Energy storage power supply
By designing a heat dissipation structure inside the casing of the energy storage power supply that is thermally coupled with the inverter, and an external fan that creates airflow, combined with a heat-conducting layer and a gradient design of heat dissipation fins, the problem of poor heat dissipation capacity of portable energy storage power supplies is solved, achieving efficient heat dissipation and lightweight design.
Patent Information
- Application Number
- PCT/CN2025/072827
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-14
- Filing Date
- 2025-01-16
- Publication Date
- 2026-02-12
AI Technical Summary
Existing portable energy storage power supplies have poor heat dissipation capabilities even after the protection level is improved, resulting in large heat dissipation volume and ineffective cooling.
An energy storage power supply was designed, which uses a heat dissipation structure inside the casing that is thermally coupled with the inverter, and a fan installed on the outside to form airflow. Combined with the gradient design of the heat conduction layer and heat dissipation fins, the heat dissipation channel and fan layout are optimized to reduce contact thermal resistance.
It improves the heat dissipation of the inverter, reduces the overall height and volume of the energy storage power supply, lowers the manufacturing cost, and enhances protection and portability.
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Figure CN2025072827_12022026_PF_FP_ABST
Abstract
Description
Energy storage power supply
[0001] Priority information
[0002] This application claims priority to and the benefit of Chinese Patent Application No. 202411633032.5 and 202422796238.1, filed on November 14, 2024, with the State Intellectual Property Office of China, and incorporates by reference the entire disclosure thereof. TECHNICAL FIELD
[0003] The present application relates to the technical field of energy storage, in particular to an energy storage power supply. BACKGROUND
[0004] With the improvement of living standards, users have higher and higher requirements for the protection level and high power of portable power supplies.
[0005] After the protection level of the current portable energy storage is improved, the corresponding result is that the heat dissipation volume of the energy storage power supply is large, which cannot effectively cool down, resulting in poor heat dissipation capacity. SUMMARY
[0006] Therefore, the present application aims to at least partially solve one of the problems in the related art. To this end, the purpose of the present application is to provide an energy storage power supply.
[0007] The present application provides an energy storage power supply. The energy storage power supply comprises a housing, a battery module, an inverter and a fan. The housing has a mounting cavity, and the housing is formed with a heat dissipation structure; the battery module is installed in the mounting cavity; the inverter is installed in the mounting cavity and is thermally coupled with the heat dissipation structure and electrically connected with the battery module; the fan is installed on the outside of the housing, and the fan forms an air flow that flows through the heat dissipation structure.
[0008] In some embodiments, the heat dissipation structure comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at the bottom, side and / or top of the housing.
[0009] In some embodiments, the plurality of heat dissipation fins are arranged radially and form a mounting space in the middle, and the fan is installed in the mounting space.
[0010] In some embodiments, the arrangement density of the heat dissipation fins gradually changes from dense to sparse from the center to the periphery, and the arrangement height of the heat dissipation fins gradually changes from low to high from the center to the periphery.
[0011] In some embodiments, the fan is a centrifugal fan or an axial flow fan.
[0012] In some embodiments, the heat dissipation structure further comprises a protrusion, which is located in the installation cavity and fixedly arranged on the shell, and the protrusion is thermally coupled with the power element of the inverter.
[0013] In some embodiments, a thermally conductive layer is arranged between the protrusion and the power element, and the protrusion is thermally coupled with the power element of the inverter through the thermally conductive layer.
[0014] In some embodiments, the thickness of the thermally conductive layer is less than 1 mm, and the thermal conductivity of the thermally conductive layer is greater than 3 W / M / K.
[0015] In some embodiments, the energy storage power supply further comprises a foot pad, the bottom of the shell is provided with a foot pad, and the foot pad is used to contact an external support surface so that the bottom of the shell is arranged in a spaced manner with the external support surface.
[0016] In some embodiments, the energy storage power supply further comprises a first cover plate, which is fixedly arranged on the outer side of the shell and covers the fan arrangement, and the first cover plate is provided with a ventilation hole.
[0017] In some embodiments, the first cover plate covers the heat dissipation structure, the first cover plate comprises a first bottom plate and a first side plate arranged around the first bottom plate, an air duct is formed between the heat dissipation structure and the first cover plate, the ventilation hole comprises a first ventilation hole and a second ventilation hole, the air duct is arranged between the first ventilation hole and the second ventilation hole, the first bottom plate is provided with the first ventilation hole, and the first side plate is provided with the second ventilation hole.
[0018] In some embodiments, the energy storage power supply further comprises a foot pad, which is arranged on the side of the first cover plate opposite to the fan, and the foot pad is used to contact an external support surface so that the bottom of the first cover plate is arranged in a spaced manner with the external support surface.
[0019] In some embodiments, the energy storage power supply further comprises a foot pad, the bottom plate of the cover plate is provided with a through hole corresponding to the foot pad, the foot pad is fixedly arranged on the bottom of the cover plate through the through hole, and the foot pad is used to contact an external support surface so that the bottom of the cover plate is arranged in a spaced manner with the external support surface.
[0020] In some embodiments, the shell comprises a first shell and a second shell, the first shell and the second shell are buckled to each other to form the installation cavity, the inverter is fixed on the first shell, the first shell is provided with a heat dissipation structure, and the battery module is fixed on the second shell.
[0021] In some embodiments, the first shell is an aluminum alloy shell, the inner side of the first shell is thermally coupled with the inverter, and the outer side of the first shell is formed with the heat dissipation structure.
[0022] In some embodiments, the first shell is anodized.
[0023] In some embodiments, the first shell is provided with a receiving cavity, and the inverter is fixedly installed in the receiving cavity.
[0024] In some embodiments, the second shell is provided with a panel, and the panel is provided with an electric energy output port.
[0025] In some embodiments, the first shell and the second shell are upper and lower buckles, and the first shell is arranged on the lower side of the second shell.
[0026] In some embodiments, a temperature sensor is installed on the heat dissipation structure to detect the temperature of the heat dissipation structure, and the energy storage power supply controls the start-stop or rotation speed of the fan based on the temperature of the heat dissipation structure.
[0027] In some embodiments, the energy storage power supply further comprises a semiconductor refrigeration device, the semiconductor refrigeration device comprises a hot end and a cold end, the cold end is thermally coupled with the inverter, and the hot end is thermally coupled with the heat dissipation structure.
[0028] In some embodiments, the side of the heat dissipation structure facing the inverter has a mounting groove, and the semiconductor refrigeration device is installed in the mounting groove.
[0029] In some embodiments, the outer wall of the mounting cavity has a heat dissipation port, and the heat dissipation structure is installed on the heat dissipation port.
[0030] In some embodiments, the heat dissipation structure comprises a mounting portion and a fixed flange arranged around the mounting portion, the mounting portion extends into the heat dissipation port, the semiconductor refrigeration device is installed on the mounting portion, and the fixed flange is fixed on the outer wall of the mounting cavity by a connecting piece to close the heat dissipation port by the heat dissipation structure.
[0031] In some embodiments, the energy storage power supply further comprises a heat dissipation support, the inverter comprises a circuit board, and the circuit board is provided with the power element; the heat dissipation support is installed on the shell, the heat dissipation support fixes the circuit board and is thermally coupled with the power element, and the heat dissipation support is further thermally coupled with the heat dissipation structure.
