Optical connector module and manufacturing method thereof

Abstract

The optical connector module of the present invention comprises: an optical fiber guide including an optical element provided on a first surface of a first body, a first magnetic body provided on a second surface of the first body, and a first coupling hole penetrating through the first surface and the second surface of the first body; an optical fiber block including a second magnetic body provided on a first surface of a second body and a second coupling hole penetrating through the first surface and the second surface of the second body; and an optical signal transmission member inserted into the second coupling hole. The optical fiber guide and the optical fiber block of the optical connector module may be coupled by the first magnetic body and the second magnetic body.

Description

Optical connector module and manufacturing method thereof

[0001] The present invention relates to an optical connector module and a manufacturing method thereof for improving the accuracy of alignment between an optical element and an optical fiber and production efficiency.

[0002] With the advancement of communication technology, data transmission and reception between electronic devices and between components within electronic devices is now occurring accurately and quickly.

[0003] Copper-based cables are often used for communication between electronic devices or between their internal components. However, using copper-based cables for communication can result in signal attenuation, noise generation, and reduced capacity / high-speed data transmission.

[0004] Recently, communication technologies that transmit and receive data using optical signals are being developed to complement the shortcomings of communication using copper-based cables.

[0005] Communication using optical signals requires technology to connect two or more optical paths and technology to transmit, amplify, and merge optical signals by utilizing optical phenomena including refraction, reflection, interference, and diffraction of light.

[0006] Communication using an optical signal may include an optical element that transmits or receives an optical signal, a substrate that processes a signal received through the optical element and a signal to be transmitted, and a transmission cable that is provided adjacent to the optical element and transmits an optical signal to the optical element or from the optical element. The transmission cable here may be an optical cable.

[0007] When placing a transmission cable and an optical element on a substrate, there is a problem in which the efficiency of transmitting and receiving an optical signal is reduced due to misalignment between the transmission cable and the optical element.

[0008] The present invention aims to solve the above-mentioned problems and other problems.

[0009] The present invention provides an optical connector module that allows an optical fiber guide and an optical fiber block to be coupled using a magnetic material.

[0010] One aspect of the present invention provides an optical connector module and a manufacturing method thereof, which allows an optical fiber guide and an optical element to be coupled using a notch provided in an optical fiber guide and a solder ball mounted in the notch.

[0011] Another aspect of the present invention provides an optical connector module and a method for manufacturing the same, which allows an optical fiber of a transmission cable to be inserted into a coupling hole of an optical fiber guide through a guide surface provided on the optical fiber guide.

[0012] An optical connector module according to one aspect of the present invention includes an optical fiber guide including an optical element provided on a first surface of a first body, a first magnetic body provided on a second surface of the first body, and a first coupling hole penetrating from the first surface to the second surface of the first body; an optical fiber block including a second magnetic body provided on the first surface of the second body, and a second coupling hole penetrating from the first surface to the second surface of the second body; and an optical signal transmission member inserted into the second coupling hole. The optical fiber guide and the optical fiber block of the optical connector module according to one aspect of the present invention can be coupled by the first magnetic body and the second magnetic body.

[0013] The position of the optical signal region of the optical element of the optical connector module according to one aspect of the present invention may correspond to the position of the first coupling hole. The position of the first coupling hole of the optical fiber guide of the optical connector module according to one aspect of the present invention may correspond to the position of the second coupling hole of the optical fiber block.

[0014] An optical fiber guide of an optical connector module according to one aspect of the present invention further includes a mounting portion provided on a first surface of a first body and in which an optical element is mounted, a notch provided on the mounting portion and in which a solder ball is mounted, and a guide electrode provided adjacent to the notch.

[0015] The mounting portion of the optical fiber guide of the optical connector module according to one aspect of the present invention is a groove formed by recessing into the interior of the body from the first surface of the body through an etching process, and includes a bottom surface and a side surface surrounding the bottom surface. The side surface of the mounting portion may be an inclined surface.

[0016] According to one aspect of the present invention, the guide electrode of the optical fiber guide of the optical connector module can be connected to the electrode of the optical element by a solder ball.

[0017] An optical fiber block of an optical connector module according to one aspect of the present invention may further include a fixing agent provided on a second surface of the optical fiber block and provided at a portion where the second coupling hole and the optical signal transmission member are connected.

[0018] The optical fiber block of the optical connector module according to one aspect of the present invention may further include a guide surface connecting the second surface of the optical fiber block and the second coupling hole. The guide surface of the optical connector module according to one aspect of the present invention may be an inclined surface or a curved surface.

[0019] The first magnetic body of the optical connector module according to one aspect of the present invention may be plural, and the plural first magnetic bodies may be provided spaced apart from each other on the second surface of the first body.

[0020] The second magnetic body of the optical connector module according to one aspect of the present invention may be plural, and the plural second magnetic bodies may be provided spaced apart from each other on the first surface of the second body, but may be provided at positions corresponding to the plural first magnetic bodies, and may have a polarity opposite to that of the plural first magnetic bodies.

[0021] The first and second magnetic bodies of the optical connector module according to one aspect of the present invention may each include a magnetized ferromagnetic material.

[0022] An optical connector module according to one aspect of the present invention comprises: an optical fiber guide including a mounting portion provided on a first surface of a body, a notch provided on the mounting portion and into which a solder ball is mounted, a guide electrode provided adjacent to the notch, and a coupling hole penetrating from the first surface to the second surface of the body; an optical element including an optical signal region for transmitting and receiving an optical signal, the optical element mounted on the mounting portion; and a transmission cable including an optical fiber inserted into the coupling hole, wherein the optical element and the optical fiber guide are coupled by melting the solder ball in the notch by heat and pressure, and the optical signal region of the optical element can be aligned at a position corresponding to a position of the coupling hole by the pressure.

[0023] The mounting portion of the optical connector module according to one aspect of the present invention is a groove formed by recessing into the interior of the body from the first surface of the body through an etching process, and includes a bottom surface and a side surface surrounding the bottom surface, and the side surface of the mounting portion may be an inclined surface.

[0024] The guide electrode of the optical connector module according to one aspect of the present invention can be formed by extending from the first surface of the body through the side surface of the mounting portion to the bottom surface of the mounting portion through an electron beam deposition process.

[0025] The guide electrode of the optical connector module according to one aspect of the present invention can be formed by extending from the first surface of the body through the side surface of the mounting portion to the bottom surface of the mounting portion through an electron beam deposition process.

[0026] The notch of the optical connector module according to one aspect of the present invention may include a groove that extends from the surface of the guide electrode to the lower part of the bottom surface of the mounting portion.

[0027] In one aspect of the present invention, the optical connector module further includes an insulating film provided in an area excluding an area where the notch is provided and an area surrounding the notch, among the areas of the guide electrode, and the area where the notch is provided and the area surrounding the notch may be non-insulating areas.

[0028] A method for manufacturing an optical connector module according to one aspect of the present invention may include forming a mounting portion on a first surface of a body through first etching, depositing a guide electrode from the first surface of the body through a side surface of the mounting portion to a bottom surface of the mounting portion, forming a notch from a surface of the guide electrode to a lower portion of the bottom surface of the mounting portion through second etching, forming a coupling hole penetrating from the first surface of the body to a second surface through third etching, mounting a solder ball in the notch, arranging an optical element in the mounting portion, applying heat and pressure to melt the solder ball so that the optical fiber guide and the optical element are coupled, inserting an optical fiber into the coupling hole, and applying a fixing agent to the second surface of the body and the coupling hole.

[0029] According to the disclosed invention, the effects of the optical connector module according to the present invention and the optical wiring module including the same are described as follows.

[0030] According to at least one of the embodiments of the present invention, the present invention has the advantage that an optical element and an optical fiber can be naturally aligned with each other by a magnetic material, thereby increasing the efficiency of transmitting and receiving an optical signal through an optical wiring module, and increasing the production efficiency of an optical connector module and an optical wiring module.

[0031] Since the present invention provides an optical fiber guide and an optical fiber block that are separable and joined by a magnetic material, the optical fiber guide and the optical fiber block can be easily separated and joined, and the optical fiber block can be cleaned, so that contaminants in the optical fiber block can be easily removed.

[0032] Since the optical fiber guide and the optical fiber block are provided separately in the present invention, damage to the optical element can be prevented when the optical fiber is inserted into the optical fiber guide, and the lifespan of the optical fiber guide can be extended.

[0033] The present invention can reduce the depth of the mounting portion of the optical fiber guide by combining an optical element and an optical fiber guide using a notch and solder ball provided in the optical fiber guide, thereby reducing the size of the optical connector module.

[0034] The present invention can improve the degree of process freedom of the optical fiber guide mounting portion by reducing the depth of the optical fiber guide mounting portion, and can easily pattern the first and second guide electrodes on the optical fiber guide mounting portion. Through this, the present invention can improve the patterning process yield of the first and second guide electrodes.

[0035] The present invention can prevent short circuits, prevent peeling of the first and second guide electrodes, and improve the strength of the first and second guide electrodes by coating the first and second guide electrodes provided in the optical fiber guide with an insulating film.

[0036] The present invention can prevent short circuit between the first and second electrodes provided in the optical element by coating the first and second electrodes with an insulating film, can prevent peeling of the first and second electrodes, and can improve the strength of the first and second electrodes.

[0037] The present invention can improve the marketability of optical connector modules and optical wiring modules, and further increase user satisfaction, improve user reliability, and secure product competitiveness.

[0038] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0039] FIG. 1 is a drawing illustrating an optical wiring module including an optical connector module according to one embodiment of the present invention.

[0040] Figure 2 is an example diagram of the optical connector module illustrated in Figure 1.

[0041] Figure 3 is an exemplary drawing of a first surface of an optical fiber guide according to one embodiment.

