Processing system and processing method

Abstract

A processing system for processing a plurality of dies, the processing system including a transfer device including a transfer component for transferring a plurality of the dies held by a first object to a second object, and a conveying device for conveying a cleaning tool for cleaning die holding surfaces in the transfer component.

Description

Processing system and processing method

[0001] The present disclosure relates to a processing system and a processing method.

[0002] Patent Document 1 discloses a die bonding equipment having a die bonding module that picks up a die from a die stage and bonds it to a substrate.

[0003] Japanese Patent Application Laid-Open No. 2023-098635

[0004] The technology according to the present disclosure efficiently cleans the holding surfaces of transfer components used when transferring multiple dies to a target body.

[0005] One aspect of the present disclosure is a processing system for processing multiple dies, comprising a transfer device having transfer parts for transferring the multiple dies held on a first object to a second object, and a transport device for transporting a cleaning tool for cleaning the holding surface of the dies on the transfer parts.

[0006] According to the present disclosure, it is possible to efficiently clean the holding surface of a transfer component used when transferring a plurality of dies to a target body.

[0007] 1 is a side view showing the outline of the configuration of a wafer on which a plurality of dies are mounted; FIG. 2 is a side view showing the outline of the configuration of a dicing tape and a dicing frame that hold a plurality of dies; FIG. 3 is a side view showing the outline of the configuration of a carrier that holds a plurality of dies; FIG. 4 is a plan view showing the outline of the configuration of a processing system; FIG. 5 is a perspective view showing the outline of the configuration of a die placement apparatus; FIG. 6 is a side view showing the outline of the configuration of a portion of the die placement apparatus; FIG. 7 is a perspective view showing the outline of the configuration of a release section of the die placement apparatus; FIG. 8 is a perspective view showing the outline of the configuration of a collet section of the die placement apparatus; FIG. 9 is a perspective view showing the outline of the configuration of a die bonding apparatus; FIG. 10 is a side view showing the outline of the configuration of a portion of the die bonding apparatus; FIG. 11 is a perspective view showing the outline of the configuration of a release section of the die bonding apparatus; FIG. 12 is a perspective view showing the outline of the configuration of a collet section and a head section of the die bonding apparatus; FIG. 13 is an explanatory diagram schematically showing some steps in a die-on wafer manufacturing process; FIG. 14 is a side view showing the outline of the configuration of a transfer arm; FIG. 15 is a side view showing the outline of the configuration of a transfer arm; FIG. 16 is a plan view showing the outline of the configuration of a first surface of the transfer arm; FIG. 17 is a plan view showing the outline of the configuration of a second surface of the transfer arm; FIG. 18 is a plan view showing the outline of the configuration of a support wafer on which a plurality of release sections and collet sections are supported; and FIG. 19 is a plan view showing the outline of the configuration of a cleaning tool. Fig. 1 is an explanatory view showing a state in which a transport arm holds a cleaning tool; Fig. 2 is an explanatory view showing a state in which a cleaning tool held by a transport arm cleans a holding surface of a chuck; Fig. 3 is a plan view showing an outline of a configuration of a cleaning tool according to another embodiment; Fig. 4 is a plan view showing an outline of a configuration of a cleaning tool according to another embodiment.

[0008] Hereinafter, a processing system and a processing method according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0009] In this embodiment, a die-on process is performed to mount a plurality of dies D on a wafer W as shown in Fig. 1. Specifically, first, a plurality of dies D held on a dicing tape T as shown in Fig. 2 are placed on a carrier C as shown in Fig. 3. Next, the plurality of dies D placed on the carrier C are bonded to the wafer W to be mounted.

[0010] 1 to 3, the die D has a configuration in which, for example, a silicon layer S and a device layer E are stacked. A circuit is formed in the device layer E. Note that the surface of the die D on which the device layer E is formed is referred to as the front surface Da, and the surface opposite to the front surface Da is referred to as the back surface Db.

[0011] As shown in Fig. 1, the wafer W on which the die D is mounted is a semiconductor wafer such as a silicon substrate or a glass substrate used in the manufacturing process of semiconductor devices. For example, the diameter of the wafer W is 300 mm and the thickness is approximately 800 µm. The surface of the wafer W on which the die D is mounted is referred to as the front surface Wa, and the surface opposite to the front surface Wa is referred to as the back surface Wb. The device layer E on the front surface Da side of the die D is bonded to the front surface Wa.

[0012] The number and arrangement of the dies D mounted on the front surface Wa of the wafer W are set to a desired pattern. A device layer (not shown) may be formed on the front surface Wa. The device layer is formed to correspond to the device layer E of the die D.

[0013] 2, the dicing frame F has an annular shape, and the dicing tape T is fixed to the back surface of the dicing frame F. The surface of the dicing tape T is adhesive, and multiple dies D are held on the surface (adhesive surface) of the dicing tape T. The dicing tape T holds the silicon layer S on the back surface Db side of the dies D.

[0014] 3, the carrier C has an upper surface that is an adsorption surface for electrostatically and vacuum-adsorbing and holding a plurality of dies D. The carrier C adsorbs and holds the silicon layer S on the back surface Db side of the die D. The carrier C has a configuration in which a substrate M and a holding layer N are stacked.

[0015] The substrate M has approximately the same diameter and thickness as the wafer W on which the die D is to be mounted, for example, a diameter of 300 mm and a thickness of approximately 800 μm. The substrate M is made of any conductive material, such as silicon, aluminum, an aluminum alloy, stainless steel, alumina, zirconia, SiC, or titanium. In other words, a silicon substrate may be used as the substrate M. The substrate M may also be made of approximately the same diameter as the wafer W on which the die D is to be mounted, but with a thickness different from that of the wafer W (for example, 500 μm to 1000 μm).

[0016] The substrate M has a plurality of through holes H formed therethrough in the thickness direction. The plurality of through holes H can be formed at any position on the suction surface of the carrier C. For example, the plurality of through holes H may be formed one for each of the plurality of dies D held by the carrier C, in other words, the same number as the plurality of dies D held by the carrier C. Furthermore, for example, the plurality of through holes H may be formed in a number corresponding to each of the plurality of dies D held by the carrier C, in other words, a number greater than the plurality of dies D held by the carrier C.

[0017] Furthermore, the number, size, spacing, and arrangement of the through holes H are not particularly limited, but it is desirable to determine the number, size, and spacing so as to ensure the strength (rigidity) to prevent deformation such as bending of the carrier C. For example, the diameter of the through holes H is 0.5 mm to 5.0 mm, and the spacing (the center-to-center distance between adjacent through holes H) is 0.5 mm to 5.0 mm.

[0018] The retaining layer N is a layer formed on the surface of the substrate M, and constitutes an adsorption surface for the die D on the carrier C. The retaining layer N does not have through holes formed therein, and covers the surface of the substrate M. The thickness of the retaining layer N is such that the die D can be held on the carrier C by electrostatic adsorption, for example, several tens of μm.

[0019] The retaining layer N is made of a material that is thermoplastic, flexible, and insulating, such as polyimide or EVA (ethylene-vinyl acetate copolymer). In this embodiment, "the retaining layer N is thermoplastic" means that it flows, softens, and can be reshaped at a predetermined temperature, for example, 80°C. Furthermore, "the retaining layer N is flexible" means that the elastic modulus of the retaining layer N on the substrate M is 2 GPa or less, preferably 0.5 GPa or less. Furthermore, "the retaining layer N is insulating" means that the dielectric breakdown voltage of the retaining layer N on the substrate M is 30 kV or more, preferably 40 kV or more.

[0020] The carrier C in this embodiment is configured as described above, and generates an electrostatic (Coulomb) force between the carrier C and the die D, thereby attracting and holding the die D on the attracting surface.

[0021] Furthermore, in the carrier C of this embodiment, the holding layer N is formed of a flexible material with a small elastic modulus. After the die D is placed on the carrier C, a gap is formed between the die D and the holding layer N before the die D is attracted and held by electrostatic force. Due to the flexibility of the holding layer N, when the die D is attracted to the holding layer N by electrostatic force, air is released from between the die D and the holding layer N due to the force of attraction of the die D to the holding layer N, and a pseudo-vacuum state is formed between the die D and the holding layer N. As a result, in addition to electrostatic attraction due to electrostatic force, a vacuum attraction force formed by the pseudo-vacuum state is generated between the carrier C and the die D, and a strong holding state is formed using both the electrostatic attraction force and the vacuum attraction force.

