Optical assembly, optical module, and related device

Abstract

An optical assembly (1102), an optical module, and a related device. The optical assembly (1102) comprises N optical chips and a coupling chip (300); the N optical chips at least comprise a first optical chip (310) and a second optical chip (320); the standard supported by the first optical chip (310) is different from the standard supported by the second optical chip (320); the first optical chip (310) is used for transmitting a first optical signal to the coupling chip (300) by means of a first light inlet (301) of the coupling chip (300); the second optical chip (320) is used for transmitting a second optical signal to the coupling chip (300) by means of a second light inlet (302) of the coupling chip (300); on the coupling chip (300), the transmission optical path of the first optical signal is different from the transmission optical path of the second optical signal; the coupling chip (300) is used for combining the first optical signal and the second optical signal to obtain a combined optical signal; the coupling chip (300) is further used for transmitting the combined optical signal to an optical fiber assembly (350).

Description

Optical assembly, optical module and related device

[0001] The present application claims priority to the Chinese patent application No. 202411087567.7, filed on August 8, 2024, and entitled "Optical assembly, optical module and related device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of optical communication technology, and in particular, to an optical assembly, an optical module and related device. BACKGROUND

[0003] The optical assembly is an important hardware part in optical communication services, which functions to convert electrical signals into optical signals.

[0004] FIG. 1a is an example diagram of the overall structure of an existing optical assembly, and FIG. 1b is an example diagram of the internal structure of FIG. 1a. The existing optical assembly includes a module body 100, a transmitting transistor outline (TO) 110, and a transmitting TO 120. The transmitting TO 110 includes a laser for emitting a first optical signal, and the transmitting TO 120 includes a laser for emitting a second optical signal. The wavelength of the first optical signal is different from the wavelength of the second optical signal. The module body 100 includes a glass sheet 101 and an optical fiber assembly 102. The glass sheet 101 receives the first optical signal from the transmitting TO 110 and transmits it to the optical fiber assembly 102 for output. The glass sheet 101 receives the second optical signal from the transmitting TO 120 and reflects it to the optical fiber assembly 102 for output.

[0005] However, the existing optical assembly has different lasers located at different positions of the module body 100, thereby increasing the packaging size of the overall optical assembly for emitting multiple optical signals, reducing the integration of the optical assembly, and increasing the power consumption of the overall optical assembly. SUMMARY

[0006] The present application provides an optical assembly, an optical module and related device, which can output multiple optical signals supporting different standards, and reduce the packaging size of the overall optical assembly, improve the integration of the optical assembly, and reduce the power consumption of the overall optical assembly.

[0007] In a first aspect, an optical assembly is provided. The optical assembly includes N optical chips and a coupling chip, where N is an integer greater than or equal to 2. The N optical chips include at least a first optical chip and a second optical chip. The first optical chip supports a first standard, and the second optical chip supports a second standard. The coupling chip includes N input ports and an output port. The N input ports include at least a first input port and a second input port. The first input port is connected to the first optical chip, and the second input port is connected to the second optical chip. The output port is configured to be connected to an optical fiber assembly. The coupling chip is an optical chip based on silicon photonics technology. The coupling chip has high integration and low power consumption, which helps to improve the rate of the optical assembly. The first optical chip is configured to transmit a first optical signal to the coupling chip via the first input port. The second optical chip is configured to transmit a second optical signal to the coupling chip via the second input port. The first optical signal and the second optical signal have different transmission paths in the coupling chip. The coupling chip is configured to combine the first optical signal and the second optical signal to obtain a combined optical signal. The coupling chip is further configured to transmit the combined optical signal to the optical fiber assembly.

[0008] The optical assembly can integrate N optical chips supporting different standards, without the need for independent packaging of the N optical chips supporting different standards. This reduces the overall packaging size of the optical assembly, improves the integration, and meets the demand for miniaturization of the optical assembly supporting multiple different standards. Moreover, in the case where the N optical chips support different standards, the coupling chip effectively improves the coupling efficiency of the N optical signals from the N optical chips to the optical fiber assembly, and improves the signal quality of the combined optical signal. The coupling chip combines the N optical signals to obtain a combined optical signal, and transmits the combined optical signal to the optical fiber assembly. This reduces the number of optical devices included in the optical assembly, and improves the integration of the optical assembly. In the coupling chip, the N optical signals from the N optical chips are transmitted along different optical paths, which effectively reduces the crosstalk between different optical signals, and improves the signal quality and transmission distance of the combined optical signal.

[0009] In an optional implementation of the first aspect, the N optical chips further include a third optical chip, the third optical chip supports a standard different from the standard supported by the first optical chip, and the third optical chip supports a standard different from the standard supported by the second optical chip, the N optical input ports further include a third optical input port, the third optical input port is connected to the third optical chip; the third optical chip is configured to transmit a third optical signal to the coupling chip via the third optical input port, on the coupling chip, a transmission path of the third optical signal is different from a transmission path of the first optical signal, and a transmission path of the third optical signal is different from a transmission path of the second optical signal, and the coupling chip is configured to combine the first optical signal, the second optical signal, and the third optical signal to obtain the combined optical signal.

[0010] With the implementation, the same optical assembly can integrate and package optical chips supporting three different standards, the coupling chip can combine three optical signals from the three optical chips supporting different standards to obtain a combined optical signal, and the coupling chip transmits the combined optical signal to the fiber assembly, thereby improving the coupling efficiency.

[0011] In an optional implementation of the first aspect, the standard supported by the first optical chip is GPON, the standard supported by the second optical chip is 50GPON, and the standard supported by the third optical chip is 10GPON.

[0012] With the implementation, the same optical assembly can integrate and package optical chips supporting three different standards, the coupling chip can combine three optical signals from the three optical chips supporting different standards to obtain a combined optical signal, and the coupling chip transmits the combined optical signal to the fiber assembly, thereby improving the coupling efficiency.

[0013] In an optional implementation of the first aspect, the coupling chip includes a substrate, and a combiner, a first optical waveguide, a second optical waveguide, and a combined optical waveguide integrated on the substrate, a first end of the first optical waveguide is connected to the first optical input port, a second end of the first optical waveguide is connected to the combiner, a first end of the second optical waveguide is connected to the second optical input port, a second end of the second optical waveguide is connected to the combiner, a first end of the combined optical waveguide is connected to the combiner, and a second end of the combined optical waveguide is connected to the optical output port; the combiner is configured to receive the first optical signal via the first optical waveguide and receive the second optical signal via the second optical waveguide, combine the first optical signal and the second optical signal to obtain the combined optical signal, and transmit the combined optical signal to the optical output port via the combined optical waveguide.

[0014] According to the implementation, the coupling chip includes the first optical waveguide and the second optical waveguide, so that the transmission path of the first optical signal on the coupling chip is isolated from the transmission path of the second optical signal on the coupling chip, the crosstalk between optical signals supporting different standards is avoided, and the signal quality is improved. Moreover, the combiner can successfully combine the optical signals supporting different standards and transmit them to the optical fiber assembly, thereby improving the reliability of the optical assembly.

[0015] According to the first aspect, in an optional implementation, the mode of the first optical signal transmitted via the first optical waveguide matches the mode of the first optical waveguide, and the mode of the second optical signal transmitted via the second optical waveguide matches the mode of the second optical waveguide.

[0016] According to the implementation, the mode of the first optical signal transmitted via the first optical waveguide matches the mode of the first optical waveguide, so that the first optical signal can be stably and efficiently transmitted to the combiner of the coupling chip via the first optical waveguide. If the mode of the first optical signal transmitted via the first optical waveguide does not match the mode of the first optical waveguide, the energy of the first optical signal may be scattered and increased in loss. If the mode of the first optical signal transmitted via the first optical waveguide matches the mode of the first optical waveguide, the energy scattering and loss of the first optical signal can be effectively suppressed, so that the first optical signal can be transmitted to the combiner with low loss via the first optical waveguide, thereby effectively improving the transmission distance of the first optical signal. The mode of the second optical signal transmitted via the second optical waveguide matches the mode of the second optical waveguide, so that the second optical signal can be stably and efficiently transmitted to the combiner of the coupling chip via the second optical waveguide, the energy scattering and loss of the second optical signal can be effectively suppressed, so that the second optical signal can be transmitted to the combiner with low loss via the second optical waveguide, thereby effectively improving the transmission distance of the second optical signal.

[0017] According to the first aspect, in an optional implementation, the mode of each optical signal transmitted via the combiner optical waveguide matches the mode of the combiner optical waveguide.

[0018] According to the implementation, each optical signal in the combined optical signal can be transmitted to the combiner of the coupling chip with low loss.

[0019] In an optional implementation of the first aspect, the first optical chip and the first light inlet are connected by a first coupling optical waveguide, the second optical chip and the second light inlet are connected by a second coupling optical waveguide, the first coupling optical waveguide has a first extension line on the surface of the coupling chip, the first extension line and the first optical waveguide form a first included angle, the second coupling optical waveguide has a second extension line on the surface of the coupling chip, the second extension line and the second optical waveguide form a second included angle, the first included angle has a vertex at the intersection between the first optical waveguide and the first extension line, the first optical waveguide and the first extension line are two sides of the first included angle, the second included angle has a vertex at the intersection between the second optical waveguide and the second extension line, the second optical waveguide and the second extension line are two sides of the second included angle, and the first included angle and the second included angle are acute angles.

[0020] According to the implementation, when the first included angle and the second included angle are both acute angles, the energy of the first optical signal emitted from the first optical chip and the second optical signal emitted from the second optical chip, which is re-injected into the laser of the first optical chip and the second optical chip, is effectively suppressed, so that the stability of the laser is improved, the stability and reliability of each optical chip included in the optical assembly are improved, and the signal quality is effectively improved.

[0021] In an optional implementation of the first aspect, the substrate further integrates a first light splitting module and a second light splitting module, the first light splitting module is connected between the first light inlet and the combiner, the first light splitting module is further connected to a first detection module, the second light splitting module is connected between the second light inlet and the combiner, and the second light splitting module is further connected to a second detection module; the first light splitting module is configured to transmit a first sub-optical signal to the first detection module, the first detection module is configured to detect the optical power of the first optical signal according to the first sub-optical signal, the first sub-optical signal is a part of the first optical signal, the second light splitting module is configured to transmit a second sub-optical signal to the second detection module, and the second detection module is configured to detect the optical power of the second optical signal according to the second sub-optical signal, the second sub-optical signal is a part of the second optical signal.

[0022] With the present implementation, the first detection module can detect the power and quality of the first optical signal entering the coupling chip, and the optical assembly can further adjust the output power of the first optical chip based on the first detection module to ensure that the optical power emitted by the first optical chip is within a proper power range, thereby reducing signal attenuation or distortion and improving signal quality, which helps to improve the transmission distance of the optical assembly. Similarly, the second detection module can detect the power and quality of the second optical signal entering the coupling chip, and the optical assembly can further adjust the output power of the second optical chip based on the second detection module to ensure that the optical power emitted by the second optical chip is within a proper power range, thereby reducing signal attenuation or distortion and improving signal quality, which helps to improve the transmission distance of the optical assembly.

