Camera module and manufacturing apparatus therefor

Abstract

This camera module comprises: a printed circuit board having one or more insertion holes formed at regular intervals; an image sensor chip which is mounted on the printed circuit board and detects light as an electrical signal; a housing coupled to the upper surface of the printed circuit board, having formed thereon one or more solder pins protruding downward by a predetermined length, wherein the solder pins are respectively vertically and downwardly inserted into the insertion holes; and a coupling portion for coupling solder melted by heating solder balls by a laser beam, to the solder pins, so as to bond the housing and the printed circuit board, wherein each of the solder pins is made of a different material such that the shrinkage rate of the solder varies when soldering is performed using the laser beam.

Description

Camera module and manufacturing device thereof

[0001] The present invention relates to a camera module and a manufacturing device thereof, and more particularly, to a camera module and a manufacturing device thereof, which can minimize shrinkage of solder by configuring the material of solder pins differently when soldering with laser solder jetting during the manufacturing of a camera module, and can prevent misalignment of a lens and an image sensor according to a soldering process.

[0002] Recently, mobile devices such as cell phones and laptops are equipped with camera modules equipped with image capture devices such as CCD image sensors or CMOS image sensors.

[0003] A conventional method for manufacturing a camera module includes a substrate, an image sensor disposed on the substrate, a housing assembly coupled to an upper surface of the substrate, a lens accommodated in the housing assembly, and a curable resin disposed between the upper surface of the substrate and the housing assembly, wherein the housing assembly is pressed toward the substrate while being disposed in the curable resin before the curable resin is cured, thereby performing focusing.

[0004] The housing assembly can be actively aligned with the optical axis of the lens and the optical axis of the image sensor during the pressing process toward the substrate.

[0005] At this time, the curable resin uses epoxy that is cured by ultraviolet rays (UV).

[0006] Since epoxy materials require pre-curing and then final curing (thermal curing), a separate oven process is required, which takes a long time. In addition, epoxy management requires frozen storage, which makes it difficult to handle in terms of management.

[0007] The optical axis alignment (focusing) of the lens and image sensor is performed using active alignment equipment, and the housing assembly is pressed toward the substrate so that the lens approaches the image sensor and is focused. However, the conventional camera module manufacturing method performs a process of curing epoxy by irradiating ultraviolet rays after performing active alignment. If there is a slight movement from the time of ultraviolet irradiation to the time when the epoxy is completely cured, the alignment state of the lens and the image sensor may change slightly, and the lens and the image sensor may not be in focus.

[0008] Therefore, research is ongoing on ways to easily and quickly assemble the lens module and substrate to reduce optical axis alignment errors in the camera module.

[0009] The purpose of the present invention is to provide a camera module and a manufacturing device thereof, which can minimize shrinkage of solder by configuring the material of solder pins differently when soldering with laser solder jetting during the manufacture of a camera module, and can prevent misalignment of a lens and an image sensor according to the soldering process.

[0010] A camera module according to the features of the present invention to achieve the above purpose,

[0011] A printed circuit board having one or more insertion holes formed at regular intervals;

[0012] An image sensor chip mounted on the above printed circuit board and detecting light as an electrical signal;

[0013] A housing that is bonded to the upper surface of the printed circuit board and forms one or more solder pins protruding downwards by a certain length, and inserts each solder pin vertically downward into each insertion hole; and

[0014] A joint portion is included where the housing and the printed circuit board are joined by heating the solder ball by a laser beam and melting the solder to combine it with the solder pin,

[0015] Each of the above solder pins is composed of a different material so that the shrinkage rate of the solder is different when soldered by a laser beam.

[0016]

[0017] A device for manufacturing a camera module according to the features of the present invention,

[0018] A camera module comprising a printed circuit board having one or more insertion holes formed at regular intervals, an image sensor chip mounted on the printed circuit board and detecting light as an electrical signal, and a housing having one or more solder pins bonded to an upper surface of the printed circuit board and protruding downward by a regular length, each solder pin being inserted vertically downward into each of the insertion holes, and having a lens mounted in an internal space;

[0019] An active alignment device that adjusts the positions of the lens and the image sensor chip to focus the lens and the image sensor chip; and

[0020] A laser solder jetting device is provided that heats solder balls with a laser beam to melt solder and combines the melted solder with the solder pins to join the housing and the printed circuit board, wherein each of the solder pins is configured with a different material so that the shrinkage rate of the solder is different when soldering with the laser beam.