[0022] The method of holding the die D by the carrier C is not limited to this embodiment. For example, the die D may be pressed against the carrier C to be pressure-bonded. In this case, by pressing the die D against the carrier C, air is removed from between the die D and the holding layer N, and a vacuum suction force is generated between the die D and the holding layer N, resulting in the die D being adsorbed and held by the carrier C. When pressing the die D against the carrier C, the holding layer N may be heated. In this case, since the holding layer N has thermoplasticity, the holding layer N softens, making it easier for the die D to be adsorbed and held by the carrier C. The material of the substrate M in the carrier C does not need to be conductive and is optional. The material of the holding layer N also need only be thermoplastic and flexible, and does not need to be insulating and is optional.

[0023] Furthermore, for example, an adhesive sheet may be used for the holding layer N of the carrier C. In such a case, adhesive force is generated between the die D and the holding layer N, and the die D is held on the carrier C. A thermal release sheet may also be used for the holding layer N. The thermal release sheet is a sheet that has adhesive force at room temperature but is released when heated. As will be described later, when the die D is bonded to the wafer W, the die D is released from the carrier C, and at this time, heating the holding layer N can make it easier to release the die D.

[0024] Next, the processing system 1 according to this embodiment will be described. FIG. 4 is a plan view showing the outline of the configuration of the processing system 1.

[0025] 4, the processing system 1 includes a first processing system 2 and a second processing system 3. In the first processing system 2, a plurality of dies D held on a dicing tape T is placed on a carrier C, and the carrier C for holding the plurality of dies D is prepared. In the second processing system 3, the plurality of dies D held on the carrier C prepared in the first processing system 2 is bonded to a wafer W for mounting.

[0026] The first processing system 2 has a configuration in which a carry-in / out station 10 and a processing station 11 are integrally connected. In the carry-in / out station 10, for example, FOUPs Ff, Fc, each capable of accommodating a plurality of dicing frames F and a plurality of carriers C, are carried in and out between the station 10 and the outside. The processing station 11 is equipped with processing equipment for implementing the processing described below.

[0027] The loading / unloading station 10 is provided with a FOUP mounting table 20. In the illustrated example, a plurality of FOUPs, for example, two FOUPs Ff and two FOUPs Fc, are placed on the FOUP mounting table 20, aligned in a line in the Y-axis direction. Note that the number and arrangement of FOUPs Ff and Fc placed on the FOUP mounting table 20 are not limited to those in this embodiment and can be determined arbitrarily.

[0028] A transfer device 30 is provided adjacent to the FOUP mounting table 20 on the positive side of the X-axis. The transfer device 30 is configured to be movable on a transfer path 31 extending in the Y-axis direction. The transfer device 30 also has, for example, two transfer arms 32 that hold and transfer the dicing frame F and carrier C. Each transfer arm 32 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. Note that the configuration of the transfer arms 32 is not limited to this embodiment and may have any configuration. The transfer device 30 is configured to be able to transfer the dicing frame F and carrier C to the FOUPs Ff, Fc on the FOUP mounting table 20, a transition device 50 (described later), and a buffer device 51 (described later).

[0029] The processing station 11 is provided with a conveying device 40, a transition device 50, a buffer device 51, and a die placement device 60 as a transfer device. The number and arrangement of these various processing devices are not limited to this embodiment and can be determined arbitrarily.

[0030] The transfer device 40 has, for example, two transfer arms 41 that hold and transfer the dicing frame F and the carrier C, and a rotating table 42 that rotatably supports the transfer arms 41. Each transfer arm 41 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. The transfer device 40 is configured to be able to transfer the dicing frame F and the carrier C to the transition device 50, the buffer device 51, and the die placement device 60.

[0031] The transition device 50 and the buffer device 51 are disposed on the negative side of the X-axis of the transport device 40. The transition device 50 and the buffer device 51 are stacked in this order vertically from the top. Note that a plurality of buffer devices 51 may be stacked.

[0032] The transition device 50 transfers the dicing frame F and the carrier C between the transfer device 30 and the transfer device 40. The buffer device 51 temporarily stores the dicing frame F and the carrier C.

[0033] One die placement device 60 is disposed in the positive direction of the Y-axis of the transport device 40, and another is disposed in the negative direction of the Y-axis of the transport device 40. The die placement device 60 has a chamber 61. A shutter 62 is provided on the side of the chamber 61 facing the transport device 40 to open and close the loading and unloading ports for the dicing frame F and the carrier C. Inside the chamber 61, multiple dies D held by a dicing tape T are placed on the carrier C. In the die placement device 60, the dicing frame F and dicing tape T correspond to the first object in this disclosure, and the carrier C corresponds to the second object in this disclosure. The configuration of the die placement device 60 will be described later.

[0034] The second processing system 3 has a configuration in which a load / unload station 70 and a processing station 71 are integrally connected. In the load / unload station 70, for example, FOUPs Fc and Fw, each capable of accommodating a plurality of carriers C and a plurality of wafers W, are loaded and unloaded between the load / unload station 70 and the outside. The processing station 71 is equipped with processing devices for performing the processes described below.

[0035] The loading / unloading station 70 is provided with a FOUP mounting table 80. In the illustrated example, a plurality of FOUPs, for example, two FOUPs Fc and two FOUPs Fw, are placed on the FOUP mounting table 80, aligned in a line in the Y-axis direction. Note that the number and arrangement of FOUPs Fc and Fw placed on the FOUP mounting table 80 are not limited to those in this embodiment and can be determined arbitrarily.

[0036] A transfer device 90 is provided adjacent to the FOUP mounting table 80 on the positive side of the X-axis. The transfer device 90 is configured to be movable on a transfer path 91 extending in the Y-axis direction. The transfer device 90 also has, for example, two transfer arms 92 for holding and transferring the carriers C and wafers W. Each transfer arm 92 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. Note that the configuration of the transfer arms 92 is not limited to this embodiment and may have any configuration. The transfer device 90 is configured to be able to transfer the carriers C and wafers W to the FOUPs Fc and Fw on the FOUP mounting table 80, a transition device 110 (described later), and a buffer device 111 (described later).

[0037] The processing station 11 is provided with a transport device 100, a transition device 110, a buffer device 111, and a die bonding device (die bonding device) 120 as a transfer device. The number and arrangement of these various processing devices are not limited to this embodiment and can be determined arbitrarily.

[0038] The transfer device 100 has, for example, two transfer arms 101 that hold and transfer the carriers C and wafers W, and a rotary table 102 that rotatably supports the transfer arms 101. Each transfer arm 101 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. The transfer device 100 is configured to be able to transfer the carriers C and wafers W to the transition device 110, the buffer device 111, and the die bonding device 120.

[0039] The transition device 110 and the buffer device 111 are disposed on the negative side of the X-axis of the transport device 100. The transition device 110 and the buffer device 111 are stacked in this order vertically from the top. Note that a plurality of buffer devices 111 may be stacked.

[0040] The transition device 110 transfers the carriers C and wafers W between the transfer device 90 and the transfer device 100. The buffer device 111 temporarily stores the carriers C and wafers W.

[0041] Two die bonding devices 120 are arranged in the positive direction of the Y axis of the transfer device 100, and two are arranged in the negative direction of the Y axis of the transfer device 100. The die bonding device 120 has a chamber 121. A shutter 122 for opening and closing a loading / unloading port for the carrier C and the wafer W is provided on the side of the chamber 121 facing the transfer device 100. Inside the chamber 121, multiple dies D held in the carrier C are bonded to the wafer W. In the die bonding device 120, the carrier C corresponds to a first object in this disclosure, and the wafer W corresponds to a second object in this disclosure. The configuration of the die bonding device 120 will be described later.

