Proximity sensor and electronic device

Abstract

A proximity sensor and an electronic device, belonging to the technical field of sensors. The proximity sensor comprises a coil (1), a magnetic core (2), a printed circuit board and a housing (6), wherein the magnetic core (2) comprises a coil outer wall; the printed circuit board comprises a main board (3), a first pad (4-1) and a second pad (4-2), which are arranged at a first end of the main board (3), and a debugging assembly (11), which is arranged at a second end of the main board (3); a first lead end of the coil (1) is connected to the first pad (4-1), and a second lead end of the coil (1) is connected to the second pad (4-2); and the housing (6) is sleeved outside the printed circuit board, and the debugging assembly (11) is exposed outside the housing (6). The present invention has the advantages of simple assembly, a simple debugging operation, a high fault tolerance rate, and high product consistency.

Description

Proximity sensor and electronic device TECHNICAL FIELD

[0001] The present disclosure belongs to the technical field of sensors, and particularly relates to a proximity sensor and an electronic device. BACKGROUND

[0002] As a kind of position sensor, inductive proximity sensor can realize non-contact position detection on metal target object, has the advantages of good reliability, strong anti-interference ability, high repeat positioning accuracy, long service life and avoiding metal target wear, and is widely used in mechanical manufacturing, electronics, automobile, aerospace, food and plastic industries.

[0003] Inductive proximity sensor is also called proximity switch, mainly composed of high-frequency oscillation circuit and detection circuit, and its sensitive element is detection coil. In short, its detection principle is: the starting and stopping state of the oscillation circuit is controlled by using eddy current loss principle, and discrete level signals are outputted to the outside, so as to realize the detection on the position of metal target object.

[0004] In the production process of inductive proximity sensor, it needs to be debugged for many times to determine the optimal parameters of the circuit, so as to ensure that the inductive proximity sensor has the maximum detection distance, so as to ensure the measurement performance of the proximity sensor; in the assembly process of inductive proximity sensor, the relative position accuracy and connection relationship between components need to be ensured, so as to ensure the measurement stability of the proximity sensor. SUMMARY

[0005] The present disclosure aims to at least solve one of the technical problems existing in the prior art. On the one hand, a proximity sensor is provided, which comprises a coil, a magnetic core, a printed circuit board, and a shell. The magnetic core comprises an outer wall of the coil, the printed circuit board comprises a main board, a first pad and a second pad arranged at a first end of the main board, and a debugging component arranged at a second end of the main board. The first lead end of the coil is connected with the first pad, and the second lead end of the coil is connected with the second pad. The shell is arranged outside the printed circuit board, and the debugging component is exposed outside the shell.

[0006] In some embodiments, the first end of the main board has a first connecting part; the proximity sensor further comprises a connecting component, which comprises a first main body part and a second connecting part; wherein the first main body part comprises oppositely arranged first and second surfaces; the first surface is opposite to the magnetic core, the second connecting part is connected with the second surface, and the second connecting part has a first limiting groove; and the first connecting part is fixed in the first limiting groove.

[0007] In some embodiments, the first end of the main plate has a first connecting portion; the proximity sensor further comprises a connecting assembly, the connecting assembly comprising a first body portion; the first body portion comprises a first surface and a second surface arranged oppositely; the first surface is opposite to the magnetic core; a first limiting groove is arranged on the second surface side of the first body portion; and the first connecting portion is fixed in the first limiting groove.

[0008] In some examples, the magnetic core has a second limiting groove; the connecting assembly further comprises a third connecting portion connecting the first surface; and the third connecting portion is fixed in the second limiting groove.

[0009] In some examples, the third connecting portion comprises a third body portion and a third end portion connected with the third body portion; the third end portion comprises a third surface and a fourth surface arranged oppositely, and a third connecting side surface connecting the third surface and the fourth surface; the fourth surface is connected with the third body portion, and the area of the third surface is smaller than the area of the fourth surface.

[0010] In some examples, the connecting assembly further comprises a first probe and a second probe connecting the second surface; the first lead end and the second lead end of the coil are connected with the first probe and the second probe respectively.

[0011] In some examples, when the first connecting portion is fixed in the first limiting groove, the first probe and the first pad are opposite, and there is a gap between the first probe and the first pad; the second probe and the second pad are opposite, and there is a gap between the second probe and the second pad.

[0012] In some examples, the magnetic core has a first accommodating portion and a second accommodating portion; the first body portion further has a first connecting side surface connecting the first surface and the second surface; the first connecting side surface has a third accommodating portion and a fourth accommodating portion; the first lead end of the coil extends to the first pad and is connected therewith via the first accommodating portion and the third accommodating portion; and the second lead end of the coil extends to the second pad and is connected therewith via the second accommodating portion and the fourth accommodating portion.

[0013] In some examples, the orthographic projection of the first surface on the magnetic core is located in the magnetic core; the depth of the third accommodating portion is not less than the depth of the first accommodating portion, and the depth of the fourth accommodating portion is not less than the depth of the second accommodating portion.

[0014] In some examples, the third accommodating portion has a third bottom opposite to the opening thereof, and a first connecting surface and a second connecting surface connected with the first connecting side surface; the fourth accommodating portion has a fourth bottom opposite to the opening thereof, and a third connecting surface and a fourth connecting surface connected with the first connecting side surface; at least one of the third bottom, the fourth bottom, the first connecting surface, the second connecting surface, the third connecting surface and the fourth connecting surface is an arc surface.

[0015] In some examples, the first surface and the magnetic core are connected through a colloid.

[0016] In some examples, the proximity sensor further comprises a cable, a first cover and a second cover; wherein the first end of the cable is connected with the main board; the magnetic core is located in the first cover, and the second end of the main board is located in the second cover; the second cover has a through hole, and the second end of the cable extends to the outside of the proximity sensor through the through hole.

[0017] In some examples, the main board comprises a first circuit board and a second circuit board; the second end of the first circuit board and the first end of the second circuit board are connected and located in the shell; the second end of the second circuit board is exposed to the outside of the shell, and the debugging component is arranged at the second end of the second circuit board.

[0018] In some examples, the proximity sensor further comprises a first cover, a second cover and a socket located at the second end of the second circuit board; the second cover has a plug pin; the magnetic core is located in the first cover, the second end of the second circuit board is located in the second cover, and the socket is connected with the plug pin.

