Shoe sole capable of temperature regulation

Abstract

Disclosed in the present invention is a shoe sole capable of temperature regulation, the shoe sole comprising: a support member, the support member being provided with an air guide channel; a semiconductor temperature control unit, the semiconductor temperature control unit being arranged inside the support member, the semiconductor temperature control unit having a first temperature control end and a second temperature control end, the first temperature control end of the semiconductor temperature control unit being in contact with an air flow in an accommodating space to generate a first air flow, and the second temperature control end of the semiconductor temperature control unit being in contact with an air flow in the accommodating space to generate a second air flow; and an air flow distribution device, the flow distribution device being arranged in the support member, and the flow distribution device operating to divert the first air flow, which is generated after processing by the first temperature control end of the semiconductor temperature control unit, to the inside of a shoe body, and to divert the second air flow, which is generated after processing by the second temperature control end of the semiconductor temperature control unit, to the outside of the shoe body, thereby allowing the temperature and humidity of air flow inside the shoe body to remain relatively stable, and further improving use experience of users.

Description

Temperature-adjustable shoe sole TECHNICAL FIELD

[0001] The present application relates to the technical field of footwear, in particular to a temperature-adjustable shoe sole. BACKGROUND

[0002] With the improvement of people's living standards, consumers have higher and higher requirements for the wearing comfort of shoes, hats and clothes. For example, for shoes, in addition to the requirement that the shoes are comfortable to wear, consumers also have higher requirements for the dry and breathable performance of the shoes.

[0003] In hot summer, as the outside temperature rises, the temperature in the shoes also rises. If the heat and moisture generated in the shoes cannot be discharged in time, it will bring strong discomfort to the wearer and also easily lead to a series of foot diseases. Although some shoes are provided with a breathable mesh on the vamp to make the shoes more breathable, such shoes have low ventilation efficiency and poor heat dissipation and moisture removal effect, and cannot keep the air in the shoe body relatively stable in temperature and humidity to be dry and comfortable. In cold winter, as the outside temperature decreases, the temperature in the shoes also decreases. If the heat lost in the shoes cannot be replenished in time, it will bring strong discomfort to the wearer and also easily lead to cold feet. Although some shoes are provided with a warm-keeping material in the shoes to make the shoes more warm-keeping, such shoes are also easy to sweat, have low ventilation efficiency and poor heat dissipation and moisture removal effect, and cannot keep the air in the shoe body relatively stable in temperature and humidity to be dry and comfortable.

[0004] Therefore, the present application provides a temperature-adjustable shoe sole which can effectively solve the above problems. SUMMARY

[0005] In order to overcome the shortcomings of the prior art, the present application provides a temperature-adjustable shoe sole which has a simple structure and can effectively keep the air in the shoe body relatively stable in temperature and humidity to be dry and comfortable.

[0006] The technical scheme adopted by the present application to solve the technical problems is:

[0007] The temperature-adjustable shoe sole comprises:

[0008] a support member provided with a containing space and an air guide channel in communication with the containing space;

[0009] a temperature control assembly comprising a semiconductor temperature control unit and an air fluid distribution device; the semiconductor temperature control unit is used to generate a first air fluid and a second air fluid, and the air fluid distribution device is used to distribute the first air fluid to the inside of the shoe body through the air guide channel in communication with the containing space.

[0010] As an improvement of the present application, the semiconductor temperature control unit is arranged in the support accommodating space, the semiconductor temperature control unit has a first temperature control end and a second temperature control end, the first temperature control end of the semiconductor temperature control unit is in fluid contact with the air in the accommodating space, so as to cool or heat the air; the second temperature control end of the semiconductor temperature control unit is in fluid contact with the air in the accommodating space, so as to heat or cool the air.

