Resin composition for optical communication component and optical communication component using same

Abstract

A resin composition for an optical communication component according to one aspect of the present disclosure contains: a base resin including a polyether ether ketone resin as a main component; silica; and at least one higher fatty acid or related substance selected from the group consisting of higher fatty acids, higher fatty acid esters, and higher fatty acid salts. If the total quantity of the base resin and the silica is defined as 100 parts by mass, 55-75 parts by mass of the silica are included.

Description

Resin composition for optical communication parts and optical communication parts using the same

[0001] The present invention relates to a resin composition for optical communication parts and an optical communication part using the same.

[0002] Optical communication components, such as ferrules and sleeves for optical fiber connectors, are generally composed of resin compositions containing resin and inorganic fillers. Optical communication components require high dimensional accuracy. Therefore, the resin compositions that make up optical communication components must be easily moldable and capable of providing excellent dimensional accuracy to the optical communication components. Furthermore, with the increasing need to mount optical connectors on circuit boards, heat resistance during solder reflow processing (up to 260°C) is required.

[0003] As a resin composition for constituting such optical communication components, Patent Document 1 discloses a resin composition for optical communication components containing a base resin containing polyether ether ketone (PEEK) resin as a main component and silica, wherein the content of the silica in the resin composition for optical communication components is 55 to 75 mass %.

[0004] Japanese Patent Application Publication No. 2021-24971

[0005] Optical fiber connectors connect fibers for optical communication and require high dimensional accuracy. Optical fiber connectors can be manufactured by, for example, injection molding, but molding stability is required to ensure high dimensional accuracy. However, the resin composition for optical communication components described in Patent Document 1 has a problem in that it increases in viscosity with each injection molding shot, resulting in a gradual increase in injection pressure. One aspect of the present invention aims to suppress the increase in viscosity due to heating of a resin composition containing a PEEK resin as a main component.

[0006] As a result of intensive research to solve the above-mentioned problems, the present inventors have found for the first time that adding a higher fatty acid to a resin composition containing silica and a base resin containing PEEK resin as a main component can suppress thickening of the resin composition due to heating, and have completed the present invention. That is, in order to solve the above-mentioned problems, a resin composition for optical communication components according to one aspect of the present invention contains a base resin containing a polyether ether ketone resin as a main component, silica, and at least one higher fatty acid selected from the group consisting of higher fatty acids, higher fatty acid esters, and higher fatty acid salts, and contains 55 parts by mass or more and 75 parts by mass or less of the silica when the total amount of the base resin and the silica is 100 parts by mass.

[0007] According to one aspect of the present invention, it is possible to suppress thickening of a resin composition containing a PEEK resin as a main component due to heating.

[0008] Hereinafter, one embodiment of the present invention will be described in detail. In this specification, unless otherwise specified, the expression "A to B" representing a range of numerical values ​​means "A or more and B or less."

[0009] [1. Resin composition for optical communication components] A resin composition for optical communication components according to one embodiment of the present invention contains a base resin containing a PEEK resin as a main component, silica, and at least one higher fatty acid selected from the group consisting of higher fatty acids, higher fatty acid esters, and higher fatty acid salts, and contains 55 parts by mass or more and 75 parts by mass or less of the silica when the total amount of the base resin and the silica is 100 parts by mass.

[0010] According to a resin composition for optical communication components according to one aspect of the present invention, a resin composition containing a PEEK resin as a main component contains higher fatty acids, which can suppress thickening of the resin composition due to heating. For example, thickening of the resin composition with each injection molding shot, which causes the injection pressure to gradually increase, can be suppressed. As a result, a resin composition for optical communication components with excellent processing stability can be obtained.

[0011] Furthermore, the resin composition for optical communication components according to one embodiment of the present invention contains a base resin containing PEEK resin as a main component and a specific amount of silica, so that optical communication components can be easily molded, excellent dimensional accuracy can be imparted to the optical communication components, and thermal deformation of the optical communication components can be sufficiently suppressed even when the optical communication components are heated at solder reflow temperatures. In this specification, the "resin composition for optical communication components" may also be simply referred to as the "resin composition."

[0012] The resin composition will be described in detail below.

[0013] <Base Resin> The base resin contains a PEEK resin as a main component. Here, the main component refers to a component whose content in the base resin is 50% by mass or more.

[0014] The PEEK resin has a repeating unit represented by the following formula (1). In the above formula (1), R １ , R ２ , R ３ are all substituents, and p, q, and r are each integers of 0 to 4. Examples of the substituent include a halogen group, an alkyl group, an alkenyl group, and an aryl group. It is preferable that p, q, and r are each 0.

[0015] The PEEK resin has n repeating units, where n is a positive integer representing the average degree of polymerization.

[0016] The melt volume rate (MVR) of the PEEK resin is not particularly limited, but is preferably 100 cm ３ In this case, it is preferable that the MVR of the resin composition is 100 cm / 10 minutes or more. ３ In this case, molding of the optical communication component can be performed more easily than when the time is less than 10 minutes.

[0017] The MVR of PEEK resin is 150 cm ３ / 10 minutes or more is more preferable, and 200 cm ３ It is particularly preferable that the time is 10 minutes or more.

[0018] However, the MVR of PEEK resin is 500 cm ３In this case, it is preferable that the MVR of the PEEK resin is 500 cm ３ Compared to when the heating time exceeds 10 minutes, the melting point of the PEEK resin is higher, and thermal deformation of the optical communication component can be more sufficiently suppressed when the optical communication component is heated at the solder reflow temperature. In addition, the strength of the optical communication component is further improved. MVR is a value measured under conditions of 380°C and a load of 5 kg in accordance with ISO 1133.

[0019] The base resin may be made of only PEEK resin, or may be made of a mixed resin of PEEK resin and other resins.

[0020] As the other resin, polyarylene sulfide (PAS) resin, polyethersulfone (PES) resin, polyetherimide (PEI) resin, liquid crystal resin (LCP) having a melting point of 300° C. or higher, or a combination of two or more of these is preferred.

