Optical module

Abstract

The present application discloses an optical module. The optical module comprises a module main body and an optical microstructure assembly. A plurality of pixel points are evenly arranged on one side surface of the module main body. The optical microstructure assembly comprises a plurality of independently arranged optical microstructures, and the plurality of optical microstructures are arranged above the plurality of pixel points.

Description

Optical module

[0001] This application claims priority to Chinese Patent Application No. 202421937060.1, filed on August 9, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of optical modules, in particular to an optical module. BACKGROUND

[0003] At present, the surface layer of most optical modules is configured with optical film materials (such as prism film, naked-eye grating film, microlens array film, etc.) to form multiple sets of optical microstructures. These optical microstructures can diffuse, shape, uniform, focus, image, etc. the incident light beam of the optical module by adjusting the shape, focal length, arrangement, duty cycle, etc. parameters, so that the optical module can display specific optical effects. SUMMARY

[0004] The present application is defined by the independent claims attached hereto, and the related improvements are set forth in the dependent claims.

[0005] The embodiments of the present application provide an optical module to improve the optical module with optical microstructures.

[0006] In a first aspect, the embodiments of the present application provide an optical module, comprising a module main body and an optical microstructure assembly, a side surface of the module main body is uniformly provided with a plurality of pixel points, the optical microstructure assembly comprises a plurality of independently arranged optical microstructures, and the plurality of optical microstructures are arranged above the plurality of pixel points.

[0007] In some possible embodiments of the present application, each optical microstructure corresponds to at least one pixel point.

[0008] In some possible embodiments of the present application, each optical microstructure is arranged above the corresponding at least one pixel point.

[0009] In some possible embodiments of the present application, one optical microstructure is arranged above each pixel point.

[0010] In some possible embodiments of the present application, the module main body comprises a module main board and a plurality of chip units, the plurality of chip units are uniformly arranged on one side surface of the module main board to form the plurality of pixel points one by one, and the plurality of chip units are further covered with a packaging glue layer away from the one side surface of the module main board.

[0011] In some possible embodiments of the present application, the surface of the encapsulation layer is concavely provided with a plurality of recessed card slots, each of the recessed card slots corresponding to at least one chip unit, and each of the recessed card slots is arranged above the corresponding at least one chip unit.

[0012] The plurality of recessed card slots are arranged one-to-one with the plurality of optical microstructures, and each of the optical microstructures is arranged in the corresponding recessed card slot.

[0013] In some possible embodiments of the present application, the optical microstructure comprises a microstructure body and a microstructure base, the microstructure body is arranged on the top side of the microstructure base, and the microstructure base is embeddedly arranged in the corresponding recessed card slot.

[0014] In some possible embodiments of the present application, the bottom side of the microstructure base is fastened to the groove bottom of the corresponding recessed card slot through a first adhesive layer.

[0015] In some possible embodiments of the present application, the circumferential side of the microstructure base is further concavely provided with a plurality of overflow grooves.

[0016] In some possible embodiments of the present application, each of the optical microstructures is fastened to the surface of the encapsulation layer through a second adhesive layer.

[0017] In some possible embodiments of the present application, each of the second adhesive layers is arranged on a preset region of the surface of the encapsulation layer through a steel mesh printing structure or a dispensing structure.

[0018] In some possible embodiments of the present application, each of the optical microstructures is fastened to the surface of the encapsulation layer through a geometric fastener.

[0019] In some possible embodiments of the present application, the optical microstructure assembly comprises any one or more of a wide-view microstructure, a brightening microstructure, a three-dimensional depth-of-field microstructure, and a photochromic microstructure.

[0020] This summary is provided to introduce a selection of concepts that are further described below in the detailed description of the application. This summary does not necessarily identify key or essential teachings of the claimed subject matter, nor does it necessarily delineate the scope of the claimed subject matter. The term "subject matter" can refer to the content described above and components, structures, processes, methods, and / or operations described throughout this document. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the accompanying drawings in the following description only represent some of the embodiments of the present application, and all other drawings obtained by those of ordinary skill in the art without creative effort based on these drawings also belong to the protection scope of the present application.