[0042] The above-described processing system 1 (first processing system 2 and second processing system 3) is provided with at least one control device 130. The control device 130 processes computer-executable instructions that cause the processing system 1 to perform the various processes described in this disclosure. The control device 130 may be configured to control each element of the processing system 1 to perform the various processes described herein. In one embodiment, some or all of the control device 130 may be included in the processing system 1. The control device 130 may include a processing unit, a storage unit, and a communication interface. The control device 130 is implemented, for example, by a computer. The processing unit may be configured to read from the storage unit a program that provides logic or routines that enable various control operations and execute the read program to perform various control operations. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processing unit for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the processing system 1 via a communication line such as a LAN (Local Area Network).

[0043] Although the processing system 1 according to this embodiment is configured as described above, the configuration of the processing system 1 is not limited to this. For example, the first processing system 2 and the second processing system 3 may be combined into an integrated configuration. Furthermore, for example, each of the first processing system 2 and the second processing system 3 may further include other processing devices depending on the purpose.

[0044] For example, the first processing system 2 may be provided with a die cleaning device that cleans the surface Da of the die D held on the dicing tape T. The cleaning method in the die cleaning device is arbitrary, but a cleaning liquid may be supplied to the surface Da, or ultraviolet light may be irradiated onto the surface Da.

[0045] For example, the second processing system 3 may be provided with a die cleaning device that cleans the surface Da of the die D held in the carrier C, and a wafer cleaning device that cleans the surface Wa of the wafer W. The cleaning methods used in these die cleaning devices and wafer cleaning devices are arbitrary, and may include supplying a cleaning liquid to the surfaces Da and Wa, or irradiating the surfaces Da and Wa with ultraviolet light.

[0046] For example, the second processing system 3 may be provided with a die modification device, a wafer modification device, a die hydrophilization device, and a wafer hydrophilization device. The wafer modification device and the die modification device use plasma to modify the surface Da of the die D held on the carrier C and the surface Wa of the wafer W, respectively. The die hydrophilization device and the wafer hydrophilization device supply pure water to the surface Da of the die D held on the carrier C and the surface Wa of the wafer W, respectively, to hydrophilize the surfaces Da and Wa. By modifying the surfaces Da and Wa, van der Waals forces (intermolecular forces) are generated between the surfaces Da and Wa when the die D is bonded to the wafer W, thereby bonding the surfaces Da and Wa together. Furthermore, by hydrophilizing the surfaces Da and Wa, hydrophilic groups between the surfaces Da and Wa form hydrogen bonds (intermolecular forces), thereby firmly bonding the surfaces Wa and Da together.

[0047] Furthermore, for example, the second processing system 3 may be provided with an inspection device that inspects the wafer W on which the die D is mounted. The inspection device takes an image of the wafer W using, for example, an IR camera, and inspects for the presence or absence of voids between the surface Wa of the wafer W and the die D.

[0048] Next, a description will be given of the configuration of the die placement apparatus 60. Fig. 5 is a perspective view showing an outline of the configuration of the die placement apparatus 60. Fig. 6 is a side view showing an outline of a portion of the configuration of the die placement apparatus 60.

[0049] As shown in Fig. 5, the die placement device 60 has a stage 200. The stage 200 is divided into a pickup area 201 and an arrange area 202. The pickup area 201 and the arrange area 202 are arranged side by side in the horizontal direction (X-axis direction). In the pickup area 201, a die D held on a dicing tape T is removed from the dicing tape T and picked up. In the arrange area 202, the die D picked up in the pickup area 201 is placed on a carrier C.

[0050] A frame holding unit 210 is provided in the pickup area 201. The frame holding unit 210 has the holding surface of the dicing frame F on its upper surface, and holds the dicing tape T and dicing frame F that hold the die D with the surface Da of the die D facing upward.

[0051] A mounting area 211 is formed on the upper surface of the frame holding part 210, on the positive X-axis side of the holding surface of the dicing frame F. A replacement release part 220 and collet part 230, which will be described later, are temporarily placed on the mounting area 211.

[0052] A movement mechanism 212 is provided below the frame holding unit 210. The frame holding unit 210 is configured to be movable in the horizontal direction (X-axis direction and Y-axis direction) by the movement mechanism 212. The drive unit of the movement mechanism 212 is not particularly limited, but a linear motor, for example, is used.

[0053] As shown in Fig. 6, a detachable portion 220 is provided inside the frame holding portion 210. The detachable portion 220 is configured to be detachable from the frame holding portion 210 and is configured to be replaceable. As shown in Fig. 7, the detachable portion 220 has, for example, a substantially cylindrical shape. A push-up pin 221 configured to be movable up and down is provided on the top surface of the detachable portion 220.

[0054] The detachment section 220 is provided with an elevation mechanism 222 that raises and lowers the push-up pins 221. The elevation mechanism 222 allows the push-up pins 221 to freely protrude from the upper surface of the detachment section 220. The push-up pins 221 can push up the die D on the dicing tape T held by the frame holding section 210 from below, thereby detaching the die D from the suction surface of the dicing tape T.

[0055] 6, a collet unit 230 is provided above the frame holding unit 210. The collet unit 230 picks up a die D from the dicing tape T, transports it, and places the die D on the carrier C. Specifically, the collet unit 230 holds the die D that has been pushed up and lifted by the removing unit 220, removes it from the dicing tape T, and transports the held die D from the pickup area 201 to the arrangement area 202.

[0056] 8, the collet member 230 has a chuck 231, a base 232, and a joint 233. The collet member 230 is configured to be detachable from a support member 241 of a moving mechanism 240 (described later) and is configured to be replaceable.

[0057] The chuck 231 receives and holds the die D on the dicing tape T from above. The method of holding the die D by the chuck 231 is arbitrary. However, since the surface Da of the die D held by the chuck 231 is the device surface of the device layer E, the chuck 231 must hold the die D without damaging the device surface. For example, the chuck 231 may be a non-contact chuck that can hold the die D from above without contact using the Bernoulli effect or ultrasonic squeeze effect. Alternatively, instead of holding the surface Da of the die D, the chuck 231 may be configured to clamp and hold the side surface of the die D that has been raised by, for example, supplying air.

[0058] The base 232 is larger than the chuck 231 and supports the entire upper surface of the chuck 231. The joint 233 is provided on the upper surface side of the base 232 and is fitted into and supported by a support portion 241, which will be described later.

[0059] 5, the collet member 230 is supported by a movement mechanism 240. The movement mechanism 240 supports and moves the collet member 230. The movement mechanism 240 has a support portion 241, an arm 242, a rail 243, a base 244, and a drive portion 245.

[0060] The support portion 241 supports the joint 233 of the collet portion 230. The tip portion of the arm 242 supports the support portion 241, and the base end portion is attached to the rail 243. The rail 243 is supported by the base 244. The rail 243 and the base 244 extend in the X-axis direction between the pickup area 201 and the arrange area 202. The drive portion 245 moves the support portion 241, the arm 242, and the collet portion 230 in the X-axis direction along the rail 243. The drive portion 245 also moves the support portion 241, the arm 242, and the collet portion 230 in the Y-axis direction. The drive source of the drive portion 245 is not particularly limited, but a linear motor, for example, is used.

[0061] A carrier holding unit 250 is provided in the arrangement area 202. The carrier holding unit 250 has a holding surface for the carrier C on its upper surface, and holds the carrier C with the holding surface, on which the die D is arranged, facing upward. The carrier holding unit 250 is supported by a support plate 251.

[0062] A movement mechanism 252 is provided below the support plate 251. The carrier holding unit 250 and the support plate 251 are configured to be movable in the horizontal direction (X-axis direction and Y-axis direction) by the movement mechanism 252. The drive unit of the movement mechanism 252 is not particularly limited, but a linear motor, for example, is used.

[0063] The configuration of the die placement device 60 is not limited to this embodiment. For example, the frame holder 210 holds the dicing frame F horizontally, but it may hold it vertically. Similarly, the carrier holder 250 holds the carrier C horizontally, but it may hold it vertically.

[0064] Furthermore, for example, the die placement device 60 may be provided with a plurality of imaging units for alignment. For example, by imaging the die D on the dicing tape T, the position of the collet unit 230 is adjusted when picking up the die D. Furthermore, by imaging the die D and the carrier C held by the collet unit 230, the position of the collet unit 230 is adjusted when placing the die D on the carrier C.

