Computing device and vehicle

Abstract

A computing device and a vehicle, applied to the field of smart terminals. The computing device comprises a heat dissipation apparatus and a circuit board. The heat dissipation apparatus comprises a first cold plate and a second cold plate, wherein the first cold plate and the second cold plate are stacked. The circuit board is sandwiched between the first cold plate and the second cold plate. The circuit board has a first surface and a second surface that are arranged opposite to each other in the thickness direction of the heat dissipation apparatus, wherein at least one first heating device is provided on the first surface, and at least one second heating device is provided on the second surface. The first cold plate is thermally conductively connected to the at least one first heating device, and the second cold plate is thermally conductively connected to the at least one second heating device. Double-sided heat dissipation of a circuit board is implemented by using a first cold plate and a second cold plate of a heat dissipation apparatus, thereby greatly improving the heat dissipation efficiency, solving the heat dissipation problem of a circuit board on which high-power devices are concentrated, and improving the thermal management stability and safety of computing devices. In addition, double-sided heat dissipation is conducive to reducing the layout area of a circuit board, thereby improving the integration level of computing devices.

Description

A computing device and vehicle

[0001] The present application claims priority to the Chinese patent application No. 202411078717.8, filed on August 6, 2024, entitled "A computing device and vehicle", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the fields of computer technology and terminal technology, and in particular, to a computing device and vehicle. BACKGROUND

[0003] With the increasing requirements of intelligence, safety and comfort of devices, more and more devices are deployed inside the devices. With the rapid development of digitization and intelligence, the functions of devices are gradually integrated, and more and more functions are concentrated on the computing platform to be completed, which makes the electronic devices, especially high-power electronic devices, integrated on the circuit board of the computing platform more and more, bringing great challenges to the heat dissipation of the devices. Taking a smart car as an example, the early electronic and electrical architecture adopts a decentralized architecture, and a single function uses an independent controller. The vehicle includes nearly one hundred controllers, which has high cost, large weight and low assembly level. With the iteration of the vehicle electronic and electrical architecture, from the decentralized architecture to the domain fusion architecture, and then to the central computing platform, the functions of the vehicle are gradually concentrated on the central computing device. In the face of complex and variable mobile travel and life scenarios, as well as the functional innovation of intelligent cockpit, intelligent driving, vehicle control and the like, a computing device with strong performance is needed to support, which makes the board area of the computing device increase continuously, and the high-power electronic devices deployed on the circuit board also increase continuously.

[0004] With the development of circuit integration and chip packaging technology, the product size of high-power devices is also developing towards miniaturization, which leads to the concentration of heat on the circuit board and affects the reliability of electronic devices. In the electronic industry, when the environmental temperature of a device increases by 10℃, its failure rate will double (the famous "10℃ rule"). Therefore, the circuit board needs to be configured with a corresponding heat dissipation device.

[0005] However, the power consumption of the chips arranged on the circuit board is getting larger and larger, and the power per unit area is getting higher and higher. For a vehicle, a large number of high-power devices are often concentrated on the circuit board of the central computing platform of the vehicle. The current liquid cooling heat dissipation scheme cannot meet the heat dissipation needs of the circuit board with high-power device concentration. Especially for the computing platform in the vehicle, its reliability is closely related to the personal safety of users. Solving the heat dissipation problem of the circuit board with high-power device concentration has become a key research direction in the vehicle industry. SUMMARY

[0006] The application provides a computing device and a vehicle, and also provides a heat dissipation device, which can realize double-sided heat dissipation of a circuit board when dissipating heat for the circuit board in the computing device, can greatly improve heat dissipation efficiency, solves the heat dissipation problem of the circuit board with high-power devices concentrated, and improves the thermal management stability and safety of the computing device. Moreover, the double-sided heat dissipation is beneficial to reducing the layout area of the circuit board and is beneficial to the miniaturization and integration design of the computing device.

[0007] In a first aspect, the application provides a computing device, comprising a heat dissipation device and a circuit board. The heat dissipation device comprises a first cold plate and a second cold plate, which are stacked along the thickness direction of the heat dissipation device. The circuit board is arranged between the first cold plate and the second cold plate, and comprises a first surface and a second surface arranged oppositely along the thickness direction of the heat dissipation device. The first surface is provided with at least one first heat-generating device, and the second surface is provided with at least one second heat-generating device. The first cold plate of the heat dissipation device is in thermal conductive connection with the at least one first heat-generating device, and the second cold plate is in thermal conductive connection with the at least one second heat-generating device.

[0008] In the computing device provided by the application, the first cold plate and the second cold plate are arranged on both sides of the circuit board, and the first cold plate and the second cold plate are respectively used for dissipating heat for the heat-generating devices arranged on the first surface and the second surface of the circuit board. That is, the heat dissipation device can realize double-sided heat dissipation of the circuit board, and the double-sided heat dissipation can greatly improve the heat dissipation efficiency of the circuit board and solve the heat dissipation problem of the circuit board with high-power devices concentrated.

[0009] The above design can solve the heat dissipation problem of the circuit board with high-power devices concentrated. As a possible implementation, since both sides of the circuit board can dissipate heat, the first surface and the second surface of the circuit board can both arrange high-power devices (such as chips), that is, double-sided layout of the circuit board is realized, so that the layout area of the circuit board is greatly reduced, and the heat dissipation requirements of the high-power devices on both sides of the circuit board can be met.

[0010] As another possible implementation, the circuit board can still be single-sidedly laid out, but a heat-conducting component can be arranged on the back of part or all of the high-power devices, which can guide the heat generated by the high-power devices to the back. At this time, the single-sidedly laid out high-power devices can be dissipated on both the front and back. Those skilled in the art should know that, when the placement positions of the high-power devices on the circuit board are designed, the high-power devices are usually spaced apart by a large distance in consideration of the heat dissipation efficiency. In the application, the heat dissipation efficiency is greatly improved by dissipating heat on both sides of the high-power devices, so that the high-power devices can be arranged more densely, thereby making the layout area of the circuit board smaller.

[0011] In summary, the computing device provided in the application greatly improves the heat dissipation efficiency, solves the heat dissipation problem of the circuit board with high-power devices concentrated, can reduce the layout area of the circuit board, and is conducive to the miniaturization and integration design of the computing device. Especially in the intelligent vehicle scenario, more chips will be arranged on the circuit board of the computing platform (such as an intelligent driving controller) in the vehicle, and the power consumption of these chips is very high. Through the computing device provided in the application, the heat dissipation problem of the circuit board with high-power devices concentrated in the vehicle can be solved, and the stability, reliability and safety of the vehicle can be improved.

[0012] Optionally, the heat dissipation device can adopt one or more of liquid cooling, air cooling and the like to dissipate heat. The liquid cooling dissipates heat by flowing liquid (i.e. cooling medium) to take away heat, so as to reduce the temperature of the heat generating device. The air cooling dissipates heat by flowing air to take away heat, so as to reduce the temperature of the heat generating device.

[0013] In a possible implementation of the first aspect, the first cold plate is provided with a first flow channel, and the second cold plate is provided with a second flow channel, and the first flow channel and the second flow channel are used for the cooling medium to flow. At this time, the first cold plate and the second cold plate dissipate heat by flowing the cooling medium, which has high heat dissipation efficiency, is less affected by environmental temperature, air circulation and the like, and has high stability.

[0014] In a possible implementation of the first aspect, the first cold plate includes a third surface, and the third surface is provided with at least one first heat dissipation boss. The protruding heat dissipation boss facilitates the lamination with the heat generating device on the circuit board, so as to dissipate heat from the heat generating device in a targeted manner, and the heat dissipation efficiency of the heat generating device can be improved.

[0015] Further, when the first cold plate is a cold plate that dissipates heat by liquid cooling, the first cold plate is further provided with a first flow channel. Along the thickness direction of the first cold plate, the third surface and the first flow channel are located on opposite sides of the first cold plate.

[0016] In another possible implementation of the first aspect, the orthographic projection of the at least one first heat generating device and the at least one first heat dissipation boss on the third surface at least partially overlaps. Further, the at least one first heat generating device is in thermal conductive connection with the at least one first heat dissipation boss.

[0017] In the above implementation, the positions of the heat dissipation boss and the heat generating device correspond to each other, facilitating the lamination of the two, so as to improve the heat dissipation efficiency of the heat generating device in a targeted manner. The thermal conductive connection here can be contact connection (i.e. close lamination) or connection through a thermal conductive material, so that heat can be conducted from the heat generating device to the heat dissipation boss.

[0018] Exemplarily, a heat-conducting medium is arranged between the at least one first heat-generating device and the at least one first heat-dissipating boss, and the two are attached through the heat-conducting medium. The heat-conducting medium can include silicone grease or a heat-conducting pad (for example, a phase-change heat-conducting film), and the like. Through the heat-conducting material, direct contact between the boss and the surface of the high-power-consumption device can be avoided, and the risk of damage to the high-power-consumption device can be reduced. The heat-conducting medium has a low thermal resistance, and a very thin thickness can be achieved in the process. By attaching the heat-dissipating boss and the high-power-consumption chip through the heat-conducting medium, the heat conduction efficiency can be improved, and the temperature of the high-power-consumption device can be reduced.

[0019] In a further possible implementation manner of the first aspect, the first flow channel forms a first projection on the third surface, the at least one first heat-generating device forms a second projection on the third surface, and the first projection covers the second projection. In the above implementation manner, the flow channel in the first cold plate can cover the area on the first surface where the heat-generating device is arranged, so that the heat dissipation requirement of the heat-generating device can be guaranteed to the greatest extent, and the heat dissipation efficiency can be improved.

[0020] In a further possible implementation manner of the first aspect, the first flow channel forms a first projection on the third surface, the at least one first heat-generating device forms a second projection on the third surface, and the first projection covers the second projection. In the above implementation manner, the flow channel in the first cold plate can cover the area on the first surface where the heat-generating device is arranged, so that the heat dissipation requirement of the heat-generating device can be guaranteed to the greatest extent, and the heat dissipation efficiency can be improved.

[0021] In a further possible implementation manner of the first aspect, the second cold plate includes a fourth surface, and the fourth surface is provided with at least one second heat-dissipating boss. The technical effects can be referred to the foregoing.

[0022] In a further possible implementation manner of the first aspect, the at least one second heat-generating device and the at least one second heat-dissipating boss at least partially coincide in the orthographic projection on the fourth surface. Further, the at least one second heat-generating device and the at least one second heat-dissipating boss are in heat-conducting connection.

[0023] In a further possible implementation manner of the first aspect, the second flow channel forms a third projection on the fourth surface, and the at least one second heat-generating device forms a fourth projection on the fourth surface, and the third projection covers the fourth projection.

[0024] In a further possible implementation manner of the first aspect, the second flow channel forms a third projection on the fourth surface, and the at least one second heat-generating device forms a fourth projection on the fourth surface, and the third projection covers the fourth projection.

[0025] In a further possible implementation form of the first aspect, the at least one first heat generating device comprises a chip, and the at least one second heat generating device comprises a chip. The above implementation form introduces a board layout manner, the first surface and the second surface of the circuit board can both be arranged with high-power devices (such as chips), i.e., a double-sided board layout manner. This board layout manner makes the design position of the chip more flexible, and can greatly reduce the board layout area of the circuit board, and the double-sided heat dissipation heat dissipation device can ensure that the heat dissipation requirements of the high-power devices on both sides of the circuit board can be met.