[0032] In some embodiments, the heat dissipation support comprises a base and a second cover plate. The base comprises a second bottom plate and two second side plates connected to two ends of the second bottom plate respectively; a heat conduction pad is arranged between the second bottom plate and the power element; the second cover plate is connected to the two second side plates, and the second cover plate is provided with a limiting piece for limiting the battery module.
[0033] In some embodiments, the energy storage power supply further comprises a heat pipe, which is thermally coupled with the heat dissipation structure.
[0034] The energy storage power supply of the present application is provided with a heat dissipation structure in the part of the shell located in the mounting cavity, and the inverter is thermally coupled with the heat dissipation structure, and the fan is mounted on the outside of the shell. The fan forms an air flow that flows through the heat dissipation structure. Compared with the natural heat dissipation mode, the heat dissipation effect of the inverter of the present application is better, and the weight of the inverter is lighter. The introduction of the fan improves the heat dissipation efficiency, and at the same time, the shell has the functions of heat dissipation and support, saving the internal space and manufacturing cost of the energy storage power supply.
[0035] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter in the description of embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0036] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the appended drawings, wherein:
[0037] Fig. 1 is a structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0038] Fig. 2 is a disassembled structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0039] Fig. 3 is a partial structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0040] Fig. 4 is a partial structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0041] Fig. 5 is a partial structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0042] Fig. 6 is a partial structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0043] Fig. 7 is a partial structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0044] Fig. 8 is a partial structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0045] Fig. 9 is a partial structural schematic diagram of an energy storage power supply according to some embodiments of the present application;
[0046] Fig. 10 is a schematic diagram of a partial structure of an energy storage power supply according to some embodiments of the present application.
[0047] Mainly marked description of the drawings: energy storage power supply 100; shell 10, bottom 101, side 102, top 103, mounting cavity 11, heat dissipation structure 12, heat dissipation fin 121, second clamping part 1211, first connecting column 1212, mounting space 1201, protrusion 122, heat conduction layer 123, semiconductor refrigeration part 124, heat preservation part 125, mounting groove 126, mounting part 127, fixed convex edge 128, sealing part 129, first shell 13, first clamping part 131, containing cavity 132, second shell 14, second clamping part 141; battery module 20, protection plate 21; inverter 30, circuit board 31, power element 311, heat conduction pad 312, transformer 3111, inductor 3112, heat dissipation support 32, base 321, second bottom plate 3211, containing groove 32111, second side plate 3212, heat dissipation fin 32121, second cover plate 322, limiting part 3221, insulating plate 33; fan 40, first clamping part 41; foot pad 50; first cover plate 60, ventilation hole 61, first ventilation hole 611, second ventilation hole 612, first bottom plate 62, first side plate 63, perforated hole 64. DETAILED DESCRIPTION
[0048] The embodiments of the present application are described in detail below with reference to the accompanying drawings. The embodiments described below are examples for explaining the present application and should not be construed as limiting the present application.
[0049] In the description of the present application, the terms "first", "second", etc. are only used for the purpose of description and should not be construed as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0050] In the description of the present application, it is necessary to explain that, unless there is explicit provision and limitation, the terms "mounting", "connection" should be understood broadly, which can mean fixed connection, or detachable connection, or integral connection; can be mechanical connection, or electrical connection or can communicate with each other; can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0051] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.
[0052] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.
[0053] Please refer to FIG. 1 to FIG. 4, the present application discloses a kind of energy storage power supply 100. Energy storage power supply 100 includes shell 10, battery module 20, inverter 30 and fan 40. Shell 10 has installation cavity 11, and shell 10 is formed with heat dissipation structure 12. Battery module 20 is installed in installation cavity 11. Inverter 30 is installed in installation cavity 11, and is thermally coupled with heat dissipation structure 12, and is electrically connected with battery module 20. Fan 40 is installed on the outside of shell 10, and fan 40 forms flowing air through heat dissipation structure 12.
[0054] It can be understood that, since battery module 20 has relatively large heat capacity and relatively small heat generation, battery module 20 can achieve cooling by using natural heat dissipation, while inverter 30 has relatively large heat generation, and needs heat dissipation structure 12 formed on shell 10 to cooperate with fan 40 to cool down. Since the heat generated during the operation of inverter 30 is transferred to heat dissipation structure 12, the heat is transferred to the outside through fan 40, reducing the temperature of inverter 30, thereby ensuring the cooling effect of the energy storage power supply.
[0055] That is, the energy storage power supply 100 can use the shell 10 as a support frame and as a heat sink at the same time, without the need to additionally set a heat sink, thereby reducing the overall height and volume of the energy storage power supply 100 and achieving the purpose of high protection of the inverter 30.
[0056] The shell 10 can be made of metal, so that the energy storage power supply 100 is more durable.
[0057] The heat coupling mode of the inverter 30 and the heat dissipation structure 12 can be direct heat conduction connection or indirect heat conduction connection through an intermediate connecting component.
[0058] The electrical connection mode of the inverter 30 and the battery module 20 can be direct electrical connection or indirect electrical connection. For example, the battery module 20 can be indirectly electrically connected to the inverter 30 through a battery protection plate. The battery protection plate can realize overvoltage, overtemperature, overcurrent protection, and can open or close the electrical connection between the battery and the outside.
[0059] In this way, the shell 10 of the energy storage power supply 100 is formed with the heat dissipation structure 12, the inverter 30 is heat-coupled with the heat dissipation structure 30, and the fan 40 is installed on the outside of the shell 10. The fan 40 forms an air flow flowing through the heat dissipation structure 12. Compared with the natural heat dissipation mode, the heat dissipation effect of the inverter 30 is better, and the weight of the inverter 30 is lighter. The introduction of the fan 40 improves the heat dissipation efficiency, and the shell 10 has heat dissipation and support functions, thereby saving the internal space and manufacturing cost of the energy storage power supply 100.
[0060] Referring to FIG. 4, in some embodiments, the heat dissipation structure 12 includes a plurality of heat dissipation fins 121. The plurality of heat dissipation fins 121 are arranged on the bottom 101, the side 102 and / or the top 103 of the shell 10.
[0061] Specifically, the plurality of heat dissipation fins 121 arranged on the bottom 101, the side 102 and / or the top 103 of the shell 10 include the following cases: (1) the plurality of heat dissipation fins 121 are arranged at any one of the bottom 101, the side 102 or the top 103 of the shell 10; (2) the plurality of heat dissipation fins 121 are arranged at any two of the bottom 101, the side 102 or the top 103 of the shell 10; (3) the plurality of heat dissipation fins 121 are arranged on the bottom 101, the side 102 and the top 103 of the shell 10.
[0062] Please refer to FIG. 4, the plurality of heat dissipation fins 121 are arranged at the bottom 101 of the shell 10 of the energy storage power supply 100, so that the overall energy storage power supply 100 is more beautiful. In addition, because the heat dissipation fins 121 are arranged at the bottom 101 of the shell 10 of the energy storage power supply 100, when the user takes the energy storage power supply 100, it is not easy to touch the heat dissipation fins 121 to cause the hand to be scalded.
[0063] In addition, the plurality of heat dissipation fins 121 arranged at the bottom 101 of the shell 10 of the energy storage power supply 100 can also prevent rainwater from entering the installation cavity 11, and has better waterproof effect. In this way, when the energy storage power supply 100 is used in an outdoor environment, the problem of water in the air entering the installation cavity 11 in rainy or humid weather, causing the circuit board 31 in the inverter 30 to short circuit and damage, can be avoided.