[0011] As an improvement of the present application, the fluid distribution device is arranged in the support accommodating space, the fluid distribution device works to distribute the first air fluid processed by the first temperature control end of the semiconductor temperature control unit to the inside of the shoe body, and distribute the second air fluid processed by the second temperature control end of the semiconductor temperature control unit to the outside of the shoe body, so as to keep the temperature and humidity of the air in the shoe body relatively stable.

[0012] As an improvement of the present application, the first temperature control end of the semiconductor temperature control unit is directed to the top of the shoe sole, and the second temperature control end is directed to the bottom of the shoe sole, so that the first conduction unit coupled with the first temperature control end is arranged above the second conduction unit coupled with the second temperature control end, so that the first air fluid is kept above the second air fluid during the distribution.

[0013] As an improvement of the present application, the semiconductor temperature control unit is coupled with a first conduction unit and a second conduction unit, the first conduction unit includes a first coupling end coupled with the first temperature control end of the semiconductor temperature control unit, and the second conduction unit includes a second coupling end coupled with the second temperature control end of the semiconductor temperature control unit.

[0014] As an improvement of the present application, the air fluid distribution device includes a first fan for distributing the first air fluid to the inside of the shoe body through the air guide channel, and a second fan for distributing the second air fluid to the outside of the shoe body through the side air outlet.

[0015] As an improvement of the present application, when the power supply of the semiconductor temperature control unit is connected in normal mode, the first temperature control end of the semiconductor temperature control unit is a refrigeration end, and the second temperature control end is a heating end; when the power supply of the semiconductor temperature control unit is connected in reverse mode, the first temperature control end of the semiconductor temperature control unit is a heating end, and the second temperature control end is a refrigeration end.

[0016] As an improvement of the present application, the shoe sole further comprises a supporting insole arranged on the top of the shoe sole and a supporting surface cover, the supporting surface cover is provided with an upper surface air inlet and an upper surface air outlet of the shoe sole, the supporting insole and the supporting surface cover are coupled to form a hollow layer for air circulation, the hollow layer is used for redistributing the first air fluid flowing into the shoe body through the upper surface air outlet after flowing out of the air guide channel, so that the first air fluid is more evenly distributed in the shoe body; the upper surface air inlet (121) is provided with a dustproof screen.

[0017] As an improvement of the present application, the shoe sole further comprises a water-cooling heat dissipation device for assisting heat dissipation or heat removal. The accommodating space comprises a first accommodating space and a second accommodating space; the first accommodating space is used for accommodating the temperature control assembly, and the second accommodating space is used for accommodating the water-cooling heat dissipation device.

[0018] As an improvement of the present application, the supporting member is provided with a side air outlet and a side air inlet, the side air outlet is communicated with the first accommodating space and is used for discharging the second air fluid, the side air inlet is communicated with the first accommodating space and is used for absorbing the air fluid in the environment, and the side air inlet is provided with a dustproof screen.

[0019] As an improvement of the present application, the shoe sole is further provided with a main control circuit board and a power supply; the power supply is detachable.

[0020] As an improvement of the present application, the supporting member is provided with a temperature sensing device, the temperature sensing device is used for detecting the temperature in the accommodating space, the temperature sensing device is controlled by a preset program in the mobile terminal, and the preset program automatically adjusts the power of the temperature control assembly according to the data change fed back by the temperature sensing device.

[0021] As an improvement of the present application, a shoe is provided, which comprises the improved shoe sole of the present application.

[0022] The beneficial effects of the present application are: through the arrangement of the above structure, in use, the first temperature control end of the semiconductor temperature control unit is in contact with the air fluid in the accommodation space to generate a first air fluid; the second temperature control end of the semiconductor temperature control unit is in contact with the air fluid in the accommodation space to generate a second air fluid; the air fluid distribution device is arranged in the support, and the fluid distribution device works to divert the first air fluid treated by the first temperature control end of the semiconductor temperature control unit to the inside of the shoe body and divert the second air fluid treated by the second temperature control end of the semiconductor temperature control unit to the outside of the shoe body, so as to keep the temperature and humidity of the air fluid in the shoe body relatively stable, make the user's feet feel cool / warm and comfortable, and improve the user's use experience. In addition, the thermal inertia of the semiconductor temperature control unit is very small, the refrigeration and heating time is very fast, refrigeration by the semiconductor temperature control unit does not require refrigerant, is pollution-free, safe to use, has low noise, and has long service life. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. The drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings. In addition, the drawings are not drawn in a 1:1 ratio, and the relative sizes of the various elements are only exemplarily drawn in the drawings, but not necessarily drawn in true proportions.

