Optical module and processing method therefor

Abstract

Disclosed are an optical module and a processing method therefor. The processing method comprises the following operations: providing a module body, wherein the module body comprises a module main board and a plurality of chip units; providing a plurality of optical micro-structures, and correspondingly attaching the plurality of optical micro-structures to the upper surfaces of the plurality of chip units on a one-to-one basis, thereby obtaining an optical module preform; and performing potting encapsulation processing on the side surface of the optical module preform provided with the plurality of chip units, thereby forming an encapsulation adhesive layer that covers the plurality of chip units entirely and the plurality of optical micro-structures partially.

Description

Optical module and processing method thereof

[0001] This application claims priority to Chinese Patent Application No. 202411094206.5, filed on August 9, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of optical modules, in particular to an optical module and a processing method thereof. BACKGROUND

[0003] Generally, a plurality of optical microstructures are formed by setting optical film materials (such as prism film, naked-eye grating film, microlens array film, etc.) on the surface of an optical module. By adjusting the shape, focal length, arrangement, duty cycle, etc. of these optical microstructures, the incident light beam of the optical module can be modulated for diffusion, shaping, uniformity, focusing, imaging, etc., so that the optical module can display specific optical effects. SUMMARY

[0004] The present application is defined by the independent claims appended hereto, and dependent improvements are set forth in the dependent claims.

[0005] Embodiments of the present application provide an optical module and a processing method thereof to improve the optical module with optical microstructures.

[0006] In a first aspect, embodiments of the present application provide a processing method of an optical module, the processing method comprising the following operations:

[0007] providing a module main body, the module main body comprising a module main plate and a plurality of chip units, the plurality of chip units being uniformly arranged on one side surface of the module main plate;

[0008] providing a plurality of optical microstructures, and attaching the plurality of optical microstructures one by one to one side surface of the plurality of chip units away from the module main plate to obtain an optical module prototype;

[0009] performing a glue filling and packaging process on the one side surface of the optical module prototype provided with the plurality of chip units to form a packaging glue layer completely covering the plurality of chip units and partially covering the plurality of optical microstructures.

[0010] In possible embodiments, the optical microstructure comprises a microstructure body and a microstructure base, the microstructure body is arranged on the top side of the microstructure base, and the microstructure base is provided with adhesive glue close to one side surface of the corresponding chip unit.

[0011] In possible embodiments, the adhesive glue is a two-component thermosetting glue material or a one-component ultraviolet (UV) curing glue material.

[0012] In a possible implementation, the adhesive glue comprises any one of modified epoxy resin, silicone resin, polyurethane, acrylic resin or phenolic resin.

[0013] In a possible implementation, the operation of attaching each of the optical microstructures to the side surface of the chip unit away from the mainboard of the module one by one to obtain the optical module prototype comprises:

[0014] After transferring each of the optical microstructures to the side surface of the corresponding chip unit away from the mainboard of the module by the transfer arm, ultraviolet curing treatment or thermal curing treatment is performed, so that each of the optical microstructures is attached to the side surface of the chip unit away from the mainboard of the module one by one to obtain the optical module prototype.

[0015] In a possible implementation, the operation of performing glue filling encapsulation treatment on the side surface of the optical module prototype provided with the chip units to form an encapsulation glue layer completely covering the chip units and partially covering the optical microstructures comprises:

[0016] The encapsulation glue is filled into the side surface of the mainboard of the module provided with the chip units, so that the encapsulation glue layer is formed when the encapsulation glue is completely cured.

[0017] In a possible implementation, the encapsulation glue is a two-component epoxy resin, and is completely cured by thermal solidification to form the encapsulation glue layer.

[0018] In a possible implementation, the height of the encapsulation glue layer is greater than the height of any chip unit and less than the sum of the height of any chip unit and the height of any optical microstructure.

[0019] In a possible implementation, the microstructure body is any one of polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), silica gel and resin obtained by mold injection and extrusion molding.

[0020] In a second aspect, the embodiments of the present application further provide an optical module obtained by the above processing method.