[0019] In some examples, the first cover and the shell are filled with a colloid.

[0020] In some examples, the debugging component comprises a potentiometer or a slide rheostat.

[0021] In the second aspect, the present application provides an electronic device comprising the proximity sensor of any one of the examples of the first aspect. BRIEF DESCRIPTION OF DRAWINGS

[0022] FIG. 1A is an exploded view of the structure of a conventional wire leading type proximity sensor;

[0023] FIG. 1B is a perspective view of the proximity sensor shown in FIG. 1A;

[0024] FIG. 1C is an exploded view of the structure of a conventional plug-in type proximity sensor;

[0025] FIG. 1D is a perspective view of the proximity sensor shown in FIG. 1C;

[0026] Figure 2A is an exploded view of the proximity sensor provided in an embodiment of this disclosure;

[0027] Figure 2B is a schematic diagram of the assembly of the proximity sensor shown in Figure 2A;

[0028] Figure 3 is a schematic diagram showing the structure and location of the connection component provided in an embodiment of this disclosure;

[0029] Figure 4A shows an example of a connecting component;

[0030] Figure 4B is a top view of the connecting component shown in Figure 4A;

[0031] Figure 4C is a bottom view of the connecting component shown in Figure 4A;

[0032] Figure 5 shows an example of the first connecting part;

[0033] Figure 6A shows another example of a connecting component;

[0034] Figure 6B is a top view of the connecting component shown in Figure 6A;

[0035] Figure 6C is a bottom view of the connecting component shown in Figure 6A;

[0036] Figure 7 shows another example of the first connecting part;

[0037] Figures 8A and 8B are schematic diagrams showing the location and structure of the third connecting part;

[0038] Figures 9A and 9B are schematic diagrams showing the positions and structures of the first and second probes;

[0039] Figure 10A shows the location of the wire lead-out type proximity sensor debugging component and the structure of the main board;

[0040] Figure 10B is a schematic diagram of the installation position of the motherboard and the housing shown in Figure 10A;

[0041] Figure 10C is an enlarged view of the second cover shown in Figure 10B;

[0042] Figure 11A shows the location of the connector-type proximity sensor debugging component and the structure of the motherboard.

[0043] Figure 11B is an assembly diagram of the proximity sensor shown in Figure 11A;

[0044] Figure 11C is a schematic diagram of the structure of the first circuit board;

[0045] Figure 11D is a schematic diagram of the second circuit board.

[0046] Wherein the reference signs are: 1, coil; 2, magnetic core; 3, main plate; 4-1, first solder pad; 4-2, second solder pad; 6, shell; 7, first cover body; 8, second cover body; 3-1, first connecting part; 9, cable; 11, debugging assembly; 10, pin; 12, connecting assembly; 12-1, first main body part; 12-2, second connecting part; 12-3, first limiting groove; 12-4, third accommodating part; 12-5, fourth accommodating part; S1, first surface; S2, second surface; 2-1, first accommodating part; 14-1, first probe; 14-2, second probe; 14, first connecting face; 15, second connecting face; 16, third connecting face; 17, fourth connecting face; 13, third connecting part; 13-1, third end part; 13-2, third main body part; 3-2, first circuit board; 3-3, second circuit board; 20, socket. DETAILED DESCRIPTION

[0047] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0048] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning understood by a person of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one", "a", or "the" and similar terms do not denote a quantity restriction, but mean that at least one exists. The terms "include" or "contain" and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, without excluding other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are used only to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships can also change accordingly.

[0049] As used herein, "parallel", "perpendicular" includes the stated case and the case similar to the stated case, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement being discussed and the error related to the measurement of a specific quantity (i.e., the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, wherein the acceptable deviation range of approximately parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximately perpendicular, wherein the acceptable deviation range of approximately perpendicular can also be, for example, within 5° deviation.

[0050] It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0051] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the layers of components of the devices are shown in the drawings. Therefore, the thickness of layers and regions can be exaggerated for clarity. It will also be appreciated that changes can be made in the shape of the layers and regions, including their placement relative to each other, without departing from the spirit and scope of the exemplary embodiments. Accordingly, exemplary embodiments should not be construed as limited to the shapes illustrated herein, but are to include deviations in shapes that result from, for example, manufacturing. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of exemplary embodiments.

[0052] The proximity sensor includes a capacitive proximity sensor and an inductive proximity sensor. Among them, the inductive proximity sensor is a sensor based on the eddy current effect, which can non-contact measure the distance between the metal target object and the inductive proximity sensor, and has the advantages of high linearity and high resolution. The embodiments of the present disclosure mainly relate to the inductive proximity sensor, hereinafter referred to as proximity sensor.

[0053] The proximity sensor mainly comprises a high-frequency oscillation circuit and a detection circuit. The high-frequency oscillation circuit can generate an alternating magnetic field, and the core component thereof is coil 1. Specifically, when an alternating voltage U1 is applied to both ends of coil 1, an alternating current I1 flows through coil 1 to generate an alternating magnetic field H1; when the metal target object to be detected approaches the proximity sensor, according to the principle of electromagnetic induction, eddy current I2 is generated in the metal target object, and a magnetic field H2 opposite to the direction of the alternating magnetic field H1 is generated, so that part of the alternating magnetic field H1 is cancelled; at this time, coil 1 must increase the alternating current I1 flowing therethrough to maintain the alternating magnetic field H1, that is, the inductance L, impedance Z or quality factor Q of coil 1 must be changed. Therefore, in simple terms, the principle of the proximity sensor is that the change of the distance between the metal target object and coil 1 causes the change of the inductance L, impedance Z or quality factor Q of coil 1, or in other words, the change of the inductance L, impedance Z or quality factor Q of coil 1 can reflect the change of the distance between the metal target object and the proximity sensor, so in principle, by measuring the change amount of the inductance L, impedance Z or quality factor Q of coil 1, the distance between the metal target object and the proximity sensor can be obtained. Specifically, when the proximity sensor is used for measurement, the metal target object is brought close to the proximity sensor, and once the distance between the two reaches the sensing distance of the proximity sensor, an eddy current will be generated in the proximity sensor, causing the oscillation of the high-frequency oscillation circuit to attenuate and even stop; the change of the high-frequency oscillation circuit, i.e. the oscillation attenuation and stop, is detected by the detection circuit and modulated, for example, the inductance change is converted into a voltage or current signal, which is amplified and then converted into a switching signal (e.g. low level "0" or high level "1"); finally, the switching signal is output to a driving control device, which performs "on" or "off" operation according to the switching signal to achieve the purpose of non-contact detection and control. In summary, the inductive proximity sensor uses the principle of eddy current loss to control the start and stop state of the high-frequency oscillation circuit, and outputs discrete level signals to the outside.