[0064] When the plurality of heat dissipation fins 121 are arranged at the side 102 or the top 103, the electronic components inside the installation cavity 11 can be cooled from the side 102 and the top 103 of the shell 10, and the cooling mode and the cooling channel are more diversified.
[0065] In some embodiments, the plurality of heat dissipation fins 121 are arranged in a radial manner and a central portion forms an installation space 1201, and the fan 40 is installed in the installation space 1201.
[0066] Specifically, as shown in FIG. 4, the fan 40 can be provided with a first clamping piece 41, and the heat dissipation fin 121 can be provided with a second clamping piece 1211 matched with the first clamping piece 41, and the fan 40 is installed at the center of the heat dissipation fin 121 by clamping connection of the first clamping piece 41 and the second clamping piece 1211. The first clamping piece 41 can be a clamping column, and the second clamping piece 1211 can be a clamping hole, or the first clamping piece 41 can be a clamping hole, and the second clamping piece 1211 can be a clamping column, which is not limited herein.
[0067] Because the fan 40 is installed outside the shell 10, the fan 40 forms a flowing air current through the heat dissipation structure 12 to form a cooling channel, thereby achieving the cooling effect of the inverter 30 in the installation cavity 11. Or, because one end of the plurality of heat dissipation fins 121 encloses the installation space 1201, and the fan 40 is installed in the installation space 1201, during the rotation of the fan 40, the cooling air current can contact the heat dissipation fin 121 from all directions, thereby more favorably improving the cooling effect of the heat dissipation fin 121.
[0068] At this time, no matter where the heat dissipation fin 121 is arranged at the bottom 101, the side 102 or the top 103 of the shell 10, the fan 40 can be arranged at the center of the outside of the shell 10, and the heat dissipation fin 121 can be arranged around the fan 40 in an interval manner, thereby forming a shorter and more direct cooling channel, forming a larger cooling area, and achieving a better cooling effect.
[0069] Referring to FIG. 5, in some embodiments, the arrangement density of the heat dissipation fins 121 gradually changes from dense to sparse from the center to the periphery, and the arrangement height of the heat dissipation fins 121 gradually changes from low to high from the center to the periphery.
[0070] Specifically, from the center inner region of the heat dissipation fins 121, since this part is close to the heat source and has a large heat generation power, the heat dissipation fins 121 are designed to be relatively dense. The dense arrangement of the heat dissipation fins 121 can increase the heat dissipation area in a limited space, thereby more efficiently absorbing and conducting heat. Although the heat dissipation fins 121 are relatively dense, the height of the heat dissipation fins 121 is relatively low, which on the one hand can ensure reasonable arrangement in the limited internal space, avoid occupying too much space due to the too high heat dissipation fins 121, and affect the installation and arrangement of other components. On the other hand, the relatively low height of the heat dissipation fins 121 also helps to conduct heat to the outside more quickly, avoiding the accumulation of heat in the center inner region of the heat dissipation fins 121, and facilitating the diffusion of heat to the periphery outside the shell 10, thereby achieving better heat dissipation effect.
[0071] In the outer region of the heat dissipation fins 121 relative to the center inner region, the height of the heat dissipation fins 121 is relatively high. This is because the space outside the heat dissipation fins 121 is relatively spacious, and the relatively high heat dissipation fins 121 can better exchange heat with the surrounding air, thereby improving the heat dissipation efficiency. At the same time, the outer heat dissipation fins 121 are relatively sparse, which can reduce the weight of the overall heat sink while ensuring the heat dissipation effect. The sparse arrangement of the heat dissipation fins 121 can reduce the use of materials, thereby reducing costs, and also makes the heat sink more lightweight, facilitating installation and carrying.
[0072] The range interval of the gradient angle of the arrangement density of the heat dissipation fins 121 from the inner side to the outer side can be (10°, 15°).
[0073] In this way, the energy storage power supply 100 can effectively achieve the uniform heating effect through the gradient design of the heat dissipation fins 121, which are dense and low in the inner region and high and sparse in the outer region. After the heat is generated from the heat source such as the inverter 30, it is first quickly absorbed and conducted by the dense heat dissipation fins 121 in the center inner region of the shell 10, and then gradually diffuses to the outer region. Since the heat dissipation fins 121 in the outer region are relatively high and sparse, they can better exchange heat with the air, thereby uniformly dissipating heat to the surrounding environment and avoiding local overheating.
[0074] At the same time, the gradient design of the heat dissipation fins 121, which are dense and low in the inner region and high and sparse in the outer region, can also achieve the purpose of weight reduction while ensuring the heat dissipation performance, and is conducive to the lightweight design of the portable power supply high-protection inverter.
[0075] In some embodiments, the fan 40 is a centrifugal fan or an axial fan.
[0076] Specifically, an axial fan pushes air to flow in the same direction as the shaft, i.e., the inlet direction is parallel to the outlet direction, when in operation. Axial fans are generally capable of providing a large air volume, which helps to quickly remove heat from the energy storage power supply, achieving effective heat dissipation. Axial fans have a relatively simple structure and low manufacturing cost, thus having a high cost performance in use. Axial fans are suitable for most heat dissipation needs of energy storage power supplies, especially in situations where a large air volume is required for rapid heat dissipation.
[0077] A centrifugal fan pushes air to flow in a direction perpendicular to the shaft, i.e., the radial direction, when in operation, i.e., the inlet direction is perpendicular to the outlet direction. Centrifugal fans are capable of generating a high air pressure, which helps to remove heat from the energy storage power supply, especially suitable for situations where the heat dissipation channel is long or the heat dissipation resistance is large. Centrifugal fans can change the flow direction of air flow to be perpendicular to the axial direction, which is very useful in some specific heat dissipation designs. Under the same size and other comparable performance, the noise of a centrifugal fan is generally lower than that of an axial fan, which helps to improve the overall user experience of the energy storage power supply. Centrifugal fans are suitable for heat dissipation situations that require air flow to rotate 90 degrees or require a large air pressure.
[0078] When the fan 40 is a centrifugal fan, since the inlet direction of the centrifugal fan is perpendicular to the outlet direction, the centrifugal fan can achieve effective air flow in a smaller space. This means that in the design of the energy storage power supply 100, the position and direction of the centrifugal fan can be more flexible to adapt to the space layout inside the energy storage power supply 100. Therefore, by optimizing the layout and direction of the fan, the limited space inside the energy storage power supply can be used more effectively. For example, the centrifugal fan can be installed on the side or top of the power supply, thereby avoiding occupying too much space in front of or behind the energy storage power supply 100. Such a layout not only reduces the overall volume of the energy storage power supply 100, but also helps to reduce the height of the energy storage power supply 100, making the structure of the energy storage power supply 100 more compact and portable.
[0079] That is, due to the characteristic that the inlet direction of the centrifugal fan is perpendicular to the outlet direction, the space can be more flexibly utilized in the design of the energy storage power supply 100, thereby effectively reducing the overall volume and height of the energy storage power supply 100. Such a design not only improves the compactness and portability of the energy storage power supply 100, but also helps to improve the heat dissipation efficiency of the energy storage power supply 100 and prolong the service life.
[0080] In addition, the fan 40 can achieve an IP68 protection level by a glue-filling process and vacuum plating of a printed circuit board assembly inside the fan 40, so that the fan 40 has very high dustproof and waterproof performance and can adapt to various harsh working environments to ensure normal heat dissipation and operation of the energy storage power supply 100.
