Display device

Abstract

Disclosed is a display device. The display device according to the present disclosure may comprise: a display panel; a frame positioned on the rear side of the display panel; a main board coupled to the frame; a plurality of substrates arranged between the display panel and the frame and coupled to the frame; a plurality of light sources mounted on each of the plurality of substrates; a driving chip mounted on each of the plurality of substrates; an extension board to which the plurality of substrates are electrically connected; and a cable electrically connecting the main board to the extension board.

Description

display device

[0001] The present disclosure relates to a display device.

[0002] As the information society develops, the demand for display devices is also increasing in various forms, and in response to this, various display devices such as LCD (Liquid Crystal Display Device), PDP (Plasma Display Panel), ELD (Electro luminescent Display), VFD (Vacuum Fluorescent Display), and OLED (Organic Light Emitting Diode) are being researched and used in recent years.

[0003] Among these, the LCD panel has a TFT substrate and a color substrate that face each other with a liquid crystal layer in between, and can display an image using light provided from a backlight unit.

[0004] Recently, much research has been conducted on the structure of substrates that house light sources like LEDs. Furthermore, considerable research is being conducted to improve the image quality of display panels.

[0005] The present disclosure aims to solve the above-mentioned and other problems.

[0006] Another purpose may be to provide a structure that can improve image quality by implementing a large number of local dimming blocks.

[0007] Another purpose may be to provide a structure that allows the removal of existing LED driver boards.

[0008] Another purpose may be to provide a structure that can minimize the number of cables connecting the main board and the LED substrates.

[0009] Another purpose may be to provide a display device having an LED substrate equipped with a driver IC.

[0010] Another purpose may be to provide an expansion board having a processor connected to driver ICs of LED substrates.

[0011] Another purpose may be to provide various examples of the shapes of LED substrates and the placement of driver ICs.

[0012] According to one aspect of the present disclosure for achieving the above or other purposes, a display device may include: a display panel; a frame positioned at the rear of the display panel; a main board coupled to the frame; a plurality of substrates positioned between the display panel and the frame and coupled to the frame; a plurality of light sources mounted on each of the plurality of substrates; a driving chip mounted on each of the plurality of substrates; an expansion board to which the plurality of substrates are electrically connected; and a cable electrically connecting the main board to the expansion board.

[0013] The effects of the display device according to the present disclosure are described as follows.

[0014] According to at least one of the embodiments of the present disclosure, a structure capable of improving image quality by implementing a large number of local dimming blocks can be provided.

[0015] According to at least one of the embodiments of the present disclosure, a structure capable of eliminating an existing LED driver board can be provided.

[0016] According to at least one of the embodiments of the present disclosure, a structure can be provided that can minimize the number of cables connecting the main board and the LED substrates.

[0017] According to at least one of the embodiments of the present disclosure, a display device having an LED substrate equipped with a driver IC can be provided.

[0018] According to at least one of the embodiments of the present disclosure, an expansion board having a processor connected to driver ICs of LED substrates can be provided.

[0019] According to at least one of the embodiments of the present disclosure, various examples regarding the shape of LED substrates and the arrangement of driver ICs can be provided.

[0020] Further scope of the applicability of the present disclosure will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present disclosure will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present disclosure, are given by way of example only.

[0021] Figures 1 to 52 are drawings illustrating examples of display devices according to embodiments of the present disclosure.

[0022] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components are given the same reference numbers and redundant descriptions thereof will be omitted.

[0023] The suffixes "module" and "part" used for components in the following description are given or used interchangeably only for the convenience of writing specifications, and do not have distinct meanings or roles in themselves.

[0024] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of a related known technology may obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of the present disclosure.

[0025] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0026] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0027] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0028] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0029] The direction indications of up (U), down (D), left (Le), right (Ri), front (F), and back (R) shown in the drawings are only for convenience of explanation, and the technical ideas disclosed in this specification are not limited thereby.

[0030]

[0031] Referring to FIG. 1, a display device (1) may include a display panel (10). The display panel (10) may display an image.

[0032] The display device (1) may include a first long side (LS1), a second long side (LS2) opposite the first long side (LS1), a first short side (SS1) adjacent to the first long side (LS1) and the second long side (LS2), and a second short side (SS2) opposite the first short side (SS1). Meanwhile, for convenience of explanation, the lengths of the first and second long sides (LS1, LS2) are illustrated and described as being longer than the lengths of the first and second short sides (SS1, SS2), but it may also be possible for the lengths of the first and second long sides (LS1, LS2) to be approximately equal to the lengths of the first and second short sides (SS1, SS2).

[0033] The direction parallel to the long sides (LS1, LS2) of the display device (1) may be referred to as the left-right direction or the first direction (DR1). The first short side (SS1) may be referred to as the left side (Le, x), and the second short side (SS2) may be referred to as the right side (Ri).

[0034] The direction parallel to the short sides (SS1, SS2) of the display device (1) may be referred to as the up-down direction or the second direction (DR2). The first long side (LS1) may be referred to as the upper side (U, y), and the second long side (LS2) may be referred to as the lower side (D).

[0035] The vertical direction parallel to the long sides (LS1, LS2) and short sides (SS1, SS2) of the display device (1) may be referred to as the front-back direction or the third direction (DR3). The direction in which the display panel (10) displays an image may be referred to as the front (F, z), and the opposite direction may be referred to as the rear (R).

[0036] The first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) may be referred to as edges of the display device (1). The points where the first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) meet may be referred to as corners. The point where the first short side (SS1) and the first long side (LS1) meet may be referred to as a first corner (Ca). The point where the first long side (LS1) and the second short side (SS2) meet may be referred to as a second corner (Cb). The point where the second short side (SS2) and the second long side (LS2) meet may be referred to as a third corner (Cc). The point where the second long side (LS2) and the first short side (SS1) meet may be referred to as a fourth corner (Cd).

[0037]

[0038] Referring to FIGS. 1 and 2, the display device (1) may include a display panel (10), a side frame (20), a backlight unit, a frame (80), and a back cover (90).

[0039] The display panel (10) can form the front surface of the display device (1) and display an image. The display panel (10) can display an image by having a plurality of pixels output RGB (Red, Green, or Blue) for each pixel in accordance with the timing. The display panel (10) can be divided into an active area where an image is displayed and a de-active area where an image is not displayed. The display panel (10) can include a front substrate and a rear substrate that face each other with a liquid crystal layer therebetween. The display panel (10) can be referred to as an LCD panel (10).

[0040] The front substrate may include a plurality of pixels composed of red, green, and blue sub-pixels. The front substrate may output light corresponding to the color red, green, or blue according to a control signal.

[0041] The rear substrate may include switching elements. The rear substrate may switch the pixel electrode. For example, the pixel electrode may change the molecular arrangement of the liquid crystal layer according to a control signal input from an external source. The liquid crystal layer may include liquid crystal molecules. The arrangement of the liquid crystal molecules may change in response to a voltage difference generated between the pixel electrode and the common electrode. The liquid crystal layer may transmit light provided from the backlight unit to the front substrate or block it.

[0042] The side frame (20) may extend along the perimeter of the display panel (10). The side frame (20) may cover the perimeter of the display panel (10). For example, the side frame (20) may include a plastic or metal material. The side frame (20) may be referred to as a guide panel (20).

[0043] The backlight unit may be positioned at the rear of the display panel (10). The backlight unit may be positioned at the front of the frame (80) and may be coupled to the frame (80). The backlight unit may be driven by a full driving method or a partial driving method such as local dimming or impulsive. The backlight unit may include light sources that provide light to the front, a substrate (40) on which the light sources are mounted, lenses (53) that cover the light sources, a reflective sheet (60) that covers the front of the substrate (40), and an optical unit (30) that is positioned at the front of the reflective sheet (60).

[0044] The optical unit (30) may be opposite the display panel (10) with respect to the side frame (20). The optical unit (30) may evenly transmit light from the light source to the display panel (10). The optical unit (30) may include a diffusion plate (31) and an optical sheet (32).

[0045] A diffuser (31) may be positioned between a reflective sheet (60) and an optical sheet (32). The diffuser (31) may diffuse light from the light source. In addition, an air gap may be formed between the reflective sheet (60) and the diffuser (31). The air gap may function as a buffer, and the light from the light source may be widely diffused by the air gap. A supporter (39) may be positioned between the reflective sheet (60) and the diffuser (31), may be coupled to the reflective sheet (60), and may support the diffuser (31).

[0046] The optical sheet (32) may be adjacent to or in contact with the front surface of the diffusion plate (31). The optical sheet (32) may include at least one sheet. For example, the optical sheet (32) may include a plurality of sheets having different functions, and the plurality of sheets may be adhered or closely attached to each other. For example, the first optical sheet (32a) may be a diffusion sheet, and the second optical sheet (32b) may be a prism sheet. The diffusion sheet may prevent light from being partially concentrated from the diffusion plate (31) to uniformly distribute the light. The prism sheet may collect the light from the diffusion sheet and provide it to the display panel (10). The number and / or positions of the diffusion sheet and the prism sheet may be changed.

[0047] For example, the optical sheet (32) can change the wavelength or color of light provided from the light source. For example, the optical sheet (32) can include a red series phosphor and / or a green series phosphor. In this case, the light source can provide blue series light, and the optical sheet (32) can change the light of the light source to white. The optical sheet (32) can be referred to as a QD sheet (Quantum Dot Sheet).

[0048] The frame (80) may be positioned at the rear of the backlight unit. The display panel (10), the side frame (20), and the backlight unit may be coupled to the frame (80). The frame (80) may support the components of the display device described above and below. For example, the frame (80) may include a metal material such as an aluminum alloy. The frame (80) may be referred to as a main frame (80), a module cover (80), or a cover bottom (80).

[0049] The back cover (90) can cover the rear of the frame (80) and can be joined to the frame (80). For example, the back cover (90) can be an injection-molded resin material. As another example, the back cover (90) can include a metal material.

[0050]

[0051] Referring to FIG. 3, the flat portion (81) can define the front surface of the frame (80). A plurality of frame holes (81a, 81b, 81c, 81d, 81e, 81f, 81g, 81h, 81i) can be formed in the flat portion (81).

[0052]

[0053] Referring to FIGS. 3 and 4, a heat sink (83) can cover the front surface of the flat portion (81) and can be coupled to the flat portion (81). A plurality of heat sink holes (83a, 83b, 83c, 83d, 83e, 83f, 83g, 83h, 83i) can be formed in the heat sink (83) and can be aligned with a plurality of frame holes (81a, 81b, 81c, 81d, 81e, 81f, 81g, 81h, 81i). The heat sink (83) may be omitted.

[0054]

[0055] Referring to FIGS. 5 and 6, the substrate (41) may be coupled to the front surface of the frame (80) or the heat sink (83). The substrate (41) may be a printed circuit board (PCB). For example, the substrate (41) may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (41) may have a plate shape.

[0056] The substrate (41) may be provided in at least one. Each of the plurality of substrates (41a, 41b, 41c, 41d, 41e, 41f, 41g, 41h, 41i) may cover each of the plurality of areas (83A1, 83A2, 83A3, 83A4, 83A5, 83A6, 83A7, 83A8, 83A9) of the heat sink (83).

[0057] A light source (51) can be mounted on the front surface of the substrate (41). A plurality of light sources (51) can be arranged in a matrix form on the front surface of the substrate (41). The light source (51) can be a light emitting diode (LED) chip or an LED package. The light source (51) can be a colored LED that emits at least one color among colors such as red, green, and blue, or can be composed of a white LED. The light source (51) can be a mini LED. An electrode pattern can be formed on the substrate (41), and an adapter (connector) can be connected to the light source (51). A power supply board can provide power to the light source (51) through the substrate (41). For example, the electrode pattern can be a carbon nanotube electrode pattern.

[0058] The integrated element (52a) and the capacitor (52b) can be positioned around the light source (51) and mounted on the front surface of the substrate (41). The integrated element (52a) can be an IC chip. A plurality of capacitors (52b) can be opposite to each other with respect to the integrated element (52a). The integrated element (52a) can control the power supplied to a certain number of light sources (51).

[0059]

[0060] Referring to FIGS. 7 and 8, a reflective sheet (60) can be bonded to the front surface of a substrate (41, see FIG. 5). The reflective sheet (60) can reflect light provided from a light source (51) or reflected from a diffuser (31) forward (see FIG. 2). For example, the reflective sheet (60) can include a metal and / or metal oxide having a high reflectivity, such as at least one of aluminum (Al), silver (Ag), gold (Au), or titanium dioxide (TiO2). For example, a resin can be deposited or applied on the reflective sheet (60). At least one reflective sheet (60) can be provided. A plurality of reflective sheets (60a, 60b, 60c, 60d, 60e, 60f, 60g, 60h, 60i) can cover the substrate(s) (41, see FIG. 5).

