thickness of the first adhesive layer, the PET layer and the second adhesive layer in this embodiment can be made smaller compared to the solution that uses adhesive layers throughout.

[0021] In one possible implementation, the display stack includes a back film layer, a panel layer, and an optical film layer stacked sequentially. The back film layer, a portion of the panel layer, and the optical film layer constitute the display area, and another portion of the panel layer constitutes the bending area. The first cover plate is fixedly connected to the side of the back film layer of the display area away from the panel layer.

[0022] It is understood that the first cover plate is fixedly connected to the side of the panel layer away from the display area of ​​the back film layer, and the first cover plate will not damage the panel layer due to direct contact with the panel layer. The panel layer has better reliability.

[0023] In one possible implementation, the material of the first cover plate includes pure copper, copper-PI-copper, copper-titanium copper, copper-steel copper, steel-aluminum, titanium-aluminum, titanium-steel, or stainless steel; thus, the first cover plate has better strength and resistance to deformation.

[0024] And / or, the material of the second cover plate includes pure copper, copper-PI-copper, copper-titanium copper, copper-steel copper, steel-aluminum, titanium-aluminum, titanium-steel, or stainless steel. This results in better strength and resistance to deformation for the second cover plate.

[0025] In one possible implementation, the modulus of the first cover plate is in the range of 90 GPa to 150 GPa, or the impedance of the first cover plate is in the range of 0.017 Ω / m to 1.2 Ω / m; this can increase the strength and deformation resistance of the first cover plate.

[0026] And / or, the modulus of the second cover plate is in the range of 90 GPa to 150 GPa, or the impedance of the second cover plate is in the range of 0.017 Ω / m to 1.2 Ω / m. This increases the strength and resistance to deformation of the second cover plate.

[0027] In one possible implementation, the capillary structure is fixedly connected to the first cover plate, or the capillary structure is fixedly connected to the second cover plate, or a portion of the capillary structure is fixedly connected to the first cover plate and a portion is fixedly connected to the second cover plate.

[0028] In one possible implementation, a portion of the first cover plate extends relative to the second cover plate to form a second protrusion, the second protrusion being provided with a clearance hole. It is understood that the clearance hole can be used to avoid interference with some functional components.

[0029] In one possible implementation, the clearance aperture includes a first type of clearance aperture and a second type of clearance aperture; the first type of clearance aperture is used to clear the optical path of the camera module, and the second type of clearance aperture is used to clear the optical path of the proximity light sensor.

[0030] In one possible implementation, a portion of the first cover plate is recessed toward the second cover plate and is fixedly connected to the capillary structure.

[0031] Understandably, in the thickness direction of the display, the second cover plate can support the first cover plate to some extent through capillary structures. This results in better overall strength between the first and second cover plates. Consequently, the heat dissipation layer can better support the display stack.

[0032] In one possible implementation, a portion of the second cover plate protrudes toward the first cover plate and passes through the capillary structure, and is fixedly connected to the first cover plate.

[0033] Understandably, the second cover plate can support the first cover plate along the thickness direction of the display. The overall strength of the first and second cover plates is better. The heat dissipation layer can better support the display stack.

[0034] In one possible implementation, the heat spreader further includes a support column located within the sealed cavity, with one end of the support column fixedly connected to the first cover plate and the other end fixedly connected to the second cover plate.

[0035] Understandably, the support columns are used to maintain the shape of the heat exchange layer. They also help resist deformation of the heat exchange layer caused by pressure differences between the inside and outside atmospheres, as well as other external forces, to prevent the heat exchange layer from failing due to flattening of its sealing cavity and capillary structure.

[0036] In one possible implementation, the capillary structure is one or more of copper mesh, copper fiber, copper powder, or copper foam.

[0037] In one possible implementation, the cooling medium includes water, methanol, or acetone.

[0038] In one possible implementation, the area of ​​the non-display surface of the display area covered by the first cover plate is a first area, and the area of ​​the non-display surface of the display area is a second area, wherein the ratio of the first area to the second area is between 50% and 100%. For example, the ratio of the first area to the second area can be 50%, 60%, 80%, 85%, 90%, or 100%.

[0039] It is understood that the heat dissipation layer of this embodiment can cover the non-display surface of the entire display area. In this way, on the one hand, the area of ​​the heat dissipation layer of this embodiment is large enough to greatly improve the heat dissipation effect, and on the other hand, the entire non-display surface of the display screen of this embodiment can form the effect of a heat dissipation material.

[0040] Secondly, this application provides a display module. The display module includes a protective cover and a display screen as described above, wherein the protective cover is attached to the side of the display stack away from the heat spreader layer.

[0041] Understandably, display modules can achieve both weight and thinning effects, and can also significantly improve heat dissipation by increasing the heat dissipation area.

[0042] Thirdly, this application provides an electronic device. It includes a housing and a display module as described above, the display module being mounted on the housing.

[0043] It is understandable that electronic devices can achieve both weight reduction and thinning, and can also significantly improve heat dissipation by increasing the heat dissipation area.

[0044] In one possible implementation, the display module and the housing enclose a receiving space for the electronic device; the electronic device further includes a first device located within the receiving space, the first device being disposed opposite to the heat dissipation layer of the display screen.

