Electronic device

Abstract

The embodiments of the present application relate to the technical field of electronic devices. Provided is an electronic device. The electronic device comprises a housing, a light-transmitting cover plate, a bonding member, a circuit board, and a glue member, wherein the housing is provided with a through hole; the light-transmitting cover plate is disposed on the outer side of the housing and covers the through hole in the direction of thickness of the electronic device; and the circuit board is connected to the inner side of the housing and covers the through hole in the direction of thickness of the electronic device. The housing and the light-transmitting cover plate form an annular gap, and at least part of the bonding member is located inside the annular gap and is bonded to both the housing and the light-transmitting cover plate. The circuit board, the housing, the light-transmitting cover plate and the bonding member jointly form an accommodating cavity, and the glue member is located inside the accommodating cavity. The glue member has a first surface and a second surface connected to each other, wherein the orthographic projection of the first surface on the light-transmitting cover plate is annular, the first surface fits with the inner wall of the through hole, and the second surface fits with the light-transmitting cover plate. In this way, the waterproof performance of the electronic device can be improved, thereby meeting long-term waterproof requirements.

Description

Electronic device

[0001] This application claims priority from the Chinese patent application No. 202421816083.7 filed on July 29, 2024, and entitled "Electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of electronic devices, in particular to an electronic device. BACKGROUND

[0003] At present, electronic devices (for example, smart watches or smart bands) are integrated with heart rate detection functions, which can collect the heart rates of users in daily life, work and other scenarios for health monitoring.

[0004] In the related art, an electronic device includes a shell, a light-transmitting lens and a heart rate detection module. The heart rate detection module is located inside the shell. The light-transmitting lens is bonded to the shell by means of dispensing and covers a through hole penetrating the shell. The light-transmitting lens is used to transmit or receive light beams emitted or received by the heart rate detection module, thereby realizing heart rate detection.

[0005] However, in the related art, the sealing performance between the light-transmitting lens and the shell is poor, which cannot meet the long-term waterproofing requirement. SUMMARY

[0006] Embodiments of the present application provide an electronic device, which can improve the sealing performance between the light-transmitting cover plate and the shell, thereby improving the waterproof performance of the electronic device and meeting the long-term waterproofing requirement.

[0007] Embodiments of the present application provide an electronic device. The electronic device includes a shell, a light-transmitting cover plate, an adhesive member, a circuit board and a gel member. The shell has a through hole. The light-transmitting cover plate is disposed on the outside of the shell and covers the through hole along the thickness direction of the electronic device. The circuit board is connected to the inside of the shell and covers the through hole along the thickness direction of the electronic device. The shell and the light-transmitting cover plate form an annular gap. At least part of the adhesive member is located inside the annular gap and is bonded to the shell and the light-transmitting cover plate, respectively. The circuit board, the shell, the light-transmitting cover plate and the adhesive member jointly form an accommodation cavity. The gel member is located inside the accommodation cavity. The gel member has a first surface and a second surface connected to each other. The first surface has a circular normal projection on the light-transmitting cover plate and is attached to the inner wall of the through hole. The second surface is attached to the light-transmitting cover plate.

[0008] The first surface is attached to the inner wall of the through hole and the second surface is attached to the light-transmitting cover plate, so that the gel member seals the annular gap and realizes sealing between the shell and the light-transmitting cover plate. In addition, the gel member is located inside the accommodation cavity, which can increase the volume of the gel member, increase the width of the second surface in the direction perpendicular to the thickness direction of the electronic device, increase the waterproof width, improve the sealing performance between the light-transmitting cover plate and the shell, thereby improving the waterproof performance of the electronic device, and further meeting the long-term waterproof requirement.

[0009] In some possible implementation manners, the electronic device further includes an optical module, the optical module is connected to the circuit board and located inside the accommodation cavity, and a projection of the optical module on the light-transmitting cover plate is located inside a projection of the gel member on the light-transmitting cover plate.

[0010] In this way, the waterproof width of the gel member is further increased, the waterproof performance of the electronic device is further improved, and the performance of the electronic device is ensured. In addition, the normal operation of the optical module is also ensured.

[0011] In some possible implementation manners, the optical module and the gel member are spaced apart in the thickness direction of the electronic device, or at least part of the optical module is located inside the gel member.

[0012] In this way, the gel member can block sweat, sebum and the like outside the electronic device outside the electronic device, realize waterproofing and ensure the normal operation of the optical module. In addition, the gel member wraps at least part of the optical module, which can further improve the waterproof performance of the electronic device.

[0013] In some possible implementation manners, the light transmittance of the gel member is greater than or equal to 90%, which can reduce the influence of the gel member on the optical module and improve the optical performance of the optical module.

[0014] In some possible implementation manners, the refractive index of the gel member is less than or equal to 1.5, which can reduce the influence of the gel member on the optical module and improve the optical performance of the optical module.

[0015] In some possible implementation manners, the electronic device further includes an optical module and an annular stopper, the annular stopper is located inside the accommodation cavity, the annular stopper divides the accommodation cavity into a first cavity and a second cavity which are spaced apart from each other, the gel member is located inside the first cavity, and the optical module is located inside the second cavity and connected to the circuit board.

[0016] In this way, the first cavity and the second cavity are used to accommodate the gel member and the optical module respectively, so that the gel member is spaced apart from the optical module, the influence of the gel member on the optical module is avoided, and the optical performance of the optical module meets the requirements. In addition, the gel member can also seal the light-transmitting cover plate and the shell, and meet the long-term waterproof requirement.