[0026] In a further possible implementation form of the first aspect, the at least one first heat generating device comprises a chip, and the at least one second heat generating device comprises a heat conduction component in heat conduction connection with the chip. The heat conduction component is for example a copper sheet, a metal boss, etc. The above implementation form introduces another board layout manner, the first surface of the circuit board is arranged with high-power devices (such as chips), and the second surface can be arranged with heat conduction components, which can conduct the heat generated by the high-power devices to the back surface. At this time, the high-power devices arranged on one side can be cooled on both the front and back surfaces, which can greatly improve the heat dissipation efficiency, so that the high-power devices can be arranged more densely, thereby making the board layout area of the circuit board smaller.

[0027] Optionally, the heat conduction component and the chip at least partially overlap in the orthographic projection on the first surface, which can improve the heat conduction efficiency of the heat conduction component and the heat dissipation efficiency.

[0028] In a further possible implementation form of the first aspect, the first cold plate is provided with a first liquid passing opening, a second liquid passing opening, a first communication opening and a second communication opening, and the second cold plate is provided with a third communication opening and a fourth communication opening. The first flow channel and the second flow channel are in communication through the first communication opening and the third communication opening, and the second flow channel and the second liquid passing opening are in communication through the second communication opening and the fourth communication opening. The first liquid passing opening, the first flow channel, the first communication opening, the third communication opening, the second flow channel, the second communication opening, the fourth communication opening and the second liquid passing opening are sequentially in communication.

[0029] The above embodiment introduces a design of the liquid inlet and outlet of the heat dissipation device. The first cold plate and the second cold plate share the liquid inlet and outlet, and the liquid inlet and outlet are arranged on the first cold plate. The first flow channel and the second flow channel are communicated, and the cooling medium can flow between the first cold plate and the second cold plate through the communication port. In this embodiment, the cooling system only needs to design one set of cooling medium output and output pipeline to meet the demand, which can reduce the design complexity of the cooling system matched with the heat dissipation device. In addition, in the above embodiment, the liquid inlet and outlet (i.e. the first liquid passage and the second liquid passage) are arranged on the first cold plate. Therefore, the pipeline matched with the liquid inlet and outlet can be designed in the same plane, which is convenient for pipeline wiring design and installation. In addition, the liquid inlet and outlet are arranged on the first cold plate, which reduces the design complexity of the external shape of the second cold plate, facilitates the mold manufacturing of the heat dissipation device, and can reduce the production cost.

[0030] In another possible implementation of the first aspect, the third communication port is a connecting port of a first pipe joint arranged on the second cold plate. At this time, the first communication port on the first cold plate is an interface of a first through hole, which is matched with the first pipe joint and can be fixedly connected, so as to realize the communication of the first flow channel and the second flow channel. Alternatively, the first pipe joint is arranged on the first cold plate, and the first through hole is correspondingly arranged on the second cold plate.

[0031] Similarly, the fourth communication port is a connecting port of a second pipe joint arranged on the second cold plate. The first cold plate is further provided with a second through hole matched with the second pipe joint, and the second through hole and the second pipe joint can be fixedly connected, so as to realize the communication of the second flow channel and the second liquid passage. Alternatively, the second pipe joint is arranged on the first cold plate, and the second through hole is correspondingly arranged on the second cold plate.

[0032] In another possible implementation of the first aspect, the first communication port and the third communication port are arranged on the same side of the heat dissipation device. Since the first communication port and the third communication port need to be communicated, arranging them on the same side can reduce the length of the pipeline communication, which is helpful for the lightweight design of the computing device.

[0033] Similarly, the second communication port and the fourth communication port can be arranged on the same side of the heat dissipation device. Since the second communication port and the fourth communication port need to be communicated, arranging them on the same side can reduce the length of the pipeline communication, which is helpful for the lightweight design of the computing device.

[0034] In another possible implementation of the first aspect, the first liquid passage and the second liquid passage are arranged on the same side of the heat dissipation device. In this way, the liquid inlet pipeline and the liquid outlet pipeline can be arranged on the same side of the heat dissipation device, which can reduce the design complexity of the cooling system matched with the heat dissipation device. Moreover, the liquid inlet and outlet arranged on the same side facilitate mold manufacturing and reduce production cost.

[0035] In a further possible implementation form of the first aspect, the first liquid passage opening and the second liquid passage opening are disposed at opposite sides of the heat dissipation device. The liquid passage openings disposed at opposite sides can adapt to various possible liquid inlet / outlet designs. For example, in a cold plate, the flow channel design is usually S-shaped, and the liquid passage openings disposed at opposite sides can adapt to the S-shaped flow channel design. Those skilled in the art can know that the S-shaped design can cover S-shaped designs and the like, and the overall design is S-shaped.

[0036] In a further possible implementation form of the first aspect, the first cold plate is provided with a third liquid passage opening and a fifth communication opening, the second cold plate is provided with a fourth liquid passage opening and a sixth communication opening, the first flow channel and the second flow channel are communicated through the fifth communication opening and the sixth communication opening, and the third liquid passage opening, the first flow channel, the fifth communication opening, the sixth communication opening, the second flow channel and the fourth liquid passage opening are sequentially communicated.

[0037] The above implementation introduces another liquid inlet / outlet design of the heat dissipation device. The first cold plate and the second cold plate share the liquid inlet / outlet, one of the liquid inlet and the liquid outlet is disposed on the first cold plate, and the other is disposed on the second cold plate. The first flow channel and the second flow channel are communicated, and the cooling medium can flow between the first cold plate and the second cold plate through the communication openings. Similarly, the cooling system only needs to design one set of cooling medium output and output pipelines to meet the requirements, which can reduce the design complexity of the cooling system matched with the heat dissipation device. In addition, the liquid inlet and the liquid outlet are separately disposed, which can reduce a set of communication openings, reduce the interfaces in the pipelines, reduce the risk of liquid leakage, and is conducive to the lightweight design of the computing device.

[0038] In a further possible implementation form of the first aspect, the fifth communication opening and the sixth communication opening are disposed at the same side of the heat dissipation device. Since the fifth communication opening and the sixth communication opening need to be communicated, disposing them at the same side can reduce the length of the pipeline communication, which is conducive to the lightweight design of the computing device.

[0039] In a further possible implementation form of the first aspect, the third liquid passage opening and the fourth liquid passage opening are disposed at the same side of the heat dissipation device. In this way, the liquid inlet pipeline and the liquid outlet pipeline can be disposed at the same side of the heat dissipation device, which can reduce the design complexity of the cooling system matched with the heat dissipation device.

[0040] In a further possible implementation form of the first aspect, the third liquid passage opening and the fourth liquid passage opening are disposed at opposite sides of the heat dissipation device. This implementation can adapt to various possible flow channel designs. For example, in a cold plate, the flow channel design is usually S-shaped, and the liquid passage openings disposed at opposite sides can adapt to the S-shaped flow channel design.

[0041] In a further possible implementation form of the first aspect, the first cold plate is provided with a first inlet and a first outlet, both of which are in communication with the first flow channel, the first inlet being configured to allow the cooling medium to flow in, and the first outlet being configured to allow the cooling medium to flow out. The second cold plate is provided with a second inlet and a second outlet, both of which are in communication with the second flow channel, the second inlet being configured to allow the cooling medium to flow in, and the second outlet being configured to allow the cooling medium to flow out.

[0042] The above-mentioned implementation form introduces a further design of the inlet and outlet of the heat dissipation device. The flow channels of the first cold plate and the second cold plate are independent, and each has a pair of inlet and outlet. The cooling medium used by the first cold plate and the second cold plate can be the same or different. The independent flow channels make the heat dissipation capacity of the first cold plate equal to that of the second cold plate, so that both surfaces of the electrothermal plate can achieve good heat dissipation effect and improve the heat dissipation efficiency.

[0043] In a further possible implementation form of the first aspect, the first inlet and the second inlet are located on the same side of the heat dissipation device, and the first outlet and the second outlet are located on the same side of the heat dissipation device. In this way, the design complexity of the cooling system matched with the heat dissipation device can be reduced.

[0044] In a further possible implementation form of the first aspect, the first flow channel is an "S"-shaped flow channel. The S-shaped flow channel allows the cooling liquid to pass through the entire third surface of the first cold plate in sequence, facilitating the flow of the cooling liquid and improving the heat dissipation efficiency.

[0045] In a further possible implementation form of the first aspect, the first cold plate comprises a first base plate and a first cover plate, the first flow channel is recessed in a fifth surface of the first base plate, the fifth surface being a surface of the first base plate away from the circuit board, and the first cover plate is configured to seal the first flow channel. In the above-mentioned implementation form, the first cold plate comprises two components, i.e., the first base plate and the first cover plate, which facilitates the overall manufacturing of the first base plate, reduces the production difficulty, and improves the production efficiency.

[0046] Further, the first cover plate and the first base plate can be integrated by welding, sealing glue bonding, sealing ring connection or the like.

[0047] In a further possible implementation form of the first aspect, the first flow channel comprises a plurality of sub-flow channels connected in sequence. In the above-mentioned implementation form, the first flow channel is divided into a plurality of sub-flow channels, and the plurality of sub-flow channels are connected in sequence, so that the cooling medium can flow in a certain fixed path in sequence, and the flow rate of the cooling medium in the first cold plate can be more uniform. The design of the sub-flow channel can also avoid water flow blocking, static or vortex at a certain place, and can improve the heat dissipation efficiency.

[0048] In a further possible implementation form of the first aspect, the first flow channel comprises a first sub-flow channel, a second sub-flow channel and a third sub-flow channel.

[0049] The first cold plate has a first side and a second side opposite to each other along a length direction of the heat dissipation device, and a third side and a fourth side opposite to each other along a width direction of the heat dissipation device. The first flow channel is provided with a first partition component and a second partition component, the first partition component and the second partition component are arranged at intervals along the width direction of the heat dissipation device, a bottom of the first partition component is connected with a bottom surface of the first flow channel and extends along the length direction of the heat dissipation device, one end of the first partition component is connected with the first side and the other end is arranged at intervals from the second side. A bottom of the second partition component is connected with the bottom surface of the first flow channel and extends along the length direction of the heat dissipation device, one end of the second partition component is connected with the second side and the other end is arranged at intervals from the first side. The first partition component and the third side form the first sub-flow channel, the first partition component and the second partition component form the second sub-flow channel, and the second partition component and the fourth side form the third sub-flow channel. The first sub-flow channel and the second sub-flow channel are communicated through the interval between the first partition component and the second side of the first cold plate, and the second sub-flow channel and the third sub-flow channel are communicated through the interval between the second partition component and the first side of the first cold plate.

[0050] In the above implementation form, the first flow channel is divided into three sub-flow channels connected in series by the two partition components, so that the cooling medium flows along the three sub-flow channels arranged in an S shape, the cooling medium flows uniformly, and the heat dissipation efficiency is improved.

[0051] Exemplarily, in combination with the inlet and outlet port design of the first heat dissipation device described above, the first liquid passing port is arranged at the first side of the first cold plate, and the first liquid passing port is communicated with the first sub-flow channel. Optionally, the second liquid passing port and the second communication port are arranged at a position close to the first side of the first cold plate.

[0052] Exemplarily, in combination with the inlet and outlet port design of the second heat dissipation device described above, the third liquid passing port is arranged at the first side of the first cold plate, and the third liquid passing port is communicated with the first sub-flow channel.

[0053] Exemplarily, in combination with the inlet and outlet port design of the third heat dissipation device described above, the first liquid inlet port is arranged at the first side of the first cold plate, and the first liquid inlet port is communicated with the first sub-flow channel. The first liquid outlet port is arranged at the second side of the first cold plate, and the first liquid outlet port is communicated with the third sub-flow channel.

[0054] In a further possible implementation form of the first aspect, the first cold plate further comprises a plurality of first heat dissipation fins protruding into the first flow channel, and the plurality of first heat dissipation fins are connected to the bottom surface of the first flow channel. By designing the heat dissipation fins, the contact area between the cooling medium and the substrate can be increased, and the heat dissipation efficiency can be improved. Optionally, the plurality of first heat dissipation fins can be integrally formed with the first substrate by die casting, or can be integrally formed with the first substrate by brazing, friction welding or other connection methods.