[0021] In this case, the other resin typically has a lower melt viscosity than the PEEK resin during molding, and therefore the fluidity of the resin composition can be further increased, and the optical communication component can be more easily molded, compared to when the base resin does not further contain the other resin. Furthermore, although the other resin has a lower melting point than the PEEK resin, it generally has a high melting point due to its high crystallinity, and therefore has a low coefficient of linear expansion and low hygroscopicity, thereby imparting excellent dimensional accuracy to the optical communication component, and when the optical communication component is heated at a solder reflow temperature, thermal deformation of the optical communication component can be more sufficiently suppressed, compared to when a resin other than the other resin is used.

[0022] Among these, PAS resin is preferred as the other resin. PAS resin is a polymer containing 80 mol% or more of repeating units represented by the structural formula [-Ar-S-] (where Ar is an arylene group and S is sulfur). Among PAS resins, polyphenylene sulfide (PPS) resin having repeating units represented by the structural formula [-Ph-S-] (where Ph is a paraphenylene group and S is sulfur) is preferred. One type of PPS may be used alone, or two or more types may be used in combination.

[0023] Furthermore, the PPS resin preferably contains 80 mol % or more, and more preferably 90 mol % or more, of the repeating units. In this case, the PPS resin has higher crystallinity and a higher melting point than when the repeating units of the PPS resin are less than 80 mol %, and even when the PPS resin is blended with the PEEK resin, the loss of heat distortion resistance during solder reflow is more sufficiently suppressed.

[0024] (Base Resin Content) The content of the base resin in the resin composition according to one embodiment of the present invention is not particularly limited. The inclusion of the base resin in the resin composition according to one embodiment of the present invention provides the effect of improving the fluidity of the resin composition. For example, the resin composition according to one embodiment of the present invention preferably contains 25 parts by mass or more and 45 parts by mass or less of the base resin when the total amount of the base resin and silica is 100 parts by mass.

[0025] This increases the fluidity of the resin composition, making it easier to mold optical communication components, compared to when the base resin content is less than 25 parts by mass, and also provides optical communication components with superior dimensional accuracy, compared to when the base resin content is more than 45 parts by mass, assuming that the total amount of the base resin and silica is 100 parts by mass.

[0026] From the viewpoint of molding stability, the content of the base resin in the resin composition according to one embodiment of the present invention is more preferably 27 parts by mass or more, and particularly preferably 29 parts by mass or more, when the total amount of the base resin and silica is 100 parts by mass.

[0027] Furthermore, from the viewpoint of the fluidity of the resin composition, the content of the base resin in the resin composition according to one embodiment of the present invention is more preferably 42 parts by mass or less, and particularly preferably 40 parts by mass or less, when the total amount of the base resin and silica is 100 parts by mass.

[0028] When the base resin is a mixed resin of PEEK resin and another resin, the content of the other resin in the base resin is preferably 35% by mass or less. For example, when the other resin is PPS resin, the content of the PPS resin in the base resin is preferably 20% by mass or less. In this case, compared to when the PPS resin content in the base resin exceeds 20% by mass, thermal deformation of the optical communication component can be more sufficiently suppressed when the optical communication component is heated at solder reflow temperatures compared to when a resin other than PPS resin is used. Furthermore, in this case, thickening of the resin composition due to heating can be more sufficiently suppressed compared to when the PPS resin content in the base resin exceeds 20% by mass.

[0029] It is more preferable that the content of PPS resin in the base resin is 10% by mass or less. Compared to when the content of PPS resin in the base resin exceeds 20% by mass, the PPS resin is less likely to melt partially due to the high temperature during solder reflow, and thermal deformation of the molded optical communication component can be more sufficiently suppressed.

[0030] However, it is more preferable that the content of PPS resin in the base resin is 2% by mass or more. In this case, the fluidity of the resin composition can be further increased, making it easier to mold the resin composition. However, if the MVR of the PEEK resin is sufficiently high, it is not necessarily necessary to blend PPS resin. In other words, if the MVR of the PEEK resin is sufficiently high, the content of PPS resin in the base resin may be 0% by mass.

[0031] <Silica> Examples of silica used in one embodiment of the present invention include amorphous silica (fused silica) and crystalline silica (quartz, cristobalite, etc.).

[0032] The silica may be either amorphous silica or crystalline silica, but amorphous silica is preferred as the silica used in one embodiment of the present invention. In this case, amorphous silica has lower hardness than crystalline silica, and therefore can more sufficiently prevent damage to equipment used in molding and processing the resin composition.

[0033] The silica may be spherical or pulverized amorphous, but spherical is preferred, as this improves the fluidity of the material when blended with the base resin and the dimensional accuracy of the molded product compared to when pulverized amorphous silica is used instead of spherical silica.

[0034] When the silica has a spherical shape, it is particularly preferred that the silica is produced by a fusion process.

[0035] The sphericity of silica is generally expressed by circularity, and the circularity is preferably 0.80 or more. In this case, optical communication components with a lower anisotropy of the linear expansion coefficient can be molded. The circularity is more preferably 0.85 or more, and particularly preferably 0.90 or more. Here, the circularity of silica is defined by taking a projection image of each silica particle and using the perimeter of the projection image and the perimeter of the equivalent circle according to the following formula (2): (Circularity) = (Perimeter of Equivalent Circle) / (Perimeter of Particle Projected Image) (2) Specifically, the circularity is measured using a flow particle image analyzer FPIA-1000 manufactured by Sysmex Corporation, and the average of the measured values ​​is taken as the circularity. Typically, the number of particles sampled is about 200.

[0036] In the above formula (2), the "equivalent circle" refers to a virtual circle having the same area as the projected image of the silica particle to be measured; if the particle is perfectly spherical, the projected image will also be perfectly circular, and the circularity will be 1. If the perimeter of one projected particle image is L and the area is S, the circularity can be calculated using the following formula: Circularity = 4πS / L ２

[0037] The average particle size of the silica is not particularly limited, but is preferably 1 μm or more. In this case, the resin composition has higher fluidity and is more excellent in moldability than when the average particle size of the silica is less than 1 μm, and therefore the dimensional accuracy of the molded product obtained by molding the resin composition is further improved.