[0081] Referring to FIG. 5, in some embodiments, the heat dissipation structure 12 further comprises a protrusion 122. The protrusion 122 is located in the mounting cavity 11 and fixedly arranged on the shell 10, and the protrusion 122 is thermally coupled with the power elements of the inverter 30.
[0082] It can be understood that when two solid surfaces are in contact, the heat transfer between the two solids will be hindered due to factors such as surface roughness, gaps, etc. This hindrance is the contact thermal resistance.
[0083] Since the contact area between the protrusion 122 and the power elements 311 of the inverter 30 is relatively large, and the design of the protrusion 122 can help reduce the existence of gaps and air, the contact thermal resistance between the inverter 30 and the shell 10 can be reduced. This means that the heat transfer between the inverter 30 and the shell 10 will be hindered, thereby improving the heat dissipation efficiency of the power elements 311 of the inverter 30.
[0084] In detail, referring to FIG. 3, the power elements 311 of the inverter 30 include elements such as transformers 3111 and inductors 3112, and the power elements 311 such as transformers 3111 and inductors 3112 can be arranged as close as possible to the protrusion 122 on the shell 10 to fully utilize the effect of the protrusion 122 in reducing the contact thermal resistance between the inverter 30 and the shell 10.
[0085] Therefore, the protrusion 122 arranged at the bottom of the mounting cavity 11 can be thermally coupled with the power elements 311 of the inverter 30 to reduce the contact thermal resistance between the inverter 30 and the shell 10 and improve the heat dissipation efficiency of the power elements 311 of the inverter 30.
[0086] Referring to FIG. 6, in some embodiments, a thermally conductive layer 123 is arranged between the protrusion 122 and the power elements 311. The protrusion 122 is thermally coupled with the power elements 311 of the inverter 30 through the thermally conductive layer 123.
[0087] Specifically, the thermally conductive layer 123 can be a thermally conductive pad, a thermally conductive gel, or a thermally conductive structure formed by other high-thermal-conductivity materials, which is not limited herein.
[0088] Therefore, the energy storage power supply 100 can set the heat-conducting layer between the convex 122 inside the shell 10 and the power element 311, the heat-conducting layer is flexible, which can make the power element 311 of the inverter 30 and the convex 122 more closely, accelerate the heat conduction process between the inverter 30 and the convex 122, so as to accelerate the heat conduction of the inverter 30 to the shell 10 for heat dissipation.
[0089] In some embodiments, the thickness of the heat-conducting layer 123 is less than 1mm, and the thermal conductivity of the heat-conducting layer 123 is greater than 3W / M / K.
[0090] It can be understood that, due to the height of the heat-conducting layer 123 is too high, which will reduce the heat conduction efficiency between the inverter 30 and the convex 122.
[0091] Therefore, the thickness of the heat-conducting layer 123 of the present application can be set to less than 1mm, and the thermal conductivity of the heat-conducting layer 123 is greater than 3W / M / K, which can ensure the heat conduction efficiency between the inverter 30 and the convex 122, so as to ensure that the heat can be quickly conducted from the power element such as the circuit board device of the inverter 30 to the shell 10.
[0092] In other words, the present application sets the convex 122 inside the shell 10 inside the installation cavity 11, which can reduce the setting height of the heat-conducting layer 123, so that the heat conduction efficiency between the inverter 30 and the shell 10 is optimal.
[0093] Please refer to FIG. 1, in some embodiments, the energy storage power supply 100 further comprises a foot pad 50. The bottom 101 of the shell 10 has a foot pad 50, which is used to contact with the external support surface, so that the bottom 101 of the shell 10 is spaced apart from the external support surface.
[0094] Specifically, the foot pad 50 is arranged on the bottom 101 of the shell 10, on the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply 100, and the appearance is beautiful, on the other hand, the driving airflow between the fan 40 and the heat dissipation structure 12 can flow in a relatively sufficient space, so as to ensure the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.
[0095] In addition, the energy storage power supply 100 of the present application is supported by the foot pad 50, and the human body is not easy to touch the fan 40, which improves the use safety of the energy storage power supply 100.
[0096] Optionally, the foot pad 50 is four, and the four foot pads 50 are respectively located at the four corners of the shell 10. Therefore, the stability of the energy storage power supply 100 on the external support surface can be ensured. Of course, in other embodiments of the present application, the number of foot pads 50 can also be adjusted according to actual needs, and is not limited to four.
[0097] Referring to FIG. 2, in some embodiments, the energy storage power supply 100 further comprises a first cover plate 60. The first cover plate 60 is fixedly installed outside the shell 10 and covers the fan 40. The first cover plate 60 is provided with a ventilation hole 61.
[0098] That is, the first cover plate 60 is arranged at a position corresponding to the position of the fan 40. When the fan 40 is installed on the bottom 101 of the shell 10, the first cover plate 60 is also arranged on the bottom 101 of the shell 10. When the fan 40 is installed on the side 102 of the shell 10, the first cover plate 60 is also arranged on the side 102 of the shell 10. When the fan 40 is installed on the top 103 of the shell 10, the first cover plate 60 is also arranged on the top 103 of the shell 10.
[0099] In the present application, the first cover plate 60 is fixedly installed outside the shell 10 and covers the fan 40 and the heat dissipation fins 121. This can avoid the fan 40 and the heat dissipation fins 121 from being exposed, can protect the fan 40, can avoid the user from touching the heat dissipation fins 121 when taking the energy storage power supply 100 and causing burns, and at the same time, the first cover plate 60 also has a certain aesthetic effect. The first cover plate 60 can be fixedly installed outside the shell 10 by screws or other components, which is not limited herein.
[0100] The first cover plate 60 of the present application is provided with a ventilation hole 61. Through the action of the fan 40, the heat generated by the inverter 30 can be dissipated to the outside through the ventilation hole 61 of the first cover plate 60, thereby achieving the heat dissipation effect of the heat conducted from the inverter 30 to the shell 10.
[0101] In some embodiments, the first cover plate 60 comprises a first bottom plate 62 and a first side plate 63 surrounding the first bottom plate 62. The heat dissipation structure 12 and the first cover plate 60 form an air duct therebetween. The ventilation hole 61 comprises a first ventilation hole 611 and a second ventilation hole 612. The air duct is arranged between the first ventilation hole 611 and the second ventilation hole 612. The first bottom plate 62 is provided with the first ventilation hole 611. The first side plate 63 is provided with the second ventilation hole 612.
[0102] Specifically, the first cover plate 60 is provided with the first ventilation hole 611 and the second ventilation hole 612 at the same time, that is, the first cover plate 60 is provided with ventilation holes in two directions. This can form an independent air duct between the first cover plate 60 and the shell 10, so that the energy storage power supply 100 of the present application can be quickly cooled.
[0103] As shown in FIG. 4, the first vent holes 611 can be multiple, and the multiple first vent holes 611 are arranged in an array. The second vent holes 612 can also be multiple, and the multiple second vent holes 612 can also be arranged in an array. It can be understood that the more the number of the first vent holes 611 and the second vent holes 612 or the larger the aperture, the better the ventilation effect, so that the final heat dissipation effect is better.
[0104] Therefore, the energy storage power supply 100 of the present application can form an independent air duct between the first cover plate 60 and the shell 10 through the first vent holes 611 and the second vent holes 612 on the first cover plate 60, so that the heat dissipation effect of the heat dissipation structure 12 on the shell 10 is better.