[0055] In a further possible implementation form of the first aspect, the plurality of first heat dissipation fins extend in a direction perpendicular to the bottom surface of the first flow channel. The heat dissipation fins are easy to manufacture or weld, and the production efficiency is relatively high.

[0056] In a further possible implementation form of the first aspect, at least one of the plurality of first heat dissipation fins is inclined to the bottom surface of the first flow channel in a direction of flow of the cooling medium. The inclined first heat dissipation fins can reduce the resistance during cooling flow, increase the flow rate, and thus improve the heat dissipation efficiency. In addition, the inclined heat dissipation fins are not easy to be eroded by water flow, and the service life of the heat dissipation device can be improved.

[0057] In a further possible implementation form of the first aspect, the second cold plate comprises a second substrate and a second cover plate, the second flow channel is recessed in a sixth surface of the second substrate, the sixth surface is a surface of the second substrate away from the circuit board, and the second cover plate is used for sealing the second flow channel. The related beneficial effects can be referred to the beneficial effects of the first cold plate described above.

[0058] In a further possible implementation form of the first aspect, the second flow channel comprises a plurality of sub-flow channels connected in sequence.

[0059] In a further possible implementation form of the first aspect, the second flow channel comprises a fourth sub-flow channel, a fifth sub-flow channel, a sixth sub-flow channel and a seventh sub-flow channel. The second cold plate has a fourth side and a sixth side opposite to each other in a length direction of the heat dissipation device, and a seventh side and an eighth side opposite to each other in a width direction of the heat dissipation device. The first flow channel is provided with a third partition component, a fourth partition component and a fifth partition component, the bottom of the third partition component, the bottom of the fourth partition component and the bottom of the fifth partition component are connected to the bottom surface of the second flow channel. The third partition component extends in the width direction of the heat dissipation device, one end of the third partition component is connected to the eighth side, and the other end of the third partition component is connected to the fourth partition component and is spaced apart from the seventh side. The fourth partition component extends in the length direction of the heat dissipation device, one end of the fourth partition component is connected to the third partition component and is spaced apart from the sixth side, and the other end of the fourth partition component is spaced apart from the fourth side. The fifth partition component is arranged between the fourth partition component and the eighth side, the fourth partition component and the fifth partition component are arranged in the width direction of the heat dissipation device, the fifth partition component extends in the length direction of the heat dissipation device, one end of the fifth partition component is connected to the fourth side of the second substrate, and the other end of the fifth partition component is spaced apart from the third partition component.

[0060] The third partition member and the second side form a fourth sub-flow channel, the fourth partition member and the third side form a fifth sub-flow channel, the fourth partition member and the fifth partition member form a sixth sub-flow channel, and the fifth partition member and the fourth side form a seventh sub-flow channel. The fourth sub-flow channel and the fifth sub-flow channel are connected through a first interval and a second interval, the first interval being an interval between the third partition member and the third side, and the second interval being an interval between the fourth partition member and the second side. The fifth sub-flow channel and the sixth sub-flow channel are connected through an interval between the fourth partition member and the first side, and the sixth sub-flow channel and the seventh sub-flow channel are connected through an interval between the fifth partition member and the third partition member.

[0061] In the above embodiment, the three partition members divide the second flow channel into four sub-flow channels connected in series, so that the cooling medium flows along the four sub-flow channels connected in series, so that the cooling medium flows uniformly, and the heat dissipation efficiency can be improved.

[0062] In a further possible implementation form of the first aspect, the second cold plate further comprises a plurality of second heat dissipation fins protruding into the second flow channel, and the plurality of second heat dissipation fins are connected to the bottom surface of the second flow channel.

[0063] In a further possible implementation form of the first aspect, the plurality of second heat dissipation fins extend in a direction perpendicular to the bottom surface of the second flow channel.

[0064] In a further possible implementation form of the first aspect, at least one of the plurality of second heat dissipation fins is inclined to the bottom surface of the second flow channel at an angle in a direction of flow of the cooling medium.

[0065] In a further possible implementation form of the first aspect, the first cold plate and the second cold plate have a receiving space therebetween, which can be a full-enclosing space, a half-enclosing space, or an approximately full-enclosing space with a through hole. The receiving space is used to accommodate the circuit board. In some schemes, the first cold plate and the second cold plate simultaneously serve as a shell of the computing device, and the circuit board is sealed (or half-sealed) in a box formed by the first cold plate and the second cold plate as the shell.

[0066] In a further possible implementation form of the first aspect, the first cold plate is further provided with at least one first connecting part for fixed connection between the first cold plate and other structural members. For example, the circuit board can be provided with a second connecting part, and the first connecting part and the second connecting part can be fitted together to realize fixed connection between the first cold plate and the circuit board.

[0067] Similarly, the second cold plate can also have a similar mounting design. For example, the second cold plate is further provided with at least one third connecting part, and the circuit board is provided with a fourth connecting part, and the third connecting part and the fourth connecting part are used to realize fixed connection between the second cold plate and the circuit board.

[0068] In a further possible implementation form of the first aspect, the first cold plate is further provided with at least one fifth connecting part, and the second cold plate is provided with a sixth connecting part, the fifth connecting part and the sixth connecting part being used for cooperative assembly to realize fixed connection between the first cold plate and the second cold plate.

[0069] In a further possible implementation form of the first aspect, the first cold plate is further provided with a first positioning part, and the second cold plate is further provided with a second positioning part, the first positioning part being used for cooperation with the second positioning part to facilitate cooperative assembly between the first cold plate and the second cold plate.

[0070] In a second aspect, the embodiments of the present application provide a heat dissipation device, which comprises a first cold plate and a second cold plate. The first cold plate and the second cold plate are stacked along the thickness direction of the heat dissipation device. The first cold plate is in heat conduction connection with at least one first heat generating device arranged on the first surface of the circuit board, and the second cold plate is in heat conduction connection with at least one second heat generating device arranged on the second surface of the circuit board, the first surface and the second surface being two surfaces of the circuit board arranged opposite to each other along the thickness direction of the heat dissipation device.

[0071] Further, the first cold plate and the second cold plate can be cold plates using liquid cooling for heat dissipation, at this time, the first cold plate is provided with a first flow channel, and the second cold plate is provided with a second flow channel, the first flow channel and the second flow channel being used for cooling medium flow. Of course, the first cold plate and the second cold plate can also be cold plates using other heat dissipation modes, for example, air cooling.

[0072] Possible implementation forms of the heat dissipation device can refer to the description of the first aspect or any possible implementation form of the first aspect.

[0073] In a third aspect, the present application provides a terminal, which comprises the computing device described in the first aspect or any possible implementation form of the first aspect, or comprises the heat dissipation device described in the second aspect or any possible implementation form of the second aspect.

[0074] The terminal can comprise a vehicle, a drone, a robot, an industrial mechanical arm, or other intelligent devices.

[0075] The beneficial effects of the technical solutions of the second aspect and the third aspect of the present application can refer to the beneficial effects of the technical solutions of the first aspect. BRIEF DESCRIPTION OF DRAWINGS

[0076] The drawings needed in the following embodiment description will be briefly introduced.

[0077] FIG. 1 is a schematic diagram of the overall structure of a heat dissipation device provided by the embodiments of the present application;

[0078] FIG. 2 is a schematic diagram of the disassembly of a heat dissipation device provided by the embodiments of the present application;

[0079] FIG. 3 and FIG. 4 are exploded schematic diagrams of an electronic device according to an embodiment of the present application;

[0080] FIG. 5 and FIG. 6 are exploded schematic diagrams of a first cold plate according to an embodiment of the present application;

[0081] FIG. 7 and FIG. 8 are exploded schematic diagrams of a second cold plate according to an embodiment of the present application;

[0082] FIG. 9 is a schematic diagram of a circulation path of a cooling system;

[0083] FIG. 10 is a schematic diagram of a cooling medium flow path of a heat dissipation device according to an embodiment of the present application;

[0084] FIG. 11 is a schematic diagram of a circulation path of another cooling system;

[0085] FIG. 12 is a schematic diagram of a cooling medium flow path of another heat dissipation device according to an embodiment of the present application;

[0086] FIG. 13 is a schematic diagram of a cooling medium flow path of another heat dissipation device according to an embodiment of the present application;

[0087] FIG. 14 is a schematic diagram of a heat dissipation scenario according to an embodiment of the present application;

[0088] FIG. 15 is a schematic diagram of another heat dissipation scenario according to an embodiment of the present application;

[0089] FIG. 16 is a schematic diagram of a position relationship between a projection of a heat dissipation boss and a projection of a heat generating device according to an embodiment of the present application;

[0090] FIG. 17 is a schematic diagram of a position relationship between a projection of another heat dissipation boss and a projection of a heat generating device according to an embodiment of the present application;

[0091] FIG. 18 is a schematic diagram of a position relationship between a projection of a flow channel and a projection of a heat generating device according to an embodiment of the present application;

[0092] FIG. 19 is a schematic diagram of an overall structure of an electronic device according to an embodiment of the present application;

[0093] FIG. 20 is an exploded schematic diagram of another heat dissipation device according to an embodiment of the present application;

[0094] FIG. 21 is a schematic diagram of a vehicle according to an embodiment of the present application.

[0095] 10 - heat dissipation device, 11 - first cold plate, 12 - second cold plate, 20 - circuit board, 21 - first surface, 21 (such as 21a and 21b) - first heat generating device, 22 - second surface, 22x (such as 22a and 22b) - second heat generating device, 23 - second connecting part, 30 - computing device, 41 - first base plate, 411 - first side, 412 - second side, 413 - third side, 414 - fourth side, 415 - first partition component, 416 - second partition component, 417 - first connector assembly opening, 418 - first connecting part, 419 - fifth connecting part, 42 - first cover plate, 43 - first liquid passage, 44 - second liquid passage, 45 - first flow channel, 451 - first sub-flow channel, 452 - second sub-flow channel, 453 - third sub-flow channel, 454 - first communication opening, 455 - second communication opening, 456 - first heat dissipation fin, 457 - first side hole, 46 - third surface, 461x (such as 461a and 461b) - first heat dissipation boss, 47 - first positioning part, 51 - second base plate, 511 - fifth side, 512 - sixth side, 513 - seventh side, 514 - eighth side, 515 - third partition component, 516 - fourth partition component, 517 - fifth partition component, 52 - second cover plate, 53 - first pipe joint, 54 - second pipe joint, 55 - fourth surface, 551x (such as 551a and 551b) - second heat dissipation boss, 56 - second positioning part, 57 - second flow channel, 571 - fourth sub-flow channel, 572 - fifth sub-flow channel, 573 - sixth sub-flow channel, 574 - seventh sub-flow channel, 575 - third communication opening, 576 - second side hole, 577 - second heat dissipation fin, 578 - third side hole, 579 - fourth communication opening, 481 - third liquid passage, 482 - fifth communication opening, 581 - fourth liquid passage, 582 - sixth communication opening, 483 - first liquid inlet, 484 - first liquid outlet, 583 - second liquid inlet, 584 - second liquid outlet, 60 - connecting port support frame. DETAILED DESCRIPTION

[0096] With the development of computer, artificial intelligence and other technologies, the functions of devices are becoming more and more intelligent and diversified. The intelligent and diversified functions rely on high-performance computing devices to realize, which makes the high-power devices, such as chips, arranged on the circuit board of the computing device more and more. High-power devices generate a large amount of heat when working, which needs to be dissipated in time. Especially in the case where multiple high-power devices are concentrated on the circuit, the heat per unit area of the circuit board is high, and the current heat dissipation scheme cannot meet the heat dissipation demand of the circuit board with high-power device concentration.