[0045] It is understandable that when the heat generated by the first device can be conducted to the heat dissipation layer with a shorter path and dissipated through the heat dissipation layer, the heat dissipation effect of the electronic device can be greatly improved. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0047] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0048] Figure 2 is a partially exploded schematic diagram of the electronic device shown in Figure 1 in some embodiments;

[0049] Figure 3 is a schematic cross-sectional view of the electronic device shown in Figure 1 cut along point AA in some embodiments;

[0050] Figure 4 is a partially exploded schematic diagram of the display module shown in Figure 2 in some embodiments;

[0051] Figure 5 is a partial cross-sectional view of the electronic device shown in Figure 1 in some other embodiments;

[0052] Figure 6 is a schematic diagram of the assembly of the display screen and heat spreader shown in Figure 5 in some embodiments;

[0053] Figure 7 is a partially exploded view of the display screen shown in Figure 4 in some embodiments;

[0054] Figure 8 is a schematic diagram of the stack shown in Figure 7 from another angle;

[0055] Figure 9 is a schematic diagram of the structure of the heat exchange layer shown in Figure 7 from another angle;

[0056] Figure 10 is a partially exploded schematic diagram of the heat spreader shown in Figure 9 in some embodiments;

[0057] Figure 11 is a partial cross-sectional view of the heat spreader shown in Figure 7 along line BB in some embodiments;

[0058] Figure 12 is a structural schematic diagram of the display screen shown in Figure 4 from another angle;

[0059] Figure 13 is a partial cross-sectional view of the display module shown in Figure 2 along the CC line in some embodiments;

[0060] Figure 14 is a partial cross-sectional view of the electronic device shown in Figure 1 cut along AA in some other embodiments;

[0061] Figure 15 is a partial cross-sectional view of the display module shown in Figure 2 along the CC line in some other embodiments;

[0062] Figure 16 is a partial cross-sectional view of the display module shown in Figure 2 along the CC line in some embodiments;

[0063] Figure 17 is a partial cross-sectional view of the display module shown in Figure 2 along the CC line in some embodiments;

[0064] Figure 18 is a schematic diagram of the structure of the heat spreader shown in Figure 7 in some other embodiments;

[0065] Figure 19 is a partial cross-sectional view of the display module shown in Figure 2 along the DD line in some embodiments;

[0066] Figure 20 is a partial cross-sectional view of the display module shown in Figure 2 along the DD line in some other embodiments;

[0067] Figure 21 is a partial cross-sectional view of the display module shown in Figure 2 along the DD line in some embodiments. Detailed Implementation

[0068] The embodiments of this application are described below with reference to the accompanying drawings.

[0069] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two. A and / or B include three schemes, specifically scheme A, scheme B, and scheme AB. Wherein, the two components obtaining an integrated structure through an integral molding process means that during the formation of one of the two components, that component is connected to the other component, without requiring further processing (such as bonding, welding, snap-fit ​​connection, or screw connection) to connect the two components together.

[0070] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0071] It is understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0072] Figure 1 is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application.

[0073] As shown in Figure 1, in some embodiments, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), personal computer, laptop computer, in-vehicle device, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, etc., all of which have a display module 100. The electronic device 1000 in the embodiment shown in Figure 1 is illustrated using a mobile phone as an example.

[0074] Figure 2 is a partially exploded schematic diagram of the electronic device 1000 shown in Figure 1 in some embodiments.

[0075] As shown in Figures 1 and 2, the electronic device 1000 includes a display module 100, a housing 200, and functional components 300. It is understood that Figure 1 and the related figures below only schematically show some of the components included in the electronic device 1000, and the actual shape, size, position, and structure of these components are not limited by Figure 1 and the figures below.

[0076] For example, the display module 100 can be an organic light-emitting diode (OLED) display module 100, an active-matrix organic light-emitting diode (AMOLED) display module 100, a liquid crystal display (LCD) module 100, etc. This embodiment does not specifically limit the specific structure of the display module 100.

[0077] For example, the functional device 300 can be a camera module 301, a proximity sensor 302, a battery 303, a speaker 304, or other devices with certain functions. This embodiment does not limit the specific structure of the functional device 300.

[0078] Figure 3 is a schematic cross-sectional view of the electronic device shown in Figure 1 cut along point AA in some embodiments.

[0079] Referring to Figure 3, and in conjunction with Figures 1 and 2, exemplarily, the display module 100 is mounted on the housing 200. The display module 100 and the housing 200 can enclose a receiving space 400 of the electronic device 1000. Functional devices 300 can be disposed within the receiving space 400. Functional devices 300 can be disposed opposite to the display module 100.

[0080] Referring to Figure 3, and in conjunction with Figures 1 and 2, the housing 200, exemplarily, includes a mid-frame 201 and a rear cover 202. A display module 100 is mounted on the mid-frame 201. The rear cover 202 is mounted on the side of the mid-frame 201 away from the display module 100. The display module 100, the mid-frame 201, and the rear cover 202 together enclose a receiving space 400 of the electronic device 1000. It is understood that the mid-frame 201 can be used to support the display module 100. The rear cover 202 can be used to cover the functional components 300 within the receiving space 400.

[0081] For example, the display module 100 can be fixedly connected to the mid-frame 201 by a dispensing process. The back cover 202 can also be fixedly connected to the mid-frame 201 by a dispensing process.

[0082] It is understood that although this embodiment describes one implementation of the housing 200 structure, this application does not specifically limit the specific structure of the housing 200. For example, the middle frame 201 and the rear cover 202 can also be an integrally formed structure.

[0083] Referring to Figure 3, and in conjunction with Figures 1 and 2, the middle frame 201 may, by way of example, be provided with a battery compartment 203. The opening of the battery compartment 203 may be on the surface of the middle frame 201 facing the display module 100.

[0084] For example, the battery 303 can be fixedly connected to the mid-frame 201 and located inside the battery compartment 203. The back cover 202 covers the battery 303 to protect it. It is understood that the size of the battery compartment 203 can be flexibly set according to different needs to better fit the size of the battery 303.

[0085] In other embodiments, the middle frame 201 may not have a battery compartment 203.

[0086] In other embodiments, the location of the battery 303 is not limited to the location shown in FIG3. For example, the battery 303 may also be fixedly connected to the side of the middle frame 201 facing the rear cover 202. Specific details are not limited here.

[0087] Figure 4 is a partially exploded view of the display module 100 shown in Figure 2 in some embodiments.

[0088] As shown in Figure 4, the display module 100 includes a display screen 10 and a protective cover 20. Exemplarily, the display screen 10 includes a display surface 10a and a non-display surface 10b that are disposed opposite to each other. It is understood that the display surface 10a of the display screen 10 is the side of the display screen 10 that can be used to display images. The non-display surface 10b of the display screen 10 is the side of the display screen 10 that is not used to display images.

[0089] Referring to Figure 4 and in conjunction with Figure 2, the protective cover 20 is attached to the display surface 10a of the display screen 10. The protective cover 20 can be used to protect the display screen 10. For example, the protective cover 20 can be made of glass or polyimide, etc.