[0054] As can be known from the principle of the inductive proximity sensor, the impedance Z, the inductance L and the quality factor Q of the coil 1 can all change to reflect the change of the measured distance, so the coil 1 is the core component of the inductive proximity sensor. Therefore, the parameters of the coil 1 are the key factors affecting the maximum detection distance of the proximity sensor, and the parameters of the coil 1 usually include but are not limited to the number of turns of the coil, the cross-sectional area of the coil, the diameter of the coil, the diameter of the coil wire, the resistance of the coil, etc. Among them, the number of turns of the coil is the most important factor affecting the inductance L. The more the number of turns, the greater the output inductance, the greater the difference in inductance between the proximity and the principle, and the detection distance of the proximity sensor will also increase accordingly. In addition, the relative position relationship, installation direction and precision between each accessory of the proximity sensor will affect the detection performance of the proximity sensor, and the accuracy of the cooperation between each accessory of the proximity sensor will also affect the stability and consistency of the proximity sensor in the production and use process. Usually, in order to determine the optimal parameters of the coil when the proximity sensor reaches the maximum detection distance, the operator often needs to debug the design parameters of the proximity sensor repeatedly several times, which is very tedious.

[0055] More specifically, the proximity sensor includes a wire leading type proximity sensor and a connector type proximity sensor. FIG. 1A is a structural schematic diagram of the wire leading type proximity sensor in the related art, and FIG. 1B is a perspective sectional view of the wire leading type proximity sensor shown in FIG. 1A. As shown in FIG. 1A and FIG. 1B, the wire leading type proximity sensor includes a coil 1, a magnetic core 2, a printed circuit board, a shell 6, a first cover 7, a second cover 8, and a cable 9. The coil 1 is combined with the magnetic core 2, and the magnetic core 2 includes the outer wall of the coil 1. The printed circuit board includes a main board 3, a first solder pad 4-1 and a second solder pad 4-2 disposed at the first end of the main board 3, and a debugging component 11 disposed on the main board 3. The second cover 8 has a through hole (not shown) for the cable 9 to pass through, the first end of the cable 9 is connected with the main board 3, and the second end is led out to the outside of the proximity sensor through the through hole formed on the second cover 8.

[0056] FIG. 1C is a structural schematic diagram of the connector type proximity sensor in the related art, and FIG. 1D is a perspective sectional view of the connector type proximity sensor shown in FIG. 1C. As shown in FIG. 1C and FIG. 1D, the connector type proximity sensor includes a coil 1, a magnetic core 2, a printed circuit board, a shell 6, a first cover 7, a second cover 8, and a connector pin 10. The coil 1 is combined with the magnetic core 2, and the magnetic core 2 includes the outer wall of the coil 1. The printed circuit board includes a main board 3, a first solder pad 4-1 and a second solder pad 4-2 disposed at the first end of the main board 3, and a debugging component 11 disposed on the main board 3. In addition, the main board 3 is also provided with a socket for connecting the first end of the connector pin 10, and the second end of the connector pin 10 is connected with the second cover 8.

[0057] In the related art, whether it is a lead-out type proximity sensor or a plug-in type proximity sensor, the length of the shell 6 is always greater than the length of the main board 3 and is sleeved outside the main board 3, so the debugging component 11 arranged on the main board 3 is always inside the shell 3. The principle of debugging the parameters of the coil 1 or other components to obtain the optimal parameters that make the proximity sensor achieve the maximum detection distance is roughly as follows: first, by adjusting various parameters of the coil 1, such as the number of turns of the coil 3, whether the wire used when winding the coil 3 is single-stranded or double-stranded, the diameter of the coil 3, etc., a plurality of coils 3 with different inductances L and impedances Z are obtained; the plurality of coils 3 with different inductances L and impedances Z are respectively connected in parallel with a plurality of capacitors with different capacitances F to form a plurality of high-frequency oscillation circuits with different characteristics; finally, the maximum distance that the proximity sensor can detect under each high-frequency oscillation circuit is tested; the maximum distance with the highest value corresponds to the optimal parameters of the high-frequency oscillation circuit. For the proximity sensor in the prior art, the above debugging process is roughly as follows: the main board 3 is sleeved in the shell 6, after assembly is completed, the debugging component 11 is adjusted multiple times, different characteristics of the high-frequency oscillation circuit are selected, the selected high-frequency oscillation circuit is tested, and the maximum distance that the proximity sensor can detect under the high-frequency oscillation circuit is obtained.

[0058] Since the debugging component 11 in the prior art is always inside the shell 6, the above existing debugging process often has the following problems: 1. Each time the debugging component 11 is adjusted, the shell 6 sleeved outside the main board 3 needs to be disassembled in advance, and after adjustment is completed, the shell 6 needs to be assembled with the main board 3 again, on the one hand, the operation is cumbersome and inconvenient, on the other hand, it is difficult to ensure that the shell 6 remains consistent during multiple assemblies, thereby affecting the debugging accuracy; 2. After debugging is completed, the shell 6 assembled with the main board 3 needs to be filled with glue to fix the main board 3, however, after the glue solidifies, if the inductance L or the impedance Z of the coil 1 changes, the debugging component 11 that has been solidified in the shell 6 cannot be adjusted at this time. In summary, the proximity sensor in the prior art has the debugging component 11 inside the shell 6, on the one hand, the debugging process is cumbersome and inconvenient, and multiple disassembly of the shell 6 can easily affect the accuracy of the debugging result; on the other hand, it cannot adjust the debugging component again after the glue solidifies, and does not have fault tolerance.