[0023] In an optional implementation based on the first aspect, the coupling chip includes a first detection optical port and a second detection optical port, the first detection module is connected to the first detection optical port through an optical waveguide, and the second detection module is connected to the second detection optical port through an optical waveguide.

[0024] With the present implementation, the first detection module is connected to the coupling chip through the first detection optical port, and the second detection module is connected to the coupling chip through the second detection optical port, which facilitates the mounting and maintenance of each detection module and improves the reliability of the structure of the optical assembly.

[0025] In an optional implementation based on the first aspect, at least one of the first detection optical port and the second detection optical port is located at the edge of the coupling chip, and / or at least one of the first detection optical port and the second detection optical port is located at the top surface of the coupling chip, the coupling chip includes a substrate and a combiner integrated on the substrate, and the combiner is located between the top surface and the substrate.

[0026] With the present implementation, the reliability of the connection between each detection module and the coupling chip can be ensured.

[0027] In an optional implementation based on the first aspect, the coupling chip includes a substrate and a combiner integrated on the substrate, the substrate further integrates a heating electrode, the heating electrode is located close to the combiner, the heating electrode is used to transfer heat to the combiner, and the combiner is used to combine the first optical signal and the second optical signal to obtain the combined optical signal under the action of the heat of the heating electrode.

[0028] By heating the combiner by the heating electrode, the combiner temperature can be kept stable, so that the combiner performance is kept in a stable state, the combiner performance change caused by environmental stability change is inhibited, the combiner can combine the first optical signal and the second optical signal to obtain a combined optical signal, the reliability of the combined optical signal is improved, the signal quality of the combined optical signal is improved, and the stability of the combiner is improved

[0029] In an optional implementation based on the first aspect, the first light inlet and the second light inlet are located at a first edge of the coupling chip.

[0030] In the implementation, the first light inlet and the second light inlet are located at the same edge of the coupling chip, and the efficiency of manufacturing the coupling chip is improved.

[0031] In an optional implementation based on the first aspect, the first light inlet is located at a first edge of the coupling chip, and the second light inlet is located at a second edge of the coupling chip, the first edge being different from the second edge.

[0032] In the implementation, the first light inlet and the second light inlet are located at different edges of the coupling chip, the crosstalk between different optical chips is reduced, and the signal quality is improved.

[0033] In an optional implementation based on the first aspect, the light outlet is located at the first edge or the second edge, and the first edge and the second edge are two opposite edges of the coupling chip.

[0034] In the implementation, the light assembly includes the first light inlet, the second light inlet, and the light outlet, which are distributed on the first edge and the second edge of the coupling chip, the packaging size of the light assembly is reduced, and the integration of the light assembly is improved.

[0035] In an optional implementation based on the first aspect, the light assembly further includes a reflection module, the coupling chip includes a third edge and a fourth edge opposite to each other, the third edge is an edge of the coupling chip facing the reflection module, a part of the first light inlet, the second light inlet, and the light outlet are located at the third edge, and the other part of the first light inlet, the second light inlet, and the light outlet are located at the fourth edge, and the reflection module is configured to reflect the combined optical signal to the optical fiber assembly. The reflection module can be a prism, a total reflection prism, a plane mirror, a spherical mirror, an aspherical mirror, or a grating.

[0036] According to the implementation, the light assembly includes the light inlets and the light outlets, which are distributed on the third edge and the fourth edge opposite to the coupling chip, so that the packaging size of the light assembly is reduced and the integration of the light assembly is improved.

[0037] According to the first aspect, in an optional implementation, the first optical chip includes a first substrate and a first laser, and the first laser is integrated on the first substrate by a carrier chip on package (COC) manner; the second optical chip includes a second substrate and a second laser, and the second laser is integrated on the second substrate by a COC manner; and the first substrate and the second substrate are connected to the substrate of the coupling chip, respectively.

[0038] According to the implementation, to improve the reliability of the light assembly structure and improve the coupling efficiency of the first optical signal to the coupling chip and the coupling efficiency of the second optical signal to the coupling chip, the first substrate and the second substrate are connected to the substrate of the coupling chip, for example, the first substrate and the second substrate can be connected to the substrate of the coupling chip by a mechanical fixing manner (for example, clamping connection, bolt connection, riveting connection, locking connection, sliding connection, bolt connection, etc.), and the first substrate and the second substrate can also be connected to the substrate of the coupling chip by welding or glue bonding. In the case that the first substrate is connected to the substrate, the first optical signal emitted by the first optical chip can be accurately incident to the light inlet of the coupling chip, the optical path between the light inlet of the first laser and the light inlet of the coupling chip is aligned, and the coupling efficiency of the first optical signal to the coupling chip is improved. In the case that the second substrate is connected to the substrate, the second optical signal emitted by the second optical chip can be accurately incident to the light inlet of the coupling chip, the optical path between the light inlet of the second laser and the light inlet of the coupling chip is aligned, and the coupling efficiency of the second optical signal to the coupling chip is improved.

[0039] According to the second aspect, the embodiments of the present application provide a light module, which includes a circuit board and one or more light assemblies connected to the circuit board, and the light assembly is described in any one of the first aspect.

[0040] According to the third aspect, the embodiments of the present application provide an optical communication device, which includes a device single board and a light module connected to the device single board, and the light module is described in any one of the first aspect.

[0041] In a fourth aspect, an embodiment of the present application provides a radar, comprising a processor and an optical assembly connected to the processor, the optical assembly being as described in any one of the first aspect; the processor is configured to send a first probe electrical signal and a second probe electrical signal to the optical assembly, the optical assembly is configured to process the first probe electrical signal into the first optical signal, and to process the second probe electrical signal into the second optical signal, and to emit the first optical signal and the second optical signal through the optical fiber assembly; the optical assembly is configured to receive a first return optical signal and a second return optical signal, the first return optical signal being an optical signal reflected by a detection object to the optical assembly according to the first optical signal, and the second return optical signal being an optical signal reflected by the detection object to the optical assembly according to the second optical signal; the optical assembly is configured to process the first return optical signal and the second return optical signal into a first return electrical signal and a second return electrical signal respectively; and the processor is configured to obtain relevant information of the detection object according to the first return electrical signal and the second return electrical signal.

[0042] In a fifth aspect, an embodiment of the present application provides an optical module, comprising a module body, a routing module and a plurality of optical assemblies, the optical assembly being as described in any one of the first aspect; the plurality of optical assemblies are respectively connected to different positions of the module body, the module body is connected to the optical fiber assembly, and the routing module in the module body is configured to turn on an optical path between each of the optical assemblies and the optical fiber assembly.

[0043] In a sixth aspect, an embodiment of the present application provides an optical network, comprising a plurality of optical communication devices, each of the optical communication devices being as described in the third aspect, and details are not repeated here.

[0044] In a seventh aspect, an embodiment of the present application provides a vehicle, the vehicle comprising the radar as described in the fourth aspect. BRIEF DESCRIPTION OF DRAWINGS

[0045] FIG. 1a is an example diagram of the overall structure of an existing optical assembly;

[0046] FIG. 1b is an example diagram of the internal structure of FIG. 1a;

[0047] FIG. 2a is an example diagram of a structure of an optical network;

[0048] FIG. 2b is another example diagram of a structure of an optical network;

[0049] FIG. 3 is an example diagram of the structure of a first embodiment of the optical assembly provided by the present application;

[0050] FIG. 4 is an example diagram of the specific structure of the coupling chip shown in FIG. 3;

[0051] FIG. 5 is an example diagram of connection between a first optical chip and a coupling chip according to the present application;

[0052] FIG. 6 is an example diagram of a second embodiment of an optical assembly according to the present application;

[0053] FIG. 7 is an example diagram of a third embodiment of an optical assembly according to the present application;

[0054] FIG. 8 is an example diagram of a fourth embodiment of an optical assembly according to the present application;

[0055] FIG. 9 is an example diagram of a fifth embodiment of an optical assembly according to the present application;

[0056] FIG. 10 is an example diagram of a sixth embodiment of an optical assembly according to the present application;

[0057] FIG. 11 is an example diagram of an embodiment of a radar according to the present application;

[0058] FIG. 12 is an example diagram of an embodiment of a vehicle according to the present application. DETAILED DESCRIPTION

[0059] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0060] FIG. 2a is an example diagram of a structure of an optical network. For example, the type of the optical network 200 shown in the example is a passive optical network (PON). Then, the optical network 200 includes a first optical communication device 201, an optical distribution network (ODN) 210, and at least one second optical communication device 202. The first optical communication device 201 is connected to the at least one second optical communication device 202 through the ODN 210, and the number of the second optical communication devices 202 included in the optical network is not limited in the example. The ODN 210 includes a passive optical splitter, a feeder optical fiber connected between the first optical communication device 201 and the passive optical splitter, and a drop optical fiber connected between the second optical communication device 202 and the passive optical splitter.

[0061] The first optical communication device 201 shown in the example is an optical line terminal (OLT), and the second optical communication device 202 can be an optical network unit (ONU) or an optical network terminal (ONT). The first optical communication device 201 is connected to a network-side device (such as a switch, a router, etc.) at a higher layer. The second optical communication device 202 can be connected to a user-side device. For example, the second optical communication device 202 provides an Ethernet user port or a plain old telephone service (POTS) user port to connect to a user-side device. It should be noted that the description of the optical network type shown in FIG. 2a is an optional example and is not limited. For example, the optical network can also be applied to an optical transport network (OTN), and the first optical communication device 201 and the second optical communication device 202 are both OTN devices. If the optical network 200 is applied to a wireless mesh network (Mesh), also known as a multi-hop network. The Mesh includes a plurality of transmission devices with Mesh functions. The first optical communication device 201 and the second optical communication device 202 are any two connected transmission devices in the plurality of transmission devices. The optical network 200 shown in the example can also be applied to any one or a combination of data center network (DCN), metropolitan area network (MAN), optical access network (OAN), Ethernet passive optical network (EPON), Ethernet (Ethernet), or flex Ethernet (FlexE), wavelength division multiplexing (WDM) network, etc., and the specific type is not limited.

[0062] Taking the first optical communication device 201 as an example, as the application scene of the optical network is different, the type of the first optical communication device 201 can also be different. For example, the first optical communication device 201 can be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, etc., and can also be a computing server (usually referred to as a server), a high-performance computer (HPC), a storage server, or a memory resource pool, etc. The type of the first optical communication device 201 is not limited in this example, as long as the first optical communication device 201 has an electro-optical conversion function and has an optical interface capable of connecting an optical fiber. For the type of the second optical communication device 202, please refer to the description of the first optical communication device 201, and details are not described herein.