[0042] FIG. 4 and FIG. 5 are exemplary drawings of a first magnetic body provided in an optical fiber guide according to one embodiment.

[0043] Figure 6 is a detailed illustration of an optical fiber guide according to one embodiment.

[0044] FIG. 7 is an example drawing of a notch and solder ball provided in an optical fiber guide according to one embodiment.

[0045] Figure 8 is an example drawing of a guide electrode and a notch provided in an optical fiber guide according to one embodiment.

[0046] FIG. 9 is an exemplary diagram of an insulating film provided on an optical fiber guide according to one embodiment.

[0047] FIG. 10 is a drawing showing a first process of a method for manufacturing an optical fiber guide according to one embodiment.

[0048] Fig. 11 is a drawing showing a second process of a method for manufacturing an optical fiber guide according to one embodiment.

[0049] Fig. 12 is a drawing showing the third process of a method for manufacturing an optical fiber guide according to one embodiment.

[0050] Fig. 13 is a drawing showing the fourth process of a method for manufacturing an optical fiber guide according to one embodiment.

[0051] FIG. 14 and FIG. 15 are drawings showing the fifth process of a method for manufacturing an optical fiber guide according to one embodiment.

[0052] Fig. 16 is an exemplary diagram of a manufacturing method for combining an optical fiber guide (20) and an optical element (40) according to one embodiment.

[0053] Fig. 17 is an exemplary diagram of a method for manufacturing an optical fiber block (500) according to one embodiment.

[0054] Fig. 18 is an example of a combination of an optical fiber guide and an optical fiber block according to one embodiment.

[0055] Figure 19 is an exemplary diagram of an optical fiber block according to another embodiment.

[0056] Fig. 20 is a cross-sectional view of an optical fiber block according to another embodiment.

[0057] FIG. 21 is a drawing showing an example of a manufacturing method for forming a guide surface of an optical fiber block according to another embodiment.

[0058] FIG. 22 is a drawing showing another example of a manufacturing method for forming a guide surface of an optical fiber block according to another embodiment.

[0059] Fig. 23 is an example of a combination of an optical fiber guide and an optical fiber block according to another embodiment.

[0060] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be assigned the same reference numbers, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the convenience of writing the specification, and do not in themselves have distinct meanings or roles.

[0061] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of a related known technology may obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of the present invention.

[0062] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0063] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0064] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0065] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0066]

[0067] FIG. 1 is a drawing illustrating an optical wiring module including an optical connector module according to one embodiment of the present invention.

[0068] As illustrated in FIG. 1, the optical wiring module (100) can perform a function of converting an electrical signal into an optical signal and transmitting it, and can perform a function of receiving an optical signal and converting it into an electrical signal.

[0069] The optical wiring module (100) can transmit an optical signal to another optical wiring module (not shown) through the optical signal transmission member (400), and can receive an optical signal transmitted from another optical wiring module through the optical signal transmission member (400). The optical signal may contain data. That is, the optical wiring module (100) can transmit and receive data through the optical signal. The optical wiring module (100) can transmit a large amount of data, such as VR and 3D image content, at high speed while minimizing phenomena such as signal attenuation and noise. The optical signal transmission member (400) may include at least one of a transmission cable, an optical component, an optical waveguide, and an optical substrate. That is, any device that transmits and receives an optical signal can be used as the optical signal transmission member (400). Hereinafter, an example is described in which the optical signal transmission member (400) is a transmission cable, but as described above, the optical signal transmission member (400) may be an optical element, an optical waveguide, an optical substrate, etc.

[0070] The optical wiring module (100) may include an optical connector module (10), a main board (50), a light emitting control element (70) mounted on the main board (50), and an electrical connector (90).

[0071] The optical connector module (10) can serve as a contact point connecting the transmission cable (400) and the main board (50). That is, the optical connector module (10) can be a contact point that generates and transmits an optical signal and can be a contact point that receives an optical signal transmitted from another optical wiring module.

[0072] The optical connector module (10) can have a direct effect on the efficiency of transmission and reception of optical signals. For example, assuming that light generated by the optical connector module (10) is transmitted through a transmission cable (400), if the virtual first optical path with the strongest intensity of the generated light is aligned with the virtual second optical path passing through the center of a specific optical fiber included in the transmission cable (400), factors that negatively affect the transmission efficiency of light, such as reflection, refraction, and diffraction, can be minimized. In other words, it can be said that the light-emitting surface or light-receiving surface of the optical element that generates or receives an optical signal must be positioned parallel to the end of the optical fiber that is adjacent to or in contact with it. In other words, it can be said that the light-emitting surface or light-receiving surface of the optical element that generates or receives an optical signal must be positioned at an optimal position with respect to the central axis of the optical fiber.

[0073] This can be more clearly understood by considering a case where the first optical path, through which the generated light is emitted, and the second optical path, which is the centerline of the optical fiber, are not aligned but rather tilted. In other words, if the first and second optical paths are not aligned but rather tilted, the transmission and reception efficiency of the optical signal is reduced.

[0074] An optical connector module (10) according to one embodiment of the present invention can be naturally installed at a position where the efficiency of transmission and reception of optical signals is optimized during the manufacturing process of the optical connector module (10).

[0075] Figure 2 is an example diagram of the optical connector module illustrated in Figure 1.

[0076] As illustrated in Fig. 2, an optical connector module (10) according to one embodiment of the present invention can be mounted on a main board (50). A transmission cable (400) can be connected to the optical connector module (10).

[0077] An optical connector module (10) according to one embodiment of the present invention may include an optical fiber guide (20), an optical element (40), and an optical fiber block (500).

[0078] The optical fiber guide (20) can be produced using a MEMS (Micro Electro-Mechanical System) process. The MEMS process allows for high yield and freedom in product design. Therefore, even when the product design changes, the optical fiber guide (20) corresponding to the changed design can be easily produced. Considering the market situation, price competitiveness is an important factor in the success of the optical fiber guide (20). Production of the optical fiber guide (20) using the MEMS process can increase yield, thereby increasing productivity, and achieve material cost reduction and improved assembly.

[0079] The optical fiber guide (20) can connect the optical element (40) and the transmission cable (400) to each other through the optical fiber block (500).

[0080] The optical fiber guide (20) may include a body (20a) forming an exterior. The body of the optical fiber guide (20) may be a first body.

[0081] An optical element (40) can be coupled to a first surface (a1) of the body of the optical fiber guide (20), and an optical fiber block (500) can be coupled to a second surface (a2) of the body. The optical fiber guide (20) can electrically and communicatively connect the optical element (40) and the transmission cable (400) through coupling between the optical element (40) and the optical fiber block (500).

[0082] The structure of the optical fiber guide (20) and the optical fiber block (500) for coupling the optical element (40) and the transmission cable (400), and the coupling configuration of the optical fiber guide (20) and the optical fiber block (500) will be described in detail later.

[0083] By coupling the optical element (40) to the optical fiber guide (20), the center of the optical fiber guide (20) can be naturally aligned with the center of the optical element (40). Accordingly, light output from the center of the optical element (40) can be incident on the center of the optical fiber (420) coupled to the optical fiber guide (20), or light transmitted through the optical fiber (420) can be incident on the center of the optical element (40). In other words, this means that the transmission or reception efficiency of light can be maintained high in the optical connector module (10) without using the conventional active alignment method that is costly and time-consuming.

[0084] The optical element (40) may include at least one of a light-emitting element and a light-receiving element. In the present embodiment, an example in which both a light-emitting element and a light-receiving element are included in the optical element is described.

[0085] The optical element (40) can operate according to a control signal of the control element (70). For example, when an electric signal of the control element (70) is input, the optical element (40) can operate accordingly to generate an optical signal.

[0086] The optical element (40) can be composed of GaAs, InGaAs, or InP materials.

[0087] The thermal expansion coefficient of the material constituting the optical element (40) may be equal to or similar to the thermal expansion coefficient of the optical fiber guide (20) in contact with the optical element (40). Therefore, even if the optical element (40) expands or contracts due to temperature changes, the alignment with the optical fiber guide (20) located at a position where the transmission or reception efficiency of the optical element (40) is optimized may not be misaligned. In other words, it can be said that the optical element (40) and the optical fiber guide (20) have the same expansion or contraction amount. In other words, when the direction parallel to the light-emitting surface or light-receiving surface of the optical element (40) is referred to as the first direction, it can be said that the expansion or contraction amounts of the optical element (40) and the optical fiber guide (20) in the first direction are substantially the same.

[0088] The optical element (40) can be fixed to the optical fiber guide (20) by the first fixing agent (44).

[0089] The first fixing member (44) is provided on the outer surface of the optical fiber guide (20) and the optical element (40), and may be provided at the part where the optical fiber guide (20) and the optical element (40) are connected.

[0090] The first fixing agent (44) may be a thermosetting and / or photocurable resin including at least one of epoxy, liquid silicone, and urethane. The first fixing agent (44) may be an elastic body.

[0091] The optical fiber guide (20) coupled with the optical element (40) can be fixed to the main substrate (50) by a second fixing agent (33). The second fixing agent (33) can be a solder ball.

[0092] The second fixing member (33) may be provided on the first surface of the optical fiber guide (20). Here, the first surface of the optical fiber guide (20) may be the surface to which the optical element (40) is coupled.

[0093] The second fixing member (33) may also be provided on the second surface of the optical fiber guide (20). The second surface of the optical fiber guide (20) may be the surface to which the optical fiber block (500) is coupled.

[0094] The second fixing member (33) provided on the first surface of the optical fiber guide (20) can be coupled to the guide electrode (23). The second fixing member (33) provided on the first surface of the optical fiber guide (20) can electrically and physically connect the guide electrode (25) and the electrode (not shown) of the main substrate (50).