[0105] In some embodiments, the first vent holes 611 are air inlets, and the second vent holes 612 are air outlets; or, the second vent holes 612 are air inlets, and the first vent holes 611 are air outlets.
[0106] That is, the first vent holes 611 of the present application can be used as air inlets or air outlets, and when used as air inlets, they are responsible for introducing external cold air into the power supply, or when used as air outlets, they are responsible for discharging internal hot air. The second vent holes 612 can also be used as air inlets or air outlets, and when used as air inlets, they are responsible for introducing external cold air into the power supply, or when used as air outlets, they are responsible for discharging internal hot air, depending on the heat dissipation requirements of the energy storage power supply 100 and the air flow path inside the energy storage power supply 100.
[0107] Among them, the present application can control the direction of the fan 40 to control whether the two vent holes are used as air inlets or air outlets.
[0108] Further, the first vent holes 611 or the second vent holes 612 can be provided with a grille, which can not only play a role in heat dissipation of the energy storage power supply 100, but also block foreign matter from entering the first cover plate 60 of the energy storage power supply 100.
[0109] In some embodiments, the energy storage power supply 100 includes a foot pad. The foot pad is arranged on the side of the first cover plate 60 opposite to the fan 40. The foot pad is used to contact with an external supporting surface, so that the bottom of the first cover plate 60 is spaced apart from the external supporting surface.
[0110] That is, the present application can directly provide a foot pad on the bottom of the first cover plate 60, which can not only make the appearance of the energy storage power supply 100 more beautiful, but also make the driving air flow between the fan 40 and the heat dissipation structure 12 flow in a more sufficient space, thereby ensuring the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.
[0111] Optionally, the four foot pads 50 are respectively arranged at the four corners of the first cover plate 60, so as to ensure the stability of the energy storage power supply 100 on the external supporting surface. Of course, the number of the foot pads 50 can be adjusted according to actual needs in other embodiments of the present application, and is not limited to four.
[0112] Referring to FIGS. 2 and 4, in some embodiments, the energy storage power supply 100 comprises the foot pads 50. The first bottom plate 62 of the first cover plate 60 is provided with the perforations 64 corresponding to the foot pads 50. The foot pads 50 are fixedly arranged at the bottom of the first cover plate 60 through the perforations 64, and the foot pads 50 are used to contact the external supporting surface, so that the bottom of the first cover plate 60 is arranged in a spaced manner with the external supporting surface.
[0113] In one embodiment, as shown in FIG. 4, when the bottom of the shell 10 is provided with the heat dissipation fins 121, the first connecting columns 1212 can be arranged on the heat dissipation fins 121, and the first connecting holes corresponding to the first connecting columns 1212 can be arranged on the foot pads 50. The foot pads 50 can be fixed at the bottom of the shell 10 through the cooperation of the first connecting columns 1212 and the first connecting holes, so that the pressure received by the foot pads 50 can be directly conducted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further avoid the first cover plate 60 from being crushed.
[0114] In another embodiment, when the bottom of the shell 10 is provided with the heat dissipation fins 121, the second connecting holes can also be arranged on the heat dissipation fins 121, and the second connecting columns 52 corresponding to the second connecting holes can be arranged on the foot pads 50. The foot pads 50 can be fixed at the bottom of the shell 10 through the cooperation of the second connecting columns 52 and the second connecting holes, so that the pressure received by the foot pads 50 can be directly conducted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further avoid the first cover plate 60 from being crushed.
[0115] In yet another embodiment, the first clamping columns corresponding to the perforations 64 can be arranged on the foot pads 50, and the second clamping columns with clamping holes corresponding to the clamping columns can be arranged on the shell 10, so that the first clamping columns can be clamped with the second clamping columns through the perforations 64. In this way, the foot pads 50 can be stably installed together with the shell 10 through the first cover plate 60, so that the pressure received by the foot pads 50 can be directly conducted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further avoid the first cover plate 60 from being crushed.
[0116] Similarly, the foot pads 50 are arranged at the bottom of the first cover plate 60, on one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply, and the appearance is beautiful, and on the other hand, the driving airflow between the fan 40 and the heat dissipation structure 12 can flow in a relatively sufficient space, so as to ensure the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.
[0117] Optionally, the four foot pads 50 are respectively arranged at the four corners of the first cover plate 60, so as to ensure the stability of the energy storage power supply 100 on the external supporting surface. Of course, the number of the foot pads 50 can be adjusted according to actual needs in other embodiments of the present application, and is not limited to four.
[0118] Referring to FIG. 2, in some embodiments, the shell 10 comprises a first shell 13 and a second shell 14, which are buckled to each other to form the mounting cavity 11. The inverter 30 is fixed on the first shell 13, and the battery module 20 is fixed on the second shell 14.
[0119] Specifically, the first shell 13 is a lower shell, and the second shell 14 is an upper shell. The first shell 13 can be provided with a first clamping member 131, and the second shell 14 can be provided with a second clamping member 141 which is clamped with the first clamping member 131. The first clamping member 131 can be a hollow first clamping column as shown in FIG. 3, and the second clamping member 141 can be a solid second clamping column which is correspondingly matched with the first clamping column as shown in FIG. 2.
[0120] The first shell 13 and the second shell 14 of the present application can be pressure die cast, which is simple in structure and convenient to manufacture.
[0121] The shell 10 of the present application is designed as a spliced structure formed by the first shell 13 and the second shell 14, which facilitates the assembly of the energy storage power supply 100.
[0122] It can be understood that when the shell 10 is designed as a spliced structure, the corresponding heat dissipation structure 12 on the shell 10 can be a spliced structure or can not be a spliced structure, which is not limited herein.
[0123] Referring to FIG. 4, in some embodiments, the first shell 13 is an aluminum alloy shell, the inner side of the first shell 13 is thermally coupled with the inverter 30, and the outer side of the first shell 13 is formed with the heat dissipation structure 12.
[0124] It can be understood that the first shell 13 is an aluminum alloy shell, and the aluminum alloy has good heat conduction performance, so the heat dissipation performance of the first shell 13 made of aluminum alloy material is also good. Since the outer side of the first shell 13 is formed with the heat dissipation structure 12, the heat dissipation structure 12 is also made of aluminum alloy material, and the heat dissipation performance of the corresponding heat dissipation structure 12 of the present application is also good.
[0125] In addition, since the aluminum alloy has a lower density and a higher strength compared with traditional metal materials such as steel and copper, the strength of the first shell 13 made of aluminum alloy material is good and is not easy to be damaged.
[0126] In some embodiments, the first shell 13 is subjected to an anodization treatment.
[0127] Specifically, the first shell 13 is subjected to an anodization treatment, which can improve the corrosion resistance of the first shell 13 while improving the surface emissivity, thereby improving the radiation capacity of the first shell 13.
[0128] Referring to FIGS. 3 and 5, in some embodiments, the first shell 13 is provided with a receiving cavity 132, and the inverter 30 is fixedly installed in the receiving cavity 132.
[0129] Specifically, the inverter 30 can be fixedly installed in the receiving cavity 132 by screws or bolts, or can be fixedly installed in the receiving cavity 132 by other means, which is not limited herein.
[0130] In this way, the inverter 30 of the present application can be fixedly installed in the receiving cavity 132, so as to be cooled by the heat dissipation structure 12 formed on the outside of the first shell 13, achieving a better cooling effect.