[0038] However, the average particle size of the silica is preferably 30 μm or less, which can improve the mechanical strength and dimensional accuracy of the resin composition compared to when the average particle size of the silica exceeds 30 μm.

[0039] The average particle size is a value measured by a laser diffraction scattering particle size distribution measuring device.

[0040] In one embodiment of the present invention, a portion of the silica may be replaced with an inorganic filler having a thermal expansion coefficient lower than that of silica. Such an inorganic filler may be a known inorganic filler, such as a negative thermal expansion (NTE) inorganic filler.

[0041] (Silica Content) The resin composition according to one embodiment of the present invention contains 55 parts by mass or more and 75 parts by mass or less of silica, when the total amount of the base resin and silica is 100 parts by mass. This allows for better dimensional accuracy of optical communication components compared to when the silica content is less than 55 parts by mass, when the total amount of the base resin and silica is 100 parts by mass. Furthermore, when the total amount of the base resin and silica is 100 parts by mass, the resin composition has higher fluidity than when the silica content is more than 75 parts by mass, and optical communication components can be more easily molded.

[0042] From the viewpoint of dimensional stability, the content of silica in the resin composition according to one embodiment of the present invention is more preferably 58 parts by mass or more, and particularly preferably 60 parts by mass or more, when the total amount of the base resin and silica is 100 parts by mass.

[0043] Furthermore, from the viewpoint of the fluidity of the resin composition, the content of silica in the resin composition according to one embodiment of the present invention is preferably 73 parts by mass or less, and particularly preferably 71 parts by mass or less, when the total amount of the base resin and silica is 100 parts by mass.

[0044] The total content of the base resin and silica in the resin composition according to one embodiment of the present invention is 98% by mass or more, preferably 99% by mass or more, based on the total amount (100% by mass) of the resin composition. The upper limit of the total content of the base resin and silica is, for example, 100% by mass or less, preferably less than 100% by mass, more preferably 99.9% by mass or less, and even more preferably 99.8% by mass or less.

[0045] <Higher Fatty Acids> The resin composition according to one aspect of the present invention contains at least one higher fatty acid selected from the group consisting of higher fatty acids, higher fatty acid esters, and higher fatty acid salts, thereby achieving the effect of suppressing thickening of the resin composition containing a PEEK resin as a main component due to heating.

[0046] Here, in this specification, "higher fatty acids" is a general term for higher fatty acids, higher fatty acid esters, and higher fatty acid salts. The higher fatty acids may be used singly or in combination of two or more. The higher fatty acids used in the resin composition according to one aspect of the present invention are preferably higher fatty acids. The higher fatty acids used in the resin composition according to one aspect of the present invention may be higher fatty acid esters or higher fatty acid salts. Higher fatty acid esters and higher fatty acid salts can be decomposed by heating to produce higher fatty acids, and therefore, by adding them to the resin composition according to one aspect of the present invention, the same effects as higher fatty acids can be achieved.

[0047] Examples of higher fatty acids include alkyl groups and alkenyl groups having 9 to 36 carbon atoms, and fatty acids having two or more unsaturated bonds. The hydrogen atoms of the fatty acids may be substituted with hydroxyl groups, and the fatty acids may be branched. Specific examples of higher fatty acids used in the resin composition according to one embodiment of the present invention include saturated fatty acids such as capric acid, undecylic acid, lauric acid, tridecylic acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid, 12-hydroxystearic acid, nonadecylic acid, arachidic acid, heicosylic acid, behenic acid, tricosylic acid, lignoceric acid, cerotic acid, montanic acid, melissic acid, and tetratriacontanoic acid; and straight-chain unsaturated fatty acids such as 4-decenoic acid, 4-dodecenoic acid, palmitoleic acid, α-linolenic acid, linoleic acid, γ-linolenic acid, stearidonic acid, petroselinic acid, oleic acid, elaidic acid, vaccenic acid, eicosapentaenoic acid, docosapentaenoic acid, and docosahexaenoic acid. One type of higher fatty acid may be used alone, or two or more types may be used in combination.

[0048] The higher fatty acid is preferably a fatty acid having 10 to 28 carbon atoms, more preferably a fatty acid having 16 to 28 carbon atoms. The higher fatty acid is preferably at least one higher fatty acid selected from the group consisting of palmitic acid, stearic acid, behenic acid, and montanic acid, more preferably stearic acid.

[0049] Examples of higher fatty acid esters include esters of the above-mentioned higher fatty acids and alcohols. The type of alcohol is not particularly limited. Specific examples of higher fatty acid esters used in the resin composition according to one embodiment of the present invention include myristyl palmitate, butyl stearate, behenyl behenate, octyldodecyl behenate, stearyl stearate, glycerin monopalmitate, glycerin monostearate, glycerin monooleate, glycerin distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, and pentaerythritol tetrastearate. One type of higher fatty acid ester may be used alone, or two or more types may be used in combination.

[0050] Examples of higher fatty acid salts include alkali metal salts and alkaline earth metal salts of the above-mentioned higher fatty acids. The higher fatty acid salt used in the resin composition according to one embodiment of the present invention is preferably a metal salt of a long-chain fatty acid having 16 to 36 carbon atoms, and examples include metal stearates such as magnesium stearate, calcium stearate, zinc stearate, aluminum stearate, sodium stearate, and lithium stearate. One type of higher fatty acid salt may be used alone, or two or more types may be used in combination.

[0051] (Content of higher fatty acids) The content of higher fatty acids in the resin composition according to one embodiment of the present invention is not particularly limited. By including higher fatty acids in the resin composition according to one embodiment of the present invention, an effect of suppressing thickening of the resin composition due to heating can be obtained. For example, the content of higher fatty acids in the resin composition according to one embodiment of the present invention can be 0.001 parts by mass or more and 2.0 parts by mass or less when the total amount of the base resin and silica is 100 parts by mass.

