Carrier module for array server, and array server

Abstract

The present application relates to a carrier module for an array server, and an array server. A first heat dissipation member and a second heat dissipation member of the carrier module are arranged in parallel. A circuit board is coupled between the first heat dissipation member and the second heat dissipation member. A data connector is arranged at one end of the circuit board and detachably connected to the array server. A plurality of sets of heat dissipation holes run through the circuit board in the thickness direction of the circuit board. A plurality of chips are arranged on the side of the circuit board facing the first heat dissipation member, and respectively correspond to the positions of the plurality of sets of heat dissipation holes. A plurality of first thermally conductive adhesives are coupled between the plurality of chips and the first heat dissipation member. A plurality of second thermally conductive adhesives are coupled between the circuit board and the second heat dissipation member, and respectively correspond to the positions of the plurality of sets of heat dissipation holes.

Description

Carrier module for array server and array server

[0001] The present application claims priority to the Chinese patent application No. 202411087845.9, filed on August 8, 2024, entitled “Carrier module for array server and array server”, the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] Embodiments of the present disclosure generally relate to the field of array server, and in particular, to a carrier module for array server and array server. BACKGROUND

[0003] Advanced RISC Machines (ARM) array server architecture is known for its low power consumption and high energy efficiency in high-load scenarios such as offline computing and cloud gaming, especially in large-scale cloud service environments, which can significantly reduce power consumption. Compared with X86 architecture general-purpose servers, ARM array servers can achieve higher cost-effectiveness. In a conventional array server, in order to maintain the performance and cost advantages of hardware, more chips may be integrated on the circuit board. When the chips are maintained or replaced, all the remaining chips need to be removed at the same time, which seriously affects the performance of the server. SUMMARY

[0004] In a first aspect of the present disclosure, a carrier module for array server is provided. The carrier module comprises: a first heat dissipation member and a second heat dissipation member arranged side by side; a circuit board coupled between the first heat dissipation member and the second heat dissipation member, and comprising a data connector and a plurality of groups of heat dissipation holes, the data connector being arranged at one end of the circuit board and being adapted to be detachably connected to the array server, the plurality of groups of heat dissipation holes penetrating through the circuit board along the thickness direction of the circuit board; and a plurality of chips arranged on the side of the circuit board facing the first heat dissipation member and corresponding to the positions of the plurality of groups of heat dissipation holes respectively; a plurality of first thermal conductive adhesives coupled between the plurality of chips and the first heat dissipation member; and a plurality of second thermal conductive adhesives coupled between the circuit board and the second heat dissipation member and corresponding to the positions of the plurality of groups of heat dissipation holes respectively.

[0005] In a second aspect of the present disclosure, an array server is provided. The array server comprises: a cabinet comprising a receiving cavity and a first opening, the first opening being arranged at one side of the cabinet and communicating with the receiving cavity; a server mainboard arranged in the receiving cavity and coupled to the cabinet; a plurality of bridge boards arranged side by side in the receiving cavity and coupled to the cabinet, the plurality of bridge boards being coupled to the server mainboard, and each bridge board being provided with a plurality of data interfaces at an end thereof facing the first opening; and a plurality of groups of carrier modules, each group of carrier modules comprising a plurality of carrier modules, each carrier module being the carrier module according to the first aspect of the present disclosure, and the data connectors of each group of carrier modules being detachably coupled to the data interfaces of the corresponding bridge board.

[0006] It should be understood that the content described in this section is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become apparent through the following description. BRIEF DESCRIPTION OF DRAWINGS

[0007] The above and other features, advantages, and aspects of embodiments of the present disclosure will become more apparent by describing in detail the following embodiments with reference to the attached drawings. In the drawings, the same or similar reference numerals refer to the same or similar elements, and wherein:

[0008] FIG. 1 shows a perspective view of a carrier module according to some embodiments of the present disclosure;

[0009] FIG. 2 shows an exploded view of a carrier module according to some embodiments of the present disclosure, in which a second thermal conductive glue is shown;

[0010] FIG. 3 shows an exploded view of a carrier module according to some embodiments of the present disclosure, in which a first thermal conductive glue is shown;

[0011] FIG. 4 shows a schematic view of the positional relationship between a first heat dissipation member, a first thermal conductive glue, a chip, a circuit board, a second thermal conductive glue, and a second heat dissipation member according to some embodiments of the present disclosure, in which a heat dissipation hole on the circuit board is shown;

[0012] FIG. 5 shows a schematic view of the layering structure of a circuit board according to some embodiments of the present disclosure;

[0013] FIG. 6 shows a schematic view of the drilling structure of a circuit board according to some embodiments of the present disclosure;

[0014] FIG. 7 shows a schematic view of a connecting member, a mating member, and an elastic member according to some embodiments of the present disclosure;

[0015] FIG. 8 shows a perspective view of a carrier module according to some other embodiments of the present disclosure;

[0016] FIG. 9 shows an exploded view of a carrier module according to some other embodiments of the present disclosure, in which a second thermal conductive glue is shown;

[0017] Fig. 10 shows an exploded schematic view of a carrier module of some embodiments of the present disclosure, wherein a first thermal conductive glue is shown;

[0018] Fig. 11 shows a perspective view of an array server of some embodiments of the present disclosure, wherein the carrier module is shown at the front side;

[0019] Fig. 12 shows a perspective view of an array server of some embodiments of the present disclosure, wherein the fan module is shown at the front side;

[0020] Fig. 13 shows a perspective view of an array server of some embodiments of the present disclosure, wherein the carrier module is shown at the front side; and

[0021] Fig. 14 shows a perspective view of a liquid cooling system in an array server of some embodiments of the present disclosure.

[0022] BRIEF DESCRIPTION OF THE DRAWINGS 100, carrier module; 11, first heat dissipation member; 111, second groove; 12, second heat dissipation member; 121, third protrusion; 13, first thermal conductive glue; 14, second thermal conductive glue; 15a, first limiting groove; 15b, second limiting groove; 16, flow channel; 17, first heat exchange plate; 18, second heat exchange plate; 19a, first mounting hole; 19b, second mounting hole; 20, circuit board; 21, data connector; 22, heat dissipation hole; 30, chip; 40, carrier handle; 41, ventilation hole; 42, fourth groove; 43, through hole; 44, indication assembly; 50, metal shielding net; 51, elastic part; 61, connecting piece; 611, first protrusion; 612, second protrusion; 62, matching piece; 620, first groove; 63, elastic piece; 71, first heat pipe; 72, second heat pipe; 200, case; 201, first opening; 202, second opening; 203, accommodating cavity; 210, server mainboard; 220, bridge plate; 221, data interface; 231, power module; 232, fan module; 233, identity recognition assembly; 234, input / output module; 235, power control assembly; 236, data transmission assembly; 241, first ear plate; 242, second ear plate; 250, support; 251, compartment; 252, sliding groove; 253, third groove; 260, liquid cooling system; 261, first branch; 262, second branch; 263, liquid supply pipe; 264, liquid return pipe; 265, cold plate; 266, heat exchange wall. DETAILED DESCRIPTION

[0023] Preferred embodiments of the present disclosure will be described in greater detail below, with reference to the accompanying drawings. While preferred embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0024] The term "comprising" and variations thereof as used herein are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Unless otherwise specified, the term "or" as used herein is intended to mean "and / or". The term "based on" means "based, at least in part, on". The terms "one example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", and the like can refer to different or same objects.