[0061] A hole (601) can be formed in the reflective sheet (60), and a light source (51, see FIG. 6) or a lens (53) covering the light source (51) can be positioned in the hole (601). The diameter of the hole (601) can be larger than the diameter of the lens (53). The number of holes (601) can be equal to the number of light sources (51) or lenses (53).

[0062] The receiving hole (602) may be formed in the reflective sheet (60), and the integrated element (52a, see FIG. 6) may be positioned in the receiving hole (602). The first cut line (CLa) around the receiving hole (602) may be opened by the integrated element (52a). The second cut lines (CLb) in a cross shape may be formed in the reflective sheet (60), and may be opposite to each other with respect to the first cut line (CLa). The capacitors (52b, see FIG. 6) may be positioned at the second cut lines (CLb), and the second cut lines (CLb) may be opened by the capacitors (52b). Accordingly, the reflective sheet (60) may be closely attached to the substrate (41), and the light uniformity may be improved.

[0063] Meanwhile, the supporter (39) can be detachably coupled to the heat sink (83) and / or the frame (80) by penetrating the reflective sheet (60) and the substrate (41) (see FIG. 5). A plurality of supporters (39) spaced apart from each other can be placed on the reflective sheet (60). The front end of the supporter (39) can support the rear surface of the diffuser plate (31) (see FIG. 2).

[0064]

[0065] Referring to FIGS. 9 and 10, the substrate (42) may be coupled to the front surface of the frame (80) or the heat sink (83). The substrate (42) may be a printed circuit board (PCB). For example, the substrate (42) may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (42) may have a fork shape.

[0066] The substrate (42) may include a body (421) and legs (422). The body (421) may be elongated. The legs (422) may extend in a direction intersecting the body (421) from one long side of the body (421). The legs (422) may be referred to as arms (422). The longitudinal direction of the body (421) may be defined in a vertical direction, and the longitudinal direction of the legs (422) may be defined in a horizontal direction. The width (42La) of the body (421) may be smaller than the length (42Ha) of the body (421) and smaller than or similar to the length (42Lb) of the legs (422). The legs (422) may be spaced apart from each other in the longitudinal direction of the body (421). The spacing (Gb) between the legs (422) may be equal to the width (42Hb) of the legs (422).

[0067] The substrate (42) may be provided in at least one. Each of the plurality of substrates (42) may cover each of the plurality of areas (83A1, 83A2, 83A3, 83A4, 83A5, 83A6, 83A7, 83A8, 83A9, see FIG. 4) of the heat sink (83).

[0068] A light source (51) can be mounted on the front surface of the substrate (42). A plurality of light sources (51) can be arranged in a matrix form on the front surfaces of the body (421) and the legs (422). An integrated device and a capacitor can be positioned around the light source (51) and can be mounted on the front surface of the substrate (42). A reflective sheet (60) can be coupled to the front surface of the substrate (42) and can have a hole in which the light source (51) or a lens covering the light source (51) is positioned. A plurality of reflective sheets (60a, 60b, 60c, 60d, 60e, 60f, 60g, 60h, 60i) can cover the substrate(s) (42).

[0069]

[0070] Referring to FIG. 11, a board (P) may be mounted on a frame (80). A plurality of electronic components may be mounted on the board (P). The board (P) may be a printed circuit board (PCB) and may be electrically connected to electronic components of a display device. The plurality of boards (P) may be coupled to the rear surface of the frame (80).

[0071] The power supply board (P1) can supply power to each component of the display device. The LED driver board (P2, Light Emitting Diode driver board) can be electrically connected to the power supply board (P1) and the main board (P3) via a cable, and can provide power and current to a substrate on which light sources such as LEDs are mounted. The main board (P3) can control each component of the display device. The timing controller board (P4, timing controller board) can be connected to the main board (P3) via a cable, and can provide a video signal to the display panel (10). For example, the power supply board (P1) can be adjacent to the left side of the frame (80), and the main board (P3) can be adjacent to the right side of the frame (80). The LED driver board (P2) can be located between the power supply board (P1) and the main board (P3), and the timing controller board (P4) can be located below the LED driver board (P2).

[0072] The cable (11) may be electrically connected to the display panel (10) adjacent to the lower side of the display panel (10). The cable (11) may pass through a slit (SL) or hole formed in the frame (80). For example, the cable (11) may be a COF (Chip On Film).

[0073] A source PCB (12, source PCB) may be coupled to the rear surface of the frame (80) adjacent to the lower side of the frame (80) and may be electrically connected to a cable (11). For example, a plurality of source PCBs (12a, 12b, 12c, 12d) may be spaced apart from each other along the lower side of the frame (80) and may be electrically connected to a plurality of cables (11). A second source PCB (12b) may be electrically connected to the first source PCB (12a) via a first bridge cable (unsymbolized). A third source PCB (12c) may be electrically connected to a fourth source PCB (12d) via a second bridge cable (unsymbolized). The second source PCB (12b) and the third source PCB (12c) may be electrically connected to a timing controller board (P4) via connecting cables (unsymbolized). For example, the first and second bridge cables and the connecting cables may be FFC (Flexible Flat Cable).

[0074] Accordingly, the timing controller board (P4) can provide digital video data and timing control signals to the display panel (10) through the source PCB (12).

[0075] The back cover (90) can be positioned at the rear of the frame (80) and can be coupled to the frame (80). The board (P) can be positioned between the frame (80) and the back cover (90) and can be covered by the back cover (90).

[0076]

[0077] Referring to FIGS. 12 and 13, a plurality of connectors (54a, 54b, 54c, 54d, 54e, 54f, 54g, 54h) may be mounted on the rear surfaces of a plurality of substrates (41; 42). The number of connectors (54a, 54b, 54c, 54d, 54e, 54f, 54g, 54h) may be equal to the number of substrates (41; 42).

[0078] Referring to FIG. 12, each of the plurality of substrates (41a, 41b, 41c, 41d, 41e, 41g, 41h) may have a plate shape (see FIG. 5). The first connector (54a) may be coupled to the rear surface of the first substrate (41a), and the second connector (54b) may be coupled to the rear surface of the second substrate (41b). The third connector (54c) may be coupled to the rear surface of the third substrate (41c), and the fourth connector (54d) may be coupled to the rear surface of the fourth substrate (41d). The fifth connector (54e) may be coupled to the rear surface of the fifth substrate (41e), and the sixth connector (54f) may be coupled to the rear surface of the sixth substrate (41f). The seventh connector (54g) can be coupled to the rear surface of the seventh substrate (41g), and the eighth connector (54h) can be coupled to the rear surface of the eighth substrate (41h).

[0079] Referring to FIG. 13, each of the plurality of substrates (42a, 42b, 42c, 42d, 42e, 42f, 42g, 42h) may have a fork shape (see FIG. 9). The first connector (54a) may be coupled to the rear surface of the body (421) of the first substrate (42a), and the second connector (54b) may be coupled to the rear surface of the body (421) of the second substrate (42b). The third connector (54c) may be coupled to the rear surface of the body (421) of the third substrate (42c), and the fourth connector (54d) may be coupled to the rear surface of the body (421) of the fourth substrate (42d). The fifth connector (54e) can be coupled to the rear surface of the body (421) of the fifth substrate (42e), and the sixth connector (54f) can be coupled to the rear surface of the body (421) of the sixth substrate (42f). The seventh connector (54g) can be coupled to the rear surface of the body (421) of the seventh substrate (42g), and the eighth connector (54h) can be coupled to the rear surface of the body (421) of the eighth substrate (42h).

[0080]

[0081] Referring to FIG. 14, the LED driver board (P2) can be electrically connected to connectors (54a, 54b, 54c, 54d, 54e, 54f, 54g, 54h) via cables (Fa, Fb, Fc, Fd, Fe, Ff, Fg, Fh). The cables (Fa, Fb, Fc, Fd, Fe, Ff, Fg, Fh) can be FFC (Flexible Flat Cables).

[0082] One end of the first cable (Fa) can be connected to the first connector (Ja) of the LED driver board (P2), and the other end of the first cable (Fa) can be connected to the first connector (54a) through the first frame hole (81a).

[0083] One end of the second cable (Fb) can be connected to the second connector (Jb) of the LED driver board (P2), and the other end of the second cable (Fb) can be connected to the second connector (54b) through the second frame hole (81b).

[0084] One end of the third cable (Fc) can be connected to the third connector (Jc) of the LED driver board (P2), and the other end of the third cable (Fc) can be connected to the third connector (54c) through the third frame hole (81c).

[0085] One end of the fourth cable (Fd) can be connected to the fourth connector (Jd) of the LED driver board (P2), and the other end of the fourth cable (Fd) can be connected to the fourth connector (54d) through the fourth frame hole (81d).

[0086] One end of the fifth cable (Fe) can be connected to the fifth connector (Je) of the LED driver board (P2), and the other end of the fifth cable (Fe) can be connected to the fifth connector (54e) through the fifth frame hole (81e).

[0087] One end of the sixth cable (Ff) can be connected to the sixth connector (Jf) of the LED driver board (P2), and the other end of the sixth cable (Ff) can be connected to the sixth connector (54f) through the sixth frame hole (81f).

[0088] One end of the seventh cable (Fg) can be connected to the seventh connector (Jg) of the LED driver board (P2), and the other end of the seventh cable (Fg) can be connected to the seventh connector (54g) through the seventh frame hole (81g).

[0089] One end of the 8th cable (Fh) can be connected to the 8th connector (Jh) of the LED driver board (P2), and the other end of the 8th cable (Fh) can be connected to the 8th connector (54h) through the 8th frame hole (81h).

[0090] In order for the LED driver board (P2) to be connected to a plurality of substrates (41, see FIG. 12; 42, see FIG. 13), a number of cables (Fa, Fb, Fc, Fd, Fe, Ff, Fg, Fh) equal to the number of substrates (41; 42) may be required. Due to this large number of cables (Fa, Fb, Fc, Fd, Fe, Ff, Fg, Fh), the manufacturing cost of the display device may increase, and the connection structure between the LED driver board (P2) and the substrates (41; 42) may become complicated.

[0091]

[0092] Referring to FIGS. 15 to 17, the LED driver board (P2) may include a processor (C), a connector for connecting a power supply board (Ka), a connector for connecting a main board (Kc), a plurality of connectors (Ja, Jb, Jc, Jd, Je, Jf, Jg, Jh), and a plurality of driver ICs (Ua, Ub, Uc, Ud, Ue, Uf, Ug, Uh, Integrated Circuits).

[0093] The connector (Ka) for connecting the power supply board can be electrically connected to the power supply board (P1) via a cable (see Fig. 11). The connector (Kc) for connecting the main board can be electrically connected to the main board (P3) via a cable (see Fig. 11).

[0094] The processor (C) may be an MCU (Micro Controller Unit). The processor (C) may also be referred to as a controller (C) or a control unit (C). The processor (C) may convert (process) data regarding the image quality (e.g., brightness) of light sources received from the main board (P3) and provide the data to a plurality of driver ICs (Ua, Ub, Uc, Ud, Ue, Uf, Ug, Uh).

[0095] A plurality of driver ICs (Ua, Ub, Uc, Ud, Ue, Uf, Ug, Uh) can be electrically connected to a plurality of substrates (41, see FIG. 12; 42, see FIG. 13) based on data received from the processor (C).

[0096] The number of the plurality of connectors (Ja, Jb, Jc, Jd, Je, Jf, Jg, Jh) and the number of the plurality of driver ICs (Ua, Ub, Uc, Ud, Ue, Uf, Ug, Uh, Integrated Circuits) may be equal to the number of the plurality of substrates (41, see FIG. 12; 42, see FIG. 13). The driver IC may be referred to as a DIC, a driver IC, a driver chip, or a driver unit.

[0097] The first driver IC (Ua) can be electrically connected to the light sources (i.e., the first LED array) on the first substrate (41a; 42a) via a first cable (Fa) connecting the first connector (Ja) of the LED driver board (P2) and the first connector (54a, see FIGS. 12 and 13) of the first substrate (41a; 42a).

