MEMS module

Abstract

A MEMS module according to an embodiment of the present invention comprises: a substrate; a first MEMS structure disposed on the substrate; a second MEMS structure disposed on the substrate and spaced apart from the first MEMS structure; and a partition structure disposed between the first MEMS structure and the second MEMS structure.

Description

MEMS module

[0001] The present invention relates to a MEMS module.

[0002] Typically, audio devices use electrodes to vibrate a diaphragm to generate sound. Recent technological advancements have led to significant advancements in the audio device field. These devices are increasingly used in diverse applications, including portable terminals and hearing aids. As the devices they are used in become slimmer, the devices themselves are also becoming smaller.

[0003] Additionally, microphones and speakers utilizing MEMS (Micro Electro Mechanical Systems), a semiconductor technology, have recently been developed and used. MEMS is a technology that enables the manufacturing of tiny mechanical components on the surface of silicon wafers.

[0004] MEMS microphones and MEMS speakers are used in environments such as wireless earphones (TWS, True Wireless Stereo), smartphones, etc., and as the functions of the devices diversify, technology to configure the MEMS microphone and MEMS speaker into a single module is required.

[0005] The technical problem to be solved by the present invention is to provide a MEMS module in which a MEMS microphone and a MEMS microphone are integrally configured.

[0006] In order to solve the above technical problem, a MEMS module according to one embodiment of the present invention includes: a substrate; a first MEMS structure disposed on the substrate; a second MEMS structure disposed on the substrate and spaced apart from the first MEMS structure; and a partition structure disposed between the first MEMS structure and the second MEMS structure.

[0007] In addition, the substrate may include a cover that covers the upper portion of the substrate to form an internal space, the internal space including a first internal space and a second internal space separated by the partition structure, the first MEMS structure may be arranged in the first internal space, and the second MEMS structure may be arranged in the second internal space.

[0008] Additionally, the bulkhead structure may include a side wall disposed between the first internal space and the second internal space.

[0009] Additionally, the cover may include a first hole formed in an area corresponding to the first internal space.

[0010] Additionally, the first MEMS structure may be a speaker, and the second MEMS structure may be a microphone.

[0011] Additionally, the substrate may include a second hole formed in an area corresponding to the first MEMS structure; and a third hole formed in an area corresponding to the second MEMS structure.

[0012] In addition, the device includes a first cover covering the upper portion of the substrate to form a third internal space; and a second cover covering a portion of an area of ​​the upper portion of the substrate within the third internal space to form a fourth internal space, wherein the partition structure is a side wall of the third cover disposed between the first MEMS structure and the second MEMS structure, and the first MEMS structure may be disposed within the third internal space, but outside the fourth internal space, and the second MEMS structure may be disposed within the fourth internal space.

[0013] Additionally, the first cover may include a fourth hole formed in an area corresponding to the first MEMS structure.

[0014] In addition, the third cover covering the first area of ​​the upper portion of the substrate corresponding to the first MEMS structure to form a fifth internal space; and the fourth cover covering the second area of ​​the upper portion of the substrate corresponding to the second MEMS structure to form a sixth internal space, wherein the partition structure is a side wall of the sixth cover disposed between the first MEMS structure and the second MEMS structure, and the first MEMS structure may be disposed in the fifth internal space, and the second MEMS structure may be disposed in the sixth internal space.

[0015] Additionally, the fifth cover may include a fifth hole formed in an area corresponding to the first MEMS structure.

[0016] In addition, it includes a signal processing element that processes a signal of the second MEMS structure, and the signal processing element is arranged in the same space as the second MEMS structure and can be arranged separately from the first MEMS structure.

[0017] In addition, it includes a control element that controls the first MEMS structure, and the control element is arranged in the same space as the second MEMS structure and can be arranged separately from the first MEMS structure.

[0018] In addition, the integrated device includes a control device that controls the first MEMS structure and a signal processing device that processes a signal of the second MEMS structure, and the integrated device is arranged in the same space as the second MEMS structure and can be arranged separately from the first MEMS structure.

[0019] In addition, it includes a control element that controls the first MEMS structure, and the control element can be placed on the lower part of the substrate.

[0020] In addition, it includes a control element that controls the first MEMS structure, and the control element is arranged in the same space as the first MEMS structure and can be arranged separately from the second MEMS structure.