[0090] It is understood that, for ease of description, the display module 100 is defined in the following text as having a first direction Z, a second direction Y, and a third direction X. The first direction Z can be the thickness direction of the display module 100. The second direction Y can be the length direction of the display module 100. The third direction X can be the width direction of the display module 100. In some embodiments, the coordinate system of the display module 100 can be flexibly set according to specific actual needs.

[0091] The preceding text, with reference to the accompanying drawings, provided a detailed description of the general structure of the electronic device 1000 and the display module 100. It is understandable that high-performance electronic devices 1000 often generate a significant amount of heat; therefore, heat dissipation performance is a crucial factor for users. The following text, with reference to the accompanying drawings, illustrates a heat dissipation scheme for the electronic device 1000.

[0092] Figure 5 is a partial cross-sectional view of the electronic device 1000 shown in Figure 1 in some other embodiments. Figure 6 is a schematic diagram of the assembly of the display screen 10 and the heat spreader 600 shown in Figure 5 in some embodiments.

[0093] As shown in Figures 5 and 6, the display screen 10 includes a display stack 12, a first adhesive backing 13, and rolled pure copper 14 connected sequentially along the first direction Z. In other words, the rolled pure copper 14 is fixedly connected to the non-display surface 10b of the display stack 12 by the first adhesive backing 13. The rolled pure copper 14 is used to support the display stack 12 to ensure the robustness of the display screen 10.

[0094] In addition, the display layer 12 of the display screen 10 also includes a display area 121 and a bending area 122. The bending area 122 of the display layer 12 is bent. A portion of the bending area 122 of the display layer 12 is fixedly connected to the non-display surface 10b of the display area 121 of the display layer 12. Specifically, a portion of the bending area 122 of the display layer 12 is fixedly connected to the surface of the rolled pure copper 14 away from the first adhesive 13.

[0095] In addition, the electronic device 1000 also includes a second adhesive 500 and a heat spreader 600. The heat spreader 600 is fixedly connected to the side of the rolled pure copper 14 away from the first adhesive 13 by the second adhesive 500. It is understood that the heat spreader 600 is schematically shown in Figure 6 by dashed lines.

[0096] It is understandable that when the functional components 300 within the electronic device 1000 generate heat, the heat is conducted to the heat spreader 600. The heat spreader 600 can dissipate the heat, thereby solving the heat dissipation problem of the electronic device 1000. However, there are also some technical problems with the heat dissipation scheme of the electronic device 1000 shown in Figures 5 and 6. Specifically, as follows.

[0097] (1) Electronic device 1000 needs to purchase heat spreader 600 and display module 100 from different material companies, and then fix heat spreader 600 to display module 100. There are many material suppliers, resulting in high investment costs.

[0098] (2) To ensure that the rolled pure copper 14 can stably support the display stack 12 of the display screen 10, the thickness of the rolled pure copper 14 will be made as thick as possible. Thus, due to the stacking of the heat spreader 600, the second adhesive 500, and the rolled pure copper 14, the overall weight and thickness of the heat spreader 600, the second adhesive 500, and the display screen 10 will be relatively heavy. When the heat spreader 600, the second adhesive 500, and the display screen 10 are applied to the electronic device 1000, it is not conducive to the lightweight and thin design of the electronic device 1000.

[0099] (3) To avoid interference between the heat spreader 600 and the bending area 122, the heat spreader 600 will avoid the part of the bending area 122 that connects to the rolled pure copper 14. At this time, it is difficult for the heat spreader 600 to be fully covered with rolled pure copper 14, that is, it is difficult to make the area of ​​the heat spreader 600 large. Therefore, the heat dissipation capacity of the electronic device 1000 is poor.

[0100] To address the technical issues raised above, the following section will, in conjunction with relevant accompanying drawings, further describe a heat dissipation solution for the electronic device 1000. Details are as follows.

[0101] Figure 7 is a partially exploded view of the display screen 10 shown in Figure 4 in some embodiments.

[0102] As shown in Figure 7, the display screen 10 includes a heat dissipation layer 11 and a display stack 12. It is understood that the heat dissipation layer 11 can be used for heat dissipation. The display stack 12 can be used for display. The specific structures of the heat dissipation layer 11 and the display stack 12 are not specifically limited here. Furthermore, Figure 7 and the related figures below only schematically show some components included in the display screen 10; the actual shape, size, position, and structure of these components are not limited by Figure 7 and the figures below.

[0103] Figure 8 is a structural schematic diagram of the display stack 12 shown in Figure 7 from another angle. Exemplarily, Figure 8 may be a structural schematic diagram of the back side of the display stack 12 shown in Figure 7 in some embodiments.

[0104] Referring to Figure 8 and in conjunction with Figure 7, the display stack 12 includes a display area 121 and a bending area 122. The bending area 122 connects to the display area 121 and is bent. It is understood that the display area 121 can be used for display. The bending area 122 can be used to house driver chips and / or BTB (board to board) connectors, etc. The display area 121 includes a display surface 1211 and a non-display surface 1212 facing away from each other. The display surface 1211 of the display area 121 can serve as the display surface 10a of the display screen 10. Of course, in other embodiments, when the display screen 10 adopts other structures, the display surface 10a of the display screen 10 can also be formed by other components.

[0105] For example, the bending area 122 includes a first portion 1221 and a second portion 1222. The second portion 1222 is connected to the first portion 1221. The first portion 1221 may be bent. The second portion 1222 may be disposed opposite to the display area 121.

[0106] For example, the second portion 1222 of the bending region 122 can be used to set up devices such as a driver chip and / or a BTB connector.

[0107] Figure 9 is a structural schematic diagram of the heat spreader 11 shown in Figure 7 from another angle. Exemplarily, Figure 9 may be a structural schematic diagram of the back side of the heat spreader 11 shown in Figure 7 in some embodiments. Additionally, Figure 10 is a partially exploded schematic diagram of the heat spreader 11 shown in Figure 9 in some embodiments.