[0097] In some solutions, in order to reduce the heat dissipation pressure, high-power devices are arranged sparsely, which undoubtedly increases the layout area of the circuit board, and limits the installation position of the circuit board. In other solutions, the circuit board is divided into multiple pieces, and the high-power devices are placed on the multiple circuit boards, and the multiple circuit boards are stacked to reduce the layout area in the longitudinal and transverse planes. This way increases the height of the devices, significantly increases the volume of the computing device, and the stacked circuit boards need to be connected by electrical connectors, which causes high-speed signal attenuation and affects the processing efficiency of the computing device.

[0098] Therefore, the present application provides a heat dissipation device, a computing device and a vehicle, which can improve the heat dissipation efficiency and solve the heat dissipation problem of the circuit board with high-power devices concentrated. The present application can also reduce the layout area of the circuit board, which is beneficial to the miniaturization and integration design of the computing device.

[0099] The heat dissipation device provided by the present application will be described below in combination with FIG. 1 and FIG. 2.

[0100] Referring to FIG. 1 and FIG. 2, the heat dissipation device 10 includes a first cold plate 11 and a second cold plate 12, which are stacked along the thickness direction (z direction shown in FIG. 1 and FIG. 2) of the heat dissipation device 10. There is a receiving space between the first cold plate 11 and the second cold plate 12 along the thickness direction of the heat dissipation device 10, and a component to be cooled, such as a circuit board, can be arranged in the receiving space. The receiving space between the first cold plate and the second cold plate can be a fully enclosed space, a semi-enclosed space, or an approximately fully enclosed space with a through hole. The receiving space is used to accommodate the component to be cooled. In some solutions, the first cold plate 11 and the second cold plate 12 simultaneously serve as the shell of the computing device, and the component to be cooled is accommodated in the box formed by the shell.

[0101] Referring to FIG. 3 and FIG. 4, when the circuit board 20 is arranged between the first cold plate 11 and the second cold plate 12, the circuit board 20 is clamped between the first cold plate 11 and the second cold plate 12. The circuit board 20 includes a first surface 21 and a second surface 22 arranged opposite to each other along the thickness direction of the heat dissipation device 10, and the first cold plate 11 and the second cold plate 12 are used to dissipate heat for the heat generating devices arranged on the first surface 21 and the second surface 22 respectively. Therefore, the heat dissipation device 10 provided by the present application can realize double-sided heat dissipation of the circuit board 20, which can greatly improve the heat dissipation efficiency of the circuit board 20 and solve the heat dissipation problem of the circuit board 20 with high-power devices concentrated.

[0102] Exemplarily, the first surface 21 can be provided with one or more heat generating devices, and the heat generating devices provided on the first surface 21 are referred to as first heat generating devices for convenience. Exemplarily, in combination with FIG. 3, the at least one first heat generating device includes a first heat generating device 21a and a first heat generating device 21b, etc. The first cold plate 11 is in thermal conductive connection with the at least one first heat generating device, so as to dissipate heat on the side of the first surface 21 of the circuit board 20. Similarly, in combination with FIG. 4, the second surface 22 can be provided with one or more heat generating devices, and the heat generating devices provided on the second surface are referred to as second heat generating devices for convenience. Exemplarily, in combination with FIG. 3, the at least one second heat generating device includes a second heat generating device 22a and a second heat generating device 22b, etc. The second cold plate 12 is in thermal conductive connection with the at least one second heat generating device, so as to dissipate heat on the side of the second surface 22 of the circuit board 20.

[0103] In some possible embodiments, the heat dissipation device 10 can dissipate heat through one or more of liquid cooling, air cooling, etc.

[0104] As a possible implementation, the first cold plate 11 and the second cold plate 12 both adopt liquid cooling to dissipate heat, and at this time, the cold plate can also be referred to as a water cooling plate, a cooling plate, etc. Exemplarily, flow channels are provided in the first cold plate 11 and the second cold plate 12, and the flow channels are used for cooling medium to flow, so as to take away heat and reduce the temperature of the heat generating devices on the circuit board. As shown in FIG. 5, the first cold plate 11 is provided with a first flow channel 45, and the first flow channel 45 can be used for cooling medium to flow. Similarly, in combination with FIG. 8, the second cold plate 12 is provided with a second flow channel 57, and the second flow channel 57 is used for cooling medium to flow (the detailed design of the flow channel will be introduced below).

[0105] In the above introduction, the first cold plate 11 and the second cold plate 12 both adopt liquid cooling to dissipate heat, and the present application is also applicable to the case that the first cold plate 11 and / or the second cold plate 12 adopts other heat dissipation modes. As a possible implementation, the first cold plate 11 can adopt liquid cooling to dissipate heat, and the second cold plate 12 adopts other heat dissipation modes. For example, the first cold plate 11 is provided with a flow channel, and the flow channel can be used for cooling medium to flow, and the first cold plate 11 can include a fan and adopt air cooling to dissipate heat. As another possible implementation, the first cold plate 11 and the second cold plate 12 can both adopt air cooling to dissipate heat. As another possible implementation, the first cold plate 11 adopts liquid cooling to dissipate heat, and the second cold plate 12 adopts a heat conductive material to conduct heat to the first cold plate 11 to dissipate heat. In summary, the present application is applicable to various active heat dissipation modes.

[0106] In some scenarios, in order to target heat dissipation for the heat generating devices on the circuit board 20, the first cold plate 11 and / or the second cold plate 12 can be provided with heat dissipation bosses. The protruding heat dissipation bosses are easy to fit with the heat generating devices on the circuit board, thereby improving the heat dissipation efficiency of the heat generating devices. The following continues to introduce some possible embodiments of the present application:

[0107] In some possible embodiments, in combination with FIG. 6, the first cold plate 11 includes a third surface 46, and at least one heat dissipation boss (referred to as a first heat dissipation boss for ease of distinction) is protrudingly arranged on the third surface 46, such as the first heat dissipation boss 461a and the first heat dissipation boss 461b. In combination with FIG. 3, the at least one first heat dissipation boss can be fitted with at least one heat generating device of the first surface 21 of the circuit board 20. For example, the first heat dissipation boss 461a is fitted with the first heat generating device 21a, and the first heat dissipation boss 461b is fitted with the first heat generating device 21b.

[0108] Similarly, in combination with FIG. 7, the second cold plate 12 can include a fourth surface 55, and at least one heat dissipation boss (referred to as a second heat dissipation boss for ease of distinction) is protrudingly arranged on the fourth surface 55, such as the second heat dissipation boss 551a and the second heat dissipation boss 551b. In combination with FIG. 4, the at least one heat dissipation boss can be fitted with at least one second heat generating device on the second surface 22 of the circuit board 20. For example, the second heat dissipation boss 551a is fitted with the second heat generating device 22a, and the second heat dissipation boss 551b is fitted with the second heat generating device 22b.

[0109] In some possible embodiments, in combination with FIG. 5 and FIG. 6, in the case where the first cold plate 11 includes the first flow channel 45 and the third surface 46, the third surface 46 and the first flow channel 45 are arranged on opposite sides of the first cold plate 11. That is, the first flow channel 45 does not directly contact the heat generating devices on the first surface 21 of the circuit board 20, but is arranged on the side of the third surface 46 away from the circuit board 20. The heat generated by the heat generating devices of the first surface 21 of the circuit board 20 can be transmitted to the third surface 46 of the first cold plate 11 through the heat dissipation boss, and continuously transmitted in the first cold plate 11. Heat exchange occurs at the contact surface between the first flow channel 45 and the cooling medium, and heat is taken away with the flow of the cooling medium in the first flow channel 45.

[0110] Similarly, in combination with FIG. 7 and FIG. 8, in the case that the second cold plate 12 comprises the second flow channel 57 and the fourth surface 55, the fourth surface 55 and the second flow channel 57 are arranged on opposite sides of the second cold plate 12. That is, the second flow channel 57 is not in direct contact with the heat generating devices on the second surface 22 of the circuit board 20. The heat generated by the heat generating devices on the second surface 22 of the circuit board 20 can be transferred to the fourth surface 55 of the second cold plate 12 through the heat dissipation boss, and continuously transferred in the second cold plate 12. Heat exchange occurs at the contact surface between the second flow channel 57 and the cooling medium, and heat is carried away with the flow of the cooling medium in the second flow channel 57.

[0111] As mentioned before, the first cold plate 11 and the second cold plate 12 can adopt liquid cooling heat dissipation, at this time, in addition to the flow channel, the cooling device 10 also needs to design a channel for the cooling medium to flow in and out. Some possible liquid inlet and outlet schemes are introduced as follows:

[0112] Scheme 1, the flow channels in the first cold plate 11 and the second cold plate 12 are connected, for example, through connecting pipes, at this time, the cooling medium can flow between the first cold plate 11 and the second cold plate 12. Alternatively, the water inlet and outlet can be arranged on the same cold plate, or arranged on different cold plates respectively. Two possible designs of the position of the water inlet and outlet are introduced as follows:

[0113] Design 1, please refer to FIG. 5 and FIG. 6, the first cold plate 11 is provided with a first liquid passage 43, a second liquid passage 44, a first communication port 454 and a second communication port 455. Please refer to FIG. 7 and FIG. 8, the second cold plate 12 is provided with a third communication port 575 and a fourth communication port 579. The first flow channel 45 and the second flow channel 57 are connected through the first communication port 454 and the third communication port 575, and the second flow channel 57 and the second liquid passage 44 are connected through the second communication port 455 and the fourth communication port 579. The first liquid passage 43, the first flow channel 45, the first communication port 454, the third communication port 575, the second flow channel 57, the second communication port 455, the fourth communication port 579 and the second liquid passage 44 are sequentially connected.

[0114] Exemplarily, the cooling medium can enter from the first liquid passage 43, flow through the first flow channel 45, the first communication port 454, the third communication port 575, the second flow channel 57, the second communication port 455 and the fourth communication port 579, and flow out from the second liquid passage 44. Alternatively, the cooling medium can enter from the second liquid passage 44, flow through the fourth communication port 579, the second communication port 455, the second flow channel 57, the third communication port 575, the first communication port 454 and the first flow channel 45, and flow out from the first liquid passage 43.

[0115] Optionally, the third communication port 575 is a connection port of the first pipe joint 53 arranged on the second cold plate 12. In this case, the first communication port 454 on the first cold plate 11 is an interface of the first through hole, which is matched with the first pipe joint 53 to realize the conduction between the first flow channel 45 and the second flow channel 57. Alternatively, the first pipe joint 53 can also be arranged on the first cold plate, and the first through hole is correspondingly arranged on the second cold plate.

[0116] Similarly, the fourth communication port 579 is a connection port of the second pipe joint 54 arranged on the second cold plate 12. The first cold plate 11 is also provided with a second through hole, which is matched with the second pipe joint 54 to realize the conduction between the second flow channel 57 and the second through port 44. Alternatively, the second pipe joint 54 is arranged on the first cold plate 11, and the second through hole is correspondingly arranged on the second cold plate 12.

[0117] Optionally, the first communication port 454 and the third communication port 575 are arranged on the same side of the heat dissipation device 10. Optionally, the second communication port 455 and the fourth communication port 579 can be arranged on the same side of the heat dissipation device.