[0021] According to embodiments of the present invention, it is possible to prevent a decrease in the directivity and sensitivity of the MEMS microphone by configuring the MEMS microphone and the MEMS speaker as an integral unit.

[0022] FIG. 1 illustrates a MEMS module according to one embodiment of the present invention.

[0023] Figures 2 to 4 illustrate implementation examples of a MEMS module according to an embodiment of the present invention.

[0024] FIG. 5 is a drawing for explaining a hole formed in a substrate of a MEMS module according to an embodiment of the present invention.

[0025] Figures 6 to 11 illustrate implementation examples of a MEMS module according to an embodiment of the present invention.

[0026] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0027] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0028] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0029] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0030] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0031] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0032] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0033] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0034] Variations according to the present embodiment may include some components of each embodiment and some components of other embodiments. That is, a variation may include one embodiment among various embodiments, but may omit some components and include some components of the corresponding other embodiment. Or, the opposite may be true. The features, structures, effects, etc. described in the embodiments are included in at least one embodiment and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified in other embodiments by a person having ordinary skill in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be construed as being included within the scope of the embodiments.

[0035]

[0036] FIG. 1 illustrates a MEMS module according to an embodiment of the present invention. FIGS. 2 to 4 illustrate implementation examples of a MEMS module according to an embodiment of the present invention. FIG. 5 is a drawing for explaining a hole formed in a substrate of a MEMS module according to an embodiment of the present invention. FIGS. 6 to 11 illustrate implementation examples of a MEMS module according to an embodiment of the present invention.

[0037] A MEMS module (100) according to an embodiment of the present invention is composed of a substrate (110), a first MEMS structure (120), a second MEMS structure (130), and a partition wall structure (140), and may include a cover (150), a signal processing element (180), a control element (190), or an integrated element (181).

[0038] The substrate (110) has a plate shape. The substrate (110) may be a printed circuit board (PCB), and may include a flexible printed circuit board (FPCB) or a chip-on-film (COF) substrate. A chip-on-film (COF) substrate is a substrate formed by forming a circuit or mounting elements such as chips on a base film, and has a film shape, so it is a substrate that is considerably thinner than other substrates. By using a COF substrate as the substrate of a MEMS module, the thickness can be considerably reduced. The substrate (110) is a COF substrate, and may be a two-metal COF substrate. A two-metal COF is a substrate formed by forming a circuit or mounting elements on both sides of a base film. By including a via hole in the base film, circuits or elements formed on both sides can be connected. Here, the via hole may be a micro via hole and may be configured with a size of 25 um or less. Compared to single-sided COF, it can increase integration, offer greater freedom in packaging, and enable fine-pitch configurations by placing circuits or components on both sides. While fine-pitch configurations are difficult to achieve using only rigid substrates, COF substrates enable fine-pitch configurations, reducing the size of MEMS module packages by more than 50%.

[0039] A flexible printed circuit board (FPCB) is a flexible circuit board. It is also flexible and thinner than standard printed circuit boards. Therefore, using a flexible printed circuit board as the substrate for a MEMS microphone can significantly reduce its thickness. Other types of flexible substrates may also be included.

[0040] When including a COF substrate or a flexible printed circuit board (FPCB), a rigid substrate laminated on the COF substrate or the flexible printed circuit board (FPCB) may be further included. The rigid substrate may be a metal plate, SUS, or a reinforcing plate. SUS is a high-strength steel grade that mixes chromium with iron to enhance corrosion resistance. In addition, various reinforcing plates made of metal materials may be used. In addition, other types of rigid substrates that can be combined with the housing to maintain the shield may be included.

[0041] Printed circuit boards can be formed of FR4 (Flame Retardant 4) or RCC (Resin Coating) materials, and may include various other types of substrates.

[0042] A cover (150) forming an internal space may be placed on the upper portion of the substrate (110). The cover (150) may be placed on the upper portion of the MEMS module and may have a lid shape covering the substrate (110). The cover (150) may be a can type made of a metal material, and may be formed of various materials such as plastic. The cover (150) may be combined with the substrate (110). At this time, the cover (150) and the substrate (110) may be joined by welding. The area where the cover (150) and the substrate (110) are joined may be joined by micro-welding. By joining the cover (150) and the substrate (110) by micro-welding, the process of applying and curing can solder or epoxy is unnecessary, and the can solder line or epoxy application area is also unnecessary, so the size can be reduced by the corresponding area.