[0021] By the above-described configuration, the present invention has the effect of preventing misalignment of the lens and the image sensor depending on the soldering process by setting the solder shrinkage rate differently depending on the material of the solder pin when soldering with laser solder jetting.

[0022] The present invention has the effect of simplifying the manufacturing process compared to other processes such as epoxy, thereby stabilizing the camera manufacturing quality and significantly shortening the process time.

[0023] FIG. 1 is a drawing showing the overall shape of a camera module according to an embodiment of the present invention.

[0024] Figure 2 is an exploded perspective view showing the configuration of a camera module according to an embodiment of the present invention.

[0025] FIG. 3 is a drawing showing an assembled appearance of a camera module according to an embodiment of the present invention.

[0026] FIG. 4 is a cross-sectional view of a camera module according to an embodiment of the present invention.

[0027] FIG. 5 is a drawing briefly showing the configuration of an active alignment device according to an embodiment of the present invention.

[0028] Figure 6 is a block diagram briefly showing the internal configuration of a control device according to an embodiment of the present invention.

[0029] FIGS. 7 to 10 are perspective views showing the configuration of a laser solder jetting device according to an embodiment of the present invention.

[0030] FIG. 11 is a drawing showing a state in which soldering is performed on a first solder pin using a laser beam according to an embodiment of the present invention.

[0031] The present invention is susceptible to various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention. Throughout the description of each drawing, similar reference numerals have been used to designate similar components.

[0032] Terms such as "first," "second," "A," and "B" may be used to describe various components, but these components should not be limited by these terms. These terms are used solely to distinguish one component from another. For example, without departing from the scope of the present invention, the first component could be referred to as the "second component," and similarly, the second component could also be referred to as the "first component." The term "and / or" includes any combination of multiple related items listed or any one of multiple related items listed.

[0033] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0034] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0035] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0036] Hereinafter, with reference to the attached drawings, preferred embodiments of the present invention will be described in more detail. In order to facilitate an overall understanding in describing the present invention, identical reference numerals will be used for identical components in the drawings, and redundant descriptions of identical components will be omitted.

[0037] Hereinafter, a camera module according to one embodiment of the present invention will be described with reference to the attached drawings.

[0038] FIG. 1 is a drawing showing the overall shape of a camera module according to an embodiment of the present invention, FIG. 2 is an exploded perspective view showing the configuration of a camera module according to an embodiment of the present invention, FIG. 3 is a drawing showing an assembled shape of a camera module according to an embodiment of the present invention, and FIG. 4 is a drawing showing a cross-section of a camera module according to an embodiment of the present invention.

[0039] A camera module (100) according to an embodiment of the present invention includes a printed circuit board (110) having a circuit pattern formed thereon, an image sensor chip (120) mounted on the printed circuit board (110), a housing (130) mounted on the printed circuit board (110) by metal bonding to seal the image sensor chip (120), a lens barrel (140) coupled to the upper portion of the housing (130) to collect light, and a camera frame (160) mounting the housing (130) therein.

[0040] The lens barrel (140) is at least one lens and can implement various lenses that can implement a camera.

[0041] The housing (130) has an open top and includes a lens and an IR filter (131) mounted in the internal space, and the lens and the IR filter (131) may be a single optical component assembled into the housing (130).

[0042] The image sensor chip (120) includes an image sensing unit that senses light input through millions or more pixels and converts it into an electrical signal, and a plurality of electrode pads formed around the image sensing unit so as to be connected to a printed circuit board (110) by wires.

[0043] The printed circuit board (110) includes electrode terminals connected to the electrode pads of the image sensor chip (120) by wires outside the area where the image sensor chip (120) is mounted. The electrode pads of the image sensor chip (120) and the electrode terminals of the printed circuit board (110) are bonded by wires.