[0098] The second driver IC (Ub) can be electrically connected to the light sources (i.e., the second LED array) on the second substrate (41b; 42b) via a second cable (Fb) connecting the second connector (Jb) of the LED driver board (P2) and the second connector (54b, see FIGS. 12 and 13) of the second substrate (41b; 42b).

[0099] The third driver IC (Uc) can be electrically connected to the light sources (i.e., the third LED array) on the third substrate (41c; 42c) via a third cable (Fc) connecting the third connector (Jc) of the LED driver board (P2) and the third connector (54c, see FIGS. 12 and 13) of the third substrate (41c; 42c).

[0100] The fourth driver IC (Ud) can be electrically connected to the light sources (i.e., the fourth LED array) on the fourth substrate (41d; 42d) via a fourth cable (Fd) connecting the fourth connector (Jd) of the LED driver board (P2) and the fourth connector (54d, see FIGS. 12 and 13) of the fourth substrate (41d; 42d).

[0101] The fifth driver IC (Ue) can be electrically connected to the light sources (i.e., the fifth LED array) on the fifth substrate (41e; 42e) via a fifth cable (Fe) connecting the fifth connector (Je) of the LED driver board (P2) and the fifth connector (54e, see FIGS. 12 and 13) of the fifth substrate (41e; 42e).

[0102] The sixth driver IC (Uf) can be electrically connected to the light sources (i.e., the sixth LED array) on the sixth substrate (41f; 42f) via a sixth cable (Ff) connecting the sixth connector (Jf) of the LED driver board (P2) and the sixth connector (54f, see FIGS. 12 and 13) of the sixth substrate (41f; 42f).

[0103] The seventh driver IC (Ug) can be electrically connected to the light sources (i.e., the seventh LED array) on the seventh substrate (41g; 42g) via a seventh cable (Fg) connecting the seventh connector (Jg) of the LED driver board (P2) and the seventh connector (54g, see FIGS. 12 and 13) of the seventh substrate (41g; 42g).

[0104] The eighth driver IC (Uh) can be electrically connected to the light sources (i.e., the eighth LED array) on the eighth substrate (41h; 42h) via the eighth cable (Fh) connecting the eighth connector (Jh) of the LED driver board (P2) and the eighth connector (54h, see FIGS. 12 and 13) of the eighth substrate (41h; 42h).

[0105] Power (VLED) can be provided from a power supply board (P1) to a LED driver board (P2) and a plurality of connectors (54a, 54b, 54c, 54d, 54e, 54f, 54g, 54h, see FIGS. 12 and 13) of a plurality of substrates (41a, 41b, 41c, 41d, 41e, 41f, 41g, 41h; 42a, 42b, 42c, 42d, 42e, 42f, 42g, 42h) via a plurality of cables (Fa, Fb, Fc, Fd, Fe, Ff, Fg, Fh). Power (VLED) supplied through a plurality of connectors (54a, 54b, 54c, 54d, 54e, 54f, 54g, 54h) can be provided to light sources (51) of each of a plurality of substrates (41a, 41b, 41c, 41d, 41e, 41f, 41g, 41h; 42a, 42b, 42c, 42d, 42e, 42f, 42g, 42h). The current passing through the light sources (51) can flow to each of the plurality of driver ICs (Ua, Ub, Uc, Ud, Ue, Uf, Ug, Uh, see FIG. 15) through each of the plurality of connectors (54a, 54b, 54c, 54d, 54e, 54f, 54g, 54h) and each of the plurality of cables (Fa, Fb, Fc, Fd, Fe, Ff, Fg, Fh).

[0106] The light sources (51) of each of the plurality of substrates (41a, 41b, 41c, 41d, 41e, 41f, 41g, 41h; 42a, 42b, 42c, 42d, 42e, 42f, 42g, 42h) may be grouped into a plurality of local dimming blocks. Each of the plurality of connectors (54a, 54b, 54c, 54d, 54e, 54f, 54g, 54h) may include a power pin to which power (VLED) is supplied, and block pins connected to the local dimming blocks and the driver IC. The power pin may be electrically connected to each local dimming block through a circuit on the substrate, and the block pins may also be electrically connected to each local dimming block through a circuit on the substrate. The number of the above block pins may be equal to the number of the above local dimming blocks. The driver IC can control the brightness of the light sources (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) belonging to each local dimming block or by blocking the flow of current between the power pin and the block pins, thereby implementing local dimming.

[0107]

[0108] Referring to FIGS. 18 and 19, the substrate (43) can be coupled to the front surface of the frame (80, see FIG. 3) or the front surface of the heat sink (83, see FIG. 4). The substrate (43) can be a printed circuit board (PCB) equipped with light sources such as LEDs. For example, the substrate (43) can include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. For example, the substrate (43) can have a bar shape. The substrate (43) can extend horizontally. Alternatively, the substrate (43) can also extend vertically. A plurality of substrates (43) can be spaced apart from each other in a direction intersecting the longitudinal direction of the substrate (43).

[0109] The extension board (59') may extend in a direction intersecting the substrates (43). The extension board (59') may extend vertically. For example, the substrates (43) may extend from one long side of the extension board (59') in a direction intersecting the extension board (59') (e.g., horizontally). As another example, the substrates (43) may include first substrates (43L) and second substrates (43R) that are opposite to the extension board (59'). The first substrates (43L) and second substrates (43R) may be aligned with or staggered in the width direction of the extension board (59').

[0110] Mounting connectors (59z') can be mounted on the expansion board (59'). The mounting connectors (59z') can be attached to the front of the expansion board (59') via SMT (Surface Mount Technology). The mounting connectors (59z') can be spaced apart from each other in the longitudinal direction of the expansion board (59').

[0111] The first substrates (43La, 43Lb, 43Lc, 43Ld, 43Le, 43Lf, 43Lg, 43Lh, 43Li) may be adjacent to the first long side (e.g., the left side) of the expansion board (59') and may be electrically connected to the mounting connectors (59z') of the expansion board (59') via the first connectors (43Lz).

[0112] The second substrates (43Ra, 43Rb, 43Rc, 43Rd, 43Re, 43Rf, 43Rg, 43Rh, 43Ri) may be adjacent to the second long side (e.g., the right side) of the expansion board (59') and may be electrically connected to the mounting connectors (59z') of the expansion board (59') via the second connectors (43Rz).

[0113] Driver ICs (U, Integrated Circuits) may be mounted on an expansion board (59') rather than on an LED driver board (P2') equipped with a process (C). In the longitudinal direction of the expansion board (59'), the driver ICs (Ua, Ub, Uc, Ud, Ue, Uf, Ug, Uh) may be alternately arranged with mounting connectors (59za', 59zb', 59zc', 59zd', 59ze', 59zf', 59zg', 59zh', 59zi').

[0114] The light sources (51) can be arranged in a matrix form on the entire surface of the substrates (43). The light sources (51) can be arranged in one row on each substrate (43). Alternatively, the light sources (51) can be arranged in two or more rows on each substrate (43). The light sources (51) of each substrate (43) can constitute a local dimming block N in number. Here, N is a natural number greater than or equal to 1. For example, each of the six light sources (51) of the first substrate (43Lz) can constitute a local dimming block, or the six light sources (51) of the first substrate (43Lz) can be grouped in pairs to constitute three local dimming blocks. Driver ICs (Ua, Ub, Uc, Ud, Ue, Uf, Ug, Uh) can control the brightness of the light source(s) (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) of the substrates (43) or blocking the flow of current, thereby implementing a local dimming block.

[0115]

[0116] Referring to FIGS. 20 and 21, the power supply board (P1) and the main board (P3) can be electrically connected to the LED driver board (P2') via a cable. The cable (Fi) can be electrically connected to the connector (Ji) of the LED driver board (P2'). The cable (Fi) can be electrically connected to the connector (59i', see FIG. 18) on the rear of the expansion board (59') through the hole (81i) of the frame (80). The number of cables (Fi) can be the same as the number of expansion boards (59'). One cable (Fi) can connect the LED driver board (P2') to one expansion board (59'). The cable (Fi) can be an FFC (Flexible Flat Cable).

[0117] Accordingly, the processor (C) of the LED driver board (P2') can be electrically connected to the driver ICs (U, i.e. DICs) of the expansion board (59') via a cable (Fi). The processor (C) may be an MCU (Micro Controller Unit).

[0118] The processor (C) of the LED driver board (P2') can convert (process) data regarding the image quality (e.g., brightness) of light sources received from the main board (P3) and provide the data to the driver ICs (U) of the expansion board (59'). The driver ICs (U) can control the brightness of the light sources (51) of the substrates (43) connected to the expansion board (59'). The light sources (51) of each of the substrates (43) can be referred to as an LED array.

[0119]

[0120] Referring to FIGS. 22 and 23, power (VLED) can be provided from a power supply board (P1) to connectors (43Lz, 43Rz) of substrates (43) through an LED driver board (P2'), a cable (Fi), and an expansion board (59'). The power (VLED) of each of the connectors (43Lz, 43Rz) can be provided to light sources (51) of each of the substrates (43). Current passing through the light sources (51) can flow to the driver IC (U) through each of the connectors (43Lz, 43Rz).

[0121] For example, six light sources (51) of the second substrate (43Ra) can constitute six local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6). The lines (Lv, Lf1, Lf2, Lf3, Lf4, Lf5, Lf6) described below can be circuits formed on the second substrate (43Ra).

[0122] The power line (Lv) can be connected to the power (VL) of the second connector (43Rz) and can be arranged along the upper side of the second substrate (43Ra) adjacent to the upper side. The power line (Lv) can be branched as many times as the number of local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6). The first branch line (Lv1) can be connected to the light source (51) forming the first local dimming block (BL1). The second branch line (Lv2) can be connected to the light source (51) forming the second local dimming block (BL2). The third branch line (Lv3) can be connected to the light source (51) forming the third local dimming block (BL3). The fourth branch line (Lv4) can be connected to the light source (51) forming the fourth local dimming block (BL4). The fifth branch line (Lv5) can be connected to a light source (51) forming a fifth local dimming block (BL5). The sixth branch line (Lv6) can be connected to a light source (51) forming a sixth local dimming block (BL6).

[0123] The first line (Lf1) can connect the light source (51) connected to the first branch line (Lv1) to the first pin (B1) of the second connector (43Rz). The second line (Lf2) can connect the light source (51) connected to the second branch line (Lv2) to the second pin (B2) of the second connector (43Rz). The third line (Lf3) can connect the light source (51) connected to the third branch line (Lv3) to the third pin (B3) of the second connector (43Rz). The fourth line (Lf4) can connect the light source (51) connected to the fourth branch line (Lv4) to the fourth pin (B4) of the second connector (43Rz). The fifth line (Lf5) can connect the light source (51) connected to the fifth branch line (Lv5) to the fifth pin (B5) of the second connector (43Rz). The sixth line (Lf6) can connect the light source (51) connected to the sixth branch line (Lv6) to the sixth pin (B6) of the second connector (43Rz).

[0124] The aforementioned power supply (VL) may be power (VLED) transmitted from the power supply board (P1) to the second connector (43Rz) through the LED driver board (P2') and the expansion board (59'). The pins (B1, B2, B3, B4, B5, B6, pins) of the aforementioned second connector (43Rz) may be connected to the Driver IC (U) of the expansion board (59'). The aforementioned lines (Lf1, Lf2, Lf3, Lf4, Lf5, Lf6) may be referred to as feedback lines (Lf1, Lf2, Lf3, Lf4, Lf5, Lf6).

[0125] Power (VL) can be supplied to the first local dimming block (BL1) through the first branch line (Lv1), and current passing through the first local dimming block (BL1) can flow to the driver IC (U) through the first line (Lf1) and the first pin (B1). Likewise, the power (VL) can be supplied to each of the second to sixth local dimming blocks (BL2, BL3, BL4, BL5, BL6) through each of the second to sixth branch lines (LV2, LV3, LV4, LV5, LV6), and the current passing through each of the second to sixth local dimming blocks (BL2, BL3, BL4, BL5, BL6) can flow to the driver IC (U) through each of the second to sixth lines (Lf2, Lf3, Lf4, Lf5, Lf6) and each of the second to sixth pins (B2, B3, B4, B5, B6). The driver IC (U) can control the brightness of the light sources (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) belonging to each local dimming block or by blocking the flow of current, thereby implementing local dimming.