[0021] This summary is provided to introduce a selection of concepts that are further described below in the detailed description of the application. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used to determine the scope of the claimed subject matter. The term “subject matter” can refer to the above and components, structures, processes, methods and / or operations described throughout this document. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0023] Fig. 1 is a flow chart of the processing method of the optical module in the embodiments of the present application.

[0024] Fig. 2 is a partial structure installation schematic diagram one of the optical module in the embodiments of the present application.

[0025] Fig. 3 is a partial structure installation schematic diagram two of the optical module in the embodiments of the present application.

[0026] It should be noted that the drawings are only for the purpose of illustrating the technical solutions of the present application, and the specific positions, directions, orientations and sizes shown in the drawings are only used as a reference to help understand the present application, and are not an accurate limitation on the corresponding elements in the actual application or implementation process. The position, direction, orientation and size of each element in the actual application can be reasonably adjusted and changed according to specific needs and actual conditions. Embodiments of the present application

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), if the certain posture changes, the directional indications also change accordingly.

[0029] The technical solutions among the various embodiments can be combined with each other, but it must be based on that a person skilled in the art can realize, when the combination of the technical solutions appears contradictory or unachievable, it should be considered that the combination of the technical solutions does not exist, and is not within the protection scope required by the present application.

[0030] Generally, a plurality of optical microstructures are formed by arranging optical film materials (such as prism film, naked-eye grating film, microlens array film, etc.) on the surface of the optical module. By adjusting the shape, focal length, arrangement, duty cycle, etc. of the optical microstructures, the incident light beam of the optical module can be diffused, shaped, uniformed, focused, imaged, etc. to achieve specific optical display effects. However, in actual use, it is found that the manufacturing method of the optical module is easily affected by the expansion and contraction of the optical film material, which causes the pre-arrangement of the optical microstructures in the film material to deviate, and further causes the alignment deviation between the optical microstructures and the module pixels, which seriously affects the optical display effect of the optical module.

[0031] Therefore, an object of the present application is to provide an optical module and a processing method thereof, to improve the optical module with optical microstructures, and in particular to solve the technical problem that the manufacturing method of the existing optical module easily causes alignment deviation between the optical microstructures and the module pixels, affecting the optical display effect of the optical module.

[0032] As shown in FIG. 1, in one embodiment, the present application also provides a processing method of an optical module, which includes the following operations S110-S130.

[0033] Operation S110: providing a module main body, the module main body including a module main plate and a plurality of chip units, the plurality of chip units being uniformly arranged on one side surface of the module main plate.

[0034] It can be understood that, as shown in FIG. 2, the optical module of the present application embodiment can be specifically an LED display module, so the module main plate 111 of the module main body 110 can be specifically a module light plate, and the chip units 112 of the module main body 110 are mainly LED chip units, and one chip unit 112 can form one pixel point of the module main body 110. Each chip unit can specifically include an R chip, a G chip and a B chip, so as to obtain any color needed by mixed display of the R chip, the G chip and the B chip.

[0035] Operation S120: providing a plurality of optical microstructures, and attaching the plurality of optical microstructures one by one on the upper surfaces of the plurality of chip units to obtain an optical module prototype.

[0036] It can be understood that, as shown in FIG. 2, the upper surface of the chip unit 112 mentioned in the method operation specifically refers to the side surface of the chip unit 112 away from the module mainboard 111. After obtaining the module main body through the above method operation, a plurality of optical microstructures 120 can be provided according to the actual optical display effect needs, and the number of the plurality of optical microstructures 120 should be consistent with the number of the plurality of chip units 112, so that they maintain a one-to-one correspondence relationship, ensuring that the outgoing light beam of each chip unit 112 is modulated by the corresponding optical microstructure 120. By one-to-one corresponding the plurality of optical microstructures 120 to the upper surface of the plurality of chip units 112, the optical module prototype is obtained, which can ensure the accurate alignment between the optical microstructure 120 and the module pixel (i.e. the chip unit 112) in the optical module, and at the same time, after the encapsulation glue is solidified in the subsequent method operation, each optical microstructure 120 can be stably aligned to the corresponding chip unit 112, to better solve the alignment deviation problem mentioned in the foregoing.