[0052] From the viewpoint of further improving the effect of suppressing thickening of the resin composition due to heating, the content of higher fatty acids in the resin composition according to one embodiment of the present invention is more preferably 0.005 parts by mass or more, and particularly preferably 0.01 parts by mass or more, when the total amount of the base resin and silica is 100 parts by mass.

[0053] Furthermore, from the viewpoint of the mechanical strength of the resin composition, the content of higher fatty acids in the resin composition according to one embodiment of the present invention is preferably 1.0 part by mass or less, and particularly preferably 0.5 part by mass or less, when the total amount of the base resin and silica is 100 parts by mass.

[0054] <Antioxidant and Layered Double Hydroxide> From the viewpoint of improving the effect of suppressing thickening of the resin composition due to heating, it is preferable that the resin composition according to one aspect of the present invention further contains at least one selected from the group consisting of an antioxidant and a layered double hydroxide. By containing the resin composition according to one aspect of the present invention in combination with the above-mentioned higher fatty acid and at least one selected from the group consisting of an antioxidant and a layered double hydroxide, the effect of suppressing thickening of the resin composition due to heating is further improved.

[0055] From the viewpoint of further improving the effect of suppressing thickening of the resin composition due to heating, it is more preferable that the resin composition according to one aspect of the present invention contains all of a higher fatty acid, an antioxidant, and a layered double hydroxide.

[0056] The antioxidant and layered double hydroxide used in the resin composition according to one embodiment of the present invention will be specifically described below.

[0057] (Antioxidant) Examples of the antioxidant used in the resin composition according to one embodiment of the present invention include conventionally known antioxidants used for the purpose of preventing oxidation of resin compositions, such as phenol-based antioxidants, phosphorus-based antioxidants, thioether-based antioxidants, etc. These may be used alone or in combination of two or more.

[0058] From the viewpoint of the effect of suppressing thickening of the resin composition due to heating, the antioxidant is preferably at least one selected from the group consisting of phenolic antioxidants and phosphorus-based antioxidants, more preferably at least one selected from the group consisting of hindered phenolic antioxidants and phosphate ester-based antioxidants, and even more preferably a combination of a hindered phenolic antioxidant and a phosphate ester-based antioxidant.

[0059] The phenolic antioxidant and the phosphorus-based antioxidant used in the resin composition according to one embodiment of the present invention will be specifically described below.

[0060] (Phenol-based antioxidant) Examples of the phenol-based antioxidant include conventionally known compounds that have a phenol structure and exhibit antioxidant effects. Specific examples of the phenol-based antioxidant include 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol, 2-tert-butyl-4,6-dimethylphenol, styrenated phenol, 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 2,2'-thiobis-(6-tert-butyl-4-methylphenol), 2,2'-thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl] ... nate], 2-methyl-4,6-bis(octylsulfanylmethyl)phenol, 2,2'-isobutylidenebis(4,6-dimethylphenol), isooctyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, 2,2'-oxamido-bis[ethyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2 -ethylhexyl-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate, 2,2'-ethylenebis(4,6-di-tert-butylphenol), 3,5-di-tert-butyl-4-hydroxy-benzenepropanoic acid and C13-15 alkyl ester, 2,5-di-tert-amylhydroquinone, hindered phenol polymer (manufactured by Adeka Palmarol, trade name "AO.OH.98"), 2,2'-methylenebis[6-(1-methylcyclohexyl)-p-crezo] ol], 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, 6-[3-(3-tert-butyl-4-hydroxy-5-methyl)propoxy]-2,4,8,10-tetra-tert-butylbenz[d,f][1,3,2]-dioxaphosphobin, hexamethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, bis[monoethyl(3,5-di-tert-butyl-4-hydroxybenzyl)phosphonate]calcium salt, reaction products of 5,7-bis(1,1-dimethylethyl)-3-hydroxy-2(3H)-benzofuranone with o-xylene, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol, DL-α-tocopherol (vitamin E), 2,6-bis(α-methylbenzyl)-4-methylphenol, bis [3,3-bis-(4'-hydroxy-3'-tert-butyl-phenyl)butanoic acid] glycol ester, 2,6-di-tert-butyl-p-cresol, 2,6-diphenyl-4-octadecyloxyphenol, stearyl (3,5-di-tert-butyl-4-hydroxyphenyl)propionate, distearyl (3,5-di-tert-butyl-4-hydroxybenzyl)phosphonate, tridecyl-3,5-tert-butyl-4-hydroxybenzylthioacetate, thiodiethylenebis[(3,5-di-tert-butyl-4-hydroxy hydroxyphenyl)propionate], 4,4'-thiobis(6-tert-butyl-m-cresol), 2-octylthio-4,6-di(3,5-di-tert-butyl-4-hydroxyphenoxy)-s-triazine, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), bis[3,3-bis(4-hydroxy-3-tert-butylphenyl)butylic acid]glycol ester, 4,4'-butylidenebis(2,6-di-tert-butylphenol), 4,4'-butylidenebis(6-tert-butyl-3-methyl phenol), 2,2'-ethylidenebis(4,6-di-tert-butylphenol), 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, bis[2-tert-butyl-4-methyl-6-(2-hydroxy-3-tert-butyl-5-methylbenzyl)phenyl]terephthalate, 1,3,5-tris(2,6-dimethyl-3-hydroxy-4-tert-butylbenzyl)isocyanurate, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)isocyanurate, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-2,4,6-trimethylbenzene (manufactured by ADEKA Corporation, trade name "ADEKA STAB AO-330"), 1,3,5-tris[(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxyethyl]isocyanurate, tetrakis[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, 2-tert-butyl-4-methyl-6-(2-acryloyloxy-3-tert-butyl- 5-methylbenzyl)phenol, 3,9-bis[2-(3-tert-butyl-4-hydroxy-5-methylhydrocinnamoyloxy)-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, triethylene glycol bis[β-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate], stearyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid amide, palmityl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide 3-(3,5-dialkyl-4-hydroxyphenyl)propionic acid derivatives such as N,N'-bis[2-[2-(3,5-di-tert-butyl-4-hydroxyphenyl)ethylcarbonyloxy]ethyl]oxamide, N,N'-(1,3-propanediyl)bis[3,5-di-tert-butyl]propionic acid amide, myristyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid amide, lauryl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid amide, -4-hydroxybenzenepropanamide], 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 4-[[4,6-bis(octylthio)-1,3,5-triazin-2-yl]amino]-2,6-di-tert-butylphenol, N,N'-bis[3-(4-hydroxyphenyl)propanamide], bis[3-[3,5-di(tert-butyl)-4-hydroxyphenyl]propionic acid]thiobisethylene, N,N'-(1,6-hexanediyl)bis[3,5-di-tert-butyl-4-hydroxybenzenepropanamide], octyl 3-(4-hydroxy-3,5-diisopropylphenyl)propionate, calcium bis[3,5-di-tert-butyl-4-hydroxybenzyl(ethoxy)phosphonate], 2,4-bis(octylthiomethyl)-6-methylphenol, 2,5,7,8-tetramethyl-2-(4,8,12-trimethyltridecyl)-2H-1-benzopyran-6-ol, etc. These may be used alone or in combination of two or more.