[0063] Taking the first optical communication device 201 as an example, the first optical communication device 201 comprises a device single board and one or more optical modules. The optical module can also be referred to as an optical-electric conversion module, an optical transceiver, an optical transceiver module, etc., and the specific form is not limited. The packaging form of the optical module is not limited in this example. The packaging form of the optical module can be an optical transceiver board (OTB), a near package optics (NPO), an on board optics (OBO) based on optical input & output (OIO) technology, a co-package optics (CPO), a small form-factor pluggable (SFP), etc. The number of device single boards included in the first optical communication device 201 is not limited in this example. The device single board is integrated with the first optical communication device 201, or the device single board is an independent pluggable single board. The number of optical modules included in the first optical communication device 201 is not limited in this example. The optical module can be integrated with the device single board or pluggable on the device single board, etc., and the specific form is not limited. Specifically, the device single board has a processor and a connector for connecting the processor and the optical module. The processor can be one or more chips, or one or more integrated circuits. For example, the processor can be one or more neural processing units (NPUs), optical digital signal processors (oDSPs), field-programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), system on chips (SoCs), central processor units (CPUs), network processors (NPs), microcontroller units (MCUs), programmable logic devices (PLDs), network card chips, storage interface chips or other integrated chips, and the specific form is not repeated. The processor has a sending interface and a receiving interface, and the sending interface and the receiving interface are connected with the connector, respectively. The connector is used to provide an electrical interface to realize pluggable electrical connection with the optical module.The second optical communication device 202 comprises a device single board and one or more optical modules. For details, refer to the description of the first optical communication device 201, which will not be repeated here.

[0064] Fiber to the home (FTTH) is a transmission mode of fiber communication. The access network part of the optical network can achieve wider coverage of the optical network through the FTTH mode. In addition, fiber to the office (FTTO), fiber to the building (FTTB), and the like are also proposed, which are the same or similar communication transmission modes, and can also be the application architecture of the optical assembly provided by the present application. The example shown in FIG. 2b is exemplarily introduced based on FTTH.

[0065] On the basis of FTTH, in order to solve the problem of wireless fidelity (WiFi) coverage of the home network, the optical fiber can be further extended to the room of the user. The optical terminal device providing WiFi access is installed in the room, so as to reduce the distance between the user terminal and the WiFi access point and improve the signal quality. This application scenario is called fiber to the room (FTTR).

[0066] FIG. 2b is another structural example diagram of an optical network. Specifically, FIG. 2b is a system architecture diagram of FTTR. The FTTR network and the FTTH network can be regarded as a cascaded PON system. The OLT in the FTTH is deployed in the center office (CO), and the ONU is deployed in the information box of the home. The master device in the FTTR can replace the ONU in the FTTH. The master device has similar functions to the OLT in the FTTH scenario, and also has similar functions to the ONU in the FTTH scenario. That is to say, the master device in the FTTR is a device with OLT and ONU functions, which can serve as a network device between FTTH and FTTR. The slave device in the FTTR can be deployed in each room of the home and used to connect with the user terminal. The slave device and the ONU in the FTTH are similar network devices in nature. The slave device in the FTTR enters each room and also has the function of an access point (AP) and can directly connect with the user terminal through WiFi. The user terminal can access the slave device and perform data transmission through the WiFi connection established with the slave device.

[0067] It should be understood that multiple slave devices can be deployed in the FTTR, each of which is connected with a corresponding downstream port on the master device, and the master device can implement unified management and configuration of all slave devices. It should be noted that the master device can also be referred to as a "master gateway", a "master optical modem" or a "master FTTR device", etc., and the slave device can also be referred to as a "slave gateway", a "slave optical modem" or a "slave FTTR device", etc., and the specific name is not limited in the present application. The first optical communication device shown in FIG. 2a can also be a master device under the FTTR architecture, and the second optical communication device shown in FIG. 2a can also be a slave device under the FTTR architecture.

[0068] In combination with the architecture of the foregoing FIG. 2a, in some scenarios, when the slave device in the FTTR provides services for the user terminal, the data transmission manner of the user terminal accessing the slave device can be different from the data transmission manner of the devices in the FTTH and the FTTR. For example, the FTTH or the FTTR communicates internally through an optical fiber, and the slave device and the terminal can communicate through a wireless network, which can include but is not limited to WiFi, near field communication (NFC), infrared, Bluetooth or ZigBee, etc.

[0069] It can be understood that FIG. 2a and FIG. 2b are only schematic diagrams, and the optical network can further include other devices, such as a wavelength division device, an optical amplifier device, more second optical communication devices, etc., which are not shown in FIG. 2a and FIG. 2b.

[0070] Based on the foregoing architecture of the optical network, the optical module provided by the embodiment of the present application is introduced as follows. In the example shown in FIG. 2a, the optical module is located in the first optical communication device, and in the example shown in FIG. 2b, the optical module is located in the master device. It should be noted that the embodiment does not limit the specific location of the optical module, as long as the optical module can convert multiple electrical signals into optical signals so that the optical module can emit multiple optical signals. Specifically, the optical module includes a circuit board and an optical assembly electrically connected to the circuit board, wherein the circuit board can be a printed circuit board (PCB). The PCB has packaged a processor, which is used to perform digital signal processing on the electrical signals to be sent to the optical assembly, such as compensation based on a feed forward equalizer (FFE) or a continuous time linear equalizer (CTLE), digital-to-analog conversion, clock recovery, channel compensation, multiple-in multiple-out (MIMO) equalization, etc. It should be noted that the embodiment does not limit the type of digital signal processing performed by the processor. For a description of the type of processor included in the optical module, please refer to the description of the type of processor included in the device board above, and the specific description is omitted. The processor further sends the electrical signals processed by the digital signal processing to the optical assembly, the optical assembly converts the electrical signals into optical signals, and the optical assembly emits the optical signals.

[0071] The commercial deployment of gigabit-capable PON (GPON), 10-gigabit-capable passive optical network (XG-PON), etc. has reached a peak, and the 50-gigabit PON (50G PON) and higher-speed PON standards are currently in the stage of formal commercial use. Therefore, there is a demand for optical modules that can simultaneously implement GPON, 10G PON, 50G PON, and even higher-speed coexistence, that is, the optical module needs to adopt multiple standards in one. For example, a three-standard-in-one optical module that simultaneously supports GPON standards, 10G PON standards, and 50G PON standards. In the existing scheme shown in FIG. 1a and FIG. 1b, TO 110 can support 10G PON standards, and TO 120 can support 50G PON standards when multiple standards are supported in the same optical module. Then, TO 110 supporting 10G PON standards and TO 120 supporting 50G PON standards are independently packaged. Although the independent packaging allows the optical module to support multiple standards, the TOs supporting different standards in the independent packaging state increase the overall packaging size of the optical module outputting multiple optical signals, reduce the integration of the optical assembly, and increase the overall power consumption of the optical assembly.

[0072] Embodiment one

[0073] The structure of the optical assembly provided by the embodiment is described in combination with FIG. 3, wherein FIG. 3 is a structure example diagram of the first embodiment of the optical assembly provided by the present application. Specifically, the optical assembly shown in the embodiment is taken as an example of a BOX packaging, without limitation, for example, the optical assembly can also adopt TO packaging, surface mounted devices (SMD) packaging, dual inline-pin package (DIP) packaging, chip scale package (CSP) packaging, chip-on-board (COB) packaging, etc.

[0074] The optical assembly shown in the embodiment specifically includes N optical chips and a coupling chip 300. The N is any integer greater than or equal to 2. The embodiment takes the value of N as 3 as an example, and the optical assembly provided by the embodiment specifically includes a first optical chip 310, a second optical chip 320 and a third optical chip 330. It should be noted that the description of the number of optical chips included in the optical assembly in the embodiment is an optional example and is not limited. For example, the optical assembly can include two optical chips, and for another example, the optical assembly can include more than three optical chips. Taking the first optical chip 310 as an example, the first optical chip 310 includes a first substrate and a first laser diode (LD) packaged on the surface of the first substrate. The type of the first laser diode is not limited in the embodiment, as long as the first laser diode can realize the conversion of electrical signals to optical signals, for example, the first laser diode can adopt a direct modulation laser (DML), an electro-absorption modulated laser (EML), a vertical cavity surface emitting laser (VCSEL), a distributed bragg reflector (DBR), a fabry-pérot laser, a distributed feedback laser, a modulated grating y-branch (MG-Y laser), a multi-channel interference (MCI laser), a V-cavity laser and a chirped sampled grating-distributed reflector laser (CSG-DR laser). For another example, the first laser diode can also adopt the structure of a laser and a modulator, and the modulator can be a mach-zehnder modulator (MZM) or a miro ring modulator (MRM). Optionally, the first laser diode can be integrated on the first substrate in a chip on carrier (COC) manner. Similarly, the second optical chip 320 includes a second substrate and a second laser diode. For the description of the type of the second laser diode, please refer to the description of the type of the first laser diode, and details are not described herein. The second laser diode is integrated on the second substrate in a COC manner.The third optical chip 330 includes a third substrate and a third laser. The third laser is integrated on the third substrate by COC. It should be noted that the structure of the optical chip in the embodiment is an optional example and is not limited. In order to improve the reliability of the optical assembly structure, and improve the coupling efficiency of the first optical signal to the coupling chip, the coupling efficiency of the second optical signal to the coupling chip, and the coupling efficiency of the third optical signal to the coupling chip, the first substrate is connected to the substrate of the coupling chip, the second substrate is connected to the substrate, and the third substrate is connected to the substrate of the coupling chip. For example, the substrate of the coupling chip can be connected by mechanical fixation (such as clamping connection, bolt connection, rivet connection, locking connection, sliding connection, bolt connection, etc.), and the first substrate can be connected to the substrate of the coupling chip by welding or glue bonding. Taking the first substrate as an example, when the first substrate is connected to the substrate, the first optical signal emitted by the first optical chip can be accurately incident to the optical port of the coupling chip, the optical path between the optical port of the first laser and the optical port of the coupling chip is aligned, and the coupling efficiency of the first optical signal transmitted to the coupling chip is improved.

[0075] In the embodiment, the spacing between different optical chips can be greater than or equal to 0.2 millimeters (mm), so as to improve the assembly efficiency of assembling the optical chips to the coupling chip, facilitate the manufacturing process such as dispensing, and improve the packaging precision. Taking the first optical chip as an example, the first substrate is larger than the first laser. Specifically, the orthographic projection of the first laser is within the coverage range of the orthographic projection of the first substrate, so as to supply power to the first laser and facilitate clamping the entire first optical chip by clamping the first substrate, thereby achieving the assembly of the optical assembly.

[0076] The standards supported by the first optical chip 310, the standards supported by the second optical chip 320, and the standards supported by the third optical chip 330 are different from each other. For example, the first optical chip 310 supports the GPON standard, the second optical chip 320 supports the 50GPON standard, and the third optical chip 330 supports the 10GPON standard. It can be understood that, since the standards supported by the different optical chips are different, the speeds and wavelengths of the different optical chips are also different. For example, the wavelength range of the first optical chip 310 supporting the GPON standard is 1260-1360 nanometers (nm) or 1480-1500 nm. The wavelength range of the third optical chip 330 supporting the 10GPON standard is 1530-1550 nm. The wavelength range of the second optical chip 320 supporting the 50GPON standard is 1570-1610 nm. For another example, the speed of the first optical chip 310 supporting the GPON standard is about 2.488 gigabits per second (Gbps), the speed of the third optical chip 330 supporting the 10GPON standard is about 10 Gbps, and the speed of the second optical chip 320 supporting the 50GPON standard is usually much higher than that of the first optical chip 310 supporting the GPON standard. The speed of the second optical chip 320 supporting the 50GPON standard is about 50 Gbps. The optical chips supporting different standards can also be different in power and mode. Specifically, different powers can be achieved according to the equipment of the optical assembly, the transmission distance of the optical assembly, the type of the connected optical fiber assembly, and the like, to ensure that the optical signals emitted by the optical chips can be transmitted to the optical assembly on the receiving side. The mode supported by the optical chip refers to the type of optical fiber and the corresponding transmission mode that can be compatible with or used in communication. The type of optical fiber includes but is not limited to single mode (SM) or multi mode (MM), and the like. The transmission mode includes but is not limited to Simplex, Half-Duplex, or Full-Duplex, and the like. It should be noted that the type of standard supported by each optical chip is not limited in the embodiment, for example, a standard with a lower speed than the GPON standard can also be supported, for another example, a standard with a higher speed than the 50GPON standard can also be supported, and the like.