[0022] Fig. 1 is a schematic view of a partial structure of an optical module according to an embodiment of the present application;

[0023] Fig. 2 is a schematic view of a side of the optical module shown in Fig. 1;

[0024] Fig. 3 is a schematic view of a partial disassembly of another structure of the optical module shown in Fig. 1;

[0025] Fig. 4 is a schematic view of an assembly of the optical module shown in Fig. 2;

[0026] Fig. 5 is a schematic view of a partial disassembly of another structure of the optical module shown in Fig. 1;

[0027] Fig. 6 is a schematic view of a partial disassembly of another structure of the optical module shown in Fig. 1.

[0028] It should be noted that the accompanying drawings are only used to illustrate the technical solutions of the present application, and the specific positions, directions, orientations and sizes shown in the drawings are only used as a reference to help understand the present application, and are not an accurate limitation on the corresponding elements in the actual application or implementation process of the present application. In the actual application, the positions, directions, orientations and sizes of the elements can be reasonably adjusted and changed according to specific needs and actual conditions. Embodiments of the present application

[0029] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort also belong to the protection scope of the present application.

[0030] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0031] In addition, the descriptions involving "first", "second", etc. in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0032] At present, the surface layer of most optical modules will form multiple sets of optical microstructures through the setting mode of optical film materials (such as prism film, naked-eye grating film, microlens array film, etc.). These optical microstructures can diffuse, shape, uniform, focus, image, etc. modulate the incident light beam of the optical module by adjusting the shape, focal length, arrangement, duty cycle, etc. parameters, so that the optical module can display specific optical effects. However, it is found in actual use that this setting mode of optical microstructure is easily affected by the expansion and contraction of the material of the optical film material itself, causing the pre-arrangement of the optical microstructure in the film material to deviate, and further causing the alignment deviation between the optical microstructure and the module pixel, which seriously affects the optical display effect of the optical module.

[0033] Based on this, the purpose of the present application is to provide an optical module to improve the optical module with optical microstructure, especially to solve the technical problem that the setting mode of the optical microstructure of the existing optical module easily causes the alignment deviation between the optical microstructure and the module pixel, which seriously affects the optical display effect of the optical module.

[0034] In some embodiments, as shown in FIG. 1 and FIG. 2, the present application provides an optical module 100, which can specifically include a module body 110 and an optical microstructure assembly 120. The module body 110 is uniformly provided with a plurality of pixel points 111 on one side surface, and the optical microstructure assembly 120 includes a plurality of independently arranged optical microstructures 121. Each optical microstructure 121 corresponds to at least one pixel point 111, and each optical microstructure 121 is arranged above the corresponding at least one pixel point 111, and each pixel point 111 is arranged above one optical microstructure 121.

[0035] It can be understood that the optical module 100 of the embodiments of the present application can be an LED display module with a specific optical display effect. The plurality of optical microstructures 121 mentioned above are independently set, which means that each optical microstructure 121 is independently manufactured and is not connected to other optical microstructures 121, and the plurality of optical microstructures 121 are independent structures. Compared with the prior art in which a plurality of optical microstructures are directly arranged in the same optical film material, the plurality of optical microstructures 121 of the present application can be formed by any one of polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), silica gel, and resin through mold injection and extrusion molding to form individual independent optical microstructures 121, and then the plurality of optical microstructures 121 are arranged above the corresponding at least one pixel point 111. As mentioned above, each optical microstructure 121 corresponds to at least one pixel point 111, which means that each optical microstructure 121 can correspond to one pixel point 111 or a plurality of pixel points 111 (i.e. two or more pixel points 111). As mentioned above, each optical microstructure 121 is arranged above the corresponding at least one pixel point 111, which means that by arranging the optical microstructure 121 above the corresponding one or more pixel points 111, the outgoing light beams of the corresponding one or more pixel points 111 are modulated to obtain the required optical display effect, such as diffusion, shaping, uniformity, focusing, imaging, etc. Each pixel point 111 has an optical microstructure 121 arranged above it, which ensures that the outgoing light beams of each pixel point 111 are modulated by the corresponding optical microstructure 121.