[0024] The present application will be further described below in combination with the drawings and embodiments.

[0025] Fig. 1 is a schematic view of the overall structure of the shoe sole at one angle according to the present application;

[0026] Fig. 2 is a schematic view of the exploded structure of the shoe sole at one angle according to the present application;

[0027] Fig. 3 is a schematic view of the air fluid circulation of the shoe sole at the first angle according to the present application;

[0028] Fig. 4 is a schematic view of the air fluid circulation of the shoe sole at the second angle according to the present application;

[0029] Fig. 5 is a schematic view of the air fluid circulation of the shoe sole at the third angle according to the present application;

[0030] Fig. 6 is a schematic view of the air fluid circulation of the shoe sole at the fourth angle according to the present application;

[0031] Fig. 7 is a schematic view of the air fluid circulation of the shoe sole at the fifth angle according to the present application;

[0032] Fig. 8 is a schematic view of the air fluid circulation of the shoe at one angle according to the present application; DETAILED DESCRIPTION

[0033] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described herein and by one of ordinary skill in the art without departing from the spirit and scope of the present application, and it is therefore intended that all such variations be considered as falling within the scope of the present application. It should be understood that the use of the terms "include", "comprise" or "have" in the description herein specify the presence of the stated features, integers, steps, components, elements or the like, but do not preclude the presence or addition of one or more other features, integers, steps, components, elements or the like.

[0034] In the description of the present application, it should be understood that, if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0035] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0036] In the present application, unless otherwise specifically defined and limited, if the terms "mount", "connect", "connect", "fix" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship of two elements, unless otherwise specifically limited. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] In the present application, unless otherwise explicitly specified and limited, if there is a description such as "on" or "under" or the like between a first feature and a second feature, it can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0038] It should be noted that if an element is referred to as "fixed to" or "provided on" another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for illustrative purposes and do not represent the only implementation.

[0039] Referring to FIGS. 1-8, a temperature-adjustable sole includes:

[0040] A support 150 is provided with a receiving space 151 and an air guide channel 152 in communication with the receiving space 151;

[0041] A temperature control assembly 140 includes a semiconductor temperature control unit 141 and an air fluid distribution device 142; the semiconductor temperature control unit 141 is used to generate a first air fluid and a second air fluid, and the air fluid distribution device 142 is used to distribute the first air fluid to the inside of the shoe body through the air guide channel 152 in communication with the receiving space 151.

[0042] Through the above structure, in use, the first temperature control end 1411 of the semiconductor temperature control unit 141 is in contact with the air fluid in the receiving space, generating a first air fluid; the second temperature control end 1412 of the semiconductor temperature control unit 141 is in contact with the air fluid in the receiving space, generating a second air fluid; the air fluid distribution device 142 is provided in the support 150, and the air fluid distribution device 142 works to distribute the first air fluid treated by the first temperature control end 1411 of the semiconductor temperature control unit 141 to the inside of the shoe body, and to distribute the second air fluid treated by the second temperature control end 1412 of the semiconductor temperature control unit 141 to the outside of the shoe body, thereby keeping the temperature and humidity of the air fluid in the shoe body relatively stable and improving the user's experience.