[0025] As described above, in a conventional array server, in order to maintain the performance and cost advantages of hardware, more chips can be integrated on the circuit board. When the chips need to be replaced and maintained, all the remaining chips need to be removed at the same time, which seriously affects the performance of the server.

[0026] Embodiments of the present disclosure provide a carrier module for an array server and an array server. The carrier module includes a circuit board and a plurality of chips, and the plurality of chips are arranged on the circuit board. The carrier module is detachably connected to the array server through a data connector on the circuit board. With this arrangement, the array server can connect multiple carrier modules, and when a single carrier module needs to be replaced and maintained, the carrier module can be detached from the array server without affecting the operation of other carrier modules, thereby reducing the product failure radius (also known as the explosion radius). At the same time, the chips can be cooled by heat-conducting glue, heat dissipation holes, and heat dissipation pieces, which can meet the operation requirements of high-performance chips, thereby having the characteristics of high performance, high-density computing power, and high energy efficiency ratio.

[0027] The structure and working principle of the carrier module of the embodiments of the present disclosure will be described in detail below with reference to FIGS. 1-10, wherein FIGS. 1-7 show the structure of the carrier module 100 of some embodiments of the present disclosure, and FIGS. 8-10 show the structure of the carrier module 100 of other embodiments of the present disclosure. First, the structure and working principle of the carrier module 100 of some embodiments of the present disclosure will be described in detail with reference to FIGS. 1-7.

[0028] As shown in FIGS. 1-4, the carrier module 100 generally includes a first heat dissipation piece 11, a second heat dissipation piece 12, a circuit board 20, a chip 30, a first heat-conducting glue 13, and a second heat-conducting glue 14.

[0029] As shown in FIGS. 2 and 3, the first heat sink 11 and the second heat sink 12 can be heat sinks or other types of heat dissipaters, which can be used to absorb heat generated by the chips 30 during operation. The first heat sink 11 and the second heat sink 12 are arranged side by side, and the circuit board 20 can be placed between the two heat sinks to provide heat dissipation support on both sides of the circuit board 20.

[0030] As shown in FIGS. 2 and 3, the circuit board 20 carries the chips 30 and other electronic components, and can transmit and process signals. One end of the circuit board 20 is provided with a data connector 21, which can be detachably connected to an array server, such as a pluggable bridge board 220 in the array server. In this way, the array server can connect multiple carrier modules 100. When a single carrier module 100 needs to be replaced and maintained, the carrier module 100 can be detached from the array server without affecting the operation of other carrier modules 100, thereby reducing the failure radius of the product.

[0031] As shown in FIG. 4, a plurality of groups of heat dissipation holes 22 are further provided on the circuit board 20. The heat dissipation holes 22 penetrate the circuit board 20, which helps heat conduction. The circuit board 20 is located between the first heat sink 11 and the second heat sink 12 to dissipate heat from both sides of the circuit board 20.

[0032] A plurality of chips 30 are arranged on the side of the circuit board 20 facing the first heat sink 11, and correspond to the positions of the plurality of groups of heat dissipation holes 22. In some embodiments, the chips 30 can be used for graphics and multimedia processing, high-speed network connection, multi-camera support, vehicle applications, and Internet of Things applications, etc. The chips 30 can also be other types, and embodiments of the present disclosure are not limited thereto.

[0033] As shown in FIG. 4, a portion of the heat generated by the plurality of chips 30 during operation can be transferred to the first heat sink 11, and another portion of the heat can be transferred to the second heat sink 12 along the plurality of groups of heat dissipation holes 22. In this way, the heat dissipation holes 22 on the circuit board 20 improve the heat dissipation efficiency of the chips 30, which can meet the operation requirements of high-performance chips 30.

[0034] In some embodiments, as shown in FIGS. 5 and 6, each of the plurality of groups of heat dissipation holes 22 includes a plurality of laser holes. The laser hole is a tiny hole made on the circuit board 20 using laser drilling technology. Each group of heat dissipation holes 22 is independent and can be distributed in different areas of the circuit board 20, thereby helping to uniformly transfer heat and avoiding local overheating. Each group of heat dissipation holes 22 is composed of a plurality of smaller laser holes, which can increase the surface area of the heat dissipation holes 22, thereby facilitating heat conduction. In addition, the plurality of laser holes not only can maintain a high heat dissipation efficiency, but also can reduce damage to the structural integrity of the circuit board 20, thereby maintaining the structural stability and reliability of the circuit board 20.

[0035] In some embodiments, the first and second thermal conductive glue 13 and 14 are high thermal conductive materials, for example, in paste form. The first and second thermal conductive glue 13 and 14 can fill the tiny gaps between the surface of the chip 30 and the heat sink, and between the surface of the circuit board 20 and the heat sink.

[0036] The number of the first thermal conductive glue 13 can be consistent with the number of the chip 30, that is, there is one first thermal conductive glue 13 at each chip 30. In this way, the first thermal conductive glue 13 can quickly and uniformly transfer the heat generated by the chip 30 to the first heat sink 11.

[0037] The plurality of second thermal conductive glue 14 is also a high thermal conductive material, which is used to improve the heat conduction performance between the circuit board 20 and the second heat sink 12. The second thermal conductive glue 14 is distributed in the area where the circuit board 20 contacts the second heat sink 12, and the position of the second thermal conductive glue 14 corresponds to the plurality of groups of heat dissipation holes 22 on the circuit board 20. That is, the second thermal conductive glue 14 can quickly transfer the heat in the area where the heat dissipation holes 22 are located to the second heat sink 12, thereby accelerating the heat dissipation of the chip 30.

[0038] The thermal conductive glue can tightly fit between the first heat sink 11 and the chip 30, and between the circuit board 20 and the second heat sink 12, thereby reducing the thermal resistance between the chip 30 and the heat sink, significantly improving the heat conduction efficiency, and reducing the temperature of the chip 30.

[0039] With this arrangement, the chip 30 can be cooled by the first thermal conductive glue 13, the second thermal conductive glue 14, the heat dissipation holes 22, the first heat sink 11, and the second heat sink 12, which can meet the operation requirements of the high-performance chip 30, thereby having the characteristics of high performance, high-density computing power, and high energy efficiency ratio.

[0040] In some examples, as shown in FIGS. 2 and 3, the plurality of chips 30 are arranged in rows along the extension direction of the circuit board 20, and the positions of the rows of chips 30 are staggered along the extension direction of the circuit board 20.

[0041] As an example, as shown in FIGS. 2 and 3, there are 5 chips 30 arranged on the circuit board 20, and the 5 chips 30 are arranged in two rows. The first row has 3 chips 30, and the second row has 2 chips 30. The 2 chips 30 of the second row are aligned with the gap positions of the 3 chips 30 of the first row. With this arrangement, the layout of the chips 30 on the circuit board 20 is more uniform, thereby avoiding the situation of local overheating. At the same time, the uniform arrangement of the plurality of chips 30 is also conducive to efficient heat transfer to the first heat sink 11 and the second heat sink 12.

[0042] It should be noted that the numbers, values, etc. mentioned above and elsewhere in the present disclosure are exemplary and are not intended to limit the scope of the present disclosure in any way. Any other appropriate numbers, values, etc. are possible.