[0061] (Phosphorus-Based Antioxidant) The phosphorus-based antioxidant can be appropriately selected from conventionally known phosphorus-based antioxidants, such as phosphate ester compounds, phosphite ester compounds, and phosphate compounds.

[0062] Specific examples of the phosphate ester compound and the phosphite ester compound include bis(decyl)pentaerythritol diphosphite, bis(diisodecyl)pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, bis(stearyl)pentaerythritol diphosphite, trilaurylthiophosphite heptakis(dipropylene glycol) triphosphite bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4,6-tri-tert-butylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite poly(dipropylene glycol)phenyl phosphite, tetra(tridecyl)isopropylidenediphenol diphosphite, tetra(tridecyl)-4,4'-n-butylidenebis(2-tert-butyl-5-methylphenol)diphosphite, hexa(tridecyl) -1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane triphosphite, tetrakis(2,4-di-tert-butylphenyl)[1,1-biphenyl]-4,4'-diylbisphosphonite, tetrakis(2,4-di-tert-butyl-5-methylphenyl)-4,4'-biphenylidenephosphonite, tetra(C12-C15 alkyl)-4,4'-isopropylidenediphenyl diphosphite, alkyl(C10)bisphenol A phosphite, 4,4'-butylidene-bis(3-methyl-6-te tert-butylphenylditridecyl) phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-butyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-ethylhexyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-decyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-dodecyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-octadecyl phosphite, 2,2'-Ethylenebis(4,6-di-tert-butylphenyl)fluorophosphite, 6-ethylhexyl-2,4,8,10-tetra-tert-butyldibenzo[d.f][1,3,2]dioxaphosphepine, 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d.f] f][1,3,2]dioxaphosphepine (Sumilizer-GP), triethyl phosphite, tris(2-ethylhexyl)phosphite, tri(decyl)phosphite, triisodecyl phosphite, triisooctyl phosphite, trilauryl phosphite, tris(tridecyl)phosphite, tristearyl phosphite, tris(dipropylene glycol)phosphite, trioleyl phosphite, trisnonylphenyl phosphite, dioleylhydrogen phosphite, diisooctylphenyl phosphite, di(decyl)monophenyl phosphite, diphenyl mono(2-ethylhexyl)phosphite, diphenyl monodecyl phosphite, diphenyl mono(tridecyl)phosphite, Diphenyl octyl phosphite, diphenyl isooctyl phosphite, diphenyl isodecyl phosphite, diphenyl tridecyl phosphite, diisooctyl phosphite, bis(tridecyl) phosphite, bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite, tris[2-[(2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-6-yl)oxy]ethyl]amine, tris(2,4-di-tert-butylphenyl)phosphite, tetraphenyl dipropyl glycol diphosphite, 2,4,6-tri-tert-butylphenyl-2-butyl-2-ethyl-1,3-propanediol phosphite, tetrakis(2,Examples of suitable esters include 4-di-tert-butylphenyl)biphenylene diphosphonite, hydrogenated bisphenol-A-pentaerythritol phosphite polymer (manufactured by Johoku Chemical Industry Co., Ltd., trade name "JPH-3800"), 2-hydroxyethyl methacrylate acid phosphate (manufactured by Johoku Chemical Industry Co., Ltd., trade name "JPA-514"), stearyl bisphenol-A phosphite polymer (manufactured by Johoku Chemical Industry Co., Ltd., trade name "HBP"), stearyl acid phosphate zinc salt (manufactured by Johoku Chemical Industry Co., Ltd., trade name "JP-518Zn"), and condensed phosphate ester (manufactured by Daihachi Chemical Industry Co., Ltd., trade name "SR-3000"). These may be used alone or in combination of two or more.

[0063] Examples of the phosphate compound include inorganic or organic metal phosphate compounds of ammonium, sodium, calcium, zinc, potassium, aluminum, magnesium, zirconium, barium, lithium, or rare earth elements, etc. These may be used alone or in combination of two or more.

[0064] Specific examples of inorganic phosphate compounds include anhydrous monosodium phosphate, monosodium phosphate monohydrate or dihydrate, anhydrous disodium phosphate, disodium phosphate dihydrate, disodium phosphate heptahydrate, disodium phosphate octahydrate or disodium phosphate dodecahydrate, hexagonal anhydrous trisodium phosphate, cubic anhydrous trisodium phosphate, trisodium phosphate hemihydrate, trisodium phosphate hexahydrate, trisodium phosphate octahydrate, trisodium phosphate dodecahydrate, ammonium dihydrogen phosphate, etc. These may be used alone or in combination of two or more.