[0077] The coupling chip 300 shown in the embodiment specifically comprises a first light inlet 301, a second light inlet 302 and a third light inlet 303. The first light inlet 301 is connected to the first optical chip 310. Then, the first optical chip 310 can input the first optical signal to the coupling chip 300 through the first light inlet 301. The second light inlet 302 is connected to the second optical chip 320. Then, the second optical chip 320 can input the second optical signal to the coupling chip 300 through the second light inlet 302. The third light inlet 303 is connected to the third optical chip 330. Then, the third optical chip 330 can input the third optical signal to the coupling chip 300 through the third light inlet 303. The coupling chip 300 is used to combine the first optical signal, the second optical signal and the third optical signal to obtain a combined optical signal. In the embodiment, on the coupling chip 300, the first optical signal is transmitted along a first optical path, the second optical signal is transmitted along a second optical path, and the third optical signal is transmitted along a third optical path. Any two of the first optical path, the second optical path and the third optical path are different from each other. In the case that any two of the first optical path, the second optical path and the third optical path are different from each other, the crosstalk between the first optical signal, the second optical signal and the third optical signal can be effectively reduced, the signal quality of the first optical signal, the second optical signal and the third optical signal caused by the crosstalk can be avoided, and the transmission distance of the first optical signal, the second optical signal and the third optical signal can be effectively improved.

[0078] The coupling chip 300 further comprises an optical output port 304. The optical output port 304 is connected to the optical fiber assembly 350. In the case that the coupling chip 300 combines the first optical signal, the second optical signal and the third optical signal to obtain a combined optical signal, the coupling chip 300 transmits the combined optical signal to the optical output port 304, so that the combined optical signal can be transmitted to the optical fiber assembly 350. In the embodiment, the optical assembly comprises the optical fiber assembly 350, and in other examples, the optical assembly and the optical fiber assembly 350 can be in a separate structure. The embodiment does not limit the manner in which the optical fiber assembly 350 is connected to the optical assembly, and any manner such as pluggable, pigtail, welding, mechanical fixation or adhesive curing can be used. For example, the optical fiber assembly 350 can be a ferrule connector (FC) type optical fiber connector, a subscriber connector (SC) type optical fiber connector, a lucent connector (LC) type optical fiber connector, a straight tip (ST) type optical fiber connector, a fiber distributed data interface (FDDI) type optical fiber connector, a multi-fiber push-on connector (MPO) and the like. The optical fiber assembly 350 can also be connected to an optical fiber through a movable connector, a modular optical fiber access structure and the like, and the specific manner is not limited. The optical fiber connected by the optical fiber assembly 350 is used to connect another optical assembly.

[0079] The embodiment does not limit the type of the coupling chip 300, for example, the coupling chip 300 can be an optical chip manufactured based on silicon photonics technology, and then the coupling chip 300 can be a silicon optical chip, so that the coupling chip 300 shown in the embodiment has high integration and low power consumption, which helps to improve the rate of the optical assembly and can be better applied to 50GPON and higher speed standards.

[0080] Optionally, the optical assembly shown in the embodiment further comprises a lens set 340 between the coupling chip 300 and the optical fiber assembly 350, and the lens set 340 can comprise one or more lenses. The lens set 340 is used to collimate the combined optical signal emitted by the optical output port 304, and couple the collimated combined optical signal to the optical fiber assembly 350, so as to improve the coupling efficiency of the combined optical signal coupled to the optical fiber assembly 350.

[0081] The structure of the coupling chip 300 is not limited in the embodiment, as long as the coupling chip 300 can realize the functions of transmitting the first optical signal, the second optical signal and the second optical signal along different optical paths respectively, and has the function of combining the first optical signal, the second optical signal and the third optical signal to obtain a combined optical signal, and has the function of transmitting the combined optical signal to the optical fiber assembly 350. The specific structure of the coupling chip 300 is not limited. For example, the specific structure of the coupling chip 300 can be referred to the specific structure example of the coupling chip shown in FIG. 4. It should be noted that the structure of the coupling chip shown in FIG. 4 is an optional example, and the specific structure is not limited. The coupling chip 300 specifically includes a substrate and a combiner 305, a first optical waveguide 306, a second optical waveguide 307, a third optical waveguide 308 and a combined optical waveguide 309 integrated on the substrate. The first end of the first optical waveguide 306 is connected with the first light inlet 301, and the second end of the first optical waveguide 306 is connected with the combiner 305. The first end of the second optical waveguide 307 is connected with the second light inlet 302, and the second end of the second optical waveguide 307 is connected with the combiner 305. The first end of the third optical waveguide 308 is connected with the third light inlet 303, and the second end of the third optical waveguide 308 is connected with the combiner 305. Then, the combiner 305 shown in the embodiment can receive the first optical signal from the first optical waveguide 306, the second optical signal from the second optical waveguide 307 and the third optical signal from the third optical waveguide 308. The combiner 305 combines the first optical signal, the second optical signal and the third optical signal to obtain a combined optical signal. The first end of the combined optical waveguide 309 is connected with the combiner 305, and the second end of the combined optical waveguide 309 is connected with the light outlet 304 of the coupling chip 300. Then, the combined optical signal emitted from the combiner 305 is transmitted to the light outlet 304 through the combined optical waveguide 309, and the combined optical signal emitted from the light outlet 304 can be transmitted to the optical fiber assembly 350.

[0082] The type of the combiner 305 is not limited in the embodiment, for example, the combiner 305 can be a wavelength division multiplexer (WDM) or an optical grating. The optical grating can be an arrayed waveguide grating (AWG) or a variable chirped grating. It should be noted that the type of the combiner 305 is not limited in the embodiment, as long as the combiner can combine N optical signals to obtain a combined optical signal when receiving N optical signals from N optical chips, and can transmit the combined optical signal to the light outlet 304 of the coupling chip 300.

[0083] The embodiment shown, the first light chip 310 out of the first light signal, the second light chip 320 out of the second light signal and the third light chip 330 out of the third light signal, can be low loss transmission to the combiner 305, thereby effectively improving the first light chip 310 out of the first light signal, from the second light chip 320 out of the second light signal and from the third light chip 330 out of the third light signal, the coupling efficiency of the fiber assembly 350. For this, taking the first light chip 310 as an example, in order to realize the first light chip 310 out of the first light signal, which can be low loss transmission to the combiner 305, then, the mode of the first light signal needs to be transmitted through the first optical waveguide 306, which is matched with the mode of the first optical waveguide 306. Specifically, the mode of the first light signal transmitted through the first optical waveguide 306 describes the light field distribution form of the first light signal transmitted through the first optical waveguide 306. According to the different transmission mode and light field distribution form of the first light signal, the mode of the first light signal can be divided into many types, such as single mode, multi mode, transverse mode, longitudinal mode and polarization mode, etc. These modes determine the transmission characteristics of the first light signal in the first optical waveguide 306. The mode of the first optical waveguide 306 refers to the electromagnetic field distribution form that can be stably transmitted in the first optical waveguide 306, which is also called waveguide mode. The mode of the first light signal transmitted through the first optical waveguide 306 is matched with the mode of the first optical waveguide 306, which means that the mode of the first light signal transmitted through the first optical waveguide 306 is consistent or similar with the mode supported by the first optical waveguide 306, so as to ensure that the first light signal can be stably and efficiently transmitted to the combiner 305 through the first optical waveguide 306. If the mode of the first light signal transmitted through the first optical waveguide 306 is not matched with the mode of the first optical waveguide 306, it may cause the energy scattering and loss of the first light signal to increase. However, the mode of the first light signal transmitted through the first optical waveguide 306 is matched with the mode of the first optical waveguide 306 in the embodiment, which can effectively suppress the energy scattering and loss of the first light signal, so as to realize the low loss transmission of the first light signal through the first optical waveguide 306 to the combiner 305, thereby effectively improving the transmission distance of the first light signal. The embodiment does not limit the specific way to ensure that the mode of the first light signal transmitted through the first optical waveguide 306 is matched with the mode of the first optical waveguide 306, for example, a suitable single mode or multi mode optical waveguide can be selected as the first optical waveguide 306, and for example, the first optical waveguide 306 with a specific optical waveguide structure such as ridge waveguide and groove waveguide can be used to match the mode of the first light signal.The mode of the second optical signal transmitted via the second optical waveguide 307 matches the mode of the second optical waveguide 307, and the mode of the third optical signal transmitted via the third optical waveguide 308 matches the mode of the third optical waveguide 308. For details, refer to the description of the mode of the first optical signal transmitted via the first optical waveguide 306 matching the mode of the first optical waveguide 306, which is not repeated here.

[0084] The first optical chip 310 shown in this embodiment can include a heat sink for dissipating heat from the first laser. The heat sink can change the distance between the first laser and the first substrate in the vertical direction, which is perpendicular to the surface of the coupling chip substrate. Then, the optical port of the first laser and the optical port of the combiner can be ensured to be consistent or almost consistent in the vertical direction by the heat sink, effectively reducing the loss of the first optical signal coupling to the combiner and improving the coupling efficiency. It should be noted that the embodiment takes changing the distance between the first laser and the first substrate in the vertical direction by the heat sink to ensure that the optical port of the first laser and the optical port of the combiner are consistent or almost consistent in the vertical direction as an example, which is not limited. For example, the distance between the first laser and the first substrate in the vertical direction can also be changed by a structure such as a spacer. Alternatively, the coupling chip shown in this embodiment can also include a structure such as a spacer between the substrate surface and the combiner, thereby changing the distance between the combiner and the substrate in the vertical direction to ensure that the optical port of the first laser and the optical port of the combiner are consistent or almost consistent in the vertical direction. For details of ensuring that the optical port of the second laser of the second optical chip and the optical port of the combiner are consistent or almost consistent in the vertical direction, and ensuring that the optical port of the third laser of the third optical chip and the optical port of the combiner are consistent or almost consistent in the vertical direction, refer to the above description of ensuring that the optical port of the first laser of the first optical chip and the optical port of the combiner are consistent or almost consistent in the vertical direction, which is not repeated here.