[0059] In addition, in the related art, whether it is a lead-out type proximity sensor or a connector type proximity sensor, the following problems also exist: 3. When assembling the magnetic core 2 with the coil 1 and the main board 3, attention needs to be paid to keeping the main board 3 parallel to the central axis of the shell 6, and the main board 3 is parallel to the central axis of the magnetic core 2, so as to avoid the main board 3 contacting the shell 6 during assembly, causing electrical short circuit and other defects. In the prior art, the relative position relationship between the magnetic core 2 and the main board 3 is usually calibrated by manual calibration or using a relatively complex jig, which is low in efficiency and poor in consistency; 4. The first lead end and the second lead end (not shown) of the coil 1 are connected to the first pad 4-1 and the second pad 4-2 respectively by soldering. This connection method cannot guarantee that the main board 3 and the magnetic core 2 with the coil 1 remain fixed, and in the subsequent assembly process, it is easy to cause soldering-off, fracture and other situations, thereby affecting the assembly efficiency and product yield; 5. The contact surface between the main board 3 and the magnetic core 2 is small, and after the two are connected by the colloid, it is easy to disconnect again due to the small contact surface. Even if the colloid is filled in the magnetic core 2 to reinforce the connection between the magnetic core 2 and the main board 3, but since the colloid usually needs more than 20 hours to solidify, it is difficult to guarantee that the relative position of the main board 3 and the magnetic core 2 does not change during the waiting period for the colloid to solidify. In summary, the existing proximity sensor assembly process has the problems of high operation difficulty, low efficiency and poor product consistency.

[0060] To solve at least one of the above technical problems, on the one hand, the embodiments of the present disclosure provide a proximity sensor. FIG. 2A is an exploded view of the structure of the proximity sensor provided by the embodiments of the present disclosure; FIG. 2B is a schematic view of the proximity sensor after assembly. As shown in FIG. 2A, it includes a coil 1 (not shown), a magnetic core 2, a printed circuit board, and a shell 6. The magnetic core 2 includes the outer wall of the coil 1; the printed circuit board includes a main board 3, a first pad 4-1 and a second pad 4-2 (not shown) provided at a first end of the main board 3, and a debugging component 11 provided at a second end of the main board 3; a first lead end (not shown) of the coil 1 is connected to the first pad 4-1, and a second lead end (not shown) of the coil 1 is connected to the second pad 4-2. The shell 6 is sleeved outside the printed circuit board, and the debugging component 11 is exposed outside the shell 6. For example, the debugging component 11 includes a potentiometer or a slide rheostat.

[0061] In the embodiment of the present disclosure, the debugging assembly 11 is arranged at the second end of the main plate 3 and exposed outside the shell 6, so that the debugging assembly 11 is exposed outside the shell 6. In the multiple debugging processes, it is not necessary to disassemble the shell 6 before adjusting the debugging assembly 11 each time, which improves the debugging efficiency, especially reduces the debugging work of operators in the subsequent mass production process, saves time and labor cost, avoids the problem of poor product consistency caused by multiple disassembly and installation of the shell 6, and improves the fault tolerance of the product.

[0062] In some embodiments, as shown in FIG. 3, the proximity sensor not only includes the above structure, but also includes a connecting assembly 12. FIG. 3 is a schematic view of the installation position of the connecting assembly 12.

[0063] The present disclosure provides several structural examples of the connecting assembly 12.

[0064] FIGS. 4A-4C are structural examples of a first connecting assembly 12. As shown in FIG. 4A, the connecting assembly 12 includes a first main body part 12-1 and a second connecting part 12-2. FIG. 4B is a top view of the connecting assembly 12 shown in FIG. 4A, wherein the first main body part 12-1 includes oppositely arranged first and second surfaces S1 and S2, and the first surface S1 is opposite to the magnetic core 2. FIG. 4C is a bottom view of the connecting assembly 12 shown in FIG. 4A, from which it can be seen that the second connecting part 12-2 is connected to the second surface S2, and the second connecting part 12-2 has a first limiting groove 12-3.

[0065] In some examples, the first end of the main plate 3 has a first connecting part 3-1. FIG. 5 is a schematic view of the first connecting part 3-1, which is fixed in the first limiting groove 12-3 of the connecting assembly 12 shown in FIG. 4A.

[0066] In the above example, by arranging the first limiting groove 12-3 on the second surface S2 of the connecting assembly 12, by reasonably arranging the position, shape and size of the first limiting groove 12-3, the first connecting part 3-1 of the main plate 3 is fixed in the first limiting groove 12-3, and the first connecting part 3-1 can be clamped with the first limiting groove 12-3 to realize the fixed connection of the main plate 3 and the connecting assembly 12, which is convenient for maintaining the relative position relationship between the main plate 3 and the magnetic core 2 in the subsequent assembly process, and thus the electrical short circuit defect caused by the contact between the main plate 3 and the shell 6 can be avoided, and the assembly difficulty is reduced and the assembly efficiency and precision are improved.

[0067] FIGS. 6A-6C are a second example of the structure of the connecting assembly 12. As shown in FIG. 6A, the connecting assembly 12 includes a first body part 12. The first body part 12 includes oppositely arranged first and second surfaces S1 and S2. FIG. 6B is a top view of the connecting assembly 12 shown in FIG. 6A, from which the shape of the first surface S1 opposite to the magnetic core 2 can be seen. FIG. 6C is a bottom view of the connecting assembly 12 shown in FIG. 6A, from which it can be seen that the first limiting groove 12-3 is arranged on the second surface S2 of the first body part 12.

[0068] In some examples, the first end of the main plate 3 has a first connecting part 3-1. FIG. 7 is another schematic view of the shape and position of the first connecting part 3-1, which is fixed in the first limiting groove 12-3 of the connecting assembly 12 shown in FIG. 6A. In this example, the size of the first limiting groove 12-3 is not less than the size of the first connecting part 3-1 of the main plate 3. For example, for the first connecting part 3-1 with a thickness of 0.6-0.8 mm, a length of 1.6-1.8 mm and a width of 1.4-1.6 mm, the size of the corresponding first limiting groove 12-3 can be set as follows: the depth can be 1.5-1.7 mm, and the cross-sectional size can be 0.8 mm x 1.8 mm-1 mm x 2.2 mm. Specifically, when the length of the first connecting part 3-1 is 1.8 mm, the width is 1.5 mm, and the thickness is 0.8 mm, the size of the corresponding first limiting groove 12-3 can be set as follows: the depth is 1.7 mm, and the cross-sectional size is 1 mm x 2 mm. It should be noted that the length of the first connecting part 3-1 corresponds to the depth of the first limiting groove 12-3, and the thickness and height correspond to the cross-sectional size of the first limiting groove 12-3.