[0065] A specific example of the organometallic phosphate compound is sodium 2,2'-methylenebis(4,6-di-tert-butylphenyl)phosphate (manufactured by ADEKA Corporation, trade name "ADEKA STAB Na-11"). These compounds may be used alone or in combination of two or more.

[0066] (Antioxidant Content) The resin composition according to one embodiment of the present invention preferably contains 0.05 parts by mass or more and 0.35 parts by mass or less of an antioxidant when the total amount of the base resin and silica is 100 parts by mass. This improves the effect of suppressing thickening of the resin composition due to heating compared to when the antioxidant content is less than 0.05 parts by mass when the total amount of the base resin and silica is 100 parts by mass. Furthermore, when the total amount of the base resin and silica is 100 parts by mass, the mechanical strength of the resin composition can be ensured compared to when the antioxidant content is more than 0.35 parts by mass.

[0067] From the viewpoint of improving the effect of suppressing thickening of the resin composition due to heating, the content of the antioxidant in the resin composition according to one aspect of the present invention is more preferably 0.1 parts by mass or more, and particularly preferably 0.2 parts by mass or more, when the total amount of the base resin and silica is 100 parts by mass.

[0068] Furthermore, from the viewpoint of ensuring the mechanical strength of the resin composition, the content of the antioxidant in the resin composition according to one aspect of the present invention is preferably 0.3 parts by mass or less, and particularly preferably 0.25 parts by mass or less, when the total amount of the base resin and silica is 100 parts by mass.

[0069] When two or more different types of antioxidants are used in combination, the total content of the antioxidants in the resin composition according to one aspect of the present invention may be within the above-mentioned range. Furthermore, the ratio of the content of the two or more antioxidants may be appropriately adjusted and is not particularly limited. For example, when the antioxidant is a combination of a phenolic antioxidant and a phosphorus-based antioxidant, the ratio of the content of the phenolic antioxidant to the content of the phosphorus-based antioxidant (phenolic antioxidant:phosphorus-based antioxidant) is preferably in the range of 0.2:1 or more and 5:1 or less, more preferably 1:1, in terms of mass ratio, from the viewpoint of improving the effect of suppressing thickening of the resin composition due to heating.

[0070] (Layered double hydroxides) Layered double hydroxides (hereinafter abbreviated as "LDH") are inorganic compounds having a layered crystal structure of hydroxides of divalent metal ions and trivalent metal ions, and having a structure containing anions between the layers of the layered crystal structure (also called a "hydrotalcite structure"), or a calcined product thereof. The divalent metal ions constituting the layered double hydroxides are, for example, Mg ２＋ , Mn ２＋ , Fe ２＋ , Co ２＋ , Ni ２＋ , Cu ２＋ , and Zn ２＋ The trivalent metal ion is, for example, Al ３＋ , Fe ３＋ , Cr ３＋ , Co ３＋ , and In ３＋ The anion may be, for example, OH － , F － , Cl － ,Br － , NO ３ － , CO ３ -, SO ４ ２－ , Fe(CN) ６ ３－ and CH ３ COO － , molybdate ion, polymolybdate ion, vanadate ion, and polyvanadate ion. Layered double hydroxides are sometimes called "hydrotalcite-like compounds."

[0071] As the layered double hydroxide, any natural or synthetic layered double hydroxide can be used as long as it is a compound having a hydrotalcite structure, and these can also be used in combination. Furthermore, the layered double hydroxide can be used without any restrictions on its crystal structure, crystal particle size, etc.

[0072] The layered double hydroxide may have a divalent metal ion of Mg ２＋ and the trivalent metal ion is Al ３＋ Mg-Al-based layered compound in which the divalent metal ion is Mg ２＋and the trivalent metal ion is Fe ３＋ Mg—Fe-based layered compound in which the divalent metal ion is Fe ２＋ and the trivalent metal ion is Fe ３＋ Fe-Fe based layered compound in which the divalent metal ion is Zn ２＋ and the trivalent metal ion is Al ３＋ These may be used alone or in combination of two or more.

[0073] Among these, from the viewpoint of heat resistance and stabilization, the layered double hydroxide is preferably an Mg—Al-based layered compound, and more preferably hydrotalcite.

[0074] (Layered double hydroxide content) The resin composition according to one embodiment of the present invention preferably contains 0.1 to 0.5 parts by mass of layered double hydroxide, relative to 100 parts by mass of the total of the base resin and silica. This improves the effect of suppressing thickening of the resin composition due to heating, compared to when the layered double hydroxide content is less than 0.1 parts by mass, relative to 100 parts by mass of the total of the base resin and silica. Furthermore, compared to when the layered double hydroxide content is more than 0.5 parts by mass, relative to 100 parts by mass of the total of the base resin and silica, outgassing during molding can be suppressed, ensuring moldability.

[0075] From the viewpoint of improving the effect of suppressing thickening of the resin composition due to heating, the content of the layered double hydroxide in the resin composition according to one embodiment of the present invention is more preferably 0.15 parts by mass or more, and particularly preferably 0.2 parts by mass or more, when the total amount of the base resin and silica is 100 parts by mass.

[0076] Furthermore, from the viewpoint of suppressing outgassing during molding, the content of the layered double hydroxide in the resin composition according to one embodiment of the present invention is preferably 0.4 parts by mass or less, and particularly preferably 0.3 parts by mass or less, when the total amount of the base resin and silica is 100 parts by mass.

[0077] <Other Components> The resin composition according to one embodiment of the present invention may further contain other components as needed in addition to the components described above, as long as the object of the present invention is not impaired. Examples of other components include optional additives such as weathering agents, lubricants, plasticizers, antistatic agents, colorants, and inorganic fillers other than silica.

[0078] Specific examples of inorganic fillers other than silica include inorganic whiskers such as potassium titanate, nano-silica, and nano-fillers such as carbon nanofibers (hereinafter referred to as CNF), which micro-reinforce materials and can impart properties such as electrical conductivity, surface slipperiness, and smoothness to the resin composition according to one embodiment of the present invention.