[0085] Continuing with the first optical chip as an example, the first optical chip shown in this embodiment can also ensure that the optical port of the first laser of the first optical chip and the first optical port are consistent or almost consistent in the vertical direction, that the optical port of the second laser of the second optical chip and the second optical port are consistent or almost consistent in the vertical direction, and that the optical port of the third laser of the third optical chip and the third optical port are consistent or almost consistent in the vertical direction. For details, refer to the above description of ensuring that the optical port of the first laser of the first optical chip and the optical port of the combiner are consistent or almost consistent in the vertical direction, which is not repeated here.

[0086] In this embodiment, the combined optical signal emitted from the combiner 305 is transmitted to the light outlet 304 via the combined optical waveguide 304. In order to reduce the loss of the combined optical signal during transmission, the mode of each optical signal transmitted via the combined optical waveguide 309 is matched with the mode of the combined optical waveguide 309. For a description of the mode matching, please refer to the description of the mode matching between the mode of the first optical signal and the mode of the first optical waveguide above, which will not be repeated here. Each optical signal (e.g. the first optical signal, the second optical signal and the third optical signal) transmitted along the combined optical waveguide 309 can have different modes. In order to ensure that each optical signal in the combined optical signal can be transmitted to the combiner 305 with low loss, it is necessary to ensure that the mode of each optical signal transmitted via the combined optical waveguide 304 is matched with the mode of the combined optical waveguide 309. For this purpose, the mode of each optical signal can be preprocessed before the combined optical signal enters the combined optical waveguide 309, for example by using a wavelength selector, a polarization controller or a mode converter, etc. to adjust the mode of each optical signal, so that the mode of each adjusted optical signal is matched with the mode of the combined optical waveguide 309.

[0087] The optical assembly shown in the embodiment can also improve the performance of each optical signal included in the optical assembly. For example, as shown in FIG. 5, which is an example diagram of the connection between a first optical chip and a coupling chip provided in the present application. Taking the first optical chip 310 as an example, the first coupling optical waveguide 501 is connected between the first optical chip 310 and the first light inlet of the coupling chip 300. For a description of the first light inlet, please refer to the corresponding description in FIG. 4, and details are not repeated. The first coupling optical waveguide 501 has a first extension line 502 on the surface of the coupling chip 300. The first extension line 501 and the first optical waveguide 306 have a first included angle 511. Specifically, the vertex of the first included angle 511 is the intersection between the first optical waveguide 306 and the first extension line 502, and the first optical waveguide 306 and the first extension line 502 serve as two sides of the first included angle 511. In the present embodiment, the first included angle 511 is an acute angle. In the case where the first included angle 511 is an acute angle, the energy of the first optical signal that has been emitted from the first optical chip 310 is effectively inhibited from being re-injected (i.e., feedback) into the laser of the first optical chip 310, thereby improving the stability of the laser. Specifically, if the first optical signal that has been emitted from the first laser of the first optical chip 310 is re-injected into the first laser, it will cause interference between the re-injected optical signal and the optical field inside the first laser, resulting in fluctuations in optical intensity, changes in frequency, mode jumps, and the like. The first included angle 511 in the present embodiment, which is an acute angle, can effectively inhibit the re-injection of the first optical signal into the first laser, thereby improving the stability and reliability of the first optical chip 310. Moreover, if part of the energy of the first optical signal is re-injected into the first laser, it will affect the output power, linewidth, noise, and other performance of the first laser, thereby reducing the signal quality of the first optical signal emitted from the first optical chip 310. The present embodiment effectively inhibits the re-injection of the first optical signal into the first optical chip 310, thereby effectively inhibiting the impact on the performance of the first laser caused by the re-injection of the first optical signal into the first optical chip 310, improving the signal quality of the first optical signal emitted from the first optical chip 310, and improving the performance of the first optical chip 310. By inhibiting the re-injection of the first optical signal into the first optical chip 310, damage to the internal elements (such as gain medium, cavity mirror, etc.) of the laser caused by the re-injected first optical signal into the first optical chip 310 can also be avoided, thereby improving the performance and reliability of the first optical chip 310.

[0088] The second optical chip 320 shown in the embodiment is connected with the second light inlet of the coupling chip through a second coupling optical waveguide, the second coupling optical waveguide has a second extension line on the surface of the coupling chip, and the second coupling optical waveguide and the second extension line have a second included angle. The vertex of the second included angle is the intersection between the second optical waveguide and the second extension line, the second optical waveguide and the second extension line are two sides of the second included angle, and the second included angle is an acute angle. Similarly, the third optical chip 330 shown in the embodiment is connected with the third light inlet of the coupling chip through a third coupling optical waveguide, the third coupling optical waveguide has a third extension line on the surface of the coupling chip, and the third coupling optical waveguide and the third extension line have a third included angle. The vertex of the third included angle is the intersection between the third optical waveguide and the third extension line, the third optical waveguide and the third extension line are two sides of the third included angle, and the third included angle is an acute angle. The second included angle and the third included angle shown in the embodiment are acute angles, which can effectively inhibit the re-injection of optical signals into the second optical chip and the third optical chip. For details, refer to the description of the first included angle in FIG. 5.

[0089] The connection positions of the first optical chip 310, the second optical chip 320 and the third optical chip 330 at the edge of the coupling chip 300 are not limited in the embodiment, and specific descriptions can be referred to the following optional examples.

[0090] Example 1

[0091] For example, as shown in FIG. 4, the first light inlet 301 and the second light inlet 302 are located at the first edge 361 of the coupling chip 300. It can be understood that the first light inlet 301 and the second light inlet 302 shown in the embodiment are located at the same edge position (i.e., the first edge 361) of the coupling chip 300. Then, the first optical chip 310 and the second optical chip 320 shown in the embodiment are connected at the same edge position of the coupling chip 300. In the example, the coupling chip 300 includes the first edge 361 and the second edge 362 opposite to each other, wherein the second edge 362 of the coupling chip 300 is the edge of the coupling chip 300 facing the fiber assembly 350, and the second edge 362 of the coupling chip 300 includes the light outlet 304, so as to ensure that the combined optical signal emitted from the light outlet 304 can be successfully transmitted to the fiber assembly 350. The coupling chip 300 shown in the example further includes the third edge 363 and the fourth edge 364, wherein the third edge 363 and the fourth edge 364 are two edges opposite to each other included in the coupling chip 300, and the third edge 363 is connected to the first edge 361 and the second edge 362 at two ends thereof, and the fourth edge 364 is connected to the first edge 361 and the second edge 362 at two ends thereof. It should be noted that the structure of the coupling chip 300 and the number of edges included in the embodiment are not limited.

[0092] Optionally, as shown in FIG. 4, the third light inlet 303 shown in the embodiment is located at the fourth edge 364 of the coupling chip 300, and then the third optical chip 330 is connected to the fourth edge 364 of the coupling chip 300.

[0093] Example 2

[0094] The difference between Example 2 and Example 1 is that the position of the third light inlet 303 is different. FIG. 6 is a structural example diagram of a second embodiment of the optical assembly provided in the application. In Example 2, the third light inlet 303 is located at the second edge 362 of the coupling chip 300, and then the third optical chip 330 is connected to the second edge 362 of the coupling chip 300. The first light inlet 301 and the second light inlet 302 are located at the first edge 361 of the coupling chip 300. For the first edge 361, the second edge 362, the third edge 363 and the fourth edge 364 of the coupling chip 300, please refer to the description in Example 1, and details are not described herein. The light outlet 304 shown in the example is located at the second edge 362 of the coupling chip 300. For the description of the light outlet 304 located at the second edge 362, please refer to the description in Example 1, and details are not described herein.

[0095] It can be understood that, by using the structure of the optical assembly shown in the present example, the light-in ports for connecting the optical chips and the light-out ports for transmitting the combined optical signal to the optical fiber assembly 350 are distributed on the first edge 361 and the second edge 362 of the coupling chip 300, and the third edge 363 and the fourth edge 364 of the coupling chip 300 do not need to be provided with the light-in ports for connecting the optical chips and do not need to be provided with the light-out ports for transmitting the combined optical signal, thereby effectively shortening the width of the optical assembly in the first direction, and further improving the integration of the optical assembly in the first direction. The first direction is the arrangement direction of the third edge 363 and the fourth edge 364 included in the coupling chip 300.

[0096] Example 3

[0097] The difference between Example 3 and Example 1 and Example 2 is that the position of the third light-in port 303 is different. The third light-in port 303 shown in the present example is located on the third edge 363 of the coupling chip, and then the third optical chip 330 shown in the present example is connected to the third edge 363 of the coupling chip 300.

[0098] Example 4

[0099] The difference between Example 4 and the above examples is that the position of the third light-in port 303 is different. The third light-in port 303 shown in the present example is located on the first edge 361 of the coupling chip, and it can be understood that the first light-in port 301, the second light-in port 302 and the third light-in port 303 shown in the present example are located on the same edge (i.e. the first edge 301 shown in the present example) of the coupling chip 300.

[0100] Example 5

[0101] In Examples 1 to 4, the first light-in port 301 and the second light-in port 302 are located on the first edge 361 of the coupling chip 300 as an example, in the present example, the first light-in port 301 and the second light-in port 302 can be located on the second edge 362, the third edge 363 or the fourth edge 364 of the coupling chip 300. For the position of the third light-in port 303 on the coupling chip 300, please refer to the above Examples 1 to 4, and the specific description is not repeated.

[0102] Example 6

[0103] In the example 5, the first input port 301 and the second input port 302 are located on the same edge of the coupling chip 300. In the present example, the first input port 301 and the second input port 302 are located on different edges of the coupling chip 300. For example, the first input port 301 is located on the first edge 361, and the second input port 302 is located on one of the second edge 362, the third edge 363 or the fourth edge 364. For another example, the first input port 301 is located on the second edge 362, and the second input port 302 is located on one of the first edge 361, the third edge 363 or the fourth edge 364. For another example, the first input port 301 is located on the third edge 363, and the second input port 302 is located on one of the first edge 361, the second edge 362 or the fourth edge 364. For another example, the first input port 301 is located on the fourth edge 364, and the second input port 302 is located on one of the first edge 361, the second edge 362 or the third edge 363.

[0104] Example 7

[0105] The difference between the present example and the above examples is that the positions of the output ports are different. FIG. 7 is a structural example diagram of a third embodiment of the optical assembly provided in the present application.

[0106] The output port 304 shown in the present embodiment is located on the third edge 363 of the coupling chip 300. In order to ensure that the combined optical signal emitted from the output port 304 can be successfully transmitted to the fiber assembly 350, the optical assembly shown in the present embodiment further comprises a reflection module 701, which is located on the transmission light path of the combined optical signal 711 emitted from the output port 304. The reflection module 701 is used to change the transmission direction of the combined optical signal 711, and the reflection module 701 emits the combined optical signal 712 whose transmission direction has been changed. The lens group 340 shown in the present example is located on the transmission light path of the combined optical signal 712 emitted from the reflection module 701. The specific type of the reflection module 701 is not limited in the present embodiment, as long as the reflection module 701 can reflect the combined optical signal emitted from the output port 304 to the lens group 340. For example, the reflection module 701 can be a prism, a total reflection prism, a plane mirror, a spherical mirror, an aspherical mirror or a grating, and the like. For a specific example, the reflection module 701 can be a 45° total reflection prism. It should be noted that the reflection module 701 shown in the present embodiment is an optional optical device. In other examples, the optical assembly can not include the reflection module 701, and then the lens group 340 is directly located on the transmission light path of the combined optical signal emitted from the output port 304.