[0065] Next, a description will be given of the configuration of the die bonding apparatus 120. Fig. 9 is a perspective view showing an outline of the configuration of the die bonding apparatus 120. Fig. 10 is a side view showing an outline of a partial configuration of the die bonding apparatus 120.

[0066] As shown in Fig. 9, the die bonding apparatus 120 has a stage 300. The stage 300 is divided into a pickup area 301 and a bonding area 302. The pickup area 301 and the bonding area 302 are arranged side by side in the horizontal direction (X-axis direction). In the pickup area 301, a die D held by a carrier C is removed from the carrier C and picked up. In the bonding area 302, the die D picked up in the pickup area 301 is bonded to a wafer W.

[0067] A carrier holding section 310 is provided in the pickup area 301. The carrier holding section 310 has a holding surface for a carrier C on its upper surface, and holds the carrier C holding a die D with the surface Da of the die D facing upward.

[0068] A mounting area 311 is formed on the upper surface of the carrier holding part 310, on the positive X-axis side of the holding surface of the carrier C. A replacement release part 320 and collet part 330, which will be described later, are temporarily placed in the mounting area 311.

[0069] A movement mechanism 312 is provided below the carrier holding unit 310. The carrier holding unit 310 is configured to be movable in the horizontal direction (X-axis direction and Y-axis direction) by the movement mechanism 312. The drive unit of the movement mechanism 312 is not particularly limited, but a linear motor, for example, is used.

[0070] As shown in Fig. 10, a detachable portion 320 is provided inside the carrier holding portion 310. The detachable portion 320 is configured to be detachable from the carrier holding portion 310 and to be replaceable. As shown in Fig. 11, the detachable portion 320 has, for example, a substantially cylindrical shape. On the top surface of the detachable portion 320, a push-up pin 321 configured to be able to move up and down and an air supply hole 322 for supplying air are provided.

[0071] The release section 320 is provided with an elevation mechanism 323 that raises and lowers the push-up pin 321. The elevation mechanism 323 allows the push-up pin 321 to freely protrude from the upper surface of the release section 320. The push-up pin 321 can push up the die D on the carrier C held by the carrier holding section 310 from below, thereby releasing the die D from the suction surface of the carrier C.

[0072] An air supply source 324 that supplies air to the air supply hole 322 is connected to the release section 320. The air supply hole 322 supplies air to the through-hole H of the carrier C held by the carrier holding section 310, and further supplies air to the back surface Db side of the die D on the carrier C via the through-hole H. In this way, air pressure is applied to the die D, which reduces the adhesion between the die D and the holding layer N on the suction surface of the carrier C. Then, the die D can be released from the suction surface of the carrier C.

[0073] Although the release portion 320 of this embodiment includes both the push-up pin 321 and the air supply hole 322, it may include only one of the push-up pin 321 and the air supply hole 322.

[0074] 9 , a collet unit 330 is provided above the carrier holding unit 310. The collet unit 330 picks up and transports a die D from the carrier C, and then transfers the die D, which will be described later, to the head unit 360. Specifically, the collet unit 330 holds the die D that has floated up due to a decrease in adhesion between the collet unit 330 and the holding layer N caused by the release unit 320, releases the die D from the carrier C, and then transports the held die D from the pickup region 301 to the bonding region 302.

[0075] 12, the collet member 330 has a chuck 331, a base 332, and a joint 333. The collet member 330 is configured to be detachable from a support member 341 of a moving mechanism 340 (described later) and is configured to be replaceable.

[0076] The chuck 331 receives and holds the die D on the carrier C from above. The method of holding the die D by the chuck 331 is arbitrary. However, since the surface Da of the die D held by the chuck 331 is the device surface of the device layer E, the chuck 331 needs to hold the die D by the chuck 331 without damaging the device surface. For example, the chuck 331 may be a non-contact chuck that can hold the die D from above without contact using the Bernoulli effect or ultrasonic squeeze effect. Alternatively, instead of holding the surface Da of the die D, the chuck 331 may be configured to clamp and hold the side surface of the die D that has been raised by, for example, supplying air.

[0077] The base 332 is larger than the chuck 331 and supports the entire upper surface of the chuck 331. The joint 333 is provided on the upper surface side of the base 332 and is fitted into and supported by a support portion 341, which will be described later.

[0078] 9, the collet member 330 is supported by a moving mechanism 340. The moving mechanism 340 supports and moves the collet member 330. The moving mechanism 340 has a support portion 341, an arm 342, a rail 343, a base 344, and a drive portion 345.

[0079] The support 341 supports the joint 333 of the collet 330. The tip of the arm 342 supports the support 341, and the base is attached to a rail 343. The rail 343 extends in the X-axis direction and is supported by a base 344. The drive unit 345 moves the support 341, the arm 342, and the collet 330 in the X-axis direction along the rail 343. The drive unit 345 also moves the support 341, the arm 342, and the collet 330 in the Y-axis direction. Furthermore, the drive unit 345 rotates the collet 330 supported by the support 341 around a horizontal axis (around the X-axis), allowing the collet 330 to flip the front and back surfaces of the die D it holds. The drive source of the drive unit 345 is not particularly limited, but a linear motor, for example, may be used.

[0080] A wafer holding unit 350 is provided in the bonding region 302. The wafer holding unit 350 has a holding surface for the wafer W on its upper surface, and holds the wafer W with its front surface Wa, which is the mounting surface for the die D, facing upward. The wafer holding unit 350 is supported by a support plate 351.

[0081] A mounting area 352 is formed on the upper surface of the support plate 351 on the X-axis positive side of the wafer holding part 350. A replacement head part 360 (described later) is temporarily placed on the mounting area 352.

[0082] A moving mechanism 353 is provided below the support plate 351. The moving mechanism 353 is configured to move the wafer holder 350 and the support plate 351 in horizontal directions (X-axis direction and Y-axis direction). The driving unit of the moving mechanism 353 is not particularly limited, but a linear motor, for example, is used.

[0083] A head unit 360, which is a bonding bed, is provided above the wafer holding unit 350. The head unit 360 receives and holds the die D from the collet unit 330, transports the held die D to the wafer W, and bonds the die D to the wafer W.

[0084] 12, the head unit 360 has a chuck 361, a base 362, and a joint 363. The head unit 360 is configured to be detachable from a support unit 371 of a moving mechanism 370 (described later) and is configured to be replaceable.

[0085] The chuck 361 receives and holds the die D held by the collet part 330 from above. The method of holding the die D by the chuck 361 is arbitrary. Because the back surface Db of the die D held by the chuck 361 is a silicon layer S, the chuck 361 does not necessarily have to be configured as a non-contact chuck or the like like the collet part 330. For example, a vacuum chuck may be used for the chuck 361, and the chuck 361 may suck and hold the die D by vacuuming it using a vacuum mechanism (not shown).

[0086] The base 362 is larger than the chuck 361 and holds the entire upper surface of the chuck 361. The joint 363 is provided on the upper surface side of the base 362 and is fitted into and supported by a support portion 371, which will be described later.

[0087] 9 , the head unit 360 is supported by a movement mechanism 370. The movement mechanism 370 supports and moves the head unit 360. The movement mechanism 370 has a support unit 371, an arm 372, a rail 373, a base 374, and a drive unit 375.

[0088] The support unit 371 supports the joint 363 of the head unit 360. The tip of the arm 372 supports the support unit 371, and the base end is attached to a rail 373. The rail 373 extends in the X-axis direction and is supported by a base 374. The drive unit 375 moves the support unit 371, the arm 372, and the head unit 360 in the X-axis direction along the rail 373. The drive unit 375 also moves the support unit 371, the arm 372, and the head unit 360 in the Y-axis direction. The drive source of the drive unit 375 is not particularly limited, but a linear motor, for example, is used.

[0089] The configuration of the die bonding apparatus 120 is not limited to this embodiment. For example, the die bonding apparatus 120 may be provided with multiple imaging units for alignment. For example, the position of the collet unit 330 is adjusted when picking up the die D by imaging the die D on the carrier C. Furthermore, the position of the collet unit 330 is adjusted when transferring the die D to the head unit 360 by imaging the die D held by the collet unit 330. Furthermore, the position of the head unit 360 is adjusted when bonding the die D to the wafer W by imaging the die D and the wafer W held by the head unit 360.