[0043] In some embodiments, as shown in FIG. 2 and FIG. 3, the side of the first heat sink 11 facing away from the circuit board 20 is provided with a first limiting slot 15a. The side of the second heat sink 12 facing away from the circuit board 20 is provided with a second limiting slot 15b. The carrier module 100 further comprises a first heat pipe 71 and a second heat pipe 72. The first heat pipe 71 is disposed in the first limiting slot 15a and coupled to the first heat sink 11. The first heat pipe 71 can further transfer the heat transferred from the circuit board 20 to the first heat sink 11. The second heat pipe 72 is placed in the second limiting slot 15b and coupled to the second heat sink 12. The second heat pipe 72 has the same function as the first heat pipe 71 and can help the second heat sink 12 to dissipate heat further.

[0044] As shown in FIG. 2 and FIG. 3, two first limiting slots 15a are provided on the first heat sink 11, and one first heat pipe 71 is placed in each of the two first limiting slots 15a. Two second limiting slots 15b are provided on the second heat sink 12, and one second heat pipe 72 is placed in each of the two second limiting slots 15b. The first heat sink 11 and the second heat sink 12 are usually made of metal (such as copper or aluminum) with good thermal conductivity. When the chip 30 generates heat during operation, the heat is first transferred to the first heat sink 11 and the second heat sink 12 by heat conduction. When the first heat sink 11 and the second heat sink 12 absorb the heat of the chip 30, the heat can be transferred to the first heat pipe 71 and the second heat pipe 72 in contact with them by heat conduction.

[0045] In the first heat pipe 71 and the second heat pipe 72, the working fluid evaporates into vapor by absorbing heat, and a large amount of heat needs to be absorbed in this process. The vapor moves to the condensing section along with the pressure gradient inside the heat pipe, where it releases heat and condenses back to liquid. The condensed liquid returns to the evaporation section by capillary action or gravity inside the heat pipe, forming a cycle.

[0046] As an example, the heat in the condensing section can be released to the surrounding environment by natural convection of air or forced air cooling.

[0047] As another example, the heat pipe can be connected to a heat sink or a fan to enhance the heat dissipation effect.

[0048] As yet another example, the heat pipe can be coupled to a liquid cooling system, so that the heat is taken away by the cooling medium in the liquid cooling system.

[0049] With this arrangement, in the carrier module 100, the first heat pipe 71 and the second heat pipe 72 utilize the phase change of the working fluid to transfer heat, which can help the heat dissipation member to transfer heat from the chip 30 to the external environment, thereby improving the heat dissipation efficiency.

[0050] In some embodiments, as shown in FIGS. 2 and 3, a plurality of first mounting holes 19a are provided at the bottom of the first limiting groove 15a. A plurality of first thermal conductive adhesives 13 are placed in the plurality of first mounting holes 19a, and the first thermal conductive adhesive 13 can fill the gap between the chip 30 and the first heat dissipation member 11 to improve the heat conduction efficiency. Each first thermal conductive adhesive 13 is in contact with the first heat pipe 71, i.e., the first heat pipe 71 is directly pressed on the first thermal conductive adhesive 13. With this arrangement, since the first heat pipe 71 directly contacts the first thermal conductive adhesive 13, the first heat pipe 71 can effectively absorb heat from the first heat dissipation member 11 and transfer the heat to the outside of the carrier module 100 through the phase change cycle of the first heat pipe 71 itself, thereby improving the heat dissipation efficiency of the side of the chip 30 facing the first heat pipe 71.

[0051] In addition, a plurality of second mounting holes 19b are provided at the bottom of the second limiting groove 15b. A plurality of second thermal conductive adhesives 14 are placed in the plurality of second mounting holes 19b, and the second thermal conductive adhesive 14 can fill the gap between the circuit board 20 and the second heat dissipation member 12 to improve the heat conduction efficiency. Each second thermal conductive adhesive 14 is in contact with the second heat pipe 72, i.e., the second heat pipe 72 is directly pressed on the second thermal conductive adhesive 14. With this arrangement, since the second heat pipe 72 directly contacts the second thermal conductive adhesive 14, the second heat pipe 72 can effectively absorb heat from the second heat dissipation member 12 and transfer the heat to the outside of the carrier module 100 through the phase change cycle of the second heat pipe 72 itself, thereby improving the heat dissipation efficiency of the side of the chip 30 facing the second heat pipe 72.

[0052] In some embodiments, as shown in FIGS. 1 to 3, the carrier module 100 further includes a carrier handle 40. The carrier handle 40 is a handle that is convenient for maintenance personnel to grasp and operate, which can help the maintenance personnel to insert or remove the carrier module 100 on the array server. The carrier handle 40 is provided at the end of the circuit board 20 away from the data connector 21, and the carrier handle 40 is connected with the first heat dissipation member 11 and the second heat dissipation member 12, for example, by screws, buckles or other means.

[0053] With this arrangement, when the maintenance personnel operate the carrier handle 40, the maintenance personnel can quickly insert or remove the data connector 21 from the array server, thereby realizing the connection or separation between the carrier module 100 and the server. In addition, the pluggable structure of the carrier module 100 also simplifies the difficulty of server maintenance and upgrade, and improves the convenience of operation.

[0054] In some embodiments, as shown in FIGS. 2 and 3, the carrier handle 40 is provided with a ventilation hole 41. One end of the ventilation hole 41 is adjacent to the circuit board 20, and fresh air can be introduced or hot air can be discharged through the ventilation hole 41. The other end of the ventilation hole 41 is away from the circuit board 20 and faces the external environment.

[0055] With this arrangement, the ventilation hole 41 can make the air flow in and out of the carrier module 100, helping to discharge hot air and introduce fresh air, thereby improving heat dissipation inside the carrier module 100. At the same time, when the carrier module 100 is connected with the array server, the ventilation hole 41 can also cooperate with the fan module 232 of the array server to form a complete air flow path.

[0056] In some embodiments, the carrier module 100 further comprises a locking assembly. When the carrier module 100 is connected with the array server, the locking assembly can fix the carrier module 100 on the array server, thereby avoiding loosening and falling off of the carrier module 100. The operation personnel can also disassemble the carrier module 100 from the array server by operating the locking assembly, thereby replacing and maintaining the carrier module 100.

[0057] As an example, as shown in FIGS. 1, 2, 3 and 7, the locking assembly comprises a connecting piece 61, a cooperating piece 62 and a resilient piece 63.

[0058] The connecting piece 61 comprises a first end and a second end opposite to each other. The first end of the connecting piece 61 is provided with a first protrusion 611, and the second end of the connecting piece 61 is provided with a second protrusion 612. A pin hole can be provided on the connecting piece 61, and a pin shaft can be fitted on the carrier handle 40. The pin hole of the connecting piece 61 is rotatably connected to the pin shaft on the carrier handle 40, so as to switch the connecting piece 61 between the locked position and the unlocked position.

[0059] The cooperating piece 62 is arranged on one side of the connecting piece 61, and the cooperating piece 62 can be connected to the carrier handle 40 through another set of pin holes and pin shafts. A first recess 620 is arranged on one side of the cooperating piece 62. The first recess 620 is adapted in shape and size to the second protrusion 612 and can allow the second protrusion 612 to be inserted.

[0060] The resilient piece 63 is further installed on the carrier handle 40 and connected to the carrier handle 40 and the cooperating piece 62. The resilient piece 63 can apply a force to the cooperating piece 62, so as to make the first recess 620 of the cooperating piece 62 face the direction of the connecting piece 61.