[0043] In the embodiment, the semiconductor temperature control unit 141 is arranged in the accommodating space 151 of the support 150, the semiconductor temperature control unit 141 has a first temperature control end 1411 and a second temperature control end 1412, the first temperature control end 1411 of the semiconductor temperature control unit 141 is in fluid contact with the air in the accommodating space, so as to cool or heat the air; the second temperature control end 1412 of the semiconductor temperature control unit 141 is in fluid contact with the air in the accommodating space 151, so as to heat or cool the air. Through the above structure, when the power of the semiconductor temperature control unit is connected in normal, the first temperature control end 1411 of the semiconductor temperature control unit 141 is in fluid contact with the air in the accommodating space, so as to cool the air, and the obtained first air is cold air; the second temperature control end 1412 of the semiconductor temperature control unit 141 is in fluid contact with the air in the accommodating space 151, so as to heat the air, and the obtained second air is hot air; when the power of the semiconductor temperature control unit 141 is connected reversely, the first temperature control end 1411 of the semiconductor temperature control unit 141 is in fluid contact with the air in the accommodating space, so as to heat the air, and the obtained first air is hot air; the second temperature control end 1412 of the semiconductor temperature control unit 141 is in fluid contact with the air in the accommodating space 151, so as to cool the air, and the obtained second air is cold air. The user can freely switch the power connection or reverse connection according to his own needs, so as to keep the temperature and humidity of the air in the shoe body relatively stable, make the user's feet feel cool / warm and comfortable, and further improve the user's experience.

[0044] In the embodiment, the fluid distribution device is arranged in the accommodating space 151 of the support 150, and the fluid distribution device works to distribute the first air treated by the first temperature control end 1411 of the semiconductor temperature control unit 141 to the inside of the shoe body, and distribute the second air treated by the second temperature control end 1412 of the semiconductor temperature control unit 141 to the outside of the shoe body, so as to keep the temperature and humidity of the air in the shoe body relatively stable. Through the above structure, in use, the first air treated by the first temperature control end 1411 of the semiconductor temperature control unit 141 (which may be cold air or hot air, and can be adjusted according to needs) is distributed to the accommodating space 300 in the inside of the shoe body through the air guide channel 152; the second air treated by the second temperature control end 1412 of the semiconductor temperature control unit 141 (which may be hot air or cold air, and is opposite to the first air in temperature) is distributed to the outside of the shoe body, so as to keep the temperature and humidity of the air in the shoe body relatively stable, make the user's feet feel cool / warm and comfortable, and further improve the user's experience.

[0045] In this embodiment, the first temperature control end 1411 of the semiconductor temperature control unit 141 is directed to the top of the shoe sole, and the second temperature control end 1412 is directed to the bottom of the shoe sole, so that the first conduction unit 143 coupled with the first temperature control end 1411 of the semiconductor temperature control unit 141 is arranged above the second conduction unit 144 coupled with the second temperature control end 1412 of the semiconductor temperature control unit 141, so that the first air fluid and the second air fluid are separated, and the first air fluid is kept above the second air fluid. Through the arrangement of the above structure, in use, the first temperature control end 1411 of the semiconductor temperature control unit 141 is directed to the top of the shoe sole, and the second temperature control end 1412 is directed to the bottom of the shoe sole, so that the first conduction unit 143 coupled with the first temperature control end 1411 of the semiconductor temperature control unit 141 is arranged above the second conduction unit 144 coupled with the second temperature control end 1412 of the semiconductor temperature control unit 141, so that the first air fluid and the second air fluid are separated, and the first air fluid is kept below the second air fluid, so that in the process of the fluid distribution device working to separate the first air fluid generated through the first temperature control end 1411 of the semiconductor temperature control unit 141 to the inside of the shoe body and the second air fluid generated through the second temperature control end 1412 of the semiconductor temperature control unit 141 to the outside of the shoe body, an isolation layer of the first air fluid is formed, so that the temperature and humidity of the air fluid in the shoe body are relatively stable, the user's feet feel cool / warm and comfortable, and the user's use experience is further improved.