[0095] The optical fiber guide (20) may further include a reinforcing plate (not shown) to reinforce the rigidity of the optical fiber guide (20). In this case, the second fixing member provided on the second surface of the optical fiber guide (20) may be coupled to the reinforcing plate (not shown).

[0096] The stability of the optical connector module (10) can be secured through the second fixing agent (33). In the case of the Butt Coupling method according to one embodiment of the present invention, when the optical fiber guide (20) is coupled in a vertical direction with respect to the plane of the main board (50), the transmission cable (400) can be coupled in the plane direction of the main board (50) through the optical fiber block (500). When the transmission cable (400) is coupled through the optical fiber block (500), a force is applied in the X or -X direction, which is the plane direction of the main board (50), and if the coupling of the optical fiber guide (20) is weak, the alignment may be misaligned.

[0097] According to one embodiment of the present invention, an optical connector module (10) including an optical fiber guide (20) is stably coupled to a main board (50) through a second fixing member (33), thereby preventing a situation in which alignment is disturbed.

[0098] When the optical fiber guide (20) and the optical element (40) are combined, a protective material (not shown) can be applied to the outer surface of the optical fiber guide (20) and the optical element (40). By applying the protective material (not shown), contamination of the optical fiber guide (20) can be prevented and the strength can be increased.

[0099] The optical fiber guide (20) may include a first magnetic body (m1) provided on the second surface. There may be at least two first magnetic bodies (m1).

[0100] The transmission cable (400) may include a covering (410) and an optical fiber (420) provided inside the covering (410). The covering (410) may be a portion that wraps around the outside of the optical fiber (420) to protect the optical fiber (420). The optical fiber (420) may be a portion that includes a core or a core and a cladding.

[0101] The transmission cable (400) can be coupled to an optical fiber block (500).

[0102] According to one embodiment of the present invention, the optical fiber (420) can be coupled to a pre-designed position of the optical fiber block (500). Here, the pre-designed position may be a coupling hole (i.e., a second coupling hole) provided in the optical fiber block (500). In other words, it can be said that the optical fiber (420) can be coupled to an accurate position within the optical fiber block (500) without using an active alignment method that requires a lot of money and time. In other words, it can be said that a passive alignment method that requires less money and time is used.

[0103] The optical fiber block (500) includes a body (500a) forming an exterior, and may include a second magnetic body (m2) provided on a first surface (501) of the body (500a). There may be at least two second magnetic bodies (m2). The body of the optical fiber block (500) may be a second body.

[0104] The second magnetic body (m2) of the optical fiber block (500) can be magnetically coupled to the first magnetic body (m1) of the optical fiber guide (20). That is, the optical fiber block (500) and the optical fiber guide (20) can be coupled to each other using the magnetic bodies (m1, m2). Through this, the optical element (40) coupled to the optical fiber guide (20) and the optical fiber (420) coupled to the optical fiber block (500) can be precisely aligned.

[0105] The transmission cable (400) can be fixed to the optical fiber block (500) by the third fixing agent (430).

[0106] The third fixing member (430) is provided on the second surface (502) of the body (500a) of the optical fiber block (500) and the outer surface of the transmission cable (400), and may be provided at the part where the second surface of the optical fiber block (500) and the transmission cable (400) are connected.

[0107] The third fixing agent (430) may be a thermosetting and / or photocurable resin including at least one of epoxy, liquid silicone, and urethane. The third fixing agent (430) may be an elastomer.

[0108]

[0109] The structure of the optical fiber guide is described with reference to FIGS. 3 to 9.

[0110] FIG. 3 is an exemplary drawing of a first surface of an optical fiber guide according to one embodiment, and FIGS. 4 and 5 are exemplary drawings of a first magnetic body provided in an optical fiber guide according to one embodiment.

[0111] FIG. 6 is a detailed illustration of an optical fiber guide according to one embodiment, FIG. 7 is an illustration of a notch and a solder ball provided in an optical fiber guide according to one embodiment, FIG. 8 is an illustration of a guide electrode and a notch provided in an optical fiber guide according to one embodiment, and FIG. 9 is an illustration of an insulating film provided in an optical fiber guide according to one embodiment.

[0112] As illustrated in Fig. 3, it is also possible to provide multiple optical fiber guides (20) in one body (20a). The structures of the multiple optical fiber guides (20) provided in one body (20a) may be identical to each other.

[0113] Each of the plurality of optical fiber guides (20) may include a mounting portion (21) formed by being recessed inward from a first surface (a1) of a body (20a), a first coupling hole (22) provided in the mounting portion (21), first and second guide electrodes (23, 24) provided by extending from the first surface (a1) of the body (20a) to the mounting portion (21), and first and second notches (25, 26) provided in the mounting portion (21) and adjacent to the first and second guide electrodes (23, 24), respectively, and recessed into the interior of the mounting portion (21). Here, the interior of the mounting portion (21) may be the interior of the body (20a).

[0114] The first coupling hole (22) may be an empty space. In this case, the first coupling hole (22) may function as a transmission path for an optical signal through which an optical signal is transmitted and received after coupling the optical fiber guide (20) and the optical fiber block (500).

[0115]

[0116] As illustrated in Fig. 4, one or more first magnetic materials (m1) may be provided on the second surface (a2) of the body of the optical fiber guide (20).

[0117] When a plurality of first magnetic bodies (m1) are provided, the plurality of first magnetic bodies (m1) may be provided spaced apart from each other.

[0118] As shown in (a) of Fig. 4, a plurality of first magnetic bodies (m1: m11, m12) are provided on the outer portions on both sides of the second surface (a2) of the body, and may be provided along the short-side direction.

[0119] The outer portions on both sides of the second side (a2) of the body may include the outer portion of the first joining hole (22) based on the first joining hole (22).

[0120] As shown in (b) of Fig. 4, a plurality of first magnetic bodies (m1: m11, m12) are provided on each of the outer portions on both sides of the second surface (a2) of the body, and may be provided along the long side direction.

[0121] As shown in (c) of Fig. 4, a plurality of first magnetic bodies (m1: m11, m12, m13) are provided on the outer and central portions of both sides of the second surface (a2) of the body, and may be provided along the short-side direction.

[0122] The number and arrangement positions of the first magnetic body (m1) illustrated in FIG. 4 are merely an example of the arrangement of the first magnetic body when a plurality of optical fiber guides are provided in one body, and the number and arrangement positions of the first magnetic body are not limited thereto.

[0123] As illustrated in Fig. 5, when one optical fiber guide (20) is provided in one body (20a), the first magnetic body (m1) may be placed on the second surface (a2) of the body (20a), and may be placed around the first coupling hole (22) with the first coupling hole (22) as the center.

[0124] As shown in (a) of Fig. 5, a plurality of first magnetic bodies (m1: m11, m12) may be respectively arranged on the left and right sides of the first coupling hole (22) with the first coupling hole (22) as the center, or may be respectively arranged above and below the first coupling hole (22).

[0125] As shown in (b) of Fig. 5, a plurality of first magnetic bodies (m1: m11, m12, m13, m14) are arranged on the outer portion of the second surface (a2) of the body (20a), but may also be arranged above, below, left, and right of the first coupling hole (22) with the first coupling hole (22) as the center.

[0126] As illustrated in (c) of Fig. 5, the first magnetic body (m1) may be provided on the entire second surface (a2) of the body of the optical fiber guide (20) excluding the first coupling hole. In this case, there may be one first magnetic body (m1).

[0127] As illustrated in (d) of FIG. 5, the first magnetic body (m1) is provided on the entire second surface (a2) of the body of the optical fiber guide (20) excluding the first coupling hole, but it is also possible to provide the first magnetic body (m1) on the second surface (a2) of the body of the optical fiber guide (20) excluding the area within the first predetermined distance from the outer edge of the second surface and the area within the second predetermined distance from the edge of the first coupling hole (22). In this case, there may be one first magnetic body (m1).

[0128] The first magnetic material (m1) may be produced by nano-depositing a ferromagnetic material and then magnetizing it.

[0129] The first magnetic body (m1) may be provided at a position corresponding to the position of the second magnetic body of the optical fiber block. The first magnetic body (m1) may also be provided in a shape corresponding to the shape of the second magnetic body of the optical fiber block.

[0130] As illustrated in Fig. 6, the mounting portion (21) may include a bottom surface (21a) and a plurality of side surfaces (21b) surrounding the bottom surface (21a).

[0131] The plurality of side surfaces (21b) may be inclined slopes. Therefore, the width (W1) of the inlet side of the mounting portion (21) may be wider than the width (W2) of the bottom surface (21a) of the mounting portion (21).

[0132] The fixing portion (21) may be provided in a square shape, but the shape of the fixing portion (21) is not limited thereto.

[0133] When the shape of the optical element (40) is a cylindrical shape, the bottom surface (21a) and the side surface (21b) of the mounting portion may be provided in a shape corresponding to the shape of a single cylindrical shape. In this case, the bottom surface (21a) of the mounting portion may be circular, and the side surface (21b) of the mounting portion may be in the shape of an inclined cylindrical shape.

[0134] The first coupling hole (22) may be provided at a position corresponding to the light-emitting surface and light-receiving surface of the optical element (40) among the positions of the bottom surface (21a) of the mounting portion (21). The light-emitting surface and light-receiving surface of the optical element (40) are referred to as the optical signal area (41) of the optical element (40).

[0135] The first guide electrode (23) can be provided to extend from the first surface (a1) of the body (20a) through the side surface (21b) of the mounting portion to the bottom surface (21a) of the mounting portion.