[0090] Next, a description will be given of a die-ion wafer manufacturing process carried out in the processing system 1 configured as above. Figure 13 is an explanatory diagram showing a schematic diagram of some steps in the die-ion wafer manufacturing process.

[0091] First, a description will be given of the processing in the first processing system 2. In the first processing system 2, a carrier C for holding a plurality of dies D is prepared.

[0092] First, the hoops Ff and Fc, each housing a dicing frame F and a carrier C, are placed on the hoop mounting table 20 of the carry-in / out station 10. At this time, as shown in Fig. 13(a), a plurality of dies D are held on the dicing tape T, and the dicing tape T is stored with its surface (dies D) facing upward. The carrier C is also stored with its surface (holding layer N) facing upward.

[0093] Next, the transfer device 30 removes the dicing frame F from the FOUP Ff, transfers it to the transition device 50, and then transfers it to the die placement device 60 by the transfer device 40. Also, the transfer device 30 removes the carrier C from the FOUP Fc, transfers it to the transition device 50, and then transfers it to the die placement device 60 by the transfer device 40.

[0094] In the die placement device 60, the dicing frame F is held by the frame holding part 210 with the surface Da of the die D facing upward. The carrier C is held by the carrier holding part 250 with the surface (holding layer N) facing upward.

[0095] Next, the release unit 220 lifts one die D to be joined from the suction surface of the dicing tape T among the multiple dies D on the dicing tape T held by the frame holding unit 210 .

[0096] Next, the collet member 230 is lowered, and the surface Da of one of the die D to be joined that has been raised is held by the collet member 230. The die D may be held by the collet member 230 before the die D is raised by the release member 220, or may be held at the same time as the die D is raised by the release member 220. Next, the collet member 230 is raised, and the die D is picked up from the dicing tape T, as shown in FIG. 13(b).

[0097] Next, the collet member 230 is moved in the positive direction of the X axis until it is moved above the carrier C held by the carrier holding member 250 .

[0098] Next, the collet member 230 is lowered, and the die D is placed on the carrier C with the surface Da (device layer E) facing upward, as shown in Fig. 13(c). Subsequently, the collet member 230 is raised.

[0099] In this manner, the die D is placed on the carrier C. The process of picking up the die D from the dicing tape T and placing the die D on the carrier C is repeated until a plurality of dies D are arranged side by side on the carrier C as shown in FIG.

[0100] Next, the carrier C is transported to the transition device 50 by the transport device 40, and further transported to the FOUP Fc by the transport device 30. In this way, the processing in the first processing system 2 is completed, and the carrier C holding a plurality of dies D is prepared.

[0101] The FOUP from which the carrier C is retrieved does not necessarily have to be the same FOUP that housed the carrier C when it was brought in. That is, for example, the FOUPs that housed the carriers C may each carry out different components, or a new FOUP or the like for carrying out the carriers C may be carried into the first processing system 2.

[0102] Next, a description will be given of the processing in the second processing system 3. In the second processing system 3, a plurality of dies D held in the carrier C prepared in the first processing system 2 are mounted on a wafer W.

[0103] First, the FOUPs Fc and Fw, each containing a carrier C and a wafer W, are placed on the FOUP placement table 80 of the carry-in / out station 70. At this time, as shown in Fig. 13(d), a plurality of dies D are held in the carrier C, and the carrier C is stored with its front surface (dies D) facing upward. The wafers W are also stored with their front surfaces Wa facing upward.

[0104] Next, the carrier C in the FOUP Fc is removed by the transfer device 90, transferred to the transition device 110, and further transferred to the die bonding device 120 by the transfer device 100. Also, the wafer W in the FOUP Fw is removed by the transfer device 90, transferred to the transition device 110, and further transferred to the die bonding device 120 by the transfer device 100.

[0105] In the die bonding apparatus 120, the carrier C is held by the carrier holder 310 with the surface Da of the die D facing upward. The wafer W is held by the wafer holder 350 with the surface Wa facing upward.

[0106] Next, the release unit 320 lifts one die D to be bonded from the suction surface of the carrier C among the plurality of dies D on the carrier C held by the carrier holding unit 310 .

[0107] Next, the collet member 330 is lowered, and the surface Da of one of the floating die D to be joined is held by the collet member 330. The die D may be held by the collet member 330 before the die D is raised by the release member 320, or may be held at the same time as the die D is raised by the release member 320. Next, the collet member 330 is raised, and the die D is picked up from the carrier C, as shown in FIG. 13( e).

[0108] Next, the collet part 330 is rotated around the horizontal axis (around the X axis), thereby inverting the front and back surfaces of the die D. Then, the back surface Db of the die D held by the collet part 330 is brought into a state facing upward.

[0109] Next, the collet part 330 is moved in the positive direction of the X axis to a position below the chuck 361 of the head part 360. Subsequently, the die D is transferred from the collet part 330 to the chuck 361.

[0110] Next, the chuck 361 is lowered, and as shown in Fig. 13(f), the surface Da of the die D held by the chuck 361 is brought into contact with the surface Wa of the wafer W, and the die D is pressed, thereby bonding the die D to the wafer W. Subsequently, the chuck 361 is raised.

[0111] In this manner, the die D is bonded to the wafer W. The process of picking up the die D from the carrier C and bonding the die D to the wafer W is repeated until a plurality of dies D are bonded and mounted on the wafer W, as shown in FIG.

[0112] Next, the wafer W is transferred to the transition device 110 by the transfer device 100, and further transferred to the FOUP Fw by the transfer device 90. In this way, the processing in the second processing system 3 is completed, and the series of die-on wafer manufacturing processes is completed.

[0113] The FOUP into which the wafers W are recovered does not necessarily have to be the same FOUP that housed the wafers W when they were carried in. That is, for example, the FOUPs that housed the wafers W may each carry out different members, or a new FOUP or the like for carrying out the wafers W may be carried into the second processing system 3.

[0114] In a die-on-wafer manufacturing process, different types of dies may be mounted on multiple wafers. Also, multiple types of dies may be mounted on a single wafer. The multiple types of dies may include dies of different sizes. In such cases, the die placement device 60 needs to replace the release part 220 and the collet part 230 depending on the size of the die D. Also, the die bonding device 120 needs to replace the release part 320, the collet part 330, and the head part 360 depending on the size of the die D. In the following description, the release part 220, the collet part 230, the release part 320, the collet part 330, and the head part 360 may be referred to as first transfer parts.

[0115] Conventionally, such replacement of the first transfer component has been performed manually by an operator. However, when an operator replaces the first transfer component, particles are generated, which may contaminate the interior of the die placement apparatus 60 or the die bonding apparatus 120. Furthermore, when an operator replaces the first transfer component, it takes time before the operator can start the work, and the work itself takes time.

[0116] In addition, in the past, replacement first transfer parts were stored within the die placement device 60 or the die bonding device 120, and the first transfer parts were automatically replaced within the device. However, when storing first transfer parts within the device, the device size is limited, and the storage space is also limited, so there is a limit to the number of first transfer parts that can be stored. For this reason, the number of types of die D that can be mounted on a wafer W through automatic operation of the device is limited, and there are cases where the required number of types cannot be met.

[0117] Although Patent Document 1 discloses a die bonding module that picks up a die and bonds it to a substrate, it does not mention or suggest automatic replacement of the first transfer component of the die bonding module.

[0118] Therefore, in this embodiment, the transfer device 40 inside the first processing system 2 is used to replace at least one of the release part 220 and the collet part 230, which are the first transfer parts of the die placement device 60. Also, the transfer device 100 inside the second processing system 3 is used to replace at least one of the release part 320, the collet part 330, and the head part 360, which are the first transfer parts of the die bonding device 120.

[0119] First, a description will be given of a method for replacing the detachment unit 220 and the collet unit 230 of the die placement device 60 in the first processing system 2. As shown in Figures 14 to 17, the transfer arm 41 of the transfer device 40 has a first holding unit 400 and a second holding unit 401.