[0046] In the embodiment, the semiconductor temperature control unit 141 is coupled with a first conduction unit 143 and a second conduction unit 144. The first conduction unit 143 includes a first coupling end coupled with the first temperature control end 1411 of the semiconductor temperature control unit 141. The second conduction unit 144 includes a second coupling end coupled with the second temperature control end 1412 of the semiconductor temperature control unit 141. Through the above structure, when the power supply of the semiconductor temperature control unit 141 is connected in normal mode, the first coupling end of the first conduction unit 143 coupled with the first temperature control end 1411 of the semiconductor temperature control unit 141 rapidly absorbs heat from the first temperature control end 1411, and through heat conduction, the part of the first conduction unit 143 in contact with the air fluid rapidly cools down, absorbs heat from the air fluid, so that the efficiency of the semiconductor temperature control unit 141 in cooling the air fluid is improved. The second coupling end coupled with the second temperature control end 1412 of the semiconductor temperature control unit 141 rapidly absorbs heat emitted from the second temperature control end 1412, and through heat conduction, forms hot air fluid, and through the air fluid distribution device 142, the hot air fluid is distributed to the outside of the shoe body, so that the temperature and humidity of the air fluid in the shoe body are relatively stable, the user's feet feel cool / warm and comfortable, and the user's experience is further improved. When the power supply of the semiconductor temperature control unit 141 is connected in reverse mode, the process is similar, except that the first conduction unit 143 changes from cooling to heating, and the second conduction unit 144 changes from heating to cooling.

[0047] In the embodiment, the air fluid distribution device 142 includes a first fan 1421 for distributing the first air fluid through the air guide channel 152 to the inside of the shoe body, and a second fan 1422 for distributing the second air fluid through the side air outlet to the outside of the shoe body. Through the above structure, in use, the first fan 1421 distributes the first air fluid formed by the first temperature control end 1411 of the semiconductor temperature control unit 141 to the inside of the shoe body, and the second fan 1422 distributes the second air fluid formed by the second temperature control end 1412 of the semiconductor temperature control unit 141 to the outside of the shoe body, so that the temperature and humidity of the air fluid in the shoe body are relatively stable, the user's feet feel cool / warm and comfortable, and the user's experience is further improved.

[0048] In this embodiment, when the power supply of the semiconductor temperature control unit 141 is connected in normal, the first temperature control end 1411 of the semiconductor temperature control unit 141 is the refrigeration end, and the second temperature control end 1412 is the heating end; when the power supply of the semiconductor temperature control unit 141 is connected in reverse, the first temperature control end 1411 of the semiconductor temperature control unit 141 is the heating end, and the second temperature control end 1412 is the refrigeration end. Through the above structure, the first temperature control end 1411 of the semiconductor temperature control unit 141 can be switched to refrigeration or heating according to the needs during use, so that the first air flow flowing into the shoe body accommodating space 300 can be cold air flow or hot air flow, thereby better maintaining the relative stability of the temperature and humidity of the air flow in the shoe body, making the user's feet feel cool / warm and comfortable, and further improving the user's experience.

[0049] In this embodiment, the shoe sole further comprises a support insole 110 and a support cover 120 arranged on the top of the shoe sole, the support cover 120 is provided with an upper surface air inlet 121 and an upper surface air outlet 122 of the shoe sole, and the insole 110 and the support cover 120 are coupled to form a hollow layer for air circulation. The hollow layer is used to redistribute the first air flow flowing into the shoe body interior through the upper surface air outlet 122 after flowing out of the air guide channel 152, so that the first air flow is more evenly distributed in the shoe body interior. The upper surface air inlet 121 is provided with a dust screen. Through the above structure, the support insole 110 and the support cover 120 arranged on the top of the shoe sole are coupled to form a hollow layer for air circulation, and the first air flow flowing into the shoe body interior from the air guide channel 152 passes through the hollow layer for air circulation and flows into the shoe body interior through the small holes on the support insole 110, thereby better maintaining the relative stability of the temperature and humidity of the air flow in the shoe body, making the user's feet feel cool / warm and comfortable, and improving the user's experience. The upper surface air inlet 121 is provided with a dust screen, which can prevent impurities such as sand from entering the circulating channel of the air flow, ensure the smoothness of the circulating channel of the air flow, and further improve the user's experience.