[0108] As shown in Figures 9 and 10, the heat spreader 11 includes a first cover plate 111, a second cover plate 112, a capillary structure 113, and a cooling medium 114. It is understood that Figures 9 and 10, and the related figures below, only schematically show some of the components included in the heat spreader 11; the actual shape, size, location, and construction of these components are not limited by Figures 9 and 10, and the figures below. Furthermore, Figure 10 only schematically shows the cooling medium 114 within a rectangular frame.

[0109] For example, the first cover plate 111 may include a first surface 1111 and a second surface 1112 disposed opposite to each other.

[0110] For example, the material of the first cover plate 111 includes pure copper, copper-PI-copper, copper-titanium copper, copper-steel copper, steel-aluminum, titanium-aluminum, titanium-steel, or stainless steel. PI stands for polyimide.

[0111] For example, the modulus of the first cover plate 111 is in the range of 90 GPa to 150 GPa, or the impedance of the first cover plate 111 is in the range of 0.017 Ω / m to 1.2 Ω / m. In this way, the material of the first cover plate 111 is a high-modulus or high-impedance material, thereby increasing the strength and deformation resistance of the first cover plate 111.

[0112] For example, the thickness H of the first cover plate 111 can be less than or equal to 0.2 mm. For instance, the thickness H of the first cover plate 111 can be 0.2 mm, 0.15 mm, 0.14 mm, 0.13 mm, 0.12 mm, or 0.1 mm, etc. In other embodiments, the thickness H of the first cover plate 111 may not be specifically limited.

[0113] For example, the material and thickness of the second cover plate 112 can be determined with reference to the material and thickness of the first cover plate 111. Specific details will not be elaborated here. For instance, the material of the second cover plate 112 may include pure copper, copper-PI-copper, copper-titanium copper, copper-steel copper, steel-aluminum, titanium-aluminum, titanium-steel, or stainless steel. For example, the modulus of the second cover plate 112 may be in the range of 90 GPa to 150 GPa, or the impedance of the second cover plate 112 may be in the range of 0.017 Ω / m to 1.2 Ω / m. This increases the strength and deformation resistance of the first cover plate 111.

[0114] For example, the capillary structure 113 can be a metal structural component with a porous structure.

[0115] For example, the capillary structure 113 is one or more of copper mesh, copper fiber, copper powder or copper foam.

[0116] For example, the cooling medium 114 includes water, methanol, or acetone.

[0117] Figure 11 is a partial cross-sectional view of the heat spreader 11 shown in Figure 7 along line BB in some embodiments.

[0118] Please refer to Figure 11, and in conjunction with Figures 9 and 10, the first cover plate 111 and the second cover plate 112 are fixedly connected and enclose the sealing cavity 115.

[0119] For example, a portion of the first cover plate 111 extends relative to the second cover plate 112, forming a first protrusion 1113. In other embodiments, the portion of the first cover plate 111 may not extend relative to the second cover plate 112, that is, the first cover plate 111 may not include the first protrusion 1113. In this case, the edge of the first cover plate 111 may be flush with the edge of the second cover plate 112.

[0120] For example, the second cover plate 112 can be fixedly connected to the first surface 1111 of the first cover plate 111.

[0121] For example, the edge of the second cover plate 112 can be fixedly connected to the first cover plate 111. The middle part of the second cover plate 112 can be spaced apart from the first cover plate 111 and form a sealing cavity 115.

[0122] In some embodiments, the edge of the second cover plate 112 can be fixedly connected to the first cover plate 111 by a welding process (e.g., brazing). This makes the connection between the second cover plate 112 and the first cover plate 111 more stable and secure. Furthermore, the sealing performance of the sealing cavity 115 is improved.

[0123] Referring to Figure 9 and in conjunction with Figure 10, exemplarily, a portion of the first cover plate 111 extends relative to the second cover plate 112, forming a second protrusion 1114. The second protrusion 1114 is provided with a clearance hole 1115. The clearance hole 1115 can be used to avoid some functional devices 300 (see Figure 2). For example, the clearance hole 1115 includes a first type of clearance hole 1116 and a second type of clearance hole 1117. The first type of clearance hole 1116 is used to avoid the optical path of the camera module 301 (see Figure 2), and the second type of clearance hole 1117 is used to avoid the optical path of the proximity light sensor 302 (see Figure 2).

[0124] In other embodiments, the first cover plate 111 may not include the second protrusion 1114 and the clearance hole 1115.

[0125] It is understandable that although the above description, in conjunction with the accompanying drawings, details a connection method between the first cover plate 111 and the second cover plate 112, this application does not specifically limit the connection method between the first cover plate 111 and the second cover plate 112.

[0126] Please refer to Figure 11 and, in conjunction with Figure 10, the capillary structure 113 is fixed within the sealing cavity 115.

[0127] For example, the capillary structure 113 may be disposed within the sealing cavity 115. The capillary structure 113 may be fixedly connected to the second cover plate 112.

[0128] For example, the capillary structure 113 can be fixedly connected to the second cover plate 112 by welding. In this way, the connection between the capillary structure 113 and the second cover plate 112 is more stable and firm.

[0129] In other embodiments, the capillary structure 113 may be fixedly connected to the first cover plate 111.

[0130] In other embodiments, a portion of the capillary structure 113 may be fixedly connected to the first cover plate 111, and a portion may be fixedly connected to the second cover plate 112.

[0131] Referring to Figure 11 and in conjunction with Figure 10, the cooling medium 114 is disposed within the sealed cavity 115. The capillary structure 113 can be immersed in the cooling medium 114.

[0132] Figure 12 is a structural schematic diagram of the display screen 10 shown in Figure 4 from another angle. Figure 13 is a partial cross-sectional view of the display module 100 shown in Figure 2 taken along the CC line in some embodiments.

[0133] As shown in Figures 12 and 13, the first cover plate 111 is fixedly connected to the non-display surface 1212 of the display area 121. At this time, the protective cover 20 is attached to the side of the display stack 12 away from the heat spreader 11. It can be understood that Figure 13 schematically distinguishes the display area 121 and the bending area 122 by dashed lines.