[0037] Operation S130: The side surface of the optical module prototype provided with the plurality of chip units is subjected to a glue filling encapsulation process to form an encapsulation glue layer covering the entire plurality of chip units and part of the plurality of optical microstructures, so as to obtain a target optical module.

[0038] It can be understood that, as shown in FIG. 2 and FIG. 3, after obtaining the optical module prototype through the above method operation, the side surface of the optical module prototype provided with the plurality of chip units 112 can be further subjected to a glue filling encapsulation process to form an encapsulation glue layer 113 covering the entire plurality of chip units 112 and part of the plurality of optical microstructures 120, so as to obtain a target optical module.

[0039] Therefore, each optical microstructure 120 is independently arranged on the upper surface of the corresponding chip unit 112, so that the installation and fixation of each optical microstructure 120 will not be affected by the installation and fixation of other optical microstructures 120, and will not be affected by the spacing between the pixel points of the optical module. In addition, during the processing of the optical module, not only is each optical microstructure 120 correspondingly arranged on the upper surface of the corresponding chip unit 112 to achieve stable fastening connection between each optical microstructure 120 and the corresponding chip unit 112, but further encapsulation processing is performed, so that part of the plurality of optical microstructures 120 is filled into the encapsulation glue layer to achieve semi-encapsulation fixation of the optical microstructures 120, so that the optical microstructures 120 are not easy to be extruded and fall off by external force. That is, the processing method of the optical module can also ensure the stable installation of each optical microstructure 120 and prevent it from falling off. In this way, the processing method of the optical module can not only ensure the stable installation of each optical microstructure 120 and prevent it from falling off, but also can prevent the optical microstructures 120 from being affected by the expansion and contraction of the optical film material to cause deviation of the alignment between the optical microstructures 120 and the module pixels, and can also prevent the need for re-molding of the optical film material according to the pixel spacing to increase the mold cost.

[0040] In some embodiments, as shown in FIGS. 2 and 3, the optical microstructure 120 includes a microstructure body 121 and a microstructure base 122, and the microstructure body 121 is arranged on the top side of the microstructure base 122.

[0041] In some embodiments, the lower surface of the microstructure base 122 (close to the side surface of the corresponding chip unit 112) is provided with adhesive glue (not shown). In this way, when the plurality of optical microstructures 120 are correspondingly attached to the upper surfaces of the plurality of chip units 112, the initial fastening connection between each optical microstructure 120 and the corresponding chip unit 112 can be quickly achieved through the bonding effect of the adhesive glue, so as to avoid the problem of displacement of the optical microstructure 120 in the subsequent glue pouring process. Further, the adhesive glue can be a two-component thermosetting glue material or a single-component ultraviolet (UV) curing glue material. When the adhesive glue is a two-component thermosetting glue material, the adhesive glue can be cured by heating after the plurality of optical microstructures 120 are correspondingly attached to the upper surfaces of the plurality of chip units 112. When the adhesive glue is a single-component UV curing glue material, the adhesive glue can be cured by irradiating ultraviolet light after the plurality of optical microstructures 120 are correspondingly attached to the upper surfaces of the plurality of chip units 112. Further, the adhesive glue can specifically include any one of modified epoxy resin, silicone resin, polyurethane, acrylic resin or phenolic resin, at which time the adhesive glue should also include a corresponding curing agent and solvent, so that the adhesive glue can be well coated on the corresponding microstructure base 122.