[0079] The content of each additive in the resin composition may be adjusted as appropriate from the viewpoint of the performance expression of each additive. Furthermore, from the viewpoint of reducing the influence on the physical properties of the resulting molded article, the total content of the additives in the resin composition is preferably 1% by mass or less, and more preferably 0.5% by mass or less, based on the total amount (100% by mass) of the resin composition.

[0080] <Properties and Form of Resin Composition for Optical Communication Components> The level of the thickening suppression effect of the resin composition for optical communication components according to one embodiment of the present invention is not particularly limited, but for example, the longer the thickening time obtained by the long-term retention evaluation test described in the Examples below, the better. For example, the thickening time is preferably 30 minutes or more, more preferably 40 minutes or more, even more preferably 50 minutes or more, and even more preferably 60 minutes or more.

[0081] The resin composition having a thickening time of 30 minutes or more has a sufficiently high effect of suppressing thickening due to heating, and therefore has good molding stability in, for example, injection molding, and is therefore suitable for use as a resin composition for producing optical communication components by injection molding.

[0082] The form of the resin composition for optical communication components according to one embodiment of the present invention is not particularly limited, and may be any form, such as powder, granules, pellets, etc. From the viewpoint of ease of injection molding, the resin composition for optical communication components according to one embodiment of the present invention is preferably in the form of pellets.

[0083] <Method for producing resin composition for optical communication components> The resin composition for optical communication components according to one embodiment of the present invention can be obtained by powder-mixing a base resin, silica, higher fatty acids, etc., followed by melt-kneading. Kneading can be performed using a kneader such as a single-screw extruder or a twin-screw kneading extruder.

[0084] [2. Optical Communication Component] Next, an optical communication component according to one aspect of the present invention will be described.

[0085] The optical communication component according to one aspect of the present invention includes the resin composition for an optical communication component described above. The resin composition for an optical communication component according to one aspect of the present invention in the optical communication component according to one aspect of the present invention has already been described, so description thereof will not be repeated here.

[0086] The resin composition for optical communication components described above can easily mold optical communication components, can impart excellent dimensional accuracy to the optical communication components, and can sufficiently suppress thermal deformation of the optical communication components even when heated at solder reflow temperatures. Therefore, the optical communication components of the present invention have excellent appearance and dimensional accuracy, and can sufficiently suppress thermal deformation even when heated at solder reflow temperatures.

[0087] Examples of optical communication components include ferrules for optical connectors, sleeves for housing ferrules, etc. Among these, the present invention is particularly effective for ferrules for optical connectors, which require extremely high dimensional accuracy and are sometimes mounted on circuit boards and subjected to solder reflow.

[0088] The optical connector of the ferrule for optical connector may be a single-core optical connector or a multi-core optical connector. Examples of the ferrule include an MT ferrule, an SC ferrule, and an LC ferrule.

[0089] <Method for Producing Optical Communication Component> The optical communication component according to one aspect of the present invention can be produced by molding the above-described resin composition for an optical communication component by, for example, injection molding or transfer molding.

[0090] [Summary] The resin composition for optical communication components according to aspect 1 of the present invention contains a base resin containing a polyether ether ketone resin as a main component, silica, and at least one higher fatty acid selected from the group consisting of higher fatty acids, higher fatty acid esters, and higher fatty acid salts, and contains 55 parts by mass or more and 75 parts by mass or less of the silica when the total amount of the base resin and the silica is 100 parts by mass.

[0091] In the resin composition for optical communication components according to Aspect 2 of the present invention, in Aspect 1, the higher fatty acids are preferably higher fatty acids.

[0092] In the resin composition for optical communication components according to Aspect 3 of the present invention, in Aspect 1 or 2, the higher fatty acid is preferably stearic acid.

[0093] The resin composition for optical communication components according to Aspect 4 of the present invention is preferably the resin composition for optical communication components according to any one of Aspects 1 to 3, further comprising an antioxidant.

[0094] In the resin composition for optical communication components according to Aspect 5 of the present invention, in the above-mentioned Aspect 4, it is preferable that the antioxidant is at least one selected from the group consisting of hindered phenol-based antioxidants and phosphate ester-based antioxidants.

[0095] The resin composition for optical communication components according to Aspect 6 of the present invention is preferably any one of Aspects 1 to 5, further comprising a layered double hydroxide.

[0096] A resin composition for optical communication components according to Aspect 7 of the present invention is preferably the same as Aspect 6, in which the layered double hydroxide is hydrotalcite.

[0097] The resin composition for optical communication components according to Aspect 8 of the present invention is preferably any one of Aspects 1 to 7, wherein the base resin further comprises at least one resin selected from the group consisting of polyarylene sulfide resins, polyethersulfone resins, polyetherimide resins, and liquid crystalline resins having a melting point of 300°C or higher.

[0098] A ninth aspect of the present invention relates to the resin composition for optical communication components of the eighth aspect, wherein the base resin further contains the polyarylene sulfide resin.

[0099] A resin composition for optical communication components according to Aspect 10 of the present invention is the resin composition for optical communication components according to Aspect 9, wherein the polyarylene sulfide resin is preferably a polyphenylene sulfide resin.

[0100] In the resin composition for optical communication components according to Aspect 11 of the present invention, in Aspect 10, the content of the polyphenylene sulfide resin in the base resin is preferably 20 mass % or less.

[0101] A twelfth aspect of the present invention provides a resin composition for optical communication components, in any one of the first to eleventh aspects, wherein the polyether ether ketone resin is 100 cm ３ It is preferable that the resin has a melt volume rate of 10 minutes or more (melt volume rate conditions: resin temperature 380°C, load 5 kg, conforming to ISO 1133).

[0102] An optical communication component according to Aspect 13 of the present invention includes the resin composition for an optical communication component according to any one of Aspects 1 to 12 above.

[0103] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in the embodiments are also included in the technical scope of the present invention.

[0104] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.