[0061] With this arrangement, when the connecting member 61 is in the locked position, the second protrusion 612 of the connecting member 61 can be inserted into the first recess 620, and the first protrusion 611 is located outside the edge of the carrier handle 40. The second protrusion 612 of the connecting member 61 is constrained by the first recess 620, so that the connecting member 61 cannot continue to rotate. At this time, the first protrusion 611 is located outside the edge of the carrier handle 40, and the first protrusion 611 can be inserted into the third recess 253 on the bracket 250 of the array server. The first protrusion 611 cannot slide out of the third recess 253, thereby avoiding loosening or falling off of the carrier module 100. The maintenance personnel can also actively press or rotate the cooperating member 62, so that the second protrusion 612 of the connecting member 61 is separated from the first recess 620. When the maintenance personnel pulls the carrier handle 40, the connecting member 61 can rotate along the pin shaft, and the first protrusion 611 of the connecting member 61 can be rotated to the inside of the edge of the carrier handle 40, so as not to affect the dismounting of the carrier handle 40 from the array server.

[0062] In some embodiments, as shown in FIG. 4, a fourth recess 42 is arranged on the side of the carrier handle 40 facing the connecting member 61. The fourth recess 42 forms a stepped structure at the bottom edge of the carrier handle 40. The connecting member 61, the cooperating member 62 and the elastic member 63 are arranged in the fourth recess 42, so that the bottom surface of the connecting member 61 and the bottom surface of the cooperating member 62 are flush with the bottom surface of the carrier handle 40.

[0063] With this arrangement, even if the connecting member 61 and the cooperating member 62 are mounted on the carrier handle 40, the overall size of the carrier handle 40 is not increased, and the size of the carrier module 100 can be simplified, thereby increasing the installation density of the carrier module 100 in the array server.

[0064] In some embodiments, as shown in FIG. 2 and FIG. 3, a through hole 43 is further arranged on the carrier handle 40. One end of the through hole 43 is adjacent to the circuit board 20, and the other end of the through hole 43 is away from the circuit board 20. An indicating assembly 44 is arranged in the through hole 43, and the indicating assembly 44 is electrically connected with the circuit board 20.

[0065] As shown in FIG. 2 and FIG. 3, the indicating assembly 44 can include an indicating lamp. The indicating lamp is used to indicate the running state of the circuit board 20 and the plurality of chips 30. For example, when the circuit board 20 and the plurality of chips 30 are normally running, the indicating assembly 44 can display green light. When the circuit board 20 and the plurality of chips 30 malfunction, the indicating assembly 44 can display red light or flicker. With this arrangement, the maintenance personnel can monitor the running state of the carrier module 100 through the indicating assembly 44, and can timely dismount the carrier module 100 from the array server when the carrier module 100 malfunctions, thereby avoiding the expansion of the damage.

[0066] In some embodiments, as shown in FIGS. 1-3, the edge of the first heat dissipation member 11 is provided with a second groove 111. The edge of the second heat dissipation member 12 is provided with a third protrusion 121. The third protrusion 121 is inserted into the second groove 111, which can limit the position of the first heat dissipation member 11 and the second heat dissipation member 12.

[0067] As shown in FIGS. 1-3, the first heat dissipation member 11 and the second heat dissipation member 12 are both rectangular structures. Two second grooves 111 are arranged on each of the two side edges of the first heat dissipation member 11, and two third protrusions 121 are arranged on each of the two side edges of the second heat dissipation member 12. The shape and size of the third protrusion 121 are matched with those of the second groove 111. When the first heat dissipation member 11 and the second heat dissipation member 12 are attached together, the two third protrusions 121 are respectively inserted into the two second grooves 111. The third protrusion 121 and the second groove 111 can limit the position of the first heat dissipation member 11 and the second heat dissipation member 12, thereby improving the structural stability of the carrier module 100.

[0068] In some embodiments, as shown in FIGS. 1-3, the carrier module 100 further comprises a metal shielding net 50. The metal shielding net 50 is installed on the side of the carrier handle 40 facing the first heat dissipation member 11 and the second heat dissipation member 12.

[0069] As shown in FIGS. 1-3, the metal shielding net 50 is a mesh structure made of metal, which can prevent external electromagnetic interference (EMI) from entering the interior of the carrier module 100. At the same time, the metal shielding net 50 can also prevent the electromagnetic radiation generated inside the carrier module 100 from leaking to the outside, avoiding affecting other electronic devices. In addition, the position of the metal shielding net 50 is close to the ventilation hole 41, which helps to improve the air flow at the ventilation hole 41, thereby improving the heat exchange efficiency between the air and the first heat dissipation member 11 and the second heat dissipation member 12.

[0070] In some embodiments, as shown in FIGS. 1-3, the edge of the metal shielding net 50 is provided with an elastic part 51. The elastic part 51 extends to the outside of the carrier handle 40, and can be used to limit the position of the metal shielding net 50 and the carrier handle 40.

[0071] As shown in FIGS. 1-3, two elastic parts 51 are arranged on each of the left side edge and the right side edge of the metal shielding net 50. The elastic part 51 is in an arc-shaped structure. When the carrier module 100 is connected with the bracket 250 of the array server, the carrier module 100 can be inserted into the compartment 251 of the bracket 250. At this time, the two pairs of elastic parts 51 abut against the side walls of the compartment 251. Under the action of the elastic force of the elastic part 51, the carrier module 100 can be prevented from loosening, which helps to improve the stability and reliability of the circuit connection.

[0072] In some embodiments, as shown in FIGS. 1-3, the elastic portion 51 is a structure bent from the edge of the metal shielding net 50. With this arrangement, the bent elastic portion 51 is not easily damaged even after multiple installations and removals, ensuring reliability and stability for long-term use.

[0073] The structure and working principle of the carrier module 100 of other embodiments of the present disclosure will be described in detail below in conjunction with FIGS. 8-10. The structure of the carrier module 100 shown in FIGS. 8-10 is similar to some of the structure of the carrier module 100 described in conjunction with FIGS. 1-7. In the following, the differences between them will be mainly described, and the same parts will not be described again.

[0074] As shown in FIGS. 8-10, the carrier module 100 further includes a first heat exchange plate 17 and a second heat exchange plate 18. The first heat exchange plate 17 is coupled to the side of the first heat dissipation member 11 away from the circuit board 20. The second heat exchange plate 18 is coupled to the side of the second heat dissipation member 12 away from the circuit board 20. The first heat exchange plate 17 and the second heat exchange plate 18 can increase the heat exchange area of the corresponding heat dissipation member, thereby improving the heat dissipation efficiency. In this way, by increasing the conduction and convection of heat, the carrier module 100 can dissipate the heat generated during operation more effectively.

[0075] As shown in FIGS. 8-10, the first heat exchange plate 17 and the second heat exchange plate 18 are both double-layer rectangular plates. A plurality of partitions are provided between the double-layer rectangular plates, and a flow channel 16 is formed between adjacent two partitions, thereby forming a plurality of flow channels 16 in the first heat exchange plate 17 and the second heat exchange plate 18, respectively. The extension direction of the plurality of flow channels 16 is the same as the extension direction of the circuit board 20, which can make the heat exchange air flow along a specific path, thereby improving the heat dissipation performance.

[0076] One end of the flow channel 16 is connected with the ventilation hole 41, so that the heat exchange air can enter the plurality of flow channels 16 from the ventilation hole 41 and flow along the plurality of flow channels 16, and finally be discharged from the other end of the plurality of flow channels 16.

[0077] With this arrangement, the first heat exchange plate 17 and the second heat exchange plate 18 can increase the heat exchange area of the heat dissipation member and optimize the flow path of the heat exchange air, thereby improving the heat dissipation performance of the carrier module 100.