[0131] Referring to FIGS. 1 and 2, in some embodiments, the second shell 14 is provided with a panel 142, and the panel 142 is provided with an electric energy output port 1421.
[0132] That is, the energy storage power supply 100 of the present application can output electric energy through the electric energy output port 1421 provided on the panel 142 of the second shell 14.
[0133] In some embodiments, the first shell 13 and the second shell 14 are upper and lower buckling, and the first shell 13 is arranged on the lower side of the second shell 14.
[0134] That is, the shell 10 of the present application can be composed of two half shells buckling up and down, which is simple in structure and easy to mass-produce the shell 10.
[0135] In addition, since the heat dissipation structure 12 is arranged on the outside of the first shell 13 and the first shell 13 is arranged on the lower side of the second shell 14, the energy storage power supply 100 of the present application is equivalent to arranging the heat dissipation structure 12 below the shell 10, so that the heat dissipation structure 12 is not easy to be contacted and can be protected from being damaged.
[0136] In some embodiments, a temperature sensor is installed on the heat dissipation structure 12 to detect the temperature of the heat dissipation structure 12. The energy storage power supply 100 controls the start-stop or rotation speed of the fan 40 based on the temperature of the heat dissipation structure 12.
[0137] That is, the energy storage power supply 100 can also be installed with a temperature sensor on the shell 10. When the temperature sensor detects that the temperature of the heat dissipation structure 12 is greater than or equal to the first threshold value, the energy storage power supply 100 can automatically control the fan 40 to start, so as to ensure that the temperature of the heat dissipation structure 12 does not become too high, and facilitate timely heat dissipation of the energy storage power supply 100.
[0138] When the temperature sensor detects that the temperature of the heat dissipation structure 12 is less than or equal to the second threshold value, the energy storage power supply 100 can automatically control the fan 40 to stop working, so as to improve the heat dissipation efficiency of the fan 40 and save energy consumption.
[0139] The first threshold value may be, for example, 38°, 39°, 40°, 43°, 45°, 48°, 50°, 51°, 55°, or 60°, without limitation.
[0140] The second threshold value may be, for example, 28°, 29°, 29.5°, 30°, 31°, 34°, 35°, 36°, 37°, or 38°, without limitation.
[0141] In this way, the application can timely sense the temperature of the heat dissipation structure 12 by setting a temperature sensor on the heat dissipation structure 12, so that the energy storage power supply 100 can timely control the fan 40 to start to start heat dissipation, and timely control the fan 40 to stop working to stop heat dissipation.
[0142] Referring to FIG. 7, in some embodiments, the energy storage power supply 100 further includes a semiconductor refrigeration device 124. The semiconductor refrigeration device 124 includes a hot end and a cold end. The cold end is thermally coupled to the inverter 30, and the hot end is thermally coupled to the heat dissipation structure 12.
[0143] It can be understood that the heat dissipation structure 12 can include a semiconductor refrigeration device 124. The semiconductor refrigeration technology is a high-efficiency refrigeration and heat pump technology. It uses semiconductor materials as refrigerants and generates refrigeration effect through electric current. This technology has the advantages of energy saving, environmental protection, small size, and good refrigeration effect, and has been widely used in various fields. The principle of semiconductor refrigeration technology is to achieve refrigeration through electric current transmission and thermoelectric effect of semiconductor materials. When electric current passes through semiconductor materials, one side of the semiconductor materials becomes hot and the other side becomes cold. This is because the carriers of the semiconductor materials produce energy transfer under the action of the thermoelectric field. By using this effect, heat can be transferred from the cold side to the hot side, thereby achieving the effect of refrigeration.
[0144] In the embodiment, the cold end of the semiconductor refrigeration device 124 is in thermal connection with the inverter 30, and the hot end is in thermal connection with the heat dissipation structure 12. The air at the hot end of the semiconductor refrigeration device 124 is transferred to the outside through the heat dissipation structure 12 and the fan 40, so as to achieve the purpose of refrigeration at the cold end and reduce the temperature of the inverter 30, thereby ensuring the cooling effect of the energy storage power supply 100.
[0145] At the same time, since the semiconductor refrigeration device 124 can accurately control the temperature, the temperature of the shell 10 can be adjusted according to the power consumption parameters of the semiconductor refrigeration device 124 according to the user's demand, so as to achieve intelligent adjustment of the temperature of the shell 10 and improve the user experience.
[0146] Referring to FIG. 7, the heat dissipation structure 12 further comprises a heat preservation member 125 surrounding the semiconductor refrigeration device 124. It can be understood that, since the semiconductor refrigeration device 124 refrigerates at one end and heats at the other end during operation, the heat preservation member 125 is needed to prevent the external environment from affecting the use performance of the semiconductor refrigeration device 124. The heat preservation member 125 needs to be made of an insulating material with low thermal conductivity and good compression performance, such as pearl wool, foam and the like. Of course, in other embodiments of the present application, the material of the heat preservation member 125 can also be adjusted according to actual needs, and is not limited to the above.
[0147] Optionally, the thickness of the heat preservation member 125 is determined according to the compression performance of the heat preservation material, and is generally 1.5-2 times the thickness of the semiconductor refrigeration device 124. The heat preservation member 125 is filled between the inverter 30 and the heat dissipation structure 12, and is compressed and filled by the locking force of the heat dissipation structure 12 from bottom to top, so as to ensure good heat preservation performance.
[0148] Please refer to FIG. 8. In some embodiments, the side of the heat dissipation structure 12 facing the inverter 30 has a mounting groove 126, and the semiconductor refrigeration device 124 is mounted in the mounting groove 126.
[0149] It can be understood that the heat dissipation structure 12 serves as a support for the semiconductor refrigeration device 124 and the fan 40, so that the heat dissipation structure 12, the semiconductor refrigeration device 124 and the fan 40 form a heat dissipation whole, facilitating assembly. Mounting the semiconductor refrigeration device 124 in the mounting groove 126 can improve the contact area between the hot end of the semiconductor refrigeration device 124 and the heat dissipation structure 12, thereby facilitating the heat dissipation effect of the heat dissipation structure 12 on the hot end of the semiconductor refrigeration device 124.
[0150] Optionally, the size of the mounting groove 126 is slightly larger than the size of the semiconductor refrigeration device 124, and the depth of the mounting groove 126 is between 0.1 mm and 0.2 mm. The main purpose is to position the semiconductor refrigeration device 124, and at the same time, a heat conduction material is applied at the position where the mounting groove 126 contacts the semiconductor refrigeration device 124, so as to eliminate the thermal resistance of heat conduction. The heat conduction material is generally a flowable heat conduction material such as silicone grease.
[0151] Referring to Fig. 4, in some embodiments, the outer wall of the installation cavity 11 has a heat dissipation opening 15, and the heat dissipation structure 12 is installed on the heat dissipation opening 15.
[0152] Specifically, the heat dissipation structure 12 can be fixedly installed on the heat dissipation opening 15 by screws or bolts.
[0153] In this way, the heat dissipation structure 12 of the present application can be installed on the heat dissipation opening 15 of the outer wall of the installation cavity 11, facilitating heat dissipation of the inverter 30 through the heat dissipation opening 15.
