Dimming assembly and preparation method therefor, and vehicle

Abstract

The present application relates to a dimming assembly and a preparation method therefor, and a vehicle. The dimming assembly comprises a first transparent substrate, a first adhesive layer, a dimming layer, a second adhesive layer and a second transparent substrate, which are stacked in sequence, wherein the first adhesive layer, the dimming layer and the second adhesive layer are all retracted relative to the first transparent substrate and the second transparent substrate. The dimming assembly further comprises a sealant layer, wherein the sealant layer is arranged in at least part of a retracted region and is in contact with the first transparent substrate and the second transparent substrate, the side edge of the sealant layer does not extend beyond those of the first transparent substrate and the second transparent substrate, and the width of the sealant layer is greater than or equal to 1 mm.

Description

Light modulation assembly, preparation method thereof and vehicle

[0001] Related applications

[0002] The present application claims priority to the Chinese Patent Application No. 2024110814014, filed on August 8, 2024, and entitled "Light modulation assembly, preparation method thereof and vehicle", the contents of which are hereby incorporated by reference in its entirety.

[0003] The present application claims priority to the Chinese Patent Application No. 2024219069370, filed on August 8, 2024, and entitled "Light modulation assembly and vehicle", the contents of which are hereby incorporated by reference in its entirety. TECHNICAL FIELD

[0004] The present application relates to the field of light modulation, and in particular, to a light modulation assembly, a preparation method thereof and a vehicle. BACKGROUND

[0005] A conventional light modulation assembly includes a first transparent substrate, a first adhesive layer, a light modulation layer, a second adhesive layer and a second transparent substrate which are sequentially stacked, however, the conventional light modulation assembly has poor water vapor blocking ability when the distance between the edge of the light modulation layer and the edge of the transparent substrate is small. SUMMARY

[0006] According to various embodiments of the present application, a light modulation assembly is provided.

[0007] In addition, some other embodiments of the present application further provide a preparation method of the light modulation assembly and a vehicle.

[0008] A light modulation assembly includes:

[0009] a first transparent substrate;

[0010] a first adhesive layer disposed on a surface of the first transparent substrate;

[0011] a light modulation layer disposed on a surface of the first adhesive layer away from the first transparent substrate;

[0012] a second adhesive layer disposed on a surface of the light modulation layer away from the first transparent substrate;

[0013] a second transparent substrate disposed on a surface of the second adhesive layer away from the first transparent substrate;

[0014] wherein the first bonding layer, the light control layer, and the second bonding layer are all recessed with respect to the first transparent substrate and the second transparent substrate, the light control assembly further comprises a sealant layer, the sealant layer is disposed in at least a portion of the recessed area and contacts the first transparent substrate and the second transparent substrate, a side edge of the sealant layer does not exceed a side edge of the first transparent substrate and the second transparent substrate, and a width of the sealant layer is greater than or equal to about 1 mm.

[0015] In some embodiments, the width of the sealant layer is about 1 mm to about 20 mm.

[0016] In some embodiments, the width of the sealant layer is about 1 mm to about 15 mm.

[0017] In some embodiments, the width of the sealant layer is about 1 mm to about 10 mm.

[0018] In some embodiments, the first bonding layer, the light control layer, and the second bonding layer are flush or the light control layer is recessed with respect to the first bonding layer and the second bonding layer by a distance less than or equal to about 5 mm, and a side edge of the sealant layer contacts the first bonding layer and the second bonding layer.

[0019] In some embodiments, the width of the sealant layer is greater than or equal to about 3 mm.

[0020] In some embodiments, the width of the sealant layer is about 3 mm to about 10 mm.

[0021] In some embodiments, the light control layer is recessed with respect to the first bonding layer and the second bonding layer by a distance greater than about 5 mm, a third bonding layer is further provided between the first bonding layer and the second bonding layer, the third bonding layer contacts a side edge of the light control layer, and the sealant layer contacts the first bonding layer, the second bonding layer, and the third bonding layer.

[0022] In some embodiments, the third bonding layer is flush with the first bonding layer and the second bonding layer; or,

[0023] the third bonding layer is recessed with respect to the first bonding layer and the second bonding layer, and the width of the sealant layer increases from the first bonding layer to the third bonding layer and from the second bonding layer to the third bonding layer.

[0024] In some embodiments, the maximum width of the sealant layer is about 1 mm to about 5 mm.

[0025] In some embodiments, the water vapor transmission rate of the sealant layer is less than or equal to about 10-3 g / m 2 ·d.

[0026] In some embodiments, the sealant layer comprises one or more of a polyurethane sealant layer, a butyl sealant layer, and a POE sealant layer.

[0027] In some embodiments, the sealant layer comprises one or both of a butyl sealant layer and a POE sealant layer.

[0028] In some embodiments, a surface activation layer is further provided on the side surface of the sealant layer facing the first transparent substrate and the second transparent substrate, and the side surface of the sealant layer facing the first adhesive layer, the second adhesive layer, and the light modulation layer.

[0029] In some embodiments, each of the first adhesive layer and the second adhesive layer independently comprises one of a PVB adhesive layer and an EVA adhesive layer.

[0030] A method for preparing a light modulation assembly, comprising the following steps:

[0031] obtaining a stack, the stack comprising a first transparent substrate, a first adhesive layer, a light modulation layer, a second adhesive layer, and a second transparent substrate arranged in sequence;

[0032] causing the light modulation layer, the first adhesive layer, and the second adhesive layer in the stack to be inwardly retracted relative to the first transparent substrate and the second transparent substrate;

[0033] providing a sealant layer between the first transparent substrate and the second transparent substrate of the stack, the sealant layer filling at least part of the inwardly retracted region and contacting the first transparent substrate and the second transparent substrate, a side edge of the sealant layer not exceeding a side edge of the first transparent substrate and the second transparent substrate, a width of the sealant layer being greater than or equal to about 1 mm, to obtain a light modulation assembly.

[0034] In some embodiments, the width of the sealant layer is about 1 mm to about 20 mm.

[0035] In some embodiments, the width of the sealant layer is about 1 mm to about 15 mm.

[0036] In some embodiments, the width of the sealant layer is about 1 mm to about 10 mm.

[0037] In some embodiments, the step of inwardly retracting the light modulating layer, the first adhesive layer, and the second adhesive layer in the stack relative to the first and second transparent substrates includes inwardly retracting the light modulating layer relative to the first and second adhesive layers by a distance of less than or equal to about 5 mm;

[0038] The step of providing a sealant layer between the first and second transparent substrates of the stack, such that the sealant layer fills at least a portion of the inwardly retracted area, includes:

[0039] The step of providing a hole-containing support between the first and second transparent substrates, such that the hole-containing support is in contact with the side edges of the first and second adhesive layers;

[0040] The step of providing a hole-containing support between the first and second transparent substrates, such that the hole-containing support is in contact with the side edges of the first and second adhesive layers;

[0041] The step of providing a hole-containing support between the first and second transparent substrates, such that the hole-containing support is in contact with the side edges of the first and second adhesive layers;

[0042] In some embodiments, the sealant layer has a width of greater than or equal to about 3 mm.

[0043] In some embodiments, the sealant layer has a width of about 3 mm to about 10 mm.

[0044] In some embodiments, the step of inwardly retracting the light modulating layer, the first adhesive layer, and the second adhesive layer in the stack relative to the first and second transparent substrates includes inwardly retracting the light modulating layer relative to the first and second adhesive layers by a distance of greater than about 5 mm;

[0045] The step of providing a sealant layer between the first and second transparent substrates of the stack, such that the sealant layer fills at least a portion of the inwardly retracted area, includes:

[0046] The step of providing a third adhesive layer between the first and second adhesive layers, such that the third adhesive layer is flush with the side edges of the first and second adhesive layers;

[0047] The step of providing a hole-containing support between the first and second transparent substrates, such that the hole-containing support is in contact with the side edges of the first, second, and third adhesive layers, to obtain a stack;

[0048] The step of providing a hole-containing support between the first and second transparent substrates, such that the hole-containing support is in contact with the side edges of the first, second, and third adhesive layers, to obtain a stack;

[0049] After the pressing is completed, the hole-containing support is removed, and the sealant layer is filled in the area where the hole-containing support is located.

[0050] In some embodiments, the preparation method comprises:

[0051] The laminated piece is obtained, the first adhesive layer, the second adhesive layer in the laminated piece are flush with the first transparent substrate and the second transparent substrate, and the light modulation layer is recessed relative to the first adhesive layer and the second adhesive layer;

[0052] A third adhesive layer is arranged between the first adhesive layer and the second adhesive layer, the third adhesive layer contacts the side edge of the light modulation layer, and is flush with the first adhesive layer and the second adhesive layer;

[0053] The laminated piece provided with the third adhesive layer is pressed;

[0054] After the pressing is completed, part of the first adhesive layer, part of the second adhesive layer and part of the third adhesive layer are removed, and the first adhesive layer, the second adhesive layer and the third adhesive layer are all recessed relative to the first transparent substrate and the second transparent substrate;

[0055] The sealant layer is filled in the area where the first adhesive layer, the second adhesive layer and the third adhesive layer are removed, and the light modulation assembly is prepared.