[0136] The second guide electrode (24) may be provided to extend from the first surface (a1) of the body (20a) through the side surface (21b) of the mounting portion to the bottom surface (21a) of the mounting portion. The second guide electrode (24) may be provided to be spaced apart from the first guide electrode (23) by a certain distance.

[0137] The second guide electrode (24) may be provided to be insulated from the first guide electrode (23).

[0138] The first guide electrode (23) can be connected to the first electrode (42) of the optical element (40), and the second guide electrode (24) can be connected to the second electrode (43) of the optical element (40).

[0139] The polarities of the first guide electrode (23) and the second guide electrode (24) may be different from each other. For example, when the first guide electrode (23) is an anode, the second guide electrode (24) may be a cathode.

[0140] The first guide electrode (23) and the second guide electrode (24) can be provided in the body (2a) of the optical fiber guide in the form of a strip.

[0141] The first and second notches (25, 26) may be provided on the bottom surface (21a) of the mounting portion and may be spaces in which solder balls (36) are mounted and received.

[0142] The first and second notches (25, 26) may be provided in the shape of a cone, a hemisphere, a tetrahedron, or a hexahedron, and the shape of the first and second notches is not limited thereto.

[0143] The size (S) of the entrance side of each notch may be larger than the diameter of the solder ball (36).

[0144] As shown in Fig. 7, the size (S) of the entrance side of each notch is a size that can stably seat the solder ball (36), and may be a size greater than 1 / 4 of the diameter of the solder ball (36), but the size of the entrance side of the notch is not limited thereto.

[0145] The entrance side of each notch may be a portion positioned horizontally with the bottom surface (21a) of the mounting portion among the areas of the notch.

[0146] The capacity of the space forming each notch may be equal to or smaller than the capacity of the solder ball (36). This allows the solder ball to be accommodated inside the notch before melting, and allows some of the melted solder ball to flow out to the periphery of the notch when melting the solder ball. Here, the periphery of the notch may be the surface of the guide electrode. That is, since only a part of each melted solder ball (36) comes into contact with the guide electrode (23, 24) and the electrode (42, 43) of the optical element, and most of each melted solder ball (36) is accommodated inside each notch, each melted solder ball cannot flow out of the first and second guide electrodes (23, 24).

[0147] By providing solder balls (36) and first and second notches (25, 26) for joining the optical element (40) on the bottom surface (21a) of the mounting portion, the depth (D) of the mounting portion for joining the optical element (40) can be minimized.

[0148] By minimizing the depth of the mounting portion (21), the degree of freedom of the process of the mounting portion of the optical fiber guide (20) can be improved, and the size of the optical connector module can be reduced.

[0149] Here, minimizing the depth of the mounting portion (21) means minimizing the length of the side surface (21b) of the mounting portion. By minimizing the length of the side surface (21b) of the mounting portion in this way, the first and second guide electrodes (23, 24) can be easily patterned on the side surface (21b) of the mounting portion of the optical fiber guide. Through this, the present invention can improve the patterning process yield of the first and second guide electrodes (23, 24).

[0150] The first notch (25) can be provided on the first guide electrode (23) or can be provided around the first guide electrode (23).

[0151] The second notch (26) may be provided on the second guide electrode (24) or may be provided around the second guide electrode (24).

[0152] The structures of these first and second notches (25, 26) may be identical. An example of the structure of the first notch (25) is described with reference to Fig. 8.

[0153] As shown in (a) of Fig. 8, the first notch (25) may be provided in a portion of the first guide electrode (23).

[0154] A part of the first guide electrode (23) may be an area of ​​the first guide electrode (23) provided on the bottom surface (21a) of the mounting portion among the areas of the first guide electrode (23).

[0155] The first notch (25) may be formed to extend from a portion of the first guide electrode (23) to the inside of the mounting portion (21). The first guide electrode (23) may not be formed on the surface of the first notch (25). The first notch (25) may be a groove formed in a portion of the first guide electrode (23). The groove formed in a portion of the first guide electrode (23) may extend to the inside of the mounting portion (21) to form the first notch (25).

[0156] As illustrated in (b) of Fig. 8, the first notch (25) may be a groove formed on the bottom surface (21a) of the mounting portion. The first notch (25) may be provided around the first guide electrode (23), but may be provided adjacent to the first guide electrode (23).

[0157] The first notch (25) can be provided in an area corresponding to the position of the end of the first guide electrode (23) among the areas of the bottom surface (21a) of the mounting portion.

[0158] In this case, the first guide electrode (23) may be provided to extend from the surface of the body (20a) through the side surface (21b) of the mounting portion to the bottom surface (21a) of the mounting portion, and may extend to the boundary line of the first notch (25).

[0159] As shown in (c) of Fig. 8, the first notch (25) may be a groove formed on the bottom surface (21a) of the mounting portion. A first guide electrode (23) may be provided on the surface of the first notch (25).

[0160] That is, the first guide electrode (23) can be provided on the bottom surface (21a) of the mounting portion and the surface of the first notch (25).

[0161] The first guide electrode (23) can be provided up to the area surrounding the first notch (25) among the areas of the bottom surface (21a) of the mounting portion.

[0162] The first guide electrode (23) may be provided to extend from the surface of the body (20a) through the side surface (21b) of the mounting portion to the bottom surface (21a) of the mounting portion, and may extend through the first notch (25) to the surrounding area of ​​the first notch.

[0163] In this case, the first and second guide electrodes (23, 24) can be said to include the first and second notches (25, 26).

[0164] As shown in (d) of Fig. 8, the first guide electrode (23) is provided on the bottom surface (21a) of the mounting portion and the surface of the first notch (25), but it is also possible to provide it up to the boundary line of the first notch (25) in the area of ​​the bottom surface (21a) of the mounting portion.

[0165] The first guide electrode (23) may be provided to extend from the surface of the body (20a) through the side surface (21b) of the mounting portion to the bottom surface (21a) of the mounting portion, and may extend through the first notch (25) to the boundary line of the first notch.

[0166] In this case, the first and second guide electrodes (23, 24) can be said to include the first and second notches (25, 26).

[0167]

[0168] Referring to Fig. 2, the combined configuration of the optical fiber guide (20) and the optical element (40) is described.

[0169] As illustrated in Fig. 2, an optical element (40) can be mounted on the mounting portion (21) of the optical fiber guide. By mounting the optical element (40) on the mounting portion (21) of the optical fiber guide (20), the optical element (40) can come into contact with the optical fiber guide (20).

[0170] By providing the optical fiber guide (20) and the optical element (40) so that they can be in contact, the optical fiber guide (20) and the optical element (40) can be combined.

[0171] At least one of the surfaces of the optical element (40) can be mounted on the mounting portion (21) of the optical fiber guide (20). Through this, at least one of the surfaces of the optical element (40) can be provided so as to be in contact with the optical fiber guide (20).

[0172] For example, at least one surface of the optical element (40) may be a surface including an optical signal region (41). As another example, at least one surface of the optical element (40) may include an optical signal region and two or four surfaces provided adjacent to the optical signal region.

[0173] When the optical element (40) is mounted on the mounting portion (21) of the optical fiber guide (20), the optical element (40) can be electrically and physically connected to the first and second guide electrodes (23, 24) through the solder ball (36). In addition, the first and second guide electrodes (23, 24) can be electrically and physically connected to the main substrate (50). As a result, the optical element (40) can be electrically connected to the main substrate (50) through the first and second guide electrodes (23, 24).

[0174] When combining the optical fiber guide (20) and the optical element (40), the solder ball (36) may be provided around the first and second guide electrodes (23, 24) of the optical fiber guide (20). The solder ball (36) may also be provided on the first and second electrodes (42, 43) of the optical element (40).

[0175]

[0176] As illustrated in FIG. 9, the optical fiber guide (20) may further include an insulating film (28) provided on some areas of the surfaces of the first and second guide electrodes (23, 24) and in the area between the first guide electrode (23) and the second guide electrode (24).

[0177] The insulating film (28) may be composed of silicon oxide (SiO2) and / or silicon nitride (Si3N4) materials, and / or nitride.

[0178] The insulating film (28) may be a film formed by a coating method.

[0179] The insulating film (28) can be provided in an area of ​​the body (20a) or the mounting portion (21) excluding the bonding area (29).

[0180] The bonding area (29) is an area where solder balls (36) are bonded and may be a non-insulating area.

[0181] The bonding area (29) may include the area of ​​the first and second notches (25, 26) and the area of ​​the surface adjacent to the first and second notches (25, 26) among the surfaces of the first and second guide electrodes (23, 24).

[0182] The insulating film (28) of the first and second guide electrodes may be a film formed by coating only the area for insulation, excluding the bonding area (29) of the first and second guide electrodes.

[0183] The bonding region (29) of the first and second guide electrodes may be a region formed by removing the insulating film coated on the bonding region (29) after coating the insulating film (28) on the first and second guide electrodes.

[0184] An insulating film may also be provided in some areas of the first and second electrodes (42, 43) of the optical element (40). Among the areas of the first and second electrodes of the optical element, an insulating film may be provided in an area corresponding to the position of the insulating film (28) of the first and second guide electrodes (23, 24).

[0185] The optical element (40) may have a non-insulating region (i.e., a bonding region of the first and second electrodes) provided in a region corresponding to the bonding region (29) of the first and second guide electrodes (23, 24) among the regions of the first and second electrodes.

[0186] The solder balls (36) accommodated in the first and second notches (25, 26) can be melted by heat and pressure. By melting the solder balls (36), the insides of the first and second notches (25, 26) can be filled with the solder balls. A portion of the melted solder balls (36) can contact the bonding areas of the first and second guide electrodes (23, 24), and the remainder of the melted solder balls can contact the bonding areas of the first and second electrodes (42, 43) of the optical element.

[0187] The optical element (40) and the optical fiber guide (20) can be brought into contact and joined by the molten solder ball (36).