[0044] A plurality of insertion holes (111) are formed in the upper surface of the printed circuit board (110) in the vertical direction at regular intervals.

[0045] The printed circuit board (110) is connected by inserting a solder pin (132) of a certain length into each insertion hole (111).

[0046] The housing (130) has a solder pin (132) of a certain length protruding from one side of the lower surface.

[0047] The solder pin (132) may include a first solder pin (132a), a second solder pin (132b), and a third solder pin (132c).

[0048] The solder pin (132) is a member made of metal for mounting the housing (130) to the printed circuit board (110), and is formed with a constant length in the downward direction on one side of the lower portion of the housing (130).

[0049] The solder pin (132) protrudes longer than the lower end of the housing (130).

[0050] The housing (130) is fixed by inserting a solder pin (132) into an insertion hole (111) of a printed circuit board (110).

[0051] FIG. 5 is a drawing briefly showing the configuration of an active alignment device according to an embodiment of the present invention, and FIG. 6 is a block diagram briefly showing the internal configuration of a control device according to an embodiment of the present invention.

[0052] An active alignment device (200) according to an embodiment of the present invention performs optical alignment of active alignment (AA) between a lens and an image sensor in a camera module (100) by inserting each solder pin (132) vertically downward into each insertion hole (111), thereby joining the housing (130) and the printed circuit board (110).

[0053] A camera module (100) includes a housing (130) that is coupled to one surface of a printed circuit board (110) and has one or more solder pins (132) protruding downward with a constant length, a printed circuit board (110) in which one or more insertion holes (111) are formed at constant intervals and solder pins (132) of a constant length are respectively inserted and coupled into the insertion holes (111), and an image sensor chip (120) that is mounted on the printed circuit board (110) and detects light as an electrical signal.

[0054] The active alignment device (200) includes a control device (201) and a height adjustment unit (210).

[0055] A control device (201) according to an embodiment of the present invention includes a control unit (220), a communication unit (223), a storage unit (230), an image sensor processing unit (240), an image information processing unit (250), a vehicle processing unit (260), and a laser irradiation unit (270). In addition, the control unit (220) includes an active alignment control unit (221) and a laser solder jetting control unit (222).

[0056] The height adjustment unit (210) performs the function of adjusting the height of the housing (130) in the vertical direction, forms a base body (211) in the shape of a rectangular parallelepiped, and includes a stand (212) of a constant height that extends vertically from the base body (211) to a constant length.

[0057] The height adjustment part (210) is formed in the internal space of the base body (211), and is vertically erected at a certain height in the internal space, and a first screw (213) of a certain length is formed that penetrates the base body (211) upward and is vertically erected on the inside of the stand (212), a first bevel gear (215) is coupled to the lower end of the first screw (213), a second bevel gear (216) is meshed with the first bevel gear (215) in a vertical direction, and the second bevel gear (216) is coupled to the first rotation shaft (217) of the first driving motor (218).

[0058] The first screw (213) is formed in a straight shape with a constant length, and is formed long in the longitudinal direction so as to penetrate and join the first moving block part (214) of a constant shape.

[0059] The first screw (213) has a screw groove machined along the circumferential direction by a rolling or grinding method.

[0060] The first moving block part (214) forms a nut part (not shown) inside, and the first screw (213) penetrates the center part of the nut part and is coupled thereto.

[0061] The nut portion of the first moving block portion (214) has a through hole formed through the front and rear surfaces so that the first screw (213) can be coupled to the central portion, and a screw thread corresponding to the screw groove formed on the outer surface of the first screw (213) is formed on the inner surface of the through hole.

[0062] The first screw (213) is inserted into the through hole of the nut part of the first moving block part (214) so ​​that the screw groove and the screw thread are screw-connected.

[0063] The first moving block part (214) forms a fixed member (219) of a certain length extending from one side of the front, and forms two first arms (219a) and two second arms (219b) on the left and right sides of the fixed member (219).

[0064] The first arm (219a) and the second arm (219b) hold one edge of the housing (130) to secure and connect the camera module (100).