[0056] In some embodiments, in the step of recessing the light modulation layer, the first adhesive layer and the second adhesive layer in the laminated piece relative to the first transparent substrate and the second transparent substrate, the light modulation layer is recessed relative to the first adhesive layer and the second adhesive layer by a distance greater than about 5 mm;

[0057] The step of arranging the sealant layer between the first transparent substrate and the second transparent substrate, so that the sealant layer fills at least part of the recessed area comprises:

[0058] A third adhesive layer is arranged between the first adhesive layer and the second adhesive layer, the third adhesive layer is recessed relative to the first adhesive layer and the second adhesive layer;

[0059] A hole-containing support is arranged between the first transparent substrate and the second transparent substrate, the hole-containing support contacts the side edges of the first adhesive layer, the second adhesive layer and the third adhesive layer;

[0060] The laminated piece provided with the third adhesive layer and the hole-containing support is pressed;

[0061] After the pressing is completed, the hole support is removed, and the sealant layer is filled in the area where the hole support is located.

[0062] In some embodiments, the sealant layer has a maximum width of about 1 mm to about 5 mm.

[0063] In some embodiments, the sealant layer has a water vapor transmission rate of less than or equal to about 10 -3 g / m 2 ·d.

[0064] In some embodiments, the sealant layer includes one or more of a polyurethane sealant layer, a butyl sealant layer, and a POE sealant layer.

[0065] In some embodiments, the sealant layer includes one or both of a butyl sealant layer and a POE sealant layer.

[0066] A vehicle including the light control assembly described above or including the light control assembly prepared by the preparation method described above.

[0067] In a conventional light control assembly, the light control layer is recessed relative to the transparent substrate and the adhesive layer, and a bordering layer is arranged between the side of the light control layer, the first adhesive layer, and the second adhesive layer to protect the light control layer. The bordering layer is usually made of adhesive layer material with a thickness comparable to that of the light control layer. The inventors have found that conventional adhesive layer materials have poor water vapor blocking ability. Increasing the length of the adhesive layer can achieve a certain water vapor blocking effect, but for cases where the distance between the light control layer and the edge of the transparent substrate is small, the water vapor blocking effect is poor.

[0068] Based on this, some embodiments of the present application provide a light control assembly including a first transparent substrate, a second transparent substrate, a first adhesive layer, a light control layer, a second adhesive layer, and a sealant layer. The first adhesive layer, the light control layer, and the second adhesive layer are all recessed relative to the transparent substrate. A sealant layer with a width greater than or equal to about 1 mm is arranged in at least part of the recessed area. The sealant layer can prevent water vapor from eroding the interior of the light control layer, and still has a certain water vapor erosion resistance effect in cases where the distance between the edge of the light control layer and the edge of the transparent substrate is small.

[0069] The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the application will be apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF DRAWINGS

[0070] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the accompanying drawings in the following description only need to be drawn for the embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of the disclosed drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any one of the disclosed applications, the presently described embodiments and / or examples, and the best mode presently understood of these applications.

[0071] Fig. 1 is a schematic structural diagram of a conventional dimming assembly;

[0072] Fig. 2 is a schematic diagram of a dimming assembly according to some embodiments of the present application;

[0073] Fig. 3 is a schematic structural diagram of a dimming assembly according to a first embodiment;

[0074] Fig. 4 is another schematic structural diagram of the dimming assembly according to the first embodiment;

[0075] Fig. 5 is a schematic structural diagram of a dimming assembly according to a second embodiment;

[0076] Fig. 6 is a schematic structural diagram of a dimming assembly according to a third embodiment;

[0077] Fig. 7 is another schematic structural diagram of the dimming assembly according to the third embodiment;

[0078] Fig. 8 is a process flow diagram of a method for manufacturing the dimming assembly according to the first embodiment;

[0079] Fig. 9 is a schematic diagram of the process flow diagram shown in Fig. 8;

[0080] Fig. 10 is a schematic structural diagram of a hole-bearing support used;

[0081] Fig. 11 is a process flow diagram of a method for manufacturing the dimming assembly according to the second embodiment;

[0082] Fig. 12 is a process flow diagram of a method for manufacturing the dimming assembly according to the third embodiment;

[0083] Fig. 13 is a process flow diagram of a method for manufacturing the dimming assembly according to a fourth embodiment.

[0084] Reference signs: In FIG. 1, a conventional light control assembly 100, a first transparent substrate 110, a first adhesive layer 120, a light control layer 130, a second adhesive layer 140, a second transparent substrate 150, a bordering layer 160, a first ink layer 112, and a second ink layer 152; In FIGS. 3 and 4, a light control assembly 200 of a first embodiment, a first transparent substrate 210, a first adhesive layer 220, a light control layer 230, a second adhesive layer 240, a second transparent substrate 250, a sealant layer 260, a surface activation layer 270, a first shielding layer 212, and a second shielding layer 252; In FIG. 5, a light control assembly 300 of a second embodiment, a first transparent substrate 310, a first adhesive layer 320, a light control layer 330, a second adhesive layer 340, a second transparent substrate 350, a third adhesive layer 360, a sealant layer 370, a surface activation layer 380, a first shielding layer 312, and a second shielding layer 352; In FIGS. 6 and 7, a light control assembly 400 of a third embodiment, a first transparent substrate 410, a first adhesive layer 420, a light control layer 430, a second adhesive layer 440, a second transparent substrate 450, a third adhesive layer 460, a sealant layer 470, a surface activation layer 480, a first shielding layer 412, and a second shielding layer 452. DETAILED DESCRIPTION

[0085] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0086] In the present application, "first" and "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features.

[0087] When a numerical range is disclosed in the present application, the above range is considered to be continuous, and includes the minimum value and the maximum value of the range, and each value between the minimum value and the maximum value. Further, when the range is referred to as an integer, each integer between the minimum value and the maximum value of the range is included. In addition, when multiple ranges are provided to describe a feature or a characteristic, the ranges can be combined. In other words, unless otherwise indicated, all ranges disclosed in the present application should be understood to include any and all sub-ranges falling within the range.

[0088] In the present application, the technical features described in an open manner include a closed technical solution consisting of the listed features, and also include an open technical solution including the listed features.

[0089] The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device that includes a list of steps or units is not limited to the listed steps or units, but can optionally further include steps or units not listed, or can optionally further include other steps or components inherent to such processes, methods, products or devices.

[0090] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor does it necessarily refer to a separate or alternative embodiment in isolation or in combination with other embodiments. It is expressly understood that the embodiments described in this application can be combined with each other.

[0091] In a conventional light control assembly, the light control layer is recessed relative to the transparent substrate and the adhesive layer, and a trimming layer is arranged between the side of the light control layer, the first adhesive layer and the second adhesive layer, and the trimming layer is usually made of adhesive layer material with a thickness comparable to that of the light control layer. For example, referring to FIG. 1, a conventional light control assembly 100 includes a first transparent substrate 110, a first adhesive layer 120, a light control layer 130, a second adhesive layer 140 and a second transparent substrate 150 arranged in sequence, and a trimming layer 160 is arranged between the first adhesive layer 120 and the second adhesive layer 140. A first ink layer 112 is further arranged on the side of the first transparent substrate 110 away from the second transparent substrate 150, and a second ink layer 152 is further arranged on the side of the second transparent substrate 150 facing the first transparent substrate 110. The materials of the first adhesive layer 120, the second adhesive layer 140 and the trimming layer 160 are usually polyvinyl butyral (PVB), ethylene-vinyl acetate copolymer (EVA) or the like, which has poor water vapor barrier capability and is suitable for cases where the edge of the light control layer is far away from the edge of the transparent substrate (usually more than 30 mm). By increasing the length of the adhesive layer, a certain water vapor barrier effect can be achieved, for example, for sunroof glass, the printing area is large, the edge of the light control layer is far away from the edge of the glass substrate, and the conventional light control assembly can achieve the water vapor barrier effect. However, for cases where the edge of the light control layer is close to the edge of the glass substrate, for example, door and window glass, the ink-free printing area or the small ink printing area, the edge of the light control layer is close to the edge of the glass substrate, and the use of conventional adhesive layers such as PVB, EVA or the like cannot meet the water vapor or water oxygen barrier requirements of light control layers such as EC, SPD or nano light control LV, which are sensitive to water vapor or water oxygen, and are easily eroded by water vapor or water oxygen, causing edge degradation and even loss of function.

[0092] Therefore, the present application provides a light control assembly and a preparation method thereof, which can improve the water vapor barrier capability.