[0154] Referring to Figs. 4 and 8, in some embodiments, the heat dissipation structure 12 can include an installation portion 127 and a fixed flange 128 arranged around the installation portion 127. The installation portion 127 extends into the heat dissipation opening 15, and the semiconductor refrigeration element 124 is installed on the installation portion 127. The fixed flange 128 is fixed on the outer wall of the installation cavity 11 by a connecting member to close the heat dissipation opening 15 by the heat dissipation structure 12.
[0155] It can be understood that the heat dissipation structure 12 is an independent module attached to the outer wall of the installation cavity by the connecting member. On the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply, and the appearance is beautiful. On the other hand, the cold end of the semiconductor refrigeration element 124 can be tightly attached to the inverter 30, thereby improving the cooling effect of the inverter 30.
[0156] Optionally, referring to Fig. 9, a sealing member 129 is sleeved on the installation portion 127. The outer wall of the sealing member 129 abuts against the inner wall of the heat dissipation opening 15 of the housing 10. Thus, the connection sealing property of the heat dissipation structure 12 and the housing 10 can be improved, thereby avoiding external dirt or liquid from entering the energy storage power supply 100 and reducing the failure rate of the energy storage power supply 100.
[0157] Optionally, the heat dissipation structure 12 is an integrated die casting. Thus, the heat dissipation fins 121, the installation portion 127, and the fixed flange 128 can be formed at one time, facilitating the manufacturing of the heat dissipation structure 12 and being conducive to reducing the weight of the heat dissipation structure 12, thereby being conducive to the lightweight design of the energy storage power supply.
[0158] Referring to Fig. 9, in some embodiments, the energy storage power supply 100 further includes a heat dissipation bracket 32. The inverter 30 includes a circuit board 31, and the circuit board 31 is provided with a power element 311. The heat dissipation bracket 32 is installed on the housing 10, and the heat dissipation bracket 32 fixes the circuit board 31 and is thermally coupled with the power element 311. The heat dissipation bracket 32 is also thermally coupled with the heat dissipation structure 12.
[0159] It can be understood that the circuit board 31 is fixed on the heat dissipation support 32, which can play a role in protecting the power element 311. The heat dissipation support 32 is in thermal connection with the circuit board 31, and the heat dissipation support 32 is in thermal connection with the heat dissipation structure 12. In actual working process, the heat generated by the power element 311 on the circuit board 31 can be transmitted from the circuit board 31 to the heat dissipation support 32, and then dissipated to the outside by the heat dissipation structure 12 and the fan 40, which can improve the cooling effect of the inverter 30, thereby ensuring the heat dissipation effect of the energy storage power supply 100.
[0160] Optionally, the heat dissipation support 32 is provided with heat dissipation fins 32121. The heat dissipation fins 32121 provided on the heat dissipation support 32 can play a role in heat dissipation, and the cooperation of the heat dissipation fins 32121 and the heat dissipation structure 12 can ensure the cooling effect of the inverter 30, thereby ensuring that the energy storage power supply 100 has good heat dissipation function. In the embodiments of the present application, the number and area of the heat dissipation fins 32121 can be selected according to actual needs, so that they have relatively small area while ensuring the heat dissipation effect, thereby facilitating the lightweight design of the energy storage power supply.
[0161] Please refer to FIG. 10. In some embodiments, the heat dissipation support 32 includes a base 321 and a second cover plate 322. The base 321 includes a second bottom plate 3211 and two second side plates 3212 connected to both ends of the second bottom plate 3211. The second bottom plate 3211 is provided with a heat-conducting pad 312 between the power element 311. The second cover plate 322 is connected with the two second side plates 3212, and the second cover plate 322 is provided with a limiting piece 3221 for limiting the battery module 20.
[0162] It can be understood that, as shown in FIG. 9, the base 321 is formed as a U-shaped plate, and the second bottom plate 3211 is provided with a heat-conducting pad 312 between the circuit board 31. The second side plate 3212 is provided with heat dissipation fins 32121. The heat generated by the power element 311 on the circuit board 31 can be quickly conducted to the heat dissipation support 32 through the heat-conducting pad 312, and then quickly dissipated through the heat dissipation fins 32121, thereby ensuring the heat dissipation effect of the circuit board 31.
[0163] The second cover plate 322 is provided with a limiting piece 3221 for limiting the battery module 20. The limiting piece 3221 can avoid the inverter 30 from shaking relative to the battery module 20, and can also provide positioning for the installation of the inverter 30, thereby facilitating assembly and improving the reliability of the energy storage power supply.
[0164] Optionally, as shown in FIG. 10, the second bottom plate 3211 is provided with a receiving groove 32111 for accommodating the semiconductor refrigeration element 124. The size of the receiving groove 32111 is slightly larger than that of the semiconductor refrigeration element 124, and the depth of the receiving groove 32111 is between 0.1 mm and 0.2 mm. The main purpose is to position the semiconductor refrigeration element 124, and at the same time, a heat-conducting material is applied at the position where the receiving groove 32111 contacts the semiconductor refrigeration element 124 to eliminate the thermal resistance of heat conduction. Generally, the heat-conducting material is a flowable heat-conducting material such as silicone grease. In this way, the positioning effect of the semiconductor refrigeration element 124 on the heat dissipation support 32 can be improved, and the heat dissipation effect of the semiconductor refrigeration element 124 on the heat dissipation support 32 can be improved.
[0165] Optionally, as shown in FIG. 10, the inverter 30 further includes an insulating plate 33. The insulating plate 33 is arranged between the second bottom plate 3211 and the circuit board 31, and the insulating plate 33 is provided with an avoiding hole 351 corresponding to the heat-conducting pad 312. It can be understood that the added insulating plate 33 can ensure the insulation between the circuit board 31 and the second bottom plate 3211, avoid the short circuit phenomenon caused by the electrification of the heat dissipation support 32, and thus improve the working reliability of the energy storage power supply. The avoiding hole 351 provided on the insulating plate 33 can ensure that the heat-conducting pad 312 directly abuts against the second bottom plate 3211, and ensure that the heat on the circuit board 31 can be quickly conducted to the heat dissipation support 32, thereby facilitating the improvement of the heat dissipation efficiency of the inverter 30.
[0166] In some embodiments, the energy storage power supply 100 further includes a heat pipe, which is thermally coupled with the heat dissipation structure 12.
[0167] Specifically, the heat pipe is generally a closed copper pipe with a phase change medium, and the heat pipe has very strong heat conductivity. The heat pipe is arranged in the receiving cavity 132 and is attached to the heat dissipation structure 12. The heat is mainly generated from the inverter 30, and different power elements 311 of the inverter 30 generate different amounts of heat, which causes different temperatures in different regions of the heat dissipation structure 12, and an extremely high temperature region can occur.
[0168] Therefore, the heat pipe can guide the heat in the high temperature region to the low temperature region, achieve uniform heat dissipation of the heat dissipation structure 12, better heat dissipation, and better heat dissipation effect.
[0169] Please refer to FIG. 2. In some embodiments, the battery module 20 can be arranged above the inverter 30, and a protection plate 21 can be arranged on the side of the battery module 20 opposite to the inverter 30. The protection plate 21 is used to protect the battery module 20.
[0170] In detail, the protection plate 21 can prevent the inverter 30 or other external objects from directly contacting the battery module 20, thereby avoiding physical damage that may be caused by friction, collision or extrusion. This is crucial for maintaining the structural integrity of the battery module 20 and prolonging its service life.