[0188] Due to the first and second notches (25, 26) and the bonding area (29) of the first and second guide electrodes, even when the solder ball (36) is melted, the molten solder ball (36) may not overflow the bonding area (29). Accordingly, bonding by the solder ball can be performed more stably, and the occurrence of defects due to overflow or flow of the molten solder ball (36) can be prevented in advance.

[0189] Since the first and second guide electrodes (23, 24) are coated with an insulating film (28), the first and second guide electrodes (23, 24) can be prevented from being peeled off by heat when the solder ball (36) is melted.

[0190]

[0191] FIG. 10 is a drawing showing a first process of a method for manufacturing an optical fiber guide according to one embodiment.

[0192] As illustrated in (a) of Fig. 10, the first process may include a pretreatment process for flattening the surface of the wafer. Here, the wafer may be the body (20a) of the optical fiber guide.

[0193] As illustrated in (b) of Fig. 10, the first process may further include an oxidation process of applying high temperature heat to the body (20a) to oxidize the body (20a). The oxidation process may be a process of depositing an oxide film (SiO2, 101) that serves as an insulating film on the body (20a).

[0194] At this time, an oxide film can be deposited on the first and second surfaces (a1, a2) of the body (20a).

[0195]

[0196] Fig. 11 is a drawing showing a second process of a method for manufacturing an optical fiber guide according to one embodiment.

[0197] The second process may be a process of forming a mounting portion (21) in the body (20a).

[0198] As shown in (a) of FIG. 11, the second process may include a process of coating a photoresist (PR: Photo Resist, 102) on an oxide film (101) deposited on a body (20a), aligning a mask on the photoresist, and then irradiating light to form a photoresist pattern on the photoresist (102) through exposure and development.

[0199] The coating method may include spin coating or slit coating.

[0200] The mask may have a pattern engraved on it that corresponds to the photoresist pattern.

[0201] Performing exposure and development may be performing lithography.

[0202] As shown in (b) of Fig. 11, the second process includes forming an oxide film pattern corresponding to the photoresist pattern through etching.

[0203] The photoresist pattern is a portion where no fixing portion is formed, and may be a photoresist (102) that remains on the body in the form of a pattern.

[0204] The oxide film pattern is a portion where no settling portion is formed, and may be an oxide film (101) that remains on the body in the form of a pattern.

[0205] The etching here may be SiO2 etching or wet etching.

[0206] As illustrated in (c) of Fig. 11, the second process may include stripping the patterned photoresist (101). At this time, only the patterned oxide film (101) may remain on the body (20a).

[0207] As illustrated in (d) of Fig. 11, the second process may include performing etching based on a pattern-shaped oxide film (101). Performing etching based on the pattern-shaped oxide film (101) may include forming a mounting portion (21). The etching for forming the mounting portion here may be Si etching or wet etching.

[0208] As shown in (e) of Fig. 11, the second process may further include peeling off the pattern-shaped oxide film (101) after the formation of the fixing portion (21) is completed based on etching.

[0209] Stripping the oxide film in the form of a pattern may include stripping all of the acid-base films on the first and second sides (a1, a2) of the body.

[0210]

[0211] Fig. 12 is a drawing showing the third process of a method for manufacturing an optical fiber guide according to one embodiment.

[0212] The third process may be a process of forming first and second guide electrodes (23, 24) in the body (20a).

[0213] As illustrated in (a) of Fig. 12, the third process may include an oxidation process in which high temperature heat is applied to the body (20a) on which the fixing portion (21) is formed to oxidize the body (20a). The oxidation process may be a process in which an oxide film (SiO2, 103) serving as an insulating film is deposited on the body (20a).

[0214] Depositing the oxide film may include depositing an acid-base film (103) on both the first and second surfaces of the body.

[0215] As shown in (b) of Fig. 12, the third process may further include a process of coating a photoresist on an oxide film (103) deposited on a body (20a), aligning a mask on the photoresist, and then irradiating light to form a photoresist pattern on the photoresist (104) through exposure and development.

[0216] The mask may have patterns engraved on it corresponding to the first and second guide electrodes.

[0217] As illustrated in (c) of FIG. 12, the third process may include a process of depositing a conductive material (23) on a patterned photoresist (104) and an oxide film (103). The conductive material may include Cr or Au. The deposition of the conductive material may include electron beam evaporation.

[0218] As illustrated in (d) of Fig. 12, the third process may include a lift-off process for separating the patterned photoresist (103) and the conductive material (23) deposited on the photoresist. Through this, only the guide electrode (23) can be left on the body (20a).

[0219]

[0220] Fig. 13 is a drawing showing the fourth process of a method for manufacturing an optical fiber guide according to one embodiment.

[0221] The fourth process is a process of forming a first coupling hole (22) in the mounting portion (21) of the body (20a) of the optical fiber guide (20).

[0222] The fourth process includes a process of coating a photoresist on the second surface (a2) of the optical fiber guide (20).

[0223] Since an oxide film (103) is provided on the second surface of the optical fiber guide (20), a photoresist (105) can be coated on the oxide film (103) on the second surface of the optical fiber guide (20).

[0224] As shown in (a) of Fig. 13, the fourth process may further include a process of aligning a mask on a photoresist and then forming a photoresist pattern on the photoresist (105) through exposure and development by irradiating light.

[0225] The mask may have a pattern engraved corresponding to the first joining hole (22).

[0226] As illustrated in (b) of Fig. 13, the fourth process includes forming an oxide film pattern corresponding to a photoresist pattern on the second surface (a2) of the body (20a) of the optical fiber guide (20) through primary etching. Here, the primary etching may be SiO2 etching or RIE (Reactive Ion Etching).

[0227] The photoresist pattern may be a photoresist (105) remaining on the second surface (a2) of the body (20a) in the form of a pattern, in a portion where the first bonding hole (22) is not formed.

[0228] The oxide film pattern is a portion where the first bonding hole (22) is not formed, and may be an oxide film (103) remaining on the second surface (a2) of the body (20a) in the form of a pattern.

[0229] As shown in (c) of Fig. 13, the fourth process includes performing secondary etching based on a pattern-shaped oxide film (103) and a pattern-shaped photoresist (105).

[0230] As illustrated in (d) of Fig. 13, the fourth process may include peeling off the patterned photoresist (105) after the formation of the first bonding hole (22) is completed based on the secondary etching. Here, the secondary etching may be Si etching or DRIE (Deep Reactive Ion Etching).

[0231]

[0232] FIG. 14 and FIG. 15 are drawings showing the fifth process of a method for manufacturing an optical fiber guide according to one embodiment.

[0233] The fifth process may include a process of forming first and second notches (25, 26) in the body (20a) of the optical fiber guide.

[0234] The process of forming the first and second notches (25, 26) can be performed before forming the first and second guide electrodes or after forming the first and second guide electrodes, depending on the structure of the first and second notches.

[0235] Fig. 14 is a drawing showing an example of the fifth process of the method for manufacturing an optical fiber guide according to one embodiment, and is an exemplary drawing of the process of forming first and second notches in the first and second guide electrodes after forming the first and second guide electrodes. Fig. 14 is a cross-sectional view showing only the first notch portion, but the first and second notches may be formed simultaneously.

[0236] As shown in (a) of FIG. 14, the fifth process may include a process of coating a photoresist (106) on the first surface (a1) of the body (20a) on which the first and second guide electrodes (23, 24) are formed, aligning a mask on the photoresist, and then irradiating light to form a photoresist pattern on the photoresist (106) through exposure and development.

[0237] The mask may have a pattern engraved on it that corresponds to the photoresist pattern.

[0238] The photoresist pattern may be a photoresist (106) that remains on the body in the form of a pattern, in a portion where the first and second notches are not formed.

[0239] As shown in (b) of Fig. 14, the fifth process can perform etching based on a photoresist (106) in a pattern shape, and includes forming first and second notches (25, 26) through etching.

[0240] The etching here may be SiO2 or Si etching, or may be wet etching.

[0241] Forming each notch may include etching from the surface of each guide electrode through the oxide film (103) to the interior of the body (20a).

[0242] Forming each notch may include etching the oxide film (103) from the surface of each guide electrode.

[0243] As shown in (c) of FIG. 14, the fifth process may include peeling off a photoresist (106) in a pattern shape.

[0244]

[0245] Fig. 15 is a drawing showing another example of the fifth process of the method for manufacturing an optical fiber guide according to one embodiment, and is an exemplary drawing of the process of forming first and second notches in the first and second guide electrodes before forming the first and second guide electrodes. Fig. 15 is a cross-sectional view showing only the first notch portion, but the first and second notches may be formed simultaneously.

[0246] As shown in (a) of FIG. 15, the fifth process may include a process of coating a photoresist (107) on the first surface of the body (20a) on which an oxide film (103) is deposited, aligning a mask on the photoresist, and then irradiating light to form a photoresist pattern on the photoresist (107) through exposure and development.

[0247] The mask may have a pattern engraved on it that corresponds to the photoresist pattern.

[0248] The photoresist pattern may be a photoresist (107) that remains on the body in the form of a pattern, in a portion where no notch is formed.

[0249] As shown in (b) of Fig. 15, the fifth process can perform etching based on a photoresist (107) in a pattern form, and includes forming first and second notches (25, 26) through etching.

[0250] The etching here may be SiO2 or Si etching, or may be wet etching.

[0251] Forming each notch may involve etching from the surface of the oxide film to the interior of the body (20a).

[0252] Forming each notch may include etching a length corresponding to the thickness of the oxide film.

[0253] As illustrated in (c) of Fig. 15, the fifth process may include peeling off the patterned photoresist (107). Through this, the first and second notches (25, 26) can be formed in the mounting portion (21) of the body of the optical fiber guide (20).