[0126] In this case, the second connector (43Rz) of the second substrate (43Ra) may have as many pins (B1, B2, B3, B4, B5, B6) as the number of local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6) of the second substrate (43Ra). That is, if the number of local dimming blocks increases, the number of pins of the second connector (43Rz) should also increase correspondingly. However, since there is a limitation on the width of the second substrate (43Ra) or the width of the second connector (43Rz), there may be a limit to increasing the number of pins of the second connector (43Rz). In addition, the second connector (43Rz) may be difficult to share with substrates having different numbers of local dimming blocks. In addition, since the second connector (43Rz) is provided at one end of the second substrate (43Ra), as the number of lines (circuits) of the second substrate (43Ra) connected to the local dimming blocks increases, wiring to connect the lines (circuits) to the second connector (43Rz) may become more difficult.

[0127]

[0128] Referring to FIGS. 24 and 25, the substrate (44) may be coupled to the front surface of the frame (80, see FIG. 3) or the front surface of the heat sink (83, see FIG. 4). The substrate (44) may be a printed circuit board (PCB) having light sources such as LEDs mounted thereon. For example, the substrate (44) may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. For example, the substrate (44) may have a bar shape. The substrate (44) may extend horizontally. Alternatively, the substrate (44) may extend vertically. A plurality of substrates (44) may be spaced apart from each other in a direction intersecting the longitudinal direction of the substrate (44). The substrate (44) may be referred to as a substrate (40).

[0129] The extension board (59) may extend in a direction intersecting the substrates (44). The extension board (59) may extend vertically. For example, the substrates (44) may extend from one long side of the extension board (59') in a direction intersecting (e.g., vertically) the extension board (59'). As another example, the substrates (44) may include first substrates (44L) and second substrates (44R) that are opposite each other with respect to the extension board (59'). The first substrates (44L) and the second substrates (44R) may be aligned with each other or staggered in the width direction of the extension board (59'). The first substrates (44L) may be referred to as first substrates (40L), and the second substrates (44R) may be referred to as second substrates (40R).

[0130] Mounting connectors (59z) can be mounted on the expansion board (59). The mounting connectors (59z) can be attached to the front of the expansion board (59) via SMT (Surface Mount Technology). The mounting connectors (59z) can be spaced apart from each other in the longitudinal direction of the expansion board (59).

[0131] The first substrates (44La, 44Lb, 44Lc, 44Ld, 44Le, 44Lf, 44Lg, 44Lh) may be adjacent to the first long side (e.g., the left side) of the expansion board (59) and may be electrically connected to the mounting connectors (59z) of the expansion board (59) via the first connectors (44Lz).

[0132] The second substrates (44Ra, 44Rb, 44Rc, 44Rd, 44Re, 44Rf, 44Rg, 44Rh) may be adjacent to the second long side (e.g., the right side) of the expansion board (59) and may be electrically connected to the mounting connectors (59z) of the expansion board (59) via the second connectors (44Rz).

[0133] The processor (C) may be mounted on an expansion board (59). The processor (C) may be an MCU (Micro Controller Unit). The processor (C) may be referred to as a controller (C) or a control unit (C). Driver ICs (U, Integrated Circuits) may be mounted on substrates (44). Each of the substrates (44) may have at least one driver IC (U). The processor (C) may convert (process) data regarding the image quality (e.g., brightness) of light sources received from the main board (P3) and provide the converted data to the driver ICs (U). The driver ICs (U) may be electrically connected to the substrates (44) based on the data received from the processor (C). The driver IC (U) may be referred to as a DIC (U), a driving chip (U), a driving IC (U), or a driving unit (U, driver unit).

[0134] The light sources (51) may be arranged in a matrix form on the entire surface of the substrates (44). The light sources (51) may be arranged in one row on each substrate (44). Alternatively, the light sources (51) may be arranged in two or more rows on each substrate (44). The light sources (51) of each substrate (44) may constitute a local dimming block N in number. Here, N is a natural number greater than or equal to 1. For example, each of the six light sources (51) of the first substrate (44La) may constitute a local dimming block, or the six light sources (51) of the first substrate (44La) may be grouped in pairs to constitute three local dimming blocks. The driver ICs (U) can control the brightness of the light source(s) (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) of the substrates (44) or blocking the flow of current, thereby implementing a local dimming block.

[0135]

[0136] Referring to FIGS. 26 and 27, the power supply board (P1) can be electrically connected to the cable (F1), and the cable (F1) can be electrically connected to the connector (59i) of the expansion board (59) through the hole (81i) of the frame (80). The main board (P3) can be electrically connected to the cable (F3), and the cable (F3) can be electrically connected to the connector (59i) of the expansion board (59) through the hole (81i) of the frame (80). The connector (59i) can be provided on the rear of the expansion board (59). The expansion board (59) can be connected to the power supply board (P1) and the main board (P3) through two cables (F1, F3). Each of the cables (F1, F3) can be an FFC (Flexible Flat Cable).

[0137] Accordingly, the LED driver board can be omitted, and the cost can be reduced. Meanwhile, the processor (C) can be mounted on the main board (P3) or the power supply board (P1) instead of the expansion board (59), and the LED driver board can be omitted. In this case, the processor (C) of the main board (P3) or the processor (C) of the power supply board (P1) can be electrically connected to the expansion board (59) via cables (F1, F3), and can be electrically connected to the driver ICs connected to the expansion board (59). Hereinafter, the description will be made based on the case where the processor (C) is mounted on the expansion board (59), and this description can also be applied when the processor (C) is mounted on the main board (P3) or the power supply board (P1), unless it is applicable only when the processor (C) is mounted on the expansion board (59).

[0138] The processor (C) of the expansion board (59), i.e., the MCU, can be electrically connected to the driver ICs (i.e., DICs) of the substrates (44) connected to the expansion board (59). The processor (C) of the expansion board (59) can convert (process) data regarding the image quality (e.g., brightness) of the light sources received from the main board (P3) and provide the data to the driver ICs (U) of the substrates (44). The driver ICs (U) can control the brightness of the light sources (51) of the substrates (44). The light sources (51) of each of the substrates (44) can be referred to as an LED array.

[0139]

[0140] Referring to FIG. 28, power (VLED) can be provided from a power supply board (P1) to connectors (44Lz, 44Rz) of substrates (44) via a cable (F1) and an expansion board (59). The power (VLED) of each of the connectors (44Lz, 44Rz) can be provided to light sources (51) of each of the substrates (44). The driver IC (U) of each substrate (44) can control the brightness of the light sources (51) by controlling the amount of current flowing to the light sources (51) of each substrate (44) or by blocking the flow of current, thereby implementing local dimming.

[0141]

[0142] Referring to FIGS. 29 to 32, the connectors (44Lz, 44Rz) can use various communication interfaces to communicate with the driver IC (U) of the substrate (44).

[0143] Referring to FIGS. 29 and 30, the connectors (44Lz, 44Rz) may use a modified SPI interface (Serial Peripheral Interface). The connectors (44Lz, 44Rz) may include first to seventh pins. The first pin may supply power (VLED) to light sources (51) of the substrate (44). The second pin may supply power (VCC) to a driver IC (U) of the substrate (44). The third pin may form a ground (GND) of the driver IC (U). Each of the fourth to seventh pins may correspond to a serial clock input (SCI), a serial data input (SDI), a serial data output (SDO), and a serial clock (SCO), respectively.

[0144] Referring to FIG. 31, the connectors (44Lz, 44Rz) may use an SPI interface (Serial Peripheral Interface). The connectors (44Lz, 44Rz) may include first to tenth pins. The first pin may supply power (VLED) to light sources (51) of the substrate (44). The ninth pin may supply power (VCC) to a driver IC (U) of the substrate (44). The tenth pin may form a ground (GND) of the driver IC (U). Each of the second to eighth pins may correspond to FB (Feedback), CSB (Chip Select Bar), SDI (Serial Data Input), SCLK (Serial Clock), FPWM (Forced Pulse Width Modulation), VSYNC (Vertical Synchronization), and SPI_EN (SPI Enable).

[0145] Referring to FIG. 32, the connectors (44Lz, 44Rz) may use a one-wire communication interface. The connectors (44Lz, 44Rz) may include first to fourth pins. The first pin may supply power (VLED) to the light sources (51) of the substrate (44). The second pin may supply power (VCC) to the driver IC (U) of the substrate (44). The third pin may form a ground (GND) of the driver IC (U). The fourth pin may correspond to data transmission.

[0146] Accordingly, the connector (44Lz, 44Rz) may have a specific number of pins. The number of these pins may be determined depending on the type of interface used in the connector (44Lz, 44Rz) and may be independent of the number of local dimming blocks in the substrate (44). In other words, the number of local dimming blocks in the substrate (44) may be increased regardless of the width of the connector (44Lz, 44Rz). The connector (44Lz, 44Rz) may be shared among substrates having different numbers of local dimming blocks. Since the driver IC (U) is arranged on the substrate (44), the lines (circuits) of the substrate (44) connected to the local dimming blocks may be easily wired.

[0147]

[0148] Referring to FIG. 33, the driver IC (U) may be positioned between the light sources (51) of the substrate (44). In the direction in which the light sources (51) are arranged, the driver IC (U) may overlap the light sources (51). The light sources (51) and the driver IC (U) may be arranged in one row. The driver ICs (U) may be spaced apart from each other with the light source(s) (51) interposed therebetween.

[0149] As the spacing (G, pitch) between the light sources (51) decreases, the width (Wu) for designing (arranging) the driver IC (U) between the light sources (51) may also decrease. There may be a limit to reducing the spacing (G) between the light sources (51) due to the driver IC (U). There may be a limit to increasing the number of light sources (51) within a substrate (44) of a specific length due to the driver IC (U). There may be a limit to increasing the number of local dimming blocks within a substrate (44) of a specific length due to the driver IC (U).

[0150]

[0151] Referring to FIG. 34, the substrate (44') may be connected to an expansion board (59, see FIGS. 24 and 25) via a connector (44Rz) in place of the substrate (44) of FIG. 33. The substrate (44') may be a printed circuit board (PCB) equipped with light sources such as LEDs. For example, the substrate (44') may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (44') may be referred to as a substrate (40).

[0152] The driver IC (U) may be positioned away from the line in which the light sources (51) of the substrate (44') are arranged. For example, the driver IC (U) may not overlap the light sources (51) in the width direction (i.e., vertical direction) of the substrate (44'). The driver IC (U) may be arranged between the upper side of the substrate (44') and the light sources (51). Alternatively, the driver IC (U) may be arranged between the lower side of the substrate (44') and the light sources (51). The driver ICs (U) may be arranged in one row but spaced apart from each other. Alternatively, the driver ICs (U) may be arranged in different rows.

[0153] Reducing the spacing (G, pitch) between light sources (51) may not be restricted by the driver IC (U). For example, the spacing (G) between light sources (51) may be smaller than the width of the driver IC (U). Compared to a substrate (44, see FIG. 33), it may be easy to increase the number of light sources (51) within a substrate (44') of a specific length or to increase the number of local dimming blocks.

[0154] The width (W') of the substrate (44') may be greater than the width (W) of the substrate (44, see FIG. 33). That is, the width of the substrate (44') may be increased in order to position the driver IC (U) away from the line on which the light sources (51) are arranged, thereby increasing the manufacturing cost of the substrate (44').

[0155]

[0156] Referring to FIG. 35, the substrate (44'') may be connected to an expansion board (59, see FIGS. 24 and 25) via a connector (44Rz) in place of the substrate (44') of FIG. 34. The substrate (44'') may be a printed circuit board (PCB) equipped with light sources such as LEDs. For example, the substrate (44'') may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (44'') may be referred to as a substrate (40).

[0157] The light sources (51) may be arranged in two rows on the substrate (44''). The driver IC (U) may be positioned away from the lines on which the light sources (51) are arranged. For example, the driver IC (U) may not overlap the light sources (51) in the width direction (i.e., vertical direction) of the substrate (44''). The driver IC (U) may be arranged between the light sources (51) of the first row (R1) and the light sources (51) of the second row (R2). Alternatively, the driver IC (U) may be arranged between the upper side of the substrate (44'') and the light sources (51) of the first row (R1). Alternatively, the driver IC (U) may be arranged between the lower side of the substrate (44'') and the light sources (51) of the second row (R2). The driver ICs (U) may be arranged in one row but spaced apart from each other. Alternatively, the driver ICs (U) may be arranged in different rows.

[0158] Reducing the spacing (G, pitch) between the light sources (51) may not be restricted by the driver IC (U). For example, the spacing (G) between the light sources (51) may be smaller than the width of the driver IC (U). Compared to the substrate (44, see FIG. 33), it may be easy to increase the number of light sources (51) within a substrate (44'') of a specific length or to increase the number of local dimming blocks.