[0078] Embodiments of the present disclosure also provide an array server. As shown in FIGS. 11-14, in the array server, the circuit board 20 carries the chip 30 and other electronic components, and can transmit and process signals. One end of the circuit board 20 is provided with a data connector 21, which is detachably connected to the column server, for example, pluggably connected to the bridge board 220 in the array server. In this way, the array server can connect multiple carrier modules 100. When a single carrier module 100 needs to be replaced and maintained, the carrier module 100 can be detached from the array server, without affecting the operation of other carrier modules 100, thereby reducing the failure radius of the product.

[0079] The structure and working principle of the array server will be described in detail below in combination with FIGS. 11-14, wherein FIGS. 11 and 12 show the structure of the array server according to some embodiments of the present disclosure, and FIGS. 13 and 14 show the structure of the array server according to other embodiments of the present disclosure. First, the structure and working principle of the array server according to some embodiments of the present disclosure will be described in detail in combination with FIGS. 11 and 12.

[0080] As shown in FIGS. 11 and 12, the array server includes a cabinet 200, a server mainboard 210, a plurality of bridge boards 220, and a plurality of groups of the carrier module 100 of any of the above.

[0081] The cabinet 200 is a frame structure of the array server, and can be a cuboid frame structure. The cabinet 200 not only needs to have enough space to accommodate all necessary hardware, but also needs to consider the functions such as heat dissipation and electromagnetic shielding of the server.

[0082] The cabinet 200 has an accommodating cavity 203 in the interior. The accommodating cavity 203 can be used to place hardware components such as the server mainboard 210, the bridge board 220, and the carrier module 100. One side of the cabinet 200 is provided with a first opening 201, which is in communication with the accommodating cavity 203. The first opening 201 can be used for access and detachment of the carrier module 100. The server mainboard 210 is a core control unit of the array server, and is responsible for processing and coordinating the work of all hardware components. The server mainboard 210 is installed in the accommodating cavity 203 and coupled with the cabinet 200.

[0083] The plurality of bridge boards 220 are arranged side by side in the accommodating cavity 203, and the plurality of bridge boards 220 are respectively coupled with the server mainboard 210. Each bridge board 220 is provided with a plurality of data interfaces 221 at one end facing the first opening 201. Each group of carrier modules 100 includes a plurality of carrier modules 100, and each carrier module 100 includes a data connector 21. The data connector 21 of the carrier module 100 is detachably connected with the data interface 221 of the bridge board 220.

[0084] As an example, as shown in FIG. 11, the number of bridge plates 220 is 7, and the 7 bridge plates 220 are arranged in 7 parallel layers. A total of 49 data interfaces 221 are provided on the 7 bridge plates 220. The number of carrier modules 100 is 48, and the 48 carrier modules 100 are connected to the 48 data interfaces 221. The remaining 1 data interface can be connected to other functional modules, such as an input / output module 234. Each carrier module 100 is provided with 5 chips 30. In this way, the array server can provide an operation capacity of 240 chips 30.

[0085] With this arrangement, the array server can connect multiple carrier modules 100, and can expand the storage capacity or computing capacity of the server as needed, so that the user can adjust the server configuration according to the change of business demand. When a single carrier module 100 needs to be replaced or maintained, it can be removed from the array server without affecting the normal operation of other carrier modules 100, thereby avoiding the risk of system downtime due to a single point of failure.

[0086] In some embodiments, as shown in FIGS. 11 and 12, the chassis 200 further includes a second opening 202. The second opening 202 is in communication with the accommodation cavity 203, and the second opening 202 is provided on the side of the chassis 200 opposite to the first opening 201. The array server further includes a power module 231, a fan module 232, and an identity recognition component 233.

[0087] As shown in FIGS. 11 and 12, in addition to the first opening 201, the chassis 200 further includes a second opening 202. The second opening 202 is also in communication with the accommodation cavity 203, and the second opening 202 is provided on the side of the chassis 200 opposite to the first opening 201. In this way, it is beneficial to organize and manage the space inside the chassis 200, and to ensure that the various components can be reasonably distributed.

[0088] The power module 231 is installed in the second opening 202 and coupled to the server motherboard 210. The power module 231 can provide power to the server motherboard 210 and other hardware components, ensuring that the entire system can operate stably. At the same time, the power module 231 is arranged away from the carrier modules 100, which helps to reduce the thermal impact of the power module 231 on the internal components and the carrier modules 100, and facilitates the management and heat dissipation of power cables.

[0089] The fan module 232 is also arranged in the second opening 202, and the fan module 232 is coupled to the server motherboard 210. The fan module 232 can provide cooling air flow inside the chassis 200, thereby ensuring that the server motherboard 210 and the carrier modules 100 are within a suitable temperature range.

[0090] The identity component 233 (UID component) is used to identify the array server. The identity component 233 is disposed on the chassis 200 and coupled to the server motherboard 210. In data centers and large IT environments, the identity component 233 can help administrators quickly locate and manage specific servers.

[0091] As an example, the identity component 233 provides a unique identifier for each array server, which can be a number, a letter, or a combination of both, to distinguish different servers. The identity component 233 is usually equipped with an LED light or other types of indicator lights to identify the server at the physical level. For example, when the administrator needs to find a specific server for maintenance, the target server can be quickly located by lighting the indicator light on the identity component 233.

[0092] In some embodiments, as shown in FIG. 11, the array server further includes an input / output module 234. The input / output module 234 is disposed at the first opening 201 and detachably coupled to one of the plurality of bridge boards 220.

[0093] As shown in FIG. 11, the input / output module 234 (I / O module) is mainly used to expand the input / output capability of the array server, providing additional interfaces to support various peripheral devices and network connections. The I / O module can be installed and removed without interrupting the server operation, thus providing flexibility for server maintenance and expansion.

[0094] The I / O module can integrate various types of interfaces, such as Universal Serial Bus (USB), serial port, Ethernet port, Fibre Channel, Serial Attached SCSI (SAS) port, etc. Various types of interfaces can enable the server to connect various peripheral devices, such as keyboard, mouse, printer, storage device, etc. In addition, the interfaces can also communicate with other computers or network devices. According to specific application requirements, the I / O module can customize different interface types and quantities to meet specific connection requirements.

[0095] As shown in FIG. 11, the I / O module supports plug-and-play functionality, which can be inserted or removed at any time without restarting the server. The operator can add or replace the I / O module while the server is running to adapt to new connection requirements.

[0096] With this arrangement, the input / output module 234 can provide diversified interfaces and support plug-and-play functionality in the array server, providing flexible connection capability and expandability for the server. In addition, the input / output module 234 can also ensure the security of data transmission and the stability of the system.

[0097] In some embodiments, as shown in FIGS. 11 and 12, the array server further comprises a first ear plate 241, a second ear plate 242, a power control component 235, and a data transmission component 236.

[0098] As shown in FIGS. 11 and 12, in the array server, the first ear plate 241 and the second ear plate 242 are fixed on the case 200 and provide a platform for mounting other components. The first ear plate 241 is coupled to one side of the case 200 and can be used to mount the power control component 235. The first ear plate 241 can be provided with openings or reserved slots, etc., through which the power control component 235 can be mounted on the first ear plate 241. The second ear plate 242 is coupled to the other side of the case 200, and the second ear plate 242 is opposite to the first ear plate 241. The second ear plate 242 can be used to mount the data transmission component 236.