[0093] In a first aspect, the present application provides a light control assembly, comprising:

[0094] a first transparent substrate;

[0095] a first adhesive layer disposed on a surface of the first transparent substrate;

[0096] a light control layer disposed on a surface of the first adhesive layer distal to the first transparent substrate;

[0097] a second adhesive layer disposed on a surface of the light control layer distal to the first transparent substrate;

[0098] a second transparent substrate disposed on a surface of the second adhesive layer distal to the first transparent substrate;

[0099] wherein the first adhesive layer, the light control layer, and the second adhesive layer are each recessed with respect to the first transparent substrate and the second transparent substrate, and the light control assembly further comprises a sealant layer disposed in at least a portion of the recessed region and contacting the first transparent substrate and the second transparent substrate, a lateral edge of the sealant layer does not exceed a lateral edge of the first transparent substrate and the second transparent substrate, and a width of the sealant layer is greater than or equal to 1 mm.

[0100] The light control assembly described above comprises a first transparent substrate, a second transparent substrate, a first adhesive layer, a light control layer, a second adhesive layer, and a sealant layer, the first adhesive layer, the light control layer, and the second adhesive layer are each recessed with respect to the transparent substrates, and a sealant layer with a width greater than or equal to 1 mm is disposed in at least a portion of the recessed region, the sealant layer can prevent water vapor from eroding the interior of the light control layer, and still has a certain water vapor erosion resistance effect in the case where the edge of the light control layer is relatively small from the edge of the transparent substrate.

[0101] In this document, contact includes direct contact and indirect contact, for example, the sealant layer contacting the first transparent substrate includes the sealant layer directly contacting the first transparent substrate without other structures therebetween, and also includes the case where the sealant layer and the first transparent substrate contact each other through the provision of one or more other structures therebetween, such as the surface activation layer mentioned below. The contact between the other two layers has a similar meaning and is not described again.

[0102] In some embodiments, the first transparent substrate and the second transparent substrate are each independently selected from one of glass and a polycarbonate plate (PC). In some of these embodiments, a surface of the first transparent substrate distal to the second transparent substrate is an incident surface, i.e., the first transparent substrate is directed toward a surface directly irradiated by sunlight.

[0103] In some embodiments, a first shielding layer is provided on at least one surface of the first transparent substrate, the edge of the first shielding layer is flush with the edge of the first transparent substrate, and the width of the first shielding layer is less than or equal to 30 mm. Optionally, the width of the first shielding layer is 10 mm to 30 mm.

[0104] In some of the embodiments, there are two first shielding layers, and the two first shielding layers are spaced apart and symmetrically arranged at two ends of the first transparent substrate.

[0105] In one of the embodiments, the first shielding layer is arranged on the surface of the first transparent substrate facing the second transparent substrate. It can be understood that in another embodiment, the first shielding layer can also be arranged on the surface of the first transparent substrate away from the second transparent substrate, or the first shielding layer is arranged on the surface of the first transparent substrate facing and away from the second transparent substrate.

[0106] In one of the embodiments, the first shielding layer is an opaque layer relative to the first transparent substrate. For example, the first shielding layer can be but is not limited to an ink layer.

[0107] In some embodiments, a second shielding layer is provided on at least one surface of the second transparent substrate, the edge of the second shielding layer is flush with the edge of the second transparent substrate, and the width of the second shielding layer is less than or equal to 30 mm. Optionally, the width of the second shielding layer is 10 mm to 30 mm.

[0108] In some of the embodiments, there are two second shielding layers, and the two second shielding layers are spaced apart and symmetrically arranged at two ends of the first transparent substrate.

[0109] In one of the embodiments, the second shielding layer is arranged on the surface of the second transparent substrate facing the first transparent substrate. It can be understood that in another embodiment, the second shielding layer can also be arranged on the surface of the second transparent substrate away from the first transparent substrate, or the second shielding layer is arranged on the surface of the second transparent substrate facing and away from the first transparent substrate.

[0110] In one of the embodiments, the second shielding layer is an opaque layer relative to the second transparent substrate. For example, the second shielding layer can be but is not limited to an ink layer.

[0111] It can be understood that the width of the first shielding layer can be the same as or different from the width of the second shielding layer. Optionally, the width of the first shielding layer is the same as the width of the second shielding layer.

[0112] In some embodiments, the first bonding layer and the second bonding layer are each independently one of a PVB bonding layer and an EVA bonding layer. Specifically, the PVB bonding layer and the EVA bonding layer can be a common bonding layer or a bonding layer with a UV blocking effect. In some of the embodiments, the PVB bonding layer and the EVA bonding layer can be a high-UV blocking bonding layer, for example, a UV cutoff wavelength ≥ 390 nm, a blocking rate ≥ 99%. Alternatively, the UV cutoff wavelength is 400 nm, and the blocking rate ≥ 99%.

[0113] In some of the embodiments, the first bonding layer is closer to the first transparent substrate than the second bonding layer, the first bonding layer is selected from one of a PVB bonding layer with a UV blocking effect and an EVA bonding layer with a UV blocking effect, and the second bonding layer is selected from one of a common PVB bonding layer without a UV blocking effect and a common EVA bonding layer without a UV blocking effect. It can be understood that the common PVB bonding layer without a UV blocking effect and the common EVA bonding layer without a UV blocking effect are relative to the PVB bonding layer with a UV blocking effect and the EVA bonding layer with a UV blocking effect, the UV blocking rate of the common PVB bonding layer without a UV blocking effect and the common EVA bonding layer without a UV blocking effect is lower than the UV blocking rate of the PVB bonding layer with a UV blocking effect and the EVA bonding layer with a UV blocking effect. Therefore, the first bonding layer is closer to the first transparent substrate than the second bonding layer, and the UV blocking rate of the first bonding layer is higher than the UV blocking rate of the second bonding layer.

[0114] In some embodiments, the light modulation layer is selected from one of an EC (electrochromic) light modulation layer, an SPD (suspended particle) light modulation layer, an LV nanophotonic light modulation layer, and a dye liquid crystal light modulation layer (abbreviated as LC or DLC). In some of the embodiments, the light modulation layer has an electrode therein.

[0115] In some embodiments, the light modulation layer is recessed by 3 mm to 30 mm relative to the first transparent substrate and the second transparent substrate. Alternatively, the light modulation layer is recessed by 3 mm to 15 mm relative to the first transparent substrate and the second transparent substrate. Alternatively, the light modulation layer is recessed by 3 mm to 10 mm relative to the first transparent substrate and the second transparent substrate. The recessed distance can be adjusted according to the use of the light modulation assembly.

[0116] In some embodiments, the water vapor transmission rate of the sealant layer is ≤ 10 -3 g / m 2 ·d (grams per square meter per day). The test of the water vapor transmission rate refers to the standard ISO 15106-3.

[0117] In some embodiments, the sealant layer comprises one or more of a polyurethane sealant layer, a butyl sealant layer, and a POE sealant layer. Optionally, the sealant layer comprises one or both of a butyl sealant layer and a POE sealant layer. When the sealant layer comprises multiple layers, the multiple layers can be a mixed layer of multiple materials or a stacked layer of multiple layers. It is to be understood that the above only gives several commonly used sealant layers, but is not limited thereto.

[0118] In some embodiments, the sealant layer has a width greater than or equal to 1 mm. For example, the sealant layer can have a width of 1 mm, 2 mm, 3 mm, 5 mm, 8 mm, 10 mm, 12 mm, 15 mm, 18 mm, 20 mm, 25 mm, 30 mm, or a range defined by any two of these values, but is not limited thereto. It is to be understood that the width of the sealant layer is less than or equal to the width of the inwardly recessed area of the first adhesive layer, the light modulation layer, and the second adhesive layer relative to the first transparent substrate and the second transparent substrate. The width of the sealant layer can be adjusted according to the width of the inwardly recessed area. In some embodiments, the width of the sealant layer is 1 mm to 20 mm, 1 mm to 15 mm, 1 mm to 10 mm, etc.

[0119] In some embodiments, the thickness of the sealant layer is comparable to the total thickness of the first adhesive layer, the light modulation layer, and the second adhesive layer. Here, comparable means that the absolute value of the difference between the thickness of the sealant layer and the total thickness of the first adhesive layer, the light modulation layer, and the second adhesive layer is less than or equal to 0.2 mm.

[0120] In some embodiments, a surface activation layer is further provided on the surface of the sealant layer facing the first transparent substrate and the second transparent substrate, and on the side of the sealant layer facing the first adhesive layer, the second adhesive layer, and the light modulation layer. By providing the surface activation layer, the adhesion between the sealant layer and the first transparent substrate, the second transparent substrate, and the adhesive layers is improved, and the water vapor erosion resistance is further improved.

[0121] In some embodiments, the material of the surface activation layer comprises a surface activation agent.