[0043] A first MEMS structure (120) and a second MEMS structure (130) may be arranged on a substrate (110). The first MEMS structure (120) and the second MEMS structure (130) may each include one or more first MEMS structures (120) and second MEMS structures (130). One of the first MEMS structure (120) and the second MEMS structure (130) may be a microphone, and the other may be a speaker.

[0044] The first MEMS structure (120) may be a MEMS speaker, and the second MEMS structure (130) may be a MEMS microphone. Here, the first MEMS structure (120) may be an ultrasonic MEMS speaker. A VCM (Voice coil motor) type speaker cannot be integrated with a microphone because mechanical vibration causes crosstalk that affects the microphone. An ultrasonic MEMS speaker can be integrated with a MEMS microphone.

[0045] A MEMS microphone may include a body, a back plate, and a diaphragm. The MEMS structure may sense an acoustic signal by measuring the capacitance at the back plate when the diaphragm vibrates due to sound pressure from an external sound source. A hole is formed to be connected to the outside, and when the diaphragm vibrates due to sound pressure from an external sound source through the hole, the capacitance at the back plate may be measured to sense an acoustic signal. The back plate may be positioned above the diaphragm, or the diaphragm may be positioned above the back plate.

[0046] A MEMS speaker requires sufficient air to achieve full Sound Pressure Level (SPL) at low frequencies, and for this purpose, two or more holes are required to utilize the air flowing in through the upper and lower holes. In this case, if a MEMS microphone is formed in the same space as the MEMS speaker and two or more holes are formed in the space, the MEMS microphone may have directionality due to the two or more holes, which may cause a problem of reduced sensitivity. The MEMS microphone must have one hole formed so that it can have omni-directional characteristics. That is, in order for the MEMS speaker to have two or more holes and the MEMS microphone to have one hole, the MEMS module according to an embodiment of the present invention includes a partition structure (140) that physically separates the MEMS speaker and the MEMS microphone from each other.

[0047] A partition wall structure (140) is arranged between the first MEMS structure (120) and the second MEMS structure (130). The partition wall structure (140) physically separates the space where the first MEMS structure (120) is arranged and the space where the second MEMS structure (130) is arranged, thereby preventing air flows within each space from interfering with each other. The partition wall structure (140) may be formed in various shapes depending on the shape of the cover (150).

[0048] The cover (150) can cover the upper part of the substrate (110) to form an internal space, and the internal space formed by the cover (150) can include a first internal space (161) and a second internal space (162) separated by a partition wall structure (140). At this time, the first MEMS structure (120) can be placed in the first internal space (161), and the second MEMS structure (130) can be placed in the second internal space (162). As shown in Fig. 2, one cover (150) covers the entire substrate (110) to form an internal space, and the partition wall structure (140) can be formed as a side wall placed between the first internal space (161) and the second internal space (162). The partition wall structure (140) can extend from the cover (150) and be in contact with the substrate (110). It can be formed along the boundary between the first internal space (161) and the second internal space (162) to physically separate the first internal space (161) and the second internal space (162). Depending on the boundary between the first internal space (161) and the second internal space (162), the partition wall structure (140) can be formed in various shapes, such as a shape crossing the outer side wall of the cover (150) or a shape surrounding the first MEMS structure (120) or the second MEMS structure (130). The partition wall structure (140) can be formed in various shapes depending on the arrangement of the first MEMS structure (120) and the second MEMS structure (130). Here, the partition wall structure (140) can be formed integrally with the cover (150).

[0049] The cover (150) may include a first hole (171) formed in an area corresponding to the first internal space (161). The substrate (110) may include a second hole (172) formed in an area corresponding to the first MEMS structure (120) and a third hole (173) formed in an area corresponding to the second MEMS structure (130). The first hole (171) may be formed in an area corresponding to the first MEMS structure (120), and the first hole (171) and the second hole (172) may correspond in the vertical direction. The first MEMS structure (120) may have the first hole (171) and the second hole (172) positioned at the upper and lower portions, respectively, and the second MEMS structure (130) may have the third hole (173) positioned only at the lower portion. That is, the first MEMS structure (120) and the second MEMS structure (130) may be separated from each other, and two holes may be formed in the first internal space (161) where the first MEMS structure (120), which is a MEMS speaker, is arranged, and one hole may be formed in the second internal space (162) where the second MEMS structure (130), which is a MEMS microphone, is arranged. The necessary holes are formed according to the role of each MEMS structure, so that the MEMS speaker and the MEMS microphone can be formed as one body while securing their respective performances.