[0134] Exemplarily, the display screen 10 includes an adhesive layer 116. The second surface 1112 of the first cover plate 111 can be fixedly connected to the non-display surface 1212 of the display area 121 via the adhesive layer 116. Exemplarily, the adhesive layer 116 may be a solid state pre-formed electronics adhesive (SPEA).

[0135] In other embodiments, the first cover plate 111 may also be fixedly connected to the non-display surface 1212 of the display area 121 by other fixing methods, and this embodiment does not limit the specific method.

[0136] As shown in Figures 12 and 13, a portion of the bending area 122 bypasses the first cover plate 111 and is fixedly connected to the side of the first cover plate 111 away from the display area 121. Exemplarily, a portion of the bending area 122 bypasses the first cover plate 111 and is fixedly connected to the side of the first protrusion 1113 of the first cover plate 111 away from the display area 121.

[0137] For example, the first portion 1221 of the bending area 122 bypasses the first cover plate 111. The second portion 1222 of the bending area 122 is fixedly connected to the side of the first protrusion 1113 of the first cover plate 111 that is away from the display area 121.

[0138] It is understood that in this embodiment, the first cover plate 111 of the heat dissipation layer 11 is fixedly connected to the non-display surface 1212 of the display area 121 of the display stack 12, so that the heat dissipation layer 11 and the display stack 12 can be integrated into a whole, namely the display screen 10. Therefore, compared with the conventional display screen 10, the display screen 10 of this embodiment integrates the heat dissipation layer 11. In this way, the display screen 10 not only has a display function, but also incorporates a heat dissipation function. The display screen 10 of this embodiment has the effect of "one thing serving multiple purposes".

[0139] In the electronic device 1000 shown in Figures 5 and 6, the electronic device 1000 needs to purchase the heat spreader 600, display screen 10, and protective cover 20 from different material suppliers, and then fix the heat spreader 600 and protective cover 20 onto the display screen 10. The number of material suppliers is large, resulting in high investment costs. However, in this embodiment, as shown in Figures 12 and 13, since the display screen 10 integrates a heat spreader layer 11, the procurement of materials for the electronic device 1000 only requires the purchase of the display screen 10 and protective cover 20; it is not necessary to separately purchase the heat spreader 600. Therefore, this embodiment can reduce the number of material suppliers, thereby reducing investment costs.

[0140] In the electronic device 1000 shown in Figures 5 and 6, the rolled pure copper 14 is made as thick as possible to ensure that it can stably support the display stack 12 of the display screen 10. This results in a relatively heavy and thick overall mass due to the stacking of the heat spreader 600, the second adhesive 500, and the display screen 10. When the heat spreader 600, the second adhesive 500, and the display screen 10 are used in the electronic device 1000, it is detrimental to the lightweight and thin design of the electronic device 1000. However, in this embodiment, as shown in Figures 12 and 13, the first cover plate 111 of the heat spreader 11 is fixedly connected to the non-display surface 1212 of the display area 121 of the display stack 12, thereby directly utilizing the heat spreader 11 to support the display stack 12, improving the overall strength of the display stack 12 and preventing damage to the display stack 12. Obviously, the heat dissipation layer 11 in this embodiment can serve both as a heat dissipation layer and a support layer. The heat dissipation layer 11 in this embodiment has a "multi-purpose" effect. Furthermore, in this embodiment, since the heat dissipation layer 11 can directly support the display stack 12, the display screen 10 of this embodiment does not need to include the rolled pure copper 14 and the second adhesive 500 of the electronic device 1000 shown in Figures 5 and 6. That is, the display screen 10 of this embodiment can omit the rolled pure copper 14 and the second adhesive 500. In terms of mass, the display screen 10 of this embodiment can at least save the mass of the rolled pure copper 14 and the second adhesive 500, thus facilitating a lighter design for the display screen 10. In terms of thickness, the display screen 10 of this embodiment can at least save the thickness of the rolled pure copper 14 and the second adhesive 500, thus facilitating a thinner design for the display screen 10. When the display screen 10 is applied to the display module 100 and the electronic device 1000, it also facilitates a lighter and thinner design for both the display module 100 and the electronic device 1000.

[0141] Compared to the electronic device 1000 scheme shown in Figures 5 and 6, the display screen 10 of this embodiment can reduce its weight by more than 2.1g and its thickness by more than 0.05mm, which is very beneficial for the lightweight and thinner design of the display module 100 and the electronic device 1000.

[0142] It is understood that since the display screen 10 of this embodiment can omit the rolled pure copper 14 and the second backing adhesive 500, the mass and space saved by the display screen 10 can be used to increase the mass and space of the heat dissipation layer 11. For example, the space saved by the display screen 10 can be used to increase the volume of the sealing cavity 115 of the heat dissipation layer 11. The mass saved by the display screen 10 can be used to increase the mass of the cooling medium 114 of the heat dissipation layer 11. In this way, the heat dissipation capacity of the display screen 10 can be greatly improved.

[0143] In the electronic device 1000 shown in Figures 5 and 6, to avoid interference between the heat spreader 600 and the bending area 122, the heat spreader 600 avoids the portion of the bending area 122 where the rolled pure copper 14 is connected. At this time, it is difficult to cover the entire surface of the heat spreader 600 with rolled pure copper 14, meaning the area of ​​the heat spreader 600 is difficult to increase. Therefore, the heat dissipation capacity of the electronic device 1000 is poor. However, in this embodiment, as shown in Figures 12 and 13, since the heat spreader layer 11 is formed directly during the formation of the display screen 10, the heat spreader layer 11 in this embodiment can be formed on the non-display surface 1212 of the display area 121 before the step of fixing the bending area 122 to the non-display surface 1212 of the display area 121. Then, the bending area 122 is fixedly connected to the side of the first cover plate 111 away from the display area 121. Thus, during the formation of the heat dissipation layer 11 in this embodiment, it will no longer interfere with the portion of the bending area 122 that connects to the display area 121. The heat dissipation layer 11 in this embodiment can be laid over a large area on the non-display surface 1212 of the display area 121. Therefore, the area of ​​the heat dissipation layer 11 in this embodiment can be set to be sufficiently large. The heat dissipation capacity of the heat dissipation layer 11 in this embodiment is better.