[0107] In the case that the light output port 304 is located on the third edge 363 of the coupling chip 300, the first light input port 301 in the embodiment is located on the third edge 363, and the second light input port 302 and the third light input port 303 are both located on the fourth edge 364 of the coupling chip. Then, the light output port and the light input ports in the embodiment are distributed on the third edge 363 and the fourth edge 364 of the coupling chip 300, effectively shortening the length of the optical assembly along the second direction and improving the integration of the optical assembly along the second direction. The second direction of the optical assembly is the arrangement direction of the first edge 361 and the second edge 362 of the coupling chip 300. The third edge 363 in the example is an edge of the coupling chip 300 facing the reflection module 701. For the relative positions among the first edge 361, the second edge 362, the third edge 363, and the fourth edge 364, please refer to the description in Example 1, and details are not repeated here.

[0108] It should be noted that the third edge 363 is taken as an example in the example, and the light output port 304 can be located on the first edge 361, the second edge 362, or the fourth edge 362 in other examples, and the specific position is not limited. The positions of the first light input port 301, the second light input port 302, and the third light input port 303 in the example are optional examples, and the specific positions are not limited. For example, the specific positions of the first light input port 301, the second light input port 302, and the third light input port 303 on the coupling chip 300 can be referred to any of the above examples, and details are not repeated here.

[0109] Optionally, the substrate of the coupling chip further integrates a heating electrode, and the heating electrode is electrically connected to the PCB of the optical module. For example, the coupling chip includes a metal pad for electrically connecting the heating electrode and the PCB of the optical module, so that the PCB can supply power to the heating electrode, so that the heating electrode generates heat. On the surface of the substrate, the heating electrode is located close to the combiner, so that the heat generated by the heating electrode can be transferred to the combiner. The combiner is used to combine the first optical signal, the second optical signal, and the third optical signal to obtain a combined optical signal under the action of the heat of the heating electrode. By heating the combiner through the heating electrode, the performance of the combiner can be kept stable, the performance change of the combiner caused by environmental changes can be inhibited, the reliability of combining the first optical signal, the second optical signal, and the third optical signal to obtain the combined optical signal by the combiner can be improved, the signal quality of the combined optical signal can be improved, and the stability of the combiner can be improved. The combiner in a stable state can improve the coupling efficiency of the optical signal to the fiber assembly, reduce the loss, and improve the communication performance.

[0110] Optionally, taking the first optical chip as an example, the first optical chip includes a microstrip line electrically connected to the first laser and the PCB of the optical module, respectively. The microstrip line is a microwave transmission line composed of a single conductor strip on the first substrate of the first optical chip. The microstrip line has excellent high-speed transmission characteristics, reduces signal attenuation and distortion, and reduces loss. Therefore, the optical module uses the microstrip line to transmit electrical signals to the first laser, so that the first laser converts the electrical signals into first optical signals, improving the signal rate and quality. Moreover, the microstrip line can also form a matching network with other solid-state devices such as inductors and capacitors, so that the signal output end and the load are well matched. This matching network can optimize signal transmission effects and improve the overall performance of the circuit. In the process of high-speed signal transmission, signals are often subject to various interferences. The microstrip line, through its structure and material design, can effectively resist external factors such as electromagnetic noise and radio frequency interference, ensuring the stability and reliability of the signals. The volume and weight of the microstrip line are relatively small, which is conducive to the miniaturization and lightness of the optical assembly. The second optical chip and the third optical chip shown in the embodiment can also include a microstrip line. For details, please refer to the description of the microstrip line included in the first optical chip, which will not be repeated here.

[0111] Optionally, the substrate surface of the coupling chip shown in the embodiment can also integrate a microstrip line. Taking the first optical waveguide as an example, the microstrip line is used to transmit electrical signals related to the coupling of the first optical signal transmitted by the first optical waveguide, for example, the electrical signals transmitted by the microstrip line are used to realize monitoring, modulation, clock synchronization, etc. The electrical signals transmitted by the microstrip line interact with the first optical signal transmitted by the first optical waveguide to jointly realize the transmission and processing of the first optical signal, thereby improving the transmission rate, reliability and stability of the first optical signal.

[0112] By using the optical assembly shown in the embodiment, the same optical assembly can integrate N optical chips supporting different standards, reducing the overall packaging size of the optical assembly and improving the integration level, thereby meeting the demand for miniaturization of optical assemblies supporting multiple different standards. Moreover, in the case where the N optical chips support different standards respectively, the coupling chip effectively improves the coupling efficiency of the N optical signals from the N optical chips to the fiber assembly, ensuring the consistency and uniformity of the coupling of the N optical signals from the N optical chips to the fiber assembly, and improving the signal quality of the combined optical signal. Moreover, by using one coupling chip, the N optical signals are combined to obtain a combined optical signal, and the combined optical signal is transmitted to the fiber assembly, thereby reducing the number of optical devices included in the optical assembly and improving the integration level of the optical assembly. On the coupling chip, the N optical signals from the N optical chips are transmitted along different optical paths, which can effectively reduce the crosstalk between different optical signals and improve the signal quality and transmission distance of the combined optical signal.

[0113] Embodiment two

[0114] Figure 8 is a structural diagram of a fourth embodiment of the optical assembly provided by the present application. The optical assembly shown in this embodiment includes a first optical chip 310, a second optical chip 320, a third optical chip 330, a coupling chip, a lens group 340, and an optical fiber assembly 350. For the first optical chip 310, the second optical chip 320, the third optical chip 330, the lens group 340, and the optical fiber assembly 350, please refer to the description of the first embodiment, and no further description is provided herein. The coupling chip shown in this embodiment includes a first light inlet 301, a second light inlet 302, a third light inlet 303, and a light outlet 304. For the first light inlet 301, the second light inlet 302, the third light inlet 303, and the light outlet 304, please refer to the description of the first embodiment, and no further description is provided herein.

[0115] The difference between the embodiment and the embodiment one is that the substrate of the coupling chip further integrates a first light splitting module 811, a second light splitting module 812 and a third light splitting module 813. Taking the first light splitting module 811 as an example, the first light splitting module 811 is connected between the first light inlet 301 and the combiner 305. The combiner 305 is described in the embodiment one, and details are not described herein. The substrate of the coupling chip shown in the embodiment further integrates two first optical waveguides, i.e., a first optical waveguide 831 and a first optical waveguide 832. The first optical waveguide 831 is connected between the first light inlet 301 and the first light splitting module 811, and the first optical waveguide 832 is connected between the first light splitting module 811 and the combiner 305. The description of each first optical waveguide is shown in the embodiment one, and details are not described herein. The substrate shown in the embodiment further integrates a first branch optical waveguide 833 connected between the first light splitting module 811 and the first detection light outlet 801. The first detection light outlet 801 shown in the embodiment is used to connect a first detection module 821. For example, the first detection module 821 can be a monitor photodiode (MPD). Specifically, the first optical signal emitted from the first optical chip 310 is transmitted to the first optical waveguide 831 through the first light inlet 301, and the first optical signal is transmitted to the first light splitting module 811 along the first optical waveguide 831. The first light splitting module 811 is used to split the first optical signal to obtain a first sub-optical signal and a first split optical signal. The optical power of the first sub-optical signal shown in the embodiment is less than the optical power of the first split optical signal, and details are not limited. It can be understood that the first sub-optical signal and the first split optical signal shown in the embodiment are both part of the first optical signal. For example, the optical power of the first sub-optical signal is 2% of the optical power of the first optical signal, and the optical power of the first split optical signal is 98% of the optical power of the first optical signal. The first sub-optical signal emitted from the first light splitting module 811 is transmitted to the first detection light outlet 801 through the first branch optical waveguide 833, and the first split optical signal emitted from the first light splitting module 811 is transmitted to the combiner 305 through the first optical waveguide 832. The type of the first light splitting module 811 is not limited in the embodiment, as long as the first light splitting module 811 can split the first optical signal into the first sub-optical signal and the first split optical signal. For example, the first light splitting module 811 can be a light splitter, a prism or a grating, etc. The first MPD 821 can detect the optical power of the first optical signal emitted from the first optical chip 310 according to the first sub-optical signal when the first sub-optical signal is received through the first branch optical waveguide 833.The optical assembly shown in the embodiment can detect the power and quality of the first optical signal entering the coupling chip based on the first MPD 821, and the optical assembly can also adjust the output power of the first optical chip 310 based on the first MPD 821 to ensure that the optical power emitted by the first optical chip 310 is within a proper power range, thereby reducing signal attenuation or distortion and improving signal quality, which helps to improve the transmission distance of the optical assembly.

[0116] The substrate of the coupling chip shown in the embodiment also integrates two second optical waveguides, i.e., a second optical waveguide 841 and a second optical waveguide 842. The second optical waveguide 841 is connected between the second light inlet 302 and the second light splitting module 812, and the second optical waveguide 842 is connected between the second light splitting module 812 and the combiner 305. For the description of each second optical waveguide, please refer to the embodiment one, and the specific description is omitted. The substrate shown in the embodiment also integrates a second shunt optical waveguide 843 connected between the second light splitting module 812 and the second detection light outlet 802. The second detection light outlet 802 shown in the embodiment is used to connect a second detection module 822. For example, the second detection module 822 can be an MPD. Specifically, the second optical signal emitted from the second optical chip 320 is transmitted to the second optical waveguide 841 via the second light inlet 302, and the second optical signal is transmitted along the second optical waveguide 841 to the second light splitting module 812. The second light splitting module 812 is used to split the second optical signal to obtain a second sub-optical signal and a second split optical signal. For the description of the second light splitting module 812 and the splitting, please refer to the description of the first light splitting module 811, and the specific description is omitted. The second sub-optical signal emitted from the second light splitting module 812 is transmitted to the second detection light outlet 802 via the second shunt optical waveguide 843, and the second split optical signal emitted from the second light splitting module 812 is transmitted to the combiner 305 via the second optical waveguide 842. For the description of the second detection module 822, please refer to the description of the first MPD, and the specific description is omitted.

[0117] The substrate of the coupling chip shown in this embodiment also integrates two third optical waveguides, i.e., a third optical waveguide 851 and a third optical waveguide 852. The third optical waveguide 851 is connected between the third light inlet 303 and the third light splitting module 813, and the third optical waveguide 852 is connected between the third light splitting module 813 and the optical combiner 305. For the description of each third optical waveguide, please refer to the description of the first embodiment, and details are not described herein. The substrate shown in this embodiment also integrates a third shunt optical waveguide 853 connected between the third light splitting module 813 and the third detection light outlet 803. The third detection light outlet 803 shown in this embodiment is used to connect the third detection module 823. Specifically, the third optical signal emitted from the third optical chip 330 is transmitted to the third optical waveguide 851 via the third light inlet 303, and the third optical signal is transmitted along the third optical waveguide 851 to the third light splitting module 813. The third light splitting module 813 is used to split the third optical signal to obtain a third sub-optical signal and a third split optical signal. For the description of the third light splitting module 813 and the splitting, please refer to the description of the first light splitting module 811, and details are not described herein. The third sub-optical signal emitted from the third light splitting module 813 is transmitted to the third detection light outlet 803 via the third shunt optical waveguide 853, and the third split optical signal emitted from the third light splitting module 813 is transmitted to the optical combiner 305 via the third optical waveguide 852. For the description of the third detection module 823, please refer to the description of the first MPD, and details are not described herein.