[0017] In some possible implementation manners, the optical module is a heart rate detection module, and the heart rate detection module includes the light emitting element and the light receiver, and the light emitting element and the light receiver are electrically connected to the circuit board.

[0018] In this way, the electronic device has the heart rate detection function and can detect the heart rate of the user.

[0019] In some possible implementation manners, the adhesive member is made of glue with a viscosity less than or equal to 10,000 cps, so that the glue used to form the adhesive member can flow better, reducing the difficulty of flowing the glue to the regions of the accommodation cavity, and reducing the manufacturing difficulty of the adhesive member.

[0020] In some possible implementation manners, the adhesive member has a ring-shaped orthographic projection on the light-transmitting cover plate, and the adhesive member is made of sealant.

[0021] In this way, the adhesive member can fix the light-transmitting cover plate to the shell while playing a waterproof role, further improving the sealing performance of the light-transmitting cover plate and the shell, and helping to further improve the waterproof performance of the electronic device.

[0022] In some possible implementation manners, the electronic device further includes at least one glue injection hole in communication with the accommodation cavity, so that the glue enters the accommodation cavity and forms the adhesive member.

[0023] In some possible implementation manners, the at least one glue injection hole penetrates the circuit board, so that the glue enters the interior of the accommodation cavity while reducing the difficulty of injecting the glue.

[0024] In some possible implementation manners, the circuit board and the shell form the at least one glue injection hole, so that the glue enters the interior of the accommodation cavity while reducing the area occupied by the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0025] FIG. 1 is a cross-sectional schematic view of an electronic device in the related art;

[0026] FIG. 2 is a cross-sectional schematic view of a first electronic device according to an embodiment of the present application;

[0027] FIG. 3 is a cross-sectional schematic view of a second electronic device according to an embodiment of the present application;

[0028] FIG. 4 is a cross-sectional schematic view of a third electronic device according to an embodiment of the present application;

[0029] FIG. 5 is a process schematic view of a preparation method of an adhesive member according to an embodiment of the present application;

[0030] FIG. 6 is a cross-sectional schematic view of a fourth electronic device according to an embodiment of the present application;

[0031] FIG. 7 is a front projection diagram of the optical module, the adhesive member and the annular blocking member on the light-transmitting cover plate in FIG. 6;

[0032] FIG. 8 is a front view diagram of another annular blocking member provided in an embodiment of the present application.

[0033] Legend: 100, housing; 110, through hole; 120, accommodating groove; 200, light-transmitting cover plate; 300, circuit board; 400, adhesive member; 500, adhesive member; 510, first surface; 520, second surface; 600, optical module; 610, light-emitting element; 620, light receiver; 700, glue-filling hole; 800, annular blocking member; 810, rigid body; 820, flexible body; X, length direction; Y, width direction; Z, thickness direction. DETAILED DESCRIPTION

[0034] FIG. 1 is a cross-sectional view diagram of an electronic device in the related art.

[0035] In the related art, referring to FIG. 1, an electronic device includes a housing 10, a light-transmitting lens 20 and a heart rate detection module 30. The heart rate detection module 30 is located inside the housing 10. The light-transmitting lens 20 is adhered to the housing 10 by means of dispensing and covers a through hole 40 penetrating the housing 10. The light-transmitting lens 20 is used to transmit a light beam emitted or received by the heart rate detection module 30 to achieve heart rate detection. In the use process of the electronic device, the light-transmitting lens 20 is in contact with the user's skin to achieve heart rate detection.

[0036] However, in the long-term use process of the electronic device, the adhesive 50 between the housing 10 and the light-transmitting lens 20 is easily eroded by sweat, sebum and the like, which can cause the adhesive 50 to lose adhesion with at least one of the housing 10 and the light-transmitting lens 20. Sweat, sebum and the like outside the electronic device can enter the inside and affect the normal operation of the electronic device. Therefore, how to ensure that the electronic device meets the long-term waterproof requirement becomes a problem to be solved.

[0037] Therefore, an embodiment of the present application provides an electronic device. The electronic device is internally provided with an adhesive member 500 for sealing an annular gap between a light-transmitting cover plate 200 and a housing 100, which can increase the waterproof width and improve the waterproof performance to meet the long-term waterproof requirement.

[0038] An embodiment of the present application provides an electronic device, which can include but is not limited to a wearable device, a virtual reality device, a heart rate measuring instrument and the like. The wearable device can be a smart watch, a smart bracelet, a helmet, a smart clothing or other accessories. Hereinafter, the electronic device is taken as a smart watch for example.

[0039] The electronic device provided by the embodiment of the present application will be described in detail below in combination with specific embodiments.

[0040] Embodiment one

[0041] FIG. 2 is a cross-sectional schematic view of a first electronic device provided by the embodiment of the present application.

[0042] The electronic device can include a display screen (not shown in the figure), a housing 100, a light-transmitting cover plate 200, a circuit board 300, an adhesive 400, an optical module 600 and a gel member 500. Of course, the electronic device can also include other devices that make the functions of the electronic device complete, such as a battery.

[0043] The display screen is connected to the housing 100 and is used to display text, images and other information. The display screen, the housing 100 and the light-transmitting cover plate 200 together form a cavity that accommodates the circuit board 300, the optical module 600, the gel member 500 and other devices.

[0044] Referring to FIG. 2, the housing 100 has a through hole 110, which can be a circular hole. Of course, the through hole 110 can also be of other shapes, for example, the through hole 110 can be a square hole.