[0036] In addition, as mentioned above, the upper side of the pixel point 111 means the side of the pixel point 111 away from the module main body 110, i.e. the side of the chip unit away from the module main board 112.

[0037] In this way, the optical module 100 of the embodiment of the present application, since the optical microstructure assembly 120 of the optical module 100 comprises a plurality of optical microstructures 121 arranged independently, and each optical microstructure 121 is arranged independently above the corresponding at least one pixel point 111, so that the installation and fixation of each optical microstructure 121 will not be affected by the installation and fixation of other optical microstructures 121, and will not be affected by the spacing between the pixel points 111 of the optical module 100. In this way, the installation and fixation mode of the optical microstructure 121 of the optical module 100 will not be affected by the expansion and contraction of the optical film material, and will not be affected by the installation of the optical module 100 with different pixel spacings, and will not need to re-open the mold to produce the optical film material according to the pixel spacing, resulting in a multiplicative increase in mold cost.

[0038] In some examples, as shown in FIGS. 1 and 2, the module body 110 can specifically include a module main plate 112 and a plurality of chip units, the plurality of chip units are arranged uniformly on one side surface of the module main plate 112 to form a plurality of pixel points 111 one by one, and the plurality of chip units are further covered with a packaging glue layer 113 away from the one side surface of the module main plate 111. In this way, through the above structure, the plurality of pixel points 111 formed one by one by the plurality of chip units can be covered and protected by the packaging glue layer 113, so as to effectively improve the service life of the plurality of pixel points 111.

[0039] It can be understood that each chip unit can specifically include an R chip, a G chip and a B chip, so as to obtain any color needed by mixing the R chip, the G chip and the B chip.

[0040] In some examples, as shown in FIGS. 3 to 5, the surface of the packaging glue layer 113 is recessed with a plurality of recessed card slots 114, each recessed card slot 114 corresponds to at least one chip unit, each recessed card slot 114 is arranged above the corresponding at least one chip unit, and each chip unit is arranged above one optical microstructure 121. The plurality of recessed card slots 114 and the plurality of optical microstructures 121 are arranged one by one, and each optical microstructure 121 is arranged in the corresponding recessed card slot 114. In this way, through the above structure, each optical microstructure 121 is embeddedly installed in the corresponding recessed card slot 114, so as to ensure that the installation and fixation of each optical microstructure 121 is more firm.

[0041] It can be understood that the recessed card slot 114 can be set to any shape according to the actual installation and fixation needs of each optical microstructure 121, including but not limited to a trapezoidal structure (as shown in FIG. 5) or an I-shaped structure (as shown in FIGS. 3 and 4). In this way, the installation and fixation of each optical microstructure 121 can be further ensured to be more secure, so that it is not easy to fall off from the corresponding recessed card slot 114. The groove depth of the recessed card slot 114 can be 0.1 mm to 0.5 mm. In this way, by setting this parameter, the installation and fixation of each optical microstructure 121 can be ensured to be more secure, while each optical microstructure 121 is closer to the corresponding pixel point 111 to ensure the optical modulation effect of the outgoing light beam of the corresponding pixel point 111.