[0069] In the above example, by arranging the first limiting groove 12-3 on the second surface S2 of the connecting assembly 12, and by reasonably arranging the position, shape and size of the first limiting groove 12-3, the first connecting part 3-1 of the main board 3 is fixed in the first limiting groove 12-3, so that the main board 3 can be quickly positioned and calibrated, and the relative position relationship between the main board 3 and the magnetic core 2 in the subsequent assembly process is ensured. This process does not need to use artificial or other complex jigs, so that the electrical short circuit defect caused by the contact between the main board 3 and the shell 6 can be avoided, and the assembly difficulty can be reduced and the assembly efficiency and accuracy can be improved.

[0070] In some examples, the magnetic core 2 has a second limiting groove (not shown). As shown in FIGS. 8A and 8B, the connecting assembly 12 further includes a third connecting part 13 connecting the first surface S1. The third connecting part 13 is fixed in the second limiting groove of the magnetic core 2. In this example, the size of the third connecting part 13 is smaller than the size of the second limiting groove, so as to avoid the third connecting part 13 from pressing the magnetic core 2 and causing the magnetic core 2 to crack. For example, for an M8 type proximity sensor, the diameter of the second limiting groove of the magnetic core 2 is about 1.2mm-1.4mm, and the diameter of the third connecting part 13 can be correspondingly set to 0.8mm-1mm, and the length can be set to 1.3mm-1.5mm, depending on the depth of the second limiting groove in the magnetic core 2. Specifically, when the diameter of the second limiting groove of the magnetic core 2 is 1.2mm, the diameter of the third connecting part 13 is preferably set to 0.8mm.

[0071] In the above example, by arranging the third connecting part 13 on the first surface S1 of the connecting assembly 12, the third connecting part 13 can be inserted into the second limiting groove of the magnetic core 2, so as to fix and position the magnetic core 2 and the connecting assembly 12, and to facilitate ensuring that the central axes of the magnetic core 2 and the connecting assembly 12 coincide, thereby quickly calibrating the relative position of the main board 3 and the magnetic core 2, keeping the main board 3 in a state of parallel with the central axis of the magnetic core 2, and improving the assembly efficiency and accuracy.

[0072] Further, as shown in FIGS. 8A and 8B, the third connecting part 13 includes a third main body part 13-2 and a third end part 13-1 connected with the third main body part 13-2. The third end part 13-1 includes oppositely arranged third and fourth surfaces, and a third connecting side surface connecting the third and fourth surfaces. The fourth surface is connected with the third main body part 13-2, and the area of the third surface is smaller than the area of the fourth surface. For example, the third end part 13-1 can be a frustum (e.g., a circular frustum or a prismatic frustum).

[0073] In the above example, by arranging the top of the third connecting part 13, i.e., the third end part 13-1, as a chamfer, such arrangement is more convenient for assembly, and can also avoid damage to the magnetic core 2 caused by the third connecting part 13, thereby affecting the performance of the proximity sensor.

[0074] In some examples, the connecting assembly 12 further comprises a first probe 14-1 and a second probe 14-2 connecting the second surface S2. FIG. 9A is a schematic view of the first probe 14-1 and the second probe 14-2. The first lead end and the second lead end of the coil 1 are connected to the first probe 14-1 and the second probe 14-2, respectively. FIG. 9B is a schematic view of the relative positions of the first probe 14-1 and the second probe 14-2 and the main board 3. As shown in FIG. 9B, when the first connecting portion 3-1 is fixed in the first limiting slot 12-3, the first probe 14-1 and the first pad 4-1 are opposite to each other and have a spacing therebetween, and the second probe 14-2 and the second pad 4-2 are opposite to each other and have a spacing therebetween. In some examples, the cross-sectional shape of the first probe 14-1 and the second probe 14-2 can be square or circular. For example, the cross-sectional dimension of the first probe 14-1 and the second probe 14-2 can be 0.4 mm x 0.4 mm to 0.5 mm x 0.5 mm, and the length can be 2 mm to 2.5 mm. The spacing between the first probe 14-1 and the second probe 14-2 is determined by the spacing between the first pad 4-1 and the second pad 4-2, and for example, can be 2.8 mm to 3 mm. The spacing between the first probe 14-1 and the first pad 4-1 can be 0.3 mm to 0.5 mm, and the spacing between the second probe 14-2 and the second pad 4-2 can also be 0.3 mm to 0.5 mm. Preferably, the cross-sectional shape of the first probe 14-1 and the second probe 14-2 is square, the cross-sectional dimension is 0.4 mm x 0.4 mm, the spacing between the first probe 14-1 and the second probe 14-2 is 2.8 mm, and the spacing between the first probe 14-1 and the first pad 4-1 and the spacing between the second probe 14-2 and the second pad 4-2 are both 0.5 mm. In this way, the first pad 4-1 and the second pad 4-2 can be prevented from being scratched by the first probe 14-1 and the second probe 14-2 during the process of inserting the main board 3 into the connecting assembly 12, and the electrical connection performance can be affected.

[0075] In the above examples, the first lead end and the second lead end of the coil 1 are connected to the first probe 14-1 and the second probe 14-2, respectively, and then the first probe 14-1 and the second probe 14-2 are connected to the first pad 4-1 and the second pad 4-2 of the main board 3, respectively, to achieve the connection between the coil 1 and the main board 3. Compared with the prior art in which the first lead end and the second lead end of the coil 1 are connected to the first pad 4-1 and the second pad 4-2 by soldering, respectively, the above-mentioned connection method can prevent the coil 1 and the main board 3 from being broken during assembly, which can cause the high-frequency oscillation circuit to fail.