[0045] In the embodiment of the present application, the side of the housing 100 along the thickness direction of the electronic device towards the display screen is the inner side, and the side of the housing 100 along the thickness direction of the electronic device away from the display screen is the outer side.

[0046] The light-transmitting cover plate 200 is arranged on the outer side of the housing 100 and covers the through hole 110 along the thickness direction Z of the electronic device, that is, the orthogonal projection of the through hole 110 on the reference plane is located inside the orthogonal projection of the light-transmitting cover plate 200 on the reference plane. The reference plane is the plane in which the length direction X and the width direction Y of the electronic device lie. The circuit board 300 is connected to the inner side of the housing 100 and covers the through hole 110 along the thickness direction Z of the electronic device, that is, the orthogonal projection of the through hole 110 on the reference plane is located inside the orthogonal projection of the circuit board 300 on the reference plane.

[0047] As shown in FIG. 2, the light-transmitting cover plate 200 is opposite to the optical module 600. The light-transmitting cover plate 200 can transmit the light emitted by the optical module 600 to the outside of the electronic device, and can also transmit the light from the outside of the electronic device to the optical module 600. The light-transmitting cover plate 200 is made of a light-transmitting material, such as glass, sapphire, etc.

[0048] As shown in FIG. 2, the adhesive 400 is adhered to the housing 100 and the light-transmitting cover plate 200 respectively, so that the light-transmitting cover plate 200 is fixed to the housing 100 through the adhesive 400. The housing 100 and the light-transmitting cover plate 200 form an annular gap, and at least part of the adhesive 400 is located inside the annular gap, for example, as shown in FIG. 2, the adhesive 400 is located inside the annular gap, of course, the adhesive 400 can also be partially located inside the annular gap.

[0049] The circuit board 300, the housing 100, the light-transmitting cover plate 200 and the adhesive 400 jointly form a containing cavity, the gel member 500 is located inside the containing cavity, and the optical module 600 is connected to the circuit board 300 and located inside the containing cavity. The orthogonal projection of the optical module 600 on the light-transmitting cover plate 200 is located inside the orthogonal projection of the gel member 500 on the light-transmitting cover plate 200.

[0050] The material of the gel member 500 is glue with light-transmitting property, and the type of the glue can be hot melt glue, silicone glue, epoxy glue, etc.

[0051] The gel member 500 has a first surface 510 and a second surface 520 connected to each other. The orthogonal projection of the first surface 510 on the light-transmitting cover plate 200 is annular and abuts the inner wall of the through hole 110, and the second surface 520 abuts the light-transmitting cover plate 200, so that the gel member 500 seals the annular gap and realizes waterproofing between the housing 100 and the light-transmitting cover plate 200. That is, the electronic device blocks the annular gap through the gel member 500, which plays a waterproofing role. In addition, the gel member 500 covers the area of the light-transmitting cover plate 200 opposite to the through hole 110 along the thickness direction Z of the electronic device, so that the width of the second surface 520 in the direction perpendicular to the thickness direction Z of the electronic device (for example, the Y direction in FIG. 2) is increased, thereby increasing the waterproofing width and further meeting the long-term waterproofing requirement.

[0052] Referring to FIG. 2, the gel member 500 is located outside the annular gap. However, in some embodiments, part of the gel member 500 can also be filled inside the annular gap, and the other part is located outside the annular gap.

[0053] Referring to FIG. 2, part of the gel member 500 is located inside the through hole 110, and the cross-sectional shape of the part of the gel member 500 located inside the through hole 110 is circular with the same diameter as the diameter of the through hole 110, and the cross section of the gel member 500 is perpendicular to the axial direction of the through hole 110.

[0054] Exemplarily, the optical module 600 can be a heart rate detection module, so that the electronic device has a heart rate detection function. Of course, the optical module 600 can also be other types of detection modules. In some embodiments, in addition to enabling the electronic device to have a heart rate detection function, the optical module 600 can also enable the electronic device to have other detection functions, such as a blood oxygen saturation detection function.

[0055] Referring to FIG. 2, the heart rate detection module can include a light emitting element 610 and a light receiver 620, which are electrically connected to the circuit board 300. The number of light emitting elements 610 can be one or two, for example, as shown in FIG. 2, the number of light emitting elements 610 is two. The number of light receivers 620 can be one or two, for example, as shown in FIG. 2, the number of light receivers 620 is two. The light emitting elements 610 and the light receivers 620 are alternately arranged in a direction perpendicular to the thickness direction Z of the electronic device.

[0056] The light emitting element 610 can be a LED (light emitting diode) to emit probe light. Of course, the light emitting element 610 can also be other light emitting devices.

[0057] The light receiver 620 can be a PD (photodiode) to convert optical signals into electrical signals. Of course, the light receiver 620 can also be other devices that convert optical signals into electrical signals.

[0058] In order to improve the appearance of the electronic device, in some possible implementation manners, referring to FIG. 2, the shell 100 has a receiving groove 120, the through hole 110 penetrates the groove bottom of the receiving groove 120 and communicates the inside of the receiving groove 120 with the inside of the shell 100, and the light-transmitting cover plate 200 is located in the inside of the receiving groove 120 and forms an annular gap with the groove bottom of the receiving groove 120.