[0171] In addition, in some cases, the inverter 30 may generate electromagnetic interference or electrical noise. The protection plate 21 can serve as an electrical barrier to reduce the impact of these disturbances on the battery module 20, ensuring that the battery module 20 can work stably and safely.
[0172] In addition, the battery module 20 will generate heat during operation, and the inverter 30 can also be a heat source. The protection plate 21 can to some extent act as a heat shield, reducing heat exchange between the battery module 20 and the inverter 30, and helping to maintain the battery module within the appropriate operating temperature range.
[0173] If the inverter 30 fails or produces abnormalities such as short circuit, overheating, etc., the protection plate 21 can serve as an additional safety barrier to prevent these failures from directly damaging the battery module 20. It can also reduce the risk of fire, explosion and other safety hazards to some extent.
[0174] The above embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be interpreted as a limitation on the scope of the patent of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be subject to the appended claims.
Claims
1. An energy storage power supply, wherein, The energy storage power supply comprises: a housing having a mounting cavity, the housing being formed with a heat dissipation structure; a battery module mounted in the mounting cavity; an inverter mounted in the mounting cavity, thermally coupled with the heat dissipation structure, and electrically connected with the battery module; and a fan mounted on the outside of the housing, the fan forming an air flow through the heat dissipation structure. The heat dissipation structure comprises a plurality of heat dissipation fins arranged on the bottom, sides and / or top of the housing.
2. The energy storage power supply of claim 1, wherein, The plurality of heat dissipation fins are arranged radially and the middle part forms a mounting space, and the fan is mounted in the mounting space.
3. The energy storage power supply of claim 2, wherein, The arrangement density of the heat dissipation fins gradually changes from dense to sparse from the center to the periphery, and the arrangement height of the heat dissipation fins gradually changes from low to high from the center to the periphery.
4. The energy storage power supply of claim 2 or 3, wherein, The fan is a centrifugal fan or an axial flow fan.
5. The energy storage power supply of any of claims 1-4, wherein, The heat dissipation structure further comprises a protrusion located in the mounting cavity and fixedly arranged on the housing, and the protrusion is thermally coupled with a power element of the inverter.
6. The energy storage power supply of any one of claims 1-5, wherein, A thermally conductive layer is arranged between the protrusion and the power element, and the protrusion is thermally coupled with the power element of the inverter through the thermally conductive layer.
7. The energy storage power supply of claim 6, wherein, The thickness of the thermally conductive layer is less than 1 mm, and the thermal conductivity coefficient of the thermally conductive layer is greater than 3 W / M / K.
8. The energy storage power supply of claim 7, wherein, The energy storage power supply further comprises a foot pad, the bottom of the housing is provided with a foot pad, the foot pad is used to contact with an external supporting surface, so that the bottom of the housing is arranged spaced apart from the external supporting surface.
9. The energy storage power supply of any of claims 1-8, wherein, The energy storage power supply further comprises a first cover plate, the first cover plate is fixedly mounted on the outside of the housing and covers the fan, and the first cover plate is provided with a ventilation hole.
10. The energy storage power supply of any of claims 1-9, wherein, The first cover plate covers the heat dissipation structure, the first cover plate comprises a first bottom plate and a first side plate arranged around the first bottom plate, an air duct is formed between the first cover plate and the heat dissipation structure, the ventilation hole comprises a first ventilation hole and a second ventilation hole, the air duct is arranged between the first ventilation hole and the second ventilation hole, the first bottom plate is provided with the first ventilation hole, and the first side plate is provided with the second ventilation hole.
11. The energy storage power supply of claim 10, wherein, The energy storage power supply further comprises a foot pad, the foot pad is arranged on the side of the first cover plate opposite to the fan, the foot pad is used to contact with an external supporting surface, so that the bottom of the first cover plate is arranged spaced apart from the external supporting surface.
12. The energy storage power supply of claim 10 or 11, wherein, The energy storage power supply further comprises a foot pad, the bottom plate of the cover plate is provided with a through hole corresponding to the foot pad, the foot pad is fixedly arranged on the bottom of the cover plate through the through hole, the foot pad is used to contact with an external supporting surface, so that the bottom of the cover plate is arranged spaced apart from the external supporting surface.
13. The energy storage power supply of any of claims 10-12, wherein, The housing comprises a first housing and a second housing, the first housing and the second housing are buckled to each other to form the mounting cavity, the inverter is fixed on the first housing, the first housing is provided with a heat dissipation structure, and the battery module is fixed on the second housing.
14. The energy storage power supply of any one of claims 1-13, wherein, The first housing is an aluminum alloy housing, the inside of the first housing is thermally coupled with the inverter, and the outside of the first housing is formed with the heat dissipation structure.
15. The energy storage power supply of claim 14, wherein, 16. The energy storage power supply of claim 15, wherein, The first shell is subjected to an anodization treatment.
17. The energy storage power supply of any of claims 14-16, wherein, The first shell is provided with a receiving cavity, and the inverter is fixedly installed in the receiving cavity.
18. The energy storage power supply of any of claims 14-17, wherein, The second shell is provided with a panel, and the panel is provided with an electric energy output port.
19. The energy storage power supply of any of claims 14-18, wherein, The first shell is buckled with the second shell from top to bottom, and the first shell is arranged on the lower side of the second shell.
20. The energy storage power supply of any of claims 1-19, wherein, A temperature sensor is installed on the heat dissipation structure to detect the temperature of the heat dissipation structure, and the energy storage power supply controls the start-stop or rotation speed of the fan based on the temperature of the heat dissipation structure.
21. The energy storage power supply of any of claims 1-20, wherein, The energy storage power supply further comprises a semiconductor refrigeration device, the semiconductor refrigeration device comprises a hot end and a cold end, the cold end is thermally coupled with the inverter, and the hot end is thermally coupled with the heat dissipation structure.
22. The energy storage power source of claim 21, wherein, The side of the heat dissipation structure facing the inverter is provided with a mounting groove, and the semiconductor refrigeration device is installed in the mounting groove.
23. The energy storage power supply of claim 21 or 22, wherein, The outer wall of the mounting cavity is provided with a heat dissipation port, and the heat dissipation structure is installed on the heat dissipation port.
24. The energy storage power source of claim 23, wherein, The heat dissipation structure comprises a mounting portion and a fixed flange arranged around the mounting portion, the mounting portion extends into the heat dissipation port, the semiconductor refrigeration device is installed on the mounting portion, and the fixed flange is fixed on the outer wall of the mounting cavity by a connecting piece to close the heat dissipation port by the heat dissipation structure.
25. The energy storage power supply of any one of claims 6-8, wherein, The energy storage power supply further comprises a heat dissipation support, The inverter comprises a circuit board, and the circuit board is provided with the power element; The heat dissipation support is installed on the shell, the heat dissipation support fixes the circuit board and is thermally coupled with the power element, and the heat dissipation support is also thermally coupled with the heat dissipation structure.
26. The energy storage power source of claim 25, wherein, The heat dissipation support comprises: a base, the base comprises a second bottom plate and two second side plates, the two second side plates are respectively connected to both ends of the second bottom plate; a heat conduction pad is arranged between the second bottom plate and the power element; and a second cover plate, the second cover plate is connected with the two second side plates, and the second cover plate is provided with a limiting piece for limiting the battery module.
27. The energy storage power source of any of claims 1-26, wherein, The energy storage power supply further comprises a heat pipe, and the heat pipe is thermally coupled with the heat dissipation structure.
Citation Information
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Inverter device having heat dissipation mechanism
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