[0099] The power control component 235 is disposed on the first ear plate 241 and coupled to the server motherboard 210. The power control component 235 is responsible for controlling the functions such as starting, shutting down, and restarting of the array server. The power control component 235 can include a power button, an indicator light, and other related control circuits. After pressing the power button, the power control component 235 sends a start signal to the server motherboard 210 to start the server. The power control component 235 can also send a shutdown signal to the server motherboard 210 to shut down the server. In addition, the power control component 235 can also perform a restart operation, which can be used when encountering software failure or needing to update the system.

[0100] The data transmission component 236 is disposed on the second ear plate 242 and coupled to the server motherboard 210. The data transmission component 236 is mainly used for transmitting data signals of the array server environment control, which can include temperature, humidity, fan speed, and other environmental monitoring information. For example, the server motherboard 210 can adjust the fan speed based on the environmental control data to improve the heat dissipation effect.

[0101] In some embodiments, as shown in FIGS. 11 and 12, the array server further comprises a bracket 250. The bracket 250 is disposed at the first opening 201 of the case 200 and is used to support and fix the carrier module 100. The structure of the bracket 250 facilitates the insertion and removal of the carrier module 100 and connects the data connector 21 of the carrier module 100 with the data interface 221 on the bridge plate 220.

[0102] The support 250 internally comprises a plurality of compartments 251, each of which corresponds to a data interface 221 on the bridge plate 220. The number of compartments 251 matches the number of data interfaces 221 on the bridge plate 220, ensuring that each data interface 221 has a corresponding compartment 251 to accommodate a group of carrier modules 100. The carrier module 100 can be inserted into the compartment 251 and coupled with the corresponding data interface 221 on the bridge plate 220.

[0103] With this arrangement, the carrier module 100 can be easily inserted into the corresponding compartment 251, thereby quickly coupling with the data interface 221 on the bridge plate 220. When the carrier module 100 needs to be replaced or maintained, the corresponding carrier module 100 can be removed from the support 250 without affecting the operation of other carrier modules 100. The support 250 makes full use of the space inside the case 200, allowing the carrier modules 100 to be closely arranged, thereby maximizing storage and computing resources in a limited space.

[0104] In some embodiments, as shown in FIG. 12, the sidewall of each of the plurality of compartments 251 is provided with a third groove 253, and the third groove 253 is capable of inserting the first protrusion 611 of the carrier module 100.

[0105] As shown in FIG. 12, when the connecting piece 61 of the carrier module 100 is in the locked position, the first protrusion 611 of the connecting piece 61 is located outside the edge of the carrier handle 40. At this point, the first protrusion 611 is inserted into the third groove 253, which can limit the position of the carrier module 100, thereby preventing the carrier module 100 from loosening or falling off during operation due to vibration or other reasons.

[0106] Due to the cooperation between the first protrusion 611 and the third groove 253, the carrier module 100 can also be removed when maintenance is needed. For example, the maintenance personnel press the fitting piece 62, which can make the connecting piece 61 switch to the unlocked state. At this time, the second protrusion 612 is separated from the first groove 620, and the connecting piece 61 can be rotated. The first protrusion 611 is rotated to the inside of the edge of the carrier handle 40, thereby allowing the carrier module 100 to be freely pulled out of the compartment 251.

[0107] In some embodiments, as shown in FIG. 12, the sidewall of each of the plurality of compartments 251 is provided with a sliding groove 252. The sliding groove 252 is slidably connected to the sidewall of the carrier module 100.

[0108] As shown in FIG. 12, the sliding groove 252 extends along the side wall and can be matched with the side wall of the carrier module 100. With this arrangement, the carrier module 100 can be smoothly slid into the compartment 251 and helps to ensure that the carrier module 100 is accurately positioned when inserted into the compartment 251. The data connector 21 of the carrier module 100 can be accurately coupled with the data interface 221 on the bridge plate 220, thereby ensuring the stability of data transmission. In addition, through the matching between the sliding groove 252 and the side wall of the carrier module 100, the carrier module 100 can be quickly installed on the support 250, which can enable the operation and maintenance personnel to quickly complete the installation task.

[0109] The structure and working principle of the array server of other embodiments of the present disclosure will be described in detail below in combination with FIG. 13 and FIG. 14. The structure of the array server shown in FIG. 13 and FIG. 14 is similar to part of the structure of the array server described in combination with FIG. 11 and FIG. 12. In the following, the differences between them will be mainly described, and the same parts will not be described again.

[0110] As shown in FIG. 13, the array server further comprises a liquid cooling system 260. The liquid cooling system 260 removes heat through cooling medium circulation, thereby reducing the temperature inside the server.

[0111] As an example, as shown in FIG. 14, the liquid cooling system 260 can comprise a liquid supply pipe 263, a liquid return pipe 264, a first branch 261, a second branch 262, a cold plate 265, and a heat exchange wall 266. The liquid supply pipe 263 can deliver cooling medium from a cooling source (for example, an outdoor heat exchanger) to each branch. The liquid return pipe 264 is used to send the cooling medium that has absorbed heat back to the cooling source for cooling again. The first branch 261 is connected with the liquid supply pipe 263 and the liquid return pipe 264, and is used to deliver cooling medium to the cold plate 265. The second branch 262 is connected with the liquid supply pipe 263 and the liquid return pipe 264, and can deliver cooling medium to the heat exchange wall 266.

[0112] The cold plate 265 is arranged in the accommodation cavity 203 and on the first branch 261. The cold plate 265 can directly contact the server mainboard 210 and remove the heat generated thereby. The heat exchange wall 266 is arranged on the side of the plurality of carrier modules 100 facing the bridge plate 220 and is detachably connected with the plurality of carrier modules. The heat exchange wall 266 can remove the heat generated by the plurality of carrier modules 100.

[0113] With this arrangement, by arranging the liquid cooling system 260 in the array server, the heat generated by the server mainboard 210 and the carrier module 100 can be removed, thereby reducing the temperature inside the server to improve the heat dissipation efficiency of the system. In addition, the temperature of the cooling liquid can also be accurately controlled by the liquid cooling system 260 to maintain the temperature inside the server within a suitable range, thereby improving the stability of the system.​

[0114] Embodiments of the present disclosure are also embodied in the following examples.

[0115] Example 1. A carrier module for an array server, comprising:

[0116] a first heat sink and a second heat sink arranged side by side;

[0117] a circuit board coupled between the first heat sink and the second heat sink, and comprising a data connector arranged at one end of the circuit board and adapted to be detachably connected to an array server, and a plurality of groups of heat dissipation holes penetrating through the circuit board along a thickness direction of the circuit board;

[0118] a plurality of chips arranged on a side of the circuit board facing the first heat sink, and respectively corresponding to positions of the plurality of groups of heat dissipation holes;

[0119] a plurality of first thermal conductive adhesives coupled between the plurality of chips and the first heat sink; and

[0120] a plurality of second thermal conductive adhesives coupled between the circuit board and the second heat sink, and respectively corresponding to positions of the plurality of groups of heat dissipation holes.

[0121] Example 2. The carrier module of example 1, wherein a side of the first heat sink facing away from the circuit board is provided with a first limiting slot, a side of the second heat sink facing away from the circuit board is provided with a second limiting slot, and the carrier module further comprises:

[0122] a first heat pipe arranged in the first limiting slot and coupled to the first heat sink; and

[0123] a second heat pipe arranged in the second limiting slot and coupled to the second heat sink.