[0065] The first screw (213) rotates according to the driving of the first driving motor (218), and the first moving block part (214), the first arm (219a), and the second arm (219b) can rise or fall along the first screw (213).

[0066] The lens and image sensor chip (120) constituting the camera module (100) are arranged vertically. More specifically, the camera module (100) is inserted into the insertion hole (111) of the printed circuit board (110) to which the solder pin (132) of the housing (130) is coupled, and is coupled to one side of the housing (130) using the first arm (219a) and the second arm (219b).

[0067] The active alignment device (200) of the present invention has a lens positioned at the bottom, a printed circuit board (110) positioned at the top, and an inspection chart (10) is placed at a certain distance below the lens.

[0068] Not limited to this, and conversely, the active alignment device (200) may have the lens positioned at the top and the printed circuit board (110) positioned at the bottom, and an inspection chart (10) may be placed at a certain distance above the lens.

[0069] The inspection chart (10) forms a pattern for spatial frequency response (SFR) inspection at the center and each corner. Here, the SFR inspection analyzes the frequency components of the edge portion of the pattern and determines the resolution based on the size of the high-frequency component value. Since this SFR inspection is a method generally and widely used to inspect the resolution of a camera module (100), a detailed description of this inspection method is omitted.

[0070] The image sensor chip (120) captures a chart for inspection having multiple patterns and acquires a chart image.

[0071] The active alignment control unit (221) performs the function of aligning the X, Y, and R axes relative positions of the lens and the image sensor chip (120).

[0072] The image sensor chip (120) is electrically connected to the image sensor processing unit (240), receives a photographed chart image from the image sensor processing unit (240), and transmits it to the active alignment control unit (221).

[0073] The active alignment control unit (221) receives a photographed chart image from the image sensor chip (120), extracts the first center point of the received photographed chart image and the second center point of the reference chart image of the preset inspection chart, and compares the first center point and the second center point to determine whether they match.

[0074] The active alignment control unit (221) generates a driving signal and transmits it to the first driving motor (218), and controls the first arm (219a) and the second arm (219b) coupled to the first moving block unit (214) to rise and fall by rotating the first screw (213) according to the driving of the first driving motor (218).

[0075] The active alignment control unit (221) receives a shooting chart image from the image sensor chip (120) while raising and lowering the housing (130), extracts the first center point of the received shooting chart image and the second center point of a preset inspection chart located on the upper part of the lens, compares the first and second center points to periodically determine whether they match, and aligns the X, Y, and R axis positions of the lens and the image sensor chip (120) so that the first and second center points match.

[0076] When the deviation between the first center point and the second center point does not fall within the reference range, the active alignment control unit (221) drives the first driving motor (218) to move the housing (130) up and down and to move the positions of the lens and the image sensor chip (120) minutely to perform alignment so that the optical axis of the lens and the optical axis of the image sensor chip align according to the coincidence of the first center point and the second center point.

[0077] Here, the positions of the lens and the image sensor chip (120) can be manually adjusted by hand, or, although not shown in the drawing, the positions can be adjusted by fitting the lens to a jig using a height-adjusting device (not shown).

[0078] The height adjustment unit (210) can adjust the position of the image sensor chip (120) by moving it up and down.

[0079] The active alignment control unit (221) determines that the optical axis of the lens and the optical axis of the image sensor chip (120) substantially coincide when the deviation between the first center point and the second center point falls within a reference range, and aligns the optical axis of the lens and the optical axis of the image sensor chip (120).

[0080] Optical alignment aligns the optical axis of the lens and the optical axis of the image sensor by pressing the housing (130) toward the printed circuit board (110).

[0081] The control unit (220) can control the coordinate information, image information, etc. calculated by the active alignment control unit (221) to be stored in the storage unit (230), or can transmit them to the outside via wireless communication through the communication unit (223).

[0082] The aforementioned laser solder jetting control unit (222), image information processing unit (250), moving means processing unit (260), and laser irradiation unit (270) will be described in detail with reference to FIG. 7 below. The laser solder jetting device (300) supplies solder balls, heats the solder balls with a laser beam, melts them, and sprays the melted solder at a target location so that the solder pins (132) are electrically connected to the printed circuit board (110).