[0042] In some examples, as shown in FIGS. 3 to 5, the optical microstructure 121 includes a microstructure body 1211 and a microstructure base 1212, the microstructure body 1211 is arranged on the top side of the microstructure base 1212, and the microstructure base 1212 is embeddedly arranged in the corresponding recessed card slot 114. In this way, by the above structure, only the microstructure base 1212 of each optical microstructure 121 is embeddedly arranged in the corresponding recessed card slot 114, and part or all of the microstructure body 1211 is exposed outside the corresponding recessed card slot 114, so that the optical modulation effect of the microstructure body 1211 on the outgoing light beam of the corresponding pixel point is not affected by the packaging layer 113. Further, the bottom side of the microstructure base 1212 and the groove bottom of the corresponding recessed card slot 114 are further tightly connected by the first adhesive layer 115. In this way, the installation and fixation of each optical microstructure 121 can be further ensured to be more secure by the further adhesion and fixation of the first adhesive layer 115. Further, the peripheral side of the microstructure base 1212 is further recessed with a plurality of glue overflow grooves 1213. In this way, by the above structure, when the bottom side of the microstructure base 1212 and the groove bottom of the corresponding recessed card slot 114 are further tightly connected by the first adhesive layer 115, the first adhesive layer 115 will be extruded to flow to the four sides, so that the first adhesive layer 115 overflows between the recessed card slot 114 and the microstructure base 1212, and the plurality of glue overflow grooves 1213 increases the contact area of the microstructure base 1212 and the first adhesive layer 115, while the first adhesive layer 115 is embedded in the microstructure base 1212 to form an integral whole, and forms a mortise and tenon structure with the recessed card slot 114 on the packaging layer 113, so that the optical microstructure 121 is more stably fixed on the optical module 100.

[0043] It can be understood that the height of the microstructure base can be specifically 0.1 mm to 0.5 mm. In this way, through the setting of this parameter, the installation and fixation of each optical microstructure 121 can be ensured to be more firm, and at the same time, the microstructure body 1211 of each optical microstructure 121 is closer to the corresponding pixel point 111, so as to ensure the optical modulation effect of the outgoing light beam of the corresponding pixel point 111. The groove width of the overflow glue groove 1213 is 0.4 to 0.6 times the height of the microstructure base 1212. In this way, through the setting of this parameter, the contact area between the microstructure base 1212 and the first adhesive layer 115 can be maximized while the structural strength of the microstructure base 1212 itself is not adversely affected.

[0044] In some examples, as shown in FIG. 6, each optical microstructure 121 can also be fastened to the surface of the packaging glue layer 113 by a second adhesive layer 116. In this way, through the structural setting of the second adhesive layer 116, the installation and fixation of each optical microstructure 121 on the surface of the packaging glue layer 113 can be effectively realized. Further, each second adhesive layer 116 is arranged on the preset area of the surface of the packaging glue layer 113 by screen printing structure or dispensing structure. In this way, through the above structural setting, each second adhesive layer 116 can be efficiently arranged on the preset area of the surface of the packaging glue layer 113.

[0045] It can be understood that, compared with the whole surface spraying method which is easy to cause the uneven thickness of the optical module 100, the dispensing structure in the present example can be point-to-point dispensing according to the input coordinates, so that only the preset area is provided with the second adhesive layer 116, to ensure the thickness consistency of the optical module 100. The screen printing structure in the present example performs whole plate printing on the optical module 100 by screen printing, that is, the screen plate of the screen printing machine is provided with a matrix distribution of through holes, the positions of the through holes correspond to the pixel points 111 of the module one by one, and the shapes of the through holes can be circular, square, polygonal, etc. The screen plate and the module are aligned through the positioning points, so that each second adhesive layer 116 can be quickly printed above the corresponding pixel point 111 of the module (i.e., the preset area of the surface of the packaging glue layer 113) through the through holes of the screen plate. Compared with the dispensing structure, the efficiency is higher.

[0046] In addition, each optical microstructure 121 is also fastened to the surface of the packaging glue layer 113 by a geometric fastener (not shown). In this way, through the structural setting of the geometric fastener, the installation and fixation of each optical microstructure 121 on the surface of the packaging glue layer 113 can be effectively realized, and at the same time, each optical microstructure 121 can be easily disassembled and replaced according to actual needs.