[0122] In some embodiments, the sealant layer is provided on three edges of the light modulation assembly. For example, referring to FIG. 2, an electrode line is provided on the bottom edge of the light modulation assembly, and no sealant layer is required to be provided there, and the sealant layer is provided on the other three edges.

[0123] The light modulation assembly and its structure will be described in detail below in combination with different arrangements of the sealant layer:

[0124] In the first embodiment, the first adhesive layer, the light modulation layer, and the second adhesive layer are flush or the light modulation layer is inwardly recessed relative to the first adhesive layer and the second adhesive layer by a distance less than or equal to 5 mm, the sealant layer is provided between the first transparent substrate and the second transparent substrate, and the side edges of the sealant layer contact the first adhesive layer and the second adhesive layer.

[0125] Referring to FIG. 3, the light control assembly 200 comprises a first transparent substrate 210, a first adhesive layer 220, a light control layer 230, a second adhesive layer 240 and a second transparent substrate 250 which are sequentially stacked, the first adhesive layer 220, the light control layer 230 and the second adhesive layer 240 are recessed relative to the first transparent substrate 210 and the second transparent substrate 250, and a sealant layer 260 is further arranged between the first transparent substrate 210 and the second transparent substrate 250. The sealant layer 260 contacts the side edges of the first adhesive layer 220 and the second adhesive layer 240, and the side edges of the sealant layer 260 do not exceed the side edges of the first transparent substrate 210 and the second transparent substrate 250. A first shielding layer 212 is arranged on the side of the first transparent substrate 210 away from the second transparent substrate 250, and a second shielding layer 252 is arranged on the side of the second transparent substrate 250 facing the first transparent substrate 210.

[0126] Through the above arrangement, the water vapor erosion resistance of the light control assembly 200 is improved.

[0127] In some embodiments, the light control layer 230 is flush with the first adhesive layer 220 and the second adhesive layer 240, or the light control layer 230 is recessed relative to the first adhesive layer 220 and the second adhesive layer 240 by a distance less than or equal to 5 mm. For the case that the light control layer 230 has low sensitivity to water vapor or water oxygen, for example, the light control layer 230 is a PDLC light control layer which is not sensitive to water oxygen and does not react with the sealant layer 260, at this time, the light control layer 230 can be arranged to be flush with the first adhesive layer 220 and the second adhesive layer 240. For the case that the light control layer 230 has high sensitivity to water vapor or water oxygen, for example, the light control layer 230 is an EC light control layer, by recessing the light control layer 230 relative to the first adhesive layer 220 and the second adhesive layer 240 by a distance less than or equal to 5 mm, in the pressing process, the first adhesive layer 220 and the second adhesive layer 240 soften and wrap the light control layer 230, further improving the water vapor or water oxygen erosion resistance of the light control assembly 200.

[0128] In some embodiments, the sealant layer 260 fills all the areas where the first adhesive layer 220 and the second adhesive layer 240 are recessed relative to the first transparent substrate 210 and the second transparent substrate 250. For example, the width of the area where the first adhesive layer 220 and the second adhesive layer 240 are recessed relative to the first transparent substrate 210 and the second transparent substrate 250 is greater than or equal to 3 mm. At this time, the width of the sealant layer 260 is greater than or equal to 3 mm.

[0129] It can be understood that the width of the sealing glue layer 260 can be adjusted according to the width of the inwardly recessed area of the first bonding layer 220 and the second bonding layer 240 relative to the first transparent substrate 210 and the second transparent substrate 250, for example, the width of the inwardly recessed area of the first bonding layer 220 and the second bonding layer 240 relative to the first transparent substrate 210 and the second transparent substrate 250 is 3mm-20mm, and the width of the sealing glue layer 260 is 3mm-20mm. Alternatively, the width of the inwardly recessed area of the first bonding layer 220 and the second bonding layer 240 relative to the first transparent substrate 210 and the second transparent substrate 250 is 3mm-15mm, and the width of the sealing glue layer 260 is 3mm-15mm. Alternatively, the width of the inwardly recessed area of the first bonding layer 220 and the second bonding layer 240 relative to the first transparent substrate 210 and the second transparent substrate 250 is 3mm-10mm, and the width of the sealing glue layer 260 is 3mm-10mm.

[0130] It can be understood that in some other embodiments, the sealing glue layer 260 can also be filled in the part area of the first bonding layer 220 and the second bonding layer 240 relative to the first transparent substrate 210 and the second transparent substrate 250, as long as the width of the sealing glue layer 260 is 3mm-20mm, 3mm-15mm or 3mm-10mm. In one example, the width of the sealing glue layer 260 is 6mm.

[0131] Please refer to Figure 4, in some embodiments, the light modulation assembly 200 further comprises a surface activation layer 270. The surface activation layer 270 is arranged on the side surface of the sealing glue layer 260 facing the first transparent substrate 210 and the second transparent substrate 250, and the side surface of the sealing glue layer 260 facing the first bonding layer 220, the second bonding layer 240 and the light modulation layer 230.

[0132] In Figures 3 and 4, the side of the light modulation layer 230 and the side of the first bonding layer 220 and the second bonding layer 240 are sealed by the sealing glue layer 260, which is beneficial to improve the water vapor corrosion resistance of the light modulation assembly 200.

[0133] In the second embodiment, the light modulation layer is inwardly recessed relative to the first bonding layer and the second bonding layer by a distance greater than 5mm, a third bonding layer is further arranged between the first bonding layer and the second bonding layer, the third bonding layer contacts the side edge of the light modulation layer, and the sealing glue layer contacts the first bonding layer, the second bonding layer and the third bonding layer. The first bonding layer, the second bonding layer and the third bonding layer are flush.

[0134] Referring to FIG. 5, the light control assembly 300 comprises a first transparent substrate 310, a first adhesive layer 320, a light control layer 330, a second adhesive layer 340, and a second transparent substrate 350, which are sequentially stacked. The light control layer 330 is inwardly recessed relative to the first adhesive layer 320 and the second adhesive layer 340 by a distance greater than 5 mm. A third adhesive layer 360 is provided between the first adhesive layer 320 and the second adhesive layer 340, and contacts a side edge of the light control layer 330. The third adhesive layer 360 is flush with the first adhesive layer 320 and the second adhesive layer 340, and is inwardly recessed relative to the first transparent substrate 310 and the second transparent substrate 350. A sealant layer 370 is provided between the first transparent substrate 310 and the second transparent substrate 350, and contacts the first adhesive layer 320, the second adhesive layer 340, and the third adhesive layer 360. A first shielding layer 312 is provided on a side of the first transparent substrate 310 away from the second transparent substrate 350, and a second shielding layer 352 is provided on a side of the second transparent substrate 350 facing the first transparent substrate 310.

[0135] In some embodiments, the sealant layer 370 has a width of 1 mm to 20 mm. In some of these embodiments, the sealant layer 370 has a width of 1 mm to 15 mm. In some of these embodiments, the sealant layer 370 has a width of 1 mm to 10 mm. In some of these embodiments, the sealant layer 370 has a width of 1 mm to 5 mm.

[0136] In FIG. 5, the third adhesive layer 360 is flush with the first adhesive layer 320 and the second adhesive layer 340. The sealant layer 370 has an equal width in a direction from the first adhesive layer 320 to the third adhesive layer 360, and in a direction from the second adhesive layer 340 to the third adhesive layer 360.

[0137] In some embodiments, the third adhesive layer 360 is one of a PVB adhesive layer and an EVA adhesive layer. It can be understood that the third adhesive layer 360 can be the same as or different from the first adhesive layer 320 and the second adhesive layer 340.

[0138] In FIG. 5, the light control assembly 300 further comprises a surface activation layer 380. The surface activation layer 380 is provided on a side surface of the sealant layer 370 facing the first transparent substrate 310 and the second transparent substrate 350, and on a side surface of the sealant layer 370 facing the first adhesive layer 320, the second adhesive layer 340, and the third adhesive layer 360. It can be understood that the surface activation layer 380 can be omitted in other embodiments.

[0139] The difference between the light adjusting assembly 300 in FIG. 5 and the light adjusting assembly 200 in FIGS. 3 and 4 is that, in FIG. 5, the light adjusting layer 330 is retracted by a larger distance relative to the first adhesive layer 320 and the second adhesive layer 340, and a third adhesive layer 360 is arranged in the retracted area of the light adjusting layer 330 relative to the first adhesive layer 320 and the second adhesive layer 340. On the one hand, the water vapor or water oxygen corrosion resistance is further improved. On the other hand, the light adjusting layer 330 is protected during the pressing process.