[0118] Optionally, the first through port 43 and the second through port 44 are arranged on the same side of the heat dissipation device 10. In some schemes, the cooling medium needs to be processed by the cooling system. The first through port and the second through port are arranged on the same side, and the inlet pipe and the outlet pipe of the cooling system can be correspondingly arranged on the same side of the heat dissipation device. Please refer to FIG. 9, which is a circulating path schematic diagram of a cooling system. The cooling system includes a cooling loop and a refrigeration loop. The cooling loop includes a cooler and a cold plate (such as the two cold plates in this application), and optionally includes one or more of an electronic water pump, an electronic expansion valve (or an electromagnetic valve and a thermal expansion valve), and an electronic water valve. Among them: the cooling plate and the cooler are heat exchange components, which are respectively used for heat exchange between the heat generating component and the cooling loop, and the cooling loop and the refrigeration loop. The electronic water pump is a driving component that provides power source for cooling liquid circulation. The electronic expansion valve can actively adjust the loop flow according to the pressure and temperature of the loop, and is a control component. As can be seen from FIG. 9, arranging the water inlet and the water outlet on the same side of the cold plate can make the pipeline design between the heat dissipation device and the cooling system more simple. Optionally, the cooling system can simultaneously cool the power battery pack. In this case, the heat dissipation device can be connected in series or parallel with the battery cooling plate, and the cooling system can be used to cool the circuit board and the power battery pack at the same time.

[0119] Alternatively, the first liquid passage 43 and the second liquid passage 44 are disposed on opposite sides of the heat dissipation device 10. Referring to FIG. 10, the first liquid passage 43 and the second liquid passage 44 are both disposed on the first cold plate 11 and on opposite sides of the first cold plate 11. Taking the first liquid passage 43 as the liquid outlet and the second liquid passage 44 as the liquid inlet as an example, the cooling medium flows into the first liquid passage 43 on one side of the first cold plate, passes through the first flow channel, the first communication port 454, the third communication port 575, the second flow channel, the fourth communication port 579, and the second communication port (not directly shown), and flows out of the second liquid passage 44. In the design shown in FIG. 10, the liquid inlet and the liquid outlet are disposed on opposite sides, and this design can be adapted to a cooling system in which the liquid inlet pipe and the liquid outlet pipe are disposed on opposite sides of the cooling device, as shown in FIG. 11. In addition, in this design, the flow channels in the first cold plate 11 and the second cold plate 12 can both be designed as S-shaped, as shown in FIG. 10.

[0120] The above describes a design in which the liquid inlet and the liquid outlet are both disposed on the same cold plate. The following describes another design of the positions of the liquid inlet and the liquid outlet.

[0121] Design 2. Referring to FIG. 12, the first cold plate 11 is provided with a third liquid passage 481 and a fifth communication port 482, and the second cold plate 12 is provided with a fourth liquid passage 581 and a sixth communication port 582. The first flow channel and the second flow channel are communicated through the fifth communication port 482 and the sixth communication port 582, and the third liquid passage 481, the first flow channel, the fifth communication port 482, the sixth communication port 582, the second flow channel, and the fourth liquid passage 581 are sequentially communicated. Since the first flow channel and the second flow channel are communicated, the cooling medium can flow between the first cold plate and the second cold plate through the fifth communication port 482 and the sixth communication port 582. In this case, the cooling system only needs to design one set of cooling medium output and output pipe to meet the requirements, which can reduce the design complexity of the cooling system cooperating with the heat dissipation device. In addition, the liquid inlet and the liquid outlet are separately disposed, which can reduce one set of communication ports, reduce the interfaces in the pipe, reduce the risk of liquid leakage, and is conducive to the lightweight design of the computing device. Illustratively, the cooling medium can enter from the third liquid passage 481, flow through the first flow channel, the fifth communication port 482, the sixth communication port 582, and the second flow channel, and flow out of the fourth liquid passage 581. Alternatively, the cooling medium can enter from the fourth liquid passage 581, flow through the second flow channel, the sixth communication port 582, the fifth communication port 482, and the first flow channel, and flow out of the third liquid passage 481.

[0122] Optionally, the fifth communication port 482 and the sixth communication port 582 are disposed on the same side of the heat dissipation device.

[0123] Optionally, the third liquid passing port 481 and the fourth liquid passing port 581 are arranged on the same side of the heat dissipation device. In this case, the liquid inlet pipe and the liquid outlet pipe can be arranged on the same side of the heat dissipation device (as shown in FIG. 9), which can reduce the design complexity of the cooling system matched with the heat dissipation device. Alternatively, the third liquid passing port and the fourth liquid passing port are arranged on the opposite sides of the heat dissipation device. Arranging the liquid inlet port and the liquid outlet port on the opposite sides can adapt to the cooling system in which the liquid inlet pipe and the liquid outlet pipe are arranged on the opposite sides of the cooling device, such as the cooling system shown in FIG. 11.

[0124] In scheme 2, the flow channels in the first cold plate and the second cold plate are independent. In this case, the first cold plate and the second cold plate each have a pair of liquid inlet and outlet ports. Further, the cooling medium used by the first cold plate 11 and the second cold plate 12 can be the same or different.

[0125] Referring to FIG. 13, the first cold plate 11 is provided with a first liquid inlet port 483 and a first liquid outlet port 484, both of which are in communication with the first flow channel. The first liquid inlet port 483 is used for the flow of the cooling medium, and the first liquid outlet port 484 is used for the outflow of the cooling medium. The second cold plate 12 is provided with a second liquid inlet port 583 and a second liquid outlet port 584, both of which are in communication with the second flow channel. The second liquid inlet port 583 is used for the flow of the cooling medium, and the second liquid outlet port 584 is used for the outflow of the cooling medium. In the above design, the first cold plate 11 and the second cold plate 12 use independent flow channels, so that the heat dissipation capacity of the first cold plate and the heat dissipation capacity of the second cold plate are equal, and both surfaces of the electric heating plate can achieve good heat dissipation effect, thereby improving the heat dissipation efficiency.

[0126] Optionally, the first liquid inlet port 483 and the second liquid inlet port 583 are arranged on the same side of the heat dissipation device, and the first liquid outlet port 484 and the second liquid outlet port 584 are arranged on the same side of the heat dissipation device. In this way, the design complexity of the cooling system matched with the heat dissipation device can be reduced.

[0127] The above describes the design of the liquid inlet and outlet ports of the cold plate. The possible structures of the first cold plate and the second cold plate will be introduced below. First, the structure of the first cold plate will be introduced.

[0128] Referring to FIGS. 5 and 6, the first cold plate 11 includes a first base plate 41 and a first cover plate 42. The first flow channel 45 is recessed in a fifth surface of the first base plate 41, which is a surface of the first base plate away from the circuit board 20 (or the second cold plate 12). The first cover plate 42 is used to seal the first flow channel 45. Optionally, the first base plate 41 and the first cover plate 42 can be integrated by welding, sealing glue adhesion, sealing ring connection or other connection methods. Since the first cold plate needs to be provided with a flow channel for the flow of the cooling medium, the first cold plate is divided into two structural members, and the flow channel is formed by connecting the structural members, which can reduce the manufacturing difficulty of the cold plate, reduce the cost and improve the production efficiency.

[0129] In some possible embodiments, the first flow channel 45 is an "S" shaped flow channel, and the cooling liquid flows in the "S" shaped flow channel in a meandering manner, so that the cooling liquid can cover most of the area of the circuit board. The "S" shaped flow channel design can avoid water flow blocking, static or vortex at a certain place, and can improve the heat dissipation efficiency. It should be understood that the S-shaped design can cover the S-shaped design (such as the "yi" character-shaped design), and the overall design is S-shaped.

[0130] In yet some possible embodiments, the first flow channel 45 includes a plurality of sub-flow channels connected in sequence. The plurality of sub-flow channels are connected in sequence, so that the cooling medium can flow in a certain fixed path in sequence, and the flow rate of the cooling medium at each place in the first cold plate can be more uniform. As a possible design, the plurality of sub-flow channels connected in sequence can be arranged in an "S" shape to cover most of the area of the circuit board.

[0131] Exemplarily, referring to FIG. 5, two partition components can be arranged on the first substrate 41, and the two partition components in combination with the two side walls can divide the first flow channel into three sub-flow channels connected in series, so that the cooling medium flows along the three sub-flow channels arranged in an S shape, so that the cooling medium flows uniformly, and the heat dissipation efficiency can be improved. Specifically, referring to FIG. 5, the first flow channel 45 includes a first sub-flow channel 451, a second sub-flow channel 452, and a third sub-flow channel 453. The first substrate 41 has a first side 411 and a second side 412 opposite to each other in a length direction (such as the x direction) of the heat dissipation device 10, and a third side 413 and a fourth side 414 opposite to each other in a width direction (such as the y direction) of the heat dissipation device 10. Here, the length direction and the width direction are only used to represent two different directions, and can be replaced by a first direction or a second direction, and the first direction can be perpendicular to the second direction. The first flow channel 45 is provided with a first partition component 415 and a second partition component 416, and the first partition component 415 and the second partition component 416 are arranged in the width direction of the heat dissipation device 10. The bottom of the first partition component 415 is connected to the bottom surface of the first flow channel 45 and extends in the length direction of the heat dissipation device 10. One end of the first partition component 415 is connected to the first side 411, and the other end is arranged in a spaced manner with the second side 412. The bottom of the second partition component 416 is connected to the bottom surface of the first flow channel 45 and extends in the length direction of the heat dissipation device 10. One end of the second partition component 416 is connected to the second side 412, and the other end is arranged in a spaced manner with the first side 411. The first partition component 415 and the third side 413 form the first sub-flow channel 451, the first partition component 415 and the second partition component 416 form the second sub-flow channel 452, and the second partition component 416 and the fourth side 414 form the third sub-flow channel 453. The first sub-flow channel 451 and the second sub-flow channel 452 are communicated through the space between the first partition component 415 and the second side 412 of the first cold plate 11, and the second sub-flow channel 452 and the third sub-flow channel 453 are communicated through the space between the second partition component 416 and the first side 411 of the first cold plate 11.

[0132] Exemplarily, in combination with the first inlet and outlet port design described above, in combination with FIG. 5 and FIG. 6, the first liquid passage 43 is arranged on the first side 411 of the first cold plate, and the first liquid passage 43 is communicated with the first sub-flow channel 451. Alternatively, the second liquid passage 44 and the second communication port 455 are arranged close to the first side 411.

[0133] Exemplarily, in combination with the second inlet and outlet port design described above, in combination with FIG. 12, the third liquid passage 481 is arranged on the first side of the first cold plate 11 and communicated with the first sub-flow channel.

[0134] For example, in combination with the third design of the inlet and outlet port, referring to FIG. 13, the first inlet port 483 is arranged on the first side of the first cold plate 11, and the first inlet port 483 is in communication with the first sub-flow channel. The first outlet port 484 is arranged on the second side of the first cold plate 11, and the first outlet port 484 is in communication with the third sub-flow channel 453.

[0135] Optionally, the second side 412 of the first cold plate 11 is provided with a first side hole 457 on the surface of the first flow channel 45, which is used to realize the communication between the first communication port 454 and the first flow channel 45 (or the third sub-flow channel 453).

[0136] It should be understood that the flow channel design in the first cold plate described above is only an example, and more (or less) partition components can be arranged along the width direction of the heat dissipation device to form more (or less) sub-flow channels in the specific implementation.

[0137] In some schemes, in order to improve the contact area between the cooling medium and the substrate, one or more heat dissipation teeth can be arranged in the flow channel. Referring to FIG. 5, the first cold plate 11 further includes a plurality of first heat dissipation teeth 456 (or heat dissipation columns) protruding in the first flow channel, and the plurality of first heat dissipation teeth 456 are connected with the bottom surface of the first flow channel. Optionally, the plurality of first heat dissipation teeth 456 can be directly integrated with the first substrate 41 by die casting, or can be integrated with the first substrate 41 by brazing, friction welding or other connection methods.