[0118] The third sub-optical signal emitted from the third light splitting module 813 is transmitted to the third detection light outlet 803 via the third shunt optical waveguide 853, and the third split optical signal emitted from the third light splitting module 813 is transmitted to the optical combiner 305 via the third optical waveguide 852. For the description of the third detection module 823, please refer to the description of the first MPD, and details are not described herein.

[0119] It can be understood that the optical combiner 305 shown in this embodiment receives the first split optical signal, the second split optical signal, and the third split optical signal, and is used to combine the first split optical signal, the second split optical signal, and the third split optical signal to obtain a combined optical signal. For the description of the combined optical signal and the description of the coupling chip transmitting the combined optical signal to the fiber assembly 350, please refer to the description of the first embodiment, and details are not described herein.

[0120] It should be noted that the description of the positions of the first light inlet 301, the second light inlet 302, the third light inlet 303, and the light outlet 304 in this embodiment is described in the first embodiment, and details are not described herein. The first detection light outlet 801 shown in this embodiment is taken as an example of being located on the third edge 363 of the coupling chip. In other examples, the first detection light outlet 801 can also be located on the first edge 361, the second edge 362, or the fourth edge 364 of the coupling chip, and details are not described herein. For the description of the positions of the second detection light outlet 802 and the third detection light outlet 803, please refer to the description of the position of the first detection light outlet 801, and details are not described herein.

[0121] The first detection light port 801 in this embodiment is located at the edge of the coupling chip. FIG. 9 is a structural diagram of a fifth embodiment of the optical assembly provided by the present application. The optical assembly shown in FIG. 9 includes an optical chip 921, a coupling chip, and an optical fiber assembly 922. The optical chip 921 can be the first optical chip, the second optical chip, or the third optical chip shown in Embodiment One. For the description of the optical fiber assembly 922, please refer to the description of the optical fiber assembly shown in Embodiment One. The coupling chip includes a substrate 900 and a shell 902 covering the substrate 900, and the combiner 901 is located on the surface of the substrate 900 and inside the shell 902. The light inlet port 911 in this embodiment penetrates through the shell 902 and is connected to the combiner 901 through an optical waveguide, and the light inlet port 911 is also connected to the optical chip 921. If the optical chip 921 is the first optical chip, then the light inlet port 911 is the first light inlet port, and the same applies to other cases, which will not be described herein.

[0122] The detection light port 913 in this embodiment is located on the top surface of the coupling chip, and the combiner 901 is located between the top surface and the substrate 900. Specifically, the combiner 901 is located between the top surface of the shell 902 and the substrate 900, and the detection light port 913 penetrates through the top surface of the shell 902 and is connected to the detection module 923. The detection module 923 can be the first MPD, the second MPD, or the third MPD shown above, and the specific type is not limited. The detection light port 913 can be any one of the first detection light port, the second detection light port, and the third detection light port shown above. The number of detection light ports penetrating through the top surface of the shell 902 is not limited in this embodiment. For example, the first detection light port, the second detection light port, and the third detection light port can all penetrate through the top surface of the shell 902.

[0123] Taking the first detection module as an example, the first detection module in this embodiment is located outside the coupling chip. In other examples, the coupling chip can integrate the first detection module. For example, the surface of the substrate 900 can also integrate the first detection module. The second detection module and the third detection module can be integrated into the coupling chip, and for the description of the integration of the first detection module into the coupling chip, please refer to the description, which will not be described herein.

[0124] Embodiment Three

[0125] The optical assembly shown in this embodiment can also detect optical signals. FIG. 10 is a structural diagram of a sixth embodiment of the optical assembly provided by the present application.

[0126] The optical assembly shown in this embodiment includes a light emitting assembly 1001, a light receiving assembly 1002, a light splitting assembly 1003, and a fiber assembly 1000. The light emitting assembly 1001 specifically includes N light chips and a coupling chip. For the N light chips and the coupling chip, please refer to the description of the first embodiment or the second embodiment, and details are not described herein. For the structure of the fiber assembly 1000 shown in this embodiment, please refer to the description of the first embodiment, and details are not described herein. The light receiving assembly 1002 includes a detector, for example, the detector can be a PIN diode or an APD, etc. The number and specific structure of the detector included in the light receiving assembly 1002 are not limited in this embodiment, as long as the light receiving assembly 1002 can convert the optical signal into an electrical signal. The fiber assembly 1000 receives a received optical signal from another optical assembly. The wavelength of the received optical signal is within the first wavelength range. The fiber assembly 1000 sends the received optical signal to the light splitting assembly 1003, and the light splitting assembly 1003 sends the received optical signal to the light receiving assembly 1002, and the light receiving assembly 1002 is used to convert the received optical signal into a service electrical signal. The light emitting assembly 1001 sends a combined optical signal to the light splitting assembly 1003. For the combined optical signal, please refer to the description of the first embodiment or the second embodiment, and details are not described herein. The wavelength of the combined optical signal shown in this embodiment is within the second wavelength range. The light splitting assembly 1003 sends the combined optical signal to the fiber assembly 1000, and the fiber assembly 1003 sends the combined optical signal to another optical assembly. It can be understood that the structure of the optical assembly shown in this embodiment can realize the transmission and reception of optical signals simultaneously. The type of the light splitting assembly 1003 is not limited in this embodiment, as long as the light splitting assembly 1003 can split light based on the wavelength. For example, the light splitting assembly 1003 can be a glass sheet, an optical filter, a coated prism, a light splitter, a polarizer, etc.

[0127] Optionally, the fiber assembly 1000 and the light splitting assembly 1003 shown in this embodiment can further include a lens group. The lens group is used to converge the received optical signal from the fiber assembly 1000 to the light receiving assembly 1002, and is also used to collimate the combined optical signal from the light emitting assembly 1001 to enter the fiber assembly 1000. For the lens group, please refer to the description of the first embodiment, and details are not described herein.

[0128] Optionally, the coupling chip shown in the first embodiment or the second embodiment can further integrate a detector and a light splitting assembly. Specifically, the substrate surface of the coupling chip can further integrate a detector and a light splitting assembly. For the detector and the light splitting assembly integrated on the substrate surface, please refer to the corresponding description of FIG. 10, and details are not described herein.

[0129] The embodiment of the present application provides a light module, and the light module comprises a module body, a routing module and a plurality of light assemblies. The plurality of light assemblies are connected to different positions of the module body. The structure of the light assembly is described in any of the embodiments 1 to 3, and details are not described herein. If the module body of the embodiment is connected to two light assemblies, each light assembly simultaneously implements three transmission channels supporting different standards, so as to realize the transmission of the first optical signal, the second optical signal and the third optical signal. The transmission of the first optical signal, the second optical signal and the third optical signal by the light assembly is described in the embodiment 1, and details are not described herein. The light module of the embodiment can realize six transmission channels supporting different standards when the two light assemblies are connected. The module body is connected to the fiber assembly, and the fiber assembly is described in the embodiments 1 or 2, and details are not limited. The routing module in the module body is used to guide the light path between each light assembly and the fiber assembly. The type of the routing module is described in the above description of the type of the light splitting assembly, and details are not limited.

[0130] The embodiment of the present application further provides a light module, and the light module comprises a PCB and a light assembly connected to the PCB, and the light assembly is used to realize the transceiving of service electrical signals between the PCB. The light assembly is described in the above embodiments 1, 2 and 3, and the light module is described in the corresponding description of Fig. 2a, and details are not described herein.

[0131] The embodiment of the present application further provides a light communication device, and the structure of the light communication device is described in the corresponding description of Fig. 2a, and details are not described herein.

[0132] The embodiment of the present application further provides a light network, and the light network comprises a first light communication device and a second light communication device. The light assemblies included in the first light communication device and the second light communication device are described in the above embodiments 1, 2 and 3, and details are not described herein.

[0133] FIG. 11 is a structural diagram of an embodiment of a radar provided by the present application. The embodiment takes a laser radar as an example, which is a target detection technology. The laser radar emits a detection light signal, the detection light signal is diffusely reflected after encountering a detection object, and the distance, direction, height, speed, attitude, shape, and other characteristic quantities of the detection object are determined through the reflected echo light signal. The laser radar is applied to the fields of intelligent driving vehicles, intelligent driving aircrafts, 3D printing, virtual reality (VR), augmented reality (AR), service robots, and the like. The intelligent driving in the embodiment of the present application can be unmanned driving, autonomous driving, or assisted driving.

[0134] The laser radar 1100 shown in the embodiment includes a processor 1101 and an optical assembly 1102 connected to the processor 1101. The optical assembly is described in the above-mentioned embodiment one, embodiment two, and embodiment three, and will not be described in detail. Specifically, the processor 1101 is configured to send a detection electrical signal to each laser in the optical assembly 1102, and the laser emits a detection light signal according to the detection electrical signal. The intensity, frequency, phase, and the like of the detection light signal are modulated to adapt to the detection requirements and improve the detection accuracy and efficiency. For example, the processor sends a first detection electrical signal to the first optical chip, and the first laser in the first optical chip converts the first detection electrical signal into a first detection light signal. For another example, the processor sends a second detection electrical signal to the second optical chip, and the second laser in the second optical chip converts the second detection electrical signal into a second detection light signal. The first detection light signal and the second detection light signal are reflected on the surface of the detection object after encountering the detection object, and the reflected echo light signal is received by the optical assembly 1102. For example, the first detection light signal is reflected on the surface of the detection object, and the reflected first echo light signal is received by the optical assembly 1102. For another example, the second detection light signal is reflected on the surface of the detection object, and the reflected second echo light signal is received by the optical assembly 1102. The optical assembly converts the first echo light signal, the second echo light signal, and the like into a first echo electrical signal and a second echo electrical signal. The processor 1101 is configured to obtain related information of the detection object according to the first echo electrical signal and the second echo electrical signal. Meanwhile, the laser radar 1100 can also emit detection light signals with different spatial orientations to the detection object, so as to obtain the position information of each point on the surface of the detection object and generate a point cloud image of the detection object.

[0135] The laser radar 1100 shown in FIG. 11 can be applied to a vehicle, and in other examples, the laser radar 1100 can also be applied to a fixed radar (for example, a radar fixed at a road, a monitoring radar, a radar in an industrial scene, etc.). The laser radar 1100 can also be applied to a radar of a logistics warehouse unmanned vehicle or a radar of a smart home appliance (for example, the smart home appliance is an automatic cleaning robot), etc., and the specific implementation is not limited.