[0076] As shown in FIG. 6A, in some examples, the magnetic core 2 has a first accommodating portion 2-1 and a second accommodating portion (not shown). As shown in FIGS. 4A-4C and FIGS. 6A-6C, the first body portion 12 further has a first connecting side surface connecting the first surface S1 and the second surface S2; the first connecting side surface has a third accommodating portion 12-4 and a fourth accommodating portion 12-5. The first lead end of the coil 1 extends to and is connected to the first pad 4-1 via the first accommodating portion 2-1 and the third accommodating portion 12-4; the second lead end of the coil 1 extends to and is connected to the second pad 4-2 via the second accommodating portion and the fourth accommodating portion 12-5.

[0077] In some examples, the first surface S1 is connected to the magnetic core 2 by a colloid; and the orthographic projection of the first surface S1 on the magnetic core 2 is located within the magnetic core 2, i.e., the area of the first surface S1 of the connecting assembly 12 is smaller than the area of the magnetic core 2 to which the first surface S1 is fitted. For example, for an M8 type proximity sensor, the cross-sectional diameter of the magnetic core 2 is 5.1 mm-5.3 mm, and the diameter of the first surface S1 of the connecting assembly 12 can be set to 4.8 mm-5 mm; specifically, for a magnetic core 2 with a cross-sectional diameter of 5.3 mm, the diameter of the first surface S1 of the connecting assembly 12 can be set to 5 mm, so as to avoid affecting the subsequent potting operation of the magnetic core 2. The depth of the third accommodating portion 12-4 is not less than the depth of the first accommodating portion 2-1, and the depth of the fourth accommodating portion 12-5 is not less than the depth of the second accommodating portion. For example, for an M8 type proximity sensor, the depth of the first accommodating portion 2-1 and the second accommodating portion is 0.5 mm-0.7 mm, and in the present example, the depth of the third accommodating portion 12-4 and the fourth accommodating portion 12-5 can be set to 0.7 mm-0.9 mm; specifically, when the depth of the first accommodating portion 2-1 and the second accommodating portion is 0.7 mm, the depth of the third accommodating portion 12-4 and the fifth accommodating portion 12-5 is preferably set to 0.9 mm, so as to avoid the first lead end of the coil 1 being bent and cut off at the junction of the first accommodating portion 2-1 and the third accommodating portion 12-4, and the second lead end being bent and cut off at the junction of the second accommodating portion and the fourth accommodating portion 12-5, affecting the electrical performance of the high-frequency oscillation circuit.

[0078] Continuing to refer to FIG. 6B, in some examples, the third accommodating portion 12-4 has a third bottom opposite the opening thereof, and a first connecting surface 14 and a second connecting surface 15 connected to the first connecting side surface; the fourth accommodating portion 12-5 has a fourth bottom opposite the opening thereof, and a third connecting surface 16 and a fourth connecting surface 17 connected to the first connecting side surface. At least one of the third bottom, the fourth bottom, the first connecting surface 14, the second connecting surface 15, the third connecting surface 16, and the fourth connecting surface 17 is an arc surface. In this way, the first lead end and the second lead end of the coil can be prevented from being bent and cut off due to contact with a sharp point, causing the high-frequency oscillation circuit to fail.

[0079] In some examples, the proximity sensor in the embodiments of the present disclosure can be a wire leading out type proximity sensor. Referring to FIGS. 2A and 2B, the proximity sensor includes not only the above-described structure, but also a cable 9, a first cover 7 and a second cover 8. The first end of the cable 9 is connected to the main plate 3. The magnetic core 2 is located in the first cover 7, and the second end of the main plate 3 is located in the second cover 8. The second cover 8 has a through hole, and the second end of the cable 9 extends to the outside of the proximity sensor through the through hole. Specifically, in this example, for the M8 type proximity sensor, the length of the shell can be set to 38-40 mm, and the material can be stainless steel, brass nickel plating, or zinc nickel plating, etc. Preferably, the shell length is 38 mm, and the material is stainless steel, which can be processed by a CNC lathe. The size parameters and position settings of the main plate 3 and the shell 6 can be as shown in FIGS. 10A and 10B. Specifically, for the M8 type proximity sensor, the length of the main plate 3 is a ∈ [38, 40] mm, and the width matches the diameter of the shell 6, for example, it can be set to b ∈ [3.8, 4] mm; the length of the first connecting part 3-1 is c ∈ [1.4, 1.5] mm; preferably, the length of the main plate 3 is a 38 mm, the width is b 4 mm, and the length of the first connecting part 3-1 is c 1.5 mm. The size of the debugging assembly 11 is about 2.8 mm x 1.8 mm x 1.2 mm-3 mm x 2 mm x 1.2 mm, and the rightmost end of the debugging assembly 11 can have a certain interval with the rightmost end of the main plate 3, for example, the interval can be d ∈ [0.4, 0.5] mm; wherein, the second end of the main plate 3 is about e ∈ [2.7, 3] mm longer than the length of the shell 6; preferably, the size of the debugging assembly 11 is 3 mm x 2 mm x 1.2 mm, the interval d between the rightmost end of the debugging assembly 11 and the rightmost end of the main plate 3 is 0.5 mm, and the length e of the second end of the main plate 3 is about 2.7 mm longer than the second end of the shell 6. The processing method of the main plate 3 can adopt SMT, which is not limited here. FIG. 10C is an example of the second cover 8, wherein the second cover 8 has an inner groove for accommodating the second end of the main plate 3, the length of the inner groove is f, the diameter of the inner groove is g, and the difference between the inner diameter and the outer diameter of the second cover 8 is h. The above parameters should satisfy: f > e, that is, the length of the inner groove is greater than the length of the second end of the main plate 3 which exceeds the length of the shell 6; g > b, that is, the diameter of the inner groove is greater than the width of the main plate 3; in order to ensure that the second cover 8 has a certain strength, preferably, the difference h between the inner diameter and the outer diameter of the second cover 8 is h ≥ 0.8 mm. Preferably, the second cover 8 is preferably made of semi-transparent PC material, so that the change of the indicator light located at the second end of the proximity sensor can be observed, and the processing method of the second cover 8 can be injection molding, which is not limited here.

[0080] For the wire leading out type proximity sensor described in the above example, the assembly process generally includes:

[0081] Step S101, winding the enameled wire on the coil framework to form a coil 1, and assembling the coil 1 with a magnetic core 2 to form the magnetic core 2 provided with the coil 1.