[0159] The width (W'') of each of the substrates (44'') may be greater than the sum of the widths (W) of the substrates (44Ra, 44Rb, see FIG. 33). That is, in order to position the driver IC (U) away from the line on which the light sources (51) are arranged, the width of the substrate (44'') may be widened, which may increase the manufacturing cost of the substrate (44'').

[0160] One connector (44Rz) can be mounted on a substrate (44'') having 20 light sources (51) and can be connected to driver ICs (Ua, Ub, Uc, Ud, Ue) of the substrate (44''). In comparison, each of two connectors (44Rz) can be mounted on each of the substrates (44Ra, 44Rb, see FIG. 33) having a total of 20 light sources (51) and can be connected to driver ICs (Ua, Ub, Uc, see FIG. 33) of each of the substrates (44Ra, 44Rb). That is, even if the total number of light sources (51) of the substrates (44'') and the total number of light sources (51) of the substrates (44, see FIG. 33) are the same, the number of connectors (44Rz) used in the substrates (44'') may be half of the number of connectors (44Rz) used in the substrates (44, see FIG. 33).

[0161]

[0162] Referring to FIG. 36, the substrate (45) may be connected to an expansion board (59, see FIGS. 24 and 25) via a connector (45Rz) in place of the substrate (44'') of FIG. 35. The substrate (45) may be a printed circuit board (PCB) equipped with light sources such as LEDs. For example, the substrate (45) may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (45) may be referred to as a substrate (40).

[0163] The substrate (45) may have an overall shape of tongs, a tuning fork, or a chain. The substrate (45) may include a body (450) and legs (451, 452). A connector (45Rz) may be mounted on the body (450) adjacent to one side of the body (450). The legs (451, 452) may extend horizontally from the other side of the body (450) and may be spaced apart from each other in the vertical direction. The legs (451, 452) may be referred to as arms (451, 452). The light sources (51) may be arranged in two rows on the substrate (45). The light sources (51) of the first row (R1) may be arranged along the first leg (451). The light sources (51) of the second row (R2) can be arranged along the second leg (452).

[0164] For example, the substrate (45) may have 20 light sources (51) and may have an area smaller than that of the substrate (44'', see FIG. 35) having 20 light sources (51). The difference in the areas of the substrates (45) and the substrates (44'') may correspond to the size of the empty area (45S) between the legs (451, 452) of the substrate (45). As a result, the manufacturing cost of the substrate (45) may be lower than the manufacturing cost of the substrate (44'').

[0165] The driver IC (U) may be positioned between the light sources (51) of the substrate (45). In the direction in which the light sources (51) of the first row (R1) are arranged, the driver IC (U) may overlap the light sources (51). The light sources (51) of the first row (R1) and the driver IC (U) may be arranged in one line. In the direction in which the light sources (51) of the second row (R2) are arranged, the driver IC (U) may overlap the light sources (51). The light sources (51) of the second row (R2) and the driver IC (U) may be arranged in one line. The driver ICs (U) may be spaced apart from each other with the light source(s) (51) therebetween.

[0166] As the spacing (G, pitch) between the light sources (51) decreases, the width (Wu) for designing (arranging) the driver IC (U) between the light sources (51) may also decrease. There may be a limit to reducing the spacing (G) between the light sources (51) due to the driver IC (U). There may be a limit to increasing the number of light sources (51) within a substrate (44) of a specific length due to the driver IC (U). There may be a limit to increasing the number of local dimming blocks within a substrate (44) of a specific length due to the driver IC (U).

[0167]

[0168] Referring to FIG. 37, the substrate (46) may be connected to an expansion board (59, see FIGS. 24 and 25) via a connector (46Rz) in place of the substrate (44'') of FIG. 35. The substrate (46) may be a printed circuit board (PCB) equipped with light sources such as LEDs. For example, the substrate (46) may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (46) may be referred to as a substrate (40).

[0169] The substrate (46) may have a comb or saw blade shape. The substrate (46) may include a body (460) and legs (46E). The body (460) may be elongated. The legs (46E) may extend from one long side of the body (460) in a direction intersecting the body (460) and may be spaced apart from each other in the longitudinal direction of the body (460). The longitudinal direction of the body (460) may be defined in the horizontal direction, and the longitudinal direction of the legs (46E) may be defined in the vertical direction. The length of the legs (46E) may be smaller than the length of the body (460). The legs (46E) may be referred to as arms (46E). The light sources (51) may be arranged in two rows on the substrate (46). The light sources (51) of the first row (R1) can be arranged along the body (460). Each of the light sources (51) of the second row (R2) can be arranged on each of the legs (46E).

[0170] For example, the substrate (46) may have 20 light sources (51) and may have an area smaller than that of the substrate (44'', see FIG. 35) having the 20 light sources (51). The difference in the areas of the substrates (46) and the substrates (44'') may correspond to the sum of the sizes of the empty areas (46S) between the legs (46E) of the substrate (46). As a result, the manufacturing cost of the substrate (46) may be lower than the manufacturing cost of the substrate (44'').

[0171] The driver IC (U) may be positioned between the light sources (51) of the substrate (46). In the direction in which the light sources (51) of the first row (R1) are arranged, the driver IC (U) may overlap the light sources (51). The light sources (51) of the first row (R1) and the driver IC (U) may be arranged in one line. The driver ICs (U) may be spaced apart from each other with the light source(s) (51) therebetween.

[0172] As the spacing (G, pitch) between the light sources (51) decreases, the width (Wu) for designing (arranging) the driver IC (U) between the light sources (51) may also decrease. There may be a limit to reducing the spacing (G) between the light sources (51) due to the driver IC (U). There may be a limit to increasing the number of light sources (51) within a substrate (46) of a specific length due to the driver IC (U). There may be a limit to increasing the number of local dimming blocks within a substrate (46) of a specific length due to the driver IC (U).

[0173]

[0174] Referring to FIG. 38, the substrate (46') may be connected to an expansion board (59, see FIGS. 24 and 25) via a connector (46Rz) instead of the substrate (46) of FIG. 37. The substrate (46') may be a printed circuit board (PCB) equipped with light sources such as LEDs. For example, the substrate (46') may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (46') may include legs (46E) that are spaced apart from each other in the horizontal direction, and a body (460') that extends horizontally and connects the legs (46E). The legs (46E) may be referred to as arms (46E). The light sources (51) of the first row (R1) may be arranged along the body (460'). Each of the light sources (51) of the second row (R2) can be placed on each of the legs (46E). The substrate (46') can be referred to as a substrate (40).

[0175] The driver IC (U) may be positioned away from the first row (R1) in which the light sources (51) are arranged. For example, the driver IC (U) may not overlap the light sources (51) in the width direction (i.e., vertical direction) of the substrate (46'). The driver IC (U) may be positioned between the upper side of the substrate (46') and the first row (R1).

[0176] Reducing the spacing (G, pitch) between the light sources (51) may not be restricted by the driver IC (U). For example, the spacing (G) between the light sources (51) may be smaller than the width of the driver IC (U). Compared to the substrate (46, see FIG. 37), it may be easy to increase the number of light sources (51) within a substrate (46') of a specific length or to increase the number of local dimming blocks.

[0177] The width (W6') of the body (460') of the substrate (46') may be greater than the width (W6) of the body (460) of the substrate (46, see FIG. 37). That is, the width of the body (460') may be increased in order to position the driver IC (U) away from the line on which the light sources (51) are arranged, thereby increasing the manufacturing cost of the substrate (46').

[0178]

[0179] Referring to FIG. 39, the substrate (46'') may be connected to an expansion board (59, see FIGS. 24 and 25) via a connector (46Rz) instead of the substrate (46) of FIG. 37. The substrate (46'') may be a printed circuit board (PCB) on which light sources such as LEDs are mounted. For example, the substrate (46'') may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (46'') may include a body (460) extending horizontally, and legs (46E') extending vertically from the body (460) and spaced apart from each other. The legs (46E') may be referred to as arms (46E'). Each of the light sources (51) of the first row (R1) may be arranged on each of the legs (46E'). Alternatively, each of the light sources (51) of the first row (R1) may be placed at the boundary between the body (460) and the legs (46E'). Each of the light sources (51) of the second row (R2) may be placed at each of the legs (46E'). The substrate (46'') may be referred to as a substrate (40).

[0180] The driver IC (U) may be positioned away from the first row (R1) in which the light sources (51) are arranged. For example, the driver IC (U) may not overlap with the light sources (51) in the width direction (i.e., vertical direction) of the substrate (46''). The driver IC (U) may be placed in the body (460).

[0181] Reducing the spacing (G, pitch) between the light sources (51) may not be restricted by the driver IC (U). For example, the spacing (G) between the light sources (51) may be smaller than the width of the driver IC (U). Compared to the substrate (46, see FIG. 37), it may be easy to increase the number of light sources (51) within a substrate (46'') of a specific length or to increase the number of local dimming blocks.

[0182] The length (L6') of each of the legs (46E') of the substrate (46'') may be greater than the length (L6) of each of the legs (46E) of the substrate (46, see FIG. 37). That is, in order to place the light sources (51) of the first and second rows (R1, R2) on the legs (46E'), the length of the legs (46E') may be increased, which may increase the manufacturing cost of the substrate (46'').

[0183]

[0184] Referring to FIG. 40, the substrate (47) may be connected to an expansion board (59, see FIGS. 24 and 25) via a connector (47Rz) in place of the substrate (44'') of FIG. 35. The substrate (47) may be a printed circuit board (PCB) equipped with light sources such as LEDs. For example, the substrate (47) may include at least one of polyethylene terephthalate (PET), glass, polycarbonate (PC), or silicon. The substrate (47) may be referred to as a substrate (40).

[0185] The substrate (47) may have an antenna or a double sided saw blade shape. The substrate (47) may include a body (470) and legs (47E). The body (470) may be elongated. The legs (47E) may intersect the body (470) and may be spaced apart from each other along the body (470). The legs (47E) may be referred to as arms (47E). The legs (47E) may include first legs (47EA) extending from a first long side of the body (470) in a direction intersecting the body (470), and second legs (47EB) extending from a second long side of the body (470) in a direction intersecting the body (470). In the width direction of the body (470), the first legs (47EA) and the second legs (47EB) may be aligned with each other or arranged staggered. The length direction of the body (470) may be defined in the horizontal direction, and the width direction of the body (470) and the length direction of the legs (47E) may be defined in the vertical direction. The length of each of the legs (47E) may be smaller than the length of the body (470). The light sources (51) may be arranged in two rows on the substrate (47). Each of the light sources (51) of the first row (R1) may be arranged on each of the first legs (47EA). Each of the light sources (51) of the second row (R2) may be arranged on each of the second legs (47EB).

[0186] For example, the substrate (47) may have 20 light sources (51) and may have an area smaller than that of the substrate (44'', see FIG. 35) having 20 light sources (51). The difference in the areas of the substrate (47) and the substrate (44'') may correspond to the sum of the sizes of the empty areas (47S) between the legs (47E). As a result, the manufacturing cost of the substrate (47) may be lower than the manufacturing cost of the substrate (44'').

[0187] The driver IC (U) may be positioned away from the first row (R1) and the second row (R2) in which the light sources (51) are arranged. For example, the driver IC (U) may not overlap the light sources (51) in the width direction (i.e., vertical direction) of the substrate (47). The driver IC (U) may be positioned between the first row (R1) and the second row (R2). The driver IC (U) may be positioned in the body (470). The driver ICs (U) may be arranged along the body (470).

[0188] Reducing the spacing (G, pitch) between the light sources (51) may not be restricted by the driver IC (U). For example, the spacing (G) between the light sources (51) may be smaller than the width of the driver IC (U). Compared to the substrate (44'', see FIG. 35), it may be easy to increase the number of light sources (51) within a substrate (47) of a specific length or to increase the number of local dimming blocks.

[0189]

[0190] Referring to FIGS. 41 to 43, the areas between substrates (41, 44'', 47) on which light sources (51) are mounted can be compared. Each of the substrates (41, 44'', 47) can be formed by cutting a plate (S) of a specific size. The plate (S) can have a specific width (Ws) and height (Hs).

[0191] Referring to Fig. 41, a specific number of light sources (51) can be arranged in a matrix form on one substrate (41). The matrix formed by the light sources (51) can be composed of 8 rows (R1, R2, R3, R4, R5, R6, R7, R8) and 18 columns (C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18), and the total number of light sources (51) can be 144. The substrate (41) can be separated from the plate (S).