[0138] In the above, one end of the first heat dissipation tooth 456 is connected with the bottom surface of the flow channel, and the extension direction and shape of the first heat dissipation tooth 456 have multiple possible designs. Taking the extension direction as an example, as one possible design, the plurality of first heat dissipation teeth 456 extend in a direction perpendicular to the bottom surface of the first flow channel 45, and the vertically arranged heat dissipation teeth are convenient for manufacturing or welding, and have high production efficiency. As another possible design, at least one of the plurality of first heat dissipation teeth 456 is at an angle with the bottom surface of the first flow channel 45, and the extension direction is inclined along the direction of the flow of the cooling medium. The inclined first heat dissipation tooth can reduce the resistance during the flow of the cooling medium, improve the flow rate, and thus improve the heat dissipation efficiency. In addition, the inclined heat dissipation tooth is not easy to be eroded by the water flow, and can improve the service life of the heat dissipation device. Optionally, the shape of the first heat dissipation tooth 456 can be cylindrical, prismatic, lightning-shaped, etc., and here the cylindrical heat dissipation tooth is taken as an example for introduction. When the heat dissipation tooth is cylindrical, the surface of the heat dissipation tooth is uniformly pressed along the flow direction of the water flow, can resist erosion, avoid pollution of the cooling medium, and can improve the service life of the computing device.

[0139] The structure of the first cold plate is introduced above, and the possible structures of the second cold plate are introduced below. It should be understood that the detailed description of the design of the second cold plate can refer to the introduction of the first cold plate.

[0140] Referring to FIGS. 7 and 8, the second cold plate 12 includes a second base plate 51 and a second cover plate 52, a second flow channel 57 is recessed in a sixth surface of the second base plate 51, the sixth surface being a surface of the second base plate 51 facing away from the circuit board 20 (or the first cold plate 11), and the second cover plate 52 is used to seal the second flow channel 57. The relevant beneficial effects can be seen in the aforementioned beneficial effects of the first cold plate side.

[0141] In some possible embodiments, the second flow channel comprises a plurality of sub-flow channels connected in sequence. For example, three partition components can be arranged on the second substrate to divide the second flow channel into four sub-flow channels connected in sequence, so that the cooling medium flows along the four sub-flow channels connected in sequence to improve the heat dissipation efficiency. Specifically, referring to FIG. 8, the second flow channel 57 comprises a fourth sub-flow channel 571, a fifth sub-flow channel 572, a sixth sub-flow channel 573, and a seventh sub-flow channel 574. The second substrate 51 has a fifth side 511 and a sixth side 512 opposite to each other along the length direction (e.g., the x direction) of the heat dissipation device 10 (or the second cold plate 12, or the second substrate 51), and a seventh side 513 and an eighth side 514 opposite to each other along the width direction (e.g., the y direction) of the heat dissipation device 10. The second flow channel 57 is provided with a third partition component 515, a fourth partition component 516, and a fifth partition component 517, the bottom of the third partition component 515, the bottom of the fourth partition component 516, and the bottom of the fifth partition component 517 are connected with the bottom surface of the second flow channel 57. The third partition component 515 extends along the width direction of the heat dissipation device 10, one end of the third partition component 515 is connected with the eighth side 514, and the other end of the third partition component 515 is connected with the fourth partition component 516 and is spaced apart from the seventh side 513. The fourth partition component 516 extends along the length direction of the heat dissipation device 10, one end of the fourth partition component 516 is connected with the third partition component 515 and is spaced apart from the sixth side 512, and the other end of the fourth partition component 516 is spaced apart from the fifth side 511. The fifth partition component 517 is arranged between the fourth partition component 516 and the eighth side 514, the fourth partition component 516 and the fifth partition component 517 are arranged in the width direction of the heat dissipation device 10, the fifth partition component 517 extends along the length direction of the heat dissipation device 10, one end of the fifth partition component 517 is connected with the fifth side 511 of the second substrate 51, and the other end of the fifth partition component 517 is spaced apart from the third partition component 515. The fourth sub-flow channel 571 is formed between the third partition component 515 and the sixth side 512, the fifth sub-flow channel 572 is formed between the fourth partition component 516 and the seventh side 513, the sixth sub-flow channel 573 is formed between the fourth partition component 516 and the fifth partition component 517, and the seventh sub-flow channel 574 is formed between the fifth partition component 517 and the eighth side 514. The fourth sub-flow channel 574 and the fifth sub-flow channel 572 are connected through a first interval and a second interval, the first interval is the interval between the third partition component 515 and the seventh side 513, and the second interval is the interval between the fourth partition component 516 and the sixth side 512. The fifth sub-flow channel 572 and the sixth sub-flow channel 573 are connected through the interval between the fourth partition component 516 and the fifth side 511, and the sixth sub-flow channel 573 and the seventh sub-flow channel 574 are connected through the interval between the fifth partition component 517 and the third partition component 515.

[0142] Optionally, the sixth side 512 of the second cold plate 12 is provided with a second side hole 576 facing the surface of the second flow channel 57, which is used to realize the conduction between the third communication port 575 and the second flow channel 57 (or the fourth sub-flow channel 571). Optionally, the fifth side 511 of the second cold plate 12 is provided with a third side hole 578 facing the surface of the second flow channel 57, which is used to realize the conduction between the fourth communication port 579 and the second flow channel 57 (or the seventh sub-flow channel 574).

[0143] In some schemes, in order to improve the contact area of the cooling medium and the substrate, one or more heat dissipation fins can be arranged in the second flow channel 57. Please refer to FIG. 8, the second cold plate 12 further comprises a plurality of second heat dissipation fins 577 protruding in the second flow channel 57, and the plurality of second heat dissipation fins 577 are connected with the bottom surface of the second flow channel 57. Optionally, the plurality of second heat dissipation fins 577 can be directly integrated with the second substrate 51 by die casting, or can be integrated with the second substrate 51 by brazing, friction welding or other connection methods.

[0144] Similar to the first heat dissipation fin 456 described above, one end of the second heat dissipation fin 577 is connected with the bottom surface of the second flow channel 57, but the extension direction and shape of the second heat dissipation fin have multiple possible designs. Taking the extension direction as an example, as one possible design, the plurality of second heat dissipation fins 577 extend in a direction perpendicular to the bottom surface of the second flow channel 57, and the vertically arranged heat dissipation fins are convenient to manufacture or weld, and have higher production efficiency. As another possible design, at least one of the plurality of second heat dissipation fins 577 is at an angle with the bottom surface of the second flow channel 57, and the extension direction is inclined along the direction of the flow of the cooling medium. Optionally, the shape of the second heat dissipation fin 577 can be cylindrical, prismatic, lightning-shaped, etc., and here the cylindrical heat dissipation fin is taken as an example for introduction. When the second heat dissipation fin 577 is cylindrical, the surface of the heat dissipation fin is uniformly pressed along the flow direction of the water, which can resist erosion, avoid pollution of the cooling medium, and improve the service life of the computing device.

[0145] The first cold plate and the second cold plate are introduced respectively above, and the connection and assembly design between the first cold plate and the second cold plate are introduced below.

[0146] In some possible embodiments, in order to facilitate the output of the circuit board and / or the installation of the output line, the first cold plate 11 and / or the second cold plate 12 can be provided with a first connector assembly port, which is used to assemble a connector, or to facilitate the insertion of the connection end of the transmission line into the connection port on the circuit board. Please refer to FIG. 7, the first cold plate 11 can be provided with a first connector assembly port 417, which is in communication with the accommodation space formed between the first cold plate 11 and the second cold plate 12, and can facilitate the insertion of the connection end of the transmission line into the connection port on the circuit board 20.

[0147] In some possible implementation manners, the first cold plate 11 is further provided with at least one first connecting part 418, which is used to realize fixed connection between the first cold plate 11 and other structural members.

[0148] Similarly, the second cold plate 12 can also have similar mounting part design. For example, the second cold plate 12 is further provided with at least one third connecting part, which is used to realize fixed connection between the second cold plate 12 and other structural members.

[0149] In some possible implementation manners, the first cold plate 11 is further provided with at least one fifth connecting part 419, and the second cold plate 12 is provided with a sixth connecting part, the fifth connecting part 419 and the sixth connecting part are used to cooperate to realize fixed connection between the first cold plate 11 and the second cold plate 12. Please refer to FIG. 5, the first base plate 41 is provided with a first connecting hole (i.e. the fifth connecting part 419), please refer to FIG. 7, the second base plate 51 is provided with a second connecting hole 518, and the first cover plate is provided with a third connecting hole 521, by means of fastening screw passing through the third connecting hole 521, the second connecting hole 518 and the third connecting hole 521, fixed assembly between the first cold plate and the second cold plate can be realized.

[0150] In some possible implementation manners, the first cold plate 11 is further provided with a first positioning part 47, and the second cold plate is further provided with a second positioning part 56, the first positioning part 47 is used to cooperate with the second positioning part 56 to facilitate assembly between the first cold plate 11 and the second cold plate 12. Please refer to FIG. 6, the first cold plate 11 is provided with a positioning hole (which can be regarded as the first positioning part 47), and the second cold plate 12 is provided with a positioning pin (which can be regarded as the third positioning part 56), the positioning pin can be inserted into the positioning hole to facilitate assembly between the first cold plate 11 and the second cold plate 12.

[0151] The above describes the heat dissipation device, and the following describes a computing device provided by the embodiment of the application in combination with FIG. 3 and FIG. 4.

[0152] The application provides a computing device 30 comprising the aforementioned heat dissipation device 10 and the circuit board 20. As known from the above, the heat dissipation device 10 comprises the first cold plate 11 and the second cold plate 12, which are stacked along the thickness direction of the heat dissipation device 10. The circuit board 20 is arranged between the first cold plate 11 and the second cold plate 12, and the circuit board 20 comprises the first surface 21 and the second surface 22 arranged oppositely along the thickness direction of the heat dissipation device 10, the first surface 21 is provided with at least one first heat generating component, and the second surface 22 is provided with at least one second heat generating component. The first cold plate 11 of the heat dissipation device 10 is in thermal conductive connection with the at least one first heat generating component, and the second cold plate 12 is in thermal conductive connection with the at least one second heat generating component. In the computing device 30 provided by the application, the heat dissipation device 10 can realize double-sided heat dissipation of the circuit board 20, and the double-sided heat dissipation can greatly improve the heat dissipation efficiency of the circuit board 20, thereby solving the heat dissipation problem of the circuit board 20 with high-power components.

[0153] The heat dissipation device 10 can adopt one or more of the following heat dissipation modes, such as liquid cooling and air cooling. The liquid cooling is to reduce the temperature of the heat generating component by flowing liquid (i.e., cooling medium) to take away heat. The air cooling is to reduce the surface temperature of the component by flowing air to take away heat. For possible implementation modes of the heat dissipation device, reference can be made to the above, which will not be described herein.

[0154] The circuit board refers to a printed circuit board (PCB) on which electronic components are welded or assembled, and in some scenarios, it can also be referred to as a printed circuit board assembly (PCBA). Further, some structural components can also be assembled on the circuit board, and the circuit board is also referred to as a single board. In some scenarios, the basic (or main) circuit board in a device (or controller) can also be referred to as a main board, also known as a main circuit board, a system board or a mother board. In summary, the circuit board in the application can cover the concepts of PCBA, single board, main board, etc.

[0155] In order to facilitate understanding of the advantages of double-sided heat dissipation, two possible heat dissipation scenarios are described below.

[0156] In one possible example, the at least one first heat generating device comprises a chip, and the at least one second heat generating device comprises a chip. As shown in FIG. 14, the first surface 21 of the circuit board 20 is arranged with a first chip 21c and a second chip 21d, and the second surface 22 is arranged with a third chip 22c and a fourth chip 22d, i.e., the circuit board 20 is arranged in a double-sided manner, and the first surface 21 and the second surface 22 are both arranged with chips. As can be seen, when deploying the same number of high-power devices, the double-sided arrangement can significantly reduce the layout area of the circuit board 20. It should be understood that the positions and the number of the chips are only examples.