[0120] 16, the first holding units 400 are provided at, for example, three locations on the first surface 41a of the transfer arm 41. The first holding units 400 are connected to, for example, a vacuum mechanism (not shown), and suction-hold the back surface of the dicing frame F (the surface opposite the holding surface of the die D) and the back surface of the carrier C (the surface opposite the holding layer N) by vacuuming.

[0121] As shown in Fig. 17, the second holding part 401 is provided, for example, at one location on the second surface 41b opposite the first surface 41a of the transfer arm 41. As shown in Fig. 14, the second holding part 401 is connected, for example, to a vacuum mechanism (not shown) and sucks and holds the upper surface of the detachment part 220 by vacuuming. Also, as shown in Fig. 15, the second holding part 401 sucks and holds the joint 233 of the collet part 230.

[0122] The method of holding the release portion 220 and the collet portion 230 by the second holding portion 401 is not limited to this embodiment. For example, the second holding portion 401 may hold the release portion 220 and the collet portion 230 by sandwiching them. Furthermore, for example, if the joint 233 of the collet portion 230 is made of a magnet, the second holding portion 401 may hold the joint 233 by magnetic force.

[0123] Second holding unit 401 may also be provided with a component holding unit that holds release unit 220 and a component holding unit that holds collet unit 230. Second holding unit 401 may also be provided with a component holding unit that holds used release units 220 and collet units 230 and a component holding unit that holds unused release units 220 and collet units 230.

[0124] In this embodiment, the transfer arm 41 has the first holding unit 400 and the second holding unit 401, but the first holding unit 400 and the second holding unit 401 may be provided on different transfer arms. For example, the transfer arm 41 may have the first holding unit 400, and another transfer arm (not shown) may have the second holding unit 401.

[0125] In the first processing system 2, the buffer device 51 stores the replacement release part 220 and the collet part 230. The transfer device 40 transfers the release part 220 and the collet part 230 between the buffer device 51 and the die placement device 60.

[0126] When replacing the detachable part 220, first, the collet part 230 is used to place the used detachable part 220 provided inside the frame holding part 210 on the placement area 211. Next, the transfer arm 41 holding the unused detachable part 220 enters the chamber 61 and places the unused detachable part 220 on the placement area 211. Next, the transfer arm 41 holds the used detachable part 220 and exits the chamber 61. Also, the collet part 230 is used to install the unused detachable part 220 from the placement area 211 on the frame holding part 210. In this way, the replacement of the detachable part 220 is completed.

[0127] The method for replacing the collet member 230 is the same as the method for replacing the detachment member 220. That is, first, the used collet member 230 supported by the support member 241 is placed in the placement area 211. Next, the transfer arm 41 holding the unused collet member 230 enters the chamber 61 and places the unused collet member 230 in the placement area 211. Next, the transfer arm 41 holds the used collet member 230 and exits the chamber 61. Furthermore, the support member 241 supports the unused collet member 230 in the placement area 211. In this way, the replacement of the collet member 230 is completed.

[0128] The method of replacing the detachment part 220 and the collet part 230 is not limited to this embodiment. For example, the transfer arm 41 of the transfer device 40 may be used to directly replace the detachment part 220 relative to the frame holding part 210. In such a case, the transfer arm 41 may have second holding parts 401 in two locations and be configured to hold both a used detachment part 220 and an unused detachment part 220. Similarly, for example, the transfer arm 41 may be used to directly replace the collet part 230 relative to the support part 241, and in such a case, the transfer arm 41 may be configured to hold a used collet part 230 and an unused collet part 230.

[0129] 18 , for example, the detachment parts 220 may be replaced using a support wafer Ws on which the detachment parts 220 are supported. The support wafer Ws is configured to be able to support a plurality of detachment parts 220 on its front surface. The buffer device 51 stores the support wafer Ws supporting the detachment parts 220. The transfer device 40 holds the back surface of the support wafer Ws with the first holding part 400 of the transfer arm 41, and transfers the support wafer Ws between the buffer device 51 and the die placement device 60.

[0130] In such a case, first, transfer arm 41 holding support wafer Ws supporting unused detachment part 220 enters chamber 61. Next, collet part 230 is used to place used detachment part 220 provided inside frame holding part 210 on support wafer Ws, and further collet part 230 is used to install unused detachment part 220 on support wafer Ws onto frame holding part 210. In this way, replacement of detachment part 220 is completed.

[0131] 18 , for example, the collet member 230 may be replaced using a support wafer Ws on which the collet member 230 is supported. In such a case, first, the transfer arm 41 holding the support wafer Ws supporting the unused collet member 230 enters the chamber 61. Next, the support member 241 places the used collet member 230 on the support wafer Ws, and then the support member 241 supports the unused collet member 230 on the support wafer Ws. In this way, the replacement of the collet member 230 is completed.

[0132] The method of storing replacement detachment parts 220 and collet parts 230 is not limited to this embodiment. For example, the detachment parts 220 and collet parts 230 may be stored inside a FOUP (not shown) placed on the FOUP mounting table 20. In such a case, the FOUP containing the detachment parts 220 and collet parts 230 is transported between the first processing system 2 and the outside. This allows for an increase in the types of detachment parts 220 and collet parts 230 that can be stored, improving the flexibility of replacing the detachment parts 220 and collet parts 230.

[0133] 5, a storage area 260 for storing the release unit 220 and the collet unit 230 may be formed inside the die placement device 60. The storage area 260 is formed, for example, in the pickup area 201 of the stage 200, on the positive side of the X-axis of the frame holding unit 210.

[0134] In such a case, first, the transfer arm 41 enters the chamber 61. Next, the transfer arm 41 transfers the used detachable part 220 provided inside the frame holding part 210 to the storage area 260 and places it there. Furthermore, the transfer arm 41 transfers the unused detachable part 220 from the storage area 260 to the frame holding part 210 and places it there. In this way, the replacement of the detachable part 220 is completed.

[0135] Similarly, for example, the transport arm 41 transports and places the used collet member 230 supported by the support member 241 in the storage area 260. Furthermore, the transport arm 41 transports the unused collet member 230 from the storage area 260 to the support member 241, and the support member 241 supports the collet member 230. In this way, the replacement of the collet member 230 is completed.

[0136] Next, a description will be given of a method for replacing the release part 320, the collet part 330, and the head part 360 of the die bonding apparatus 120 in the second processing system 3. The method for replacing the release part 320, the collet part 330, and the head part 360 of the die bonding apparatus 120 is the same as the method for replacing the release part 220 and the collet part 230 of the die placement apparatus 60 described above.

[0137] The transfer arm 101 of the transfer device 100 has a configuration similar to that of the transfer arm 41 of the transfer device 40, and includes a first holding unit 400 and a second holding unit 401. The first holding unit 400 holds the back surface of the carrier C (the surface opposite to the holding layer N) and the back surface Wb of the wafer W. The second holding unit 401 holds the upper surface of the release unit 320, the joint 333 of the collet unit 330, and the joint 363 of the head unit 360. The transfer device 100 then transfers the release unit 320, the collet unit 330, and the head unit 360 to the die bonding device 120.

[0138] The storage method of the release unit 320, the collet unit 330, and the head unit 360 is the same as the storage method of the release unit 220 and the collet unit 230 of the die placement apparatus 60 described above. For example, the release unit 320, the collet unit 330, and the head unit 360 may be stored inside the buffer apparatus 111. Alternatively, for example, the release unit 320, the collet unit 330, and the head unit 360 may be stored inside a FOUP (not shown) placed on the FOUP mounting table 80. Furthermore, for example, as shown in FIG. 9 , the release unit 320 and the collet unit 330 may be stored in a storage area 380 formed on the X-axis positive side of the carrier holding unit 310 in the pickup area 301 of the stage 300. Alternatively, the head unit 360 may be stored in a storage area 381 formed on the X-axis positive side of the wafer holding unit 350 in the bonding area 302.

[0139] The method for replacing the detachment part 320 is the same as the method for replacing the detachment part 220 of the die placement device 60 described above. For example, the transfer device 100 may be used to replace the detachment part 320 via the placement area 311. Alternatively, for example, the transfer device 100 may be used to directly replace the detachment part 320. Furthermore, for example, the support wafer Ws that supports the detachment part 320 may be used to replace the detachment part 320.