[0059] In order to further improve the waterproof performance of the electronic device, in some possible implementation manners, the normal projection of the adhesive 400 on the light-transmitting cover plate 200 is annular, and the material of the adhesive 400 is sealing glue. The adhesive 400 plays a waterproof role when fixing the light-transmitting cover plate 200 to the shell 100, further improves the sealing performance between the light-transmitting cover plate 200 and the shell 100, and helps to further improve the waterproof performance of the electronic device.

[0060] The material of the sealing glue can be hot melt glue, silicone glue, epoxy glue, back glue, etc.

[0061] It should be noted that in addition to being sealing glue, the adhesive 400 can also be double-sided adhesive, which can also fix the light-transmitting cover plate 200 to the shell 100.

[0062] Exemplarily, the width of the adhesive member 400 in the direction perpendicular to the thickness direction Z of the electronic device (such as the Y direction in FIG. 2) can be 1.0 mm to 2.0 mm, which helps to further improve the waterproof effect of the adhesive member 400.

[0063] FIG. 3 is a cross-sectional view of a second electronic device according to an embodiment of the present application, and FIG. 4 is a cross-sectional view of a third electronic device according to an embodiment of the present application.

[0064] The relative position relationship between the colloidal member 500 and the optical module 600 will be described below.

[0065] In some embodiments, at least part of the optical module 600 can be located inside the colloidal member 500, for example, as shown in FIG. 2, the colloidal member 500 fills the accommodating cavity, so that the optical module 600 is located inside the colloidal member 500, that is, the colloidal member 500 wraps the optical module 600. Of course, as shown in FIG. 3, part of the optical module 600 can also be located outside the colloidal member 500, and another part is located inside the colloidal member 500, that is, the colloidal member 500 wraps part of the optical module 600.

[0066] In other embodiments, as shown in FIG. 4, the optical module 600 and the colloidal member 500 can also be spaced apart along the thickness direction Z of the electronic device, that is, the optical module 600 is located outside the colloidal member 500, and the projection of the optical module 600 and the projection of the colloidal member 500 do not overlap along the direction perpendicular to the thickness direction Z of the electronic device (such as the Y direction in FIG. 4).

[0067] In summary, the colloidal member 500 can wrap at least part of the optical module 600 or can be spaced apart from the optical module 600 along the thickness direction Z of the electronic device, both of which can seal the gap between the light-transmitting cover plate 200 and the shell 100, block sweat, sebum, etc. outside the electronic device outside the electronic device, achieve waterproof and ensure the normal work of the optical module 600. In addition, the colloidal member 500 wrapping at least part of the optical module 600 can further improve the waterproof performance of the electronic device.

[0068] Referring to FIG. 2, since the colloidal member 500 is arranged at the region of the light-transmitting cover plate 200 opposite to the through hole 110, the colloidal member 500 will affect the light emitted or received by the optical module 600. By optimizing the light transmittance and / or refractive index of the colloidal member 500, the influence of the colloidal member 500 on the optical module 600 can be reduced, and the optical performance of the optical module 600 can be improved.

[0069] In some possible implementations, the light transmittance of the colloidal member 500 can be greater than or equal to 90%, which can further improve the optical effect of the optical module 600.

[0070] The specific value of the light transmittance of the colloidal member 500 is not limited herein. For example, the light transmittance of the colloidal member 500 can be 90%, 93%, 95.6%, or 97%, etc.

[0071] In some possible implementation manners, the refractive index of the colloidal member 500 can be less than or equal to 1.5, which can further improve the optical effect of the optical module 600.

[0072] The specific value of the refractive index of the colloidal member 500 is not limited herein. For example, the refractive index of the colloidal member 500 can be 1.3, 1.35, 1.4, or 1.5, etc.

[0073] Since the colloidal member 500 is a structural member formed after the curing of glue, in order to reduce the difficulty of forming the colloidal member 500, in some possible implementation manners, the material of the colloidal member 500 can be glue with a viscosity less than or equal to 10,000 cps, so that the glue used to form the colloidal member 500 can flow better, reducing the difficulty of the glue flowing to various regions of the accommodation cavity, and reducing the manufacturing difficulty of the colloidal member 500.

[0074] Specifically, the viscosity of the glue is less than or equal to 10,000 cps, so that the glue becomes thin, and during the process of pouring the glue into the accommodation cavity, the glue can flow more easily to various regions of the accommodation cavity to cover the region of the light-transmitting cover plate 200 opposite to the through hole 110.

[0075] It should be noted that, in addition to the glue with a viscosity less than or equal to 10,000 cps, the glue with a viscosity greater than 10,000 cps can also be used to form the colloidal member 500.

[0076] In order to pour the glue into the accommodation cavity to form the colloidal member 500, referring to FIG. 2, the electronic device further includes at least one glue pouring hole 730 in communication with the accommodation cavity. For example, the electronic device can include three glue pouring holes 730, and of course, the number of glue pouring holes 730 can be less than or more than three. Through the glue pouring hole 730, the glue can enter the accommodation cavity and form the colloidal member 500.

[0077] In some embodiments, the at least one glue pouring hole 730 penetrates the circuit board 300, that is, the circuit board 300 is provided with at least one glue pouring hole 730. For example, the circuit board 300 is provided with two glue pouring holes 730, and of course, the number of glue pouring holes 730 provided on the circuit board 300 can be more than or less than two.

[0078] In some embodiments, the circuit board 300 forms at least one glue pouring hole 730 with the shell 100, for example, the circuit board 300 forms two glue pouring holes 730 with the shell 100, and of course, the circuit board 300 can form more than two glue pouring holes 730 with the shell 100.