[0140] In the third embodiment, the light adjusting layer is retracted relative to the first adhesive layer and the second adhesive layer by a distance greater than 5 mm, and a third adhesive layer is further arranged between the first adhesive layer and the second adhesive layer, the third adhesive layer contacts the side edge of the light adjusting layer, the sealant layer contacts the first adhesive layer, the second adhesive layer, and the third adhesive layer, the third adhesive layer is retracted relative to the first adhesive layer and the second adhesive layer, and the width of the sealant layer increases from the first adhesive layer to the third adhesive layer and from the second adhesive layer to the third adhesive layer.

[0141] Referring to FIGS. 6 and 7, the light adjusting assembly 400 includes a first transparent substrate 410, a first adhesive layer 420, a light adjusting layer 430, a second adhesive layer 440, and a second transparent substrate 450 arranged in sequence. The light adjusting layer 430 is retracted relative to the first adhesive layer 420 and the second adhesive layer 440 by a distance greater than 5 mm, and a third adhesive layer 460 is further arranged between the first adhesive layer 420 and the second adhesive layer 440, the third adhesive layer 460 contacts the side edge of the light adjusting layer 430, and the first adhesive layer 420 and the second adhesive layer 440 are retracted relative to the first transparent substrate 410 and the second transparent substrate 450, a sealant layer 470 is further arranged between the first transparent substrate 410 and the second transparent substrate 450, and the sealant layer 470 contacts the first adhesive layer 420, the second adhesive layer 440, and the third adhesive layer 460. The third adhesive layer 460 is retracted relative to the first adhesive layer 420 and the second adhesive layer 440, and the width of the sealant layer 470 increases from the first adhesive layer 420 to the third adhesive layer 460 and from the second adhesive layer 440 to the third adhesive layer 460.

[0142] In some embodiments, the maximum width of the sealant layer 470 is 1 mm to 20 mm. In some of these embodiments, the maximum width of the sealant layer 470 is 1 mm to 15 mm. In some of these embodiments, the maximum width of the sealant layer 470 is 1 mm to 10 mm. In some of these embodiments, the maximum width of the sealant layer 470 is 1 mm to 5 mm. It can be understood that the maximum width of the sealant layer 470 is the width of the sealant layer 470 arranged on the side of the light adjusting layer 430.

[0143] In FIGS. 6 and 7, the light modulation assembly 400 further comprises a surface activation layer 480. The surface activation layer 480 is arranged on the side surface of the sealant layer 470 facing the first transparent substrate 410 and the second transparent substrate 450, and the side surface of the sealant layer 470 facing the first bonding layer 420, the second bonding layer 440 and the third bonding layer 460. It can be understood that in other embodiments, the surface activation layer 480 can also be omitted.

[0144] It can be understood that the above FIGS. 6 and 7 only give schematic diagrams of two different shapes of the sealant layer, but are not limited thereto. The shape of the sealant layer can also be adjusted according to actual conditions, and the maximum width of the sealant layer can be 1 mm to 20 mm, optionally 1 mm to 15 mm, optionally 1 mm to 10 mm, and optionally 1 mm to 5 mm.

[0145] In FIGS. 5 to 7, the side surface of the light modulation layer is provided with the third bonding layer and the sealant layer, and the water vapor corrosion resistance of the light modulation assembly is improved by cooperation of the two.

[0146] In a second aspect, the present application provides a preparation method of a light modulation assembly, comprising the following steps:

[0147] obtaining a laminated piece, the laminated piece comprising a first transparent substrate, a first bonding layer, a light modulation layer, a second bonding layer and a second transparent substrate arranged in sequence;

[0148] causing the light modulation layer, the first bonding layer and the second bonding layer in the laminated piece to be inwardly retracted relative to the first transparent substrate and the second transparent substrate;

[0149] arranging a sealant layer between the first transparent substrate and the second transparent substrate of the laminated piece, so that the sealant layer fills at least part of the inwardly retracted area and contacts the first transparent substrate and the second transparent substrate, the side edge of the sealant layer does not exceed the side edge of the first transparent substrate and the second transparent substrate, the width of the sealant layer is greater than or equal to 1 mm, and a light modulation assembly is obtained.

[0150] In this document, the arrangement in sequence is only used to represent the stacking order between the layers, and other layers can also be stacked between the layers without special limitation. The laminated piece comprising a first transparent substrate, a first bonding layer, a light modulation layer, a second bonding layer and a second transparent substrate arranged in sequence means that the layers are stacked in sequence along the thickness direction.

[0151] In some embodiments, in the step of causing the light modulation layer, the first bonding layer and the second bonding layer in the laminated piece to be inwardly retracted relative to the first transparent substrate and the second transparent substrate, the first bonding layer, the light modulation layer and the second bonding layer are flush or the light modulation layer is inwardly retracted relative to the first bonding layer and the second bonding layer, and the inwardly retracted distance is less than or equal to 5 mm;

[0152] The step of disposing a sealant layer between the first transparent substrate and the second transparent substrate, so that the sealant layer fills at least part of the inwardly retracted region, comprises:

[0153] The step of disposing a hole-containing support between the first transparent substrate and the second transparent substrate, so that the hole-containing support is in contact with the side edges of the first bonding layer and the second bonding layer;

[0154] The step of laminating the layered assembly with the hole-containing support;

[0155] After the laminating is completed, the hole-containing support is removed, and a sealant layer is filled in the region where the hole-containing support is located.

[0156] In some embodiments, the step of inwardly retracting the light-adjusting layer, the first bonding layer and the second bonding layer in the layered assembly relative to the first transparent substrate and the second transparent substrate comprises:

[0157] The step of disposing a sealant layer between the first transparent substrate and the second transparent substrate, so that the sealant layer fills at least part of the inwardly retracted region, comprises:

[0158] The step of disposing a third bonding layer between the first bonding layer and the second bonding layer, so that the third bonding layer is flush with the first bonding layer and the second bonding layer;

[0159] The step of disposing a hole-containing support between the first transparent substrate and the second transparent substrate, so that the hole-containing support is in contact with the side edges of the first bonding layer, the second bonding layer and the third bonding layer, to obtain the layered assembly;

[0160] The step of laminating the layered assembly with the third bonding layer and the hole-containing support;

[0161] After the laminating is completed, the hole-containing support is removed, and a sealant layer is filled in the region where the hole-containing support is located.

[0162] In some embodiments, the method for manufacturing the light-adjusting assembly comprises:

[0163] The step of obtaining the layered assembly comprises:

[0164] The step of disposing a third bonding layer between the first bonding layer and the second bonding layer, so that the third bonding layer is in contact with the side edges of the light-adjusting layer and is flush with the first bonding layer and the second bonding layer;

[0165] The step of laminating the layered assembly with the third bonding layer;

[0166] After the pressing is completed, the first bonding layer, the second bonding layer and the third bonding layer are removed, and the first bonding layer, the second bonding layer and the third bonding layer are all inwardly retracted relative to the first transparent substrate and the second transparent substrate;

[0167] The sealant layer is filled in the removal area of the first bonding layer, the second bonding layer and the third bonding layer to prepare the light-adjustable assembly.

[0168] In some embodiments, the light-adjustable layer is inwardly retracted relative to the first bonding layer and the second bonding layer in the step of making the light-adjustable layer, the first bonding layer and the second bonding layer all inwardly retracted relative to the first transparent substrate and the second transparent substrate, and the inward retraction distance is greater than 5 mm.

[0169] The sealant layer is filled in the removal area of the first bonding layer, the second bonding layer and the third bonding layer to prepare the light-adjustable assembly.

[0170] The third bonding layer is arranged between the first bonding layer and the second bonding layer, and the third bonding layer is inwardly retracted relative to the first bonding layer and the second bonding layer.

[0171] The hole-bearing support is arranged between the first transparent substrate and the second transparent substrate, and the hole-bearing support is in contact with the side edges of the first bonding layer, the second bonding layer and the third bonding layer.

[0172] The hole-bearing support is arranged between the first transparent substrate and the second transparent substrate, and the hole-bearing support is in contact with the side edges of the first bonding layer, the second bonding layer and the third bonding layer.

[0173] After the pressing is completed, the hole-bearing support is removed, and the sealant layer is filled in the area where the hole-bearing support is located.

[0174] The preparation methods of the above several light-adjustable assemblies are described in detail in combination with different structures of the light-adjustable assemblies.

[0175] In the first embodiment, the structure of the light-adjustable assembly is shown in FIG. 3, and please refer to FIG. 8 for the preparation method of the light-adjustable assembly, which includes the following steps:

[0176] Step S510: The first transparent substrate, the first bonding layer, the light-adjustable layer, the second bonding layer and the second transparent substrate are sequentially stacked to obtain a stack, so that the first bonding layer, the light-adjustable layer and the second bonding layer are flush or the light-adjustable layer is inwardly retracted relative to the first bonding layer and the second bonding layer, and the inward retraction distance is less than or equal to 5 mm, and the first bonding layer and the second bonding layer are both inwardly retracted relative to the first transparent substrate and the second transparent substrate.