[0192] Referring to FIG. 42, 144 light sources (51) may be arranged on substrates (44''). Each of the substrates (44'') may have a bar shape. 36 light sources (51) may be arranged in two rows on a first substrate (44Ra''). 36 light sources (51) may be arranged in two rows on a second substrate (44Rb''). 36 light sources (51) may be arranged in two rows on a third substrate (44Rc''). 36 light sources (51) may be arranged in two rows on a fourth substrate (44Rd''). The first to fourth substrates (44Ra'', 44Rb'', 44Rc'', 44Rd'') may have the same shape. The total area of ​​the first to fourth substrates (44Ra'', 44Rb'', 44Rc'', 44Rd'') may be smaller than the area of ​​the substrate (41, see FIG. 41). The substrates (44'') separated from the plate (S) may be spaced apart from each other.

[0193] Referring to FIG. 43, 144 light sources (51) may be arranged on substrates (47). Each of the substrates (47) may have the shape of an antenna or a double-sided saw blade (see FIG. 40 and its description). 36 light sources (51) may be arranged in two rows on the legs (47EA, 47EB) of the first substrate (47Ra). 36 light sources (51) may be arranged in two rows on the legs (47EA, 47EB) of the second substrate (47Rb). 36 light sources (51) may be arranged in two rows on the legs (47EA, 47EB) of the third substrate (47Rc). 36 light sources (51) may be arranged in two rows on the legs (47EA, 47EB) of the fourth substrate (47Rd). The first to fourth substrates (47Ra, 47Rb, 47Rc, 47Rd) may have the same shape. The second legs (47EB) of the first substrate (47Ra) may be positioned between the first legs (47EA) of the second substrate (47Rb), and the second legs (47EB) of the second substrate (47Rb) may be positioned between the first legs (47EA) of the third substrate (47Rc). The second legs (47EB) of the third substrate (47Rc) may be positioned between the first legs (47EA) of the fourth substrate (47Rd). The sum total of the areas of the first to fourth substrates (47Ra, 47Rb, 47Rc, 47Rd) may be smaller than the sum total of the areas of the first to fourth substrates (44Ra'', 44Rb'', 44Rc'', 44Rd''). The substrates (47) separated from the plate (S) may be spaced apart from each other.

[0194] Accordingly, the substrate (47) may be advantageous in reducing manufacturing costs compared to the substrates (41, 44'').

[0195]

[0196] Referring to FIG. 44, the light sources (51) can be arranged along the first leg (451) of the substrate (45) and can be mounted on the first leg (451) and the body (450). The light sources (51) can be arranged along the second leg (452) of the substrate (45) and can be mounted on the second leg (452) and the body (450). The first driver unit (Ua) can be positioned between the light sources (51) of the first leg (451) and can be mounted on the first leg (451). The second driver unit (Ub) can be positioned between the light sources (51) of the second leg (452) and can be mounted on the second leg (452). The lines described below (Lv, Lf1, Lf2, Lf3, Lf4, Lf5, Lf6, Lf7, Lf8, Lf9, Lf10, Lf11, Lf12, Lc, Lg, Li, Le) may be circuits wired on the substrate (45). Jumpers (Ja, Jb) may connect wires on the substrate (45).

[0197] The power line (Lv) can be connected to the power pin (VL) of the connector (45Rz) and can be wired along the legs (451, 452). The power pin (VL) can provide power (VLED) received from the power supply board (P1) to the power line (Lv). The power line (Lv) can be branched as many times as the number of local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) of the substrate (45).

[0198] The first branch line (Lv1) may be connected to a light source (51) forming a first local dimming block (BL1). The second branch line (Lv2) may be connected to a light source (51) forming a second local dimming block (BL2). The third branch line (Lv3) may be connected to a light source (51) forming a third local dimming block (BL3). The fourth branch line (Lv4) may be connected to a light source (51) forming a fourth local dimming block (BL4). The fifth branch line (Lv5) may be connected to a light source (51) forming a fifth local dimming block (BL5). The sixth branch line (Lv6) may be connected to a light source (51) forming a sixth local dimming block (BL6). The first to sixth local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6) can be formed in the first leg (451).

[0199] The seventh branch line (Lv7) may be connected to a light source (51) forming a seventh local dimming block (BL7). The eighth branch line (Lv8) may be connected to a light source (51) forming an eighth local dimming block (BL8). The ninth branch line (Lv9) may be connected to a light source (51) forming a ninth local dimming block (BL9). The tenth branch line (Lv10) may be connected to a light source (51) forming a tenth local dimming block (BL10). The eleventh branch line (Lv11) may be connected to a light source (51) forming an eleventh local dimming block (BL11). The twelfth branch line (Lv12) may be connected to a light source (51) forming a twelfth local dimming block (BL12). The seventh to twelfth local dimming blocks (BL7, BL8, BL9, BL10, BL11, BL12) may be formed in the second leg (452).

[0200] A first line (Lf1) can connect a light source (51) connected to a first branch line (Lv1) to a first driver unit (Ua). A second line (Lf2) can connect a light source (51) connected to a second branch line (Lv2) to a first driver unit (Ua). A third line (Lf3) can connect a light source (51) connected to a third branch line (Lv3) to a first driver unit (Ua). A fourth line (Lf4) can connect a light source (51) connected to a fourth branch line (Lv4) to a first driver unit (Ua). A fifth line (Lf5) can connect a light source (51) connected to a fifth branch line (Lv5) to a first driver unit (Ua). The sixth line (Lf6) can connect the light source (51) connected to the sixth branch line (Lv6) to the first driver unit (Ua).

[0201] The seventh line (Lf7) can connect the light source (51) connected to the seventh branch line (Lv7) to the second driver unit (Ub). The eighth line (Lf8) can connect the light source (51) connected to the eighth branch line (Lv8) to the second driver unit (Ub). The ninth line (Lf9) can connect the light source (51) connected to the ninth branch line (Lv9) to the second driver unit (Ub). The tenth line (Lf10) can connect the light source (51) connected to the tenth branch line (Lv10) to the second driver unit (Ub). The eleventh line (Lf11) can connect the light source (51) connected to the eleventh branch line (Lv11) to the second driver unit (Ub). The 12th line (Lf12) can connect the light source (51) connected to the 12th branch line (Lv12) to the second driver unit (Ub).

[0202] The power pin (VCC) of the connector (45Rz) can be sequentially connected to the first driver unit (Ua) and the second driver unit (Ub) via the first line (Lc1) and the second line (Lc2), and the second driver unit (Ub) can be connected to the ground pin (GND) of the connector (45Rz) via the line (Lg). The first line (Lc1) and the second line (Lc2) can be collectively referred to as the line (Lc). Accordingly, the first driver unit (Ua) and the second driver unit (Ub) can be driven by power provided from the power pin (VCC).

[0203] The signal pins (Signals) of the connector (45Rz) can be sequentially connected to the first driver unit (Ua) and the second driver unit (Ub) via lines (Li) (see arrows in Fig. 44), and the second driver unit (Ub) can be connected to the signal out pin (signal out) of the connector (45Rz) via lines (Le). Accordingly, the processor (C, see Figs. 27 and 28) of the expansion board (59) can convert (process) data regarding the brightness of the light sources (51) received from the main board (P3) and provide the data to the driver ICs (U).

[0204] Power (VLED) can be supplied to the first local dimming block (BL1) through the first branch line (Lv1), and current passing through the first local dimming block (BL1) can flow to the first driver IC (Ua) through the first line (Lf1). Likewise, the power (VLED) can be supplied to each of the second to twelfth local dimming blocks (BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) through each of the second to twelfth branch lines (Lv2, Lv3, Lv4, Lv5, Lv6, Lv7, Lv8, Lv9, Lv10, Lv11, Lv12), and the current passing through each of the second to twelfth local dimming blocks (BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) can be supplied to each of the second to twelfth lines (Lf2, Lf3, Lf4, Lf5, Lf6, Lf7, Lf8, Lf9, Lf10, The current can flow to the first driver IC (Ua) or the second driver IC (Ub) through each of Lf11 and Lf12. The driver ICs (Ua and Ub) can control the brightness of the light sources (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) belonging to each local dimming block or by blocking the flow of current, thereby implementing local dimming.

[0205]

[0206] Referring to FIG. 45, light sources (51) may be arranged along the body (460) of the substrate (46) and may be mounted on the body (460). Each of the light sources (51) may be mounted on each of the legs (46E) of the substrate (46). The first driver unit (Ua) and the second driver unit (Ub) may be positioned between the light sources (51) of the body (460) and may be mounted on the body (460). The lines (Lv, Lf1, Lf2, Lf3, Lf4, Lf5, Lf6, Lf7, Lf8, Lf9, Lf10, Lf11, Lf12, Lc, Lg, Li, Le) described below may be circuits wired on the substrate (46). The jumpers (Ja, Jb, Jc) may connect wires on the substrate (46).

[0207] The power line (Lv) can be connected to the power pin (VL) of the connector (46Rz) and can be wired along the legs (46E). The power pin (VL) can provide power (VLED) received from the power supply board (P1) to the power line (Lv). The power line (Lv) can be branched as many times as the number of local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) of the substrate (46).

[0208] The first branch line (Lv1) may be connected to a light source (51) forming a first local dimming block (BL1). The second branch line (Lv2) may be connected to a light source (51) forming a second local dimming block (BL2). The third branch line (Lv3) may be connected to a light source (51) forming a third local dimming block (BL3). The fourth branch line (Lv4) may be connected to a light source (51) forming a fourth local dimming block (BL4). The fifth branch line (Lv5) may be connected to a light source (51) forming a fifth local dimming block (BL5). The sixth branch line (Lv6) may be connected to a light source (51) forming a sixth local dimming block (BL6). The first to sixth local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6) can be formed in the body (460).

[0209] The seventh branch line (Lv7) may be connected to a light source (51) forming a seventh local dimming block (BL7). The eighth branch line (Lv8) may be connected to a light source (51) forming an eighth local dimming block (BL8). The ninth branch line (Lv9) may be connected to a light source (51) forming a ninth local dimming block (BL9). The tenth branch line (Lv10) may be connected to a light source (51) forming a tenth local dimming block (BL10). The eleventh branch line (Lv11) may be connected to a light source (51) forming an eleventh local dimming block (BL11). The twelfth branch line (Lv12) may be connected to a light source (51) forming a twelfth local dimming block (BL12). The seventh to twelfth local dimming blocks (BL7, BL8, BL9, BL10, BL11, BL12) can be formed in the legs (46E).

[0210] A first line (Lf1) can connect a light source (51) connected to a first branch line (Lv1) to a first driver unit (Ua). A second line (Lf2) can connect a light source (51) connected to a second branch line (Lv2) to a first driver unit (Ua). A third line (Lf3) can connect a light source (51) connected to a third branch line (Lv3) to a first driver unit (Ua). A fourth line (Lf4) can connect a light source (51) connected to a fourth branch line (Lv4) to a second driver unit (Ub). A fifth line (Lf5) can connect a light source (51) connected to a fifth branch line (Lv5) to a second driver unit (Ub). The sixth line (Lf6) can connect the light source (51) connected to the sixth branch line (Lv6) to the second driver unit (Ub).

[0211] The seventh line (Lf7) can connect the light source (51) connected to the seventh branch line (Lv7) to the first driver unit (Ua). The eighth line (Lf8) can connect the light source (51) connected to the eighth branch line (Lv8) to the first driver unit (Ua). The ninth line (Lf9) can connect the light source (51) connected to the ninth branch line (Lv9) to the first driver unit (Ua). The tenth line (Lf10) can connect the light source (51) connected to the tenth branch line (Lv10) to the second driver unit (Ub). The eleventh line (Lf11) can connect the light source (51) connected to the eleventh branch line (Lv11) to the second driver unit (Ub). The 12th line (Lf12) can connect the light source (51) connected to the 12th branch line (Lv12) to the second driver unit (Ub).

[0212] The power pin (VCC) of the connector (46Rz) can be sequentially connected to the first driver unit (Ua) and the second driver unit (Ub) via a first line (Lc1, not shown) and a second line (Lc2, not shown), and the second driver unit (Ub) can be connected to the ground pin (GND) of the connector (46Rz) via a line (Lg, not shown). The first line (Lc1) and the second line (Lc2) can be collectively referred to as a line (Lc). Accordingly, the first driver unit (Ua) and the second driver unit (Ub) can be driven by power provided from the power pin (VCC).