[0050] It can be formed according to the shape of each corresponding MEMS structure formed on the substrate (110) or cover (150). For example, the cross-sectional area of ​​the hole can be circular or rectangular. It can also be formed in various other shapes. Here, the hole can be an acoustic hole. As shown in Fig. 5, the hole formed on the substrate (110) can be formed in various shapes. The sizes of the second hole (172) and the third hole (173) can be the same or different, and can be formed in various shapes according to the shape of the MEMS structure. The second hole (172) and the third hole (173) can be formed in different sizes, such as 510 and 520, and can be arranged so as to secure a distance from each other according to the shape of the substrate (110). In addition, as in 530 and 540, the second hole (172) may be formed in a rectangular shape rather than a circular shape, and the longitudinal direction may be formed differently depending on the arrangement of the first MEMS structure (120). The first hole (171) may be formed in the cover (150) to correspond to the second hole (172).

[0051] A MEMS speaker requires a control element, which is a driver that drives a MEMS structure, to generate sound, and a MEMS microphone requires a signal processing element that can process a signal according to the vibration of the MEMS structure to sense sound. The control element (190) and the signal processing element (180) may each be individually placed on a substrate (110), or may be placed on the substrate (110) as a single integrated element (181).

[0052] The control element (190) or the signal processing element (180) can be connected to the substrate (110) and supplied with power. The control element (190) can receive power through the substrate (110) and drive the first MEMS structure (120), which is a MEMS speaker. The signal processing element (180) can receive power through the substrate (110). The signal processing element (120) is driven by the received power and can supply a bias voltage to the second MEMS structure (130), which is a MEMS microphone. The signal processing element (180) can be connected to the substrate (110) by wire bonding, or can be bonded to the substrate (110) by forming a flip-chip BGA in a flip-chip manner, or can be electrically connected to the wire pad of the substrate (110) in a BGA manner.

[0053] The signal processing element (180) supplies a bias voltage to the second MEMS structure (130), and a signal sensed by the second MEMS structure (130) can be transmitted to the signal processing element (180) according to changes in the bias voltage and capacitance. The second MEMS structure (130) and the signal processing element (180) can be electrically connected. At this time, the second MEMS structure (130) and the signal processing element (180) are connected by a wire through wire bonding, and the signal sensed by the second MEMS structure (130) can be transmitted to the signal processing element (180) through the wire.

[0054] The signal processing element (180) can process an electrical signal sensed and transmitted from the second MEMS structure (130). The signal processing element (180) can amplify the signal sensed from the second MEMS structure (130). Here, the signal processing element (180) may include an application-specific integrated circuit (ASIC), but is not limited thereto. The signal processing element (180) may be formed in a chip form. The signal processing element (180) may include an ASIC and an encapsulant that coats the ASIC.

[0055] The signal processing element (180) can be arranged in the same space as the second MEMS structure (130). That is, it can be arranged together with the second MEMS structure (130) in the second internal space (162). The signal processing element (180) can be arranged together with the second MEMS structure (130) in the second internal space (162) to receive a signal from the second MEMS structure (130). Since signal transmission between the second MEMS structure (130) and the signal processing element (180) takes place in the internal space surrounded by the cover (150) and the partition wall structure (140), noise can be reduced.

[0056] When the signal processing element (180) supplies a bias voltage to the second MEMS structure (130), power can be supplied from an external power source such as a battery through a power input terminal, and a bias voltage can be supplied to the second MEMS structure (130) through a MEMS bias charge pump using a stable power source through a regulator.

[0057] The control element (190) drives the first MEMS structure (120), and may be disposed within the same space as the second MEMS structure (130). It may be disposed together with the second MEMS structure (130) in the second internal space (162). The control element (190) may be electrically connected to the first MEMS structure (120) through the substrate (110). Since two holes are formed at the upper and lower portions of the first internal space (161) where the first MEMS structure (120) is disposed, it is greatly affected by external influences. In order to reduce noise caused by such influences, the control element (190) may be disposed in the second internal space (162) rather than the first internal space (161). That is, as shown in FIG. 2, a first MEMS structure (120) may be placed in the first internal space (161), and a second MEMS structure (130), a signal processing element (180), and a control element (190) may be placed in the second internal space (162).