[0144] For example, the area of ​​the heat dissipation layer 11 covering the non-display surface 1212 of the display area 121 is a first area. The area of ​​the non-display surface 1212 of the display area 121 is a second area. The ratio of the first area to the second area is between 50% and 100%. For example, the ratio of the first area to the second area can be 50%, 60%, 80%, 85%, 90%, or 100%. It is understood that the heat dissipation layer 11 of this embodiment can substantially cover the entire non-display surface 1212 of the display area 121. In this way, on the one hand, the area of ​​the heat dissipation layer 11 of this embodiment is large enough to greatly improve the heat dissipation effect; on the other hand, a heat dissipation material effect can be formed on the entire non-display surface 1212 of the display screen 10 of this embodiment.

[0145] It is understood that when the display module 100 of this embodiment is applied to the electronic device 1000 (see FIG. 3), since the heat dissipation layer 11 of this embodiment can be laid on the non-display surface 1212 of the display area 121 over a large area, the heat dissipation layer 11 can cover most of the functional devices 300 (see FIG. 3) within the electronic device 1000 (see FIG. 3). In this way, the heat generated by most of the functional devices 300 (see FIG. 3) can be conducted to the heat dissipation layer 11 with a shorter path and dissipated through the heat dissipation layer 11, thereby greatly improving the heat dissipation effect of the electronic device 1000 (see FIG. 3).

[0146] It is understood that this embodiment integrates the heat dissipation layer 11 into the display screen 10 to form a new stacked structure. This allows the heat dissipation layer 11 to support the display stack 12, ensuring the reliability of the display screen 10. It also achieves weight and thinning of the display screen 10 and significantly improves heat dissipation by increasing the heat dissipation area. This meets the user's iterative needs for the electronic device 1000 and helps to promote product sales.

[0147] For example, this embodiment achieves the thinning and weight reduction of the display module 100 and the electronic device 1000 by changing the bottom stacked structure of the display module 100 in the electronic device 1000 shown in FIG5 and FIG6, that is, changing the original stacked structure of rolled pure copper 14 and second backing adhesive 500 to a new display screen 10 containing composite lightweight materials such as PET, copper or copper-PI-copper or high-resistance copper or copper-steel-copper, and containing capillary structures.

[0148] Figure 14 is a partial cross-sectional view of the electronic device 1000 shown in Figure 1 cut along point AA in some other embodiments.

[0149] As shown in Figure 14, exemplarily, the functional device 300 includes a first device 305. The first device 305 is disposed opposite to the heat dissipation layer 11 of the display screen 10. In other words, in the first direction Z, the heat dissipation layer 11 can cover the first device 305. In this way, the heat generated by the first device 305 can be conducted to the heat dissipation layer 11 with a shorter path and dissipated through the heat dissipation layer 11, thereby greatly improving the heat dissipation effect of the electronic device 1000.

[0150] For example, the second cover plate 112 of the heat spreader 11 is disposed opposite to the first device 305. In this way, the heat generated by the first device 305 can be conducted to the second cover plate 112 of the heat spreader 11 with a shorter path, and then conducted to the cooling medium 114 and the first cover plate 111 through the second cover plate 112.

[0151] For example, the first device 305 may be a battery or a speaker, etc.

[0152] Figure 15 is a partial cross-sectional view of the display module 100 shown in Figure 2 along the CC line in some other embodiments.

[0153] As shown in Figure 15, a portion of the bending area 122 bypasses the first cover plate 111 and the second cover plate 112, and is fixedly connected to the side of the second cover plate 112 away from the display area 121.

[0154] For example, the first portion 1221 of the bending area 122 bypasses the first cover plate 111 and the second cover plate 112. The second portion 1222 of the bending area 122 is fixedly connected to the side of the second cover plate 112 away from the display area 121.

[0155] It is understood that, during the formation process of the heat dissipation layer 11 in this embodiment, there will be no interference with the portion of the bending area 122 that connects to the display area 121. The heat dissipation layer 11 in this embodiment can be laid over a large area on the non-display surface 1212 of the display area 121. Therefore, the area of ​​the heat dissipation layer 11 in this embodiment can be set to be sufficiently large. The heat dissipation capacity of the heat dissipation layer 11 in this embodiment is better.

[0156] Understandably, by fixing the second portion 1222 of the bending area 122 to the side of the second cover plate 112 away from the display area 121, a portion of the second cover plate 112 can be located between the bending area 122 and the display area 121. This results in a larger volume of the sealed cavity 115 enclosed by the first cover plate 111 and the second cover plate 112. The mass of the cooling medium 114 can also be increased. Therefore, the heat dissipation capacity of the display screen 10 can be significantly improved.

[0157] The preceding text, with reference to the accompanying drawings, described one method of connecting the heat spreader 11 and the display area 121. The following text, with reference to the accompanying drawings, describes another method of connecting the heat spreader 11 and the display area 121.

[0158] Figure 16 is a partial cross-sectional view of the display module 100 shown in Figure 2 along the CC line in some embodiments.

[0159] As shown in Figure 16, the display screen 10 includes a first adhesive layer 1171, a PET (polyethylene terephthalate) layer 1172, and a second adhesive layer 1173. The PET layer 1172 is connected between the first adhesive layer 1171 and the second adhesive layer 1173.

[0160] For example, both the first adhesive layer 1171 and the second adhesive layer 1173 can be SPEA adhesive. In other embodiments, the first adhesive layer 1171 and the second adhesive layer 1173 may also adopt other structures. Specifically, this embodiment is not limited.

[0161] As shown in Figure 16, the first adhesive layer 1171 is fixedly connected to the display area 121, and the second adhesive layer 1173 is fixedly connected to the first cover plate 111.

[0162] For example, the first adhesive layer 1171 is fixedly connected to the non-display surface 1212 of the display area 121, and the second adhesive layer 1173 is fixedly connected to the second surface 1112 of the first cover plate 111.