[0083] In other words, the way laser solder jetting works is to instantly heat and melt solder balls with a laser beam, and then precisely spray solder from the melted solder balls at a desired location to join the solder pin (132) and the printed circuit board (110).

[0084] FIGS. 7 to 10 are perspective views showing the configuration of a laser solder jetting device according to an embodiment of the present invention.

[0085] A laser solder jetting device (300) according to an embodiment of the present invention is electrically connected to a control device (201).

[0086] The solder pin (132) may include a first solder pin (132a), a second solder pin (132b), and a third solder pin (132c).

[0087] The laser solder jetting device (300) forms a device body (310) in the shape of a rectangular parallelepiped, forms a second screw (312) of a predetermined length that is vertically erected on the inside of the device body (310), combines a first gear (not shown) at the bottom of the second screw (312), meshes a second gear (not shown) with the first gear in a vertical direction, and combines the second gear with a rotational axis of a second drive motor (not shown).

[0088] The second screw (312) is formed in a straight shape with a constant length, and is formed long in the longitudinal direction so as to penetrate and join the second moving block part (311) of a constant shape.

[0089] The second screw (312) has a screw groove machined along the circumferential direction by a rolling or grinding method.

[0090] The second moving block part (311) forms a nut part (not shown) inside, and the second screw (312) penetrates the center part of the nut part and is coupled thereto.

[0091] The nut portion of the second moving block portion (311) has a through hole formed through the front and rear surfaces so that the second screw (312) can be coupled to the central portion, and a screw thread corresponding to the screw groove formed on the outer surface of the second screw (312) is formed on the inner surface of the through hole.

[0092] The second screw (312) is inserted into the through hole of the nut part of the second moving block part (311) so that the screw groove and the screw thread are screw-connected.

[0093] The second moving block part (311) includes a first rotating arm (313) extending from one side to a certain length, and a second rotating arm (314) that is coupled to the first rotating arm (313) and rotates.

[0094] A rotary motor (315) capable of 360-degree rotation is attached to one end of the second rotary arm (314).

[0095] The rotary motor (315) is connected to the lower part of the soldering part (318) that performs soldering by a laser beam.

[0096] Here, soldering is a process of joining two or more metal parts together, in which solder balls are heated by a laser beam so that the melted solder flows into the metal parts to form a joint.

[0097] The joint may mean that solder flows into a metal part to form a certain shape so as to electrically connect the melted solder pin (132) and the printed circuit board (110).

[0098] The solder part (318) combines the camera part (316) and the laser irradiation nozzle (317) at the bottom.

[0099] The solder part (318) includes a laser generating part that generates a laser beam, a lens assembly part that converts a laser beam in the form of a diffuse beam emitted from the laser generating part into a form of a parallel beam, and a solder ball (S) that is irradiated with the laser beam to form a bonding surface by performing soldering using the laser beam is accommodated.

[0100] The camera unit (316) captures coordinate information of the solder pin (132) of the printed circuit board (110), generates image information including the coordinate information, and transmits it to the image information processing unit (250) of the control device (201).

[0101] The image information processing unit (250) processes the image information and transmits it to the laser solder jetting control unit (222).

[0102] The laser solder jetting control unit (222) receives image information including coordinate information from the image information processing unit (250), extracts coordinate information from the received image information, and monitors the position where the laser beam is irradiated.

[0103] The laser solder jetting control unit (222) stores preset position coordinates for the first solder pin (132a), the second solder pin (132b), and the third solder pin (132c), and is programmed to melt solder balls by a laser beam in the order of the position coordinates of the first solder pin (132a), the second solder pin (132b), and the third solder pin (132c) and to bond the solder to the solder pin (132).

[0104] The laser solder jetting control unit (222) extracts coordinate information from the image information received from the image information processing unit (250), and transmits mapping information obtained by comparing the extracted coordinate information with the preset position coordinates of the first solder pin (132a) to the moving means processing unit (260).

[0105] The moving means processing unit (260) drives the rotation motor (315) and the second driving motor based on the mapping information to move along the X-axis direction, Y-axis direction, and Z-axis direction to the position coordinates of the first solder pin (132a).