[0079] In some embodiments, the shell 100 has at least one glue pouring hole 730, for example, the shell 100 can have two glue pouring holes 730, and of course, the shell 100 can have more or less than two glue pouring holes 730.

[0080] In summary, the glue pouring hole 730 can be provided on the circuit board 300 (as shown in FIG. 2) or the shell 100, or the circuit board 300 and the shell 100 form the glue pouring hole 730, and the position of the glue pouring hole 730 is not limited. In addition, the glue pouring hole 730 provided on the circuit board 300, the glue pouring hole 730 provided on the shell 100, and the circuit board 300 and the shell 100 forming the glue pouring hole 730 can be freely combined, for example, the circuit board 300 is provided with the glue pouring hole 730 and forms the glue pouring hole 730 with the shell 100, which can allow the glue to enter the inside of the glue body while reducing the area occupied by the circuit board 300.

[0081] FIG. 5 is a process schematic diagram of a preparation method of a glue body provided in an embodiment of the present application.

[0082] Referring to FIG. 5, the embodiment of the present application further provides a preparation method of a glue body 500, and the preparation method comprises the following steps:

[0083] S101, forming a containing cavity.

[0084] Specifically, as shown in S1 in FIG. 5, the circuit board 300 is connected to the inner side of the shell 100, and the light-transmitting cover plate 200 is bonded to the inner side of the shell 100 through the bonding member 400, so that the circuit board 300, the bonding member 400, the shell 100 and the light-transmitting cover plate 200 enclose a containing cavity.

[0085] Among them, the bonding member 400 bonding the light-transmitting cover plate 200 and the shell 100 can be formed by dispensing. Of course, the bonding member 400 can also be double-sided adhesive tape or back adhesive tape, etc.

[0086] S102, pouring glue into the containing cavity through the glue pouring hole 730.

[0087] Specifically, as shown in S2 of FIG. 5, glue is poured into the accommodating cavity through the glue pouring hole 730 arranged on the circuit board 300 (as shown in A of FIG. 5). Of course, in addition to the glue pouring hole 730 arranged on the circuit board 300, the shell 100 can also have the glue pouring hole 730, and / or the shell 100 and the circuit board 300 can also form the glue pouring hole 730.

[0088] S103, vacuuming the glue in the accommodating cavity.

[0089] Specifically, as shown in S3 of FIG. 5, the glue in the accommodating cavity is vacuumed through the glue pouring hole 730 to remove the bubbles in the glue (as shown in B of FIG. 5), so as to avoid the bubbles in the glue remaining, prevent holes from appearing in the glue member 500, and improve the appearance of the electronic device and / or the optical performance of the optical module 600.

[0090] S104, curing the glue.

[0091] Specifically, as shown in S3 of FIG. 5, a corresponding glue curing process is selected according to the type of the glue, and the glue after vacuuming is cured to form the glue member 500.

[0092] Embodiment Two

[0093] FIG. 6 is a cross-sectional view of a fourth electronic device according to an embodiment of the present application, FIG. 7 is a front projection view of the optical module, the glue member and the annular blocking piece on the light-transmitting cover plate in FIG. 6, and FIG. 8 is a front view of another annular blocking piece according to an embodiment of the present application.

[0094] The electronic device can include a display screen (not shown in the figure), a shell 100, a light-transmitting cover plate 200, a circuit board 300, an adhesive member 400, an optical module 600 and a glue member 500. Of course, the electronic device can also include other devices that make the function of the electronic device complete, such as a battery.

[0095] The display screen is connected to the shell 100 and is used to display text, images and the like. The display screen, the shell 100 and the light-transmitting cover plate 200 together form a cavity that accommodates devices such as the circuit board 300, the optical module 600 and the glue member 500.

[0096] As shown in FIG. 6, the shell 100 has a through hole 110, which can be a circular hole. Of course, the through hole 110 can also be of other shapes, for example, the through hole 110 can be a square hole.

[0097] In the embodiment of the present application, the side of the shell 100 along the thickness direction of the electronic device towards the display screen is the inner side, and the side of the shell 100 along the thickness direction of the electronic device away from the display screen is the outer side.

[0098] The light-transmissive cover plate 200 is arranged on the outside of the housing 100 and covers the through hole 110 in the thickness direction Z of the electronic device, that is, the orthogonal projection of the through hole 110 on a reference plane is inside the orthogonal projection of the light-transmissive cover plate 200 on the reference plane, and the reference plane is the plane in which the length direction X and the width direction Y of the electronic device lie. The circuit board 300 is connected to the inside of the housing 100 and covers the through hole 110 in the thickness direction Z of the electronic device, that is, the orthogonal projection of the through hole 110 on the reference plane is inside the orthogonal projection of the circuit board 300 on the reference plane.

[0099] As shown in FIG. 6, the light-transmissive cover plate 200 is opposite to the optical module 600, and the light-transmissive cover plate 200 can transmit the light emitted by the optical module 600 to the outside of the electronic device and can transmit the light from the outside of the electronic device to the optical module 600. The light-transmissive cover plate 200 is made of a light-transmissive material, such as glass, sapphire, etc.

[0100] As shown in FIG. 6, the adhesive 400 is adhered to the housing 100 and the light-transmissive cover plate 200 respectively, so that the light-transmissive cover plate 200 is fixed to the housing 100 through the adhesive 400. The housing 100 and the light-transmissive cover plate 200 form an annular gap, and at least part of the adhesive 400 is located inside the annular gap, for example, as shown in FIG. 6, the adhesive 400 is located inside the annular gap, of course, part of the adhesive 400 can also be located inside the annular gap.