[0177] Step S520: The hole-bearing support is arranged between the first transparent substrate and the second transparent substrate, and the hole-bearing support is in contact with the side edges of the first bonding layer and the second bonding layer.

[0178] Step S530: The stack provided with the hole-bearing support is pressed.

[0179] Step S540: After the pressing is finished, the hole-containing support is removed.

[0180] Step S550: A sealant layer is filled in the area where the hole-containing support is located, to prepare the light-adjustable assembly.

[0181] By using the above method, the light-adjustable assembly, such as the vehicle door glass, which has a light-adjustable layer sensitive to water vapor or water oxygen and is close to the edge of the transparent substrate (for example, the distance between the light-adjustable layer and the edge of the transparent substrate is less than or equal to 30 mm, and further less than or equal to 20 mm) can be prepared. In addition, the size of the bonding layer and the light-adjustable layer is comparable during the lamination packaging (i.e., the side edges of the first bonding layer, the light-adjustable layer and the second bonding layer are flush or the light-adjustable layer is recessed relative to the first bonding layer and the second bonding layer, and the recessed distance is less than or equal to 5 mm), which is beneficial to reduce the edge trimming process of the light-adjustable layer and improve the efficiency. In addition, during the lamination packaging, the hole-containing support with equal thickness is filled in the recessed area, which avoids the thickness difference of the transparent substrate caused by the processing process and the local stress (fragile) of the glass caused by the thickness difference. In addition, the hole-containing support is beneficial to the discharge of gas during the lamination process.

[0182] FIG. 8 is a flowchart of a method for preparing a light-adjustable assembly according to an embodiment of the present application. It should be understood that although each step in the flowchart shown in FIG. 8 is displayed in sequence according to the arrow, these steps are not necessarily performed in the order indicated by the arrow, unless otherwise specified herein. The execution of these steps is not necessarily limited in sequence, and they can be executed in other orders. In addition, at least a part of the steps in FIG. 8 can include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but can be performed at different times. The execution sequence of these sub-steps or stages is not necessarily sequential, but can be performed alternately or alternately with at least a part of other steps or other sub-steps or stages.

[0183] In some embodiments, referring to FIG. 9, FIG. 9 is a schematic diagram of a process flow of the preparation of the light-adjustable assembly shown in FIG. 8. In FIG. 9, a is a schematic diagram of step S510, the first transparent substrate 210, the first adhesive layer 220, the light-adjustable layer 230, the second adhesive layer 240 and the second transparent substrate 250 are sequentially laminated to obtain a laminated piece, so that the first adhesive layer 220, the light-adjustable layer 230 and the second adhesive layer 240 are flush or the light-adjustable layer 230 is recessed relative to the first adhesive layer 220 and the second adhesive layer 240 by a distance less than or equal to 5 mm, and the first adhesive layer 220 and the second adhesive layer 240 are both recessed relative to the first transparent substrate 210 and the second transparent substrate 250. b is a schematic diagram of step S520, the hole-containing support 280 is arranged between the first transparent substrate 210 and the second transparent substrate 250, so that the hole-containing support 280 is in contact with the side edges of the first adhesive layer 220 and the second adhesive layer 240. c is a schematic diagram of step S530, the laminated piece provided with the hole-containing support 280 is subjected to pressing. d is a schematic diagram of step S540, after the pressing, the hole-containing support 280 is removed. e is a schematic diagram of step S550, the sealant layer 260 is filled in the area where the hole-containing support 280 is located, and the light-adjustable assembly is prepared.

[0184] It can be understood that in FIG. 9, the shape of the hole in the hole-containing support 280 is a triangle, but is not limited thereto. Referring to FIG. 10, FIG. 10 shows the longitudinal sectional schematic diagrams of several common hole-containing support structures. In FIG. 10, from left to right, the hole-containing supports are respectively provided with circular through holes on the side surface, semicircular blind holes on the upper surface and the lower surface, and triangular blind holes on the upper surface and the lower surface. It can be understood that in other embodiments, the hole-containing support can also be provided with circular through holes on the upper surface and the lower surface. The longitudinal section refers to the plane cut in the direction perpendicular to the upper and lower surfaces.

[0185] In some embodiments, the material of the hole-containing support includes but is not limited to Teflon. For example, the hole-containing support can be but is not limited to a hole-containing Teflon plug.

[0186] In some embodiments, the pressing process can be commonly used in the art, for example, the pressing process includes primary pressing and high-pressure pressing.

[0187] In some embodiments, the thickness of the sealant layer is comparable to the total thickness of the first adhesive layer, the light-adjustable layer and the second adhesive layer. Wherein, the thickness being comparable means that the absolute value of the difference between the thickness of the sealant layer and the total thickness of the first adhesive layer, the light-adjustable layer and the second adhesive layer is less than or equal to 0.2 mm.

[0188] In some embodiments, after the step of filling the sealant layer in the area where the hole-containing support is located, the step of scraping the sealant is further included. In some of the embodiments, the flat scraping or U-shaped sealant scraping is used to remove the excess sealant.

[0189] In some embodiments, the sealant layer is filled within 8 hours after the pressing.

[0190] It can be understood that, in actual processes, the sealant layer is used to seal the three edges of the transparent substrate (the distance between the light modulation layer and the edge of the transparent substrate is less than or equal to 30 mm, and further less than or equal to 20 mm) after splicing.

[0191] In some embodiments, before the step of filling the sealant layer in the area where the hole support is located, the method further comprises filling a surface activation layer in the area where the hole support is located. By filling the surface activation layer first and then filling the sealant layer, the adhesion between the sealant layer and the first transparent substrate, the second transparent substrate, and the adhesive layer is improved, and the water vapor erosion resistance of the light modulation assembly is further improved.

[0192] In the second embodiment, the structure of the light modulation assembly is shown in FIG. 5, and please refer to FIG. 11. The preparation method of the light modulation assembly comprises the following steps:

[0193] Step S610: sequentially stack the first transparent substrate, the first adhesive layer, the light modulation layer, the second adhesive layer, and the second transparent substrate to obtain a stacked piece, so that the light modulation layer is recessed inward relative to the first adhesive layer and the second adhesive layer, and the recessed distance is greater than 5 mm, and the first adhesive layer and the second adhesive layer are recessed inward relative to the first transparent substrate and the second transparent substrate.

[0194] Step S620: a third adhesive layer is arranged between the first adhesive layer and the second adhesive layer, so that the third adhesive layer is flush with the first adhesive layer and the second adhesive layer.

[0195] Step S630: a hole support is arranged between the first transparent substrate and the second transparent substrate, so that the hole support is in contact with the side edges of the first adhesive layer, the second adhesive layer, and the third adhesive layer.

[0196] Step S640: the stacked piece provided with the third adhesive layer and the hole support is pressed.

[0197] Step S650: after the pressing is completed, the hole support is removed.

[0198] Step S660: a sealant layer is filled in the area where the hole support is located to prepare a light modulation assembly.

[0199] The preparation method of the light modulation assembly of the second embodiment is different from the preparation method of the light modulation assembly of the first embodiment in that, before the step of arranging the hole support between the first transparent substrate and the second transparent substrate, the method further comprises arranging a third adhesive layer between the first adhesive layer and the second adhesive layer. The other steps are the same as those of the first embodiment, and will not be described herein.

[0200] In some embodiments, the thickness of the third bonding layer is equivalent to the thickness of the light-adjusting layer. Herein, the thickness equivalence refers to that the absolute value of the difference between the thickness of the third bonding layer and the thickness of the light-adjusting layer is less than or equal to 0.2 mm.

[0201] In the third embodiment, the structure of the light-adjusting assembly is shown in FIGS. 6 and 7. Please refer to FIG. 12 for the preparation method of the light-adjusting assembly in the third embodiment, which comprises the following steps:

[0202] Step S710: sequentially stack the first transparent substrate, the first bonding layer, the light-adjusting layer, the second bonding layer, and the second transparent substrate to obtain a stacked piece, so that the first transparent substrate, the first bonding layer, the second bonding layer, and the second transparent substrate are flush, and the light-adjusting layer is recessed relative to the first bonding layer and the second bonding layer.

[0203] Step S720: dispose a third bonding layer between the first bonding layer and the second bonding layer, so that the third bonding layer contacts the side edge of the light-adjusting layer and is flush with the first bonding layer and the second bonding layer.

[0204] Step S730: press the stacked piece provided with the third bonding layer.

[0205] Step S740: after the pressing is completed, remove part of the first bonding layer, part of the second bonding layer, and part of the third bonding layer, so that the first bonding layer, the second bonding layer, and the third bonding layer are all recessed relative to the first transparent substrate and the second transparent substrate.

[0206] Step S750: fill a sealing glue layer in the removed area of the first bonding layer, the second bonding layer, and the third bonding layer to prepare the light-adjusting assembly.

[0207] In some embodiments, a hook knife is used to remove part of the first bonding layer, part of the second bonding layer, and part of the third bonding layer.