[0140] The method of replacing the collet member 330 and the head member 360 is also similar to the method of replacing the collet member 230 of the die placement device 60 described above. For example, the transfer device 100 may be used to replace the collet member 330 and the head member 360 via the placement areas 311, 352. Alternatively, the transfer device 100 may be used to directly replace the collet member 330 and the head member 360. Furthermore, for example, the collet member 330 and the head member 360 may be replaced using a support wafer Ws that supports the collet member 330 and the head member 360.

[0141] According to the above embodiment, the release unit 220 and the collet unit 230 can be replaced using the conveying device 40, and the release unit 320, the collet unit 330, and the head unit 360 can be replaced using the conveying device 100. Therefore, the first transfer component can be replaced automatically. This reduces particle generation inside the die placement device 60 and the die bonding device 120, thereby maintaining the interior cleanliness, compared to when an operator manually replaces the first transfer component. Furthermore, compared to when an operator manually replaces the first transfer component, the work time can be reduced. Furthermore, even when the number of die D varieties increases, the first transfer component can be replaced according to the die D. Therefore, the first transfer component can be replaced efficiently in the die-on-wafer manufacturing process.

[0142] Furthermore, in this embodiment, the transfer device 40 inside the first processing system 2 holds the dicing frame F and the carrier C with the first holding part 400, and holds the release part 220 and the collet part 230 with the second holding part 401. Similarly, the transfer device 100 of the second processing system 3 holds the carrier C and the wafer W with the first holding part 400, and holds the release part 320, the collet part 330, and the head part 360 with the second holding part 401. In this way, the transfer devices 40 and 100 each transfer the target object and also transfer the first transfer parts, resulting in high transfer efficiency.

[0143] Furthermore, in this embodiment, since the first transfer parts can be replaced inside the first processing system 2, particles do not enter from the outside of the die placement apparatus 60, and the inside of the die placement apparatus 60 can be kept clean. Similarly, since the first transfer parts can be replaced inside the second processing system 3, particles do not enter from the outside of the die bonding apparatus 120, and the inside of the die bonding apparatus 120 can be kept clean.

[0144] In the die-on-wafer manufacturing process of the above embodiment, the die placement device 60 uses the collet unit 230 to pick up the die D from the dicing tape T and place it on the carrier C. At this time, the chuck 231 of the collet unit 230 holds the die D multiple times, so there is a risk of particles or other foreign matter adhering to the holding surface of the chuck 231 holding the die D. Also, in the die bonding device 120, the collet unit 330 is used to pick up the die D from the carrier C and transfer it to the head unit 360, which then bonds the die D to the wafer W. At this time, the chuck 331 of the collet unit 330 and the chuck 361 of the head unit 360 each hold the die D multiple times, so there is a risk of particles or other foreign matter adhering to the holding surfaces of the chucks 331 and 361 holding the die D. For this reason, it is necessary to clean the holding surfaces of the chucks 231, 331, and 361. In the following description, the collet member 230, the collet member 330, and the head member 360 may be referred to as second transfer parts (corresponding to transfer parts in this disclosure).

[0145] Conventionally, cleaning of the holding surfaces of the chucks 231, 331, and 361 of the second transfer components has been performed manually by, for example, an operator. However, when an operator cleans the second transfer components, particles are generated, which may contaminate the interior of the die placement device 60 or the die bonding device 120. Furthermore, when an operator cleans the second transfer components, it takes time before the operator can start the work, and the work itself also takes time.

[0146] Although Patent Document 1 discloses a die bonding module that picks up a die and bonds it to a substrate, it does not mention or suggest automatic cleaning of the second transfer component of the die bonding module.

[0147] 19 is used to clean the holding surface of the chuck 231 of the collet unit 230, which is the second transfer component of the die placement device 60. Also, the cleaning tool 500 is used to clean at least one of the holding surface of the chuck 331 of the collet unit 330 and the holding surface of the chuck 361 of the head unit 360, which are the second transfer components of the die bonding device 120.

[0148] The cleaning tool 500 has an adhesive tape 501 and a support part 502. The adhesive tape 501 has a substantially rectangular shape in a plan view. The support part 502 also has a substantially rectangular shape in a plan view, and supports the adhesive tape 501.

[0149] The adhesive tape 501 adheres to and removes foreign matter P adhering to the holding surfaces of the chucks 231, 331, and 361. The adhesive tape 501 is formed with a plurality of adhesive regions 501a for adhering the foreign matter P, and is configured so that the holding surfaces of the chucks 231, 331, and 361 can be cleaned multiple times.

[0150] In the first processing system 2, the buffer device 51 stores the cleaning tool 500. As shown in Figures 20 and 21 , the transfer device 40 holds the support part 502 of the cleaning tool 500 with the first holding part 400 of the transfer arm 41, and transfers the cleaning tool 500 between the buffer device 51 and the die placement device 60. Note that the transfer device 40 may hold the cleaning tool 500 with the second holding part 401.

[0151] When cleaning the holding surface of the chuck 231 of the collet member 230 in the die placement device 60, the transport arm 41 holding the cleaning tool 500 enters the chamber 61 and is positioned below the chuck 231. Next, as shown in Figure 21, adhesive tape 501 is brought into contact with the holding surface of the chuck 231 to adhere and remove foreign matter P adhering to the holding surface. Next, the transport arm 41 exits the chamber 61 while still holding the cleaning tool 500. In this way, cleaning of the holding surface of the chuck 231 is completed.

[0152] In the second processing system 3, the buffer device 111 stores the cleaning tool 500. As described above, the transfer device 100 has a configuration similar to that of the transfer device 40, and holds the support part 502 of the cleaning tool 500 by the first holding part 400 of the transfer arm 41, and transfers the cleaning tool 500 between the buffer device 111 and the die bonding device 120. Note that the transfer device 100 may hold the cleaning tool 500 by the second holding part 401.

[0153] In the die bonding apparatus 120, the methods for cleaning the holding surfaces of the chuck 331 of the collet unit 330 and the chuck 361 of the head unit 360 are the same as the above-described method for cleaning the holding surfaces of the chuck 231 of the die placement apparatus 60. That is, the holding surfaces of the chucks 331 and 361 are cleaned using a cleaner 500 held by the transfer arm 41 of the transfer apparatus 100.

[0154] The configuration of the cleaning tool 500 is not limited to this embodiment. For example, as shown in FIG. 22 , a cleaning tool 510 according to another embodiment includes an adhesive tape 511 and a support portion 512. The support portion 512 has a disk shape, i.e., a circular shape in a plan view. The support portion 512 has approximately the same diameter and thickness as the wafer W, e.g., a diameter of 300 mm and a thickness of approximately 800 μm. The adhesive tape 511 is attached to the support portion 512 and has a circular shape in a plan view. Like the adhesive tape 501, the adhesive tape 511 has multiple adhesive regions 511 a for adhering foreign matter P thereto, and is configured to be able to clean the holding surfaces of the chucks 231, 331, and 361 multiple times.

[0155] 23 , a cleaning tool 520 according to another embodiment includes an adhesive tape 521 and a support portion 522. The support portion 522 has an annular shape in a plan view. The support portion 522 has the same shape as the dicing frame F. The adhesive tape 521, like the dicing tape T, is fixed to the back surface of the support portion 522 and has a circular shape in a plan view. Like the adhesive tape 501, the adhesive tape 521 has multiple adhesive regions 521 a formed thereon for adhering foreign matter P, and is configured to enable cleaning of the holding surfaces of the chucks 231, 331, and 361 multiple times.

[0156] In the first processing system 2, the buffer device 51 stores the cleaning tools 510 and 520 in the same manner as the cleaning tool 500. The transport device 40 holds the support parts 512 and 522 of the cleaning tools 510 and 520 with the first holding part 400 of the transport arm 41, and transports the cleaning tools 510 and 520 between the buffer device 51 and the die placement device 60. The transport device 40 may hold the cleaning tools 510 and 520 with the second holding part 401.

[0157] The method of cleaning the holding surface of the chuck 231 of the collet member 230 in the die placement device 60 using the cleaners 510 and 520 is the same as the cleaning method using the cleaner 500. That is, the holding surface of the chuck 231 is cleaned using the cleaners 510 and 520 held by the transfer arm 41 of the transfer device 40.