[0136] The embodiment also provides a vehicle, and the specific structure is described with reference to FIG. 12. FIG. 12 is a structural example diagram of an embodiment of the vehicle provided in the application. The vehicle shown in the example can be a car, a truck, a motorcycle, a public vehicle, a lawn mower, an entertainment vehicle, an amusement park vehicle, an electric car, a golf cart, a train, a trolley or a drone, etc. The vehicle 1200 in the embodiment is configured to be in a fully or partially autonomous driving mode. The vehicle shown in the embodiment includes a vehicle body, and the vehicle body is used to fix a sensing system 1220, an advanced driving assistance system (ADAS) 1210, a peripheral device 1230 and a computer system 1240.

[0137] The sensing system 1220 includes one or more sensors for sensing environmental information about the surroundings of the vehicle 1200. For example, the sensing system 1220 can include a positioning system, which is any positioning system such as a global positioning system (GPS) system or a Beidou system, etc. The sensing system 1220 also includes an inertial measurement unit (IMU), a laser radar and a camera, etc. The laser radar is described with reference to the corresponding embodiment of FIG. 11, and the specific implementation is not limited. The sensing system 1220 can also include sensors for monitoring the internal systems of the vehicle 1200 (for example, an in-vehicle air quality monitor, a fuel gauge, an oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their respective characteristics (position, shape, direction, speed, etc.). The positioning system can be used to estimate the geographical position of the vehicle 1200. The IMU is used to sense the position and orientation changes of the vehicle 1200 based on inertial acceleration. The IMU can be a combination of an accelerometer and a gyroscope. The laser radar can use radio signals to detect detection objects in the surroundings of the vehicle 1200, for example, the detection objects can be pedestrians, vehicles or buildings, etc.

[0138] The ADAS 1210 senses the environment around the vehicle at all times during operation of the vehicle, collects data, identifies, detects, and tracks static and dynamic objects, and combines with navigation map data to perform system computation and analysis, thereby allowing the driver to be aware of potential dangers in advance, effectively increasing the comfort and safety of driving the vehicle. For example, the ADAS 1210 can control the vehicle through data obtained by the sensing system. For another example, the ADAS 1210 can control the vehicle through vehicle driving related information, which can be main data on the vehicle instrument panel (fuel consumption, engine speed, temperature, etc.), vehicle speed information, steering wheel angle information, or vehicle body attitude data, etc.

[0139] The vehicle 1200 interacts with external sensors, other vehicles, other computer systems, or users through the peripherals 1230. The peripherals 1230 can include a wireless communication system, an on-board computer, a microphone, and / or a speaker. For example, the on-board computer can provide information to a user of the vehicle 1200. The user interface can also operate the on-board computer to receive input from the user. The on-board computer can be operated through a touch screen. In other cases, the peripherals 1230 can provide a means for the vehicle 1200 to communicate with other devices located within the vehicle. For example, the microphone can receive audio (e.g., voice commands or other audio input) from a user of the vehicle 1200. The speaker can output audio to a user of the vehicle 1200. The wireless communication system can wirelessly communicate with one or more devices, either directly or via a communication network.

[0140] Some or all of the functions of the vehicle 1200 are controlled by the computer system 1240. The computer system 1240 can control the functions of the vehicle 1200 based on input received from various systems (e.g., the sensing system 1220, the ADAS 1210, the peripherals 1230), as well as from the user interface. The computer system 1240 can include at least one processor that executes instructions stored in memory.

[0141] Those skilled in the art can clearly understand that, for the convenience and brevity of the description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the foregoing method embodiments, which will not be described here.

[0142] The above-described embodiments are merely intended for describing and illustrating the technical solutions of the present application, but not intended to limit the same; even though the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some of the technical features; and such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A light assembly, characterized in that, The application relates to a coupling chip for coupling N optical chips and a fiber assembly, wherein N is an integer greater than or equal to 2, the N optical chips at least include a first optical chip and a second optical chip, the first optical chip supports a standard different from the standard supported by the second optical chip, the coupling chip includes N input ports and an output port, the N input ports at least include a first input port and a second input port, the first input port is connected to the first optical chip, the second input port is connected to the second optical chip, and the output port is used for connecting the fiber assembly. The first optical chip is used for transmitting a first optical signal to the coupling chip through the first input port, the second optical chip is used for transmitting a second optical signal to the coupling chip through the second input port, the transmission path of the first optical signal is different from the transmission path of the second optical signal on the coupling chip, the coupling chip is used for combining the first optical signal and the second optical signal to obtain a combined optical signal, and the coupling chip is further used for transmitting the combined optical signal to the fiber assembly.

2. The light assembly of claim 1, wherein, The N optical chips further include a third optical chip, the third optical chip supports a standard different from the standard supported by the first optical chip and different from the standard supported by the second optical chip, and the N input ports further include a third input port, the third input port is connected to the third optical chip. The third optical chip is used for transmitting a third optical signal to the coupling chip through the third input port, the transmission path of the third optical signal is different from the transmission path of the first optical signal and different from the transmission path of the second optical signal on the coupling chip, and the coupling chip is used for combining the first optical signal, the second optical signal and the third optical signal to obtain the combined optical signal.

3. The light assembly of claim 2, wherein, The standard supported by the first optical chip is gigabit passive optical network (GPON), the standard supported by the second optical chip is 50GPON, and the standard supported by the third optical chip is 10GPON.

4. The light assembly of any one of claims 1 to 3, wherein, The coupling chip includes a substrate, a combiner integrated on the substrate, a first optical waveguide, a second optical waveguide and a combined optical waveguide, a first end of the first optical waveguide is connected to the first input port, a second end of the first optical waveguide is connected to the combiner, a first end of the second optical waveguide is connected to the second input port, a second end of the second optical waveguide is connected to the combiner, a first end of the combined optical waveguide is connected to the combiner, and a second end of the combined optical waveguide is connected to the output port. The combiner is used for receiving the first optical signal through the first optical waveguide and receiving the second optical signal through the second optical waveguide, combining the first optical signal and the second optical signal to obtain the combined optical signal, and transmitting the combined optical signal to the output port through the combined optical waveguide.

5. The light assembly of claim 4, wherein, The mode of the first optical signal transmitted via the first optical waveguide matches the mode of the first optical waveguide, and the mode of the second optical signal transmitted via the second optical waveguide matches the mode of the second optical waveguide.

6. The light assembly of claim 4 or 5, wherein, The mode of each optical signal transmitted via the combining optical waveguide matches the mode of the combining optical waveguide.

7. The light assembly of any of claims 4 to 6, wherein, The first optical chip and the first light inlet are connected by a first coupling optical waveguide, the second optical chip and the second light inlet are connected by a second coupling optical waveguide, the first coupling optical waveguide has a first extension line on the surface of the coupling chip, the first extension line and the first optical waveguide have a first included angle, the second coupling optical waveguide has a second extension line on the surface of the coupling chip, the second extension line and the second optical waveguide have a second included angle, wherein the vertex of the first included angle is the intersection between the first optical waveguide and the first extension line, the first optical waveguide and the first extension line are two sides of the first included angle, the vertex of the second included angle is the intersection between the second optical waveguide and the second extension line, the second optical waveguide and the second extension line are two sides of the second included angle, and the first included angle and the second included angle are acute angles respectively.

8. The light assembly of any of claims 4 to 7, wherein, The substrate further integrates a first light splitting module and a second light splitting module, the first light splitting module is connected between the first light inlet and the combiner, and the first light splitting module is further connected to a first detection module, the second light splitting module is connected between the second light inlet and the combiner, and the second light splitting module is further connected to a second detection module. The first light splitting module is used for transmitting a first sub-optical signal to the first detection module, the first detection module is used for detecting the optical power of the first optical signal according to the first sub-optical signal, the first sub-optical signal is a part of the first optical signal, the second light splitting module is used for transmitting a second sub-optical signal to the second detection module, and the second detection module is used for detecting the optical power of the second optical signal according to the second sub-optical signal, the second sub-optical signal is a part of the second optical signal.

9. The light assembly of claim 8, wherein, The coupling chip includes a first detection light inlet and a second detection light inlet, the first detection module is connected to the first detection light inlet through an optical waveguide, and the second detection module is connected to the second detection light inlet through an optical waveguide.

10. The light assembly of claim 9, wherein, At least one of the first detection light inlet and the second detection light inlet is located at the edge of the coupling chip, and / or at least one of the first detection light inlet and the second detection light inlet is located at the top surface of the coupling chip, the coupling chip includes a substrate and a combiner integrated on the substrate, and the combiner is located between the top surface and the substrate.

11. The light assembly of any of claims 1-10, wherein, The coupling chip comprises a substrate and a combiner integrated on the substrate, the substrate further integrates a heating electrode, the heating electrode is close to the combiner, the heating electrode is used for delivering heat to the combiner, and the combiner is used for combining the first optical signal and the second optical signal to obtain the combined optical signal under the action of the heat of the heating electrode.

12. The light assembly of any one of claims 1 to 11, wherein, The first optical inlet and the second optical inlet are located at a first edge of the coupling chip.

13. The light assembly of any one of claims 1 to 11, wherein, The first optical inlet is located at a first edge of the coupling chip, and the second optical inlet is located at a second edge of the coupling chip, the first edge being different from the second edge.

14. The light assembly of claim 12 or 13, wherein, The optical outlet is located at the first edge or the second edge, and the first edge and the second edge are two opposite edges of the coupling chip.

15. The light assembly of any of claims 1-11, wherein, The optical assembly further comprises a reflection module, the coupling chip comprises a third edge and a fourth edge opposite to each other, the third edge is an edge of the coupling chip facing the reflection module, and a part of the optical inlets and outlets among the first optical inlet, the second optical inlet and the optical outlet are located at the third edge, and the other part of the optical inlets and outlets are located at the fourth edge, and the reflection module is used for reflecting the combined optical signal to the fiber assembly.

16. The light assembly of any one of claims 1 to 15, wherein, The first optical chip comprises a first substrate and a first laser, and the first laser is integrated on the first substrate in a COC manner; the second optical chip comprises a second substrate and a second laser, and the second laser is integrated on the second substrate in a COC manner; and the first substrate and the second substrate are connected to the substrate of the coupling chip, respectively.

17. An optical module characterized by comprising: The optical assembly comprises a circuit board and one or more optical assemblies connected to the circuit board, and the optical assembly is as claimed in any one of claims 1 to 16.

18. An optical communication device, comprising: The optical module comprises a device single board and an optical module connected to the device single board, and the optical module is as claimed in claim 17.

19. A radar, characterized by The optical assembly comprises a processor and an optical assembly connected to the processor, and the optical assembly is as claimed in any one of claims 1 to 16. The processor is used for sending a first probe electrical signal and a second probe electrical signal to the optical assembly, the optical assembly is used for processing the first probe electrical signal into the first optical signal, processing the second probe electrical signal into the second optical signal, and emitting the first optical signal and the second optical signal through the fiber assembly; The optical assembly is used for receiving a first echo optical signal and a second echo optical signal, the first echo optical signal being an optical signal reflected by a probe object to the optical assembly according to the first optical signal, and the second echo optical signal being an optical signal reflected by the probe object to the optical assembly according to the second optical signal; The optical assembly is used for processing the first echo optical signal and the second echo optical signal into a first echo electrical signal and a second echo electrical signal, respectively; The processor is used for obtaining relevant information of the probe object according to the first echo electrical signal and the second echo electrical signal.

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