[0163] It is understood that in this embodiment, by providing a PET layer 1172 between the first adhesive layer 1171 and the second adhesive layer 1173, and then using the first adhesive layer 1171 to be fixedly connected to the non-display surface 1212 of the display area 121, and the second adhesive layer 1173 to be fixedly connected to the second surface 1112 of the first cover plate 111, the overall thickness of the first adhesive layer 1171, the PET layer 1172 and the second adhesive layer 1173 in this embodiment can be made smaller than the thickness of the adhesive layer 116 in FIG. 13.

[0164] Figure 17 is a partial cross-sectional view of the display module 100 shown in Figure 2 along the CC line in some embodiments.

[0165] As shown in Figure 17, the display stack 12 includes a back film layer 124, a panel layer 125 and an optical film layer 126 stacked sequentially along the first direction Z. The back film layer 124, a part of the panel layer 125 and the optical film layer 126 constitute the display area 121, and another part of the panel layer 125 constitutes the bending area 122.

[0166] As shown in Figure 17, the first cover plate 111 is fixedly connected to the side of the back film layer 124 of the display area 121 away from the panel layer 125 of the display area 121. Exemplarily, the second surface 1112 of the first cover plate 111 is fixedly connected to the side of the back film layer 124 of the display area 121 away from the panel layer 125 of the display area 121 by an adhesive layer 116.

[0167] In this embodiment, since the heat dissipation layer 11 can directly support the display stack 12, the display screen 10 of this embodiment does not need to include the rolled pure copper 14 and the second backing adhesive 500 of the electronic device 1000 shown in Figures 5 and 6. That is, the display screen 10 of this embodiment can omit the rolled pure copper 14 and the second backing adhesive 500. In terms of mass, the display screen 10 of this embodiment can at least eliminate the mass of the rolled pure copper 14 and the second backing adhesive 500, thereby facilitating a lighter design for the display screen 10. In terms of thickness, the display screen 10 of this embodiment can at least eliminate the thickness of the rolled pure copper 14 and the second backing adhesive 500, thereby facilitating a thinner design for the display screen 10. When the display screen 10 is applied to the display module 100 and the electronic device 1000, it also facilitates a lighter and thinner design for both the display module 100 and the electronic device 1000.

[0168] Figure 18 is a structural schematic diagram of the heat spreader 11 shown in Figure 7 in some other embodiments. Figure 19 is a partial cross-sectional view of the display module 100 shown in Figure 2 taken along line DD in some embodiments.

[0169] As shown in Figures 18 and 19, a portion of the first cover plate 111 is recessed toward the second cover plate 112 to form a recess 119. The recess 119 is fixedly connected to the capillary structure 113. Exemplarily, a portion of the first surface 1111 of the first cover plate 111 is fixedly connected to the capillary structure 113.

[0170] Understandably, in the first direction Z, the second cover plate 112 can support the first cover plate 111 to some extent through the capillary structure 113. The overall strength of the first cover plate 111 and the second cover plate 112 is better. In this way, the heat dissipation layer 11 can better support the display stack 12.

[0171] It is understood that the size, position, and number of recesses 119 are not limited to those shown in Figure 18, and this application does not impose any specific limitations. In addition, the size of the recesses 119 can be set to ensure that the first cover plate 111 has better flatness, thereby better supporting the display stack 12.

[0172] As shown in Figures 18 and 19, by way of example, a portion of the adhesive layer 116 may be located in the recess 119 in the first cover plate 111. In this case, the connection area between the adhesive layer 116 and the first cover plate 111 is larger, which is beneficial to improving the connection strength between the first cover plate 111 and the adhesive layer 116.

[0173] For example, the recess 119 can also pass through the capillary structure 113 and be fixedly connected to the second cover plate 112. In this way, the second cover plate 112 can directly support the first cover plate 111 in the first direction Z. The overall strength of the first cover plate 111 and the second cover plate 112 is better. The heat dissipation layer 11 can better support the display stack 12.

[0174] Figure 20 is a partial cross-sectional view of the display module 100 shown in Figure 2 along the DD line in some other embodiments.

[0175] As shown in Figure 20, a portion of the second cover plate 112 protrudes towards the first cover plate 111 and passes through the capillary structure 113 to be fixedly connected to the first cover plate 111. Thus, in the first direction Z, the second cover plate 112 can support the first cover plate 111. The overall strength of the first cover plate 111 and the second cover plate 112 is improved. The heat dissipation layer 11 can better support the display stack 12.

[0176] For example, a portion of the second cover plate 112 protrudes toward the first cover plate 111 and passes through the capillary structure 113 to be fixedly connected to the first surface 1111 of the first cover plate 111. In this way, the second cover plate 112 can directly support the first cover plate 111 in the first direction Z.

[0177] In other embodiments, when the capillary structure 113 is fixedly connected to the first cover plate 111, a portion of the second cover plate 112 protrudes toward the first cover plate 111 and passes through the capillary structure 113 to be fixedly connected to the first cover plate 111. Alternatively, when the capillary structure 113 is fixedly connected to the first cover plate 111, a portion of the second cover plate 112 protrudes toward the first cover plate 111 and is fixedly connected to the capillary structure 113.

[0178] Figure 21 is a partial cross-sectional view of the display module 100 shown in Figure 2 along the DD line in some embodiments.

[0179] As shown in Figure 21, the heat spreader 11 also includes a support column 118, which is located inside the sealing cavity 115. One end of the support column 118 is fixedly connected to the first cover plate 111, and the other end is fixedly connected to the second cover plate 112. For example, one end of the support column 118 is fixedly connected to the first surface 1111 of the first cover plate 111.

[0180] For example, the support column 118 may pass through the capillary structure 113 and the cooling medium 114.

[0181] Understandably, the support column 118 can be used to maintain the shape of the heat spreader 11. The support column 118 can also be used to resist the deformation of the heat spreader 11 caused by the pressure difference between the inside and outside atmospheres and other external forces, so as to prevent the heat spreader 11 from failing due to the flattening of the sealing cavity 115 and the capillary structure 113.

[0182] Understandably, in the first direction Z, the second cover plate 112 can support the first cover plate 111 via the support column 118. The overall strength of the first cover plate 111 and the second cover plate 112 is better. The heat dissipation layer 11 can better support the display stack 12.