[0101] The circuit board 300, the housing 100, the light-transmissive cover plate 200 and the adhesive 400 jointly form a containing cavity, the gelling member 500 is located inside the containing cavity, and the optical module 600 is connected to the circuit board 300 and located inside the containing cavity. As shown in FIG. 7, the orthogonal projection of the optical module 600 on the light-transmissive cover plate 200 does not overlap with the orthogonal projection of the gelling member 500 on the light-transmissive cover plate 200, avoiding the influence of the gelling member 500 on the optical performance of the optical module 600, so that the light transmittance and the refractive index of the gelling member 500 do not need to be optimized.

[0102] The material of the gelling member 500 can be hot melt adhesive, silicone, epoxy adhesive, etc.

[0103] The colloid piece 500 has a first surface 510 and a second surface 520 connected to each other. The first surface 510 has a projection on the light-transmitting cover plate 200 in a shape of a ring and is attached to the inner wall of the through hole 110. The second surface 520 is attached to the light-transmitting cover plate 200, so that the colloid piece 500 seals the annular gap and realizes waterproofing between the shell 100 and the light-transmitting cover plate 200. That is, the electronic device blocks the annular gap by the colloid piece 500, which plays a waterproofing role. In addition, the colloid piece 500 covers a part of the light-transmitting cover plate 200 opposite to the through hole 110 along the thickness direction Z of the electronic device, which can increase the width of the second surface 520 in a direction perpendicular to the thickness direction Z of the electronic device (for example, the Y direction in FIG. 6), so as to increase the waterproofing width, and thus the long-term waterproofing requirement can be met.

[0104] Referring to FIG. 6, the electronic device further includes an annular blocking piece 800. The annular blocking piece 800 has a projection on the light-transmitting cover plate 200 in a shape of a ring, for example, as shown in FIG. 7, the projection of the annular blocking piece 800 on the light-transmitting cover plate 200 can be a circular ring. The annular blocking piece 800 is located inside the accommodating cavity, and the annular blocking piece 800 divides the accommodating cavity into a first cavity and a second cavity separated from each other. The colloid piece 500 is located inside the first cavity, and the optical module 600 is located inside the second cavity and connected to the circuit board 300, so that the projection of the optical module 600 on the light-transmitting cover plate 200 does not overlap the projection of the colloid piece 500 on the light-transmitting cover plate 200.

[0105] In this way, the first cavity and the second cavity are used to accommodate the colloid piece 500 and the optical module 600 respectively, so that the colloid piece 500 is separated from the optical module 600, avoiding the influence of the colloid piece 500 on the optical module 600, so that the optical performance of the optical module 600 meets the requirements. In addition, the colloid piece 500 can also seal the light-transmitting cover plate 200 and the shell 100, so as to meet the long-term waterproofing requirement.

[0106] Exemplarily, the colloid piece 500 is located outside the annular gap and inside the first cavity. However, in some embodiments, a part of the colloid piece 500 can also be filled inside the annular gap, and another part is located inside the first cavity.

[0107] Referring to FIG. 6, a part of the colloid piece 500 is located inside the through hole 110. The cross-sectional shape of the part of the colloid piece 500 located inside the through hole 110 is a circular ring with an outer diameter same as the diameter of the through hole 110, and the cross section of the colloid piece 500 is perpendicular to the axial direction of the through hole 110.

[0108] Referring to FIG. 6, the colloid piece 500 fills the first cavity completely. However, the colloid piece 500 can also fill a part of the first cavity.

[0109] Referring to FIG. 6, along the thickness direction Z of the electronic device, the circuit board 300 and the light-transmissive cover plate 200 are respectively located at opposite ends of the annular blocking piece 800 and are respectively attached to the annular blocking piece 800, so that the accommodation cavity is divided into a first cavity and a second cavity which are separated.

[0110] In order to improve the sealing performance of the circuit board 300 and the annular blocking piece 800 and the sealing performance of the light-transmissive cover plate 200 and the annular blocking piece 800, in some embodiments, the annular blocking piece 800 can be made of a material with elasticity, for example, the material of the annular blocking piece 800 can be foam, silica gel pad, etc.

[0111] In another embodiment, referring to FIG. 8, the annular blocking piece 800 can also include a rigid body 810 and two flexible bodies 820, along the thickness direction Z of the electronic device, the rigid body 810 is located between the two flexible bodies 820 and is connected to the two flexible bodies 820 respectively, one of the two flexible bodies 820 abuts against the circuit board 300, and the other flexible body 820 abuts against the light-transmissive cover plate 200, so that the light-transmissive cover plate 200 and the circuit board 300 are closely attached to the two flexible bodies 820 respectively.

[0112] The flexible body 820 can be made of an elastic material such as foam, silica gel pad, etc. In addition, the orthogonal projection of the flexible body 820 and the rigid body 810 on the light-transmissive cover plate 200 is annular.

[0113] In some embodiments, the annular blocking piece 800 can be fixed to the light-transmissive cover plate 200, for example, the annular blocking piece 800 can be connected to the light-transmissive cover plate 200 by adhesion, so as to facilitate assembly. In another embodiment, the annular blocking piece 800 can also be fixed to the circuit board 300, for example, the annular blocking piece 800 can be connected to the circuit board 300 by adhesion, which can also facilitate assembly.