[0208] In some embodiments, before the step of filling the sealing glue layer in the removed area of the first bonding layer, the second bonding layer, and the third bonding layer, the method further comprises filling a surface activation layer in the removed area of the first bonding layer, the second bonding layer, and the third bonding layer. By filling the surface activation layer first and then filling the sealing glue layer, the adhesion between the sealing glue layer and the first transparent substrate, the second transparent substrate, and the bonding layers is improved, and the water vapor erosion resistance of the light-adjusting assembly is further improved.

[0209] The preparation method of the light-adjusting assembly in the third embodiment described above can use the traditional splicing and packaging process of the light-adjusting assembly, without the need to change the existing process and production line. After splicing, a hook knife is used to remove part of the bonding layer in the packaging process, and then a sealing glue layer is filled in the removed bonding layer area. After sealing, the water (oxygen) vapor erosion to the inside of the light-adjusting assembly is protected, and finally the operation of achieving the product requirement of narrow distance between the light-adjusting layer and the transparent substrate is realized.

[0210] It can be understood that in other embodiments, the structure of the light modulation assembly is as shown in FIG. 5, and the preparation method of the light modulation assembly can also adopt the preparation method of the third embodiment. At this time, after the pressing is completed in step S740, the part of the first adhesive layer, the part of the second adhesive layer, and the part of the third adhesive layer are removed, and the step of making the first adhesive layer, the second adhesive layer, and the third adhesive layer all inwardly retract relative to the first transparent substrate and the second transparent substrate is that the areas of the removed first adhesive layer, the removed second adhesive layer, and the removed third adhesive layer are the same.

[0211] In the fourth embodiment, the structure of the light modulation assembly is as shown in FIGS. 6 and 7, and please refer to FIG. 13 for the preparation method of the light modulation assembly of the fourth embodiment, which includes the following steps:

[0212] Step S810: stack the first transparent substrate, the first adhesive layer, the light modulation layer, the second adhesive layer, and the second transparent substrate in sequence to obtain a stacked piece, so that the light modulation layer inwardly retracts relative to the first adhesive layer and the second adhesive layer by a distance greater than 5 mm, and the first adhesive layer and the second adhesive layer inwardly retract relative to the first transparent substrate and the second transparent substrate.

[0213] Step S820: set a third adhesive layer between the first adhesive layer and the second adhesive layer, so that the third adhesive layer inwardly retracts relative to the first adhesive layer and the second adhesive layer.

[0214] Step S830: set a hole-supported piece between the first transparent substrate and the second transparent substrate, so that the hole-supported piece is in contact with the side edges of the first adhesive layer, the second adhesive layer, and the third adhesive layer.

[0215] Step S840: press the stacked piece provided with the third adhesive layer and the hole-supported piece.

[0216] Step S850: after the pressing is completed, the hole-supported piece is removed.

[0217] Step S860: fill a sealant layer in the area where the hole-supported piece is located to prepare a light modulation assembly.

[0218] It can be understood that in step S820, the third adhesive layer inwardly retracts relative to the first adhesive layer and the second adhesive layer, that is, the side edges of the first adhesive layer, the second adhesive layer, and the third adhesive layer are not irregular. In step S830, by setting a hole-supported piece with a special shape, the hole-supported piece is in contact with the side edges of the first adhesive layer, the second adhesive layer, and the third adhesive layer. The shape of the hole-supported piece can be adjusted according to the shape of the side edges of the first adhesive layer, the second adhesive layer, and the third adhesive layer.

[0219] In a third aspect, the present application provides a vehicle comprising the light-adjusting assembly of the first aspect or comprising the light-adjusting assembly prepared by the preparation method of the second aspect.

[0220] In some embodiments, the light-adjusting assembly can be used as a door glass or a sunroof glass of a vehicle.

[0221] In order to make the objects and advantages of the present application more clear, the light-adjusting assembly and its effects are further described in detail below in combination with embodiments. It should be understood that the embodiments described herein are only used to explain the present application and should not be used to limit the present application. The following embodiments do not include other components except for inevitable impurities, if not otherwise specified. In the embodiments, the drugs and instruments are selected according to the conventional selection in the art, if not otherwise specified. The experimental methods in the embodiments are implemented according to the conventional conditions, for example, the conditions described in the literature, books or the methods recommended by the manufacturers.

[0222] Embodiment 1

[0223] The present embodiment provides a light-adjusting assembly, the structure of which is shown in FIG. 3. The light-adjusting assembly 200 comprises a first transparent substrate 210, a first adhesive layer 220, a light-adjusting layer 230, a second adhesive layer 240 and a second transparent substrate 250 which are sequentially stacked. The light-adjusting layer 230 is flush with the first adhesive layer 220 and the second adhesive layer 240, and is recessed relative to the first transparent substrate 210 and the second transparent substrate 250 by a distance of 5 mm. A sealant layer 260 is further provided between the first transparent substrate 210 and the second transparent substrate 250. The first transparent substrate 210 and the second transparent substrate 220 are both glass, and the first adhesive layer 220 and the second adhesive layer 240 are both PVB adhesive layers. The light-adjusting layer 230 is an EC light-adjusting layer, and the sealant layer 260 is a butyl sealant layer. The width of the sealant layer 260 is 5 mm.

[0224] Embodiment 2

[0225] The present embodiment provides a light-adjusting assembly, which is similar to the light-adjusting assembly of Embodiment 1, except that the first adhesive layer 220, the light-adjusting layer 230 and the second adhesive layer 240 are all recessed relative to the first transparent substrate 210 and the second transparent substrate 250 by a distance of 10 mm, and the width of the sealant layer 260 is 10 mm.

[0226] Embodiment 3

[0227] The present embodiment provides a light control assembly, which is similar to the light control assembly of embodiment 1, except that the first adhesive layer 220, the light control layer 230 and the second adhesive layer 240 are all inwardly retracted relative to the first transparent substrate 210 and the second transparent substrate 250 by a retraction distance of 20 mm, and the width of the sealant layer 260 is 20 mm. The sealant layer 260 is a polyurethane sealant layer.

[0228] Embodiment 4

[0229] The present embodiment provides a light control assembly, which is similar to the light control assembly of embodiment 1, except that the light control layer 230 is an LV light control layer, and the first adhesive layer 220, the light control layer 230 and the second adhesive layer 240 are all inwardly retracted relative to the first transparent substrate 210 and the second transparent substrate 250 by a retraction distance of 10 mm, and the width of the sealant layer 260 is 10 mm. The sealant layer 260 is a POE sealant layer.

[0230] Comparative Example 1

[0231] Comparative Example 1 provides a light control assembly, which is similar to the light control assembly of embodiment 1, except that the sealant layer in Comparative Example 1 is replaced by a PVB adhesive layer.

[0232] Comparative Example 2

[0233] Comparative Example 2 provides a light control assembly, which is similar to the light control assembly of embodiment 2, except that the sealant layer in Comparative Example 2 is replaced by a PVB adhesive layer.

[0234] Comparative Example 3

[0235] Comparative Example 3 provides a light control assembly, which is similar to the light control assembly of embodiment 3, except that the sealant layer in Comparative Example 3 is replaced by a PVB adhesive layer.

[0236] Comparative Example 4

[0237] Comparative Example 4 provides a light control assembly, which is similar to the light control assembly of embodiment 4, except that the sealant layer in Comparative Example 4 is replaced by a PVB adhesive layer.

[0238] The light control assemblies of the above embodiments and comparative examples are subjected to a damp heat test, and the test results are shown in Table 1 below.

[0239] Table 1: Damp heat test results of the light control assemblies of the embodiments and comparative examples

[0240] In Table 1 above, in Comparative Example 1, the abnormality of the 10mm-20mm edge portion of the EC film refers to an abnormality occurring in a region 10mm-20mm away from the edge of the light control layer. Similar meanings are applicable to other comparative examples, and will not be described again. The abnormality of the light control function refers to a situation where the light control assembly can still work, but the key performance parameters deviate from the design standards, resulting in poor light control effect. The light control failure refers to a situation where the light control assembly completely loses the core function and cannot perform light control operation.

[0241] As can be seen from Table 1 above, by providing the sealing adhesive layer, the water vapor corrosion resistance of the light control assembly can be improved. It can be understood that when the structure of the light control assembly is as shown in FIGS. 4-7, by providing the sealing adhesive layer, the water vapor corrosion resistance of the light control assembly can also be improved, and will not be described again.

[0242] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict each other, they should be considered within the scope of the present disclosure.