[0050] In this embodiment, the shoe sole further comprises a water-cooled heat dissipation device 130 for auxiliary heat dissipation. Through the above structure, the water-cooled heat dissipation device 130 arranged on the shoe sole is used to assist the second conduction unit in heat dissipation or heat dissipation, thereby improving the heat dissipation or heat dissipation efficiency, better maintaining the relative stability of the temperature and humidity of the air flow in the shoe body, and further improving the user's experience.

[0051] In the embodiment, the accommodation space includes a first accommodation space 1511 and a second accommodation space 1512; the first accommodation space 1511 is used to accommodate the temperature control assembly 140, and the second accommodation space 1512 is used to accommodate the water-cooled heat dissipation device 130. Through the arrangement of the above structure, in use, the temperature control assembly 140 arranged in the first accommodation space 1511 cooperates with the water-cooled heat dissipation device 130 arranged in the second accommodation space 1512, further improves the temperature control efficiency, and thus better keeps the temperature and humidity of the air fluid in the shoe body relatively stable, makes the user's feet feel cooler and more comfortable, and further improves the user's experience.

[0052] In the embodiment, the support 150 is provided with a side air outlet 153 and a side air inlet 154; the side air outlet 153 is in communication with the first accommodation space 1511 and is used to discharge the second air fluid; the side air inlet 154 is in communication with the first accommodation space 1511 and is used to absorb the air fluid in the environment; and the side air inlet 154 is provided with a dust screen. Through the arrangement of the above structure, in use, the second air fluid that is not needed is discharged into the air through the side air outlet 153, and the air fluid in the environment is sucked in through the side air inlet 154, so as to improve the heat dissipation efficiency or cooling efficiency of the second conduction unit 144, thus better keeping the temperature and humidity of the air fluid in the shoe body relatively stable, making the user's feet feel cooler and more comfortable, and further improving the user's experience. The side air inlet 154 is provided with a dust screen, which can prevent impurities such as sand from entering the circulating channel of the air fluid, ensure the smoothness of the circulating channel of the air fluid, and further improve the user's experience.

[0053] In the embodiment, the shoe body is further provided with a main control circuit board 145 and a power supply 146; and the power supply 146 is detachable. Through the arrangement of the above structure, in use, the main control circuit board 145 and the power supply 146 are installed in the accommodation space 151 of the support 150; the power supply 146 is electrically connected with the temperature control assembly 140 through the main control circuit board 145 and provides electric energy for the temperature control assembly 140; the temperature control assembly 140 converts the electric energy into mechanical energy for rotating the first fan 1421 and the second fan 1422, adjusts the distribution of the air fluid in the shoe, achieves good ventilation, perspiration and cooling effects, and further improves the user's experience. The power supply 146 can be selected as a lithium battery with high energy density, so as to reduce the user's charging frequency and reduce the weight of the battery, and further improve the user's experience. The power supply 146 is detachable, so that the user can carry a spare power supply, replace the power supply 146 with low power at any time, and conveniently connect the power supply with low power to the power supply, without having to charge the shoe, and thus further improves the user's experience.

[0054] In this embodiment, the support 150 is provided with a temperature sensing device for detecting the temperature in the accommodation space 300, which is controlled by a preset program in the mobile terminal. The preset program automatically adjusts the power of the semiconductor temperature control unit 141 according to the data changes fed back by the temperature sensing device. The preset program controls the temperature of the air fluid in the shoe accommodation space 300 by the following steps:

[0055] Step one: the user enters the control applet and selects the cooling mode or heating mode;

[0056] Step two: after selecting the mode, the user sets the target temperature X through the applet;

[0057] Step three: the temperature sensing device detects the temperature of the air fluid in the shoe accommodation space;