[0058] The control element (190) may be placed outside, rather than inside, the cover (150). That is, as shown in FIG. 3, the control element (190) may be placed on the lower portion of the substrate (110). Alternatively, the control element (190) may be placed on a set substrate on which the MEMS module is placed. That is, a first MEMS structure (120) may be placed in the first internal space (161), a second MEMS structure (130) and a signal processing element (180) may be placed in the second internal space (162), and the control element (190) may be placed on the lower portion of the substrate (110).

[0059] The control element (190) and the signal processing element (180) may be integrated and arranged as a single integrated element (181). Here, the integrated element may be an ASIC. As shown in Fig. 4, a first MEMS structure (120) may be arranged in a first internal space (161), and a second MEMS structure (130) and the integrated element (181) may be arranged in a second internal space (162).

[0060] The cover may include a first cover (151) and a second cover (152). The cover may be formed as a dual structure including two covers. The first cover (151) may cover the upper portion of the substrate (110) to form a third internal space (161-1), and the second cover (152) may cover a portion of an area of ​​the upper portion of the substrate (110) within the third internal space (161-1) to form a fourth internal space (162-1). That is, the second cover (152) may be formed as a structure in which the first cover (151) double-covers it. In this case, the partition wall structure (141) may be a side wall of the second cover (152) arranged between the first MEMS structure (120) and the second MEMS structure (130). The first MEMS structure (120) may be placed inside the third internal space (161-1), but outside the fourth internal space (162-1), and the second MEMS structure (130) may be placed in the fourth internal space (162-1). The first cover (151) may include a fourth hole (174) formed in an area corresponding to the first MEMS structure (120).

[0061] The second MEMS structure (130) can be placed in a space separated from the first MEMS structure (120) through the second cover (152), and through this, it can be prevented from having directivity or sensitivity being reduced without being affected by the fourth hole (174) formed in the first cover (151).

[0062] The signal processing element (180) may be placed in the fourth internal space (162-1) which is the same space as the second MEMS structure (130). At this time, the control element (190) may be placed together with the first MEMS structure (120) in the third internal space (161-1) which is inside the first cover (151) and outside the second cover (152). As shown in Fig. 6, the first MEMS structure (120) and the control element (190) may be placed in the third internal space (161-1), and the second MEMS structure (130) and the signal processing element (180) may be placed in the fourth internal space (162-1).

[0063] The control element (190) may be placed outside, rather than inside, the first cover (151) or the second cover (152). That is, as shown in FIG. 7, the control element (190) may be placed on the lower portion of the substrate (110). Alternatively, the control element (190) may be placed on a set substrate on which the MEMS module is placed. That is, the first MEMS structure (120) may be placed in the third internal space (161-1), the second MEMS structure (130) and the signal processing element (180) may be placed in the fourth internal space (162-1), and the control element (190) may be placed on the lower portion of the substrate (110).

[0064] The control element (190) and the signal processing element (180) may be integrated and arranged as a single integrated element (181). Here, the integrated element may be an ASIC. As shown in Fig. 8, the first MEMS structure (120) may be arranged in the third internal space (161-1), and the second MEMS structure (130) and the integrated element (181) may be arranged in the fourth internal space (162-1).

[0065] The cover may include two covers, but may be formed as a separate structure rather than a dual structure. The cover may include a third cover (153) and a fourth cover (154). The third cover (153) may cover a first area of ​​the upper portion of the substrate (110) corresponding to the first MEMS structure (120) to form a fifth internal space (161-2), and the fourth cover (154) may cover a second area of ​​the upper portion of the substrate (110) corresponding to the second MEMS structure (130) to form a sixth internal space (162-2). That is, the third cover (153) and the fourth cover (154) may be separated from each other to cover their respective areas. At this time, the partition wall structure (142) may be a side wall of the fourth cover (154) arranged between the first MEMS structure (120) and the second MEMS structure (130). The first MEMS structure (120) may be placed in the fifth internal space (161-2), and the second MEMS structure (130) may be placed in the sixth internal space (162-2). The third cover (153) may include a fifth hole (175) formed in an area corresponding to the first MEMS structure (120).