[0105] [Raw Materials for Resin Composition] The raw materials for the resin compositions used in the Examples and Comparative Examples are as follows.

[0106] <Base Resin> As the base resin, a mixed resin obtained by mixing the following PEEK resin and the following PPS resin at a specific ratio was used.

[0107] (PEEK resin) Daicel-Evonik Co., Ltd., trade name "1000P"; p, q, and r in the formula (1) are 0; MVR measured according to ISO 1133 at 380°C under a load of 5 kg is 150 cm ３ / 10 min (PPS resin) Tosoh Corporation, trade name "#140" <Silica> Surface-treated spherical amorphous silica (trade name "TSS-6 vinylsilane treatment", Tatsumori Co., Ltd., circularity: 0.93, average particle size: 5 μm) was used.

[0108] <Higher fatty acids> Stearic acid (trade name "Sakura Stearic Acid", manufactured by NOF Corporation) <Antioxidants> (Phenol-based antioxidants) Hindered phenol-based antioxidant (trade name "ADK STAB AO-330", manufactured by ADEKA Corporation, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-2,4,6-trimethylbenzene) (Phosphorus-based antioxidants) Phosphate ester-based antioxidant (trade name "SR-3000", manufactured by Daihachi Chemical Industry Co., Ltd., condensed phosphate ester) <Layered double hydroxides> Hydrotalcite (trade name "DHT-4C", manufactured by Kyowa Chemical Industry Co., Ltd.) [Examples 1 to 3, Comparative Examples 1 to 3] The components were uniformly dry-blended using a Henschel mixer in the compounding ratios shown in Table 1, and then melt-kneaded at a resin temperature of 380 to 410°C using a twin-screw kneading extruder (product name "TEM37SS", manufactured by Toshiba Machine Co., Ltd.) to obtain pellets of the resin composition. In Table 1, the unit of compounding amount is parts by mass, and the values ​​shown are those when the total amount of the base resin and silica is 100 parts by mass.

[0109] [Long-term retention evaluation] Pellets of the resin composition of Example 1 were charged into a small batch kneader (product name "Labo Plastomill (registered trademark)", manufactured by Toyo Seiki Seisakusho, Ltd.), and the molten resin was kneaded for a long time at a barrel temperature of 400°C, and the rotational torque of the screw was measured. The rotational torque of the screw at the start of kneading was defined as the initial torque, and the time required for the rotational torque of the screw to become twice the initial torque was defined as the thickening time. The thickening time was also measured in the same manner for each of the resin compositions of Examples 2 to 3 and Comparative Examples 1 to 3.

[0110] [Results] The results are shown in Table 1.

[0111]

[0112] In a resin composition containing silica and a base resin primarily composed of PEEK resin, the PPS contained in the base resin is thought to decompose due to heat when exposed to high temperatures, such as the processing temperature of PEEK resin, for a long period of time, becoming a source of radicals that induce a crosslinking reaction of the PEEK resin. Furthermore, the surface functional groups of the filler silica contain silanol groups (Si—OH), which are thought to become a source of radicals when exposed to high temperatures.

[0113] However, a comparison between Comparative Example 1 and Comparative Example 3 revealed that there was no change in the thickening time even when antioxidants (phenolic antioxidant and phosphorus-based antioxidant) and hydrotalcite were added to a resin composition containing silica and a base resin containing PEEK resin as the main component.

[0114] In Examples 1 to 3, in which stearic acid was further added, the thickening time was longer than in Comparative Example 3, in which stearic acid was not added. In particular, in Example 3, in which a phenolic antioxidant and a phosphorus-based antioxidant were used in combination as antioxidants, the thickening suppression effect of adding stearic acid was more remarkable, and the thickening time was more than twice as long as that of Comparative Example 1.

[0115] The above results show that by adding stearic acid to a resin composition containing a base resin containing PEEK resin as the main component and silica, it is possible to suppress thickening of the resin composition due to heating.

[0116] The resin composition according to one aspect of the present invention can be suitably used as a resin composition for optical communication components.

Claims

1. A resin composition for optical communication components, comprising: a base resin containing a polyether ether ketone resin as a main component; silica; and at least one higher fatty acid selected from the group consisting of higher fatty acids, higher fatty acid esters, and higher fatty acid salts, wherein the silica is contained in an amount of 55 parts by mass or more and 75 parts by mass or less when the total amount of the base resin and the silica is 100 parts by mass.

2. The resin composition for optical communication parts according to claim 1, wherein the higher fatty acids are higher fatty acids.

3. The resin composition for optical communication parts according to claim 1, wherein the higher fatty acid is stearic acid.

4. The resin composition for optical communication parts according to claim 1, further comprising an antioxidant.

5. The resin composition for optical communication parts according to claim 4, wherein the antioxidant is at least one selected from the group consisting of hindered phenol-based antioxidants and phosphate ester-based antioxidants.

6. The resin composition for optical communication parts according to claim 1, further comprising a layered double hydroxide.

7. The resin composition for optical communication parts according to claim 6, wherein the layered double hydroxide is hydrotalcite.

8. A resin composition for optical communication components according to claim 1, wherein the base resin further contains at least one resin selected from the group consisting of polyarylene sulfide resins, polyethersulfone resins, polyetherimide resins, and liquid crystalline resins having a melting point of 300°C or higher.

9. The resin composition for optical communication parts according to claim 8, wherein the base resin further contains the polyarylene sulfide resin.

10. The resin composition for optical communication parts according to claim 9, wherein the polyarylene sulfide resin is a polyphenylene sulfide resin.

11. The resin composition for optical communication components according to claim 10, wherein the content of said polyphenylene sulfide resin in said base resin is 20 mass % or less.

12. The polyether ether ketone resin is 100 cm ３ 2. The resin composition for optical communication parts according to claim 1, having a melt volume rate of 10 minutes or more (melt volume rate conditions: resin temperature 380°C, load 5 kg, conforming to ISO 1133).

13. An optical communication part comprising the resin composition for optical communication parts according to any one of claims 1 to 12.

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