[0243] The above-described embodiments only express several implementation manners of the present application, and the description is specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A dimming assembly, comprising: The present application relates to a light control assembly, comprising: a first transparent substrate; a first adhesive layer disposed on a surface of the first transparent substrate; a light control layer disposed on a surface of the first adhesive layer away from the first transparent substrate; a second adhesive layer disposed on a surface of the light control layer away from the first transparent substrate; a second transparent substrate disposed on a surface of the second adhesive layer away from the first transparent substrate; wherein the first adhesive layer, the light control layer and the second adhesive layer are each recessed with respect to the first transparent substrate and the second transparent substrate, the light control assembly further comprising a sealant layer disposed in at least a portion of the recessed area and contacting the first transparent substrate and the second transparent substrate, a side edge of the sealant layer not extending beyond a side edge of the first transparent substrate and the second transparent substrate, and a width of the sealant layer being greater than or equal to about 1 mm.

2. The dimming assembly of claim 1, wherein, The width of the sealant layer is about 1 mm to about 20 mm.

3. The dimming assembly of claim 2, wherein, The width of the sealant layer is about 1 mm to about 15 mm.

4. The dimming assembly of claim 3, wherein, The width of the sealant layer is about 1 mm to about 10 mm.

5. The dimming assembly of any one of claims 1-4, wherein, The first adhesive layer, the light control layer and the second adhesive layer are flush or the light control layer is recessed with respect to the first adhesive layer and the second adhesive layer by a distance less than or equal to about 5 mm, and a side edge of the sealant layer contacts the first adhesive layer and the second adhesive layer.

6. The dimming assembly of claim 5, wherein, The width of the sealant layer is greater than or equal to about 3 mm.

7. The dimming assembly of claim 6, wherein, The width of the sealant layer is about 3 mm to about 10 mm.

8. The dimming assembly of any of claims 1-4, wherein, The light control layer is recessed with respect to the first adhesive layer and the second adhesive layer by a distance greater than about 5 mm, a third adhesive layer is further disposed between the first adhesive layer and the second adhesive layer, the third adhesive layer contacts a side edge of the light control layer, and the sealant layer contacts the first adhesive layer, the second adhesive layer and the third adhesive layer.

9. The dimming assembly of claim 8, wherein, The third adhesive layer is flush with the first adhesive layer and the second adhesive layer; or The third adhesive layer is recessed with respect to the first adhesive layer and the second adhesive layer, and the width of the sealant layer increases from the first adhesive layer to the third adhesive layer and from the second adhesive layer to the third adhesive layer.

10. The dimming assembly of claim 9, wherein, The maximum width of the sealant layer is about 1 mm to about 5 mm.

11. The dimming assembly of any of claims 1-10, wherein, The sealant layer has a water vapor transmission rate of < about 10 -3 g / m 2 ·d.

12. The dimming assembly of any of claims 1-11, wherein, The sealant layer comprises one or more of a polyurethane sealant layer, a butyl sealant layer and a POE sealant layer.

13. The dimming assembly of claim 12, wherein, The sealant layer comprises one or both of a butyl sealant layer and a POE sealant layer.

14. The dimmable assembly of any of claims 1-13, wherein, A surface activation layer is further disposed on a surface of the sealant layer facing the first transparent substrate and the second transparent substrate, and on a surface of the sealant layer facing the first adhesive layer, the second adhesive layer and the light control layer.

15. The dimmable assembly of any of claims 1-14, wherein, The first adhesive layer and the second adhesive layer each independently comprise one of a PVB adhesive layer and an EVA adhesive layer.

16. A method of making a light modulating assembly, wherein, The present application further relates to a method for manufacturing a light control assembly, comprising the following steps: obtaining a stack comprising a first transparent substrate, a first adhesive layer, a light control layer, a second adhesive layer and a second transparent substrate disposed in sequence; The light adjusting layer, the first adhesive layer and the second adhesive layer in the stack are all inwardly retracted relative to the first transparent substrate and the second transparent substrate; A sealant layer is arranged between the first transparent substrate and the second transparent substrate of the stack, the sealant layer fills at least part of the inwardly retracted area and contacts the first transparent substrate and the second transparent substrate, the side edge of the sealant layer does not exceed the side edge of the first transparent substrate and the second transparent substrate, the width of the sealant layer is greater than or equal to about 1 mm, and a light adjusting assembly is obtained.

17. The method of claim 16, wherein the light modulating assembly is prepared by the method of claim 1. The width of the sealant layer is about 1 mm to about 20 mm.

18. The method of claim 17, wherein the light modulating assembly is prepared by the method of claim 1. The width of the sealant layer is about 1 mm to about 15 mm.

19. The method of claim 18, wherein the light control assembly is prepared by the steps of: The width of the sealant layer is about 1 mm to about 10 mm.

20. The method of claim 16-19, wherein the light control assembly is prepared by the method comprising: In the step of making the light adjusting layer, the first adhesive layer and the second adhesive layer in the stack all inwardly retract relative to the first transparent substrate and the second transparent substrate, the first adhesive layer, the light adjusting layer and the second adhesive layer are flush or the light adjusting layer is inwardly retracted relative to the first adhesive layer and the second adhesive layer by a distance less than or equal to about 5 mm; The step of arranging a sealant layer between the first transparent substrate and the second transparent substrate of the stack includes: A hole-bearing support is arranged between the first transparent substrate and the second transparent substrate, the hole-bearing support contacts the side edges of the first adhesive layer and the second adhesive layer; The stack provided with the hole-bearing support is laminated; After the lamination is completed, the hole-bearing support is removed, and the sealant layer is filled in the area where the hole-bearing support is located.

21. The method of claim 20, wherein the light modulating assembly is prepared by the steps of: The width of the sealant layer is greater than or equal to about 3 mm.

22. The method of claim 21, wherein the light modulating assembly is prepared by the method of claim 20. The width of the sealant layer is about 3 mm to about 10 mm.

23. The method of claim 16-19, wherein the light control assembly is prepared by the steps of: In the step of making the light adjusting layer, the first adhesive layer and the second adhesive layer in the stack all inwardly retract relative to the first transparent substrate and the second transparent substrate, the light adjusting layer is inwardly retracted relative to the first adhesive layer and the second adhesive layer by a distance greater than about 5 mm; The step of arranging a sealant layer between the first transparent substrate and the second transparent substrate of the stack includes: A third adhesive layer is arranged between the first adhesive layer and the second adhesive layer, the third adhesive layer is flush with the first adhesive layer and the second adhesive layer; A hole-bearing support is arranged between the first transparent substrate and the second transparent substrate, the hole-bearing support contacts the side edges of the first adhesive layer, the second adhesive layer and the third adhesive layer; The stack provided with the third adhesive layer and the hole-bearing support is laminated; After the lamination is completed, the hole-bearing support is removed, and the sealant layer is filled in the area where the hole-bearing support is located.

24. The method of claim 16-19, wherein the light control assembly is prepared by the steps of: The preparation method includes: obtaining the stack, the first bonding layer, the second bonding layer and the first and second transparent substrates being flush, the light control layer being recessed relative to the first and second bonding layers; providing a third bonding layer between the first and second bonding layers, the third bonding layer being in contact with the side edges of the light control layer and being flush with the first and second bonding layers; pressing the stack provided with the third bonding layer; after the pressing, removing part of the first bonding layer, part of the second bonding layer and part of the third bonding layer, the first, second and third bonding layers being recessed relative to the first and second transparent substrates; filling the sealant layer in the removed areas of the first, second and third bonding layers to produce the light control assembly.

25. The method of claim 16-19, wherein the light control assembly is prepared by the method comprising: In the step of recessing the light control layer, the first bonding layer and the second bonding layer relative to the first and second transparent substrates, the light control layer is recessed relative to the first and second bonding layers by a distance greater than about 5 mm; providing a sealant layer between the first and second transparent substrates, the sealant layer filling at least part of the recessed areas, the step of providing a sealant layer between the first and second transparent substrates comprising: providing a third bonding layer between the first and second bonding layers, the third bonding layer being recessed relative to the first and second bonding layers; providing a perforated support between the first and second transparent substrates, the perforated support being in contact with the side edges of the first, second and third bonding layers; pressing the stack provided with the third bonding layer and the perforated support; after the pressing, removing the perforated support and filling the sealant layer in the area where the perforated support was located.

26. The method of claim 23, 24 or 25, wherein the light control assembly is prepared by the method of any one of claims 1 to 22. The sealant layer has a maximum width of about 1 mm to about 5 mm.

27. The method of making a light control assembly according to any one of claims 16 to 26, wherein, The sealant layer has a water vapor transmission rate of < about 10 -3 g / m 2 ·d.

28. The method of claim 16-27, wherein the light control assembly is prepared by the steps of: The sealant layer comprises one or more of a polyurethane sealant layer, a butyl sealant layer and a POE sealant layer.

29. The method of claim 28, wherein the light modulating assembly is prepared by, The sealant layer comprises one or both of a butyl sealant layer and a POE sealant layer.

30. A vehicle, wherein, The light control assembly of any one of claims 1 to 15 or produced by the method of any one of claims 16 to 29.

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