[0066] The second MEMS structure (130) can be placed in a space separated from the first MEMS structure (120) through the third cover (153) and the fourth cover (154), and through this, it can be prevented from having directivity or reducing sensitivity by not being affected by the fifth hole (175) formed in the third cover (153).

[0067] The signal processing element (180) may be placed in the sixth internal space (162-2), which is the same space as the second MEMS structure (130). At this time, the control element (190) may be placed together with the first MEMS structure (120) in the fifth internal space (161-2) inside the third cover (153). As shown in Fig. 9, the first MEMS structure (120) and the control element (190) may be placed in the fifth internal space (161-2), and the second MEMS structure (130) and the signal processing element (180) may be placed in the sixth internal space (162-2).

[0068] The control element (190) may be placed outside, rather than inside, the third cover (153) or the fourth cover (154). That is, as shown in FIG. 10, the control element (190) may be placed on the lower portion of the substrate (110). Alternatively, the control element (190) may be placed on a set substrate on which the MEMS module is placed. That is, the first MEMS structure (120) may be placed in the fifth internal space (161-2), the second MEMS structure (130) and the signal processing element (180) may be placed in the sixth internal space (162-2), and the control element (190) may be placed on the lower portion of the substrate (110).

[0069] The control element (190) and the signal processing element (180) may be integrated and arranged as a single integrated element (181). Here, the integrated element may be an ASIC. As shown in Fig. 11, the first MEMS structure (120) may be arranged in the fifth internal space (161-2), and the second MEMS structure (130) and the integrated element (181) may be arranged in the sixth internal space (162-2).

[0070] As described above, by configuring the MEMS microphone and MEMS speaker as an integral unit and physically separating the MEMS microphone and MEMS speaker, the directivity and sensitivity of the MEMS microphone can be prevented from being degraded.

[0071] Those skilled in the art will appreciate that the present invention can be implemented in modified forms without departing from the essential characteristics of the above-described description. Therefore, the disclosed methods should be considered illustrative rather than restrictive. The scope of the present invention is set forth in the claims, not the foregoing description, and all differences within the scope equivalent thereto should be construed as being encompassed by the present invention.

Claims

1. Substrate; A first MEMS structure disposed on the substrate; A second MEMS structure disposed on the substrate and spaced apart from the first MEMS structure; and A MEMS module including a partition structure disposed between the first MEMS structure and the second MEMS structure.

2. In paragraph 1, Includes a cover that covers the upper part of the substrate to form an internal space, The above internal space includes a first internal space and a second internal space separated by the above bulkhead structure, The above first MEMS structure is arranged in the first internal space, The above second MEMS structure is a MEMS module arranged in the second internal space.

3. In paragraph 2, The above bulkhead structure is a MEMS module including a side wall disposed between the first internal space and the second internal space.

4. In paragraph 2, The above cover is a MEMS module including a first hole formed in an area corresponding to the first internal space.

5. In paragraph 1, The above first MEMS structure is a speaker, The above second MEMS structure is a microphone MEMS module.

6. In paragraph 1, The above substrate is, A second hole formed in an area corresponding to the first MEMS structure; and A MEMS module including a third hole formed in an area corresponding to the second MEMS structure.

7. In paragraph 1, A first cover covering the upper portion of the substrate to form a third internal space; and A second cover is included to cover a portion of the upper area of ​​the substrate within the third internal space, thereby forming a fourth internal space. The above bulkhead structure is a side wall of the second cover disposed between the first MEMS structure and the second MEMS structure, The first MEMS structure is disposed inside the third internal space, but outside the fourth internal space, The above second MEMS structure is a MEMS module arranged in the fourth internal space.

8. In paragraph 7, A MEMS module in which the first cover includes a fourth hole formed in an area corresponding to the first MEMS structure.

9. In paragraph 1, A third cover covering a first area of ​​the upper portion of the substrate corresponding to the first MEMS structure to form a fifth internal space; and A fourth cover is included to cover the second area of ​​the upper portion of the substrate corresponding to the second MEMS structure to form a sixth internal space, The above bulkhead structure is a side wall of the fourth cover disposed between the first MEMS structure and the second MEMS structure, The above first MEMS structure is arranged in the fifth internal space, The above second MEMS structure is a MEMS module arranged in the sixth internal space.

10. In paragraph 9, The third cover is a MEMS module including a fifth hole formed in an area corresponding to the first MEMS structure.

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