[0106] The laser solder jetting control unit (222) moves to the position coordinates of the first solder pin (132a) and controls the laser irradiation unit (270) to perform soldering using a laser beam.

[0107] The laser irradiation unit (270) adjusts the focus position of the laser beam to be fired, thereby adjusting the irradiation position of the laser beam to the center point of the laser irradiation nozzle (317).

[0108] The solder part (318) moves the solder ball (S) downward along the inner surface of the laser irradiation nozzle (317) and supplies it to the laser irradiation nozzle (317).

[0109] Here, the solder ball (S) is a small spherical metal ball mainly composed of tin (Sn) and lead (Pb), and is used to electrically connect the solder pin (132) and the printed circuit board (110).

[0110] Solder balls can be composed of a single material, such as polymer, glass, metal, or a composite.

[0111] The composition of solder balls can include various solders, such as lead-based solders made of tin and lead, lead-free solders made of alloys of tin, silver, and copper, and special alloys of tin-bismuth alloys.

[0112] The laser beam passing through the solder portion (318) can heat and melt the solder ball to be bonded.

[0113] The laser irradiation nozzle (317) sprays solder from a solder ball melted by a laser beam onto the first solder pin (132a) to form a joint. The joint electrically connects the solder pin (132) exposed by the solder from the solder ball to the printed circuit board (110).

[0114] The laser solder jetting control unit (222) extracts coordinate information from the image information received from the image information processing unit (250), and transmits mapping information comparing the extracted coordinate information with the preset position coordinates of the second solder pin (132b) to the moving means processing unit (260).

[0115] The moving means processing unit (260) drives the rotation motor (315) and the second driving motor based on the mapping information to move along the X-axis direction, Y-axis direction, and Z-axis direction to the position coordinates of the second solder pin (132b).

[0116] The laser solder jetting control unit (222) moves to the position coordinates of the second solder pin (132b) and controls the laser irradiation unit (270) to perform soldering using a laser beam. The remaining third solder pin (132c) can also be soldered in the same manner.

[0117] Referring to FIG. 11 below, a method of performing soldering using a laser beam in the order of the position coordinates of the first solder pin (132a), the second solder pin (132b), and the third solder pin (132c) will be described in detail.

[0118] FIG. 11 is a drawing showing a state in which soldering is performed on a first solder pin using a laser beam according to an embodiment of the present invention.

[0119] When the laser solder jetting device (300) performs soldering on the first solder pin (132a) and then performs soldering on the second solder pin (132b), micro-movement occurs due to micro-contraction of the solder bonded to the first first solder pin (132a), and the alignment state of the lens and the image sensor changes micro-wise, so that the lens and the image sensor may not be in focus.

[0120] The solder pin (132) may exhibit different solder shrinkage rates during soldering depending on the material of which it is composed. In other words, depending on the material of the solder pin (132), the solder shrinkage may be less or more during soldering. The active alignment process requires high precision, and the occurrence of micro-movements may disrupt the optimal alignment between the lens and the image sensor.

[0121] Accordingly, each solder pin (132a, 132b, 132c) can be configured with a different material so that the shrinkage rate of the solder is different when soldering with a laser beam.

[0122] Depending on the pin material, the solder pin (132) can affect whether the solder shrinks less or more during soldering.

[0123] In other words, the first solder pin (132a) can be made of a material that causes less solder shrinkage than the material of the second solder pin (132b) and the third solder pin (132c).

[0124] If the solder pin (132) is made of a material that reduces solder shrinkage during soldering, the cost increases.

[0125] Accordingly, the material of the first solder pin (132a) is expensive and can be configured so that the solder shrinks less during soldering, and the material of the second solder pin (132b) and the third solder pin (132c) can be configured so that the material is cheaper than the material of the first solder pin (132a) and so that the solder shrinks more during soldering than the first solder pin (132a).

[0126] The second solder pin (132b) and the third solder pin (132c) can be made of the same material.