[0254] As illustrated in (d) of Fig. 15, the first and second guide electrodes (23, 24) can be formed on a body having first and second notches (25, 26). At this time, the first guide electrode (23) can be formed in a space forming the first notch (25), and the second guide electrode (24) can be formed in a space forming the second notch (26). In other words, the first and second guide electrodes (23, 24) can be guide electrodes having the first and second notches (25, 26), respectively.

[0255] The electrode formation process of the first and second guide electrodes (23, 24) may be as shown in Fig. 10.

[0256]

[0257]

[0258]

[0259] Fig. 16 is an exemplary diagram of a manufacturing method for combining an optical fiber guide (20) and an optical element (40) according to one embodiment.

[0260] The bonding process for bonding the optical fiber guide (20) and the optical element (40) may include mounting solder balls (36) in the first and second notches (25, 26) formed in the mounting portion (21) of the body of the optical fiber guide (20), respectively.

[0261] The bonding manufacturing process may include securing and fixing solder balls (36) to the first and second notches through a primary bonding process.

[0262] The primary bonding process of the solder ball (36) may include an ultrasonic bonding process. Here, the primary bonding process may include picking up the solder ball (36), positioning and settling it in the first and second notches, and performing ultrasonic bonding when the settling of the solder ball in the first and second notches is completed.

[0263] Through this, it is possible to prevent in advance the phenomenon of the position of the solder ball (36) changing due to the movement of the optical element (40) when aligning the optical element (40) and the optical fiber guide. Through this, the speed of joining the optical element (20) and the optical element (40) can be increased, thereby increasing production efficiency, and defects due to changes in the position of the solder ball (36) can be prevented in advance.

[0264] The bonding manufacturing process may include performing a secondary bonding process of the solder ball after the primary bonding process of the solder ball (36) is completed so that the optical element (40) and the optical fiber guide (20) are bonded by the solder ball.

[0265] The secondary bonding process of the solder ball may include a reflow process.

[0266] The secondary bonding process of the solder ball may include bonding the solder ball (36) to the optical element (40) and the guide electrode (20) using heat, pressure, and / or laser irradiation with reflow equipment.

[0267] As illustrated in (a) of Fig. 16, the secondary bonding process of the solder ball includes placing the optical element on the upper side of the optical fiber guide to which the solder ball is first fixed.

[0268] The side surface of the mounting portion of the optical fiber guide (20) can be in contact with the edge of the optical element (40). In other words, the side surface of the mounting portion of the optical fiber guide (20) can be said to support the edge of the optical element.

[0269] On the bottom surface of the mounting portion of the optical fiber guide (20), a surface including an optical signal region among the surfaces of the optical element may be positioned. At this time, the first and second guide electrodes provided on the bottom surface of the mounting portion of the optical fiber guide (20) may be positioned adjacent to the first and second electrodes of the optical element, and may be positioned via solder balls (36).

[0270] The position of the first coupling hole of the optical fiber guide (20) and the position of the optical signal region of the optical element (40) can correspond to each other. As a result, the first coupling hole of the optical fiber guide (20) and the optical signal region of the optical element (40) can be naturally aligned.

[0271] As illustrated in (b) of FIG. 16, the secondary bonding process of the solder ball may include pressing the optical element using a compression jig provided on the upper side of the optical element to bring the optical element into close contact with the mounting portion of the optical fiber guide, applying a preset temperature and / or pressure while pressing the optical element using the compression jig to melt the solder ball, thereby bringing the first and second electrodes of the optical element (40) into close contact and contact with the first and second guide electrodes (23, 24) of the optical fiber guide.

[0272] By bringing the optical element into close contact with the mounting portion of the optical fiber guide, the optical element can be moved in the X direction. At this time, the position of the optical element can be moved in the Z direction or the -Z direction along the side surface (21b) of the mounting portion. The optical element (40) moving in the Z direction or the -Z direction comes into contact with two points of the side surface (21b) of the mounting portion and stops at a point where the coupling force in the -X direction is balanced. The point where the coupling force in the -X direction is balanced may be the bottom surface of the mounting portion.

[0273] The solder ball (36) can be positioned between the first and second electrodes and the first and second guide electrodes (23, 24) of the optical element (40). Through melting of the solder ball (36), the first electrode and the first guide electrode (23) of the optical element (40) can be electrically and physically connected, and the second electrode and the second guide electrode (24) of the optical element can be electrically and physically connected.

[0274] According to the solder ball (36), first and second guide electrodes (23, 24) and / or related configuration and assembly method according to one embodiment of the present invention, an electric circuit can be effectively configured while simplifying the assembly process. In addition, the solder ball (36) can be coupled to the correct position through the first and second processes for the solder ball (36) according to one embodiment of the present invention.

[0275] As illustrated in (c) of Fig. 16, the bonding process may include fixing the optical element (40) to the optical fiber guide (20) using a first fixing agent (44) after bonding of the optical element (40) and the optical fiber guide (20) is completed by solder balls.

[0276] The combined manufacturing process may include applying a first fixing agent (44) to the outer surface of the optical fiber guide (20) and the optical element (40), and applying the first fixing agent (44) to the portion where the optical fiber guide (20) and the optical element (40) are connected.

[0277] The first fixing agent (44) may be applied to the entire portion where the optical fiber guide (20) and the optical element (40) are connected.

[0278] The first fixing agent (44) may be a thermosetting and / or photocurable resin containing at least one of epoxy, liquid silicone, and urethane. The first fixing agent (44) may be an elastic body. In other words, the first fixing agent (44) may have a certain elasticity even after being cured. The first fixing agent (44) may play a role in absorbing a certain portion of deformation of the optical element (40), etc. For example, when the optical element (40) expands due to heat generation, the elasticity of the first fixing agent (44) means that even if the optical element (40) expands, the first fixing agent (43) is compressed, and the separation or position of the expanded optical element (40) can be maintained.

[0279] Therefore, the optical element (40) has isotropy and the first fixing agent (43) elastically deforms according to the expansion or contraction of the optical element (40), so that the alignment of the optical element (40) and the optical fiber (20) can be maintained.

[0280]

[0281] Fig. 17 is an exemplary diagram of a method for manufacturing an optical fiber block (500) according to one embodiment.

[0282] As illustrated in (a) of Fig. 17, the first process may form a second bonding hole (503) by performing etching on the body (500a) of the optical fiber block. Here, the etching may be DRIE (Deep Reactive Ion Etching).

[0283] As illustrated in (b) of Fig. 17, the second process is a process of forming a first magnetic body (m2) on the first surface (501) of the body (500a) of the optical fiber block. Forming the second magnetic body (m2) may include magnetizing a ferromagnetic material after nano-depositing it on an area of ​​the first surface (501) of the body (500a) of the optical fiber block, excluding the first coupling hole (503).

[0284] As shown in (c) of Fig. 17, the third process is a process of bonding an optical fiber (421) to an optical fiber block (500).

[0285] The third process may include inserting an optical fiber (421) of a transmission cable (400) along the central axis of a second coupling hole (503) of an optical fiber block (500). Here, the optical fiber (421) may be an optical fiber with an end processed.

[0286] As illustrated in (d) of Fig. 17, the fourth process may include applying a third fixing agent (430) to the inlet portion of the second coupling hole (503) of the optical fiber block (500).

[0287] The inlet portion of the second coupling hole (503) of the optical fiber block (500) may be the portion where the second surface (502) of the body (500a) of the optical fiber block (500) and the transmission cable (400) are connected.

[0288] The third fixing agent (430) can be applied or molded entirely on the second surface (502) of the body (500a) of the optical fiber block (500) and the portion where the transmission cable (400) is connected.

[0289] The third fixing agent (430) may be a thermosetting and / or photocurable resin containing at least one of epoxy, liquid silicone, and urethane. The third fixing agent (430) may be an elastic body. In other words, the third fixing agent (430) may have a certain elasticity even after being cured. The third fixing agent (430) may play a role in absorbing a certain portion of deformation of the transmission cable (400), etc. For example, when expansion of the transmission cable (400) occurs due to heat generation, the elasticity of the third fixing agent (430) may compress the third fixing agent (430) even when the transmission cable (400) expands, thereby allowing the expanded transmission cable (400) to be separated or maintain its position.

[0290]

[0291] Fig. 18 is an example of a combination of an optical fiber guide and an optical fiber block according to one embodiment.

[0292] The first magnetic body (m1: m11, 12) of the optical fiber guide can be coupled to the second magnetic body (m2: m21, 22) of the optical fiber block by magnetic force.

[0293] The first magnetic body (m1: m11, 12) of the optical fiber guide can be provided at a position corresponding to the second magnetic body (m2: m21, 22) of the optical fiber block.

[0294] The polarities of the first magnetic bodies (m1: m11, 12) of the optical fiber guide (20) may be the same, the polarities of the second magnetic bodies (m2: m21, 22) of the optical fiber block (500) may be the same, and the polarities of the first magnetic bodies of the optical fiber guide (20) and the second magnetic bodies (m2: m21, 22) of the optical fiber block (500) may be different from each other. For example, if the polarities of the first magnetic bodies (m1: m11, m12) of the optical fiber guide are all N poles, the polarities of the second magnetic bodies of the optical fiber block may all be S poles.

[0295] The polarities of the first magnetic body (m1: m11, 12) of the optical fiber guide (20) may be different from each other, the polarities of the second magnetic body (m2: m21, 22) of the optical fiber block (500) may be different from each other, and the polarities of the first magnetic body of the optical fiber guide and the second magnetic body of the optical fiber block (500) facing each other may be different from each other.