[0124] Example 3. The carrier module of example 2, wherein the first heat sink comprises a plurality of first mounting holes arranged at a bottom of the first limiting slot, the plurality of first mounting holes respectively accommodate the plurality of first thermal conductive adhesives, and the plurality of first thermal conductive adhesives abut against the first heat pipe;

[0125] the second heat sink comprises a plurality of second mounting holes arranged at a bottom of the second limiting slot, the plurality of second mounting holes respectively accommodate the plurality of second thermal conductive adhesives, and the plurality of second thermal conductive adhesives abut against the second heat pipe.

[0126] Example 4. The carrier module of example 1, further comprising:

[0127] A carrier handle is disposed at an end of the circuit board distal from the data connector and is coupled to the first heat sink and the second heat sink, the carrier handle being operable to connect or disconnect the data connector from the array server.

[0128] Example 5. The carrier module of example 4, wherein the carrier handle is provided with a ventilation hole, one end of the ventilation hole being adjacent to the circuit board and the other end of the ventilation hole being away from the circuit board for heat exchange air to pass through.

[0129] Example 6. The carrier module of example 5, further comprising:

[0130] a first heat exchange plate coupled to a side of the first heat sink distal from the circuit board; and

[0131] a second heat exchange plate coupled to a side of the second heat sink distal from the circuit board.

[0132] wherein the first heat exchange plate and the second heat exchange plate each comprise a plurality of flow channels, the plurality of flow channels extending in the same direction as the circuit board, and one end of the plurality of flow channels corresponding to the ventilation hole.

[0133] Example 7. The carrier module of example 5, further comprising:

[0134] a metal shielding net coupled to a side of the carrier handle facing the first heat sink and the second heat sink.

[0135] Example 8. The carrier module of example 7, wherein an edge of the metal shielding net is provided with a resilient portion, and the resilient portion extends to an outside of the carrier handle to limit the position of the metal shielding net and the carrier handle.

[0136] Example 9. The carrier module of example 4, further comprising:

[0137] a connecting piece rotatably coupled to the carrier handle and switchable between an unlocked position and a locked position, the connecting piece comprising a first end and a second end opposite to each other, the first end being provided with a first protruding portion, and the second end being provided with a second protruding portion;

[0138] a cooperating piece rotatably coupled to the carrier handle, and one side of the cooperating piece being provided with a first recess capable of inserting the second protruding portion; and

[0139] a resilient piece coupled to the carrier handle and the cooperating piece, the resilient piece being configured to apply a force to the cooperating piece to make the first recess face the connecting piece.

[0140] wherein in the case that the connecting member is in the locked position, the second protrusion is inserted into the first groove, and the first protrusion is located outside the edge of the carrier handle; and in the case that the connecting member is in the unlocked position, the second protrusion is separated from the first groove.

[0141] Example 10. The carrier module of example 4, wherein the carrier handle is provided with a through hole, and the carrier module further comprises:

[0142] an indicating assembly arranged in the through hole, and the indicating assembly is coupled to the circuit board.

[0143] Example 11. The carrier module of any one of examples 1 to 10, wherein an edge of the first heat dissipation member is provided with a second groove, and an edge of the second heat dissipation member is provided with a third protrusion, the third protrusion is inserted into the second groove to limit the position of the first heat dissipation member and the second heat dissipation member.

[0144] Example 12. The carrier module of any one of examples 1 to 10, wherein each of the plurality of groups of heat dissipation holes comprises a plurality of laser holes.

[0145] Example 13. The carrier module of any one of examples 1 to 10, wherein the plurality of chips are arranged in rows along the extension direction of the circuit board, and

[0146] the positions of the chips in each row are staggered along the extension direction of the circuit board.

[0147] Example 14. An array server, comprising:

[0148] a cabinet comprising a receiving cavity and a first opening, the first opening is arranged on one side of the cabinet and communicates with the receiving cavity;

[0149] a server mainboard arranged in the receiving cavity and coupled to the cabinet;

[0150] a plurality of bridge boards arranged side by side in the receiving cavity and coupled to the cabinet, the plurality of bridge boards are coupled to the server mainboard, and each bridge board is provided with a plurality of data interfaces at an end facing the first opening; and

[0151] a plurality of groups of carrier modules, each group of carrier modules comprises a plurality of carrier modules, each carrier module is the carrier module of any one of examples 1 to 13, and the data connectors of each group of carrier modules are respectively detachably coupled to the data interfaces of the corresponding bridge boards.

[0152] Example 15. The array server of example 14, wherein the chassis further comprises a second opening, the second opening being in communication with the receiving cavity and disposed on an opposite side of the chassis from the first opening, and the array server further comprises:

[0153] a power module disposed in the second opening and coupled to the server motherboard;

[0154] a fan module disposed in the second opening and coupled to the server motherboard; and

[0155] an identification component disposed on the chassis and coupled to the server motherboard.

[0156] Example 16. The array server of example 14 or 15, further comprising:

[0157] an input / output module disposed at the first opening and removably coupled to one of the plurality of bridge boards.

[0158] Example 17. The array server of example 14 or 15, further comprising:

[0159] a first ear plate coupled to one side of the chassis;

[0160] a second ear plate coupled to another side of the chassis opposite the first ear plate;

[0161] a power control component disposed on the first ear plate and coupled to the server motherboard; and

[0162] a data transfer component disposed on the second ear plate and coupled to the server motherboard.

[0163] Example 18. The array server of example 14 or 15, further comprising:

[0164] a support disposed at the first opening of the chassis, the support comprising a plurality of compartments, and the plurality of compartments respectively corresponding to the plurality of data interfaces, the plurality of compartments respectively for insertion of the plurality of sets of carrier modules.

[0165] Example 19. The array server of example 18, wherein each compartment of the plurality of compartments is provided with a third recess, and the third recess is capable of insertion of the first protrusion of the carrier module.

[0166] Example 20. The array server of example 14 or 15, further comprising:

[0167] a liquid supply pipe and a liquid return pipe;

[0168] A first branch, which is in communication with the liquid supply pipe and the liquid return pipe;

[0169] A second branch, which is in communication with the liquid supply pipe and the liquid return pipe;

[0170] A cold plate, which is disposed in the accommodation cavity, coupled to the first branch, and the cold plate is coupled to the server mainboard; and

[0171] A heat exchange wall, which is disposed on a side of the plurality of groups of carrier modules facing the bridge plate, coupled to the second branch, and the heat exchange wall is detachably coupled to the plurality of groups of carrier modules.

[0172] The above has described various embodiments of the present disclosure, the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles, practical applications, or technical improvements of the technology in the market, or to enable other ordinary skilled in the art to understand the embodiments disclosed herein.