[0127] As illustrated in Fig. 11, if soldering is performed first on the first solder pin (132a), shrinkage of the solder is reduced, so when soldering of the second solder pin (132b) and the third solder pin (132c) is performed later, micro-movement of the housing (130) and the printed circuit board (110) does not occur, and thus optimal alignment between the lens and the image sensor can be achieved.

[0128] Among each solder pin (132), one first solder pin (132a) is made of a first material having a first shrinkage ratio of solder during soldering, and the remaining second and third solder pins (132b, 132c) are made of a second material having a second shrinkage ratio in which solder shrinkage is greater than the first shrinkage ratio of the first material during soldering.

[0129] The solder pin (132a) performing the first soldering may be composed of the first material, and the solder pins (132b, 132c) performing the remaining soldering may be composed of the second material.

[0130] The melting form of the solder ball of the solder pin (132) varies depending on the material. This is because the material of the solder pin (132) affects the thermal conductivity, thermal expansion coefficient, and surface characteristics.

[0131] If the material of the solder pin (132) is different, the way the solder of the solder ball melts and flows may change, which may change the quality and characteristics of the joint.

[0132] Thermal conductivity determines how well the solder pin (132) material conducts heat, which affects the heating and cooling speed of the solder ball. For example, a high thermal conductivity material such as copper conducts heat quickly, allowing the solder ball to melt and solidify quickly.

[0133] On the other hand, materials with low thermal conductivity, such as stainless steel, heat and cool more slowly.

[0134] The coefficient of thermal expansion (CTE) varies depending on the material of the solder pin (132). CTE indicates how much a material expands when heated and affects the stress and strain at the solder joint. Materials with a high CTE expand more when heated, which can result in uneven forces being applied to the solder joint.

[0135] Surface properties indicate the surface treatment or coating of the solder pin (132) and have a significant impact on the wettability with solder. Good wettability allows the solder to spread well on the surface of the solder pin (132), thereby forming a good bond.

[0136] Among these properties, the coefficient of thermal expansion affects the shrinkage of the solder during the soldering process.

[0137] The coefficient of thermal expansion is a value that indicates how much a material expands or contracts with temperature changes. During the soldering process, the solder contracts as it cools. If the solder and the solder pin (132) have different coefficients of thermal expansion, a thermal mismatch between the two materials can occur.

[0138] If the solder and solder pin (132) have a similar range of thermal expansion coefficients, the thermal stress during cooling can be reduced, thereby reducing problems due to shrinkage.

[0139] If the solder and solder pin (132) have different coefficients of thermal expansion beyond a similar range, stress may occur in the solder joint due to thermal mismatch during the cooling process.

[0140] For example, a solder pin (132) made of copper has high thermal conductivity and a specific coefficient of thermal expansion, which is similar to the coefficient of thermal expansion of lead-based solder and lead-free solder, which are generally made of tin and lead, so that shrinkage may occur less.

[0141] However, iron or nickel-plated solder pins (132) have different coefficients of thermal expansion than lead-based solder and lead-free solder, which may cause stress when the solder shrinks due to thermal mismatch.

[0142] Solder pin materials such as copper, iron, and nickel each have different coefficients of thermal expansion, which affect the shrinkage of the solder during cooling.

[0143] The material of the solder pin (132) affects the shrinkage rate of the solder, which may be caused by differences in the coefficients of thermal expansion of the two materials.

[0144] Therefore, for example, the first solder pin (132a) may be made of copper material to reduce solder shrinkage (first shrinkage ratio), and the second solder pin (132b) and the third solder pin (132c) may be made of iron or nickel plating (second shrinkage ratio).

[0145] The thermal expansion coefficient of the solder pin performing the first soldering is configured so that the thermal expansion coefficient of the solder is within a similar range, and the thermal expansion coefficients of the solder pins performing the remaining soldering are configured so that the thermal expansion coefficients of the solder are different from each other by more than a similar range.

[0146] Here, a similar range may mean a range in which the thermal expansion coefficient of the solder pin and the thermal expansion coefficient of the solder have similar values, resulting in less shrinkage of the solder.