[0082] Step S102, coating the first surface S1 of the connecting assembly 12 with glue, and embedding the third connecting part 13 of the connecting assembly 12 into the second limiting groove of the magnetic core 2 to fix the connecting assembly 12 and the magnetic core 2.

[0083] Step S103, embedding the first connecting part 3-1 of the main board 3 into the first limiting groove 12-3 of the connecting assembly 12 to fix the main board 3 and the connecting assembly 12.

[0084] Step S104, welding the first lead end of the coil 1 with the first probe 14-1 via the first accommodating part 2-1 and the third accommodating part 12-4, welding the second lead end of the coil 1 with the second probe 14-2 via the second accommodating part and the fourth accommodating part 12-5, and welding the first probe 14-1 and the second probe 14-2 with the first pad 4-1 and the second pad 4-2 respectively to electrically connect the coil 1 and the main board 3.

[0085] Step S105, assembling the magnetic core 2 provided with the coil 1 with the first cover 7, and further installing the first cover 7 on the first end of the shell 6; it should be understood by those skilled in the art that the main board 3 is sleeved in the shell 6.

[0086] Step S106, first adjusting the debugging assembly 11 located at the second end of the main board 3 and exposed outside the shell 6 to obtain the optimal parameters of the proximity sensor reaching the maximum detection distance.

[0087] Step S107, filling the glue in the first cover 7 and the shell 6, and waiting for the glue to solidify.

[0088] Step S108, after the glue solidifies, if the parameters of the coil 1 change, second adjusting the debugging assembly 11 to re-obtain the optimal parameters of the proximity sensor reaching the maximum detection distance.

[0089] Step S109, embedding the second end of the main board 3 into the second cover 8, extending the cable 9 welded on the main board 3 to the outside of the proximity sensor through the through hole of the second cover 8, filling the glue in the second cover 8, and installing the second cover 8 on the second end of the shell 6, and waiting for the glue to solidify.

[0090] In some examples, the proximity sensor in the embodiments of the present disclosure can be a connector type proximity sensor. The proximity sensor not only includes the above structure, but also includes a first circuit board 3-2 and a second circuit board 3-3, as shown in FIGS. 11A-11D. The second end of the first circuit board 3-2 and the first end of the second circuit board 3-3 are connected and located in the shell 6. The second end of the second circuit board 3-3 is exposed outside the shell 6, and the debugging component 11 is arranged at the second end of the second circuit board 3-3. Further, in some examples, the proximity sensor further includes a first cover 7, a second cover 8, and a socket 20 at the second end of the second circuit board 3-3. The second cover 8 has a pin 10. The magnetic core 2 is located in the first cover 7, the second end of the second circuit board 3-3 is located in the second cover 8, and the socket 20 is connected with the pin 10. Specifically, in this example, for an M8 type proximity sensor, the length of the shell 6 can be set to 52-54 mm, and the material can be stainless steel, brass nickel plating, or zinc nickel plating, preferably stainless steel, formed by a CNC lathe process, which is not limited here. Referring to FIG. 11C, the length of the first circuit board 3-2 is A, the width of the connection area of the second circuit board 3-3 is B, and the length of the first connecting part 3-1 is C. Optionally, A ∈ [52, 54] mm, D ∈ [5.0, 5.2] mm; the length of the first connecting part 3-1 can be set according to the length of the first limiting groove of the magnetic core 2, for example, for an M8 type proximity sensor, C ∈ [1.4, 1.5] mm; the processing method of the first circuit board 3-2 is selected by SMT process, which is not limited here. Specifically, the length A of the first circuit board 3-2 can be 54 mm, the width B of the connection area of the first circuit board 3-2 can be 5.2 mm, and the length C of the first connecting part 3-1 can be 1.5 mm. The second circuit board 3-3 is selected to be a flexible circuit board that can be bent, so that it can be stretched to the outside of the shell 6 during the adjustment of the debugging component 11 for debugging, as shown in FIG. 11D. The second circuit board 3-3 has a reserved position for the debugging component 11, an indicator light (not shown), and the socket 20, with a length D, a thickness H, a width E of the connection area with the first circuit board 3-2, a width F of the bending area, and a distance G between the debugging component 11 and the rightmost end of the second circuit board 3-3. For an M8 type proximity sensor, the above parameters can be set in the following ranges: D ∈ [35, 37] mm, E ∈ [5.0, 5.2] mm, F ∈ [3.8, 4] mm, G ∈ [7.4, 7.5] mm, H ∈ [0.18, 0.2] mm. Specifically, the parameters of the second circuit board 3-3 can be set as follows: the length D is 37 mm, the width E of the connection area is 5.2 mm (the same as the width B of the connection area of the first circuit board 3-2), the width F of the bending area is 4 mm, the distance G between the rightmost end of the debugging component 11 and the rightmost end of the second circuit board 3-3 is 7.5 mm, and the thickness H of the second circuit board 3-3 is 0.2 mm.After the plug-in type proximity sensor is assembled as shown in FIG. 11A, the debugging component 11 is exposed outside the shell 6.

[0091] For the plug-in type proximity sensor described in the above example, the assembly process generally includes:

[0092] Step S201, winding the enameled wire on the coil former to form the coil 1, and assembling the coil 1 with the magnetic core 2 to form the magnetic core 2 assembled with the coil 1.

[0093] Step S202, coating the colloid on the first surface S1 of the connecting component 12, and embedding the third connecting part 13 of the connecting component 12 into the second limiting groove of the magnetic core 2 to fixedly connect the connecting component 12 and the magnetic core 2.

[0094] Step S203, embedding the first connecting part 3-1 of the first circuit board 3-2 into the first limiting groove 12-3 of the connecting component 12 to fixedly connect the first circuit board 3-2 and the connecting component 12, and bindingly connecting the second end of the first circuit board 3-2 with the first end of the second circuit board 3-3, and welding the jack 20 on the second end of the second circuit board 3-3.