[0213] The signal pins (Signals) of the connector (46Rz) can be sequentially connected to the first driver unit (Ua) and the second driver unit (Ub) via lines (Li, not shown) (see arrows in Fig. 45), and the second driver unit (Ub) can be connected to the signal out pin (signal out) of the connector (46Rz) via lines (Le). Accordingly, the processor (C, see Figs. 27 and 28) of the expansion board (59) can convert (process) data regarding the brightness of the light sources (51) received from the main board (P3) and provide the data to the driver ICs (U).

[0214] Power (VLED) can be supplied to the first local dimming block (BL1) through the first branch line (Lv1), and current passing through the first local dimming block (BL1) can flow to the first driver IC (Ua) through the first line (Lf1). Likewise, the power (VLED) can be supplied to each of the second to twelfth local dimming blocks (BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) through each of the second to twelfth branch lines (Lv2, Lv3, Lv4, Lv5, Lv6, Lv7, Lv8, Lv9, Lv10, Lv11, Lv12), and the current passing through each of the second to twelfth local dimming blocks (BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) can be supplied to each of the second to twelfth lines (Lf2, Lf3, Lf4, Lf5, Lf6, Lf7, Lf8, Lf9, Lf10, The current can flow to the first driver IC (Ua) or the second driver IC (Ub) through each of Lf11 and Lf12. The driver ICs (Ua and Ub) can control the brightness of the light sources (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) belonging to each local dimming block or by blocking the flow of current, thereby implementing local dimming.

[0215]

[0216] Referring to Fig. 46, each of the light sources (51) can be mounted on each of the legs (46E') of the substrate (46''). The driver unit (U) can be mounted on the body (460) of the substrate (46''). The lines (Lv, Lf1, Lf2, Lf3, Lc, Lg, Ls) described below can be circuits wired on the substrate (46''). The jumpers (Ja, Jb) can connect the wires on the substrate (46'').

[0217] The power line (Lv) can be connected to the power pin (VL) of the connector (46Rz) and can be routed along the legs (46E'). The power pin (VL) can provide power (VLED) received from the power supply board (P1) to the power line (Lv). The power line (Lv) can be branched as many times as the number of local dimming blocks (BL1, BL2, BL3) of the board (46'').

[0218] The first branch line (Lv1) may be connected to a light source (51) forming a first local dimming block (BL1). The second branch line (Lv2) may be connected to a light source (51) forming a second local dimming block (BL2). The third branch line (Lv3) may be connected to a light source (51) forming a third local dimming block (BL3). The first to third local dimming blocks (BL1, BL2, BL3) may be formed on the legs (46E').

[0219] The first line (Lf1) can connect a light source (51) connected to the first branch line (Lv1) to the driver unit (U). The second line (Lf2) can connect a light source (51) connected to the second branch line (Lv2) to the driver unit (U). The third line (Lf3) can connect a light source (51) connected to the third branch line (Lv3) to the driver unit (U).

[0220] The power pin (VCC) of the connector (46Rz) can be connected to the driver unit (U) via the line (Lc), and the driver unit (U) can be connected to the ground pin (GND) of the connector (46Rz) via the line (Lg). Accordingly, the driver unit (U) can be driven by power supplied from the power pin (VCC).

[0221] The signal pins (Signals) of the connector (46Rz) can be connected to the driver unit (U) via lines (Ls). Accordingly, the processor (C, see FIGS. 27 and 28) of the expansion board (59) can convert (process) data regarding the brightness of the light sources (51) received from the main board (P3) and provide the data to the driver ICs (U).

[0222] The power (VLED) can be supplied to the first local dimming block (BL1) through the first branch line (Lv1), and the current passing through the first local dimming block (BL1) can flow to the driver IC (U) through the first line (Lf1). Similarly, the power (VLED) can be supplied to the second and third local dimming blocks (BL2, BL3) through the second and third branch lines (Lv2, Lv3), respectively, and the current passing through the second and third local dimming blocks (BL2, BL3) can flow to the driver IC (U) through the second and third lines (Lf2, Lf3), respectively. The driver IC (U) can control the brightness of the light sources (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) belonging to each local dimming block or by blocking the flow of current, thereby implementing local dimming.

[0223]

[0224] Referring to FIG. 47, each of the light sources (51) may be mounted on each of the first legs (47EA) of the substrate (47). Each of the light sources (51) may be mounted on each of the second legs (47EB) of the substrate (47). The lines (Lv, Lf1, Lf2, Lf3, Lf4, Lf5, Lf6, Lc, Lg, Ls) described below may be circuits wired on the substrate (47). The jumpers (Ja, Jb) may connect the wires on the substrate (47).

[0225] The power line (Lv) can be connected to the power pin (VL) of the connector (46Rz) and can be wired along the legs (46E). The power pin (VL) can provide power (VLED) received from the power supply board (P1) to the power line (Lv). The power line (Lv) can be branched as many times as the number of local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6) of the substrate (47).

[0226] The first branch line (Lv1) may be connected to a light source (51) forming a first local dimming block (BL1). The second branch line (Lv2) may be connected to a light source (51) forming a second local dimming block (BL2). The third branch line (Lv3) may be connected to a light source (51) forming a third local dimming block (BL3). The fourth branch line (Lv4) may be connected to a light source (51) forming a fourth local dimming block (BL4). The fifth branch line (Lv5) may be connected to a light source (51) forming a fifth local dimming block (BL5). The sixth branch line (Lv6) may be connected to a light source (51) forming a sixth local dimming block (BL6). The first to sixth local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6) can be formed in the legs (47E).

[0227] A first line (Lf1) can connect a light source (51) connected to a first branch line (Lv1) to a driver unit (U). A second line (Lf2) can connect a light source (51) connected to a second branch line (Lv2) to a driver unit (U). A third line (Lf3) can connect a light source (51) connected to a third branch line (Lv3) to a driver unit (U). A fourth line (Lf4) can connect a light source (51) connected to a fourth branch line (Lv4) to a driver unit (U). A fifth line (Lf5) can connect a light source (51) connected to a fifth branch line (Lv5) to a driver unit (U). A sixth line (Lf6) can connect a light source (51) connected to a sixth branch line (Lv6) to a driver unit (U).

[0228] The power pin (VCC) of the connector (47Rz) can be connected to the driver unit (U) via the line (Lc), and the driver unit (U) can be connected to the ground pin (GND) of the connector (47Rz) via the line (Lg). Accordingly, the driver unit (U) can be driven by power supplied from the power pin (VCC).

[0229] The signal pins (Signals) of the connector (47Rz) can be connected to the driver unit (U) via lines (Ls). Accordingly, the processor (C, see FIGS. 27 and 28) of the expansion board (59) can convert (process) data regarding the brightness of the light sources (51) received from the main board (P3) and provide the data to the driver ICs (U).

[0230] The power (VLED) can be supplied to the first local dimming block (BL1) through the first branch line (Lv1), and the current passing through the first local dimming block (BL1) can flow to the driver IC (U) through the first line (Lf1). Similarly, the power (VLED) can be supplied to the second to sixth local dimming blocks (BL2, BL3, BL4, BL5, BL6) through the second to sixth branch lines (Lv2, Lv3, Lv4, Lv5, Lv6), respectively, and the current passing through the second to sixth local dimming blocks (BL2, BL3, BL4, BL5, BL6) can flow to the driver IC (U) through the second to sixth lines (Lf2, Lf3, Lf4, Lf5, Lf6), respectively. The driver IC (U) can control the brightness of the light sources (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) belonging to each local dimming block or by blocking the flow of current, thereby implementing local dimming.

[0231]

[0232] Referring to FIG. 48, each of the light sources (51) may be mounted on each of the first legs (47EA) of the substrate (47). Each of the light sources (51) may be mounted on each of the second legs (47EB) of the substrate (47). The first driver unit (Ua) and the second driver unit (Ub) may be mounted on the body (470). The lines (Lv, Lf1, Lf2, Lf3, Lf4, Lf5, Lf6, Lf7, Lf8, Lf9, Lf10, Lf11, Lf12, Lc, Lg, Li, Le) described below may be circuits wired on the substrate (47). The jumpers (Ja, Jb) may connect the wires on the substrate (47).

[0233] The power line (Lv) can be connected to the power pin (VL) of the connector (47Rz) and can be wired along the legs (47E). The power pin (VL) can provide power (VLED) received from the power supply board (P1) to the power line (Lv). The power line (Lv) can be branched as many times as the number of local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) of the substrate (47).

[0234] The first branch line (Lv1) may be connected to a light source (51) forming a first local dimming block (BL1). The second branch line (Lv2) may be connected to a light source (51) forming a second local dimming block (BL2). The third branch line (Lv3) may be connected to a light source (51) forming a third local dimming block (BL3). The fourth branch line (Lv4) may be connected to a light source (51) forming a fourth local dimming block (BL4). The fifth branch line (Lv5) may be connected to a light source (51) forming a fifth local dimming block (BL5). The sixth branch line (Lv6) may be connected to a light source (51) forming a sixth local dimming block (BL6). The first to sixth local dimming blocks (BL1, BL2, BL3, BL4, BL5, BL6) can be formed in the first legs (47EA).

[0235] The seventh branch line (Lv7) may be connected to a light source (51) forming a seventh local dimming block (BL7). The eighth branch line (Lv8) may be connected to a light source (51) forming an eighth local dimming block (BL8). The ninth branch line (Lv9) may be connected to a light source (51) forming a ninth local dimming block (BL9). The tenth branch line (Lv10) may be connected to a light source (51) forming a tenth local dimming block (BL10). The eleventh branch line (Lv11) may be connected to a light source (51) forming an eleventh local dimming block (BL11). The twelfth branch line (Lv12) may be connected to a light source (51) forming a twelfth local dimming block (BL12). The seventh to twelfth local dimming blocks (BL7, BL8, BL9, BL10, BL11, BL12) may be formed in the second legs (47EB).

[0236] A first line (Lf1) can connect a light source (51) connected to a first branch line (Lv1) to a first driver unit (Ua). A second line (Lf2) can connect a light source (51) connected to a second branch line (Lv2) to a first driver unit (Ua). A third line (Lf3) can connect a light source (51) connected to a third branch line (Lv3) to a first driver unit (Ua). A fourth line (Lf4) can connect a light source (51) connected to a fourth branch line (Lv4) to a first driver unit (Ua). A fifth line (Lf5) can connect a light source (51) connected to a fifth branch line (Lv5) to a first driver unit (Ua). The sixth line (Lf6) can connect the light source (51) connected to the sixth branch line (Lv6) to the first driver unit (Ua).

[0237] The seventh line (Lf7) can connect the light source (51) connected to the seventh branch line (Lv7) to the second driver unit (Ub). The eighth line (Lf8) can connect the light source (51) connected to the eighth branch line (Lv8) to the second driver unit (Ub). The ninth line (Lf9) can connect the light source (51) connected to the ninth branch line (Lv9) to the second driver unit (Ub). The tenth line (Lf10) can connect the light source (51) connected to the tenth branch line (Lv10) to the second driver unit (Ub). The eleventh line (Lf11) can connect the light source (51) connected to the eleventh branch line (Lv11) to the second driver unit (Ub). The 12th line (Lf12) can connect the light source (51) connected to the 12th branch line (Lv12) to the second driver unit (Ub).

[0238] The power pin (VCC) of the connector (47Rz) can be sequentially connected to the second driver unit (Ub) and the first driver unit (Ua) via the line (Lc), and the first driver unit (Ua) can be connected to the ground pin (GND) of the connector (47Rz) via the line (Lg). Accordingly, the first driver unit (Ua) and the second driver unit (Ub) can be driven by power supplied from the power pin (VCC).

[0239] The signal pins (Signals) of the connector (47Rz) can be sequentially connected to the second driver unit (Ub) and the first driver unit (Ua) via lines (Li), and the first driver unit (Ua) can be connected to the signal out pin (signal out) of the connector (47Rz) via lines (Le). Accordingly, the processor (C, see FIGS. 27 and 28) of the expansion board (59) can convert (process) data regarding the brightness of the light sources (51) received from the main board (P3) and provide the data to the driver ICs (U).