[0157] Further, the first cold plate 11 is arranged with a first heat dissipation boss 461c and a first heat dissipation boss 461d on the surface close to the circuit board 20, wherein the first heat dissipation boss 461c can be attached to the first chip 21c (including through a heat-conducting medium), and the first heat dissipation boss 461d is attached to the second chip 21d, thereby dissipating heat for the first chip 21c and the second chip 21d. Similarly, the second cold plate 12 is arranged with a second heat dissipation boss 551c and a second heat dissipation boss 551d on the surface close to the circuit board 20, wherein the second heat dissipation boss 551c is attached to the third chip 22c, and the second heat dissipation boss 551d is attached to the fourth chip 22d, thereby dissipating heat for the third chip 22c and the fourth chip 22d. In the case of double-sided arrangement, the upper and lower cold plates arranged in a stack solve the problem of heat dissipation of high-power devices on both sides of the circuit board.

[0158] In yet another possible example, the at least one first heat generating device comprises a chip, and the at least one second heat generating device comprises a heat-conducting component in heat-conducting connection with the chip. The heat-conducting component is, for example, a copper sheet, a metal boss, etc. As shown in FIG. 15, the first surface 21 of the circuit board 20 is arranged with a first chip 21e and a second chip 21f, and the second surface 22 is arranged with a first heat-conducting component 22e and a second heat-conducting component 22f. The first heat-conducting component 22e is in heat-conducting connection with the first chip 21e, and can conduct the heat generated by the first chip 21e to the other surface (i.e., the second surface 22) of the circuit board 20. Similarly, the second heat-conducting component 22f is in heat-conducting connection with the second chip 21f, and can conduct the heat generated by the second chip 21f to the second surface 22 of the circuit board 20. In this way, the high-power devices arranged on one surface of the circuit board can be dissipated on both the front and back surfaces, which can greatly improve the heat dissipation efficiency, and the high-power devices can be arranged more densely, thereby making the layout area of the circuit board smaller. Optionally, the heat-conducting component and the chip are at least partially overlapped in the orthographic projection on the first surface, which can improve the heat-conducting efficiency of the heat-conducting component and the heat dissipation efficiency.

[0159] Further, the first cold plate 11 is provided with a first heat dissipation boss 461e and a first heat dissipation boss 461f on the surface close to the circuit board 20, wherein the first heat dissipation boss 461e can be attached to the first chip 21e (including attachment through a heat conducting medium), and the first heat dissipation boss 461f is attached to the second chip 21f, thereby dissipating heat for the first chip 21e and the second chip 21f. Similarly, the second cold plate 12 is provided with a second heat dissipation boss 551e and a second heat dissipation boss 551f on the surface close to the circuit board 20, wherein the second heat dissipation boss 551e can be attached to the first heat conducting component 22e, and the second heat dissipation boss 551f is attached to the second heat conducting component 22f, thereby dissipating heat for the second heat dissipation boss 551e and the second heat dissipation boss 551f, indirectly dissipating heat for the first chip 21e and the second chip 21f, so as to greatly improve the heat dissipation efficiency of the high-power device.

[0160] It should be understood that the two examples described above can be combined. For example, the circuit board uses a double-sided board, but for some chips with extremely high power consumption, a heat conducting component can be used on the back to achieve double-sided heat dissipation.

[0161] Optionally, the chips arranged on the circuit board 20 can include system on chip (SoC) and other forms of chips, such as application-specific integrated circuit (ASIC), programmable logic device (PLD), central processing unit (CPU), microprocessor unit (MPU), microcontroller unit (MCU), neural network processing unit (NPU), etc.

[0162] The above introduces the heat dissipation scenarios that can be applied by the present application. The following introduces the association design between the first cold plate 11 and the first surface 21 of the circuit board 20.

[0163] In some possible implementations, the third surface 46 of the first cold plate 11 is provided with at least one first heat dissipation boss, and at least one first heat generating device is in heat conducting connection with the at least one first heat dissipation boss. In this way, the heat generating device can be dissipated in a targeted manner. Taking liquid cooling as an example, the heat generated by the first heat generating device is conducted into the cold plate through the heat dissipation boss, and through the circulation of the liquid cooling medium, the temperature of the first heat generating device can be reduced. For related content, please refer to the foregoing description.

[0164] In some possible implementation manners, the orthographic projection of the at least one first heat-dissipating boss on the third surface at least partially overlaps with the orthographic projection of the at least one first heat-generating device on the third surface. The at least partial overlap includes complete overlap, complete coverage, and partial overlap. For example, A and B completely overlap, which means that A and B have the same shape and area and are completely consistent in position. A and B completely cover, which means that A completely covers B or B completely covers A. A partially covers B, which means that A covers part of B, and another part of B is not covered. For example, referring to FIG. 16, the orthographic projection of the first heat-dissipating boss 461a on the third surface 46 completely covers the orthographic projection of the first heat-generating device 21a on the third surface 46, and the orthographic projection of the first heat-dissipating boss 461b on the third surface 46 completely covers the orthographic projection of the first heat-generating device 21b. For another example, referring to FIG. 17, the orthographic projection of the first heat-dissipating boss 461a on the third surface 46 partially covers the orthographic projection of the first heat-generating device 21a on the third surface 46, and the orthographic projection of the first heat-dissipating boss 461b on the third surface 46 partially covers the orthographic projection of the first heat-generating device 21b on the third surface 46. Of course, because there are multiple first heat-dissipating bosses, the coverage between different first heat-dissipating bosses and corresponding first heat-generating devices can be different. For example, some first heat-dissipating bosses and corresponding first heat-generating devices completely cover, and some other first heat-dissipating bosses and corresponding first heat-generating devices partially overlap.

[0165] In some possible implementation manners, a heat-conducting medium can be arranged between the at least one first heat-dissipating boss and the at least one first heat-generating device. The heat-conducting medium can include silicone grease or a heat-conducting pad (for example, a phase-change heat-conducting film), and the like. The heat-conducting medium can avoid direct contact between the boss and the high-power-consumption device, and reduce the risk of damage to the high-power-consumption device. In addition, the heat-conducting medium has low thermal resistance and can be implemented in an extremely thin thickness, and the heat-dissipating boss and the high-power-consumption chip can be attached through the heat-conducting medium, which can improve the heat conduction efficiency and reduce the temperature of the high-power-consumption device.

[0166] In some possible implementation manners, the first cold plate 11 is provided with a first flow channel 45. The first flow channel 45 forms a first projection on the third surface 46, and the at least one first heat-generating device forms a second projection on the third surface 46, and the first projection covers the second projection. Alternatively, the first projection partially covers the second projection. For example, referring to FIG. 18, among the projections of the first heat-generating devices arranged on the first surface 21, the projection of the first heat-generating device 21a is covered by the projection of the first flow channel 45. The projection of the first heat-generating device 21b is partially covered by the projection of the first flow channel 45.

[0167] The following continues to describe the association design between the second cold plate 12 and the heat-generating devices on the second surface 22 of the circuit board 20.

[0168] In some possible implementation manners, the fourth surface 55 of the second cold plate 12 is provided with at least one second heat dissipation boss, and at least one second heat generating component is in heat conduction connection with the at least one second heat dissipation boss. In this way, the heat dissipation can be performed on the heat generating component in a targeted manner. Further, the at least one second heat generating component and the at least one second heat dissipation boss are at least partially overlapped in the orthographic projection on the fourth surface 55. For details, refer to the related description of FIG. 16 and FIG. 17.

[0169] In some possible implementation manners, the second flow channel 57 forms a third projection on the fourth surface 55, and the at least one second heat generating component forms a fourth projection on the fourth surface 55, and the third projection covers the fourth projection or the third projection partially covers the fourth projection. For details, refer to the related description of FIG. 18.

[0170] In some possible implementation manners, the first cold plate 11 and the second cold plate 12 have a receiving space therebetween, which can be a full-enclosing space, a half-enclosing space or an approximately full-enclosing space with a through hole. The receiving space is used to accommodate the circuit board 20.

[0171] Please refer to FIG. 19, which is an assembly diagram of an electronic device provided in the embodiments of the present application. The first cold plate 11 and the second cold plate 12 simultaneously serve as the shell of the computing device 30, and the circuit board 20 is sealed in the box formed by the shell. Optionally, the computing device further includes a connection port support frame 60, which can be fixedly installed in the first cold plate 11 and / or the second cold plate 12 to facilitate the installation of the output of the circuit board and / or the output line.

[0172] In some possible implementation manners, in combination with FIG. 3, FIG. 4 and FIG. 20, the first cold plate 11 is provided with at least one first connecting part 418, and the circuit board 20 is provided with a second connecting part 23, and the first connecting part 418 and the second connecting part 23 can be assembled in cooperation to achieve the fixed connection of the first cold plate 11 and the circuit board 20. For example, the surface (i.e., the third surface 46) of the first cold plate 11 close to the circuit board 20 is provided with a stud (which can be regarded as the first connecting part 418), and the circuit board is provided with a through hole (which can be regarded as the second connecting part 23), and a screw (such as a fastening screw) is screwed into the stud through the through hole, so as to achieve the fixed connection of the first cold plate 11 and the circuit board 20.

[0173] In some possible implementation manners, the second cold plate 12 is further provided with at least one third connecting part, and the circuit board is provided with a fourth connecting part, and the third connecting part and the fourth connecting part are used to achieve the fixed connection of the second cold plate 12 and the circuit board 20.

[0174] The heat dissipation device provided by the embodiments of the present application can be applied in various devices with heat dissipation requirements, and is used for heat dissipation of the circuit board with high-power device concentration of the terminal. For example, the heat dissipation device and the computing device provided by the present application can be applied in a terminal, a network device, a computer room device, an industrial device, or an entertainment and leisure device. The terminal can be, for example, a traffic device, a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, or smart glasses. The traffic device can further include a vehicle, a ship, an aircraft, rail transit (such as a subway or a high-speed rail), or a logistics robot. The network device includes, but is not limited to, a metropolitan router, a central router, or a base station. The computer room device can be, for example, a data center server or a data center switch. The industrial device can be, for example, an industrial robot or a mechanical arm. The entertainment and leisure device can be, for example, a virtual reality (VR) device, a mixed reality (MR) device, a massage chair, or a 4D cinema cabin. The embodiments of the present application do not make strict limitations on this.

[0175] Taking the terminal as an example, the embodiments of the present application further provide a terminal, which includes the heat dissipation device or the computing device. The terminal can include a vehicle, a drone, a robot, an industrial mechanical arm, or other intelligent devices. Please refer to FIG. 21, which is a schematic diagram of a vehicle. The vehicle 100 includes a computing device 30, which can be used as (or include) a smart driving controller, a cockpit domain controller, a vehicle domain controller (VDC), a vehicle integrated unit (VIU), or a battery management system. The smart driving controller can be, for example, a mobile data center (MDC).

[0176] It should be appreciated by those skilled in the art that the on-board computing device is usually installed in the engine compartment, the cockpit, the co-driver glove box, the vehicle head, etc. of the electric vehicle. These positions have a high ambient temperature and a very poor heat dissipation environment. With the development of vehicle intelligence, intelligent driving, intelligent cockpit and other intelligent functions have gradually become the standard configuration of vehicles, which brings more and more chips arranged on the vehicle-mounted device, continuously increasing power consumption, and growing demand for heat dissipation of the vehicle-mounted device. Taking an intelligent driving controller carrying an advanced driving system (ADS) as an example, the intelligent driving controller can interact with various sensors installed on the vehicle body through a cable, receive driving condition data fed back by multiple sensors (such as laser radar, millimeter wave radar, camera, positioning module, temperature / humidity sensor, inertial measurement unit, etc.), and perform real-time inference and judgment on the driving environment, and issue operation commands to various control units in the vehicle to control the vehicle to complete various operations, such as braking, deceleration, lane changing, or parking, etc. Therefore, the intelligent driving controller needs to operate and analyze a large amount of data and output a large amount of operation results and / or control signals. If the intelligent driving controller has an over-temperature risk, it is extremely likely to endanger the lives of passengers. Therefore, it is necessary to provide stable and efficient heat dissipation for the intelligent driving controller.