[0095] Step S204, welding the first lead end of the coil 1 with the first probe 14-1 via the first accommodating part and the third accommodating part 12-4, and welding the second lead end of the coil 1 with the second probe 14-2 via the second accommodating part and the fourth accommodating part 12-5, and welding the first probe 14-1 and the second probe 14-2 with the first solder pad 4-1 and the second solder pad 4-2 respectively to electrically connect the coil 1 and the main board 3.

[0096] Step S205, assembling the magnetic core 2 assembled with the coil 1 with the first cover 7, and further installing the first cover 7 on the first end of the shell 6, and those skilled in the art should understand that the main board 3 is sleeved in the shell 6.

[0097] Step S206, first adjusting the debugging component 11 located at the second end of the second circuit board 3-3 and exposed outside the shell 6 to obtain the optimal parameters of the proximity sensor reaching the maximum detection distance.

[0098] Step S207, filling the colloid in the first cover 7 and the shell 6, and waiting for the colloid to solidify.

[0099] Step S208, after the colloid is solidified, if the parameters of the coil 1 change, the debugging component 11 is adjusted for the second time to re-obtain the optimal parameters of the proximity sensor reaching the maximum detection distance.

[0100] Step S209, the pin 10 on the second cover 8 is inserted into the socket of the second circuit board 3-3; after the second circuit board 3-3 is bent towards the inside of the shell 6, the glue is filled in the second cover 8, and the second cover 8 is installed on the second end of the shell 6, and waits for the glue to solidify.

[0101] In a second aspect, the disclosure provides an electronic device comprising the proximity sensor of any of the examples of the first aspect.

[0102] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present application, and these modifications and improvements are also considered to be within the protection scope of the present application.

Claims

1. A proximity sensor comprising a coil, a magnetic core, a printed wiring board, a housing; wherein, The magnetic core comprises the coil outer wall, the printed circuit board comprises a main plate, a first pad and a second pad arranged at a first end of the main plate, and a debugging component arranged at a second end of the main plate; The first lead end of the coil is connected with the first pad, and the second lead end of the coil is connected with the second pad; The shell sleeve is arranged outside the printed circuit board, and the debugging component is exposed outside the shell.

2. The proximity sensor of claim 1, wherein, The first end of the main plate has a first connecting part; The proximity sensor further comprises a connecting component, the connecting component comprises a first body part and a second connecting part; wherein the first body part comprises a first surface and a second surface arranged oppositely; the first surface is opposite to the magnetic core, the second connecting part is connected with the second surface, and the second connecting part has a first limiting groove; The first connecting part is fixed in the first limiting groove.

3. The proximity sensor of claim 1, wherein, The first end of the main plate has a first connecting part; The proximity sensor further comprises a connecting component, the connecting component comprises a first body part; the first body part comprises a first surface and a second surface arranged oppositely; the first surface is opposite to the magnetic core; a first limiting groove is arranged on the second surface side of the first body part; The first connecting part is fixed in the first limiting groove.

4. The proximity sensor of claim 2 or 3, wherein, The magnetic core has a second limiting groove; The connecting component further comprises a third connecting part connected with the first surface; The third connecting part is fixed in the second limiting groove.

5. The proximity sensor of claim 4, wherein, The third connecting part comprises a third body part and a third end part connected with the third body part; The third end part comprises a third surface and a fourth surface arranged oppositely, and a third connecting side surface connecting the third surface and the fourth surface; The fourth surface is connected with the third body part, and the area of the third surface is smaller than the area of the fourth surface.

6. The proximity sensor of claim 2 or 3, wherein, The connecting component further comprises a first probe and a second probe connected with the second surface; The first lead end and the second lead end of the coil are connected with the first probe and the second probe respectively.

7. The proximity sensor of claim 6, wherein, When the first connecting part is fixed in the first limiting groove, the first probe is opposite to the first pad, and there is a gap between the first probe and the first pad; the second probe is opposite to the second pad, and there is a gap between the second probe and the second pad.

8. The proximity sensor of claim 2 or 3, wherein, The magnetic core has a first accommodating part and a second accommodating part; The first body part further has a first connecting side surface connecting the first surface and the second surface; the first connecting side surface has a third accommodating part and a fourth accommodating part; The first lead end of the coil extends to the first pad and is connected with the first pad via the first accommodating part and the third accommodating part; The second lead end of the coil extends to the second pad and is connected with the second pad via the second accommodating part and the fourth accommodating part.

9. The proximity sensor of claim 8, wherein, The normal projection of the first surface on the magnetic core is located in the magnetic core; The depth of the third accommodating part is not less than the depth of the first accommodating part, and the depth of the fourth accommodating part is not less than the depth of the second accommodating part.

10. The proximity sensor of claim 8, wherein, The third accommodating portion has a third bottom opposite to the opening thereof, and a first connecting surface and a second connecting surface connected with the first connecting side surface; and the fourth accommodating portion has a fourth bottom opposite to the opening thereof, and a third connecting surface and a fourth connecting side surface connected with the first connecting side surface. At least one of the third bottom, the fourth bottom, the first connecting surface, the second connecting surface, the third connecting surface and the fourth connecting surface is an arc surface.

11. The proximity sensor of claim 2 or 3, wherein, The first surface and the magnetic core are connected by a colloid.

12. The proximity sensor of claim 1, wherein, The proximity sensor further comprises a cable, a first cover and a second cover. The first end of the cable is connected with the main board; the magnetic core is located in the first cover, and the second end of the main board is located in the second cover. The second cover has a through hole, and the second end of the cable extends to the outside of the proximity sensor through the through hole.

13. The proximity sensor of claim 1, wherein, The main board comprises a first circuit board and a second circuit board. The second end of the first circuit board and the first end of the second circuit board are connected and located in the shell. The second end of the second circuit board is exposed outside the shell, and the debugging component is arranged at the second end of the second circuit board.

14. The proximity sensor of claim 13, wherein, The proximity sensor further comprises a first cover, a second cover and a socket at the second end of the second circuit board. The second cover has a pin. The magnetic core is located in the first cover, the second end of the second circuit board is located in the second cover, and the socket is connected with the pin.

15. The proximity sensor of claim 12 or 14, wherein, The first cover and the shell are filled with a colloid.

16. The proximity sensor of claim 1, wherein, The debugging component comprises a potentiometer or a slide rheostat.

17. An electronic device comprising the proximity sensor of any one of claims 1-16.

Images