[0147] While some aspects of the present invention have been described in the context of a device, they may also represent a description of a corresponding method, wherein a block or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method may also be described as a corresponding block or item or a feature of a corresponding device. Some or all of the method steps may be performed by (or using) a hardware device, such as, for example, a microprocessor, a programmable computer, or an electronic circuit. In some embodiments, one or more of the most significant method steps may be performed by such a device.

[0148] In embodiments, a programmable logic device (e.g., a field programmable gate array) may be used to perform some or all of the functions of the methods described herein. In embodiments, the field programmable gate array may operate in conjunction with a microprocessor to perform one of the methods described herein. In general, the methods are preferably performed by some hardware device.

[0149] Although the present invention has been described above with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below.

Claims

1. A printed circuit board in which one or more insertion holes are formed at regular intervals; An image sensor chip mounted on the above printed circuit board and detecting light as an electrical signal; A housing that is bonded to the upper surface of the printed circuit board and forms one or more solder pins protruding downwards by a certain length, and inserts each solder pin vertically downward into each insertion hole; and A joint portion is included where the housing and the printed circuit board are joined by heating the solder ball by a laser beam and melting the solder to combine it with the solder pin, A camera module in which each of the solder pins is composed of a different material so that the shrinkage rate of the solder is different when soldered by a laser beam.

2. In paragraph 1, One of the solder pins above is made of a first material having a first shrinkage ratio of solder during soldering, and the remaining solder pins are made of a second material having a second shrinkage ratio in which solder shrinkage is greater than the first shrinkage ratio of the first material during soldering. Camera module.

3. In paragraph 2, The solder pin performing the first soldering is composed of the first material, and the solder pin performing the remaining soldering is composed of the second material. Camera module.

4. In paragraph 1, The thermal expansion coefficient of the solder pin performing the first soldering is configured such that the thermal expansion coefficient of the solder is within a similar range, and the thermal expansion coefficients of the solder pins performing the remaining soldering are configured such that the thermal expansion coefficients of the solder are different from each other by more than a similar range. Camera module.

5. A camera module including a printed circuit board having one or more insertion holes formed at regular intervals, an image sensor chip mounted on the printed circuit board and detecting light as an electrical signal, and a housing having one or more solder pins bonded to an upper surface of the printed circuit board and protruding downward by a regular length, each solder pin being inserted vertically downward into each insertion hole, and having a lens mounted in an internal space; An active alignment device that adjusts the positions of the lens and the image sensor chip to focus the lens and the image sensor chip; and A laser solder jetting device is included, which heats solder balls with a laser beam and melts the solder to join the solder pins to the housing and the printed circuit board, wherein each solder pin is made of a different material so that the shrinkage rate of the solder is different when soldering with a laser beam. Camera module manufacturing device.

6. In paragraph 5, One of the solder pins above is made of a first material having a first shrinkage ratio of solder during soldering, and the remaining solder pins are made of a second material having a second shrinkage ratio in which solder shrinkage is greater than the first shrinkage ratio of the first material during soldering. Camera module manufacturing device.

7. In paragraph 5, After performing optical alignment of the active alignment (AA) to focus the lens and the image sensor chip using the above active alignment device, the laser solder jetting device solders the solder pin of the first material by a laser beam, and then solders the solder pin of the second material in the following order. Camera module manufacturing device.

8. In paragraph 5, The image sensor chip acquires a chart image by photographing an inspection chart having a plurality of patterns formed thereon arranged at the bottom of the lens, A control device that receives a photographed chart image of an inspection chart from the image sensor chip, extracts a first center point of the received photographed chart image and a second center point of a reference chart image of the inspection chart, compares the first center point with the second center point to determine whether they match, and performs active alignment by moving the positions of the lens and the image sensor chip so that the optical axis of the lens and the optical axis of the image sensor chip match according to the match between the first center point and the second center point. A manufacturing device for a camera module including:

9. In paragraph 5, The thermal expansion coefficient of the solder pin performing the first soldering is configured so that the thermal expansion coefficient of the solder is within a similar range, and the thermal expansion coefficients of the solder pins performing the remaining soldering are configured so that the thermal expansion coefficient of the solder is within a similar range or more. Camera module manufacturing device.

Images