[0296] For example, if the polarity of the first magnetic body (m11) arranged on the left among the first magnetic bodies of the optical fiber guide is the N pole and the polarity of the second magnetic body (m12) arranged on the right is the S pole, the polarity of the second magnetic body (m21) arranged on the left among the second magnetic bodies of the optical fiber block (500) may be the S pole, and the polarity of the second magnetic body (m22) arranged on the right among the second magnetic bodies of the optical fiber block may be the N pole.

[0297] The first magnetic body (m1: m11, 12) of the optical fiber guide (20) and the second magnetic body (m2: m21, 22) of the optical fiber block (500) can be arranged so that the polarities of the magnetic bodies facing each other are opposite to each other so that an attractive force can be applied to each other.

[0298] The optical fiber guide (20) and the optical fiber block (500) can be coupled to each other by the first and second magnetic bodies.

[0299] When the optical fiber guide (20) and the optical fiber block (500) are combined, the position of the first coupling hole of the optical fiber guide (20) and the position of the second coupling hole of the optical fiber block (500) can correspond to each other.

[0300] When the optical fiber guide (20) and the optical fiber block (500) are combined, the position of the first coupling hole of the optical fiber guide (20), the position of the second coupling hole of the optical fiber block (500), and the position of the optical signal area of ​​the optical element may also correspond to each other.

[0301] Since the optical fiber guide (20) and the optical fiber block (500) are coupled using magnetic materials provided at predetermined locations, the optical element and the optical fiber can be aligned at precise locations. This can increase the transmission and reception efficiency of the optical signal.

[0302] Since the optical fiber guide (20) and the optical fiber block (500) are combined using a magnetic material, the combination of the optical fiber guide (20) and the optical fiber block (500) is easy, and the separation of the optical fiber guide (20) and the optical fiber block (500) can also be easy.

[0303] Since the present invention provides an optical fiber guide and an optical fiber block that are separable and joined by a magnetic material, the optical fiber guide and the optical fiber block can be easily separated and joined, and the optical fiber block can be cleaned, so that contaminants in the optical fiber block can be easily removed.

[0304] Since the optical fiber guide and the optical fiber block are provided separately in the present invention, damage to the optical element can be prevented when the optical fiber is inserted into the optical fiber guide, and the lifespan of the optical fiber guide can be extended.

[0305] The transmission and reception configuration of the optical signal of the optical connector module is described as follows.

[0306] The optical element (40) coupled to the optical fiber guide (20) of the optical connector module illustrated in FIG. 18 can transmit an optical signal to an optical fiber (421) in a second coupling hole of an optical fiber block (500) through a first coupling hole, and can receive an optical signal received through an optical fiber (421) in the second coupling hole of the optical fiber block (500) through the first coupling hole.

[0307]

[0308] FIG. 19 is an exemplary diagram of an optical fiber block according to another embodiment, and FIG. 20 is a cross-sectional diagram of an optical fiber block according to another embodiment.

[0309] An optical fiber block (500) according to another embodiment may further include a guide surface (503). This will be described in more detail.

[0310] As illustrated in Fig. 19, when a plurality of optical fiber blocks (500) are provided in one body, the optical fiber blocks (500) may include a plurality of second coupling holes (503).

[0311] The second coupling hole (503) provided in each of the plurality of optical fiber blocks (500) may be formed in a cylindrical shape inside the body (500a) of the optical fiber block (500).

[0312] The second coupling holes (503) provided in each of the plurality of optical fiber blocks (500) may include a guide surface (504) provided at the boundary with the second surface (502) of the body. The structures of the second coupling holes (503) provided in each of the plurality of optical fiber blocks (500) may be identical. Accordingly, the second coupling holes (503) provided in one optical fiber block (500) will be described.

[0313] As shown in Figure 20,

[0314] The second bonding hole (503) of the optical fiber block (500) may be formed to extend from the first surface (501) to the second surface (502) of the optical fiber block (500). This second bonding hole (503) may be formed by a dry etching process.

[0315] The optical fiber (421) can penetrate the optical fiber block (500) in the thickness direction through the second coupling hole (503).

[0316] The optical fiber block (500) may include a guide surface (504) provided in an area forming a second coupling hole (503) among the areas of the second surface (502) of the body (500a). The second surface (502) of the optical fiber block (500) may be a surface into which an optical fiber (421) of a transmission cable (400) is inserted.

[0317] The guide surface (504) of the optical fiber block (500) is formed on the inlet side of the second coupling hole (503) and may be an inclined surface. The guide surface (504) of the optical fiber block (500) may be formed symmetrically with the inlet of the second coupling hole (503) as the center. In other words, the guide surface (504) of the optical fiber block (500) may be formed at the same inclination angle with the center line of the longitudinal direction of the second coupling hole (503) as the center. In other words, the guide surface (504) of the optical fiber block (500) may have a width length (L1) on the inlet side that is greater than a width length (L2) on the inner side. The length (L1) of the width of the entrance side of the guide surface (504) of the optical fiber block (500) may be longer than the diameter of the optical fiber (421), and the length (L2) of the width of the inner side of the guide surface (504) of the optical fiber block (500) may be equal to or greater than the diameter of the optical fiber (421).

[0318] The guide surface (504) of the optical fiber block (500) may have a constant curvature (R). The guide surface (504) of the optical fiber block (500) may be formed by an etching process. Therefore, the task of inserting the optical fiber (421) into the second coupling hole (503) can be performed more conveniently.

[0319] The optical fiber (421) can be inserted from the second surface (502) of the body of the optical fiber block (500) to the first surface (501) of the optical fiber block (500) by passing through the guide surface (504) of the optical fiber block (500) and being inserted into the second coupling hole (503).

[0320] According to the present invention, the optical fiber (421) of the transmission cable (400) can be easily inserted into the second coupling hole (503) by the guide surface (504) of the optical fiber block (500). When the optical fiber (421) is inserted into the optical fiber block (500), damage to the optical fiber (421) of the transmission cable (400) can be prevented.

[0321] The optical fiber block (500) may further include a third fixing agent (430).

[0322] The third fixing agent (430) may be applied to the inlet portion of the second coupling hole (503) of the optical fiber block (500).

[0323] The inlet portion of the second coupling hole (503) of the optical fiber block (500) may be a portion where the second surface (502) of the body of the optical fiber block (500) and the transmission cable (400) are connected.

[0324] The third fixing agent (430) can be applied or molded entirely on the second surface (502) of the body of the optical fiber block (500) and the part where the transmission cable (400) is connected.

[0325] The third fixing agent (430) may be a thermosetting and / or photocurable resin containing at least one of epoxy, liquid silicone, and urethane. The third fixing agent (430) may be an elastic body. In other words, the third fixing agent (430) may have a certain elasticity even after being cured. The third fixing agent (430) may play a role in absorbing a certain portion of deformation of the transmission cable (400), etc. For example, when expansion of the transmission cable (400) occurs due to heat generation, the elasticity of the third fixing agent (430) may compress the third fixing agent (430) even when the transmission cable (400) expands, thereby allowing the expanded transmission cable (400) to be separated or maintain its position.

[0326] The manufacturing process of the guide surface (504) of the optical fiber block (500) will be described.

[0327] FIG. 21 is a drawing showing an example of a manufacturing method for forming a guide surface of an optical fiber guide according to another embodiment.

[0328] As shown in (a) of Fig. 21, the first process includes a process of first forming a second bonding hole (503) on the first surface (501) of the body of the optical fiber block through first etching.

[0329] The first etching may be Deep Reactive Ion Etching (DRIE).

[0330] The primary formation of the second joining hole (503) may include forming the second joining hole (503) inward from the first surface (501) of the body by a preset length.

[0331] Forming the second joining hole (503) in the first stage may include forming the second joining hole (503) inward from the first surface (501) of the body, but forming the second joining hole (503) so as not to penetrate the second surface (502) of the body.

[0332] As illustrated in (b) of FIG. 21, the second process may include forming a passivation layer (111) on the second surface (502) of the body of the optical fiber block (500), performing secondary etching based on the position of the second bonding hole (503) formed on the first surface (501) of the body, and forming the second bonding hole (503) and the guide surface (504) based on the secondary etching.

[0333] The secondary etching may be Si etching or wet etching.

[0334] Forming the guide surface (504) may include performing etching from the position of the pattern of the passivation layer (111) to the position of the first-formed second bonding hole based on the pattern formed by the passivation layer (111). At this time, since there is a gap between the position of the pattern of the passivation layer (111) and the position of the second bonding hole, when performing etching from the position of the pattern of the passivation layer (111) to the position of the first bonding hole formed in the first step, the surface formed by the etching may be inclined. As a result, an inclined guide surface may be formed.

[0335] As illustrated in (c) of Fig. 21, the third process may include a process of removing the passivation layer once formation is complete.

[0336]

[0337] FIG. 22 is a drawing showing another example of a manufacturing method for forming a guide surface of an optical fiber block according to another embodiment.

[0338] The manufacturing process for forming the guide surface may include a process of depositing a first passivation layer (112) on the second surface (502) of the body of the optical fiber block (500), aligning a mask on a photoresist, and then irradiating light to form a pattern on the first passivation layer (112) through exposure and development.

[0339] As illustrated in (a) of FIG. 24, the first process may include forming a second bonding hole (504) from the first surface (501) of the body to the second surface (502) by depositing a second passivation layer (113) on the first passivation layer (112) and performing a first etching based on the position and size of the second bonding hole (504). Here, the first etching may be DRIE (Deep Reactive Ion Etching).

[0340] After the formation of the second bonding hole, the width of the pattern of the first passivation layer (112) may be wider than the width of the second bonding hole.

[0341] After the formation of the second bonding hole, the width of the pattern of the first passivation layer (112) may be wider than the width of the pattern of the second passivation layer (113).