[0177] The heat dissipation device and the computing device provided by the embodiments of the present application can greatly improve the heat dissipation efficiency, solve the heat dissipation problem of the vehicle-mounted controller with high-power devices concentrated therein, provide stable and efficient heat dissipation for the vehicle-mounted controller, and improve the thermal management stability and safety of the vehicle. Moreover, the scheme of the present application can also reduce the board area of the vehicle-mounted controller, which is beneficial to the miniaturization and integration design of the vehicle-mounted device.

[0178] It should be understood that in the embodiments of the present application, the words "exemplarily" or "for example" are used to represent an example, illustration or description. Any embodiment or design scheme described as "exemplarily" or "for example" in the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words "exemplarily" or "for example" are used to present the relevant concept in a specific manner.

[0179] In the embodiments of the present application, the "end" appearing in the words "one end", "the other end", "end", "free end", "upper end", "lower end", "connection end" and the like is not limited to the end, end point or end face, but also includes a part extending an axial distance and / or a radial distance from the end, end point or end face on the device or element to which the end, end point or end face belongs.

[0180] In the description of the present application, the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", "left", "side" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. It should be understood that the z direction, y direction and the like mentioned in some embodiments of the present application are taken as a reference in the XYZ rectangular coordinate system to facilitate the description of the features in the present application, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation.

[0181] In addition, in the embodiments of the present application, opposite arrangement means that the orientations are different, and it is not necessarily limited that the orientations of two parts are completely opposite in two directions. For example, the first surface and the second surface are arranged opposite to each other, which means that the first surface and the second surface are oriented in substantially different directions in the z direction, for example, one is oriented in the positive direction of the z direction and the other is oriented in the negative direction of the z direction. In some possible cases, the first surface and the second surface are parallel and arranged opposite to each other, and in some other cases, the first surface and the second surface can not be completely opposite, but there can be a certain inclination angle. Similarly, the first edge and the second edge are opposite, the third edge and the fourth edge are opposite, and the like have similar cases.

[0182] In the embodiments of the present application, "at least one" means one or more, and "multiple" means two or more. "At least one of the following" or the like means any combination of the items, including any combination of single item or multiple items. For example, at least one of a, b, or c can represent: a, b, c, (a and b), (a and c), (b and c), or (a and b and c), where a, b, and c can be single or multiple. "And / or" describes the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can represent: A alone, A and B together, and B alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects.

[0183] In addition, unless otherwise stated, the ordinal numbers "first", "second" and the like used in the embodiments of the present application are used to distinguish a plurality of objects, and are not used to limit the order, time sequence, priority or importance of the plurality of objects.

Claims

1. A computing device, comprising: The heat dissipation device and the circuit board are provided, The heat dissipation device comprises a first cold plate and a second cold plate, the first cold plate is provided with a first flow channel, and the second cold plate is provided with a second flow channel, and the first flow channel and the second flow channel are used for flowing of a cooling medium; The first cold plate and the second cold plate are stacked along the thickness direction of the heat dissipation device, The circuit board is clamped between the first cold plate and the second cold plate, and the circuit board comprises a first surface and a second surface arranged oppositely along the thickness direction of the heat dissipation device, the first surface is provided with at least one first heat generating component, and the second surface is provided with at least one second heat generating component, The first cold plate is in thermal connection with the at least one first heat generating component, and the second cold plate is in thermal connection with the at least one second heat generating component.

2. The computing device of claim 1, wherein, The first cold plate comprises a third surface, and the third surface is provided with at least one first heat dissipation boss, The first surface of the circuit board is provided with at least one first heat generating component, and the third surface of the first cold plate is provided with at least one first heat dissipation boss, and the orthographic projection of the at least one first heat generating component and the at least one first heat dissipation boss on the third surface at least partially overlaps, The first cold plate is in thermal connection with the at least one first heat generating component, and the second cold plate is in thermal connection with the at least one second heat generating component.

3. The computing device of claim 2, wherein, The first flow channel forms a first projection on the third surface, the at least one first heat generating component forms a second projection on the third surface, the first projection covers the second projection, or the first projection partially covers the second projection.

4. The computing device of claim 2 or 3, wherein, The second cold plate comprises a fourth surface, the fourth surface is provided with at least one second heat dissipation boss, the orthographic projection of the at least one second heat generating component and the at least one second heat dissipation boss on the fourth surface at least partially overlaps, and the at least one second heat generating component and the at least one second heat dissipation boss are in thermal connection.

5. The computing device of claim 4, wherein, The second flow channel forms a third projection on the fourth surface, the at least one second heat generating component forms a fourth projection on the fourth surface, the third projection covers the fourth projection, or the third projection partially covers the fourth projection.

6. The computing device of any of claims 1-5, wherein, The at least one first heat generating component comprises a chip, and the at least one second heat generating component comprises a chip.

7. The computing device of any of claims 1-5, wherein, The at least one first heat generating component comprises a chip, and the at least one second heat generating component comprises a heat conduction component in thermal connection with the chip.

8. The computing device according to any one of claims 1-7, wherein The first cold plate is provided with a first liquid passage, a second liquid passage, a first communication port and a second communication port, the second cold plate is provided with a third communication port and a fourth communication port, The first flow channel and the second flow channel are in communication through the first communication port and the third communication port, and the second flow channel and the second liquid passage are in communication through the second communication port and the fourth communication port; The first liquid passage, the first flow channel, the first communication port, the third communication port, the second flow channel, the second communication port, the fourth communication port and the second liquid passage are sequentially communicated.

9. The computing device of claim 8, wherein, The first communication port and the third communication port are arranged on the same side of the heat dissipation device, The second communication port and the fourth communication port are arranged on the same side of the heat dissipation device, The first liquid passing port and the second liquid passing port are arranged on the same side of the heat dissipation device, or on different sides.

10. The computing device of any of claims 1-7, wherein, The first cold plate is provided with a third liquid passing port and a fifth communication port, and the second cold plate is provided with a fourth liquid passing port and a sixth communication port, The first flow channel and the second flow channel are communicated through the fifth communication port and the sixth communication port, The third liquid passing port, the first flow channel, the fifth communication port, the sixth communication port, the second flow channel and the fourth liquid passing port are sequentially communicated.

11. The computing device of any of claims 1-7, wherein, The first cold plate is provided with a first liquid inlet and a first liquid outlet, both of which are communicated with the first flow channel, the first liquid inlet is used for the cooling medium to flow in, and the first liquid outlet is used for the cooling medium to flow out, The second cold plate is provided with a second liquid inlet and a second liquid outlet, both of which are communicated with the second flow channel, the second liquid inlet is used for the cooling medium to flow in, and the second liquid outlet is used for the cooling medium to flow out.

12. The computing device of any of claims 1-11, wherein, The first flow channel is an "S" type flow channel.

13. The computing device of any of claims 1-12, wherein, The first cold plate includes a first base plate and a first cover plate, the first flow channel is recessed in a fifth surface of the first base plate, the fifth surface is a surface of the first base plate away from the circuit board, and the first cover plate is used to seal the first flow channel.

14. The computing device of any of claims 1-13, wherein, The first flow channel includes a plurality of sub-flow channels sequentially communicated in a head-to-tail manner.

15. The computing device of any of claims 11-14, wherein, The first flow channel includes a first sub-flow channel, a second sub-flow channel and a third sub-flow channel. The first cold plate has a first side and a second side opposite in a length direction of the heat dissipation device, and a third side and a fourth side opposite in a width direction of the heat dissipation device; The first flow channel is provided with a first separation component and a second separation component, and the first separation component and the second separation component are arranged in a spaced manner along the width direction of the heat dissipation device; The bottom of the first separation component is connected with the bottom surface of the first flow channel and extends along the length direction of the heat dissipation device, one end of the first separation component is connected with the first side, and the other end is arranged in a spaced manner with the second side; The bottom of the second separation component is connected with the bottom surface of the first flow channel and extends along the length direction of the heat dissipation device, one end of the second separation component is connected with the second side, and the other end is arranged in a spaced manner with the first side; The first separation component and the third side form the first sub-flow channel, the first separation component and the second separation component form the second sub-flow channel, and the second separation component and the fourth side form the third sub-flow channel; The first sub-flow channel and the second sub-flow channel are communicated through the interval between the first separation component and the second side, and the second sub-flow channel and the third sub-flow channel are communicated through the interval between the second separation component and the first side.

16. The computing device of any of claims 1-15, wherein, The first cold plate further includes a plurality of first heat dissipation teeth protruding in the first flow channel, and the plurality of first heat dissipation teeth are connected with the bottom surface of the first flow channel.

17. The computing device of any of claims 1-16, wherein, The second cold plate comprises a second base plate and a second cover plate, the second flow channel is recessed in a sixth surface of the second base plate, the sixth surface being a surface of the second base plate away from the circuit board, and the second cover plate is used for sealing the second flow channel.

18. The computing device of claim 17, wherein, The second flow channel comprises a plurality of sub-flow channels connected in sequence.

19. The computing device of claim 17 or 18, wherein, The second flow channel comprises a fourth sub-flow channel, a fifth sub-flow channel, a sixth sub-flow channel and a seventh sub-flow channel. The second cold plate has a fifth side and a sixth side opposite along the length direction of the heat dissipation device, and a seventh side and an eighth side opposite along the width direction of the heat dissipation device. The first flow channel is provided with a third partition component, a fourth partition component and a fifth partition component, the bottom of the third partition component, the bottom of the fourth partition component and the bottom of the fifth partition component are connected with the bottom surface of the second flow channel, The third partition component extends along the width direction of the heat dissipation device, one end is connected with the eighth side, and the other end is connected with the fourth partition component and is arranged in a spaced manner with the seventh side, The fourth partition component extends along the length direction of the heat dissipation device, one end is connected with the third partition component and is arranged in a spaced manner with the sixth side, and the other end is arranged in a spaced manner with the fifth side, The fifth partition component is arranged between the fourth partition component and the eighth side, and the fourth partition component and the fifth partition component are arranged in a spaced manner along the width direction of the heat dissipation device, The fifth partition component extends along the length direction of the heat dissipation device, one end is connected with the fifth side of the second base plate, and the other end is arranged in a spaced manner with the third partition component, The third partition component and the sixth side form a fourth sub-flow channel, the fourth partition component and the seventh side form a fifth sub-flow channel, the fourth partition component and the fifth partition component form a sixth sub-flow channel, and the fifth partition component and the eighth side form a seventh sub-flow channel; The fourth sub-flow channel and the fifth sub-flow channel are communicated through a first interval and a second interval, the first interval being the interval between the third partition component and the seventh side, and the second interval being the interval between the fourth partition component and the sixth side; The fifth sub-flow channel and the sixth sub-flow channel are communicated through the interval between the fourth partition component and the fifth side; The sixth sub-flow channel and the seventh sub-flow channel are communicated through the interval between the fifth partition component and the third partition component.

20. The computing device of any of claims 1-19, wherein, The second cold plate further comprises a plurality of second heat dissipation fins arranged in the second flow channel, and the plurality of second heat dissipation fins are connected with the bottom surface of the second flow channel.

21. A vehicle characterized by The vehicle comprises the computing device according to any one of claims 1-20.

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