[0042] In some embodiments, as shown in FIGS. 2 and 3, the specific process of performing the above method operation S120 is as follows: after each optical microstructure 120 is transferred to the upper surface of the corresponding chip unit 112 by the transfer arm, since the lower surface of the microstructure base 122 of each optical microstructure 120 is pre-coated with adhesive glue of a two-component thermosetting glue material or a single-component UV curing glue material, the plurality of optical microstructures can be correspondingly attached to the upper surfaces of the plurality of chip units by UV curing treatment or heat curing treatment, so as to obtain the optical module prototype, and at the same time, due to the curing of the adhesive glue, the initial fastening connection between each optical microstructure 120 and the corresponding chip unit 112 is achieved. In this way, the problem of displacement of the optical microstructure 120 in the subsequent glue pouring process can be effectively avoided.

[0043] In some embodiments, as shown in FIG. 2 and FIG. 3, the specific process of performing the above-mentioned method operation S130 is as follows: the encapsulation glue filling process is performed on the side surface of the module body 110 where the plurality of chip units 112 are arranged, so as to form the encapsulation glue layer 113 when the encapsulation glue is completely cured. It can be understood that the above-mentioned encapsulation glue filling process can be completed by using a COB (Chip on Board) process, a COG (Chip on Glass) process or a GOB (Glue on Board) process. The COB process is to fix the plurality of chip units 112 on the module main board 111 by welding or bonding, and then use encapsulation glue (usually epoxy resin) to cover and encapsulate the plurality of chip units 112 to form the encapsulation glue layer 113. The COG process is similar to the COB process, and the difference between the two is that the COG process uses a glass substrate as the substrate (i.e. the module main board 111), that is, the plurality of chip units 112 are directly mounted on the glass substrate (i.e. the module main board 111). The GOB process is similar to the COB process, and the difference between the two is that the plurality of chip units 112 in the GOB process are fixed on the module main board 111 by special glue, which provides mechanical support and insulation function after curing. In this way, the desired encapsulation glue layer 113 can be better formed to encapsulate and protect the entire plurality of chip units 112 and part of the plurality of optical microstructures 120. Further, the above-mentioned encapsulation glue can be a two-component epoxy resin, which is completely cured by heat setting to form the encapsulation glue layer 113. In this way, the encapsulation glue layer 113 formed by the two-component epoxy resin can well encapsulate and protect the entire plurality of chip units 112 and part of the plurality of optical microstructures 120 while not affecting the optical display effect of the plurality of chip units 112 and the plurality of optical microstructures 120.

[0044] In some embodiments, as shown in FIG. 3, the height of the encapsulation glue layer 113 is greater than the height of any chip unit 112 and less than the sum of the height of any chip unit 112 and the height of any optical microstructure 120. In this way, through the above-mentioned structure arrangement, it can be ensured that the encapsulation glue layer 113 covers the entire plurality of chip units 112 and only covers part of the plurality of optical microstructures 120, so as to ensure the stable installation of each optical microstructure 120 and not easy to fall off while not adversely affecting the optical display effect of each optical microstructure 120.

[0045] In some embodiments, the microstructure body 121 mentioned in the above embodiments can be any one of PMMA, PC, PS, silica gel and resin materials obtained by mold injection and extrusion molding. In this way, through the above structure, the microstructure body 121 can form any shape and any required microstructure according to actual needs. Further, the microstructure body 121 can be any one or any combination of wide viewing angle microstructure, brightening microstructure, 3D depth of field microstructure, and photochromic microstructure. In this way, through the above structure, the difference of multiple optical microstructures can be placed according to the actual optical effect display needs of the optical module, to realize wide viewing angle, brightening, or parallax effect and other optical functions.

[0046] The technical scheme provided in the present application, through the above method operation processing, each optical microstructure in the optical module is independently arranged on the upper surface of the corresponding chip unit, so that the installation and fixation of each optical microstructure will not be affected by the installation and fixation of other optical microstructures, and will not be affected by the spacing between the pixel points of the optical module. In addition, during the processing of the optical module, not only is the multiple optical microstructures one-to-one corresponding to the upper surface of the multiple chip units, so that each optical microstructure and the corresponding chip unit are stably and tightly connected, but also further processing of glue filling and packaging is carried out, so that part of the multiple optical microstructures are filled into the packaging glue layer to realize semi-packaging fixation of the optical microstructure, so that the optical microstructure is not easy to be extruded and fall off by external force. That is, the processing method of the optical module can also ensure the stable installation of each optical microstructure and prevent it from falling off. In this way, the processing method of the optical module can not only ensure the stable installation of each optical microstructure and prevent it from falling off, but also can make the processed optical module not be affected by the expansion and contraction of the optical film material to cause the alignment deviation between the optical microstructure and the module pixel, and also can not need to re-open the mold to produce the optical film material according to the pixel spacing to cause the mold cost to increase exponentially.