[0058] If the cooling mode is selected, the following steps are continued to be executed:

[0059] Step four: when the temperature of the air fluid in the shoe accommodation space 300 is less than X+1 degrees, the semiconductor temperature control unit 141 automatically opens a power adjustment to regulate the temperature of the air fluid in the shoe accommodation space 300; when the temperature of the air fluid in the shoe accommodation space 300 is greater than or equal to X+1 degrees and less than X+3 degrees, the semiconductor temperature control unit 141 automatically opens a five-power adjustment to regulate the temperature of the air fluid in the shoe accommodation space 300; when the temperature of the air fluid in the shoe accommodation space 300 is greater than or equal to X+3 degrees, the semiconductor temperature control unit 141 automatically opens a ten-power adjustment to regulate the temperature of the air fluid in the shoe accommodation space 300. When the temperature of the air fluid in the shoe accommodation space 300 is less than X-2 degrees, the semiconductor temperature control unit 141 is closed.

[0060] Step five: the temperature sensing device continuously detects the temperature of the air fluid in the shoe accommodation space and feeds back the detected temperature data to the preset program, and the preset program cyclically executes step four.

[0061] If the heating mode is selected, the following steps are continued to be executed:

[0062] Step six: when the temperature of the air fluid in the shoe containing space 300 is less than X-1 degree, the semiconductor temperature control unit 141 automatically opens a gear to adjust the temperature of the air fluid in the shoe containing space 300; when the temperature of the air fluid in the shoe containing space 300 is greater than or equal to X-3 degree and less than X-1 degree, the semiconductor temperature control unit 141 automatically opens a gear to adjust the temperature of the air fluid in the shoe containing space 300; when the temperature of the air fluid in the shoe containing space 300 is less than or equal to X-3 degree, the semiconductor temperature control unit 141 automatically opens a gear to adjust the temperature of the air fluid in the shoe containing space 300. When the temperature of the air fluid in the shoe containing space 300 is greater than X+2 degree, the semiconductor temperature control unit 141 is closed.

[0063] Step seven: the temperature sensing device continuously detects the temperature of the air fluid in the shoe containing space and feeds the detected temperature data to the preset program, and the preset program cyclically executes step six.

[0064] In this embodiment, a shoe is provided, which comprises the shoe sole described in the present application.

[0065] The above is one or more embodiments provided in combination with specific content, and it is not intended that the specific implementation of the present application is limited to these descriptions. Any approximation, similarity, or replacement based on the concept of the present application should be considered as the protection scope of the present application.

Claims

1. A temperature-adjustable sole, characterized by, The application relates to a temperature control assembly for a shoe body, comprising: a support (150) provided with a containing space (151) and an air guide channel (152) in communication with the containing space (151); a temperature control assembly (140) comprising a semiconductor temperature control unit (141) and an air fluid distribution device (142); the semiconductor temperature control unit (141) is used for manufacturing first air fluid and second air fluid, and the air fluid distribution device (142) is used for distributing the first air fluid to the inside of the shoe body through the air guide channel (152) in communication with the containing space (151).

2. The temperature adjustable sole of claim 1, wherein, The semiconductor temperature control unit (141) is arranged in the containing space (151) of the support (150), the semiconductor temperature control unit (141) has a first temperature control end (1411) and a second temperature control end (1412), the first temperature control end (1411) of the semiconductor temperature control unit (141) is in contact with air fluid in the containing space, so that the air fluid is cooled or heated; the second temperature control end (1412) of the semiconductor temperature control unit (141) is in contact with air fluid in the containing space (151), so that the air fluid is heated or cooled.

3. A temperature adjustable sole according to claim 2, wherein, The fluid distribution device is arranged in the containing space (151) of the support (150), and the fluid distribution device works to distribute the first air fluid treated by the first temperature control end (1411) of the semiconductor temperature control unit (141) to the inside of the shoe body and distribute the second air fluid treated by the second temperature control end (1412) of the semiconductor temperature control unit (141) to the outside of the shoe body, so that the temperature and humidity of the air fluid in the inside of the shoe body are relatively stable.