[0114] For example, the optical module 600 can be a heart rate detection module, so that the electronic device has a heart rate detection function. Of course, the optical module 600 can also be other types of detection modules. In some embodiments, in addition to having a heart rate detection function, the optical module 600 can also make the electronic device have other detection functions, such as blood oxygen saturation detection function.

[0115] As shown in FIG. 6, the heart rate detection module can include a light emitting element 610 and a light receiver 620, and the light emitting element 610 and the light receiver 620 are respectively electrically connected to the circuit board 300. The number of light emitting elements 610 can be one or two, for example, as shown in FIG. 6, the number of light emitting elements 610 is two. The number of light receivers 620 can be one or two, for example, as shown in FIG. 6, the number of light receivers 620 is two. The light emitting elements 610 and the light receivers 620 are alternately arranged in a direction perpendicular to the thickness direction Z of the electronic device.

[0116] The light emitting element 610 can be a light emitting diode (LED) to emit the probe light. Of course, the light emitting element 610 can also be another light emitting device.

[0117] The light receiving element 620 can be a photodiode (PD) to convert the optical signal into an electrical signal. Of course, the light receiving element 620 can also be another device to convert the optical signal into an electrical signal.

[0118] In order to improve the appearance of the electronic device, in some possible implementation manners, as shown in FIG. 6, the shell 100 has a receiving groove 120, the through hole 110 penetrates the groove bottom of the receiving groove 120 and communicates the inside of the receiving groove 120 with the inside of the shell 100, and the light-transmitting cover plate 200 is located in the inside of the receiving groove 120 and forms an annular gap with the groove bottom of the receiving groove 120.

[0119] In order to further improve the waterproof performance of the electronic device, in some possible implementation manners, the normal projection of the adhesive 400 on the light-transmitting cover plate 200 is annular, and the material of the adhesive 400 is sealant. The adhesive 400 plays a waterproof role when fixing the light-transmitting cover plate 200 to the shell 100, further improves the sealing performance between the light-transmitting cover plate 200 and the shell 100, and helps to further improve the waterproof performance of the electronic device.

[0120] The material of the sealant can be hot melt adhesive, silicone, epoxy adhesive, back adhesive, etc.

[0121] It should be noted that in addition to the sealant, the adhesive 400 can also be double-sided adhesive, which can also fix the light-transmitting cover plate 200 to the shell 100.

[0122] Exemplarily, the width of the adhesive 400 in the direction perpendicular to the thickness direction Z of the electronic device can be 1.0 mm to 2.0 mm, which helps to further improve the waterproof effect of the adhesive 400.

[0123] Since the gel member 500 is a structural member formed after the glue solidifies, in order to reduce the difficulty of forming the gel member 500, in some possible implementation manners, the material of the gel member 500 can be glue with a viscosity less than or equal to 10,000 cps, so that the glue used to form the gel member 500 can flow better, reducing the difficulty of the glue flowing to all regions of the first cavity and reducing the manufacturing difficulty of the gel member 500.

[0124] Specifically, the viscosity of the glue is less than or equal to 10,000 cps, so that the glue is thin, and the glue is more easily flowed to each area of the first cavity during the process of pouring the glue into the first cavity, covering the cavity bottom opposite to the through hole 110 in the first cavity.

[0125] It should be noted that the material of the glue body 500 can also be formed by using glue with a viscosity greater than 10,000 cps in addition to the glue with a viscosity less than or equal to 10,000 cps.

[0126] In order to pour the glue into the first cavity to form the glue body 500, the electronic device further comprises at least one glue pouring hole 730 in communication with the accommodating cavity, for example, the electronic device can comprise three glue pouring holes 730, of course, the number of glue pouring holes 730 can also be less than or more than three. Through the glue pouring hole 730, the glue can enter the accommodating cavity and form the glue body 500. As shown in FIG. 6, the glue body 500 is located in the first cavity, so each glue pouring hole 730 is in communication with the first cavity.

[0127] In some embodiments, at least one glue pouring hole 730 penetrates the circuit board 300, that is, at least one glue pouring hole 730 is provided on the circuit board 300, for example, two glue pouring holes 730 are provided on the circuit board 300, of course, the number of glue pouring holes 730 provided on the circuit board 300 can also be more than or less than two.

[0128] In another embodiment, the circuit board 300 and the shell 100 form at least one glue pouring hole 730, for example, the circuit board 300 and the shell 100 form two glue pouring holes 730, of course, the number of glue pouring holes 730 formed by the circuit board 300 and the shell 100 can also be more than or less than two.

[0129] In yet another embodiment, the shell 100 has at least one glue pouring hole 730, for example, the shell 100 can have two glue pouring holes 730, of course, the number of glue pouring holes 730 provided on the shell 100 can also be more than or less than two.

[0130] In summary, the glue pouring hole 730 can be provided on the circuit board 300 (as shown in FIG. 6) or the shell 100, or the circuit board 300 and the shell 100 form the glue pouring hole 730, and the position of the glue pouring hole 730 is not specifically limited. In addition, the glue pouring hole 730 provided on the circuit board 300, the glue pouring hole 730 provided on the shell 100, and the glue pouring hole 730 formed by the circuit board 300 and the shell 100 can be freely combined, for example, the circuit board 300 is provided with the glue pouring hole 730 and forms the glue pouring hole 730 with the shell 100, which can allow the glue to enter the inside of the accommodating cavity while reducing the area occupied by the circuit board 300.