[0047] As shown in FIGS. 1-3, the present application also provides an optical module processed by the processing method of the optical module in the above embodiments.

[0048] In this way, the optical module of the embodiment of the present application has each optical microstructure 120 independently arranged on the upper surface of the corresponding chip unit 112, so that the installation and fixation of each optical microstructure 120 will not be affected by the installation and fixation of other optical microstructures 120, nor by the spacing between the pixel points of the optical module, while ensuring the accurate alignment between the optical microstructures 120 and the module pixels in the optical module. Meanwhile, the encapsulation adhesive layer 113 covers all the chip units 112 and part of the optical microstructures 120, so as to ensure the stable installation of each optical microstructure 120 and prevent it from falling off.

[0049] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features. Such modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A processing method of an optical module, comprising the following operations: providing a module main body, the module main body comprising a module main plate and a plurality of chip units, the plurality of chip units being uniformly arranged on a side surface of the module main plate; providing a plurality of optical microstructures, and pasting the plurality of optical microstructures one by one on a side surface of the plurality of chip units away from the module main plate to obtain an optical module prototype; performing glue filling and packaging processing on the side surface of the optical module prototype provided with the plurality of chip units to form a packaging glue layer completely covering the plurality of chip units and partially covering the plurality of optical microstructures.

2. The method of processing according to claim 1, wherein, The optical microstructure comprises a microstructure body and a microstructure base, the microstructure body being arranged on a top side of the microstructure base, and the microstructure base being provided with adhesive glue close to a side surface of the corresponding chip unit.

3. The method of processing according to claim 2, wherein, The adhesive glue is a two-component thermosetting glue material or a one-component ultraviolet curing glue material.

4. The method of processing according to claim 2, wherein, The adhesive glue comprises any one of modified epoxy resin, organic silicon resin, polyurethane, acrylic resin or phenolic resin.

5. The process according to any one of claims 2 to 4, wherein, The operation of pasting the plurality of optical microstructures one by one on the side surface of the plurality of chip units away from the module main plate to obtain the optical module prototype comprises: After transferring each optical microstructure to the side surface of the corresponding chip unit away from the module main plate by a transfer arm, ultraviolet curing processing or thermosetting processing is performed, so that the plurality of optical microstructures are pasted one by one on the side surface of the plurality of chip units away from the module main plate to obtain the optical module prototype.

6. The process according to any one of claims 2 to 5, wherein, The operation of performing glue filling and packaging processing on the side surface of the optical module prototype provided with the plurality of chip units to form the packaging glue layer completely covering the plurality of chip units and partially covering the plurality of optical microstructures comprises: Performing packaging glue filling and processing on the side surface of the module main body provided with the plurality of chip units to form the packaging glue layer when the packaging glue is completely cured.

7. The method of processing according to claim 6, wherein, The packaging glue is a two-component epoxy resin, and is completely cured by heat setting to form the packaging glue layer.

8. The method of processing according to claim 6 or 7, wherein, The height of the packaging glue layer is greater than the height of any chip unit and less than the sum of the height of any chip unit and the height of any optical microstructure.

9. The process of any one of claims 2-8, wherein, The microstructure body is any one of polymethyl methacrylate material, polycarbonate material, polystyrene material, silica gel material and resin material obtained by mold injection and extrusion molding.

10. An optical module, comprising: The optical module is processed by the processing method according to any one of claims 1-9.

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