4. A temperature adjustable sole according to claim 3, characterized in that The first temperature control end (1411) of the semiconductor temperature control unit (141) faces the top of the shoe sole, and the second temperature control end (1412) faces the bottom of the shoe sole, so that the first conduction unit (143) coupled with the first temperature control end (1411) is arranged above the second conduction unit (144) coupled with the second temperature control end (1412), and the first air fluid is kept above the second air fluid during distribution.

5. A temperature adjustable sole according to claim 4, characterized in that The semiconductor temperature control unit (141) is coupled with the first conduction unit (143) and the second conduction unit (144), the first conduction unit (143) comprises a first coupling end coupled with the first temperature control end (1411) of the semiconductor temperature control unit (141), and the second conduction unit (144) comprises a second coupling end coupled with the second temperature control end (1412) of the semiconductor temperature control unit (141).

6. The temperature adjustable sole of claim 4, wherein, The air fluid distribution device (142) comprises a first fan (1421) for distributing the first air fluid to the inside of the shoe body through the air guide channel (152) and a second fan (1422) for distributing the second air fluid to the outside of the shoe body through a side air outlet (153).

7. The temperature adjustable sole of claim 4, wherein, When the power supply of the semiconductor temperature control unit (141) is connected in normal, the first temperature control end (1411) of the semiconductor temperature control unit (141) is the refrigeration end, and the second temperature control end (1412) is the heating end; when the power supply of the semiconductor temperature control unit (141) is connected in reverse, the first temperature control end (1411) of the semiconductor temperature control unit (141) is the heating end, and the second temperature control end (1412) is the refrigeration end.

8. The temperature adjustable sole of claim 4, wherein, The shoe sole further comprises a support shoe pad (110) arranged on the top of the shoe sole and a support cover (120), wherein the support cover (120) is provided with an upper surface air inlet (121) and an upper surface air outlet (122) of the shoe sole, the support shoe pad (110) and the support cover (120) are coupled to form a hollow layer for air circulation, and the hollow layer is used for redistributing the first air fluid flowing into the shoe body through the upper surface air outlet (122) after flowing out of the air guide channel (152), so that the first air fluid is more evenly distributed in the shoe body; and the upper surface air inlet (121) is provided with a dustproof screen.

9. The temperature adjustable sole of claim 1, wherein, The shoe sole further comprises a water-cooling heat dissipation device (130) for assisting heat dissipation or heat release; the accommodating space comprises a first accommodating space (1511) and a second accommodating space (1512); the first accommodating space (1511) is used for accommodating the temperature control assembly (140), and the second accommodating space (1512) is used for accommodating the water-cooling heat dissipation device (130).

10. A temperature adjustable sole according to claim 9, characterized in that The support (150) is provided with a side air outlet (153) and a side air inlet (154), the side air outlet (153) is communicated with the first accommodating space (1511) and is used for discharging the second air fluid, and the side air inlet (154) is communicated with the first accommodating space (1511) and is used for absorbing the air fluid in the environment; and the side air inlet (154) is provided with a dustproof screen.

11. The temperature adjustable sole of claim 1, wherein, The shoe sole is further provided with a main control circuit board (145) and a power supply (146); and the power supply (146) is detachable.

12. The temperature adjustable sole of claim 1, wherein, The support (150) is provided with a temperature sensing device, the temperature sensing device is used for detecting the temperature in the accommodating space (300), and the temperature sensing device is controlled by a preset program in the mobile terminal, the preset program automatically adjusts the power of the temperature control assembly (140) according to the data change fed back by the temperature sensing device.

13. A shoe, characterized by The shoe sole comprises the shoe sole according to any one of claims 1-12. The shoe sole comprises the shoe sole according to any one of claims 1-12.

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