[0047] In some examples, as shown in FIGS. 1-4, the optical microstructure assembly 120 includes any one or more of wide-view microstructures, brightening microstructures, three-dimensional (3D) depth-of-field microstructures, photochromic microstructures. In this way, by the above structure arrangement, the differential placement of multiple types of optical microstructures can be performed according to the actual optical effect display needs of the optical module, to achieve wide-view, brightening, or parallax effect, and the like.

[0048] In some examples, as shown in FIGS. 1-4, the microstructure body 1211 mentioned in the above examples can specifically be any one of PMMA material, PC material, PS material, silicone material, and resin material, obtained by mold injection and extrusion molding. In this way, by the above structure arrangement, the microstructure body 1211 can be formed into any shape and any required microstructure according to actual needs.

[0049] The technical solution provided in the present application, since the optical microstructure assembly of the optical module includes a plurality of independently arranged optical microstructures, and each optical microstructure is independently arranged above the corresponding at least one pixel point, the installation and fixation of each optical microstructure is not affected by the installation and fixation of other optical microstructures, and is also not affected by the spacing between the pixel points of the optical module. In this way, the installation and fixation mode of the optical microstructure of the present optical module will not be affected by the expansion and contraction of the optical film material to cause alignment deviation between the optical microstructure and the module pixels, and will not need to re-open the mold to produce the optical film material according to the pixel spacing due to the installation needs of the optical module with different pixel spacings, resulting in a multiplied increase in mold cost.

[0050] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, comprising: The module body is provided with a plurality of pixel points on one side surface, and the optical microstructure assembly includes a plurality of independently arranged optical microstructures arranged above the plurality of pixel points.

2. The optical module according to claim 1, wherein Each optical microstructure corresponds to at least one pixel point.

3. The optical module according to claim 1 or 2, wherein Each optical microstructure is arranged above the corresponding at least one pixel point.

4. The optical module according to any one of claims 1 to 3, wherein One optical microstructure is arranged above each pixel point.

5. The optical module according to any one of claims 1 to 4, wherein The module body includes a module main plate and a plurality of chip units, which are uniformly arranged on one side surface of the module main plate to form the plurality of pixel points one by one, and the plurality of chip units are further covered with a packaging glue layer away from the one side surface of the module main plate.

6. The optical module according to claim 5, wherein The surface of the packaging glue layer is recessed with a plurality of groove clamping positions, each groove clamping position corresponds to at least one chip unit, and each groove clamping position is arranged above the corresponding at least one chip unit. The plurality of groove clamping positions and the plurality of optical microstructures are arranged one by one, and each optical microstructure is arranged in the corresponding groove clamping position.

7. The optical module according to claim 6, wherein The optical microstructure includes a microstructure body and a microstructure base, the microstructure body is arranged on the top side of the microstructure base, and the microstructure base is embeddedly arranged in the corresponding groove clamping position.

8. The optical module according to claim 7, wherein The bottom side of the microstructure base and the groove bottom of the corresponding groove clamping position are fastened and connected through a first adhesive glue layer.

9. The optical module according to claim 8, wherein, The circumferential side of the microstructure base is further recessed with a plurality of glue overflow grooves.

10. The optical module according to any one of claims 5 to 9, wherein, Each optical microstructure is fastened to the surface of the packaging glue layer through a second adhesive glue layer.

11. The optical module according to claim 10, wherein Each second adhesive glue layer is arranged in a predetermined area of the surface of the packaging glue layer through a steel mesh printing structure or a dispensing structure.

12. The optical module according to any one of claims 5 to 11, wherein, Each optical microstructure is fastened to the surface of the packaging glue layer through a geometric fastener.

13. The optical module according to any one of claims 1 to 12, wherein, The optical microstructure assembly includes any one or more of a wide-view microstructure, a brightening microstructure, a three-dimensional depth-of-field microstructure, and a photochromic microstructure.

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