[0342] In addition, the first process may be performed by depositing a first passivation layer (112) having a pattern on the second surface (502) of the body where the second bonding hole is created, and then depositing a second passivation layer (113) covering the first passivation layer (112) on the first passivation layer (112). Here, the pattern may be a pattern provided at a position corresponding to the position of the second bonding hole (503).

[0343] The pattern of the first passivation layer (112) may be shorter than the pattern of the second passivation layer (113).

[0344] As illustrated in (b) of FIG. 22, the second process includes removing the second passivation layer (113) of the second surface of the optical fiber block (500), performing a second etching based on the pattern of the first passivation layer, and forming a guide surface (504) based on the second etching. Here, the second etching may be Si etching or wet etching.

[0345] Forming the guide surface (504) may include performing etching from the position of the pattern of the first passivation layer (112) to the position of the second bonding hole at a reference slope based on the pattern formed by the first passivation layer (112). This allows for forming an inclined guide surface.

[0346] As illustrated in (c) of FIG. 22, the third process may include removing the first passivation layer (112) once the formation of the guide surface (504) is completed.

[0347]

[0348] Fig. 23 is an example of a combination of an optical fiber guide and an optical fiber block according to another embodiment.

[0349] The optical fiber block (500) coupled to the optical fiber guide (20) may further include a guide surface (504). A third fixing agent (430) may be provided on the guide surface (504) of the optical fiber block (500). The third fixing agent (430) provided on the guide surface (504) may be the third fixing agent used when molding the second surface (502) of the body of the optical fiber block (500) and the transmission cable (400).

[0350] The third fixing agent (430) provided on the guide surface (504) may be a third fixing agent that flows into the guide surface (504) during molding of the second surface (502) of the body of the optical fiber block (500) and the transmission cable (400).

[0351] The first magnetic body (m1: m11, 12) of the optical fiber guide can be coupled to the second magnetic body (m2: m21, 22) of the optical fiber block by magnetic force.

[0352] The first magnetic body (m1: m11, 12) of the optical fiber guide can be provided at a position corresponding to the second magnetic body (m2: m21, 22) of the optical fiber block.

[0353] The polarities of the first magnetic bodies (m1: m11, 12) of the optical fiber guide (20) may be the same, the polarities of the second magnetic bodies (m2: m21, 22) of the optical fiber block (500) may be the same, and the polarities of the first magnetic bodies of the optical fiber guide (20) and the second magnetic bodies (m2: m21, 22) of the optical fiber block (500) may be different from each other. For example, if the polarities of the first magnetic bodies (m1: m11, m12) of the optical fiber guide are all N poles, the polarities of the second magnetic bodies of the optical fiber block may all be S poles.

[0354] The polarities of the first magnetic body (m1: m11, 12) of the optical fiber guide (20) may be different from each other, the polarities of the second magnetic body (m2: m21, 22) of the optical fiber block (500) may be different from each other, and the polarities of the first magnetic body of the optical fiber guide and the second magnetic body of the optical fiber block (500) facing each other may be different from each other.

[0355] For example, if the polarity of the first magnetic body (m11) arranged on the left among the first magnetic bodies of the optical fiber guide is the N pole and the polarity of the second magnetic body (m12) arranged on the right is the S pole, the polarity of the second magnetic body (m21) arranged on the left among the second magnetic bodies of the optical fiber block (500) may be the S pole, and the polarity of the second magnetic body (m22) arranged on the right among the second magnetic bodies of the optical fiber block may be the N pole.

[0356] That is, the polarity of the first magnetic body (m1: m11, 12) of the optical fiber guide (20) may be opposite to the polarity of the second magnetic body (m2: m21, 22) of the facing optical fiber block (500).

[0357] In this way, since the optical fiber guide (20) and the optical fiber block (500) are combined using a magnetic material, the combination of the optical fiber guide (20) and the optical fiber block (500) is easy, and the separation of the optical fiber guide (20) and the optical fiber block (500) can also be easy.

[0358] Since the optical fiber guide (20) and the optical fiber block (500) are coupled using magnetic materials provided at predetermined locations, the optical element and the optical fiber can be aligned at precise locations. This can increase the transmission and reception efficiency of the optical signal.

[0359] Since the present invention provides an optical fiber guide and an optical fiber block that are separable and joined by a magnetic material, the optical fiber guide and the optical fiber block can be easily separated and joined, and the optical fiber block can be cleaned, so that contaminants in the optical fiber block can be easily removed.

[0360] Since the optical fiber guide and the optical fiber block are provided separately in the present invention, damage to the optical element can be prevented when the optical fiber is inserted into the optical fiber guide, and the lifespan of the optical fiber guide can be extended.

[0361] The optical fiber guide of one embodiment and another embodiment includes a notch and can be coupled to the optical element using a solder ball seated in the notch.

[0362] The optical fiber guide without a notch can be coupled to the optical element via solder balls. That is, the first and second guide electrodes of the optical fiber guide can be connected to the first and second electrodes of the optical element via solder balls. In addition, the optical fiber guide without a notch can include a first magnetic body and can be coupled to a second magnetic body of the optical fiber block via the first magnetic body.

[0363] The disclosed embodiments have been described with reference to the attached drawings as described above. Those skilled in the art will understand that the present invention can be implemented in forms other than the disclosed embodiments without altering the technical spirit or essential features of the present invention. The disclosed embodiments are illustrative and should not be construed as limiting.

Claims

1. An optical fiber guide including an optical element provided on a first surface of a first body, a first magnetic body provided on a second surface of the first body, and a first coupling hole penetrating from the first surface of the first body to the second surface; An optical fiber block including a second magnetic body provided on a first surface of a second body and a second coupling hole penetrating from the first surface of the second body to the second surface; and Including an optical signal transmission member inserted into the second coupling hole; An optical connector module in which the optical fiber guide and the optical fiber block are coupled by the first magnetic body and the second magnetic body.

2. In paragraph 1, The position of the optical signal region of the above optical element corresponds to the position of the first coupling hole, An optical connector module in which the position of the first coupling hole of the optical fiber guide corresponds to the position of the second coupling hole of the optical fiber block.

3. In the first paragraph, the optical fiber guide, An optical connector module further comprising a mounting portion provided on a first surface of the first body and on which the optical element is mounted, a notch provided on the mounting portion and on which a solder ball is mounted, and a guide electrode provided adjacent to the notch.

4. In paragraph 3, The above-mentioned mounting portion is a groove formed by recessing into the interior of the body from the first surface of the body through an etching process, and includes a bottom surface and a side surface surrounding the bottom surface. The side surface of the above-mentioned mounting portion is an inclined optical connector module.

5. In paragraph 3, An optical connector module in which the guide electrode of the optical fiber guide is connected to the electrode of the optical element by the solder ball.

6. In the first paragraph, the optical fiber block, An optical connector module further comprising a fixing agent provided on the second surface of the optical fiber block and provided at a portion where the second coupling hole and the optical signal transmission member are connected.

7. In the 6th paragraph, the optical fiber block, Further comprising a guide surface connecting the second surface of the optical fiber block and the second coupling hole, The above guide surface is an inclined surface or a curved surface, an optical connector module.

8. In paragraph 1, The above first magnetic material is plural, The plurality of first magnetic bodies are provided spaced apart from each other on the second surface of the first body, The above second magnetic material is plural, An optical connector module in which the plurality of second magnetic bodies are provided spaced apart from each other on the first surface of the second body, and are provided at positions corresponding to the plurality of first magnetic bodies, and have a polarity opposite to that of the plurality of first magnetic bodies.

9. In paragraph 1, An optical connector module wherein the first and second magnetic materials each include a magnetized ferromagnetic material.

10. An optical fiber guide including a mounting portion provided on a first surface of the body, a notch provided on the mounting portion and into which a solder ball is mounted, a guide electrode provided adjacent to the notch, and a coupling hole penetrating from the first surface of the body to the second surface; An optical element comprising an optical signal region for transmitting and receiving an optical signal, and mounted on the mounting portion; and A transmission cable including an optical fiber inserted into the above-mentioned joint, The optical element and the optical fiber guide are joined by melting the solder ball in the notch by heat and pressure, An optical connector module in which the optical signal area of ​​the optical element is aligned at a position corresponding to the position of the coupling hole by the pressure.

11. In paragraph 10, The above-mentioned mounting portion is a groove formed by recessing into the interior of the body from the first surface of the body through an etching process, and includes a bottom surface and a side surface surrounding the bottom surface. The side surface of the above-mentioned mounting portion is an inclined optical connector module.

12. In the 11th paragraph, the guide electrode, An optical connector module formed by extending from the first surface of the body through the side surface of the mounting portion to the bottom surface of the mounting portion through an electron beam deposition process.

13. In the 12th paragraph, the notch is An optical connector module including a groove extending from the surface of the guide electrode to the lower part of the bottom surface of the mounting portion.

14. In paragraph 13, Among the areas of the above guide electrode, an insulating film is further provided in an area excluding the area where the notch is provided and the area surrounding the notch, An optical connector module in which the area provided with the above notch and the area surrounding the above notch are non-insulating areas.

15. Form a mounting portion on the first surface of the body through the first etching, A guide electrode is deposited from the first surface of the body to the bottom surface of the mounting portion through the side surface of the mounting portion, Through the second etching, a notch is formed from the surface of the guide electrode to the lower part of the bottom surface of the mounting portion, A joint hole is formed through the third etching from the first surface of the body to the second surface, Place the solder ball in the above notch, Place the optical element in the above-mentioned mounting portion, Applying heat and pressure to the optical fiber guide and the optical element to melt the solder ball, Insert the optical fiber into the above joint, A method for manufacturing an optical connector module, wherein a fixing agent is applied to the second surface of the body and the joint.

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