[0158] In the second processing system 3, the buffer device 111 stores the cleaning tools 510 and 520 in the same manner as the cleaning tool 500. The transfer device 100 holds the support parts 512 and 522 of the cleaning tools 510 and 520 using the first holding part 400 of the transfer arm 41, and transfers the cleaning tools 510 and 520 between the buffer device 111 and the die bonding device 120. The transfer device 100 may hold the cleaning tools 510 and 520 using the second holding part 401.

[0159] The method of cleaning the holding surfaces of the chucks 331 of the collet unit 330 and the chucks 361 of the head unit 360 in the die bonding apparatus 120 using the cleaners 510 and 520 is the same as the cleaning method using the cleaner 500. That is, the cleaning tools 510 and 520 held by the transport arm 41 of the transport apparatus 100 are used to clean the holding surfaces of the chucks 331 and 361.

[0160] According to the above embodiment, the holding surface of the chuck 231 can be cleaned using the conveying device 40 and the cleaning tool 500, and the holding surfaces of the chucks 331 and 361 can be cleaned using the conveying device 100 and the cleaning tool 500. Therefore, cleaning of the second transfer components can be performed automatically. Therefore, compared to when an operator manually cleans the second transfer components, generation of particles inside the die placement device 60 or the die bonding device 120 can be suppressed, and the interiors can be kept clean. Furthermore, compared to when an operator manually cleans the second transfer components, the work time can be shortened. Therefore, cleaning of the second transfer components can be performed efficiently in the die-on wafer manufacturing process.

[0161] Furthermore, according to this embodiment, the holding surface of the chuck 231 is cleaned in the first processing system 2, so that the die D can be properly held by the chuck 231 and properly placed on the carrier C. Similarly, the holding surfaces of the chucks 331 and 361 in the second processing system 3 are cleaned, so that the die D can be properly held by the chucks 331 and 361 and properly bonded to the wafer W.

[0162] In the die bonding apparatus 120, the wafer W on which the die D is mounted becomes a product, and therefore high bonding accuracy is required when bonding the die D held by the chuck 361 of the head unit 360 to the wafer W. However, if, for example, foreign matter P adheres to the holding surface of the chuck 361 and the die D cannot be held properly, the die D cannot be bonded to the desired position on the wafer W. In contrast, in this embodiment, the holding surface of the chuck 361 is cleaned, and the die D can be held properly by the chuck 361, thereby improving the bonding accuracy of the die D to the wafer W. Therefore, cleaning the holding surface of the chuck 361 as in this embodiment is particularly useful.

[0163] In this embodiment, the transfer device 40 inside the first processing system 2 holds the dicing frame F and the carrier C in the first holding part 400, and holds the cleaning tool 500 in the first holding part 400 or the second holding part 401. Similarly, the transfer device 100 in the second processing system 3 holds the carrier C and the wafer W in the first holding part 400, and holds the cleaning tool 500 in the first holding part 400 or the second holding part 401. In this way, the transfer devices 40 and 100 each transfer the target object and also the cleaning tool 500, resulting in high transfer efficiency.

[0164] Furthermore, in this embodiment, the second transfer parts can be cleaned inside the first processing system 2, so particles do not enter from the outside of the die placement apparatus 60, and the inside of the die placement apparatus 60 can be kept clean. Similarly, the second transfer parts can be cleaned inside the second processing system 3, so particles do not enter from the outside of the die bonding apparatus 120, and the inside of the die bonding apparatus 120 can be kept clean.

[0165] As described above, according to the present embodiment, the first transfer part can be replaced using the transport device 40, 100, while the second transfer part can be cleaned using the transport device 40, 100. Therefore, maintenance efficiency is improved compared to the conventional method.

[0166] In the above embodiment, the first processing system 2 places the plurality of dies D held on the dicing tape T on the carrier C, and the second processing system 3 bonds and mounts the plurality of dies D held on the carrier C to the wafer W. However, the plurality of dies D held on the dicing tape T may also be directly bonded and mounted to the wafer W. In such a case, the carrier C is omitted, and the first processing system 2 is omitted from the processing system 1. Furthermore, in the second processing system 3, a dicing frame F and a dicing tape T are transported and processed instead of the carrier C. Even when the plurality of dies D are directly mounted from the dicing tape T to the wafer W in this manner, the first method for replacing transfer components of the die bonding apparatus 120 and the second method for cleaning transfer components according to the present disclosure can be applied.

[0167] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0168] Furthermore, the effects described in this specification are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0169] REFERENCE SIGNS LIST 1 Processing system 2 First processing system 3 Second processing system 40 Transfer device 60 Die placement device 100 Transfer device 120 Die bonding device 230 Collet unit 330 Collet unit 360 Head unit 500 Cleaning tool C Carrier D Die F Dicing frame T Dicing tape W Wafer

Claims

1. A processing system for processing a plurality of dies, comprising: a transfer device having transfer components for transferring the plurality of dies held on a first object to a second object; a conveying device that conveys a cleaning tool for cleaning the die holding surface of the transfer component. 　 The processing system according to claim 1 , wherein the transport device transports the cleaning tool to the holding surface and cleans the holding surface. 　 The processing system according to claim 1 , wherein the cleaning tool has an adhesive tape that adheres to and removes foreign matter adhering to the holding surface. 　 the cleaning tool has a support part that supports the adhesive tape, The adhesive tape has a circular shape in a plan view, The processing system according to claim 3 , wherein the support portion has a circular shape in a plan view. 　 the cleaning tool has a support part that supports the adhesive tape, The adhesive tape has a circular shape in a plan view, The processing system according to claim 3 , wherein the support portion has an annular shape in a plan view. 　 a storage device for storing the cleaning tool; The processing system according to claim 1 , wherein the transport device transports the cleaning tool between the storage device and the transfer device. 　 The processing system according to claim 1 , wherein the transport device transports the first object and the second object to the transfer device. 　 the transfer device is a die bonding device that bonds the plurality of dies to the second object, The transfer part is a collet portion for picking up the die from the first object; a head portion that receives the die from the collet portion and joins the die to the second object, 8. The processing system according to claim 1, wherein the cleaning tool cleans at least one of the collet part and the head part. 　 the transfer device is a die placement device that places the plurality of dies on the second target body, the transfer component includes a collet portion that picks up the die from the first target body and places the die on the second target body, The processing system according to any one of claims 1 to 7, wherein the cleaning tool cleans the collet part.

1. A processing method for processing a plurality of dies, comprising: transferring the dies held on the first object to a second object using a transfer component in a transfer device; and transporting a cleaning tool for cleaning the die holding surface of the transfer part using a transport device. 　 The processing method according to claim 10 , further comprising using the transport device to transport the cleaning tool to the holding surface and clean the holding surface. 　 The cleaning tool has an adhesive tape, The method according to claim 10 , further comprising removing foreign matter adhering to the holding surface by using the adhesive tape. 　 the cleaning tool has a support part that supports the adhesive tape, The adhesive tape has a circular shape in a plan view, The processing method according to claim 12 , wherein the support portion has a circular shape in a plan view. 　 the cleaning tool has a support part that supports the adhesive tape, The adhesive tape has a circular shape in a plan view, The processing method according to claim 12 , wherein the support portion has an annular shape in a plan view. 　 The cleaning tool is stored in a storage device; The processing method according to claim 10 , further comprising: transporting the cleaning tool between the storage device and the transfer device using the transport device. 　 The processing method according to claim 10 , further comprising: transporting the first object and the second object to the transfer device using the transport device. 　 the transfer device is a die bonding device that bonds the plurality of dies to the second object, The transfer part is a collet portion for picking up the die from the first object; a head portion that receives the die from the collet portion and joins the die to the second object, The processing method according to any one of claims 10 to 16, comprising cleaning at least one of the collet part and the head part using the cleaning tool. 　 the transfer device is a die placement device that places the plurality of dies on the second target body, the transfer component includes a collet portion that picks up the die from the first target body and places the die on the second target body, The processing method according to any one of claims 10 to 16, comprising cleaning the collet part using the cleaning tool.

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