[0240] Power (VLED) can be supplied to the first local dimming block (BL1) through the first branch line (Lv1), and current passing through the first local dimming block (BL1) can flow to the first driver IC (Ua) through the first line (Lf1). Likewise, the power (VLED) can be supplied to each of the second to twelfth local dimming blocks (BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) through each of the second to twelfth branch lines (Lv2, Lv3, Lv4, Lv5, Lv6, Lv7, Lv8, Lv9, Lv10, Lv11, Lv12), and the current passing through each of the second to twelfth local dimming blocks (BL2, BL3, BL4, BL5, BL6, BL7, BL8, BL9, BL10, BL11, BL12) can be supplied to each of the second to twelfth lines (Lf2, Lf3, Lf4, Lf5, Lf6, Lf7, Lf8, Lf9, Lf10, The current can flow to the first driver IC (Ua) or the second driver IC (Ub) through each of Lf11 and Lf12. The driver ICs (Ua and Ub) can control the brightness of the light sources (51) belonging to each local dimming block by controlling the amount of current flowing to the light sources (51) belonging to each local dimming block or by blocking the flow of current, thereby implementing local dimming.

[0241]

[0242] Referring to FIGS. 49 and 50, the expansion board (59) may be extended in a vertical direction. A plurality of first substrates (47L) and a plurality of second substrates (47R) may be extended in a horizontal direction and may be electrically connected to the expansion board (59). The first substrates (47L) may be arranged along the left side of the expansion board (59), and the second substrates (47R) may be arranged along the right side of the expansion board (59). The first substrates (47L) may be referred to as first substrates (40L), and the second substrates (47R) may be referred to as second substrates (40R).

[0243] A driver IC (U) may be placed on each of the substrates (47L, 47R). A plurality of driver ICs (U) may be placed on each of the substrates (47L, 47R) and may be spaced apart from each other.

[0244] Referring to FIG. 49, the substrates (47L, 47R) may be composed of one type of substrate. That is, the substrates (47L, 47R) may have the same shape, and the positions of the driver ICs (U) of the substrates (47L, 47R) may be the same. In this case, the driver ICs (U) of the first substrates (47L) may be aligned with each other in the vertical direction, and the driver ICs (U) of the second substrates (47R) may also be aligned with each other in the vertical direction.

[0245] Referring to FIG. 50, the substrates (47L, 47R) may be composed of two types of substrates. The first type substrate (47A) and the second type substrate (47B) may have the same shape, but the position of the driver IC (U) of the first type substrate (47A) and the position of the driver IC (U) of the second type substrate (47B) may be different. The first type substrates (47A) and the second type substrates (47B) constituting the first substrates (47L) may be arranged alternately. In this case, the driver ICs (U) of the first substrates (47L) may be arranged in a zigzag manner in the vertical direction. The first type substrates (47A) and the second type substrates (47B) constituting the second substrates (47R) may be arranged alternately. In this case, the driver ICs (U) of the second substrates (47R) can be arranged in a zigzag pattern in the vertical direction.

[0246] Accordingly, the driver ICs (U) of FIG. 50 can be arranged more widely across the entire substrates (47L, 47R) than the driver ICs (U) of FIG. 49. That is, the arrangement of the driver ICs (U) of FIG. 50 can be more advantageous in lowering the temperature of the driver ICs (U) than the arrangement of the driver ICs (U) of FIG. 49.

[0247]

[0248] Referring to FIGS. 51 and 52, the rear surface of the substrate (47) can be bonded to the front surface of the frame (80) or the heat sink (83) via an adhesive sheet (47AD). The adhesive sheet (47AD) may be a double-sided tape. The rear surface of the reflective sheet (60) can be bonded to the front surface of the substrate (47) via an adhesive sheet (60AD). The adhesive sheet (60AD) may be a double-sided tape. The light sources (51) on the substrate (47) can be positioned in the holes (60ADh) of the adhesive sheet (60AD) and the holes (601) of the reflective sheet (60). The reflective sheet (60) can cover the driver IC(s) (U) on the substrate (47).

[0249] Light from light sources (51) can be provided to the display panel (10) through a diffuser plate (31) and an optical sheet (32). Lenses (53) can cover the light sources (51), be coupled to the front surface of the substrate (47), and be positioned in holes (60ADh, 601). The lens (53) can include at least one of silicone, polymethyl methacrylate (PMMA), or polycarbonate (PC). Light from the light source (51) can be refracted or reflected by the lens (53) and spread to a wider angle of incidence than the light source (51). The reflective sheet (60) can reflect light provided from the light source (51) or reflected from the diffuser plate (31) forward.

[0250] Meanwhile, the side frame (20) may include a first part (21), a second part (22), a third part (23), and a fourth part (24) (see FIG. 2). The first part (21) may extend along the upper side of the display panel (10), and the second part (22) may extend along the lower side of the display panel (10). The third part (23) may extend along the left side of the display panel (10), and the fourth part (24) may extend along the right side of the display panel (10). Each of the first to fourth parts (21, 22, 23, 24) may include a vertical portion and a horizontal portion. The vertical portion (21V) of the first part (21) may cover the upper side of the display panel (10) and the upper side of the frame (80). The horizontal portion (21H) of the first part (21) can intersect the vertical portion (21V) and be positioned between the display panel (10) and the optical sheet (32). The front pad (FP1) can be coupled to the rear surface of the display panel (10) and the front surface of the horizontal portion (21H). The rear pad (RP1) can be coupled to the rear surface of the horizontal portion (21H) and the front surface of the optical sheet (32). Accordingly, the side frame (20) can protect the edges of the display panel (10).

[0251]

[0252] Referring to FIGS. 1 to 52, a display device (1) may include: a display panel (10); a frame (80) positioned at the rear of the display panel (10); a main board (P3) coupled to the frame (80); a plurality of substrates (40) positioned between the display panel (10) and the frame and coupled to the frame (80); a plurality of light sources (51) mounted on each of the plurality of substrates (40); a driving chip (U) mounted on each of the plurality of substrates (40); an expansion board (59) to which the plurality of substrates (40) are electrically connected; and a cable (F3) electrically connecting the main board (P3) to the expansion board (59).

[0253] The above expansion board (59) may include a processor (C) that processes data regarding the brightness of the light sources (51) of the main board (P3) and provides the data to the driving chip (U).

[0254] The above display device (1) may further include a power supply board (P1) coupled to the frame (80); and a cable (F1) electrically connecting the power supply board (P1) to the expansion board (59).

[0255] The main board (P3) and the power supply board (P1) may be coupled to the rear of the frame (80), and the frame (80) may include a hole (81i) through which the cable (F3) connected to the main board (P3) and the cable (F1) connected to the power supply board (P1) pass.

[0256] The above plurality of light sources (51) can be grouped into a plurality of local dimming blocks for each of the plurality of substrates (40), and the driving chip (U) can control the flow of current passing through the plurality of local dimming blocks.

[0257] The above expansion board (59) can be extended long, and the plurality of substrates (40) can be extended in a direction crossing the expansion board (59) and spaced apart from each other along the expansion board (59).

[0258] The plurality of substrates (40) may include: first substrates (40L) adjacent to one long side of the expansion board (59) and coupled to the expansion board (59) and extending in a direction intersecting the expansion board (59); and second substrates (40R) adjacent to the other long side of the expansion board (59) and coupled to the expansion board (59) and extending in a direction intersecting the expansion board (59).

[0259] The plurality of substrates (40) may include: a first substrate; a second substrate spaced apart from the first substrate; and a third substrate opposite the first substrate with respect to the second substrate, and the driving chip (U) of the first substrate, the driving chip (U) of the second substrate, and the driving chip (U) of the third substrate may be arranged in a zigzag manner in the longitudinal direction of the expansion board (59).

[0260] The first substrate and the third substrate may be substrates of the first type, and the second substrate may be a substrate of a second type different from the first type.

[0261] The above substrate (46'') may include: a body (460) that extends long; and legs (46E') that extend from one long side of the body (460) in a direction intersecting the body (460) and are spaced apart from each other along the body (460), and each of the light sources (51) may be mounted on each of the legs (46E'), and the driving chip (U) may be mounted on the body (460).

[0262] The substrate (47) may include: a body (470) that extends elongatedly; first legs (47EA) that extend from one long side of the body (470) in a direction intersecting the body (470) and are spaced apart from each other along the body (470); and second legs (47EB) that extend from the other long side of the body (470) in a direction intersecting the body (470) and are spaced apart from each other along the body (470), and the light sources (51) may include: a first row (R1) of light sources (51) mounted on each of the first legs (47EA); and a second row (R2) of light sources (51) mounted on each of the second legs (47EB), and the driving chip (U) may be mounted on the body (470).

[0263] The spacing (G) between the above light sources (51) may be smaller than the width (Wu) of the driving chip (U).

[0264] The above driving chip (U) may include a plurality of driving chips (U) spaced apart from each other along the body (470).

[0265] The plurality of driving chips (U) may include: a first driving chip (Ua) that controls the brightness of the light sources (51) of the first row (R1); and a second driving chip (Ub) that controls the brightness of the light sources (51) of the second row (R2).

[0266] The above display device (1) may further include a reflective sheet (60) covering the plurality of substrates (40) and having a plurality of holes (601) in which the plurality of light sources (51) are positioned, and the reflective sheet (60) may cover the driving chip (U).

[0267]

[0268] Any or all of the embodiments of the present disclosure described above are not mutually exclusive or distinct. Any or all of the embodiments of the present disclosure described above may have their respective components or functions combined or used together.

[0269] For example, it means that a configuration A described in a particular embodiment and / or drawing can be combined with a configuration B described in another embodiment and / or drawing. That is, even if a combination between configurations is not directly described, it means that a combination is possible, except in cases where a combination is described as impossible.

[0270] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the present invention are intended to be included within the scope of the present invention.

Claims

1. Display panel; A frame located at the rear of the above display panel; A main board coupled to the above frame; A plurality of substrates positioned between the display panel and the frame and coupled to the frame; A plurality of light sources mounted on each of the plurality of substrates; A driving chip mounted on each of the plurality of substrates; An expansion board in which the above plurality of substrates are electrically connected; and A display device comprising a cable electrically connecting the main board to the expansion board.

2. In paragraph 1, The above expansion board: A display device including a processor that processes data regarding the brightness of the light sources of the main board and provides the data to the driving chip.

3. In paragraph 1, A power supply board coupled to the above frame; and A display device further comprising a cable electrically connecting the power supply board to the expansion board.

4. In paragraph 3, The above main board and the above power supply board, is coupled to the rear of the above frame, The above frame: A display device including a hole through which the cable connected to the main board and the cable connected to the power supply board pass.

5. In paragraph 1, The above multiple light sources are, Each of the above multiple substrates is grouped into multiple local dimming blocks, The above driving chip, A display device that controls the flow of current passing through the plurality of local dimming blocks.

6. In paragraph 1, The above expansion board is extended, The above multiple substrates are, A display device extending in a direction intersecting the above expansion board and spaced apart from each other along the above expansion board.

7. In paragraph 6, The above multiple substrates are: First substrates connected to the expansion board adjacent to one long side of the expansion board and extending in a direction crossing the expansion board; and A display device comprising second substrates coupled to the expansion board adjacent to the other long side of the expansion board and extending in a direction intersecting the expansion board.

8. In paragraph 6, The above multiple substrates are: 1st substrate; A second substrate spaced apart from the first substrate; and, A third substrate opposite the first substrate is included in the second substrate, The driving chip of the first substrate, the driving chip of the second substrate, and the driving chip of the third substrate, A display device arranged in a zigzag pattern along the length of the above expansion board.

9. In paragraph 8, The above first substrate and the above third substrate are first type substrates, The above second substrate, A display device having a second type of substrate different from the first type above.

10. In paragraph 1, The above substrate is: A long, elongated body; and, Includes legs extending from one long side of the body in a direction intersecting the body and spaced apart from each other along the body, Each of the above light sources is mounted on each of the above legs, The above driving chip is a display device mounted on the body.

11. In paragraph 1, The above substrate is: Long, elongated body; First legs extending from one longitudinal side of the body in a direction intersecting the body and spaced apart from each other along the body; and Including second legs extending from the other long side of the body in a direction intersecting the body and spaced apart from each other along the body, The above light sources are: A first row of light sources mounted on each of the first legs; and, Including a second row of light sources mounted on each of the second legs, The above driving chip is a display device mounted on the body.

12. In paragraph 11, The spacing between the above light sources is A display device smaller than the width of the above driving chip.

13. In paragraph 11, The above driving chip: A display device comprising a plurality of driving chips spaced apart from each other along the body.

14. In paragraph 13, The above plurality of driving chips are: A first driving chip for controlling the brightness of the light sources of the first row; and A display device including a second driving chip that controls the brightness of the light sources of the second row.

15. In paragraph 1, Further comprising a reflective sheet covering the plurality of substrates and having a plurality of holes in which the plurality of light sources are positioned, The above reflective sheet is a display device that covers the driving chip.

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