[0183] It is understood that, without conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0184] It is understood that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application. The above are merely some embodiments and implementation methods of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display screen (10) characterized by, The display screen (10) comprises a heat equalizing layer (11) and a display stack (12), the display stack (12) comprises a display area (121) and a bending area (122), and the bending area (122) is connected to the display area (121); The heat equalizing layer (11) comprises a first cover plate (111), a second cover plate (112), a capillary structure (113) and a cooling medium (114), the first cover plate (111) is fixedly connected with the second cover plate (112) and encloses a sealed cavity (115), the capillary structure (113) is fixed in the sealed cavity (115), and the cooling medium (114) is arranged in the sealed cavity (115), wherein the first cover plate (111) is fixedly connected to a non-display surface (1212) of the display area (121); Part of the bending area (122) passes around the first cover plate (111) and is fixedly connected to a side of the first cover plate (111) away from the display area (121), or part of the bending area (122) passes around the first cover plate (111) and the second cover plate (112) and is fixedly connected to a side of the second cover plate (112) away from the display area (121).

2. The display screen (10) according to claim 1, characterized in that Part of the first cover plate (111) protrudes relative to the second cover plate (112) to form a first protruding portion (1113); Part of the bending area (122) passes around the first cover plate (111) and is fixedly connected to a side of the first protruding portion (1113) away from the display area (121).

3. A display screen (10) according to claim 1 or 2, characterized in that The display screen (10) comprises a glue layer (116), and the first cover plate (111) is fixedly connected to the non-display surface (1212) of the display area (121) through the glue layer (116).

4. A display screen (10) according to claim 1 or 2, characterized in that The display screen (10) comprises a first glue layer (1171), a PET layer (1172) and a second glue layer (1173), and the PET layer (1172) is connected between the first glue layer (1171) and the second glue layer (1173); The first glue layer (1171) is fixedly connected to the non-display surface (1212) of the display area (121), and the second glue layer (1173) is fixedly connected to the first cover plate (111).

5. The display screen (10) according to any one of claims 1 to 4, characterized in that The display stack (12) comprises a back film layer (124), a panel layer (125) and an optical film layer (126) which are sequentially stacked, part of the back film layer (124), the panel layer (125) and the optical film layer (126) constitute the display area (121), and the other part of the panel layer (125) constitutes the bending area (122); The first cover plate (111) is fixedly connected to a side of the back film layer (124) of the display area (121) away from the panel layer (125) of the display area (121).

6. The display screen (10) according to any one of claims 1 to 5, characterized in that The material of the first cover plate (111) includes pure copper, copper-PI-copper, copper-titanium-copper, copper-steel-copper, steel-aluminum, titanium-aluminum, titanium-steel or stainless steel; and / or, the material of the second cover plate (112) includes pure copper, copper-PI-copper, copper-titanium-copper, copper-steel-copper, steel-aluminum, titanium-aluminum, titanium-steel or stainless steel.

7. The display screen (10) according to any one of claims 1 to 6, characterized in that The modulus of the first cover plate (111) is in the range of 90GPa to 150GPa, or the impedance of the first cover plate (111) is in the range of 0.017Ω / m to 1.2Ω / m; And / or, the modulus of the second cover plate (112) is in the range of 90GPa to 150GPa, or the impedance of the second cover plate (112) is in the range of 0.017Ω / m to 1.2Ω / m.

8. The display screen (10) according to any one of claims 1 to 7, characterized in that The capillary structure (113) is fixedly connected with the first cover plate (111), or the capillary structure (113) is fixedly connected with the second cover plate (112), or part of the capillary structure (113) is fixedly connected with the first cover plate (111) and part of the capillary structure (113) is fixedly connected with the second cover plate (112).

9. The display screen (10) according to any one of claims 1 to 8, characterized in that Part of the first cover plate (111) protrudes relative to the second cover plate (112) to form a second protruding portion (1114), and the second protruding portion (1114) is provided with a relief hole (1115).

10. A display screen (10) according to claim 9, characterised in that The relief hole (1115) includes a first type of relief hole (1116) and a second type of relief hole (1117); The first type of relief hole (1116) is used to avoid the light path of the camera module (301), and the second type of relief hole (1117) is used to avoid the light path of the proximity light sensor (302).

11. The display screen (10) according to any one of claims 1 to 10, characterized in that Part of the first cover plate (111) is recessed in the direction of the second cover plate (112) and is fixedly connected with the capillary structure (113); Or, part of the second cover plate (112) protrudes in the direction of the first cover plate (111) and passes through the capillary structure (113) and is fixedly connected with the first cover plate (111).

12. The display screen (10) according to any one of claims 1 to 11, characterized in that The uniform heating layer (11) further includes a support column (118), the support column (118) is located in the sealed cavity (115), one end of the support column (118) is fixedly connected with the first cover plate (111), and the other end of the support column (118) is fixedly connected with the second cover plate (112).

13. The display screen (10) according to any one of claims 1 to 12, characterized in that The capillary structure (113) is one or more of copper mesh, copper fiber, copper powder or foamed copper.

14. The display screen (10) according to any one of claims 1 to 13, characterized in that The cooling medium (114) includes water, methanol or acetone.

15. The display screen (10) according to any one of claims 1 to 14, characterized in that The area of the non-display surface (1212) of the display area (121) covered by the first cover plate (111) is a first area, the area of the non-display surface (1212) of the display area (121) is a second area, and the ratio of the first area to the second area is 50% to 100%.

16. A display module (100) characterized by The display screen (10) as claimed in any one of claims 1 to 15, and a protective cover (20) attached to a side of the display stack (12) away from the uniform heating layer (11).

17. An electronic device (1000), characterized by, The display module (100) as claimed in claim 16 is installed in the shell (200).

18. The electronic device (1000) according to claim 17, characterized by, The display module (100) and the shell (200) enclose a containing space (400) of the electronic device (1000). The electronic device (1000) further comprises a first device (305) located in the containing space (400), and the first device (305) is arranged opposite to the uniform heating layer (11) of the display screen (10).

Images