[0131] The embodiment two of the application further provides a preparation method of the gel member 500, which comprises the following steps:

[0132] S101, the annular blocking piece 800 is attached to the light-transmitting cover plate 200 or the circuit board 300.

[0133] Specifically, the annular blocking piece 800 can be attached to the light-transmitting cover plate 200, or the annular blocking piece 800 can also be attached to the circuit board 300.

[0134] S102, a containing cavity is formed.

[0135] Specifically, the circuit board 300 is connected to the inner side of the shell 100, and the light-transmitting cover plate 200 is attached to the inner side of the shell 100 through the adhesive piece 400, so that the circuit board 300, the adhesive piece 400, the shell 100 and the light-transmitting cover plate 200 form the containing cavity.

[0136] The adhesive piece 400 for attaching the light-transmitting cover plate 200 to the shell 100 can be formed by dispensing. Of course, the adhesive piece 400 can also be double-sided adhesive tape or back adhesive.

[0137] S103, glue is poured into the containing cavity through the glue pouring hole 730.

[0138] Specifically, the glue is poured into the first cavity through the glue pouring hole 730 arranged on the circuit board 300. Of course, in addition to the glue pouring hole 730 arranged on the circuit board 300, the shell 100 can also have the glue pouring hole 730, and / or the shell 100 and the circuit board 300 can also form the glue pouring hole 730.

[0139] S104, the glue in the containing cavity is vacuum degassed.

[0140] Specifically, the glue in the first cavity is subjected to vacuum degassing operation through the glue pouring hole 730, so as to remove the bubbles in the glue, avoid the bubbles in the glue remaining, prevent holes from appearing in the gel member 500, and improve the appearance of the electronic device and / or the optical performance of the optical module 600.

[0141] S105, the glue is cured.

[0142] Specifically, according to the type of the glue, a corresponding glue curing process is selected, and the glue after vacuum degassing is subjected to curing operation to form the gel member 500.

[0143] In the description of the embodiments of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "mount", "connect", "connection" should be understood as broad, for example, can be fixedly connected, can be indirectly connected through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0144] In the embodiments of the present application or the devices or elements implied by the embodiments of the present application must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0145] The terms "first", "second", "third", "fourth" and the like (if any) in the description of the embodiments of the present application and the above drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0146] The term "a plurality of" herein refers to two or more. The term "and / or" herein is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " herein generally represents that the associated objects before and after are in an "or" relationship; in the formula, the character " / " represents that the associated objects before and after are in a "division" relationship.

[0147] It can be understood that the various numbers involved in the embodiments of the present application are only distinguished for the convenience of description, and do not limit the scope of the embodiments of the present application.

[0148] It can be understood that in the embodiments of the present application, the size of the serial number of the above processes does not mean the order of execution, and the execution order of the processes should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, comprising: The electronic device comprises a housing, a light-transmitting cover plate, an adhesive, a circuit board and a gel member. The housing has a through hole, the light-transmitting cover plate is arranged on the outer side of the housing and covers the through hole in the thickness direction of the electronic device, and the circuit board is connected to the inner side of the housing and covers the through hole in the thickness direction of the electronic device. The housing and the light-transmitting cover plate form an annular gap, at least part of the adhesive is located inside the annular gap and is bonded to the housing and the light-transmitting cover plate respectively. The circuit board, the housing, the light-transmitting cover plate and the adhesive jointly form a containing cavity, the gel member is located inside the containing cavity, the gel member has a first surface and a second surface connected to each other, the first surface has a circular orthographic projection on the light-transmitting cover plate and is fitted to the inner wall of the through hole, and the second surface is fitted to the light-transmitting cover plate.

2. The electronic device of claim 1, wherein, The electronic device further comprises an optical module connected to the circuit board and located inside the containing cavity, and an orthographic projection of the optical module on the light-transmitting cover plate is located inside an orthographic projection of the gel member on the light-transmitting cover plate.

3. The electronic device of claim 2, wherein, The optical module and the gel member are arranged in a spaced manner in the thickness direction of the electronic device, or at least part of the optical module is located inside the gel member.

4. The electronic device of claim 2, wherein, The light transmittance of the gel member is greater than or equal to 90%; and / or The refractive index of the gel member is less than or equal to 1.

5.

5. The electronic device of claim 1, wherein, The electronic device further comprises an optical module and an annular barrier, the annular barrier is located inside the containing cavity, the annular barrier divides the containing cavity into a first cavity and a second cavity which are spaced from each other, the gel member is located inside the first cavity, and the optical module is located inside the second cavity and connected to the circuit board.

6. The electronic device of any one of claims 2 to 5, wherein, The optical module is a heart rate detection module, the heart rate detection module comprises a light-emitting element and a light receiver, and the light-emitting element and the light receiver are electrically connected to the circuit board respectively.

7. The electronic device of any one of claims 1 to 5, wherein, The material of the gel member is glue with a viscosity less than or equal to 10,000 cps.

8. The electronic device of any one of claims 1 to 5, wherein, An orthographic projection of the adhesive on the light-transmitting cover plate is annular, and the material of the adhesive is sealant.

9. The electronic device of any one of claims 1 to 5, wherein, The electronic device further comprises at least one glue-filling hole in communication with the containing cavity.

10. The electronic device of claim 9, wherein, At least one of the glue-filling holes penetrates the circuit board; and / or The circuit board and the housing form at least one of the glue-filling holes.

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