Claims

1. A carrier module (100) for an array server, comprising: a first heat sink (11) and a second heat sink (12) arranged side by side; a circuit board (20) coupled between the first heat sink (11) and the second heat sink (12) and comprising a data connector (21) arranged at one end of the circuit board (20) and adapted to be detachably connected to an array server, and a plurality of groups of heat dissipation holes (22) penetrating through the circuit board (20) along a thickness direction of the circuit board (20); a plurality of chips (30) arranged on a side of the circuit board (20) facing the first heat sink (11) and corresponding to positions of the plurality of groups of heat dissipation holes (22) respectively; a plurality of first thermal conductive adhesives (13) coupled between the plurality of chips (30) and the first heat sink (11); and a plurality of second thermal conductive adhesives (14) coupled between the circuit board (20) and the second heat sink (12) and corresponding to the positions of the plurality of groups of heat dissipation holes (22) respectively. 2.The carrier module (100) of claim 1, wherein a side of the first heat sink (11) facing away from the circuit board (20) is provided with a first limiting groove (15a), a side of the second heat sink (12) facing away from the circuit board (20) is provided with a second limiting groove (15b), and the carrier module (100) further comprises: a first heat pipe (71) arranged in the first limiting groove (15a) and coupled to the first heat sink (11); and a second heat pipe (72) arranged in the second limiting groove (15b) and coupled to the second heat sink (12). 3.The carrier module (100) of claim 2, wherein the first heat sink (11) comprises a plurality of first mounting holes (19a) arranged at a bottom of the first limiting groove (15a), the plurality of first mounting holes (19a) respectively accommodate the plurality of first thermal conductive adhesives (13) therein, and the plurality of first thermal conductive adhesives (13) abut against the first heat pipe (71); the second heat sink (12) comprises a plurality of second mounting holes (19b) arranged at a bottom of the second limiting groove (15b), the plurality of second mounting holes (19b) respectively accommodate the plurality of second thermal conductive adhesives (14) therein, and the plurality of second thermal conductive adhesives (14) abut against the second heat pipe (72). 4.The carrier module (100) of claim 1, further comprising: a carrier handle (40) arranged at an end of the circuit board (20) away from the data connector (21) and coupled to the first heat sink (11) and the second heat sink (12), the carrier handle (40) being operable to connect or disconnect the data connector (21) to or from the array server. ​ ​ 5. The carrier module (100) according to claim 4, wherein the carrier handle (40) is provided with a ventilation hole (41), one end of the ventilation hole (41) being adjacent to the circuit board (20), and the other end of the ventilation hole (41) being away from the circuit board (20) for passing heat exchange air.

6. The carrier module (100) according to claim 5, further comprising: a first heat exchange plate (17) coupled to a side of the first heat sink (11) away from the circuit board (20); and a second heat exchange plate (18) coupled to a side of the second heat sink (12) away from the circuit board (20); wherein the first heat exchange plate (17) and the second heat exchange plate (18) each comprise a plurality of flow channels (16) extending in the same direction as the circuit board (20), and one end of the plurality of flow channels (16) corresponds to the ventilation hole (41).

7. The carrier module (100) according to claim 5, further comprising: a metal shielding net (50) coupled to a side of the carrier handle (40) facing the first heat sink (11) and the second heat sink (12).

8. The carrier module (100) according to claim 7, wherein an edge of the metal shielding net (50) is provided with an elastic part (51), and the elastic part (51) extends to an outside of the carrier handle (40) to limit the positions of the metal shielding net (50) and the carrier handle (40).

9. The carrier module (100) according to claim 4, further comprising: a connecting piece (61) rotatably coupled to the carrier handle (40) and switchable between an unlocked position and a locked position, the connecting piece (61) comprising a first end and a second end opposite to each other, the first end being provided with a first protruding part (611), and the second end being provided with a second protruding part (612); a cooperating piece (62) rotatably coupled to the carrier handle (40), and one side of the cooperating piece (62) being provided with a first recess (620) capable of inserting the second protruding part (612); and an elastic piece (63) coupled to the carrier handle (40) and the cooperating piece (62), the elastic piece (63) being configured to apply a force to the cooperating piece (62) to make the first recess (620) face the connecting piece (61); wherein when the connecting piece (61) is in the locked position, the second protruding part (612) is inserted into the first recess (620), and the first protruding part (611) is located outside an edge of the carrier handle (40); and when the connecting piece (61) is in the unlocked position, the second protruding part (612) is separated from the first recess (620).

10. The carrier module (100) according to claim 4, wherein the carrier handle (40) is provided with a through hole (43), and the carrier module (100) further comprises: ​ An indicating component (44) is arranged in the through hole (43), and the indicating component (44) is coupled to the circuit board (20).

11. The carrier module (100) according to any one of claims 1 to 10, wherein an edge of the first heat dissipation member (11) is provided with a second groove (111), and an edge of the second heat dissipation member (12) is provided with a third protrusion (121), the third protrusion (121) is inserted into the second groove (111) to limit the positions of the first heat dissipation member (11) and the second heat dissipation member (12).

12. The carrier module (100) according to any one of claims 1 to 10, wherein each of the plurality of groups of heat dissipation holes (22) comprises a plurality of laser holes.

13. The carrier module (100) according to any one of claims 1 to 10, wherein the plurality of chips (30) are arranged in rows along the extension direction of the circuit board (20), and the positions of the chips (30) in each row are staggered along the extension direction of the circuit board (20).

14. An array server, comprising: a cabinet (200) comprising a receiving cavity (203) and a first opening (201), the first opening (201) being arranged on one side of the cabinet (200) and communicating with the receiving cavity (203); a server mainboard (210) arranged in the receiving cavity (203) and coupled to the cabinet (200); a plurality of bridge boards (220) arranged side by side in the receiving cavity (203) and coupled to the cabinet (200), the plurality of bridge boards (220) being coupled to the server mainboard (210), and each of the bridge boards (220) being provided with a plurality of data interfaces (221) at an end facing the first opening (201); and a plurality of groups of carrier modules (100), each group of the carrier modules (100) comprising a plurality of carrier modules (100), each of the carrier modules (100) being the carrier module (100) according to any one of claims 1 to 13, and the data connectors (21) of each group of the carrier modules (100) being detachably coupled to the data interfaces (221) of the corresponding bridge boards (220), respectively.

15. The array server according to claim 14, wherein the cabinet (200) further comprises a second opening (202) communicating with the receiving cavity (203) and arranged on a side of the cabinet (200) opposite to the first opening (201), and the array server further comprises: a power supply module (231) arranged in the second opening (202) and coupled to the server mainboard (210); a fan module (232) arranged in the second opening (202) and coupled to the server mainboard (210); and an identity recognition component (233) arranged on the cabinet (200) and coupled to the server mainboard (210). ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 16.The array server of claim 14 or 15, further comprising: an input-output module (234) disposed at the first opening (201) and detachably coupled to one of the plurality of bridge boards (220). 17.The array server of claim 14 or 15, further comprising: a first ear plate (241) coupled to one side of the cabinet (200) ; a second ear plate (242) coupled to another side of the cabinet (200) opposite to the first ear plate (241) ; a power supply control component (235) disposed on the first ear plate (241) and coupled to the server motherboard (210) ; and a data transmission component (236) disposed on the second ear plate (242) and coupled to the server motherboard (210). 18.The array server of claim 14 or 15, further comprising: a bracket (250) disposed at the first opening (201) of the cabinet (200), the bracket (250) comprising a plurality of compartments (251) corresponding to the plurality of data interfaces (221), respectively, the plurality of compartments (251) being configured to receive the plurality of groups of carrier modules (100), respectively. 19.The array server of claim 18, wherein each of the plurality of compartments (251) is provided with a third groove (253) configured to receive the first protrusion (611) of the carrier module (100). 20.The array server of claim 14 or 15, further comprising: a liquid supply pipe (263) and a liquid return pipe (264) ; a first branch (261) in communication with the liquid supply pipe (263) and the liquid return pipe (264) ; a second branch (262) in communication with the liquid supply pipe (263) and the liquid return pipe (264) ; a cold plate (265) disposed in the receiving cavity (203) and coupled to the first branch (261), the cold plate (265) being coupled to the server motherboard (210) ; and a heat exchange wall (266) disposed on a side of the plurality of groups of carrier modules (100) facing the bridge board (220) and coupled to the second branch (262), the heat exchange wall (266) being detachably coupled to the plurality of groups of carrier modules (100). ​ ​

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